CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
EB105 Version 1.0
May 2016
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
2 EB105-1.0
Contents
Acronyms in This Document ................................................................................................................................................. 3
Introduction .................................................................................................................................................................. 4 1.
Headers and Test Connections ..................................................................................................................................... 6 2.
Programming Circuit ..................................................................................................................................................... 7 3.
3.1. Bridging Circuit .................................................................................................................................................... 7
3.2. I2C Expander ........................................................................................................................................................ 8
Power Supply ................................................................................................................................................................ 9 4.
Status Indicators ......................................................................................................................................................... 11 5.
References .......................................................................................................................................................................... 12
Technical Support Assistance............................................................................................................................................... 12
Appendix A. LIF-MD6000-ML-EVN-BRD Schematics ........................................................................................................... 13
Appendix B. LIF-MD6000-ML-EVN-BRD Bill of Materials .................................................................................................... 21
Appendix C. SMA-IOL-EVN-BRD Schematics ....................................................................................................................... 27
Appendix D. SMA-IOL-EVN-BRD Bill of Materials................................................................................................................ 28
Appendix E. B-IOL-EVN-BRD Schematics............................................................................................................................. 29
Appendix F. B-IOL-EVN-BRD Bill of Materials ..................................................................................................................... 30
Revision History ................................................................................................................................................................... 31
Figures
Figure 1.1. Top View of Master Link Board and its Key Components ................................................................................... 4
Figure 1.2. Bottom View of Master Link Board ..................................................................................................................... 5
Figure 3.1. Programming Block ............................................................................................................................................. 7
Figure 3.2. Bridging Block ..................................................................................................................................................... 8
Figure 3.3. I2C Expander Block .............................................................................................................................................. 8
Figure 4.1. Power Supply Block ............................................................................................................................................. 9
Tables
Table 2.1. Headers and Test Connectors .............................................................................................................................. 6
Table 4.1. Power LEDs ........................................................................................................................................................... 9
Table 4.2. Device Power Rail Summary and Test Points ..................................................................................................... 10
Table 5.1. Status LED I/O Map ............................................................................................................................................ 11
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 3
Acronyms in This Document
A list of acronyms used in this document.
Acronym
Definition
CMOS
Complementary Metal-Oxide Semiconductor
CSI-2
Camera Serial Interface
DSI
Display Serial Interface
FTDI
Future Technology Devices International
I2C
Inter-Integrated Circuit
LVDS
Low-Voltage Differential Signaling
SPI
Serial Peripheral Interface
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
4 EB105-1.0
Introduction 1.
This document describes the Lattice Semiconductor CrossLinkTM LIF-MD6000 Master Link board that supports a variety
of demos, encompassing different signaling logic standards bridging with MIPI® CSI-2/DSI interface. The board‘s key
component is the CrossLink Family device that features built in MIPI D-PHY hard blocks to support different bridging
solutions.
For the latest information about this board, including optional Tx/Rx Link boards, demo files, further documentation
and more, see the Lattice website at: www.latticesemi.com/masterlink
For details about the CrossLink device refer to DS1055, CrossLink Family Data Sheet.
The content of this user guide includes descriptions of on-board jumper settings, programming circuit, a complete set
of schematics, and bill of materials for LIF-MD6000 Master Link board.
Refer to Appendix A, B, C, D, E, F for the schematics and BOM of the CrossLink LIF-MD6000 Master Link board and the
schematics and BOMs of the Breakout IOLink and SMA IOLink boards that are included in the demo kit.
Circuits on the development kit board:
Programming Circuit
Mini USB Type-B connector to FTDI
FTDI to CrossLink using SPI
FTDI to XO3LF device using JTAG
CrossLink
MIPI CSI-2/DSI hard block
Bridging of multiple signaling standards
SPI flash configuration
General Purpose Input/Output
LED display
LCMXO3LF-1300E
I2C muxing
Figure 1.1 shows the top view of the LIF-MD6000 Master Link board and its key components. Figure 1.2 on the next
page shows the bottom view of the board.
Tx Connector 1 & 2 (U9, U7)
Power Switch (SW1)
External Power Input
External Power Jack (J3)
LCMXO3L-1300E (U19)
USB 2.0 Mini-B (J2)
JTAG Header (J1)
FTDI Chip (U1)
SPI Flash Device (U14)
Rx Connectors (U11, U12)
Power LEDs
LIF-MD6000-CSFBGA81
Debug Header (J18)
Debug and
Configuration LEDs
Reset and wake-up buttons
Switch (SW2)
Clock Source Selection (J26, J27)
Bank 1, 2 Voltage Selection
Headers (J24, J25)
External Clock SMA Inputs
XO3 Reset (SW3)
Figure 1.1. Top View of Master Link Board and its Key Components
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 5
Figure 1.2. Bottom View of Master Link Board
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
6 EB105-1.0
Headers and Test Connections 2.
