BAP64-05
General
Purpose Pin Diodes
250mW
omponents
20736 Marilla Street Chatsworth
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MCC
ParameterSymbolLimitsUnit
Continuous Reverse Voltage V
R
175 V
Forward CurrentI
F
100 mA
Power Dissipation(TA=90oC) P
D
250mW
Junction and Storage temperatureT
j，
P
stg
-65~+150 ℃
Features
• Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Low diode capacitance
• Low diode forward resistance
• MARKING: 5K
Thermal Resistance Junction to
Revision: A 2011/01/01
1 of 3
TM
Micro Commercial Components
• Moisture Sensitivity Level 1
Maximum Ratings @ 25°C Unless Otherwise Specified
Ambient RthJA 500 oC/W
Parameter Symbol Min. TYP Max. Unit Conditions
Reverse Voltage IR 10 VR=175V
Diode forward
rD 2 3.8 Ω I F=10mA , f=100MHz
1.0 VR=20V
Forward voltage VF 1.1 V IF=50mA
Diode capacitance
Cd3 0.23 0.35 pF VR=20V,f=1MHz
Cd1 0.52 pF VR=0V,f=1MHz
Cd2 0.37 pF VR=1V,f=1MHz
rD 20 40 Ω IF=0.5mA, f=100MHz
rD 10 20 Ω I F=1mA , f=100MHz
Leakage
Electrical Characteristics @ 25°C Unless Otherwise Specified
www.mccsemi.com
uA
Current
rD 0.7 1.35 Ω I F=100mA , f=100MHz
resistance
Charge carrier
τL
when switched from
I
F=10 mA to IR= 6 mA; RL=
100Ω;measured at IR=3mA
1.55 μS
life time
Series inductance LS 1.4 nH
IF=100mA, f=100MHz
SOT-23
Suggested Solder
Pad Layout
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A.110 .120 2.80 3.04
C.047 .055 1.20 1.40
D.035 .041 .89 1.03
E.070 .081 1.78 2.05
F.018 .024 .45 .60
G.0005 .0039 .013 .100
H.035 .044 .89 1.12
J.003 .007 .085 .180
K.015 .020 .37 .51
A
B
C
D
E
F
G
H
J
.079
2.000
inches
mm
.031
.800
.035
.900
.037
.950
.037
.950
B .083 .104 2.10 2.64
MCC TM
Micro Commercial Components
www.mccsemi.com
Revision: A 2011/01/01
2 of 3
Typical Characteristics
MCC
Revision: A 2011/01/01
TM
Micro Commercial Components
www.mccsemi.com
3 of 3
Ordering Information
Device Packing
(Part Number)-TP Tape&Reel;3Kpcs/Reel
2
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