Freescale Semiconductor
Advance Information
Document Number: MM912_634D1
Rev. 7.0, 3/2012
© Freescale Semiconductor, Inc., 2010-2012. All rights reserved.
This document contains certain information on a new product. Specifications and information
herein are subject to change without notice.
Integrated S12 Based Relay
Driver with LIN
The MM912G634 (48 kB) and MM912H634 (64 kB) are
integrated single package solutions that integrate an HCS12
microcontroller with a SMARTMOS analog control IC. The Die
to Die Interface (D2D) controlled analog die combines system
base chip and application specific functions, including a LIN
transceiver.
Features
• 16-Bit S12 CPU, 64/48 kByte P-FLASH,
• 6.0 kByte RAM; 4/2 kByte D-FLASH
• Background debug (BDM) & debug module (DBG)
• Die to Die bus interface for transparent memory mapping
• On-chip oscillator & two independent watchdogs
• LIN 2.1 Physical Layer Interface with integrated SCI
• 10 digital MCU GPIOs shared with SPI (PA7…0, PE1…0)
• 10-Bit, 15 Channel - Analog to Digital Converter (ADC)
• 16-Bit, 4 Channel - Timer Module (TIM16B4C)
• 8-Bit, 2 Channel - Pulse width modulation module (PWM)
• Six high voltage / Wake-up inputs (L5…0)
• Three low voltage GPIOs (PB2…0)
• Low power modes with cyclic sense & forced wake-up
• Current sense module with selectable gain
• Reverse battery protected voltage sense module
• Two protected low side outputs to drive inductive loads
• Two protected high side outputs
• Chip temperature sensor
• Hall sensor supply & integrated voltage regulator(s)
Figure 1. Simp lified Application Diagram
ORDERING INFORMATION
See Page 2.
MM912_634
48-PIN LQFP, 7.0 mm x 7.0 mm
AE SUFFIX: Exposed Pad Option
AP SUFFIX: Non Exposed Pad Option
MM912_634
VSENSE
VS1
VS2
LIN
VDD
AGND
RESET
RESET_A
PA0/MISO
LS1
LS2
ISENSEH*
HS1
HS2*
TEST_A
LGND
Battery Sense
L1
M
TCLK
L2
L3
L4*
ISENSEL*
PGND
L0
L5*
Hall Sensor
HSUP
Hall Sensor
PTB0/AD0/RX/TIM0CH0
PTB1/AD1/TX/TIM0CH1
PTB2/AD2/PWM/TIM0CH2
PA1/MOSI
PA2/SCK
PA3/SS
PA4
PA5
PA6
PA7
BKGD/MODC
PE0/EXTAL
PE1/XTAL
TEST
ADC25
VDDD2D
VDDX
VDDRX
DGND
VSSRX
VSSD2D
Power Supply
LIN Interface
ADC Supply
2.5 V Suppy
5.0 V Supply
Digital Ground
Reset
5.0 V Digital I/O
Debug and External
Oscillator
MCU Test
* Feature not availablre in all Analog Options
Low Side Drivers
Current Sense Moe
Hall Sensor Supply
5.0 V GPI/O with optional
pull-up (shared with ADC,
PWM, Timer, and SCI)
12 V Light/LED and
Switch Supply
Analog/Digita inputs
(High Voltage and Wake-up
capable)
Analog Test
Ordering Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 2
1 Ordering Information
2 Part Identification
This section provides an explanation of the part numbers and their alpha numeric breakdown.
2.1 Description
Part numbers for the chips have fields that identify the specific part configuration. You can use the values of these fields to
determine the specific part you have received.
2.2 Format and Examples
Part numbers for a given device have the following format, followed by a device example:
Table 3 - Part Numbering - Analog EMBEDDED MCU + POWER:
MM 9 cc f xxx r v PPP RR - MM912G634CM1AE
Table 1. ORDERING IN FORMATI ON
Device
(Add an R2 suffix for
Tape and Reel orders)
Temperature
Range (TA)Package
Max. Bus
Frequency in MHz
(fBUSMAX)
Flash (kB) Data Flash (kB) RAM (kB) Analog
Option(1)
MM912G634CM1AE -40°C to 125°C LQFP48-EP 20 48(2) 2(3) 2(4) A1
MM912G634CV1AE -40°C to 105°C LQFP48-EP 20 48(2) 2(3) 2(4) A1
MM912G634CV2AP -40°C to 105°C LQFP48 16 48(2) 2(3) 2(4) A2
MM912H634CM1AE -40°C to 125°C LQFP48-EP 20 64 4 6 A1
MM912H634CV1AE -40°C to 105°C LQFP48-EP 20 64 4 6 A1
Note:
1. See Table 2.
2. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested FLASHSIZE reduced to 48 kB. This will limit the
usable Flash area to the first 48 kB (0x3_4000-0x3_FFFF).
3. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested Data - FLASHSIZE reduced to 2.0 kB. This will limit
the usable Data Flash area to the first 2.0 kB (0x0_4400-0x0_4BFF).
4. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested RAMSIZE reduced to 2.0 kB. This will limit the
usable RAM area to the first 2.0 kB (0x0_2800-0x0_2FFF).
Table 2. Analog Options(5)
Feature A1 A2
Battery Sense Module YES YES
Current Sense Module YES NO
2nd High Side Output (HS2) YES YES
Wake-up Inputs (Lx) L0…L5 L0…L3
Hall Supply Output (HSUP) YES YES
LIN Module YES YES
Note:
5. This table only highlights the analog die differences between the derivatives. Features highlighted as “NO” or the Lx Inputs not
mentioned are not available in the specific option and not bonded out and/or not tested. See Section 5.3.3, “Analog Die Options" for
detailed information.
Part Identification
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 3
2.3 Fields
These tables list the possible values for each field in the part number (not all combinations are valid).
Table 3. Part Numbering - Analog EMBEDDED MCU + POWER
FIELD DESCRIPTION VALUES
MM Product Category
• MM- Qualified Standard
• SM- Custom Device
• PM- Prototype Device
9Memory Type • 9 = Flash, OTP
• Blank = ROM
cc Micro Core •08 = HC08
•12 = HC12
fMemory Size
•A 1k
•B 2k
•C 4k
•D 8k
•E 16k
•F 32k
•G 48k
•H 64k
•I 96k
• J 128 k
xxx Analog Core/Target • Assigned by Marketing
rRevision • (default A)
tTemperature Range
• I = 0 °C to 85 °C
• C = -40 °C to 85 °C
• V = -40 °C to 105 °C
• M = -40 °C to 125 °C
vVariation • (default blank)
PPP Package Designator • Assigned by Packaging
RR Tape and Reel Indicator
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 4
Table of Contents
1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Part Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2.2 Format and Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2.3 Fields. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
3 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
3.1 MM912_634 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3.2 MCU Die Signal Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
4.2 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
4.3 Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4.4 Supply Currents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4.5 Static Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4.6 Dynamic Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
4.7 Thermal Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
4.8 ESD Protection and Latch-up Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
4.9 Additional Test Information ISO7637-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
5 Functional Description and Application Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
5.2 Device Register Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
5.3 MM912_634 - Analog Die Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
5.4 Modes of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
5.5 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
5.6 Die to Die Interface - Target . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
5.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
5.8 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
5.9 Wake-up / Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
5.10 Window Watchdog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
5.11 Hall Sensor Supply Output - HSUP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
5.12 High Side Drivers - HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
5.13 Low Side Drivers - LSx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
5.14 PWM Control Module (PWM8B2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
5.15 LIN Physical Layer Interface - LIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100
5.16 Serial Communication Interface (S08SCIV4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102
5.17 High Voltage Inputs - Lx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
5.18 General Purpose I/O - PTB[0…2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
5.19 Basic Timer Module - TIM (TIM16B4C). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120
5.20 Analog Digital Converter - ADC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
5.21 Current Sense Module - ISENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141
5.22 Temperature Sensor - TSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143
5.23 Supply Voltage Sense - VSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .144
5.24 Internal Supply Voltage Sense - VS1SENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .144
5.25 Internal Bandgap Reference Voltage Sense - BANDGAP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .144
5.26 MM912_634 - Analog Die Trimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145
5.27 MM912_634 - MCU Die Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150
5.28 Port Integration Module (S12IPIMV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157
5.29 Memory Map Control (S12PMMCV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .165
5.30 Interrupt Module (S12SINTV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .176
5.31 Background Debug Module (S12SBDMV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .180
5.32 S12S Debug Module (S12SDBGV2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .197
5.33 Security (S12X9SECV2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .230
5.34 Impact on MCU modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .231
5.35 Secure firmware Code Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .232
5.36 Initialization of a Virgin Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235
5.37 Impact of Security on Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 5
5.38 S12 Clock, Reset and Power Management Unit (S12CPMU). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .236
5.39 Serial Peripheral Interface (S12SPIV5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .274
5.40 64 KByte Flash Module (S12FTMRC64K1V1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .294
5.41 Die-to-Die Initiator (D2DIV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .328
6 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .340
6.1 Package Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .340
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .345
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 6
Figure 2. Device Block Diagram
Cascaded
Voltage Regulators
VDD = 2.5V
VDDX = 5V
Die To Die
Interface
Reset
Control Module
Window
Watchdog Module
RESET_A
VS2
AGND
18V
clamped
Output
Module
HS1
LS2
HSUP
VSENSE
ISENSEL
Lx Input Module
LIN
VS1
D2DDAT1
D2DDAT0
D2DCLK
D2DINT
Wake Up
Module
Current Sense
Module
Interrupt
Control Module
Low Side Control Module
VBAT Sense
Module
Analog Multiplexer
L3
L2
L1
L0
HS2
LS1
ISENSEH
PGND
Chip Temp
Sense Module
High Side Control
Module
VDDX
VDD
SCI
D2DDAT3
D2DDAT2
OSC (trimmable)
ADC
10bit
PTB1/AD1/TX/TIMCH1
GPIO
PTB0/AD0/RX/TIMCH0
PTB2/AD2/PWM/TIMCH
2
LIN
Physical
Layer
Internal Bus
Analog Die
Internal Bus
CPU 12-V1
CPU
Register ALU
D2DI
Flash 64k Bytes with ECC
Data Flash 4k Bytes with ECC
RAM 6k Byte
Debug Module
include 64 byte Trace Buffer RAM
Reset Generation and
Test Entry
Amplitude Contr. Low
Power Pierce OSC
PLL with Freq. Modulation option
OSC Clock Monitor
Single-Wire Background Debug
Module
COP Watchdog
Periodic Interrupt
Interrupt Module
SPI
DDRA
MOSI
MISO
SCK
PORTA
MCU Die
SS
PA0
PA1
PA2
PA3
PA4
PA5
TEST
PE1/XTAL
PE0/EXTAL
BKGD/MODC
RESET
VSSRX
VDDRX
VSSD2D
VDDD2D
DGND
L5
L4
4 Channel Timer
Module
ADC2p5
LGND
Test
Interface
TCLK
TEST_A
2 Channel
PWM
Module
VREG
1.8V Core
2.7V Flash
PA7
PORTE[0:1]
PA6
Pin Assignment
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 7
3 Pin Assignment
Figure 3. MM912_634 Pin Out
NOTE
The device exposed pad (package option AE only) is recommended to be connected to
GND.
Not all pins are available for analog die option 2. See Section 5.3.3, “Analog Die Options"
for details.
1
2
3
4
5
6
7
8
9
10
11
12
PA6
VSSRX
VDDRX
PE0/EXTAL
PE1/XTAL
TEST
PA5
PA4
PA3
PA2
PA1
PA0
36
35
34
33
32
31
30
29
28
27
26
25
L5
PTB0
LGND
L4
L3
L2
L1
L0
AGND
ADC2p5
PTB2
PTB1
37
38
39
40
41
42
43
44
45
46
47
48
LS1
BKGD
PA7
PGND
LS2
ISENSEL
ISENSEH
NC
TEST_A
TCLK
RESET_A
RESET
24
23
22
21
20
19
18
17
16
15
14
13
LIN
VDDD2D
VSSD2D
HSUP
HS2
HS1
VS2
VS1
VSENSE
DGND
VDDX
VDD
Pin Assignment
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 8
3.1 MM912_634 Pin Description
The following table gives a brief description of all available pins on the MM912_634 package. Refer to the highlighted chapter for
detailed information.
Table 4. MM912_634 Pin Description
Pin # Pin Name Formal Name Description
1PA6 MCU PA6
General purpose port A input or output pin 6. See Section 5.28, “Port Integration
Module (S12IPIMV1)"
2 PE0/EXTAL MCU Oscillator
EXTAL is one of the optional crystal/resonator driver and external clock pins. On
reset, all the device clocks are derived from the Internal Reference Clock and port
PE may be used for general purpose I/O. See Section 5.38.2.2, “EXTAL and XTAL"
and Section 5.28, “Port Integration Module (S12IPIMV1)".
3 PE1/XTAL MCU Oscillator
XTAL is one of the optional crystal/resonator driver and external clock pins. On
reset, all the device clocks are derived from the Internal Reference Clock and port
PE may be used for general purpose I/O. See Section 5.38.2.2, “EXTAL and XTAL"
and Section 5.28, “Port Integration Module (S12IPIMV1)".
4TEST MCU Test
This input only pin is reserved for test. This pin has a pull-down device. The TEST
pin must be tied to EVSS in user mode.
5PA5 MCU PA5
General purpose port A input or output pin 5. See Section 5.28, “Port Integration
Module (S12IPIMV1)"
6PA4 MCU PA4
General purpose port A input or output pin 4. See Section 5.28, “Port Integration
Module (S12IPIMV1)".
7 PA3 MCU PA3 / SS General purpose port A input or output pin 3, shared with the SS signal of the
integrated SPI Interface. See Section 5.28, “Port Integration Module (S12IPIMV1)".
8 PA2 MCU PA2 / SCK General purpose port A input or output pin 2, shared with the SCLK signal of the
integrated SPI Interface. See Section 5.28, “Port Integration Module (S12IPIMV1)".
9 PA1 MCU PA1 / MOSI General purpose port A input or output pin 1, shared with the MOSI signal of the
integrated SPI Interface. See Section 5.28, “Port Integration Module (S12IPIMV1)".
10 PA0 MCU PA0 / MISO General-purpose port A input or output pin 0, shared with the MISO signal of the
integrated SPI Interface. See Section 5.28, “Port Integration Module (S12IPIMV1)".
11 VSSRX MCU 5.0 V Ground Ground for the MCU 5.0 V power supply.
12 VDDRX MCU 5.0 V Supply MCU 5.0 V - Core- and Flash Voltage Regulator supply. See Section 5.27,
“MM912_634 - MCU Die Overview".
13 VSSD2D MCU 2.5 V Ground Ground for the MCU 2.5 V power supply.
14 VDDD2D MCU 2.5 V Supply MCU 2.5 V - MCU Die-to-Die Interface power supply. See Section 5.27,
“MM912_634 - MCU Die Overview".
15 VDD Voltage Regulator
Output 2.5 V
+2.5 V main voltage regulator output pin. External capacitor (CVDD) needed. See
Section 5.5, “Power Supply".
16 VDDX Voltage Regulator Output
5.0 V
+5.0 V main voltage regulator output pin. External capacitor (CVDDX) needed. See
Section 5.5, “Power Supply".
17 DGND Digital Ground This pin is the device digital ground connection for the 5.0 V and 2.5V logic. DGND,
LGND, and AGND are internally connected to PGND via a back to back diode.
18 VSENSE Voltage Sense
Battery voltage sense input. This pin can be connected directly to the battery line for
voltage measurements. The voltage present at this input is scaled down by an
internal voltage divider, and can be routed to the internal ADC via the analog
multiplexer.The pin is self-protected against reverse battery connections. An
external resistor (RVSENXSE) is needed for protection(6). See Section 5.23,
“Supply Voltage Sense - VSENSE". Note: This pin function is not available on all
device configurations.
Note:
6. An optional filter capacitor CVSENSE is recommended to be placed between the board connector and DVSENSE to GND for increased
ESD performance.
Pin Assignment
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 9
19 VS1 Power Supply Pin 1
This pin is the device power supply pin 1. VS1 is primarily supplying the VDDX
Voltage regulator and the Hall Sensor Supply Regulator (HSUP). VS1 can be
sensed via a voltage divider through the AD converter. Reverse battery protection
diode is required. See Section 5.5, “Power Supply"
20 VS2 Power Supply Pin 2 This pin is the device power supply pin 2. VS2 supplies the High Side Drivers (HSx).
Reverse battery protection diode required. See Section 5.5, “Power Supply"
21 HS1 High Side Output 1
This pin is the first High Side output. It is supplied through the VS2 pin. It is designed
to drive small resistive loads with optional PWM. In cyclic sense mode, this output
will activate periodically during low power mode. See Section 5.12, “High Side
Drivers - HS".
22 HS2 High Side Output 2
This pin is the second High Side output. It is supplied through the VS2 pin. It is
designed to drive small resistive loads with optional PWM. In cyclic sense mode, this
output will activate periodically during low power mode. See Section 5.12, “High
Side Drivers - HS". Note: This pin function is not available on all device
configurations.
23 HSUP Hall Sensor Supply Output
This pin is designed as an 18 V Regulator to drive Hall Sensor Elements. It is
supplied through the VS1 pin. An external capacitor (CHSUP) is needed. See
Section 5.11, “Hall Sensor Supply Output - HSUP". Note: This pin function is not
available on all device configurations.
24 LIN LIN Bus I/O
This pin represents the single-wire bus transmitter and receiver. See Section 5.15,
“LIN Physical Layer Interface - LIN". Note: This pin function is not available on all
device configurations.
25 LGND LIN Ground Pin This pin is the device LIN Ground connection. DGND, LGND, and AGND are
internally connected to PGND via a back to back diode.
26 PTB0 General Purpose I/O 0
This is the General Purpose I/O pin 0 based on VDDX with the following shared
functions:
• PTB0 - Bidirectional 5.0 V (VDDX) digital port I/O with selectable internal pull-up
resistor.
• AD0 - Analog Input Channel 0, 0…2.5V (ADC2p5) analog input
• TIM0CH0 - Timer Channel 0 Input/Output
• Rx - Selectable connection to LIN / SCI
See Section 5.18, “General Purpose I/O - PTB[0…2]".
27 PTB1 General Purpose I/O 1
This is the General Purpose I/O pin 1 based on VDDX with the following shared
functions:
• PTB1 - Bidirectional 5.0 V (VDDX) digital port I/O with selectable internal pull-up
resistor.
• AD1 - Analog Input Channel 1, 0…2.5 V (ADC2p5) analog input
• TIM0CH1 - Timer Channel 1 Input/Output
• Tx - Selectable connection to LIN / SCI
See Section 5.18, “General Purpose I/O - PTB[0…2]".
28 PTB2 General Purpose I/O 2
This is the General Purpose I/O pin 2 based on VDDX with the following shared
functions:
• PTB2 - Bidirectional 5.0 V (VDDX) digital port I/O with selectable internal pull-up
resistor.
• AD2 - Analog Input Channel 2, 0…2.5V (ADC2p5) analog input
• TIM0CH2 - Timer Channel 2 Input/Output
• PWM - Selectable connection to PWM Channel 0 or 1
See Section 5.18, “General Purpose I/O - PTB[0…2]".
29 ADC2p5 ADC Reference Voltage This pin represents the ADC reference voltage and has to be connected to a filter
capacitor. See Section 5.20, “Analog Digital Converter - ADC"
30 AGND Analog Ground Pin This pin is the device Analog to Digital converter ground connection. DGND, LGND
and AGND are internally connected to PGND via a back to back diode.
Table 4. MM912_634 Pin Description
Pin # Pin Name Formal Name Description
Pin Assignment
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 10
31 L0 High Voltage Input 0
This pins is the High Voltage Input 0 with the following shared functions:
• L0 - Digital High Voltage Input 0. When used as digital input, a series resistor
(RLX) must be used to protect against automotive transients.(7)
• AD3 - Analog Input 3 with selectable divider for 0…5.0 V and 0…18 V
measurement range.
• WU0 - Selectable Wake-up input 0 for wake up and cyclic sense during low
power mode.
See Section 5.17, “High Voltage Inputs - Lx"
32 L1 High Voltage Input 1
This pins is the High Voltage Input 1 with the following shared functions:
• L1 - Digital High Voltage Input 1. When used as digital input, a series resistor
(RLX) must be used to protect against automotive transients.(7)
• AD4 - Analog Input 4 with selectable divider for 0…5.0 V and 0…18 V
measurement range.
• WU1 - Selectable Wake-up input 1 for wake-up and cyclic sense during low
power mode.
See Section 5.17, “High Voltage Inputs - Lx"
33 L2 High Voltage Input 2
This pins is the High Voltage Input 2 with the following shared functions:
• L2 - Digital High Voltage Input 2. When used as digital input, a series resistor
(RLX) must be used to protect against automotive transients.(7)
• AD5 - Analog Input 5 with selectable divider for 0…5.0 V and 0…18 V
measurement range.
• WU2 - Selectable Wake-up input 2 for wake-up and cyclic sense during low
power mode.
See Section 5.17, “High Voltage Inputs - Lx". Note: This pin function is not available
on all device configurations.
34 L3 High Voltage Input 3
This pins is the High Voltage Input 3 with the following shared functions:
• L3 - Digital High Voltage Input 3. When used as digital input, a series resistor
(RLX) must be used to protect against automotive transients.(7)
• AD6 - Analog Input 6 with selectable divider for 0…5.0 V and 0…18 V
measurement range.
• WU3 - Selectable Wake-up input 3 for wake-up and cyclic sense during low
power mode.
See Section 5.17, “High Voltage Inputs - Lx". Note: This pin function is not available
on all device configurations.
35 L4 High Voltage Input 4
This pins is the High Voltage Input 4 with the following shared functions:
• L4 - Digital High Voltage Input 4. When used as digital input, a series resistor
(RLX) must be used to protect against automotive transients.(7)
• AD7 - Analog Input 7 with selectable divider for 0…5.0 V and 0…18 V
measurement range.
• WU4 - Selectable Wake-up input 4 for wake-up and cyclic sense during low
power mode.
See Section 5.17, “High Voltage Inputs - Lx". Note: This pin function is not available
on all device configurations.
36 L5 High Voltage Input 5
This pins is the High Voltage Input 5 with the following shared functions:
• L5 - Digital High Voltage Input 5. When used as digital input, a series resistor
(RLX) must be used to protect against automotive transients.(7)
• AD8 - Analog Input 8 with selectable divider for 0…5.0 V and 0…18 V
measurement range.
• WU5 - Selectable Wake-up input 5 for wake-up and cyclic sense during low
power mode.
See Section 5.17, “High Voltage Inputs - Lx". Note: This pin function is not available
on all device configurations.
Note:
7. An optional filter capacitor CLX is recommended to be placed between the board connector and RLX to GND for increased ESD
performance.
Table 4. MM912_634 Pin Description
Pin # Pin Name Formal Name Description
Pin Assignment
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 11
3.2 MCU Die Signal Properties
This section describes the external MCU signals. It includes a table of signal properties.
37 LS1 Low Side Output 1
Low Side output 1 used to drive small inductive loads like relays. The output is
short-circuit protected, includes active clamp circuitry and can be also controlled by
the PWM module.
See Section 5.13, “Low Side Drivers - LSx"
38 PGND Power Ground Pin This pin is the device Low Side Ground connection. DGND, LGND and AGND are
internally connected to PGND via a back to back diode.
39 LS2 Low Side Output 2
Low Side output 2 used to drive small inductive loads like relays. The output is
short-circuit protected, includes active clamp circuitry and can be also controlled by
the PWM module.
See Section 5.13, “Low Side Drivers - LSx"
40 ISENSEL Current Sense Pin L
Current Sense differential input “Low”. This pin is used in combination with
ISENSEH to measure the voltage drop across a shunt resistor. See Section 5.21,
“Current Sense Module - ISENSE". Note: This pin function is not available on all
device configurations.
41 ISENSEH Current Sense Pin H
Current Sense differential input “High”. This pin is used in combination with
ISENSEL to measure the voltage drop across a shunt resistor. Section 5.21,
“Current Sense Module - ISENSE". Note: This pin function is not available on all
device configurations.
42 NC Not connected This pin is reserved for alternative function and should be left floating.
43 TEST_A Test Mode Analog die Test Mode pin for Test Mode only. This pin must be grounded in user
mode!
44 TCLK Test Clock Input
Test Mode Clock Input pin for Test Mode only. The pin can be used to disable the
internal watchdog for development purpose in user mode. See Section 5.10,
“Window Watchdog". The pin is recommended to be grounded in user mode.
45 RESET_A Reset I/O Bidirectional Reset I/O pin of the analog die. Active low signal. Internal pull-up. VDDX
based. See Section 5.8, “Resets". To be externally connected to the RESET pin.
46 RESET MCU Reset
The RESET pin is an active low bidirectional control signal. It acts as an input to
initialize the MCU to a known start-up state, and an output when an internal MCU
function causes a reset. The RESET pin has an internal pull-up device to VDDRX.
47 BKGD MCU Background Debug
and Mode
The BKGD/MODC pin is used as a pseudo-open-drain pin for the background
debug communication. It is used as MCU operating mode select pin during reset.
The state of this pin is latched to the MODC bit at the rising edge of RESET. The
BKGD pin has a pull-up device.
48 PA7 MCU PA7 General purpose port A input or output pin 7. See Section 5.28, “Port Integration
Module (S12IPIMV1)"
Table 5. Signal Properties Summary
Pin
Name
Function 1
Pin
Name
Function 2
Power
Supply
Internal Pull
Resistor Description
CTRL Reset
State
PE0 EXTAL VDDRX
PUPEE/
OSCPINS_EN DOWN Port E I/O, Oscillator pin
PE1 XTAL VDDRX
PUPBE/
OSCPINS_EN DOWN Port E I/O, Oscillator pin
RESET — VDDRX PULLUP External reset
TEST — N.A. RESET pin DOWN Test input
BKGD MODC VDDRX BKPUE UP Background debug
PA7 — VDDRX NA NA Port A I/O
Table 4. MM912_634 Pin Description
Pin # Pin Name Formal Name Description
Pin Assignment
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 12
PA6 — VDDRX NA NA Port A I/O
PA5 — VDDRX NA NA Port A I/O
PA4 — VDDRX NA NA Port A I/O
PA3 SS VDDRX NA NA Port A I/O, SPI
PA2 SCK VDDRX NA NA Port A I/O, SPI
PA1 MOSI VDDRX NA NA Port A I/O, SPI
PA0 MISO VDDRX NA NA Port A I/O, SPI
PC1 D2DINT VDDD2D PUPCE/
D2DEN Disabled Port C I/O, D2DI
PC0 D2DCLK VDDD2D NA NA Port C I/O, D2DI
PD7-0 D2DDAT7-0 VDDD2D PUPDE/
D2DEN Disabled Port D I/O, D2DI
Table 5. Signal Properties Summary
Pin
Name
Function 1
Pin
Name
Function 2
Power
Supply
Internal Pull
Resistor Description
CTRL Reset
State
General
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 13
4 Electrical Characteristics
4.1 General
This section contains electrical information for the embedded MC9S12I64 microcontroller die, as well as the MM912_634 analog
die.
4.2 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima is not guaranteed.
Stress beyond those limits may affect the reliability or cause permanent damage of the device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields. However, it is advised that
normal precautions be taken to avoid application of any voltages higher than maximum rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. All voltages are with respect
to ground, unless otherwise noted.
Table 6. Absolute Maximum Electrical Ratings - Analog Die
Ratings Symbol Value Unit
Supply Voltage at VS1 and VS2
Normal operation (DC)
Transient conditions (load dump)
Transient input voltage with external component (according to LIN
Conformance Test Specification / ISO7637-2)
VSUP(SS)
VSUP(PK)
VSUP(TR)
-0.3 to 27
-0.3 to 40
(8)
V
L0…L5 - Pin Voltage
Normal operation with a series RLX resistor (DC)
Transient input voltage with external component (according to LIN
Conformance Test Specification / ISO7637-2)
VLxDC
VLxTR
27 to 40
(8)
V
LIN Pin Voltage
Normal operation (DC)
Transient input voltage with external component (according to LIN
Conformance Test Specification / ISO7637-2)
VBUSDC
VBUSTR
-33 to 40
(8)
V
Supply Voltage at VDDX VDDX -0.3 to 5.5 V
Supply Voltage at VDD VDD -0.3 to 2.75 V
VDD Output Current IVDD Internally Limited A
VDDX Output Current IVDDX Internally Limited A
TCLK Pin Voltage VTCLK -0.3 to 10 V
RESET_A Pin Voltage VIN -0.3 to VDDx+0.3 V
Input / Output Pins PTB[0:2] Voltage VIN -0.3 to VDDx+0.3 V
HS1 and HS2 Pin Voltage (DC) VHS -0.3 to VS2+0.3 V
LS1 and LS2 Pin Voltage (DC) VLS -0.3 to 45 V
ISENSEH and ISENSEL Pin Voltage (DC) VISENSE -0.3 to 40 V
HSUP Pin Voltage (DC) VHSUP -0.3 to VS1+0.3 V
VSENSE Pin Voltage (DC) VVSENSE -27 to 40 V
Note:
8. See Section 4.9, “Additional Test Information ISO7637-2"
Operating Co nditions
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 14
4.3 Operating Conditions
This section describes the operating conditions of the device. Unless otherwise noted those conditions apply to all the following
data.
Table 7. Ma ximum Electrical Ratings - MCU Die(9)
Ratings Symbol Value Unit
5.0 V Supply Voltage (Supplying the MCU internal regulator for core and
flash) VDDRX -0.3 to 6.0 V
2.5 V D2D - Supply Voltage VDDD2D -0.3 to 3.6 V
Digital I/O input voltage (PA0...PA7, PE0, PE1) VIN -0.3 to 6.0 V
EXTAL, XTAL (PE0 and PE1 in alternative configuration) VILV -0.3 to 2.16 V
TEST Input VTEST -0.3 to 10.0 V
Instantaneous Maximum Current
Single pin limit for all digital I/O pins ID-25 to 25 mA
Instantaneous Maximum Current
Single pin limit for EXTAL, XTAL IDL -25 to 25 mA
Note:
9. All digital I/O pins are internally clamped to VSSRX and VDDRX.
Table 8. Maximum Thermal Ratings
Ratings Symbol Value Unit
Storage Temperature TSTG -55 to 150 C
Package (LQFP48), Thermal Resistance RJA max. 48 k
Peak Package Reflow Temperature During Reflow(10), (11) TPPRT Note 11 °C
Notes
10. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
11. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
Table 9. Operating Conditions
Ratings Symbol Value Unit
Analog Die Nominal Operating Voltage VSUP 5.5 to 18 V
Analog Die Functional Operating Voltage - Device is fully functional. All
features are operating. VSUPOP 5.5 to 27 V
MCU I/O and Supply Voltage(12) VDDRX 4.75 to 5.25 V
MCU Digital Logic Supply Voltage(12) VDDD2D 2.25 to 2.75 V
MCU Oscillator
MM912x634xxxAE
MM912x634xxxAP
fOSC 4.0 to 16
4.0 to 16
MHz
MCU Bus frequency
MM912x634xxxAE
MM912x634xxxAP
fBUS fBUSMAX(13) MHz
Note:
12. During power up and power down sequence always VDDD2D < VDDRX
13. fBUSMAX frequency ratings differ by device and is specified in Table 1
Supply Currents
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 15
4.4 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for the measurements.
4.4.1 Measurement Conditions
All measurements are without output loads. Currents are measured in MCU special single chip mode and the CPU code is
executed from RAM, unless otherwise noted.
4.5 Static Electrical Characteristics
All characteristics noted under the following conditions:
•5.5V VSUP 18 V
•-40°C TA 125 °C (MM912x634xMxxx)
•-40°C TA 105 °C (MM912x634xVxxx)
Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise noted.
Operating Ambient Temperature
MM912x634xMxxx
MM912x634xVxxx
TA-40 to 125
-40 to 105
C
Operating Junction Temperature - Analog Die TJ_A -40 to 150 C
Operating Junction Temperature - MCU Die TJ_M -40 to 150 C
Table 10. Supply Currents
Ratings Symbol Min Typ(14) Max Unit
Normal Mode analog die only, excluding external loads, LIN Recessive State
(5.5 V VSUP 18 V, 2.25 V VDD 2.75 V, 4.5 V VDDX 5.5V, -40°C
TJ_A 150 °C).
IRUN_A -5.08.0mA
Normal Mode MCU die only (TJ_M=150 °C; VDDD2D = 2.75 V, VDDRX = 5.5 V,
fOSC = 4.0 MHz, fBUS= fBUSMAX(15)(16) IRUN_M -1820mA
Stop Mode internal analog die only, excluding external loads, LIN Recessive
State, Lx enabled, measured at VS1+VS2 (5.5 V VSUP 18 V, 2.25 V VDD
2.75 V, 4.5 V VDDX 5.5 V)
-40 °C TJ_A 125 °C
ISTOP_A
-2040
µA
Stop Mode MCU die only (VDDD2D = 2.75 V, VDDRX = 5.5 V, fOSC= 4.0 MHz;
MCU in STOP; RTI and COP off)(17)
TJ_M=150°C
TJ_M=-40°C
TJ_M=25°C
ISTOP_M -
-
-
85
31
31
150
50
50
µA
Sleep Mode (VDD = VDDX = OFF; 5.5 V VSUP 18 V; -40 °C TJ_A
125 °C; 3.0 V LX 1.0 V). ISLEEP -1528µA
Cyclic Sense Supply Current Adder (5.0 ms Cycle) ICS -1520µA
Note:
14. Typical values noted reflect the approximate parameter mean at TA = 25 °C
15. fBUSMAX frequency ratings differ by device and is specified in Table 1
16. IRUN_M denotes the sum of the currents flowing into VDD and VDDX.
17. ISTOP_M denotes the sum of the currents flowing into VDD and VDDX.
Table 9. Operating Conditions
Ratings Symbol Value Unit
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 16
4.5.1 Static Electrical Characteristics Analog Die
Table 11. Static Electrical Characteristics - Power Supply
Ratings Symbol Min Typ Max Unit
Power-On Reset (POR) Threshold (measured on VS1) VPOR 1.5 - 3.5 V
Low Voltage Warning (LVI)
Threshold (measured on VS1, falling edge)
Hysteresis (measured on VS1)
VLVI
VLVI_H
5.55
-
6.0
1.0
6.6
-
V
High Voltage Warning (HVI)
Threshold (measured on VS2, rising edge)
Hysteresis (measured on VS2)
VHVI
VHVI_H
18
-
19.25
1.0
20.5
-
V
Low Battery Warning (LBI)
Threshold (measured on VSENSE, falling edge)
Hysteresis (measured on VSENSE)
VLBI
VLBI_H
5.55
-
6.0
1.0
6.6
-
V
J2602 Under-voltage threshold VJ2602UV 5.5 5.7 6.2 V
Low VDDX Voltage (LVRX) Threshold VLVRX 2.7 3.0 3.3 V
Low VDD Voltage Reset (LVR) Threshold Normal Mode VLVR 2.30 2.35 2.4 V
Low VDD Voltage Reset (LVR) Threshold Stop Mode VLVRS 1.6 1.85 2.1 V
VDD Over-voltage Threshold (VROV) VVDDOV 2.575 2.7875 3.0 V
VDDX Over-voltage Threshold (VROVX) VVDDXOV 5.25 5.675 6.1 V
Table 12. Static Electrical Characteristics - Resets
Ratings Symbol Min Typ Max Unit
Low-state Output Voltage IOUT = 2.0 mA VOL --0.8V
Pull-up Resistor RRPU 25 - 50 kOhm
Low-state Input Voltage VIL - - 0.3VDDX V
High-state Input Voltage VIH 0.7VDDX --V
Reset Release Voltage (VDDX) VRSTRV -1.5- V
RESET_A pin Current Limitation 5.0 7.5 10 mA
Table 13. Static Electrical Characteristics - Window Watchdog
Ratings Symbol Min Typ Max Unit
Watchdog Disable Voltage (fixed voltage) VTST 7.0 - 10 V
Watchdog Enable Voltage (fixed voltage) VTSTEN --5.5V
Table 14. Static Electrical Characteristics - Voltage Regulator 5.0 V (VDDX)
Ratings Symbol Min Typ Max Unit
Normal Mode Output Voltage
1.0 mA < IVDDX + IVDDXinternal < 80 mA; 5.5 V < VSUP < 27 V VDDXRUN 4.75 5.00 5.25 V
Normal Mode Output Current Limitation (IVDDX)I
VDDXRUN 80 130 200 mA
Stop Mode Output Voltage (IVDDX < 500 µA) VDDXSTOP -5.05.5V
Stop Mode Output Current Limitation (IVDDX)I
VDDXSTOP 1.0 - 20 mA
Line Regulation
Normal Mode, IVDDX = 80 mA
Stop Mode, IVDDX = 500 µA
LRXRUN
LRXSTOP
-
-
20
-
25
200
mV
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 17
Load Regulation
Normal Mode, 1.0 mA < IVDDX < 80 mA
Normal Mode, VSUP = 3.6 V, 1.0 mA < IVDDX < 40 mA
Stop Mode, 0.1 mA < IVDDX < 500 µA
LDXRUN
LDXCRK
LDXSTOP
-
-
-
15
-
-
80
200
250
mV
External Capacitor CVDDX 1.0 - 10 µF
External Capacitor ESR CVDDX_R --10Ohm
Table 15. Static Electrical Characteristics - Voltage Regulator 2.5 V (VDD)
Ratings Symbol Min Typ Max Unit
Normal Mode Output Voltage
1.0 mA < IVDD <= 45 mA; 5.5 V < VSUP < 27 V VDDRUN 2,425 2.5 2,575 V
Normal Mode Output Current Limitation (IVDD)
TJ < 25 °C
TJ ≥ 25 °C
IVDDLIMRUN -
-
80
80
120
143
mA
Stop Mode Output Voltage (IVDD < 0.5 mA) VDDSTOP 2.25 2.5 2.75 V
Stop Mode Output Current Limitation (IVDD)I
VDDLIMSTOP --10mA
Line Regulation
Normal Mode, IVDD = 45 mA
Stop Mode, IVDD = 1.0 mA
LRRUN
LRSTOP
-
-
10
-
12.5
200
mV
Load Regulation
Normal Mode, 1.0 mA < IVDD < 45 mA
Normal Mode, VSUP = 3.6 V, 1.0 mA < IVDD < 30 mA
Stop Mode, 0.1 mA < IVDD < 1.0 mA
LDRUN
LDCRK
LDSTOP
-
-
-
7.5
-
-
40
40
200
mV
External Capacitor CVDD 1.0 - 10 µF
External Capacitor ESR CVDD_R --10Ohm
Table 16. Static Electrical Characteristics - Hall Sensor Supply Output - HSUP
Ratings Symbol Min Typ Max Unit
Current Limitation IHSUP 40 70 90 mA
Output Drain-to-Source On resistance
TJ = 150 °C, ILOAD = 30 mA; 5.5 V ≤ VSUP ≤ 16 V
TJ = 150 °C, ILOAD = 30 mA; 3.7 V ≤ VSUP < 5.5 V
RDS(ON) -
-
-
-
10
12
Ohm
Output Voltage: (18 V VSUP 27 V) VHSUPMAX 16 17.5 18 V
Load Regulation (1.0 mA < IHSUP < 30 mA; VSUP > 18 V) LDHSUP - - 500 mV
Hall Supply Capacitor Range CHSUP 0.22 - 10 µF
External Capacitor ESR CHSUP_R --10Ohm
Table 14. Static Electrical Characteristics - Voltage Regulator 5.0 V (VDDX)
Ratings Symbol Min Typ Max Unit
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 18
Table 17. Static Electrical Characteristics - High Side Drivers - HS
Ratings Symbol Min Typ Max Unit
Output Drain-to-Source On resistance
TJ = 25 °C, ILOAD = 50 mA; VSUP > 9.0 V
TJ = 150 °C, ILOAD = 50 mA; VSUP > 9.0 V
TJ = 150 °C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V
RDS(ON)
-
-
-
-
-
-
7.0
10
14
Ohm
Output Current Limitation (0 V < VOUT < VSUP - 2.0 V) ILIMHSX 60 110 250 mA
Open Load Current Detection IOLHSX -5.07.5mA
Leakage Current (-0.2 V < VHSx < VS2 + 0.2 V) ILEAK --10µA
Current Limitation Flag Threshold (5.5 V < VSUP < 27 V) VTHSC VSUP -2 - - V
Table 18. Static Electrical Characteristics - Low Side Drivers - LS
Ratings Symbol Min Typ Max Unit
Output Drain-to-Source On resistance
TJ = 25 °C, ILOAD = 150 mA, VSUP > 9.0 V
TJ = 150 °C, ILOAD = 150 mA, VSUP > 9.0 V
TJ = 150 °C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V
RDS(ON)
–
–
–
–
–
–
2.5
4.5
10
Ohm
Output Current Limitation (2.0 V < VOUT < VSUP)I
LIMLSX 180 275 380 mA
Open Load Current Detection IOLLSX -8.012mA
Leakage Current (-0.2 V < VOUT < VS1) ILEAK --10µA
Active Output Energy Clamp (IOUT = 150 mA) VCLAMP 40 - 45 V
Coil Series Resistance (IOUT = 150 mA) RCOIL 120 - Ohm
Coil Inductance (IOUT = 150 mA) RCOIL --400m
Current Limitation Flag Threshold (5.5 V < VSUP < 27 V) VTHSC 2.0 - - V
Ta ble 19. Static Electrical Characteristics - LIN Physical Layer Interface - LIN
Ratings Symbol Min Typ Max Unit
Current Limitation for Driver dominant state. VBUS = 18 V IBUSLIM 40 120 200 mA
Input Leakage Current at the Receiver incl. Pull-up Resistor
RSLAVE; Driver OFF; VBUS = 0 V; VBAT = 12 V IBUS_PAS_DOM -1.0 - - mA
Input Leakage Current at the Receiver incl. Pull-up Resistor
RSLAVE; Driver OFF;
8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS VBAT
IBUS_PAS_REC --20µA
Input Leakage Current; GND Disconnected; GNDDEVICE = VSUP;
0 < VBUS < 18 V; VBAT = 12 V IBUS_NO_GND -1.0 - 1.0 mA
Input Leakage Current; VBAT disconnected; VSUP_DEVICE =
GND; 0 < VBUS < 18 V IBUS_NO_BAT - - 100 µA
Receiver Input Voltage; Receiver Dominant State VBUSdom --0.4V
SUP
Receiver Input Voltage; Receiver Recessive State VBUSrec 0.6 - - VSUP
Receiver Threshold Center (VTH_DOM + VTH_REC)/2 VBUS_CNT 0.475 0.5 0.525 VSUP
Receiver Threshold Hysteresis (VTH_REC - VTH_DOM)V
BUS_HYS - - 0.175 VSUP
Voltage Drop at the serial Diode Dser_int 0.4 0.7 1.0 V
LIN Pull-up Resistor Rslave 20 30 60 kOhm
Bus Wake-up Threshold from Stop or Sleep VWUP 4.0 5.0 6.0 V
Bus Dominant Voltage VDOM --2.5V
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 19
Table 20. Static Electrical Characteristics - High Voltage Inputs - Lx
Ratings Symbol Min Typ Max Unit
Low Detection Threshold
(7.0 V VSUP 27 V)
(5.5 V VSUP 7.0 V)
VTHL
2.2
1.5
2.5
2.5
3.4
4.0
V
High Detection Threshold
(7.0 V VSUP 27 V)
(5.5 V VSUP 7.0 V)
VTHH
2.6
2.0
3.0
3.0
3.7
4.5
V
Hysteresis
(5.5 V < VSUP < 27 V)
VHYS
0.25 0.45 1.0
V
Input Current Lx (-0.2 V < VIN < VS1) IIN -10 - 10 µA
Analog Input Impedance Lx RLxIN --1.2MOhm
Lx Series Resistor RLX 9.5 10 10.5 kOhm
Lx Capacitor (optional)(18) CLX - 100 - nF
Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0)
LXDS (Lx Divider Select) = 0
LXDS (Lx Divider Select) = 1
RATIOLx -
-
2.0
7.2
-
-
Analog Input Divider Ratio Accuracy RATIOLX -5.5 - 5.5 %
Analog Inputs Channel Ratio - Mismatch
LXDS (Lx Divider Select) = 0
LXDS (Lx Divider Select) = 1
LxMATCH -
-
-
-
5.0
5.0
%
Note:
18. The ESD behavior specified in Section 4.8, “ESD Protection and Latch-up Immunity" are guaranteed without the optional capacitor.
Table 21. Static Electrical Characteristics - General Purpose I/O - PTB[0…2]
Ratings Symbol Min Typ Max Unit
Input High Voltage VIH 0.7VDDX -V
DDX+0.3 V
Input Low Voltage VIL VSS-0.3 - 0.35VDDX V
Input Hysteresis VHYS - 140 - mV
Input High Voltage (VS1 = 3.7 V) VIH3.7 2.1 - VDDX+0.3 V
Input Low Voltage (VS1 = 3.7 V) VIL3.7 VSS-0.3 - 1.4 V
Input Hysteresis (VS1 = 3.7 V) VHYS3.7 100 200 300 mV
Input Leakage Current (pins in high-impedance input mode)
(VIN = VDDX or VSSX)IIN -1.0 - 1.0 µA
Output High Voltage (pins in output mode) Full drive IOH = -10 mA VOH VDDX-0.8 - - V
Output Low Voltage (pins in output mode) Full drive IOL = 10 mA VOL --0.8V
Internal Pull-up Resistance (VIH min > Input voltage > VIL max) RPUL 26.25 37.5 48.75 kOhm
Input Capacitance CIN -6.0- pF
Clamp Voltage when selected as analog input VCL_AIN VDD - - V
Analog Input impedance = 10 kOhm max, Capacitance = 12 pF RAIN - - 10 kOhm
Analog Input Capacitance = 12 pF CAIN -12- pF
Maximum current all PTB combined (VDDX capability!) IBMAX -15 - 15 mA
Output Drive strength at 10 MHz COUT - - 100 pF
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 20
Table 22. Static Electrical Characteristics - Analog Digital Converter - ADC(19)
Ratings Symbol Min Typ Max Unit
ADC2p5 Reference Voltage
5.5 V < VSUP < 27 V
VADC2p5RU
N2,45 2.5 2.55 V
ADC2p5 Reference Stop Mode Output Voltage VADC2p5ST
OP
- - 100 mV
Line Regulation, Normal Mode LRRUNA - 10 12.5 mV
External Capacitor CADC2p5 0.1 - 1.0 µF
External Capacitor ESR CVDD_R --10Ohm
Scale Factor Error ESCALE -1 - 1 LSB
Differential Linearity Error EDNL -1.5 - 1.5 LSB
Integral Linearity Error EINL -1.5 - 1.5 LSB
Zero Offset Error EOFF -2.0 - 2.0 LSB
Quantization Error EQ-0.5 - 0.5 LSB
Total Error with offset compensation TE -5.0 - 5.0 LSB
Bandgap measurement Channel (CH14) Valid Result Range
(including ±7.0% bg1p25sleep accuracy + high-impedance measurement
error of ±5.0% at fADC)(20)
ADCH14 1.11.251.4 V
Note:
19. No external load allowed on the ADC2p5 pin.
20. Reduced ADC frequency will lower measurement error.
Table 23. Static Electrical Characteristics - Current Sense Module - ISENSE
Ratings Symbol Min Typ Max Unit
Gain
CSGS (Current Sense Gain Select) = 000
CSGS (Current Sense Gain Select) = 001
CSGS (Current Sense Gain Select) = 010
CSGS (Current Sense Gain Select) = 011
CSGS (Current Sense Gain Select) = 100
CSGS (Current Sense Gain Select) = 101
CSGS (Current Sense Gain Select) = 110
CSGS (Current Sense Gain Select) = 111
G
-
-
-
-
-
-
-
-
7
9
10
12
14
18
24
36
-
-
-
-
-
-
-
-
Gain Accuracy -3.0 - 3.0 %
Offset -1.5 - 1.5 %
Resolution(21) RES - 51 - mA/LSB
ISENSEH, ISENSEL Input Common Mode Voltage Range VIN -0.2 - 3.0 V
Current Sense Module - Normal Mode Current Consumption Adder
(CSE = 1) IISENSE - 600 - µA
Note:
21. RES = 2.44 mV/(GAIN*RSHUNT)
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 21
4.5.2 Static Electr ical Characteristics MCU Die
4.5.2.1 I/O Characteristics
This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST and supply pins.
Ta ble 24. Static Electric al Char acteristics - Temperature Sensor - TSENSE
Ratings Symbol Min Typ Max Unit
Internal Chip Temperature Sense Gain(22) TSG-9.17-mV/k
Internal Chip Temperature Sense Error at the end of conversion(22) TSErr –5.0 - 5.0 °C
Temperature represented by a ADCIN Voltage of 0.150 V(22) T0.15V -55 -50 -45 °C
Temperature represented by a ADCIN Voltage of 1.984 V(22) T1.984V 145 150 155 °C
Note:
22. Guaranteed by design and characterization.
Table 25. Static Electrical Characteristics - Supply Voltage Sense - VSENSE and VS1SENSE
Ratings Symbol Min Typ Max Unit
VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / ADCIN)
5.5 V < VSUP < 27 V
RATIOVSENS
E
- 10.8 5.0%
VSENSE error - whole path (VSENSE pad to Digital value) ErVSENSE --5.0%
VS1SENSE Input Divider Ratio (RATIOVS1SENSE = VVS1SENSE / ADCIN)
5.5 V < VSUP < 27 V
RATIOVS1SE
NSE
- 10.8 5.0%
VS1SENSE error - whole path (VS1 pad to Digital value) ErVS1SENSE --5.0%
VSENSE Series Resistor RVSENSE 9.5 10 10.5 kOhm
VSENSE Capacitor (optional)(23) CVSENSE - 100 - nF
Note:
23. The ESD behavior specified in Section 4.8, “ESD Protection and Latch-up Immunity" is guaranteed without the optional capacitor.
Table 26. 5.0 V I/O Characteristics for PTA, PTE, RESET and BKGD Pins
Ratings Symbol Min Typ Max Unit
Input high voltage VIH 0.65*VDDRX --V
Input high voltage VIH --
VDDRX +
0.3 V
Input low voltage VIL --
0.35*VDDR
X
V
Input low voltage VIL VSSRX - 0.3 - - V
Input hysteresis VHYS - 250 - mV
Input leakage current (pins in high-impedance input mode)
VIN = VDDRX or VSSRX IIN -1.0 - 1.0 A
Output high voltage (pins in output mode) IOH = -4.0 mA VOH VDDRX – 0.8 - - V
Output low voltage (pins in output mode) IOL = +4.0 mA VOL --0.8V
Internal pull-up resistance (VIHmin > input voltage > VILmax) RPUL 25 - 50 k
Internal pull-down resistance (VIHmin > input voltage > VILmax) RPDH 25 - 50 k
Input capacitance Cin -6.0-pF
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 22
4.5.2.2 Electrical Specification for MCU internal Volta ge Regulator
NOTE
The LVR monitors the voltages VDD_CORE, VDDFLASH and VDDRX. As soon as voltage drops
on these supplies which would prohibit the correct function of the microcontroller, the LVR is
triggering a reset.
4.5.2.3 Chip Power-up and Voltage Drops
LVI (low voltage interrupt), POR (power-on reset) and LVRs (low voltage reset) handle chip power-up or drops of the supply
voltage.
Injection current(24)
Single pin limit
Total device Limit, sum of all injected currents
IICS
IICP
-2.5
-25
-
-
2.5
25
mA
Note:
24. Refer to Section 4.8, “ESD Protection and Latch-up Immunity" for more details.
Table 27. IVREG Cha racteristics
Characteristic Symbol Min Typical Max Unit
VDDRX Low Voltage Reset (25)(26)(27)
Assert Level
Deassert Level
VLVRXA
VLVRXD
2.97
—
3.06
3.09
—
3.3
V
V
Power-on Reset(28)
Assert Level
Deassert Level
VPORA
VPORD
0.6
—
0.9
0.95
—
1.60
V
V
Note:
25. Device functionality is guaranteed on power down to the LVR assert level.
26. Monitors VDDRX, active only in Full Performance mode. MCU is monitored by the POR in RPM (see Figure ).
27. Monitors VDDRX, active only in Full Performance mode. VLVRA and VPORD.
28. Monitors MCU_CORE_VDD. Active in all modes.
Table 26. 5.0 V I/O Characteristics for PTA, PTE, RESET and BKGD Pins
Ratings Symbol Min Typ Max Unit
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 23
Figure 4. MC9S12I32 - Chip Power-up and Voltage Drops (not scaled)
4.6 Dynamic Electrical Characteristics
Dynamic characteristics noted under conditions 5.5 V VSUP 18 V, -40 °C TA 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise noted.
4.6.1 Dynamic Electrical Characteristic s Analog Die
Table 28. Dynamic Electrical Characteristics - Modes of Operation
Ratings Symbol Min Typ Max Unit
VDD Short Timeout tVTO 110 150 205 ms
Analog Base Clock fBASE - 100 - kHz
Reset Delay tRST 140 200 280 µs
Table 29. Dynamic Electrical Characteristics - Power Supply(29)
Ratings Symbol Min Typ Max Unit
Glitch Filter Low Battery Warning (LBI) tLB -2.0- µs
Glitch Filter Low Voltage Warning (LVI) tLV -2.0- µs
Glitch Filter High Voltage Warning (HVI) tHV -2.0- µs
Note:
29. Guaranteed by design.
VLVID
VLVIA
VLVRD
VLVRA
VPORD
LVI
POR
LVR
t
VVDDRX
V
DD_Core
LVI enabled LVI disabled due to LVR
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 24
Table 30. Dynamic Electrical Characteristics - Die to Die Interface - D2D
Ratings Symbol Min Typ Max Unit
Operating Frequency (D2DCLK, D2D[0:3]) fD2D --f
BUSMAX(30) MHz
Note:
30. fBUSMAX frequency ratings differ by device and is specified in Ta b l e 1
Ta ble 31. Dynamic Electrical Characteristics - Resets
Ratings Symbol Min Typ Max Unit
Reset Deglitch Filter Time tRSTDF 1.2 2.0 3.0 µs
Reset Low Level Duration tRSTLOW 140 200 280 µs
Table 32. Dynamic Electrical Characteristics - Wake-up / Cyclic Sense
Ratings Symbol Min Typ Max Unit
Lx Wake-up Filter Time tWUF -20 s
Cyclic Sense / Forced Wake-up Timing Accuracy - not trimmed CSAC -35 - 35 %
Cyclic Sense / Forced Wake-up Timing Accuracy - trimmed(31) CSACT -5.0 - 5.0 %
Time between HSx on and Lx sense during cyclic sense tSsame as tHSON / tHSONT -
HSx ON duration during Cyclic Sense tHSON 140 200 280 s
HSx ON duration during Cyclic Sense - trimmed(31) tHSONT 180 200 220 s
Note:
31. No trimming possible in Sleep mode.
Ta ble 33. Dynamic Electrical Characteristics - Window Watchdog
Ratings Symbol Min Typ Max Unit
Initial Non-window Watchdog Timeout tIWDTO 110 150 190 ms
Watchdog Timeout Accuracy - not trimmed WDAC -35 - 35 %
Watchdog Timeout Accuracy - trimmed WDACT -5.0 - 5.0 %
Table 34. Dynamic Electrical Characteristics - High Side Drivers - HS
Ratings Symbol Min Typ Max Unit
High Side Operating Frequency(32)
Load Condition: CLOAD2.2 nF; RLOAD500 fHS --50
kHz
Note:
32. Guaranteed by design.
Table 35. Dynamic Electrical Characteristics - Low Side Drivers - LS
Ratings Symbol Min Typ Max Unit
Low Side Operating Frequency fLS --10kHz
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 25
Table 36. Dynamic Ele ctrical Characteristics - LIN Physical Layer Interface - LIN
Ratings Symbol Min Typ Max Unit
Bus Wake-up Deglitcher (Sleep and Stop mode) tPROPWL 60 80 100 µs
Fast Bit Rate (Programming mode) BRFAST - - 100 kBit/s
Propagation Delay of Receiver, tREC_PD = MAX (tREC_PDR, tREC_PDF)(33) tREC_PD --6.0µs
Symmetry of Receiver Propagation Delay, tREC_PDF - tREC_PDR tREC_SYM -2.0 - 2.0 µs
Note:
33. VSUP from 7.0 to 18 V, bus load RBUS and CBUS 1.0nF / 1.0k, 6.8 nF / 660 , 10 nF / 500 . Measurement thresholds: 50% of TXD
signal to LIN signal threshold defined at each parameter. See Figure 5 and Figure 8.
LIN Driver - 20.0 kBit/s; Bus load conditions (CBUS; RBUS): 1.0nF; 1.0k / 6,8 nF;660 / 10 nF;500 . Measurement thresholds: 50% of TXD
signal to LIN signal threshold defined at each parameter. See Figure 5 and Figure 6.
Duty Cycle 1:
THREC(MAX) = 0.744 x VSUP
THDOM(MAX) = 0.581 x VSUP
7.0 V VSUP18 V; tBit = 50 µs;
D1 = tBUS_REC(MIN)/(2 x tBit)
D1 0.396 - -
Duty Cycle 2:
THREC(MIN) = 0.422 x VSUP
THDOM(MIN) = 0.284 x VSUP
7.6 V VSUP18 V; tBIT = 50 µs
D2 = tBUS_REC(MAX)/(2 x tBIT)
D2 - - 0.581
LIN Driver - 10.0 kBit/s; Bus load conditions (CBUS; RBUS): 1.0 nF; 1.0 k / 6,8 nF;660 / 10 nF;500 Measurement thresholds: 50% of TXD
signal to LIN signal threshold defined at each parameter. See Figure 5 and Figure 7.
Duty Cycle 3:
THREC(MAX) = 0.778 x VSUP
THDOM(MAX) = 0.616 x VSUP
7.0 V VSUP18 V; tBIT = 96 µs
D3 = TBUS_REC(MIN)/(2 x tBIT)
D3 0.417 - -
Duty Cycle 4:
THREC(MIN) = 0.389 x VSUP
THDOM(MIN) = 0.251 x VSUP
7.6 V VSUP18 V; tBIT = 96 µs
D4 = tBUS_REC(MAX)/(2 x tBIT)
D4 - - 0.590
LIN Transmitter Timing, (VSUP from 7.0 to 18 V) - See Figure 9
Transmitter Symmetry
ttran_sym < MAX(ttran_sym60%, ttran_sym40%)
tran_sym60% = ttran_pdf60% - ttran_pdr60%
tran_sym40% = ttran_pdf40% - ttran_pdr40%
ttran_sym -7.25 0 7.25 µs
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 26
Figure 5. Test Circuit for Timing Measurements
Figure 6. LIN Timing Meas ur ements for Normal Baud Rate
Note: R
0
and C
0
= 1.0 k
1.0 nF,
660 /6.8 nF, a,d 500 /10 nF
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 27
Figure 7. LIN Timing Measu rements for Slow Baud Rate
Figure 8. LIN Receiver Timing
Figure 9. LIN Transmitter Timing
BUS
TX
60%
40%
ttran_pdr60%
ttran_pdr40%ttran_pdf60%
ttran_pdf40%
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 28
4.6.2 Dynamic Electrical Characteristics MCU Die
4.6.2.1 NVM
4.6.2.1.1 Timing Parameters
The time base for all NVM program or erase operations is derived from the bus clock using the FCLKDIV register. The frequency
of this derived clock must be set within the limits specified as fNVMOP
. The NVM module does not have any means to monitor the
frequency and will not prevent program or erase operations at frequencies above or below the specified minimum. When
attempting to program or erase the NVM module at a lower frequency, a full program or erase transition is not assured.
The following sections provide equations which can be used to determine the time required to execute specific flash commands.
All timing parameters are a function of the bus clock frequency, fNVMBUS. All program and erase times are also a function of the
NVM operating frequency, fNVMOP
. A summary of key timing parameters can be found in Table 39.
4.6.2.1.1.1 Erase Verify All Blocks (Blank Check) (FCMD=0x01)
The time required to perform a blank check on all blocks is dependent on the location of the first non-blank word starting at relative
address zero. It takes one bus cycle per phrase to verify plus a setup of the command. Assuming that no non-blank location is
found, then the time to erase verify all blocks is given by:
4.6.2.1.1.2 Erase Verify Block (Blank Check) (FCMD=0x02)
The time required to perform a blank check is dependent on the location of the first non-blank word starting at relative address
zero. It takes one bus cycle per phrase to verify plus a setup of the command.
Assuming that no non-blank location is found, then the time to erase verify a P-Flash block is given by:
Table 37. Dynamic Electrical Characteristics - General Purpose I/O - PTB[0…2](34)
Ratings Symbol Min Typ Max Unit
GPIO Digital Frequency fPTB --10MHz
Propagation Delay - Rising Edge(35) tPDR - - 20 ns
Rise Time - Rising Edge(34) tRISE --17.5ns
Propagation Delay - Falling Edge(34) tPDF - - 20 ns
Rise Time - Falling Edge(34) tFALL --17.5ns
Note:
34. Guaranteed by design.
35. Load PTBx = 100 pF.
Table 38. Dynamic Ele ctrical Cha racteristics - Analog Digital Converter - ADC(36)
Ratings Symbol Min Typ Max Unit
ADC Operating Frequency fADC 1.6 2.0 2.4 MHz
Conversion Time (from ACCR write to CC Flag) tCONV 26 clk
Sample Frequency Channel 14 (Bandgap) fCH14 --2.5kHz
Note:
36. Guaranteed by design.
tcheck 19200 1
fNVMBUS
---------------------
=
tpcheck 17200 1
fNVMBUS
---------------------
=
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 29
Assuming that no non-blank location is found, then the time to erase verify a D-Flash block is given by:
4.6.2.1.1.3 Erase Verify P-Flash Section (FCMD=0x03)
The maximum time to erase verify a section of P-Flash depends on the number of phrases being verified (NVP) and is given by:
4.6.2.1.1.4 Read Once (FCMD=0x04)
The maximum read once time is given by:
4.6.2.1.1.5 Program P-Flash (FCMD=0x06)
The programming time for a single phrase of four P-Flash words and the two seven-bit ECC fields is dependent on the bus
frequency, fNVMBUS, as well as on the NVM operating frequency, fNVMOP
.
The typical phrase programming time is given by:
The maximum phrase programming time is given by:
4.6.2.1.1.6 Program Once (FCMD=0x07)
The maximum time required to program a P-Flash Program Once field is given by:
4.6.2.1.1.7 Erase All Blocks (FCMD=0x08)
The time required to erase all blocks is given by:
4.6.2.1.1.8 Erase P-Flash Block (FCMD=0x09)
The time required to erase the P-Flash block is given by:
tdcheck 2800 1
fNVMBUS
---------------------
=
t450 NVP
+
1
fNVMBUS
---------------------
t400 1
fNVMBUS
---------------------
=
tppgm 164 1
fNVMOP
------------------ 2000 1
fNVMBUS
---------------------
+
tppgm 164 1
fNVMOP
------------------ 2500 1
fNVMBUS
---------------------
+
t164 1
fNVMOP
------------------ 2150 1
fNVMBUS
---------------------
+
tmass 100100 1
fNVMOP
------------------ 38000 1
fNVMBUS
---------------------
+
tpmass 100100 1
fNVMOP
------------------ 35000 1
fNVMBUS
---------------------
+
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 30
4.6.2.1.1.9 Erase P-Flash Sector (FCMD=0x0A)
The typical time to erase a 512-byte P-Flash sector is given by:
The maximum time to erase a 512-byte P-Flash sector is given by:
4.6.2.1.1.10 Unsecure Flash (FCMD=0x0B)
The maximum time required to erase and unsecure the Flash is given by:
4.6.2.1.1.11 Verify Backdoor Access Key (FCMD=0x0C)
The maximum verify back door access key time is given by:
4.6.2.1.1.12 Set User Margin Level (FCMD=0x0D)
The maximum set user margin level time is given by:
4.6.2.1.1.13 Set Field Margin Level (FCMD=0x0E)
The maximum set field margin level time is given by:
4.6.2.1.1.14 Erase Verify D-Flash Section (FCMD=0x10)
The time required to Erase Verify D-Flash for a given number of words NW is given by:
4.6.2.1.1.15 Program D-Flash (FCMD=0x11)
D-Flash programming time is dependent on the number of words being programmed and their location with respect to a row
boundary, since programming across a row boundary requires extra steps. The D-Flash programming time is specified for
different cases: 1,2,3,4 words and 4 words across a row boundary.
The typical D-Flash programming time is given by the following equation, where NW denotes the number of words; BC=0 if no
row boundary is crossed and BC=1 if a row boundary is crossed:
tpera 20020 1
fNVMOP
------------------
700 1
fNVMBUS
---------------------
+
tpera 20020 1
fNVMOP
------------------
1400 1
fNVMBUS
---------------------
+
tuns 100100 1
fNVMOP
------------------ 38000 1
fNVMBUS
---------------------
+
t400 1
fNVMBUS
---------------------
=
t350 1
fNVMBUS
---------------------
=
t350 1
fNVMBUS
---------------------
=
tdcheck 450 NW
+
1
fNVMBUS
---------------------
tdpgm 14 54 NW
+14 BC+1
fNVMOP
------------------
500 525 NW
100 BC++
1
fNVMBUS
---------------------
+
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 31
The maximum D-Flash programming time is given by:
4.6.2.1.1.16 Erase D-Flash Sector (FCMD=0x12)
Typical D-Flash sector erase times, expected on a new device where no margin verify fails occur, is given by:
Maximum D-Flash sector erase times is given by:
The D-Flash sector erase time is ~5.0 ms on a new device and can extend to ~20 ms as the flash is cycled.
4.6.2.1.2 NVM Reliability Parameters
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process monitors, and burn-in to
screen early life failures.
The data retention and program/erase cycling failure rates are specified at the operating conditions noted. The program/erase
cycle count on the sector is incremented every time a sector or mass erase event is executed.
NOTE
All values shown in Tab le 4 0 are preliminary and subject to further characterization.
Ta ble 39. NVM Timing Characteristics (FTMRC)
C Rating Symbol Min Typ(37) Max(38) Unit(39)
Bus frequency(40) fNVMBUS 1—32MHz
Operating frequency fNVMOP 0.8 1.0 1.05 MHz
D Erase all blocks (mass erase) time tmass — 100 130 ms
D Erase verify all blocks (blank check) time tCHECK — — 19200 tCYC
D Unsecure Flash time tUNS — 100 130 ms
D P-Flash block erase time tPMASS — 100 130 ms
D P-Flash erase verify (blank check) time tPCHECK — — 17200 tCYC
D P-Flash sector erase time tPERA —2026ms
D P-Flash phrase programming time tPPGM — 226 285 s
D D-Flash sector erase time tDERA —5
(41) 26 ms
D D-Flash erase verify (blank check) time tDCHECK — — 2800 tCYC
D D-Flash one word programming time tDPGM1 — 100 107 s
D D-Flash two word programming time tDPGM2 — 170 185 s
D D-Flash three word programming time tDPGM3 — 241 262 s
D D-Flash four word programming time tDPGM4 —311339s
D D-Flash four word programming time crossing row boundary tDPGM4C — 328 357 s
Note:
37. Typical program and erase times are based on typical fNVMOP and maximum fNVMBUS.
38. Maximum program and erase times are based on minimum fNVMOP and maximum fNVMBUS.
39. tCYC = 1 / fNVMBUS
40. The maximum device bus clock is specified as fBUS.
41. Typical value for a new device.
tdpgm 14 54 NW
+14 BC+1
fNVMOP
------------------
500 750NW 100 BC++
1
fNVMBUS
---------------------
+
tdera 5025 1
fNVMOP
------------------ 700 1
fNVMBUS
---------------------
+
tdera 20100 1
fNVMOP
------------------ 3400 1
fNVMBUS
---------------------
+
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 32
4.6.2.2 Phase Locke d Loop
4.6.2.2.1 Jitter Definitions
With each transition of the feedback clock, the deviation from the reference clock is measured and input voltage to the VCO is
adjusted accordingly.The adjustment is done continuously with no abrupt changes in the VCOCLK frequency. Noise, voltage,
temperature, and other factors cause slight variations in the control loop resulting in a clock jitter. This jitter affects the real
minimum and maximum clock periods, as illustrated in Figure 10.
Figure 10. Jitter Definitions
The relative deviation of tNOM is at its maximum for one clock period, and decreases towards zero for larger number of clock
periods (N). Jitter is defined as:
Table 40. NVM Reliability Characteristics
Rating Symbol Min Typ Max Unit
Program Flash Arrays
Data retention at an average junction temperature of TJAVG = 85 C(42) after up to
10,000 program/erase cycles tNVMRET 20 100(43) — Years
Program Flash number of program/erase cycles
(-40 C TJ 150 CnFLPE 10K 100K(44) —Cycles
Data Flash Array
Data retention at an average junction temperature of TJAVG = 85 C(42) after up to
50,000 program/erase cycles tNVMRET 5 100(43) — Years
Data retention at an average junction temperature of TJAVG = 85 C(42) after up to
10,000 program/erase cycles tNVMRET 10 100(43) — Years
Data retention at an average junction temperature of TJAVG = 85 C(42) after less
than 100 program/erase cycles tNVMRET 20 100(43) — Years
Data Flash number of program/erase cycles (-40 C TJ 150 CnFLPE 50K 500K(44) —Cycles
Note:
42. TJAVG does not exceed 85 C in a typical temperature profile over the lifetime of a consumer, industrial or automotive application.
43. Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25 C
using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please refer to Engineering
Bulletin EB618
44. Spec table quotes typical endurance evaluated at 25 C for this product family. For additional information on how Freescale defines
Typical Endurance, please refer to Engineering Bulletin EB619.
23 N-1N1
tNOM
tMAX1
tMIN1
tMAXN
tMINN
0
JN max 1tmax N
Nt
nom
-----------------------
–1
tmin N
Nt
nom
-----------------------
–,
=
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 33
For N < 100, the following equation is a good fit for the maximum jitter:
Figure 11. Maximum Bus Clock Jitter Approximation
NOTE
On timers and serial modules a prescaler will eliminate the effect of the jitter to a large extent.
4.6.2.2.2 Electrical Characteristics for the PLL(45)
4.6.2.3 Electrical Characteristics for the IRC1M
Table 41. PLL Characteristics
Rating Symbol Min Typ Max Unit
VCO Frequency During System Reset fVCORST 8.0 — 32 MHz
VCO Locking Range fVCO 32 — 64 MHz
Reference Clock fREF 1.0 — — MHz
Lock Detection Lock|0 — 1.5%
(46)
Un-Lock Detection unl| 0.5 — 2.5 %(46)
Time to Lock tlock ——
150 +
256/fREF s
Jitter Fit Parameter 1(47) j1——1.2%
Note:
45. the maximum device bus clock is specified as fBUS.
46. % deviation from target frequency.
47. fREF = 1.0 MHz, fBUS = 32 MHz equivalent fPLL = 64 MHz, REFRQ=00, SYNDIV=$1F, VCOFRQ=01, POSTDIV=$00.
Table 42. IRC1M Characteristics
Rating Symbol Min Typ Max Unit
Internal Reference Frequency, Factory Trimmed
-40 °C TJ 150 °C fIRC1M_TRIM 0.987 1.0 1.013 MHz
JN j1
N
--------
=
1 5 10 20 N
J(N)
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 34
4.6.2.4 Electrical Characteristics for the Oscillator (OSCLCP)
4.6.2.5 Reset Characte ristics
4.6.2.6 SPI Timing
This section provides electrical parametrics and ratings for the SPI. In Tabl e 45 the measurement conditions are listed.
4.6.2.6.1 Master Mode
In Figure 12 the timing diagram for master mode with transmission format CPHA = 0 is depicted.
Table 43. OSCLCP Characteristics
Rating Symbol Min Typ Max Unit
Crystal Oscillator Range fOSC 4.0 — 16 MHz
Startup Current iOSC 100 — — A
Oscillator Start-up time (LCP, 4MHz)(48) tUPOSC —2.010 ms
Oscillator Start-up time (LCP, 8MHz)(48) tUPOSC —1.68.0 ms
Oscillator Start-up time (LCP, 16MHz)(48) tUPOSC —1.05.0 ms
Clock Monitor Failure Assert Frequency fCMFA 200 450 1200 KHz
Input Capacitance (EXTAL, XTAL pins) CIN —7.0— pF
EXTAL Pin Input Hysteresis VHYS,EXTAL —120— mV
EXTAL Pin Oscillation Amplitude (loop controlled Pierce) VPP,EXTAL —0.9— V
Note:
48. These values apply for carefully designed PCB layouts with capacitors that match the crystal/resonator requirements.
49. Only applies if EXTAL is externally driven.
Table 44. Reset and Stop Characteristics
Rating Symbol Min Typ Max Unit
Reset Input Pulse Width, Minimum Input Time PWRSTL 2.0 — — tVCORST
Startup from Reset nRST — 768 — tVCORST
STOP Recovery Time tSTP_REC —50—s
Table 45. Measurement Conditions
Description Value Unit
Drive mode Full drive mode —
Load capacitance CLOAD(50), on all outputs 50 pF
Thresholds for delay measurement points (20% / 80%) VDDRX V
Note:
50. Timing specified for equal load on all SPI output pins. Avoid asymmetric load.
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 35
Figure 12. SPI Master Timing (CPHA = 0)
In Figure 13 the timing diagram for master mode with transmission format CPHA=1 is depicted.
Figure 13. SPI Master Timing (CPHA = 1)
In Table 46 the timing characteristics for master mode are listed.
SCK
(Output)
SCK
(Output)
MISO
(Input)
MOSI
(Output)
SS
(Output)
1
9
5 6
MSB IN2
Bit MSB-1…1
LSB IN
MSB OUT2 LSB OUT
Bit MSB-1… 1
11
4
4
2
10
(CPOL = 0)
(CPOL = 1)
3
13
13
1. If configured as an output.
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, bit 2... MSB.
12
12
SCK
(Output)
SCK
(Output)
MISO
(Input)
MOSI
(Output)
1
5 6
MSB IN2
Bit MSB-1... 1
LSB IN
Master MSB OUT2 Master LSB OUT
Bit MSB-1... 1
4
4
9
12 13
11
Port Data
(CPOL = 0)
(CPOL = 1)
Port Data
SS
(Output)
212 13 3
1.If configured as output
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1,bit 2... MSB.
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 36
4.6.2.6.2 Slave Mode
In Figure 14 the timing diagram for slave mode with transmission format CPHA = 0 is depicted.
Figure 14. SPI Slave Timing (CPHA = 0)
In Figure 15 the timing diagram for slave mode with transmission format CPHA = 1 is depicted.
Ta ble 46. SPI Master Mode Timing Characteristics
Characteristic Symbol Min Typ Max Unit
SCK Frequency fSCK 1/2048 — 12f
BUS
SCK Period tSCK 2.0 — 2048 tBUS
Enable Lead Time tLEAD —1/2—t
SCK
Enable Lag Time tLAG —1/2—t
SCK
Clock (SCK) High or Low Time tWSCK —1/2—t
SCK
Data Setup Time (inputs) tSU 8.0 — — ns
Data Hold Time (inputs) tHI 8.0 — — ns
Data Valid After SCK Edge tVSCK — — 29 ns
Data Valid After SS Fall (CPHA = 0) tVSS — — 15 ns
Data Hold Time (outputs) tHO 20 — — ns
Rise and Fall Time Inputs tRFI ——8.0ns
Rise and Fall Time Outputs tRFO ——8.0ns
SCK
(Input)
SCK
(Input)
MOSI
(Input)
MISO
(Output)
SS
(Input)
1
9
5 6
MSB IN
Bit MSB-1... 1
LSB IN
Slave MSB Slave LSB OUT
Bit MSB-1... 1
11
4
4
2
7
(CPOL = 0)
(CPOL = 1)
3
13
NOTE: Not defined
12
12
11
See
13
Note
8
10
See
Note
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 37
Figure 15. SPI Slave Timing (CPHA = 1)
In Table 47 the timing characteristics for slave mode are listed.
Table 47. SPI Slave Mode Timing Characteristics
Characteristic Symbol Min Typ Max Unit
SCK Frequency fSCK DC — 14f
BUS
SCK Period tSCK 4— tBUS
Enable Lead Time tLEAD 4— — t
BUS
Enable Lag Time tLAG 4.0 — — tBUS
Clock (SCK) High or Low Time tWSCK 4.0 — — tBUS
Data Setup Time (inputs) tSU 8.0 — — ns
Data Hold Time (inputs) tHI 8.0 — — ns
Slave Access Time (time to data active) tA—— 20 ns
Slave MISO Disable Time tDIS —— 22 ns
Data Valid After SCK Edge tVSCK — — 29 + 0.5 tBUS(51) ns
Data Valid After SS Fall tVSS — — 29 + 0.5 tBUS(51) ns
Data Hold Time (outputs) tHO 20 — — ns
Rise and Fall Time Inputs tRFI —— 8.0 ns
Rise and Fall Time Outputs tRFO —— 8.0 ns
Note:
51. 0.5 tBUS added due to internal synchronization delay
SCK
(Input)
SCK
(Input)
MOSI
(Input)
MISO
(Output)
1
5 6
MSB IN
Bit MSB-1... 1
LSB IN
MSB OUT Slave LSB OUT
Bit MSB-1… 1
4
4
9
12 13
11
(CPOL = 0)
(CPOL = 1)
SS
(Input)
212 13
3
NOTE: Not defined
Slave
7
8
See
Note
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 38
4.7 Thermal Protection Characteristics
Characteristics noted under conditions 5.5 V VSUP 18 V, -40 °C TA 125 °C, unless otherwise noted. Typical values noted
reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise noted.
4.8 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive grade integrated circuits. During the
device qualification, ESD stresses were performed for the Human Body Model (HBM), Machine Model (MM), Charge Device
Model (CDM), as well as LIN transceiver specific specifications.
A device will be defined as a failure if after exposure to ESD pulses, the device no longer meets the device specification.
Complete DC parametric and functional testing is performed per the applicable device specification at room temperature,
followed by hot temperature, unless specified otherwise in the device specification.
Ta ble 48. Thermal Charac teristics - Voltage Regulators VDD (2.5 V) & VDDX (5.0 V)(52)
Ratings Symbol Min Typ Max Unit
VDD/VDDX High-temperature Warning (HTI)
Threshold
Hysteresis
THTI
THTI_H
110
-
125
10
140
-
°C
VDD/VDDX Over-temperature Shutdown
Threshold
Hysteresis
TSD
TSD_H
155
-
170
10
185
-
°C
HSUP Over-temperature Shutdown THSUPSD 150 165 180 °C
HSUP Over-temperature Shutdown Hysteresis THSUPSD_HYS -10-°C
HS Over-temperature Shutdown THSSD 150 165 180 °C
HS Over-temperature Shutdown Hysteresis THSSD_HYS -10-°C
LS Over-temperature Shutdown TLSSD 150 165 180 °C
LS Over-temperature Shutdown Hysteresis TLSSD_HYS -10-°C
LIN Over-temperature Shutdown TLINSD 150 165 200 °C
LIN Over-temperature Shutdown Hysteresis TLINSD_HYS -20-°C
Note:
52. Guaranteed by characterization. Functionality tested.
Table 49. ESD and Latch-up Protection Characteristics
Ratings Symbol Value Unit
ESD - Human Body Model (HBM) following AEC-Q100 / JESD22-A114
(CZAP = 100 pF, RZAP = 1500 )
- LIN (DGND, PGND, AGND, and LGND shorted)
- VS1, VS2, VSENSE, Lx
- HSx
- All other Pins
VHBM
±8000
±4000
±3000
±2000
V
ESD - Charged Device Model (CDM) following AEC-Q100,
Corner Pins (1, 12, 13, 24, 25, 36, 37, and 48)
All other Pins
VCDM ±750
±500
V
ESD - Machine Model (MM) following AEC-Q100
(CZAP = 200 pF, RZAP =0), All Pins VMM ±200 V
Latch-up current at TA= 125 C(53) ILAT ±100 mA
Electrical Characteristics
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 39
4.9 Additional Test Information ISO7637-2
Immunity against transients for the LIN, Lx, and VBAT, is specified according to the LIN Conformance Test Specification - Section
LIN EMC Test Specification refer to the LIN Conformance Test Certification Report - available as separate document.
ESD GUN - LIN Conformance Test Specification(55), unpowered, contact
discharge, CZAP= 150 pF, RZAP = 330 .
- LIN (with or without bus filter CBUS=220 pF)
- VS1, VS2 with CVS
- Lx with serial RLX
±15000
±20000
±6000
V
ESD GUN - following IEC 61000-4-2 Test Specification(56), unpowered,
contact discharge, CZAP= 150 pF, RZAP = 330
- LIN (with or without bus filter CBUS=220 pF)
- VSENSE with serial RVSENSE(54)
- VS1, VS2 with CVS
- Lx with serial RLX
±8000
±8000
±8000
±8000
V
ESD GUN - following ISO10605 Test Specification(56), unpowered, contact
discharge, CZAP= 150 pF, RZAP =2.0k
- LIN (with or without bus filter CBUS=220pF)
- VSENSE with serial RVSENSE(54)
- VS1, VS2 with CVS
- Lx with serial RLX
±6000
±6000
±6000
±6000
V
ESD GUN - following ISO10605 Test Specification(56), powered, contact
discharge, CZAP= 330 pF, RZAP =2.0k
- LIN (with or without bus filter CBUS=220 pF)
- VSENSE with serial RVSENSE(54)
- VS1, VS2 with CVS
- Lx with serial RLX
±8000
±8000
±8000
±8000
V
Note:
53. Input Voltage Limit = -2.5 to 7.5 V.
54. With CVBAT (10…100 nF) as part of the battery path.
55. Certification available on request
56. Tested internally only; certification pending
Table 49. ESD and Latch-up Protection Characteristics (continued)
Ratings Symbol Value Unit
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 40
5 Functional Description and Application Information
5.1 Introduction
This chapter describes the MM912_634 dual die device functions on a block by block base. To distinguish between the module
location being the MCU die or the analog die, the following symbols are shown on all module cover pages:
The documented module is physically located on the Analog die. This applies to Section 5.3, “MM912_634 - Analog
Die Overview" through Section 5.26, “MM912_634 - Analog Die Trimming".
The documented module is physically located on the Microcontroller die. This applies to Section 5.27, “MM912_634
- MCU Die Overview" through Section 5.39, “Serial Peripheral Interface (S12SPIV5)".
Sections concerning both dies or the complete device will not have a specific indication.
5.2 Device Register Maps
Table 50 shows the device register memory map overview for the 64 kByte MCU die (MC9S12I64).
