DAC1205D750HW/C1,5 - NXP Semiconductors

1. General description

The DAC1205D750 is a high-speed 12-bit dual channel Digital-to-Analog Converter

(DAC) with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless

transmitters.

Thanks to its digital on-chip modulation, the DAC1205D750 allows the complex I and Q

inputs to be converted from BaseBand (BB) to IF. The mixing frequency is adjusted via a

Serial Peripheral Interface (SPI) with a 32-bit Numerically Controlled Oscillator (NCO) and

the phase is controlled by a 16-bit register.

Two modes of operation are available: separate data ports or a single interleaved

high-speed data port. In the Interleaved mode, the input dat a stream is demultiplexed into

its original I and Q data and then latched.

A 4 and 8 clock multiplier enables the DAC1205D750 to provide the appropriate

internal clocks from the internal PLL. The internal PLL can be byp assed enabling the use

of an external high frequency clock. The voltage regulator enables adjustment of the

output full-scale current.

2. Features and benefits

DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Rev. 4 — 31 January 2012 Product data sheet

Dual 12-bit resolution IMD3: 74 dBc; fs= 737.28 Msps;

fo= 140 MHz

750 Msps maximum update rate ACPR: 69 dBc; 2-carrier WCDMA;

fs= 737.28 Msps; fo=153.6MHz

Selectable 4 or 8 interpolation filters Typical 1.2 W power dis sipation at 4

interpolation, PLL off and 740 Msps

Input data rate up to 185 Msps Power-down and Sleep modes

Very low noise cap-free integrated PLL Differential scalable output current from

1.6 mA to 22 mA

32-bit programmable NCO frequency On-chip 1.29 V reference

Dual port or Interleaved data modes External analog offset control

(10-bit auxiliary DACs)

1.8 V and 3.3 V power supplies Internal digital offset control

LVDS compatible clock Inverse x / (sin x) function

Two’s complement or binary offset

data format

Fully compatible SPI port

1.8 V/3.3 V CMOS input data buffers Industrial temperature range from

40 C to +85 C

Product data sheet Rev. 4 — 31 January 2012 2 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

3. Applications

Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA

Communication: LMDS/MMDS, point-to-point

Direct Digital Synthesis (DDS)

Broadband wireless systems

Digital radio links

Instrumentation

Automated Test Equipment (ATE)

4. Ordering information

Table 1. Ordering information

Type number Package

Name Description Version

DAC1205D750HW HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads;

body 14  14  1 mm; exposed die pad SOT638-1

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

Product data sheet Rev. 4 — 31 January 2012 3 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

5. Block diagram

Fig 1. Block diagram

001aam193

DAC1205D750

FIR1

2 ×

FIR1

FIR2

2 ×

FIR2

FIR3

2 ×

FIR3

NCO

cos sin

66 12

63 65 64

CLOCK GENERATOR/PLL

COMPLEX MODULATOR

LATCH

CLKP

RESET_N SYNCP

DAC

AUXILIARY

DAC

AUXILIARY

DAC

REFERENCE

BANDGAP

OFFSET

CONTROL

10-BIT

GAIN

CONTROL

10-BIT

OFFSET

CONTROL

10-BIT

GAIN

CONTROL

10-BIT

OFFSET

CONTROL

SCLK

SCS_N

SDIO

SDO

CLKN

Q0 to Q11

dual port/

interleaved

data modes

I0 to I11

41, 42,

45 to 48,

51 to 56

18 to 25,

28 to 31

SPI AUXAN

GAPOUT

AUXAP

IOUTAN

VIRES

IOUTAP

IOUTBN

IOUTBP

AUXBN

AUXBP

mixer

−

mixer

SYNCN

sin x

Product data sheet Rev. 4 — 31 January 2012 4 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

6. Pinning information

6.1 Pinning

Fig 2. Pin configuratio n

DAC1205D750HW

VDDA(3V3) VDDA(3V3)

AUXAP AUXBP

AUXAN AUXBN

AGND AGND

VDDA(1V8) VDDA(1V8)

AGND GAPOUT

CLKP VIRES

CLKN d.n.c.

AGND RESET_N

VDDA(1V8) SCS_N

n.c. SCLK

n.c. SDIO

TM1 SDO

I9 Q0

I8 Q1

I7 Q2

I6 Q3

TM0

VDD(IO)(3V3)

GNDIO

I11

I10

TM3

VDD(IO)(3V3)

GNDIO

n.c.

I4 Q5

VDDD(1V8) AGND

DGND VDDA(1V8)

I3 AGND

I2 VDDA(1V8)

I1 AGND

I0 VDDA(1V8)

VDDD(1V8) AGND

DGND VDDA(1V8)

n.c. AGND

n.c. IOUTAN

VDDD(1V8) IOUTAP

DGND AGND

TM2 n.c.

