25 Watts Flanged Attenuators Model RFP-25-XXAPZ Flanged Attenuators General Specifications Resistive Element: Substrate: Cover: Mounting Flange: Lead(s): Features * DC - 2.5 GHz * 25 Watts * BeO Ceramic * Welded Silver Leads * Non-Nichrome Resistive Element * Low VSWR Thick film Beryllium oxide ceramic Alumina ceramic Copper nickel plated per QQ-N-290 99.99% pure silver (.005" thk) Electrical Specifications Attenuation Value: Frequency Range: Power: 1, 2, 3, 4, 5, 6, 9, 10, 20 or 30 dB DC - 2.5 GHz 25 Watts Notes: Tolerance is .010, unless otherwise specified. Operating temperature is -55C to +150C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Lead length 0.15" minimum. Specifications subject to change without notice. * 100% Tested Outline Drawing Note: XX denotes attenuation value. VER. 12/5/01 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Flanged Attenuators Model RFP-25-XXAPZ Specifications PART NUMBER ATTENUATION (dB) TOL. (+/-dB) POWER (WATTS) VSWR FREQ. (GHz) RFP-25-1APZ 1 0.5 25 1.20:1 2.5 RFP-25-2APZ 2 0.5 25 1.20:1 2.5 RFP-25-3APZ 3 0.5 25 1.20:1 2.5 RFP-25-4APZ 4 0.5 25 1.20:1 2.5 RFP-25-5APZ 5 0.5 25 1.20:1 2.5 RFP-25-6APZ 6 0.5 25 1.20:1 2.5 RFP-25-9APZ 9 0.5 25 1.25:1 2.5 RFP-25-10APZ 10 0.5 25 1.25:1 2.5 RFP-25-20APZ 20 1.0 25 1.20:1 2.5 RFP-25-30APZ 30 1.5 25 1.20:1 2.0 Suggested Mounting Procedures Power Derating % OF RATED POWER .025 MIN. (2 PLACES) 100 BOARD LOWER THAN LEAD. 75 BOARD EVEN WITH LEAD. SUGGESTED STRESS RELIEF METHODS SCALE: 50 BOARD LOWER THAN LEAD. BOARD HIGHER THAN LEAD. NOT RECOMMENDED APPLICATION SCALE: 1. Make sure that the devices are mounted on flat surfaces (.001" under the device) to optimize the heat transfer. 25 0 25 50 75 100 125 CASE TEMPERATURE -- C 150 2. Drill & tap the heatsink for the appropriate thread size to be used. 3. Coat heatsink with a minimum amount of high quality silicone grease (.001" max. thickness). 4. Position device on mounting surface and secure using socket head screws, flat & split washers. Torque screws to the appropriate value. Make sure that the device is flat against the heatsink. (Care should be taken to avoid upward pressure of the leads towards the lid). 5. Solder leads in place using an SN63 type solder with a controlled temperature iron (210C). 2 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369