Table 50. Device Register Memory Map Overvie w
Address Module Size (Bytes)
0x0000–0x0009 PIM (port integration module) 10
0x000A–0x000B MMC (memory map control) 2
0x000C–0x000D PIM (port integration module) 2
0x000E–0x000F Reserved 2
0x0010–0x0015 MMC (memory map control) 8
0x0016–0x0019 Reserved 2
0x001A–0x001B Device ID register 2
0x001C–0x001E Reserved 4
0x001F INT (interrupt module) 1
0x0020–0x002F DBG (debug module) 16
0x0030–0x0033 Reserved 4
0x0034–0x003F CPMU (clock and power management) 12
0x0040–0x00D7 Reserved 152
0x00D8–0x00DF D2DI (die 2 die initiator) 8
0x00E0–0x00E7 Reserved 32
0x00E8–0x00EF SPI (serial peripheral interface) 8
0x00F0–0x00FF Reserved 32
0x0100–0x0113 FTMRC control registers 20
0x0114–0x011F Reserved 12
0x0120–0x017F PIM (port integration module) 96
0x0180–0x01EF Reserved 112
0x01F0–0x01FC CPMU (clock and power management) 13
0x01FD–0x01FF Reserved 3
0x0200-0x02FF D2DI (die 2 die initiator, blocking access window) 256
0x0300–0x03FF D2DI (die 2 die initiator, non-blocking write window) 256
ANALOGMCU
ANALOGMCU
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 41
NOTE
Reserved register space shown in Tab le 5 0 is not allocated to any module. This register
space is reserved for future use, and will show as grayed areas in tables throughout this
document. Writing to these locations has no effect. Read access to these locations returns
zero.
5.2.1 Detailed Module Register Maps
Table 51 to Tab le 7 3 show the detailed module maps of the MC9S12I64 MCU die.
Table 51. 0x0000–0x0007 Port Integration Module (PIM) Map 1 of 3
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0000 PORTA RPA7 PA6 PA5 PA4 PA3 PA2 PA1 PA 0
W
0x0001 PORTB R000000
PB1 PB0
W
0x0002 DDRA RDDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0
W
0x0003 DDRE R000000
DDRE1 DDRE0
W
0x0004-
0x0009 Reserved R00000000
W
Table 52. 0x000A–0x000B Memory Map Control (MMC) Map 1 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x000A Reserved R00000000
W
0x000B MODE RMODC 0000000
W
Table 53. 0x000C–0x000D Port In tegration Module (PIM) Map 2 of 3
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x000C PUCR R0 BKPUE 0000
PDPEE 0
W
0x000D RDRIV R0000
RDRD RDRC 00
W
Table 54. 0x000E–0x000F Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x000E-
0x000F Reserved R00000000
W
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 42
Ta ble 55. 0x0010–0x001B Memory Map Control (MMC) Map 2 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0010 Reserved R00000000
W
0x0011 DIRECT RDP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8
W
0x0012 Reserved R00000000
W
0x0013 Reserved R00000000
W
0x0014 Reserved R00000000
W
0x0015 PPAGE R0000
PIX3 PIX2 PIX1 PIX0
W
Table 56. 0x0016–0x0019 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0016-
0x0019 Reserved R00000000
W
Table 57. 0x001A–0x001B Device ID Register (PARTIDH/PARTIDL)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x001A PARTIDH RPARTIDH
W
0x001B PARTIDL RPARTIDL
W
Ta ble 58. 0x001C–0x001E Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x001C-
0x001E Reserved R00000000
W
Table 59. 0x001F Interrupt Module (INT)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x001F IVBR RIVB_ADDR[7:0]
W
Table 60. 0x0020–0 x002F Debug Module (DBG)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0020 DBGC1 RARM 00
BDM DBGBRK 0COMRV
WTRIG
0x0021 DBGSR R TBF 0 0 0 0 SSF2 SSF1 SSF0
W
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 43
0x0022 DBGTCR R0 TSOURCE 00 TRCMOD 0TALIGN
W
0x0023 DBGC2 R000000 ABCM
W
0x0024 DBGTBH R Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
0x0025 DBGTBL R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
0x0026 DBGCNT R TBF 0 CNT
W
0x0027
DBGSCRX R0000
SC3 SC2 SC1 SC0
W
DBGMFR R00000MC2MC1MC0
W
0x0028
DBGACTL RSZE SZ TAG BRK RW RWE NDB COMPE
W
DBGBCTL RSZE SZ TAG BRK RW RWE 0COMPE
W
DBGCCTL R0 0 TAG BRK RW RWE 0COMPE
W
0x0029 DBGXAH R000000
Bit 17 Bit 16
W
0x002A DBGXAM RBit 15 14 13 12 11 10 9 Bit 8
W
0x002B DBGXAL RBit 7654321Bit 0
W
0x002C DBGADH RBit 15 14 13 12 11 10 9 Bit 8
W
0x002D DBGADL RBit 7654321Bit 0
W
0x002E DBGADHM RBit 15 14 13 12 11 10 9 Bit 8
W
0x002F DBGADLM RBit 7654321Bit 0
W
Table 61. 0x0030–0x033 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0030-
0x0033 Reserved R00000000
W
Table 60. 0x0020–0 x002F Debug Module (DBG)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 44
Table 62. 0x0034–0x003F Clock and Power Management (CPMU) Map 1 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0034 CPMU
SYNR
RVCOFRQ[1:0] SYNDIV[5:0]
W
0x0035 CPMU
REFDIV
RREFFRQ[1:0] 00 REFDIV[3:0]
W
0x0036 CPMU
POSTDIV
R000 POSTDIV[4:0]
W
0x0037 CPMUFLG RRTIF PORF LVRF LOCKIF LOCK ILAF OSCIF UPOSC
W
0x0038 CPMUINT RRTIE 00
LOCKIE 00
OSCIE 0
W
0x0039 CPMUCLKS RPLLSEL PSTP 00
PRE PCE RTI
OSCSEL
COP
OSCSEL
W
0x003A CPMUPLL R0 0 FM1 FM0 0000
W
0x003B CPMURTI RRTDEC RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0
W
0x003C CPMUCOP RWCOP RSBCK 000
CR2 CR1 CR0
W WRTMASK
0x003D Reserved R00000000
W
0x003E Reserved R00000000
W
0x003F CPMU
ARMCOP
R00000000
W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Ta ble 63. 0x0040–0x0D7 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0040-
0x00D7 Reserved R00000000
W
Tab le 64. 0x00D8–0x00D F Die 2 Die Initiator (D2DI) Map 1 of 3
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00D8 D2DCTL0 RD2DEN D2DCW D2DSWAI 000
D2DCLKDIV[1:0]
W
0x00D9 D2DCTL1 RD2DIE 000 TIMEOUT[3:0]
W
0x00DA D2DSTAT0 RERRIF ACKERF CNCLF TIMEF TERRF PARF PAR1 PAR0
W
0x00DB D2DSTAT1 RD2DIF D2DBSY 0 00000
W
0x00DC D2DADRHI RRWB SZ8 0 NBLK0000
W
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 45
0x00DD D2DADRLO R ADR[7:0]
W
0x00DE D2DDATAHI R DATA[15:8]
W
0x00DF D2DDATALO R DATA[7:0]
W
Table 65. 0x00E0–0x0E7 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00E0-
0x00E7 Reserved R00000000
W
Table 66. 0x00E8–0x00EF Serial Peripheral Interface (SPI)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00E8 SPICR1 RSPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
0x00E9 SPICR2 R0 XFRW 0MODFEN BIDIROE 0SPISWAI SPC0
W
0x00EA SPIBR R0 SPPR2 SPPR1 SPPR0 0SPR2 SPR1 SPR0
W
0x00EB SPISR R SPIF 0 SPTEF MODF 0 0 0 0
W
0x00EC SPIDRH R R15 R14 R13 R12 R11 R10 R9 R8
W T15 T14 T13 T12 T11 T10 T9 T8
0x00ED SPIDRL RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
0x00EE Reserved R00000000
W
0x00EF Reserved R00000000
W
Table 67. 0x00F0–0x 0FF Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00E0-
0x00FF Reserved R00000000
W
Tab le 64. 0x00D8–0x00D F Die 2 Die Initiator (D2DI) Map 1 of 3
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 46
Tab le 68. 0x0100–0x011F Flash Mo dule (FTMRC)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0100 FCLKDIV RFDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0101 FSEC R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0102 FCCOBIX R00000
CCOBIX2 CCOBIX1 CCOBIX0
W
0x0103 Reserved R00000000
W
0x0104 FCNFG RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0105 FERCNFG R000000
DFDIE SFDIE
W
0x0106 FSTAT RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0107 FERSTAT R000000
DFDIF SFDIF
W
0x0108 FPROT RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0109 DFPROT RDPOPEN 000
DPS3 DPS2 DPS1 DPS0
W
0x010A FCCOBHI RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x010B FCCOBLO RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x010C Reserved R00000000
W
0x010D Reserved R00000000
W
0x010E Reserved R00000000
W
0x010F Reserved R00000000
W
0x0110 FOPT R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0111 Reserved R00000000
W
0x0112 Reserved R00000000
W
0x0113 Reserved R00000000
W
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 47
Ta ble 69. 0x0120 Port Integration Mod ule (PIM) Ma p 3 of 3
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0120 PTIA R PTIA7 PTIA6 PTIA5 PTIA4 PTIA3 PTIA2 PTIA1 PTIA0
W
0x0121 PTIB R000000PTIB1PTIB0
W
0x0122-
0x017F Reserved R00000000
W
Table 70. 0x0180–0x1 EF Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0180-
0x01EF Reserved R00000000
W
Table 71. 0x01F0–0x01FF Clock and Power Management (CPMU) Map 2 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x01F0 Reserved R00000000
W
0x01F1 CPMU
LVCTL
R00 000LVDS
LVIE LVIF
W
0x01F6 Reserved R00000000
W
0x01F7 Reserved R00000000
W
0x01F8 CPMU
IRCTRIMH
RTCTRIM[3:0] 00 IRCTRIM[9:8]
W
0x01F9 CPMU
IRCTRIML
RIRCTRIM[7:0]
W
0x01FA CPMUOSC ROSCE OSCBW
OSCPINS_
EN OSCFILT[4:0]
W
0x01FB CPMUPROT R0000000
PROT
W
0x01FC Reserved R00000000
W
Table 72. 0x01FD–0x1FF Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x01FD-
0x01FF Reserved R00000000
W
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 48
Table 74 shows the detailed module maps of the MM912_634 analog die.
Table 73. 0x0200–0x03FF Die-To-Die Initiator Blocking and Non-Blocking Access Window
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0200-
0x02FF
Blocking Access
Window
R
W
0x0300-
0x03FF
Non-Blocking
Access Window
R
W
Ta ble 74. Analog die Registers(57) - 0x0200–0x02FF D2D Bloc king Access (D2DI) 2 of 3/
0x0300–0x03FF D2D Non Blocking Access (D2DI) 3 of 3
Offset Name 76543210
0x00 ISR (hi) R 0 0 HOT LSOT HSOT LINOT SCI RX
Interrupt Source Register W
0x01 ISR (lo) R TX ERR TOV CH3 CH2 CH1 CH0 VSI
Interrupt Source Register W
0x02 IVR R 0 0 IRQ
Interrupt Vector Register W
0x04 VCR R 0 0 0 VROVIE HTIE HVIE LVIE LBIE
Voltage Control Register W
0x05 VSR R 0 0 0 VROVC HTC HVC LVC LBC
Voltage Status Register W
0x08 LXR R 0 0 L5 L4 L3 L2 L1 L0
Lx Status Register W
0x09 LXCR R 0 0 L5DS L4DS L3DS L2DS L1DS L0DS
Lx Control Register W
0x10 WDR R WDOFF WDWO 0 0 0 WDTO
Watchdog Register W
0x11 WDSR R WDSR
Watchdog Service Register W
0x12 WCR R CSSEL L5WE L4WE L3WE L2WE L1WE L0WE
Wake Up Control Register W
0x13 TCR R FWM CST
Timing Control Register W
0x14 WSR R FWU LINWU L5WU L4WU L3WU L2WU L1WU L0WU
Wake Up Source Register W
0x15 RSR R 0 0 WDR EXR WUR LVRX LVR POR
Reset Status Register W
0x16 MCR R000000 MODE
Mode Control Register W
0x18 LINR R LINOTIE LINOTC RX TX LVSD LINEN LINSR
LIN Register W
0x20 PTBC1 R 0 PUEB2 PUEB1 PUEB0 0DDRB2 DDRB1 DDRB0
Port B Configuration Register 1 W
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 49
0x21 PTBC2 R 0 0 0 0 PWMCS PWMEN SERMOD
Port B Config Register 2 W
0x22 PTB R00000
PTB2 PTB1 PTB0
Port B Data Register W
0x28 HSCR R HSOTIE HSHVSD
EPWMCS2 PWMCS1 PWMHS2 PWMHS1 HS2 HS1
High Side Control Register W
0x29 HSSR R HSOTC 0 0 0 HS2CL HS1CL HS2OL HS1OL
High Side Status Register W
0x30 LSCR R LSOTIE 0PWMCS2 PWMCS1 PWMLS2 PWMLS1 LS2 LS1
Low Side Control Register W
0x31 LSSR R LSOTC 0 0 0 LS2CL LS1CL LS2OL LS1OL
Low Side Status Register W
0x32
LSCEN R0000
LSCEN
Low-Side Control Enable
Register W
0x38 HSR R HOTIE HOTC00000
HSUPON
Hall Supply Register W
0x3C CSR R CSE 000
CCD CSGS
Current Sense Register W
0x40 SCIBD (hi) R LBKDIE RXEDGIE 0SBR12 SBR11 SBR10 SBR9 SBR8
SCI Baud Rate Register W
0x41 SCIBD (lo) R SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
SCI Baud Rate Register W
0x42 SCIC1 R LOOPS 0RSRC M 0ILT PE PT
SCI Control Register 1 W
0x43 SCIC2 R TIE TCIE RIE ILIE TE RE RWU SBK
SCI Control Register 2 W
0x44 SCIS1 R TDRE TC RDRF IDLE OR NF FE PF
SCI Status Register 1 W
0x45 SCIS2 R LBKDIF RXEDGIF 0RXINV RWUID BRK13 LBKDE RAF
SCI Status Register 2 W
0x46 SCIC3 R R8 T8 TXDIR TXINV ORIE NEIE FEIE PEIE
SCI Control Register 3 W
0x47 SCID RR7R6R5R4R3R2R1R0
SCI Data Register WT7T6T5T4T3T2T1T0
0x60 PWMCTL R CAE1 CAE0 PCLK1 PCLK0 PPOL1 PPOL0 PWME1 PWME0
PWM Control Register W
0x61 PWMPRCLK R 0 PCKB2 PCKB1 PCKB0 0PCKA2 PCKA1 PCKA0
PWM Presc. Clk Select Reg W
0x62 PWMSCLA R Bit 7 6 5 4 3 2 1 Bit 0
PWM Scale A Register W
Ta ble 74. Analog die Registers(57) - 0x0200–0x02FF D2D Bloc king Access (D2DI) 2 of 3/
0x0300–0x03FF D2D Non Blocking Access (D2DI) 3 of 3
Offset Name 76543210
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 50
0x63 PWMSCLB R Bit 7 6 5 4 3 2 1 Bit 0
PWM Scale B Register W
0x64 PWMCNT0 R Bit 7 6 5 4 3 2 1 Bit 0
PWM Ch Counter Reg 0 W 0 0 0 0 0 0 0 0
0x65 PWMCNT1 R Bit 7 6 5 4 3 2 1 Bit 0
PWM Ch Counter Reg 1 W 0 0 0 0 0 0 0 0
0x66 PWMPER0 R Bit 7 6 5 4 3 2 1 Bit 0
PWM Ch Period Register 0 W
0x67 PWMPER1 R Bit 7 6 5 4 3 2 1 Bit 0
PWM Ch Period Register 1 W
0x68 PWMDTY0 R Bit 7 6 5 4 3 2 1 Bit 0
PWM Ch Duty Register 0 W
0x69 PWMDTY1 R Bit 7 6 5 4 3 2 1 Bit 0
PWM Ch Duty Register 1 W
0x80 ACR R SCIE CCE OCE ADCRST 0PS2 PS1 PS0
ADC Config Register W
0x81 ASR R SCF 2p5CLF 0 0 CCNT3 CCNT2 CCNT1 CCNT0
ADC Status Register W
0x82 ACCR (hi) R CH15 CH14 0CH12 CH11 CH10 CH9 CH8
ADC Conversion Ctrl Reg W
0x83 ACCR (lo) R CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0
ADC Conversion Ctrl Reg W
0x84 ACCSR (hi) R CC15 CC14 0 CC12 CC11 CC10 CC9 CC8
ADC Conv Complete Reg W
0x85 ACCSR (lo) R CC7 CC6 CC5 CC4 CC3 CC2 CC1 CC0
ADC Conv Complete Reg W
0x86 ADR0 (hi) R adr0 9 adr0 8 adr0 7 adr0 6 adr0 5 adr0 4 adr0 3 adr0 2
ADC Data Result Register 0 W
0x87 ADR0 (lo) R adr0 1 adr0 0 0 0 0 0 0 0
ADC Data Result Register 0 W
0x88 ADR1 (hi) R adr1 9 adr1 8 adr1 7 adr1 6 adr1 5 adr1 4 adr1 3 adr1 2
ADC Data Result Register 1 W
0x89 ADR1 (lo) R adr1 1 adr1 0 0 0 0 0 0 0
ADC Data Result Register 1 W
0x8A ADR2 (hi) R adr2 9 adr2 8 adr2 7 adr2 6 adr2 5 adr2 4 adr2 3 adr2 2
ADC Data Result Register 2 W
0x8B ADR2 (lo) R adr2 1 adr2 0 0 0 0 0 0 0
ADC Data Result Register 2 W
0x8C ADR3 (hi) R adr3 9 adr3 8 adr3 7 adr3 6 adr3 5 adr3 4 adr3 3 adr3 2
ADC Data Result Register 3 W
0x8D ADR3 (lo) R adr3 1 adr3 0 0 0 0 0 0 0
ADC Data Result Register 3 W
Ta ble 74. Analog die Registers(57) - 0x0200–0x02FF D2D Bloc king Access (D2DI) 2 of 3/
0x0300–0x03FF D2D Non Blocking Access (D2DI) 3 of 3
Offset Name 76543210
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 51
0x8E ADR4 (hi) R adr4 9 adr4 8 adr4 7 adr4 6 adr4 5 adr4 4 adr4 3 adr4 2
ADC Data Result Register 4 W
0x8F ADR4 (lo) R adr4 1 adr4 0 0 0 0 0 0 0
ADC Data Result Register 4 W
0x90 ADR5 (hi) R adr5 9 adr5 8 adr5 7 adr5 6 adr5 5 adr5 4 adr5 3 adr5 2
ADC Data Result Register 5 W
0x91 ADR5 (lo) R adr5 1 adr5 0 0 0 0 0 0 0
ADC Data Result Register 5 W
0x92 ADR6 (hi) R adr6 9 adr6 8 adr6 7 adr6 6 adr6 5 adr6 4 adr6 3 adr6 2
ADC Data Result Register 6 W
0x93 ADR6 (lo) R adr6 1 adr6 0 0 0 0 0 0 0
ADC Data Result Register 6 W
0x94 ADR7 (hi) R adr7 9 adr7 8 adr7 7 adr7 6 adr7 5 adr7 4 adr7 3 adr7 2
ADC Data Result Register 7 W
0x95 ADR7 (lo) R adr7 1 adr7 0 0 0 0 0 0 0
ADC Data Result Register 7 W
0x96 ADR8 (hi) R adr8 9 adr8 8 adr8 7 adr8 6 adr8 5 adr8 4 adr8 3 adr8 2
ADC Data Result Register 8 W
0x97 ADR8 (lo) R adr8 1 adr8 0 0 0 0 0 0 0
ADC Data Result Register 8 W
0x98 ADR9 (hi) R adr9 9 adr9 8 adr9 7 adr9 6 adr9 5 adr9 4 adr9 3 adr9 2
ADC Data Result Register 9 W
0x99 ADR9 (lo) R adr9 1 adr9 0 0 0 0 0 0 0
ADC Data Result Register 9 W
0x9A ADR10 (hi) R adr10 9 adr10 8 adr10 7 adr10 6 adr10 5 adr10 4 adr10 3 adr10 2
ADC Data Result Reg 10 W
0x9B ADR10 (lo) R adr10 1 adr10 0 0 0 0 0 0 0
ADC Data Result Reg 10 W
0x9C ADR11 (hi) R adr11 9 adr11 8 adr11 7 adr11 6 adr11 5 adr11 4 adr11 3 adr11 2
ADC Data Result Reg 11 W
0x9D ADR11 (lo) R adr11 1 adr11 0 0 0 0 0 0 0
ADC Data Result Reg 11 W
0x9E ADR12 (hi) R adr12 9 adr12 8 adr12 7 adr12 6 adr12 5 adr12 4 adr12 3 adr12 2
ADC Data Result Reg 12 W
0x9F ADR12 (lo) R adr12 1 adr12 0 0 0 0 0 0 0
ADC Data Result Reg 12 W
0xA2 ADR14 (hi) R adr14 9 adr14 8 adr14 7 adr14 6 adr14 5 adr14 4 adr14 3 adr14 2
ADC Data Result Reg 14 W
0xA3 ADR14 (lo) R adr14 1 adr14 0 0 0 0 0 0 0
ADC Data Result Reg 14 W
0xA4 ADR15 (hi) R adr15 9 adr15 8 adr15 7 adr15 6 adr15 5 adr15 4 adr15 3 adr15 2
ADC Data Result Reg 15 W
Ta ble 74. Analog die Registers(57) - 0x0200–0x02FF D2D Bloc king Access (D2DI) 2 of 3/
0x0300–0x03FF D2D Non Blocking Access (D2DI) 3 of 3
Offset Name 76543210
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 52
0xA5 ADR15 (lo) R adr15 1 adr15 0 0 0 0 0 0 0
ADC Data Result Reg 15 W
0xC0 TIOS R 0 0 0 0 IOS3 IOS2 IOS1 IOS0
TIM InCap/OutComp Select W
0xC1 CFORC R00000000
Timer Compare Force Reg W FOC3 FOC2 FOC1 FOC0
0xC2 OC3M R 0 0 0 0 OC3M3 OC3M2 OC3M1 OC3M0
Output Comp 3 Mask Reg W
0xC3 OC3D R 0 0 0 0 OC3D3 OC3D2 OC3D1 OC3D0
Output Comp 3 Data Reg W
0xC4 TCNT (hi) R tcnt 15 tcnt 14 tcnt 13 tcnt 12 tcnt 11 tcnt 10 tcnt 9 tcnt 8
Timer Count Register W
0xC5 TCNT (lo) R tcnt 7 tcnt 6 tcnt 5 tcnt 4 tcnt 3 tcnt 2 tcnt 1 tcnt 0
Timer Count Register W
0xC6 TSCR1 R TEN 00
TFFCA 0000
Timer System Control Reg 1 W
0xC7 TTOV R 0 0 0 0 TOV3 TOV2 TOV1 TOV0
Timer Toggle Overflow Reg W
0xC8 TCTL1 R OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0
Timer Control Register 1 W
0xC9 TCTL2 R EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A
Timer Control Register 2 W
0xCA TIE R0000
C3I C2I C1I C0I
Timer Interrupt Enable Reg W
0xCB TSCR2 R TOI 000
TCRE PR2 PR1 PR0
Timer System Control Reg 2 W
0xCC TFLG1 R0000
C3F C2F C1F C0F
Main Timer Interrupt Flag 1 W
0xCD TFLG2 R TOF 0000000
Main Timer Interrupt Flag 2 W
0xCE TC0 (hi) R tc0 15 tc0 14 tc0 13 tc0 12 tc0 11 tc0 10 tc0 9 tc0 8
TIM InCap/OutComp Reg 0 W
0xCF TC0 (lo) R tc0 7 tc0 6 tc0 5 tc0 4 tc0 3 tc0 2 tc0 1 tc0 0
TIM InCap/OutComp Reg 0 W
0xD0 TC1 (hi) R tc1 15 tc1 14 tc1 13 tc1 12 tc1 11 tc1 10 tc1 9 tc1 8
TIM InCap/OutComp Reg 1 W
0xD1 TC1 (lo) R tc1 7 tc1 6 tc1 5 tc1 4 tc1 3 tc1 2 tc1 1 tc1 0
TIM InCap/OutComp Reg 1 W
0xD2 TC2 (hi) R tc2 15 tc2 14 tc2 13 tc2 12 tc2 11 tc2 10 tc2 9 tc2 8
TIM InCap/OutComp Reg 2 W
0xD3 TC2 (lo) R tc2 7 tc2 6 tc2 5 tc2 4 tc2 3 tc2 2 tc2 1 tc2 0
TIM InCap/OutComp Reg 2 W
Ta ble 74. Analog die Registers(57) - 0x0200–0x02FF D2D Bloc king Access (D2DI) 2 of 3/
0x0300–0x03FF D2D Non Blocking Access (D2DI) 3 of 3
Offset Name 76543210
Functional Description and Application Information
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 53
0xD4 TC3 (hi) R tc3 15 tc3 14 tc3 13 tc3 12 tc3 11 tc3 10 tc3 9 tc3 8
TIM InCap/OutComp Reg 3 W
0xD5 TC3 (lo) R tc3 7 tc3 6 tc3 5 tc3 4 tc3 3 tc3 2 tc3 1 tc3 0
TIM InCap/OutComp Reg 3 W
0xF0 CTR0 R LINTRE LINTR WDCTRE CTR0_4 CTR0_3 WDCTR2 WDCTR1 WDCTR0
Trimming Reg 0 W
0xF1 CTR1 R BGTRE CTR1_6 BGTRIM
UP
BGTRIM
DN IREFTRE IREFTR2 IREFTR1 IREFTR0
Trimming Reg 1 W
0xF2 CTR2 R CTR2_E CTR2_1 CTR2_0 SLPBGT
RE
SLPBG_L
OCK
SLPBGT
R2
SLPBGT
R1
SLPBGT
R0
Trimming Reg 2 W
0xF3 CTR3 R OFFCTR
E
OFFCTR
2
OFFCTR
1
OFFCTR
0CTR3_E CTR3_2 CTR3_1 CTR3_0
Trimming Reg 3 W
0xF4 SRR R0000 FMREV MMREV
Silicon Revision Register W
Note:
57. Registers not shown are reserved and must not be accessed.
Ta ble 74. Analog die Registers(57) - 0x0200–0x02FF D2D Bloc king Access (D2DI) 2 of 3/
0x0300–0x03FF D2D Non Blocking Access (D2DI) 3 of 3
Offset Name 76543210
MM912_634 - Analog Die Overview
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 54
5.3 MM912_634 - Analog Die Overview
5.3.1 Introduction
The MM912_634 analog die implements all system base functionality to operate the integrated microcontroller,
and delivers application specific actuator control as well as input capturing.
5.3.2 Sy st em Re gi st ers
5.3.2.1 Silicon Revision Register (SRR)
NOTE
Please refer to the MM912F634ER - Mask set errata document for details on the analog die
mask revisions.
5.3.3 Analog Die Options
The following section describes the differences between analog die options 1 and 2.
NOTE
This document will describe the features and functions of option 1 (all modules available and
tested). Beyond this chapter, there will be no additional note or differentiation between the
different implementations.
Table 75. Silicon Revision Register (SRR)
Offset(58) 0xF4 Access: User read
76543210
R0 0 0 0 FMREV MMREV
W
Note:
58. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 76. SRR - Register Field Descriptions
Field Description
3-2
FMREV
MM912_634 analog die Silicon Revision Register Full Mask Revision - The three bits represent the revision count of full
mask change. Read only, writing will have no effect. The first Full Mask will have the count 00.
1-0
MMREV
MM912_634 analog die Silicon Revision Register Metal Tweak Revision - The three bits represent the count of metal
tweaks applied to the full mask.Read only, writing will have no effect. The first Full Mask will have the count 00.
Table 77. Analog Die Options
Feature Option 1 Option 2
Current Sense Module YES NO
Wake Up Inputs (Lx) L0…L5 L0.L3
ANALOGMCU
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 55
5.3.3.1 Current Sense Module
For device options with the current sense module not available, the following considerations are to be made.
5.3.3.1.1 Pinout considerations
5.3.3.1.2 Register Considerations
The Current Sense Register must remain in default (0x00) state.
The Conversion Control Register - Bit 9 must always be written 0.
The Conversion Complete Register - Bit 9 must be ignored.
The ADC Data Result Reg 9 must be ignored.
5.3.3.1.3 Functional Considerations
• The complete Current Sense Module is not available.
• The ADC Channel 9 is not available.
5.3.3.2 Wake-up Inputs (Lx)
For device options with reduced number of wake up inputs (Lx), the following considerations are to be made.
5.3.3.2.1 Pinout considerations
Table 78. ISENSE - Pin Considerations
PIN PIN name for option 1 New PIN name Comment
40 ISENSEL NC ISENSE feature not bonded and/or not tested. Connect PINs 40 and 41
(NC) to GND.
41 ISENSEH NC
Offset Name 76543210
0x3C CSR R CSE 000
CCD CSGS
Current Sense Register W
0x82 ACCR (hi) R CH15 CH14 0CH12 CH11 CH10 CH9 CH8
ADC Conversion Ctrl Reg W
0x84 ACCSR (hi) R CC15 CC14 0 CC12 CC11 CC10 CC9 CC8
ADC Conv Complete Reg W
0x98 ADR9 (hi) R adr9 9 adr9 8 adr9 7 adr9 6 adr9 5 adr9 4 adr9 3 adr9 2
ADC Data Result Register 9 W
0x99 ADR9 (lo) R adr9 1 adr9 0 0 0 0 0 0 0
ADC Data Result Register 9 W
Table 79. Lx - Pin Considerations
PIN PIN Name for
Option 1 New PIN
name Comment
31…36 Lx NC
One or more Lx wake up inputs are not available based on the analog die option. Not available Lx
inputs are not bonded and/or not tested. Connect not available Lx pins (NC) to GND. RLx is not
required on those pins.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 56
5.3.3.2.2 Register Considerations
The Lx - Bit for the not available Lx input in the Lx Status Register must be ignored.
The Lx Control register for the not available Lx input must be written 0.
A not available Lx input can not be selected as Wake-up Source and must have its LxWE bit set to 0.
The Wake-up Source Register for not available Lx inputs must be ignored.
The Conversion Control Register for the not available Lx analog input (3…8) must always be written 0.
The Conversion Complete Register for the not available Lx analog input (3.8) must be ignored.
The ADC Data Result Register for the not available Lx analog input (3.8) must be ignored.
5.3.3.2.3 Functional Considerations
For the not available Lx inputs, the following functions are limited:
• No Wake-up feature / Cyclic Sense
• No Digital Input
• No Analog Input and conversion via ADC
Offset Name 76543210
0x08 LXR R 0 0 L5 L4 L3 L2 L1 L0
Lx Status Register W
0x09 LXCR R 0 0 L5DS L4DS L3DS L2DS L1DS L0DS
Lx Control Register W
0x12 WCR R CSSEL L5WE L4WE L3WE L2WE L1WE L0WE
Wake Up Control Register W
0x14 WSR R FWU LINWU L5WU L4WU L3WU L2WU L1WU L0WU
Wake Up Source Register W
0x82 ACCR (hi) R CH15 CH14 0CH12 CH11 CH10 CH9 CH8
ADC Conversion Ctrl Reg W
0x83 ACCR (lo) R CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0
ADC Conversion Ctrl Reg W
0x84 ACCSR (hi) R CC15 CC14 0 CC12 CC11 CC10 CC9 CC8
ADC Conv Complete Reg W
0x85 ACCSR (lo) R CC7 CC6 CC5 CC4 CC3 CC2 CC1 CC0
ADC Conv Complete Reg W
0x8C-0
x97
ADRx (hi) R adrx 9 adrx 8 adrx 7 adrx 6 adrx 5 adrx 4 adrx 3 adrx 2
ADC Data Result Register x W
ADRx (lo) R adrx 1 adrx 0 0 0 0 0 0 0
ADC Data Result Register x W
Modes of Operation
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 57
5.4 Modes of Operation
The MM912_634 analog die offers three main operating modes: Normal (Run), Stop, and Sleep. In Normal mode,
the device is active and is operating under normal application conditions. In Stop mode, the voltage regulator
operates with limited current capability, the external load is expected to be reduced while in Stop mode. In Sleep
mode both voltage regulators are turned off (VDD =V
DDX =0V).
Wake-up from Stop mode is indicated by an interrupt signal. Wake-up from Sleep mode will change the MM912_634 analog die
into reset mode while the voltage regulator is turned back on.
The selection of the different modes is controlled by the Mode Control Register (MCR).
Figure 16 describes how transitions are done between the different operating modes.
Figure 16. Modes of Operatio n and Transitions
5.4.1 Power Down Mode
For the device power (VS1) below VPOR, the MM912_634 analog die is virtually in Power Down mode. Once VS1>VPOR, the
MM912_634 analog die will enter Reset mode with the condition “Power On Reset - POR”.
5.4.2 Reset Mode
The MM912_634 analog die enters Reset mode if a reset condition occurs (POR - Power On Reset, LVR- Low Voltage Reset,
Low Voltage VDDX Reset - LVRX, WDR - Watchdog Reset, EXR - External Reset, and WUR - Wake-up Sleep Reset).
For internal reset sources, the RESET_A pin is driven low for tRST after the reset condition is gone. After this delay, the RESET_A
pin is released. With a high detected on the RESET_A pin, VDD>VLVR and VDDX>VLVRX the MM912_634 analog die enters
in Normal mode.
To avoid short-circuit conditions being present for a long time, a tVTO timeout is implemented. Once VDD < VLVR or VDDX <
VLVRX with VS1 > (VLVI + VLVI_H) for more than tVTO, the MM912_634 analog die will transit directly to Sleep mode.
ANALOGMCU
Power
Down
Reset
Normal
Mode
Stop
Mode
Sleep
Mode
Power Up
(POR = 1)
VDD High and Reset
Delay (tRST) expired
Wake Up
Wake Up
External or
Internal Reset
Power Down
(VSUP<VPOR)
WatchDog Time-Out1,
External or Internal Reset
Stop
Command
Sleep
Command
1) Initial WD to be served within tWDTO to enable Window WD
VDD Low and VSUV = 0
and Delay (tVTO) expired
Power Down
(VSUP<VPOR)
Modes of Operation
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 58
The Reset Status Register (RSR) will indicate the source of the reset by individual flags.
• POR - Power On Reset
• LVR - Low Voltage Reset VDD
• LVRX - Low Voltage Reset VDDX
• WDR - Watchdog Reset
• EXR - External Reset
• WUR - Wake-up Sleep Reset
See also Section 5.8, “Resets".
5.4.3 Normal Mode
In Normal mode, all MM912_634 analog die user functions are active and can be controlled by the D2D Interface. Both regulators
(VDD and VDDX) are active and operate with full current capability.
Once entered in Normal mode, the Watchdog will operate as a simple non-window watchdog with an initial timeout (tIWDTO) to
be reset via the D2D Interface. After the initial reset, the watchdog will operate in standard window mode. See Section 5.10,
“Window Watchdog" for details.
5.4.4 Stop Mode
The Stop mode will allow reduced current consumption with fast startup time. In this mode, both voltage regulators (VDD and
VDDX) are active, with limited current drive capability. In this condition, the MCU is supposed to operate in Low Power mode
(STOP).
NOTE
To avoid any pending analog die interrupts prevent the MCU from entering MCU stop
resulting in unexpected system behavior, the analog die IRQ sources should be disabled
and the corresponding flags be cleared before entering stop.
The device can enter in Stop mode by configuring the Mode Control Register (MCR) via the D2D Interface. The MCU has to enter
a Low Power mode immediately afterwards executing the STOP instruction. The Wake-up Source Register (WSR) has to be read
after a wake-up condition in order to execute a new STOP mode command. Two base clock cycles (fBASE) delay are required
between WSR read and MCR write.
While in Stop mode, the MM912_634 analog die will wake up on the following sources:
• Lx - Wake-up (maskable with selectable cyclic sense)
• Forced Wake-up (configurable timeout)
• LIN Wake-up
• D2D Wake-up (special command)
After Wake-up from the sources listed above, the device will transit to Normal mode.
Reset will wake up the device directly to Reset mode.
See Section 5.9, “Wake-up / Cyclic Sense" for details.
5.4.5 S le ep Mo d e
The Sleep mode will allow very low current consumption. In this mode, both voltage regulators (VDD and VDDX) are inactive.
The device can enter into Sleep mode by configuring the Mode Control Register (MCR) via the D2D- Interface. During Sleep
mode, all unused internal blocks are deactivated to allow the lowest possible consumption. Power consumption will decrease
further if the Cyclic Sense or Forced Wake-up feature are disabled. While in Sleep mode, the MM912_634 analog die will wake
up on the following sources:
• Lx - Wake-up (maskable with selectable cyclic sense)
• Forced Wake-up (configurable timeout)
• LIN Wake-up
After Wake-up from the sources listed above or a reset condition, the device will transit to Reset mode.
See Section 5.9, “Wake-up / Cyclic Sense" for details.
Modes of Operation
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 59
5.4.6 Analog Die Functionality by Operation Mode
5.4.7 R e gi st e r De fin ition
5.4.7.1 Mode Control Register (MCR)
Table 80. Operation Mode Overview
Function Reset Normal Stop Sleep
VDD/VDDX full full stop OFF
HSUP
OFF
full OFF OFF
LSx full OFF OFF
HSx full Cyclic Sense(59) Cyclic Sense(59)
ADC full OFF OFF
D2D full functional OFF
Lx full Wake-up(59) Wake-up(59)
PTBx full OFF OFF
LIN full Wake-up(59) Wake-up(59)
Watchdog full(60) OFF OFF
VSENSE full OFF OFF
CSENSE full OFF OFF
Cyclic Sense not active Cyclic Sense(59) Cyclic Sense(59)
Note:
59. If configured.
60. Special init through non window watchdog.
Table 81. Mode Control Register (MCR)
Offset(61) 0x16 Access: User read/write
76543210
R000000 MODE
W
Reset00000000
Note:
61. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 82 . MCR - Register Fie ld Descriptions
Field Description
1-0
MODE
Mode Select - These bits will issue a transition from to the selected Operating Mode.
00 - Normal Mode. Only with effect in Stop Mode. Will issue Wake Up and transition to Normal Mode.
01 - Stop Mode. Will initiate transition to Stop Mode.(62)
10 - Sleep Mode. Will initiate transition to Sleep Mode.
11 - Normal Mode.
Note:
62. The Wake-up Source Register (WSR) has to be read after a wake-up condition in order to execute a new STOP mode command. Two
base clock cycles (fBASE) delay are required between WSR read and MCR write.
Power Sup ply
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 60
5.5 Power Supply
The MM912_634 analog die supplies VDD (2.5 V), VDDX (5.0 V), and HSUP, based on the supply voltage applied
to the VS1 pin. VDD is cascaded of the VDDX regulator. To separate the High Side outputs from the main power
supply, the VS2 pin does only power the High Side drivers. Both supply pins have to be externally protected
against reverse battery conditions. To supply external Hall Effect Sensors, the HSUP pin will supply a switchable
regulated supply. See Section 5.11, “Hall Sensor Supply Output - HSUP".
A reverse battery protected input (VSENSE) is implemented to measure the Battery Voltage directly. A serial resistor (RVSENSE)
is required on this pin. See Section 5.23, “Supply Voltage Sense - VSENSE". In addition, the VS1 supply can be routed to the
ADC (VS1SENSE) to measure the VS1 pin voltage directly. See Section 5.24, “Internal Supply Voltage Sense - VS1SENSE".
To have an independent ADC verification, the internal sleep mode bandgap voltage can be routed to the ADC (BANDGAP). As
this node is independent from the ADC reference, any out of range result would indicate malfunctioning ADC or Bandgap
reference. See Section 5.25, “Internal Bandgap Reference Voltage Sense - BANDGAP".
To stabilize the internal ADC reference voltage for higher precision measurements, the current limited ADC2p5 pin needs to be
connected to an external filter capacitor (CADC2p5). It is not recommended to connect additional loads to this pin. See
Section 5.20, “Analog Digital Converter - ADC".
The following safety features are implemented:
• LBI - Low Battery Interrupt, internally measured at VSENSE
• LVI - Low Voltage Interrupt, internally measured at VS1
• HVI - High Voltage Interrupt, internally measured at VS2
• VROVI - Voltage Regulator Over-voltage Interrupt internally measured at VDD and VDDX
• LVR - Low Voltage Reset, internally measured at VDD
• LVRX - Low Voltage Reset, internally measured at VDDX
• HTI - High Temperature Interrupt measured between the VDD and VDDX regulators
• Over-temperature Shutdown measured between the VDD and VDDX regulators
Figure 17. MM912_634 Power Supply
ANALOGMCU
VDDX (5V)
Regulator
VDD (2.5V)
Regulator
HSUP (18V)
Regulator
HS1 & HS2
ADC
÷
VS2
VS1
VSENSE
HSUP
HS1
HS2
VDDX
VDD
ADC 2.5V
Reference
VDDXINTERNAL
VDDINTERNAL
ADC2p5
CVDDX
CVDD
CADC
CHSUP
HVI
LVI
LBI
LVR
LVRX
VROV
bg1p25sleep
Power Sup ply
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 61
5.5.1 Voltage Regulators VDD (2.5 V) & VDDX (5.0 V)
To supply the MCU die and minor additional loads two cascaded voltage regulators have been implemented, VDDX (5.0 V) and
VDD (2.5 V). External capacitors (CVDD) and (CVDDX) are required for proper regulation.
5.5.2 Power Up Behavior / Power Down Behavior - I64
To guarantee safe power up and down behavior, special dependencies are implemented to prevent unwanted MCU execution.
Figure 18 shows a standard power up and power down sequence.
Figure 18. Power Up / Down Sequence
To avoid any critical behavior, it is essential to have the MCU Power On Reset (POR) active when the analog die reset
(RESET_A) is not fully active. As the RESET_A circuity is supplied by VDDX, VDD needs to be below the POR threshold when
VDDX is to low to guarantee RESET_A active (3;6). This is achieved with the following implementation.
Power Up:
• The VDD regulator is enabled after VDDX has reached the VLVRX threshold (1).
• Once VDD reaches VLRV, the RESET_A is released (2).
• The MCU is also protected by the MCU_LVR.
Power Down:
• Once VDDX has reached the VLVRX threshold (4), the VDD regulator is disabled and the regulator output is actively
pulled down to discharge any VDD capacitance (5). RESET_A is activated as well.
• The active discharge guarantees VDD to be below POR level before VDDX discharges below critical level for the reset
circuity.
NOTE
The behavior explained previously is essential for the MC9S12I64 MCU die used, as this
MCU does have an internal regulator stage, but the LVR function only active in normal
modeMC9S12I64.
The shutdown behavior should be considered when sizing the external capacitors CVDD and
CVDDX for extended low voltage operation.
MCU_POR
5V
VLBI / VLVI
Normal Operating
Range (not to scale)
VLVRX
VLVR
VPOR_A
RESET_A
VDDX VDD
VSUP
VPOR_MCU
VROVX
VROX
14
5
6
2
3
/ VLVR_MCU
MCU_LVR
MCU_LVR
MCU_POR
Power Sup ply
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 62
5.5.3 R e gi st e r De fin ition
5.5.3.1 Voltage Control Register (VCR)
5.5.3.2 Voltage Status Regist er (VSR)
Tab le 83. Voltage Control Register (VCR)
Offset(63) 0x04 Access: User read/write
76543210
R0 0 0 VROVIE HTIE HVIE LVIE LBIE
W
Reset00000000
Note:
63. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 84. VCR - Register Field Descriptions
Field Description
4
VROVIE
Voltage Regulator Over-voltage Interrupt Enable — Enables the interrupt for the Regulator Over-voltage Condition.
0 - Voltage Regulator Over-voltage Interrupt is disabled
1 - Voltage Regulator Over-voltage Interrupt is enabled
3
HTIE
High Temperature Interrupt Enable — Enables the interrupt for the Voltage Regulator (VDD/VDDX) Temperature Warning.
0 - High Temperature Interrupt is disabled
1 - High Temperature Interrupt is enabled
2
HVIE
High Voltage Interrupt Enable — Enables the interrupt for the VS2 - High Voltage Warning.
0 - High Voltage Interrupt is disabled
1 - High Voltage Interrupt is enabled
1
LVIE
Low Voltage Interrupt Enable — Enables the interrupt for the VS1 - Low Voltage Warning.
0 - Low Voltage Interrupt is disabled
1 - Low Voltage Interrupt is enabled
0
LBIE
Low Battery Interrupt Enable — Enables the interrupt for the VSENSE - Low Battery Voltage Warning.
0 - Low Battery Interrupt is disabled
1 - Low Battery Interrupt is enabled
Table 85. Voltage Status Register (VSR)
Offset(64) 0x05 Access: User read
76543210
R000VROVC HTC HVC LVC LBC
W
Reset00000000
Note:
64. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Power Sup ply
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 63
Tabl e 86. VSR - Register Field Descriptions
Field Description
4
VROVC
Voltage Regulator Over-voltage Condition - This status bit indicates an over-voltage warning is present for at least one of the
main voltage regulators (VDD or VDDX). Reading the register will clear the VROVI flag if present. See Section 5.7, “Interrupts"
for details. Note: This feature requires the trimming of Section 5.26.1.2.3, “Trimming Register 2 (CTR2)" to be done to be
effective. Untrimmed devices may issue the VROVC condition including the LS turn off at normal operation!
0 - No Voltage Regulator Over-voltage Condition present.
1 - Voltage Regulator Over-voltage Condition present.
3
HTC
High Temperature Condition - This status bit indicates a high temperature warning is present for the Voltage regulators
(VDD/VDDX). Reading the register will clear the HTI flag if present. See Section 5.7, “Interrupts" for details.
0 - No High Temperature Condition present.
1 - High Temperature Condition present.
2
HVC
High Voltage Condition - This status bit indicates a high voltage warning for VS2 is present. Reading the register will clear the
HVI flag if present. See Section 5.7, “Interrupts" for details.
0 - No High Voltage Condition present.
1 - High Voltage Condition present.
1
LVC
Low Voltage Condition - This status bit indicates a low voltage warning for VS1 is present. Reading the register will clear the
LVI flag if present. See Section 5.7, “Interrupts" for details.
0 - No Low Voltage Condition present.
1 - Low Voltage Condition present.
0
LBC
Low Battery Condition - This status bit indicates a low voltage warning for VSENSE is present. Reading the register will clear
the LBI flag if present. See Section 5.7, “Interrupts" for details.
0 - No Low Battery Condition present.
1 - Low Battery Condition present.
Die to Die Interface - Target
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 64
5.6 Die to Die Interface - Target
The D2D Interface is the bus interface to the Microcontroller. Access to the MM912_634 analog die is controlled
by the D2D Interface module. This section describes the functionality of the die-to-die target block (D2D).
5.6.1 Overview
The D2D is the target for a data transfer from the target to the initiator (MCU). The initiator provides a set of configuration registers
and two memory mapped 256 Byte address windows. When writing to a window, a transaction is initiated sending a write
command, followed by an 8-bit address, and the data byte or word is received from the initiator. When reading from a window, a
transaction is received with the read command, followed by an 8-bit address. The target then responds with the data. The basic
idea is that a peripheral located on the MM912_634 analog die, can be addressed like an on-chip peripheral.
Features:
• software transparent register access to peripherals on the MM912_634 analog die
• 256 Byte address window
• supports blocking read or write, as well as non-blocking write transactions
• 4-bit physical bus width
• automatic synchronization of the target when initiator starts driving the interface clock
• generates transaction and error status as well as EOT acknowledge
• providing single interrupt interface to D2D Initiator
5.6.2 L ow Pow er Mod e Op e rat io n
The D2D module is disabled in SLEEP mode. In Stop mode, the D2DINT signal is used to wake-up a powered down MCU. As
the MCU could wake-up without the MM912_634 analog die, a special command will be recognized as a wake-up event during
Stop mode. See Section 5.4, “Modes of Operation".
5.6.2.1 Normal Mode / Stop Mode
While in Normal or Stop mode, D2DCLK acts as input only with pull present. D2D[3:0] operates as an input/output with pull-down
always present. D2DINT acts as output only.
NOTE
The maximum allowed clock speed of the interface is limited to fD2D.
5.6.2.2 Sleep Mode
While in Sleep mode, all Interface data pins are pulled down to DGND to reduce power consumption.
ANALOGMCU
Interrupts
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 65
5.7 Interrupts
Interrupts are used to signal a microcontroller that a peripheral needs to be serviced. While in Stop mode, the
interrupt signal is used to signal Wake-up events. The interrupts are signaled by an active high level of the D2DINT
pin, which will remain high until the interrupt is acknowledged via the D2D-Interface. Interrupts are only asserted
while in Normal mode.
5.7.1 Interrupt Source Identification
Once an Interrupt is signalized, there are two options to identify the corresponding source(s).
5.7.1.1 Interrupt Source Mirror
All Interrupt sources in MM912_634 analog die are mirrored to a special Interrupt Source Register (ISR). This register is read
only and will indicate all currently pending Interrupts. Reading this register will not acknowledge any interrupt. An additional D2D
access is necessary to serve the specific module.
NOTE
The VSI - Voltage Status Interrupt combines the five status flags for the Low Battery
Interrupt, Low Voltage Interrupt, High Voltage Interrupt, Voltage Regulator Over-voltage
Interrupt, and the Voltage Regulator High Temperature Interrupt. The specific source can be
identified by reading the Voltage Status Register - VSR.
5.7.1.1.1 Interrupt Source Regis t er (ISR)
Table 87. Interrupt Source Register (ISR)
Offset(65) 0x00 (0x00 and 0x01 for 8Bit access) Access: User read
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R0 0 HOT LSOT HSOT LINOT SCI RX TX ERR TOV CH3 CH2 CH1 CH0 VSI
W
Note:
65. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 88. ISR - Register Field Descriptions
Field Description
0 - VSI
VSI - Voltage Status Interrupt combining the following sources:
• Low Battery Interrupt
• Low Voltage Interrupt
• High Voltage Interrupt
• Voltage Regulator Over-voltage Interrupt
• Voltage Regulator High Temperature Interrupt
1 - CH0 CH0 - TIM Channel 0 Interrupt
2 - CH1 CH1 - TIM Channel 1 Interrupt
3 - CH2 CH2 - TIM Channel 2 Interrupt
4 - CH3 CH3 - TIM Channel 3 Interrupt
5 - TOV TOV - Timer Overflow Interrupt
6 - ERR ERR - SCI Error Interrupt
7 - TX TX - SCI Transmit Interrupt
8 - RX RX - SCI Receive Interrupt
9 - SCI SCI - ADC Sequence Complete Interrupt
10 - LINOT LINOT - LIN Driver Over-temperature Interrupt
11 - HSOT HSOT - High Side Over-temperature Interrupt
12 - LSOT LSOT - Low Side Over-temperature Interrupt
13 - HOT HOT - HSUP Over-temperature Interrupt
ANALOGMCU
Interrupts
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 66
5.7.1.2 Interrupt Vector Emulation by Priority
To allow a vector based interrupt handling by the MCU, the number of the highest prioritized interrupt pending is returned in the
Interrupt Vector Register. To allow an offset based vector table, the result is pre-shifted (multiple of 2). Reading this register will
not acknowledge an interrupt. An additional D2D access is necessary to serve the specific module.
5.7.1.2.1 Interrupt Vector Register (IVR)
The following table is listing all MM912_634 analog die interrupt sources with the corresponding priority.
Table 89. Interrupt Vector Register (IVR)
Offset(66) 0x02 Access: User read
76543210
R0 0 IRQ
W
Note:
66. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 90. IVR - Register Field Descriptions
Field Description
5:0
IRQ
Represents the highest prioritized interrupt pending. See Table 91 In case no interrupt is pending, the result will be 0.
Table 91. Interrupt Source Priority
Interrupt Source IRQ Priority
no interrupt pending or wake-up from Stop mode 0x00 1 (highest)
LVI - Low Voltage Interrupt 0x02 2
HTI - Voltage Regulator High Temperature Interrupt 0x04 3
LBI - Low Battery Interrupt 0x06 4
CH0 - TIM Channel 0 Interrupt 0x08 5
CH1 - TIM Channel 1 Interrupt 0x0A 6
CH2 - TIM Channel 2 Interrupt 0x0C 7
CH3 - TIM Channel 3 Interrupt 0x0E 8
TOV - Timer Overflow Interrupt 0x10 9
ERR - SCI Error Interrupt 0x12 10
TX - SCI Transmit Interrupt 0x14 11
RX - SCI Receive Interrupt 0x16 12
SCI - ADC Sequence Complete Interrupt 0x18 13
LINOT - LIN Driver Over-temperature Interrupt 0x1A 14
HSOT - High Side Over-temperature Interrupt 0x1C 15
LSOT - Low Side Over-temperature Interrupt 0x1E 16
HOT - HSUP Over-temperature Interrupt 0x20 17
HVI - High Voltage Interrupt 0x22 18
VROVI - Voltage Regulator Over-voltage Interrupt 0x24 19 (lowest)
Interrupts
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 67
5.7.2 Interrupt Sources
5.7.2.1 Voltage Status Interrupt (VSI)
The Voltage Status Interrupt - VSI combines the five interrupt sources of the Voltage Status Register. It is only available in the
Interrupt Source Register (ISR). Acknowledge the interrupt by reading the Voltage Status Register - VSR. To issue a new
interrupt, the condition has to vanish and occur again. See Section 5.5, “Power Supply" for details on the Voltage Status Register
including masking information.
5.7.2.2 Low Voltage Interrupt (LVI)
Acknowledge the interrupt by reading the Voltage Status Register - VSR. To issue a new interrupt, the condition has to vanish
and occur again. See Section 5.5, “Power Supply" for details on the Voltage Status Register including masking information.
5.7.2.3 Voltage Regulator High Temperature Interrupt (HTI)
Acknowledge the interrupt by reading the Voltage Status Register - VSR. To issue a new interrupt, the condition has to vanish
and occur again. See Section 5.5, “Power Supply" for details on the Voltage Status Register including masking information.
5.7.2.4 Low Battery Interrupt (LBI)
Acknowledge the interrupt by reading the Voltage Status Register - VSR. To issue a new interrupt, the condition has to vanish
and occur again. See Section 5.5, “Power Supply" for details on the Voltage Status Register including masking information.
5.7.2.5 TIM Channel 0 Interrupt (CH0)
See Section 5.19, “Basic Timer Module - TIM (TIM16B4C)".
5.7.2.6 TIM Channel 1 Interrupt (CH1)
See Section 5.19, “Basic Timer Module - TIM (TIM16B4C)".
5.7.2.7 TIM Channel 2 Interrupt (CH2)
See Section 5.19, “Basic Timer Module - TIM (TIM16B4C)".
5.7.2.8 TIM Channel 3 Interrupt (CH3)
See Section 5.19, “Basic Timer Module - TIM (TIM16B4C)".
5.7.2.9 TIM Timer Overflow Interrupt (TOV)
See Section 5.19, “Basic Timer Module - TIM (TIM16B4C)".
5.7.2.10 SCI Error Interrupt (ERR)
See Section 5.16, “Serial Communication Interface (S08SCIV4)".
5.7.2.11 SCI Transmit Interrupt (TX)
See Section 5.16, “Serial Communication Interface (S08SCIV4)".
5.7.2.12 SCI Receive Interrupt (RX)
See Section 5.16, “Serial Communication Interface (S08SCIV4)".
5.7.2.13 LIN Driver Over-temperature Interrupt (LINOT)
Acknowledge the interrupt by reading the LIN Register - LINR. To issue a new interrupt, the condition has to vanish and occur
again. See Section 5.15, “LIN Physical Layer Interface - LIN" for details on the LIN Register including masking information.
Interrupts
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 68
5.7.2.14 High Side Over-temperature Interrupt (HSOT)
Acknowledge the interrupt by reading the High Side Status Register - HSSR. To issue a new interrupt, the condition has to vanish
and occur again. See Section 5.12, “High Side Drivers - HS" for details on the High Side Status Register including masking
information.
5.7.2.15 Low Side Over-temperature Interrupt (LSOT)
Acknowledge the interrupt by reading the Low Side Status Register - LSSR. To issue a new interrupt, the condition has to vanish
and occur again. See Section 5.13, “Low Side Drivers - LSx" for details on the Low Side Status Register including masking
information.
5.7.2.16 HSUP Over-temperature Interrupt (HOT)
Acknowledge the interrupt by reading the Hall Supply Register - HSR. To issue a new interrupt, the condition has to vanish and
occur again. See Section 5.11, “Hall Sensor Supply Output - HSUP" for details on the Hall Supply Register including masking
information.
5.7.2.17 High Voltage Interrupt (HVI)
Acknowledge the interrupt by reading the Voltage Status Register - VSR. To issue a new interrupt, the condition has to vanish
and occur again. See Section 5.5, “Power Supply" for details on the Voltage Status Register including masking information.
5.7.2.18 Voltage Regulator Over-vo ltage Interrupt (VR OVI )
Acknowledge the interrupt by reading the Voltage Status Register - VSR. To issue a new interrupt, the condition has to vanish
and occur again. See Section 5.5, “Power Supply" for details on the Voltage Status Register including masking information.
Resets
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 69
5.8 Resets
To protect the system during critical events, the MM912_634 analog die will drive the RESET_A pin low during the
presence of the reset condition. In addition, the RESET_A pin is monitored for external reset events. To match the
MCU, the RESET_A pin is based on the VDDX voltage level.
After an internal reset condition has gone, the RESET_A will stay low for an additional time tRST before being
released. Entering reset mode will cause all MM912_634 analog die registers to be initialized to their RESET default. The only
registers with valid information are the Reset Status Register (RSR) and the Wake-up Source Register (WUS).
5.8.1 Reset Sources
In the MM912_634 six reset sources exist.
5.8.1.1 POR - Analog Die Power On Reset
To indicate the device power supply (VS1) was below VPOR or the MM912_634 analog die was powered up, the POR condition
is set. See Section 5.4, “Modes of Operation".
5.8.1.2 LVR - Low Voltage Reset - VDD
With the VDD voltage regulator output voltage falling below VLVR, the Low Voltage Reset condition becomes present. As the
VDD Regulator is shutdown once a LVRX condition is detected, The actual cause could be also a low voltage condition at the
VDDX regulator. See Section 5.5, “Power Supply".
5.8.1.3 LVRX - Low Voltage Reset - VDDX
With the VDDX voltage regulator output voltage falling below VLVRX, the Low Voltage Reset condition becomes present. See
Section 5.5, “Power Supply".
5.8.1.4 WUR - Wake-up Reset
While in Sleep mode, any active wake-up event will cause a MM912_634 analog die transition from Sleep to Reset Mode. To
determine the wake-up source, refer to Section 5.9, “Wake-up / Cyclic Sense".
5.8.1.5 EXR - External Reset
Any low level voltage at the RESET_A pin with a duration > tRSTDF will issue an External Reset event. This reset source is also
active in Stop mode.
5.8.1.6 WDR - Watchdog Reset
Any incorrect serving if the MM912_634 analog die Watchdog will result in a Watchdog Reset. Please refer to the Section 5.10,
“Window Watchdog" for details.
5.8.2 R e gi st e r De fin ition
5.8.2.1 Reset Status Regi st er (RSR )
Table 92. Reset Status Register (RSR)
Offset(67) 0x15 Access: User read
76543210
R0 0 WDR EXR WUR LVRX LVR POR
W
Note:
67. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
ANALOGMCU
Resets
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 70
Reading the Reset Status register will clear the information inside. Writing has no effect. LVR and LVRX are masked when POR
or WUR are set.
Table 93. RSR - Register Field Descriptions
Field Description
5 - WDR Watchdog Reset - Reset caused by an incorrect serving of the watchdog.
4 - EXR External Reset - Reset caused by the RESET_A pin driven low externally for > tRSTDF.
3 - WUR Wake-up Reset - Reset caused by a wake-up from Sleep mode. To determine the wake-up source, refer to Section 5.9,
“Wake-up / Cyclic Sense".
2 - LVRX Low Voltage Reset VDDX - Reset caused by a low voltage condition monitored at the VDDX output.
1 - LVR Low Voltage Reset VDD - Reset caused by a low voltage condition monitored at the VDD output.(68)
0 - POR Power On Reset - Supply Voltage was below VPOR.
Note:
68. As the VDD Regulator is shutdown once a LVRX condition is detected, The actual cause could be also a low voltage condition at the
VDDX regulator.
Wake-up / Cyclic Sense
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 71
5.9 Wake-up / Cyclic Sense
To wake-up the MM912_634 analog die from Stop or Sleep mode, several wake-up sources are implemented. As
described in Section 5.4, “Modes of Operation", a wake-up from Stop mode will result in an interrupt (D2DINT) to
the MCU combined with a transition to Normal mode. A wake-up from Sleep mode will result in a transition to
Reset mode. In any case, the source of the wake-up can be identified by reading the Wake-up Source Register
(WSR). The Wake-up Source Register (WSR) has to be read after a wake-up condition in order to execute a new STOP mode
command. Two base clock cycles (fBASE) delay are required between the WSR read and MCR write.
In general, there are the following seven main wake-up sources:
• Wake-up by a state change of one of the Lx inputs
• Wake-up by a state change of one of the Lx inputs during a cyclic sense
• Wake-up due to a forced wake-up
• Wake-up by the LIN module
• Wake-up by D2D interface (Stop mode only)
• Wake-up due to internal / external Reset (Stop mode only)
• Wake-up due to loss of supply voltage (Sleep mode only)
Figure 19. Wake-up Sources
5.9.1 Wake-up Sources
5.9.1.1 Lx - Wake-up (Cyclic Sense Disabled)
Any state digital change on a Wake-up Enabled Lx input will issue a wake-up. In order to select and activate a Wake-up Input
(Lx), the Wake-up Control Register (WCR) must be configured with appropriate LxWE inputs enabled or disabled before entering
low power mode. The Lx - Wake-up may be combined with the Forced Wake-up.
Note: Selecting a Lx Input for wake-up will disable a selected analog input once entering low power mode.
5.9.1.2 Lx - Cyclic Sense Wake-up
To reduce external power consumption during low power mode a cyclic wake-up has been implemented. Configuring the Timing
Control Register (TCR) a specific cycle time can be selected to implement a periodic switching of the HS1 or HS2 output with the
corresponding detection of an Lx state change. Any configuration of the HSx in the High Side Control Register (HSCR) will be
ignored when entering low power mode. The Lx - Cyclic Sense Wake-up may be combined with the Forced Wake-up. In case
both (forced and Lx change) events are present at the same time, the Forced Wake-up will be indicated as Wake-up source.
NOTE
Once Cyclic Sense is configured (CSSEL!=0), the state change is only recognized from one
cyclic sense event to the next.
The additional accuracy of the cyclic sense cycle by the WD clock trimming is only active
during STOP mode. There is no trimmed clock available during SLEEP mode.
ANALOGMCU
LIN Bus
HS1
HS2
L1
L2
L3
L4
L5
VSUP
LIN
D2DINT
D2DCLK
D2D3
D2D2
D2D1
D2D0
Wake Up
Module
D2D
Wake Up
LIN Wake Up
Lx – Wake Up
Cyclic Sense / Forced
Wake Up Timer
Forced
Wake Up
Cyclic Wake Up
L0
Wake-up / Cyclic Sense
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 72
5.9.1.3 Forced Wake-up
Configuring the Forced Wake-up Multiplier (FWM) in the Timing Control Register (TCR) will enable the forced wake-up based on
the selected Cyclic Sense Timing (CST). Forced Wake-up can be combined with all other wake-up sources considering the timing
dependencies.
5.9.1.4 LIN - Wake-up
While in Low-Power mode the MM912_634 analog die monitors the activity on the LIN bus. A dominant pulse longer than
tPROPWL followed by a dominant to recessive transition will cause a LIN Wake-up. This behavior protects the system from a
short-to-ground bus condition.
5.9.1.5 D2D - Wake-up (Stop Mode only)
Receiving a Normal mode request via the D2D interface (MODE=0, Mode Control Register (MCR)) will result in a wake-up from
stop mode. As this condition is controlled by the MCU, no wake-up status bit does indicate this wake-up source.
5.9.1.6 Wake-up Due to Internal / External Reset (STOP Mode Only)
While in Stop mode, a Reset due to a VDD low voltage condition or an external Reset applied on the RESET_A pin will result in
a Wake-up with immediate transition to Reset mode. In this case, the LVR or EXR bits in the Reset Status Register will indicate
the source of the event.
5.9.1.7 Wake-up Due to Loss of Supply Voltage (SLEEP Mode Only)
While in Sleep mode, a supply voltage VS1 < VPOR will result in a transition to Power On mode.
5.9.2 R e gi st e r De fin ition
5.9.2.1 Wake-up Control Register (WCR)
Table 94. Wake-up Control Register (WCR)
Offset(69) 0x12 Access: User read/write
76543210
RCSSEL L5WE L4WE L3WE L2WE L1WE L0WE
W
Reset00111111
Note:
69. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 95. WCR - Register Field Descriptions
Field Description
7-6
CSSEL
Cyclic Sense Select - Configures the HSx output for the cyclic sense event. Note, with no LxWE selected - only the selected
HSx output will be switched periodically, no Lx state change would be detected. For all configurations, the Forced Wake-up
can be activated in parallel in Section 5.9.2.2, “Timing Control Register (TCR)"
00 - Cyclic Sense Off
01 - Cyclic Sense with periodic HS1on
10 - Cyclic Sense with periodic HS2 on
11 - Cyclic Sense with periodic HS1 and HS2 on.
5 - L5WE
Wake-up Input 5 Enabled - L5 Wake-up Select Bit.
0 - L5 Wake-up Disabled
1 - L5 Wake-up Enabled
4 - L4WE
Wake-up Input 4 Enabled - L4 Wake-up Select Bit.
0 - L4 Wake-up Disabled
1 - L4 Wake-up Enabled
Wake-up / Cyclic Sense
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 73
5.9.2.2 Timing Control Register (TCR)
3 - L3WE
Wake-up Input 3 Enabled - L3 Wake-up Select Bit.
0 - L3Wake-up Disabled
1 - L3 Wake-up Enabled
2- L2WE
Wake-up Input 2 Enabled - L2 Wake-up Select Bit.
0 - L2 Wake-up Disabled
1 - L2 Wake-up Enabled
1 - L1WE
Wake-up Input 1 Enabled - L1 Wake-up Select Bit.
0 - L1 Wake-up Disabled
1 - L1 Wake-up Enabled
0 - L0WE
Wake-up Input 0 Enabled - L0 Wake-up Select Bit.
0 - L0 Wake-up Disabled
1 - L0 Wake-up Enabled
Table 96. T iming Co ntro l Regis ter (TCR)
Offset(70) 0x13 Access: User read/write
76543210
RFWM CST
W
Reset00000000
Note:
70. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 95. WCR - Register Field Descriptions
Field Description
Wake-up / Cyclic Sense
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 74
5.9.2.3 Wake-up Source Register (WSR)
Ta ble 97. TCR - Register Field Descriptions
Field Description
7-4
FWM
Forced Wake-up Multiplicator - Configures the multiplicator for the forced wake-up. The selected multiplicator (FWM!=0)
will force a wake-up every FWM x CST ms. With this implementation, Forced and Cyclic wake-up can be performed in
parallel with the cyclic sense period <= the forced wake-up period.
0000 - Forced Wake-up = Off
0001 - 1x
0010 - 2x
0011 - 4x
0100 - 8x
0101 - 16x
0110 - 32x
0111 - 64x
1000 - 128x
1001 - 256x
1010 - 512x
1011 - 1024x
11xx - not implemented (Forced Wake Multiplicator = 1024x)
3-0
CST
Cyclic Sense Timing(71)
0000 - 1.0 ms
0001 - 2.0 ms
0010 - 5.0 ms
0011 - 10 ms
0100 - 20 ms
0101 - 50 ms
0110 - 100 ms
0111 - 200 ms
1000 - 500 ms
1001 - 1000 ms
1010 - 1111 - not implemented (Cyclic Sense Timing = 1000 ms)
Note:
71. Cyclic Sense Timing with Accuracy CSAC and CSACT.
Table 98. Wake-up Source Register (WSR)
Offset(72) 0x14 Access: User read
76543210
RFWU LINWU L5WU L4WU L3WU L2WU L1WU L0WU
W
Note:
72. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 99. WSR - Register Field Descriptions
Field Description
7 - FWU Forced Wake-up - Wake-up caused by a forced wake-up
6 - LINWU LIN Wake-up - Wake-up caused by a LIN wake-up
5 - L5WU L5 Wake-up - Wake-up caused by a state change of the L6 Input
4 - L4WU L4 Wake-up - Wake-up caused by a state change of the L5 Input
3 - L3WU L3 Wake-up - Wake-up caused by a state change of the L4 Input
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 75
Reading the WSR will clear the wake-up status bit(s). Writing will have no effect. The Wake-up Source Register (WSR) has to be
read after a wake-up condition, in order to execute a new STOP mode command. Two base clock cycles (fBASE) delays are
required between the WSR read and the MCR write.
2 - L2WU L2 Wake-up - Wake-up caused by a state change of the L3 Input
1 - L1WU L1 Wake-up - Wake-up caused by a state change of the L2 Input
0 - L0WU L0 Wake-up - Wake-up caused by a state change of the L1 Input
Ta ble 99. WSR - Register Field Descriptions
Field Description
Window Watchdog
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 76
5.10 Window Watchdog
The MM912_634 analog die includes a configurable window watchdog, which is active in Normal mode. The
watchdog module is based on a separate clock source (fBASE) operating independent from the MCU based
D2DCLK clock. The watchdog timeout (tWDTO) can be configured between 10 ms and 1280 ms (typ.) using the
Watchdog Register (WDR).
During Low Power mode, the watchdog feature is not active, a D2D read during Stop mode will have the WDOFF bit set.
To clear the watchdog counter, a alternating write must be performed to the Watchdog Service Register (WDSR). The first write
after the RESET_A has been released has to be 0xAA. The next one must be 0x55.
After the RESET_A has been released, there will be a standard (non-window) watchdog active with a fixed timeout of tIWDTO.
The Watchdog Window Open (WDWO) bit is set during that time and the window watchdog can be configured (WDR) without
changing the initial timeout, and can be trimmed using the trim value given in the MCU trimming Flash section. See Section 5.26,
“MM912_634 - Analog Die Trimming".
Figure 20. MM912_634 An alog Die Watchdog Operation
To enable the window watchdog, the initial counter reset has to be performed by writing 0xAA to the Watchdog Service Register
(WDSR) before tIWDTO is reached.
If the tIWDTO timeout is reached with no counter reset or a value different from 0xAA was written to the WDSR, a watchdog reset
will occur.
Once entering Window Watchdog mode, the first half of the time tWDTO forbids a counter reset. To reset the watchdog counter,
an alternating write of 0x55 and 0xAA must be performed within the second half of the tWDTO. A Window Open (WDWO) flag will
indicate the current status of the window. A timeout or wrong value written to the WDSR will force a watchdog reset.
For debug purpose, the watchdog can be completely disabled by applying VTST to the TCLK pin while TEST_A is grounded.
The watchdog will be disabled as long as VTST is present. The watchdog is guaranteed functional for VTSTEN. The WDOFF bit
will indicate the watchdog being disabled. The WDSR register will reset to default once the watchdog is disabled. Once the
watchdog is re-enabled, the initial watchdog sequence has to be performed.
During Low Power mode, the Watchdog clock is halted and the Watchdog Service Register (WDSR) is reset to the default state.
5.10.1 Register Definitio n
5.10.1.1 Watchdog Regist er (WDR)
Table 100. Watchdog Register (WDR)
Offset(73) 0x10 Access: User read/write
76543210
RWDOFF WDWO 000 WDTO
W
Reset00000000
Note:
73. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
ANALOGMCU
Window Watch Dog
Window Closed
Window Watch Dog
Window Open
Standard Initial Watch Dog (no window)
tIWDTO
WD Register
WRITE = 0x55
Initial WD Reg.
WRITE = 0xAA
RESET_A release
Window Watch Dog
Window Closed
Window Watch Dog
Window Open
tWDTO / 2 tWDTO / 2
Window WD timing (tWDTO)
t
WD Register
WRITE = 0xAA
(to be continued)
Window Watchdog
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 77
5.10.1.2 Watchdog Service Register (WDSR)
Table 101. WDR - Register Field Descriptions
Field Description
7 - WDOFF Watchdog Off - Indicating the Watchdog module is being disabled externally.
6 - WDWO Watchdog Window Open - Indicating the Watchdog Window is currently open for counter reset.
2-0
WDTO[2:0]
Watchdog Timeout Configuration - configuring the Watchdog timeout duration tWDTO.
000 - 10 ms
001 - 20 ms
010 - 40 ms
011 - 80 ms
100 - 160 ms
101 - 320 ms
110 - 640 ms
111 - 1280 ms
Table 102. Watchdog Service Register (WDSR)
Offset(74) 0x11 Access: User read/write
76543210
RWDSR
W
Reset01010101
Note:
74. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 103. WDSR - Register Field Descriptions
Field Description
7-0
WDSR
Watchdog Service Register - Writing this register with the correct value (0xAA alternating 0x55) while the window is open
will reset the watchdog counter. Writing the register while the watchdog is disabled will have no effect.
Hall Sensor Supply Output - HSUP
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 78
5.11 Hall Sensor Supply Output - HSUP
To supply Hall Effect Sensors or similar external loads, the HSUP output is implemented. To reduce power
dissipation inside the device, the output is implemented as a switchable Voltage Regulator, internally connected
to the VS1 supply input. For protection, an Over-temperature Shutdown and a Current Limitation is implemented.
A write to the Hall Supply Register (HSR), when the over-temperature condition is gone, will re-enable the Hall
Supply Output.
The HSUP output is active only during Normal mode. A capacitor CHSUP is recommended for operation.
5.11.1 Register Defin it io n
5.11.1.1 Hall Supply Register (HSR)
Table 104. Hall Supply Register (HSR)
Offset(75) 0x38 Access: User read/write
76543210
RHOTIE HOTC 0 0000
HSUPON
W
Reset00000000
Note:
75. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 105. HSR - Register Field Descriptions
Field Description
7 - HOTIE Hall Supply Over-temperature Interrupt Enable
6 - HOTC Hall Supply Over-temperature Condition present. During the event, the Hall Supply is shut down. Reading the register will
clear the HOT flag if present. See Section 5.7, “Interrupts" for details.
0 - HSUPON
Hall Supply On:
0 - Hall Supply Regulator disabled
1 - Hall Supply Regulator enabled
ANALOGMCU
High Side Drivers - HS
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 79
5.12 High Side Drivers - HS
These outputs are two high side drivers, intended to drive small resistive loads or LEDs incorporating the following
features:
• PWM capability via the PWM Module
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• High voltage shutdown - HVI (software maskable)
• Cyclic-Sense, See Section 5.9, “Wake-up / Cyclic Sense"
5.12.1 Open Load Detection
Each high side driver signals an open load condition if the current through the high side is below the open load current threshold.
The open load condition is indicated with the bits HS1OL and HS2OL in the High Side Status Register (HSSR).
5.12.2 Current Limitation
Each high side driver has an output current limitation. In combination with the over-temperature shutdown the high side drivers
are protected against over-current and short-circuit failures.
That the driver operates in the current limitation area is indicated with the bits HS1CL and HS2CL in the High Side Status Register
(HSSR).
5.12.3 Over-temperature Protection (HS Interrupt)
Both high side drivers are protected against over-temperature. In over-temperature conditions, both high side drivers are shut
down and the event is latched in the Interrupt Control Module. The shutdown is indicated as HS Interrupt in the Interrupt Source
Register (ISR).
A thermal shutdown of the high side drivers is indicated by setting the HSOT bit in the High Side Status Register (HSSR).
A write to the High Side Control Register (HSCR), when the over-temperature condition is gone, will re- enable the high side
drivers.
5.12.4 High Voltage Shutdown
In case of a high voltage condition (HVI), and if the high voltage shutdown is enabled (bit HVSDE in the High Side Control Register
(HSCR) is set), both high side drivers are shut down. A write to the High Side Control Register (HSCR), when the high voltage
condition is gone, will re-enable the high side drivers.
5.12.5 Sleep And Stop Mode
The high side drivers can be enabled to operate in Sleep and Stop mode for cyclic sensing. See Section 5.9, “Wake-up / Cyclic
Sense"
5.12.6 PWM Capability
Section 5.14, “PWM Control Module (PWM8B2C)"
5.12.7 Register Definitio n
5.12.7.1 High Side Control Register (HSCR)
Table 106. High Side Control Register (HSCR)
Offset(76) 0x28 Access: User read/write
76543210
RHSOTIE HSHVSDE PWMCS2 PWMCS1 PWMHS2 PWMHS1 HS2 HS1
W
Reset00000000
Note:
76. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
ANALOGMCU
High Side Drivers - HS
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 80
5.12.7.2 High Side Status Register (HSSR)
Ta ble 107. HSCR - Register Field Descriptions
Field Description
7 - HSOTIE High Side Over-temperature Interrupt Enable
6 - HSHVSDE High Side High Voltage Shutdown. Once enabled, both high sides will shut down when a high voltage condition - HVC is
present. See Section 5.5, “Power Supply" for the Voltage Status Register.
5 - PWMCS2
PWM Channel Select HS2
0 - PWM Channel 0 selected as PWM Channel
1 - PWM Channel 1 selected as PWM Channel
4 - PWMCS1
PWM Channel Select HS1
0 - PWM Channel 0 selected as PWM Channel
1 - PWM Channel 1 selected as PWM Channel
3 - PWMHS2
PWM Enable for HS2
0 - PWM disabled on HS2
1 - PWM enabled on HS2 (Channel as selected with PWMCS2)
2 - PWMHS1
PWM Enable for HS1
0 - PWM disabled on HS1
1 - PWM enabled on HS1 (Channel as selected with PWMCS1)
1 - HS2
HS2 Control
0 - HS2 disabled
1 - HS2 enabled
0 - HS1
HS2 Control
0 - HS1 disabled
1 - HS1 enabled
Table 1 08. High Side Status Register (HSSR)
Offset(77) 0x29 Access: User read
76543210
RHSOTC 0 0 0 HS2CL HS1CL HS2OL HS1OL
W
Reset00000000
Note:
77. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 109. HSSR - Register Field Descriptions
Field Description
7 - HSOTC High Side Over-temperature Condition present. Both drivers are turned off. Reading the register will clear the HSOT
interrupt flag if present. See Section 5.7, “Interrupts" for details.
3 - HS2CL High Side 2 Current Limitation
2 - HS1CL High Side 1 Current Limitation
1 - HS2OL High Side 2 Open Load
1 - HS1OL High Side 1Open Load
Low Side Drivers - LSx
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 81
5.13 Low Side Drivers - LSx
5.13.1 Introduction / Features
These outputs are two low side drivers intended to drive relays (inductive loads) incorporating the following
features:
• PWM capability
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• Active clamp
• Independent VREG - High Voltage Shutdown
5.13.1.1 Block Diagram
The following Figure shows the basic structure of the LS drivers.
Figure 21. Low Side Drive rs - Blo ck Diagram
5.13.1.2 Modes of Opera tio n
The Low Side module is active only in Normal mode; the Low Side drivers are disabled in Sleep and Stop mode.
5.13.2 External Signal Description
This section lists and describes the signals that do connect off-chip.
Table 110 shows all the pins and their functions that are controlled by the Low Side module.
Ta ble 110. Pin Functions and Priorities
Pin Name Pin Function
& Priority I/O Description Pin Function
after Reset
LS1 High Voltage Output OLow Side Power Output Driver, Active Clamping LS1
LS2 O LS2
ANALOGMCU
ANALOG
LSx
Low Side - Driver
(active clamp)
open load detection
current limitation
overtemperture shutdown (maskable interrupt)
VREG high voltage shutdown (maskable interrupt)
PGND
active
clamp
Interrupt
Control
Module
LSOTIE
LS - Control
LSx
LSxOL
LSxCL
MODE[1:0]
High Temperature IRQ
on/off
Status
VDD
PWMLSx
LSOTC
PWMCSx
PWM0
PWM1
VROVC
VROVIE
VREG High Voltage IRQ
Vreg high
voltage
LSCEN[3:0] VDD Digital Sleep2p5 Digital
4Bit
4Bit
VREG HV
Shutdown
Latch
Control
1Bit
Located in VCR
Located in VSR
Low Side Drivers - LSx
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 82
5.13.3 Memory Map and Registers
5.13.3.1 Module Memory Map
Table 111 shows the register map of the Low Side Driver module. All Register addresses given are referenced to the D2D
interface offset.
5.13.3.2 Register Descrip tion s
5.13.3.2.1 Low Side Control Register (LSCR)
Table 111. Low Side Module - Memory Map
Register
Name Bit 7 654321Bit 0
0x30
LSCR
RLSOTIE 0PWMCS2 PWMCS1 PWMLS2 PWMLS1 LS2 LS1
W
0x31
LSSR
RLSOTC 0 0 0 LS2CL LS1CL LS2OL LS1OL
W
0x32
LSCEN
R0000 LSCEN
W
Table 112. Low Side Control Register (LSCR)
Offset(78) 0x30 Access: User read/write
76543210
RLSOTIE 0PWMCS2 PWMCS1 PWMLS2 PWMLS1 LS2 LS1
W
Reset00000000
Note:
78. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 113. LSCR - Register Field Descriptions
Field Description
7 - LSOTIE Low Side Over-temperature Interrupt Enable
5 - PWMCS2
PWM Channel Select LS2
0 - PWM Channel 0 selected as PWM Channel
1 - PWM Channel 1 selected as PWM Channel
4 - PWMCS1
PWM Channel Select LS1
0 - PWM Channel 0 selected as PWM Channel
1 - PWM Channel 1 selected as PWM Channel
3 - PWMLS2
PWM Enable for LS2
0 - PWM disabled on LS2
1 - PWM enabled on LS2 (Channel as selected with PWMCS2)
2 - PWMLS1
PWM Enable for LS1
0 - PWM disabled on LS1
1 - PWM enabled on LS1 (Channel as selected with PWMCS1)
1 - LS2 LS2 Enable; LSEN has to be written once to control the LS2 Driver
0 - LS1 LS1 Enable; LSEN has to be written once to control the LS1 Driver
Low Side Drivers - LSx
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 83
5.13.3.2.2 Low Side Status Register (LSSR)
5.13.3.2.3 Low Side Control Enable Register (LSCEN)
5.13.4 Functional Description
The Low Side switches are controlled by the bits LS1:2 in the Low Side Control Register (LSCR). In order to control the Low
Sides, the LSCEN register has to be correctly written once after RESET or VROV.
To protect the device against over-voltage when an inductive load (relay) is turned off an active clamp circuit is implemented.
5.13.4.1 Voltage Regulator Over- voltage Protecti o n
To protect the application for an unintentional activation of the drivers in case of a voltage regulator over-voltage failure, the Low
Side Drivers will automatically shut down in case of an over-voltage on one of the two regulators.
The shutdown is fully handled in the analog section of the driver. This will secure the feature in case the digital logic is damaged
due to the over-voltage condition.
Table 114. Low Side Status Regis t e r (LSSR)
Offset(79) 0x31 Access: User read
76543210
RLSOTC 0 0 0 LS2CL LS1CL LS2OL LS1OL
W
Reset00000000
Note:
79. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 115. LSSR - Register Field Descriptions
Field Description
7 - LSOTC Low Side Over-temperature condition present. Both drivers are turned off. Reading the register will clear the LSOT interrupt
flag if present. See Section 5.7, “Interrupts" for details.