Figure 1.1 shows the top view of the Master Link board. The headers and test connections on the board provide access
to LIF-MD6000 Master Link demo board circuits. Table 2.1 lists the headers and test connectors.
Table 2.1. Headers and Test Connectors
Part
Description
Setting
J1
External JTAG interface - For LCMX03 only
—
J8
External 12 V terminal block
Open
J9
External 5 V terminal block
Open
SW1
External adaptor power ON/OFF
—
J22
External reference clock input for MIPI D-PHY reference clock
—
J21
External or internal reference clock selection
1–2 (External), 2–3 (Internal)
J5
Debug I/O
—
J20
LIF-MD6000 chip select
OPEN-OFF, SHORT-ON
J19
SPI Flash chip select
OPEN-OFF, SHORT-ON
J4
External clock input for MIPI D-PHY reference clock
—
J6
External or internal clock selection
1–2 (External), 2–3 (Internal)
J18
External SP/I2C access
—
SW2
Configuration reset for LIF-MD6000
—
J29
Reset signal voltage selector
1-2 (VCCIO2), 2-3 (VCCIO0)
J28
Reveal analyzer signal connector
—
J26
Internal/External clock and I2C SDA Mux
1-2 (CLK_INT), 2-3 (CLK_EXT), 2-4 (SDA)
J27
Internal/External reference clock and I2C SCL Mux
1-2 (CLK_INT_REF), 2-3 (CLK_EXT_REF), 2-4 (SCL)
J24
VCCIO1 Bank voltage selector
1-2 (2.5 V), 2-3 (3.3 V), 2-4 (1.2 V)
J25
VCCIO1 Bank voltage selector
1-2 (2.5 V), 2-3 (3.3 V), 2-4 (1.2 V)
J3
External power jack
—
U7, U9
Tx Connectors for external interface
—
U11, U12
Rx Connectors for external interface
—
SW4
External reset for LIF-MD6000 device
—
SW3
External reset for LCMXO3L device
—
SW5
PMU WAKEUP Switch
—
J23
Debug Header for LCMXO3L device
—
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 7
Programming Circuit 3.
The Mini-B USB connector is used for programming the board by using Lattice Diamond® programmer software.
Figure 3.1 shows the programming block of LIF-MD6000 Master Link board.
The Mini-B USB connector interfaces to the FTDI FT2232H IC. The FTDI IC works with Diamond programmer software to
provide interfaces for:
JTAG – to program MachXO2-1300E
SPI – to program both CrossLink, and SPI Flash Memory
USB Mini-B
(J2) FTDI Chip (U1)
SPI Flash (U14)
LIF-MD6000
CSFBGA81 (U8)
LCMXO3LF-1300E
MG121 (U19)
JTAG
SPI
Figure 3.1. Programming Block
3.1. Bridging Circuit
Figure 3.2 shows the block diagram of bridging of different standard interfaces. The CrossLink device is used as a
bridging device that supports a variety of I/O standards. This demo board supports development of the following
interface bridges:
1:1 MIPI DSI Display Interface Bridge
1:2 MIPI DSI Display Interface Bridge
2:1 MIPI CSI-2 Image Sensor Aggregator Bridge
CMOS to MIPI CSI-2 Image Sensor Interface Bridge
MIPI CSI-2 to CMOS Image Sensor Interface Bridge
MIPI DSI to CMOS Display Interface Bridge
OpenLDI LVDS to MIPI DSI Display Interface Bridge
CMOS to MIPI DSI Display Interface Bridge
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
8 EB105-1.0
LIF-MD6000
CSFBGA81 (U8)
Rx Connector 1
Rx Connector 2
D-PHY I/F
D-PHY Rx/
LVDS/CMOS
D-PHY Rx/
LVDS/CMOS
Tx Connector 2
Tx Connector 1
D-PHY I/F
Figure 3.2. Bridging Block
3.2. I2C Expander
Figure 3.3 shows the block diagram of the I2C expander. The LCMXO3LF-1200E device is used as an I2C expander and it
supports a single master and multiple slave devices connected to the board. The master I2C interface is connected to
the Tx header and the slave device I2C interface is connected to the Rx connectors supporting any slave device access
from the master based on the slave address.
LCMXO3LF-1200E-
MG121 (U19)
Rx Connector 1
Rx Connector 2
LIF-MD6000
CSFBGA81 (U8)
Tx
H
e
a
d
e
r
I2C
2 X I2C
2 X I2C
Figure 3.3. I2C Expander Block
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 9
Power Supply 4.