DGND AGND

Q9 VDDA(1V8)

Q8 AGND

Q7 VDDA(1V8)

Q6 AGND

DGND

VDDD(1V8)

Q11/SELIQ

Q10

DGND

VDDD(1V8)

VDDA(1V8)

IOUTBP

IOUTBN

AGND

VDDA(1V8)

AGND

VDDD(1V8) AGND

001aam194

100

AGND

Product data sheet Rev. 4 — 31 January 2012 5 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

6.2 Pin description

Table 2. Pin description

Symbol Pin Type[1] Description

VDDA(3V3) 1 P analog supply voltage 3.3 V

AUXAP 2 O auxiliary DAC B output current

AUXAN 3 O complementary auxiliary DAC B output current

AGND 4 G analog ground

VDDA(1V8) 5 P analog supply voltage 1.8 V

VDDA(1V8) 6 P analog supply voltage 1.8 V

AGND 7 G analog ground

CLKP 8 I clock input

CLKN 9 I complementary clock input

AGND 10 G analog ground

VDDA(1V8) 11 P analo g su pp l y vol tage 1. 8 V

SYNCP 12 O synchronous clock output

SYNCN 13 O complementary synchronous clock output

TM1 14 I/O test mode 1 (connected to DGND)

TM0 15 I/O test mode 0 (connected to DGND)

VDD(IO)(3V3) 16 P input/output buffers supply voltage 3.3 V

GNDIO 17 G input/output buffers grou n d

I11 18 I I data input bit 11 (MSB)

I10 19 I I data input bit 10

I9 20 I I data input bit 9

I8 21 I I data input bit 8

I7 22 I I data input bit 7

I6 23 I I data input bit 6

I5 24 I I data input bit 5

I4 25 I I data input bit 4

VDDD(1V8) 26 P digital supply voltage 1.8 V

DGND 27 G dig ital ground

I3 28 I I data input bit 3

I2 29 I I data input bit 2

I1 30 I I data input bit 1

I0 31 I I data input bit 0 (LSB)

VDDD(1V8) 32 P digital supply voltage 1.8 V

DGND 33 G dig ital ground

n.c. 34 not connected

n.c. 35 not connected

VDDD(1V8) 36 P digital supply voltage 1.8 V

DGND 37 G dig ital ground

TM2 38 - test mode 2 (to connect to DGND)

DGND 39 G dig ital ground

Product data sheet Rev. 4 — 31 January 2012 6 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

VDDD(1V8) 40 P digital supply voltage 1.8 V

Q11/SELIQ 41 I Q data input bit 11 (MSB)/select IQ in In te rl ea ve d mo de

Q10 42 I Q da ta input bit 10

DGND 43 G dig ital ground

VDDD(1V8) 44 P digital supply voltage 1.8 V

Q9 45 I Q data input bit 9

Q8 46 I Q data input bit 8

Q7 47 I Q data input bit 7

Q6 48 I Q data input bit 6

DGND 49 G dig ital ground

VDDD(1V8) 50 P digital supply voltage 1.8 V

Q5 51 I Q data input bit 5

Q4 52 I Q data input bit 4

Q3 53 I Q data input bit 3

Q2 54 I Q data input bit 2

Q1 55 I Q data input bit 1

Q0 56 I Q data input bit 0 (LSB)

n.c. 57 I no t conn ected

n.c. 58 I no t conn ected

GNDIO 59 G input/output buffers grou n d

VDD(IO)(3V3) 60 P input/output buffers supply voltage 3.3 V

TM3 61 I/O test mode 3 (to connect to DGND)

SDO 62 O SPI da ta output

SDIO 63 I/O SPI data input/output

SCLK 64 I SPI clock input

SCS_N 65 I SPI chip select (active LOW)

RESET_N 66 I general reset (active LOW)

d.n.c. 67 - do not connect

VIRES 68 I/O DAC biasing resistor

GAPOUT 69 I/O bandgap input/ou tput voltage

VDDA(1V8) 70 P analog supp l y vol tage 1. 8 V

VDDA(1V8) 71 P analog supp l y vol tage 1. 8 V

AGND 72 G analog ground

AUXBN 73 O auxiliary DAC B output current

AUXBP 74 O complementary auxiliary DAC B output current

VDDA(3V3) 75 P analog supp l y vol tage 3. 3 V

AGND 76 G analog ground

VDDA(1V8) 77 P analog supp l y vol tage 1. 8 V

AGND 78 G analog ground

VDDA(1V8) 79 P analog supp l y vol tage 1. 8 V

AGND 80 G analog ground

Table 2. Pin description …continued

Symbol Pin Type[1] Description

Product data sheet Rev. 4 — 31 January 2012 7 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

[1] P = power supply

G = ground

I = input

O = output.

[2] H = heatsink (exposed die pad to be soldered)

VDDA(1V8) 81 P analog supp l y vol tage 1. 8 V

AGND 82 G analog ground

VDDA(1V8) 83 P analog supp l y vol tage 1. 8 V

AGND 84 G analog ground

IOUTBN 85 O complementary DAC B output current

IOUTBP 86 O DAC B output current

AGND 87 G analog ground

n.c. 88 - not connected

AGND 89 G analog ground

IOUTAP 90 O DAC A output current

IOUTAN 91 O complementary DAC A output current

AGND 92 G analog ground

VDDA(1V8) 93 P analog supp l y vol tage 1. 8 V

AGND 94 G analog ground

VDDA(1V8) 95 P analog supp l y vol tage 1. 8 V

AGND 96 G analog ground

VDDA(1V8) 97 P analog supp l y vol tage 1. 8 V

AGND 98 G analog ground

VDDA(1V8) 99 P analog supp l y vol tage 1. 8 V

AGND 100 G analog ground

AGND H[2] G analo g ground

Table 2. Pin description …continued

Symbol Pin Type[1] Description

Product data sheet Rev. 4 — 31 January 2012 8 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

7. Limiting values

8. Thermal characteristics

[1] In compliance with JEDEC test board, in free air.