3 - LS2CL Low Side 2 Current Limitation
2 - LS1CL Low Side 1 Current Limitation
1 - LS2OL Low Side 2 Open Load
0 - LS1OL Low Side 1Open Load
Table 1 16. Low Side Enable Register (LSEN)
Offset(80) 0x32 Access: User read/write
76543210
R0000 LSCEN
W
Reset00000000
Note:
80. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 117. LSEN - Register Field Descriptions
Field Description
3-0
LSCEN
Low Side Control Enable - To allow the LS Control via LSx, the correct value has to be written into the LSCEN Register.
0x5 - Low Side Control Enabled
all other values - Low Side Control Disabled
Low Side Drivers - LSx
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 84
Once an over-voltage condition on one of the voltage regulators occurs, the LSx control bits in the Low Side Control Register
(LSCR) will be reset to 0. The Voltage Regulator Over-voltage Condition Bit (VROVC) in the Voltage Status Register (VSR) will
stay set as long as the condition is present. If the Voltage Regulator Over-voltage Interrupt was enabled (VROVIE=1), the VROV-
Interrupt will be issued. Reading the Voltage Regulator Over-voltage Condition Bit (VROVC) in the Voltage Status Register (VSR)
will clear the interrupt. To issue another VROV - Interrupt, the condition has to vanish and be present again.
To re-enable the Low Side Drivers after a Voltage Regulator Over-voltage condition occurred, first the LSCEN register has to be
written with “0x05” - this information is processed through the main digital blocks, and would secure a minimum functionality
before enabling the LS drivers again. In a second step, the LSx Control Bits in the Low Side Control Register (LSCR) must be
enabled again after the over-voltage condition has vanished (VROVC=0).
NOTE
The over-voltage threshold has to be trimmed at system power up. Please refer to
Section 5.26.1.2.3, “Trimming Register 2 (CTR2)" for details. The default trim is worst case
and may have disabled the LS function already. An initial LS enable would be needed.
5.13.4.2 Open Load Detection
Each Low Side driver signals an open load condition if the current through the Low Side is below the open load current threshold.
The open load condition is indicated with the bit LS1OP and LS2OP in the Low Side Status Register (LSSR).
5.13.4.3 Current Limitation
Each Low Side driver has a current limitation. In combination with the over-temperature shutdown, the Low Side drivers are
protected against over-current and short-circuit failures.
The driver operates in current limitation, and is indicated with the bits LS1CL and LS2CL in the Low Side Status Register (LSSR).
Note: If the drivers is operating in current limitation mode excessive power might be dissipated.
5.13.4.4 Over-temperature Protection (LS Interrupt)
Both Low Side drivers are protected against over-temperature. In case of an over-temperature condition, both Low Side drivers
are shut down and the event is latched in the Interrupt Control Module. The shutdown is indicated as LS Interrupt in the Interrupt
Source Register (ISR).
If the bit LSM is set in the Interrupt Mask Register (IMR) than an Interrupt (IRQ) is generated.
A write to the Low Side Control Register (LSCR) will re-enable the Low Side drivers when the over-temperature condition is gone.
5.13.5 PWM Capability
See Section 5.14, “PWM Control Module (PWM8B2C)".
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 85
5.14 PWM Control Module (PWM8B2C)
5.14.1 Introduction
To control the High Side (HS1, HS2) and the Low Side (LS1, LS2) duty cycle as well as the PTB2 output, the PWM
module is implemented. Refer to the individual driver section for details on the use of the internal PWM1 and
PWM0 signal (Section 5.12, “High Side Drivers - HS", Section 5.13, “Low Side Drivers - LSx" and Section 5.18, “General Purpose
I/O - PTB[0…2]")
The PWM definition is based on the HC12 PWM definitions with some of the simplifications incorporated. The PWM module has
two channels with independent controls of left and center aligned outputs on each channel.
Each of the two channels has a programmable period and duty cycle as well as a dedicated counter. A flexible clock select
scheme allows a total of four different clock sources to be used with the counters. Each of the modulators can create independent
continuous waveforms with software-selectable duty rates from 0% to 100%.
5.14.1.1 Features
The PWM block includes these distinctive features:
• Two independent PWM channels with programmable periods and duty cycles
• Dedicated counter for each PWM channel
• Programmable PWM enable/disable for each channel
• Software selection of PWM duty pulse polarity for each channel
• Period and duty cycle are double buffered. Change takes effect when the end of the effective period is reached (PWM
counter reaches zero), or when the channel is disabled
• Programmable center or left aligned outputs on individual channels
• Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies
• Programmable clock select logic
5.14.1.2 Modes of Opera tio n
The PWM8B2C module does operate in Normal mode only.
5.14.1.3 Block Diagram
Figure 22 shows the block diagram for the 8-bit 2-channel PWM block.
Figure 22. PWM Block Diag ram
ANALOGMCU
Clock Select PWM Clock
Period and Duty Counter
Channel 1
Alignment
Polarity
Control
PWM8B2C
PWM1
Enable
PWM Channels
Period and Duty Counter
Channel 0
PWM0
D2D Clock
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 86
5.14.2 Signal Description
The PWM module has a total of two internal outputs to control the Low Side Outputs, the High Side Outputs and / or the PTB2
output with pulse width modulation. See Section 5.12, “High Side Drivers - HS", Section 5.13, “Low Side Drivers - LSx" and
Section 5.18, “General Purpose I/O - PTB[0…2]" for configuration details.
NOTE
Based on the D2D clock speed, the PWM8B2C module is capable of generating PWM signal
frequencies higher than the maximum output frequency of the connected driver (HS, LS).
Please refer to Section 4.6, “Dynamic Electrical Characteristics" for details.
Do not exceed the driver maximum output frequency!
5.14.2.1 D2DCLK
Die 2 Die Interface Clock.
5.14.2.2 PWM1 — Pulse Width Modulator Channel 1
This signal serves as waveform output of PWM channel 1.
5.14.2.3 PWM0 — Pulse Width Modulator Channel 0
This signal serves as waveform output of PWM channel 0.
5.14.3 Register Description s
This section describes in detail all the registers and register bits in the PWM module. Reserved bits within a register will always
read as 0 and the write will be unimplemented. Unimplemented functions are indicated by shading the bit.
Table 118. PWM Register Summary
Name / Offset(81) 7 6 5 4 3 2 1 0
0x60
PWMCTL
RCAE1 CAE0 PCLK1 PCLK0 PPOL1 PPOL0 PWME1 PWME0
W
0x61
PWMPRCLK
R0 PCKB2 PCKB1 PCKB0 0PCKA2 PCKA1 PCKA0
W
0x62
PWMSCLA
RBit 7 6 5 4 3 2 1 Bit 0
W
0x63
PWMSCLB
RBit 7 6 5 4 3 2 1 Bit 0
W
0x64
PWMCNT0
RBit 7 6 5 4 3 2 1 Bit 0
W00000000
0x65
PWMCNT1
RBit 7 6 5 4 3 2 1 Bit 0
W00000000
0x66
PWMPER0
RBit 7 6 5 4 3 2 1 Bit 0
W
0x67
PWMPER1
RBit 7 6 5 4 3 2 1 Bit 0
W
0x68
PWMDTY0
RBit 7 6 5 4 3 2 1 Bit 0
W
0x69
PWMDTY1
RBit 7 6 5 4 3 2 1 Bit 0
W
Note:
81. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 87
5.14.3.1 PWM Control Regi st er (PWMCT L )
5.14.3.1.1 PWM Enable (PWMEx)
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx bits are set (PWMEx = 1),
the associated PWM output is enabled immediately. However, the actual PWM waveform is not available on the associated PWM
output until its clock source begins its next cycle, due to the synchronization of PWMEx and the clock source.
NOTE
The first PWM cycle after enabling the channel can be irregular. If both PWM channels are
disabled (PWME1–0 = 0), the prescaler counter shuts off for power savings.
5.14.3.1.2 PWM Polarity (PPOLx)
The starting polarity of each PWM channel waveform is determined by the associated PPOLx bit. If the polarity bit is one, the
PWM channel output is high at the beginning of the cycle and then goes low when the duty count is reached. Conversely, if the
polarity bit is zero, the output starts low and then goes high when the duty count is reached.
NOTE
PPOLx register bits can be written anytime. If the polarity changes while a PWM signal is
being generated, a truncated or stretched pulse can occur during the transition
Table 119. PWM Control Register (PWMCTL)
Offset(82) 0x60 Access: User read/write
76543210
RCAE1 CAE0 PCLK1 PCLK0 PPOL1 PPOL0 PWME1 PWME0
W
Reset00000000
Note:
82. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 120. PWMCTL - Register Field Descriptions
Field Description
7–6
CAE[1:0]
Center Aligned Output Modes on Channels 1–0
0 Channels 1–0 operate in left aligned output mode.
1 Channels 1–0 operate in center aligned output mode.
5
PCLK1
Pulse Width Channel 1 Clock Select
0 Clock B is the clock source for PWM channel 1.
1 Clock SB is the clock source for PWM channel 1.
4
PCLK0
Pulse Width Channel 0 Clock Select
0 Clock A is the clock source for PWM channel 0.
1 Clock SA is the clock source for PWM channel 0.
3–2
PPOL[1:0]
Pulse Width Channel 1–0 Polarity Bits
0 PWM channel 1–0 outputs are low at the beginning of the period, then go high when the duty count is reached.
1 PWM channel 1–0 outputs are high at the beginning of the period, then go low when the duty count is reached.
1-0
PWME[1:0]
Pulse Width Channel 1–0 Enable
0 Pulse width channel 1–0 is disabled.
1 Pulse width channel 1–0 is enabled. The pulse modulated signal becomes available at PWM, output bit 1 when its
clock source begins its next cycle.
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 88
5.14.3.1.3 PWM Clock Select (PCLKx)
Each PWM channel has a choice of two clocks to use as the clock source for that channel as described by the following.
NOTE
Register bits PCLK0 and PCLK1 can be written anytime. If a clock select changes while a
PWM signal is being generated, a truncated or stretched pulse can occur during the
transition.
5.14.3.1.4 PWM Center Align Enable (CAEx)
The CAEx bits select either center aligned outputs or left aligned output for both PWM channels. If the CAEx bit is set to a one,
the corresponding PWM output will be center aligned. If the CAEx bit is cleared, the corresponding PWM output will be left
aligned. See Section 5.14.4.2.5, “Left Aligned Outputs" and Section 5.14.4.2.6, “Center Aligned Outputs" for a more detailed
description of the PWM output modes.
NOTE
Write these bits only when the corresponding channel is disabled.
5.14.3.2 PWM Prescale Clock Select Register (PWMPRCLK)
This register selects the prescale clock source for clocks A and B independently.
Ta ble 121. PWM Prescale Clock Select Register (PWMPRCL K)
Offset(83) 0x61 Access: User read/write
76543210
R0
PCKB2 PCKB1 PCKB0 0PCKA2 PCKA1 PCKA0
W
Reset00000000
Note:
83. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 122. PWMPRCLK - Register Fiel d Des cri pti ons
Field Description
6–4
PCKB[2:0]
Prescaler Select for Clock B — Clock B is one of two clock sources which can be used for channel 1. These three bits
determine the rate of clock B, as shown in Table 123.
2–0
PCKA[2:0]
Prescaler Select for Clock A — Clock A is one of two clock sources which can be used for channel 0. These three bits
determine the rate of clock A, as shown in Table 124.
Table 123. Clock B Prescaler Selects
PCKB2 PCKB1 PCKB0 Value of Clock B
0 0 0 D2D clock
0 0 1 D2D clock / 2
0 1 0 D2D clock / 4
0 1 1 D2D clock / 8
1 0 0 D2D clock / 16
1 0 1 D2D clock / 32
1 1 0 D2D clock / 64
1 1 1 D2D clock / 128
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 89
NOTE
PCKB2–0 and PCKA2–0 register bits can be written anytime. If the clock pre-scale is
changed while a PWM signal is being generated, a truncated or stretched pulse can occur
during the transition.
5.14.3.3 PWM Scale A Register (PWMSCLA)
PWMSCLA is the programmable scale value used in scaling clock A to generate clock SA. Clock SA is generated by taking clock
A, dividing it by the value in the PWMSCLA register and dividing that by two.
Clock SA = Clock A / (2 * PWMSCLA)
NOTE
When PWMSCLA = $00, PWMSCLA value is considered a full scale value of 256. Clock A
is thus divided by 512.
Any value written to this register will cause the scale counter to load the new scale value (PWMSCLA)
.
5.14.3.4 PWM Scale B Register (PWMSCLB)
PWMSCLB is the programmable scale value used in scaling clock B to generate clock SB. Clock SB is generated by taking clock
B, dividing it by the value in the PWMSCLB register and dividing that by two.
Clock SB = Clock B / (2 * PWMSCLB)
NOTE
When PWMSCLB = $00, PWMSCLB value is considered a full scale value of 256. Clock B
is thus divided by 512.
Any value written to this register will cause the scale counter to load the new scale value (PWMSCLB).
Table 124. Clock A Prescaler Selects
PCKA2 PCKA1 PCKA0 Value of Clock A
00 0 D2D clock
0 0 1 D2D clock / 2
0 1 0 D2D clock / 4
0 1 1 D2D clock / 8
1 0 0 D2D clock / 16
1 0 1 D2D clock / 32
1 1 0 D2D clock / 64
1 1 1 D2D clock / 128
Ta ble 125. PWM Scale A Register (PWMSCLA)
Offset(84) 0x62 Access: User read/write
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W
Reset00000000
Note:
84. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 90
5.14.3.5 PWM Channel Counter Registers (PWMCNTx)
Each channel has a dedicated 8-bit up/down counter, which runs at the rate of the selected clock source. The counter can be
read at any time without affecting the count or the operation of the PWM channel. In left aligned output mode, the counter counts
from 0 to the value in the period register - 1. In center aligned output mode, the counter counts from 0 up to the value in the period
register and then back down to 0.
Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up, the immediate load of
both duty and period registers with values from the buffers, and the output to change according to the polarity bit. The counter is
also cleared at the end of the effective period (see Section 5.14.4.2.5, “Left Aligned Outputs" and Section 5.14.4.2.6, “Center
Aligned Outputs" for more details). When the channel is disabled (PWMEx = 0), the PWMCNTx register does not count. When a
channel becomes enabled (PWMEx = 1), the associated PWM counter starts at the count in the PWMCNTx register. For more
detailed information on the operation of the counters, see Section 5.14.4.2.4, “PWM Timer Counters".
NOTE
Writing to the counter while the channel is enabled can cause an irregular PWM cycle to
occur.
5.14.3.6 PWM Channel Period Registers (PWMPERx)
There is a dedicated period register for each channel. The value in this register determines the period of the associated PWM
channel.
The period registers for each channel are double buffered, so if they change while the channel is enabled, the change will NOT
take effect until one of the following occurs:
• The effective period ends
• The counter is written (counter resets to $00)
• The channel is disabled
In this way, the output of the PWM will always be either the old waveform or the new waveform, not some variation in between.
If the channel is not enabled, then writes to the period register will go directly to the latches as well as the buffer.
NOTE
Reads of this register return the most recent value written. Reads do not necessarily return
the value of the currently active period due to the double buffering scheme.
Ta ble 126. PWM Scale B Register (PWMSCLB)
Offset(85) 0x63 Access: User read/write
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W
Reset00000000
Note:
85. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 127. PWM Channel Counter Reg isters (PWMCNTx)
Offset(86) 0x64/0x65 Access: User read/write
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W00000000
Reset00000000
Note:
86. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 91
See Section 5.14.4.2.3, “PWM Period and Duty" for more information.
To calculate the output period, take the selected clock source period for the channel of interest (A, B, SA, or SB) and multiply it
by the value in the period register for that channel:
• Left aligned output (CAEx = 0)
• PWMx Period = Channel Clock Period * PWMPERx Center Aligned Output (CAEx = 1)
• PWMx Period = Channel Clock Period * (2 * PWMPERx)
For boundary case programming values, please refer to Section 5.14.4.2.7, “PWM Boundary Cases".
5.14.3.7 PWM Channel Duty Registers (PWMDTYx)
There is a dedicated duty register for each channel. The value in this register determines the duty of the associated PWM
channel. The duty value is compared to the counter and if it is equal to the counter value a match occurs and the output changes
state.
The duty registers for each channel are double buffered, so if they change while the channel is enabled, the change will NOT
take effect until one of the following occurs:
• The effective period ends
• The counter is written (counter resets to $00)
• The channel is disabled
In this way, the output of the PWM will always be either the old duty waveform or the new duty waveform, not some variation in
between. If the channel is not enabled, then writes to the duty register will go directly to the latches as well as the buffer.
NOTE
Reads of this register return the most recent value written. Reads do not necessarily return
the value of the currently active duty due to the double buffering scheme.
See Section 5.14.4.2.3, “PWM Period and Duty" for more information.
NOTE
Depending on the polarity bit, the duty registers will contain the count of either the high time
or the low time. If the polarity bit is one, the output starts high and then goes low when the
duty count is reached, so the duty registers contain a count of the high time. If the polarity
bit is zero, the output starts low and then goes high when the duty count is reached, so the
duty registers contain a count of the low time.
To calculate the output duty cycle (high time as a% of period) for a particular channel:
• Polarity = 0 (PPOL x =0)
– Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
• Polarity = 1 (PPOLx = 1)
– Duty Cycle = [PWMDTYx / PWMPERx] * 100%
For boundary case programming values, please refer to Section 5.14.4.2.7, “PWM Boundary Cases".
Table 128. PWM Channel Period Registers (PWMPERx)
Offset(87) 0x66/0x67 Access: User read/write
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W
Reset00000000
Note:
87. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 92
5.14.4 Functional Description
5.14.4.1 PWM Clock Select
There are four available clocks: clock A, clock B, clock SA (scaled A), and clock SB (scaled B). These four clocks are based on
the D2D clock.
Clock A and B can be software selected to be 1, 1/2, 1/4, 1/8,..., 1/64, 1/128 times the D2D clock. Clock SA uses clock A as an
input and divides it further with a reloadable counter. Similarly, clock SB uses clock B as an input and divides it further with a
reloadable counter. The rates available for clock SA are software selectable to be clock A divided by 2, 4, 6, 8,..., or 512 in
increments of divide by 2. Similar rates are available for clock SB. Each PWM channel has the capability of selecting one of two
clocks, either the pre-scaled clock (clock A or B) or the scaled clock (clock SA or SB).
The block diagram in Figure 23 shows the four different clocks and how the scaled clocks are created.
5.14.4.1.1 Prescale
The input clock to the PWM prescaler is the D2D clock. The input clock can also be disabled when both PWM channels are
disabled (PWME1-0 = 0). This is useful for reducing power by disabling the prescale counter.
Clock A and clock B are scaled values of the input clock. The value is software selectable for both clock A and clock B and has
options of 1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, or 1/128 times the D2D clock. The value selected for clock A is determined by the
PCKA2, PCKA1, PCKA0 bits in the PWMPRCLK register. The value selected for clock B is determined by the PCKB2, PCKB1,
PCKB0 bits also in the PWMPRCLK register.
5.14.4.1.2 Clock Scale
The scaled A clock uses clock A as an input and divides it further with a user programmable value and then divides this by 2.
The scaled B clock uses clock B as an input and divides it further with a user programmable value and then divides this by 2.
The rates available for clock SA are software selectable to be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by
2. Similar rates are available for clock SB.
Tab le 129. PWM Channe l Duty Registers (PWMDTYx)
Offset(88) 0x68/0x69 Access: User read/write
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W
Reset00000000
Note:
88. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 93
Figure 23. PWM Clock Select Block Diagram
Clock A is used as an input to an 8-bit down counter. This down counter loads a user programmable scale value from the scale
register (PWMSCLA). When the down counter reaches one, a pulse is output and the 8-bit counter is re-loaded. The output signal
from this circuit is further divided by two. This gives a greater range with only a slight reduction in granularity. Clock SA equals
clock A divided by two times the value in the PWMSCLA register.
128248163264
PCKB2
PCKB1
PCKB0
M
U
X
Clock A
Clock B
Clock SA
Clock A/2, A/4, A/6,....A/512
Prescale Scale
Divide by
D2D Clock
Clock Select
M
U
X
PCLK0
Clock to
PWM Ch 0
M
U
X
PCLK1
Clock to
PWM Ch 1
Load
DIV 2PWMSCLB Clock SB
Clock B/2, B/4, B/6,....B/512
M
U
X
PCKA2
PCKA1
PCKA0
PWME1-0
Count = 1
Load
DIV 2PWMSCLA
Count = 1
8-Bit Down
Counter
8-Bit Down
Counter
Prescaler Taps:
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 94
NOTE
Clock SA = Clock A / (2 * PWMSCLA)
When PWMSCLA = $00, PWMSCLA value is considered a full scale value of 256. Clock A
is thus divided by 512.
Similarly, clock B is used as an input to an 8-bit down counter followed by a divide by two producing clock SB. Thus, clock SB
equals clock B divided by two times the value in the PWMSCLB register.
NOTE
Clock SB = Clock B / (2 * PWMSCLB)
When PWMSCLB = $00, PWMSCLB value is considered a full scale value of 256. Clock B
is thus divided by 512.
As an example, consider the case in which the user writes $FF into the PWMSCLA register. Clock A for this case will be E divided
by 4. A pulse will occur at a rate of once every 255x4 E cycles. Passing this through the divide by two circuit produces a clock
signal at an E divided by 2040 rate. Similarly, a value of $01 in the PWMSCLA register when clock A is E divided by 4 will produce
a clock at an E divided by 8 rate.
Writing to PWMSCLA or PWMSCLB causes the associated 8-bit down counter to be re-loaded. Otherwise, when changing rates
the counter would have to count down to $01 before counting at the proper rate. Forcing the associated counter to re-load the
scale register value every time PWMSCLA or PWMSCLB is written prevents this.
NOTE
Writing to the scale registers while channels are operating can cause irregularities in the
PWM outputs.
5.14.4.1.3 Clock Select
Each PWM channel has the capability of selecting one of two clocks. For channels 0 the clock choice is clock A or clock SA. For
channels 1 the choice is clock B or clock SB. The clock selection is done with the PCLKx control bits in the PWMCTL register.
NOTE
Changing clock control bits while channels are operating can cause irregularities in the PWM
outputs.
5.14.4.2 PWM Channel Timers
The main part of the PWM module are the actual timers. Each of the timer channels has a counter, a period register, and a duty
register (each are 8-bit). The waveform output period is controlled by a match between the period register and the value in the
counter. The duty is controlled by a match between the duty register and the counter value, and causes the state of the output to
change during the period. The starting polarity of the output is also selectable on a per channel basis. Shown in Figure 24 is the
block diagram for the PWM timer.
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 95
Figure 24. PWM Timer Channel Block Diagram
5.14.4.2.1 PWM Enable
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx bits are set (PWMEx = 1),
the associated PWM output signal is enabled immediately. However, the actual PWM waveform is not available on the associated
PWM output until its clock source begins its next cycle due to the synchronization of PWMEx and the clock source.
NOTE
The first PWM cycle after enabling the channel can be irregular.
On the front end of the PWM timer, the clock is enabled to the PWM circuit by the PWMEx bit being high. There is an
edge-synchronizing circuit to guarantee that the clock will only be enabled or disabled at an edge. When the channel is disabled
(PWMEx = 0), the counter for the channel does not count.
5.14.4.2.2 PWM Polarity
Each channel has a polarity bit to allow starting a waveform cycle with a high or low signal. This is shown on the block diagram
as a mux select of either the Q output or the Q output of the PWM output flip flop. When one of the bits in the PWMPOL register
is set, the associated PWM channel output is high at the beginning of the waveform, then goes low when the duty count is
reached. Conversely, if the polarity bit is zero, the output starts low and then goes high when the duty count is reached.
5.14.4.2.3 PWM Period and Duty
Dedicated period and duty registers exist for each channel and are double buffered, so if they change while the channel is
enabled, the change will NOT take effect until one of the following occurs:
• The effective period ends
• The counter is written (counter resets to $00)
• The channel is disabled
D2D Clock
T
R
Q
Q
PPOLx
PWMEx
PWM
Gate
8-bit Compare =
PWMDTYx
8-bit Compare =
PWMPERx
CAEx
T
R
Q
Q
8-Bit Counter
PWMCNTx
(Clock Edge
Sync)
Up/Down Reset
M
U
X
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 96
In this way, the output of the PWM will always be either the old waveform or the new waveform, not some variation in between.
If the channel is not enabled, then writes to the period and duty registers will go directly to the latches as well as the buffer.
A change in duty or period can be forced into effect “immediately” by writing the new value to the duty and/or period registers,
and then writing to the counter. This forces the counter to reset and the new duty and/or period values to be latched. In addition,
since the counter is readable, it is possible to know where the count is with respect to the duty value, and software can be used
to make adjustments
NOTE
When forcing a new period or duty into effect immediately, an irregular PWM cycle can occur.
Depending on the polarity bit, the duty registers will contain the count of either the high time
or the low time.
5.14.4.2.4 PWM Timer Counters
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source (see Section 5.14.4.1,
“PWM Clock Select" for the available clock sources and rates). The counter compares to two registers, a duty register and a
period register as shown in Figure 24. When the PWM counter matches the duty register, the output flip-flop changes state,
causing the PWM waveform to also change state. A match between the PWM counter and the period register behaves differently
depending on what output mode is selected as shown in Figure 24 and described in Section 5.14.4.2.5, “Left Aligned Outputs"
and Section 5.14.4.2.6, “Center Aligned Outputs".
Each channel counter can be read at anytime without affecting the count or the operation of the PWM channel.
Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up, the immediate load of
both duty and period registers with values from the buffers, and the output to change according to the polarity bit. When the
channel is disabled (PWMEx = 0), the counter stops. When a channel becomes enabled (PWMEx = 1), the associated PWM
counter continues from the count in the PWMCNTx register. This allows the waveform to continue where it left off when the
channel is re-enabled. When the channel is disabled, writing “0” to the period register will cause the counter to reset on the next
selected clock.
NOTE
To start a new “clean” PWM waveform without any “history” from the old waveform, writing
the channel counter (PWMCNTx) must happen prior to enabling the PWM channel
(PWMEx = 1).
Generally, writes to the counter are done prior to enabling a channel in order to start from a known state. However, writing a
counter can also be done while the PWM channel is enabled (counting). The effect is similar to writing the counter when the
channel is disabled, except that the new period is started immediately with the output set according to the polarity bit.
NOTE
Writing to the counter while the channel is enabled can cause an irregular PWM cycle to
occur.
The counter is cleared at the end of the effective period (see Section 5.14.4.2.5, “Left Aligned Outputs" and Section 5.14.4.2.6,
“Center Aligned Outputs" for more details).
5.14.4.2.5 Left Aligned Outputs
The PWM timer provides the choice of two types of outputs, left aligned or center aligned. They are selected with the CAEx bits
in the PWMCTL register. If the CAEx bit is cleared (CAEx = 0), the corresponding PWM output will be left aligned.
In left aligned output mode, the 8-bit counter is configured as an up counter only. It compares to two registers, a duty register and
a period register as shown in the block diagram in Figure 24. When the PWM counter matches the duty register the output flip-flop
changes state causing the PWM waveform to also change state. A match between the PWM counter and the period register
resets the counter and the output flip-flop, as shown in Figure 24, as well as performing a load from the double buffer period and
duty register to the associated registers, as described in Section 5.14.4.2.3, “PWM Period and Duty". The counter counts from 0
to the value in the period register – 1.
Table 130. PWM Timer Counter Conditions
Counter Clears ($00) Counter Counts Counter Stops
When PWMCNTx register written to any value When PWM channel is enabled (PWMEx = 1).
Counts from last value in PWMCNTx. When PWM channel is disabled (PWMEx = 0)
Effective period ends
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 97
NOTE
Changing the PWM output mode from left aligned to center aligned output (or vice versa)
while channels are operating can cause irregularities in the PWM output. It is recommended
to program the output mode before enabling the PWM channel.
Figure 25. PWM Left Aligned Output Waveform
To calculate the output frequency in left aligned output mode for a particular channel, take the selected clock source frequency
for the channel (A, B, SA, or SB), and divide it by the value in the period register for that channel.
• PWMx Frequency = Clock (A, B, SA, or SB) / PWMPERx
• PWMx Duty Cycle (high time as a % of period):
— Polarity = 0 (PPOLx = 0)
• Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
— Polarity = 1 (PPOLx = 1)
Duty Cycle = [PWMDTYx / PWMPERx] * 100%
As an example of a left aligned output, consider the following case:
Clock Source = E, where E = 10 kHz (100 µs period)
PPOLx = 0
PWMPERx = 4
PWMDTYx = 1
PWMx Frequency = 10 kHz/4 = 2.5 kHz
PWMx Period = 400 µs
PWMx Duty Cycle = 3/4 *100% = 75%
The output waveform generated is shown in Figure 26.
Figure 26. PWM Left Aligned Output Example Waveform
5.14.4.2.6 Center Aligned Outputs
For a center aligned output mode selection, set the CAEx bit (CAEx = 1) in the PWMCTL register, and the corresponding PWM
output will be center aligned.
The 8-bit counter operates as an up/down counter in this mode, and is set to up whenever the counter is equal to $00. The counter
compares to two registers, a duty register and a period register, as shown in the block diagram in Figure 24. When the PWM
counter matches the duty register, the output flip-flop changes state, causing the PWM waveform to also change state. A match
between the PWM counter and the period register changes the counter direction from an up-count to a down-count. When the
PWM counter decrements and matches the duty register again, the output flip-flop changes state, causing the PWM output to
also change state. When the PWM counter decrements and reaches zero, the counter direction changes from a down-count back
to an up-count, and a load from the double buffer period and duty registers to the associated registers is performed, as described
PWMDTYx
Period = PWMPERx
PPOLx = 0
PPOLx = 1
Period = 400 µs
E=100µs
Duty Cycle = 75%
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 98
in Section 5.14.4.2.3, “PWM Period and Duty". The counter counts from 0 up to the value in the period register and then back
down to 0. Thus the effective period is PWMPERx*2.
NOTE
Changing the PWM output mode from left aligned to center aligned output (or vice versa)
while channels are operating can cause irregularities in the PWM output. It is recommended
to program the output mode before enabling the PWM channel.
Figure 27. PWM Center Aligned Output Waveform
To calculate the output frequency in center aligned output mode for a particular channel, take the selected clock source frequency
for the channel (A, B, SA, or SB) and divide it by twice the value in the period register for that channel.
• PWMx Frequency = Clock (A, B, SA, or SB) / (2*PWMPERx)
• PWMx Duty Cycle (high time as a% of period):
— Polarity = 0 (PPOLx = 0)
Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
— Polarity = 1 (PPOLx = 1)
Duty Cycle = [PWMDTYx / PWMPERx] * 100%
As an example of a center aligned output, consider the following case:
Clock Source = E, where E = 10 kHz (100 µs period)
PPOLx = 0
PWMPERx = 4
PWMDTYx = 1
PWMx Frequency = 10 kHz/8 = 1.25 kHz
PWMx Period = 800 µs
PWMx Duty Cycle = 3/4 *100% = 75%
Figure 28 shows the output waveform generated.
Figure 28. PWM Cente r Aligned Output Example Wavefo rm
PPOLx = 0
PPOLx = 1
PWMDTYx PWMDTYx
Period = PWMPERx*2
PWMPERx
PWMPERx
E=100µs
DUTY CYCLE = 75%
E=100µs
PERIOD = 800 µs
PWM Control Module (PWM8B2C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 99
5.14.4.2.7 PWM Boundary Cases
Table 131 summarizes the boundary conditions for the PWM, regardless of the output mode (left aligned or center aligned).
5.14.5 Resets
The reset state of each individual bit is listed within the Section 5.14.3, “Register Descriptions", which details the registers and
their bit-fields. All special functions or modes which are initialized during or just following reset are described within this section.
• The 8-bit up/down counter is configured as an up counter out of reset.
• All the channels are disabled and all the counters do not count.
5.14.6 Interrupts
The PWM module has no Interrupts.
Table 131. PWM Boundary Cases
PWMDTYx PWMPERx PPOLx PWMx Output
$00
(indicates no duty) >$00 1 Always low
$00
(indicates no duty) >$00 0 Always high
XX $00(89)
(indicates no period) 1 Always high
XX $00(89)
(indicates no period) 0 Always low
>= PWMPERx XX 1 Always high
Note:
89. Counter = $00 and does not count.
LIN Physical Layer Interface - LIN
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 100
5.15 LIN Physical Layer Interface - LIN
The LIN bus pin provides a physical layer for single-wire communication in automotive applications. The LIN
physical layer is designed to meet the LIN physical layer version 2.1 specification, and has the following features:
• LIN physical layer 2.1 compliant
• Slew rate selection 20 kBit, 10 kBit, and fast Mode (100 kBit)
• Over-temperature Shutdown - HTI
• Permanent Pull-up in Normal mode 30 k, 1.0 M in low power
• Current limitation
• External Rx / Tx access. See Section 5.18, “General Purpose I/O - PTB[0…2]"
• Slew Rate Trim Bit. See Section 5.26, “MM912_634 - Analog Die Trimming"
The LIN driver is a Low Side MOSFET with current limitation and thermal shutdown. An internal pull-up resistor with a serial diode
structure is integrated, so no external pull-up components are required for the application in a slave node. The fall time from
dominant to recessive and the rise time from recessive to dominant is controlled. The symmetry between both slopes is
guaranteed.
5.15.1 LIN Pin
The LIN pin offers high susceptibility immunity level from external disturbance, guaranteeing communication during external
disturbance. See Section 4.8, “ESD Protection and Latch-up Immunity".
5.15.2 Slew Rate Selection
The slew rate can be selected for optimized operation at 10 kBit/s and 20 kBit/s as well as a fast baud rate (100 kBit) for test and
programming. The slew rate can be adapted with the bits LINSR[1:0] in the LIN Register (LINR). The initial slew rate is 20 kBit/s.
5.15.3 Over-temperature Shutdown (LIN Interrupt)
The output Low Side FET (transmitter) is protected against over-temperature conditions. In case of an over-temperature
condition, the transmitter will be shut down and the bit LINOTC in the LIN Register (LINR) is set as long as the condition is
present.
If the LINOTIE bit is set in the LIN Register (LINR), an Interrupt IRQ will be generated. Acknowledge the interrupt by reading the
LIN Register (LINR). To issue a new interrupt, the condition has to vanish and occur again.
The transmitter is automatically re-enabled once the over-temperature condition is gone and TxD is High.
5.15.4 Low Power Mode and Wake-up Feature
During Low Power mode operation the transmitter of the physical layer is disabled. The receiver is still active and able to detect
Wake-up events on the LIN bus line.
A dominant level longer than tPROPWL followed by a rising edge, will generate a wake-up event and be reported in the Wake-up
Source Register (WSR).
5.15.5 J2602 Compliance
A Low Voltage Shutdown feature was implemented to allow controlled J2602 compliant LIN driver behavior under Low Voltage
conditions (LVSD=0).
When an under-voltage occurs on VS1 (LVI), the LIN stays in recessive mode if it was in recessive state. If it was in a dominant
state, it waits until the next dominant to recessive transition, then it stays in the recessive state.
When the under-voltage condition (LVI) is gone, the LIN will start operating when Tx is in a recessive state or on the next dominant
to recessive transition.
ANALOGMCU
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 101
5.15.6 Register Definitio n
5.15.6.1 LIN Register (LINR)
Ta ble 132. LIN Register (LINR)
Offset(90) 0x18 Access: User read
76543210
RLINOTIE LINOTC RX TX LVSD LINEN LINSR
W
Reset00000000
Note:
90. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 133. LINR - Register Field Des c ripti on s
Field Description
7 - LINOTIE LIN - Over-temperature Interrupt Enable
6 - LINOTC LIN - Over-temperature condition present. LIN driver is shut down. Reading this bit will clear the LINOT interrupt flag.
5 - RX
LIN - Receiver (Rx) Status.
0 - LIN Bus Dominant
1 - LIN Bus Recessive
4 - TX
LIN - Direct Transmitter Control. The inverted signal is OR
0 - Transmitter not controlled
1 - Transmitter Dominant
3 - LVSD
LIN - Low Voltage Shutdown Disable (J2602 Compliance Control)
0 - LIN will be set to recessive state in case of VS1 under-voltage condition
1 - LIN will stay functional even with a VS1 under-voltage condition
2 - LINEN
LIN Module Enable
0 - LIN Module Disabled
1 - LIN Module Enabled
1-0 - LINSR
LIN - Slew Rate Select
00 - Normal Slew Rate (20 kBit)
01 - Slow Slew Rate (10.4 kBit)
10 - Fast Slew Rate (100 kBit)
11 - Normal Slew Rate (20 kBit)
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 102
5.16 Serial Communication Interface (S08SCIV4)
5.16.1 Introduction
5.16.1.1 Features
Features of the SCI module include:
• Full-duplex, standard non-return-to-zero (NRZ) format
• Double-buffered transmitter and receiver with separate enables
• Programmable baud rates (13-bit modulo divider)
• Interrupt-driven or polled operation:
— Transmit data register empty and transmission complete
— Receive data register full
— Receive overrun, parity error, framing error, and noise error
— Idle receiver detect
— Active edge on receive pin
— Break detect supporting LIN
• Hardware parity generation and checking
• Programmable 8-bit or 9-bit character length
• Receiver wake-up by idle-line or address-mark
• Optional 13-bit break character generation / 11-bit break character detection
• Selectable transmitter output polarity
5.16.1.2 Modes of Opera tio n
See Section 5.16.3, “Functional Description", for details concerning SCI operation in these modes:
• 8 and 9-bit data modes
• Loop mode
• Single-wire mode
5.16.1.3 Block Diagram
Figure 29 shows the transmitter portion of the SCI.
ANALOGMCU
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 103
Figure 29. SCI Transmitter Block Diagram
Figure 30 shows the receiver portion of the SCI.
H876543210L
SCID – Tx BUFFER
(WRITE-ONLY)
INTERNAL BUS
STOP
11-BIT TRANSMIT SHIFT REGISTER
START
SHIFT DIRECTION
LSB
1 BAUD
RATE CLOCK
PARITY
GENERATION
TRANSMIT CONTROL
SHIFT ENABLE
PREAMBLE (ALL 1s)
BREAK (ALL 0s)
SCI CONTROLS TxD
TxD DIRECTION
TO TxD
LOGIC
LOOP
CONTROL TO RECEIVE
DATA IN
TO TxD
Tx INTERRUPT
REQUEST
LOOPS
RSRC
TIE
TC
TDRE
M
PT
PE
TCIE
TE
SBK
T*
TXDIR
LOAD FROM SCID
TX-
BRK13
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 104
Figure 30. SCI Receiver Block Diagram
H876543210L
SCID – Rx BUFFER
(READ-ONLY)
INTERNAL BUS
STOP
11-BIT RECEIVE SHIFT REGISTER
START
SHIFT DIRECTION
LSB
FROM RxD
RATE CLOCK
Rx INTERRUPT
REQUEST
DATA RECOVERY
DIVIDE
16 BAUD
SINGLE-WIRE
LOOP CONTROL
WAKEUP
LOGIC
ALL 1s
MSB
FROM
TRANSMITTER
ERROR INTERRUPT
REQUEST
PARITY
CHECKING
BY 16
RDRF
RIE
IDLE
ILIE
OR
ORIE
FE
FEIE
NF
NEIE
PF
LOOPS
PEIE
PT
PE
RSRC
ILT RWU
M
LBKDIF
LBKDIE
RXEDGIF
RXEDGIE
ACTIVE EDGE
DETECT
RX-
LBKDE
RWUID
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 105
5.16.2 Register Definitio n
The SCI has eight 8-bit registers to control baud rate, select SCI options, report SCI status, and for transmit/receive data.
Refer to Section 5.6, “Die to Die Interface - Target" of this data sheet for the absolute address assignments for all SCI registers.
This section refers to registers and control bits only by their names.
5.16.2.1 SCI Baud Rate Registers (SCIBD (hi), SCIBD (lo))
This pair of registers controls the prescale divisor for SCI baud rate generation. To update the 13-bit baud rate setting
[SBR12:SBR0], first write to SCIBD (hi) to buffer the high half of the new value, and then write to SCIBD (lo). The working value
in SCIBD (hi) does not change until SCIBD (lo) is written.
SCIBDL is reset to a non-zero value, so after reset the baud rate generator remains disabled until the first time the receiver or
transmitter is enabled (RE or TE bits in SCIC2 are written to 1).
Ta ble 134. SCI Baud Rate Register (SCIBD (hi))
Offset(91) 0x40 Access: User read/write
76543210
RLBKDIE RXEDGIE 0SBR12 SBR11 SBR10 SBR9 SBR8
W
Reset00000000
Note:
91. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 135. SCIBD (hi) Field Descriptions
Field Description
7
LBKDIE
LIN Break Detect Interrupt Enable (for LBKDIF)
0 Hardware interrupts from LBKDIF disabled (use polling).
1 Hardware interrupt requested when LBKDIF flag is 1.
6
RXEDGIE
RxD Input Active Edge Interrupt Enable (for RXEDGIF)
0 Hardware interrupts from RXEDGIF disabled (use polling).
1 Hardware interrupt requested when RXEDGIF flag is 1.
4:0
SBR[128]
Baud Rate Modulo Divisor — The 13 bits in SBR[12:0] are referred to collectively as BR, and they set the modulo divide rate
for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to reduce supply current. When BR = 1
to 8191, the SCI baud rate = BUSCLK/(16BR). See also BR bits in Table 137.
Table 136. SCI Baud Rate Register (SCIBDL)
Offset(92) 0x41 Access: User read/write
76543210
RSBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
W
Reset00000100
Note:
92. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 137. SCIBDL Field Descriptions
Field Description
7:0
SBR[7:0]
Baud Rate Modulo Divisor — These 13 bits in SBR[12:0] are referred to collectively as BR, and they set the modulo divide rate
for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to reduce supply current. When BR = 1
to 8191, the SCI baud rate = BUSCLK/(16BR). See also BR bits in Table 135.
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 106
5.16.2.2 SCI Control Register 1 (SCIC1)
This read/write register is used to control various optional features of the SCI system.
Table 138. SCI Control Register 1 (SCIC1 )
Offset(93) 0x42 Access: User read/write
76543210
RLOOPS 0RSRC M 0ILT PE PT
W
Reset00000000
Note:
93. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 139. SCIC1 Field Descriptions
Field Description
7
LOOPS
Loop Mode Select — Selects between loop back modes and normal 2-pin full-duplex modes. When LOOPS = 1, the transmitter
output is internally connected to the receiver input.
0 Normal operation — RxD and TxD use separate pins.
1 Loop mode or single-wire mode where transmitter outputs are internally connected to receiver input. (See RSRC bit.)
RxD pin is not used by SCI.
5
RSRC
Receiver Source Select — This bit has no meaning or effect unless the LOOPS bit is set to 1. When LOOPS = 1, the receiver
input is internally connected to the TxD pin and RSRC determines whether this connection is also connected to the transmitter
output.
0 Provided LOOPS = 1, RSRC = 0 selects internal loop back mode and the SCI does not use the RxD pins.
1 Single-wire SCI mode where the TxD pin is connected to the transmitter output and receiver input.
4
M
9-Bit or 8-Bit Mode Select
0 Normal — start + 8 data bits (LSB first) + stop.
1 Receiver and transmitter use 9-bit data characters start + 8 data bits (LSB first) + 9th data bit + stop.
2
ILT
Idle Line Type Select — Setting this bit to 1 ensures that the stop bit and logic 1 bits at the end of a character do not count
toward the 10 or 11 bit times of logic high level needed by the idle line detection logic. Refer to Section 5.16.3.3.2.1, “Idle-line
Wake-up" for more information.
0 Idle character bit count starts after start bit.
1 Idle character bit count starts after stop bit.
1
PE
Parity Enable — Enables hardware parity generation and checking. When parity is enabled, the most significant bit (MSB) of
the data character (eighth or ninth data bit) is treated as the parity bit.
0 No hardware parity generation or checking.
1 Parity enabled.
0
PT
Parity Type — Provided parity is enabled (PE = 1), this bit selects even or odd parity. Odd parity means the total number of 1s
in the data character, including the parity bit, is odd. Even parity means the total number of 1s in the data character, including
the parity bit, is even.
0 Even parity.
1 Odd parity.
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 107
5.16.2.3 SCI Control Register 2 (SCIC2)
This register can be read or written at any time.
Table 140. SCI Control Register 2 (SCIC2 )
Offset(94) 0x43 Access: User read/write
76543210
RTIE TCIE RIE ILIE TE RE RWU SBK
W
Reset00000000
Note:
94. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 141. SCIC2 Field Descriptions
Field Description
7
TIE
Transmit Interrupt Enable (for TDRE)
0 Hardware interrupts from TDRE disabled (use polling).
1 Hardware interrupt requested when TDRE flag is 1.
6
TCIE
Transmission Complete Interrupt Enable (for TC)
0 Hardware interrupts from TC disabled (use polling).
1 Hardware interrupt requested when TC flag is 1.
5
RIE
Receiver Interrupt Enable (for RDRF)
0 Hardware interrupts from RDRF disabled (use polling).
1 Hardware interrupt requested when RDRF flag is 1.
4
LIE
Idle Line Interrupt Enable (for IDLE)
0 Hardware interrupts from IDLE disabled (use polling).
1 Hardware interrupt requested when IDLE flag is 1.
3
TE
Transmitter Enable
0 Transmitter off.
1 Transmitter on.
TE must be 1 in order to use the SCI transmitter. When TE = 1, the SCI forces the TxD pin to act as an output for the SCI
system.
When the SCI is configured for single-wire operation (LOOPS = RSRC = 1), TXDIR controls the direction of traffic on the single
SCI communication line (TxD pin).
TE also can be used to queue an idle character by writing TE = 0 then TE = 1 while a transmission is in progress. Refer to
Section 5.16.3.2.1, “Send Break and Queued Idle" for more details.
When TE is written to 0, the transmitter keeps control of the port TxD pin until any data, queued idle, or queued break character
finishes transmitting before allowing the pin to revert to a general-purpose I/O pin.
2
RE
Receiver Enable — When the SCI receiver is off, the RxD pin reverts to being a general-purpose port I/O pin. If LOOPS = 1
the RxD pin reverts to being a general-purpose I/O pin even if RE = 1.
0 Receiver off.
1 Receiver on.
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 108
5.16.2.4 SCI Status Register 1 (SCI S1)
This register has eight read-only status flags. Writes have no effect. Special software sequences (which do not involve writing to
this register) are used to clear these status flags.
1
RWU
Receiver Wake-up Control — This bit can be written to 1 to place the SCI receiver in a standby state where it waits for automatic
hardware detection of a selected wake-up condition. The wake-up condition is either an idle line between messages
(WAKE = 0, idle-line wake-up), or a logic 1 in the most significant data bit in a character (WAKE = 1, address-mark wake-up).
Application software sets RWU and (normally) a selected hardware condition automatically clears RWU. Refer to
Section 5.16.3.3.2, “Receiver Wake-up Operation" for more details.
0 Normal SCI receiver operation.
1 SCI receiver in standby waiting for wake-up condition.
0
SBK
Send Break — Writing a 1 and then a 0 to SBK queues a break character in the transmit data stream. Additional break
characters of 10 or 11 (13 or 14 if BRK13 = 1) bit times of logic 0 are queued as long as SBK = 1. Depending on the timing of
the set and clear of SBK relative to the information currently being transmitted, a second break character may be queued
before software clears SBK. Refer to Section 5.16.3.2.1, “Send Break and Queued Idle" for more details.
0 Normal transmitter operation.
1 Queue break character(s) to be sent.
Table 142. SCI Status Register 1 (SCIS1)
Offset(95) 0x44 Access: User read/write
76543210
R TDRE TC RDRF IDLE OR NF FE pF
W
Reset11000000
Note:
95. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 143. SCIS1 Field Descriptions
Field Description
7
TDRE
Transmit Data Register Empty Flag — TDRE is set out of reset and when a transmit data value transfers from the transmit data
buffer to the transmit shifter, leaving room for a new character in the buffer. To clear TDRE, read SCIS1 with TDRE = 1 and
then write to the SCI data register (SCID).
0 Transmit data register (buffer) full.
1 Transmit data register (buffer) empty.
6
TC
Transmission Complete Flag — TC is set out of reset and when TDRE = 1 and no data, preamble, or break character is being
transmitted.
0 Transmitter active (sending data, a preamble, or a break).
1 Transmitter idle (transmission activity complete).
TC is cleared automatically by reading SCIS1 with TC = 1 and then doing one of the following three things:
• Write to the SCI data register (SCID) to transmit new data
• Queue a preamble by changing TE from 0 to 1
• Queue a break character by writing 1 to SBK in SCIC2
5
RDRF
Receive Data Register Full Flag — RDRF becomes set when a character transfers from the receive shifter into the receive
data register (SCID). To clear RDRF, read SCIS1 with RDRF = 1 and then read the SCI data register (SCID).
0 Receive data register empty.
1 Receive data register full.
Table 141. SCIC2 Field Descriptions (continued)
Field Description
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 109
5.16.2.5 SCI Status Register 2 (SCI S2)
This register has one read-only status flag.
4
IDLE
Idle Line Flag — IDLE is set when the SCI receive line becomes idle for a full character time after a period of activity. When
ILT = 0, the receiver starts counting idle bit times after the start bit. So if the receive character is all 1s, these bit times and the
stop bit time count toward the full character time of logic high (10 or 11 bit times depending on the M control bit) needed for the
receiver to detect an idle line. When ILT = 1, the receiver doesn’t start counting idle bit times until after the stop bit. So the stop
bit and any logic high bit times at the end of the previous character do not count toward the full character time of logic high
needed for the receiver to detect an idle line.
To clear IDLE, read SCIS1 with IDLE = 1 and then read the SCI data register (SCID). After IDLE has been cleared, it cannot
become set again until after a new character has been received and RDRF has been set. IDLE will get set only once even if
the receive line remains idle for an extended period.
0 No idle line detected.
1 Idle line was detected.
3
OR
Receiver Overrun Flag — OR is set when a new serial character is ready to be transferred to the receive data register (buffer),
but the previously received character has not been read from SCID yet. In this case, the new character (and all associated
error information) is lost because there is no room to move it into SCID. To clear OR, read SCIS1 with OR = 1 and then read
the SCI data register (SCID).
0 No overrun.
1 Receive overrun (new SCI data lost).
2
NF
Noise Flag — The advanced sampling technique used in the receiver takes seven samples during the start bit and three
samples in each data bit and the stop bit. If any of these samples disagrees with the rest of the samples within any bit time in
the frame, the flag NF will be set at the same time as the flag RDRF gets set for the character. To clear NF, read SCIS1 and
then read the SCI data register (SCID).
0 No noise detected.
1 Noise detected in the received character in SCID.
1
FE
Framing Error Flag — FE is set at the same time as RDRF when the receiver detects a logic 0 where the stop bit was expected.
This suggests the receiver was not properly aligned to a character frame. To clear FE, read SCIS1 with FE = 1 and then read
the SCI data register (SCID).
0 No framing error detected. This does not guarantee the framing is correct.
1 Framing error.
0
PF
Parity Error Flag — PF is set at the same time as RDRF when parity is enabled (PE = 1) and the parity bit in the received
character does not agree with the expected parity value. To clear PF, read SCIS1 and then read the SCI data register (SCID).
0 No parity error.
1 Parity error.
Table 144. SCI Status Register 2 (SCIS2)
Offset(96) 0x45 Access: User read/write
76543210
RLBKDIF RXEDGIF 0RXINV(97) RWUID BRK13 LBKDE RAF
W
Reset00000000
Note:
96. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 14 3. SCIS1 Field Descriptions (continued)
Field Description
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 110
When using an internal oscillator in a LIN system, it is necessary to raise the break detection threshold by one bit time. Under
the worst case timing conditions allowed in LIN, it is possible that a 0x00 data character can appear to be 10.26 bit times long at
a slave which is running 14% faster than the master. This would trigger normal break detection circuitry which is designed to
detect a 10 bit break symbol. When the LBKDE bit is set, framing errors are inhibited and the break detection threshold changes
from 10 bits to 11 bits, preventing false detection of a 0x00 data character as a LIN break symbol.
5.16.2.6 SCI Control Register 3 (SCIC3)
Ta ble 145. SCIS2 Field Descriptions
Field Description
7
LBKDIF
LIN Break Detect Interrupt Flag — LBKDIF is set when the LIN break detect circuitry is enabled and a LIN break character is
detected. LBKDIF is cleared by writing a “1” to it.
0 No LIN break character has been detected.
1 LIN break character has been detected.
6
RXEDGIF
RxD Pin Active Edge Interrupt Flag — RXEDGIF is set when an active edge (falling if RXINV = 0, rising if RXINV=1) on the
RxD pin occurs. RXEDGIF is cleared by writing a “1” to it.
0 No active edge on the receive pin has occurred.
1 An active edge on the receive pin has occurred.
4
RXINV(97)
Receive Data Inversion — Setting this bit reverses the polarity of the received data input.
0 Receive data not inverted
1 Receive data inverted
3
RWUID
Receive Wake Up Idle Detect— RWUID controls whether the idle character that wakes up the receiver sets the IDLE bit.
0 During receive standby state (RWU = 1), the IDLE bit does not get set upon detection of an idle character.
1 During receive standby state (RWU = 1), the IDLE bit gets set upon detection of an idle character.
2
BRK13
Break Character Generation Length — BRK13 is used to select a longer transmitted break character length. Detection of a
framing error is not affected by the state of this bit.
0 Break character is transmitted with length of 10 bit times (11 if M = 1)
1 Break character is transmitted with length of 13 bit times (14 if M = 1)
1
LBKDE
LIN Break Detection Enable— LBKDE is used to select a longer break character detection length. While LBKDE is set, framing
error (FE) and receive data register full (RDRF) flags are prevented from setting.
0 Break character detection enabled.
1 Break character detection disabled.
Note:
97. Setting RXINV inverts the RxD input for all cases: data bits, start and stop bits, break, and idle.
Table 146. SCI Control Register 3 (SCIC3 )
Offset(98) 0x46 Access: User read/write
76543210
RR8 T8 TXDIR TXINV(99) ORIE NEIE FEIE PEIE
W
Reset00000000
Note:
98. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 111
5.16.2.7 SCI Data Register (SCID)
This register is actually two separate registers. Reads return the contents of the read-only receive data buffer and writes go to
the write-only transmit data buffer. Reads and writes of this register are also involved in the automatic flag clearing mechanisms
for the SCI status flags.
Ta ble 147. SCIC3 Field Descriptions
Field Description
7
R8
Ninth Data Bit for Receiver — When the SCI is configured for 9-bit data (M = 1), R8 can be thought of as a ninth receive data
bit to the left of the MSB of the buffered data in the SCID register. When reading 9-bit data, read R8 before reading SCID
because reading SCID completes automatic flag clearing sequences which could allow R8 and SCID to be overwritten with
new data.
6
T8
Ninth Data Bit for Transmitter — When the SCI is configured for 9-bit data (M = 1), T8 may be thought of as a ninth transmit
data bit to the left of the MSB of the data in the SCID register. When writing 9-bit data, the entire 9-bit value is transferred to
the SCI shift register after SCID is written so T8 should be written (if it needs to change from its previous value) before SCID
is written. If T8 does not need to change in the new value (such as when it is used to generate mark or space parity), it need
not be written each time SCID is written.
5
TXDIR
TxD Pin Direction in Single-wire Mode — When the SCI is configured for single-wire half-duplex operation
(LOOPS = RSRC = 1), this bit determines the direction of data at the TxD pin.
0 TxD pin is an input in single-wire mode.
1 TxD pin is an output in single-wire mode.
4
TXINV(99)
Transmit Data Inversion — Setting this bit reverses the polarity of the transmitted data output.
0 Transmit data not inverted
1 Transmit data inverted
3
ORIE
Overrun Interrupt Enable — This bit enables the overrun flag (OR) to generate hardware interrupt requests.
0 OR interrupts disabled (use polling).
1 Hardware interrupt requested when OR = 1.
2
NEIE
Noise Error Interrupt Enable — This bit enables the noise flag (NF) to generate hardware interrupt requests.
0 NF interrupts disabled (use polling).
1 Hardware interrupt requested when NF = 1.
1
FEIE
Framing Error Interrupt Enable — This bit enables the framing error flag (FE) to generate hardware interrupt requests.
0 FE interrupts disabled (use polling).
1 Hardware interrupt requested when FE = 1.
0
PEIE
Parity Error Interrupt Enable — This bit enables the parity error flag (PF) to generate hardware interrupt requests.
0 PF interrupts disabled (use polling).
1 Hardware interrupt requested when PF = 1.
Note:
99. Setting TXINV inverts the TxD output for all cases: data bits, start and stop bits, break, and idle.
Table 1 48. SCI Data Register (SCID)
Offset(100) 0x47 Access: User read/write
76543210
RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
Reset00000000
Note:
100. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 112
5.16.3 Functional Description
The SCI allows full-duplex, asynchronous, NRZ serial communication among the MCU and remote devices, including other
MCUs. The SCI comprises a baud rate generator, transmitter, and receiver block. The transmitter and receiver operate
independently, although they use the same baud rate generator. During normal operation, the MCU monitors the status of the
SCI, writes the data to be transmitted, and processes received data. The following describes each of the blocks of the SCI.
5.16.3.1 Baud Rate Generation
As shown in Figure 31, the clock source for the SCI baud rate generator is the D2D clock.
Figure 31. SCI Baud Rate Generation
SCI communications require the transmitter and receiver (which typically derive baud rates from independent clock sources) to
use the same baud rate. Allowed tolerance on this baud frequency depends on the details of how the receiver synchronizes to
the leading edge of the start bit and how bit sampling is performed.
The MCU resynchronizes to bit boundaries on every high-to-low transition, but in the worst case, there are no such transitions in
the full 10- or 11-bit time character frame so any mismatch in baud rate is accumulated for the whole character time. For a
Freescale Semiconductor SCI system whose bus frequency is driven by a crystal, the allowed baud rate mismatch is about ±4.5
percent for 8-bit data format and about ±4.0 percent for 9-bit data format. Although baud rate modulo divider settings do not
always produce baud rates that exactly match standard rates, it is normally possible to get within a few percent, which is
acceptable for reliable communications.
5.16.3.2 Transmitter Functional Description
This section describes the overall block diagram for the SCI transmitter, as well as specialized functions for sending break and
idle characters. The transmitter block diagram is shown in Figure 29.
The transmitter output (TxD) idle state defaults to logic high (TXINV = 0 following reset). The transmitter output is inverted by
setting TXINV = 1. The transmitter is enabled by setting the TE bit in SCIC2. This queues a preamble character that is one full
character frame of the idle state. The transmitter then remains idle until data is available in the transmit data buffer. Programs
store data into the transmit data buffer by writing to the SCI data register (SCID).
The central element of the SCI transmitter is the transmit shift register that is either 10 or 11 bits long depending on the setting
in the M control bit. For the remainder of this section, we will assume M = 0, selecting the normal 8-bit data mode. In 8-bit data
mode, the shift register holds a start bit, eight data bits, and a stop bit. When the transmit shift register is available for a new SCI
character, the value waiting in the transmit data register is transferred to the shift register (synchronized with the baud rate clock)
and the transmit data register empty (TDRE) status flag is set to indicate another character may be written to the transmit data
buffer at SCID.
If no new character is waiting in the transmit data buffer after a stop bit is shifted out the TxD pin, the transmitter sets the transmit
complete flag and enters an idle mode, with TxD high, waiting for more characters to transmit.
Writing 0 to TE does not immediately release the pin to be a general-purpose I/O pin. Any transmit activity that is in progress
must first be completed. This includes data characters in progress, queued idle characters, and queued break characters.
5.16.3.2.1 Send Break and Queued Idle
The SBK control bit in SCIC2 is used to send break characters which were originally used to gain the attention of old teletype
receivers. Break characters are a full character time of logic 0 (10 bit times including the start and stop bits). A longer break of
13 bit times can be enabled by setting BRK13 = 1. Normally, a program would wait for TDRE to become set to indicate the last
character of a message has moved to the transmit shifter, then write 1 and then write 0 to the SBK bit. This action queues a break
character to be sent as soon as the shifter is available. If SBK is still 1 when the queued break moves into the shifter
SBR12:SBR0
DIVIDE BY Tx BAUD RATE
Rx SAMPLING CLOCK
(16 ´ BAUD RATE)
BAUD RATE GENERATOR
OFF IF [SBR12:SBR0] = 0
D2D
BAUD RATE = BUSCLK
[SBR12:SBR0] ´ 16
16
MODULO DIVIDE BY
(1 THROUGH 8191)
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 113
(synchronized to the baud rate clock), an additional break character is queued. If the receiving device is another Freescale
Semiconductor SCI, the break characters will be received as 0s in all eight data bits and a framing error (FE = 1) occurs.
When idle-line wake-up is used, a full character time of idle (logic 1) is needed between messages to wake up any sleeping
receivers. Normally, a program would wait for TDRE to become set to indicate the last character of a message has moved to the
transmit shifter, then write 0 and then write 1 to the TE bit. This action queues an idle character to be sent as soon as the shifter
is available. As long as the character in the shifter does not finish while TE = 0, the SCI transmitter never actually releases control
of the TxD pin. If there is a possibility of the shifter finishing while TE = 0, set the general-purpose I/O controls so the pin that is
shared with TxD is an output driving a logic 1. This ensures that the TxD line will look like a normal idle line even if the SCI loses
control of the port pin between writing 0 and then 1 to TE.
The length of the break character is affected by the BRK13 and M bits as shown below.
5.16.3.3 Receiver Functional Description
In this section, the receiver block diagram (Figure 30) is used as a guide for the overall receiver functional description. Next, the
data sampling technique used to reconstruct receiver data is described in more detail. Finally, two variations of the receiver
wake-up function are explained.
The receiver input is inverted by setting RXINV = 1. The receiver is enabled by setting the RE bit in SCIC2. Character frames
consist of a start bit of logic 0, eight (or nine) data bits (LSB first), and a stop bit of logic 1. For information about 9-bit data mode,
refer to Section •, “8 and 9-bit data modes". For the remainder of this discussion, we assume the SCI is configured for normal
8-bit data mode.
After receiving the stop bit into the receive shifter, and provided the receive data register is not already full, the data character is
transferred to the receive data register and the receive data register full (RDRF) status flag is set. If RDRF was already set
indicating the receive data register (buffer) was already full, the overrun (OR) status flag is set and the new data is lost. Because
the SCI receiver is double-buffered, the program has one full character time after RDRF is set before the data in the receive data
buffer must be read to avoid a receiver overrun.
When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive data register by reading
SCID. The RDRF flag is cleared automatically by a 2-step sequence which is normally satisfied in the course of the user’s
program that handles receive data. Refer to Section 5.16.3.4, “Interrupts and Status Flags" for more details about flag clearing.
5.16.3.3.1 Data Sampling Technique
The SCI receiver uses a 16 baud rate clock for sampling. The receiver starts by taking logic level samples at 16 times the baud
rate to search for a falling edge on the RxD serial data input pin. A falling edge is defined as a logic 0 sample after three
consecutive logic 1 samples. The 16 baud rate clock is used to divide the bit time into 16 segments labeled RT1 through RT16.
When a falling edge is located, three more samples are taken at RT3, RT5, and RT7 to make sure this was a real start bit and
not merely noise. If at least two of these three samples are 0, the receiver assumes it is synchronized to a receive character.
The receiver then samples each bit time, including the start and stop bits, at RT8, RT9, and RT10 to determine the logic level for
that bit. The logic level is interpreted to be that of the majority of the samples taken during the bit time. In the case of the start bit,
the bit is assumed to be 0 if at least two of the samples at RT3, RT5, and RT7 are 0 even if one or all of the samples taken at
RT8, RT9, and RT10 are 1s. If any sample in any bit time (including the start and stop bits) in a character frame fails to agree
with the logic level for that bit, the noise flag (NF) will be set when the received character is transferred to the receive data buffer.
The falling edge detection logic continuously looks for falling edges, and if an edge is detected, the sample clock is
resynchronized to bit times. This improves the reliability of the receiver in the presence of noise or mismatched baud rates. It
does not improve worst case analysis because some characters do not have any extra falling edges anywhere in the character
frame.
In the case of a framing error, provided the received character was not a break character, the sampling logic that searches for a
falling edge is filled with three logic 1 samples so that a new start bit can be detected almost immediately.
Table 149. Break Character Length
BRK13 M Break Character Length
0 0 10 bit times
0 1 11 bit times
1 0 13 bit times
1 1 14 bit times
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 114
In the case of a framing error, the receiver is inhibited from receiving any new characters until the framing error flag is cleared.
The receive shift register continues to function, but a complete character cannot transfer to the receive data buffer if FE is still set.
5.16.3.3.2 Receiver Wake-up Operation
Receiver wake-up is a hardware mechanism that allows an SCI receiver to ignore the characters in a message that is intended
for a different SCI receiver. In such a system, all receivers evaluate the first character(s) of each message, and as soon as they
determine the message is intended for a different receiver, they write logic 1 to the receiver wake up (RWU) control bit in SCIC2.
When RWU bit is set, the status flags associated with the receiver (with the exception of the idle bit, IDLE, when RWUID bit is
set) are inhibited from setting, thus eliminating the software overhead for handling the unimportant message characters. At the
end of a message, or at the beginning of the next message, all receivers automatically force RWU to 0 so all receivers wake up
in time to look at the first character(s) of the next message.
5.16.3.3.2.1 Idle-line Wake-up
When WAKE = 0, the receiver is configured for idle-line wake-up. In this mode, RWU is cleared automatically when the receiver
detects a full character time of the idle-line level. The M control bit selects 8-bit or 9-bit data mode that determines how many bit
times of idle are needed to constitute a full character time (10 or 11 bit times because of the start and stop bits).
When RWU is one and RWUID is zero, the idle condition that wakes up the receiver does not set the IDLE flag. The receiver
wakes up and waits for the first data character of the next message which will set the RDRF flag and generate an interrupt if
enabled. When RWUID is one, any idle condition sets the IDLE flag and generates an interrupt if enabled, regardless of whether
RWU is zero or one.
The idle-line type (ILT) control bit selects one of two ways to detect an idle line. When ILT = 0, the idle bit counter starts after the
start bit so the stop bit and any logic 1s at the end of a character count toward the full character time of idle. When ILT = 1, the
idle bit counter does not start until after a stop bit time, so the idle detection is not affected by the data in the last character of the
previous message.
5.16.3.3.2.2 Address-Mark Wake-up
When WAKE = 1, the receiver is configured for address-mark wake-up. In this mode, RWU is cleared automatically when the
receiver detects a logic 1 in the most significant bit of a received character (eighth bit in M = 0 mode and ninth bit in M = 1 mode).
Address-mark wake-up allows messages to contain idle characters but requires that the MSB be reserved for use in address
frames. The logic 1 MSB of an address frame clears the RWU bit before the stop bit is received and sets the RDRF flag. In this
case the character with the MSB set is received even though the receiver was sleeping during most of this character time.
5.16.3.4 Interrupts and Status Flags
The SCI system has three separate interrupt vectors to reduce the amount of software needed to isolate the cause of the
interrupt. One interrupt vector is associated with the transmitter for TDRE and TC events. Another interrupt vector is associated
with the receiver for RDRF, IDLE, RXEDGIF and LBKDIF events, and a third vector is used for OR, NF, FE, and PF error
conditions. Each of these ten interrupt sources can be separately masked by local interrupt enable masks. The flags can still be
polled by software when the local masks are cleared to disable generation of hardware interrupt requests.
The SCI transmitter has two status flags that optionally can generate hardware interrupt requests. Transmit data register empty
(TDRE) indicates when there is room in the transmit data buffer to write another transmit character to SCID. If the transmit
interrupt enable (TIE) bit is set, a hardware interrupt will be requested whenever TDRE = 1. Transmit complete (TC) indicates
that the transmitter is finished transmitting all data, preamble, and break characters and is idle with TxD at the inactive level. This
flag is often used in systems with modems to determine when it is safe to turn off the modem. If the transmit complete interrupt
enable (TCIE) bit is set, a hardware interrupt will be requested whenever TC = 1. Instead of hardware interrupts, software polling
may be used to monitor the TDRE and TC status flags if the corresponding TIE or TCIE local interrupt masks are 0s.
When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive data register by reading
SCID. The RDRF flag is cleared by reading SCIS1 while RDRF = 1 and then reading SCID.
When polling is used, this sequence is naturally satisfied in the normal course of the user program. If hardware interrupts are
used, SCIS1 must be read in the interrupt service routine (ISR). Normally, this is done in the ISR anyway to check for receive
errors, so the sequence is automatically satisfied.
The IDLE status flag includes logic that prevents it from getting set repeatedly when the RxD line remains idle for an extended
period of time. IDLE is cleared by reading SCIS1 while IDLE = 1 and then reading SCID. After IDLE has been cleared, it cannot
become set again until the receiver has received at least one new character and has set RDRF.
Serial Communication Interface (S08SCIV4)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 115
If the associated error was detected in the received character that caused RDRF to be set, the error flags — noise flag (NF),
framing error (FE), and parity error flag (PF) — get set at the same time as RDRF. These flags are not set in overrun cases.
If RDRF was already set when a new character is ready to be transferred from the receive shifter to the receive data buffer, the
overrun (OR) flag gets set instead the data along with any associated NF, FE, or PF condition is lost.
At any time, an active edge on the RxD serial data input pin causes the RXEDGIF flag to set. The RXEDGIF flag is cleared by
writing a “1” to it. This function does depend on the receiver being enabled (RE = 1).
5.16.3.5 Additional SCI Functions
The following sections describe additional SCI functions.
5.16.3.5.1 8- and 9-Bit Data Modes
The SCI system (transmitter and receiver) can be configured to operate in 9-bit data mode by setting the M control bit in SCIC1.
In 9-bit mode, there is a ninth data bit to the left of the MSB of the SCI data register. For the transmit data buffer, this bit is stored
in T8 in SCIC3. For the receiver, the ninth bit is held in R8 in SCIC3.
For coherent writes to the transmit data buffer, write to the T8 bit before writing to SCID.
If the bit value to be transmitted as the ninth bit of a new character is the same as for the previous character, it is not necessary
to write to T8 again. When data is transferred from the transmit data buffer to the transmit shifter, the value in T8 is copied at the
same time data is transferred from SCID to the shifter.
9-bit data mode typically is used in conjunction with parity to allow eight bits of data plus the parity in the ninth bit. Or it is used
with address-mark wake-up so the ninth data bit can serve as the wake-up bit. In custom protocols, the ninth bit can also serve
as a software-controlled marker.
5.16.3.5.2 Stop Mode Operation
During all stop modes, clocks to the SCI module are halted.
In stop1 and stop2 modes, all SCI register data is lost and must be re-initialized upon recovery from these two stop modes. No
SCI module registers are affected in stop3 mode.
The receive input active edge detect circuit is still active in stop3 mode, but not in stop2. An active edge on the receive input
brings the CPU out of stop3 mode if the interrupt is not masked (RXEDGIE = 1).
Note that because the clocks are halted, the SCI module will resume operation upon exit from stop (only in stop3 mode). Software
should ensure stop mode is not entered while there is a character being transmitted out of or received into the SCI module.
5.16.3.5.3 Loop Mode
When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or single-wire mode (RSRC = 1).
Loop mode is sometimes used to check software, independent of connections in the external system, to help isolate system
problems. In this mode, the transmitter output is internally connected to the receiver input and the RxD pin is not used by the SCI,
so it reverts to a general purpose port I/O pin.
5.16.3.5.4 Single-wire Operation
When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or single-wire mode (RSRC = 1).
Single-wire mode is used to implement a half-duplex serial connection. The receiver is internally connected to the transmitter
output and to the TxD pin. The RxD pin is not used and reverts to a general purpose port I/O pin.
In single-wire mode, the TXDIR bit in SCIC3 controls the direction of serial data on the TxD pin. When TXDIR = 0, the TxD pin
is an input to the SCI receiver and the transmitter is temporarily disconnected from the TxD pin so an external device can send
serial data to the receiver. When TXDIR = 1, the TxD pin is an output driven by the transmitter. In single-wire mode, the internal
loop back connection from the transmitter to the receiver causes the receiver to receive characters that are sent out by the
transmitter.
High Voltage Inputs - Lx
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 116
5.17 High Voltage Inputs - Lx
Six High Voltage capable inputs are implemented with the following features:
• Digital Input Capable
• Analog Input Capable with selectable voltage divider.
• Wake-up Capable during Low Power mode. See Section 5.9, “Wake-up / Cyclic Sense".
When used as analog inputs to sense voltages outside the module a series resistor must be used on the used input. When a Lx
input is not selected in the analog multiplexer, the voltage divider is disconnected from that input. When a Lx input is selected in
the analog multiplexer, it will be disconnected in low power mode if configured as Wake-up input. Unused Lx pins are
recommended to be connected to GND to improve EMC behavior.
5.17.1 Regist e r De fin it io n
5.17.1.1 Lx Status Register (LXR)
5.17.1.2 Lx Control Register (LXCR)
Table 150. Lx Status Register (LXR)
Offset(101) 0x08 Access: User read
76543210
R0 0 L5L4L3L2L1L0
W
Note:
101. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 151. LXR - Register Field Descriptions
Field Description
L[5-0] Lx Status Register - Current Digital State of the Lx Input
Table 152. Lx Control Register (LXCR)
Offset(102) 0x09 Access: User read/write
76543210
R0 0L5DS L4DS L3DS L2DS L1DS L0DS
W
Reset00000000
Note:
102. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 153. LXCR - Register Field Descriptions
Field Description
5-0
L[5-0]DS
Analog Input Divider Ratio Selection - Lx
0 - 2 (typ.)
1 - 7.2 (typ)
ANALOGMCU
General Purpose I/O - PTB[0…2]
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5.18 General Purpose I/O - PTB[0…2]
The three multipurpose I/O pins can be configured to operate as documented in the table below.
The alternate function of PTB2, PTB1 and PTB0 can be configured by selecting the function in the corresponding module (e.g.
TIMER). The selection with the highest priority will take effect when more than one function is selected.
5.18.1 Digital I/O Functionality
All three pins act as standard digital Inputs / Outputs with selectable pull-up resistor.
5.18.2 Alternative SCI / LIN Functionality
For alternative serial configuration and for debug and certification purpose, PTB0 and PTB1 can be configured to connect to the
internal LIN and / or SCI signals (RxD and TxD). Figure 32 shows the 4 available configurations.
Figure 32. Alternativ e SCI / LIN Functiona lity
5.18.3 Alternative PWM Functionality
As an alternative routing for the PWM channel (0 or 1) output, the PortB 2 (PTB2) can be configured to output one of the two
PWM channels defined in the Section 5.14, “PWM Control Module (PWM8B2C)". The selection and output enable can be
configured in the Port B Configuration Register 2 (PTBC2).
Table 154. Gene ral purpose I/O - Operating modes
Priority Function PTB2 PTB1 PTB0 Chp/Pg
1 (H) 2.5 V Analog Input AD2 AD1 AD0 5.20/133
2 Timer Input Capture / Output Compare TIMCH2 TIMCH1 TIMCH0 5.19/120
3 LIN / SCI - Rx / Tx (PTB0…1) or PWM (PTB2) PWM Tx Rx 5.15/100
4 (L) 5.0 V Input Output PTB2 PTB1 PTB0 current
ANALOGMCU
Serial
Communication
Interface (SCI)
LIN Physical
Layer Interface
4 Channel Timer
Module
PTB0/AD0/TIM0CH0/Rx
PTB1/AD1/TIM0CH1/Tx
PTB2/AD2/TIM0CH2/PWM
LIN
TIM0CH3
Rx
Tx
Rx
Tx
Serial
Communication
Interface (SCI)
LIN Physical
Layer Interface
4 Channel Timer
Module
PTB0/AD0/TIM0CH0/Rx
PTB1/AD1/TIM0CH1/Tx
PTB2/AD2/TIM0CH2/PWM
LIN
TIM0CH3
Rx
Tx
Rx
Tx
Serial
Communication
Interface (SCI)
LIN Physical
Layer Interface
4 Channel Timer
Module
PTB0/AD0/TIM0CH0/Rx
PTB1/AD1/TIM0CH1/Tx
PTB2/AD2/TIM0CH2/PWM
LIN
TIM0CH3
Rx
Tx
Rx
Tx
Serial
Communication
Interface (SCI)
LIN Physical
Layer Interface
4 Channel Timer
Module
PTB0/AD0/TIM0CH0/Rx
PTB1/AD1/TIM0CH1/Tx
PTB2/AD2/TIM0CH2/PWM
LIN
TIM0CH3
Rx
Tx
Rx
Tx
Mode 0 (default)
Mode 1 (external SCI)
Mode 2 (external LIN)
Mode 3 (observe)
General Purpose I/O - PTB[0…2]
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5.18.4 Regi st e r de f in ition
5.18.4.1 Port B Configuration Register 1 (PTBC1)
NOTE
The pull-up resistor is not active once the port is configured as an output.
5.18.4.2 Port B Configuration Register 2 (PTBC2)
Tab le 155. Port B Config uration Register 1 (PTBC1)
Offset(103) 0x20 Access: User read/write
76543210
R0
PUEB2 PUEB1 PUEB0 0DDRB2 DDRB1 DDRB0
W
Reset00000000
Note:
103. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 156. PTBC1 - Register Field Descriptions
Field Description
6-4
PUEB[2-0]
Pull-up Enable Port B[2…0]
0 - Pull-up disabled on PTBx pin.
1- Pull-up enabled on PTBx pin.
2-0
DDRB[2-0]
Data Direction Port B[2…0]
0 - PTBx configured as input.
1 - PTBx configured as output.
Table 157. Port B Configuration Register 2 (PTBC2)
Offset(104) 0x21 Access: User read/write
76543210
R0000
PWMCS PWMEN SERMOD
W
Reset00000000
Note:
104. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
General Purpose I/O - PTB[0…2]
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Freescale Semiconductor 119
5.18.4.3 Port B Data Register (PTB)
Ta ble 158. PTBC2 - Register Field Descriptions
Field Description
3
PWMCS
PWM Channel Select PTB2. See Section 5.14, “PWM Control Module (PWM8B2C)".
0 - PWM Channel 0 selected as PWM Channel for PTB2
1 - PWM Channel 1 selected as PWM Channel for PTB2
2
PWMEN
PWM Enable for PTB2. See Section 5.14, “PWM Control Module (PWM8B2C)".
0 - PWM disabled on PTB2
1 - PWM enabled on PTB2 (Channel as selected with PWMCS)
1-0
SERMOD
Serial Mode Select for PTB0 and PTB1. See Figure 32 for details.
00 - Mode 0, SCI internally connected the LIN Physical Layer Interface. PTB0 and PTB1 are Digital I/Os
01 - Mode 1, SCI connected to PTB0 and PTB1 (external SCI mode)
10 - Mode 2, LIN Physical Layer Interface connected to PTB0 and PTB1 (external LIN mode)
11 - Mode 3, SCI internally connected the LIN Physical Layer Interface and PTB0 and PTB1 are connected both as
outputs (Observe mode)
Table 159. Port B Data Register (PTB)
Offset(105) 0x22 Access: User read/write
76543210
R00000
PTB2 PTB1 PTB0
W
Reset00000000
Note:
105. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Tab le 160. PTB - Register Field Desc riptions
Field Description
2-0
PTB[2-0]
Port B general purpose input/output data — Data Register
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered
and synchronized pin input state is read.
Basic Timer Module - TIM (TIM16B4C)
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5.19 Basic Timer Module - TIM (TIM16B4C)
5.19.1 Introduction
5.19.1.1 Overview
The basic timer consists of a 16-bit, software-programmable counter driven by a seven-stage programmable prescaler.
This timer can be used for many purposes, including input waveform measurements while simultaneously generating an output
waveform. Pulse widths can vary from microseconds to many seconds.
This timer contains 4 complete input capture/output compare channels [IOC 3:2]. The input capture function is used to detect a
selected transition edge and record the time. The output compare function is used for generating output signals or for timer
software delays.
A full access for the counter registers or the input capture/output compare registers should take place in 16bit word access.
Accessing high byte and low byte separately for all of these registers may not yield the same result as accessing them in one
word.
5.19.1.2 Features
The TIM16B4C includes these distinctive features:
• Four input capture/output compare channels.
• Clock prescaler
• 16-bit counter
5.19.1.3 Modes of Opera tio n
The TIM16B4C is only active during Normal mode.
5.19.1.4 Block Diagram
Figure 33. Timer Block Diagram
For more information see the respective functional descriptions see Section 5.19.4, “Functional Description" of this chapter.
ANALOGMCU
Prescaler
16-bit Counter
IOC1
IOC0
IOC2
IOC3
Timer overflow
interrupt
Registers
D2D Clock
Input capture
Output compare
Input capture
Output compare
Input capture
Output compare
Input capture
Output compare
Channel 0
Channel 1
Channel 2
Channel 3
Timer channel 0
interrupt
Timer channel 3
interrupt
Basic Timer Module - TIM (TIM16B4C)
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5.19.2 Signal Description
5.19.2.1 Overview
The TIM16B4C module is internally connected to the PTB (IOC0, IOC1, IOC2) and to the Rx signal as specified in Section 5.18,
“General Purpose I/O - PTB[0…2]" (IOC3).
5.19.2.2 Detailed Signal Descriptions
5.19.2.2.1 IOC3 – Input Capture and Output Compare Channel 3
This pin serves as input capture or output compare for channel 3 and is internally connected to the Rx signal as specified in
Section 5.18.2, “Alternative SCI / LIN Functionality".
NOTE
Since the Rx signal is only available as an input, using the output compare feature for this
channel would have no effect.
5.19.2.2.2 IOC2 – Input Capture and Output Compare Channel 2
This pin serves as an input capture or output compare for channel 2 and can be routed to the PTB2 general purpose I/O.
5.19.2.2.3 IOC1 – Input Capture and Output Compare Channel 1
This pin serves as an input capture or output compare for channel 1 and can be routed to the PTB1 general purpose I/O.
5.19.2.2.4 IOC0 – Input Capture and Output Compare Channel 0
This pin serves as an input capture or output compare for channel 0 and can be routed to the PTB0 general purpose I/O.
NOTE
For the description of interrupts see Section 5.19.6, “Interrupts".
5.19.3 Memory Map and Registers
5.19.3.1 Overview
This section provides a detailed description of all memory and registers.
5.19.3.2 Module Memory Map
The memory map for the TIM16B4C module is given below in Table 161.
Tab le 161. Module Memory Map
Offset(106) Use Access
0xC0 Timer Input Capture/Output Compare Select (TIOS) Read/Write
0xC1 Timer Compare Force Register (CFORC) Read/Write(107)
0xC2 Output Compare 3 Mask Register (OC3M) Read/Write
0xC3 Output Compare 3 Data Register (OC3D) Read/Write
0xC4 Timer Count Register (TCNT(hi)) Read/Write(108)
0xC5 Timer Count Register (TCNT(lo)) Read/Write(107)
0xC6 Timer System Control Register 1 (TSCR1) Read/Write
0xC7 Timer Toggle Overflow Register (TTOV) Read/Write
0xC8 Timer Control Register 1 (TCTL1) Read/Write
0xC9 Timer Control Register 2 (TCTL2) Read/Write
0xCA Timer Interrupt Enable Register (TIE) Read/Write
0xCB Timer System Control Register 2 (TSCR2) Read/Write
0xCC Main Timer Interrupt Flag 1 (TFLG1) Read/Write
Basic Timer Module - TIM (TIM16B4C)
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5.19.3.3 Register Descrip tion s
This section consists of register descriptions in address order. Each description includes a standard register diagram with an
associated figure number. Details of register bit and field function follow the register diagrams, in bit order.
