CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide EB105 Version 1.0 May 2016 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Contents Acronyms in This Document .................................................................................................................................................3 1. Introduction ..................................................................................................................................................................4 2. Headers and Test Connections .....................................................................................................................................6 3. Programming Circuit .....................................................................................................................................................7 3.1. Bridging Circuit ....................................................................................................................................................7 2 3.2. I C Expander ........................................................................................................................................................8 4. Power Supply ................................................................................................................................................................9 5. Status Indicators .........................................................................................................................................................11 References ..........................................................................................................................................................................12 Technical Support Assistance...............................................................................................................................................12 Appendix A. LIF-MD6000-ML-EVN-BRD Schematics ...........................................................................................................13 Appendix B. LIF-MD6000-ML-EVN-BRD Bill of Materials ....................................................................................................21 Appendix C. SMA-IOL-EVN-BRD Schematics .......................................................................................................................27 Appendix D. SMA-IOL-EVN-BRD Bill of Materials................................................................................................................28 Appendix E. B-IOL-EVN-BRD Schematics.............................................................................................................................29 Appendix F. B-IOL-EVN-BRD Bill of Materials .....................................................................................................................30 Revision History ...................................................................................................................................................................31 Figures Figure 1.1. Top View of Master Link Board and its Key Components ...................................................................................4 Figure 1.2. Bottom View of Master Link Board .....................................................................................................................5 Figure 3.1. Programming Block .............................................................................................................................................7 Figure 3.2. Bridging Block .....................................................................................................................................................8 2 Figure 3.3. I C Expander Block ..............................................................................................................................................8 Figure 4.1. Power Supply Block .............................................................................................................................................9 Tables Table 2.1. Headers and Test Connectors ..............................................................................................................................6 Table 4.1. Power LEDs ...........................................................................................................................................................9 Table 4.2. Device Power Rail Summary and Test Points .....................................................................................................10 Table 5.1. Status LED I/O Map ............................................................................................................................................11 (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Acronyms in This Document A list of acronyms used in this document. Acronym Definition CMOS Complementary Metal-Oxide Semiconductor CSI-2 Camera Serial Interface DSI Display Serial Interface FTDI Future Technology Devices International 2 IC Inter-Integrated Circuit LVDS Low-Voltage Differential Signaling SPI Serial Peripheral Interface (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 3 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide 1. Introduction TM This document describes the Lattice Semiconductor CrossLink LIF-MD6000 Master Link board that supports a variety of demos, encompassing different signaling logic standards bridging with MIPI(R) CSI-2/DSI interface. The board`s key component is the CrossLink Family device that features built in MIPI D-PHY hard blocks to support different bridging solutions. For the latest information about this board, including optional Tx/Rx Link boards, demo files, further documentation and more, see the Lattice website at: www.latticesemi.com/masterlink For details about the CrossLink device refer to DS1055, CrossLink Family Data Sheet. The content of this user guide includes descriptions of on-board jumper settings, programming circuit, a complete set of schematics, and bill of materials for LIF-MD6000 Master Link board. Refer to Appendix A, B, C, D, E, F for the schematics and BOM of the CrossLink LIF-MD6000 Master Link board and the schematics and BOMs of the Breakout IOLink and SMA IOLink boards that are included in the demo kit. Circuits on the development kit board: Programming Circuit Mini USB Type-B connector to FTDI FTDI to CrossLink using SPI FTDI to XO3LF device using JTAG CrossLink MIPI CSI-2/DSI hard block Bridging of multiple signaling standards SPI flash configuration General Purpose Input/Output LED display LCMXO3LF-1300E 2 I C muxing Figure 1.1 shows the top view of the LIF-MD6000 Master Link board and its key components. Figure 1.2 on the next page shows the bottom view of the board. Tx Connector 1 & 2 (U9, U7) XO3 Reset (SW3) Power Switch (SW1) Power LEDs External Power Input LCMXO3L-1300E (U19) Debug Header (J18) External Power Jack (J3) LIF-MD6000-CSFBGA81 Bank 1, 2 Voltage Selection Headers (J24, J25) Debug and Configuration LEDs USB 2.0 Mini-B (J2) Reset and wake-up buttons Switch (SW2) JTAG Header (J1) External Clock SMA Inputs FTDI Chip (U1) SPI Flash Device (U14) Rx Connectors (U11, U12) Clock Source Selection (J26, J27) Figure 1.1. Top View of Master Link Board and its Key Components (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 4 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Figure 1.2. Bottom View of Master Link Board (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 5 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide 2. Headers and Test Connections Figure 1.1 shows the top view of the Master Link board. The headers and test connections on the board provide access to LIF-MD6000 Master Link demo board circuits. Table 2.1 lists the headers and test connectors. Table 2.1. Headers and Test Connectors Part Description Setting J1 External JTAG interface - For LCMX03 only -- J8 External 12 V terminal block Open J9 External 5 V terminal block Open SW1 External adaptor power ON/OFF -- J22 External reference clock input for MIPI D-PHY reference clock -- J21 External or internal reference clock selection J5 Debug I/O J20 LIF-MD6000 chip select OPEN-OFF, SHORT-ON J19 SPI Flash chip select OPEN-OFF, SHORT-ON J4 External clock input for MIPI D-PHY reference clock J6 External or internal clock selection 1-2 (External), 2-3 (Internal) -- 2 -- 1-2 (External), 2-3 (Internal) J18 External SP/I C access -- SW2 Configuration reset for LIF-MD6000 -- J29 Reset signal voltage selector J28 Reveal analyzer signal connector J26 Internal/External clock and I2C SDA Mux J27 Internal/External reference clock and I2C SCL Mux J24 VCCIO1 Bank voltage selector 1-2 (2.5 V), 2-3 (3.3 V), 2-4 (1.2 V) J25 VCCIO1 Bank voltage selector 1-2 (2.5 V), 2-3 (3.3 V), 2-4 (1.2 V) J3 External power jack -- 1-2 (VCCIO2), 2-3 (VCCIO0) -- 1-2 (CLK_INT), 2-3 (CLK_EXT), 2-4 (SDA) 1-2 (CLK_INT_REF), 2-3 (CLK_EXT_REF), 2-4 (SCL) U7, U9 Tx Connectors for external interface -- U11, U12 Rx Connectors for external interface -- SW4 External reset for LIF-MD6000 device -- SW3 External reset for LCMXO3L device -- SW5 PMU WAKEUP Switch -- J23 Debug Header for LCMXO3L device -- (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 6 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide 3. Programming Circuit The Mini-B USB connector is used for programming the board by using Lattice Diamond(R) programmer software. Figure 3.1 shows the programming block of LIF-MD6000 Master Link board. The Mini-B USB connector interfaces to the FTDI FT2232H IC. The FTDI IC works with Diamond programmer software to provide interfaces for: JTAG - to program MachXO2-1300E SPI - to program both CrossLink, and SPI Flash Memory SPI Flash (U14) SPI USB Mini-B (J2) LIF-MD6000 CSFBGA81 (U8) FTDI Chip (U1) JTAG LCMXO3LF-1300E MG121 (U19) Figure 3.1. Programming Block 3.1. Bridging Circuit Figure 3.2 shows the block diagram of bridging of different standard interfaces. The CrossLink device is used as a bridging device that supports a variety of I/O standards. This demo board supports development of the following interface bridges: 1:1 MIPI DSI Display Interface Bridge 1:2 MIPI DSI Display Interface Bridge 2:1 MIPI CSI-2 Image Sensor Aggregator Bridge CMOS to MIPI CSI-2 Image Sensor Interface Bridge MIPI CSI-2 to CMOS Image Sensor Interface Bridge MIPI DSI to CMOS Display Interface Bridge OpenLDI LVDS to MIPI DSI Display Interface Bridge CMOS to MIPI DSI Display Interface Bridge (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 7 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Tx Connector 1 D-PHY I/F D-PHY Rx/ LVDS/CMOS Rx Connector 1 LIF-MD6000 CSFBGA81 (U8) Tx Connector 2 D-PHY Rx/ LVDS/CMOS D-PHY I/F Rx Connector 2 Figure 3.2. Bridging Block 3.2. I2C Expander 2 2 Figure 3.3 shows the block diagram of the I C expander. The LCMXO3LF-1200E device is used as an I C expander and it 2 supports a single master and multiple slave devices connected to the board. The master I C interface is connected to 2 the Tx header and the slave device I C interface is connected to the Rx connectors supporting any slave device access from the master based on the slave address. 