CM1426-04CP - California Micro Devices

08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 1

CM1426

PRELIMINARY

LCD and Camera EMI Filter Array with ESD Protection

Features

• Four, six and eight channels of EMI filtering with

integrated ESD protection

• 0.5mm pitch, 10-bump, 1.96mm x 1.33mm foot-

print Chip Scale Package (CM1426-04)

• 0.5mm pitch, 15-bump, 2.96mm x 1.33mm foot-

print Chip Scale Package (CM1426-06)

• 0.5mm pitch, 20-bump, 3.96mm x 1.33mm foot-

print Chip Scale Package (CM1426-08)

• Pi-style EMI filters in a capacitor-resistor-capacitor

(C-R-C) network

•±8kV ESD protection on each channel

(IEC 61000-4-2 Level 4, contact discharge)

•±15kV ESD protection on each channel (HBM)

• Greater than 20dB attenuation (typical) at 1 GHz

• Chip Scale Package features extremely low

lead inductance for optimum filter and ESD

performance

•Optiguard™ coated for improved reliability at

assembly

• Lead-free version available

Applications

• LCD and Camera data lines in mobile handsets

• I/O port protection for mobile handsets, notebook

computers, PDAs etc.

• EMI filtering for data ports in cell phones, PDAs or

notebook computers.

• Wireless handsets

• Handheld PCs/PDAs

• LCD and camera modules

Product Description

The CM1426 is a family of pi-style EMI filter arrays with

ESD protection, which integrates four, six and eight fil-

ters (C-R-C) in a Chip Scale Package with 0.50mm

pad pitch. The CM1426 has component values of

8.5pF-100Ω-8.5pF per channel. The CM1426 has a

cut-off frequency of 230MHz and can be used in appli-

cations where the data rates are as high as 92Mbps.

The parts include avalanche-type ESD diodes on every

pin, which provide a very high level of protection for

sensitive electronic components that may be subjected

to electrostatic discharge (ESD). The ESD protection

diodes safely dissipate ESD strikes of ±8kV, well

beyond the maximum requirement of the IEC61000-4-

2 international standard. Using the MIL-STD-883

(Method 3015) specification for Human Body Model

(HBM) ESD, the pins are protected for contact dis-

charges at greater than ±15kV.

These devices are particularly well-suited for portable

electronics (e.g. wireless handsets, PDAs, notebook

computers) because of their small package and easy-

to-use pin assignments. In particular, the CM1426 is

ideal for EMI filtering and protecting data and control

lines for the I/O data ports, LCD display and camera

interface in mobile handsets.

The CM1426 incorporates Optiguard™ which results in

improved reliability at assembly. The CM1426 is avail-

able in a space-saving, low-profile Chip Scale Package

with optional lead-free finishing.

100

8.5pF8.5pF

FILTER+ESDn*

GND*

FILTER+ESDn*

Electrical Schematic

1 of 4, 6 or 8 EMI/RFI + ESD Channels

* See Package/Pinout Diagram

for expanded pin information.

(Pins B1-Bm)

(Pins A1-An) (Pins C1-Cn)

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CM1426

PRELIMINARY

PIN DESCRIPTIONS

PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION

A1 FILTER1 Filter + ESD Channel 1 C1 FILTER1 Filter + ESD Channel 1

A2 FILTER2 Filter + ESD Channel 2 C2 FILTER2 Filter + ESD Channel 2

A3 FILTER3 Filter + ESD Channel 3 C3 FILTER3 Filter + ESD Channel 3

A4 FILTER4 Filter + ESD Channel 4 C4 FILTER4 Filter + ESD Channel 4

A5 FILTER5 Filter + ESD Channel 5 C5 FILTER5 Filter + ESD Channel 5

A6 FILTER6 Filter + ESD Channel 6 C6 FILTER6 Filter + ESD Channel 6

A7 FILTER7 Filter + ESD Channel 7 C7 FILTER7 Filter + ESD Channel 7

A8 FILTER8 Filter + ESD Channel 8 C8 FILTER8 Filter + ESD Channel 8

B1-B4 GND Device Ground

N268

43265871

Orientation

Marking

(see note 2)

N266

432651

Orientation

Marking

(see note 2)

N264

4321

Orientation

Marking

(see note 2)

FILTER5 FILTER6

GND

FILTER5 FILTER6

FILTER7 FILTER8

GND

FILTER7 FILTER8

A6A5

Orientation

Marking

B3 B4

C6C5

FILTER3 FILTER4

GND

FILTER3 FILTER4

A4A3

A8A7

C8C7C3

FILTER1 FILTER2

GND

FILTER1 FILTER2

A2A1

C2C1

FILTER5 FILTER6

GND

FILTER5 FILTER6

A6A5

Orientation

Marking

C6C5

FILTER3 FILTER4

GND

FILTER3 FILTER4

A4A3

C4C3

FILTER1 FILTER2

GND

FILTER1 FILTER2

A2A1

C2C1

Orientation

Marking

FILTER3 FILTER4

GND

FILTER3 FILTER4

A4A3

C4C3

FILTER1 FILTER2

GND

FILTER1 FILTER2

A2A1

C2C1

PACKAGE / PINOUT DIAGRAMS

Notes:

BOTTOM VIEW

CM1426-06CS/CP

15 Bump CSP Package

(Bumps Up View)

TOP VIEW

(Bumps Down View)

1) These drawings are not to scale.

