BAP63-03 - NXP Semiconductors

DATA SH EET

Product specification

Supersedes data of 2001 May 18 2004 Feb 11

DISCRETE SEMICONDUCTORS

BAP63-03

Silicon PIN diode

2004 Feb 11 2

NXP Semiconductors Product specification

Silicon PIN diode BAP63-03

FEATURES

High speed switching for RF signals

Low diode capacitance

Low diode fo rward resistance

Very low series inductance

For applications up to 3 GHz.

APPLICATIONS

RF attenuators and switches.

DESCRIPTION

Planar PIN diode in a SOD323 small SMD plastic package.

PINNING

PIN DESCRIPTION

1 cathode

2 anode

sym006

Marking code: D2.

The marking bar indicates the cathode.

Fig.1 Simplified outline (SOD323) and symbol.

ORDERING INFORMATION

LIMITING VALUES

In accordance with the Absolute Maximum Ra ting System (IEC 60134).

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

BAP63-03 plastic surface moun ted package; 2 lea ds SOD323

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VRcontinuous reverse voltage 50 V

IFcontinuous forward current 100 mA

Ptot total power dissipation Ts90 C500 mW

Tstg storage temper a t u re 65 +150 C

Tjjunction temperature 65 +150 C

2004 Feb 11 3

NXP Semiconductors Product specification

Silicon PIN diode BAP63-03

ELECTRICAL CHARACTERISTIC S

Tj=25C unless otherwise specified.

Note

1. Guaranteed on AQL bas is: inspection level S4, AQL 1.0.

THERMAL CHARACTE RISTI CS

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

VFforward voltage IF=50mA 0.95 1.1 V

IRreverse leakage current VR=35V 10 nA

Cddiode capacitance VR=0; f=1MHz 0.4 pF

VR=1V; f=1MHz 0.35 pF

VR= 20 V; f = 1 MHz 0.27 0.32 pF

rDdiode forw ard resistance IF= 0.5 mA; f = 100 MHz; note 1 2.5 3.5 

IF= 1 mA; f = 100 MHz; note 1 1.95 3 

IF= 10 mA; f = 100 MHz; note 1 1.17 1.8 

IF= 100 mA; f = 100 MHz; note 1 0.9 1.5 

s212isolation VR= 0; f = 900 MHz 15.4 dB

VR= 0; f = 1800 MHz 10.1 dB

VR= 0; f = 2 450 MHz 7.8 dB

s212insertion loss IF= 0.5 mA; f = 900 MHz 0.21 dB

IF= 0.5 mA; f = 1800 MHz 0.28 dB

IF= 0.5 mA; f = 2450 MHz 0.38 dB

s212insertion loss IF= 1 mA; f = 900 MHz 0.18 dB

IF= 1 mA; f = 1800 MHz 0.26 dB

IF= 1 mA; f = 2450 MHz 0.35 dB

s212insertion loss IF= 10 mA; f = 900 MHz 0.13 dB

IF= 10 m A; f = 1800 MHz 0.20 dB

IF= 10 m A; f = 2450 MHz 0.30 dB

s212insertion loss IF= 100 mA; f = 900 MHz 0.10 dB

IF= 100 mA; f = 1800 MHz 0.18 dB

IF= 100 mA; f = 2450 MHz 0.28 dB

Lcharge carrier life time when switched from IF=10mA to

IR=6mA; R

L=100;

measured at IR=3mA

310 ns

LSseries inductance 1.5 nH

SYMBOL PARAMETER VALUE UNIT

Rth(j-s) thermal resistance from junction to soldering point 120 K/W

2004 Feb 11 4

NXP Semiconductors Product specification

Silicon PIN diode BAP63-03

GRAPHICAL DATA

handbook, halfpage

10−1

MGW126

10−1110

IF (mA)

(Ω)

102

Fig.2 Forward resistance as a function of forward

current; ty pical values.

Tj=25C; f = 100 MHz.

handbook, halfpage

020

500

400

100

MGW130

200

300

4 8 12 16 VR (V)

(fF)

Fig.3 Diode capacitance as a function of reverse

voltage; typical values.

Tj=25C; f = 1 MHz.

handbook, halfpage

0123

−0.1

−0.3

−0.5

−0.4

−0.2

MGW131

f (GHz)

|s21|2

(dB) (1)

(2)

(3)

(4)

Fig.4 Insertion loss (s212) of the diode in on-state

as a function of frequency; typical values.

Diode inserted in series with a 50  stripline circuit and biased via the

analyzer Tee network.