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD(IO)(3V3) input/output supp l y vol tage (3.3 V) 0.5 +4.6 V

VDDA(3V3) analog supply voltage (3.3 V) 0.5 +4.6 V

VDDA(1V8) analog supply voltage (1.8 V) 0.5 +3.0 V

VDDD(1V8) digital supply voltage (1.8 V) 0.5 +3.0 V

VIinput voltage pins CLKP, CLKN, VIRES and GAPOUT

referenced to pin AGND 0.5 +3.0 V

pins I11 to I0, Q11 to Q0, SDO, SDIO, SCLK,

SCS_N and RESET_N referenced to GNDIO 0.5 +4.6 V

VOoutput voltage pins IOUTAP, IOUTAN, IOUTBP, IOUTBN,

AUXAP, AUXAN, AUXBP and AUXBN

referenced to pin AGND

0.5 +4.6 V

pins SYNCP and SYNCN referenced to

pin AGND 0.5 +3.0 V

Tstg storage temperature 55 +150 C

Tamb ambient temperature 40 +85 C

Tjjunction temperature - 125 C

Table 4. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to ambient [1] 19.8 K/W

Rth(j-c) thermal resistance from junction to case [1] 7.7 K/W

Product data sheet Rev. 4 — 31 January 2012 9 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

9. Characteristics

Table 5. Characteristics

VDDA(1V8) =V

DDD(1V8) = 1.8 V; VDDA(3V3) =V

DD(IO)(3V3) = 3.3 V; AGND, DGND and GNDIO shorted together;

Tamb =





Cto+85



C; typical values measured at Tamb =25



C; RL= 50



differential; IO(fs) = 20 mA; PLL off unless

otherwise specified.

Symbol Parameter Conditions Test[1] Min Typ Max Unit

VDD(IO)(3V3) input/output supply voltage

(3.3 V) I3.03.33.6V

VDDA(3V3) analog supply voltage

(3.3 V) I3.03.33.6V

VDDA(1V8) analog supply voltage

(1.8 V) I1.71.81.9V

VDDD(1V8) digital supply voltage (1.8 V) I 1.7 1.8 1.9 V

IDD(IO)(3V3) input/output suppl y current

(3.3 V) fo=19MHz;

fs=740Msps;

4interpolation;

NCO on

I-0.50.7mA

IDDA(3V3) analog supply current

(3.3 V) fo=19MHz;

fs=740Msps;

4interpolation;

NCO on

I - 44 50 mA

IDDD(1V8) digital supply current (1.8 V) fo=19MHz;

fs=740Msps;

4interpolation;

NCO on

I - 181 210 mA

IDDA(1V8) analog supply current

(1.8 V) fo=19MHz;

fs=740Msps;

4interpolation;

NCO on

I - 360 391 mA

IDDD digital supply current for x / (sin x) function

only I-70-mA

Ptot total power dissipation fo=19MHz; f

s= 740 Msps

4interpolation

NCO off; DAC B off C - 0.74 - W

NCO off C - 0.89 - W

NCO on; all VDD C - 1.12 1.32 W

8interpolation

NCO on I - 1.11 - W

Power-down mode:

full power-down;

all VDD

I - 0.03 0.06 W

DAC A and DAC B

Sleep mode; NCO on I - 0.63 - W

Product data sheet Rev. 4 — 31 January 2012 10 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Clock inputs (CLKP and CLKN)[2]

Viinput voltage CLKN Vgpd<50mV or

CLKP C[3] 825 - 1575 mV

Vidth input differential threshold

voltage Vgpd< 50 mV C [3] 100 - +100 mV

Riinput resistance D - 10 - M 

Ciinput capacitance D - 0.5 - pF

Clock outputs (SYNCP and SYNCN)

Vo(cm) common-mode output

voltage C-V

DDA(1V8) 

0.3 -V

VO(dif) differential output voltage C - 1.2 - V

Rooutput resistance D - 80 - 

Digital inputs (I0 to I11, Q0 to Q11)

VIL LOW-level input voltage C GNDIO - 0.8 V

VIH HIGH-level input voltage C 1.6 - VDD(IO)(3V3) V

IIL LOW-level input current VIL =0.8V I - 60 - A

IIH HIGH-level input current VIH =2.3V I - 80 - A

Digital inputs (SDO, SDIO, SCLK, SCS_N and RESET_N)

VIL LOW-level input voltage C GNDIO - 1.0 V

VIH HIGH-level input voltage C 2.3 - VDD(IO)(3V3) V

IIL LOW-level input current VIL =1.0V I - 20 - nA

IIH HIGH-level input current VIH =2.3V I - 20 - nA

Analog outputs (IOUTAP, IOUTAN, IOUTBP and IOUTBN)

IO(fs) full-scale output current register value = 00h C - 1.6 - mA

default register C - 20 - mA

VOoutput voltage compliance range C 1.8 - VDDA(3V3) V

Rooutput resistance D - 250 - k

Cooutput capacitance D - 3 - pF

EOoffset error variation C - 6 - ppm/C

EGgain error variation C - 18 - ppm/C

Reference voltage outpu t (GA POU T)

VO(ref) reference output voltage Tamb = 25 C I 1.24 1.29 1.34 V

VO(ref) reference output voltage

variation C - 117 - ppm/C

IO(ref) reference output current external voltage 1.25 V D - 40 - A

Analog auxiliary outputs (AUXAP, AUXAN, AUXBP and AUXBN)

IO(aux) auxiliary output current differential outputs I - 2.2 - mA

VO(aux) auxiliary output voltage compliance range C 0 - 2 V

NDAC(aux)mon

auxiliary DAC monotonicity guaranteed D - 10 - bit

Table 5. Characteristics …continued

VDDA(1V8) =V

DDD(1V8) = 1.8 V; VDDA(3V3) =V

DD(IO)(3V3) = 3.3 V; AGND, DGND and GNDIO shorted together;

Tamb =





Cto+85



C; typical values measured at Tamb =25



C; RL= 50



differential; IO(fs) = 20 mA; PLL off unless

otherwise specified.