2) Lead-free devices are specified by using a "

" character for the top side orientation mark.

CM1426-08CS/CP

20 Bump CSP Package

CM1426-04CS/CP

10 Bump CSP Package

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CM1426

PRELIMINARY

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.

Specifications

PART NUMBERING INFORMATION

Bumps Package

Standard Finish Lead-free Finish2

Ordering Part

Number1Part Marking

Ordering Part

Number1Part Marking

10 CSP CM1426-04CS N264 CM1426-04CP N264

15 CSP CM1426-06CS N266 CM1426-06CP N266

20 CSP CM1426-08CS N268 CM1426-08CP N268

ABSOLUTE MAXIMUM RATINGS

PARAMETER RATING UNITS

Storage Temperature Range -65 to +150 °C

DC Power per Resistor 100 mW

DC Package Power Rating 500 mW

STANDARD OPERATING CONDITIONS

PARAMETER RATING UNITS

Operating Temperature Range -40 to +85 °C

ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

R Resistance 80 100 120 Ω

CTOTAL Total Channel Capacitance At 2.5VDC Reverse

Bias, 1MHz, 30mVAC

13.6 17 20.4 pF

C Capacitance C1 At 2.5VDC Reverse

Bias, 1MHz, 30mVAC

6.8 8.5 10.2 pF

VDIODE Standoff Voltage IDIODE=10μA6.0V

ILEAK Diode Leakage Current (reverse bias) VDIODE= 3.3V 0.1 1 μA

VSIG Signal Clamp Voltage

Positive Clamp

Negative Clamp

ILOAD = 10mA

ILOAD = -10mA

5.6

-1.5

6.8

-0.8

9.0

-0.4

VESD In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883, Method

3015

b) Contact Discharge per IEC 61000-4-2 Level 4

Notes 2 and 3

±15

±8

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CM1426

PRELIMINARY

Note 1: TA=25°C unless otherwise specified.

Note 2: ESD applied to input and output pins with respect to GND, one at a time.

Note 3: These parameters are guaranteed by design and characterization.

RDYN Dynamic Resistance

Positive

Negative

2.3

0.9

fCCut-off Frequency

ZSOURCE=50Ω, ZLOAD=50Ω

R=100Ω, C=17pF

230 MHz

ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)

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CM1426

PRELIMINARY

Performance Information

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)

Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)

6490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 08/30/05

CM1426

PRELIMINARY

Performance Information (cont’d)

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)

Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)

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CM1426

PRELIMINARY

Performance Information (cont’d)

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)

Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)

8490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 08/30/05

CM1426

PRELIMINARY

Performance Information (cont’d)

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4)

Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4)

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CM1426

PRELIMINARY

Performance Information (cont’d)

Typical Diode Capacitance vs. Input Voltage

Figure 9. Filter Capacitance vs. Input Voltage over Temperature

(normalized to capacitance at 2.5VDC and 25°C)

Capacitance (Normalized)

DC Voltage

10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 08/30/05

CM1426

PRELIMINARY

Application Information

Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages

offered by California Micro Devices.

Figure 10. Recommended Non-Solder Mask Defined Pad Illustration

Figure 11. Eutectic (SnPb) Solder

Ball Reflow Profile

Figure 12. Lead-free (SnAgCu) Solder

Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER VALUE

Pad Size on PCB 0.275mm

Pad Shape Round

Pad Definition Non-Solder Mask defined pads

Solder Mask Opening 0.325mm Round

Solder Stencil Thickness 0.125mm - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round

Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish OSP (Entek Cu Plus 106A)

Tolerance — Edge To Corner Ball +50μm

Solder Ball Side Coplanarity +20μm

Maximum Dwell Time Above Liquidous (183°C) 60 seconds

Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C

Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C

Solder Mask Opening

0.325mm DIA.

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Stencil Opening

0.330mm DIA.

200

250

150

100

0 1:00.0 2:00.0 3:00.0 4:00.0

Time (minutes)

Temperature (°C)

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CM1426

PRELIMINARY

Mechanical Details

CSP Mechanical Specifications

CM1426 devices are supplied in custom Chip Scale

Packages (CSP). Dimensions are presented below.