2 X I2C Rx Connector 1 Tx H e a d e r I2C LCMXO3LF-1200EMG121 (U19) 2 X I2C Rx Connector 2 LIF-MD6000 CSFBGA81 (U8) 2 Figure 3.3. I C Expander Block (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 8 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide 4. Power Supply The power supply to the development kit is provided by the Mini-B USB connector or from an external adaptor. Figure 4.1 shows the power supply block of the CrossLink LIF-MD6000 Master Link board. The Mini-B USB connector is used only for programming and the onboard power regulator for the successful programming. The external adaptor provides 12 V power source through voltage regulators on the board to CrossLink and LCMXO3LF-1300E, as well as to the external boards connected to Tx and Rx Headers. Each I/O and core voltage rail on the board is accessible by a test point on the board. The current flowing to each rail can be measured using a 1 resistor placed in the path of each voltage rail. U18 J3 12 V 12 V to 5 V converter 5V Power adaptor J2 U15 LDO 1.2 V U5 5V LDO 3.3 V Mini-B USB U6 LDO 2.5 V U17 LDO 1.8 V Figure 4.1. Power Supply Block Table 4.1 lists the device power rails. There are five voltage regulators on the board used to supply the 5 V, 3.3 V, 2.5V 1.8 V, and 1.2 V rails. The input to these regulators is either from the Mini-B USB connector or the external 12 V adaptor that is connected to the board. Switch SW2 is used to connect or disconnect the external adaptor power to the board. Table 4.1. Power LEDs Voltage Rail LEDs Colour 12 D26 Green 5 D3 Green 3.3 D25 Green 2.5 D29 Green 1.8 D28 Green 1.2 D27 Green Table 4.2 on the next page lists the board voltage rails, including the rail source voltage, test point number, and current sense resistor number. (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 9 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Table 4.2. Device Power Rail Summary and Test Points Voltage Rail Source Rail Current Sense Resistor Test Points 12 V 12_Ext -- 12V 5V 12 V -- 5V +3.3 V 5V -- 3V3 +2.5 V 5V -- 2V5 +1.8 V 5V -- 1V8 +1.2 V 5V -- 1V2 VCCCORE +1.2 V R19 VCC_CORE VCCIO0 +3.3 V R20 VCCIO0 VCCIO1 +3.3 V R21 VCCIO1 VCCIO2 +3.3 V R28 VCCIO2 VCC_DPHY +1.2 V R417 VCC_DPHY 1K_VCC_CORE 1.2 V R190 1K_VCC_CORE 1K_VCCIO0 +3.3 V R410 1K_VCCIO0 1K_VCCIO1 +3.3 V R184 1K_VCCIO1 1K_VCCIO2 +3.3 V R186 1K_VCCIO2 1K_VCCIO3 +3.3 V R188 1K_VCCIO3 (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 10 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide 5. Status Indicators The LED status indicators on the board show power, configuration, and application status. Table 5.1 lists the status LED I/O map. Table 5.1. Status LED I/O Map Device LED Net Name Colour CrossLink D6 CMOS_IO_1 Blue CrossLink D7 CMOS_IO_2 Blue CrossLink D8 CMOS_IO_3 Blue CrossLink D9 CMOS_IO_4 Blue CrossLink D10 CDONE Green LCMX03LF-1300E D23 DONE Red (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 11 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide References For more information, refer to: DS1055, CrossLink Family Data Sheet Technical Support Assistance Submit a technical support case through www.latticesemi.com/techsupport. (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 12 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Appendix A. LIF-MD6000-ML-EVN-BRD Schematics LIF-MD6000 Master Link Board Block Diagram (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 13 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide FTDI Interface (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 14 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Power Regulator Interface (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 15 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide MIPI Block - MIPI Tx (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 16 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Bank 1, 2 - LVDS Rx (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 17 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide BANK0, Flash Interface (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 18 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide 2 I C Expander (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 19 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Layout Guidelines (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 20 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Appendix B. LIF-MD6000-ML-EVN-BRD Bill of Materials LIF-MD6000 Master Link Board Bill of Materials Item 1 2 3 Reference C1, C3 C2, C4, C5, C6, C8, C9, C12, C13, C14, C15, C16, C22, C25, C68, C112, C180, C181 C7, C20, C23, C107, C114, C141, C145, C150, C153 PCB PART_ NUMBER Manufacturer Description -- ECJ1VB0J475K Panasonic C0402 -- C0402C104K4 Kemet RACTU 10 uF C0603 -- LMK107BJ106 CAP CECAP CER 10 uF Taiyo Yuden MALTD 10 V X5R 20% 0603 Quantity Part 2 4u7 C0603 17 0.1 uF 9 Footprint Comments 4 C10, C11 2 18 pF C0402 -- 5 C21, C24, C113 3 22 uF C0805 -- 6 C29, C95, C97 3 0.1 uF C0402 -- 7 C41, C43, C53, C60, C67, C71 6 1 uF C0306 8 C42, C44 2 0.01 uF C0201 9 C42, C44, C51, C176 4 0.001 uF C0201 10 C45 1 1 uF C0402 11 C46, C66, C171, C172, C177 5 470 pF C0201 12 C46, C66, C171, C172 4 0.1 uF C0201 13 C49, C98, C179 3 100 nF C0402 14 C51, C58, C70, C176 4 100 nF C0201 15 C52 1 6800 pF C0201 16 C59, C75, C78, C175 4 1.5 nF C0201 17 C75, C78, C59, C175 4 1.5 nF C0201 18 C72 1 4700 pF C0306 19 C73, C74, C76 3 330 pF C0201 20 C77 1 5600 pF C0201 C0402C180K3 Kemet GACTU LMK212BJ226 Taiyo Yuden MG-T CL05A104MP Samsung 5NNNC LLR185C70G1 05ME05L GRM033R61C -- 103KA12D Piggyback GRM033R71C Configuration 102KA01D GRM155R61C -- 105KA12D GRM033R71C -- 471KA01D Piggyback GRM033R61C Configuration 104KE84D GRM155R61A -- 104KA01D C0603X5R1C1 -- 04K030BC GRM033R71A -- 682KA01D GRM033R71A -- 152KA01D Piggyback GRM033R71A Configuration 152KA01D LLL185R71H4 -- 72MA01L GRM033R71H -- 331KA12D GRM033R71A -- 562KA01D -- Murata Murata Murata Murata Murata Murata Murata TDK Murata Murata Murata Murata Murata Murata Cap Cer 4.7 uF 6.3 V 10% X5R 0603 CAP CERAMIC 0.1 uF 16 V X7R 0402 CAP CER 18 pF 25 V C0G 0402 CAP CERAMIC 22 uF 10 V X5R 0805 Cap Ceramic 0.1 uF 10 V X5R 20% SMD 0402 85C Paper T/R CAP CER 1uF 4 V X7S 0306 CAP CER 10000 pF 16 V X5R 0201 CAP CER 1000 pF 16 V X7R 0201 CAP CER 1 uF 16 V X5R 0402 CAP CER 470 pF 16 V X7R 0201 CAP CER 0.1 uF 16 V X5R 0201 CAP CER 100 nF 10 V 10% X5R 0402 CAP CER 0.1 uF 16 V X5R 0201 CAP CER 6800 pF 10 V X7R 0201 CAP CER 1500 pF 10 V X7R 0201 CAP CER 1500 pF 10 V X7R 0201 CAP CER 4700 pF 50 V X7R 0306 CAP CER 330 pF 50 V X7R 0201 CAP CER 5600 pF 10 V X7R 0201 (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 21 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide LIF-MD6000 Master Link Board Bill of Materials (Continued) PCB PART_ NUMBER Manufacturer Description -- CL10X106MP 8NRNC Samsung CAP CER 10 uF 10 V 20% X6S 0603 C0201 --- C0603X5R1C1 TDK 04K030BC 0.01 uF C0201 -- Item Reference Quantity 21 C94, C96 2 10 uF C0603 11 0.1 uF 5 22 23 C102, C104, C105, C139, C142, C143, C144, C147, C148, C151, C152 C103, C140, C146, C149, C154 Part Footprint Comments CC0201KRX7R Yageo 7BB103 C0402C105K9 Kemet PACTU 24 C106 1 1 uF C0402 -- 25 C115, C130 2 10 uF C0603 -- CL10A106MA 8NRNC 26 C123 1 0.1 uF C0603 -- GRM188R71E Murata 104KA01D 27 C127 1 680 pF C0603 -- C0603C681J3 GACTU 28 C128 1 0.47 uF C0402 -- CL05A474KA5 Samsung NNNC 29 C129 1 47 uF C0805 -- C2012X5R1A4 TDK 76M125AC 30 C155, C156, C157, C158, C159, C160, C161, C162, C163, C164, C165, C166, C167, C168, C169, C170 16 0.1 uF C0402 -- 04023C104KA AVX T2A 31 C173 1 2200 pF C0201 -- 32 C174 1 1000 pF C0201 -- 33 C178 1 0.1 uF C0201 -- 34 D1, D14 2 SL44-E3/ 57T SL44E357T -- 6 