Symbol Parameter Conditions Test[1] Min Typ Max Unit

Product data sheet Rev. 4 — 31 January 2012 11 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Input timing (see Figure 10)

fdata dat a rate Dual-port mode input C - - 185 MHz

tw(CLK) CLK pulse width C 40 - 60 %

th(i) input hold time C 1.6 - - ns

tsu(i) input set-up time C 0.8 - - ns

SYNC signal

tddelay time fSYNC = fs/ 4 C - 0.21 - ns

fSYNC = fs/ 8 C - 0.3 - ns

variation C - 0.27 - ps/C

Output timing

fssampling frequency C - - 750 Msps

tssettling time to 0.5 LSB D - 20 - ns

NCO frequenc y range

fNCO NCO frequency register values

00000000h D - 0 - MHz

FFFFFFFFh D - 740 - MHz

fstep step frequency D - 0.172 - Hz

Low-power NCO frequency range

fNCO NCO frequency register values

00000000h D - 0 - MHz

F8000000h D - 716.875 - MHz

fstep step frequency D - 23.125 - MHz

Dynamic performance

SFDR spurious-free dynamic

range fs= 737.28 Msps

fdata = 92.16 MHz; B = fdata /2

fo= 4 MHz; 0 dBFS C - 77 - dBc

fdata = 184.32 MHz; B = fdata /2

fo=19MHz; 0dBFS I - 74 - dBc

fo=70MHz; 0dBFS C - 86 - dBc

SFDRRBW restricted bandwidth

spurious-free dynamic

range fo= 153.6 MHz; 0 dBFS; fdata = 184.32 MHz; fs= 73 7.28 Msps

B=20MHz C - 86 - dBc

B=100MHz C - 80.5 - dBc

B = 20 MH z; 8-tone;

500 kHz spacing C-76- dBc

Table 5. Characteristics …continued

VDDA(1V8) =V

DDD(1V8) = 1.8 V; VDDA(3V3) =V

DD(IO)(3V3) = 3.3 V; AGND, DGND and GNDIO shorted together;

Tamb =





Cto+85



C; typical values measured at Tamb =25



C; RL= 50



differential; IO(fs) = 20 mA; PLL off unless

otherwise specified.

Symbol Parameter Conditions Test[1] Min Typ Max Unit

Product data sheet Rev. 4 — 31 January 2012 12 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

[1] D = guaranteed by design; C = guaranteed by characterization; I = 100 % industrially tested.

[2] CLKP and CLKN inputs are at differential LVDS levels. An external differential resistor with a value of between 80  and 120  should

be connected across the pins (see Figure 8).

[3] Vgpd represents the ground potential difference voltage. This is the voltage that results from current flowing through the finite resistance

and the inductance between the receiver and the driver circuit ground voltages.

[4] IMD3 rejection with 6 dBFS/tone.

IMD3 third-order intermodulation

distortion fdata = 184.32 MHz; fs= 737.28 Msps

fo1 =95MHz;

fo2 =97MHz C[4] -77 - dBc

fo1 =137MHz;

fo2 =143MHz C[4] -74 - dBc

fo1 =152.5MHz;

fo2 =153.5MHz I[4] -74 - dBc

ACPR adjacent channel power

ratio fdata = 184.32 MHz; fs= 737.28 Msps; fo=96MHz

1-carrier; B = 5 MHz I - 73 - dBc

2-carrier; B = 10 MHz C - 70 - dBc

4-carrier; B = 20 MHz C - 68 - dBc

fdata = 184.32 MHz; fs= 737.28 Msps; fo= 153.6 MHz

1-carrier; B = 5 MHz C - 72 - dBc

2-carrier; B = 10 MHz C - 69 - dBc

4-carrier; B = 20 MHz C - 66.5 - dBc

NSD noise spectral density fdata = 184.32 MHz; fs= 737.28 Msps

fo=19MHz;0dBFS C - 157 - dBFS/Hz

fo= 153.6 MHz;

0 dBFS; C-155 - dBFS/Hz

fo= 153.6 MHz;

10 dBFS C-157 - dBFS/Hz

Table 5. Characteristics …continued

VDDA(1V8) =V

DDD(1V8) = 1.8 V; VDDA(3V3) =V

DD(IO)(3V3) = 3.3 V; AGND, DGND and GNDIO shorted together;

Tamb =





Cto+85



C; typical values measured at Tamb =25



C; RL= 50



differential; IO(fs) = 20 mA; PLL off unless

otherwise specified.

Symbol Parameter Conditions Test[1] Min Typ Max Unit

Product data sheet Rev. 4 — 31 January 2012 13 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10. Application information

10.1 General description

The DAC1205D750 is a dual 12-bit DAC which operates at up to 750 Msps. Each DAC

consists of a segmented architecture, comprising a 6-bit thermometer sub-DAC and an

6-bit binary weighted sub-DAC.