The power supply to the development kit is provided by the Mini-B USB connector or from an external adaptor.
Figure 4.1 shows the power supply block of the CrossLink LIF-MD6000 Master Link board. The Mini-B USB connector is
used only for programming and the onboard power regulator for the successful programming. The external adaptor
provides 12 V power source through voltage regulators on the board to CrossLink and LCMXO3LF-1300E, as well as to
the external boards connected to Tx and Rx Headers. Each I/O and core voltage rail on the board is accessible by a test
point on the board. The current flowing to each rail can be measured using a 1 Ω resistor placed in the path of each
voltage rail.
J3
J2
12 V to 5 V
converter
LDO
LDO
LDO
LDO
Power adaptor
Mini-B USB
5 V
5 V
U15
U5
U6
U17
12 V
U18
1.2 V
3.3 V
2.5 V
1.8 V
Figure 4.1. Power Supply Block
Table 4.1 lists the device power rails. There are five voltage regulators on the board used to supply the 5 V, 3.3 V, 2.5V
1.8 V, and 1.2 V rails. The input to these regulators is either from the Mini-B USB connector or the external 12 V
adaptor that is connected to the board. Switch SW2 is used to connect or disconnect the external adaptor power to the
board.
Table 4.1. Power LEDs
Voltage Rail
LEDs
Colour
12
D26
Green
5
D3
Green
3.3
D25
Green
2.5
D29
Green
1.8
D28
Green
1.2
D27
Green
Table 4.2 on the next page lists the board voltage rails, including the rail source voltage, test point number, and current
sense resistor number.
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
10 EB105-1.0
Table 4.2. Device Power Rail Summary and Test Points
Voltage Rail
Source Rail
Current Sense Resistor
Test Points
12 V
12_Ext
—
12V
5 V
12 V
—
5V
+3.3 V
5 V
—
3V3
+2.5 V
5 V
—
2V5
+1.8 V
5 V
—
1V8
+1.2 V
5 V
—
1V2
VCCCORE
+1.2 V
R19
VCC_CORE
VCCIO0
+3.3 V
R20
VCCIO0
VCCIO1
+3.3 V
R21
VCCIO1
VCCIO2
+3.3 V
R28
VCCIO2
VCC_DPHY
+1.2 V
R417
VCC_DPHY
1K_VCC_CORE
1.2 V
R190
1K_VCC_CORE
1K_VCCIO0
+3.3 V
R410
1K_VCCIO0
1K_VCCIO1
+3.3 V
R184
1K_VCCIO1
1K_VCCIO2
+3.3 V
R186
1K_VCCIO2
1K_VCCIO3
+3.3 V
R188
1K_VCCIO3
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 11
Status Indicators 5.
The LED status indicators on the board show power, configuration, and application status. Table 5.1 lists the status LED
I/O map.
Table 5.1. Status LED I/O Map
Device
LED
Net Name
Colour
CrossLink
D6
CMOS_IO_1
Blue
CrossLink
D7
CMOS_IO_2
Blue
CrossLink
D8
CMOS_IO_3
Blue
CrossLink
D9
CMOS_IO_4
Blue
CrossLink
D10
CDONE
Green
LCMX03LF-1300E
D23
DONE
Red
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© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
12 EB105-1.0
References
For more information, refer to:
DS1055, CrossLink Family Data Sheet
Technical Support Assistance
Submit a technical support case through www.latticesemi.com/techsupport.