Green led_0603 -- 8 blue led_0603 -- LTSTC193TBKT-5A 35 36 D3, D25, D26, D27, D28, D29 D6, D7, D8, D9, D30, D31, D32, D33 Samsung Kemet GRM033R71E Murata 222KA12D GRM033R61E Murata 102KA01D GRM033R61C Murata 104KE84D Vishay SL44-E3/57T semiconducto r LTSTLITE-On INC C190KGKT LITE-On INC 37 D10 1 Green led_0603 -- LG L29K-G2J1OSRAM 24-Z 38 D12 1 0.3 VF MBRA340T 3G -- MBRA340T3G ON Semi 39 D23 1 Red led_0603 -- LTSTLITE-On INC C193KRKT-5A CAP CER 0.1 uF 16 V 10% X5R 0201 CAP CER 10000 pF 16 V 10% X7R 0201 CAP CERAMIC 1 uF 6.3 V X5R 0402 CAP CER 10 uF 25 V 20% X5R 0603 CAP CER 0.1 uF 25 V 10% X7R 0603 CAP CER 680 pF 25 V 5% NP0 0603 CAP CER 0.47 uF 25 V 10% X5R 0402 CAP CER 47 uF 10 V 20% X5R 0805 CAP CER 0.1 uF 25 V 10% X7R 0402 CAP CER 2200 pF 25 V X7R 0201 CAP CER 1000 pF 25 V X5R 0201 CAP CER 0.1 uF 16 V X5R 0201 Schottky Diodes & Rectifiers 4.0 A 40 V LED SUPER GREEN CLEAR 0603 SMD Standard LEDs - SMD Blue 470 nm 28mcd 5 mA LED SUPER GREEN CLEAR 0603 SMD DIODE SCHOTTKY 40 V 3 A SMA Standard LEDs - SMD Red 631 nm 14mcd 5 mA (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 22 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide LIF-MD6000 Master Link Board Bill of Materials (Continued) Item Reference Quantity Part 40 VCC_DPHY1, VCC_CORE1, VCCIO1, GND1, VCCIO2, GND2, GND3, GND4, GND5, 1K_VCCIO0, 1K_VCC_CORE1, 1K_VCCIO1, 1V2, 1K_VCCIO2, 1K_VCCIO3, TP18, TP23, TP24, TP25, 2V5, 3V3, 5V0, 12V0, VCCIO0 24 TP_S_40_ 63 41 J1 1 42 J2 43 PCB Footprint Comments PART_ NUMBER Manufacturer Description DNI -- -- Square test point, 40 mil inner diameter, 63 mil outer diameter hdr_amp_ header_1x 87220_8_ 8 1x8_100 -- 22-28-4081 Molex CONN HEADER 8POS .100 VERT TIN 1 SKT_MINI skt_miniu USB_B_RA sb_b_ra -- 5075BMR-05Neltron SM-CR J3 1 PJ-032A PJ-032A -- PJ-032A CUI Inc. 44 J4, J22 2 733910060 733910060 -- 73391-0060 Molex 45 J7, J19, J20 3 CON2 CON2 REGULAR 100 MIL HEADER -- -- General 100 mils 2 Position header 46 J8, J9 2 2 Position Terminal Block_0 TERM_BL OCK_2POS _10A 1727010 Phoenix Contact TERM BLOCK 2POS 3.81 mm PCB GRN 47 J18 1 HEADER 5X2 HEADER 2X5 -- -- General 100 Mils 2*5 header 48 J23 1 4 HEADER CON4 -- -- General 100 Mils 4 Position Header 49 J24, J25, J26, J27 4 Tri-Con TriCon -- -- General 100 Mils Header 50 J28 1 CON6 HDR1X6 -- -- -- 51 J29 1 CON3 HDR1X3 -- -- -- 52 L1, L2, L3, L4, L5, L6, L7 7 600 500 mA FB0603 -- BLM18AG601 Murata SN1D 53 L8 1 4.7 uH MPLC0730 L4R7 -- MPLC0730L4R Kemet 7 Ferrite Bead 600 @100 MHz 500 mA 0603 INDUCTOR POWER 4.7 uH 20% SMD 54 MH1, MH2, MH3, MH4, MH5, MH6, MH7, MH8, MH9, MH10 10 Thru Hole MTG125 -- -- tp_s_ 40_63 -- REGULAR 100 MIL HEADER REGULAR 100 MIL HEADER REGULAR 100 MIL HEADER REGULAR 100 MIL HEADER REGULAR 100 MIL HEADER DNL -- CONN MINI USB RCPT RA TYPE B SMD CON PWR JCK 2.0 X 6.5 M VERT CONN SMA JACK STR 50 OHM PCB (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 23 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide LIF-MD6000 Master Link Board Bill of Materials (Continued) Item 55 56 57 Reference Q9, Q10, Q11 R1, R2, R3, R56, R131, R175, R176, R177, R178, R403, R404, R405, R440, R445, R477, R478, R479, R480, R483, R484 R4, R5, R6, R7, R15, R16, R26, R37, R39, R51, R52, R53, R90, R159, R165, R167, R180, R181, R183, R192, R431, R433, R447 Quantity Part PCB Footprint Comments PART_ NUMBER Manufacturer 3 MMBT222 SM_SOT2 2A 3-3 -- MMBT2222A NXP TRANS NPN 40 V 0.6 ,215 Semiconductor A SOT23 20 4.7K R0603 -- CRCW06034 Vishay K70FKEA RES SMD 4.7 k HM 1% 1/10 W 0603 23 0 R0603 -- RC0603JR070RL Res 1/10 W 0.0 5% 0603 Yageo 58 R9, R10 2 2K2 R0603 -- CRCW06032 Vishay K20FKEA 59 R11, R17 2 12K R0603 -- RC0603FR0712KL 60 R12, R13, R14, R123, R124, R125 6 10K R0603 -- RMCF0603JT Stackpole 10K0 Electronics Inc 5 0 R0603 DNI 16 1 R0603 -- 61 62 R18, R418, R419, R422, R423 