The input dat a rate of up to 185 MHz co mbined with the maximum output sam pling rate of

750 Msps make the DAC1 205D750 extreme ly flexible in wide bandwid th and multi-carrier

systems. The device’ s quadratur e modulato r and 32-bit NCO simplifies system frequency

selection. This is also possible because the 4 and 8 interpolation filters remove

undesired images.

A SYNC signal is provided to synchronize data when the PLL is in the off state.

Two modes are available for the digital input. In Dual-port mode, each DAC uses its own

data input line. In Interleaved mode, both DACs use the same data input line.

The on-chip PLL enables generation of the internal clock signals for the digital circuitry

and the DAC from a low speed clock. The PLL can be bypassed enabling the use of an

external, high-speed clock.

Each DAC generates two complementary current outputs on pins IOUTAP/IOUTAN and

IOUTBP/IOUTBN. This provides a full- scale output current ( IO(fs)) up to 22 mA. An internal

reference is available for the reference current which is externally adjustable using pin

VIRES.

There are also some embedded features to provide an analog offset correction (auxiliary

DACs) and digit al of fset control as well as for gain adjustment. All th e functions can be se t

using the SPI.

The DAC1205D750 operates at both 3.3 V and 1.8 V each of which has separate digital

and analog power supplies. The digital input is 1.8 V and 3.3 V compliant and the clock

input is LVDS compliant.

10.2 Serial peripheral interface

10.2.1 Protocol description

The DAC1205D750 Serial Peripheral Interface (SPI) is a synchronous serial

communicat ion port allo win g easy interfacing with many industry microprocessors. It

provides access to the registers tha t de fin e th e op er a ting mo de s of the ch ip in bo th write

and read modes.

This interface can be configu red as a 3-wir e type (SDIO as a bidirectional pin) or a 4-wire

type (SDIO and SDO as unidirectional pins, input and output port respectively). In both

configurations, SCLK acts as the serial clock and SCS_N acts as the serial chip select

bar. If several DAC1205D750 devices are connected to an application on the same

SPI-bus, only a 3-wire type can be used.

Each read/write operation is sequenced by the SCS_N signal and enabled by a LOW

assertion to drive the chip with 1 to 4 bytes, depending on the content of the instruction

byte (see Table 7).

Product data sheet Rev. 4 — 31 January 2012 14 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

In Table 7 N1 and N0 indicate the number of bytes transferred after the instruction byte.

A0 to A4: indicate which register is being addressed . In the case of a multiple tr ansfer, this

address concerns the first register after which the next registers follow directly in a

decreasing order according to Table 9 “Register allocation map”.

10.2.2 SPI timing description

The interface can operate at a frequency of up to 15 MHz. The SPI timing is shown in

Figure 4.

R/W indicates the mode access, (see Table 6)

Fig 3. SPI protocol

001aaj812

RESET_N

SCS_N

SCLK

SDIO

SDO

(optional)

R/W N1 N0 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0

D7 D6 D5 D4 D3 D2 D1 D0

Table 6. Read or Write mode access description

R/W Description

0 Write mode operation

1 Read mode operation

Table 7. Number of bytes transferred

N1 N0 Number of bytes

0 0 1 byte transferred

0 1 2 bytes transfe rre d

1 0 3 bytes transfe rre d

1 1 4 bytes transfe rre d

Fig 4. SPI timing diagram

001aaj813

50 %

w(RESET_N)

su(SCS_N)

su(SDIO)

h(SDIO)

h(SCS_N)

w(SCLK)

50 %

RESET_N

SCS_N

SCLK

SDIO

50 %

Product data sheet Rev. 4 — 31 January 2012 15 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

The SPI timing characteristics are given in Table 8.

10.2.3 Detailed descriptions of registers

An overview of the details for all registers is provided in Table 9.

Table 8. SPI timing characteristics

Symbol Parameter Min Typ Max Unit

fSCLK SCLK frequency - - 15 MHz

tw(SCLK) SCLK pulse width 30 - - ns

tsu(SCS_N) SCS_N set-up time 20 - - ns

th(SCS_N) SCS_N hold time 20 - - ns

tsu(SDIO) SDIO set-up time 10 - - ns

th(SDIO) SDIO hold time 5 - - ns

tw(RESET_N) RESET_N pulse width 30 - - ns

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

Product data sheet Rev. 4 — 31 January 2012 16 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Table 9. Register allocation map