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 13
Appendix A. LIF-MD6000-ML-EVN-BRD Schematics
LIF-MD6000 Master Link Board Block Diagram
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
14 EB105-1.0
FTDI Interface
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 15
Power Regulator Interface
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
16 EB105-1.0
MIPI Block – MIPI Tx
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 17
Bank 1, 2 – LVDS Rx
CrossLink LIF-MD6000 Master Link Board
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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
18 EB105-1.0
BANK0, Flash Interface
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 19
I2C Expander
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
20 EB105-1.0
Layout Guidelines
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 21
Appendix B. LIF-MD6000-ML-EVN-BRD Bill of Materials
LIF-MD6000 Master Link Board Bill of Materials
Item
Reference
Quantity
Part
PCB
Footprint
Comments
PART_
NUMBER
Manufacturer
Description
1
C1, C3
2
4u7
C0603
—
ECJ-
1VB0J475K
Panasonic
Cap Cer
4.7 uF
6.3 V 10% X5R 0603
2
C2, C4, C5, C6, C8,
C9, C12, C13, C14,
C15, C16, C22, C25,
C68, C112, C180,
C181
17
0.1 uF
C0402
—
C0402C104K4
RACTU
Kemet
CAP CERAMIC
0.1 uF
16 V X7R 0402
3
C7, C20, C23, C107,
C114, C141, C145,
C150, C153
9
10 uF
C0603
—
LMK107BJ106
MALTD
Taiyo Yuden
CAP CECAP CER 10 uF
10 V X5R 20% 0603
4
C10, C11
2
18 pF
C0402
—
C0402C180K3
GACTU
Kemet
CAP CER 18 pF 25 V
C0G 0402
5
C21, C24, C113
3
22 uF
C0805
—
LMK212BJ226
MG-T
Taiyo Yuden
CAP CERAMIC
22 uF 10 V X5R 0805
6
C29, C95, C97
3
0.1 uF
C0402
—
CL05A104MP
5NNNC
Samsung
Cap Ceramic 0.1 uF
10 V X5R 20% SMD
0402 85C Paper T/R
7
C41, C43, C53, C60,
C67, C71
6
1 uF
C0306
—
LLR185C70G1
05ME05L
Murata
CAP CER 1uF 4 V X7S
0306
8
C42, C44
2
0.01 uF
C0201
—
GRM033R61C
103KA12D
Murata
CAP CER 10000 pF
16 V X5R 0201
9
C42, C44, C51, C176
4
0.001 uF
C0201
Piggyback
Configuration
GRM033R71C
102KA01D
Murata
CAP CER 1000 pF 16 V
X7R 0201
10
C45
1
1 uF
C0402
—
GRM155R61C
105KA12D
Murata
CAP CER
1 uF 16 V X5R 0402
11
C46, C66, C171,
C172, C177
5
470 pF
C0201
—
GRM033R71C
471KA01D
Murata
CAP CER
470 pF 16 V X7R 0201
12
C46, C66, C171, C172
4
0.1 uF
C0201
Piggyback
Configuration
GRM033R61C
104KE84D
Murata
CAP CER 0.1 uF
16 V X5R 0201
13
C49, C98, C179
3
100 nF
C0402
—
GRM155R61A
104KA01D
Murata
CAP CER 100 nF
10 V 10% X5R 0402
14
C51, C58, C70, C176
4
100 nF
C0201
—
C0603X5R1C1
04K030BC
TDK
CAP CER
0.1 uF 16 V X5R 0201
15
C52
1
6800 pF
C0201
—
GRM033R71A
682KA01D
Murata
CAP CER 6800 pF 10 V
X7R 0201
16
C59, C75, C78, C175
4
1.5 nF
C0201
—
GRM033R71A
152KA01D
Murata
CAP CER 1500 pF 10 V
X7R 0201
17
C75, C78, C59, C175
4
1.5 nF
C0201
Piggyback
Configuration
GRM033R71A
152KA01D
Murata
CAP CER 1500 pF 10 V
X7R 0201
18
C72
1
4700 pF
C0306
—
LLL185R71H4
72MA01L
Murata
CAP CER 4700 pF 50 V
X7R 0306
19
C73, C74, C76
3
330 pF
C0201
—
GRM033R71H
331KA12D
Murata
CAP CER
330 pF 50 V X7R 0201
20
C77
1
5600 pF
C0201
—
GRM033R71A
562KA01D
Murata
CAP CER 5600 pF 10 V
X7R 0201
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trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