5.19.3.3.1 Timer Input Capture/Output Compare Select (TIOS)
5.19.3.3.2 Timer Compare Force Register (CFORC)
0xCD Main Timer Interrupt Flag 2 (TFLG2) Read/Write
0xCE Timer Input Capture/Output Compare Register 0 (TC0(hi)) Read/Write(108)
0xCF Timer Input Capture/Output Compare Register 0 (TC0(lo)) Read/Write(108)
0xD0 Timer Input Capture/Output Compare Register 1 (TC1(hi)) Read/Write(108)
0xD1 Timer Input Capture/Output Compare Register 1 (TC1(lo)) Read/Write(108)
0xD2 Timer Input Capture/Output Compare Register 2 (TC2(hi)) Read/Write(108)
0xD3 Timer Input Capture/Output Compare Register 2 (TC2(lo)) Read/Write(108)
0xD4 Timer Input Capture/Output Compare Register 3 (TC3(hi)) Read/Write(108)
Note:
106. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
107. Always read $00.
108. Write to these registers have no meaning or effect during input capture.
Table 162. Timer Input Capture/Output Compare Select (TIOS)
Offset(109) 0xC0 Access: User read/write
76543210
R0000
IOS3 IOS2 IOS1 IOS0
W
Reset00000000
Note:
109. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 163. TIOS - Register Field Descriptions
Field Description
3-0
IOS[3-0]
Input Capture or Output Compare Channel Configuration
0 - The corresponding channel acts as an input capture.
1 - The corresponding channel acts as an output compare.
Table 164. Timer Compare Force Register (CFORC)
Offset(110) 0xC1 Access: User read/write
76543210
R00000000
WFOC3 FOC2 FOC1 FOC0
Reset00000000
Note:
110. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Tab le 161. Module Memory Map
Offset(106) Use Access
Basic Timer Module - TIM (TIM16B4C)
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Freescale Semiconductor 123
A write to this register with the corresponding (FOC 3:0) data bit(s) set causes the action programmed for output compare on
channel “n” to occur immediately.The action taken is the same as if a successful comparison had just taken place with the TCn
register except the interrupt flag does not get set.
NOTE
A successful channel 3 output compare overrides any channel 2:0 compares. If forced
output compare on any channel occurs at the same time as the successful output compare
then forced output compare action will take precedence and interrupt flag will not get set.
5.19.3.3.3 Output Compare 3 Mask Register (OC3M)
Setting the OC3Mn (n ranges from 0 to 2) will set the corresponding port to be an output port when the corresponding TIOSn (n
ranges from 0 to 2) bit is set to be an output compare.
NOTE
A successful channel 3 output compare overrides any channel 2:0 compares. For each
OC3M bit that is set, the output compare action reflects the corresponding OC3D bit.
5.19.3.3.4 Output Compare 3 Data Register (OC3D)
Ta ble 165. CFORC - Register Field Descriptions
Field Description
3-0
FOC[3-0]
Force Output Compare Action for Channel 3-0
0 - Force Output Compare Action disabled. Input Capture or Output Compare Channel Configuration
1 - Force Output Compare Action enabled
Table 166. Output Compare 3 Mask Register (OC3M)
Offset(111) 0xC2 Access: User read/write
76543210
R0000
OC3M3 OC3M2 OC3M1 OC3M0
W
Reset00000000
Note:
111. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Tabl e 167. OC3M - Register Field Descriptions
Field Description
3-0
OC3M[3-0]
Output Compare 3 Mask "n" Channel bit
0 - Does not set the corresponding port to be an output port
1 - Sets the corresponding port to be an output port when this corresponding TIOS bit is set to be an output compare
Ta ble 168. Output Compare 3 Data Register (OC3D)
Offset(112) 0xC3 Access: User read/write
76543210
R 0 0 0 0 OC3D3 OC3D2 OC3D1 OC3D0
W
Reset00000000
Note:
112. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Basic Timer Module - TIM (TIM16B4C)
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Freescale Semiconductor 124
NOTE
A channel 3 output compare will cause bits in the output compare 3 data register to transfer
to the timer port data register if the corresponding output compare 3 mask register bits are
set.
5.19.3.3.5 Timer Count Register (TCNT)
NOTE
The 16-bit main timer is an up counter. A full access for the counter register should take
place in one clock cycle. A separate read/write for high byte and low byte will give a different
result than accessing them as a word. The period of the first count after a write to the TCNT
registers may be a different length because the write is not synchronized with the prescaler
clock.
5.19.3.3.6 Timer System Control Register 1 (TSCR1)
Ta ble 169. OC3D - Register Field Descriptions
Field Description
3-0
OC3D[3-0]
Output Compare 3 Data for Channel "n"
Table 170. Timer Count Register (TCNT)
Offset(113) 0xC4, 0xC5 Access: User read(anytime)/write (special mode)
15 14 13 12 11 10 9 8
Rtcnt15 tcnt14 tcnt13 tcnt12 tcnt11 tcnt10 tcnt9 tcnt8
W
Reset00000000
76543210
Rtcnt7 tcnt6 tcnt5 tcnt4 tcnt3 tcnt2 tcnt1 tcnt0
W
Reset00000000
Note:
113. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 171. TCNT - Register Field Descriptions
Field Description
15-0
tcnt[15-0]
16 Bit Timer Count Register
Table 172. Timer System Control Register 1 (TSCR1)
Offset(114) 0xC6 Access: User read/write
76543210
RTEN 00
TFFCA 0000
W
Reset00000000
Note:
114. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Basic Timer Module - TIM (TIM16B4C)
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5.19.3.3.7 Timer Toggle On Overflow Register 1 (TTOV)
NOTE
TOVn toggles output compare pin on overflow. This feature only takes effect when the
corresponding channel is configured for an output compare mode. When set, an overflow
toggle on the output compare pin takes precedence over forced output compare events.
5.19.3.3.8 Timer Control Register 1 (TCTL1)
Tab le 173. TSCR1 - Register Field Descriptions
Field Description
7
TEN
Timer Enable
1 = Enables the timer.
0 = Disables the timer. (Used for reducing power consumption).
4
TFFCA
Timer Fast Flag Clear All
1 = For TFLG1 register, a read from an input capture or a write to the output compare channel [TC 3:0] causes the
corresponding channel flag, CnF, to be cleared.For TFLG2 register, any access to the TCNT register clears the TOF
flag. Any access to the PACNT registers clears the PAOVF and PAIF bits in the PAFLG register. This has the
advantage of eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental
flag clearing due to unintended accesses.
0 = Allows the timer flag clearing.
Ta ble 174. Timer Toggle On Overflow Register 1 (TTOV)
Offset(115) 0xC7 Access: User read/write
76543210
R0000
TOV3 TOV2 TOV1 TOV0
W
Reset00000000
Note:
115. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Tabl e 175. TTOV - Register Field Descriptions
Field Description
3-0
TOV[3-0]
Toggle On Overflow Bits
1 = Toggle output compare pin on overflow feature enabled.
0 = Toggle output compare pin on overflow feature disabled.
Table 176. Timer Control Register 1 (TCTL1)
Offset(116) 0xC8 Access: User read/write
76543210
ROM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0
W
Reset00000000
Note:
116. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Basic Timer Module - TIM (TIM16B4C)
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Freescale Semiconductor 126
NOTE
These four pairs of control bits are encoded to specify the output action to be taken as a
result of a successful Output Compare on "n" channel. When either OMn or OLn, the pin
associated with the corresponding channel becomes an output tied to its IOC. To enable
output action by the OMn and OLn bits on a timer port, the corresponding bit in OC3M should
be cleared.
5.19.3.3.9 Timer Control Register 2 (TCTL2)
These four pairs of control bits configure the input capture edge detector circuits.
Table 177. TCTL1 - Register Field Descriptions
Field Description
7,5,3,1
OMn
Output Mode bit
6,4,2,0
OLn
Output Level bit
Table 178. Compare Result Output Action
OMn OLn Action
0 0 Timer disconnected from output pin logic
0 1 Toggle OCn output line
1 0 Clear OCn output line to zero
1 1 Set OCn output line to one
Table 179. Timer Control Register 2 (TCTL2)
Offset(117) 0xC9 Access: User read/write
76543210
REDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A
W
Reset00000000
Note:
117. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 180. TCTL2 - Register Field Descriptions
Field Description
EDGnB,EDGnA Input Capture Edge Control
Table 181. Edge Detector Circuit Configuration
EDGnB EDGnA Configuration
0 0 Capture disabled
0 1 Capture on rising edges only
1 0 Capture on falling edges only
1 1 Capture on any edge (rising or falling)
Basic Timer Module - TIM (TIM16B4C)
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Freescale Semiconductor 127
5.19.3.3.10 Timer Interrupt Enable Register (TIE)
5.19.3.3.11 Timer System Control Register 2 (TSCR2)
NOTE
This mode of operation is similar to an up-counting modulus counter.
If register TC3 = $0000 and TCRE = 1, the timer counter register (TCNT) will stay at $0000
continuously. If register TC3 = $FFFF and TCRE = 1, TOF will not be set when the timer
counter register (TCNT) is reset from $FFFF to $0000.
The newly selected prescale factor will not take effect until the next synchronized edge,
where all prescale counter stages equal zero.
Ta ble 182. Timer Interrupt Enable Register (TIE)
Offset(118) 0xCA Access: User read/write
76543210
R0000
C3I C2I C1I C0I
W
Reset00000000
Note:
118. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Tab le 183. TIE - Regist er Field Descriptions
Field Description
3-0
C[3-0]I
Input Capture/Output Compare Interrupt Enable.
1 = Enables corresponding Interrupt flag (CnF of TFLG1 register) to cause a hardware interrupt
0 = Disables corresponding Interrupt flag (CnF of TFLG1 register) from causing a hardware interrupt
Table 184. Timer System Control Register 2 (TSCR2)
Offset(119) 0xCB Access: User read/write
76543210
RTOI 000
TCRE PR2 PR1 PR0
W
Reset00000000
Note:
119. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Tab le 185. TIE - Regist er Field Descriptions
Field Description
7
TOI
Timer Overflow Interrupt Enable
1 = Hardware interrupt requested when TOF flag set in TFLG2 register.
0 = Hardware Interrupt request inhibited.
3
TCRE
TCRE — Timer Counter Reset Enable
1 = Enables Timer Counter reset by a successful output compare on channel 3
0 = Inhibits Timer Counter reset and counter continues to run.
3-0
PR[2:0]
Timer Prescaler Select
These three bits select the frequency of the timer prescaler clock derived from the Bus Clock as shown in Table 186.
Basic Timer Module - TIM (TIM16B4C)
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Freescale Semiconductor 128
5.19.3.3.12 Main Timer Interrupt Flag 1 (TFLG1)
NOTE
These flags are set when an input capture or output compare event occurs. Flag set on a
particular channel is cleared by writing a one to that corresponding CnF bit. Writing a zero
to CnF bit has no effect on its status. When TFFCA bit in TSCR register is set, a read from
an input capture or a write into an output compare channel will cause the corresponding
channel flag CnF to be cleared.
5.19.3.3.13 Main Timer Interrupt Flag 2 (TFLG2)
Table 186. Timer Clock Selection
PR2 PR1 PR0 Timer Clock
0 0 0 D2D Clock / 1
0 0 1 D2D Clock / 2
0 1 0 D2D Clock / 4
0 1 1 D2D Clock / 8
1 0 0 D2D Clock / 16
1 0 1 D2D Clock / 32
1 1 0 D2D Clock / 64
1 1 1 D2D Clock / 128
Table 187. Main Timer Interrupt Flag 1 (TFLG1)
Offset(120) 0xCC Access: User read/write
76543210
R0 0 0 0 C3FC2FC1FC0F
W
Reset00000000
Note:
120. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 188. TFLG1 - Register Field Descriptions
Field Description
3-0
C[3:0]F
Input Capture/Output Compare Channel Flag.
1 = Input Capture or Output Compare event occurred
0 = No event (Input Capture or Output Compare event) occurred.
Table 189. Main Timer Interrupt Flag 2 (TFLG2)
Offset(111) 0xCD Access: User read/write
76543210
RTOF 0000000
W
Reset00000000
Note:
121. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Basic Timer Module - TIM (TIM16B4C)
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Freescale Semiconductor 129
NOTE
The TFLG2 register indicates when an interrupt has occurred. Writing a one to the TOF bit
will clear it. Any access to TCNT will clear TOF bit of TFLG2 register if the TFFCA bit in
TSCR register is set.
5.19.3.3.14 Timer Input Capture/Output Compare Registers (TC3 - TC0)
Table 190. TFLG2 - Register Field Descriptions
Field Description
7
TOF
Timer Overflow Flag
1 = Indicates that an Interrupt has occurred (Set when 16-bit free-running timer counter overflows from $FFFF to
$0000)
0 = Flag indicates an Interrupt has not occurred.
Table 191. Timer Input Capture/Output Compare Register 0 (TC0)
Offset(122) 0xCE, 0xCF Access: User read(anytime)/write (123)
15 14 13 12 11 10 9 8
Rtc0_15 tc0_14 tc0_13 tc0_12 tc0_11 tc0_10 tc0_9 tc0_8
W
Reset00000000
76543210
Rtc0_7 tc0_6 tc0_5 tc0_4 tc0_3 tc0_2 tc0_1 tc0_0
W
Reset00000000
Note:
122. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
123. TRead anytime. Write anytime for output compare functions Writes to these registers have no effect during input capture.
Table 192. Timer Input Capture/Output Compare Register 1(TC1)
Offset(124) 0xD0, 0xD1 Access: User read(anytime)/write (125)
15 14 13 12 11 10 9 8
Rtc1_15 tc1_14 tc1_13 tc1_12 tc1_11 tc1_10 tc1_9 tc1_8
W
Reset00000000
76543210
Rtc1_7 tc1_6 tc1_5 tc1_4 tc1_3 tc1_2 tc1_1 tc1_0
W
Reset00000000
Note:
124. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
125. TRead anytime. Write anytime for output compare functions Writes to these registers have no effect during input capture.
Basic Timer Module - TIM (TIM16B4C)
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Freescale Semiconductor 130
NOTE
TRead anytime. Write anytime for output compare function. Writes to these registers have
no effect during input capture.
Depending on the TIOS bit for the corresponding channel, these registers are used to latch
the value of the free-running counter when a defined transition is sensed by the
corresponding input capture edge detector or to trigger an output action for output compare.
Read/Write access in byte mode for high byte should takes place before low byte otherwise
it will give a different result.
Table 193. Timer Input Capture/Output Compare Register 2(TC2)
Offset(126) 0xD2, 0xD3 Access: User read(anytime)/write (127)
15 14 13 12 11 10 9 8
Rtc2_15 tc2_14 tc2_13 tc2_12 tc2_11 tc2_10 tc2_9 tc2_8
W
Reset00000000
76543210
Rtc2_7 tc2_6 tc2_5 tc2_4 tc2_3 tc2_2 tc2_1 tc2_0
W
Reset00000000
Note:
126. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
127. TRead anytime. Write anytime for output compare functions Writes to these registers have no effect during input capture.
Table 194. Timer Input Capture/Output Compare Register 3(TC3)
Offset(128) 0xD4, 0xD5 Access: User read(anytime)/write (129)
15 14 13 12 11 10 9 8
Rtc3_15 tc3_14 tc3_13 tc3_12 tc3_11 tc3_10 tc3_9 tc3_8
W
Reset00000000
76543210
Rtc3_7 tc3_6 tc3_5 tc3_4 tc3_3 tc3_2 tc3_1 tc3_0
W
Reset00000000
Note:
128. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
129. TRead anytime. Write anytime for output compare functions Writes to these registers have no effect during input capture.
Table 195. TCn - Register Field Descrip tions
Field Description
15-0
tcn[15-0]
16 Timer Input Capture/Output Compare Registers
Basic Timer Module - TIM (TIM16B4C)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 131
5.19.4 Functional Description
5.19.4.1 General
This section provides a complete functional description of the timer TIM16B4C block. Refer to the detailed timer block diagram
in Figure 34 as necessary.
Figure 34. Detailed Timer Block Diagram
5.19.4.2 Prescaler
The prescaler divides the bus clock by 1, 2, 4, 8, 16, 32, 64, or 128. The prescaler select bits, PR[2:0], select the prescaler divisor.
PR[2:0] are in the timer system control register 2 (TSCR2).
5.19.4.3 Input Capture
Clearing the I/O (input/output) select bit, IOSn, configures channel n as an input capture channel. The input capture function
captures the time at which an external event occurs. When an active edge occurs on the pin of an input capture channel, the
timer transfers the value in the timer counter into the timer channel registers, TCn.
The minimum pulse width for the input capture input is greater than two bus clocks.
An input capture on channel n sets the CnF flag. The CnI bit enables the CnF flag to generate interrupt requests.
PRESCALER
CHANNEL 0
IOC0 PIN
16-BIT COUNTER
LOGIC
PR[2:1:0]
TC0
16-BIT COMPARATOR
TCNT(hi):TCNT(lo)
INTERRUPT
LOGIC
TOF
TOI
C0F
EDGE
DETECT
CxF
CHANNEL3
TC3
16-BIT COMPARATOR C3F
IOC3 PIN
LOGIC
EDGE
DETECT
OM:OL0
TOV0
OM:OL3
TOV3
EDG3A
EDG3B
EDG0B
TCRE
CLEAR COUNTER
CxI
CH.3 COMPARE
CH.3 CAPTURE
IOC0 PIN
IOC3 PIN
TE
CH. 0 COMPARE
CH. 0 CAPTURE
PA INPUT
EDG0A
channel 3 output
compare
IOC0
IOC3
D2D Clock
TOF
C0F
C3F
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 132
5.19.4.4 Output Compare
Setting the I/O select bit, IOSn, configures channel n as an output compare channel. The output compare function can generate
a periodic pulse with a programmable polarity, duration, and frequency. When the timer counter reaches the value in the channel
registers of an output compare channel, the timer can set, clear, or toggle the channel pin. An output compare on channel n sets
the CnF flag. The CnI bit enables the CnF flag to generate interrupt requests.
The output mode and level bits, OMn and OLn, select set, clear, toggle on output compare. Clearing both OMn and OLn
disconnects the pin from the output logic.
Setting a force output compare bit, FOCn, causes an output compare on channel n. A forced output compare does not set the
channel flag.
A successful output compare on channel 3 overrides output compares on all other output compare channels. The output compare
3 mask register masks the bits in the output compare 3 data register. The timer counter reset enable bit, TCRE, enables channel
3 output compares to reset the timer counter. A channel 3 output compare can reset the timer counter even if the IOC3 pin is
being used as the pulse accumulator input.
Writing to the timer port bit of an output compare pin does not affect the pin state. The value written is stored in an internal latch.
When the pin becomes available for general-purpose output, the last value written to the bit appears at the pin.
5.19.5 Resets
5.19.5.1 General
The reset state of each individual bit is listed within the Register Description section 5.19.3, “Memory Map and Registers“, which
details the registers and their bit-fields.
5.19.6 Interrupts
5.19.6.1 General
This section describes interrupts originated by the TIM16B4C block. Table 196 lists the interrupts generated by the TIM16B4C to
communicate with the MCU.
5.19.6.2 Description of Interrupt Operation
The TIM16B4C uses a total of 5 interrupt vectors. The interrupt vector offsets and interrupt numbers are chip dependent. More
information on interrupt vector offsets and interrupt numbers can be found in the Section 5.7, “Interrupts"
5.19.6.2.1 Channel [3:0] Interrupt
These active high outputs are asserted by the module to request a timer channel 3–0 interrupt, following an input capture or
output compare event on these channels [3-0]. For the interrupt to be asserted on a specific channel, the enable, CnI bit of TIE
register should be set. These interrupts are serviced by the system controller.
5.19.6.2.2 Timer Overflow Interrupt (TOF)
This active high output will be asserted by the module to request a timer overflow interrupt, following the timer counter overflow
when the overflow enable bit (TOI) bit of TFLG2 register is set. This interrupt is serviced by the system controller.
Table 196. TIM16B4C Interrupts
Interrupt Offset Vector Priority Source Description
C[3:0]F - - - Timer Channel 3-0 Active high timer channel interrupts 3-0
TOF - - - Timer Overflow Timer Overflow interrupt
Analog Digital Conve rter - ADC
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 133
5.20 Analog Digital Converter - ADC
5.20.1 Introduction
5.20.1.1 Overview
In order to sample the MM912_634 analog die analog sources, a 10-bit resolution successive approximation Analog to Digital
Converter has been implemented. Controlled by the A/D Control Logic (ADC Wrapper), the Analog Digital Converter allows fast
and high precision conversions.
Figure 35. Analog Digital Converter Block Diagram
5.20.1.2 Features
• 10-bit resolution
• 13 µs (typ.), 10-bit Single Sample + Conversion Time
• External ADC2p5 pin with over-current protection to filter the analog reference voltage
• Total Error (TE) of ± 5 LSB without offset calibration active
• Integrated selectable offset compensation
• 14 + 1 analog channels (AD0…8; ISENSE, TSENSE and VSENSE, VS1SENSE, BANDGAP, plus calibration channel)
• Sequence- and Continuous Conversion Mode with IRQ for Sequence Complete indication
• Dedicated Result register for each channel
5.20.2 Mode s of Op era tio n
The Analog Digital Converter Module is active only in normal mode; it is disabled in Sleep and Stop mode.
5.20.3 External Signal Description
This section lists and describes the signals that do connect off-chip. Table 197 shows all the pins and their functions that are
controlled by the Analog Digital Converter Module.
ANALOGMCU
A
D
A/D Control Logic
(ADC Wrapper)
D2DCLK
Analog Multiplexer
STARTCONV,
CLKA2D,
SAMPLEA2D_N
Data
Registers
DATAA2D
AD_REF
(ADC2p5,
AGND)
Analog Digital Conve rter - ADC
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 134
5.20.4 Memory Map and Register Definition
5.20.4.1 Module Memory Map
Table 198 shows the register map of the Analog Digital Converter Module. All Register addresses given are referenced to the
D2D interface offset.
Ta ble 197. ADC - Pin Functions and Priorities
Pin Name Pin Function &
Priority I/O Description Pin Function
after Reset
AGND Analog Ground - Analog Ground Connection -
ADC2p5 Analog Regulator - Analog Digital Converter Regulator Filter Terminal. A capacitor CADC2p5 is
required for operation. -
Table 198. Analog D igital Converter Module - Memory Map
Register /
Offset(130) Bit 7 654321Bit 0
0x80
ACR
RSCIE CCE OCE ADCRST 0PS2 PS1 PS0
W
0x81
ASR
RSCF 2p5CLF 00 CCNT3 CCNT2 CCNT1 CCNT0
W
0x82
ACCR (hi)
RCH15 CH14 0CH12 CH11 CH10 CH9 CH8
W
0x83
ACCR (lo)
RCH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0
W
0x84
ACCSR (hi)
RCC15 CC14 0CC12CC11 CC10 CC9 CC8
W
0x85
ACCSR (lo)
R CC7 CC6 CC5 CC4 CC3 CC2 CC1 CC0
W
0x86
ADR0 (hi)
RADR0[9:2]
W
0x87
ADR0 (lo)
RADR0[1:0]
W
0x88
ADR1 (hi)
RADR1[9:2]
W
0x89
ADR1 (lo)
RADR1[1:0]
W
0x8A
ADR2 (hi)
RADR2[9:2]
W
0x8B
ADR2 (lo)
RADR2[1:0]
W
0x8C
ADR3 (hi)
RADR3[9:2]
W
0x8D
ADR3 (lo)
RADR3[1:0]
W
0x8E
ADR4 (hi)
RADR4[9:2]
W
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 135
0x8F
ADR4 (lo)
RADR4[1:0]
W
0x90
ADR5 (hi)
RADR5[9:2]
W
0x91
ADR5 (lo)
RADR5[1:0]
W
0x92
ADR6 (hi)
RADR6[9:2]
W
0x93
ADR6 (lo)
RADR6[1:0]
W
0x94
ADR7 (hi)
RADR7[9:2]
W
0x95
ADR7 (lo)
RADR7[1:0]
W
0x96
ADR8 (hi)
RADR8[9:2]
W
0x97
ADR8 (lo)
RADR8[1:0]
W
0x98
ADR9 (hi)
RADR9[9:2]
W
0x99
ADR9 (lo)
RADR9[1:0]
W
0x9A
ADR10 (hi)
RADR10[9:2]
W
0x9B
ADR10 (lo)
RADR10[1:0]
W
0x9C
ADR11 (hi)
RADR11[9:2]
W
0x9D
ADR11 (lo)
RADR11[1:0]
W
0x9E
ADR12 (hi)
RADR12[9:2]
W
0x9F
ADR12 (lo)
RADR12[1:0]
W
0xA0
Reserved
R
W
0xA1
Reserved
R
W
0xA2
ADR14 (hi)
RADR14[9:2]
W
0xA3
ADR14 (lo)
RADR14[1:0]
W
Table 198. Analog D igital Converter Module - Memory Map
Register /
Offset(130) Bit 7 654321Bit 0
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 136
5.20.4.2 Register Definit io n
5.20.4.2.1 ADC Config Register (ACR)
0xA4
ADR15 (hi)
RADR15[9:2]
W
0xA5
ADR15 (lo)
RADR15[1:0]
W
Note:
130. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 199. ADC Config Register (ACR)
Offset(131) 0x80 Access: User read/write
76543210
RSCIE CCE OCE ADCRST 0PS2 PS1 PS0
W
Reset00000000
Note:
131. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 200. ACR - Register Field Descriptions
Field Description
7 - SCIE
Sequence Complete Interrupt Enable
0 - Sequence Complete Interrupt Disabled
1 - Sequence Complete Interrupt Enabled
6 - CCE
Continuous Conversion Enable
0 - Continuous Conversion Disabled
1 - Continuous Conversion Enabled
5 - OCE
Offset Compensation Enable
0 - Offset Compensation Disabled
1 - Offset Compensation Enabled. This feature requires the CH15 bit in the ADC Conversion Control Register (ACCR)
to be set for all conversions
4 - ADCRST
Analog Digital Converter RESET
0 - Analog Digital Converter in Normal Operation
1 - Analog Digital Converter in Reset Mode. All ADC registers will reset to initial values. The bit has to be cleared to allow
ADC operation
2-0
PS2…0
ADC Clock Prescaler Select (D2DCLK to ADCCLK divider)
000 - 10
001 - 8
010 - 6
011 - 4
100 - 2
101 - 1
110 - 1
111 - 1
Table 198. Analog D igital Converter Module - Memory Map
Register /
Offset(130) Bit 7 654321Bit 0
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 137
NOTE
ADCRST is strongly recommended to be set during D2D clock frequency changes.
5.20.4.2.2 ADC Status Register (ASR)
5.20.4.2.3 ADC Conversion Control Register (ACCR)
Table 201. ADC Status Register (ASR)
Offset(132) 0x81 Access: User read/write
76543210
RSCF 2p5CLF 00 CCNT3 CCNT2 CCNT1 CCNT0
W
Reset00001111
Note:
132. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 202. ACR - Register Field Descriptions
Field Description
7 - SCF Sequence Complete Flag. Reading the ADC Status Register (ASR) will clear the Flag.
6 - 2p5CLF ADC Reference Voltage Current Limitation Flag
3-0
CCNT3…0
Conversion Counter Status. The content of CCNT reflects the current channel in conversion and the conversion of CCNT-1
being complete. The conversion order is CH15, CH0, CH1,..., CH14.
Ta ble 203. ADC Conversion Control Register (ACCR)
Offset(133) 0x82 (0x82 and 0x83 for 8-Bit access) Access: User read/write
1514131211109876543210
RCH15 CH14 0CH12 CH11 CH10 CH9 CH8 CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0
W
Reset0000000000000000
Note:
133. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 204. ACCR - Register Field Descriptions
Field Description
15-0
CHx
Channel Select - If 1, the selected channel is included into the sequence. Writing ACCR will stop the current sequence and
restart. Writing ACCR=0 will stop the conversion, All CCx flags will be cleared when ACCR is written.Conversion will start
after write. 16-Bit write operation recommended, writing 8-bit: Only writing the High Byte will start the conversion with
Channel 15, if selected. Write to the Low Byte will not start a conversion.
Measure individual Channels by writing a sequence of one channel. Channel 15 needs to be selected in order to have the
offset compensation functional.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 138
5.20.4.2.4 ADC Conversion Complete Status Register (ACCSR)
5.20.4.2.5 ADC Data Result Register x (ADRx)
5.20.5 Functional Description
5.20.5.1 Analog Channel Definitions
The following analog Channels are routed to the analog multiplexer:
Table 205. ADC Conversion Complete Status Register (ACCSR)
Offset(134) 0x84 (0x84 and 0x85 for 8-Bit access) Access: User read
1514131211109876543210
RCC15 CC14 0CC12CC11 CC10 CC9 CC8 CC7 CC6 CC5 CC4 CC3 CC2 CC1 CC0
W
Reset0000000000000000
Note:
134. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Ta ble 206. ACCSR - Register Field Descriptions
Field Description
15-0 CCx Conversion Complete Flag - Indicates the conversion being complete for channel x. Read operation only.16-bit read
recommended. 8-Bit read will return the current status, no latching will be performed.
Ta ble 207. ADC Data Result Register x (ADRx)
Offset(135) 0x86+x (0x86 and 0x87 for 8-Bit access) Access: User read
1514131211109876543210
RADRx 0 0 0000
W
Reset0000000000000000
Note:
135. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 208. ADRx - Register Field Descriptions
Field Description
15-6
ADRx
ADC - Channel X left adjusted Result Register. Reading the register will clear the corresponding CCx register in the ACCSR
register. 16-bit read recommended. 8-Bit read: Reading the low byte will latch the high byte for the next read, reading the
high byte will clear the cc flag.
Tabl e 209. Analog Channels
Channel Description
0 AD0 - PTB0 Analog Input AD0
1 AD1 - PTB1 Analog Input AD1
2 AD2 - PTB2 Analog Input AD2
3 AD3 - L0 Analog Input AD3
4 AD4 - L1 Analog Input AD4
5 AD5 - L2 Analog Input AD5
6 AD6 - L3 Analog Input AD6
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 139
5.20.5.2 Automatic Offset Compensation
To eliminate the Analog Digital Converter Offset, an automatic compensation is implemented. The compensation is based on a
calibrated voltage reference connected to ADC Channel 15. The reference trim is accomplished by the correct CTRx Register
content. See Section 5.26, “MM912_634 - Analog Die Trimming". The reference is factory trimmed to 8 LSB.
To activate the Offset compensation feature, the OCE bit in the ADC Config Register (ACR) has to be set, and the CH15 has to
be enabled when starting a new conversion, by writing to the ADC Conversion Control Register (ACCR). The compensation will
work with single and sequence conversion.
Figure 36. Automatic Offset Compensation
7 AD7 - L4 Analog Input AD7
8 AD8 - L5 Analog Input AD8
9 Current Sense ISENSE
10 Voltage Sense VSENSE
11 Temperature Sense TSENSE
12 VS1 Sense VS1SENSE
13 not implemented n.i.
14 Bandgap(136) BANDGAP
15 Calibration Reference CAL
Note:
136. Internal “bg1p25sleep” reference.
Tabl e 209. Analog Channels
Channel Description
MCU – IFR (0x0_40C0..0x0_40C3) => CTR0..3
OCE – Offset Compensation Enable = 1
ACCR – ADC Conversion Control Register CH15=1 + CHx = 1
Read ADRx after SCF is set
internal
Sample CH15
Offset is calculated as
difference between
result and 8 LSB
Sample CHx
Adjust CHx Result by
CH15 is a trimmed
calculated offset
reference of 8 LSB
(requires CTRx)
All x
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 140
5.20.5.3 Conversion Timing
The conversion timing is based on the ADCCLK generated by the ADC prescaler (PS) out of the D2DCLK signal. The prescaler
needs to be configured to have the ADCCLK match the specified fADC clock limits.
A conversion is divided into the following 27+ clock cycles:
• 9 cycle sampling time
• 18 cycle remaining conversion time
• A worst case (only channel 14) of 15 clock cycles to count up to the selected channel (15, 0, 1,....14)
• 4 cycles between two channels
Example 1. Single Conversion Channel 10 (VSENSE)
12c (count up to Ch10) + 9c (sample) + 18c (conversion) = 39 cycles from start to end of conversion.
Example 2. Sequence of Channel 10 (VSENSE) + Channel 15 (Offset Compensation)
1c (count) + 9c (sample Ch15) + 18c (conversion Ch15) + 4c (in between) + 0c (count further to Ch10 is performed while
converting ch15) + 9c (sample) + 18c (conversion) = 59 cycles from start to end of both conversions.
Current Sense Module - ISENSE
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 141
5.21 Current Sense Module - ISENSE
The Current Sense Module is implemented to amplify the voltage drop across an external shunt resistor to
measure the actual application current using the internal Analog Digital Converter Channel 9. Typical application
is the motor current in a window lift control module
.
Figure 37. Current Sense Module with External Filter Option
The implementation is based on a switched capacitor solution to eliminate unwanted offset.To fit several application scenarios,
eight different GAIN setting are implemented.
5.21.1 Regist e r De fin it io n
5.21.1.1 Current Sense Regi st er (CSR)
Table 210. Current Sense Registe r (CSR)
Offset(137) 0x3C Access: User read/write
76543210
RCSE 000
CCD CSGS
W
Reset00000000
Note:
137. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
ANALOGMCU
in
Q
C
Imot
P1
P1
P2
filt
C
filt
R
Vin
Vout ADC
shunt
R
filt
R
in
Q
C
G
2
C
G
2
Vin
ISENSEHISENSEL
in
Q
C
Imot
P1
P1
P2
filt
C
filt
R
Vin
Vout ADC
shunt
R
filt
R
in
Q
C
G
2
C
G
2
Vin
ISENSEHISENSEL
Current Sense Module - ISENSE
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 142
Table 21 1. CSR - Register Field Descriptions
Field Description
7
CSE
Current Sense Enable Bit
0 - Current Sense Module Disabled
1 - Current Sense Module Enabled
3
CCD
Input Filter Charge Compensation Disable Bit(138)
0 - Enabled
1 - Disabled
2-0
CSGS
Current Sense Gain Select - Selects the amplification GAIN for the current sense module
000 - 7 (typ.)
001 - 9 (typ.)
010 - 10 (typ.)
011 - 12 (typ.)
100 - 14 (typ.)
101 - 18 (typ.)
110 - 24 (typ.)
111 - 36 (typ.)
Note:
138. This feature should be used when implementing an external filter to the current sense ISENSEx inputs. In principal an internal charge
compensation is activated in synch with the conversion to avoid the sample capacitors to be discharged by the external filter.
Te mperature Sensor - TSENSE
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 143
5.22 Temperature Sensor - TSENSE
To be able to measure the current MM912_634 analog die chip temperature, the TSENSE feature is implemented.
A constant temperature related gain of TSG can be routed to the internal Analog Digital Converter (Channel 11).
Figure 38. TSENSE - Graph
Refer to the Section 5.20, “Analog Digital Converter - ADC" for details on the channel selection and analog measurement.
NOTE
Due to internal capacitor charging, temperature measurements are valid 200 ms (max) after
system power up and wake-up.
ANALOGMCU
2.5
2.0
1.5
1.0
0.5
V
-50°C 0°C 50°C 100°C 150°C
T
1,984V
150°C
Typ.
0,15V
-50°C
Typ.
Supply Voltage Sense - VSENSE
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 144
5.23 Supply Vo ltage Sense - VSENSE
The reverse battery protected VSENSE pin has been implemented to allow a direct measurement of the Battery
level voltage. Bypassing the device VSUP capacitor and external reverse battery diode will detect under-voltage
conditions without delay. A series resistor is required to protect the MM912_634 analog die from fast transients.
Figure 39. VSENSE Module
The voltage present on the VSENSE pin can be routed via an internal divider to the internal Analog Digital Converter or issue an
interrupt (LBI) to alert the MCU.
For the interrupt based alert, see Section 5.5, “Power Supply". For VSENSE measurement using the internal ADC see
Section 5.20, “Analog Digital Converter - ADC".
5.24 Internal Supply Voltage Sense - VS1SENSE
In addition to the VSENSE module, the internal VS1 supply can be routed to the analog digital converter as well. See
Section 5.20, “Analog Digital Converter - ADC" for details on the acquisition.
Figure 40. VS1Sense Module
5.25 Internal Bandgap Reference Voltage Sense - BANDGAP
The internal reference bandgap voltage “bg1p25sleep” is generated fully independent from the Analog Digital Converter
reference voltages.
Measuring(139) the “bg1p25sleep” reference through the ADC-CH14 allows should return a conversion result within
ADCH14 under normal conditions. Any result outside the range would indicate faulty behavior of either the ADC chain
or the 2p5sleep Bandgap circuity.
Note:
139. The maximum allowed sample frequency for Channel 14 is limited to fCH14. Increasing the sample frequency above can result in
unwanted turn off of the LS drivers due to a false VREG over-voltage.
ANALOGMCU
VS1
VSENSE
VS2
Prescaler
RATIOVSENSE
MUX
CH11
ADC
RVSENSE
LBI
VS1
VSENSE
VS2
MUX
ADC
RVSENSE
LVI
Prescaler
RATIOVS1
CH12
ANALOGMCU
ANALOGMCU
MM912_634 - Analog Die Trimming
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 145
5.26 MM912_634 - Analog Die Trimming
A trimming option is implemented to increase some device parameter accuracy. As the MM912_634 analog die is
exclusively combined with a FLASH- MCU, the required trimming values can be calculated during the final test of
the device, and stored to a fixed position in the FLASH memory. During start-up of the system, the trimming values
have to be copied into the MM912_634 analog die trimming registers.
The trimming registers will maintain their content during Low Power mode, Reset will set the default value.
5.26.1 Memory Map and Register Definition
5.26.1.1 Module Memory Map
There are four trimming registers implemented (CTR0…CTR3), with CTR2 being reserved for future use. The following table
shows the registers used.
At system startup, the trimming information have to be copied from the MCU IFR Flash location to the corresponding MM912_634
analog die trimming registers. The following table shows the register correlation.
NOTE
Two word (16-Bit) transfers including CTR2 are recommended at system startup. The IFR
register has to be enabled for reading (Program Page Index Register (PPAGE))
NOTE
To trim the bg1p25sleep there is two steps:
Step 1: First choose the right trim step by adjusting SLPBGTR[2:0] with SLPBGTRE=1,
SLPBG_LOCK bit has to stay at 0.
Step 2: Once the trim value is known, correct SLPBGTR[2:0], SLPBGTRE and
SLPBG_LOCK bits have to be set at the same time to apply and lock the trim. Once the trim
is locked, no other trim on the parameter is possible.
Table 212. MM912_634 Analog Die Trimming Registers
Offset Name 7 6 5 4 3 2 1 0
0xF0 CTR0 R LINTRE LINTR WDCTRE CTR0_4 CTR0_3 WDCTR2 WDCTR1 WDCTR0
Trimming Reg 0 W
0xF1 CTR1 R BGTRE CTR1_6 BGTRIMU
P
BGTRIMD
NIREFTRE IREFTR2 IREFTR1 IREFTR0
Trimming Reg 1 W
0xF2 CTR2 R 0 0 0 SLPBGTR
E
SLPBG_LOC
K
SLPBGTR
2
SLPBGTR
1
SLPBGTR
0
Trimming Reg 2 W
0xF3 CTR3 R OFFCTR
E
OFFCTR
2OFFCTR1 OFFCTR0 CTR3_E CTR3_2 CTR3_1 CTR3_0
Trimming Reg 3 W
Note:
140. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 213. MM912_634 - MCU vs. Analog Die Trimming Register Correlation
Name MCU IFR Address Analog Offset(141)
CTR0 0x0_40C0 0xF0
CTR1 0x0_40C1 0xF1
CTR2 0x0_40C2 0xF2
CTR3 0x0_40C3 0xF3
Note:
141. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
ANALOGMCU
MM912_634 - Analog Die Trimming
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Freescale Semiconductor 146
5.26.1.2 Register Descrip tion s
5.26.1.2.1 Trimming Register 0 (CTR0)
5.26.1.2.2 Trimming Register 1 (CTR1)
Table 214. Trimming Register 0 (CTR0)
Offset(142) 0xF0 Access: User read/write
76543210
RLINTRE LINTR WDCTRE CTR0_4 CTR0_3 WDCTR2 WDCTR1 WDCTR0
W
Reset00000000
Note:
142. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
Table 215. CTR0 - Register Field Descriptions
Field Description
7
LINTRE
LIN trim enable
0 - no trim can be done
1- trim can be done by setting LINTR bit
6
LINTR
LIN trim bit
0 - default slope
1 - adjust the slope
5
WDCTRE
Watchdog trim enable
0 - no trim can be done
1 - trim can be done by setting WDCTR[2:0] bits
4
CTR0_4
Spare Trim bit 4
3
CTR0_3
Spare Trim bit 3
2-0
WDCTR2…0
Watchdog clock trim (Trim effect to the 100 kHz Watch dog base clock)
000: 0%
001: +5%
010: +10%
011: +15%
100: -20%
101: -15%
110: -10%
111: -5%
Table 216. Trimming Register 1 (CTR1)
Offset(143) 0xF1 Access: User read/write
76543210
RBGTRE CTR1_6 BGTRIMUP BGTRIMDN IREFTRE IREFTR2 IREFTR1 IREFTR0
W
Reset00000000
Note:
143. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
MM912_634 - Analog Die Trimming
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5.26.1.2.3 Trimming Register 2 (CTR2)
Table 217. CTR1 - Register Field Descriptions
Field Description
7
BGTRE
Bandgap trim enable
0 - no trim can be done
1 - trim can be done by setting BGTRIMUP and BGTRIMDN bits
6
CTR1_6
Spare Trim Bit
5
BGTRIMUP
Bandgap trim up bit
0 - default slope
1 - increase bandgap slope
4
BGTRIMDN
Bandgap trim down bit
0 - default slope
1 - decrease bandgap slope
3
IREFTRE
Iref trim enable bit
0 - no trim can be done
1 - trim can be done by setting IREFTR[2:0] bits
2-0
IREFTR2…0
Iref trim - This trim is used to adjust the internal zero TC current reference
000: 0%
001: +7.6%
010: +16.43%
011: +26.83%
100: -8.54%
101: -15.75%
110: -21.79%
111: 0%
Table 218. Trimming Register 2 (CTR2)
Offset(144) 0xF2 Access: User read/write
7654 3 210
R0 0 0
SLPBGTRE SLPBG_LOCK SLPBGTR2 SLPBGTR1 SLPBGTR0
W
Reset000 0 0 000
Note:
144. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
MM912_634 - Analog Die Trimming
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Freescale Semiconductor 148
5.26.1.2.4 Trimming Register 3 (CTR3)
Table 219. CTR2 - Register Field Descriptions
Field Description
4
SLPBGTRE
Sleep Bandgap trim enable
0 no trim can be done
1 trim lock can be done by setting SLPBGTR[2:0] bits and SLPBG_LOCK bit
3
SLPBG_LOCK
bg1p25sleep trim lock bit
2-0
SLPBGTR2…0
bg1p25sleep trim - This trim is used to adjust the internal sleep mode 1.25 V bandgap used as a reference for the VDD and
VDDx over-voltage detection.
000: -12.2% (default)
001: -8.2%
010: -4.2%
011: 0%
100: +4.2%
101: +8.3%
110: +12.5%
111: -12.2% (default)
Table 220. Trimming Register 3 (CTR3)
Offset(145) 0xF3 Access: User read/write
76543210
ROFFCTRE OFFCTR2 OFFCTR1 OFFCTR0 CTR3_E CTR3_2 CTR3_1 CTR3_0
W
Reset00000000
Note:
145. Offset related to 0x0200 for blocking access and 0x300 for non blocking access within the global address space.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 149
Table 221. CTR3 - Register Field Descriptions
Field Description
7
OFFCTRE
ADC offset compensation voltage trim enable bit
0 - no trim can be done
1 - trim can be done by setting OFFCTR[2:0] bits
6-4
OFFCTR2…0
ADCOFFC trim - This trim is used to adjust the internal ADC offset compensation voltage
000: 0%
001: +7.98%
010: +15.97%
011: +23.95%
100: -23.95%
101: -15.97%
110: -7.98%
111: 0%
3
CTR3_E
Spare Trim enable bit
2
CTR3_2
Spare Trim bit 2
1
CTR3_1
Spare Trim bit 1
0
CTR3_0
Spare Trim bit 0
MM912_634 - MCU Die Overview
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Freescale Semiconductor 150
5.27 MM912_634 - MCU Die Overview
5.27.1 Introduction
The MC9S12I64 micro controller implemented in the MM912_634 is designed as counter part to an analog die,
and is not being offered as a standalone MCU.
The MC9S12I64 device contains a S12 Central Processing Unit (CPU), offers 64kB of Flash memory and 6.0 kB of system
SRAM, up to eight general purpose I/Os, an on-chip oscillator and clock multiplier, one Serial Peripheral Interface (SPI), an
interrupt module and debug capabilities via the on-chip debug module (DBG) in combination with the Background Debug Mode
(BDM) interface. Additionally there is a die-to-die initiator (D2DI) which represents the communication interface to the companion
(analog) die.
5.27.2 Features
This section describes the key features of the MC9S12I64 micro controller unit.
5.27.2.1 Chip-Level Features
On-chip modules available within the family include the following features:
• S12 CPU core (CPU12_V1)
• Kbyte on-chip flash with ECC
• 4.0 kbyte on-chip data flash with ECC
• 6.0 kbyte on-chip SRAM
• Phase locked loop (IPLL) frequency multiplier with internal filter
• 4–16 MHz amplitude controlled Pierce oscillator
• 1.0 MHz internal RC oscillator
• One serial peripheral interface (SPI) module
• On-chip voltage regulator (VREG) for regulation of input supply and all internal voltages
• Die to Die Initiator (D2DI)
5.27.3 Module Features
The following sections provide more details of the modules implemented on the MC9S12I64.
5.27.3.1 S12 16-Bit Central Processor Unit (CPU)
S12 CPU is a high-speed 16-bit processing unit:
• Full 16-bit data paths supports efficient arithmetic operation and high-speed math execution
• Includes many single-byte instructions. This allows much more efficient use of ROM space.
• Extensive set of indexed addressing capabilities, including:
— Using the stack pointer as an indexing register in all indexed operations
— Using the program counter as an indexing register in all but auto increment/decrement mode
— Accumulator offsets using A, B, or D accumulators
— Automatic index pre-decrement, pre-increment, post-decrement, and post-increment (by –8 to +8)
ANALOGMCU
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5.27.3.2 On-Chip Flash with ECC
On-chip flash memory on the MC9S12I64 features the following:
• kbyte of program flash memory
— 32 data bits plus 7 syndrome ECC (Error Correction Code) bits allow single bit error correction and double fault
detection
— Erase sector size 512 bytes
— Automated program and erase algorithm
— User margin level setting for reads
— Protection scheme to prevent accidental program or erase
• 4.0 kbyte data flash memory
— 16 data bits plus 6 syndrome ECC (Error Correction Code) bits allow single bit error correction and double-bit error
detection
— Erase sector size 256 bytes
— Automated program and erase algorithm
— User margin level setting for reads
5.27.3.3 On-Chip SRAM
6.0 kBytes of general-purpose RAM
5.27.3.4 Main External Oscillator (XOSC)
Loop controlled Pierce oscillator using a 4.0 MHz to 16 MHz crystal or resonator
— Current gain control on amplitude output
— Signal with low harmonic distortion
— Low power
— Good noise immunity
— Eliminates need for external current limiting resistor
— Transconductance sized for optimum start-up margin for typical crystals
5.27.3.5 Internal RC Oscillator (IRC)
Trimmable internal reference clock.
5.27.3.6 Internal Phase-locked Loop (IPLL)
Phase-locked loop clock frequency multiplier
— No external components required
— Reference divider and multiplier allow large variety of clock rates
— Automatic bandwidth control mode for low-jitter operation
— Automatic frequency lock detector
— Configurable option to spread spectrum for reduced EMC radiation (frequency modulation)
— Reference clock sources:
– External 4.0 to 16 MHz resonator/crystal (XOSC)
– Internal 1.0 MHz RC oscillator (IRC)
5.27.3.7 System Integrity Support
• Power-on reset (POR)
• System reset generation
• Illegal address detection with reset
• Low-voltage detection with interrupt or reset
• Real time interrupt (RTI)
• Computer operating properly (COP) watchdog
— Configurable as window COP for enhanced failure detection
— Initialized out of reset using option bits located in flash memory
• Clock monitor supervising the correct function of the oscillator
MM912_634 - MCU Die Overview
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5.27.3.8 Serial Peripheral Interface Module (SPI)
• Configurable 8 or 16-bit data size
• Full-duplex or single-wire bidirectional
• Double-buffered transmit and receive
• Master or slave mode
• MSB-first or LSB-first shifting
• Serial clock phase and polarity options
5.27.3.9 On-Chip Voltage Regulator (VREG)
• Linear voltage regulator with bandgap reference
• Low-voltage detect (LVD) with low-voltage interrupt (LVI)
• Power-on reset (POR) circuit
• Low-voltage reset (LVR)
5.27.3.10 Background Debug (BDM)
• Non-intrusive memory access commands
• Supports in-circuit programming of on-chip nonvolatile memory
5.27.3.11 Debugger (DB G)
• Trace buffer with depth of 64 entries
• Three comparators (A, B and C)
— Comparator A compares the full address bus and full 16-bit data bus
— Exact address or address range comparisons
• Two types of comparator matches
— Tagged: This matches just before a specific instruction begins execution
— Force: This is valid on the first instruction boundary after a match occurs
• Four trace modes
• Four stage state sequencer
5.27.3.12 Die to Die Initiator (D2DI)
• Up to 2.0 Mbyte/s data rate
• Configurable 4-bit or 8-bit wide data path
Figure 41 shows MC9S12I64 CPU and BDM local address translation to the global memory map. It indicates also the location of
the internal resources in the memory map. The whole 256 k global memory space is visible through the P-Flash window located
in the 64 k local memory map located at 0x8000 - 0xBFFF using the PPAGE register.
MM912_634 - MCU Die Overview
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Figure 41. MC9S12I128 Glo bal Memory Map
0x3_FFFF
PPAGE
CPU and BDM
Local Memory Map
Global Memory Map
0xFFFF
0xC000
0x8000
P-Flash window
0x3_4000
0x3_8000
0x3_C000
0x0_4000
0x0000
0x4000
0x0400
D-Flash 4K Bytes
RAM 6K Bytes
Unpaged P-Flash
0P0P1P2P3
000
0x1400
0x0_0000
RAM 6K
P-Flash
0x0_8000
NVM Resources
0x0_2800
0x3_0000
Unpaged P-Flash
(PPAGE 0x0C) (PPAGE 0x0D) (PPAGE 0x0E) (PPAGE 0x0F)
(PPAGES
(PPAGE 0x01)
(PPAGE 0x00)
0x0_4400 D-Flash
0x0_5400
0x2800
Page 0x0F
Unpaged P-Flash
Page 0x0D
Unpaged P-Flash
Page 0x0C
Registers Registers
4* 16K Pages
NVM Resources
Unpaged P-Flash
Unpaged P-Flash
0x08-0x0B)
(PPAGES
0x02-0x07)
Unimplemented
Unimplemented
0x2_0000
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5.27.4 Part ID Assignments
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses 0x001A and 0x001B). The read-only value is a
unique part ID for each revision of the chip. Table 222 shows the assigned part ID number and Mask Set number.
The Version ID in Table 22 2 is a word located in a flash information row. The version ID number indicates a specific version of
internal NVM controller.
5.27.5 System Clo c k Des c rip tio n
For the system clock description please refer to 5.38, “S12 Clock, Reset and Power Management Unit (S12CPMU)”.
5.27.6 Mode s of Op era tio n
The MCU can operate in different modes. These are described in Section 5.27.6.1, “Chip Configuration Summary". The MCU
can operate in different power modes to facilitate power saving when full system performance is not required. These are
described in Section 5.27.6.2, “Low Power Operation". Some modules feature a software programmable option to freeze the
module status whilst the background debug module is active to facilitate debugging.
5.27.6.1 Chip Configuration Summary
The different modes and the security state of the MCU affect the debug features (enabled or disabled).
The operating mode out of reset is determined by the state of the MODC signal during reset (see Table 223). The MODC bit in
the MODE register shows the current operating mode and provides limited mode switching during operation. The state of the
MODC signal is latched into this bit on the rising edge of RESET.
5.27.6.1.1 Normal Single-Chip Mode
This mode is intended for normal device operation. The opcode from the on-chip memory is being executed after reset (requires
the reset vector to be programmed correctly). The processor program is executed from internal memory.
5.27.6.1.2 Special Single-Chip Mode
This mode is used for debugging single-chip operation, boot-strapping, or security related operations. The background debug
module BDM is active in this mode. The CPU executes a monitor program located in an on-chip ROM. BDM firmware waits for
additional serial commands through the BKGD pin.
5.27.6.2 Low Power Operation
The MM912_634 has two static low-power modes Pseudo Stop and Stop Mode. For a detailed description refer to S12CPMU
section.
5.27.7 Security
The MCU security mechanism prevents unauthorized access to the Flash memory. Refer to 5.33, “Security (S12X9SECV2)”,
Section 5.31.4.1, “Security"”, and Section 5.40.5, “Security".
Table 222. Assigned Part ID Numbers
Device Mask Set Number Part ID(146) Version ID
MC9S12I64 0N53A 0x38C0 0x0000
Note:
146. The coding is as follows:
Bit 15-12: Major family identifier
Bit 11-6: Minor family identifier
Bit 5-4: Major mask set revision number including FAB transfers
Bit 3-0: Minor — non full — mask set revision
Table 223. Chip Modes
Chip Modes MODC
Normal single chip 1
Special single chip 0
MM912_634 - MCU Die Overview
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5.27.8 Resets and Interrupts
Consult the S12 CPU manual and the S12SINT section for information on exception processing.
5.27.8.1 Resets
Table 224 lists all Reset sources and the vector locations. Resets are explained in detail in the 5.38, “S12 Clock, Reset and Power
Management Unit (S12CPMU)”.
5.27.8.2 Interrupt Vectors
Table 225 lists all interrupt sources and vectors in the default order of priority. The interrupt module (see 5.30, “Interrupt Module
(S12SINTV1)”) provides an interrupt vector base register (IVBR) to relocate the vectors.
Ta ble 224. Reset Sources and Vector Locations
Vector Address Reset Source CCR
Mask Local Enable
$FFFE Power-On Reset (POR) None None
$FFFE Low Voltage Reset (LVR) None None
$FFFE External pin RESET None None
$FFFE Illegal Address Reset None None
$FFFC Clock monitor reset None OSCE Bit in CPMUOSC register
$FFFA COP watchdog reset None CR[2:0] in CPMUCOP register
Table 22 5. Interrupt Vector Locations (Sheet 1 of 2)
Vector Address(147) Interru pt So urce CCR
Mask Local Enable Wake-up
from STOP
Vector base + $F8 Unimplemented instruction trap None None -
Vector base+ $F6 SWI None None -
Vector base+ $F4 D2DI Error Interrupt X Bit None Yes
Vector base+ $F2 D2DI External Error Interrupt I bit D2DCTL (D2DIE) Yes
Vector base+ $F0 RTI timeout interrupt I bit CPMUINT (RTIE)
Vector base + $EE
to
Vector base + $DA
Reserved
Vector base + $D8 SPI I bit SPICR1 (SPIE, SPTIE) No
Vector base + $D6
to
Vector base + $CA
Reserved
Vector base + $C8 Oscillator status interrupt I bit CPMUINT (OSCIE) No
Vector base + $C6 PLL lock interrupt I bit CPMUINT (LOCKIE) No
Vector base + $C4
to
Vector base + $BC
Reserved
Vector base + $BA FLASH error I bit FERCNFG (SFDIE, DFDIE) No
Vector base + $B8 FLASH command I bit FCNFG (CCIE) No
Vector base + $B6
to
Vector base + $8C
Reserved
Vector base + $8A Low-voltage interrupt (LVI) I bit CPMUCTRL (LVIE) No
Vector base + $88
to
Vector base + $82
Reserved
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5.27.8.3 Effects of Reset
When a reset occurs, MCU registers and control bits are initialized. Refer to the respective block sections for register reset states.
On each reset, the Flash module executes a reset sequence to load Flash configuration registers.
5.27.8.3.1 Flash Configuration Reset Sequence Phase
On each reset, the Flash module will hold CPU activity while loading Flash module registers from the Flash memory. If double
faults are detected in the reset phase, Flash module protection and security may be active on leaving reset. This is explained in
more detail in the Flash module Section 5.40.6, “Initialization".
5.27.8.3.2 Reset While Flash Command Active
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being
programmed or the sector/block being erased is not guaranteed.
5.27.8.3.3 I/O Pins
Refer to the PIM section for reset configurations of all peripheral module ports.
5.27.8.3.4 Memory
The RAM arrays are not initialized out of reset.
5.27.9 COP Configuration
The COP time-out rate bits CR[2:0] and the WCOP bit in the CPMUCOP register at address 0x003C are loaded from the Flash
register FOPT. See Table 226 and Table 227 for coding. The FOPT register is loaded from the Flash configuration field byte at
global address 0x3_FF0E during the reset sequence.
Vector base + $80 Spurious interrupt — None -
Note:
147. 16 bits vector address based
Ta ble 226. Initial COP Rate Configuration
NV[2:0] in FOPT Register CR[2:0] in COPCTL Register
000 111
001 110
010 101
011 100
100 011
101 010
110 001
111 000
Table 227. Initial WCOP Configuration
NV[3] in FOPT Register WCOP in COPCTL Register
10
01
Table 22 5. Interrupt Vector Locations (Sheet 2 of 2)
Vector Address(147) Interru pt So urce CCR
Mask Local Enable Wake-up
from STOP
Port Integration Module (S12IPIMV1)
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Freescale Semiconductor 157
5.28 Port Integration Module (S12IPIMV1)
5.28.1 Introduction
The Port Integration Module (PIM) establishes the interface between the MC9S12I64 peripheral modules SPI and
Die-To-Die Interface module (D2DI) to the I/O pins of the MCU.
All port A and port E pins support general purpose I/O functionality if not in use with other functions. The PIM controls the signal
prioritization and multiplexing on shared pins.
Figure 42. Block Diagram
5.28.1.1 Features
• 8-pin port A associated with the SPI module
• 2-pin port C used as D2DI clock output and D2DI interrupt input
• 8-pin port D used as 8 or 4 bit data I/O for the D2DI module
• 2-pin port E associated with the CPMU OSC module
• GPIO function shared on port A, E pins
• Pull-down devices on PC1 and PD7-0 if used as D2DI inputs
• Reduced drive capability on PC0 and PD7-0 on per pin basis
The Port Integration Module includes these distinctive registers:
• Data registers for ports A, E when used as general-purpose I/O
• Data direction registers for ports A, E when used as general-purpose I/O
• Port input register on ports A and E
• Reduced drive register on port C and D
ANALOGMCU
D2DCLK
D2DINT
D2DDAT0
D2DDAT1
D2DI
Die-to-Die IF
PA3
PA0
PA1
PA2
PA4
PA5
MISO
MOSI
SCK
SS
SPI
Synchronous Serial IF
D2DDAT2
D2DDAT3
D2DDAT4
D2DDAT5
D2DDAT6
D2DDAT7
DDRA
Port Integration Module
PORTA
PA6
PA7
PD3
PD0
PD1
PD2
PD4
PD5
PD6
PD7
PC0
PC1
Elements
PE0
PE1
DDRE
PORTE
CPMU OSC EXTAL
XTAL
Port Integration Module (S12IPIMV1)
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5.28.2 Memory Map and Register Definition
This section provides a detailed description of all Port Integration Module registers.
5.28.2.1 Memory Map
5.28.2.2 Port A Data Register (PORTA)
Register
Name Bit 7654321Bit 0
0x0000
PORTA
RPA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0
W
0x0001
PORTB
R000000
PE1 PE0
W
0x0002
DDRA
RDDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0
W
0x0003
DDRB
R000000
DDRE1 DDRE0
W
0x0004-
0x0009
Reserved
R00000000
W
0x000C
PUCR
R0 BKPUE 0000
PDPEE 0
W
0x000D
RDRIV
R0000
RDPD RDPC 00
W
0x0120
PTIA
R PTIA7 PTIA6 PTIA5 PTIA4 PTIA3 PTIA2 PTIA1 PTIA0
W
0x0121
PTIB
R000000PTIE1PTIE0
W
0x0122-
0x17F
Reserved
R00000000
W
= Unimplemented or Reserved
Ta ble 228. Port A Data Register (PORTA)
Address 0x0000 Access: User read/write(148)
76543210
RPA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0
W
SPI
Function ————SSSCKMOSIMISO
Reset00000000
Note:
148. Read: Anytime.
Write: Anytime.
Port Integration Module (S12IPIMV1)
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5.28.2.3 Port E Data Register (PORTE)
Table 229. PORTA Register Field Descriptions
Field Description
7–4
PA
Port A general purpose input/output data—Data RegisterIn output mode the register bit is driven to the pin.
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered and
synchronized pin input state is read.
3
PA
Port A general purpose input/output data—Data Register, SPI SS input/output
When not used with the alternative function, this pin can be used as general purpose I/O.
In general purpose output mode the register bit is driven to the pin.
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input
state is read.
• The SPI function takes precedence over the general purpose I/O function if enabled.
2
PA
Port A general purpose input/output data—Data Register, SPI SCK input/output
When not used with the alternative function, this pin can be used as general purpose I/O.
In general purpose output mode the register bit is driven to the pin.
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input
state is read.
• The SPI function takes precedence over the general purpose I/O function if enabled.
1
PA
Port A general purpose input/output data—Data Register, SPI MOSI input/output
When not used with the alternative function, this pin can be used as general purpose I/O.
In general purpose output mode the register bit is driven to the pin.
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input
state is read.
• The SPI function takes precedence over the general purpose I/O function if enabled.
0
PA
Port A general purpose input/output data—Data Register, SPI MISO input/output
When not used with the alternative function, this pin can be used as general purpose I/O.
In general purpose output mode the register bit is driven to the pin.
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input
state is read.
• The SPI function takes precedence over the general purpose I/O function if enabled.
Table 230. Port E Data Register (PORTE)
Address 0x0001 Access: User read/write(149)
76543210
R 0 0 0 000
PE1 PE0
W
CPMU
OSC
Function
——————XTALEXTAL
Reset00000000
Note:
149. Read: Anytime.
Write: Anytime.
Port Integration Module (S12IPIMV1)
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5.28.2.4 Port A Data Directio n Re gi st er (DD RA)
5.28.2.5 Port E Data Direction Register (DDRE)
Table 231. PORTE Register Field Descriptions
Field Description
1
PE
Port E general purpose input/output data—Data Register, CPMU OSC XTAL signal
When not used with the alternative function, this pin can be used as general purpose I/O.
In general purpose output mode the register bit is driven to the pin.
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input
state is read.
• The CPMU OSC function takes precedence over the general purpose I/O function if enabled.
0
PE
Port E general purpose input/output data—Data Register, CPMU OSC EXTAL signal
When not used with the alternative function, this pin can be used as general purpose I/O.
In general purpose output mode the register bit is driven to the pin.
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input
state is read.
• The CPMU OSC function takes precedence over the general purpose I/O function if enabled.
Ta ble 232. Port A Data Direction Register (DDRA)
Address 0x0002 Access: User read/write(150)
76543210
RDDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0
W
Reset00000000
Note:
150. Read: Anytime.
Write: Anytime.
Table 233. DDRA Register Field Descriptions
Field Description
7–4
DDRA
Port A Data Direction— This bit determines whether the associated pin is an input or output.
1 Associated pin is configured as output.
0 Associated pin is configured as input.
3–0
DDRA
Port A Data Direction— This bit determines whether the associated pin is an input or output.
Depending on the configuration of the enabled SPI the I/O state will be forced to input or output. In this case the data direction bits
will not change.
1 Associated pin is configured as output.
0 Associated pin is configured as input.
Ta ble 234. Port E Data Direction Register (DDRE)
Address 0x0003 Access: User read/write(151)
76543210
R000000
DDRE1 DDRE0
W
Reset00000000
Note:
151. Read: Anytime.
Write: Anytime.
Port Integration Module (S12IPIMV1)
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5.28.2.6 PIM Reserved Registers
These registers are reserved for factory testing of the PIM module. Writing to these addresses can alter the module functionality.
5.28.2.7 Pull Control Register (PUCR)
Table 235. DDRE Register Field Descriptions
Field Description
1–0
DDRE
Port E Data Direction— This bit determines whether the associated pin is an input or output. The enabled CPMU OSC function
connects the associated pins directly to the oscillator module. In this case the data direction bits will not change.
1 Associated pin is configured as output.
0 Associated pin is configured as input.
Table 236. PIM Reserved Registers
Address 0x0004-0x0009 Access: User read(152)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
Note:
152. Read: Always reads 0x00
Write: Not allowed
Table 237. Pull Control Register (PUCR)
Address 0x0124 Access: User read/write(153)
76543210
R0BKPUE 0 0 0 0 PDPEE 0
W
Reset01000010
Note:
153. Read: Anytime.
Write: Anytime.
Table 238. PUCR Register Field Descriptions
Field Description
6
BKPUE
BKGD pin pull-up Enable—Enable pull-up devices on BKGD pin. This bit configures whether a pull-up device is activated, if the
pin is used as input. This bit has no effect if the pin is used as output. Out of reset the pull-up device is enabled.
1 Pull-up device enabled.
0 Pull-up device disabled.
1
PDPEE
Pull-down Port E Enable—Enable pull-down devices on all Port E input pins. This bit configures whether pull-down devices are
activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-down devices
are enabled. If the CPMU OSC function is active the pull-down devices are disabled. In this case the register bit will not change.
1 Pull-down devices enabled.
0 Pull-down devices disabled.
Port Integration Module (S12IPIMV1)
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5.28.2.8 Reduced Drive Regist er (RDR IV)
5.28.2.9 Port A Input Register (PTIA)
Table 239. Reduced Drive Register (RDRIV)
Address 0x000D Access: User read/write(154)
76543210
R0 0 0 0 RDPD RDPC 00
W
Reset00000000
Note:
154. Read: Anytime.
Write: Anytime.
Ta ble 240. RDRIV Register Field Descriptions
Field Description
3
RDPD
Port D reduced drive—Select reduced drive for output pins. This bit configures the drive strength of output pins as either full
or reduced. If a pin is used as input this bit has no effect.
1 Reduced drive selected (1/5 of the full drive strength)
0 Full drive strength enabled
2
RDPC
Port C reduced drive—Select reduced drive for D2DCLK output pin. This bit configures the drive strength of D2DCLK output
pin as either full or reduced.
1 Reduced drive selected (1/5 of the full drive strength)
0 Full drive strength enabled
Table 241 . Port A Input Register (PTIA)
Address 0x0120 Access: User read(155)
76543210
RPTIA7 PTIA6 PTIA5 PTIA4 PTIA3 PTIA2 PTIA1 PTIA0
W
Reset(156) uuuuuuuu
Note:
155. Read: Anytime.
Write: Unimplemented. Writing to this register has no effect.
156. u = Unaffected by reset
Table 24 2. PTIA Re gister F ield Descriptions
Field Description
7–0
PTIA
Port A input data — A read always returns the buffered input state of the associated pin.It can be used to detect overload or short
circuit conditions on output pins.
Port Integration Module (S12IPIMV1)
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5.28.2.10 Port E Input Register (PTIE)
5.28.2.11 PIM Reserved Registers
i
5.28.3 Functional Description
5.28.3.1 Registers
5.28.3.1.1 Data register (PORTx)
This register holds the value driven out to the pin if the pin is used as a general purpose I/O.
Writing to this register has only an effect on the pin if the pin is used as general purpose output. When reading this address, the
buffered and synchronized state of the pin is returned if the associated data direction register bit is set to “0”.
If the data direction register bits are set to logic level “1”, the contents of the data register is returned. This is independent of any
other configuration (Figure 43).
5.28.3.1.2 Data direction register (DDRx)
This register defines whether the pin is used as an input or an output. If a peripheral module controls the pin the contents of the
data direction register is ignored (Figure 43).
5.28.3.1.3 Input register (PTIx)
This is a read-only register and always returns the buffered and synchronized state of the pin (Figure 43).
Table 243. Port E Input Register (PTIE)
Address 0x0121 Access: User read(157)
76543210
R0000 0 0 PTIE1 PTIE0
W
Reset(158) uuuuuuuu
Note:
157. Read: Anytime.
Write: Unimplemented. Writing to this register has no effect.
158. u = Unaffected by reset
Table 24 4. PTIE Regi ster Field Descriptions
Field Description
1–0
PTIE
Port E input data— A read always returns the buffered input state of the associated pin.It can be used to detect overload or short
circuit conditions on output pins.
Ta ble 245. PIM Reserved Register
Address 0x0122-0x017F Access: User read(159)
76543210
R0 0 0 0 0 0 0 0
W
Reset00000000
Note:
159. Read: Anytime.
Write: Unimplemented. Writing to this register has no effect.
Port Integration Module (S12IPIMV1)
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Figure 43. Illu stration of I/O Pin Functio nality
5.28.3.1.4 Reduced Drive Register (RDRIV)
If the pin is used as an output this register allows the configuration of the drive strength.
5.28.3.1.5 Pull Device Enable Register (PUCR)
This register turns on a pull-up or pull-down device. It becomes active only if the pin is used as an input.
5.28.3.2 Ports
5.28.3.2.1 Port A
This port is associated with the SPI. Port A pins PA7-0 can be used for general-purpose I/O and PA3-0 also with the SPI
subsystem.
5.28.3.2.2 Port C
This port is associated with the D2DI interface. Port C pins PC1-0 can be used as the D2DI interrupt input and D2DI clock output,
respectively. A pull-down device is enabled on pin PC1 if used as D2DI input.A reduced drive strength can be selected on PC0
if used as D2DI output. The D2DI interrupt input is synchronized and has an asynchronous bypass in STOP mode to allow the
generation of a wake-up interrupt.
5.28.3.2.3 Port D
This port is associated with the D2DI interface. Port D pins PD7-0 can be used with the D2DI data I/O. Pull-down devices are
enabled on all pins if used as D2DI inputs.A reduced drive strength can be selected on all pins if used as D2DI outputs.
5.28.3.2.4 Port E
This port is associated with the CPMU OSC. Port E pins PE1-0 can be used for general-purpose or with the CPMU OSC module.
5.28.4 Initialization Information
5.28.4.1 Port Data and Data Direction Re gister writes
It is not recommended to write PTx and DDRx in a word access. When changing the register pins from inputs to outputs, the data
may have extra transitions during the write access. Initialize the port data register before enabling the outputs.
PORTx
DDRx
output enable
port enable
1
0
1
0
PIN
data out
Periph.
data in
Module
1
0
synch.
PTIx
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5.29 Memory Map Control (S12PMMCV1)
5.29.1 Introduction
The S12PMMC module controls the access to all internal memories and peripherals for the CPU12 and S12SBDM module. It
regulates access priorities and determines the address mapping of the on-chip resources. Figure 44 shows a block diagram of
the S12PMMC module.
5.29.1.1 Glossary
5.29.1.2 Overview
The S12PMMC connects the CPU12’s and the S12SBDM’s bus interfaces to the MCU’s on-chip resources (memories and
peripherals). It arbitrates the bus accesses and determines all of the MCU’s memory maps. Furthermore, the S12PMMC is
responsible for constraining memory accesses on secured devices and for selecting the MCU’s functional mode.
5.29.1.3 Features
The main features of this block are:
• Paging capability to support a global 256 kByte memory address space
• Bus arbitration between the masters CPU12, S12SBDM to different resources.
• MCU operation mode control
• MCU security control
• Separate memory map schemes for each master CPU12, S12SBDM
• Generation of system reset when CPU12 accesses an unimplemented address (i.e., an address which does not belong
to any of the on-chip modules) in single-chip modes
5.29.1.4 Modes of Opera tio n
The S12PMMC selects the MCU’s functional mode. It also determines the devices behavior in secured and unsecured state.
5.29.1.4.1 Functional Modes
Two functional modes are implements on devices of the S12I product family:
• Normal Single Chip (NS)
The mode used for running applications.
• Special Single Chip Mode (SS)
A debug mode which causes the device to enter BDM Active Mode after each reset. Peripherals may also provide
special debug features in this mode.
Table 246. Glossary Of Terms
Term Definition
Local Addresses Address within the CPU12’s Local Address Map (Figure 49)
Global Address Address within the Global Address Map (Figure 49)
Aligned Bus Access Bus access to an even address.
Misaligned Bus Access Bus access to an odd address.
NS Normal Single-chip Mode
SS Special Single-chip Mode
Unimplemented Address Ranges Address ranges which are not mapped to any on-chip resource.
P-Flash Program Flash
D-Plash Data Flash
NVM Non-volatile Memory; P-Flash or D-Flash
IFR NVM Information Row. Refer to FTMRC Block Guide
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5.29.1.4.2 Security
S12I derives can be secured to prohibit external access to the on-chip P-Flash. The S12PMMC module determines the access
permissions to the on-chip memories in secured and unsecured state.
5.29.1.5 Block Diagram
Figure 44 shows a block diagram of the S12PMMC.
Figure 44. S12PMMC Block Diagram
5.29.2 External Signal Description
The S12PMMC uses two external pins to determine the devices operating mode: RESET and MODC (Table 247) See Device
User Guide (DUG) for the mapping of these signals to device pins.
5.29.3 Memory Map and Registers
5.29.3.1 Module Memory Map
A summary of the registers associated with the S12PMMC block is shown in Table 248. Detailed descriptions of the registers and
bits are given in the subsections that follow.
Ta ble 247. External System Pins Associa t ed With S12PMMC
Pin Name Pin Functions Description
RESET
(See DUG) RESET The RESET pin is used the select the MCU’s operating mode.
MODC
(See DUG) MODC The MODC pin is captured at the rising edge of the RESET pin. The captured value
determines the MCU’s operating mode.
CPU
BDM
Target Bus Controller
DBG
MMC
Address Decoder & Priority
Peripherals
P-FlashD-Flash RAM
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5.29.3.2 Register Descrip tion s
This section consists of the S12PMMC control register descriptions in address order.
5.29.3.2.1 Mode Register (MODE)
Read: Anytime.
Write: Only if a transition is allowed (see Figure 45).
The MODC bit of the MODE register is used to select the MCU’s operating mode.
Table 248. MMC Register Summary
Address Register
Name Bit 765432 1Bit 0
0x000A Reserved R000000 0 0
W
0x000B MODE RMODC 00000 0 0
W
0x0010 Reserved R000000 0 0
W
0x0011 DIRECT RDP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8
W
0x0012 Reserved R000000 0 0
W
0x0013 Reserved R000000 0 0
W
0x0014 Reserved R000000 0 0
W
0x0015 PPAGE R0000
PIX3 PIX2 PIX1 PIX0
W
= Unimplemented or Reserved
Ta ble 249. Mode Register (MODE)
Address: 0x000B
76543210
RMODC 0000000
W
Reset MODC(160) 0000000
= Unimplemented or Reserved
Note:
160. External signal (see Table 247).
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Figure 45. Mode Transition Diagram Wh en MCU is Unsecured
5.29.3.2.2 Direct Page Register (DIRECT)
Read: Anytime
Write: anytime in special SS, write-one in NS.
This register determines the position of the 256 Byte direct page within the memory map.It is valid for both global and local
mapping scheme.
Figure 46. DIRECT Address Mapping
Table 250. MO DE Field Descriptions
Field Description
7
MODC
Mode Select Bit — This bit controls the current operating mode during RESET high (inactive). The external mode pin MODC
determines the operating mode during RESET low (active). The state of the pin is registered into the respective register bit
after the RESET signal goes inactive (see Figure 45).
Write restrictions exist to disallow transitions between certain modes. Figure 45 illustrates all allowed mode changes.
Attempting non authorized transitions will not change the MODE bit, but it will block further writes to the register bit except in
special modes.
Write accesses to the MODE register are blocked when the device is secured.
Table 251. Direct Register (DIRECT)
Address: 0x0011
76543210
RDP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8
W
Reset00000000
Table 252. DIRECT Field Descriptions
Field Description
7–0
DP[15:8]
Direct Page Index Bits 15–8 — These bits are used by the CPU when performing accesses using the direct addressing mode.
These register bits form bits [15:8] of the local address (see Figure 46).
Normal
Single-Chip
1
Special
Single-Chip
0
(SS)
RESET
(NS)
1
01
Bit15 Bit0
Bit7
CPU Address [15:0]
Bit8
DP [15:8]
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Example 1. This example demo nstrates usage of the Direct Addressing Mode
MOVB #$80,DIRECT ;Set DIRECT register to 0x80. Write once only.
;Global data accesses to the range 0xXX_80XX can be direct.
;Logical data accesses to the range 0x80XX are direct.
LDY <$00 ;Load the Y index register from 0x8000 (direct access).
;< operator forces direct access on some assemblers but in
;many cases assemblers are “direct page aware” and can
;automatically select direct mode.
5.29.3.2.3 Program Page Index Register (PPAGE)
Read: Anytime
Write: Anytime
These four index bits are used to map 16 kB blocks into the Flash page window located in the local (CPU or BDM) memory map
from address 0x8000 to address 0xBFFF (see Figure 47). This supports accessing up to 256 kB of Flash (in the Global map)
within the 6 kB Local map. The PPAGE index register is effectively used to construct paged Flash addresses in the Local map
format. The CPU has special access to read and write this register directly during execution of CALL and RTC instructions.
Figure 47. PAGE Address Mapping
NOTE
Writes to this register using the special access of the CALL and RTC instructions will be
complete before the end of the instruction execution.
Table 253. Program Page Index Register (PPAGE)
Address: 0x0015
76543210
R0 0 0 0 PIX3 PIX2 PIX1 PIX0
W
Reset00001110
Bit14 Bit0
Address [13:0]
PPAGE Register [3:0]
Global Address [17:0]
Bit13
Bit17
Address: CPU Local Address
or BDM Local Address
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The fixed 16 kB page from 0x0000 to 0x3FFF is the page number 0x0C. Parts of this page are covered by Registers, D-Flash
and RAM space. See SoC Guide for details.
The fixed 16 kB page from 0x4000–0x7FFF is the page number 0x0D.
The reset value of 0x0E ensures that there is linear Flash space available between addresses 0x0000 and 0xFFFF out of reset.
The fixed 16 kB page from 0xC000-0xFFFF is the page number 0x0F.
5.29.4 Functional Description
The S12PMMC block performs several basic functions of the S12I sub-system operation: MCU operation modes, priority control,
address mapping, select signal generation and access limitations for the system. Each aspect is described in the following
subsections.
5.29.4.1 MCU Operating Modes
• Normal single chip mode
This is the operation mode for running application code. There is no external bus in this mode.
• Special single chip mode
This mode is generally used for debugging operation, boot-strapping or security related operations. The active
background debug mode is in control of the CPU code execution and the BDM firmware is waiting for serial commands
sent through the BKGD pin.
5.29.4.2 Memory Map Scheme
5.29.4.2.1 CPU and BDM Memory Map Scheme
The BDM firmware lookup tables and BDM register memory locations share addresses with other modules; however they are not
visible in the memory map during user’s code execution. The BDM memory resources are enabled only during the READ_BD
and WRITE_BD access cycles to distinguish between accesses to the BDM memory area and accesses to the other modules.
(Refer to BDM Block Guide for further details).
When the MCU enters active BDM mode, the BDM firmware lookup tables and the BDM registers become visible in the local
memory map in the range 0xFF00-0xFFFF (global address 0x3_FF00 - 0x3_FFFF) and the CPU begins execution of firmware
commands or the BDM begins execution of hardware commands. The resources which share memory space with the BDM
module will not be visible in the memory map during active BDM mode.
Please note that after the MCU enters active BDM mode the BDM firmware lookup tables and the BDM registers will also be
visible between addresses 0xBF00 and 0xBFFF if the PPAGE register contains value of 0x0F.
5.29.4.2.1.1 Expansion of the Local Address Map
Expansi on of the CPU Local Address Map
The program page index register in S12PMMC allows accessing up to 256 kB of P-Flash in the global memory map by using the
four index bits (PPAGE[3:0]) to page 16x16 kB blocks into the program page window located from address 0x8000 to address
0xBFFF in the local CPU memory map.
The page value for the program page window is stored in the PPAGE register. The value of the PPAGE register can be read or
written by normal memory accesses as well as by the CALL and RTC instructions (see Section 5.29.6.1, “CALL and RTC
Instructions").
Control registers, vector space and parts of the on-chip memories are located in unpaged portions of the 64 kB local CPU address
space.
The starting address of an interrupt service routine must be located in unpaged memory unless the user is certain that the PPAGE
register will be set to the appropriate value when the service routine is called. However an interrupt service routine can call other
routines that are in paged memory. The upper 16 kB block of the local CPU memory space (0xC000–0xFFFF) is unpaged. It is
Tabl e 254. PPAGE Field Descriptions
Field Description
3–0
PIX[3:0]
Program Page Index Bits 3–0 — These page index bits are used to select which of the 256 P-Flash or ROM array pages is to
be accessed in the Program Page Window.
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recommended that all reset and interrupt vectors point to locations in this area or to the other unmapped pages sections of the
local CPU memory map.
Expansion of the BDM Local Address Map
PPAGE and BDMPPR register is also used for the expansion of the BDM local address to the global address. These registers
can be read and written by the BDM.
The BDM expansion scheme is the same as the CPU expansion scheme.
The four BDMPPR Program Page index bits allow access to the full 256 kB address map that can be accessed with 18 address
bits.
The BDM program page index register (BDMPPR) is used only when the feature is enabled in BDM and, in the case the CPU is
executing a firmware command which uses CPU instructions, or by a BDM hardware commands. See the BDM Block Guide for
further details. (see Figure 48).