Address Register name R/W Bit definition Default

Dec Hex Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bin Dec Hex

0 00h COMMon R/W 3W_SPI SPI_RST CLK_SEL - MODE_

SEL CODING IC_PD GAP_PD 10000000 128 80

1 01h TXCFG R/W NCO_ON NCO_LP_

SEL INV_SIN_

SEL MODULATION[2:0] INTERPOLATION[1:0] 10000111 135 87

2 02h PLLCFG R/W PLL_PD - PLL_DIV_

PD PLL_DIV[1:0] DAC_CLK_DELAY[1:0] DAC_CLK

_POL 00010000 16 10

3 03h FREQNCO_LSB R/W FREQ_NCO[7:0] 01100110 102 66

4 04h FREQNCO_LISB R/W FREQ_NCO[15:8] 01100110 102 66

5 05h FREQNCO_UISB R/W FREQ_NCO[23:16] 01100110 102 66

6 06h FREQNCO_MSB R/W FREQ_NCO[31:24] 00100110 38 26

7 07h PHINCO_LSB R/W PH_NCO[7:0] 00000000 0 00

8 08h PHINCO_MSB R/W PH_NCO[15:8] 00000000 0 00

9 09h DAC_A_Cfg_1 R/W DAC_A_PD DAC_A_

SLEEP DAC_A_OFFSET[4:0] - 00000000 0 00

10 0Ah DAC_A_Cfg_2 R/W DAC_A_GAIN_

COARSE[1:0] DAC_A_GAIN_FINE[5:0] 01000000 64 40

11 0Bh DAC_A_Cfg_3 R/W DAC_A_GAIN_

COARSE[3:2] DAC_A_OFFSET[10:5] 11000000 192 C0

12 0Ch DAC_B_Cfg_1 R/W DAC_B_PD DAC_B_

SLEEP DAC_B_OFFSET[4:0] - 00000000 0 00

13 0Dh DAC_B_Cfg_2 R/W DAC_B_GAIN_

COARSE[1:0] DAC_B_GAIN_FINE[5:0] 01000000 64 40

14 0Eh DAC_B_Cfg_3 R/W DAC_B_GAIN_

COARSE[3:2] DAC_B_OFFSET[10:5] 11000000 192 C0

15 0Fh DAC_Cfg R/W - MINUS_

3DB NOISE_

SHPER 00000000 0 00

16 10h SYNC_Cfg R/W SYNC_DIV SYNC_SEL - 00000000 0 00

26 1Ah DAC_A_Aux_MSB R/W AUX_A[9:2] 10000000 128 80

27 1Bh DAC_A_Aux_LSB R/W AUX_A_PD - AUX_A[1:0] 00000000 0 00

28 1Ch DAC_B_Aux_MSB R/W AUX_B[9:2] 10000000 128 80

29 1Dh DAC_B_Aux_LSB R/W AUX_B_PD - AUX_B[1:0] 00000000 0 00

Product data sheet Rev. 4 — 31 January 2012 17 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.2.4 Detailed register descriptions

Please refer to Table 9 for the register overview and relevant default values. In the

following tables, all the values shown in bold are the default values.

Table 10. COMMon register (address 00h) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

7 3W _SPI R/W serial interface bus type

0 4 wire SPI

1 3 wire SPI

6 SPI_RST R/W serial interface reset

0no reset

1 pe rforms a reset on all regi sters except 00h

5 CLK_SEL R/W data input latch

0 at CLK rising edge

1 at CLK falling edge

4 - - - reserved

3 MODE_SEL R/W input data mode

0 dual port

1 interleaved

2 CODING R/W coding

0binary

1 two’s compliment

1 IC_PD R/W power-down

0disabled

1 all circuits (digital and analog, except SPI)

are switched off

0 GAP_PD R/W internal ban dgap power-down

0 power-down disabled

1 internal bandgap references are switched off

Table 11. TXCFG register (address 01h) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

7 NCO_ON R/W NCO

0 disabled (the NCO phase is reset to 0)

1 enabled

6 NCO_LP_SEL R/W low-power NCO

0 disabled

1 NCO frequency and phase given by the five

MSBs of the registers 06h and 08h

respectively

5 INV_SIN_SEL R/W x / (sin x) function

0 disabled

1 enabled

Product data sheet Rev. 4 — 31 January 2012 18 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

4 to 2 MODULATION[2:0] R/W modulation

000 dual DAC: no modulation

001 positive upper single sideband

up-conversion

010 positive lower single sideband up -conversion

011 negative upper single sideband

up-conversion

100 negative lower single sideband

up-conversion

1 to 0 INTERPOLATION[1:0] R/W interpolation

01 reserved

10 4

11 8

Table 12. PLLCFG register (address 02h ) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

PLL ON PLL OFF

7 PLL_PD R/W PLL

0 switche d on

1 switched off

6 - - reserved

5 PLL_DIV_PD R/W PLL divider undefined

0 switche d on X

1 switched off X

4 to 3 PLL_DIV[1:0] R/W PLL divider fa ctor Digital clock delay

00 2 130 ps

01 4 280 ps

10 8 430 ps

11 X580 ps

2 to 1 DAC_CLK_DELAY[1:0] R/W phase shift (fs) undefined

00 0X

01 120X

10 240X

0 DAC_CLK_POL R/W clock edge of DAC (fs) undefined

0 normal X

1 inverted X

Table 13. FREQNCO_LSB register (address 03h) bit description

Bit Symbol Access Value Description

7 to 0 FREQ_NCO[7:0] R/W - lower 8 bits for the NCO frequency setting

Table 11. TXCFG register (address 01h) bit description …continued

Default settings are shown highlighted.

Bit Symbol Access Value Description

Product data sheet Rev. 4 — 31 January 2012 19 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Table 14. FREQNCO_LISB register (address 04h) bit description

Bit Symbol Access Value Description

7 to 0 FREQ_NCO[15:8] R/W - lower intermediate 8 bits for the NCO

frequency setting

Table 15. FREQNCO_UISB register (address 05h) bit description

Bit Symbol Access Value Description

7 to 0 FREQ_NCO[23:16] R/W - upper intermediate 8 bits for the NCO

frequency setting

Table 16. FREQNCO_MSB register (address 06h) bit description

Bit Symbol Access Value Description

7 to 0 FREQ_NCO[31:24] R/W - most significant 8 bits for the NCO frequency

setting

Table 17. PHINCO_LSB re gister (address 07h) bit description

Bit Symbol Access Value Description

7 to 0 PH_NCO[7:0] R/W - lower 8 bits for the NCO phase setting

Table 18. PHINCO_MSB register (add ress 08h) bit descriptio n

Bit Symbol Access Value Description

7 to 0 PH_NCO[15:8] R/W - most significant 8 bits for the NCO phase

setting

Table 19. DAC_A_Cfg_1 register (address 09h) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