22 EB105-1.0
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Item
Reference
Quantity
Part
PCB
Footprint
Comments
PART_
NUMBER
Manufacturer
Description
21
C94, C96
2
10 uF
C0603
—
CL10X106MP
8NRNC
Samsung
CAP CER
10 uF 10 V 20% X6S
0603
22
C102, C104, C105,
C139, C142, C143,
C144, C147, C148,
C151, C152
11
0.1 uF
C0201
-—
C0603X5R1C1
04K030BC
TDK
CAP CER
0.1 uF 16 V 10% X5R
0201
23
C103, C140, C146,
C149, C154
5
0.01 uF
C0201
—
CC0201KRX7R
7BB103
Yageo
CAP CER 10000 pF
16 V 10% X7R 0201
24
C106
1
1 uF
C0402
—
C0402C105K9
PACTU
Kemet
CAP CERAMIC
1 uF 6.3 V X5R 0402
25
C115, C130
2
10 uF
C0603
—
CL10A106MA
8NRNC
Samsung
CAP CER
10 uF 25 V 20% X5R
0603
26
C123
1
0.1 uF
C0603
—
GRM188R71E
104KA01D
Murata
CAP CER
0.1 uF 25 V 10% X7R
0603
27
C127
1
680 pF
C0603
—
C0603C681J3
GACTU
Kemet
CAP CER
680 pF 25 V 5% NP0
0603
28
C128
1
0.47 uF
C0402
—
CL05A474KA5
NNNC
Samsung
CAP CER 0.47 uF 25 V
10% X5R 0402
29
C129
1
47 uF
C0805
—
C2012X5R1A4
76M125AC
TDK
CAP CER
47 uF 10 V 20% X5R
0805
30
C155, C156, C157,
C158, C159, C160,
C161, C162, C163,
C164, C165, C166,
C167, C168, C169,
C170
16
0.1 uF
C0402
—
04023C104KA
T2A
AVX
CAP CER
0.1 uF 25 V 10% X7R
0402
31
C173
1
2200 pF
C0201
—
GRM033R71E
222KA12D
Murata
CAP CER 2200 pF 25 V
X7R 0201
32
C174
1
1000 pF
C0201
—
GRM033R61E
102KA01D
Murata
CAP CER 1000 pF 25 V
X5R 0201
33
C178
1
0.1 uF
C0201
—
GRM033R61C
104KE84D
Murata
CAP CER
0.1 uF 16 V X5R 0201
34
D1, D14
2
SL44-E3/
57T
SL44E357T
—
SL44-E3/57T
Vishay
semiconducto
r
Schottky Diodes &
Rectifiers 4.0 A 40 V
35
D3, D25, D26, D27,
D28, D29
6
Green
led_0603
—
LTST-
C190KGKT
LITE-On INC
LED SUPER GREEN
CLEAR 0603 SMD
36
D6, D7, D8, D9,
D30, D31, D32,
D33
8
blue
led_0603
—
LTST-
C193TBKT-5A
LITE-On INC
Standard LEDs - SMD
Blue 470 nm 28mcd
5 mA
37
D10
1
Green
led_0603
—
LG L29K-G2J1-
24-Z
OSRAM
LED SUPER GREEN
CLEAR 0603 SMD
38
D12
1
0.3 VF
MBRA340T
3G
—
MBRA340T3G
ON Semi
DIODE SCHOTTKY 40 V
3 A SMA
39
D23
1
Red
led_0603
—
LTST-
C193KRKT-5A
LITE-On INC
Standard LEDs - SMD
Red 631 nm 14mcd
5 mA
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EB105-1.0 23
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Item
Reference
Quantity
Part
PCB
Footprint
Comments
PART_
NUMBER
Manufacturer
Description
40
VCC_DPHY1,
VCC_CORE1,
VCCIO1, GND1,
VCCIO2, GND2,
GND3, GND4,
GND5, 1K_VCCIO0,
1K_VCC_CORE1,
1K_VCCIO1, 1V2,
1K_VCCIO2,
1K_VCCIO3, TP18,
TP23, TP24, TP25,
2V5, 3V3, 5V0,
12V0, VCCIO0
24
TP_S_40_
63
tp_s_
40_63
DNI
—
—
Square test point,
40 mil inner
diameter,
63 mil outer
diameter
41
J1
1
header_1x
8
hdr_amp_
87220_8_
1x8_100
—
22-28-4081
Molex
CONN HEADER
8POS .100 VERT TIN
42
J2
1
SKT_MINI
USB_B_RA
skt_miniu
sb_b_ra
—
5075BMR-05-
SM-CR
Neltron
CONN MINI USB
RCPT RA TYPE B SMD
43
J3
1
PJ-032A
PJ-032A
—
PJ-032A
CUI Inc.
CON PWR JCK
2.0 X 6.5 M VERT
44
J4, J22
2
73391-
0060
73391-
0060
—
73391-0060
Molex
CONN SMA JACK STR
50 OHM PCB
45
J7, J19, J20
3
CON2
CON2
REGULAR
100 MIL
HEADER
—
—
General 100 mils
2 Position header
46
J8, J9
2
2 Position
Terminal
Block_0
TERM_BL
OCK_2POS
_10A
—
1727010
Phoenix
Contact
TERM BLOCK 2POS
3.81 mm PCB GRN
47