R19, R20, R21, R25, R28, R33, R184, R186, R188, R190, R410, R417, R434, R435, R448, R449 Description 63 R22, R144 2 100E R0603 DNI 64 R23 1 0 R0603 DNI 65 R24, R185, R187, R189, R411 5 1 R0603 DNI 66 R36, R233 2 1K R0603 -- 67 R54, R55, R57, R59 4 680R R0402 DNI 68 R60, R61, R446, R457, R458, R459, R460, R461, R462, R463, R464, R467, R468, R469, R470, R471, R472, R473, R474, R475, R476 21 0 R0402 -- RC0603JR070RL Yageo Yageo RES SMD 2.2 k 1% 1/10 W 0603 RES SMD 12 k 1% 1/10 W 0603 RES SMD 10 k 5% 1/10 W 0603 Res 1/10 W 0.0 5% 0603 CRCW06031 Vishay/Dale R00JNEAHP RES SMD 1 5% 1/4W 0603 CRCW06031 Vishay / Dale 00RFKEAHP RC0603JRYageo 070RL CRCW06031 Vishay/Dale R00JNEAHP RES SMD 100 1% 1/4W 0603 Res 1/10 W 0.0 5% 0603 RES SMD 1 5% 1/4W 0603 RES SMD 1 k 1% 1/10 W 0603 RES 680 1/16 W 5% 0402 RC0603FR071KL Yageo RMCF0402JT Stackpole 680R Electronics Inc RC0402JR070RL Yageo RES SMD 0.0O HM JUMPER 1/16 W 0402 (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 24 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide LIF-MD6000 Master Link Board Bill of Materials (Continued) Quantity Part PCB Reference 69 R76, R77 2 2K R0402 -- ERJ2RKF2001X 70 R78 1 10K R0402 -- RMCF0402JT1 0K0 71 R80, R436, R437, R438, R439 5 680R R0402 -- RMCF0402JT6 80R 72 R83 1 30E R0603 -- RC0603FR0730RL Yageo RES SMD 30 1% 1/10 W 0603 73 R106, R107, R108, R110, R111, R113, R114, R117, R119, R121 10 100 R0402 DNI RC0402FR07100RL Yageo RES SMD 100 1% 1/16 W 0402 74 R160, R432 2 100K R0402 -- RMCF0402JT1 00K 75 R166, R441, R442, R443, R444 5 1K R0402 -- RMCF0402JT1 K00 76 R179 1 650 R0603 -- 77 R229 1 15K R0402 -- 78 R230 1 34K R0402 -- 79 R231 1 536K R0402 -- ERJ2RKF5363X 80 R232 1 100K R0402 -- ERJ2RKF1003X 81 R395, R399, R400 3 10K R0603 -- ERJ3EKF1002V Panasonic RES SMD 10 k 1% 1/10 W 0603 82 R412, R413, R414, R415, R416, R420, R421, R424, R425, R451, R452, R453, R454, R455, R456, R465, R466 17 0 R0603 -- RC0603JR070RL Yageo Res 1/10 W 0.0 5% 0603 83 R450 1 0 R0402 DNI RC0402JR070RL Yageo 84 R481, R482 2 0 R0603 DNL RC0603JR070RL Yageo 85 SW1 1 PWR TS01CQE_ switch TS01CQE C&K Components Footprint Comments PART_ NUMBER Item -- RC0603FR07649RL ERJ2RKF1502X ERJ2RKF3402X Manufacturer Panasonic Stackpole Electronics Inc Stackpole Electronics Inc Stackpole Electronics Inc Stackpole Electronics Inc Yageo Panasonic Panasonic Panasonic Electronic Components Panasonic Electronic Components Description RES SMD 2 k 1% 1/10 W 0402 RES 10 k 1/16 W 5% 0402 RES 680 1/16 W 5% 0402 RES 100 k 1/16 W 5% 0402 RES 1 k 1/16 W 5% 0402 RES SMD 649 1% 1/10 W 0603 RES 15 k 1/10 W 1% 0402 SMD RES 34 k 1/10 W 1% 0402 SMD RES 536 k 1/10 W 1% 0402 SMD RES 100 k 1/10 W 1% 0402 SMD RES SMD 0.0O HM JUMPER 1/16 W 0402 Res 1/10 W 0.0 5% 0603 SWITCH SLIDE SPDT 3 A 120 V (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 25 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide LIF-MD6000 Master Link Board Bill of Materials (Continued) Item Reference Quantity Part 86 SW2, SW3, SW4 3 87 SW5 1 88 U1 1 89 U2 1 90 U3 1 91 U5 1 92 U6 1 93 U7, U9, U11, U12 4 94 U8 1 95 U14 1 96 U15 1 97 U17 1 98 U18 99 PCB Footprint SYS_ RST WAKE_ UP 2psmd_es witch 2psmd_es witch tqfp64_0p FT2232HL 5_12p2x1 2p2_h1p6 so8_50_24 93LC56-SO8 4 PART_ NUMBER Manufacturer -- TL1015AF160QG E-Switch -- TL1015AF160QG E-Switch -- FT2232HL FTDI USB to UART / FIFO -- 93LC56C-I/SN Microchip IC 93LC56 EEPROM Comments Description SWITCH TACTILE SPSTNO 0.05 A 12 V SWITCH TACTILE SPSTNO 0.05 A 12 V Surface Mount Fuses Fuseblock with fuse 4A OMNI BLOK 154T NCP1117ST IC Reg LDO 3.3 V SOTsot223_4p -- NCP1117ST33T3G On Semi 33T3G 223 NCP1117ST IC Reg LDO 2.5 V SOTsot223_4p -- NCP1117ST25T3G On Semi 25T3G 223 Conn Board to Board PL Hirose HiroseHirose Electric 40 POS FX12 - 40 -- FX12B-40P-0.4SV FX12 Co Ltd 0.4 mm