Feb.1999
MITSUBISHI IGBT MODULES
CM25MD-24H
MEDIUM POWER SWITCHING USE
INSULATED TYPE
ELECTRICAL CHARACTERISTICS (Tj = 25°C)
INVERTER PART
BRAKE PART
CONVERTER PART
Note 1. IE, V EC, trr, Qrr & die/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode.
2. Pulse width and repetition rate should be such that the device junction temp. (Tj) does not exceed Tjmax rating.
3. Junction temperature (Tj) should not increase beyond 150°C.
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
5. Thermal resistance is specified under following conditions.
• The conductive greese applied, between module and fin.
• Al plate is used as fin.
Collector cutoff current
Gate-emitter
threshold voltage
Gate-emitter cutoff current
Collector-emitter
saturation voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Tur n-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Emitter-collector voltage
Reverse recovery time
Reverse recovery charge
Thermal resistance
V
V
1
0.5
3.4
—
5.0
3.8
1.0
—
100
200
150
350
3.5
250
—
1.2
1.9
VCE = VCES, VGE = 0V
VGE = VGES, VCE = 0V
Tj = 25°C
Tj = 150°C
VCC = 600V, IC = 25A, VGE = 15V
VCC = 600V, IC = 25A
VGE1 = VGE2 = 15V
RG = 13Ω
Resistive load
IE = 25A, VGE = 0V
IE = 25A, VGE = 0V
die / dt = – 50A / µs
IGBT part, Per 1/6 module
FWDi part, Per 1/6 module
mA
µA
nF
nF
nF
nC
ns
ns
ns
ns
V
ns
µC
°C/W
°C/W
—
—
2.7
2.45
—
—
—
125
—
—
—
—
—
—
0.22
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
ICES
IGES
Cies
Coes
Cres
QG
td (on)
tr
td (off)
tf
V
EC (Note. 1)
trr
(Note. 1)
Qrr
(Note. 1)
R
th(j-f)
Q
(Note. 5)
R
th(j-f)
R
(Note. 5)
Symbol Parameter Test conditions
VGE(th)
VCE(sat)
Limits
Min. Typ. Max. Unit
64.5 7.5IC = 2.5mA, VCE = 10V
IC = 25A, VGE = 15V (Note. 4)
VCE = 10V
VGE = 0V
Min. Typ. Max.
Collector cutoff current
Gate-emitter
threshold voltage
Gate-emitter cutoff current
Collector-to-emitter
saturation voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Forward voltage drop
Thermal resistance
V
V
1
0.5
3.4
—
5.0
3.8
1.0
—
1.5
1.2
1.7
VCE = VCES, VGE = 0V
VGE = VGES, VCE = 0V
Tj = 25°C
Tj = 150°C
VCC = 600V, IC = 25A, VGE = 15V
IF = 25A, Clamp diode part
IGBT part
Clamp diode part
IC = 2.5mA, VCE = 10V
IC = 25A, VGE = 15V (Note. 4)
VCE = 10V
VGE = 0V
mA
µA
nF
nF
nF
nC
V
°C/W
°C/W
—
—
2.7
2.45
—
—
—
125
—
—
—
—
—
—
—
—
—
—
—
—
—
—
ICES
IGES
Cies
Coes
Cres
QG
V
FM
R
th(j-f)
Q
(Note. 5)
R
th(j-f)
R
(Note. 5)
Symbol Parameter Condition
VGE(th)
VCE(sat)
Limits Unit
6
4.5 7.5
Repetitive reverse current
Forward voltage drop
Thermal resistance
VR = VRRM, Tj = 150°C
IF = 25A
Per 1/6 module
mA
V
°C/W
—
—
—
—
—
—
IRRM
VFM
Rth(j-f) (Note. 5)
Symbol Parameter Condition Limits
Min. Typ. Max. Unit
8
1.5
1.7