J18
1
HEADER
5X2
HEADER
2X5
REGULAR
100 MIL
HEADER
—
—
General 100 Mils
2*5 header
48
J23
1
4 HEADER
CON4
REGULAR
100 MIL
HEADER
—
—
General 100 Mils
4 Position Header
49
J24, J25, J26, J27
4
Tri-Con
TriCon
REGULAR
100 MIL
HEADER
—
—
General 100 Mils
Header
50
J28
1
CON6
HDR1X6
REGULAR
100 MIL
HEADER
—
—
—
51
J29
1
CON3
HDR1X3
REGULAR
100 MIL
HEADER
—
—
—
52
L1, L2, L3, L4, L5, L6,
L7
7
600 Ω
500 mA
FB0603
—
BLM18AG601
SN1D
Murata
Ferrite Bead 600 Ω
@100 MHz 500 mA
0603
53
L8
1
4.7 uH
MPLC0730
L4R7
—
MPLC0730L4R
7
Kemet
INDUCTOR POWER
4.7 uH 20% SMD
54
MH1, MH2, MH3,
MH4, MH5, MH6,
MH7, MH8, MH9,
MH10
10
Thru Hole
MTG125
DNL
—
—
—
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trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
24 EB105-1.0
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Item
Reference
Quantity
Part
PCB
Footprint
Comments
PART_
NUMBER
Manufacturer
Description
55
Q9, Q10, Q11
3
MMBT222
2A
SM_SOT2
3-3
—
MMBT2222A
,215
NXP
Semiconductor
TRANS NPN 40 V 0.6
A SOT23
56
R1, R2, R3, R56,
R131, R175, R176,
R177, R178, R403,
R404, R405, R440,
R445, R477, R478,
R479, R480, R483,
R484
20
4.7K
R0603
—
CRCW06034
K70FKEA
Vishay
RES SMD
4.7 kΩ HM 1% 1/10
W 0603
57
R4, R5, R6, R7, R15,
R16, R26, R37, R39,
R51, R52, R53, R90,
R159, R165, R167,
R180, R181, R183,
R192, R431, R433,
R447
23
0
R0603
—
RC0603JR-
070RL
Yageo
Res 1/10 W 0.0 Ω 5%
0603
58
R9, R10
2
2K2
R0603
—
CRCW06032
K20FKEA
Vishay
RES SMD
2.2 kΩ 1% 1/10 W
0603
59
R11, R17
2
12K
R0603
—
RC0603FR-
0712KL
Yageo
RES SMD
12 kΩ 1% 1/10 W
0603
60
R12, R13, R14,
R123, R124, R125
6
10K
R0603
—
RMCF0603JT
10K0
Stackpole
Electronics Inc
RES SMD
10 kΩ 5%
1/10 W 0603
61
R18, R418, R419,
R422, R423
5
0
R0603
DNI
RC0603JR-
070RL
Yageo
Res 1/10 W 0.0 Ω 5%
0603
62
R19, R20, R21, R25,
R28, R33, R184,
R186, R188, R190,
R410, R417, R434,
R435, R448, R449
16
1
R0603
—
CRCW06031
R00JNEAHP
Vishay/Dale
RES SMD
1 Ω 5% 1/4W 0603
63
R22, R144
2
100E
R0603
DNI
CRCW06031
00RFKEAHP
Vishay / Dale
RES SMD 100 Ω 1%
1/4W 0603
64
R23
1
0
R0603
DNI
RC0603JR-
070RL
Yageo
Res 1/10 W 0.0 Ω 5%
0603
65
R24, R185, R187,
R189, R411
5
1
R0603
DNI
CRCW06031
R00JNEAHP
Vishay/Dale
RES SMD
1 Ω 5% 1/4W 0603
66
R36, R233
2
1K
R0603
—
RC0603FR-
071KL
Yageo
RES SMD
1 kΩ 1% 1/10 W
0603
67
R54, R55, R57, R59
4
680R
R0402
DNI
RMCF0402JT
680R
Stackpole
Electronics Inc
RES 680 Ω 1/16 W
5% 0402
68
R60, R61, R446,
R457, R458, R459,
R460, R461, R462,
R463, R464, R467,
R468, R469, R470,
R471, R472, R473,
R474, R475, R476
21
0
R0402
—
RC0402JR-
070RL
Yageo
RES SMD 0.0O HM
JUMPER 1/16 W
0402
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trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 25
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Item
Reference
Quantity
Part
PCB
Footprint
Comments
PART_
NUMBER
Manufacturer
Description
69
R76, R77
2
2K
R0402
—
ERJ-
2RKF2001X
Panasonic
RES SMD
2 kΩ 1% 1/10 W
0402
70
R78
1
10K
R0402
—
RMCF0402JT1
0K0
Stackpole
Electronics
Inc
RES 10 kΩ 1/16 W
5% 0402
71
R80, R436, R437,
R438, R439
5
680R
R0402
—
RMCF0402JT6
80R
Stackpole
Electronics
Inc
RES 680 Ω 1/16 W
5% 0402
72
R83
1
30E
R0603
—
RC0603FR-
0730RL
Yageo