Solder ST SMD Pos T/R LIFLIFLattice Semiconductor Customer LIF-MD6000Lattice MD6000MD60006K CrossLink FPGA supplied csfBGA81 Semiconductor csfBGA81 csfBGA81 Family IC FLASH M25PX16M25PX16Micron SOIC8 -- 16 Mbit VMW6TG VMW6TG Technology Inc 75 MHz 8SO LDO Voltage Regulators AP7313SOT23 -- AP7313-12SAG-7 Diodes Inc LDO SOT-23R 12SAG-7 1.2 V/ 150 mA NCP1117ST IC Reg LDO 1.8 V SOTsot223_4p -- NCP1117ST18T3G On Semi 18T3G 223 FUSE 0154004D RT -- 0154004.DRT Littlefuse 1 LT3680 LT3680_10 QFN -- LT3680EDD#PBF Linear U19 1 LCMXO3LF- LCMXO3LF CPLD MachXO3 Family Customer LCMXO3LF-1200E- Lattice 1200E-1200E121-Pin CSFBGAsupplied MG121 Semiconductor MG121 MG121 0.5 mm Pitch 100 X1 1 12MHZ crystal_4p _3p2x2p5 -- 7M-12.000MAAJTXC T 12 MHz Crystal 101 X3, X4 2 KC3225A27. 27MHZ_O 0000C30E0 SC A -- KC3225A27.0000C AVX 30E0A Corporation Standard Clock Oscillators 27.000 MHz 102 LIF-MD6000 MASTER LINK BOARD PCB 1 -- -- 305-PD-16-0154 -- -- PACTRON 5 V Step down converter (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 26 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Appendix C. SMA-IOL-EVN-BRD Schematics SMA Debug Board (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 27 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Appendix D. SMA-IOL-EVN-BRD Bill of Materials SMA IOLink Board Bill of Materials Item Reference Quantity Part PCB Footprint tp_s_4 0_63 DNI Comments PART_NUMBER Manufacturer Description -- -- Square test point, 40 mil inner diameter, 63 mil outer diameter 1 GND1, +5 V, +1.8 V, +3.3 V, SN, SDA, SCLK, SCL, RESETN, MOSI, MISO, GND 12 TP_S_ 40_63 2 C1, C4 2 1 uF C0402 -- C0402C105K 9PACTU Kemet CAP CERAMIC 1 uF 6.3 V X5R 0402 3 C2, C5 2 0.1 uF C0402 -- C0402C104K 4RACTU Kemet CAP CERAMIC 0. 1 uF 16 V X7R 0402 4 C3, C6 2 0.01 uF C0402 -- C0402C103J 4RACTU Kemet CAP CERAMIC 10 nF 16 V 5% X7R 0402 5 J1, J2, J3, J4, J5, J6, J7, J8, J9, J10, J11, J12, J13, J14 14 73391 -0060 733910060 -- 73391-0060 Molex Molex Straight 50O Through Hole SMA Connector, jack, Solder Termination 6 MH1, MH2 2 Thru Hole MTG1 25 -- -- -- -- HiroseFX12S -- FX12B-40S0.4SV Hirose Electric Co Ltd Conn Board to Board PL 40 POS 0.4 mm Solder ST SMD T/R -- -- 305-PD-150589 PACTRON -- 7 U1 1 Hirose - FX12 - 40 Pos 8 SMA IOLINK BOARD PCB 1 -- (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 28 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Appendix E. B-IOL-EVN-BRD Schematics 100MILS_DEBUG Header (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 29 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Appendix F. B-IOL-EVN-BRD Bill of Materials Breakout IOLink Board Bill of Materials Item Part PCB Footprint Manufacturer Description -- -- Square test point, 40 mil inner diameter, 63 mil outer diameter Quantity 1 GND1, +5 V, +1.8 V, +3.3 V, SN, SCLK, MOSI, MISO, GND 9 2 C1, C5 2 0.1uF C0402 -- C0402C104 Kemet K4RACTU CAP CERAMIC 0.1 uF 16 V X7R 0402 3 C2, C6 2 0.01uF C0402 -- C0402C103 Kemet J4RACTU CAP CERAMIC 10 nF 16 V 5% X7R 0402 4 C3, C4 2 1uF C0402 -- C0402C105 Kemet K9PACTU CAP CERAMIC 1 uF 6.3 V X5R 0402 5 J2 1 HEADER 13X2 13X2_HDR 6 MH1, MH2 2 ThruHole MTG125 DNL 7 U1 1 Hirose FX12 - 40 Pos HiroseFX12S -- Conn Board to Board PL FX12B-40S- Hirose Electric 40 POS 0.4 mm Solder ST 0.4SV Co Ltd SMD T/R 8 BREAKOUT IOLINK BOARD PCB 1 -- -- -- 305-PD-15PACTRON 0595 TP_S_40_ tp_s_40_63 63 Comments PART_NUM BER Reference DNL REGULAR 100 -- MIL HEADER -- -- -- -- -- -- (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 30 EB105-1.0 CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide Revision History Date Version May 2016 1.0 Change Summary Initial release. (c) 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. EB105-1.0 31 th th 7 Floor, 111 SW 5 Avenue Portland, OR 97204, USA T 503.268.8000 www.latticesemi.com