Figure 48. BDMPPR Address Mapping
BDM HARDWARE COMMAND
BDM FIRMWARE COMMAND
Bit14 Bit0
BDM Local Address [13:0]
BDMPPR Register [3:0]
Global Address [17:0]
Bit13
Bit17
Bit14 Bit0
CPU Local Address [13:0]
BDMPPR Register [3:0]
Global Address [17:0]
Bit13
Bit17
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Figure 49. Local to Global Address Mapping
0x3_FFFF
PPAGE
CPU and BDM
Local Memory Map
Global Memory Map
0xFFFF
0xC000
0x8000
P-Flash window
0x3_4000
0x3_8000
0x3_C000
0x0_4000
0x0000
0x4000
0x0400
D-Flash
RAM
Unpaged P-Flash
REGISTERS
Unpaged P-Flash
Unpaged P-Flash
0P0
P1P2P3
000
0x1400
RAMSIZE
0x0_0000
RAM
RAMSIZE
10 *16K paged
P-Flash
0x0_8000
NVM Resources
REGISTERS
RAM_LOW
Unpaged P-Flash
0x3_0000
Unimplemented Area
Unpaged P-Flash
Unpaged P-Flash
(PPAGE 0x0C) (PPAGE 0x0D) (PPAGE 0x0E) (PPAGE 0x0F)
Unpaged P-Flash
or
(PPAGE 0x02-0x0B))
(PPAGE 0x01)
(PPAGE 0x00)
Unpaged P-Flash
0x0_4400 D-Flash
0x0_5400
NVM Resources
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5.29.5 Implemented Memory in the System Memory Architecture
Each memory can be implemented in its maximum allowed size. But some devices have been defined for smaller sizes, which
means less implemented pages. All non implemented pages are called unimplemented areas.
• Registers has a fixed size of 1.0 kB, accessible via xbus0.
• SRAM has a maximum size of 11 kB, accessible via xbus0.
• D-Flash has a fixed size of 4.0 kB accessible via xbus0.
• P-Flash has a maximum size of 224 kB, accessible via xbus0.
• NVM resources (IFR, Scratch-RAM, ROM) including D-Flash have maximum size of 16 kB (PPAGE 0x01).
5.29.5.0.1 Implemented Memory Map
The global memory spaces reserved for the internal resources (RAM, D-Flash, and P-Flash) are not determined by the MMC
module. Size of the individual internal resources are however fixed in the design of the device cannot be changed by the user.
Please refer to the SoC Guide for further details. Figure 50 and Table 255 show the memory spaces occupied by the on-chip
resources. Please note that the memory spaces have fixed top addresses.
In single-chip modes accesses by the CPU12 (except for firmware commands) to any of the unimplemented areas (see
Figure 50) will result in an illegal access reset (system reset). BDM accesses to the unimplemented areas are allowed but the
data will be undefined.
No misaligned word access from the BDM module will occur; these accesses are blocked in the BDM module (Refer to BDM
Block Guide).
Table 2 55. Global Implemented Memory Space
Internal Resource Bottom Address Top Address
Registers 0x0_0000 0x0_03FF
System RAM RAM_LOW =
0x0_4000 minus RAMSIZE(161) 0x0_3FFF
D-Flash 0x0_4400 0x0_53FF
P-Flash PF_LOW =
0x4_0000 minus FLASHSIZE(162) 0x3_FFFF
Note:
161. RAMSIZE is the hexadecimal value of RAM SIZE in bytes
162. FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes
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Figure 50. Implemented Global Address Mapping
5.29.5.1 Chip Bus Control
The S12PMMC controls the address buses and the data buses that interface the bus masters (CPU12, S12SBDM) with the rest
of the system (master buses). In addition the MMC handles all CPU read data bus swapping operations. All internal resources
are connected to specific target buses (see Figure 51).
0x3_FFFF
PPAGE
CPU and BDM
Local Memory Map
Global Memory Map
0xFFFF
0xC000
0x8000
P-Flash window
PF_LOW
Unpaged P-Flash
Unpaged P-Flash
0P0
P1P2P3
000
PFSIZE
Unimplemented area
P-Flash
0x0000
0x4000
0x0400
D-Flash
RAM
Unpaged P-Flash
REGISTERS
0x1400
RAMSIZE
0x0_4000
0x0_0000
RAM
RAMSIZE
0x0_8000
NVM Resources
REGISTERS
RAM_LOW
Unimplemented Area
(PPAGE 0x01)
(PPAGE 0x00)
0x0_4400 D-Flash
0x0_5400
NVM Resources
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Figure 51. S12I Pla tform
5.29.5.1.1 Master Bus Prioritization regarding Access Conflicts on Target Buses
The arbitration scheme allows only one master to be connected to a target at any given time. The following rules apply when
prioritizing accesses from different masters to the same target bus:
• CPU12 always has priority over BDM.
• BDM has priority over CPU12 when its access is stalled for more than 128 cycles. In the later case the CPU will be
stalled after finishing the current operation and the BDM will gain access to the bus.
5.29.5.2 Interrupts
The MMC does not generate any interrupts.
5.29.6 Initialization/Application Information
5.29.6.1 CALL and RTC Instructions
CALL and RTC instructions are uninterruptable CPU instructions that automate page switching in the program page window. The
CALL instruction is similar to the JSR instruction, but the subroutine that is called can be located anywhere in the local address
space or in any Flash or ROM page visible through the program page window. The CALL instruction calculates and stacks a
return address, stacks the current PPAGE value and writes a new instruction-supplied value to the PPAGE register. The PPAGE
value controls which of the 256 possible pages is visible through the 16 kbyte program page window in the 64 kbyte local CPU
memory map. Execution then begins at the address of the called subroutine.
During the execution of the CALL instruction, the CPU performs the following steps:
1. Writes the current PPAGE value into an internal temporary register and writes the new instruction-supplied PPAGE
value into the PPAGE register
2. Calculates the address of the next instruction after the CALL instruction (the return address) and pushes this 16-bit value
onto the stack
3. Pushes the temporarily stored PPAGE value onto the stack
4. Calculates the effective address of the subroutine, refills the queue and begins execution at the new address
This sequence is uninterruptable. There is no need to inhibit interrupts during the CALL instruction execution. A CALL instruction
can be performed from any address to any other address in the local CPU memory space.
The PPAGE value supplied by the instruction is part of the effective address of the CPU. For all addressing mode variations
(except indexed-indirect modes) the new page value is provided by an immediate operand in the instruction. In indexed-indirect
variations of the CALL instruction a pointer specifies memory locations where the new page value and the address of the called
subroutine are stored. Using indirect addressing for both the new page value and the address within the page allows usage of
values calculated at run time rather than immediate values that must be known at the time of assembly.
CPU BDM
MMC “Crossbar Switch”
S12X0
XBUS0
DBG
S12X1
IPBI
P-Flash D-Flash SRAM
BDM
resources Peripherals
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5.30 Interrupt Module (S12SINTV1)
5.30.1 Introduction
The INT module decodes the priority of all system exception requests and provides the applicable vector for processing the
exception to the CPU. The INT module supports:
• I bit and X bit maskable interrupt requests
• A non-maskable unimplemented op-code trap
• A non-maskable software interrupt (SWI) or background debug mode request
• Three system reset vector requests
• A spurious interrupt vector
Each of the I bit maskable interrupt requests is assigned to a fixed priority level.
5.30.1.1 Glossary
Table 256 contains terms and abbreviations used in the document.
5.30.1.2 Features
• Interrupt vector base register (IVBR)
• One spurious interrupt vector (at address vector base(163) + 0x0080).
• 2–58 I bit maskable interrupt vector requests (at addresses vector base + 0x0082–0x00F2).
• I bit maskable interrupts can be nested.
• One X bit maskable interrupt vector request (at address vector base + 0x00F4).
• One non-maskable software interrupt request (SWI) or background debug mode vector request (at address vector base
+ 0x00F6).
• One non-maskable unimplemented op-code trap (TRAP) vector (at address vector base + 0x00F8).
• Three system reset vectors (at addresses 0xFFFA–0xFFFE).
• Determines the highest priority interrupt vector requests, drives the vector to the bus on CPU request
• Wakes up the system from stop mode when an appropriate interrupt request occurs.
Note:
163. The vector base is a 16-bit address which is accumulated from the contents of the interrupt vector base register (IVBR, used as upper
byte) and 0x00 (used as lower byte).
5.30.1.3 Modes of Opera tio n
•Run mode
This is the basic mode of operation.
• Stop Mode
In stop mode, the clock to the INT module is disabled. The INT module is however capable of waking-up the CPU from
stop mode if an interrupt occurs. Please refer to Section 5.30.5.3, “Wake-up from Stop Mode" for details.
• Freeze mode (BDM active)
In freeze mode (BDM active), the interrupt vector base register is overridden internally. Please refer to
Section 5.30.3.1.1, “Interrupt Vector Base Register (IVBR)" for details.
Table 256. Terminology
Term Meaning
CCR Condition Code Register (in the CPU)
ISR Interrupt Service Routine
MCU Micro-Controller Unit
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5.30.1.4 Block Diagram
Figure 52 shows a block diagram of the INT module.
Figure 52. INT Block Diagram
5.30.2 External Signal Description
The INT module has no external signals.
5.30.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the INT module.
5.30.3.1 Register Descrip tion s
This section describes in address order all the INT registers and their individual bits.
5.30.3.1.1 Interrupt Vector Base Register (IVBR)
Read: Anytime
Write: Anytime
Table 257. Interrupt Vector Base Register (IVBR)
Address: 0x001F
76543210
RIVB_ADDR[7:0]
W
Reset11111111
Table 258. IVBR Field Descriptions
Field Description
7–0
IVB_ADDR[7:0]
Interrupt Vector Base Address Bits — These bits represent the upper byte of all vector addresses. Out of reset these bits
are set to 0xFF (i.e., vectors are located at 0xFF80–0xFFFE) to ensure compatibility to HCS12.
Note: A system reset will initialize the interrupt vector base register with “0xFF” before it is used to determine the reset
vector address. Therefore, changing the IVBR has no effect on the location of the three reset vectors
(0xFFFA–0xFFFE).
Note: If the BDM is active (i.e., the CPU is in the process of executing BDM firmware code), the contents of IVBR are
ignored and the upper byte of the vector address is fixed as “0xFF”. This is done to enable handling of all
non-maskable interrupts in the BDM firmware.
Wake-up
IVBR
Interrupt
Requests
Interrupt Requests CPU
Vector
Address
Peripheral
To CPU
Priority
Decoder
Non I bit Maskable Channels
I bit Maskable Channels
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5.30.4 Functional Description
The INT module processes all exception requests to be serviced by the CPU module. These exceptions include interrupt vector
requests and reset vector requests. Each of these exception types and their overall priority level is discussed in the subsections
below.
5.30.4.1 S12S Exception Reques ts
The CPU handles both reset requests and interrupt requests. A priority decoder is used to evaluate the priority of pending
interrupt requests.
5.30.4.2 Interrupt Prioritization
The INT module contains a priority decoder to determine the priority for all interrupt requests pending for the CPU. If more than
one interrupt request is pending, the interrupt request with the higher vector address wins the prioritization.
The following conditions must be met for an I bit maskable interrupt request to be processed.
1. The local interrupt enabled bit in the peripheral module must be set.
2. The I bit in the condition code register (CCR) of the CPU must be cleared.
3. There is no SWI, TRAP, or X bit maskable request pending.
NOTE
All non I bit maskable interrupt requests always have higher priority than the I bit maskable
interrupt requests. If the X bit in the CCR is cleared, it is possible to interrupt an I bit
maskable interrupt by an X bit maskable interrupt. It is possible to nest non maskable
interrupt requests, e.g., by nesting SWI or TRAP calls.
Since an interrupt vector is only supplied at the time when the CPU requests it, it is possible that a higher priority interrupt request
could override the original interrupt request that caused the CPU to request the vector. In this case, the CPU will receive the
highest priority vector and the system will process this interrupt request first, before the original interrupt request is processed.
If the interrupt source is unknown (for example, in the case where an interrupt request becomes inactive after the interrupt has
been recognized, but prior to the CPU vector request), the vector address supplied to the CPU will default to that of the spurious
interrupt vector.
NOTE
Care must be taken to ensure that all interrupt requests remain active until the system
begins execution of the applicable service routine; otherwise, the exception request may not
get processed at all or the result may be a spurious interrupt request (vector at address
(vector base + 0x0080)).
5.30.4.3 Reset Exception Req u ests
The INT module supports three system reset exception request types (please refer to the Clock and Reset generator module for
details):
1. Pin reset, power-on reset or illegal address reset, low voltage reset (if applicable)
2. Clock monitor reset request
3. COP watchdog reset request
5.30.4.4 Exception Priority
The priority (from highest to lowest) and address of all exception vectors issued by the INT module upon request by the CPU is
shown in Ta b l e 25 9 .
Table 259. Exception Vector Map and Priority
Vector Address(164) Source
0xFFFE Pin reset, power-on reset, illegal address reset, low voltage reset (if applicable)
0xFFFC Clock monitor reset
0xFFFA COP watchdog reset
(Vector base + 0x00F8) Unimplemented opcode trap
(Vector base + 0x00F6) Software interrupt instruction (SWI) or BDM vector request
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5.30.5 Initialization/Application Information
5.30.5.1 Initialization
After system reset, software should:
1. Initialize the interrupt vector base register if the interrupt vector table is not located at the default location
(0xFF80–0xFFF9).
2. Enable I bit maskable interrupts by clearing the I bit in the CCR.
3. Enable the X bit maskable interrupt by clearing the X bit in the CCR.
5.30.5.2 Interrupt Nesting
The interrupt request scheme makes it possible to nest I bit maskable interrupt requests handled by the CPU. I bit maskable
interrupt requests can be interrupted by an interrupt request with a higher priority.
I bit maskable interrupt requests cannot be interrupted by other I bit maskable interrupt requests per default. In order to make an
interrupt service routine (ISR) interruptible, the ISR must explicitly clear the I bit in the CCR (CLI). After clearing the I bit, other
I bit maskable interrupt requests can interrupt the current ISR.
An ISR of an interruptible I bit maskable interrupt request could basically look like this:
1. Service interrupt, e.g., clear interrupt flags, copy data, etc.
2. Clear I bit in the CCR by executing the instruction CLI (thus allowing other I bit maskable interrupt requests)
3. Process data
4. Return from interrupt by executing the instruction RTI
5.30.5.3 Wake- up from Stop Mode
5.30.5.3.1 CPU Wake-up from Stop Mode
Every I bit maskable interrupt request is capable of waking the MCU from stop mode. To determine whether an I bit maskable
interrupts is qualified to wake-up the CPU or not, the same conditions as in normal run mode are applied during stop mode: If the
I bit in the CCR is set, all I bit maskable interrupts are masked from waking-up the MCU.
Since there are no clocks running in stop mode, only interrupts which can be asserted asynchronously can wake-up the MCU
from stop mode.
The X bit maskable interrupt request can wake up the MCU from stop mode at anytime, even if the X bit in CCR is set.
If the X bit maskable interrupt request is used to wake-up the MCU with the X bit in the CCR set, the associated ISR is not called.
The CPU then resumes program execution with the instruction following the WAI or STOP instruction. This features works the
same rules like any interrupt request, i.e. care must be taken that the X interrupt request used for wake-up remains active at least
until the system begins execution of the instruction following the WAI or STOP instruction; otherwise, wake-up may not occur.
(Vector base + 0x00F4) X bit maskable interrupt request (XIRQ or D2D error interrupt)(165)
(Vector base + 0x00F2) IRQ or D2D interrupt request(166)
(Vector base + 0x00F0–0x0082) Device specific I bit maskable interrupt sources (priority determined by the low byte of the vector address,
in descending order)
(Vector base + 0x0080) Spurious interrupt
Note:
164. 16 bits vector address based
165. D2D error interrupt on MCUs featuring a D2D initiator module, otherwise XIRQ pin interrupt
166. D2D interrupt on MCUs featuring a D2D initiator module, otherwise IRQ pin interrupt
Table 259. Exception Vector Map and Priority
Vector Address(164) Source
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5.31 Background Debug Module (S12SBDMV1)
5.31.1 Introduction
This section describes the functionality of the background debug module (BDM) sub-block of the HCS12S core platform.
The background debug module (BDM) sub-block is a single-wire, background debug system implemented in on-chip hardware
for minimal CPU intervention. All interfacing with the BDM is done via the BKGD pin.
The BDM has enhanced capability for maintaining synchronization between the target and host while allowing more flexibility in
clock rates. This includes a sync signal to determine the communication rate and a handshake signal to indicate when an
operation is complete. The system is backwards compatible to the BDM of the S12 family with the following exceptions:
• TAGGO command not supported by S12SBDM
• External instruction tagging feature is part of the DBG module
• S12SBDM register map and register content modified
• Family ID readable from BDM ROM at global address 0x3_FF0F in active BDM (value for devices with HCS12S core is
0xC2)
• Clock switch removed from BDM (CLKSW bit removed from BDMSTS register)
5.31.1.1 Features
The BDM includes these distinctive features:
• Single-wire communication with host development system
• Enhanced capability for allowing more flexibility in clock rates
• SYNC command to determine communication rate
• GO_UNTIL(174) command
• Hardware handshake protocol to increase the performance of the serial communication
• Active out of reset in special single chip mode
• Nine hardware commands using free cycles, if available, for minimal CPU intervention
• Hardware commands not requiring active BDM
• 14 firmware commands execute from the standard BDM firmware lookup table
• When secured, hardware commands are allowed to access the register space in special single chip mode, if the Flash
erase tests fail.
• Family ID readable from BDM ROM at global address 0x3_FF0F in active BDM (value for devices with HCS12S core is
0xC2)
• BDM hardware commands are operational until system stop mode is entered
5.31.1.2 Modes of Opera tio n
BDM is available in all operating modes but must be enabled before firmware commands are executed. Some systems may have
a control bit that allows suspending the function during background debug mode.
5.31.1.2.1 Regular Run Modes
All of these operations refer to the part in run mode and not being secured. The BDM does not provide controls to conserve power
during run mode.
• Normal modes
General operation of the BDM is available and operates the same in all normal modes.
• Special single chip mode
In special single chip mode, background operation is enabled and active out of reset.This allows programming a system
with blank memory.
5.31.1.2.2 Secure Mode Operation
If the device is in secure mode, the operation of the BDM is reduced to a small subset of its regular run mode operation. Secure
operation prevents access to Flash other than allowing erasure. For more information please see Section 5.31.4.1, “Security".
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5.31.1.2.3 Low-power Modes
The BDM can be used until stop mode is entered. The CPU cannot enter stop mode during BDM active mode.
In stop mode the BDM clocks are stopped. When BDM clocks are disabled and stop mode is exited, the BDM clocks will restart
and BDM will have a soft reset (clearing the instruction register, any command in progress and disable the ACK function). The
BDM is now ready to receive a new command.
5.31.1.3 Block Diagram
A block diagram of the BDM is shown in Figure 53.
Figure 53. BDM Block Diagram
5.31.2 External Signal Description
A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate with the BDM system.
During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin
becomes the dedicated serial interface pin for the background debug mode.
16-Bit Shift Register
BKGD
Host
System Serial
Interface Data
Control
Register Block
Register
BDMSTS
Instruction Code
and
Execution
Standard BDM Firmware
LOOKUP TABLE
Secured BDM Firmware
LOOKUP TABLE
Bus Interface
and
Control Logic
Address
Data
Control
Clocks
BDMACT
TRACE
ENBDM
SDV
UNSEC
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5.31.3 Memory Map and Register Definition
5.31.3.1 Module Memory Map
Table 260 shows the BDM memory map when BDM is active.
5.31.3.2 Register Descrip tion s
A summary of the registers associated with the BDM is shown in Table 261. Registers are accessed by host-driven
communications to the BDM hardware using READ_BD and WRITE_BD commands.
Table 260. BDM Memory Map
Global Address Module Size
(Bytes)
0x3_FF00–0x3_FF0B BDM registers 12
0x3_FF0C–0x3_FF0E BDM firmware ROM 3
0x3_FF0F Family ID (part of BDM firmware ROM) 1
0x3_FF10–0x3_FFFF BDM firmware ROM 240
Table 261. BDM Register Summary
Global
Address Register
Name Bit 7654321Bit 0
0x3_FF00 Reserved RXXXXXX0 0
W
0x3_FF01 BDMSTS RENBDM BDMACT 0 SDV TRACE 0 UNSEC 0
W
0x3_FF02 Reserved RXXXXXXXX
W
0x3_FF03 Reserved RXXXXXXXX
W
0x3_FF04 Reserved RXXXXXXXX
W
0x3_FF05 Reserved RXXXXXXXX
W
0x3_FF06 BDMCCR RCCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0
W
0x3_FF07 Reserved R00000000
W
0x3_FF08 BDMPPR RBPAE 000
BPP3 BPP2 BPP1 BPP0
W
0x3_FF09 Reserved R00000000
W
0x3_FF0A Reserved R00000000
W
0x3_FF0B Reserved R00000000
W
= Unimplemented, Reserved = Implemented (do not alter)
X = Indeterminate 0 = Always read zero
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5.31.3.2.1 BDM Status Register (BDMSTS)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured, but subject to the following:
— ENBDM should only be set via a BDM hardware command if the BDM firmware commands are needed. (This does
not apply in special single chip mode).
— BDMACT can only be set by BDM hardware upon entry into BDM. It can only be cleared by the standard BDM
firmware lookup table upon exit from BDM active mode.
— All other bits, while writable via BDM hardware or standard BDM firmware write commands, should only be altered
by the BDM hardware or standard firmware lookup table as part of BDM command execution.
Register Global Address 0x3_FF01 Table 262. BDM Status Register (BDMSTS)
76543210
RENBDM BDMACT 0 SDV TRACE 0 UNSEC 0
W
Reset
Special Single-Chip Mode 0(167) 100000
(168) 0
All Other Modes 0 0000000
= Unimplemented, Reserved = Implemented (do not alter)
0 = Always read zero
Note:
167. ENBDM is read as 1 by a debugging environment in special single chip mode when the device is not secured or secured but fully erased
(Flash). This is because the ENBDM bit is set by the standard BDM firmware before a BDM command can be fully transmitted and
executed.
168. UNSEC is read as 1 by a debugging environment in special single chip mode when the device is secured and fully erased, else it is 0
and can only be read if not secure (see also bit description).
Table 263. BDMSTS Field Descriptions
Field Description
7
ENBDM
Enable BDM — This bit controls whether the BDM is enabled or disabled. When enabled, BDM can be made active to allow
firmware commands to be executed. When disabled, BDM cannot be made active but BDM hardware commands are still
allowed.
0 BDM disabled
1 BDM enabled
Note: ENBDM is set out of reset in special single chip mode. In special single chip mode with the device secured, this bit will
not be set until after the Flash erase verify tests are complete.
6
BDMACT
BDM Active Status — This bit becomes set upon entering BDM. The standard BDM firmware lookup table is then enabled
and put into the memory map. BDMACT is cleared by a carefully timed store instruction in the standard BDM firmware as part
of the exit sequence to return to user code and remove the BDM memory from the map.
0 BDM not active
1 BDM active
4
SDV
Shift Dat a Valid — This bit is set and cleared by the BDM hardware. It is set after data has been transmitted as part of a BDM
firmware or hardware read command or after data has been received as part of a BDM firmware or hardware write command.
It is cleared when the next BDM command has been received or BDM is exited. SDV is used by the standard BDM firmware
to control program flow execution.
0 Data phase of command not complete
1 Data phase of command is complete
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Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured
NOTE
When BDM is made active, the CPU stores the content of its CCR register in the BDMCCR
register. However, out of special single-chip reset, the BDMCCR is set to 0xD8 and not 0xD0
which is the reset value of the CCR register in this CPU mode. Out of reset in all other modes
the BDMCCR register is read zero.
When entering background debug mode, the BDM CCR holding register is used to save the condition code register of the user’s
program. It is also used for temporary storage in the standard BDM firmware mode. The BDM CCR holding register can be written
to modify the CCR value.
5.31.3.2.2 BDM Program Page Index Reg is t er (BDMPPR)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured
3
TRACE
TRACE1 BDM Firmware Command is Being Executed — This bit gets set when a BDM TRACE1 firmware command is
first recognized. It will stay set until BDM firmware is exited by one of the following BDM commands: GO or GO_UNTIL(174).
0 TRACE1 command is not being executed
1 TRACE1 command is being executed
1
UNSEC
Unsecure — If the device is secured this bit is only writable in special single chip mode from the BDM secure firmware. It is
in a zero state as secure mode is entered so that the secure BDM firmware lookup table is enabled and put into the memory
map overlapping the standard BDM firmware lookup table.
The secure BDM firmware lookup table verifies that the on-chip Flash is erased. This being the case, the UNSEC bit is set and
the BDM program jumps to the start of the standard BDM firmware lookup table and the secure BDM firmware lookup table is
turned off. If the erase test fails, the UNSEC bit will not be asserted.
0 System is in a secured mode.
1 System is in a unsecured mode.
Note: When UNSEC is set, security is off and the user can change the state of the secure bits in the on-chip Flash EEPROM.
Note that if the user does not change the state of the bits to “unsecured” mode, the system will be secured again when
it is next taken out of reset.After reset this bit has no meaning or effect when the security byte in the Flash EEPROM
is configured for unsecure mode.
Register Global Address 0x3_FF06 Table 264. BDM CCR Holding Register (BDMCCR)
76543210
RCCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0
W
Reset
Special Single-Chip Mode11011000
All Other Modes 0 0000000
Register Global Address 0x3_FF08 Table 265. BDM Program Page Register (BDMPPR)
76543210
RBPAE 000
BPP3 BPP2 BPP1 BPP0
W
Reset00000000
= Unimplemented, Reserved
Tab le 263. BDMSTS Field Descriptions (continued)
Field Description
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5.31.3.3 Family ID Assignment
The family ID is an 8-bit value located in the BDM ROM in active BDM (at global address: 0x3_FF0F). The read-only value is a
unique family ID which is 0xC2 for devices with an HCS12S core.
5.31.4 Functional Description
The BDM receives and executes commands from a host via a single wire serial interface. There are two types of BDM commands:
hardware and firmware commands.
Hardware commands are used to read and write target system memory locations and to enter active background debug mode,
see Section 5.31.4.3, “BDM Hardware Commands". Target system memory includes all memory that is accessible by the CPU.
Firmware commands are used to read and write CPU resources and to exit from active background debug mode, see
Section 5.31.4.4, “Standard BDM Firmware Commands". The CPU resources referred to are the accumulator (D), X index
register (X), Y index register (Y), stack pointer (SP), and program counter (PC).
Hardware commands can be executed at any time and in any mode excluding a few exceptions as highlighted (see
Section 5.31.4.3, “BDM Hardware Commands") and in secure mode (see Section 5.31.4.1, “Security"). BDM firmware
commands can only be executed when the system is not secure and is in active background debug mode (BDM).
5.31.4.1 Security
If the user resets into special single chip mode with the system secured, a secured mode BDM firmware lookup table is brought
into the map overlapping a portion of the standard BDM firmware lookup table. The secure BDM firmware verifies that the on-chip
Flash EEPROM are erased. This being the case, the UNSEC and ENBDM bit will get set. The BDM program jumps to the start
of the standard BDM firmware and the secured mode BDM firmware is turned off and all BDM commands are allowed. If the Flash
do not verify as erased, the BDM firmware sets the ENBDM bit, without asserting UNSEC, and the firmware enters a loop. This
causes the BDM hardware commands to become enabled, but does not enable the firmware commands. This allows the BDM
hardware to be used to erase the Flash.
BDM operation is not possible in any other mode than special single chip mode when the device is secured. The device can only
be unsecured via BDM serial interface in special single chip mode. For more information regarding security, please see the
S12S_9SEC Block Guide.
5.31.4.2 Enabling and Acti va ti n g BDM
The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated only after being
enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS) register. The ENBDM bit is set by writing to the
BDM status (BDMSTS) register, via the single-wire interface, using a hardware command such as WRITE_BD_BYTE.
After being enabled, BDM is activated by one of the following(169):
• Hardware BACKGROUND command
• CPU BGND instruction
• Breakpoint force or tag mechanism(170)
When BDM is activated, the CPU finishes executing the current instruction and then begins executing the firmware in the
standard BDM firmware lookup table. When BDM is activated by a breakpoint, the type of breakpoint used determines if BDM
becomes active before or after execution of the next instruction.
Note:
169. BDM is enabled and active immediately out of special single-chip reset.
170. This method is provided by the S12S_DBG module.
Table 266. BDMPPR Fi eld Descriptions
Field Description
7
BPAE
BDM Program Page Access Enable Bit — BPAE enables program page access for BDM hardware and firmware read/write
instructions. The BDM hardware commands used to access the BDM registers (READ_BD and WRITE_BD) can not be used
for global accesses even if the BGAE bit is set.
0 BDM Program Paging disabled
1 BDM Program Paging enabled
3–0
BPP[3:0]
BDM Program Page Index Bits 3–0 — These bits define the selected program page. For more detailed information regarding
the program page window scheme, please refer to the S12S_MMC Block Guide.
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Freescale Semiconductor 186
NOTE
If an attempt is made to activate BDM before being enabled, the CPU resumes normal
instruction execution after a brief delay. If BDM is not enabled, any hardware
BACKGROUND commands issued are ignored by the BDM and the CPU is not delayed.
In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses 0x3_FF00 to 0x3_FFFF.
BDM registers are mapped to addresses 0x3_FF00 to 0x3_FF0B. The BDM uses these registers which are readable anytime by
the BDM. However, these registers are not readable by user programs.
When BDM is activated while CPU executes code overlapping with BDM firmware space the saved program counter (PC) will be
auto incremented by one from the BDM firmware, no matter what caused the entry into BDM active mode (BGND instruction,
BACKGROUND command or breakpoints). In such a case the PC must be set to the next valid address via a WRITE_PC
command before executing the GO command.
5.31.4.3 BDM Hardware Commands
Hardware commands are used to read and write target system memory locations and to enter active background debug mode.
Target system memory includes all memory that is accessible by the CPU such as on-chip RAM, Flash, I/O and control registers.
Hardware commands are executed with minimal or no CPU intervention and do not require the system to be in active BDM for
execution, although, they can still be executed in this mode. When executing a hardware command, the BDM sub-block waits for
a free bus cycle so that the background access does not disturb the running application program. If a free cycle is not found within
128 clock cycles, the CPU is momentarily frozen so that the BDM can steal a cycle. When the BDM finds a free cycle, the
operation does not intrude on normal CPU operation provided that it can be completed in a single cycle. However, if an operation
requires multiple cycles the CPU is frozen until the operation is complete, even though the BDM found a free cycle. The BDM
hardware commands are listed in Ta bl e 26 7.
The READ_BD and WRITE_BD commands allow access to the BDM register locations. These locations are not normally in the
system memory map but share addresses with the application in memory. To distinguish between physical memory locations that
share the same address, BDM memory resources are enabled just for the READ_BD and WRITE_BD access cycle. This allows
the BDM to access BDM locations unobtrusively, even if the addresses conflict with the application memory map.
Tab le 267. Hardware Commands
Command Opcode
(hex) Data Description
BACKGROUND 90 None Enter background mode if BDM is enabled. If enabled, an ACK will be issued when the part
enters active background mode.
ACK_ENABLE D5 None Enable Handshake. Issues an ACK pulse after the command is executed.
ACK_DISABLE D6 None Disable Handshake. This command does not issue an ACK pulse.
READ_BD_BYTE E4 16-bit address
16-bit data out
Read from memory with standard BDM firmware lookup table in map.
Odd address data on low byte; even address data on high byte.
READ_BD_WORD EC 16-bit address
16-bit data out
Read from memory with standard BDM firmware lookup table in map.
Must be aligned access.
READ_BYTE E0 16-bit address
16-bit data out
Read from memory with standard BDM firmware lookup table out of map.
Odd address data on low byte; even address data on high byte.
READ_WORD E8 16-bit address
16-bit data out
Read from memory with standard BDM firmware lookup table out of map. Must be aligned
access.
WRITE_BD_BYTE C4 16-bit address
16-bit data in
Write to memory with standard BDM firmware lookup table in map.
Odd address data on low byte; even address data on high byte.
WRITE_BD_WORD CC 16-bit address
16-bit data in
Write to memory with standard BDM firmware lookup table in map. Must be aligned access.
WRITE_BYTE C0 16-bit address
16-bit data in
Write to memory with standard BDM firmware lookup table out of map.
Odd address data on low byte; even address data on high byte.
WRITE_WORD C8 16-bit address
16-bit data in
Write to memory with standard BDM firmware lookup table out of map. Must be aligned
access.
Note:
171. If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is complete
for all BDM WRITE commands.
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Freescale Semiconductor 187
5.31.4.4 St andard BDM Firmware Commands
BDM firmware commands are used to access and manipulate CPU resources. The system must be in active BDM to execute
standard BDM firmware commands, see Section 5.31.4.2, “Enabling and Activating BDM". Normal instruction execution is
suspended while the CPU executes the firmware located in the standard BDM firmware lookup table. The hardware command
BACKGROUND is the usual way to activate BDM.
As the system enters active BDM, the standard BDM firmware lookup table and BDM registers become visible in the on-chip
memory map at 0x3_FF00–0x3_FFFF, and the CPU begins executing the standard BDM firmware. The standard BDM firmware
watches for serial commands and executes them as they are received.
The firmware commands are shown in Table 26 8.
5.31.4.5 BDM Command Structure
Hardware and firmware BDM commands start with an 8-bit opcode followed by a 16-bit address and/or a 16-bit data word,
depending on the command. All the read commands return 16 bits of data despite the byte or word implication in the command
name.{Satatement}
8-bit reads return 16-bits of data, only one byte of which contains valid data. If reading an
even address, the valid data will appear in the MSB. If reading an odd address, the valid data
will appear in the LSB.
16-bit misaligned reads and writes are generally not allowed. If attempted by BDM hardware
command, the BDM ignores the least significant bit of the address and assumes an even
address from the remaining bits.
Table 268. Firmware Comma nds
Command(172) Opcode
(hex) Data Description
READ_NEXT(173) 62 16-bit data out Increment X index register by 2 (X = X + 2), then read word X points to.
READ_PC 63 16-bit data out Read program counter.
READ_D 64 16-bit data out Read D accumulator.
READ_X 65 16-bit data out Read X index register.
READ_Y 66 16-bit data out Read Y index register.
READ_SP 67 16-bit data out Read stack pointer.
WRITE_NEXT 42 16-bit data in Increment X index register by 2 (X = X + 2), then write word to location
pointed to by X.
WRITE_PC 43 16-bit data in Write program counter.
WRITE_D 44 16-bit data in Write D accumulator.
WRITE_X 45 16-bit data in Write X index register.
WRITE_Y 46 16-bit data in Write Y index register.
WRITE_SP 47 16-bit data in Write stack pointer.
GO 08 none Go to user program. If enabled, ACK will occur when leaving active background mode.
GO_UNTIL(174) 0C none Go to user program. If enabled, ACK will occur upon returning to active background mode.
TRACE1 10 none Execute one user instruction then return to active BDM. If enabled,
ACK will occur upon returning to active background mode.
TAGGO -> GO
18 none
(Previous enable tagging and go to user program.)
This command will be deprecated and should not be used anymore.
Opcode will be executed as a GO command.
Note:
172. If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is complete
for all BDM WRITE commands.
173. When the firmware command READ_NEXT or WRITE_NEXT is used to access the BDM address space the BDM resources are
accessed rather than user code. Writing BDM firmware is not possible.
174. System stop disables the ACK function and ignored commands will not have an ACK-pulse (e.g., CPU in stop mode). The GO_UNTIL
command will not get an Acknowledge if CPU executes the stop instruction before the “UNTIL” condition (BDM active again) is reached
(see Section 5.31.4.7, “Serial Interface Hardware Handshake Protocol" last note).
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Freescale Semiconductor 188
For hardware data read commands, the external host must wait at least 150 bus clock cycles after sending the address before
attempting to obtain the read data. This is to be certain that valid data is available in the BDM shift register, ready to be shifted
out. For hardware write commands, the external host must wait 150 bus clock cycles after sending the data to be written before
attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed. The
150 bus clock cycle delay in both cases includes the maximum 128 cycle delay that can be incurred as the BDM waits for a free
cycle before stealing a cycle.
For BDM firmware read commands, the external host should wait at least 48 bus clock cycles after sending the command opcode
and before attempting to obtain the read data. The 48 cycle wait allows enough time for the requested data to be made available
in the BDM shift register, ready to be shifted out.
For BDM firmware write commands, the external host must wait 36 bus clock cycles after sending the data to be written before
attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed.
The external host should wait for at least for 76 bus clock cycles after a TRACE1 or GO command before starting any new serial
command. This is to allow the CPU to exit gracefully from the standard BDM firmware lookup table and resume execution of the
user code. Disturbing the BDM shift register prematurely may adversely affect the exit from the standard BDM firmware lookup
table.
NOTE
If the bus rate of the target processor is unknown or could be changing, it is recommended
that the ACK (acknowledge function) is used to indicate when an operation is complete.
When using ACK, the delay times are automated.
Figure 54 represents the BDM command structure. The command blocks illustrate a series of eight bit times starting with a falling
edge. The bar across the top of the blocks indicates that the BKGD line idles in the high state. The time for an 8-bit command is
8 16 target clock cycles.(175)
Note:
175. Target clock cycles are cycles measured using the target MCU’s serial clock rate. See Section 5.31.4.6, “BDM Serial Interface" and
Section 5.31.3.2.1, “BDM Status Register (BDMSTS)" for information on how serial clock rate is selected.
Figure 54. BDM Command Structure
5.31.4.6 BDM Serial Interface
The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode select input which
selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the
BDM.
Hardware
Hardware
Firmware
Firmware
GO,
48-BC
BC = Bus Clock Cycles
Command Address
150-BC
Delay
Next
DELAY
8 Bits
AT ~16 TC/Bit
16 Bits
AT ~16 TC/Bit
16 Bits
AT ~16 TC/Bit
Command Address Data Next
Data
Read
Write
Read
Write
TRACE
Command Next
Command Data
76-BC
Delay
Next
Command
150-BC
Delay
36-BC
DELAY
Command
Command
Command
Command
Data
Next
Command TC = Target Clock Cycles
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Freescale Semiconductor 189
This clock will be referred to as the target clock in the following explanation.
The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on the BKGD pin to indicate
the start of each bit time. This falling edge is sent for every bit whether data is transmitted or received. Data is transferred most
significant bit (MSB) first at 16 target clock cycles per bit. The interface times out if 512 clock cycles occur between falling edges
from the host.
The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all times. It is assumed that
there is an external pull-up and that drivers connected to BKGD do not typically drive the high level. Since R-C rise time could
be unacceptably long, the target system and host provide brief driven-high (speedup) pulses to drive BKGD to a logic 1. The
source of this speedup pulse is the host for transmit cases and the target for receive cases.
The timing for host-to-target is shown in Figure 55 and that of target-to-host in Figure 56 and Figure 57. All four cases begin when
the host drives the BKGD pin low to generate a falling edge. Since the host and target are operating from separate clocks, it can
take the target system up to one full clock cycle to recognize this edge. The target measures delays from this perceived start of
the bit time while the host measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle
earlier. Synchronization between the host and target is established in this manner at the start of every bit time.
Figure 55 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a target system. The host
is asynchronous to the target, so there is up to a one clock-cycle delay from the host-generated falling edge to where the target
recognizes this edge as the beginning of the bit time. Ten target clock cycles later, the target senses the bit level on the BKGD
pin. Internal glitch detect logic requires the pin be driven high no later that eight target clock cycles after the falling edge for a
logic 1 transmission.
Since the host drives the high speedup pulses in these two cases, the rising edges look like digitally driven signals.
Figure 55. BDM Host-to-Target Serial Bit Timing
The receive cases are more complicated. Figure 56 shows the host receiving a logic 1 from the target system. Since the host is
asynchronous to the target, there is up to one clock-cycle delay from the host-generated falling edge on BKGD to the perceived
start of the bit time in the target. The host holds the BKGD pin low long enough for the target to recognize it (at least two target
clock cycles). The host must release the low drive before the target drives a brief high speedup pulse seven target clock cycles
after the perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it started the bit time.
Target Senses Bit
10 Cycles
Synchronization
Uncertainty
BDM Clock
(Target MCU)
Host
Transmit 1
Host
Transmit 0
Perceived
Start of Bit Time Earliest
Start of
Next Bit
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Freescale Semiconductor 190
Figure 56. BDM Target-to-Host Serial Bit Timing (Logic 1)
Figure 57 shows the host receiving a logic 0 from the target. Since the host is asynchronous to the target, there is up to a one
clock-cycle delay from the host-generated falling edge on BKGD to the start of the bit time as perceived by the target. The host
initiates the bit time but the target finishes it. Since the target wants the host to receive a logic 0, it drives the BKGD pin low for
13 target clock cycles then briefly drives it high to speed up the rising edge. The host samples the bit level about 10 target clock
cycles after starting the bit time.
Figure 57. BDM Target-to-Host Serial Bit Timing (Logic 0)
High-Impedance
Earliest
Start of
Next Bit
R-C Rise
10 Cycles
10 Cycles
Host Samples
BKGD Pin
Perceived
Start of Bit Time
BKGD Pin
BDM Clock
(Target MCU)
Host
Drive to
BKGD Pin
Target System
Speedup
Pulse
High-Impedance
High-Impedance
Earliest
Start of
Next Bit
BDM Clock
(Target MCU)
Host
Drive to
BKGD Pin
BKGD Pin
Perceived
Start of Bit Time
10 Cycles
10 Cycles
Host Samples
BKGD Pin
Target System
Drive and
Speedup Pulse
Speedup Pulse
High-Impedance
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Freescale Semiconductor 191
5.31.4.7 Serial Interface Hardware Handshake Protocol
BDM commands that require CPU execution are ultimately treated at the MCU bus rate. Since the BDM clock source can be
modified , it is very helpful to provide a handshake protocol in which the host could determine when an issued command is
executed by the CPU. . The alternative is to always wait the amount of time equal to the appropriate number of cycles at the
slowest possible rate the clock could be running. This sub-section will describe the hardware handshake protocol.
The hardware handshake protocol signals to the host controller when an issued command was successfully executed by the
target. This protocol is implemented by a 16 serial clock cycle low pulse followed by a brief speedup pulse in the BKGD pin. This
pulse is generated by the target MCU when a command, issued by the host, has been successfully executed (see Figure 58).
This pulse is referred to as the ACK pulse. After the ACK pulse has finished: the host can start the bit retrieval if the last issued
command was a read command, or start a new command if the last command was a write command or a control command
(BACKGROUND, GO, GO_UNTIL(174) or TRACE1). The ACK pulse is not issued earlier than 32 serial clock cycles after the
BDM command was issued. The end of the BDM command is assumed to be the 16th tick of the last bit. This minimum delay
assures enough time for the host to perceive the ACK pulse. Note also that, there is no upper limit for the delay between the
command and the related ACK pulse, since the command execution depends upon the CPU bus, which in some cases could be
very slow due to long accesses taking place.This protocol allows a great flexibility for the POD designers, since it does not rely
on any accurate time measurement or short response time to any event in the serial communication.
Figure 58. Target Acknowledge Pulse (ACK)
NOTE
If the ACK pulse was issued by the target, the host assumes the previous command was
executed. If the CPU enters stop prior to executing a hardware command, the ACK pulse
will not be issued meaning that the BDM command was not executed. After entering stop
mode, the BDM command is no longer pending.
Figure 59 shows the ACK handshake protocol in a command level timing diagram. The READ_BYTE instruction is used as an
example. First, the 8-bit instruction opcode is sent by the host, followed by the address of the memory location to be read. The
target BDM decodes the instruction. A bus cycle is grabbed (free or stolen) by the BDM and it executes the READ_BYTE
operation. Having retrieved the data, the BDM issues an ACK pulse to the host controller, indicating that the addressed byte is
ready to be retrieved. After detecting the ACK pulse, the host initiates the byte retrieval process. Note that data is sent in the form
of a word and the host needs to determine which is the appropriate byte based on whether the address was odd or even.
16 Cycles
BDM Clock
(Target MCU)
Target
Transmits
ACK Pulse
High-Impedance
BKGD Pin
Minimum Delay
From the BDM Command
32 Cycles
Earliest
Start of
Next Bit
Speedup Pulse
16th Tick of the
Last Command Bit
High-Impedance
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Freescale Semiconductor 192
Figure 59. Handshake Protocol at the Command Level
Differently from the normal bit transfer (where the host initiates the transmission), the serial interface ACK handshake pulse is
initiated by the target MCU by issuing a negative edge on the BKGD pin. The hardware handshake protocol in Figure 58 specifies
the timing when the BKGD pin is being driven, so the host should follow this timing constraint in order to avoid the risk of an
electrical conflict on the BKGD pin.
NOTE
The only place the BKGD pin can have an electrical conflict is when one side is driving low
and the other side is issuing a speedup pulse (high). Other “highs” are pulled rather than
driven. However, at low rates the time of the speedup pulse can become lengthy and so the
potential conflict time becomes longer as well.
The ACK handshake protocol does not support nested ACK pulses. If a BDM command is not acknowledge by an ACK pulse,
the host needs to abort the pending command first in order to be able to issue a new BDM command. When the CPU enters stop
while the host issues a hardware command (e.g., WRITE_BYTE), the target discards the incoming command due to the stop
being detected. Therefore, the command is not acknowledged by the target, which means that the ACK pulse will not be issued
in this case. After a certain time the host (not aware of stop) should decide to abort any possible pending ACK pulse in order to
be sure a new command can be issued. Therefore, the protocol provides a mechanism in which a command, and its
corresponding ACK, can be aborted.
NOTE
The ACK pulse does not provide a timeout. This means for the GO_UNTIL(174) command
that it can not be distinguished if a stop has been executed (command discarded and ACK
not issued) or if the “UNTIL” condition (BDM active) is just not reached yet. Hence in any
case where the ACK pulse of a command is not issued the possible pending command
should be aborted before issuing a new command. See the handshake abort procedure
described in Section 5.31.4.8, “Hardware Handshake Abort Procedure".
5.31.4.8 Hardware Handshake Abort Procedure
The abort procedure is based on the SYNC command. In order to abort a command, which had not issued the corresponding
ACK pulse, the host controller should generate a low pulse in the BKGD pin by driving it low for at least 128 serial clock cycles
and then driving it high for one serial clock cycle, providing a speedup pulse.By detecting this long low pulse in the BKGD pin,
the target executes the SYNC protocol, see Section 5.31.4.9, “SYNC — Request Timed Reference Pulse", and assumes that the
pending command and therefore the related ACK pulse, are being aborted. Therefore, after the SYNC protocol has been
completed the host is free to issue new BDM commands. For BDM firmware READ or WRITE commands it can not be
guaranteed that the pending command is aborted when issuing a SYNC before the corresponding ACK pulse. There is a short
latency time from the time the READ or WRITE access begins until it is finished and the corresponding ACK pulse is issued. The
latency time depends on the firmware READ or WRITE command that is issued and on the selected bus clock rate. When the
SYNC command starts during this latency time the READ or WRITE command will not be aborted, but the corresponding ACK
pulse will be aborted. A pending GO, TRACE1 or GO_UNTIL(174) command can not be aborted. Only the corresponding ACK
pulse can be aborted by the SYNC command.
Although it is not recommended, the host could abort a pending BDM command by issuing a low pulse in the BKGD pin shorter
than 128 serial clock cycles, which will not be interpreted as the SYNC command. The ACK is actually aborted when a negative
edge is perceived by the target in the BKGD pin. The short abort pulse should have at least 4 clock cycles keeping the BKGD
READ_BYTE
BDM Issues the
BKGD Pin Byte Address
BDM Executes the
READ_BYTE Command
Host Target
Host Tar ge t
BDM Decodes
the Command
ACK Pulse (out of scale)
Host Target
(2) Bytes are
Retrieved
New BDM
Command
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Freescale Semiconductor 193
pin low, in order to allow the negative edge to be detected by the target.In this case, the target will not execute the SYNC protocol
but the pending command will be aborted along with the ACK pulse. The potential problem with this abort procedure is when
there is a conflict between the ACK pulse and the short abort pulse. In this case, the target may not perceive the abort pulse. The
worst case is when the pending command is a read command (i.e., READ_BYTE). If the abort pulse is not perceived by the target
the host will attempt to send a new command after the abort pulse was issued, while the target expects the host to retrieve the
accessed memory byte. In this case, host and target will run out of synchronism. However, if the command to be aborted is not
a read command the short abort pulse could be used. After a command is aborted the target assumes the next negative edge,
after the abort pulse, is the first bit of a new BDM command.
NOTE
The details about the short abort pulse are being provided only as a reference for the reader
to better understand the BDM internal behavior. It is not recommended that this procedure
be used in a real application.
Since the host knows the target serial clock frequency, the SYNC command (used to abort a command) does not need to consider
the lower possible target frequency. In this case, the host could issue a SYNC very close to the 128 serial clock cycles length.
Providing a small overhead on the pulse length in order to assure the SYNC pulse will not be misinterpreted by the target. See
Section 5.31.4.9, “SYNC — Request Timed Reference Pulse".
Figure 60 shows a SYNC command being issued after a READ_BYTE, which aborts the READ_BYTE command. Note that, after
the command is aborted a new command could be issued by the host computer.
Figure 60. ACK Abort Procedure at the Command Level
NOTE
Figure 60 does not represent the signals in a true timing scale
Figure 61 shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could occur if a POD device is
connected to the target BKGD pin and the target is already in debug active mode. Consider that the target CPU is executing a
pending BDM command at the exact moment the POD is being connected to the BKGD pin. In this case, an ACK pulse is issued
along with the SYNC command. In this case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse.
Since this is not a probable situation, the protocol does not prevent this conflict from happening.
READ_BYTE READ_STATUSBKGD Pin Memory Address New BDM Command
New BDM Command
Host Target Host Target Host Target
SYNC Response
From the Target
(Out of Scale)
BDM Decode
and Starts to Execute
the READ_BYTE Command
READ_BYTE CMD is Aborted
by the SYNC Request
(Out of Scale)
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Freescale Semiconductor 194
Figure 61. ACK Pulse and SYNC Request Conflict
NOTE
This information is being provided so that the MCU integrator will be aware that such a
conflict could occur.
The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE BDM commands. This
provides backwards compatibility with the existing POD devices which are not able to execute the hardware handshake protocol.
It also allows for new POD devices, that support the hardware handshake protocol, to freely communicate with the target device.
If desired, without the need for waiting for the ACK pulse.
The commands are described as follows:
• ACK_ENABLE — enables the hardware handshake protocol. The target will issue the ACK pulse when a CPU
command is executed by the CPU. The ACK_ENABLE command itself also has the ACK pulse as a response.
• ACK_DISABLE — disables the ACK pulse protocol. In this case, the host needs to use the worst case delay time at the
appropriate places in the protocol.
The default state of the BDM after reset is hardware handshake protocol disabled.
All the read commands will ACK (if enabled) when the data bus cycle has completed and the data is then ready for reading out
by the BKGD serial pin. All the write commands will ACK (if enabled) after the data has been received by the BDM through the
BKGD serial pin and when the data bus cycle is complete. See Section 5.31.4.3, “BDM Hardware Commands" and
Section 5.31.4.4, “Standard BDM Firmware Commands" for more information on the BDM commands.
The ACK_ENABLE sends an ACK pulse when the command has been completed. This feature could be used by the host to
evaluate if the target supports the hardware handshake protocol. If an ACK pulse is issued in response to this command, the host
knows that the target supports the hardware handshake protocol. If the target does not support the hardware handshake protocol
the ACK pulse is not issued. In this case, the ACK_ENABLE command is ignored by the target since it is not recognized as a
valid command.
The BACKGROUND command issues an ACK pulse when the CPU changes from normal to background mode. The ACK pulse
related to this command could be aborted using the SYNC command.
The GO command issues an ACK pulse when the CPU exits from background mode. The ACK pulse related to this command
could be aborted using the SYNC command.
The GO_UNTIL(174) command is equivalent to a GO command with exception that the ACK pulse, in this case, is issued when
the CPU enters into background mode. This command is an alternative to the GO command and should be used when the host
wants to trace if a breakpoint match occurs and causes the CPU to enter active background mode. Note that the ACK is issued
whenever the CPU enters BDM, which could be caused by a breakpoint match or by a BGND instruction being executed. The
ACK pulse related to this command could be aborted using the SYNC command.
The TRACE1 command has the related ACK pulse issued when the CPU enters background active mode after one instruction
of the application program is executed. The ACK pulse related to this command could be aborted using the SYNC command.
BDM Clock
(Target MCU)
Target MCU
Drives to
BKGD Pin
BKGD Pin
16 Cycles
Speedup Pulse
High-Impedance
Host
Drives SYNC
To BKGD Pin
ACK Pulse
Host SYNC Request Pulse
At Least 128 Cycles
Electrical Conflict
Host and
Target Drive
to BKGD Pin
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Freescale Semiconductor 195
5.31.4.9 SYNC — Request Timed Reference Pulse
The SYNC command is unlike other BDM commands because the host does not necessarily know the correct communication
speed to use for BDM communications until after it has analyzed the response to the SYNC command. To issue a SYNC
command, the host should perform the following steps:
1. Drive the BKGD pin low for at least 128 cycles at the lowest possible BDM serial communication frequency
2. Drive BKGD high for a brief speedup pulse to get a fast rise time (this speedup pulse is typically one cycle of the host
clock.)
3. Remove all drive to the BKGD pin so it reverts to high impedance.
4. Listen to the BKGD pin for the sync response pulse.
Upon detecting the SYNC request from the host, the target performs the following steps:
1. Discards any incomplete command received or bit retrieved.
2. Waits for BKGD to return to a logic one.
3. Delays 16 cycles to allow the host to stop driving the high speedup pulse.
4. Drives BKGD low for 128 cycles at the current BDM serial communication frequency.
5. Drives a one-cycle high speedup pulse to force a fast rise time on BKGD.
6. Removes all drive to the BKGD pin so it reverts to high impedance.
The host measures the low time of this 128 cycle SYNC response pulse and determines the correct speed for subsequent BDM
communications. Typically, the host can determine the correct communication speed within a few percent of the actual target
speed and the communication protocol can easily tolerate speed errors of several percent.
As soon as the SYNC request is detected by the target, any partially received command or bit retrieved is discarded. This is
referred to as a soft-reset, equivalent to a time-out in the serial communication. After the SYNC response, the target will consider
the next negative edge (issued by the host) as the start of a new BDM command or the start of new SYNC request.
Another use of the SYNC command pulse is to abort a pending ACK pulse. The behavior is exactly the same as in a regular
SYNC command. Note that one of the possible causes for a command to not be acknowledged by the target is a host-target
synchronization problem. In this case, the command may not have been understood by the target and so an ACK response pulse
will not be issued.
5.31.4.10 Instruction Tracing
When a TRACE1 command is issued to the BDM in active BDM, the CPU exits the standard BDM firmware and executes a single
instruction in the user code. Once this has occurred, the CPU is forced to return to the standard BDM firmware and the BDM is
active and ready to receive a new command. If the TRACE1 command is issued again, the next user instruction will be executed.
This facilitates stepping or tracing through the user code one instruction at a time.
If an interrupt is pending when a TRACE1 command is issued, the interrupt stacking operation occurs but no user instruction is
executed. Once back in standard BDM firmware execution, the program counter points to the first instruction in the interrupt
service routine.
Be aware when tracing through the user code that the execution of the user code is done step by step but peripherals are free
running. Hence possible timing relations between CPU code execution and occurrence of events of other peripherals no longer
exist.
Do not trace the CPU instruction BGND used for soft breakpoints. Tracing over the BGND instruction will result in a return address
pointing to BDM firmware address space.
When tracing through user code which contains stop instructions the following will happen when the stop instruction is traced:
The CPU enters stop mode and the TRACE1 command can not be finished before leaving the low power mode. This is
the case because BDM active mode can not be entered after CPU executed the stop instruction. However all BDM
hardware commands except the BACKGROUND command are operational after tracing a stop instruction and still being
in stop mode. If system stop mode is entered (all bus masters are in stop mode) no BDM command is operational.
As soon as stop mode is exited the CPU enters BDM active mode and the saved PC value points to the entry of the
corresponding interrupt service routine.
In case the handshake feature is enabled the corresponding ACK pulse of the TRACE1 command will be discarded
when tracing a stop instruction. Hence there is no ACK pulse when BDM active mode is entered as part of the TRACE1
command after CPU exited from stop mode. All valid commands sent during CPU being in stop mode or after CPU
exited from stop mode will have an ACK pulse. The handshake feature becomes disabled only when system stop mode
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 196
has been reached. Hence after a system stop mode the handshake feature must be enabled again by sending the
ACK_ENABLE command.
5.31.4.11 Serial Communication Timeout
The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If BKGD is kept low for more
than 128 target clock cycles, the target understands that a SYNC command was issued. In this case, the target will keep waiting
for a rising edge on BKGD in order to answer the SYNC request pulse. If the rising edge is not detected, the target will keep
waiting forever without any timeout limit.
Consider now the case where the host returns BKGD to logic one before 128 cycles. This is interpreted as a valid bit transmission,
and not as a SYNC request. The target will keep waiting for another falling edge marking the start of a new bit. If, however, a new
falling edge is not detected by the target within 512 clock cycles since the last falling edge, a timeout occurs and the current
command is discarded without affecting memory or the operating mode of the MCU. This is referred to as a soft-reset.
If a read command is issued but the data is not retrieved within 512 serial clock cycles, a soft-reset will occur causing the
command to be disregarded. The data is not available for retrieval after the timeout has occurred. This is the expected behavior
if the handshake protocol is not enabled. In order to allow the data to be retrieved even with a large clock frequency mismatch
(between BDM and CPU) when the hardware handshake protocol is enabled, the time out between a read command and the
data retrieval is disabled. Therefore, the host could wait for more then 512 serial clock cycles and still be able to retrieve the data
from an issued read command. However, once the handshake pulse (ACK pulse) is issued, the timeout feature is re-activated,
meaning that the target will time out after 512 clock cycles. Therefore, the host needs to retrieve the data within a 512 serial clock
cycles time frame after the ACK pulse had been issued. After that period, the read command is discarded and the data is no
longer available for retrieval. Any negative edge in the BKGD pin after the timeout period is considered to be a new command or
a SYNC request.
Note that whenever a partially issued command, or partially retrieved data, has occurred the timeout in the serial communication
is active. This means that if a time frame higher than 512 serial clock cycles is observed between two consecutive negative edges
and the command being issued or data being retrieved is not complete, a soft-reset will occur causing the partially received
command or data retrieved to be disregarded. The next negative edge in the BKGD pin, after a soft-reset has occurred, is
considered by the target as the start of a new BDM command, or the start of a SYNC request pulse.
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5.32 S12S Debug Module (S12SDBGV2)
5.32.1 Introduction
The S12SDBG module provides an on-chip trace buffer with flexible triggering capability to allow non-intrusive debug of
application software. The S12SDBG module is optimized for S12SCPU debugging.
Typically the S12SDBG module is used in conjunction with the S12SBDM module, whereby the user configures the S12SDBG
module for a debugging session over the BDM interface. Once configured the S12SDBG module is armed and the device leaves
BDM returning control to the user program, which is then monitored by the S12SDBG module. Alternatively the S12SDBG
module can be configured over a serial interface using SWI routines.
5.32.1.1 Glossary Of Terms
COF: Change Of Flow. Change in the program flow due to a conditional branch, indexed jump or interrupt.
BDM: Background Debug Mode
S12SBDM: Background Debug Module
DUG: Device User Guide, describing the features of the device into which the DBG is integrated.
WORD: 16 bit data entity
Data Line: 20 bit data entity
CPU: S12SCPU module
DBG: S12SDBG module
POR: Power On Reset
Tag: Tags can be attached to CPU opcodes as they enter the instruction pipe. If the tagged opcode reaches the execution stage
a tag hit occurs.
5.32.1.2 Overview
The comparators monitor the bus activity of the CPU module. A match can initiate a state sequencer transition. On a transition
to the Final State, bus tracing is triggered and/or a breakpoint can be generated.
Independent of comparator matches a transition to Final State with associated tracing and breakpoint can be triggered
immediately by writing to the TRIG control bit.
The trace buffer is visible through a 2-byte window in the register address map and can be read out using standard 16-bit word
reads. Tracing is disabled when the MCU system is secured.
5.32.1.3 Features
• Three comparators (A, B and C)
— Comparators A compares the full address bus and full 16-bit data bus
— Comparator A features a data bus mask register
— Comparators B and C compare the full address bus only
— Each comparator features selection of read or write access cycles
— Comparator B allows selection of byte or word access cycles
— Comparator matches can initiate state sequencer transitions
• Three comparator modes
— Simple address/data comparator match mode
— Inside address range mode, Addmin Address Addmax
— Outside address range match mode, Address Addminor Address Addmax
• Two types of matches
— Tagged — This matches just before a specific instruction begins execution
— Force — This is valid on the first instruction boundary after a match occurs
• Two types of breakpoints
— CPU breakpoint entering BDM on breakpoint (BDM)
— CPU breakpoint executing SWI on breakpoint (SWI)
• Trigger mode independent of comparators
— TRIG Immediate software trigger
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• Four trace modes
— Normal: change of flow (COF) PC information is stored (see Section 5.32.4.5.2.1, “Normal Mode") for change of
flow definition.
— Loop1: same as Normal but inhibits consecutive duplicate source address entries
— Detail: address and data for all cycles except free cycles and opcode fetches are stored
— Compressed Pure PC: all program counter addresses are stored
• 4-stage state sequencer for trace buffer control
— Tracing session trigger linked to Final State of state sequencer
— Begin and End alignment of tracing to trigger
5.32.1.4 Modes of Opera tio n
The DBG module can be used in all MCU functional modes.
During BDM hardware accesses and whilst the BDM module is active, CPU monitoring is disabled. When the CPU enters active
BDM Mode through a BACKGROUND command, the DBG module, if already armed, remains armed.
The DBG module tracing is disabled if the MCU is secure, however, breakpoints can still be generated
5.32.1.5 Block Diagram
Figure 62. Debug Module Block Diagram
Ta ble 269. Mode Dependent Restriction Summary
BDM
Enable BDM
Active MCU
Secure Comparator
Matches Enabled Breakpoints
Possible Tagging
Possible Tracing
Possible
x x 1 Yes Yes Yes No
0 0 0 Yes Only SWI Yes Yes
0 1 0 Active BDM not possible when not enabled
1 0 0 Yes Yes Yes Yes
110 No No No No
CPU BUS
TRACE BUFFER
BUS INTERFACE
TRANSITION
MATCH0
STATE
COMPARATOR B
COMPARATOR C
COMPARATOR A
STATE SEQUENCER
MATCH1
MATCH2
TRACE
READ TRACE DATA (DBG READ DATA BUS)
CONTROL
SECURE
BREAKPOINT REQUESTS
COMPARATOR
MATCH CONTROL
TRIGGER
TAG &
MATCH
CONTROL
LOGIC
TAGS
TAGHITS
STATE
TO CPU
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5.32.2 External Signal Description
There are no external signals associated with this module.
5.32.3 Memory Map and Registers
5.32.3.1 Module Memory Map
A summary of the registers associated with the DBG sub-block is shown in Figure 270. Detailed descriptions of the registers and
bits are given in the subsections that follow.
Table 270. Quick Reference to DBG Registers
Address Name Bit 7 6 5 4 3 2 1 Bit 0
0x0020 DBGC1 RARM 00
BDM DBGBRK 0COMRV
WTRIG
0x0021 DBGSR RTBF
(176) 0 0 0 0 SSF2 SSF1 SSF0
W
0x0022 DBGTCR R0 TSOURCE 00 TRCMOD 0TALIGN
W
0x0023 DBGC2 R000000 ABCM
W
0x0024 DBGTBH R Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
0x0025 DBGTBL RBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
W
0x0026 DBGCNT R TBF 0 CNT
W
0x0027 DBGSCRX R0000
SC3 SC2 SC1 SC0
W
0x0027 DBGMFR R00000MC2MC1MC0
W
0x0028 DBGACTL RSZE SZ TAG BRK RW RWE NDB COMPE
W
0x0028 DBGBCTL RSZE SZ TAG BRK RW RWE 0COMPE
W
0x0028 DBGCCTL R0 0 TAG BRK RW RWE 0COMPE
W
0x0029 DBGXAH R000000
Bit 17 Bit 16
W
0x002A DBGXAM RBit 15 14 13 12 11 10 9 Bit 8
W
0x002B DBGXAL RBit 76 5 4 3 2 1Bit 0
W
0x002C DBGADH RBit 15 14 13 12 11 10 9 Bit 8
W
0x002D DBGADL RBit 76 5 4 3 2 1Bit 0
W
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5.32.3.2 Register Descrip tion s
This section consists of the DBG control and trace buffer register descriptions in address order. Each comparator has a bank of
registers that are visible through an 8-byte window between 0x0028 and 0x002F in the DBG module register address map. When
ARM is set in DBGC1, the only bits in the DBG module registers that can be written are ARM, TRIG, and COMRV[1:0]
5.32.3.2.1 Debug Control Register 1 (D BGC1)
Read: Anytime
Write: Bits 7, 1, 0 anytime
Bit 6 can be written anytime but always reads back as 0.
Bits 4:3 anytime DBG is not armed.
NOTE
When disarming the DBG by clearing ARM with software, the contents of bits[4:3] are not
affected by the write, since up until the write operation, ARM = 1 preventing these bits from
being written. These bits must be cleared using a second write if required.
0x002E DBGADHM RBit 15 14 13 12 11 10 9 Bit 8
W
0x002F DBGADLM RBit 76 5 4 3 2 1Bit 0
W
Note:
176. This bit is visible at DBGCNT[7] and DBGSR[7]
177. This represents the contents if the Comparator A control register is blended into this address.
178. This represents the contents if the Comparator B control register is blended into this address.
179. This represents the contents if the Comparator C control register is blended into this address.
Ta ble 271. Debug Control Register (DBGC1)
Address: 0x0020
76543210
RARM 00
BDM DBGBRK 0COMRV
WTRIG
Reset00000000
= Unimplemented or Reserved
Table 270. Quick Reference to DBG Registers
Address Name Bit 7 6 5 4 3 2 1 Bit 0
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5.32.3.2.2 Debug St atus Register (DBGSR)
Read: Anytime
Write: Never
Table 272. DBGC1 Field Descriptions
Field Description
7
ARM
Arm Bit — The ARM bit controls whether the DBG module is armed. This bit can be set and cleared by user software and is
automatically cleared on completion of a debug session, or if a breakpoint is generated with tracing not enabled. On setting
this bit the state sequencer enters State1.
0 Debugger disarmed
1 Debugger armed
6
TRIG
Immediate Trigger Request Bit — This bit when written to 1 requests an immediate trigger independent of state sequencer
status. When tracing is complete a forced breakpoint may be generated depending upon DBGBRK and BDM bit settings. This
bit always reads back a 0. Writing a 0 to this bit has no effect. If the DBGTCR_TSOURCE bit is clear no tracing is carried out.
If tracing has already commenced using BEGIN trigger alignment, it continues until the end of the tracing session as defined
by the TALIGN bit, thus TRIG has no affect. In secure mode tracing is disabled and writing to this bit cannot initiate a tracing
session.
The session is ended by setting TRIG and ARM simultaneously.
0 Do not trigger until the state sequencer enters the Final State.
1 Trigger immediately
4
BDM
Background Debug Mode Enable — This bit determines if a breakpoint causes the system to enter Background Debug Mode
(BDM) or initiate a Software Interrupt (SWI). If this bit is set but the BDM is not enabled by the ENBDM bit in the BDM module,
then breakpoints default to SWI.
0 Breakpoint to Software Interrupt if BDM inactive. Otherwise no breakpoint.
1 Breakpoint to BDM, if BDM enabled. Otherwise breakpoint to SWI
3
DBGBRK
S12SDBG Breakpoint Enable Bit — The DBGBRK bit controls whether the debugger will request a breakpoint on reaching
the state sequencer Final State. If tracing is enabled, the breakpoint is generated on completion of the tracing session. If tracing
is not enabled, the breakpoint is generated immediately.
0 No Breakpoint generated
1 Breakpoint generated
1–0
COMRV
Comparator Register Visibility Bit s — These bits determine which bank of comparator register is visible in the 8-byte window
of the S12SDBG module address map, located between 0x0028 to 0x002F. Furthermore these bits determine which register
is visible at the address 0x0027. See Table 273.
Table 273. COMRV Encoding
COMRV Visible Comparator Visible Register at 0x0027
00 Comparator A DBGSCR1
01 Comparator B DBGSCR2
10 Comparator C DBGSCR3
11 None DBGMFR
Table 274. Debug Status Register (DBGSR)
Address: 0x0021
76543210
R TBF 0 0 0 0 SSF2 SSF1 SSF0
W
Reset
POR
—
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
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5.32.3.2.3 Debug Trace Control Register (DBGTCR)
Read: Anytime
Write: Bit 6 only when DBG is neither secure nor armed.Bits 3,2,0 anytime the module is disarmed.
Ta ble 275. DBGSR Field Descriptions
Field Description
7
TBF
Trace Buffer Full — The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was last armed. If
this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits. The TBF bit is cleared when ARM in
DBGC1 is written to a one. The TBF is cleared by the power on reset initialization. Other system generated resets have no
affect on this bit
This bit is also visible at DBGCNT[7]
2–0
SSF[2:0]
St ate Sequencer Flag Bits — The SSF bits indicate in which state the State Sequencer is currently in. During a debug session
on each transition to a new state these bits are updated. If the debug session is ended by software clearing the ARM bit, then
these bits retain their value to reflect the last state of the state sequencer before disarming. If a debug session is ended by an
internal event, then the state sequencer returns to state0 and these bits are cleared to indicate that state0 was entered during
the session. On arming the module the state sequencer enters state1 and these bits are forced to SSF[2:0] = 001. See
Tab l e 2 7 6 .
Table 276. SSF[2:0] — State Sequence Flag Bit Encoding
SSF[2:0] Current State
000 State0 (disarmed)
001 State1
010 State2
011 State3
100 Final State
101,110,111 Reserved
Table 277. Debug Trace Control Register (DBGTCR)
Address: 0x0022
76543210
R0
TSOURCE 00 TRCMOD 0TALIGN
W
Reset00000000
Ta ble 278. DBGTCR Field Descriptions
Field Description
6
TSOURCE
Trace Source Control Bit — The TSOURCE bit enables a tracing session given a trigger condition. If the MCU system is
secured, this bit cannot be set and tracing is inhibited.
This bit must be set to read the trace buffer.
0 Debug session without tracing requested
1 Debug session with tracing requested
3–2
TRCMOD
T race Mode Bit s — See Section 5.32.4.5.2, “Trace Modes" for detailed Trace Mode descriptions. In Normal Mode, change of
flow information is stored. In Loop1 Mode, change of flow information is stored but redundant entries into trace memory are
inhibited. In Detail Mode, address and data for all memory and register accesses is stored. In Compressed Pure PC mode the
program counter value for each instruction executed is stored. See Table 279.
0
TALIGN
Trigger Align Bit — This bit controls whether the trigger is aligned to the beginning or end of a tracing session.
0 Trigger at end of stored data
1 Trigger before storing data
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5.32.3.2.4 Debug Control Register2 (DBGC2)
Read: Anytime
Write: Anytime the module is disarmed.
This register configures the comparators for range matching.
5.32.3.2.5 Debug Trace Buffer Register (DBGTBH:DBGTBL)
Read: Only when unlocked AND unsecured AND not armed AND TSOURCE set.
Write: Aligned word writes when disarmed unlock the trace buffer for reading but do not affect trace buffer contents.
Table 279. TRCMOD Trace Mode Bit Encoding
TRCMOD Description
00 Normal
01 Loop1
10 Detail
11 Compressed Pure PC
Table 280. Debug Control Register2 (DBGC2)
Address: 0x0023
76543210
R000000 ABCM
W
Reset00000000
= Unimplemented or Reserved
Table 281. DBGC2 Field Descriptions
Field Description
1–0
ABCM[1:0]
A and B Comparator Match Control — These bits determine the A and B comparator match mapping as described in Table 282.
Table 282. ABCM Encoding
ABCM Description
00 Match0 mapped to comparator A match: Match1 mapped to comparator B match.
01 Match 0 mapped to comparator A/B inside range: Match1 disabled.
10 Match 0 mapped to comparator A/B outside range: Match1 disabled.
11 Reserved(180)
Note:
180. Currently defaults to Comparator A, Comparator B disabled
Table 283. Debug Trace Buffer Register (DBGTB)
Address: 0x0024, 0x0025
1514131211109876543210
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
PORXXXXXXXXXXXXXXXX
Other
Resets ————————————————
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5.32.3.2.6 Debug Count Register (DBGCNT)
Read: Anytime
Write: Never
Table 284. DBGTB Field Descriptions
Field Description
15–0
Bit[15:0]
Trace Buffer Data Bit s — The Trace Buffer Register is a window through which the 20-bit wide data lines of the Trace Buffer
may be read 16 bits at a time. Each valid read of DBGTB increments an internal trace buffer pointer which points to the next
address to be read. When the ARM bit is set the trace buffer is locked to prevent reading. The trace buffer can only be unlocked
for reading by writing to DBGTB with an aligned word write when the module is disarmed. The DBGTB register can be read
only as an aligned word, any byte reads or misaligned access of these registers return 0 and do not cause the trace buffer
pointer to increment to the next trace buffer address. Similarly reads while the debugger is armed or with the TSOURCE bit
clear, return 0 and do not affect the trace buffer pointer. The POR state is undefined. Other resets do not affect the trace buffer
contents.
Ta ble 285. Debug Count Register (DBGCNT)
Address: 0x0026
76543210
R TBF 0 CNT
W
Reset
POR
—
0
—
0
—
0
—
0
—
0
—
0
—
0
—
0
= Unimplemented or Reserved
Ta ble 286. DBGCNT Field Descriptions
Field Description
7
TBF
Trace Buffer Full — The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was last armed. If
this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits. The TBF bit is cleared when ARM in
DBGC1 is written to a one. The TBF is cleared by the power on reset initialization. Other system generated resets have no
affect on this bit
This bit is also visible at DBGSR[7]
5–0
CNT[5:0]
Count Value — The CNT bits indicate the number of valid data 20-bit data lines stored in the Trace Buffer. Table 287 shows
the correlation between the CNT bits and the number of valid data lines in the Trace Buffer. When the CNT rolls over to zero,
the TBF bit in DBGSR is set and incrementing of CNT will continue in end-trigger mode. The DBGCNT register is cleared when
ARM in DBGC1 is written to a one. The DBGCNT register is cleared by power-on-reset initialization but is not cleared by other
system resets. Thus should a reset occur during a debug session, the DBGCNT register still indicates after the reset, the
number of valid trace buffer entries stored before the reset occurred. The DBGCNT register is not decremented when reading
from the trace buffer.
Table 287. CNT Decoding Table
TBF CNT[5:0] Description
0 000000 No data valid
0
000001
000010
000100
000110
…
111111
1 line valid
2 lines valid
4 lines valid
6 lines valid
…
63 lines valid
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5.32.3.2.7 Debug St ate Control Registers
There is a dedicated control register for each of the state sequencer states 1 to 3 that determines if transitions from that state are
allowed, depending upon comparator matches or tag hits, and defines the next state for the state sequencer following a match.
The three debug state control registers are located at the same address in the register address map (0x0027). Each register can
be accessed using the COMRV bits in DBGC1 to blend in the required register. The COMRV = 11 value blends in the match flag
register (DBGMFR).
5.32.3.2.7.1 Debug State Control Register 1 (DBGSCR1)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG is not armed.
This register is visible at 0x0027 only with COMRV[1:0] = 00. The state control register 1 selects the targeted next state whilst in
State1. The matches refer to the match channels of the comparator match control logic as depicted in Figure 62 and described
in Section 5.32.3.2.8.1, “Debug Comparator Control Register (DBGXCTL)". Comparators must be enabled by setting the
comparator enable bit in the associated DBGXCTL control register.
1 000000 64 lines valid; if using Begin trigger alignment,
ARM bit will be cleared and the tracing session ends.
1
000001
…
…
111110
64 lines valid,
oldest data has been overwritten by most recent data
Ta ble 288. State Control Register Access Encoding
COMRV Visible State Control Register
00 DBGSCR1
01 DBGSCR2
10 DBGSCR3
11 DBGMFR
Table 289. Debug State Control Register 1 (DBGSCR1)
Address: 0x0027
76543210
R0 0 0 0 SC3 SC2 SC1 SC0
W
Reset00000000
= Unimplemented or Reserved
Table 290. DBGSCR1 Field Descriptions
Field Description
3–0
SC[3:0]
These bits select the targeted next state whilst in State1, based upon the match event.
Tabl e 291. State1 Sequencer Next State Selection
SC[3:0] Description (Unspecified match es have no effect)
0000 Any match to Final State
0001 Match1 to State3
Table 287. CNT Decoding Table
TBF CNT[5:0] Description
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The priorities described in Table 324 dictate that in the case of simultaneous matches, a match leading to final state has priority
followed by the match on the lower channel number (0,1,2). Thus with SC[3:0]=1101 a simultaneous match0/match1 transitions
to final state.
5.32.3.2.7.2 Debug State Control Register 2 (DBGSCR2)
Read: If COMRV[1:0] = 01
Write: If COMRV[1:0] = 01 and DBG is not armed.
This register is visible at 0x0027 only with COMRV[1:0] = 01. The state control register 2 selects the targeted next state whilst in
State2. The matches refer to the match channels of the comparator match control logic as depicted in Figure 62 and described
in Section 5.32.3.2.8.1, “Debug Comparator Control Register (DBGXCTL)". Comparators must be enabled by setting the
comparator enable bit in the associated DBGXCTL control register.
0010 Match2 to State2
0011 Match1 to State2
0100 Match0 to State2....... Match1 to State3
0101 Match1 to State3.........Match0 to Final State
0110 Match0 to State2....... Match2 to State3
0111 Either Match0 or Match1 to State2
1000 Reserved
1001 Match0 to State3
1010 Reserved
1011 Reserved
1100 Reserved
1101 Either Match0 or Match2 to Final State........Match1 to State2
1110 Reserved
1111 Reserved
Table 292. Debug State Control Register 2 (DBGSCR2)
Address: 0x0027
76543210
R0 0 0 0 SC3 SC2 SC1 SC0
W
Reset00000000
= Unimplemented or Reserved
Table 293. DBGSCR2 Field Descriptions
Field Description
3–0
SC[3:0]
These bits select the targeted next state whilst in State2, based upon the match event.
Ta ble 294. State2 —Sequence r Next State Selection
SC[3:0] Description (Unspecified matches have no effect)
0000 Match0 to State1....... Match2 to State3.
0001 Match1 to State3
Tabl e 291. State1 Sequencer Next State Selection
SC[3:0] Description (Unspecified match es have no effect)
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The priorities described in Table 324 dictate that in the case of simultaneous matches, a match leading to final state has priority
followed by the match on the lower channel number (0,1,2)
5.32.3.2.7.3 Debug State Control Register 3 (DBGSCR3)
Read: If COMRV[1:0] = 10
Write: If COMRV[1:0] = 10 and DBG is not armed.
This register is visible at 0x0027 only with COMRV[1:0] = 10. The state control register three selects the targeted next state whilst
in State3. The matches refer to the match channels of the comparator match control logic as depicted in Figure 62 and described
in Section 5.32.3.2.8.1, “Debug Comparator Control Register (DBGXCTL)". Comparators must be enabled by setting the
comparator enable bit in the associated DBGXCTL control register.
0010 Match2 to State3
0011 Match1 to State3....... Match0 Final State
0100 Match1 to State1....... Match2 to State3.
0101 Match2 to Final State
0110 Match2 to State1..... Match0 to Final State
0111 Either Match0 or Match1 to Final State
1000 Reserved
1001 Reserved
1010 Reserved
1011 Reserved
1100 Either Match0 or Match1 to Final State........Match2 to State3
1101 Reserved
1110 Reserved
1111 Either Match0 or Match1 to Final State........Match2 to State1
Table 295. Debug State Control Register 3 (DBGSCR3)
Address: 0x0027
76543210
R0 0 0 0 SC3 SC2 SC1 SC0
W
Reset00000000
= Unimplemented or Reserved
Table 296. DBGSCR3 Field Descriptions
Field Description
3–0
SC[3:0]
These bits select the targeted next state whilst in State3, based upon the match event.
Ta ble 297. State3 — Sequencer Next State Selection
SC[3:0] Description (Unspecified matches have no effect)
0000 Match0 to State1
0001 Match2 to State2........ Match1 to Final State
0010 Match0 to Final State....... Match1 to State1
Ta ble 294. State2 —Sequence r Next State Selection
SC[3:0] Description (Unspecified matches have no effect)
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The priorities described in Table 324 dictate that in the case of simultaneous matches, a match leading to final state has priority
followed by the match on the lower channel number (0,1,2).
5.32.3.2.7.4 Debug Match Flag Register (DBGMFR)
Read: If COMRV[1:0] = 11
Write: Never
DBGMFR is visible at 0x0027 only with COMRV[1:0] = 11. It features 3 flag bits each mapped directly to a channel. Should a
match occur on the channel during the debug session, then the corresponding flag is set and remains set until the next time the
module is armed by writing to the ARM bit. Thus the contents are retained after a debug session for evaluation purposes. These
flags cannot be cleared by software, they are cleared only when arming the module. A set flag does not inhibit the setting of other
flags. Once a flag is set, further comparator matches on the same channel in the same session have no affect on that flag.
5.32.3.2.8 Comp arator Register Descriptions
Each comparator has a bank of registers that are visible through an 8-byte window in the DBG module register address map.
Comparator A consists of 8 register bytes (3 address bus compare registers, two data bus compare registers, two data bus mask
registers and a control register). Comparator B consists of four register bytes (three address bus compare registers and a control
register). Comparator C consists of four register bytes (three address bus compare registers and a control register).
Each set of comparator registers can be accessed using the COMRV bits in the DBGC1 register. Unimplemented registers (e.g.
Comparator B data bus and data bus masking) read as zero and cannot be written. The control register for comparator B differs
from those of comparators A and C.
0011 Match1 to Final State....... Match2 to State1
0100 Match1 to State2
0101 Match1 to Final State
0110 Match2 to State2........ Match0 to Final State
0111 Match0 to Final State
1000 Reserved
1001 Reserved
1010 Either Match1 or Match2 to State1....... Match0 to Final State
1011 Reserved
1100 Reserved
1101 Either Match1 or Match2 to Final State....... Match0 to State1
1110 Match0 to State2....... Match2 to Final State
1111 Reserved
Table 298. Debug Match Flag Register (DBGMFR)
Address: 0x0027
76543210
R 0 0 0 0 0 MC2 MC1 MC0
W
Reset00000000
= Unimplemented or Reserved
Ta ble 297. State3 — Sequencer Next State Selection
SC[3:0] Description (Unspecified matches have no effect)
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5.32.3.2.8.1 Debug Comparator Control Register (DBGXCTL)
The contents of this register bits 7 and 6 differ depending upon which comparator registers are visible in the 8-byte window of the
DBG module register address map.
