MICROPAC INDUSTRIES, INC.
OPTOELECTRONIC PRODUCTS DIVISION
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725 E.Walnut St., Garland, TX 75040
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(972)272-3571
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Fax (972)487-6918
www.micropac.com
E-MAIL: OPTOSALES @ MICROPAC.COM
3N261
66133 3N262
TO-18 OPTOCOUPLERS
3N263
OPTOELECTRONIC PRODUCTS
DIVISION
01/26/2011
Features:
• High Reliability
• Electrically similar to 4N47, 4N48, 4N49
• Base lead eliminated for improved noise immunity
• Rugged package
• +1 kV electrical isolation
• Stability over wide temperature range
Applications:
• Eliminate ground loops
• Level shifting
• Line receiver
• Switching power supplies
• Motor control
DESCRIPTION
The 66133 contains an infrared LED optically coupled to a silicon phototransistor in a hermetic 4 lead TO-18 package. The
collector of the phototransistor is electrically connected to the case. The internal base connection has been eliminated for
improved noise immunity. The 3N261, 3N262 and 3N263 c an be supplied to commercial or screened quality levels as well as
to customer specifications.
ABS OLUTE MAX IMUM R AT I NGS
Input to Output Voltage ........................................................................................................................................................ 1000 V
Emitter-Collector Voltage ........................................................................................................................................................... 7 V
Collector-Emitter Voltage ......................................................................................................................................................... 40 V
Reverse Input Voltage .............................................................................................................................................................. 2 V
Input Diode Continuous Forward Current at (or below) 65°C Free-Air Temperature (see note 1) ..................................... 40 mA
Continuous Collector Current ............................................................................................................................................... 20 mA
Continuous Transistor Power Dissipation at (or below) 25°C Free-Air Temperature (see Note 2) ............................... 190 mW
Storage Temperature ........................................................................................................................................... -55°C to +150°C
Operating Free-Air Temperature Range. ............................................................................................................ -55°C to +125°C
Lead Solder Temperature (10 seconds max, 1/16” from case) ........................................................................................... 240°C
Notes:
1. Derate linearly to 125°C free-air tem per ature at the rate of 0.67 mA/
°
C.
2. Derate linearly to 125°C free-air tem per ature at the rate of 1.9 mW/
°
C.
Package Dimensions Schematic Diagram
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
0.500 [12.70]
MIN
4 LEAD S
0.019 [0.48]
0.016 [0.41]
0.230 [5.84]
0.209 [5.31]
0.210 [5.33]
0.170 [4.32]
0.030 [0.76]
0.195 [4.95]
0.178 [4.52]
THE COLLECTO R IS IN ELEC TRICAL CONTACT WITH THE CASE .
Ø0.100 [2.54 ]
1
2
3
2
4
4
1
3