7 DAC_A_PD R/W DAC A power

0on

1off

6 DAC_A_SLEEP R/W DAC A Sleep mode

0disabled

1 enabled

5 to 1 DAC_A_OFFSET[4:0] R/W - lower 5 bits for the DAC A offset

Table 20. DAC_A_Cfg_2 register (address 0Ah) bit description

Bit Symbol Access Value Description

7 to 6 DAC_A_GAIN_

COARSE[1:0] R/W - lower 2 bits for the DAC A gain setting for

coarse adjustment

5 to 0 DAC_A_GAIN_

FINE[5:0] R/W - lower 6 bits for the DAC A gain setting for fine

adjustment

Product data sheet Rev. 4 — 31 January 2012 20 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Table 21. DAC_A_Cfg_3 register (address 0Bh) bit description

Bit Symbol Access Value Description

7 to 6 DAC_A_GAIN_

COARSE[3:2] R/W - most significant 2 bits for the DAC A gain

setting for coarse adjustment

5 to 0 DAC_A_

OFFSET[10:5] R/W - most significant 6 bits for the DAC A offset

Table 22. DAC_B_Cfg_1 register (address 0Ch) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

7 DAC_B_PD R/W DAC B power

0on

1off

6 DAC_B_SLEEP R/W DAC B Sleep mode

0disabled

1 enabled

5 to 1 DAC_B_OFFSET[4:0] R/W - lower 5bits for the DAC B offset

Table 23. DAC_B_Cfg_2 register (address 0Dh) bit description

Bit Symbol Access Value Description

7 to 6 DAC_B_GAIN_

COARSE[1:0] R/W - less significant 2 bits for the DAC B gain setting

for coarse adjustment

5 to 0 DAC_B_GAIN_

FINE[5:0] R/W - the 6 bits for th e D AC B gain setting for fin e

adjustment

Table 24. DAC_B_Cfg_3 register (address 0Eh) bit description

Bit Symbol Access Value Description

7 to 6 DAC_B_GAIN_

COARSE[3:2] R/W - most significant 2 bits for the DAC B gain

setting for coarse adjustment

5 to 0 DAC_B_

OFFSET[10:5] R/W - most significant 6 bits for the DAC B offset

Table 25. DAC_Cfg register (address 0Fh) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

7 to 2 - - - reserved

1 MINUS_3DB R/W NCO gain

0unity

13 dB

0 NOISE_SHPER R/W noise shaper

0 disabled

1 enabled

Product data sheet Rev. 4 — 31 January 2012 21 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Table 26. SYNC_Cfg register (addres s 10h) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

7 SYNC_DIV R/W fs divided by

6 SYNC_SEL R/W SYNC selection

0disabled

1 enabled

5 to 0 - - - reserved

Table 27. DAC_A_Aux_MSB register (address 1Ah) bit description

Bit Symbol Access Value Description

7 to 0 AUX_A[9:2] R/W - most significant 8 bits for the auxiliary DAC A

Table 28. DAC_A_Aux_LSB register (address 1Bh) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

7 AUX_A_PD R/W auxiliary DAC A power

0on

1off

6 to 1 - - reserved

1 to 0 AUX_A[1:0] R/W lower 2 bits for the auxiliary DAC A

Table 29. DAC_B_Aux_MSB register (address 1Ch) bit description

Bit Symbol Access Value Description

7 to 0 AUX_B[9:2] R/W - most significant 8 bits for the auxiliary DAC B

Table 30. DAC_B_Aux_LSB register (address 1Dh) bit description

Default settings are shown highlighted.

Bit Symbol Access Value Description

7 AUX_B_PD R/W auxiliary DAC B power

0on

1off

6 to 1 - - reserved

1 to 0 AUX_B[1:0] R/W lower 2-bits for the auxiliary DAC B

Product data sheet Rev. 4 — 31 January 2012 22 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.2.5 Recommended configuration

It is recommended that the following additional settings are used to obtain optimum

performance at up to 750 Msps

10.3 Input data

The setting applied to MODE_SEL (register 00h[3]; see Table 10 on page 17) defines

whether the DAC1205D750 operates in the Dual-port mode or in Interleaved mode (see

Table 32).

10.3.1 Dual-port mode

The data input for Dual-port mode operation is shown in Figure 5 “Dual -port mode”. Each

DAC has its own independent data input. The data enters the input latch on the rising

edge of the internal clock signal and is transferred to the DAC latch.

10.3.2 Interleaved mode

The data input for the Interleaved mode operation is illustrated in Figure 6 “Interleaved

mode operation”.

Table 31. Recommended configuration

Address Value

Dec Hex Bin Dec Hex

17 11h 00001010 10 0Ah

19 13h 01101100 108 6Ch

20 14h 01101100 108 6Ch

Table 32. Mode selection

Bit 3 setting Function I11 to I0 Q11 to Q0 Pin 41

0 Dual port mode active active Q11

1 Interleaved mode active off SELIQ

Fig 5. Dual-port mode

001aam195

LATCH

I2 ×2 ×2 ×

I11 to I0

FIR 1

FIR 2

FIR 3

LATCH

Q2 ×2 ×2 ×

Q11 to Q0

Product data sheet Rev. 4 — 31 January 2012 23 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

In Interleaved mode, both DACs use the same data input at twice the Dual-port mode

frequency. Data enters the latch on the ri sing edge of the internal clock signal. The data is

sent to either latch I or latch Q, depending on the SELIQ signal.