Read: DBGACTL if COMRV[1:0] = 00
DBGBCTL if COMRV[1:0] = 01
DBGCCTL if COMRV[1:0] = 10
Write: DBGACTL if COMRV[1:0] = 00 and DBG not armed
DBGBCTL if COMRV[1:0] = 01 and DBG not armed
DBGCCTL if COMRV[1:0] = 10 and DBG not armed
Table 299. Comparator Register Layout
0x0028 CONTROL Read/Write Comparators A,B and C
0x0029 ADDRESS HIGH Read/Write Comparators A,B and C
0x002A ADDRESS MEDIUM Read/Write Comparators A,B and C
0x002B ADDRESS LOW Read/Write Comparators A,B and C
0x002C DATA HIGH COMPARATOR Read/Write Comparator A only
0x002D DATA LOW COMPARATOR Read/Write Comparator A only
0x002E DATA HIGH MASK Read/Write Comparator A only
0x002F DATA LOW MASK Read/Write Comparator A only
Table 300. Debug Comparator Control Register DBGACTL (Comparator A)
Address: 0x0028
76543210
RSZE SZ TAG BRK RW RWE NDB COMPE
W
Reset00000000
= Unimplemented or Reserved
Table 301. Debug Comparator Control Register DBGBCTL (Comparator B)
Address: 0x0028
76543210
RSZE SZ TAG BRK RW RWE 0COMPE
W
Reset00000000
= Unimplemented or Reserved
Table 302. Debug Comparator Control Register DBGCCTL (Comparator C)
Address: 0x0028
76543210
R0 0 TAG BRK RW RWE 0COMPE
W
Reset00000000
= Unimplemented or Reserved
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Table 304 shows the effect for RWE and RW on the comparison conditions. These bits are ignored if the corresponding TAG bit
is set since the match occurs based on the tagged opcode reaching the execution stage of the instruction queue.
Table 303. DBGXCTL Field Descriptions
Field Description
7
SZE
(Comparators
A and B)
Size Comparator Enable Bit — The SZE bit controls whether access size comparison is enabled for the associated
comparator. This bit is ignored if the TAG bit in the same register is set.
0 Word/Byte access size is not used in comparison
1 Word/Byte access size is used in comparison
6
SZ
(Comparators
A and B)
Size Comparator Value Bit — The SZ bit selects either word or byte access size in comparison for the associated
comparator. This bit is ignored if the SZE bit is cleared or if the TAG bit in the same register is set.
0 Word access size is compared
1 Byte access size is compared
5
TAG
T ag Select — This bit controls whether the comparator match has immediate effect, causing an immediate state sequencer
transition or tag the opcode at the matched address. Tagged opcodes trigger only if they reach the execution stage of the
instruction queue.
0 Allow state sequencer transition immediately on match
1 On match, tag the opcode. If the opcode is about to be executed allow a state sequencer transition
4
BRK
Break — This bit controls whether a comparator match terminates a debug session immediately, independent of state
sequencer state. To generate an immediate breakpoint the module breakpoints must be enabled using the DBGC1 bit
DBGBRK.
0 The debug session termination is dependent upon the state sequencer and trigger conditions.
1 A match on this channel terminates the debug session immediately; breakpoints if active are generated, tracing,
if active, is terminated and the module disarmed.
3
RW
Read/Write Comparator Value Bit — The RW bit controls whether read or write is used in compare for the associated
comparator. The RW bit is not used if RWE = 0. This bit is ignored if the TAG bit in the same register is set.
0 Write cycle is matched1 Read cycle is matched
2
RWE
Read/Write Enable Bit — The RWE bit controls whether read or write comparison is enabled for the associated
comparator.This bit is ignored if the TAG bit in the same register is set
0 Read/Write is not used in comparison
1 Read/Write is used in comparison
1
NDB
(Comparator A)
Not Data Bus — The NDB bit controls whether the match occurs when the data bus matches the comparator register value
or when the data bus differs from the register value. This bit is ignored if the TAG bit in the same register is set. This bit is
only available for comparator A.
0 Match on data bus equivalence to comparator register contents
1 Match on data bus difference to comparator register contents
0
COMPE
Determines if comparator is enabled
0 The comparator is not enabled
1 The comparator is enabled
Tabl e 304. Read or Write Comparison Logic Table
RWE Bit RW Bit RW Signal Comment
0 x 0 RW not used in comparison
0 x 1 RW not used in comparison
1 0 0 Write data bus
1 0 1 No match
11 0 No match
1 1 1 Read data bus
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5.32.3.2.8.2 Debug Comparator Address High Register (DBGXAH)
The DBGC1_COMRV bits determine which comparator address registers are visible in the 8-byte window from 0x0028 to 0x002F
as shown in Table 306 .
Read: Anytime. See Table 306 for visible register encoding.
Write: If DBG not armed. See Table 306 for visible register encoding.
5.32.3.2.8.3 Debug Comparator Address Mid Register (DBGXAM)
Read: Anytime. See Table 306 for visible register encoding.
Write: If DBG not armed. See Table 306 for visible register encoding.
Table 305. Debug Comparator Address High Register (DBGXAH)
Address: 0x0029
76543210
R000000
Bit 17 Bit 16
W
Reset00000000
= Unimplemented or Reserved
Tabl e 306. Comparator Address Register Visibility
COMRV Visible Comparator
00 DBGAAH, DBGAAM, DBGAAL
01 DBGBAH, DBGBAM, DBGBAL
10 DBGCAH, DBGCAM, DBGCAL
11 None
Table 307. DBGXAH Field Descriptions
Field Description
1–0
Bit[17:16]
Comparator Address High Compare Bits — The Comparator address high compare bits control whether the selected
comparator compares the address bus bits [17:16] to a logic one or logic zero.
0 Compare corresponding address bit to a logic zero
1 Compare corresponding address bit to a logic one
Table 308. Debug Comparator Address Mid Register (DBGXAM)
Address: 0x002A
76543210
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
Reset00000000
Table 309. DBGXAM Field Descriptions
Field Description
7–0
Bit[15:8]
Comparator Address Mid Compare Bits — The Comparator address mid compare bits control whether the selected
comparator compares the address bus bits [15:8] to a logic one or logic zero.
0 Compare corresponding address bit to a logic zero
1 Compare corresponding address bit to a logic one
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5.32.3.2.8.4 Debug Comparator Address Low Register (DBGXAL)
Read: Anytime. See Table 306 for visible register encoding.
Write: If DBG not armed. See Table 306 for visible register encoding.
5.32.3.2.8.5 Debug Comparator Data High Register (DBGADH)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG not armed.
5.32.3.2.8.6 Debug Comparator Data Low Register (DBGADL)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG not armed.
Table 310. Debug Comparator Address Low Register (DBGXAL)
Address: 0x002B
76543210
RBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
W
Reset00000000
Table 311. DBGXAL Field Descriptions
Field Description
7–0
Bits[7:0]
Comparator Address Low Compare Bits — The Comparator address low compare bits control whether the selected
comparator compares the address bus bits [7:0] to a logic one or logic zero.
0 Compare corresponding address bit to a logic zero
1 Compare corresponding address bit to a logic one
Table 312. Debug Comparator Data High Register (DBGADH)
Address: 0x002C
76543210
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
Reset00000000
Table 313. DBGADH Field Descriptions
Field Description
7–0
Bits[15:8]
Comparator Data High Compare Bits— The Comparator data high compare bits control whether the selected comparator
compares the data bus bits [15:8] to a logic one or logic zero. The comparator data compare bits are only used in comparison
if the corresponding data mask bit is logic 1. This register is available only for comparator A. Data bus comparisons are only
performed if the TAG bit in DBGACTL is clear.
0 Compare corresponding data bit to a logic zero
1 Compare corresponding data bit to a logic one
Table 314. Debug Comparator Data Low Register (DBGADL)
Address: 0x002D
76543210
RBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
W
Reset00000000
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5.32.3.2.8.7 Debug Comparator Data High Mask Register (DBGADHM)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG not armed.
5.32.3.2.8.8 Debug Comparator Data Low Mask Register (DBGADLM)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG not armed.
Ta ble 315. DBGADL Field Descriptions
Field Description
7–0
Bits[7:0]
Comparator Data Low Compare Bits — The Comparator data low compare bits control whether the selected comparator
compares the data bus bits [7:0] to a logic one or logic zero. The comparator data compare bits are only used in comparison if
the corresponding data mask bit is logic 1. This register is available only for comparator A. Data bus comparisons are only
performed if the TAG bit in DBGACTL is clear
0 Compare corresponding data bit to a logic zero
1 Compare corresponding data bit to a logic one
Table 316. Debug Comparator Data High Mask Register (DBGADHM )
Address: 0x002E
76543210
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
Reset00000000
Table 317. DBGADHM Field Descriptions
Field Description
7–0
Bits[15:8]
Comparator Dat a High Mask Bits — The Comparator data high mask bits control whether the selected comparator compares
the data bus bits [15:8] to the corresponding comparator data compare bits. Data bus comparisons are only performed if the
TAG bit in DBGACTL is clear
0 Do not compare corresponding data bit Any value of corresponding data bit allows match.
1 Compare corresponding data bit
Table 318. Debug Comparator Data Low Mask Register (DBGADLM)
Address: 0x002F
76543210
RBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
W
Reset00000000
Table 319. DBGA DLM Field Descriptions
Field Description
7–0
Bits[7:0]
Comparator Dat a Low Mask Bits — The Comparator data low mask bits control whether the selected comparator compares
the data bus bits [7:0] to the corresponding comparator data compare bits. Data bus comparisons are only performed if the
TAG bit in DBGACTL is clear
0 Do not compare corresponding data bit. Any value of corresponding data bit allows match
1 Compare corresponding data bit
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5.32.4 Functional Description
This section provides a complete functional description of the DBG module. If the part is in secure mode, the DBG module can
generate breakpoints but tracing is not possible.
5.32.4.1 S12SDBG Operation
Arming the DBG module by setting ARM in DBGC1 allows triggering the state sequencer, storing of data in the trace buffer and
generation of breakpoints to the CPU. The DBG module is made up of four main blocks, the comparators, control logic, the state
sequencer, and the trace buffer.
The comparators monitor the bus activity of the CPU. All comparators can be configured to monitor address bus activity.
Comparator A can also be configured to monitor data bus activity and mask out individual data bus bits during a compare.
Comparators can be configured to use R/W and word/byte access qualification in the comparison. A match with a comparator
register value can initiate a state sequencer transition to another state (see Figure 64). Either forced or tagged matches are
possible. Using a forced match, a state sequencer transition can occur immediately on a successful match of system busses and
comparator registers. Whilst tagging, at a comparator match, the instruction opcode is tagged and only if the instruction reaches
the execution stage of the instruction queue can a state sequencer transition occur. In the case of a transition to Final State, bus
tracing is triggered and/or a breakpoint can be generated.
A state sequencer transition to final state (with associated breakpoint, if enabled) can be initiated by writing to the TRIG bit in the
DBGC1 control register.
The trace buffer is visible through a 2-byte window in the register address map and must be read out using standard 16-bit word
reads.
Figure 63. DBG Overview
5.32.4.2 Comparator Modes
The DBG contains three comparators, A, B and C. Each comparator compares the system address bus with the address stored
in DBGXAH, DBGXAM, and DBGXAL. Furthermore, comparator A also compares the data buses to the data stored in DBGADH,
DBGADL and allows masking of individual data bus bits.
All comparators are disabled in BDM and during BDM accesses.
The comparator match control logic (see Figure 63) configures comparators to monitor the buses for an exact address or an
address range, whereby either an access inside or outside the specified range generates a match condition. The comparator
configuration is controlled by the control register contents and the range control by the DBGC2 contents.
CPU BUS
TRACE BUFFER
BUS INTERFACE
TRANSITION
MATCH0
STATE
COMPARATOR B
COMPARATOR C
COMPARATOR A
STATE SEQUENCER
MATCH1
MATCH2
TRACE
READ TRACE DATA (DBG READ DATA BUS)
CONTROL
SECURE
BREAKPOINT REQUESTS
COMPARATOR
MATCH CONTROL
TRIGGER
TAG &
MATCH
CONTROL
LOGIC
TAGS
TAGHITS
STATE
TO CPU
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Freescale Semiconductor 215
A match can initiate a transition to another state sequencer state (see Section 5.32.4.4, “State Sequence Control"). The
comparator control register also allows the type of access to be included in the comparison through the use of the RWE, RW,
SZE, and SZ bits. The RWE bit controls whether read or write comparison is enabled for the associated comparator and the RW
bit selects either a read or write access for a valid match. Similarly the SZE and SZ bits allow the size of access (word or byte)
to be considered in the compare. Only comparators A and B feature SZE and SZ.
The TAG bit in each comparator control register is used to determine the match condition. By setting TAG, the comparator
qualifies a match with the output of opcode tracking logic and a state sequencer transition occurs when the tagged instruction
reaches the CPU execution stage. Whilst tagging the RW, RWE, SZE, and SZ bits and the comparator data registers are ignored;
the comparator address register must be loaded with the exact opcode address.
If the TAG bit is clear (forced type match) a comparator match is generated when the selected address appears on the system
address bus. If the selected address is an opcode address, the match is generated when the opcode is fetched from the memory,
which precedes the instruction execution by an indefinite number of cycles due to instruction pipelining. For a comparator match
of an opcode at an odd address when TAG = 0, the corresponding even address must be contained in the comparator register.
Thus for an opcode at odd address (n), the comparator register must contain address (n–1).
Once a successful comparator match has occurred, the condition that caused the original match is not verified again on
subsequent matches. Thus if a particular data value is verified at a given address, this address may not still contain that data
value when a subsequent match occurs.
Match[0, 1, 2] map directly to Comparators [A, B, C] respectively, except in range modes (see Section 5.32.3.2.4, “Debug Control
Register2 (DBGC2)"). Comparator channel priority rules are described in the priority section (Section 5.32.4.3.4, “Channel
Priorities").
5.32.4.2.1 Single Address Comparator Match
With range comparisons disabled, the match condition is an exact equivalence of address bus with the value stored in the
comparator address registers. Further qualification of the type of access (R/W, word/byte) and data bus contents is possible,
depending on comparator channel.
5.32.4.2.1.1 Comparator C
Comparator C offers only address and direction (R/W) comparison. The exact address is compared, thus with the comparator
address register loaded with address (n) a word access of address (n–1) also accesses (n) but does not cause a match.
5.32.4.2.1.2 Comparator B
Comparator B offers address, direction (R/W) and access size (word/byte) comparison. If the SZE bit is set the access size (word
or byte) is compared with the SZ bit value such that only the specified size of access causes a match. Thus if configured for a
byte access of a particular address, a word access covering the same address does not lead to match.
Assuming the access direction is not qualified (RWE=0), for simplicity, the size access considerations are shown in Table 321.
Table 320. Comparator C Access Considerations
Condition For Valid Match Comp C Address RWE RW Examples
Read and write accesses of ADDR[n] ADDR[n](181) 0X LDAA ADDR[n]
STAA #$BYTE ADDR[n]
Write accesses of ADDR[n] ADDR[n] 1 0 STAA #$BYTE ADDR[n]
Read accesses of ADDR[n] ADDR[n] 1 1 LDAA #$BYTE ADDR[n]
Note:
181. A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match. The comparator address register must contain
the exact address from the code.
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Freescale Semiconductor 216
Access direction can also be used to qualify a match for Comparator B in the same way as described for Comparator C in
Table 320.
5.32.4.2.1.3 Comparator A
Comparator A offers address, direction (R/W), access size (word/byte) and data bus comparison.
Table 322 lists access considerations with data bus comparison. On word accesses the data byte of the lower address is mapped
to DBGADH. Access direction can also be used to qualify a match for Comparator A in the same way as described for Comparator
C in Table 320.
5.32.4.2.1.4 Comparator A Dat a Bus Comparison NDB Dependency
Comparator A features an NDB control bit, which allows data bus comparators to be configured to either trigger on equivalence
or trigger on difference. This allows monitoring of a difference in the contents of an address location from an expected value.
When matching on an equivalence (NDB=0), each individual data bus bit position can be masked out by clearing the
corresponding mask bit (DBGADHM/DBGADLM) so that it is ignored in the comparison. A match occurs when all data bus bits
with corresponding mask bits set are equivalent. If all mask register bits are clear, then a match is based on the address bus only,
the data bus is ignored.
When matching on a difference, mask bits can be cleared to ignore bit positions. A match occurs when any data bus bit with
corresponding mask bit set is different. Clearing all mask bits, causes all bits to be ignored and prevents a match because no
difference can be detected. In this case address bus equivalence does not cause a match.
Table 321. Comparator B Access Size Considerations
Condition For Valid Match Comp B Address RWE SZE SZ8 Examples
Word and byte accesses of ADDR[n] ADDR[n](182) 00X MOVB #$BYTE ADDR[n]
MOVW #$WORD ADDR[n]
Word accesses of ADDR[n] only ADDR[n] 0 1 0 MOVW #$WORD ADDR[n]
LDD ADDR[n]
Note:
182. A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match. The comparator address register must contain
the exact address from the code.
Table 322. Comparator A Matches When Accessing ADDR[n]
SZE SZ DBGADHM,
DBGADLM Access DH=DBGADH, DL=DBGADL Comment
0 X $0000 Byte
Word
No data bus comparison
0X $FF00
Byte, data(ADDR[n])=DH
Word, data(ADDR[n])=DH, data(ADDR[n+1])=X
Match data(ADDR[n])
0 X $00FF Word, data(ADDR[n])=X, data(ADDR[n+1])=DL Match data(ADDR[n+1])
0 X $00FF Byte, data(ADDR[n])=X, data(ADDR[n+1])=DL Possible unintended match
0 X $FFFF Word, data(ADDR[n])=DH, data(ADDR[n+1])=DL Match data(ADDR[n], ADDR[n+1])
0 X $FFFF Byte, data(ADDR[n])=DH, data(ADDR[n+1])=DL Possible unintended match
1 0 $0000 Word No data bus comparison
1 0 $00FF Word, data(ADDR[n])=X, data(ADDR[n+1])=DL Match only data at ADDR[n+1]
1 0 $FF00 Word, data(ADDR[n])=DH, data(ADDR[n+1])=X Match only data at ADDR[n]
1 0 $FFFF Word, data(ADDR[n])=DH, data(ADDR[n+1])=DL Match data at ADDR[n] & ADDR[n+1]
1 1 $0000 Byte No data bus comparison
1 1 $FF00 Byte, data(ADDR[n])=DH Match data at ADDR[n]
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Freescale Semiconductor 217
5.32.4.2.2 Range Comparisons
Using the AB comparator pair for a range comparison, the data bus can also be used for qualification by using the comparator A
data registers. Furthermore the DBGACTL RW and RWE bits can be used to qualify the range comparison on either a read or a
write access. The corresponding DBGBCTL bits are ignored. The SZE and SZ control bits are ignored in range mode. The
comparator A TAG bit is used to tag range comparisons. The comparator B TAG bit is ignored in range modes. In order for a
range comparison using comparators A and B, both COMPEA and COMPEB must be set; to disable range comparisons both
must be cleared. The comparator A BRK bit is used to for the AB range, the comparator B BRK bit is ignored in range mode.
When configured for range comparisons and tagging, the ranges are accurate only to word boundaries.
5.32.4.2.2.1 Inside Range (CompA_Addr Address CompB_Addr)
In the Inside Range comparator mode, comparator pair A and B can be configured for range comparisons. This configuration
depends upon the control register (DBGC2). The match condition requires that a valid match for both comparators happens on
the same bus cycle. A match condition on only one comparator is not valid. An aligned word access which straddles the range
boundary is valid only if the aligned address is inside the range.
5.32.4.2.2.2 Outside Range (address < CompA_Addr or Address > CompB_Addr)
In the Outside Range comparator mode, comparator pair A and B can be configured for range comparisons. A single match
condition on either of the comparators is recognized as valid. An aligned word access which straddles the range boundary is valid
only if the aligned address is outside the range.
Outside range mode in combination with tagging can be used to detect if the opcode fetches are from an unexpected range. In
forced match mode the outside range match would typically be activated at any interrupt vector fetch or register access. This can
be avoided by setting the upper range limit to $3FFFF or lower range limit to $00000 respectively.
5.32.4.3 Match Modes (Forced or Tagged)
Match modes are used as qualifiers for a state sequencer change of state. The Comparator control register TAG bits select the
match mode. The modes are described in the following sections.
5.32.4.3.1 Forced Match
When configured for forced matching, a comparator channel match can immediately initiate a transition to the next state
sequencer state whereby the corresponding flags in DBGSR are set. The state control register for the current state determines
the next state. Forced matches are typically generated 2-3 bus cycles after the final matching address bus cycle, independent of
comparator RWE/RW settings. Furthermore since opcode fetches occur several cycles before the opcode execution a forced
match of an opcode address typically precedes a tagged match at the same address.
5.32.4.3.2 Tagged Match
If a CPU taghit occurs a transition to another state sequencer state is initiated and the corresponding DBGSR flags are set. For
a comparator related taghit to occur, the DBG must first attach tags to instructions as they are fetched from memory. When the
tagged instruction reaches the execution stage of the instruction queue a taghit is generated by the CPU. This can initiate a state
sequencer transition.
5.32.4.3.3 Immediate T rigger
Independent of comparator matches it is possible to initiate a tracing session and/or breakpoint by writing to the TRIG bit in
DBGC1. If configured for begin aligned tracing, this triggers the state sequencer into the Final State, if configured for end
alignment, setting the TRIG bit disarms the module, ending the session and issues a forced breakpoint request to the CPU.
Table 32 3. NDB and MASK Bit Dependency
NDB DBGADHM[n] /
DBGADLM[n] Comment
0 0 Do not compare data bus bit.
0 1 Compare data bus bit. Match on equivalence.
1 0 Do not compare data bus bit.
1 1 Compare data bus bit. Match on difference.
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Freescale Semiconductor 218
It is possible to set both TRIG and ARM simultaneously to generate an immediate trigger, independent of the current state of
ARM.
5.32.4.3.4 Channel Priorities
In case of simultaneous matches the priority is resolved according to Table 324. The lower priority is suppressed. It is thus
possible to miss a lower priority match if it occurs simultaneously with a higher priority. The priorities described in Table 324
dictate that in the case of simultaneous matches, the match pointing to final state has highest priority followed by the lower
channel number (0,1,2).
5.32.4.4 St ate Sequence Control
Figure 64. State Sequencer Diagram
The state sequencer allows a defined sequence of events to provide a trigger point for tracing of data in the trace buffer. Once
the DBG module has been armed by setting the ARM bit in the DBGC1 register, then state1 of the state sequencer is entered.
Further transitions between the states are then controlled by the state control registers and channel matches. From Final State
the only permitted transition is back to the disarmed state0. Transition between any of the states 1 to 3 is not restricted. Each
transition updates the SSF[2:0] flags in DBGSR accordingly to indicate the current state.
Alternatively writing to the TRIG bit in DBGSC1, provides an immediate trigger independent of comparator matches.
Independent of the state sequencer, each comparator channel can be individually configured to generate an immediate
breakpoint when a match occurs through the use of the BRK bits in the DBGxCTL registers. Thus it is possible to generate an
immediate breakpoint on selected channels, whilst a state sequencer transition can be initiated by a match on other channels. If
a debug session is ended by a match on a channel the state sequencer transitions through Final State for a clock cycle to state0.
This is independent of tracing and breakpoint activity, thus with tracing and breakpoints disabled, the state sequencer enters
state0 and the debug module is disarmed.
5.32.4.4.1 Final State
On entering Final State a trigger may be issued to the trace buffer according to the trace alignment control as defined by the
TALIGN bit (see Section 5.32.3.2.3, “Debug Trace Control Register (DBGTCR)"). If the TSOURCE bit in DBGTCR is clear then
the trace buffer is disabled and the transition to Final State can only generate a breakpoint request. In this case or upon
completion of a tracing session when tracing is enabled, the ARM bit in the DBGC1 register is cleared, returning the module to
Table 324. Channel Priorities
Priority Source Action
Highest TRIG Enter Final State
Channel pointing to Final State Transition to next state as defined by state control registers
Match0 (force or tag hit) Transition to next state as defined by state control registers
Match1 (force or tag hit) Transition to next state as defined by state control registers
Lowest Match2 (force or tag hit) Transition to next state as defined by state control registers
State1
Final State State3
ARM = 1
Session Complete
(Disarm)
State2
State 0
(Disarmed)
ARM = 0
ARM = 0
ARM = 0
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 219
the disarmed state0. If tracing is enabled a breakpoint request can occur at the end of the tracing session. If neither tracing nor
breakpoints are enabled then when the final state is reached it returns automatically to state0 and the debug module is disarmed.
5.32.4.5 Trace Buffer Operat ion
The trace buffer is a 64 lines deep by 20-bits wide RAM array. The DBG module stores trace information in the RAM array in a
circular buffer format. The system accesses the RAM array through a register window (DBGTBH:DBGTBL) using 16-bit wide
word accesses. After each complete 20-bit trace buffer line is read, an internal pointer into the RAM increments so that the next
read receives fresh information. Data is stored in the format shown in Table 325 and Table 329. After each store the counter
register DBGCNT is incremented. Tracing of CPU activity is disabled when the BDM is active. Reading the trace buffer whilst the
DBG is armed returns invalid data and the trace buffer pointer is not incremented.
5.32.4.5.1 Trace Trigger Alignment
Using the TALIGN bit (see Section 5.32.3.2.3, “Debug Trace Control Register (DBGTCR)") it is possible to align the trigger with
the end or the beginning of a tracing session.
If end alignment is selected, tracing begins when the ARM bit in DBGC1 is set and State1 is entered; the transition to Final State
signals the end of the tracing session. Tracing with Begin-Trigger starts at the opcode of the trigger. Using end alignment or when
the tracing is initiated by writing to the TRIG bit whilst configured for begin alignment, tracing starts in the second cycle after the
DBGC1 write cycle.
5.32.4.5.1.1 Storing with Begin Trigger Alignment
Storing with begin alignment, data is not stored in the Trace Buffer until the Final State is entered. Once the trigger condition is
met the DBG module remains armed until 64 lines are stored in the Trace Buffer. If the trigger is at the address of the
change-of-flow instruction the change of flow associated with the trigger is stored in the Trace Buffer. Using begin alignment
together with tagging, if the tagged instruction is about to be executed then the trace is started. Upon completion of the tracing
session the breakpoint is generated, thus the breakpoint does not occur at the tagged instruction boundary.
5.32.4.5.1.2 Storing with End Trigger Align ment
Storing with end alignment, data is stored in the Trace Buffer until the Final State is entered, at which point the DBG module
becomes disarmed and no more data is stored. If the trigger is at the address of a change of flow instruction, the trigger event is
not stored in the Trace Buffer. If all trace buffer lines have been used before a trigger event occurs then the trace continues at
the first line, overwriting the oldest entries.
5.32.4.5.2 Trace Modes
Four trace modes are available. The mode is selected using the TRCMOD bits in the DBGTCR register. Tracing is enabled using
the TSOURCE bit in the DBGTCR register. The modes are described in the following subsections.
5.32.4.5.2.1 Normal Mode
In Normal Mode, change of flow (COF) program counter (PC) addresses are stored.
COF addresses are defined as follows:
• Source address of taken conditional branches (long, short, bit-conditional, and loop primitives)
• Destination address of indexed JMP, JSR, and CALL instruction
• Destination address of RTI, RTS, and RTC instructions
• Vector address of interrupts, except for BDM vectors
LBRA, BRA, BSR, BGND as well as non-indexed JMP, JSR, and CALL instructions are not classified as change of flow and are
not stored in the trace buffer.
Stored information includes the full 18-bit address bus and information bits, which contains a source/destination bit to indicate
whether the stored address was a source address or destination address.
NOTE
When a COF instruction with destination address is executed, the destination address is
stored to the trace buffer on instruction completion, indicating the COF has taken place. If
an interrupt occurs simultaneously then the next instruction carried out is actually from the
interrupt service routine. The instruction at the destination address of the original program
flow gets executed after the interrupt service routine.
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In the following example an IRQ interrupt occurs during execution of the indexed JMP at
address MARK1. The BRN at the destination (SUB_1) is not executed until after the IRQ
service routine but the destination address is entered into the trace buffer to indicate that the
indexed JMP COF has taken place.
LDX #SUB_1
MARK1 JMP 0,X ; IRQ interrupt occurs during execution of this
MARK2 NOP ;
SUB_1 BRN * ; JMP Destination address TRACE BUFFER ENTRY 1
; RTI Destination address TRACE BUFFER ENTRY 3
NOP ;
ADDR1 DBNE A,PART5 ; Source address TRACE BUFFER ENTRY 4
IRQ_ISR LDAB #$F0 ; IRQ Vector $FFF2 = TRACE BUFFER ENTRY 2
STAB VAR_C1
RTI ;
The execution flow taking into account the IRQ is as follows
LDX #SUB_1
MARK1 JMP 0,X ;
IRQ_ISR LDAB #$F0 ;
STAB VAR_C1
RTI ;
SUB_1 BRN *
NOP ;
ADDR1 DBNE A,PART5 ;
5.32.4.5.2.2 Loop1 Mode
Loop1 Mode, similarly to Normal Mode also stores only COF address information to the trace buffer, it however allows the filtering
out of redundant information.
The intent of Loop1 Mode is to prevent the Trace Buffer from being filled entirely with duplicate information from a looping
construct such as delays using the DBNE instruction or polling loops using BRSET/BRCLR instructions. Immediately after
address information is placed in the Trace Buffer, the DBG module writes this value into a background register. This prevents
consecutive duplicate address entries in the Trace Buffer resulting from repeated branches.
Loop1 Mode only inhibits consecutive duplicate source address entries that would typically be stored in most tight looping
constructs. It does not inhibit repeated entries of destination addresses or vector addresses, since repeated entries of these
would most likely indicate a bug in the user’s code that the DBG module is designed to help find.
5.32.4.5.2.3 Detail Mode
In Detail Mode, address and data for all memory and register accesses is stored in the trace buffer. This mode is intended to
supply additional information on indexed, indirect addressing modes where storing only the destination address would not
provide all information required for a user to determine where the code is in error. This mode also features information bit storage
to the trace buffer, for each address byte storage. The information bits indicate the size of access (word or byte) and the type of
access (read or write).
When tracing in Detail Mode, all cycles are traced except those when the CPU is either in a free or opcode fetch cycle.
5.32.4.5.2.4 Compressed Pure PC Mode
In Compressed Pure PC Mode, the PC addresses of all executed opcodes, including illegal opcodes are stored. A compressed
storage format is used to increase the effective depth of the trace buffer. This is achieved by storing the lower order bits each
time and using 2 information bits to indicate if a 64 byte boundary has been crossed, in which case the full PC is stored.
Each Trace Buffer row consists of 2 information bits and 18 PC address bits
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NOTE:
When tracing is terminated using forced breakpoints, latency in breakpoint generation
means that opcodes following the opcode causing the breakpoint can be stored to the trace
buffer. The number of opcodes is dependent on program flow. This can be avoided by using
tagged breakpoints.
5.32.4.5.3 Trace Buffer Organization (Normal, Loop1, Detail modes)
ADRH, ADRM, ADRL denote address high, middle and low byte respectively. The numerical suffix refers to the tracing count.
The information format for Loop1 and Normal modes is identical. In Detail mode, the address and data for each entry are stored
on consecutive lines, thus the maximum number of entries is 32. In this case DBGCNT bits are incremented twice, once for the
address line and once for the data line, on each trace buffer entry. In Detail mode CINF comprises of R/W and size access
information (CRW and CSZ respectively).
Single byte data accesses in Detail Mode are always stored to the low byte of the trace buffer (DATAL) and the high byte is
cleared. When tracing word accesses, the byte at the lower address is always stored to trace buffer byte1 and the byte at the
higher address is stored to byte0.
5.32.4.5.3.1 Information Bit Organization
The format of the bits is dependent upon the active trace mode as described below.
Field2 Bits in Detail Mode
In Detail Mode the CSZ and CRW bits indicate the type of access being made by the CPU.
Table 325. Trace Buffer Organization (Normal,Loop1,Detail modes)
Mode Entry
Number
4-bits 8-bits 8-bits
Field 2 Field 1 Field 0
Detail Mode
Entry 1 CINF1,ADRH1 ADRM1 ADRL1
0 DATAH1 DATAL1
Entry 2 CINF2,ADRH2 ADRM2 ADRL2
0 DATAH2 DATAL2
Normal/Loop1
Modes
Entry 1 PCH1 PCM1 PCL1
Entry 2 PCH2 PCM2 PCL2
Table 326. Field2 Bit s in Detail Mode
Bit 3 Bit 2 Bit 1 Bit 0
CSZ CRW ADDR[17] ADDR[16]
Table 327. Field Descriptions
Bit Description
3
CSZ
Access Type Indicator — This bit indicates if the access was a byte or word size when tracing in Detail Mode
0 Word Access
1 Byte Access
2
CRW
Read Write Indicator — This bit indicates if the corresponding stored address corresponds to a read or write access when
tracing in Detail Mode.
0 Write Access
1 Read Access
1
ADDR[17]
Address Bus bit 17 — Corresponds to system address bus bit 17.
0
ADDR[16]
Address Bus bit 16 — Corresponds to system address bus bit 16.
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Field2 Bits in Normal and Loop1 Mod e s
5.32.4.5.4 Trace Buffer Organization (Compressed Pure PC mode)
NOTE
Configured for end aligned triggering in compressed PurePC mode, then after rollover it is
possible that the oldest base address is overwritten. In this case all entries between the
pointer and the next base address have lost their base address following rollover. For
example in Ta bl e 33 0 if one line of rollover has occurred, Line 1, PC1, is overwritten with a
new entry. Thus the entries on Lines 2 and 3 have lost their base address. For reconstruction
of program flow the first base address following the pointer must be used, in the example,
Line 4. The pointer points to the oldest entry, Line 2.
Figure 65. Information Bits PCH
Bit 3 Bit 2 Bit 1 Bit 0
CSD CVA PC17 PC16
Table 328. PCH Field Descriptions
Bit Description
3
CSD
Source Destination Indicator — In Normal and Loop1 mode this bit indicates if the corresponding stored address is a source
or destination address. This bit has no meaning in Compressed Pure PC mode.
0 Source Address
1 Destination Address
2
CVA
Vector Indicator — In Normal and Loop1 mode this bit indicates if the corresponding stored address is a vector address.
Vector addresses are destination addresses, thus if CVA is set, then the corresponding CSD is also set. This bit has no
meaning in Compressed Pure PC mode.
0 Non-Vector Destination Address
1 Vector Destination Address
1
PC17
Program Counter bit 17 — In Normal and Loop1 mode this bit corresponds to program counter bit 17.
0
PC16
Program Counter bit 16 — In Normal and Loop1 mode this bit corresponds to program counter bit 16.
Table 329. Trace Buffer Organization Example (Comp ressed PurePC mode)
Mode Line
Number
2-bits 6-bits 6-bits 6-bits
Field 3 Field 2 Field 1 Field 0
Compressed
Pure PC Mode
Line 1 00 PC1 (Initial 18-bit PC Base Address)
Line 2 11 PC4 PC3 PC2
Line 3 01 0 0 PC5
Line 4 00 PC6 (New 18-bit PC Base Address)
Line 5 10 0 PC8 PC7
Line 6 00 PC9 (New 18-bit PC Base Address)
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Field3 Bits in Compressed Pure PC Modes
Each time that PC[17:6] differs from the previous base PC[17:6], then a new base address is stored. The base address zero value
is the lowest address in the 64 address range
The first line of the trace buffer always gets a base PC address, this applies also on rollover.
5.32.4.5.5 Reading Data from Trace Buffer
The data stored in the Trace Buffer can be read provided the DBG module is not armed, is configured for tracing (TSOURCE bit
is set) and the system not secured. When the ARM bit is written to 1 the trace buffer is locked to prevent reading. The trace buffer
can only be unlocked for reading by a single aligned word write to DBGTB when the module is disarmed.
The Trace Buffer can only be read through the DBGTB register using aligned word reads, any byte or misaligned reads return 0
and do not cause the trace buffer pointer to increment to the next trace buffer address. The Trace Buffer data is read out first-in
first-out. By reading CNT in DBGCNT the number of valid lines can be determined. DBGCNT does not decrement as data is read.
Whilst reading an internal pointer is used to determine the next line to be read. After a tracing session, the pointer points to the
oldest data entry, thus if no rollover has occurred, the pointer points to line0, otherwise it points to the line with the oldest entry.
In compressed Pure PC mode on rollover the line with the oldest data entry may also contain newer data entries in fields 0 and
1. Thus if rollover is indicated by the TBF bit, the line status must be decoded using the INF bits in field3 of that line. If both INF
bits are clear then the line contains only entries from before the last rollover.
If INF0=1 then field 0 contains post rollover data but fields 1 and 2 contain pre rollover data.
If INF1=1 then fields 0 and 1 contain post rollover data but field 2 contains pre rollover data.
The pointer is initialized by each aligned write to DBGTBH to point to the oldest data again. This enables an interrupted trace
buffer read sequence to be easily restarted from the oldest data entry.
The least significant word of line is read out first. This corresponds to the fields 1 and 0 of Ta bl e 32 5. The next word read returns
field 2 in the least significant bits [3:0] and “0” for bits [15:4].
Reading the Trace Buffer while the DBG module is armed returns invalid data and no shifting of the RAM pointer occurs.
5.32.4.5.6 Trace Buffer Reset State
The Trace Buffer contents and DBGCNT bits are not initialized by a system reset. Thus should a system reset occur, the trace
session information from immediately before the reset occurred can be read out and the number of valid lines in the trace buffer
is indicated by DBGCNT. The internal pointer to the current trace buffer address is initialized by unlocking the trace buffer and
points to the oldest valid data even if a reset occurred during the tracing session. To read the trace buffer after a reset, TSOURCE
must be set, otherwise the trace buffer reads as all zeroes. Generally debugging occurrences of system resets is best handled
using end trigger alignment since the reset may occur before the trace trigger, which in the begin trigger alignment case means
no information would be stored in the trace buffer.
The Trace Buffer contents and DBGCNT bits are undefined following a POR.
NOTE
An external pin RESET that occurs simultaneous to a trace buffer entry can, in very seldom
cases, lead to either that entry being corrupted or the first entry of the session being
corrupted. In such cases the other contents of the trace buffer still contain valid tracing
information. The case occurs when the reset assertion coincides with the trace buffer entry
clock edge.
Table 330. Compressed Pure PC Mode Field 3 Infor mation Bit Encoding
INF1 INF0 TRACE BUFFER ROW CONTENT
0 0 Base PC address TB[17:0] contains a full PC[17:0] value
0 1 Trace Buffer[5:0] contain incremental PC relative to base address zero value
1 0 Trace Buffer[11:0] contain next 2 incremental PCs relative to base address zero value
1 1 Trace Buffer[17:0] contain next 3 incremental PCs relative to base address zero value
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5.32.4.6 Tagging
A tag follows program information as it advances through the instruction queue. When a tagged instruction reaches the head of
the queue a tag hit occurs and can initiate a state sequencer transition.
Each comparator control register features a TAG bit, which controls whether the comparator match causes a state sequencer
transition immediately or tags the opcode at the matched address. If a comparator is enabled for tagged comparisons, the
address stored in the comparator match address registers must be an opcode address.
Using Begin trigger together with tagging, if the tagged instruction is about to be executed then the transition to the next state
sequencer state occurs. If the transition is to the Final State, tracing is started. Only upon completion of the tracing session can
a breakpoint be generated. Using End alignment, when the tagged instruction is about to be executed and the next transition is
to Final State then a breakpoint is generated immediately, before the tagged instruction is carried out.
R/W monitoring, access size (SZ) monitoring and data bus monitoring are not useful if tagging is selected, since the tag is
attached to the opcode at the matched address and is not dependent on the data bus nor on the type of access. Thus these bits
are ignored if tagging is selected.
When configured for range comparisons and tagging, the ranges are accurate only to word boundaries.
Tagging is disabled when the BDM becomes active.
5.32.4.7 Breakpoints
It is possible to generate breakpoints from channel transitions to final state or using software to write to the TRIG bit in the DBGC1
register.
5.32.4.7.1 Breakpoints From Comparator Channels
Breakpoints can be generated when the state sequencer transitions to the Final State. If configured for tagging, then the
breakpoint is generated when the tagged opcode reaches the execution stage of the instruction queue.
If a tracing session is selected by the TSOURCE bit, breakpoints are requested when the tracing session has completed, thus if
Begin aligned triggering is selected, the breakpoint is requested only on completion of the subsequent trace (see Table 331). If
no tracing session is selected, breakpoints are requested immediately.
If the BRK bit is set, then the associated breakpoint is generated immediately independent of tracing trigger alignment.
5.32.4.7.2 Breakpoints Generated Via The TRIG Bit
If a TRIG triggers occur, the Final State is entered whereby tracing trigger alignment is defined by the TALIGN bit. If a tracing
session is selected by the TSOURCE bit, breakpoints are requested when the tracing session has completed, thus if Begin
aligned triggering is selected, the breakpoint is requested only on completion of the subsequent trace (see Ta bl e 33 1). If no
tracing session is selected, breakpoints are requested immediately. TRIG breakpoints are possible with a single write to DBGC1,
setting ARM and TRIG simultaneously.
5.32.4.7.3 Breakpoint Priorities
If a TRIG trigger occurs after Begin aligned tracing has already started, then the TRIG no longer has an effect. When the
associated tracing session is complete, the breakpoint occurs. Similarly if a TRIG is followed by a subsequent comparator
channel match, it has no effect, since tracing has already started.
If a forced SWI breakpoint coincides with a BGND in user code with BDM enabled, then the BDM is activated by the BGND and
the breakpoint to SWI is suppressed.
Table 331. Breakpoint Setup For CPU Breakpoint s
BRK TALIGN DBGBRK Breakpoint Alignment
0 0 0 Fill Trace Buffer until trigger then disarm (no breakpoints)
0 0 1 Fill Trace Buffer until trigger, then breakpoint request occurs
0 1 0 Start Trace Buffer at trigger (no breakpoints)
0 1 1 Start Trace Buffer at trigger. A breakpoint request occurs when Trace Buffer is full
1 x 1 Terminate tracing and generate breakpoint immediately on trigger
1 x 0 Terminate tracing immediately on trigger
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5.32.4.7.3.1 DBG Breakpoint Priorities And BDM Interfacing
Breakpoint operation is dependent on the state of the BDM module. If the BDM module is active, the CPU is executing out of
BDM firmware, thus comparator matches and associated breakpoints are disabled. In addition, while executing a BDM TRACE
command, tagging into BDM is disabled. If BDM is not active, the breakpoint gives priority to BDM requests over SWI requests
if the breakpoint happens to coincide with a SWI instruction in user code. On returning from BDM, the SWI from user code gets
executed.
BDM cannot be entered from a breakpoint unless the ENABLE bit is set in the BDM. If entry to BDM via a BGND instruction is
attempted and the ENABLE bit in the BDM is cleared, the CPU actually executes the BDM firmware code, checks the ENABLE
and returns if ENABLE is not set. If not serviced by the monitor then the breakpoint is re-asserted when the BDM returns to normal
CPU flow.
If the comparator register contents coincide with the SWI/BDM vector address then an SWI in user code could coincide with a
DBG breakpoint. The CPU ensures that BDM requests have a higher priority than SWI requests. Returning from the BDM/SWI
service routine care must be taken to avoid a repeated breakpoint at the same address.
Should a tagged or forced breakpoint coincide with a BGND in user code, then the instruction that follows the BGND instruction
is the first instruction executed when normal program execution resumes.
NOTE
When program control returns from a tagged breakpoint using an RTI or BDM GO command
without program counter modification it returns to the instruction whose tag generated the
breakpoint. To avoid a repeated breakpoint at the same location reconfigure the DBG
module in the SWI routine, if configured for an SWI breakpoint, or over the BDM interface
by executing a TRACE command before the GO to increment the program flow past the
tagged instruction.
5.32.5 Application Information
5.32.5.1 State Machine scenarios
Defining the state control registers as SCR1,SCR2, SCR3 and M0,M1,M2 as matches on channels 0,1,2 respectively. SCR
encoding supported by S12SDBGV1 are shown in black. SCR encoding supported only in S12SDBGV2 are shown in red. For
backwards compatibility the new scenarios use a 4th bit in each SCR register. Thus the existing encoding for SCRx[2:0] is not
changed.
5.32.5.2 Scenario 1
A trigger is generated if a given sequence of 3 code events is executed.
Figure 66. Scenario 1
Scenario 1 is possible with S12SDBGV1 SCR encoding
Table 332. Breakpoint Mapping Summary
DBGBRK BDM Bit
(DBGC1[4]) BDM
Enabled BDM
Active Breakpoint
Mapping
0 X X X No Breakpoint
1 0 X 0 Breakpoint to SWI
X X 1 1 No Breakpoint
1 1 0 X Breakpoint to SWI
1 1 1 0 Breakpoint to BDM
State1 Final State
State3
State2
SCR1=0011 SCR2=0010 SCR3=0111
M1 M2 M0
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5.32.5.3 Scenario 2
A trigger is generated if a given sequence of 2 code events is executed.
Figure 67. Scenario 2a
A trigger is generated if a given sequence of 2 code events is executed, whereby the first event is entry into a range
(COMPA,COMPB configured for range mode). M1 is disabled in range modes.
Figure 68. Scenario 2b
A trigger is generated if a given sequence of 2 code events is executed, whereby the second event is entry into a range
(COMPA,COMPB configured for range mode)
Figure 69. Scenario 2c
All 3 scenarios 2a,2b,2c are possible with the S12SDBGV1 SCR encoding
5.32.5.4 Scenario 3
A trigger is generated immediately when one of up to 3 given events occurs
Figure 70. Scenario 3
Scenario 3 is possible with S12SDBGV1 SCR encoding
5.32.5.5 Scenario 4
Trigger if a sequence of 2 events is carried out in an incorrect order. Event A must be followed by event B and event B must be
followed by event A. 2 consecutive occurrences of event A without an intermediate event B cause a trigger. Similarly 2
consecutive occurrences of event B without an intermediate event A cause a trigger. This is possible by using CompA and
CompC to match on the same address as shown.
State1 Final State
State2
SCR1=0011 SCR2=0101
M1 M2
State1 Final State
State2
SCR1=0111 SCR2=0101
M01 M2
State1 Final State
State2
SCR1=0010 SCR2=0011
M2 M0
State1 Final State
SCR1=0000M012
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Figure 71. Scenario 4a
This scenario is currently not possible using 2 comparators only. S12SDBGV2 makes it possible with 2 comparators, State 3
allowing a M0 to return to state 2, whilst a M2 leads to final state as shown.
Figure 72. Scenario 4b (with 2 comparators)
The advantage of using only 2 channels is that now range comparisons can be included (channel0)
This however violates the S12SDBGV1 specification, which states that a match leading to final state always has priority in case
of a simultaneous match, whilst priority is also given to the lowest channel number. For S12SDBG the corresponding CPU priority
decoder is removed to support this, such that on simultaneous taghits, taghits pointing to final state have highest priority. If no
taghit points to final state then the lowest channel number has priority. Thus with the above encoding from State3, the CPU and
DBG would break on a simultaneous M0/M2.
5.32.5.6 Scenario 5
Trigger if following event A, event C precedes event B. i.e. the expected execution flow is A->B->C.
Figure 73. Scenario 5
Scenario 5 is possible with the S12SDBGV1 SCR encoding
5.32.5.7 Scenario 6
Trigger if event A occurs twice in succession before any of 2 other events (BC) occurs. This scenario is not possible using the
S12SDBGV1 SCR encoding. S12SDBGV2 includes additions shown in red. The change in SCR1 encoding also has the
advantage that a State1->State3 transition using M0 is now possible. This is advantageous because range and data bus
comparisons use channel0 only.
Figure 74. Scenario 6
State1
Stat e 3 Final State
State2
M0
M0
M2
M1
M1
M1
SCR1=0100
SCR2=0011
SCR3=0001
State1
State 3 Final State
State2
M0
M01
M0
M2
M2
M2
SCR1=0110
SCR2=1100
SCR3=1110
M1 disabled in
range mode
State1 Final State
State2
SCR1=0011 SCR2=0110
M1 M0
M2
State1 Final State
State3
SCR1=1001 SCR3=1010
M0 M0
M12
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5.32.5.8 Scenario 7
Trigger when a series of 3 events is executed out of order. Specifying the event order as M1,M2,M0 to run in loops (120120120).
Any deviation from that order should trigger. This scenario is not possible using the S12SDBGV1 SCR encoding because OR
possibilities are very limited in the channel encoding. By adding OR forks as shown in red this scenario is possible.
Figure 75. Scenario 7
On simultaneous matches the lowest channel number has priority so with this configuration the forking from State1 has the
peculiar effect that a simultaneous match0/match1 transitions to final state but a simultaneous match2/match1transitions to
state2.
5.32.5.9 Scenario 8
Trigger when a routine/event at M2 follows either M1 or M0.
Figure 76. Scenario 8a
Trigger when an event M2 is followed by either event M0 or event M1
Figure 77. Scenario 8b
Scenario 8a and 8b are possible with the S12SDBGV1 and S12SDBGV2 SCR encoding.
5.32.5.1 0 Scena ri o 9
Trigger when a routine/event at A (M2) does not follow either B or C (M1 or M0) before they are executed again. This cannot be
realized with theS12SDBGV1 SCR encoding due to OR limitations. By changing the SCR2 encoding as shown in red this
scenario becomes possible.
Figure 78. Scenario 9
5.32.5.11 Scena rio 10
Trigger if an event M0 occurs following up to two successive M2 events without the resetting event M1. As shown up to 2
consecutive M2 events are allowed, whereby a reset to State1 is possible after either one or two M2 events. If an event M0 occurs
State1 Final State
State3
State2
SCR1=1101 SCR2=1100 SCR3=1101
M1 M2 M12
M0
M02
M01
State1 Final State
State2
SCR1=0111 SCR2=0101
M01 M2
State1 Final State
State2
SCR1=0010 SCR2=0111
M2 M01
State1 Final State
State2
SCR1=0111 SCR2=1111
M01 M01
M2
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following the second M2, before M1 resets to State1 then a trigger is generated. Configuring CompA and CompC the same, it is
possible to generate a breakpoint on the third consecutive occurrence of event M0 without a reset M1.
Figure 79. Scenario 10a
Figure 80. Scenario 10b
Scenario 10b shows the case that after M2 then M1 must occur before M0. Starting from a particular point in code, event M2 must
always be followed by M1 before M0. If after any M2, event M0 occurs before M1 then a trigger is generated.
State1 Final State
State3
State2
SCR1=0010 SCR2=0100 SCR3=0010
M2 M2 M0
M1
M1
State1 Final State
State3
State2
SCR1=0010 SCR2=0011 SCR3=0000
M2 M1
M0
M0
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5.33 Security (S12X9SECV2)
5.33.1 Introduction
This specification describes the function of the security mechanism in the S12I chip family (9SEC).
NOTE
No security feature is absolutely secure. However, Freescale’s strategy is to make reading
or copying the FLASH and/or EEPROM difficult for unauthorized users.
5.33.1.1 Features
The user must be reminded that part of the security must lie with the application code. An extreme example would be application
code that dumps the contents of the internal memory. This would defeat the purpose of security. At the same time, the user may
also wish to put a backdoor in the application program. An example of this is the user downloads a security key through the SCI,
which allows access to a programming routine that updates parameters stored in another section of the Flash memory.
The security features of the S12I chip family (in secure mode) are:
• Protect the content of non-volatile memories (Flash, EEPROM)
• Execution of NVM commands is restricted
• Disable access to internal memory via background debug module (BDM)
5.33.1.2 Modes of Opera tio n
Table 333 gives an overview over availability of security relevant features in unsecure and secure modes.
Figure 81 shows all modules affected by security in an MCU.
Ta ble 333. Feature Availability in Unsecure and Secure Modes on S12I
Unsecure Mode Secure Mode
NS SS NX ES EX ST NS SS NX ES EX ST
Note:
183. Restricted NVM command set only. Please refer to the NVM wrapper block guides for detailed information.
184. BDM hardware commands restricted to peripheral registers only.
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Figure 81. Chip Security Block Diagram
The security mechanism relies on non-volatile bits contained in the FLASH module. The state of these bits is passed to the
S12XMMC. Several of the MCU modules are involved in blocking certain operations which would reveal the contents of the
protected FLASH and EEPROM.
5.34 Impact on MCU modules
When the device is in secure mode, the following blocks are affected by security
5.34.1 MMC
There is a signal called “secreq” from the FLASH or EEPROM which indicates if the security is enabled. There is also a signal
from the xbdm, which is used in the process of unsecuring the chip. This signal is called “unsecure”. These two signals and the
resulting state of “device security” are shown in Table 334.
In expanded modes, if the “mmc_secure_t2” signal is asserted, the ROMON and EEON bits are forced to zero. This operation is
independent of how the part got to expanded mode (straight out of reset or by writing the mode register).
When security is enabled and the part is brought up in special single chip mode, the secure BDM firmware is brought into the
map along with the standard BDM firmware. The secure firmware has higher priority, but does not fill the whole space. It occupies
$7F_FF80 to $7F_FFFF.
Ta ble 334. : Security Bits - System Control
secreq bdm_unsecure mmc_secure
0 0 0 (unsecured)
0 1 0 (unsecured)
1 0 1 (secured)
1 1 0 (unsecured)
eeprom
xgate
xdbg
security control
security status
secreq
xmmc flash
xbdm
mmc_secure
unsecure
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One cycle after bdm_unsecure is asserted the secure firmware is disabled from the map.
In secure mode aBDM access to a non register address will be translated to a peripheral register address, and BDM registers
are not accessible.
No BDM global access is possible if the chip is secured.
In secured expanded mode or emulation mode, FLASH and EEPROM are disabled by the MMC.
5.34.2 BDM
When security is active and the blank check is performed and failed, only BDM hardware commands are available. If the blank
check is succeeds, all BDM commands are available.
The BDM status register contains a bit called UNSEC. This bit is only writable by the secure firmware in special single chip mode.
Based on the state of this bit, the BDM generates a signal called “unsecure”. The bit and signal are always reset to 0 (=
de-asserted = secure).
If the user resets into special single chip mode with the part secured, an alternate BDM firmware (“SECURE firmware”), is placed
in the map along with the standard BDM firmware. The secure firmware has higher priority than the standard firmware, but it is
smaller (less bytes). The secure firmware covers the vector space, but does not reach the beginning of the BDM firmware space.
When blank check is successfully performed, UNSEC is asserted. The BDM program jumps to the start of the standard BDM
firmware program and the secure firmware is turned off. If the blank check fails, then the ENBDM bit in the BDMSTS register is
set without asserting UNSEC, and the BDM firmware code enters a loop. This enables the BDM hardware commands. In secure
mode the MMC restricts BDM accesses to the register space.
With UNSEC asserted, security is off and the user can change the state of the secure bits in the FLASH. Note that if the user
does not change the state of these bits to “unsecured”, the part will be secured again when it is next taken out of reset.
5.34.3 DBG
S12X_DBG will disable the trace buffer, but breakpoints are still valid.
5.34.4 XGATE
XGATE internal registers XGCCR, XGPC, and XGR1 - XGR7 can not be written and will read zero from IPBI.
Single stepping in XGATE is not possible.
XGATE code residing in the internal RAM cannot be protected:
1. start MCU in NSC, let it run for a while
2. reset into SSC, MASERS the NVM
3. reset into SSC, blank check of BDM secure firmware succeeds
4. MCU is temporarily unsecured
5. BDM can be used to read internal RAM (contents not affected by reset)
5.35 Secure firmware Code Overview
The BDM contains a secure firmware code. This firmware code is invoked when the user comes out of reset in special single chip
mode with security enabled. The function of the firmware code is straight forward:
• Verify the FLASH is erased
• Verify the EEPROM is erased
• If both are erased, release security
If either the FLASH or the EEPROM is not erased, then security is not released. The ENBDM bit is set and the code enters a
loop. This allows BDM hardware commands, which may be used to erase the EEPROM and FLASH.
Note that erasing the memories and erasing / reprogramming the security bits is NOT part of the firmware code. The user must
perform these operations.
The blank check of FLASH and EEPROM is done in the BDM firmware. As such it could be changed on future parts. The current
scheme uses the NVM command state-machines (FTX, EETX) to perform the blank check.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 233
5.35.0.1 Securing the Microcontroller
Once the user has programmed the Flash and EEPROM, the chip can be secured by programming the security bits located in
the options/security byte in the Flash memory array. These non-volatile bits will keep the device secured through reset and
power-down.
The options/security byte is located at address 0xFF0F (= global address 0x7F_FF0F) in the Flash memory array. This byte can
be erased and programmed like any other Flash location. Two bits of this byte are used for security (SEC[1:0]). On devices which
have a memory page window, the Flash options/security byte is also available at address 0xBF0F by selecting page 0x3F with
the PPAGE register. The contents of this byte are copied into the Flash security register (FSEC) during a reset sequence.
The meaning of the bits KEYEN[1:0] is shown in Table 336. Please refer to Section 5.35.0.2.5, “Unsecuring the MCU Using the
Backdoor Key Access"” for more information.
The meaning of the security bits SEC[1:0] is shown in Table 337. For security reasons, the state of device security is controlled
by two bits. To put the device in unsecured mode, these bits must be programmed to SEC[1:0] = ‘10’. All other combinations put
the device in a secured mode. The recommended value to put the device in secured state is the inverse of the unsecured state,
i.e. SEC[1:0] = ‘01’.
NOTE
Please refer to the Flash block guide for actual security configuration (in section “Flash
Module Security”).
5.35.0.2 Operation of the Secured Microcontroller
By securing the device, unauthorized access to the EEPROM and Flash memory contents can be prevented. However, it must
be understood that the security of the EEPROM and Flash memory contents also depends on the design of the application
program. For example, if the application has the capability of downloading code through a serial port and then executing that
code (e.g. an application containing bootloader code), then this capability could potentially be used to read the EEPROM and
Flash memory contents even when the microcontroller is in the secure state. In this example, the security of the application could
be enhanced by requiring a challenge/response authentication before any code can be downloaded.
Secured operation has the following effects on the microcontroller:
5.35.0.2.1 Normal Single Chip Mode (NS)
• Background debug module (BDM) operation is completely disabled.
• Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for details.
• Tracing code execution using the DBG module is disabled.
Table 335. Flash Options/Security Byte
76543210
0xFF0F KEYEN1 KEYEN0 NV5 NV4 NV3 NV2 SEC1 SEC0
Table 336. Backdoor Key Access Enable Bits
KEYEN[1:0] Backdoor Key
Access Enabled
00 0 (disabled)
01 0 (disabled)
10 1 (enabled)
11 0 (disabled)
Tab le 337. Security Bits
SEC[1:0] Security State
00 1 (secured)
01 1 (secured)
10 0 (unsecured)
11 1 (secured)
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Freescale Semiconductor 234
5.35.0.2.2 Special Single Chip Mode (SS)
• BDM firmware commands are disabled.
• BDM hardware commands are restricted to the register space.
• Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for details.
• Tracing code execution using the DBG module is disabled.
Special single chip mode means BDM is active after reset. The availability of BDM firmware commands depends on the security
state of the device. The BDM secure firmware first performs a blank check of both the Flash memory and the EEPROM. If the
blank check succeeds, security will be temporarily turned off and the state of the security bits in the appropriate Flash memory
location can be changed If the blank check fails, security will remain active, only the BDM hardware commands will be enabled,
and the accessible memory space is restricted to the peripheral register area. This will allow the BDM to be used to erase the
EEPROM and Flash memory without giving access to their contents. After erasing both Flash memory and EEPROM, another
reset into special single chip mode will cause the blank check to succeed and the options/security byte can be programmed to
“unsecured” state via BDM.
While the BDM is executing the blank check, the BDM interface is completely blocked, which means that all BDM commands are
temporarily blocked.
5.35.0.2.3 Executing from Internal Memory in Expanded Mode
The user may choose to operate from internal memory while in expanded mode. To do this the user must start in single chip mode
and write to the mode bits selecting expanded operation. In this mode internal visibility and IPIPE are blocked. If the users
program tries to execute from outside the program memory space (internal space occupied by the FLASH), the FLASH and
EEPROM will be disabled. BDM operations will be blocked.
If the user begins operation in single chip mode with security on, the user is constrained to operate out of internal memory - even
if the user changes to expanded mode. To accomplish this the MMC needs to register that the part started in single chip mode
and was secured. The CPU will provide the state of the two high-order bits of the Program Counter. All this information, plus the
firmware size information is used to determine that the part is executing in the proper space. If the program strays, the selects
for FLASH and EEPROM are disabled by the MMC until the part goes through reset.
5.35.0.2.4 Unsecuring the Microcontroller
Unsecuring the microcontroller can be done by three different methods:
1. Backdoor key access
2. Reprogramming the security bits
3. Complete memory erase (special modes)
5.35.0.2.5 Unsecuring the MCU Using the Back door Key Access
In normal modes (single chip and expanded), security can be temporarily disabled using the backdoor key access method. This
method requires that:
• The backdoor key at 0xFF00–0xFF07 (= global addresses 0x7F_FF00–0x7F_FF07) has been programmed to a valid
value.
• The KEYEN[1:0] bits within the Flash options/security byte select ‘enabled’.
• In single chip mode, the application program programmed into the microcontroller must be designed to have the
capability to write to the backdoor key locations.
The backdoor key values themselves would not normally be stored within the application data, which means the application
program would have to be designed to receive the backdoor key values from an external source (e.g. through a serial port).
The backdoor key access method allows debugging of a secured microcontroller without having to erase the Flash. This is
particularly useful for failure analysis.
NOTE
No word of the backdoor key is allowed to have the value 0x0000 or 0xFFFF.
5.35.0.3 Reprogramming the Security Bits
In normal single chip mode (NS), security can also be disabled by erasing and reprogramming the security bits within Flash
options/security byte to the unsecured value. Because the erase operation will erase the entire sector from 0xFE00–0xFFFF
(0x7F_FE00–0x7F_FFFF), the backdoor key and the interrupt vectors will also be erased; this method is not recommended for
normal single chip mode. The application software can only erase and program the Flash options/security byte if the Flash sector
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 235
containing the Flash options/security byte is not protected (see Flash protection). Thus Flash protection is a useful means of
preventing this method. The microcontroller will enter the unsecured state after the next reset following the programming of the
security bits to the unsecured value.
This method requires that:
• The application software previously programmed into the microcontroller has been designed to have the capability to
erase and program the Flash options/security byte, or security is first disabled using the backdoor key method, allowing
BDM to be used to issue commands to erase and program the Flash options/security byte.
• The Flash sector containing the Flash options/security byte is not protected.
5.35.0.4 Complete Memory Erase (Special Modes)
The microcontroller can be unsecured in special modes by erasing the entire EEPROM and Flash memory contents.
When a secure microcontroller is reset into special single chip mode (SS), the BDM firmware verifies whether the EEPROM and
Flash memory are erased. If any EEPROM or Flash memory address is not erased, only BDM hardware commands are enabled.
BDM hardware commands can then be used to write to the EEPROM and Flash registers to mass erase the EEPROM and all
Flash memory blocks.
When next reset into special single chip mode, the BDM firmware will again verify whether all EEPROM and Flash memory are
erased, and this being the case, will enable all BDM commands, allowing the Flash options/security byte to be programmed to
the unsecured value. The security bits SEC[1:0] in the Flash security register will indicate the unsecure state following the next
reset.
5.36 Initialization of a Virgin Device
“Virgin” cells in the Flash array will read all programmed and the MCU will be secured as the SEC[1:0] bits would be loaded with
‘00’ from the Flash security byte.
At wafer probe NVM BIST mode is used to test and initialize the Flash IFR block. Wafer probe will leave the Flash block erased
so the MCU will be secured.
For blind-assembled products, the following sequence must be used to initialize the Flash array:
• Reset the MCU into special mode.
• Set FCLKDIV to provide a proper FCLK period.
• Set FPROT register to the unprotected state.
• Set the WRALL bit in the FTSTMOD register, if available.
• Load the Flash Pulse Timer with the mass erase time by executing a LDPTMR command write sequence.
• Execute MASERSI commands to mass erase the Flash main block and Flash IFR block.
• Execute the LDPTMR and PGMI command write sequence to program all timing parameters into the Flash IFR block.
• Reset the MCU into special single chip mode. After the reset the BDM secure firmware executes a blank check
command. If the blank check succeeds the MCU will be temporarily unsecured.
• Execute the PGM command write sequence to program the security byte to the unsecured state.
Blocking access to memories which can be secured during SCAN testing is necessary. While it would take a fair amount of
sophistication on the part of a “thief”, our DFT people still consider this a major risk to security. It is therefore highly recommended
that accesses to the FLASH and EEPROM arrays be blocked at chip level during scan test. Blocking or not blocking security at
the core level will not help this.
5.37 Impact of Security on Test
When silicon comes out of processing, it is extremely unlikely that the security bits will be configured for unsecure. There will
need to be “hooks” for running BIST (if present) or Burn-in by bypassing the security.
If wafer level burn-in is to be used, security must have a bypass which can be connected to by the burn-in layer. In burn-in,
security is bypassed, but when the burn-in layer is removed, the state of secreq determines whether the part is secured or not.
This may require some sort of weak pull-up device. At some point during testing the internal FLASH and EEPROM will need to
be unsecured. This test program should follow the same sequence as a user to unsecure the part: erase the memories, bring the
part up in special mode, erase and program the security bits to the unsecured state.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 236
5.38 S12 Clock, Reset and Power Management Unit (S12CPMU)
5.38.1 Introduction
This specification describes the function of the Clock, Reset and Power Management Unit.
• The Pierce oscillator (OSCLCP) provides a robust, low-noise and low-power external clock source. It is designed for
optimal start-up margin with typical crystal oscillators.
• The Voltage regulator (IVREG) operates from the range 3.13 to 5.5 V. It provides all the required chip internal voltages
and voltage monitors.
• The Phase Locked Loop (PLL) provides a highly accurate frequency multiplier with internal filter.
• The Internal Reference Clock (IRC1M) provides a 1.0 MHz clock.
5.38.1.1 Features
The Pierce Oscillator (OSCLCP) contains circuitry to dynamically control current gain in the output amplitude. This ensures a
signal with low harmonic distortion, low power and good noise immunity.
• Supports crystals or resonators from 4.0 to 16 MHz.
• High noise immunity due to input hysteresis and spike filtering.
• Low RF emissions with peak-to-peak swing limited dynamically
• Transconductance (gm) sized for optimum start-up margin for typical crystals
• Dynamic gain control eliminates the need for external current limiting resistor
• Integrated resistor eliminates the need for external bias resistor.
• Low power consumption: Operates from internal 1.8 V (nominal) supply, Amplitude control limits power
The Voltage Regulator (IVREG) has the following features:
• Input voltage range from 3.13 to 5.5 V
• Low-voltage detect (LVD) with low-voltage interrupt (LVI)
• Power-on reset (POR)
• Low-voltage reset (LVR)
• during scan pattern execution option to go to RPM to support IDDq test.
• external voltage reference used for HV-stress test and MIM screen, the external voltage on VDDA, divided by series
resistors, will be used as input to the regulating loop of the IVREG
The Phase Locked Loop (PLL) has the following features:
• highly accurate and phase locked frequency multiplier
• Configurable internal filter for best stability and lock time.
• Frequency modulation for defined jitter and reduced emission
• Automatic frequency lock detector
• Interrupt request on entry or exit from locked condition
• Reference clock either external (crystal) or internal square wave (1.0 MHz IRC1M) based.
• PLL stability is sufficient for LIN communication, even if using IRC1M as reference clock
The Internal Reference Clock (IRC1M) has the following features:
• Trimmable in frequency
• Factory trimmed value for 1.0 MHz in Flash Memory, can be overwritten by application if required
Other features of the S12CPMU include
• Clock monitor to detect loss of crystal
• Autonomous periodical interrupt (API)
• Bus Clock Generator
— Clock switch to select either PLLCLK or external crystal/resonator based Bus Clock
— PLLCLK divider to adjust system speed
• System Reset generation from the following possible sources:
— Power-on reset (POR)
— Low-voltage reset (LVR)
— Illegal address access
— COP timeout
— Loss of oscillation (clock monitor fail)
— External pin RESET
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Freescale Semiconductor 237
5.38.1.2 Modes of Opera tio n
This subsection lists and briefly describes all operating modes supported by the S12CPMU.
5.38.1.2.1 Run Mode
The voltage regulator is in Full Performance Mode (FPM).
The Phase-locked Loop (PLL) is on.
The Internal Reference Clock (IRC1M) is on.
The API is available.
• PLL Engaged Internal (PEI)
— This is the default mode after System Reset and Power-on Reset.
— The Bus Clock is based on the PLLCLK.
— After reset the PLL is configured for 64 MHz VCOCLK operation
Post divider is 0x03, so PLLCLK is VCOCLK divided by 4, that is 16 MHz and Bus Clock is 8.0 MHz.
The PLL can be reconfigured for other bus frequencies.
— The reference clock for the PLL (REFCLK) is based on internal reference clock IRC1M
• PLL Engaged External (PEE)
— The Bus Clock is based on the PLLCLK.
— This mode can be entered from default mode PEI by performing the following steps:
– Configure the PLL for desired bus frequency.
– Program the reference divider (REFDIV[3:0] bits) to divide down oscillator frequency if necessary.
– Enable the external oscillator (OSCE bit)
• PLL Bypassed External (PBE)
— The Bus Clock is based on the Oscillator Clock (OSCCLK).
— This mode can be entered from default mode PEI by performing the following steps:
– Enable the external oscillator (OSCE bit)
– Wait for oscillator to start up (UPOSC=1)
– Select the Oscillator Clock (OSCCLK) as Bus Clock (PLLSEL=0)
— The PLLCLK is still on to filter possible spikes of the external oscillator clock
5.38.1.2.2 Stop Mode
This mode is entered by executing the CPU STOP instruction.
The voltage regulator is in Reduced Power mode (RPM)
The API is available
The Phase Locked Loop (PLL) is off
The Internal Reference Clock (IRC1M) is off
Core Clock, Bus Clock and BDM Clock are stopped
Depending on the setting of the PSTP and the OSCE bit, Stop mode can be differentiated between Full Stop mode (PSTP = 0 or
OSCE=0) and Pseudo Stop mode (PSTP = 1 and OSCE=1).
• Full Stop mode (pstp = 0 or osce=0)
The external oscillator (OSCLCP) is disabled
After wake-up from Full Stop mode the Core Clock and Bus Clock are running on PLLCLK (PLLSEL=1). After wake-up
from Full Stop mode the COP and RTI are running on IRCCLK (COPOSCSEL=0, RTIOSCSEL=0)
• Pseudo Stop Mode (PSTP = 1 and OSCE=1)
The external oscillator (OSCLCP) continues to run. If the respective enable bits are set the COP and RTI will continue
to run.
The clock configuration bits PLLSEL, COPOSCSEL, RTIOSCSEL are unchanged
NOTE
When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from
Full Stop Mode with OSCE bit already 1) the software must wait for a minimum time
equivalent to the startup-time of the external oscillator tUPOSC before entering Pseudo Stop
mode.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 238
5.38.1.3 S12CPMU Block Diagram
Figure 82. Block diagram of S12CPMU
S12CPMU
EXTAL
XTAL
System Reset
Power-On Detect
PLL Lock Interrupt
MMC Illegal Address Access
COP time out
Loop
Reference
Divider
COP
Watchdog
Voltage
VDDR
Internal
Reset
Generator
Divide by
Phase
Post
Divider
1,2,…,32
VCOCLK
ECLK2X
LOCKIE
IRCTRIM[9:0]
SYNDIV[5:0]
LOCK
REFDIV[3:0]
2*(SYNDIV+1)
Pierce
Oscillator
4MHz-16MHz
OSCE
ILAF
PORF
divide
by 2
ECLK
POSTDIV[4:0]
Power-On Reset
Controlled
locked
Loop with
internal
Filter (PLL)
REFCLK
FBCLK
REFFRQ[1:0]
VCOFRQ[1:0]
Lock
detect
Regulator
3.13 to 5.5V
Autonomous
Periodic
Interrupt (API)
API Interrupt
VDDA
VSSA
Adaptive
Oscillator
Filter PLLSEL
OSCFILT[4:0] (to MSCAN)
VDDX
VSSX
VSS Low Voltage Detect VDDX
LVRF
PLLCLK
Reference
divide
by 8
BDM Clock
Clock
(IRC1M)
Clock
Monitor
monitor fail
Real Time
Interrupt (RTI)
RTI Interrupt
PSTP
CPMURTI
Oscillator status Interrupt
(OSCLCP)
CAN_OSCCLK
Low Voltage Interrupt
ACLK
APICLK
RTICLK
IRCCLK
OSCCLK
RTIOSCSEL
CPMUCOP
COPCLK
IRCCLK
OSCCLK
COPOSCSEL
to Reset
Generator
COP time out
PCE PRE
UPOSC=0 sets PLLSEL bit
API_EXTCLK
RC
Osc.
VDD, VDDF
(core supplies)
UPOSC
RESET
OSCIE
APIE
RTIE
LVDS LVIE
Low Voltage Detect VDDA
UPOSC
UPOSC=0 clears
&
OSCCLK
divide
by 4
Bus Clock
IRCCLK
(to LCD)
OSCBW
(Bus Clock)
(Core Clock)
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Freescale Semiconductor 239
Figure 83 shows a block diagram of the OSCLCP.
Figure 83. OSCLCP Block Diagram
5.38.2 Signal Description
This section lists and describes the signals that connect off chip.
5.38.2.1 RESET
RESET is an active-low bidirectional pin. As an input it initializes the MCU asynchronously to a known start-up state. As an
open-drain output it indicates that an MCU-internal reset has been triggered.
5.38.2.2 EXTAL and XTAL
These pins provide the interface for a crystal to control the internal clock generator circuitry. EXTAL is the external clock input or
the input to the crystal oscillator amplifier. XTAL is the output of the crystal oscillator amplifier. The MCU internal OSCCLK is
derived from the EXTAL input frequency. If OSCE=0, the EXTAL pin is pulled down by an internal resistor of approximately 200
k and the XTAL pin is pulled down by an internal resistor of approximately 700 k.
NOTE
Freescale recommends an evaluation of the application board and chosen resonator or
crystal by the resonator or crystal supplier. Loop controlled circuit is not suited for overtone
resonators and crystals.
5.38.2.3 VDDR — Regulator Power Input Pin
Pin VDDR is the power input of IVREG. All currents sourced into the regulator loads flow through this pin.
An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDR and VSS can smooth ripple on VDDR.
EXTAL XTAL
Gain Control
VDD = 1.8 V
Rf
OSCCLK
Peak
Detector
VSS
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Freescale Semiconductor 240
5.38.2.4 VSS — Ground Pin
5.38.2.5 VSS must be grounded.VDDA, VSSA — Regulator Reference Supply Pins
Pins VDDA and VSSA are used to supply the analog parts of the regulator.
Internal precision reference circuits are supplied from these signals.
An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDA and VSSA can improve the quality of this supply.
5.38.2.6 VDDX, VSSX— Pad Supply Pins
This supply domain is monitored by the Low Voltage Reset circuit.
An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDX and VSSX can improve the quality of this supply.
NOTE
Depending on the device package following device supply pins are maybe combined into
one supply pin: VDDR, VDDX and VDDA.
Depending on the device package following device supply pins are maybe combined into
one supply pin: VSS, VSSX and VSSA.
Please refer to the device Reference Manual for information if device supply pins are
combined into one supply pin for certain packages and which supply pins are combined
together.
An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between the combined
supply pin pair can improve the quality of this supply.
5.38.2.7 VDD — Internal Regulator Output Supply (Core Logic)
Node VDD is a device internal supply output of the voltage regulator that provides the power supply for the core logic. This supply
domain is monitored by the Low Voltage Reset circuit.
5.38.2.8 VDDF — Internal Regulator Output Supply (NVM Logic)
Node VDDF is a device internal supply output of the voltage regulator that provides the power supply for the NVM logic. This
supply domain is monitored by the Low Voltage Reset circuit
5.38.2.9 API_EXTCLK — API external clock output pin
This pin provides the signal selected via APIES and is enabled with APIEA bit. See device specification to which pin it connects.
5.38.2.10 vddf_t es t, vdd _ te st , vd dpll_test — suppl y te st mo de pin s
These pins allow to measure internal VDDF, VDD, VDDPLL.
5.38.2.11 cpmu_test_clk
This signal is connected to a device pin and allows measuring internal clocks if cpmu_test_clk_en bit is set.
5.38.2.12 cpmu_test_xfc
This signal is connected to a device pin and allows measuring the internal PLL filter node if cpmu_test_xfc_en bit is set.
5.38.2.13 REGFT[2:0] and REGT[2:0]
With the ipt_trim_ld_en signal of the PTI, the trim values for VDD and VDDF of the VREG are loaded into CPMUTEST3 register
which directly trims the VREG.
5.38.3 Memory Map and Registers
This section provides a detailed description of all registers accessible in the S12CPMU.
5.38.3.1 Module Memory Map
The S12CPMU registers are shown in Figure 338.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 241
Table 338. CPMU Register Sum mary
Address Name Bit 7 6 5 4 3 2 1 Bit 0
0x0034 CPMU
SYNR
RVCOFRQ[1:0] SYNDIV[5:0]
W
0x0035 CPMU
REFDIV
RREFFRQ[1:0] 00 REFDIV[3:0]
W
0x0036 CPMU
POSTDIV
R0 0 0 POSTDIV[4:0]
W
0x0037 CPMUFLG RRTIF PORF LVRF LOCKIF LOCK ILAF OSCIF UPOSC
W
0x0038 CPMUINT RRTIE 00
LOCKIE 00
OSCIE 0
W
0x0039 CPMUCLKS RPLLSEL PSTP 00
PRE PCE RTI
OSCSEL
COP
OSCSEL
W
0x003A CPMUPLL R0 0 FM1 FM0 00 0 0
W
0x003B CPMURTI RRTDEC RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0
W
0x003C CPMUCOP RWCOP RSBCK 000
CR2 CR1 CR0
W WRTMASK
0x003D RESERVEDC
PMUTEST0
Rfmcs_reg_se
l0
cpmu_test
_gfe0
cpmu_test_
xfc_en0
fc_force_e
n0 vcofrq20 0 fm_test0 test_sqw_o
sc0
W
0x003E RESERVEDC
PMUTEST1
Rpfd_force_e
n0
cpmu_test
_clk_en0
cpmu_test_
clk_sel[1]0
cpmu_test
_clk_sel[0]
0
osc_lcp_m
onitor_disa
ble0
osc_lcp_ex
tsqw_enabl
e0
pfd_force_u
p0
pfd_force_
down0
W
0x003E RESERVEDC
PMUFMCS
Rfmcs_cs[7:0]
W
0x003F CPMU
ARMCOP
R0000000 0
W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x02F0 RESERVED R00000000
W
0x02F1 CPMU
LVCTL
R0 0 0 0 0 LVDS LVIE LVIF
W
0x02F2 CPMU
APICTL
RAPICLK 00
APIES APIEA APIFE APIE APIF
W
0x02F3 CPMUAPITR RAPITR5 APITR4 APITR3 APITR2 APITR1 APITR0 00
W
0x02F4 CPMUAPIRH RAPIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8
W
0x02F5 CPMUAPIRL RAPIR7 APIR6 APIR5 APIR4 APIR3 APIR2 APIR1 APIR0
W
= Unimplemented or Reserved
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 242
5.38.3.2 Register Descrip tion s
This section describes all the S12CPMU registers and their individual bits.
Address order is as listed in Table 338.
5.38.3.2.1 S12CPMU Synthesizer Register (CPMUSYNR)
The CPMUSYNR register controls the multiplication factor of the PLL and selects the VCO frequency range.
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has no effect.
NOTE
Writing to this register clears the LOCK and UPOSC status bits.
NOTE
fVCO must be within the specified VCO frequency lock range. Bus frequency fBUS must not
exceed the specified maximum.
The VCOFRQ[1:0] bits are used to configure the VCO gain for optimal stability and lock time. For correct PLL operation the
VCOFRQ[1:0] bits have to be selected according to the actual target VCOCLK frequency as shown in Table 340. Setting the
VCOFRQ[1:0] bits incorrectly can result in a non functional PLL (no locking and/or insufficient stability).
0x02F6 RESERVEDC
PMUTEST3
R0 LVRT0vdd_exter
nal_en 0 REGFT2 0 REGFT1 0 REGFT0 0 REGT2 0 REGT1 0 REGT0
W
0x02F7 RESERVED R00000000
W
0x02F8 CPMU
IRCTRIMH
RTCTRIM[4:0] 0IRCTRIM[9:8]
W
0x02F9 CPMU
IRCTRIML
RIRCTRIM[7:0]
W
0x02FA CPMUOSC ROSCE OSCBW
OSCPINS_
EN OSCFILT[4:0]
W
0x02FB CPMUPROT R0000000
PROT
W
0x02FC RESERVEDC
PMUTEST2
R 0 0 0 LVRS 0 LVRFS 0 LVRXS 0 0 0RCEXA
W
Tabl e 339. S12CPMU Synthesizer Register (CPMUSYNR)
0x0034
76543210
RVCOFRQ[1:0] SYNDIV[5:0]
W
Reset01011111
Table 338. CPMU Register Sum mary
Address Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
fVCO 2fREF
SYNDIV 1+=
If PLL has locked (LOCK=1)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 243
5.38.3.2.2 S12CPMU Reference Divider Register (CPMUREFDIV)
The CPMUREFDIV register provides a finer granularity for the PLL multiplier steps when using the external oscillator as
reference.
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has no effect.
NOTE
Write to this register clears the LOCK and UPOSC status bits.
The REFFRQ[1:0] bits are used to configure the internal PLL filter for optimal stability and lock time. For correct PLL operation
the REFFRQ[1:0] bits have to be selected according to the actual REFCLK frequency as shown in Table 342.
If IRC1M is selected as REFCLK (OSCE=0) the PLL filter is fixed configured for the 1.0 MHz <= fREF <= 2.0 MHz range. The bits
can still be written but will have no effect on the PLL filter configuration.
For OSCE=1, setting the REFFRQ[1:0] bits incorrectly can result in a non functional PLL (no locking and/or insufficient stability).
Ta ble 340. VCO Clock Frequency Selection
VCOCLK Frequency Ranges VCOFRQ[1:0]
32 MHz <= fVCO<= 48 MHz 00
48 MHz < fVCO<= 6 4MHz 01
Reserved 10
Reserved 11
Table 341. S12CPMU Reference Divider Register (CPMUREFDIV)
0x0035
76543210
RREFFRQ[1:0] 00 REFDIV[3:0]
W
Reset00001111
fREF fOSC
REFDIV 1+
--------------------------------------
=
If OSCLCP is enabled (OSCE=1)
If OSCLCP is disabled (OSCE=0) fREF fIRC1M
=
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 244
5.38.3.2.3 S12CPMU Post Divider Register (CPMUPOSTDIV)
The POSTDIV register controls the frequency ratio between the VCOCLK and the PLLCLK.
Read: Anytime
Write: Anytime if PLLSEL=1. Else write has no effect.
5.38.3.2.4 S12CPMU Flags Register (CPMUFLG)
This register provides S12CPMU status bits and flags.
