B65526A2000X000 - EPCOS - Product.Network

 EPCOS AG 2017. Reproduction, publication and dissemination of this publication, enclosures hereto and the

information contained therein without EPCOS’ prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

Ferrites and accessories

ER 11/5

Planar cores in sets

Series/Type: B65525, B65526

Date: May 2017

25/17

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Important notes at the end of this document.

■To IEC 62317-9

■For transformers featuring high inductance

and low overall height

■Delivery mode: sets

Magnetic characteristics (per set)

Σl/A = 1.1 mm–1

le= 14.1 mm

Ae= 12.4 mm2

Amin = 10.3 mm2

Ve= 174 mm3

Approx. weight 0.85 g/set

Ungapped

Gapped (AL values/air gaps examples)

Other AL values/air gaps and materials available on request – see Processing remarks on page 4.

Material AL value

μeOrdering code

N49 800 +30/–20% 715 B65525J0000R049

N92 900 +30/–20% 814 B65525J0000R092

N87 1200 +30/–20% 1050 B65525J0000R087

N97 1200 +30/–20% 1086 B65525J0000R097

T38 6400 +40/–30% 5600 B65525J0000Y038

Material AL value

approx.

μeOrdering code

N87 160 ±3%

100 ±3%

0.08

0.14

140

B65525J0160A087

B65525J0100A087

B65525Planar core

ER 11/5

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Important notes at the end of this document.

SMD coil former with gullwing terminals

Material: GFR liquid crystal polymer (UL 94 V-0, insulation class to IEC 60085:

F max. operating temperature 155 °C), color code black

Zenite 7130® [E344082 (M)], CELANESE INTERNATIONAL CORP.

Solderability: to IEC 60068-2-58, test Td, method 6 (Group 3): 245 °C, 3 s

Resistance to soldering heat: to IEC 60068-2-58, test Td, method 6 (Group 3): 255 °C, 10 s

permissible soldering temperature for wire-wrap connection on coil former: 400 °C, 1 s

Winding: see Processing notes, 2.1

Yoke Material: Stainless spring steel (0.15 mm)

Coil former Ordering code

Sections AN

mm2

AR value

μΩ

Terminals

1 3.3 21.6 225 10 B65526B1010T001

Yoke B65526A2000X000

Recommended

PCB layout

Marking of pin 1

Coil former Yoke

Recommended

PCB layout

Marking of pin 1

B65526Accessories

ER 11/5

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Important notes at the end of this document.

Mechanical stress and mounting

Ferrite cores have to meet mechanical requirements during assembling and for a growing number

of applications. Since ferrites are ceramic materials one has to be aware of the special behavior

under mechanical load.

As valid for any ceramic material, ferrite cores are brittle and sensitive to any shock, fast tempera-

ture changing or tensile load. Especially high cooling rates under ultrasonic cleaning and high static

or cyclic loads can cause cracks or failure of the ferrite cores.

For detailed information see data book, chapter “General - Definitions, 8.1”.

Effects of core combination on AL value

Stresses in the core affect not only the mechanical but also the magnetic properties. It is apparent

that the initial permeability is dependent on the stress state of the core. The higher the stresses are

in the core, the lower is the value for the initial permeability. Thus the embedding medium should

have the greatest possible elasticity.

For detailed information see data book, chapter “General - Definitions, 8.1”.

Heating up

Ferrites can run hot during operation at higher flux densities and higher frequencies.

NiZn-materials

The magnetic properties of NiZn-materials can change irreversible in high magnetic fields.

Ferrite Accessories

EPCOS ferrite accessories have been designed and evaluated only in combination with EPCOS

ferrite cores. EPCOS explicitly points out that EPCOS ferrite accessories or EPCOS ferrite cores

may not be compatible with those of other manufacturers. Any such combination requires prior te-

sting by the customer and will be at the customer‘s own risk.

EPCOS assumes no warranty or reliability for the combination of EPCOS ferrite accessories with

cores and other accessories from any other manufacturer.

Processing remarks

The start of the winding process should be soft. Else the flanges may be destroyed.

– Too strong winding forces may blast the flanges or squeeze the tube that the cores can not be

mounted any more.

– Too long soldering time at high temperature (>300 °C) may effect coplanarity or pin arrange-

ment.

– Not following the processing notes for soldering of the J-leg terminals may cause solderability

problems at the transformer because of pollution with Sn oxyde of the tin bath or burned insula-

tion of the wire. For detailed information see chapter “Processing notes”, section 2.2.

– The dimensions of the hole arrangement have fixed values and should be understood as

a recommendation for drilling the printed circuit board. For dimensioning the pins, the group

of holes can only be seen under certain conditions, as they fit into the given hole arrangement.

To avoid problems when mounting the transformer, the manufacturing tolerances for positioning

the customers’ drilling process must be considered by increasing the hole diameter.

Cautions and warnings

Ferrites and accessories

Cautions and warnings

55/17

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Important notes at the end of this document.

Ferrites and accessories

Display of ordering codes for EPCOS products

The ordering code for one and the same product can be represented differently in data sheets,

data books, other publications and the website of EPCOS, or in order-related documents such as

shipping notes, order confirmations and product labels. The varying representations of the

ordering codes are due to different processes employed and do not affect the

specifications of the respective products. Detailed information can be found on the Internet

under www.epcos.com/orderingcodes.

Cautions and warnings

65/17

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Important notes at the end of this document.