For complete information on CSP packaging, see the

California Micro Devices CSP Package Information

document.

CM1426-04 Mechanical Specifications

The package dimensions for the CM1426-04 are pre-

sented below.

Package Dimensions for CM1426-04

Chip Scale Package

CSP Tape and Reel Specifications

Figure 13. Tape and Reel Mechanical Data

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 10

Dim Millimeters Inches

Min Nom Max Min Nom Max

A1 1.915 1.960 2.005 0.0754 0.0772 0.0789

A2 1.285 1.330 1.375 0.0506 0.0524 0.0541

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.180 0.230 0.280 0.0071 0.0091 0.0110

C2 0.180 0.230 0.280 0.0071 0.091 0.0110

D1 0.575 0.644 0.714 0.0226 0.0254 0.0281

D2 0.368 0.419 0.470 0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

DIMENSIONS IN MILLIMETERS

BOTTOM VIEW

SIDE

VIEW

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)

OptiGuard

Coating

PART NUMBER CHIP SIZE (mm)

POCKET SIZE (mm)

B0 X A0 X K0

TAPE WIDTH

REEL

DIAMETER

QTY PER

REEL P0P1

CM1426-04 1.96 x 1.33 x 0.644 2.08 x 1.45 x 0.71 8mm 178mm (7") 3500 4mm 4mm

Top

For tape feeder reference

Cover

Tape

only including draft.

Concentric around B.

Embossment

User direction of feed

0.2 mm

Center lines

of cavity

10 Pitches cumulative

tolerance on tape

12 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 08/30/05

CM1426

PRELIMINARY

Mechanical Details (cont’d)

CM1426-06 Mechanical Specifications

The package dimensions for the CM1426-06 are pre-

sented below.

Package Dimensions for

CM1426-06 Chip Scale Package

CSP Tape and Reel Specifications

Figure 14. Tape and Reel Mechanical Data

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 15

Dim Millimeters Inches

Min Nom Max Min Nom Max

A1 2.915 2.960 3.005 0.1148 0.1165 0.1183

A2 1.285 1.330 1.375 0.0506 0.0524 0.0541

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.180 0.230 0.280 0.0071 0.0091 0.0110

C2 0.180 0.230 0.280 0.0071 0.091 0.0110

D1 0.575 0.644 0.714 0.0226 0.0254 0.0281

D2 0.368 0.419 0.470 0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

3456

C1 B1

DIMENSIONS IN MILLIMETERS

BOTTOM VIEW

SIDE

VIEW

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)

OptiGuard

Coating

PART NUMBER CHIP SIZE (mm)

POCKET SIZE (mm)

B0 X A0 X K0

TAPE WIDTH

REEL

DIAMETER

QTY

PER

REEL P0P1

CM1426-06 2.96 x 1.33 x 0.644 3.10 x 1.45 x 0.74 8mm 178mm (7") 3500 4mm 4mm

Top

For tape feeder reference

Cover

Tape

only including draft.

Concentric around B.

Embossment

User direction of feed

0.2 mm

Center lines

of cavity

10 Pitches cumulative

tolerance on tape

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CM1426

PRELIMINARY

Mechanical Details (cont’d)

CM1426-08 Mechanical Specifications

The package dimensions for the CM1426-08 are pre-

sented below.

Package Dimensions for

CM1426-08 Chip Scale Package

CSP Tape and Reel Specifications

Figure 15. Tape and Reel Mechanical Data

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 20

Dim Millimeters Inches

Min Nom Max Min Nom Max

A1 3.915 3.960 4.005 0.1541 0.1559 0.1577

A2 1.285 1.330 1.375 0.0506 0.0524 0.0541

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.180 0.230 0.280 0.0071 0.0091 0.0110

C2 0.180 0.230 0.280 0.0071 0.091 0.0110

D1 0.575 0.644 0.714 0.0226 0.0254 0.0281

D2 0.368 0.419 0.470 0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

3456

C1 B1

DIMENSIONS IN MILLIMETERS

BOTTOM VIEW

SIDE

VIEW

OptiGuard

Coating

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)

PART NUMBER CHIP SIZE (mm)

POCKET SIZE (mm)

B0 X A0 X K0

TAPE

WIDTH W

REEL

DIAMETER

QTY PER

REEL P0P1

CM1426-08 3.96 x 1.33 x 0.644 4.11 x 1.57 x 0.76 8mm 178mm (7") 3500 4mm 4mm

Top

For tape feeder reference

Cover

Tape

only including draft.

Concentric around B.

Embossment

User direction of feed

0.2 mm

Center lines

of cavity

10 Pitches cumulative

tolerance on tape