Read: Anytime
Write: Refer to each bit for individual write conditions
Table 342. Reference Clock Frequency Selection if OSC_LCP is enabled
REFCLK Frequency Ranges (OSCE=1) REFFRQ[1:0]
1.0 MHz <= fREF <= 2.0 MHz 00
2.0 MHz < fREF <= 6.0 MHz 01
6.0 MHz < fREF <= 12.0 MHz 10
fREF >12 MHz 11
Table 343. S12CPMU Post Divider Register (CPMUPOSTDIV)
0x0036
76543210
R0 0 0 POSTDIV[4:0]
W
Reset00000011
= Unimplemented or Reserved
Ta ble 344. S12CPMU Flags Register (CPMUFLG)
0x0037
76543210
RRTIF PORF LVRF LOCKIF LOCK ILAF OSCIF UPOSC
W
Reset 0 (185) (186) 00
(187) 00
= Unimplemented or Reserved
Note:
185. PORF is set to 1 when a power on reset occurs. Unaffected by System Reset.
186. LVRF is set to 1 when a low voltage reset occurs. Unaffected by System Reset. Set by power on reset.
187. ILAF is set to 1 when an illegal address reset occurs. Unaffected by System Reset. Cleared by power on reset.
fPLL fVCO
POSTDIV 1+
-------------------------------------------
=
If PLL is locked (LOCK=1)
If PLL is not locked (LOCK=0) fPLL fVCO
4
---------------
=
fbus fPLL
2
-------------
=
If PLL is selected (PLLSEL=1)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 245
NOTE
The Adaptive Oscillator Filter uses the VCO clock as a reference to continuously qualify the
external oscillator clock. Because of this, the PLL is always active and a valid PLL
configuration is required for the system to work properly. Furthermore, the Adaptive
Oscillator Filter is used to determine the status of the external oscillator (reflected in the
UPOSC bit). Since this function also relies on the VCO clock, loosing PLL lock status
(LOCK=0, except for entering Pseudo Stop mode) means loosing the oscillator status
information as well (UPOSC=0).
Table 345. CPMUFLG Field Descriptions
Field Description
7
RTIF
Real Time Interrupt Flag — RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing a 1. Writing
a 0 has no effect. If enabled (RTIE=1), RTIF causes an interrupt request.
0 RTI timeout has not yet occurred.
1 RTI timeout has occurred.
6
PORF
Power on Reset Flag — PORF is set to 1 when a power on reset occurs. This flag can only be cleared by writing a 1. Writing
a 0 has no effect.
0 Power on reset has not occurred.
1 Power on reset has occurred.
5
LVRF
Low Voltage Reset Flag — LVRF is set to 1 when a low voltage reset occurs. This flag can only be cleared by writing a 1.
Writing a 0 has no effect.
0 Low voltage reset has not occurred.
1 Low voltage reset has occurred.
4
LOCKIF
PLL Lock Interrupt Flag — LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared by writing a 1.
Writing a 0 has no effect.If enabled (LOCKIE=1), LOCKIF causes an interrupt request.
0 No change in LOCK bit.
1 LOCK bit has changed.
3
LOCK
Lock Status Bit — LOCK reflects the current state of PLL lock condition. Writes have no effect. While PLL is unlocked
(LOCK=0) fPLL is fVCO / 4 to protect the system from high core clock frequencies during the PLL stabilization time tlock.
0 VCOCLK is not within the desired tolerance of the target frequency. fPLL = fVCO/4.
1 VCOCLK is within the desired tolerance of the target frequency. fPLL = fVCO/(POSTDIV+1).
2
ILAF
Illegal Address Reset Flag — ILAF is set to 1 when an illegal address reset occurs. Refer to MMC chapter for details. This
flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 Illegal address reset has not occurred.
1 Illegal address reset has occurred.
1
OSCIF
Oscillator Interrupt Flag — OSCIF is set to 1 when UPOSC status bit changes. This flag can only be cleared by writing a 1.
Writing a 0 has no effect.If enabled (OSCIE=1), OSCIF causes an interrupt request.
0 No change in UPOSC bit.
1 UPOSC bit has changed.
0
UPOSC
Oscillator Status Bit — UPOSC reflects the status of the oscillator. Writes have no effect. While UPOSC=0 the OSCCLK
going to the MSCAN module is off. Entering Full Stop Mode UPOSC is cleared.
0 The oscillator is off or oscillation is not qualified by the PLL.
1 The oscillator is qualified by the PLL.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 246
5.38.3.2.5 S12CPMU Interrupt Enable Register (CPMUINT)
This register enables S12CPMU interrupt requests.
Read: Anytime
Write: Anytime
5.38.3.2.6 S12CPMU Clock Select Register (CPMUCLKS)
This register controls S12CPMU clock selection.
Read: Anytime
Write:
1. Only possible if PROT=0 (CPMUPROT register) in all MCU Modes (Normal and Special mode).
2. All bits in Special mode (if PROT=0).
3. PLLSEL, PSTP, PRE, PCE, RTIOSCSEL: In Normal mode (if PROT=0).
4. COPOSCSEL: In Normal mode (if PROT=0) until CPMUCOP write once is taken. If COPOSCSEL was cleared by
UPOSC=0 (entering full stop mode with COPOSCSEL=1 or insufficient OSCCLK quality), then COPOSCSEL can be
set again once.
NOTE
After writing CPMUCLKS register, it is strongly recommended to read back CPMUCLKS
register to make sure that write of PLLSEL, RTIOSCSEL and COPOSCSEL was successful.
Table 346. S12CPMU Interrupt Enable Register (CPMUINT)
0x0038
76543210
RRTIE 00
LOCKIE 00
OSCIE 0
W
Reset00000000
= Unimplemented or Reserved
Table 347. CRGINT Field Descriptions
Field Description
7
RTIE
Real Time Interrupt Enable Bit
0 Interrupt requests from RTI are disabled.
1 Interrupt will be requested whenever RTIF is set.
4
LOCKIE
PLL Lock Interrupt Enable Bit
0 PLL LOCK interrupt requests are disabled.
1 Interrupt will be requested whenever LOCKIF is set.
1
OSCIE
Oscillator Corrupt Interrupt Enable Bit
0 Oscillator Corrupt interrupt requests are disabled.
1 Interrupt will be requested whenever OSCIF is set.
Table 348. S12CPMU Clock Select Register (CPMUC LKS)
0x0039
76543210
RPLLSEL PSTP 00
PRE PCE RTI
OSCSEL
COP
OSCSEL
W
Reset10000000
= Unimplemented or Reserved
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 247
5.38.3.2.7 S12CPMU PLL Control Register (CPMUPLL)
This register controls the PLL functionality.
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has no effect.
Table 349. CPMUCLKS Descriptions
Field Description
7
PLLSEL
PLL Select Bit
This bit selects the PLLCLK as source of the System Clocks (Core Clock and Bus Clock).
PLLSEL can only be set to 0, if UPOSC=1.
UPOSC= 0 sets the PLLSEL bit.
Entering Full Stop Mode sets the PLLSEL bit.
0 System clocks are derived from OSCCLK if oscillator is up (UPOSC=1, fBUS = fOSC / 2.
1 System clocks are derived from PLLCLK, fBUS = fPLL / 2.
6
PSTP
Pseudo Stop Bit
This bit controls the functionality of the oscillator during Stop Mode.
0 Oscillator is disabled in Stop Mode (Full Stop Mode).
1 Oscillator continues to run in Stop Mode (Pseudo Stop Mode), option to run RTI and COP.
Note: Pseudo Stop Mode allows for faster STOP recovery and reduces the mechanical stress and aging of the resonator in
case of frequent STOP conditions at the expense of a slightly increased power consumption.
Note: When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop Mode with OSCE
bit is already 1) the software must wait for a minimum time equivalent to the startup-time of the external oscillator tUPOSC
before entering Pseudo Stop Mode.
3
PRE
RTI Enable During Pseudo Stop Bit — PRE enables the RTI during Pseudo Stop Mode.
0 RTI stops running during Pseudo Stop Mode.
1 RTI continues running during Pseudo Stop Mode if RTIOSCSEL=1.
Note: If PRE=0 or RTIOSCSEL=0 then the RTI will go static while Stop Mode is active. The RTI counter will not be reset.
2
PCE
COP Enable During Pseudo Stop Bit — PCE enables the COP during Pseudo Stop Mode.
0 COP stops running during Pseudo Stop Mode
1 COP continues running during Pseudo Stop Mode if COPOSCSEL=1
Note: If PCE=0 or COPOSCSEL=0 then the COP will go static while Stop Mode is active. The COP counter will not be reset.
1
RTIOSCSEL
RTI Clock Select — RTIOSCSEL selects the clock source to the RTI. Either IRCCLK or OSCCLK. Changing the RTIOSCSEL
bit re-starts the RTI timeout period.
RTIOSCSEL can only be set to 1, if UPOSC=1.
UPOSC= 0 clears the RTIOSCSEL bit.
0 RTI clock source is IRCCLK.
1 RTI clock source is OSCCLK.
0
COPOSCSEL
COP Clock Select — COPOSCSEL selects the clock source to the COP. Either IRCCLK or OSCCLK. Changing the
COPOSCSEL bit re-starts the COP timeout period.
COPOSCSEL can only be set to 1, if UPOSC=1.
UPOSC= 0 clears the COPOSCSEL bit.
0 COP clock source is IRCCLK.
1 COP clock source is OSCCLK
Table 350. S12CPMU PLL Control Register (CPMUPLL)
0x003A
76543210
R0 0 FM1 FM0 0000
W
Reset00000000
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 248
NOTE
Write to this register clears the LOCK and UPOSC status bits.
NOTE
Care should be taken to ensure that the bus frequency does not exceed the specified
maximum when frequency modulation is enabled.
NOTE
The frequency modulation (FM1 and FM0) can not be used if the Adaptive Oscillator Filter
is enabled.
5.38.3.2.8 S12CPMU RTI Control Register (CPMURTI)
This register selects the timeout period for the Real Time Interrupt.
The clock source for the RTI is either IRCCLK or OSCCLK depending on the setting of the RTIOSCSEL bit. In Stop Mode with
PSTP=1 (Pseudo Stop Mode) and RTIOSCSEL=1 the RTI continues to run, else the RTI counter halts in Stop Mode.
Read: Anytime
Write: Anytime
NOTE
A write to this register starts the RTI timeout period. A change of the RTIOSCSEL bit (writing
a different value or loosing UPOSC status) restarts the RTI timeout period.
Table 351. CPMUPLL Field Desc ri pti on s
Field Description
5, 4
FM1, FM0
PLL Frequency Modulation Enable Bits — FM1 and FM0 enable frequency modulation on the VCOCLK. This is to reduce
noise emission. The modulation frequency is fref divided by 16. See Table 352 for coding.
Ta ble 352. FM Amplitude selection
FM1 FM0 FM Amplitude /
fVCO Variation
00FM off
011%
102%
114%
Ta ble 353. S12CPMU RTI Control Regi ster (CPMURTI)
0x003B
76543210
RRTDECRTR6RTR5RTR4RTR3RTR2RTR1RTR0
W
Reset00000000
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 249
Table 354. CPMURTI Field Descriptions
Field Description
7
RTDEC
Decimal or Binary Divider Select Bit — RTDEC selects decimal or binary based prescaler values.
0 Binary based divider value. See Table 355
1 Decimal based divider value. See Table 356
6–4
RTR[6:4]
Real Time Interrupt Prescale Rate Select Bits — These bits select the prescale rate for the RTI. See Table 355 and
Tab l e 3 5 6 .
3–0
RTR[3:0]
Real Time Interrupt Modulus Counter Select Bit s — These bits select the modulus counter target value to provide additional
granularity.Table 355 and Table 356 show all possible divide values selectable by the CPMURTI register.
Table 3 55. RTI Frequency Divide Rates for RTDEC = 0
RTR[3:0]
RTR[6:4] =
000
(OFF) 001
(210)010
(211)011
(212)100
(213)101
(214)110
(215)111
(216)
0000 (1) OFF(188) 210 211 212 213 214 215 216
0001 (2) OFF 2x210 2x211 2x212 2x213 2x214 2x215 2x216
0010 (3) OFF 3x210 3x211 3x212 3x213 3x214 3x215 3x216
0011 (4) OFF 4x210 4x211 4x212 4x213 4x214 4x215 4x216
0100 (5) OFF 5x210 5x211 5x212 5x213 5x214 5x215 5x216
0101 (6) OFF 6x210 6x211 6x212 6x213 6x214 6x215 6x216
0110 (7) OFF 7x210 7x211 7x212 7x213 7x214 7x215 7x216
0111 (8) OFF 8x210 8x211 8x212 8x213 8x214 8x215 8x216
1000 (9) OFF 9x210 9x211 9x212 9x213 9x214 9x215 9x216
1001 (10) OFF 10x210 10x211 10x212 10x213 10x214 10x215 10x216
1010 (11) OFF 11x210 11x211 11x212 11x213 11x214 11x215 11x216
1011 (12) OFF 12x210 12x211 12x212 12x213 12x214 12x215 12x216
1100 (13) OFF 13x210 13x211 13x212 13x213 13x214 13x215 13x216
1101 (14) OFF 14x210 14x211 14x212 14x213 14x214 14x215 14x216
1110 (15) OFF 15x210 15x211 15x212 15x213 15x214 15x215 15x216
1111 (16) OFF 16x210 16x211 16x212 16x213 16x214 16x215 16x216
Note:
188. Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility.
Table 356. RTI F r equency Divide Rates for RTDEC=1
RTR[3:0]
RTR[6:4] =
000
(1x103)001
(2x103)010
(5x103)011
(10x103)100
(20x103)101
(50x103)110
(100x103)111
(200x103)
0000 (1) 1x1032x1035x10310x10320x10350x103100x103200x103
0001 (2) 2x1034x10310x10320x10340x103100x103200x103400x103
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 250
5.38.3.2.9 S12CPMU COP Control Register (CPMUCOP)
This register controls the COP (Computer Operating Properly) watchdog.
The clock source for the COP is either IRCCLK or OSCCLK depending on the setting of the COPOSCSEL bit. In Stop Mode with
PSTP=1(Pseudo Stop Mode), COPOSCSEL=1 and PCE=1 the COP continues to run, else the COP counter halts in Stop Mode.
Read: Anytime
Write:
1. RSBCK: anytime in Special Mode; write to “1” but not to “0” in Normal Mode
2. WCOP, CR2, CR1, CR0:
— Anytime in Special Mode, when WRTMASK is 0, otherwise it has no effect
— Write once in Normal Mode, when WRTMASK is 0, otherwise it has no effect.
– Writing CR[2:0] to “000” has no effect, but counts for the “write once” condition.
– Writing WCOP to “0” has no effect, but counts for the “write once” condition.
0010 (3) 3x1036x10315x10330x10360x103150x103300x103600x103
0011 (4) 4x1038x10320x10340x10380x103200x103400x103800x103
0100 (5) 5x10310x10325x10350x103100x103250x103500x1031x106
0101 (6) 6x10312x10330x10360x103120x103300x103600x1031.2x106
0110 (7) 7x10314x10335x10370x103140x103350x103700x1031.4x106
0111 (8) 8x10316x10340x10380x103160x103400x103800x1031.6x106
1000 (9) 9x10318x10345x10390x103180x103450x103900x1031.8x106
1001 (10) 10 x10320x10350x103100x103200x103500x1031x1062x106
1010 (11) 11 x10322x10355x103110x103220x103550x1031.1x1062.2x106
1011 (12) 12x10324x10360x103120x103240x103600x1031.2x1062.4x106
1100 (13) 13x10326x10365x103130x103260x103650x1031.3x1062.6x106
1101 (14) 14x10328x10370x103140x103280x103700x1031.4x1062.8x106
1110 (15) 15x10330x10375x103150x103300x103750x1031.5x1063x106
1111 (16) 16x10332x10380x103160x103320x103800x1031.6x1063.2x106
Table 357. S12CPMU COP Control Register (CPMUCOP)
0x003C
76543210
RWCOP RSBCK 000
CR2 CR1 CR0
W WRTMASK
ResetF0000FFF
Reset 00 000
= Unimplemented or Reserved
Note:
189. After de-assert of System Reset the values are automatically loaded from the Flash memory. See Device specification for details.
Table 356. RTI F r equency Divide Rates for RTDEC=1
RTR[3:0]
RTR[6:4] =
000
(1x103)001
(2x103)010
(5x103)011
(10x103)100
(20x103)101
(50x103)110
(100x103)111
(200x103)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 251
When a non-zero value is loaded from Flash to CR[2:0] the COP timeout period is started.
A change of the COPOSCSEL bit (writing a different value or loosing UPOSC status) re-starts the COP timeout period.
In Normal Mode the COP timeout period is restarted if either of these conditions is true:
1. Writing a non-zero value to CR[2:0] (anytime in Special Mode, once in Normal Mode) with WRTMASK = 0.
2. Writing WCOP bit (anytime in Special Mode, once in Normal Mode) with WRTMASK = 0.
3. Changing RSBCK bit from “0” to “1”.
In Special Mode, any write access to CPMUCOP register restarts the COP timeout period.
5.38.3.2.10 Reserved Register CPMUTEST0
NOTE
This reserved register is designed for factory test purposes only, and is not intended for
general user access. Writing to this register when in Special Mode can alter the S12CPMU’s
functionality.
Table 358. CPMUCOP Field Descriptions
Field Description
7
WCOP
Window COP Mode Bit — When set, a write to the CPMUARMCOP register must occur in the last 25% of the selected period.
A write during the first 75% of the selected period generates a COP reset. As long as all writes occur during this window, $55
can be written as often as desired. Once $AA is written after the $55, the time-out logic restarts and the user must wait until
the next window before writing to CPMUARMCOP. Table 359 shows the duration of this window for the seven available COP
rates.
0 Normal COP operation
1 Window COP operation
6
RSBCK
COP and RTI Stop in Active BDM Mode Bit
0 Allows the COP and RTI to keep running in Active BDM mode.
1 Stops the COP and RTI counters whenever the part is in Active BDM mode.
5
WRTMASK
Write Mask for WCOP and CR[2:0] Bit — This write-only bit serves as a mask for the WCOP and CR[2:0] bits while writing
the CPMUCOP register. It is intended for BDM writing the RSBCK without changing the content of WCOP and CR[2:0].
0 Write of WCOP and CR[2:0] has an effect with this write of CPMUCOP
1 Write of WCOP and CR[2:0] has no effect with this write of CPMUCOP. (Does not count for “write once”.)
2–0
CR[2:0]
COP Watchdog Timer Rate Select — These bits select the COP timeout rate (see Table 359). Writing a nonzero value to
CR[2:0] enables the COP counter and starts the timeout period. A COP counter timeout causes a System Reset. This can be
avoided by periodically (before timeout) initializing the COP counter via the CPMUARMCOP register.
While all of the following four conditions are true the CR[2:0], WCOP bits are ignored and the COP operates at highest timeout
period (2 24 cycles) in normal COP mode (Window COP mode disabled):
1) COP is enabled (CR[2:0] is not 000)
2) BDM mode active
3) RSBCK = 0
4) Operation in Special Mode
Table 359. COP Watchdog Rates
CR2 CR1 CR0 COPCLK - Cycles to Timeout
(COPCLK is either IRCCLK or OSCCLK
depending on the COPOSCSEL bit)
0 0 0 COP disabled
001 2
14
010 2
16
011 2
18
100 2
20
101 2
22
110 2
23
111 2
24
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 252
Read: Anytime
Write: Only in Special Mode
Table 360. Reserved Register (CPMUTEST0)
0x003D
76543210
Rfmcs_reg_se
l0
cpmu_test_
gfe0
cpmu_test_x
fc_en0fc_force_en0vcofrq200fm_test0test_sqw_o
sc0
W
Reset 0 Note 10000000
1) Power on reset clears the crg_test_gfe bit
= Unimplemented or Reserved
Tabl e 361. CPMUTEST0 Field Descriptions
Field Description
7
fmcs_reg_sel
FMCS Register Select Bit— This bit switches either CPMUTEST1 or CPMUFMCS test register to address 0x003E.
0 CPMUTEST1 register is visible on address 0x003E, fm_cs[7:0] of hardmacro driven dynamically (triangular)
if fm_enable=1.
1 CPMUFMCS register is visible on address 0x003E, fm_cs[7:0] of hardmacro driven to value of FMCS register.
6
cpmu_test_gfe
Glitch Filter Enable Test Bit — This bit goes to the PTI controller, it is intended to enable the RESET pad glitch filter in
functional test mode (where it is by default disabled).
0 Glitch Filter disable request
1 Glitch Filter enable request
5
cpmu_test_xfc
_en
XFC Test Pin Enable — This bit routes the external XFC test pin to the internal filter node. Using this test feature make sure
that only one source is driving the internal filter node (FC). So for this case write fc_force_en=0, pfd_force_en=1,
pfd_force_up=pfd_force_down=0.
0 external XFC test pin not connected to internal filter node
1 external XFC test pin connected to internal filter node
4
fc_force_en
FC Force Enable Bit — This bit allows to force the internal filter node FC to defined values. If fc_force_en=1, REFFRQ[1] bit
(in CPMUREFDIV register) selects either 1/2 or 1/3 VDDPLL voltage to be driven on FC node. Using this test feature make sure
that only one source is driving the internal filter node (FC). So for this case write cpmu_test_xfc_en=0, pfd_force_en=1,
pfd_force_up=pfd_force_down=0.
0 Internal filter node (FC) not driven from defined values (1/2 or 1/3 VDDPLL)
1 If REFFRQ[1]=1 then internal filter node (FC) is driven to VDDPLL/3.
If REFFRQ[1]=0 then internal filter node (FC) is driven to VDDPLL/2.
3
vcofrq2
VCO gain Bit 2 — This bit selects together with the VCOFRQ[1:0] bits of the CPMUSYNR register the gain of the VtoI
converter in the PLL. Setting vcofrq2-0 all to 1 is intended for 160MHz VCOCLK generation.
1
fm_test
FM test amplitude Bit — This bit multiplies FM amplitude determined by FM1,FM0 and CPMUFMCS[7:0] by 4. This is to
amplify frequency variation on VCOCLK when using PLL test modes (pfd_force_en, fc_force_en). A higher frequency variation
is easier to measure on tester.
0 FM amplitude multiplied by 1
1 FM amplitude multiplied by 4
0
test_sqw_osc
Test square wave enable Bit — Enables XTAL pin digital input data used for Oscillator test.
0 XTAL pin as digital input disabled
1 XTAL pin as digital input enabled
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 253
5.38.3.2.11 Reserved Register CPMUTEST1
NOTE
This reserved register is designed for factory test purposes only, and is not intended for
general user access. Writing to this register when in Special Mode can alter the S12CPMU’s
functionality.
Read: Anytime
Write: Only in Special Mode
Table 362. Reserved Register (CPMUTEST1)
0x003E
76543210
Rpfd_force_e
n0
cpmu_test_c
lk_en0
cpmu_test_c
lk_sel[1]0
cpmu_test_c
lk_sel[0]0
osc_lcp_mo
nitor_disable
0
osc_lcp_exts
qw_enable0
pfd_force_u
p0
pfd_force_d
own0
W
Reset00000000
= Unimplemented or Reserved
Tabl e 363. CPMUTEST1 Field Descriptions
Field Description
7
pfd_force_en
Phase Detector Force Enable Bit— This bit breaks the PLL feedback loop and allows force of phase detector via
pfd_force_up or pfd_force_down bit or cpmu_test_xfc pin or fc_force_en.
0 Normal functionality of Phase Detector using REFCLK and FBCLK.
1 Phase detector de-connected from REFCLK and FBCLK (PLL loop open).
6
cpmu_test_clk_
en
CPMU test clock enable Bit— This bits routes the clock selected by cpmu_test_clk_sel[1:0] to external pin cpmu_test_clk.
0 CPMU test clock not observable.
1 CPMU test clock observable at external pin.
5, 4
cpmu_test_clk_
sel[1:0]
CPMU test clock select Bits— These bits select the CPMU test clock to be observed on external pin cpmu_test_clk for test
or characterization purposes.
00 = IRCCLK, 01=OSCCLK, 10=VCOCLK, 11=VCOCLK_DIV4.
3
osc_lcp_monito
r_disable
Oscillator clock monitor disable Bit — to disable the clock monitor in special single chip mode.
0 Clock monitor always enabled with OSCE=1.
1 Clock monitor disabled regardless of OSCE Bit.
2
osc_lcp_extsq
w_enable
Oscillator external square wave enable Bit — Drives directly osc_lcp_extsqw_enable input of OSCLCP hardmacro.
1
pfd_force_up
Phase Detector Force Up Bit — If pfd_force_en=1, this bits force the PLL charge pump to drive the internal filter voltage down,
that is VCOCLK frequency goes up. Using this test feature make sure that only one source is driving the internal filter node
(FC). So for this case write xfc_en=fc_force_en=pfd_force_down=0.
0 No effect.
1 If pfd_force_en=1 then the charge pump continuously drives internal filter node down.
0
pfd_force_up
Phase Detector Force Down Bit — If pfd_force_en=1, this bits force the PLL charge pump to drive the internal filter voltage
up, that is VCOCLK frequency goes down. Using this test feature make sure that only one source is driving the internal filter
node (FC). So for this case write xfc_en=fc_force_en=pfd_force_up=0.
0 No effect.
1 If pfd_force_en=1 then the charge pump continuously drives internal filter node up.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 254
5.38.3.2.12 Reserved Register CPMUFMCS
Read: Anytime
Write: Only in special mode
5.38.3.2.13 S12CPMU COP Timer Arm/Reset Register (CPMUARMCOP)
This register is used to restart the COP timeout period.
Read: Always reads $00
Write: Anytime
When the COP is disabled (CR[2:0] = “000”) writing to this register has no effect.
When the COP is enabled by setting CR[2:0] nonzero, the following applies:
Writing any value other than $55 or $AA causes a COP reset. To restart the COP timeout period write $55 followed by
a write of $AA. These writes do not need to occur back to back, but the sequence ($55, $AA) must be completed prior
to COP end of timeout period to avoid a COP reset. Sequences of $55 writes are allowed. When the WCOP bit is set,
$55 and $AA writes must be done in the last 25% of the selected timeout period; writing any value in the first 75% of
the selected period will cause a COP reset.
Figure 84. Reserved Register (C PMUFMCS)
0x003E
76543210
Rfm_cs[7:0]
W
Reset 00000000
= Unimplemented or Reserved
Table 364. CPMU FMCS Field Descriptions
Field Description
7
fm_cs[7:0]
Frequency Modulation Amplitude Bits— If fmcs_reg_sel = 1 (CPMUTEST0 register) then fm_cs[7:0] adds current of
0(fm_cs=$00) to 1 (fm_cs=$ff) times the value determined by FME1, FM0 bits to the VCO current. As a result VCOCLK
frequency will increase.
Table 365. S12CPMU CPMUARMCOP Register
0x003F
76543210
R00000000
WBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
Reset00000000
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 255
5.38.3.2.14 Low Voltage Control Register (CPMULVCTL)
The CPMULVCTL register allows the configuration of the low-voltage detect features.
Read: Anytime
Write: LVIE and LVIF are write anytime, LVDS is read only
5.38.3.2.15 Autonomous Periodica l Interrupt Control Register (CPMUAPICTL)
The CPMUAPICTL register allows the configuration of the autonomous periodical interrupt features.
Read: Anytime
Write: Anytime
Table 366. Low Voltage Control Register (CPMULVCTL)
0x02F1
76543210
R00000LVDS
LVIE LVIF
W
Reset00000U0U
= Unimplemented or Reserved
Note:
190. The Reset state of LVDS and LVIF depends on the external supplied VDDA level
Table 367. CPMULVCTL Field Descriptions
Field Description
2
LVDS
Low-voltage Detect Status Bit — This read-only status bit reflects the voltage level on VDDA. Writes have no effect.
0 Input voltage VDDA is above level VLVID or RPM.
1 Input voltage VDDA is below level VLVIA and FPM.
1
LVIE
Low-voltage Interrupt Enable Bit
0 Interrupt request is disabled.
1 Interrupt will be requested whenever LVIF is set.
0
LVIF
Low-voltage Interrupt Flag — LVIF is set to 1 when LVDS status bit changes. This flag can only be cleared by writing a 1.
Writing a 0 has no effect. If enabled (LVIE = 1), LVIF causes an interrupt request.
0 No change in LVDS bit.
1 LVDS bit has changed.
Figure 85. Auton omous Periodical Inter r upt Control Register (CPMUAPICTL)
0x02F2
76543210
RAPICLK 00
APIES APIEA APIFE APIE APIF
W
Reset 00000000
= Unimplemented or Reserved
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 256
Figure 86. Waveform selected on API_EXTCLK pin (APIEA=1, APIFE=1)
Table 368. CPMUAPICTL Field Descriptions
Field Description
7
APICLK
Autonomous Periodical Interrupt Clock Select Bit — Selects the clock source for the API. Writable only if APIFE = 0.
APICLK cannot be changed if APIFE is set by the same write operation.
0 Autonomous periodical interrupt clock used as source.
1 Bus Clock used as source.
4
APIES
Autonomous Periodical Interrupt External Select Bit — Selects the waveform at the external pin API_EXTCLK as shown
in Figure 86. See device level specification for connectivity of API_EXTCLK pin.
0 If APIEA and APIFE are set, at the external pin API_EXTCLK periodic high pulses are visible at the end of every selected
period with the size of half of the minimum period (APIR=0x0000 in Table 372).
1 If APIEA and APIFE are set, at the external pin API_EXTCLK a clock is visible with 2 times the selected API Period.
3
APIEA
Autonomous Periodical Int errupt External Access Enable Bit — If set, the waveform selected by bit APIES can be
accessed externally. See device level specification for connectivity.
0 Waveform selected by APIES can not be accessed externally.
1 Waveform selected by APIES can be accessed externally, if APIFE is set.
2
APIFE
Autonomous Periodical Interrupt Feature Enable Bit — Enables the API feature and starts the API timer when set.
0 Autonomous periodical interrupt is disabled.
1 Autonomous periodical interrupt is enabled and timer starts running.
1
APIE
Autonomous Periodical Interrupt Enable Bit
0 API interrupt request is disabled.
1 API interrupt will be requested whenever APIF is set.
0
APIF
Autonomous Periodical Interrupt Flag — APIF is set to 1 when the in the API configured time has elapsed. This flag can
only be cleared by writing a 1. Writing a 0 has no effect. If enabled (APIE = 1), APIF causes an interrupt request.
0 API time-out has not yet occurred.
1 API time-out has occurred.
APIES=0
APIES=1
API period
API min period / 2
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 257
5.38.3.2.16 Autonomous Periodica l Interrupt Trimming Register (CPMUAPITR)
The CPMUAPITR register configures the trimming of the API time-out period.
Read: Anytime
Write: Anytime
5.38.3.2.17 Autonomous Periodica l Interrupt Rate High and Low Register (CPMUAPIRH / CPMUAPIRL)
The CPMUAPIRH and CPMUAPIRL registers allow the configuration of the autonomous periodical interrupt rate.
Figure 87. Autonomous Periodical Interrupt Trimming Register (CPMUAPITR)
0x02F3
76543210
RAPITR5 APITR4 APITR3 APITR2 APITR1 APITR0 00
W
Reset FFFFFF00
Reset 000000
After de-assert of System Reset a value is automatically loaded from the Flash memory.
Table 369. CPMUAPITR Field Descriptions
Field Description
7–2
APITR[5:0]
Autonomous Periodical Interrupt Period Trimming Bits — See Tab le 3 7 0 for trimming effects. The APITR[5:0] value
represents a signed number influencing the ACLK period time.
Ta bl e 370. T rimmin g Effect of APITR
Bit Trimming Effect
APITR[5] Increases period
APITR[4] Decreases period less than APITR[5] increased it
APITR[3] Decreases period less than APITR[4]
APITR[2] Decreases period less than APITR[3]
APITR[1] Decreases period less than APITR[2]
APITR[0] Decreases period less than APITR[1]
Figure 88. Autonomou s Periodical Interrupt Rate High Register (CPMUAPIRH)
0x02F4
76543210
RAPIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8
W
Reset 00000000
= Unimplemented or Reserved
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 258
Read: Anytime
Write: Anytime if APIFE=0. Else writes have no effect.
The period can be calculated as follows depending on logical value of the APICLK bit:
APICLK=0: Period = 2*(APIR[15:0] + 1) * fACLK
APICLK=1: Period = 2*(APIR[15:0] + 1) * Bus Clock period
Figure 89. Autonomous Periodical Interrupt Rate Low Register (CPMUAPIRL)
0x02F5
76543210
RAPIR7 APIR6 APIR5 APIR4 APIR3 APIR2 APIR1 APIR0
W
Reset 00000000
Table 37 1. CPMUAPIRH / CPMUAPIRL Field Descriptions
Field Description
15-0
APIR[15:0]
Autonomous Periodi cal Inte rrupt Ra te Bits — These bits define the time-out period of the API. See Table 372 for details of
the effect of the autonomous periodical interrupt rate bits.
Table 372. Selectable Autonomous Periodical Interrupt Periods
APICLK APIR[15:0] Selected Period
0 0000 0.2 ms1
1When fACLK is trimmed to 10KHz.
0 0001 0.4 ms1
0 0002 0.6 ms1
0 0003 0.8 ms1
0 0004 1.0 ms1
0 0005 1.2 ms1
0 ..... .....
0 FFFD 13106.8 ms1
0 FFFE 13107.0 ms1
0 FFFF 13107.2 ms1
1 0000 2 * Bus Clock period
1 0001 4 * Bus Clock period
1 0002 6 * Bus Clock period
1 0003 8 * Bus Clock period
1 0004 10 * Bus Clock period
1 0005 12 * Bus Clock period
1 ..... .....
1 FFFD 131068 * Bus Clock period
1 FFFE 131070 * Bus Clock period
1 FFFF 131072 * Bus Clock period
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 259
5.38.3.2.18 Reserved Register CPMUTEST3
NOTE
This reserved register is designed for factory test purposes only, and is not intended for
general user access. Writing to this register when in Special mode can alter the S12CPMU’s
functionality.
Read: Anytime
Write: Only in Special Mode
5.38.3.2.19 S12CPMU IRC1M Trim Registers (CPMUIRCTRIMH / CPMUIRCTRIML)
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register). Else write has no effect
NOTE
Writes to these registers while PLLSEL=1 clears the LOCK and UPOSC status bits.
Table 373. Reserved Register (CPMUTEST3)
0x02F6
76543210
R0
LVRT 0vdd_extern
al_en 0REGFT2 0REGFT1 0REGFT0 0REGT2 0REGT1 0REGT0
W
Reset00000000
Power on
Reset 000000
= Unimplemented or Reserved
Ta ble 374. S12CPMU IRC1M Trim High Register (CPMUIRCTRIMH)
0x02F8
15 14 13 12 11 10 9 8
RTCTRIM[4:0] 0IRCTRIM[9:8]
W
Reset F F F F 0 0 F F
Reset 00000011
Note:
191. After de-assert of System Reset a factory programmed trim value is automatically loaded from the Flash memory to provide trimmed
Internal Reference Frequency fIRC1M_TRIM.
Ta ble 375. S12CPMU IRC1M Trim Low Register (CPMUIRCTRIML)
0x02F9
76543210
RIRCTRIM[7:0]
W
ResetFFFFFFFF
Reset 11111111
Note:
192. After de-assert of System Reset a factory programmed trim value is automatically loaded from the Flash memory to provide trimmed
Internal Reference Frequency fIRC1M_TRIM.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 260
Figure 90. IRC1M Frequency Trimming Diagram
Table 376. CPMUIRCTRIMH/L Field Descriptions
Field Description
15-11
TCTRIM
IRC1M temperature coefficient Trim Bits
Trim bits for the Temperature Coefficient (TC) of the IRC1M frequency.
Figure 91 shows the influence of the bits TCTRIM4:0] on the relationship between frequency and temperature.
Figure 91 shows an approximate TC variation, relative to the nominal TC of the IRC1M (i.e. for TCTRIM[4:0]=0x00000 or
0x10000).
9-0
IRCTRIM
IRC1M Frequency Trim Bits — Trim bits for Internal Reference Clock
After System Reset the factory programmed trim value is automatically loaded into these registers, resulting in an Internal
Reference Frequency fIRC1M_TRIM. See device electrical characteristics for value of fIRC1M_TRIM.
The frequency trimming consists of two different trimming methods:
A rough trimming controlled by bits IRCTRIM[9:6] can be done with frequency leaps of about 6% in average.
A fine trimming controlled by the bits IRCTRIM[5:0] can be done with frequency leaps of about 0.3% (this trimming determines
the precision of the frequency setting of 0.15%, i.e. 0.3% is the distance between two trimming values).
Figure 90 shows the relationship between the trim bits and the resulting IRC1M frequency.
IRCTRIM[9:0]
$000
$1FF
IRCTRIM[9:6]
IRCTRIM[5:0]
IRC1M frequency (IRCCLK)
600 kHz
1.5 MHz
1.0 MHz
$3FF
......
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 261
Figure 91. Influen c e of TCTRI M[4 :0] on the Tempera ture Coeffi ci ent
NOTE
The frequency is not necessarily linear with the temperature (in most cases it will not be).
The above diagram is meant only to give the direction (positive or negative) of the variation
of the TC, relative to the nominal TC.
Setting TCTRIM[4:0] at 0x00000 or 0x10000 does not mean that the temperature coefficient
will be zero. These two combinations basically switch off the TC compensation module,
which result in the nominal TC of the IRC1M.
Table 377. TC Trimming o f the Frequency of the IRC1M
TCTRIM[4:0] IRC1M indicative relative TC variation IRC1M indicative frequency drift for
relative TC variation
00000 0 (nominal TC of the IRC) 0%
00001 -0.27% -0.5%
00010 -0.54% -0.9%
00011 -0.81% -1.3%
00100 -1.08% -1.7%
00101 -1.35% -2.0%
00110 -1.63% -2.2%
00111 -1.9% -2.5%
01000 -2.20% -3.0%
01001 -2.47% -3.4%
01010 -2.77% -3.9%
01011 -3.04 -4.3%
01100 -3.33% -4.7%
01101 -3.6% -5.1%
frequency
temperature
TCTRIM[4:0] = 0x11111
TCTRIM[4:0] = 0x01111
- 40C 150C
TCTRIM[4:0] = 0x10000 or 0x00000 (nominal TC)
0x00001
0x00010
0x00011
0x00100
0x00101
...
0x01111
0x11111
...
0x10101
0x10100
0x10011
0x10010
0x10001
TC increases
TC decreases
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 262
NOTE
Since the IRC1M frequency is not a linear function of the temperature, but more like a
parabola, the above relative variation is only an indication and should be considered with
care.
Be aware that the output frequency varies with the TC trimming. A frequency trimming
correction is therefore necessary. The values provided in Tab l e 37 7 are typical values at
ambient temperature which can vary from device to device.
01110 -3.91% -5.6%
01111 -4.18% -5.9%
10000 0 (nominal TC of the IRC) 0%
10001 +0.27% +0.5%
10010 +0.54% +0.9%
10011 +0.81% +1.3%
10100 +1.07% +1.7%
10101 +1.34% +2.0%
10110 +1.59% +2.2%
10111 +1.86% +2.5%
11000 +2.11% +3.0%
11001 +2.38% +3.4%
11010 +2.62% +3.9%
11011 +2.89% +4.3%
11100 +3.12% +4.7%
11101 +3.39% +5.1%
11110 +3.62% +5.6%
11111 +3.89% +5.9%
Table 377. TC Trimming o f the Frequency of the IRC1M
TCTRIM[4:0] IRC1M indicative relative TC variation IRC1M indicative frequency drift for
relative TC variation
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 263
5.38.3.2.20 S12CPMU Oscillator Register (CPMUOSC)
This register configures the external oscillator (OSCLCP).
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has no effect.
NOTE
Write to this register clears the LOCK and UPOSC status bits.
NOTE
If the chosen VCOCLK-to-OSCCLK ratio divided by two ((fVCO / fOSC)/2) is not an integer
number, the filter can not be used and the OSCFILT[4:0] bits must be set to 0.
NOTE
The frequency modulation (FM1 and FM0) can not be used if the Adaptive Oscillator Filter
is enabled.
5.38.3.2.21 S12CPMU Protection Register (CPMUPROT)
This register protects the following clock configuration registers from accidental overwrite:
CPMUSYNR, CPMUREFDIV, CPMUCLKS, CPMUPLL, CPMUIRCTRIMH/L and CPMUOSC
Table 378. S12CPMU Oscillator Register (CPMUOSC)
0x02FA
76543210
ROSCE OSCBW OSCPINS_EN OSCFILT[4:0]
W
Reset00000000
Table 379. CPMUOSC Field Descriptions
Field Description
7
OSCE
Oscillator Enable Bit — This bit enables the external oscillator (OSCLCP). The UPOSC status bit in the CPMUFLG
register indicates when the oscillation is stable and OSCCLK can be selected as Bus Clock or source of the COP or RTI.
A loss of oscillation will lead to a clock monitor reset.
0 External oscillator is disabled. REFCLK for PLL is IRCCLK.
1 External oscillator is enabled.Clock monitor is enabled. REFCLK for PLL is external oscillator clock divided by
REFDIV.
Note: When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop Mode with
OSCE bit already 1) the software must wait for a minimum time equivalent to the startup-time of the external
oscillator tUPOSC before entering Pseudo Stop Mode.
6
OSCBW
Oscillator Filter Bandwidth Bit — If the VCOCLK frequency exceeds 25 MHz wide bandwidth must be selected. The
Oscillator Filter is described in more detail at Section 5.38.4.5.2, “The Adaptive Oscillator Filter"
0 Oscillator filter bandwidth is narrow (window for expected OSCCLK edge is one VCOCLK cycle).
1 Oscillator filter bandwidth is wide (window for expected OSCCLK edge is three VCOCLK cycles).
5
OSCPINS_EN
Oscillator Pins EXTAL and XTAL Enable Bit
If OSCE=1 this read-only bit is set. It can only be cleared with the next reset.
Enabling the external oscillator reserves the EXTAL and XTAL pins exclusively for oscillator application.
0 EXTAL and XTAL pins are not reserved for oscillator.
1 EXTAL and XTAL pins exclusively reserved for oscillator.
4-0
OSCFILT
Oscillator Filter Bits — When using the oscillator a noise filter can be enabled, which filters noise from the incoming
external oscillator clock and detects if the external oscillator clock is qualified or not (quality status shown by bit UPOSC).
The VCOCLK-to-OSCCLK ratio divided by two ((fVCO / fOSC)/2) must be an integer value. This value must be written to the
OSCFILT[4:0] bits to enable the Adaptive Oscillator Filter.
0x0000 Adaptive Oscillator Filter disabled.
else Adaptive Oscillator Filter enabled]
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 264
Read: Anytime
Write: Anytime
5.38.3.2.22 Reserved Register CPMUTEST2
NOTE
This reserved register is designed for factory test purposes only, and is not intended for
general user access. Writing to this register when in Special Mode can alter the S12CPMU’s
functionality.
Read: Anytime
Write: Only in Special Mode
The reserved register allows several setting to aid to perform device parametric tests This register can only be written after writing
a $E3 before into this register.
Tabl e 380. S12CPMU Protection Register (CPMUPROT)
0x02FB
76543210
R0000000
PROT
W
Reset00000000
Tabl e 381. Clock Configuration Registers Protection Bit
Field Description
0
Clock Configuration Registers Protection Bit — This bit protects the clock configuration registers from accidental overwrite
(see list of protected registers above).
Writing 0x26 to the CPMUPROT register clears the PROT bit, other write accesses set the PROT bit.
0 Protection of clock configuration registers is disabled.
1 Protection of clock configuration registers is enabled. (see list of protected registers above)
Table 382. Reserved Register CPMUTEST2
0x02FC
76543210
R0 00
LVRS 0 LVRFS 0 LVRXS 000RCEXA
W
Reset00000000
= Unimplemented or Reserved
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 265
5.38.4 Functional Description
5.38.4.1 Phase-locked Loop with Internal Filter (PLL)
The PLL is used to generate a high speed PLLCLK based on a low frequency REFCLK.
The REFCLK is by default the IRCCLK which is trimmed to fIRC1M_TRIM=1.0 MHz.
If using the oscillator (OSCE=1) REFCLK will be based on OSCCLK. For increased flexibility, OSCCLK can be divided in a range
of 1 to 16 to generate the reference frequency REFCLK using the REFDIV[3:0] bits. Based on the SYNDIV[5:0] bits the PLL
generates the VCOCLK by multiplying the reference clock by a 2, 4, 6,... 126, 128. Based on the POSTDIV[4:0] bits the VCOCLK
can be divided in a range of 1,2, 3, 4, 5, 6,... to 32 to generate the PLLCLK.
Tabl e 383. CPMUTEST2 Field Descriptions
Field Description
5
LVRS
Low Voltage Reset Detect VDD Status Bit — This read-only status bit reflects the Status of the Low Voltage Reset on VDD
when core reset disabled for parametric tests. Writes have no effect.
0 Input voltage VDD is above level VLVRA or device is in Reduced Performance Mode (RPM).
1 Input voltage VDD is below level VLVRA and device is in Full Performance Mode (FPM).
4
LVRFS
Low V oltage Reset Detect VDDF Status Bit — This read-only status bit reflects the Status of the Low Voltage Reset on VDDF
when core reset disabled for parametric tests. Writes have no effect.
0 Input voltage VDDF is above level VLVRFA or device is in RPM.
1 Input voltage VDDF is below level VLVRFA and device is in FPM.
3
LVRXS
Low V oltage Reset Detect VDDX St atus Bit — This read-only status bit reflects the Status of the Low Voltage Reset on VDDX
when core reset disabled for parametric tests. Writes have no effect.
0 Input voltage VDDX is above level VLVRXA or device is in RPM.
1 Input voltage VDDX is below level VLVRXA and device is in FPM.
0
RCEXA
Autonomous Periodical Interrupt clock (ACLK) External Access Enable Bit — The Autonomous Periodical Interrupt clock
(ACLK) can be mapped also to an output pin. See Section 1 (Device Overview) and Section Port Integration Module for details.
0 The Autonomous Periodical Interrupt clock (ACLK) is not mapped to an output pin.
1 The Autonomous Periodical Interrupt clock (ACLK) is mapped to an output pin if APIFE is set and APIEA=0.
fVCO 2fREF
SYNDIV 1+=
fREF fOSC
REFDIV 1+
--------------------------------------
=
If Oscillator is enabled (OSCE=1)
If Oscillator is disabled (OSCE=0) fREF fIRC1M
=
fPLL fVCO
POSTDIV 1+
-------------------------------------------
=
If PLL is locked (LOCK=1)
If PLL is not locked (LOCK=0) fPLL fVCO
4
---------------
=
fbus fPLL
2
-------------
=
If PLL is selected (PLLSEL=1)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 266
NOTE
Although it is possible to set the dividers to command a very high clock frequency, do not
exceed the specified bus frequency limit for the MCU.
Several examples of PLL divider settings are shown in Table 384. The following rules help to achieve optimum stability and
shortest lock time:
• Use lowest possible fVCO / fREF ratio (SYNDIV value).
• Use highest possible REFCLK frequency fREF
.
The phase detector inside the PLL compares the feedback clock (FBCLK = VCOCLK/(SYNDIV+1) with the reference clock
(REFCLK = (IRC1M or OSCCLK)/(REFDIV+1)). Correction pulses are generated based on the phase difference between the two
signals. The loop filter alters the DC voltage on the internal filter capacitor, based on the width and direction of the correction
pulse, which leads to a higher or lower VCO frequency.
The user must select the range of the REFCLK frequency (REFFRQ[1:0] bits) and the range of the VCOCLK frequency
(VCOFRQ[1:0] bits) to ensure that the correct PLL loop bandwidth is set.
The lock detector compares the frequencies of the FBCLK and the REFCLK. Therefore the speed of the lock detector is directly
proportional to the reference clock frequency. The circuit determines the lock condition based on this comparison.
If PLL LOCK interrupt requests are enabled, the software can wait for an interrupt request and for instance check the LOCK bit.
If interrupt requests are disabled, software can poll the LOCK bit continuously (during PLL start-up) or at periodic intervals. In
either case, only when the LOCK bit is set, the VCOCLK will have stabilized to the programmed frequency.
• The LOCK bit is a read-only indicator of the locked state of the PLL.
• The LOCK bit is set when the VCO frequency is within the tolerance, Lock, and is cleared when the VCO frequency is
out of the tolerance, unl.
• Interrupt requests can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling the LOCK bit.
5.38.4.2 Startup from Reset
An example of startup of clock system from Reset is given in Figure 92.
Figure 92. Startup of Clock System After Reset
Ta ble 384. Examples of PLL Div id er Settings
fosc REFDIV[3:0] fREF REFFRQ[1:0] SYNDIV[5:0] fVCO VCOFRQ[1:0] POSTDIV[4:0] fPLL fbus
off $00 1.0 MHz 00 $1F 64 MHz 01 $03 16 MHz 8.0 MHz
off $00 1.0 MHz 00 $1F 64 MHz 01 $00 64 MHz 32 MHz
off $00 1.0 MHz 00 $0F 32 MHz 00 $00 32 MHz 16 MHz
4.0 MHz $00 4.0 MHz 01 $03 32 MHz 01 $00 32 MHz 16 MHz
System
PLLCLK
Reset
f
VCORST
CPU reset state vector fetch, program execution
LOCK
POSTDIV $03 (default target f
PLL
=f
VCO
/4 = 16MHz)
f
PLL
increasing
f
PLL
=16MHz
t
lock
SYNDIV $1F (default target f
VCO
=64MHz)
$01
f
PLL
=32 MHz
example change
of POSTDIV
768 cycles
) (
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Freescale Semiconductor 267
5.38.4.3 Stop Mode using PLLCLK as Bus Clock
An example of what happens going into Stop mode and exiting Stop mode after an interrupt is shown in Figure 93. Disable PLL
Lock interrupt (LOCKIE=0) before going into Stop mode.
Figure 93. Stop Mode Using PLLCLK as Bus Clock
5.38.4.4 Full Stop Mode using Oscillator Clock as Bus Clock
An example of what happens going into Full Stop mode and exiting Full Stop mode after an interrupt is shown in Figure 94.
Disable PLL Lock interrupt (LOCKIE=0) and oscillator status change interrupt (OSCIE=0) before going into Full Stop mode.
Figure 94. Full Stop Mode Using Oscillator Clock as Bus Clock
5.38.4.5 External Oscillator
5.38.4.5.1 Enabling the External Oscillator
An example of how to use the oscillator as Bus Clock is shown in Figure 95.
PLLCLK
CPU
LOCK t
lock
STOP instructionexecution interrupt continue execution
wake-up
t
STP_REC
CPU
UPOSC
t
lock
STO P instruction
execution interrupt continue execution
wake-up
t
STP_REC
Core
Clock
select OSCCLK as Core/Bus Clock by writing PLLSEL to “0”
PLLSEL automa tic ally s e t w he n going into Full Stop Mode
OSCCLK
PLLCLK
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Freescale Semiconductor 268
Figure 95. Enabling the External Oscillator
5.38.4.5.2 The Adaptive Oscillator Filter
A spike in the oscillator clock can disturb the function of the modules driven by this clock.
The Adaptive Oscillator Filter includes two features:
1. Filter noise (spikes) from the incoming external oscillator clock. The filter feature is illustrated in Figure 96.
Figure 96. Noise Filtered by the Adaptive Oscillator Filter
2. Detect severe noise disturbance on external oscillator clock which can not be filtered and indicate the critical situation
to the software by clearing the UPOSC and LOCK status bit and setting the OSCIF and LOCKIF flag. An example for
the detection of critical noise is illustrated in Figure 97
Figure 97. Critical Noise Detected by the Adaptive Oscillator Filter
PLLSEL
OSCE
EXTAL
OSCCLK
Core
enable ex ternal oscillator by writing OSCE bit to one.
crystal/resonator starts oscilla ting
UPOSC
UPOSC flag is set upon successful start of oscillation
select OSCCLK as Core/Bus Clock by writing PLLSEL to zero
Clock based on PLLCLK based on OSCCLK
OSCE
EXTAL
OSCCLK
enable ex ternal oscillator
crystal/reson ator sta rts osc illa ting
UPOSC
OSC configure the A d a p tive Oscillator Filter
FILT 0> 0
LOCK
filtered filtered
(filtered)
OSCE
EXTAL
OSCCLK
enable external oscillator
crystal/resonator starts oscilla ting
UPOSC
OSC configure th e A daptive Oscillator Filter
FILT 0> 0
LOCK
(filtered)
phase shift can not be filtered but detected
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Freescale Semiconductor 269
NOTE
If the LOCK bit is clear due to severe noise disturbance on the external oscillator clock the
PLLCLK is derived from the VCO clock (with its actual frequency) divided by four (see also
Section 5.38.3.2.3, “S12CPMU Post Divider Register (CPMUPOSTDIV)").
The use of the filter function is only possible if the VCOCLK-to-OSCCLK ratio divided by two ((fVCO / fOSC)/2) is an integer number.
This integer value must be written to the OSCFILT[4:0] bits.
If enabled, the Adaptive Oscillator Filter is sampling the incoming external oscillator clock signal (EXTAL) with the VCOCLK
frequency.
Using VCOCLK, a time window is defined during which an edge of the OSCCLK is expected. In case of OSCBW = 1 the width
of this window is three VCOCLK cycles, if the OSCBW = 0 it is one VCOCLK cycle.
The noise detection is active for certain combinations of OSCFILT[4:0] and OSCBW bit settings as shown in Table 385.
NOTE
If the VCOCLK frequency is higher than 25 MHz the wide bandwidth must be selected
(OSCBW = 1).
5.38.4.6 System Clock Conf ig ur at io n s
5.38.4.6.1 PLL Engaged Internal Mode (PEI)
This mode is the default mode after System Reset or Power-on Reset.
The Bus Clock is based on the PLLCLK, the reference clock for the PLL is internally generated (IRC1M). The PLL is configured
to 64 MHz VCOCLK with POSTDIV set to 0x03. If locked (LOCK=1) this results in a PLLCLK of 16 MHz and a Bus Clock of
8.0 MHz. The PLL can be re-configured to other bus frequencies.
The clock sources for COP and RTI are based on the internal reference clock generator (IRC1M).
5.38.4.6.2 PLL Engaged External Mode (PEE)
In this mode, the Bus Clock is based on the PLLCLK as well (like PEI). The reference clock for the PLL is based on the external
oscillator. The adaptive spike filter and detection logic which uses the VCOCLK to filter and qualify the external oscillator clock
can be enabled.
The clock sources for COP and RTI can be based on the internal reference clock generator or on the external oscillator clock.
This mode can be entered from default mode PEI by performing the following steps:
1. Configure the PLL for desired bus frequency.
2. Optionally the adaptive spike filter and detection logic can be enabled by calculating the integer value for the
OSCFIL[4:0] bits and setting the bandwidth (OSCBW) accordingly.
3. Enable the external Oscillator (OSCE bit).
4. Wait for the PLL being locked (LOCK = 1) and the oscillator to start-up and additionally being qualified if the Adaptive
Oscillator Filter is enabled (UPOSC =1).
5. Clear all flags in the CPMUFLG register to be able to detect any future status bit change.
6. Optionally status interrupts can be enabled (CPMUINT register).
Since the Adaptive Oscillator Filter (adaptive spike filter and detection logic) uses the VCOCLK to continuously filter and qualify
the external oscillator clock, loosing PLL lock status (LOCK=0) means loosing the oscillator status information as well
(UPOSC=0).
The impact of loosing the oscillator status in PEE mode is as follows:
Table 385. Noise Detection Settings
OSCFILT[4:0] OSCBW Detection Filter
0 x disabled disabled
1 x disabled active
2 or 3 0 active active
1 disabled active
>=4 x active active
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Freescale Semiconductor 270
The PLLCLK is derived from the VCO clock (with its actual frequency) divided by four until the PLL locks again.
Application software needs to be prepared to deal with the impact of loosing the oscillator status at any time.
5.38.4.6.3 PLL Bypassed External Mode (PBE)
In this mode, the Bus Clock is based on the external oscillator clock. The reference clock for the PLL is based on the external
oscillator. The adaptive spike filter and detection logic can be enabled which uses the VCOCLK to filter and qualify the external
oscillator clock.
The clock sources for COP and RTI can be based on the internal reference clock generator or on the external oscillator clock.
This mode can be entered from default mode PEI by performing the following steps:
1. Make sure the PLL configuration is valid.
2. Optionally the adaptive spike filter and detection logic can be enabled by calculating the integer value for the
OSCFIL[4:0] bits and setting the bandwidth (OSCBW) accordingly.
3. Enable the external Oscillator (OSCE bit)
4. Wait for the PLL being locked (LOCK = 1) and the oscillator to start-up and additionally being qualified if the Adaptive
Oscillator Filter is enabled (UPOSC=1).
5. Clear all flags in the CPMUFLG register to be able to detect any status bit change.
6. Optionally status interrupts can be enabled (CPMUINT register).
7. Select the Oscillator Clock (OSCCLK) as Bus Clock (PLLSEL=0)
Since the Adaptive Oscillator Filter (adaptive spike filter and detection logic) uses the VCOCLK to continuously filter and qualify
the external oscillator clock, loosing PLL lock status (LOCK=0) means loosing the oscillator status information as well
(UPOSC=0).
The impact of loosing the oscillator status in PBE mode is as follows:
• PLLSEL is set automatically and the Bus Clock is switched back to the PLLCLK.
• The PLLCLK is derived from the VCO clock (with its actual frequency) divided by four until the PLL locks again.
Application software needs to be prepared to deal with the impact of loosing the oscillator status at any time.
In the PBE mode, not every noise disturbance can be indicated by bits LOCK and UPOSC (both bits are based on the Bus Clock
domain). There are clock disturbances possible, after which UPOSC and LOCK both stay asserted while occasional pauses on
the filtered OSCCLK and resulting Bus Clock occur. The adaptive spike filter is still functional and protects the Bus Clock from
frequency overshoot due to spikes on the external oscillator clock. The filtered OSCCLK and resulting Bus Clock will pause until
the PLL has stabilized again.
5.38.5 Resets
5.38.5.1 General
All reset sources are listed in Table 386. Refer to MCU specification for related vector addresses and priorities
.
5.38.5.2 Description of Reset Operation
Upon detection of any reset of Table 386, an internal circuit drives the RESET pin low for 512 PLLCLK cycles. After 512 PLLCLK
cycles the RESET pin is released. The reset generator of the S12CPMU waits for additional 256 PLLCLK cycles and then
samples the RESET pin to determine the originating source. Table 387 shows which vector will be fetched.
Table 386. Reset Summary
Reset Source Local Enable
Power-On Reset (POR) None
Low Voltage Reset (LVR) None
External pin RESET None
Illegal Address Reset None
Clock Monitor Reset OSCE Bit in CPMUOSC register
COP Reset CR[2:0] in CPMUCOP register
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Freescale Semiconductor 271
NOTE
While System Reset is asserted the PLLCLK runs with the frequency fVCORST.
The internal reset of the MCU remains asserted while the reset generator completes the 768 PLLCLK cycles long reset
sequence. In case the RESET pin is externally driven low for more than these 768 PLLCLK cycles (External Reset), the internal
reset remains asserted longer.
Figure 98. RESET Timing
5.38.5.2.1 Clock Monitor Reset
If the external oscillator is enabled (OSCE=1) in case of loss of oscillation or the oscillator frequency is below the failure assert
frequency fCMFA (see device electrical characteristics for values), the S12CPMU generates a Clock Monitor Reset. In Full Stop
mode the external oscillator and the clock monitor are disabled.
5.38.5.2.2 Computer Operating Properly Watchdog (COP) Reset
The COP (free running watchdog timer) enables the user to check that a program is running and sequencing properly. When the
COP is being used, software is responsible for keeping the COP from timing out. If the COP times out it is an indication that the
software is no longer being executed in the intended sequence; thus COP reset is generated.
The clock source for the COP is either IRCCLK or OSCCLK depending on the setting of the COPOSCSEL bit. In Stop Mode with
PSTP=1 (Pseudo Stop Mode), COPOSCSEL=1 and PCE=1 the COP continues to run, else the COP counter halts in Stop Mode.
Three control bits in the CPMUCOP register allow selection of seven COP time-out periods.
When COP is enabled, the program must write $55 and $AA (in this order) to the CPMUARMCOP register during the selected
time-out period. Once this is done, the COP time-out period is restarted. If the program fails to do this and the COP times out, a
COP reset is generated. Also, if any value other than $55 or $AA is written, a COP reset is generated.
Ta ble 387. Reset Vector Selection
Sampled RESET Pin
(256 cycles after release) Oscillator monitor
fail pending
COP
time out
pending Vector Fetc h
100
POR
LVR
Illegal Address Reset
External pin RESET
1 1 X Clock Monitor Reset
101COP Reset
0XX
POR
LVR
Illegal Address Reset
External pin RESET
)
(
)
PLLCLK
512 cycles 256 cycles
S12_CPMU drives
possibly
RESET driven
low
)
(
(
RESET
S12_CPMU releases
f
VCORST
RESET pin low RESET pin
f
VCORST
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 272
Windowed COP operation is enabled by setting WCOP in the CPMUCOP register. In this mode, writes to the CPMUARMCOP
register to clear the COP timer must occur in the last 25% of the selected time-out period. A premature write will immediately
reset the part.
5.38.5.3 Power-On Reset (POR)
The on-chip POR circuitry detects when the internal supply VDD drops below an appropriate voltage level. The POR is
deasserted, if the internal supply VDD exceeds an appropriate voltage level (voltage levels are not specified in this document
because this internal supply is not visible on device pins).
5.38.5.4 Low-voltage Reset (LVR)
The on-chip LVR circuitry detects when one of the supply voltages VDD, VDDF or VDDX drops below an appropriate voltage
level. If LVR is deasserted the MCU is fully operational at the specified maximum speed. The LVR assert and deassert levels for
the supply voltage VDDX are VLVRXA and VLVRXD and are specified in the device Reference Manual.
5.38.6 Interrupts
The interrupt/reset vectors requested by the S12CPMU are listed in Table 388. Refer to MCU specification for related vector
addresses and priorities.
5.38.6.1 Description of Interrupt Operation
5.38.6.1.1 Real Time Interrupt (RTI)
The clock source for the RTI is either IRCCLK or OSCCLK depending on the setting of the RTIOSCSEL bit. In Stop mode with
PSTP=1 (Pseudo Stop mode), RTIOSCSEL=1 and PRE=1 the RTI continues to run, else the RTI counter halts in Stop mode.
The RTI can be used to generate hardware interrupts at a fixed periodic rate. If enabled (by setting RTIE=1), this interrupt will
occur at the rate selected by the CPMURTI register. At the end of the RTI timeout period the RTIF flag is set to one and a new
RTI timeout period starts immediately.
A write to the CPMURTI register restarts the RTI timeout period.
5.38.6.1.2 PLL Lock Interrupt
The S12CPMU generates a PLL Lock interrupt when the lock condition (LOCK status bit) of the PLL changes, either from a locked
state to an unlocked state or vice versa. Lock interrupts are locally disabled by setting the LOCKIE bit to zero. The PLL Lock
interrupt flag (LOCKIF) is set to 1 when the lock condition has changed, and is cleared to 0 by writing a 1 to the LOCKIF bit.
5.38.6.1.3 Oscillator Status Interrupt
The Adaptive Oscillator Filter contains two different features:
1. Filters spikes of the external oscillator clock.
2. Qualify the external oscillator clock.
When the OSCE bit is 0, then UPOSC stays 0. When OSCE=1 and OSCFILT = 0, then the filter is transparent and no spikes are
filtered. The UPOSC bit is then set after the LOCK bit is set.
Upon detection of a status change (UPOSC), that is an unqualified oscillation becomes qualified or vice versa, the OSCIF flag is
set. Going into Full Stop Mode or disabling the oscillator can also cause a status change of UPOSC.
Tab le 388. S12CPMU Interrupt Vectors
Interrupt Source CCR Mask Local Enable
RTI timeout interrupt I bit CPMUINT (RTIE)
PLL lock interrupt I bit CPMUINT (LOCKIE)
Oscillator status interrupt I bit CPMUINT (OSCIE)
Low voltage interrupt I bit CPMULVCTL (LVIE)
Autonomous Periodical
Interrupt I bit CPMUAPICTL (APIE)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 273
Also, since the Adaptive Oscillator Filter is based on the PLLCLK, any change in PLL configuration or any other event which
causes the PLL lock status to be cleared leads to a loss of the oscillator status information as well (UPOSC=0).
Oscillator status change interrupts are locally enabled with the OSCIE bit.
NOTE
Loosing the oscillator status (UPOSC=0) affects the clock configuration of the system(193).
This needs to be dealt with in application software.
Note:
193. For details please refer to “5.38.4.6, “System Clock Configurations”
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 274
5.39 Serial Peripheral Interface (S12SPIV5)
Preface
Terminology
5.39.1 Introduction
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can
poll the SPI status flags or the SPI operation can be interrupt driven.
5.39.1.1 Glossary of Terms
5.39.1.2 Features
The SPI includes these distinctive features:
• Master mode and slave mode
• Selectable 8 or 16-bit transfer width
• Bi-directional mode
• Slave select output
• Mode fault error flag with CPU interrupt capability
• Double-buffered data register
• Serial clock with programmable polarity and phase
5.39.1.3 Modes of Opera tio n
The SPI functions in two modes: run and stop.
•Run mode
This is the basic mode of operation.
• Stop mode
The SPI is inactive in stop mode for reduced power consumption. If the SPI is configured as a master, any transmission
in progress stops, but is resumed after CPU goes into run mode. If the SPI is configured as a slave, reception and
transmission of data continues, so that the slave stays synchronized to the master.
For a detailed description of operating modes, please refer to Section 5.39.4.7, “Low Power Mode Options".
5.39.1.4 Block Diagram
Figure 99 gives an overview on the SPI architecture. The main parts of the SPI are status, control and data registers, shifter logic,
baud rate generator, master/slave control logic, and port control logic.
SPI Serial Peripheral Interface
SS Slave Select
SCK Serial Clock
MOSI Master Output, Slave Input
MISO Master Input, Slave Output
MOMI Master Output, Master Input
SISO Slave Input, Slave Output
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Freescale Semiconductor 275
Figure 99. SPI Block Diagram
5.39.2 External Signal Description
This section lists the name and description of all ports including inputs and outputs that do, or may, connect off chip. The SPI
module has a total of four external pins.
5.39.2.1 MOSI — Master Out/Slave In Pin
This pin is used to transmit data out of the SPI module when it is configured as a master and receive data when it is configured
as slave.
5.39.2.2 MISO — Master In/Slave Out Pin
This pin is used to transmit data out of the SPI module when it is configured as a slave and receive data when it is configured as
master.
SPI Control Register 1
SPI Control Register 2
SPI Baud Rate Register
SPI Status Register
SPI Data Register
Shifter
Port
Control
Logic
MOSI
SCK
Interrupt Control
SPI
MSB LSB
LSBFE=1 LSBFE=0
LSBFE=0 LSBFE=1
Data In
LSBFE=1
LSBFE=0
Data Out
Baud Rate Generator
Prescaler
Bus Clock
Counter
Clock Select
SPPR 33
SPR
Baud Rate
Phase +
Polarity
Control
Master
Slave
SCK In
SCK Out
Master Baud Rate
Slave Baud Rate
Phase +
Polarity
Control
Control
Control CPOL CPHA
2
BIDIROE
SPC0
2
Shift Sample
ClockClock
MODF
SPIF SPTEF
SPI
Request
Interrupt
SS
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 276
5.39.2.3 SS — Slave Select Pin
This pin is used to output the select signal from the SPI module to another peripheral with which a data transfer is to take place
when it is configured as a master and it is used as an input to receive the slave select signal when the SPI is configured as slave.
5.39.2.4 SCK — Serial Clock Pin
In master mode, this is the synchronous output clock. In slave mode, this is the synchronous input clock.
5.39.3 Memory Map and Register Definition
This section provides a detailed description of address space and registers used by the SPI.
5.39.3.1 Module Memory Map
The memory map for the SPI is given in Figure 389. The address listed for each register is the sum of a base address and an
address offset. The base address is defined at the SoC level and the address offset is defined at the module level. Reads from
the reserved bits return zeros and writes to the reserved bits have no effect.
5.39.3.2 Register Descrip tion s
This section consists of register descriptions in address order. Each description includes a standard register diagram with an
associated figure number. Details of register bit and field function follow the register diagrams, in bit order.
Table 389. SPI Register Summary
Register
Name Bit 7654321Bit 0
SPICR1 RSPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
SPICR2 R0 XFRW 0MODFEN BIDIROE 0SPISWAI SPC0
W
SPIBR R0 SPPR2 SPPR1 SPPR0 0SPR2 SPR1 SPR0
W
SPISR RSPIF0SPTEFMODF0000
W
SPIDRH R R15 R14 R13 R12 R11 R10 R9 R8
T15 T14 T13 T12 T11 T10 T9 T8W
SPIDRL RR7R6R5R4R3R2R1R0
T7 T6 T5 T4 T3 T2 T1 T0W
Reserved R
W
Reserved R
W
= Unimplemented or Reserved
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 277
5.39.3.2.1 SPI Control Register 1 (SPICR1)
Read: Anytime
Write: Anytime
Ta bl e 390. SPI Control Regis ter 1 (SPICR1)
76543210
RSPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
Reset00000100
Table 391. SPICR1 Field Description s
Field Description
7
SPIE
SPI Interrupt Enable Bit — This bit enables SPI interrupt requests, if SPIF or MODF status flag is set.
0 SPI interrupts disabled.
1 SPI interrupts enabled.
6
SPE
SPI System Enable Bit — This bit enables the SPI system and dedicates the SPI port pins to SPI system functions. If SPE
is cleared, SPI is disabled and forced into idle state, status bits in SPISR register are reset.
0 SPI disabled (lower power consumption).
1 SPI enabled, port pins are dedicated to SPI functions.
5
SPTIE
SPI Transmit Interrupt Enable — This bit enables SPI interrupt requests, if SPTEF flag is set.
0 SPTEF interrupt disabled.
1 SPTEF interrupt enabled.
4
MSTR
SPI Master/Slave Mode Select Bit — This bit selects whether the SPI operates in master or slave mode. Switching the SPI
from master to slave or vice versa forces the SPI system into idle state.
0 SPI is in slave mode.
1 SPI is in master mode.
3
CPOL
SPI Clock Polarity Bit — This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI modules, the
SPI modules must have identical CPOL values. In master mode, a change of this bit will abort a transmission in progress and
force the SPI system into idle state.
0 Active-high clocks selected. In idle state SCK is low.
1 Active-low clocks selected. In idle state SCK is high.
2
CPHA
SPI Clock Phase Bit — This bit is used to select the SPI clock format. In master mode, a change of this bit will abort a
transmission in progress and force the SPI system into idle state.
0 Sampling of data occurs at odd edges (1,3,5,...) of the SCK clock.
1 Sampling of data occurs at even edges (2,4,6,...) of the SCK clock.
1
SSOE
Slave Select Output Enable — The SS output feature is enabled only in master mode, if MODFEN is set, by asserting the
SSOE as shown in Table 392. In master mode, a change of this bit will abort a transmission in progress and force the SPI
system into idle state.
0
LSBFE
LSB-First Enable — This bit does not affect the position of the MSB and LSB in the data register. Reads and writes of the
data register always have the MSB in the highest bit position. In master mode, a change of this bit will abort a transmission in
progress and force the SPI system into idle state.
0 Data is transferred most significant bit first.
1 Data is transferred least significant bit first.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 278
5.39.3.2.2 SPI Control Register 2 (SPICR2)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
Table 392. SS Input / Output Selection
MODFEN SSOE Master Mode Slave Mode
00 SS
not used by SPI SS input
01 SS
not used by SPI SS input
10 SS
input with MODF feature SS input
11 SS
is slave select output SS input
Ta bl e 393. SPI Control Regis ter 2 (SPICR2)
76543210
R0XFRW 0MODFEN BIDIROE 0SPISWAI SPC0
W
Reset00000000
= Unimplemented or Reserved
Table 394. SPICR2 Field Description s
Field Description
6
XFRW
Transfer Width — This bit is used for selecting the data transfer width. If 8-bit transfer width is selected, SPIDRL becomes
the dedicated data register and SPIDRH is unused. If 16-bit transfer width is selected, SPIDRH and SPIDRL form a 16-bit data
register. Please refer to Section 5.39.3.2.4, “SPI Status Register (SPISR)" for information about transmit/receive data handling
and the interrupt flag clearing mechanism. In master mode, a change of this bit will abort a transmission in progress and force
the SPI system into idle state.
0 8-bit Transfer Width (n = 8)(194)
1 16-bit Transfer Width (n = 16)(194)
4
MODFEN
Mode Fault Enable Bit — This bit allows the MODF failure to be detected. If the SPI is in master mode and MODFEN is
cleared, then the SS port pin is not used by the SPI. In slave mode, the SS is available only as an input regardless of the value
of MODFEN. For an overview on the impact of the MODFEN bit on the SS port pin configuration, refer to Table 392. In master
mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state.
0SS
port pin is not used by the SPI.
1SS
port pin with MODF feature.
3
BIDIROE
Output Enable in the Bidirectional Mode of Operation — This bit controls the MOSI and MISO output buffer of the SPI,
when in bidirectional mode of operation (SPC0 is set). In master mode, this bit controls the output buffer of the MOSI port, in
slave mode it controls the output buffer of the MISO port. In master mode, with SPC0 set, a change of this bit will abort a
transmission in progress and force the SPI into idle state.
0 Output buffer disabled.
1 Output buffer enabled.
1
-
Reserved — For internal use
0
SPC0
Serial Pin Control Bit 0 — This bit enables bidirectional pin configurations as shown in Table 395. In master mode, a change
of this bit will abort a transmission in progress and force the SPI system into idle state.
Note:
194. n is used later in this document as a placeholder for the selected transfer width.
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Freescale Semiconductor 279
5.39.3.2.3 SPI Baud Rate Register (SPIBR)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
The baud rate divisor equation is as follows:
BaudRateDivisor = (SPPR + 1) 2(SPR + 1) Eqn. 100
The baud rate can be calculated with the following equation:
Baud Rate = BusClock / BaudRateDivisor Eqn. 101
NOTE
For maximum allowed baud rates, please refer to the SPI Electrical Specification in the
Electricals chapter of this data sheet.
Table 395. Bidirectional Pi n Configurations
Pin Mode SPC0 BIDIROE MISO MOSI
Master Mode of Operation
Normal 0 X Master In Master Out
Bidirectional 1 0MISO not used by SPI Master In
1 Master I/O
Slave Mode of Operation
Normal 0 X Slave Out Slave In
Bidirectional 1 0 Slave In MOSI not used by SPI
1 Slave I/O
Table 396. SPI Baud Rate Register (SPIBR)
76543210
R0
SPPR2 SPPR1 SPPR0 0SPR2 SPR1 SPR0
W
Reset00000000
= Unimplemented or Reserved
Table 3 97. SPIBR Field Descriptions
Field Description
6–4
SPPR[2:0]
SPI Baud Rate Preselection Bits — These bits specify the SPI baud rates as shown in Table 398. In master mode, a change
of these bits will abort a transmission in progress and force the SPI system into idle state.
2–0
SPR[2:0]
SPI Baud Rate Selection Bits — These bits specify the SPI baud rates as shown in Table 398. In master mode, a change of
these bits will abort a transmission in progress and force the SPI system into idle state.
Table 398. Example SPI Baud Rate Selection (25 MHz us Clock)
SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud Rate
Divisor Baud Rate
0 0 0 0 0 0 2 12.5 Mbit/s
0 0 0 0 0 1 4 6.25 Mbit/s
0 0 0 0 1 0 8 3.125 Mbit/s
0 0 0 0 1 1 16 1.5625 Mbit/s
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 280
0 0 0 1 0 0 32 781.25 kbit/s
0 0 0 1 0 1 64 390.63 kbit/s
0 0 0 1 1 0 128 195.31 kbit/s
0 0 0 1 1 1 256 97.66 kbit/s
0 0 1 0 0 0 4 6.25 Mbit/s
0 0 1 0 0 1 8 3.125 Mbit/s
0 0 1 0 1 0 16 1.5625 Mbit/s
0 0 1 0 1 1 32 781.25 kbit/s
0 0 1 1 0 0 64 390.63 kbit/s
0 0 1 1 0 1 128 195.31 kbit/s
0 0 1 1 1 0 256 97.66 kbit/s
0 0 1 1 1 1 512 48.83 kbit/s
0 1 0 0 0 0 6 4.16667 Mbit/s
0 1 0 0 0 1 12 2.08333 Mbit/s
0 1 0 0 1 0 24 1.04167 Mbit/s
0 1 0 0 1 1 48 520.83 kbit/s
0 1 0 1 0 0 96 260.42 kbit/s
0 1 0 1 0 1 192 130.21 kbit/s
0 1 0 1 1 0 384 65.10 kbit/s
0 1 0 1 1 1 768 32.55 kbit/s
0 1 1 0 0 0 8 3.125 Mbit/s
0 1 1 0 0 1 16 1.5625 Mbit/s
0 1 1 0 1 0 32 781.25 kbit/s
0 1 1 0 1 1 64 390.63 kbit/s
0 1 1 1 0 0 128 195.31 kbit/s
0 1 1 1 0 1 256 97.66 kbit/s
0 1 1 1 1 0 512 48.83 kbit/s
0 1 1 1 1 1 1024 24.41 kbit/s
1 0 0 0 0 0 10 2.5 Mbit/s
1 0 0 0 0 1 20 1.25 Mbit/s
1 0 0 0 1 0 40 625 kbit/s
1 0 0 0 1 1 80 312.5 kbit/s
1 0 0 1 0 0 160 156.25 kbit/s
1 0 0 1 0 1 320 78.13 kbit/s
1 0 0 1 1 0 640 39.06 kbit/s
1 0 0 1 1 1 1280 19.53 kbit/s
1 0 1 0 0 0 12 2.08333 Mbit/s
1 0 1 0 0 1 24 1.04167 Mbit/s
1 0 1 0 1 0 48 520.83 kbit/s
1 0 1 0 1 1 96 260.42 kbit/s
1 0 1 1 0 0 192 130.21 kbit/s
1 0 1 1 0 1 384 65.10 kbit/s
Table 398. Example SPI Baud Rate Selection (25 MHz us Clock) (continued)
SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud Rate
Divisor Baud Rate
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5.39.3.2.4 SPI Status Register (SPISR)
Read: Anytime
Write: Has no effect
1 0 1 1 1 0 768 32.55 kbit/s
1 0 1 1 1 1 1536 16.28 kbit/s
1 1 0 0 0 0 14 1.78571 Mbit/s
1 1 0 0 0 1 28 892.86 kbit/s
1 1 0 0 1 0 56 446.43 kbit/s
1 1 0 0 1 1 112 223.21 kbit/s
1 1 0 1 0 0 224 111.61 kbit/s
1 1 0 1 0 1 448 55.80 kbit/s
1 1 0 1 1 0 896 27.90 kbit/s
1 1 0 1 1 1 1792 13.95 kbit/s
1 1 1 0 0 0 16 1.5625 Mbit/s
1 1 1 0 0 1 32 781.25 kbit/s
1 1 1 0 1 0 64 390.63 kbit/s
1 1 1 0 1 1 128 195.31 kbit/s
1 1 1 1 0 0 256 97.66 kbit/s
1 1 1 1 0 1 512 48.83 kbit/s
1 1 1 1 1 0 1024 24.41 kbit/s
1 1 1 1 1 1 2048 12.21 kbit/s
Table 399. SPI Status Register (SPISR)
76543210
R SPIF 0 SPTEF MODF 0 0 0 0
W
Reset00100000
= Unimplemented or Reserved
Table 398. Example SPI Baud Rate Selection (25 MHz us Clock) (continued)
SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud Rate
Divisor Baud Rate
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Freescale Semiconductor 282
Table 400. SPI S R Field Descriptions
Field Description
7
SPIF
SPIF Interrupt Flag — This bit is set after received data has been transferred into the SPI data register. For information about
clearing SPIF Flag, please refer to Table 401.
0 Transfer not yet complete.
1 New data copied to SPIDR.
5
SPTEF
SPI Transmit Empty Interrupt Flag — If set, this bit indicates that the transmit data register is empty. For information about
clearing this bit and placing data into the transmit data register, please refer to Table 402.
0 SPI data register not empty.
1 SPI data register empty.
4
MODF
Mode Fault Flag — This bit is set if the SS input becomes low while the SPI is configured as a master and mode fault detection
is enabled, MODFEN bit of SPICR2 register is set. Refer to MODFEN bit description in Section 5.39.3.2.2, “SPI Control
Register 2 (SPICR2)". The flag is cleared automatically by a read of the SPI status register (with MODF set) followed by a
write to the SPI control register 1.
0 Mode fault has not occurred.
1 Mode fault has occurred.
Table 401. SPIF Interrupt Flag Clearing Sequence
XFRW Bit SPIF Interrupt Flag Clearing Sequence
0 Read SPISR with SPIF = 1 then Read SPIDRL
1 Read SPISR with SPIF = 1 then
Byte Read SPIDRL (195)
or
Byte Read SPIDRH (196) Byte Read SPIDRL
or
Word Read (SPIDRH:SPIDRL)
Note:
195. Data in SPIDRH is lost in this case.
196. SPIDRH can be read repeatedly without any effect on SPIF. SPIF Flag is cleared only by the read of SPIDRL after reading SPISR with
SPIF = 1.
Table 402. SPTEF Interrupt Flag Clearing Sequen ce
XFRW Bit SPTEF Interrupt Flag Clearing Sequence
0 Read SPISR with SPTEF = 1 then Write to SPIDRL (197)
1 Read SPISR with SPTEF = 1 then
Byte Write to SPIDRL (197)(198)
or
Byte Write to SPIDRH (197)(199) Byte Write to SPIDRL (197)
or
Word Write to (SPIDRH:SPIDRL) (197)
Note:
197. Any write to SPIDRH or SPIDRL with SPTEF = 0 is effectively ignored.
198. Data in SPIDRH is undefined in this case.
199. SPIDRH can be written repeatedly without any effect on SPTEF. SPTEF Flag is cleared only by writing to SPIDRL after reading SPISR
with SPTEF = 1.
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5.39.3.2.5 SPI Data Register (SPIDR = SPIDRH:SPIDRL)
Read: Anytime; read data only valid when SPIF is set
Write: Anytime
The SPI data register is both the input and output register for SPI data. A write to this register allows data to be queued and
transmitted. For an SPI configured as a master, queued data is transmitted immediately after the previous transmission has
completed. The SPI transmitter empty flag SPTEF in the SPISR register indicates when the SPI data register is ready to accept
new data.
Received data in the SPIDR is valid when SPIF is set.
If SPIF is cleared and data has been received, the received data is transferred from the receive shift register to the SPIDR and
SPIF is set.
If SPIF is set and not serviced, and a second data value has been received, the second received data is kept as valid data in the
receive shift register until the start of another transmission. The data in the SPIDR does not change.
If SPIF is set and valid data is in the receive shift register, and SPIF is serviced before the start of a third transmission, the data
in the receive shift register is transferred into the SPIDR and SPIF remains set (see Figure 102).
If SPIF is set and valid data is in the receive shift register, and SPIF is serviced after the start of a third transmission, the data in
the receive shift register has become invalid and is not transferred into the SPIDR (see Figure 103).
Figure 102. Reception with SPIF Serviced in Time
Table 403. SPI Data Re gister High (SPIDRH)
76543210
RR15 R14 R13 R12 R11 R10 R9 R8
WT15 T14 T13 T12 T11 T10 T9 T8
Reset00000000
Table 404. SPI Data Register Low (SPIDRL)
76543210
RR7 R6 R5 R4 R3 R2 R1 R0
WT7 T6 T5 T4 T3 T2 T1 T0
Reset00000000
Receive Shift Register
SPIF
SPI Data Register
Data A Data B
Data A
Data A Received Data B Received
Data C
Data C
SPIF Serviced
Data C Received
Data B
= Unspecified = Reception in progress
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Freescale Semiconductor 284
Figure 103. Reception with SPIF Serviced Too Late
5.39.4 Functional Description
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can
poll the SPI status flags or SPI operation can be interrupt driven.