RES SMD
30 Ω 1% 1/10 W
0603
73
R106, R107, R108,
R110, R111, R113,
R114, R117, R119,
R121
10
100
R0402
DNI
RC0402FR-
07100RL
Yageo
RES SMD 100 Ω
1% 1/16 W 0402
74
R160, R432
2
100K
R0402
—
RMCF0402JT1
00K
Stackpole
Electronics
Inc
RES 100 kΩ 1/16 W
5% 0402
75
R166, R441, R442,
R443, R444
5
1K
R0402
—
RMCF0402JT1
K00
Stackpole
Electronics
Inc
RES 1 kΩ 1/16 W 5%
0402
76
R179
1
650
R0603
—
RC0603FR-
07649RL
Yageo
RES SMD 649 Ω 1%
1/10 W 0603
77
R229
1
15K
R0402
—
ERJ-
2RKF1502X
Panasonic
RES 15 kΩ 1/10 W
1% 0402 SMD
78
R230
1
34K
R0402
—
ERJ-
2RKF3402X
Panasonic
RES 34 kΩ 1/10 W
1% 0402 SMD
79
R231
1
536K
R0402
—
ERJ-
2RKF5363X
Panasonic
Electronic
Components
RES 536 kΩ 1/10 W
1% 0402 SMD
80
R232
1
100K
R0402
—
ERJ-
2RKF1003X
Panasonic
Electronic
Components
RES 100 kΩ 1/10 W
1% 0402 SMD
81
R395, R399, R400
3
10K
R0603
—
ERJ-
3EKF1002V
Panasonic
RES SMD
10 kΩ 1% 1/10 W
0603
82
R412, R413, R414,
R415, R416, R420,
R421, R424, R425,
R451, R452, R453,
R454, R455, R456,
R465, R466
17
0
R0603
—
RC0603JR-
070RL
Yageo
Res 1/10 W 0.0 Ω 5%
0603
83
R450
1
0
R0402
DNI
RC0402JR-
070RL
Yageo
RES SMD 0.0O HM
JUMPER 1/16 W
0402
84
R481, R482
2
0
R0603
DNL
RC0603JR-
070RL
Yageo
Res 1/10 W 0.0 Ω 5%
0603
85
SW1
1
PWR
TS01CQE_
switch
—
TS01CQE
C&K
Components
SWITCH SLIDE SPDT
3 A 120 V
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trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
26 EB105-1.0
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Item
Reference
Quantity
Part
PCB
Footprint
Comments
PART_
NUMBER
Manufacturer
Description
86
SW2, SW3, SW4
3
SYS_
RST
2psmd_es
witch
—
TL1015AF160QG
E-Switch
SWITCH TACTILE SPST-
NO 0.05 A 12 V
87
SW5
1
WAKE_
UP
2psmd_es
witch
—
TL1015AF160QG
E-Switch
SWITCH TACTILE SPST-
NO 0.05 A 12 V
88
U1
1
FT2232HL
tqfp64_0p
5_12p2x1
2p2_h1p6
—
FT2232HL
FTDI
USB to UART / FIFO
89
U2
1
93LC56-SO8
so8_50_24
4
—
93LC56C-I/SN
Microchip
IC 93LC56 EEPROM
90
U3
1
FUSE
0154004D
RT
—
0154004.DRT
Littlefuse
Surface Mount Fuses
Fuseblock with fuse 4A
OMNI BLOK 154T
91
U5
1
NCP1117ST
33T3G
sot223_4p
—
NCP1117ST33T3G
On Semi
IC Reg LDO 3.3 V SOT-
223
92
U6
1
NCP1117ST
25T3G
sot223_4p
—
NCP1117ST25T3G
On Semi
IC Reg LDO 2.5 V SOT-
223
93
U7, U9, U11,
U12
4
Hirose -
FX12 - 40
Pos
Hirose-
FX12
—
FX12B-40P-0.4SV
Hirose Electric
Co Ltd
Conn Board to Board PL
40 POS
0.4 mm Solder ST SMD
T/R
94
U8
1
LIF-
MD6000-
csfBGA81
LIF-
MD6000-
csfBGA81
Customer
supplied
LIF-MD6000-
csfBGA81
Lattice
Semiconductor
Lattice Semiconductor
6K CrossLink FPGA
Family
95
U14
1
M25PX16-
VMW6TG
SOIC8
—
M25PX16-
VMW6TG
Micron
Technology Inc
IC FLASH
16 Mbit
75 MHz 8SO
96
U15
1
AP7313-
12SAG-7
SOT23
—
AP7313-12SAG-7
Diodes Inc
LDO Voltage Regulators
LDO SOT-23R
1.2 V/ 150 mA
97
U17
1
NCP1117ST
18T3G
sot223_4p
—
NCP1117ST18T3G
On Semi
IC Reg LDO 1.8 V SOT-
223
98
U18
1
LT3680
LT3680_10
QFN
—
LT3680EDD#PBF
Linear
5 V Step down
converter
99
U19
1
LCMXO3LF-
1200E-
MG121
LCMXO3LF
-1200E-
MG121
Customer
supplied
LCMXO3LF-1200E-
MG121
Lattice
Semiconductor
CPLD MachXO3 Family
121-Pin CSFBGA-
0.5 mm Pitch
100
X1
1
12MHZ
crystal_4p
_3p2x2p5
—
7M-12.000MAAJ-
T
TXC
12 MHz Crystal
101
X3, X4
2
KC3225A27.
