• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
Multilayer Chip Beads(SMD Array)
For signal line
MZA series
Type:
Issue date:
MZA1210 [0504 inch]* (2 lines)
MZA2010 [0804 inch] (4 lines)
* Dimensions Code JIS[EIA]
May 2011
• All specifications are subject to change without notice.
(1/6)
001-03 / 20110509 / e9421_mza
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA1210 Type
FEATURES
• A single MZA series chip provides noise attenuation for two
lines, making it ideal for use with I/O lines of various highly
miniaturized.
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
• Electroplated terminal electrodes accommodate reflow
soldering.
• Monolithic structure ensures high reliability.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, DVDs, DSCs, game machines, digital photo frames, PNDs,
etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
CIRCUIT DIAGRAM
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
MZA 1210 D 121 C T
(1) (2) (3) (4) (5) (6) Operating/storage –55 to +125°C
Packaging style Quantity
Taping 5000 pieces/reel
1.25±0.15
0.20±0.15
1.00±0.15
0.50±0.10
0.65±0.10
Weight: 3mg
Dimensions in mm
0.35±0.15 0.35±0.15
0.5
0.5
0.4
0.3
• No polarity
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(2/6)
001-03 / 20110509 / e9421_mza
ELECTRICAL CHARACTERISTICS
∗Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA1210D330C MZA1210D680C MZA1210D121C
MZA1210D241C
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
Part No. Impedance
(Ω)[100MHz]∗
DC resistance
(Ω)max.
Rated current
(mA)max.
Rated voltage
(V)max.
MZA1210D330C 33±25% 0.30 50 5
MZA1210D680C 68±25% 0.50 50 5
MZA1210D121C 120±25% 0.80 50 5
MZA1210D241C 240±25% 1.20 50 5
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
Z
X
R
50
100
150
200
250 500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
100
200
300
400
500
600
700
800
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
Z
X
R
200
400
600
800
1000
1200
1400
1600
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.75±0.1
4.0±0.1 4.0±0.1
2.0±0.05
1.5 +0.1
–0.0
Sprocket hole Cavity
1.45±0.2
0.8max. 1.2±0.2
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(3/6)
001-03 / 20110509 / e9421_mza
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA2010 Type
FEATURES
• A single MZA series chip provides noise attenuation for four
lines, making it ideal for use with I/O lines of various highly
miniaturized.
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
• Electroplated terminal electrodes accommodate reflow
soldering.
• Monolithic structure ensures high reliability.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, DVDs, DSCs, game machines, digital photo frames, PNDs,
etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
MATERIAL CHARACTERISTICS
B material: This type is perfectly suited for fast digital signals. By
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (300MHz to 1GHz) for signal line applica-
tions.
F material: This new product inherits the characteristic of our D-
material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres-
sion from 600MHz to as high as in the GHz range.
TYPICAL MATERIAL CHARACTERISTICS
Conformity to RoHS Directive
MZA 2010 D 121 C T
(1) (2) (3) (4) (5) (6)
B
S
D
Y
0
200
400
600
800
1000
1200
1400
1600
1800
2000
10 100 1000
Frequency(MHz)
Impedance(Ω)
F
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(4/6)
001-03 / 20110509 / e9421_mza
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
CIRCUIT DIAGRAM
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
∗Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 5000 pieces/reel
Dimensions in mmWeight: 5mg
0.5±0.1
0.5±0.1
1.0±0.15
2.0±0.15
0.2±0.15
0.6 0.6
0.6
0.5 0.25
Ferrite
Terminal
electrode
0.25+0.15/–0.10
• No polarity
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
Part No. Impedance
(Ω)[100MHz]∗
DC resistance
(Ω)max.
Rated current
(mA)max.
Rated voltage
(V)max.
MZA2010B241C 240±25% 0.45 100 5
MZA2010S800C 80±25% 0.22 100 5
MZA2010S121C 120±25% 0.25 100 5
MZA2010S241C 240±25% 0.35 100 5
MZA2010S601C 600±25% 0.50 100 5
MZA2010S102C 1000±25% 0.75 100 5
MZA2010Y800C 80±25% 0.30 100 5
MZA2010Y121C 120±25% 0.40 100 5
MZA2010Y241C 240±25% 0.60 100 5
MZA2010Y601C 600±25% 0.80 100 5
MZA2010Y102C 1000±25% 1.00 100 5
MZA2010D330C 33±25% 0.30 50 5
MZA2010D680C 68±25% 0.50 50 5
MZA2010D121C 120±25% 0.80 50 5
MZA2010D241C 240±25% 1.20 50 5
MZA2010F330C 33±25% 0.60 100 5
MZA2010F470C 47±25% 0.80 100 5
MZA2010F560C 56±25% 0.80 100 5
• All specifications are subject to change without notice.
(5/6)
001-03 / 20110509 / e9421_mza
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA2010B241C MZA2010S800C MZA2010S121C
MZA2010S241C MZA2010S601C MZA2010S102C
MZA2010Y800C MZA2010Y121C MZA2010Y241C
MZA2010Y601C MZA2010Y102C MZA2010D330C
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
R
X
Z
50
100
150
200
250
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
50
100
150
200
250
300
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
R
X
Z
20
40
60
80
100
120
140
1400
1200
1000
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
R
X
Z
100
200
300
400
500
600
700
800
900
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
R
X
Z
50
100
150
200
250
300
350
400
450
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
R
X
Z
20
40
60
80
100
120
140
160
180 300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
50
100
150
200
250
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
R
X
Z
200
400
600
800
1000 1400
1200
1000
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
• All specifications are subject to change without notice.
(6/6)
001-03 / 20110509 / e9421_mza
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA2010D680C MZA2010D121C MZA2010D241C
MZA2010F330C MZA2010F470C MZA2010F560C
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
X
ZR
Impedance(Ω)
0
400
800
1200
1600
200
600
1000
1400
1 10 100
Frequency(MHz)
1000 10000
0
100
200
300
400
500
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
R
X
Z
Impedance(Ω)
0
200
400
600
800
100
300
500
700
1 10 100
Frequency(MHz)
1000 10000
X
Z
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0R
X
Z
200
400
600
800
1000
1200
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
R
X
Z
100
200
300
400
500
600
700
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
0
100
200
300
400
500
600
700
800
900
R
X
Z
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.75±0.1
4.0±0.1 4.0±0.1
2.0±0.05
1.5 +0.1
–0.0
Sprocket hole Cavity
2.3±0.2
0.8max. 1.3±0.2
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