The SPI system is enabled by setting the SPI enable (SPE) bit in SPI control register 1. While SPE is set, the four associated
SPI port pins are dedicated to the SPI function as:
• Slave select (SS)
• Serial clock (SCK)
• Master out/slave in (MOSI)
• Master in/slave out (MISO)
The main element of the SPI system is the SPI data register. The n-bit(200) data register in the master and the n-bit(200) data
register in the slave are linked by the MOSI and MISO pins to form a distributed 2n-bit(200) register. When a data transfer
operation is performed, this 2n-bit(200) register is serially shifted n(200) bit positions by the S-clock from the master, so data is
exchanged between the master and the slave. Data written to the master SPI data register becomes the output data for the slave,
and data read from the master SPI data register after a transfer operation is the input data from the slave.
A read of SPISR with SPTEF = 1 followed by a write to SPIDR puts data into the transmit data register. When a transfer is
complete and SPIF is cleared, received data is moved into the receive data register. This data register acts as the SPI receive
data register for reads and as the SPI transmit data register for writes. A common SPI data register address is shared for reading
data from the read data buffer and for writing data to the transmit data register.
The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI control register 1 (SPICR1) select one of
four possible clock formats to be used by the SPI system. The CPOL bit simply selects a non-inverted or inverted clock. The
CPHA bit is used to accommodate two fundamentally different protocols by sampling data on odd numbered SCK edges or on
even numbered SCK edges (see Section 5.39.4.3, “Transmission Formats").
The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI control register1 is set, master mode
is selected, when the MSTR bit is clear, slave mode is selected.
Note:
200. n depends on the selected transfer width, refer to Section 5.39.3.2.2, “SPI Control Register 2 (SPICR2)"
NOTE
A change of CPOL or MSTR bit while there is a received byte pending in the receive shift
register will destroy the received byte and must be avoided.
Receive Shift Register
SPIF
SPI Data Register
Data A Data B
Data A
Data A Received Data B Received
Data C
Data C
SPIF Serviced
Data C Received
Data B Lost
= Unspecified = Reception in progress
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Freescale Semiconductor 285
5.39.4.1 Master Mode
The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate transmissions. A transmission
begins by writing to the master SPI data register. If the shift register is empty, data immediately transfers to the shift register. Data
begins shifting out on the MOSI pin under the control of the serial clock.
• Serial clock
The SPR2, SPR1, and SPR0 baud rate selection bits, in conjunction with the SPPR2, SPPR1, and SPPR0 baud rate
preselection bits in the SPI baud rate register, control the baud rate generator and determine the speed of the
transmission. The SCK pin is the SPI clock output. Through the SCK pin, the baud rate generator of the master controls
the shift register of the slave peripheral.
• MOSI, MISO pin
In master mode, the function of the serial data output pin (MOSI) and the serial data input pin (MISO) is determined by
the SPC0 and BIDIROE control bits.
•SS
pin
If MODFEN and SSOE are set, the SS pin is configured as slave select output. The SS output becomes low during each
transmission and is high when the SPI is in idle state.
If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault error. If the SS input
becomes low this indicates a mode fault error where another master tries to drive the MOSI and SCK lines. In this case,
the SPI immediately switches to slave mode, by clearing the MSTR bit and also disables the slave output buffer MISO
(or SISO in bidirectional mode). So the result is that all outputs are disabled and SCK, MOSI, and MISO are inputs. If a
transmission is in progress when the mode fault occurs, the transmission is aborted and the SPI is forced into idle state.
This mode fault error also sets the mode fault (MODF) flag in the SPI status register (SPISR). If the SPI interrupt enable
bit (SPIE) is set when the MODF flag becomes set, then an SPI interrupt sequence is also requested.
When a write to the SPI data register in the master occurs, there is a half SCK-cycle delay. After the delay, SCK is started
within the master. The rest of the transfer operation differs slightly, depending on the clock format specified by the SPI
clock phase bit, CPHA, in SPI control register 1 (see Section 5.39.4.3, “Transmission Formats").
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, XFRW, MODFEN, SPC0, or BIDIROE
with SPC0 set, SPPR2-SPPR0 and SPR2-SPR0 in master mode will abort a transmission
in progress and force the SPI into idle state. The remote slave cannot detect this, therefore
the master must ensure that the remote slave is returned to idle state.
5.39.4.2 Slave Mode
The SPI operates in slave mode when the MSTR bit in SPI control register 1 is clear.
• Serial clock
In slave mode, SCK is the SPI clock input from the master.
• MISO, MOSI pin
In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI) is determined by the
SPC0 bit and BIDIROE bit in SPI control register 2.
•SS
pin
The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI must be low. SS
must remain low until the transmission is complete. If SS goes high, the SPI is forced into idle state.
The SS input also controls the serial data output pin, if SS is high (not selected), the serial data output pin is high
impedance, and, if SS is low, the first bit in the SPI data register is driven out of the serial data output pin. Also, if the
slave is not selected (SS is high), then the SCK input is ignored and no internal shifting of the SPI shift register occurs.
Although the SPI is capable of duplex operation, some SPI peripherals are capable of only receiving SPI data in a slave
mode. For these simpler devices, there is no serial data out pin.
NOTE
When peripherals with duplex capability are used, take care not to simultaneously enable
two receivers whose serial outputs drive the same system slave’s serial data output line.
As long as no more than one slave device drives the system slave’s serial data output line, it is possible for several slaves to
receive the same transmission from a master, although the master would not receive return information from all of the receiving
slaves.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 286
If the CPHA bit in SPI control register 1 is clear, odd numbered edges on the SCK input cause the data at the serial data input
pin to be latched. Even numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or
MSB of the SPI shift register, depending on the LSBFE bit.
If the CPHA bit is set, even numbered edges on the SCK input cause the data at the serial data input pin to be latched. Odd
numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift
register, depending on the LSBFE bit.
When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA is clear and the SS
input is low (slave selected), the first bit of the SPI data is driven out of the serial data output pin. After the nth(201) shift, the transfer
is considered complete and the received data is transferred into the SPI data register. To indicate transfer is complete, the SPIF
flag in the SPI status register is set.
Note:
201. n depends on the selected transfer width, refer to Section 5.39.3.2.2, “SPI Control Register 2 (SPICR2)"
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0, or BIDIROE with
SPC0 set in slave mode will corrupt a transmission in progress and must be avoided.
5.39.4.3 Transmission Formats
During an SPI transmission, data is transmitted (shifted out serially) and received (shifted in serially) simultaneously. The serial
clock (SCK) synchronizes shifting and sampling of the information on the two serial data lines. A slave select line allows selection
of an individual slave SPI device; slave devices that are not selected do not interfere with SPI bus activities. Optionally, on a
master SPI device, the slave select line can be used to indicate multiple-master bus contention.
Figure 104. Master/Slave Transfer Block Diagram
5.39.4.3.1 Clock Phase and Polarity Controls
Using two bits in the SPI control register 1, software selects one of four combinations of serial clock phase and polarity.
The CPOL clock polarity control bit specifies an active high or low clock and has no significant effect on the transmission format.
The CPHA clock phase control bit selects one of two fundamentally different transmission formats.
Clock phase and polarity should be identical for the master SPI device and the communicating slave device. In some cases, the
phase and polarity are changed between transmissions to allow a master device to communicate with peripheral slaves having
different requirements.
5.39.4.3.2 CPHA = 0 Transfer Format
The first edge on the SCK line is used to clock the first data bit of the slave into the master and the first data bit of the master into
the slave. In some peripherals, the first bit of the slave’s data is available at the slave’s data out pin as soon as the slave is
selected. In this format, the first SCK edge is issued a half cycle after SS has become low.
A half SCK cycle later, the second edge appears on the SCK line. When this second edge occurs, the value previously latched
from the serial data input pin is shifted into the LSB or MSB of the shift register, depending on LSBFE bit.
After this second edge, the next bit of the SPI master data is transmitted out of the serial data output pin of the master to the serial
input pin on the slave. This process continues for a total of 16 edges on the SCK line, with data being latched on odd numbered
edges and shifted on even numbered edges.
SHIFT REGISTER
SHIFT REGISTER
BAUD RATE
GENERATOR
MASTER SPI SLAVE SPI
MOSI MOSI
MISO MISO
SCK SCK
SS SS
VDD
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 287
Data reception is double buffered. Data is shifted serially into the SPI shift register during the transfer and is transferred to the
parallel SPI data register after the last bit is shifted in.
After 2n(202) (last) SCK edges:
• Data that was previously in the master SPI data register should now be in the slave data register and the data that was
in the slave data register should be in the master.
• The SPIF flag in the SPI status register is set, indicating that the transfer is complete.
Figure 105 is a timing diagram of an SPI transfer where CPHA = 0. SCK waveforms are shown for CPOL = 0 and CPOL = 1. The
diagram may be interpreted as a master or slave timing diagram because the SCK, MISO, and MOSI pins are connected directly
between the master and the slave. The MISO signal is the output from the slave and the MOSI signal is the output from the
master. The SS pin of the master must be either high or reconfigured as a general-purpose output not affecting the SPI.
Note:
202. n depends on the selected transfer width, refer to Section 5.39.3.2.2, “SPI Control Register 2 (SPICR2)"
Figure 105. SPI Clock Format 0 (CPHA = 0), with 8-bit Transfer Width Selected (XFRW = 0)
tL
Begin End
SCK (CPOL = 0)
SAMPLE I
CHANGE O
SEL SS (O)
Transfer
SCK (CPOL = 1)
MSB first (LSBFE = 0):
LSB first (LSBFE = 1):
MSB
LSB
LSB
MSB
Bit 5
Bit 2
Bit 6
Bit 1
Bit 4
Bit 3
Bit 3
Bit 4
Bit 2
Bit 5
Bit 1
Bit 6
CHANGE O
SEL SS (I)
MOSI pin
MISO pin
Master only
MOSI/MISO
tT
If next transfer begins here
for tT
, tl, tL
Minimum 1/2 SCK
tItL
tL = Minimum leading time before the first SCK edge
tT = Minimum trailing time after the last SCK edge
tI = Minimum idling time between transfers (minimum SS high time)
tL, tT
, and tI are guaranteed for the master mode and required for the slave mode.
1 234 56 78910111213141516
SCK Edge Number
End of Idle State Begin of Idle State
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 288
Figure 106. SPI Clock Format 0 (CPHA = 0), with 16-Bit Transfer Width Selected (XFRW = 1)
In slave mode, if the SS line is not deasserted between the successive transmissions then the content of the SPI data register is
not transmitted; instead the last received data is transmitted. If the SS line is deasserted for at least minimum idle time (half SCK
cycle) between successive transmissions, then the content of the SPI data register is transmitted.
In master mode, with slave select output enabled the SS line is always deasserted and reasserted between successive transfers
for at least minimum idle time.
5.39.4.3.3 CPHA = 1 Transfer Format
Some peripherals require the first SCK edge before the first data bit becomes available at the data out pin, the second edge
clocks data into the system. In this format, the first SCK edge is issued by setting the CPHA bit at the beginning of the n(203)-cycle
transfer operation.
The first edge of SCK occurs immediately after the half SCK clock cycle synchronization delay. This first edge commands the
slave to transfer its first data bit to the serial data input pin of the master.
A half SCK cycle later, the second edge appears on the SCK pin. This is the latching edge for both the master and slave.
When the third edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the SPI
shift register, depending on LSBFE bit. After this edge, the next bit of the master data is coupled out of the serial data output pin
of the master to the serial input pin on the slave.
This process continues for a total of n edges on the SCK line with data being latched on even numbered edges and shifting taking
place on odd numbered edges.
Note:
203. n depends on the selected transfer width, please refer to Section 5.39.3.2.2, “SPI Control Register 2 (SPICR2)"
tL
Begin End
SCK (CPOL = 0)
SAMPLE I
CHANGE O
SEL SS (O)
Transfer
SCK (CPOL = 1)
MSB first (LSBFE = 0)
LSB first (LSBFE = 1)
MSB
LSB
LSB
MSB
Bit 13
Bit 2
Bit 14
Bit 1
Bit 12
Bit 3
Bit 11
Bit 4
Bit 5
CHANGE O
SEL SS (I)
MOSI pin
MISO pin
Master only
MOSI/MISO
tT
If next transfer begins here
for tT
, tl, tL
Minimum 1/2 SCK
tItL
tL = Minimum leading time before the first SCK edge
tT = Minimum trailing time after the last SCK edge
tI = Minimum idling time between transfers (minimum SS high time)
tL, tT
, and tI are guaranteed for the master mode and required for the slave mode.
12345678910111213141516
SCK Edge Number
End of Idle State Begin of Idle State
17181920212223242526272829303132
Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 4 Bit 3 Bit 2 Bit 1
Bit 6Bit 5 Bit 7 Bit 8 Bit 9 Bit 10Bit 11Bit 12Bit 13Bit 14
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 289
Data reception is double buffered, data is serially shifted into the SPI shift register during the transfer and is transferred to the
parallel SPI data register after the last bit is shifted in.
After 2n SCK edges:
• Data that was previously in the SPI data register of the master is now in the data register of the slave, and data that was
in the data register of the slave is in the master.
• The SPIF flag bit in SPISR is set indicating that the transfer is complete.
Figure 107 shows two clocking variations for CPHA = 1. The diagram may be interpreted as a master or slave timing diagram
because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output
from the slave, and the MOSI signal is the output from the master. The SS line is the slave select input to the slave. The SS pin
of the master must be either high or reconfigured as a general-purpose output not affecting the SPI.
Figure 107. SPI Clock Format 1 (CPHA = 1), with 8-Bit Transfer Width Selected (XFRW = 0)
tLtT
for tT
, tl, tL
Minimum 1/2 SCK
tItL
If next transfer begins here
Begin End
SCK (CPOL = 0)
SAMPLE I
CHANGE O
SEL SS (O)
Transfer
SCK (CPOL = 1)
MSB first (LSBFE = 0):
LSB first (LSBFE = 1):
MSB
LSB
LSB
MSB
Bit 5
Bit 2
Bit 6
Bit 1
Bit 4
Bit 3
Bit 3
Bit 4
Bit 2
Bit 5
Bit 1
Bit 6
CHANGE O
SEL SS (I)
MOSI pin
MISO pin
Master only
MOSI/MISO
tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers
tT = Minimum trailing time after the last SCK edge
tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers
1 234 56 78910111213141516SCK Edge Number
End of Idle State Begin of Idle State
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 290
Figure 108. SPI Clock Format 1 (CPHA = 1), with 16-Bit Transfer Width Selected (XFRW = 1)
The SS line can remain active low between successive transfers (can be tied low at all times). This format is sometimes preferred
in systems having a single fixed master and a single slave that drive the MISO data line.
Back-to-back transfers in master mode
In master mode, if a transmission has completed and new data is available in the SPI data register, this data is sent out
immediately without a trailing and minimum idle time.
The SPI interrupt request flag (SPIF) is common to both the master and slave modes. SPIF gets set one half SCK cycle after the
last SCK edge.
5.39.4.4 SPI Baud Rate Generation
Baud rate generation consists of a series of divider stages. Six bits in the SPI baud rate register (SPPR2, SPPR1, SPPR0, SPR2,
SPR1, and SPR0) determine the divisor to the SPI module clock which results in the SPI baud rate.
The SPI clock rate is determined by the product of the value in the baud rate preselection bits (SPPR2–SPPR0) and the value
in the baud rate selection bits (SPR2–SPR0). The module clock divisor equation is shown in Equation 109.
BaudRateDivisor = (SPPR + 1) 2(SPR + 1) Eqn. 109
When all bits are clear (the default condition), the SPI module clock is divided by 2. When the selection bits (SPR2–SPR0) are
001 and the preselection bits (SPPR2–SPPR0) are 000, the module clock divisor becomes 4. When the selection bits are 010,
the module clock divisor becomes 8, etc.
When the preselection bits are 001, the divisor determined by the selection bits is multiplied by 2. When the preselection bits are
010, the divisor is multiplied by 3, etc. See Table 398 for baud rate calculations for all bit conditions, based on a 25 MHz bus
clock. The two sets of selects allows the clock to be divided by a non-power of two to achieve other baud rates such as divide by
6, divide by 10, etc.
tL
Begin End
SCK (CPOL = 0)
SAMPLE I
CHANGE O
SEL SS (O)
Transfer
SCK (CPOL = 1)
MSB first (LSBFE = 0)
LSB first (LSBFE = 1)
MSB
LSB
LSB
MSB
Bit 13
Bit 2
Bit 14
Bit 1
Bit 12
Bit 3
Bit 11
Bit 4
Bit 5
CHANGE O
SEL SS (I)
MOSI pin
MISO pin
Master only
MOSI/MISO
tT
If next transfer begins here
for tT
, tl, tL
Minimum 1/2 SCK
tItL
tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers
tT = Minimum trailing time after the last SCK edge
tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers
12345678910111213141516
SCK Edge Number
End of Idle State Begin of Idle State
17181920212223242526272829303132
Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 4 Bit 3 Bit 2 Bit 1
Bit 6Bit 5 Bit 7 Bit 8 Bit 9 Bit 10Bit 11Bit 12Bit 13Bit 14
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The baud rate generator is activated only when the SPI is in master mode and a serial transfer is taking place. In the other cases,
the divider is disabled to decrease IDD current.
NOTE
For maximum allowed baud rates, please refer to the SPI Electrical Specification in the
Electricals chapter of this data sheet.
5.39.4.5 Special Features
5.39.4.5.1 SS Output
The SS output feature automatically drives the SS pin low during transmission to select external devices and drives it high during
idle to deselect external devices. When SS output is selected, the SS output pin is connected to the SS input pin of the external
device.
The SS output is available only in master mode during normal SPI operation by asserting SSOE and MODFEN bit as shown in
Table 392.
The mode fault feature is disabled while SS output is enabled.
NOTE
Care must be taken when using the SS output feature in a multimaster system because the
mode fault feature is not available for detecting system errors between masters.
5.39.4.5.2 Bidirectional Mode (MOMI or SISO)
The bidirectional mode is selected when the SPC0 bit is set in SPI control register 2 (see Table 405). In this mode, the SPI uses
only one serial data pin for the interface with external device(s). The MSTR bit decides which pin to use. The MOSI pin becomes
the serial data I/O (MOMI) pin for the master mode, and the MISO pin becomes serial data I/O (SISO) pin for the slave mode.
The MISO pin in master mode and MOSI pin in slave mode are not used by the SPI.
The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output, serial data from the shift
register is driven out on the pin. The same pin is also the serial input to the shift register.
• The SCK is output for the master mode and input for the slave mode.
•The SS
is the input or output for the master mode, and it is always the input for the slave mode.
• The bidirectional mode does not affect SCK and SS functions.
NOTE
In bidirectional master mode, with mode fault enabled, both data pins MISO and MOSI can
be occupied by the SPI, though MOSI is normally used for transmissions in bidirectional
mode and MISO is not used by the SPI. If a mode fault occurs, the SPI is automatically
switched to slave mode. In this case MISO becomes occupied by the SPI and MOSI is not
used. This must be considered, if the MISO pin is used for another purpose.
Table 405. Normal Mode and Bidirectional Mode
When SPE = 1 Master Mode MSTR = 1 Slave Mode MSTR = 0
Normal Mode
SPC0 = 0
Bidirectional Mode
SPC0 = 1
SPI
MOSI
MISO
Serial Out
Serial In
SPI
MOSI
MISO
Serial In
Serial Out
SPI
MOMI
Serial Out
Serial In
BIDIROE
SPI
SISO
Serial In
Serial Out
BIDIROE
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5.39.4.6 Error Conditions
The SPI has one error condition:
Mode fault error
5.39.4.6.1 Mode Fault Error
If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more than one master may
be trying to drive the MOSI and SCK lines simultaneously. This condition is not permitted in normal operation, the MODF bit in
the SPI status register is set automatically, provided the MODFEN bit is set.
In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by the SPI. In this special
case, the mode fault error function is inhibited and MODF remains cleared. In case the SPI system is configured as a slave, the
SS pin is a dedicated input pin. Mode fault error doesn’t occur in slave mode.
If a mode fault error occurs, the SPI is switched to slave mode, with the exception that the slave output buffer is disabled. So
SCK, MISO, and MOSI pins are forced to be high impedance inputs to avoid any possibility of conflict with another output driver.
A transmission in progress is aborted and the SPI is forced into idle state.
If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output enable of the MOMI
(MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in the bidirectional mode for SPI system
configured in slave mode.
The mode fault flag is cleared automatically by a read of the SPI status register (with MODF set) followed by a write to SPI control
register 1. If the mode fault flag is cleared, the SPI becomes a normal master or slave again.
NOTE
If a mode fault error occurs and a received data byte is pending in the receive shift register,
this data byte will be lost.
5.39.4.7 Low Power Mode Options
5.39.4.7.1 SPI in Run Mode
In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a low-power, disabled
state. SPI registers remain accessible, but clocks to the core of this module are disabled.
5.39.4.7.2 SPI in Stop Mode
Stop mode is dependent on the system. The SPI enters stop mode when the module clock is disabled (held high or low). If the
SPI is in master mode and exchanging data when the CPU enters stop mode, the transmission is frozen until the CPU exits stop
mode. After stop, data to and from the external SPI is exchanged correctly. In slave mode, the SPI will stay synchronized with
the master.
The stop mode is not dependent on the SPISWAI bit.
5.39.4.7.3 Reset
The reset values of registers and signals are described in Section 5.39.3, “Memory Map and Register Definition", which details
the registers and their bit fields.
• If a data transmission occurs in slave mode after reset without a write to SPIDR, it will transmit garbage, or the data last
received from the master before the reset.
• Reading from the SPIDR after reset will always read zeros.
5.39.4.7.4 Interrupts
The SPI only originates interrupt requests when SPI is enabled (SPE bit in SPICR1 set). The following is a description of how the
SPI makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt priority are
chip dependent.
The interrupt flags MODF, SPIF, and SPTEF are logically ORed to generate an interrupt request.
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5.39.4.7.4.1 MODF
MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the MODF feature (see
Table 392). After MODF is set, the current transfer is aborted and the following bit is changed:
MSTR = 0, The master bit in SPICR1 resets.
The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the interrupt. This interrupt will
stay active while the MODF flag is set. MODF has an automatic clearing process which is described in Section 5.39.3.2.4, “SPI
Status Register (SPISR)".
5.39.4.7.4.2 SPIF
SPIF occurs when new data has been received and copied to the SPI data register. After SPIF is set, it does not clear until it is
serviced. SPIF has an automatic clearing process, which is described in Section 5.39.3.2.4, “SPI Status Register (SPISR)".
5.39.4.7.4.3 SPTEF
SPTEF occurs when the SPI data register is ready to accept new data. After SPTEF is set, it does not clear until it is serviced.
SPTEF has an automatic clearing process, which is described in Section 5.39.3.2.4, “SPI Status Register (SPISR)".
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5.40 64 KByte Flash Module (S12FTMRC64K1V1)
5.40.1 Introduction
The module implements the following:
• kbytes of P-Flash (Program Flash) memory
• kbytes of D-Flash (Data Flash) memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage
sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify
Flash memory contents. The user interface to the memory controller consists of the indexed Flash Common Command Object
(FCCOB) register which is written to with the command, global address, data, and any required command parameters. The
memory controller must complete the execution of a command before the FCCOB register can be written to with a new command.
CAUTION
A Flash word or phrase must be in the erased state before being programmed. Cumulative
programming of bits within a Flash word or phrase is not allowed.
The Flash memory may be read as bytes, aligned words, or misaligned words. Read access time is one bus cycle for bytes and
aligned words, and two bus cycles for misaligned words. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on D-Flash memory. It is not possible to read
from D-Flash memory while a command is executing on P-Flash memory. Simultaneous P-Flash and D-Flash operations are
discussed in Allowed Simultaneous P-Flash and D-Flash Operations.
Both P-Flash and D-Flash memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and
detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8 byte
basis (a Flash phrase). Since P-Flash memory is always read by half-phrase, only one single bit fault in an aligned 4 byte
half-phrase containing the byte or word accessed will be corrected.
5.40.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including program and erase) on
the Flash memory.
D-Flash Memory — The D-Flash memory constitutes the nonvolatile memory store for data.
D-Flash Sector — The D-Flash sector is the smallest portion of the D-Flash memory that can be erased. The D-Flash sector
consists of four 64 byte rows for a total of 256 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash
command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two sets of aligned double
words with each set including 7 ECC bits for single bit fault correction and double bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector
contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Device ID, Version ID, and the
Program Once field.
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5.40.1.2 Features
5.40.1.2.1 P-Flash Features
• Single bit fault correction and double bit fault detection within a 32-bit double word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the D-Flash memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
5.40.1.2.2 D-Flash Features
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of D-Flash memory
• Ability to program up to four words in a burst sequence
5.40.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
5.40.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 110.
5.40.2 External Signal Description
The Flash module contains no signals that connect off-chip.
5.40.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in
the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored
by the Flash module.
5.40.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses .The P-Flash memory map is shown in .
The FPROT register, described in P-Flash Protection Register (FPROT), can be set to protect regions in the Flash memory from
accidental program or erase. The Flash memory addresses covered by these protectable regions are shown in the P-Flash
memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default
protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the
Flash configuration field as described in Table 406.
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Table 406. Flash Configuration Field
Global Address Size (Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 5.40.4.5.11, “Verify Backdoor Access Key Command", and
Section 5.40.5.1, “Unsecuring the MCU using Backdoor Key Access"
0x3_FF08-0x3_FF0B 4 Reserved
0x3_FF0C 1 P-Flash Protection byte.
Refer to Section 5.40.3.2.9, “P-Flash Protection Register (FPROT)"
0x3_FF0D 1 D-Flash Protection byte.
Refer to Section 5.40.3.2.10, “D-Flash Protection Register (DFPROT)"
0x3_FF0E 1 Flash Nonvolatile byte
Refer to Section 5.40.3.2.16, “Flash Option Register (FOPT)"
0x3_FF0F 1 Flash Security byte
Refer to Section 5.40.3.2.2, “Flash Security Register (FSEC)"
Note:
204. 0x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0x3_FF08
- 0x3_FF0B reserved field should be programmed to 0xFF.
Table 407. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8.0 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2.0 Version ID
0x0_40B8 – 0x0_40BF 8.0 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 5.40.4.5.6, “Program Once Command"
Note:
205. For patch code storage, see Section 5.40.4.2, “IFR Version ID Word"
206. Used to track firmware patch versions, see Section 5.40.4.2, “IFR Version ID Word"
Tab le 408. D-Flash and Me mory Controller Resource Fields
Global Address Size
(Bytes) Description
0x0_4000 – 0x0_43FF 1,024 Reserved
0x0_4400 – 0x0_53FF 4,096 D-Flash Memory
0x0_5400 – 0x0_57FF 1,024 Reserved
0x0_5800 – 0x0_5AFF 768 Memory Controller Scratch RAM
0x0_5B00 – 0x0_5FFF 1,280 Reserved
0x0_6000 – 0x0_67FF 2,048 Reserved
0x0_6800 – 0x0_7FFF 6,144 Reserved
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Figure 110. D-Flash and Memory Controller Resource Memory Ma p
5.40.3.2 Register Descrip tion s
The Flash module contains a set of 20 control and status registers located between Flash module base + 0x0000 and 0x0013.
A summary of the Flash module registers is given in Figure 409 with detailed descriptions in the following subsections.
CAUTION
Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to
prevent corruption of Flash register contents and adversely affect Memory Controller
behavior.
D-Flash Memory
4 Kbytes
D-Flash Start = 0x0_4400
0x0_6000
D-Flash End = 0x0_53FF
P-Flash IFR 1 Kbyte
0x0_4000
Reserved 1 Kbyte
Scratch Ram 768 bytes
RAM End = 0x0_5AFF
RAM Start = 0x0_5800
Reserved 6 Kbytes
Reserved 2 Kbytes
Reserved 1280 bytes
0x0_6800
0x0_7FFF
0x0_40FF
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Tab le 409. FTMRC64K1 Register Summary
Address
& Name 76543210
FCLKDIV RFDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
FSEC R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
FCCOBIX R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
FRSV0 R00000000
W
FCNFG RCCIE 00
IGNSF 00
FDFD FSFD
W
FERCNFG R000000
DFDIE SFDIE
W
FSTAT RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
FERSTAT R000000
DFDIF SFDIF
W
DFPROT RDPOPEN 000
DPS3 DPS2 DPS1 DPS0
W
FCCOBHI RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
FCCOBLO RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
FRSV1 R00000000
W
FRSV2 R00000000
W
FRSV3 R00000000
W
FRSV4 R00000000
W
FOPT R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
FRSV5 R00000000
W
FRSV6 R00000000
W
FRSV7 R00000000
W
= Unimplemented or Reserved
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5.40.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the writability of the FDIV field.
CAUTION
The FCLKDIV register must never be written to while a Flash command is executing
(CCIF=0). The FCLKDIV register is writable during the Flash reset sequence even though
CCIF is clear.
Table 410. Flash Clock Divider Register (FCLKDIV)
76543210
RFDIVLD
FDIVLCK FDIV[5:0]
W
Reset00000000
= Unimplemented or Reserved
Table 411. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and restore
writability to the FDIV field.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events during Flash
program and erase algorithms. Table 412 shows recommended values for FDIV[5:0] based on the BUSCLK frequency. Please
refer to Section 5.40.4.3, “Flash Command Operations", for more information.
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5.40.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration
field at global address 0x3_FF0F located in P-Flash memory (see Table 406) as indicated by reset condition F in Figure 413. If
a double bit fault is detected while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all
bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled.
Table 412. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency (MHz) FDIV[5:0] BUSCLK Frequency (MHz) FDIV[5:0]
MIN(207) MAX(208) MIN(207) MAX(208)
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09 25.6 26.6 0x19
10.6 11.6 0x0A 26.6 27.6 0x1A
11.6 12.6 0x0B 27.6 28.6 0x1B
12.6 13.6 0x0C 28.6 29.6 0x1C
13.6 14.6 0x0D 29.6 30.6 0x1D
14.6 15.6 0x0E 30.6 31.6 0x1E
15.6 16.6 0x0F 31.6 32.6 0x1F
Note:
207. BUSCLK is Greater Than this value.
208. BUSCLK is Less Than or Equal to this value.
Table 413. Flash Security Register (FSEC)
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
ResetFFFFFFFF
= Unimplemented or Reserved
Table 414. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the Flash module
as shown in Table 415.
5–2
RNV[5:2}
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 416. If the Flash module is
unsecured using backdoor key access, the SEC bits are forced to 10.
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The security function in the Flash module is described in Section 5.40.5, “Security".
5.40.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
5.40.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
Table 415. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED(209)
10 ENABLED
11 DISABLED
Note:
209. Preferred KEYEN state to disable backdoor key access.
Table 416. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED(210)
10 UNSECURED
11 SECURED
Note:
210. Preferred SEC state to set MCU to secured state
Table 417. FCCOB Index Register (FCCOBIX)
76543210
R00000 CCOBIX[2:0]
W
Reset00000000
= Unimplemented or Reserved
Table 418. FCCOBIX Field Desc ripti ons
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index — The CCOBIX bits are used to select which word of the FCCOB register array is
being read or written to. See Section 5.40.3.2.11, “Flash Common Command Object Register (FCCOB)”, for more details.
Table 419. Flash Reserved0 Register (FRSV0)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
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5.40.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array read access from the
CPU.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not writable.
5.40.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
All assigned bits in the FERCNFG register are readable and writable.
Table 420. Flash Conf iguration Register (FCNFG)
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset00000000
= Unimplemented or Reserved
Table 421. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 5.40.3.2.7, “Flash
Status Register (FSTAT)")
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see Section 5.40.3.2.8,
“Flash Error Status Register (FERSTAT)").
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array read
operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD. The FECCR registers
will not be updated during the Flash array read operation with FDFD set unless an actual double bit fault is detected.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see Section 5.40.3.2.7,
“Flash Status Register (FSTAT)") and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 5.40.3.2.6, “Flash Error Configuration Register (FERCNFG)")
0
FSFD
Force Single Bit Fault Detect — The FSFD bit allows the user to simulate a single bit fault during Flash array read operations
and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. The FECCR registers will not be
updated during the Flash array read operation with FSFD set unless an actual single bit fault is detected.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 5.40.3.2.7, “Flash
Status Register (FSTAT)") and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG
register is set (see Section 5.40.3.2.6, “Flash Error Configuration Register (FERCNFG)")
Table 422. Flash Error Configuration Register (FERCNFG)
76543210
R000000
DFDIE SFDIE
W
Reset00000000
= Unimplemented or Reserved
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5.40.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while
remaining bits read 0 and are not writable.
Table 423. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault is detected
during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 5.40.3.2.8, “Flash Error Status Register
(FERSTAT)")
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault is detected
during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 5.40.3.2.8, “Flash Error Status Register
(FERSTAT)")
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 5.40.3.2.8, “Flash Error Status Register
(FERSTAT)")
Table 424. Flash Status Registe r (FSTAT)
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset1000000
(211) 0(211)
= Unimplemented or Reserved
Note:
211. Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 5.40.6).
Table 425. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The CCIF flag is
cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either
a violation of the command write sequence (see Section 5.40.4.3.2) or issuing an illegal Flash command. While ACCERR is
set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing
a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an address in a
protected area of P-Flash or D-Flash memory during a command write sequence. The FPVIOL bit is cleared by writing a 1
to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a
command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 304
5.40.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
5.40.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected region can only be
increased.
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Co mpletion Status Flag — One or more MGSTAT flag bits are set if an error is detected
during execution of a Flash command or during the Flash reset sequence. See Section 5.40.4.5, “Flash Command
Description" and Section 5.40.6, “Initialization" for details.
Table 426. Flash Error Status Register (F ERSTAT )
76543210
R000000
DFDIF SFDIF
W
Reset00000000
= Unimplemented or Reserved
Table 427. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was detected in the
stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash
block that was under a Flash command operation.(212) The DFDIF flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF
has no effect on DFDIF.
0 No double bit fault detected
1 Double bit fault detected or an invalid Flash array read operation attempted
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a
single bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read
operation was attempted on a Flash block that was under a Flash command operation. The SFDIF flag is cleared by writing a
1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or an invalid Flash array read operation attempted
Note:
212. The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either single fault
or double fault but never both). A simultaneous access collision (read attempted while command running) is indicated when both SFDIF
and DFDIF flags are high.
Table 428. P-Flash Protection Register (FPROT)
76543210
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
ResetFFFFFFFF
= Unimplemented or Reserved
Tab le 425. FSTAT Field Descriptions (continued)
Field Description
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 305
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash
configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 406) as indicated by reset condition ‘F’ in
. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must
be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the
P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining
bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will
be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the
same P-Flash block are protected.
Although the protection scheme is loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can
be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single chip
mode while providing as much protection as possible if reprogramming is not required.
5.40.3.2.10 D-Flash Protection Register (DFPROT)
The DFPROT register defines which D-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the DFPROT register are writable with the restriction that protection can be added but not removed.
Writes must increase the DPS value and the DPOPEN bit can only be written from 1 (protection disabled) to 0 (protection
enabled). If the DPOPEN bit is set, the state of the DPS bits is irrelevant.
During the reset sequence, the DFPROT register is loaded with the contents of the D-Flash protection byte in the Flash
configuration field at global address 0x3_FF0D located in P-Flash memory (see Table 406) as indicated by reset condition F in
Figure 431. To change the D-Flash protection that will be loaded during the reset sequence, the P-Flash sector containing the
D-Flash protection byte must be unprotected, then the D-Flash protection byte must be programmed. If a double bit fault is
detected while reading the P-Flash phrase containing the D-Flash protection byte during the reset sequence, the DPOPEN bit
will be cleared and DPS bits will be set to leave the D-Flash memory fully protected.
Table 429. FPROT Field Descriptions
Field Description
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a protected/unprotected
area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area in P-Flash
memory as shown inTable 430. The FPHS bits can only be written to while the FPHDIS bit is set.
Table 430. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2.0 kByte
01 0x3_F000–0x3_FFFF 4.0 kByte
10 0x3_E000–0x3_FFFF 8.0 kByte
11 0x3_C000–0x3_FFFF 16 kByte
Table 431. D-Flash Protection Regis t er (DFPROT)
76543210
RDPOPEN 000 DPS[3:0]
W
Reset F 0 0 0 F F F F
= Unimplemented or Reserved
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 306
Trying to alter data in any protected area in the D-Flash memory will result in a protection violation error and the FPVIOL bit will
be set in the FSTAT register. Block erase of the D-Flash memory is not possible if any of the D-Flash sectors are protected.
5.40.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register. Byte wide reads and writes
are allowed to the FCCOB register.
Table 432. DFPROT Field Descriptions
Field Description
7
DPOPEN
D-Flash Protection Control
0 Enables D-Flash memory protection from program and erase with protected address range defined by DPS bits
1 Disables D-Flash memory protection from program and erase
3–0
DPS[3:0]
D-Flash Protection Size — The DPS[3:0] bits determine the size of the protected area in the D-Flash memory as shown in
Tab l e 4 3 3 .
Table 433. D-Flash Protection Address Range
DPS[3:0] Global Address Range Protected Size
0000 0x0_4400 – 0x0_44FF 256 bytes
0001 0x0_4400 – 0x0_45FF 512 bytes
0010 0x0_4400 – 0x0_46FF 768 bytes
0011 0x0_4400 – 0x0_47FF 1024 bytes
0100 0x0_4400 – 0x0_48FF 1280 bytes
0101 0x0_4400 – 0x0_49FF 1536 bytes
0110 0x0_4400 – 0x0_4AFF 1792 bytes
0111 0x0_4400 – 0x0_4BFF 2048 bytes
1000 0x0_4400 – 0x0_4CFF 2304 bytes
1001 0x0_4400 – 0x0_4DFF 2560 bytes
1010 0x0_4400 – 0x0_4EFF 2816 bytes
1011 0x0_4400 – 0x0_4FFF 3072 bytes
1100 0x0_4400 – 0x0_50FF 3328 bytes
1101 0x0_4400 – 0x0_51FF 3584 bytes
1110 0x0_4400 – 0x0_52FF 3840 bytes
1111 0x0_4400 – 0x0_53FF 4096 bytes
Table 434. Flash Co mmon Command Object High Register (FCCOBHI)
76543210
RCCOB[15:8]
W
Reset00000000
Table 435. Flash Common Command Object Low Register (FCCOBL O)
76543210
RCCOB[7:0]
W
Reset00000000
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 307
5.40.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant parameters to the Memory
Controller. The user first sets up all required FCCOB fields and then initiates the command’s execution by writing a 1 to the CCIF
bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF
bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes
(as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 436. The return values are
available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. Writes to the
unimplemented parameter fields (CCOBIX = 110 and CCOBIX = 111) are ignored with reads from these fields returning 0x0000.
Table 436 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command
code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each
command, see the Flash command descriptions in Section 5.40.4.5, “Flash Command Description".
5.40.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
5.40.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
Ta ble 436. FCCOB - NVM Comman d Mod e (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Table 437. Flash Reserved1 Register (FRSV1)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
Table 438. Flash Reserved2 Register (FRSV2)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 308
All bits in the FRSV2 register read 0 and are not writable.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 309
5.40.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
All bits in the FRSV3 register read 0 and are not writable.
5.40.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
5.40.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field at global
address 0x3_FF0E located in P-Flash memory (see Table 406) as indicated by reset condition F in Ta bl e 44 1. If a double bit fault
is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT
register will be set.
Table 439. Flash Reserved3 Register (FRSV3)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
Table 440. Flash Reserved4 Register (FRSV4)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
Tabl e 441. Flash Option Register (FOPT)
76543210
R NV[7:0]
W
ResetFFFFFFFF
= Unimplemented or Reserved
Table 442. FO PT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper use of the NV
bits.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 310
5.40.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
5.40.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
All bits in the FRSV6 register read 0 and are not writable.
5.40.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
All bits in the FRSV7 register read 0 and are not writable.
5.40.4 Functional Description
5.40.4.1 Modes of Opera tio n
The FTMRC64K1 module provides the modes of operation shown in Table 446. The operating mode is determined by
module-level inputs and affects the FCLKDIV, FCNFG, and DFPROT registers, Scratch RAM writes, and the command set
availability (see Table 448).
Table 443. Flash Reserved5 Register (FRSV5)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
Table 444. Flash Reserved6 Register (FRSV6)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
Table 445. Flash Reserved7 Register (FRSV7)
76543210
R00000000
W
Reset00000000
= Unimplemented or Reserved
Table 446. Modes and Mode Control In puts
Operating Mode FTMRC Input
mmc_mode_ss_t2
Normal: 0
Special: 1
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 311
5.40.4.2 IFR Versi o n ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in Table 447.
VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111 meaning ‘none’.
5.40.4.3 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from BUSCLK for Flash program
and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution
5.40.4.3.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide
BUSCLK down to a target FCLK of 1 MHz. Table 412 shows recommended values for the FDIV field based on BUSCLK
frequency.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus clock runs at less
than 0.8 MHz. Setting FDIV too high can destroy the Flash memory due to overstress.
Setting FDIV too low can result in incomplete programming or erasure of the Flash memory
cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not
been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded
during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set.
5.40.4.3.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see Section 5.40.3.2.7, “Flash
Status Register (FSTAT)") and the CCIF flag should be tested to determine the status of the current command write sequence.
If CCIF is 0, the previous command write sequence is still active, a new command write sequence cannot be started, and all
writes to the FCCOB register are ignored.
CAUTION
Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to
prevent corruption of Flash register contents and Memory Controller behavior.
5.40.4.3.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. Access to the
FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX register (see Section 5.40.3.2.3, “Flash CCOB Index
Register (FCCOBIX)").
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command
completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command
has completed. Upon completion, the Memory Controller will return CCIF to 1 and the FCCOB register will be used to
communicate any results. The flow for a generic command write sequence is shown in Figure 111.
Table 447. IFR Version ID Field s
[15:4] [3:0]
Reserved VERNUM
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 312
Figure 111. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 313
5.40.4.3.3 Valid Flash Module Commands
5.40.4.3.4 P-Flash Commands
Table 449 summarizes the valid P-Flash commands along with the effects of the commands on the P-Flash block and other
resources within the Flash module.
Tab le 448. Flash Commands by Mode
FCMD Command Unsecured Secured
NS(213) SS(214) NS(215) SS(216)
0x01 Erase Verify All Blocks
0x02 Erase Verify Block
0x03 Erase Verify P-Flash Section
0x04 Read Once
0x06 Program P-Flash
0x07 Program Once
0x08 Erase All Blocks
0x09 Erase Flash Block
0x0A Erase P-Flash Sector
0x0B Unsecure Flash
0x0C Verify Backdoor Access Key
0x0D Set User Margin Level
0x0E Set Field Margin Level
0x10 Erase Verify D-Flash Section
0x11 Program D-Flash
0x12 Erase D-Flash Sector
Note:
213. Unsecured Normal Single Chip mode
214. Unsecured Special Single Chip mode
215. Secured Normal Single Chip mode
216. Secured Special Single Chip mode
Table 449. P-Flash Command s
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All Blocks Verify that all P-Flash (and D-Flash) blocks are erased.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify P-Flash
Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that was
previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block that is
allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and D-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the
FPROT register and the DPOPEN bit in the DFPROT register are set prior to launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or D-Flash) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the
FPROT register are set prior to launching the command.
0x0A Erase P-Flash Sector Erase all bytes in a P-Flash sector.
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 314
5.40.4.3.5 D-Flash Commands
Table 450 summarizes the valid D-Flash commands along with the effects of the commands on the D-Flash block.
5.40.4.4 Allowed Simultaneous P-Flash and D-Flash Operations
Only the operations marked ‘OK’ in Table 451 are permitted to be run simultaneously on the Program Flash and Data Flash
blocks. Some operations cannot be executed simultaneously because certain hardware resources are shared by the two
memories. The priority has been placed on permitting Program Flash reads while program and erase operations execute on the
Data Flash, providing read (P-Flash) while write (D-Flash) functionality.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and D-Flash) blocks and
verifying that all P-Flash (and D-Flash) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin Level Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin Level Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 450. D-Flash Comm a nds
FCMD Command Function on D-Flash Memory
0x01 Erase Verify All Blocks Verify that all D-Flash (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the D-Flash block is erased.
0x08 Erase All Blocks
Erase all D-Flash (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the
FPROT register and the DPOPEN bit in the DFPROT register are set prior to launching the command.
0x09 Erase Flash Block
Erase a D-Flash (or P-Flash) block.
An erase of the full D-Flash block is only possible when DPOPEN bit in the DFPROT register is set
prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all D-Flash (and P-Flash) blocks and
verifying that all D-Flash (and P-Flash) blocks are erased.
0x0D Set User Margin Level Specifies a user margin read level for the D-Flash block.
0x0E Set Field Margin Level Specifies a field margin read level for the D-Flash block (special modes only).
0x10 Erase Verify D-Flash
Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program D-Flash Program up to four words in the D-Flash block.
0x12 Erase D-Flash Sector Erase all bytes in a sector of the D-Flash block.
Table 451. Allowed P-Flash and D-Flash Simultaneous Operations
Data Flash
Program Flash Read Margin Read(217) Program Sector Erase Mass Erase(219)
Read OK OK OK
Margin Read(217) OK(218)
Program
Sector Erase OK
Table 449. P-Flash Command s
FCMD Command Function on P-Flash Memory
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 315
5.40.4.5 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the
FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the
command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation will return invalid data.
If the SFDIF or DFDIF flags were not previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags
will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write
sequence (see Section 5.40.3.2.7, “Flash Status Register (FSTAT)").
CAUTION
A Flash word or phrase must be in the erased state before being programmed. Cumulative
programming of bits within a Flash word or phrase is not allowed.
5.40.4.5.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and D-Flash blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash
memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed.
Mass Erase(217) OK
Note:
217. A ‘Margin Read’ is any read after executing the margin setting commands ‘Set User Margin Level’ or ‘Set Field
Margin Level’ with anything but the ‘normal’ level specified.
218. See the Note on margin settings in Section 5.40.4.5.12, “Set User Margin Level Command" and
Section 5.40.4.5.13, “Set Field Margin Level Command".
219. The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase Flash Block’.
Table 452. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 453. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 451. Allowed P-Flash and D-Flash Simultaneous Operations
Data Flash
Program Flash Read Margin Read(217) Program Sector Erase Mass Erase(219)
MM912_634 Advance Information, Rev. 7.0
Freescale Semiconductor 316
5.40.4.5.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or D-Flash block has been erased. The FCCOB
upper global address bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or
D-Flash block is erased. The CCIF flag will set after the Erase Verify Block operation has completed.
5.40.4.5.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify
P-Flash Section command defines the starting point of the code to be verified and the number of phrases.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section
of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed.
Table 454. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02 Global address [17:16] of the
Flash block to be verified.
Tab le 455. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if an invalid global address [17:16] is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 456. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of a
P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 457. Erase Ve rify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:0] is supplied
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a 128 Kbyte boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
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5.40.4.5.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the nonvolatile information
register of P-Flash. The Read Once field is programmed using the Program Once command described in Section 5.40.4.5.6,
“Program Once Command". The Read Once command must not be executed from the Flash block containing the Program Once
reserved field to avoid code runaway.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed
register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once
command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within
P-Flash block will return invalid data.
8
5.40.4.5.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed. Cumulative
programming of bits within a Flash phrase is not allowed.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied
global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program
P-Flash operation has completed.
Table 458. Read On ce Command FCCOB Requiremen ts
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
101 Read Once word 3 value
Table 459. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 460. Program P-Flash Command FCCOB Re q uire men ts
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to identify
P-Flash block
001 Global address [15:0] of phrase location to be programmed(220)
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
Note:
220. Global address [2:0] must be 000
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5.40.4.5.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the nonvolatile information register
located in P-Flash. The Program Once reserved field can be read using the Read Once command as described in
Section 5.40.4.5.4, “Read Once Command". The Program Once command must only be issued once since the nonvolatile
information register in P-Flash cannot be erased. The Program Once command must not be executed from the Flash block
containing the Program Once reserved field to avoid code runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is
erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear,
setting only after the Program Once operation has completed.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to
program one of these phrases a second time will not be allowed. Valid phrase index values for the Program Once command range
from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash will
return invalid data.
Table 461. Program P-Fla s h Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:0] is supplied
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation
Table 462. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
Table 46 3. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed(221)
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation
Note:
221. If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed
to execute again on that same phrase.
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5.40.4.5.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and D-Flash memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space
and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security
will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF
flag will set after the Erase All Blocks operation has completed.
5.40.4.5.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or D-Flash block.
Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the selected Flash block and
verify that it is erased. The CCIF flag will set after the Erase Flash Block operation has completed.
Table 46 4. Erase All Bloc ks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 465. Erase All Bloc ks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 448)
FPVIOL Set if any area of the P-Flash or D-Flash memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation
Table 466. Erase Flash Block Command FCCOB Requir ements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to identify
Flash block
001 Global address [15:0] in Flash block to be erased
Table 467. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:16] is supplied
Set if the supplied P-Flash address is not phrase-aligned or if the D-Flash address is not
word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation
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5.40.4.5.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector
and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed.
5.40.4.5.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and D-Flash memory space and, if the erase is successful, will
release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and D-Flash
memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly
erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and
terminates without changing the security state. During the execution of this command (CCIF=0) the user must not write to any
Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed.
5.40.4.5.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see
Table 415). The Verify Backdoor Access Key command releases security if user-supplied keys match those stored in the Flash
security bytes of the Flash configuration field (see Table 406). The Verify Backdoor Access Key command must not be executed
from the Flash block containing the backdoor comparison key to avoid code runaway.
Table 468. Erase P-Flash Sector Command FCCOB Requiremen ts
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 5.40.1.2.1, “P-Flash Features" for the P-Flash sector size.
Table 469. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:16] is supplied
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation
Table 470. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Tab le 471. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 448)
FPVIOL Set if any area of the P-Flash or D-Flash memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation
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Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN
bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and
terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison
key in the Flash configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be released.
If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key
command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation
has completed.
5.40.4.5.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of the
P-Flash or D-Flash block.
Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the
targeted block and then set the CCIF flag.
NOTE
When the D-Flash block is targeted, the D-Flash user margin levels are applied only to the
D-Flash reads. However, when the P-Flash block is targeted, the P-Flash user margin levels
are applied to both P-Flash and D-Flash reads. It is not possible to apply user margin levels
to the P-Flash block only.
Valid margin level settings for the Set User Margin Level command are defined in Tab le 475.
Tab le 472. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 473. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see Section 5.40.3.2.2,
“Flash Security Register (FSEC)")
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 474. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Global address [17:16] to identify the Flash
block
001 Margin level setting
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NOTE
User margin levels can be used to check that Flash memory contents have adequate margin
for normal level read operations. If unexpected results are encountered when checking
Flash memory contents at user margin levels, a potential loss of information has been
detected.
5.40.4.5.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified
for future read operations of the P-Flash or D-Flash block.
Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the
targeted block and then set the CCIF flag.
NOTE
When the D-Flash block is targeted, the D-Flash field margin levels are applied only to the
D-Flash reads. However, when the P-Flash block is targeted, the P-Flash field margin levels
are applied to both P-Flash and D-Flash reads. It is not possible to apply field margin levels
to the P-Flash block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 478.
Table 475. Valid Set User Margin Level Setting s
CCOB (CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level(222)
0x0002 User Margin-0 Level(223)
Note:
222. Read margin to the erased state
223. Read margin to the programmed state
Table 476. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:16] is supplied
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 477. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Global address [17:16] to identify the Flash block
001 Margin level setting
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CAUTION
Field margin levels must only be used during verify of the initial factory programming .
NOTE
Field margin levels can be used to check that Flash memory contents have adequate margin
for data retention at the normal level setting. If unexpected results are encountered when
checking Flash memory contents at field margin levels, the Flash memory contents should
be erased and reprogrammed.
5.40.4.5.14 Erase Verify D-Flash Section Command
The Erase Verify D-Flash Section command will verify that a section of code in the D-Flash is erased. The Erase Verify D-Flash
Section command defines the starting point of the data to be verified and the number of words.
Upon clearing CCIF to launch the Erase Verify D-Flash Section command, the Memory Controller will verify the selected section
of D-Flash memory is erased. The CCIF flag will set after the Erase Verify D-Flash Section operation has completed.
Tab le 478. Valid Set Fiel d Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level(224)
0x0002 User Margin-0 Level(225)
0x0003 Field Margin-1 Level(224)
0x0004 Field Margin-0 Level(225)
Note:
224. Read margin to the erased state
225. Read margin to the programmed state
Table 479. Set Field Margin Level Command Error Han dlin g
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:16] is supplied
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 480. Erase Verify D-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10 Global address [17:16] to
identify the D-Flash block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
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5.40.4.5.15 Program D-Flash Command
The Program D-Flash operation programs one to four previously erased words in the D-Flash block. The Program D-Flash
operation will confirm that the targeted location(s) were successfully programmed upon completion.
CAUTION
A Flash word must be in the erased state before being programmed. Cumulative
programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program D-Flash command, the user-supplied words will be transferred to the Memory
Controller and be programmed if the area is unprotected. The CCOBIX index value at Program D-Flash command launch
determines how many words will be programmed in the D-Flash block. The CCIF flag is set when the operation has completed.
Tab le 481. Erase Verify D-Flash Section Comm and Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the D-Flash block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 482. Program D-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to identify
the D-Flash block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
Table 483. Program D-F lash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the D-Flash block
FPVIOL Set if the selected area of the D-Flash memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation
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5.40.4.5.16 Erase D-Flash Sector Command
The Erase D-Flash Sector operation will erase all addresses in a sector of the D-Flash block.
Upon clearing CCIF to launch the Erase D-Flash Sector command, the Memory Controller will erase the selected Flash sector
and verify that it is erased. The CCIF flag will set after the Erase D-Flash Sector operation has completed.
5.40.4.6 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a Flash command
operation has detected an ECC fault.
NOTE
Vector addresses and their relative interrupt priority are determined at the MCU level.
5.40.4.6.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt
request. The Flash module uses the DFDIF and SFDIF flags in combination with the DFDIE and SFDIE interrupt enable bits to
generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 5.40.3.2.5,
“Flash Configuration Register (FCNFG)", Section 5.40.3.2.6, “Flash Error Configuration Register (FERCNFG)",
Section 5.40.3.2.7, “Flash Status Register (FSTAT)", and Section 5.40.3.2.8, “Flash Error Status Register (FERSTAT)".
The logic used for generating the Flash module interrupts is shown in Figure 112.
Table 484. Erase D-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
D-Flash block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 5.40.1.2.2, “D-Flash Features" for D-Flash sector size.
Table 485. Erase D-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 448)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the D-Flash memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify operation
Tab le 486. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR) Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register) I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register) I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register) I Bit
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Figure 112. Flash Module Interrupts Implementation
5.40.4.7 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation will be completed before
the CPU is allowed to enter stop mode.
5.40.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC
register (see Table 416). During reset, the Flash module initializes the FSEC register using data read from the security byte of
the Flash configuration field at global address 0x3_FF0F. The security state out of reset can be permanently changed by
programming the security byte assuming that the MCU is starting from a mode where the necessary P-Flash erase and program
commands are available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
5.40.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor
keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the KEYEN[1:0] bits are in the enabled state (see
Section 5.40.3.2.2, “Flash Security Register (FSEC)"), the Verify Backdoor Access Key command (see Section 5.40.4.5.11,
“Verify Backdoor Access Key Command") allows the user to present four prospective keys for comparison to the keys stored in
the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the
backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Tabl e 4 1 6) will be changed to unsecure the
MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command
is active, P-Flash memory and D-Flash memory will not be available for read access and will return invalid data.
The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This
external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 5.40.3.2.2, “Flash Security Register (FSEC)"), the MCU can be
unsecured by the backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in Section 5.40.4.5.11,
“Verify Backdoor Access Key Command"
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC
register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of
the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key
command. The security as defined in the Flash security byte (0x3_FF0F) is not changed by using the Verify Backdoor Access
Key command sequence. The backdoor keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor
Access Key command sequence. The Verify Backdoor Access Key command sequence has no effect on the program and erase
protections defined in the Flash protection register, FPROT.
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
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After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector
containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if
desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses
0x3_FF00-0x3_FF07 in the Flash configuration field.
5.40.5.2 Unsecuri ng th e MC U in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the P-Flash and D-Flash
memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if the P-Flash and D-Flash
memories are erased
3. Send BDM commands to disable protection in the P-Flash and D-Flash memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the MCU into special single
chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that the P-Flash and
D-Flash memory are erased
If the P-Flash and D-Flash memory are verified as erased, the MCU will be unsecured. All BDM commands will now be enabled
and the Flash security byte may be programmed to the unsecure state by continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the Flash security byte to
the unsecured state
8. Reset the MCU
5.40.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 448.
5.40.6 Initialization
On each system reset the Flash module executes a reset sequence which establishes initial values for the Flash Block
Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The Flash module
reverts to using built-in default values that leave the module in a fully protected and secured state if errors are encountered during
execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT
register will be set.
CCIF remains clear throughout the reset sequence. The Flash module holds off all CPU access for the initial portion of the reset
sequence. While Flash memory reads and access to most Flash registers are possible when the hold is removed, writes to the
FCCOBIX, FCCOBHI, and FCCOBLO registers are ignored. Completion of the reset sequence is marked by setting CCIF high
which enables writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers to launch any available Flash command.
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being
programmed or the sector/block being erased is not guaranteed.
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5.41 Die-to-Die Initiator (D2DIV1)
5.41.0.1 Preface
This document contains the user specification of the D2D Initiator.
5.41.0.1.1 Acronyms and Abbreviatio ns
Table 487 contains sample acronyms and abbreviations used in this document.
5.41.0.1.2 Glossary
Table 488 shows a glossary of the major terms used in this document.
5.41.1 Introduction
This section describes the functionality of the die-to-die (D2DIV1) initiator block especially designed for low cost connections
between a microcontroller die (Interface Initiator) and an analog die (Interface Target) located in the same package.
The D2DI block
• realizes the initiator part of the D2D interface, including supervision and error interrupt generation
• generates the clock for this interface
• disables/enables the interrupt from the D2D interface
5.41.1.1 Overview
The D2DI is the initiator for a data transfer to and from a target typically located on another die in the same package. It provides
a set of configuration registers and two memory mapped 256 Byte address windows. When writing to a window a transaction is
initiated sending a write command, followed by an 8-bit address and the data byte or word to the target. When reading from a
window a transaction is initiated sending a read command, followed by an 8-bit address to the target. The target then responds
with the data. The basic idea is that a peripheral located on another die, can be addressed like an on-chip peripheral, except for
a small transaction delay.
Table 487. Acro nyms and Abbreviated Terms
Term Meaning
D2D Die-to-Die
Table 488. Glossar y
Term Definition
Active low The signal is asserted when it changes to logic-level zero.
Active high The signal is asserted when it changes to logic-level one.
Asserted Discrete signal is in active logic state.
Customer The end user of an SoC design or device.
EOT End of Transaction
Negated A discrete signal is in inactive logic state.
Pin External physical connection.
Revision Revised or new version of a document. Revisions produce versions; there can be no ‘Rev 0.0.’
Signal Electronic construct whose state or change in state conveys information.
Transfer A read or write on the CPU bus following the IP-Bus protocol.
Transaction Command, address and if required data sent on the D2D interface. A transaction is finished by the EOT acknowledge cycle.
Version Particular form or variation of an earlier or original document.
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Figure 113. Die-to-Die Initiator (D2DI) Block Diagram
5.41.1.2 Features
The main features of this block are
• Software transparent, memory mapped access to peripherals on target die
— 256 Byte address window
— Supports blocking read or write as well as non-blocking write transactions
• Scalable interface clock divide by 1, 2, 3, or 4 of bus clock
• Clock halt on system STOP
• Configurable for 4 or 8-bit wide transfers
• Configurable timeout period
• Non-maskable interrupt on transaction errors
• Transaction Status and Error Flags
• Interrupt enable for receiving interrupt (from D2D target)
5.41.1.3 Modes of Opera tio n
5.41.1.3.1 D2DI in STOP mode
The D2DI stops working in STOP mode. The D2DCLK signal as well as the data signals used are driven low (only after the end
of the current high phase, as defined by D2DCLKDIV).
Waking from STOP mode, the D2DCLK line starts clocking again and the data lines will be driven low until the first transaction
starts.
STOP mode is entered by different CPU instructions. Every (enabled) interrupt can be used to leave the STOP mode.
D2DCLK
D2DDAT[7:0]
/n
n=1 … 4
Bus Clock
D2DINT
D2DCW
Address and
Data Buffer
D2DIE
Address Bus
Write Data Bus
Read Data Bus
D2DINTI
D2DERR_INT
xfr_wait
D2DIF
D2DCLKDIV
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5.41.1.3.2 D2DI in special modes
The MCU can enter a special mode (used for test and debugging purposes as well as programming the FLASH). In the D2DI the
“write-once” feature is disabled. See the MCU description for details.
5.41.2 External Signal Description
The D2DI optionally uses 6 or 10 port pins. The functions of those pins depends on the settings in the D2DCTL0 register, when
the D2DI module is enabled.
5.41.2.1 D2DCLK
When the D2DI is enabled this pin is the clock output. This signal is low if the initiator is disabled, in STOP mode (with D2DSWAI
asserted), otherwise it is a continuos clock. This pin may be shared with general purpose functionality if the D2DI is disabled.
5.41.2.2 D2DDAT[7:4]
When the D2DI is enabled and the interface connection width D2DCW is set to be 8-bit wide, those lines carry the data bits 7:4
acting as outputs or inputs. When they act as inputs pull-down elements are enabled. If the D2DI is disabled or if the interface
connection width is set as 4-bit wide, the pins may be shared with general purpose pin functionality.
5.41.2.3 D2DDAT[3:0]
When the D2DI is enabled those lines carry the data bits 3:0 acting as outputs or inputs. When they act as inputs pull-down
elements are enabled. If the D2DI is disabled the pins and may be shared with general purpose pin functionality.
5.41.2.4 D2DINT
The D2DINT is an active input interrupt input driven by the target device. The pin has an active pull-down device. If the D2DI is
disabled the pin may be shared with general purpose pin functionality.
See the port interface module (PIM) guide for details of the GPIO function.
5.41.3 Memory Map and Register Definition
5.41.3.1 Memory Map
The D2DI memory map is split into three sections.
1. An eight-byte set of control registers
2. A 256 byte window for blocking transactions
3. A 256 byte window for non-blocking transactions
See the chapter “Device Memory Map” for the register layout (distribution of these sections).
Table 489. Signal Properties
Name Primary (D2DEN=1) I/O Secondary
(D2DEN=0) Reset Comm ent Pull down
D2DDAT[7:0] Bi-directional Data Lines I/O GPIO 0 driven low if in STOP mode Active(226)
D2DCLK Interface Clock Signal O GPIO 0 low if in STOP mode —
D2DINT Active High Interrupt I GPIO — — Active(227)
Note:
226. Active if in input state, only if D2DEN=1
227. only if D2DEN=1
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Figure 114. D2DI Top Level Memory Map
A summary of the registers associated with the D2DI block is shown in Table 490. Detailed descriptions of the registers and bits
are given in the subsections that follow.
5.41.3.2 Register Definit io n
5.41.3.3 D2DI Control Register 0 (D2DCTL0)
This register is used to enable and configure the interface width, the wait behavior and the frequency of the interface clock.
Table 490. D2DI Re gister Summary
Offset Register
Name Bit 7654321Bit 0
0x0 D2DCTL0 RD2DEN D2DCW D2DSWAI 000
D2DCLKDIV[1:0]
W
0x1 D2DCTL1 D2DIE 000 TIMEOUT[3:0]
0x2 D2DSTAT0 RERRIF ACKERF CNCLF TIMEF TERRF PARF PAR1 PAR0
W
0x3 D2DSTAT1 D2DIF D2DBSY 0 00000
0x4 D2DADRHI RRWB SZ8 0 NBLK0000
W
0x5 D2DADRLO R ADR[7:0]
W
0x6 D2DDATAHI R DATA[15:8]
W
0x7 D2DDATALO R DATA[7:0]
W
= Unimplemented or Reserved
Table 491. D2DI Control Register 0 (D2DCTL0)
Offset 0x0 Access: User read/write
76543210
RD2DEN D2DCW D2DSWAI 000 D2DCLKDIV[1:0]
W
Reset00000000
8 Byte Control
Registers
256 Byte Window
Blocking Access
256 Byte Window
Non-blocking Write
D2DREGS
D2DBLK
D2DNBLK
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The Clock Divider will provide the waveforms as shown in Figure 115. The duty cycle of the clock is not always 50%, the high
cycle is shorter than 50% or equal but never longer, since this is beneficial for the transaction speed.
Figure 115. Interface Clock Waveforms for various D2DCLKDIV Encoding
5.41.3.4 D2DI Control Register 1 (D2DCTL1)
This register is used to enable the D2DI interrupt and set number of D2DCLK cycles before a timeout error is asserted.
Table 492. D2DCTL0 Register Field Descriptions
Field Description
7
D2DEN
D2DI Enable — Enables the D2DI module. This bit is write-once in normal mode and can always be written in special modes.
0 D2DI initiator is disabled. No lines are not used, the pins have their GPIO (secondary) function.
1 D2DI initiator is enabled. After setting D2DEN=1 the D2DDAT[7:0] (or [3:0], see D2DCW) lines are driven low with
the IDLE command; the D2DCLK is driven by the divided bus clock.
6
D2DCW
D2D Connection Width — Sets the number of data lines used by the interface. This bit is write-once in normal modes and
can always be written in special modes.
0 Lines D2DDAT[3:0] are used for four line data transfer. D2DDAT[7:4] are unused.
1 All eight interface lines D2DDAT[7:0] are used for data transfer.
5
-
Reserved — For internal use
4:2 Reserved, should be written to 0 to ensure compatibility with future versions of this interface.
1:0
D2DCLKDIV
Interface Clock Divider — Determines the frequency of the interface clock. These bits are write-once in normal modes and
can be always written in special modes. See Figure 115 for details on the clock waveforms
00 Encoding 0. Bus clock divide by 1.
01 Encoding 1. Bus clock divide by 2.
10 Encoding 2. Bus clock divide by 3.
11 Encoding 3. Bus clock divide by 4.
Table 493. D2DI Control Register 1 (D2DCTL1)
Offset 0x1 Access: User read/write
76543210
RD2DIE 000 TIMOUT[3:0]
W
Reset00000000
00
01
10
11
bus clock
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NOTE
“Write-once“ means that after writing D2DCNTL0.D2DEN=1 the write accesses to these bits
have no effect.
5.41.3.5 D2DI Status Register 0 (D2 DSTAT0)
This register reflects the status of the D2DI transactions.
Table 494. D2DCTL1 Register Field Descriptions
Field Description
7
D2DIE
D2D Interrupt Enable — Enables the external interrupt
0 External Interrupt is disabled
1 External Interrupt is enabled
6:4 Reserved, should be written to 0 to ensure compatibility with future versions of this interface.
3:0
TIMOUT
Timeout Setting — Defines the number of D2DCLK cycles to wait after the last transaction cycle until a timeout is asserted. In
case of a timeout the TIMEF flag in the D2DSTAT0 register will be set.
These bits are write-once in normal modes and can always be written in special modes.
0000: The acknowledge is expected directly after the last transfer, i.e. the target must not insert a wait cycle.
0001 - 1111: The target may insert up to TIMOUT wait states before acknowledging a transaction until a timeout is asserted
The selected value of TIMOUT depends on the application. Determining factors include the frequency of blocking accesses or
consecutive accesses on the D2D interface.
Table 495. D2DI Status Register 0 (D2DSTAT0)
Offset 0x2 Access: User read/write
76543210
RERRIF ACKERF CNCLF TIMEF TERRF PARF PAR1 PAR0
W
Reset00000000
Table 496. D2DI Status Register 0 Field Descriptions
Field Description
7
ERRIF
D2DI error interrupt flag — This status bit indicates that the D2D initiator has detected an error condition (summary of the
following five flags).This interrupt is not locally maskable. Write a 1 to clear the flag. Writing a 0 has no effect.
0 D2DI has not detected an error during a transaction.
1 D2DI has detected an error during a transaction.
6
ACKERF
Acknowledge Error Flag— This read-only flag indicates that in the acknowledge cycle not all data inputs are sampled high,
indicating a potential broken wire. This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit.
5
CNCLF
CNCLF — This read-only flag indicates the initiator has canceled a transaction and replaced it by an IDLE command due to a
pending error flag (ERRIF). This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit.
4
TIMEF
Time Out Error Flag — This read-only flag indicates the initiator has detected a timeout error. This flag is cleared when the ERRIF
bit is cleared by writing a 1 to the ERRIF bit.
3
TERRF
T ransaction Error Flag — This read-only flag indicates the initiator has detected the error signal during the acknowledge cycle of
the transaction. This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit.
2
PARF
Parity Error Flag — This read-only flag indicates the initiator has detected a parity error. Parity bits[1:0] contain further information.
This flag is cleared when the ERRIF bit is cleared by writing a 1 to the ERRIF bit.
1
PAR1
Parity Bit — P[1] as received by the D2DI
0
PAR0
Parity Bit — P[0] as received by the D2DI
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5.41.3.6 D2DI Status Register 1 (D2 DSTAT1)
This register holds the status of the external interrupt pin and an indicator about the D2DI transaction status.
5.41.3.7 D2DI Address Buffer Register (D2DADR)
This read-only register contains information about the ongoing D2D interface transaction. The register content will be updated
when a new transaction starts. In error cases the user can track back, which transaction failed.
Table 497. D2DI Status Register 1 (D2DSTAT1)
Offset 0x3 Access: User read
76543210
RD2DIF D2DBSY 000000
W
Reset00000000
Table 498. D2DSTAT1 Register Field Descriptions
Field Description
7
D2DIF
D2D Interrupt Flag — This read-only flag reflects the status of the D2DINT Pin. The D2D interrupt flag can only be cleared by a
target specific interrupt acknowledge sequence.
0 External Interrupt is negated
1 External Interrupt is asserted
6
D2DBSY
D2D Initiator Busy — This read-only status bit indicates that a D2D transaction is ongoing.
0 D2D initiator idle.
1 D2D initiator transaction ongoing.
5:0 Reserved, should be masked to ensure compatibility with future versions of this interface.
Ta ble 499. D2DI Address Buffer Register (D2DADR)
Offset 0x4/0x5 Access: User read
1514131211109876543210
RRWB SZ8 0NBLK 00 0 0 ADR[7:0]
W
Reset 0000000000000000
Table 500. D2DI Address Buffer Register Bit Descriptions
Field Description
15
RWB
Transaction Read-Write Direction — This read-only bit reflects the direction of the transaction
0 Write Transaction
1 Read Transaction
14
SZ8
Transaction Size — This read-only bit reflects the data size of the transaction
0 16-bit transaction.
1 8-bit transaction.
13 Reserved, should be masked to ensure compatibility with future versions of this interface.
12
NBLK
Transaction Mode — This read-only bit reflects the mode of the transaction
0 Blocking transaction.
1 Non-blocking transaction.
11:8 Reserved, should be masked to ensure compatibility with future versions of this interface.
7:0
ADR[7:0]
Transaction Address — Those read-only bits contain the address of the transaction
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5.41.3.8 D2DI Data Buffer Register (D2DDATA)
This read-only register contains information about the ongoing D2D interface transaction. For a write transaction the data
becomes valid at the begin of the transaction. For a read transaction the data will be updated during the transaction and is
finalized when the transaction is acknowledged by the target. In error cases the user can track back what has happened.
Both D2DDATA and D2DADR can be read with byte accesses.
5.41.4 Functional Description
5.41.4.1 Initialization
Out of reset the interface is disabled. The interface must be initialized by setting the interface clock speed, the time-out value,
the transfer width and finally enabling the interface. This should be done using a 16-bit write or if using 8-bit write D2DCTL1 must
be written before D2D2CTL0.D2DEN=1 is written. Once it is enabled in normal modes, only a reset can disable it again
(write-once feature).
5.41.4.2 Transactions
A transaction on the D2D Interface is triggered by writing to either the 256 byte address window or reading from the address
window (see STAA/LDAA 0/1 in the next figure). Depending on which address window is used a blocking or a non-blocking
transaction is performed. The address for the transaction is the 8-bit wide window relative address. The data width of the CPU
read or write instructions determines if 8-bit or 16-bit wide data are transferred. There is always only one transaction active.
Figure 116 shows the various types of transactions explained in more detail below.
For all 16-bit read/write accesses of the CPU the addresses are assigned according the big-endian model:
word [15:8]: addr word[7:0]: addr+1
addr: byte-address (8 bit wide) inside the blocking or non-blocking window, as provided by the CPU and transferred to the D2D
target word: CPU data, to be transferred from/to the D2D target The application must care for the stretched CPU cycles (limited
by the TIMOUT value, caused by blocking or consecutive accesses), which could affect time limits, including COP (computer
operates properly) supervision. The stretched CPU cycles cause the “CPU halted” phases (see Figure 116).
Table 501. D2DI Data Buffer Register (D2DDATA)
Offset 0x6/0x7 Access: User read
1514131211109876543210
RDATA15:0
W
Reset 0000000000000000
Ta ble 502. D2DI Data Buffer Register Bit Descriptions
Field Description
15:0
DATA
Transaction Data — Those read-only bits contain the data of the transaction
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Figure 116. Blocking and Non-Blocking Transfers.
5.41.4.2.1 Blocking Writes
When writing to the address window associated with blocking transactions, the CPU is held until the transaction is completed,
before completing the instruction. Figure 116 shows the behavior of the CPU for a blocking write transaction shown in the
following example.
STAA BLK_WINDOW+OFFS0 ; WRITE0 8-bit as a blocking transaction
LDAA #BYTE1
STAA BLK_WINDOW+OFFS1 ; WRITE1 is executed after WRITE0 transaction is completed
NOP
Blocking writes should be used when clearing interrupt flags located in the target or other writes which require that the operation
at the target is completed before proceeding with the CPU instruction stream.
5.41.4.3 Non-Blocking Writes
When writing to the address window associated with non-blocking transactions, the CPU can continue before the transaction is
completed. However if there was a transaction ongoing when doing the 2nd write the CPU is held until the first one is completed,
before executing the 2nd one. Figure 116 shows the behavior of the CPU for a blocking write transaction shown in the following
example.
STAA NONBLK_WINDOW+OFFS0; write 8-bit as a non blocking transaction
LDAA #BYTE1 ; load next byte
STAA NONBLK_WINDOW+OFFS1; executed right after the first
NOP
As the figure illustrates non-blocking writes have a performance advantage, but care must be taken that the following instructions
are not affected by the change in the target caused by the previous transaction.
5.41.4.4 Blocking Read
When reading from the address window associated with blocking transactions, the CPU is held until the data is returned from the
target, before completing the instruction.Figure 116 shows the behavior of the CPU for a blocking read transaction shown in the
following example.
LDAA BLK_WINDOW+OFFS0 ; Read 8-bit as a blocking transaction
STAA MEM ; Store result to local Memory
LDAA BLK_WINDOW+OFFS1 ; Read 8-bit as a blocking transaction
STAA 0 LDAA # STAA 1
Write Transaction 0 Write Transaction 1
STAA 0 LDAA # STAA 1
Write Transaction 0 Write Transaction 1
NOP
NOP
CPU Halted CPU Halted
CPU
Halted
Blocking
Write
Non-Blocking
Write
LDAA 0 LDAA 1
Transaction 0 Transaction 1
CPU Halted CPU Halted NOP
Blocking
Read
STAA
MEM
CPU activity
CPU activity
CPU activity
D2D activity
D2D activity
D2D activity
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5.41.4.5 Non-Blocking Read
Read access to the non-blocking window is reserved for future use. When reading from the address window associated with
non-blocking writes, the read returns an all 0s data byte or word. This behavior can change in future revisions.
5.41.4.6 Transfer Width
8-bit wide writes or reads are translated into 8-bit wide interface transactions. 16-bit wide, aligned writes or reads are translated
into a16-bit wide interface transactions. 16-bit wide, misaligned writes or reads are split up into two consecutive 8-bit transactions
with the transaction on the odd address first followed by the transaction on the next higher even address. Due to the much more
complex error handling (by the MCU), misaligned 16-bit transfers should be avoided.
5.41.4.7 Error Conditions and Handling faults
Since the S12 CPU (as well as the S08) do not provide a method to abort a transfer once started, the D2DI asserts an
D2DERRINT. The ERRIF Flag is set in the D2DSTAT0 register. Depending on the error condition further error flags will be set as
described below. The content of the address and data buffers are frozen and all transactions will be replaced by an IDLE
command, until the error flag is cleared. If an error is detected during the read transaction of a read-modify-write instruction or a
non-blocking write transaction was followed by another write or read transaction, the second transaction is cancelled. The CNCLF
is set in the D2DSTAT0 register to indicate that a transaction has been cancelled. The D2DERRINT handler can read the address
and data buffer register to assess the error situation. Any further transaction will be replaced by IDLE until the ERRIF is cleared.
5.41.4.7.1 Missing Acknowledge
If the target detects a wrong command it will not send back an acknowledge. The same situation occurs if the acknowledge is
corrupted. The D2DI detects this missing acknowledge after the timeout period configured in the TIMOUT parameter of the
D2DCTL1 register. In case of a timeout the ERRIF and the TIMEF flags in the D2DSTAT0 register will be set.
5.41.4.7.2 Parity error
In the final acknowledge cycle of a transaction the target sends two parity bits. If this parity does not match the parity calculated
by the initiator, the ERRIF and the PARF flags in the D2DSTAT0 register will be set. The PAR[1:0] bits contain the parity value
received by the D2DI.
5.41.4.7.3 Error Signal
During the acknowledge cycle the target can signal a target specific error condition. If the D2DI finds the error signal asserted
during a transaction, the ERRIF and the TERRF flags in the D2DSTAT0 register will be set.
5.41.4.8 Low Power Mode Options
5.41.4.8.1 D2DI in Run Mode
In run mode with the D2D Interface enable (D2DEN) bit in the D2D control register 0 clear, the D2DI system is in a low-power,
disabled state. D2D registers remain accessible, but clocks to the core of this module are disabled. On D2D lines the GPIO
function is activated.
5.41.4.8.2 D2DI in Stop Mode
If the CPU enters the STOP mode, any pending transmission is completed. When the D2DCLK output is driven low, clock
generation is stopped. All internal clocks to the D2DCLK are stopped as well, and the module enters a power saving state.
5.41.4.8.3 Reset
In case of reset any transaction is immediately stopped and the D2DI module is disabled.
5.41.4.8.4 Interrupts
The D2DI only originates interrupt requests, when D2DI is enabled (D2DIE bit in D2DCTL0 set). There are two different interrupt
requests from the D2D module. The interrupt vector offset and interrupt priority are chip dependent.
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5.41.4.8.4.1 D2D External Interrupt
This is a level sensitive active high external interrupt driven by the D2DINT input. This interrupt is enabled if the D2DIE bit in the
D2DCTL1 register is set. The interrupt must be cleared using an target specific clearing sequence. The status of the D2D input
pin can be observed by reading the D2DIF bit in the D2DSTAT1 register.
The D2DINIT signal is asserted also in the stop mode; it can be used to leave these modes.
Figure 117. D2D External Interrupt Scheme
5.41.4.8.4.2 D2D Error Interrupt
Those D2D interface specific interrupts are level sensitive and are all cleared by writing a 1 to the ERRIF flag in the D2DSTAT0
register. This interrupt is not locally maskable and should be tied to the highest possible interrupt level in the system, on an S12
architecture to the XIRQ. See the chapter “Vectors” of the MCU description for details.
Figure 118. D2D Internal Interrupts
D2DIE
D2DINT
D2DINTI
To read data bus (D2DSTAT1.D2DIF)
ACKERF
CNCLF
TIMEF
TERRF
PARF
ERRIF
D2DEN
D2DERRINT
1
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5.41.5 Initialization Information
During initialization the transfer width, clock divider and timeout value must be set according to the capabilities of the target device
before starting any transaction. See the D2D Target specification for details.
5.41.6 Application Information
5.41.6.1 Entering low power mode
The D2DI module is typically used on a microcontroller along with an analog companion device containing the D2D target
interface and supplying the power. Interface specification does not provide special wires for signalling low power modes to the
target device. The CPU should determine when it is time to enter one of the above power modes.The basic flow is as follows:
1. CPU determines there is no more work pending.
2. CPU writes a byte to a register on the analog die using blocking write configuring which mode to enter.
3. Analog die acknowledges that write sending back an acknowledge symbol on the interface.
4. CPU executes STOP command.
5. Analog die can enter low power mode - (S12 needs some more cycles to stack data!)
; Example shows S12 code
SEI ; disable interrupts during test
; check is there is work pending?
; if yes, branch off and re-enable interrupt
; else
LDAA #STOP_ENTRY
STAA MODE_REG ; store to the analog die mode reg (use blocking write here)
CLI ; re-enable right before the STOP instruction
STOP ; stack and turn off all clocks inc. interface clock
For wake-up from STOP the basic flow is as follows:
1. Analog die detects a wake-up condition, e.g. on a switch input or start bit of a LIN message.
2. Analog die exits Voltage Regulator low power mode.
3. Analog die asserts the interrupt signal D2DINT.
4. CPU starts clock generation.
5. CPU enters interrupt handler routine.
6. CPU services interrupt and acknowledges the source on the analog die.
NOTE
Entering STOP mode mode with D2DSWAI asserted the clock will complete the high duty
cycle portion and settle at low level.
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AE SUFFIX
48-PIN
LQFP48
REVISION 0
Packaging
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AE SUFFIX
48-PIN
LQFP48
REVISION 0
Packaging
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AP SUFFIX
48-PIN
98ASH00962A
REVISION G
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REVISION G
Revision History
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7 Revision History
.
Revision Date Description
1.0 11/2010 • Initial release. Preliminary.
2.0 4/2011 • Advance Information release.
3.0 5/2011 • Added a note to the Ordering Information Table defining the addition of R2 to the part number
• Updated the Table 3 part numbering scheme
4.0 5/2011 • Corrected errors in Table 49. ESD and Latch-up Protection Characteristics
5.0 9/2011 • Corrected errors in table 213, MCU IFR Address
• Corrected an address error in table 252.
6.0 1/2012
• Corrected register note in table Table 161.
• Corrected header “Access” in Table 191, Table 192, Ta b l e 1 9 3 , and Table 194.
• Removed section on the MMC Control Register (MMCCTL1), and references to RAMON, IFRON,
and ROMON bits.
7.0 3/2012
• Added to description of pin 46
• Corrected Figure 36.
• Corrected Table 213
• Added P-Flash Protection Register table.
• Added information to D@DCTL1 Register Field Description table.
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