Tamb =25C.

(1) IF=100mA.

(2) IF=10mA. (3) IF=1mA.

(4) IF=0.5mA.

handbook, halfpage

0123

−10

−30

−40

−20

MGW132

f (GHz)

s21

(dB)

Fig.5 Isolation (s212) of the diode in off-state as a

function of frequency; typical values.

Diode zero biased and inserted in serie s with a 50  stripline circuit.

Tamb =25C.

2004 Feb 11 5

NXP Semiconductors Product specification

Silicon PIN diode BAP63-03

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOD323 SC-76

SOD323

03-12-17

06-03-16

Note

1. The marking bar indicates the cathode

UNIT A

mm 0.05

1.1

0.8 0.40

0.25 0.25

0.10 1.8

1.6 1.35

1.15 2.7

2.3 0.45

0.15

max

DIMENSIONS (mm are the original dimensions)

Plastic surface-mounted package; 2 leads

(1)

2 mm

scale

bpc D E HDQ

0.25

0.15

Lpv

0.2

detail X

A1c

HDvA

2004 Feb 11 6

NXP Semiconductors Product specification

Silicon PIN diode BAP63-03

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document b efore initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this do cument was published

and may differ in case of multiple devices. The latest product status information is available on th e Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective specification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This document contains the product specification.

DEFINITIONS

Product specification  The information and da ta

provided in a Product data she et shall define the

specification of the product as agreed between NXP

Semiconductors and its custo m er, unless NXP

Semiconductors and cus to mer have explicitly agreed

otherwise in writing. In no event however, shall an

agreement be valid in which th e NXP Semiconductors

product is deemed to offer functions and qualities beyond

those described in the Product data sheet.

DISCLAIMERS

Limited warranty and liability  Information in this

document is believed to be accurate and reliable.

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or consequential

damages (including - without limitation - lost profits, lost

savings, busin es s inte rru ption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cumulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Right to make changes  NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and prod uct descriptions, at any time and

without notice. This document supersedes and replaces all

information su pplied prior to the publication hereof.

Suitability for use  NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in life support, life-critical or safety-critic al systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to res ult in personal injur y, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductor s pr od ucts in such equipment or

application s and therefore such inclusion and /or use is at

the customer’s own risk.

Applications  Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors pro du ct is su itable and fit for the

customer’s applications and products planned, as well as

for the planned application and use of customer’s third

party customer(s). Customers should provide appropriate

design and opera ting safeguards to minimi ze the ris ks

associated with their ap plications and produ cts .

2004 Feb 11 7

NXP Semiconductors Product specification

Silicon PIN diode BAP63-03

NXP Semiconductors does not accept any liability related

to any default, damage, cost s or problem which is based

on any weakness or default in the customer’s applications

or products, or the applic ation or use by customer’s third

party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and

products using NXP Semic on ductors produc ts in or de r to

avoid a default of the app lications and the products or of

the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this

respect.

Limiting values  Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operat ion of the device at these or any other

conditions above those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

Terms and conditions of commercial sale  NXP

Semiconductors products are sold subje ct to th e general

terms and conditio ns of commercial sale, as published at

http://www.nxp.com/profile/terms, unless other wis e

agreed in a valid written individual agreement. In case an

individual agreeme nt is co nc luded only the terms and

conditions of the resp ective agreement shall apply. NXP

Semiconductors hereby expressly objects to applyi ng the

customer’s general terms and conditions with regard to the

purchase of NXP Semicon ductors produc ts by customer.

No offer to sell or license  Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for accepta nc e or the grant, conveyance or

implication of any license under any copyrights, patents or

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Export control  This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

Quick refer ence data  The Quick reference data is an

extract of th e product data given in the Li miting values and

Characteristics sections of this document, and as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products  Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable fo r automotive use. It is neither

qualified nor te sted in accorda nce with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive equip ment or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for suc h aut omo tive applications, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use sha ll be solely at

customer’s own ris k, an d (c) customer fully inde m nif i es

NXP Semiconductors for an y liability, damages or failed

product clai ms r esult ing fr om cus to mer d esi gn an d us e of

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warranty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

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The information presented in this do cum en t d oes not form part o f an y q uotation or contra ct, is b elieve d t o b e a ccur ate a nd re liable and may be changed

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Contact information

For additional information p lease visit: http://www.nxp.com

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Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No cha ng es were made to the technical co ntent, except for package outline

drawings which were updated to the latest version.

Printed in The Netherlands R77/04/pp8 Date of release: 2004 Feb 11