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for certain areas

of application. These statements are based on our knowledge of typical requirements that are often placed

on our products in the areas of application concerned. We nevertheless expressly point out that such

statements cannot be regarded as binding statements about the suitability of our products for a

particular customer application. As a rule we are either unfamiliar with individual customer applications or

less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent

on the customer to check and decide whether a product with the properties described in the product

specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure before

the end of their usual service life cannot be completely ruled out in the current state of the art, even

if they are operated as specified. In customer applications requiring a very high level of operational safety

and especially in customer applications in which the malfunction or failure of an electronic component could

endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be

ensured by means of suitable design of the customer application or other action taken by the customer (e.g.

installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the

event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this publication

may contain substances subject to restrictions in certain jurisdictions (e.g. because they are

classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet

(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our

sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this publication

may change from time to time. The same is true of the corresponding product specifications. Please

check therefore to what extent product descriptions and specifications contained in this publication are still

applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The aforementioned

does not apply in the case of individual agreements deviating from the foregoing for customer-specific

products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and

Conditions of Supply.

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF

certifications confirm our compliance with requirements regarding the quality management system in the

automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK

always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949

may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only

requirements mutually agreed upon can and will be implemented in our Quality Management

System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become

legally binding if individually agreed upon.

8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,

PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,

SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered

or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-

electronics.tdk.com/trademarks.

Release 2018-10

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Important notes at the end of this document.

Symbol Meaning Unit

AL1

Amin

ΔB

BDC

CDF

fcutoff

fmax

fmin

fCu

HDC

h/μi2

IDC

k3c

Cross section of coil

Effective magnetic cross section

Inductance factor; AL = L/N2

Minimum inductance at defined high saturation ( μa)

Minimum core cross section

Winding cross section

Resistance factor; AR = RCu/N2

RMS value of magnetic flux density

Flux density deviation

Peak value of magnetic flux density

Peak value of flux density deviation

DC magnetic flux density

Remanent flux density

Saturation magnetization

Winding capacitance

Core distortion factor

Relative disaccommodation coefficient DF = d/μi

Disaccommodation coefficient

Activation energy

Frequency

Cut-off frequency

Upper frequency limit

Lower frequency limit

Resonance frequency

Copper filling factor

Air gap

RMS value of magnetic field strength

Peak value of magnetic field strength

DC field strength

Coercive field strength

Hysteresis coefficient of material

Relative hysteresis coefficient

RMS value of current

Direct current

Peak value of current

Polarization

Boltzmann constant

Third harmonic distortion

Circuit third harmonic distortion

Inductance

mm2

μΩ = 10–6 Ω

Vs/m2, mT

F = As/V

mm–4.5

s–1, Hz

A/m

10–6 cm/A

Vs/m2

J/K

H = Vs/A

Symbols and terms

Ferrites and accessories

Symbols and terms

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Important notes at the end of this document.

Symbol Meaning Unit

ΔL/L

Lrev

PCu

Ptrans

RCu

ΔRh

Rth

ΔT

tan δ

tan δL

tan δr

tan δe

tan δh

tan δ/μi

Relative inductance change

Inductance of coil without core

Main inductance

Parallel inductance

Reversible inductance

Series inductance

Effective magnetic path length

Average length of turn

Number of turns

Copper (winding) losses

Transferrable power

Relative core losses

Performance factor

Quality factor (Q = ωL/Rs = 1/tan δL)

Resistance

Copper (winding) resistance (f = 0)

Hysteresis loss resistance of a core

Rh change

Internal resistance

Parallel loss resistance of a core

Series loss resistance of a core

Thermal resistance

Effective loss resistance of a core

Total air gap

Temperature

Temperature difference

Curie temperature

Time

Pulse duty factor

Loss factor

Loss factor of coil

(Residual) loss factor at H → 0

Relative loss factor

Hysteresis loss factor

Relative loss factor of material at H → 0

RMS value of voltage

Peak value of voltage

Effective magnetic volume

Complex impedance

Normalized impedance |Z|n = |Z| /N2 × ε (le/Ae)

mW/g

K/W

°C

mm3

Ω/mm

Symbols and terms

Ferrites and accessories

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Important notes at the end of this document.

All dimensions are given in mm.

Surface-mount device

Symbol Meaning Unit

αF

αe

εr

ηB

ηi

λs

μ0

μa

μapp

μe

μi

μp'

μp"

μr

μrev

μs'

μs"

μtot

Σl/A

τCu

Temperature coefficient (TK)

Relative temperature coefficient of material

Temperature coefficient of effective permeability

Relative permittivity

Magnetic flux

Efficiency of a transformer

Hysteresis material constant

Hysteresis core constant

Magnetostriction at saturation magnetization

Relative complex permeability

Magnetic field constant

Relative amplitude permeability

Relative apparent permeability

Relative effective permeability

Relative initial permeability

Relative real (inductive) component of μ(for parallel components)

Relative imaginary (loss) component of μ(for parallel components)

Relative permeability

Relative reversible permeability

Relative real (inductive) component of μ(for series components)

Relative imaginary (loss) component of μ(for series components)

Relative total permeability

derived from the static magnetization curve

Resistivity

Magnetic form factor

DC time constant τCu = L/RCu = AL/AR

Angular frequency; ω = 2 Πf

1/K

mT-1

A–1H–1/2

Vs/Am

Ωm–1

mm–1

s–1

Symbols and terms

Ferrites and accessories