0000C30E0
A
27MHZ_O
SC
—
KC3225A27.0000C
30E0A
AVX
Corporation
Standard Clock
Oscillators 27.000 MHz
102
LIF-MD6000
MASTER LINK
BOARD PCB
1
—
—
—
305-PD-16-0154
PACTRON
—
CrossLink LIF-MD6000 Master Link Board
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and information herein are subject to change without notice.
EB105-1.0 27
Appendix C. SMA-IOL-EVN-BRD Schematics
SMA Debug Board
CrossLink LIF-MD6000 Master Link Board
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28 EB105-1.0
Appendix D. SMA-IOL-EVN-BRD Bill of Materials
SMA IOLink Board Bill of Materials
Item
Reference
Quantity
Part
PCB
Footprint
Comments
PART_NUMBER
Manufacturer
Description
1
GND1, +5 V, +1.8 V,
+3.3 V, SN, SDA, SCLK,
SCL, RESETN, MOSI,
MISO, GND
12
TP_S_
40_63
tp_s_4
0_63
DNI
—
—
Square test point,
40 mil inner
diameter, 63 mil
outer diameter
2
C1, C4
2
1 uF
C0402
—
C0402C105K
9PACTU
Kemet
CAP CERAMIC
1 uF 6.3 V X5R
0402
3
C2, C5
2
0.1 uF
C0402
—
C0402C104K
4RACTU
Kemet
CAP CERAMIC 0.
1 uF 16 V X7R 0402
4
C3, C6
2
0.01
uF
C0402
—
C0402C103J
4RACTU
Kemet
CAP CERAMIC
10 nF 16 V 5% X7R
0402
5
J1, J2, J3, J4, J5, J6, J7,
J8, J9, J10, J11, J12,
J13, J14
14
73391
-0060
73391-
0060
—
73391-0060
Molex
Molex Straight 50O
Through Hole SMA
Connector, jack,
Solder Termination
6
MH1, MH2
2
Thru
Hole
MTG1
25
—
—
—
—
7
U1
1
Hirose
- FX12
- 40
Pos
Hirose-
FX12S
—
FX12B-40S-
0.4SV
Hirose
Electric Co
Ltd
Conn Board to
Board PL 40 POS
0.4 mm Solder ST
SMD T/R
8
SMA IOLINK BOARD
PCB
1
—
—
—
305-PD-15-
0589
PACTRON
—
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and information herein are subject to change without notice.
EB105-1.0 29
Appendix E. B-IOL-EVN-BRD Schematics
100MILS_DEBUG Header
CrossLink LIF-MD6000 Master Link Board
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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
30 EB105-1.0
Appendix F. B-IOL-EVN-BRD Bill of Materials
Breakout IOLink Board Bill of Materials
Item
Reference
Quantity
Part
PCB
Footprint
Comments
PART_NUM
BER
Manufacturer
Description
1
GND1, +5 V,
+1.8 V, +3.3 V,
SN, SCLK, MOSI,
MISO, GND
9
TP_S_40_
63
tp_s_40_63
DNL
—
—
Square test point, 40 mil
inner diameter,
63 mil outer diameter
2
C1, C5
2
0.1uF
C0402
—
C0402C104
K4RACTU
Kemet
CAP CERAMIC 0.1 uF 16
V X7R 0402
3
C2, C6
2
0.01uF
C0402
—
C0402C103
J4RACTU
Kemet
CAP CERAMIC
10 nF 16 V 5% X7R 0402
4
C3, C4
2
1uF
C0402
—
C0402C105
K9PACTU
Kemet
CAP CERAMIC
1 uF 6.3 V X5R 0402
5
J2
1
HEADER
13X2
13X2_HDR
REGULAR 100
MIL HEADER
—
—
—
6
MH1, MH2
2
ThruHole
MTG125
DNL
—
—
—
7
U1
1
Hirose -
FX12 - 40
Pos
Hirose-
FX12S
—
FX12B-40S-
0.4SV
Hirose Electric
Co Ltd
Conn Board to Board PL
40 POS 0.4 mm Solder ST
SMD T/R
8
BREAKOUT
IOLINK BOARD
PCB
1
—
—
—
305-PD-15-
0595
PACTRON
—
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trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0 31
Revision History
Date
Version
Change Summary
May 2016
1.0
Initial release.