The SELIQ input (pin 41) allo ws th e syn ch ro niz at i on of the internally demultiplexed I and

Q channels; see Figure 7.

The SELIQ signal can be either synchronous or asynchronous (single rising edge, single

pulse). The first data following the SELIQ rising edge is sent in channel I and following

data is sent in channel Q. After this, data is distributed alternately between these

channels.

Fig 6. Interleaved mode operation

CLKdig = internal digital clock

Fig 7. Interleaved mode timing (8x interpolation, latch on rising edg e )

001aam196

LATCH

I2 ×2 ×2 ×

FIR 1

FIR 2

FIR 3

LATCH

Q2 ×2 ×2 ×

I11 to I0

Q11/SELIQ

001aaj814

NIn

SELIQ

(synchronous alternative)

SELIQ

(asynchronous alternative 1)

SELIQ

(asynchronous alternative 2)

CLKdig

Latch I output

Latch Q output

XX N N + 2

N + 1 N + 2 N + 3 N + 4 N + 5

XX N + 1 N + 3

Product data sheet Rev. 4 — 31 January 2012 24 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.4 Input clock

The DAC1205D750 can operate at the following clock frequencies:

PLL on: up to 185 MHz in Dual-port mode and up to 370 MHz in Interleaved mode

PLL off: up to 750 MHz

The input clock is LVDS compliant (see Figure 8) but it can also be interfaced with CML

differential sine wave signa l (see Figure 9).

10.5 Timing

The DAC1205D750 can opera te at a sampling frequ ency (fs) up to 750 Msps with an input

data rate (fdata) up to 185 MHz. When using the internal PLL, the input data is referenced

to the CLK signal. When the internal PLL is bypassed, the SYNC signal is used as a

reference. The input timing in the second case is shown in Figure 10.

Fig 8. LVDS clock configuration

Fig 9. Interfacing CML to LVDS

001aah021

100 Ω

LVDS

CLKINP

CLKINN

LVDS

diff

= 100 Ω

001aah020

55 Ω

1.1 kΩ

2.2 kΩ

100 nF

CML

100 nF

CLKINP

LVDS

CLKINN

AGND

VDDA(1V8)

1 kΩZdiff = 100 Ω

Product data sheet Rev. 4 — 31 January 2012 25 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.5.1 Timing when using the internal PLL (PLL on)

In Table 33, the links between internal and external clocking are defined. The setting

applied to PLL_DIV[1:0] (register 02h[4:3]; see Tab l e 9 “Register allocation map”) allows

the frequency between the digital part and the DAC core to be adjusted.

The settings applied to DAC_CLK_DELAY[1:0] (register 02h[2:1]) and DAC_CLK_POL

(register 02h[0]), allow adjustment of the phase and polarity of the sampling clock. This

occurs at the input of the DAC core and depends mainly on the sampling fre quency. Some

examples are given in Table 34.

10.5.2 Timing when using an external PLL (PLL off)

It is recommended that a delay of 280 ps is used on the internal digital clock (CLKdig) to

obtain optimum device performance up to750 Msps.

10.6 FIR filters

The DAC1205D750 integrates three selectable Finite Impulse Response (FIR) filters

which enables the device to use 4 or 8 interpolation rates. All three interpolation filters

have a stop-band attenuation of at least 80 dBc and a pass-ban d ripple of less than

0.0005 dB. The coe fficients of the interpo lat ion filter s ar e give n in Table 36 “Interpolation

filter coefficients”.

Fig 10. Inp ut timing diagram when in ternal PLL bypassed (off)

001aam197

su(i)

90 %

50 %

90 %

I11 to I0/

Q11 to Q0

SYNC

(SYNCP − SYNCN)

h(i)

N + 1 N + 2

Table 33. Frequencies

Mode CLK input

(MHz) Input data rate

(MHz) Interpolation Update rate

(Msps) PLL_DIV[1:0]

Dual Port 185 185 4740 01 (/ 4)

Dual Port 92.5 92.5 8740 10 (/ 8)

Interleaved 370 370 4740 00 (/ 2)

Interleaved 185 185 8740 01 (/ 4)

Table 34. Sample clock phase and polarity examples

Mode Input data rate

(MHz) Interpolation Update rate

(Msps) DAC_CLK_

DELAY [1:0] DAC_CLK_

POL

Dual Port 92.5 4370 01 0

Dual Port 92.5 8740 01 0

Table 35. Optimum external PLL timing settings

Address Register name Value

Dec Hex Digital clock delay Bin Dec Hex

2 02h PLLCFG 280 p s 10001000 136 88h

Product data sheet Rev. 4 — 31 January 2012 26 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.7 Quadrature modulator and Numerically Controlled Oscillator (NCO)

The quadrature modulator allows the 12-bit I and Q-data to be mixed with the carrier

signal generated by the NCO.

The frequency of the Numerically Controlled Oscillator (NCO) is programmed over 32-bit

and allows the sign of the sine component to be inverted in order to operate positive or

negative, lower or upper single sideband up-conversion.

Table 36. Interpolation filter coefficients

First interpolation fil ter Second interpolation filter Third interpolation filter

Lower Upper Value Lower Upper Value Lower Upper Value

H(1) H(55) 4 H(1) H(23) 2 H(1) H(15) 39

H(2) H(54) 0 H(2) H(22) 0 H(2) H(14) 0

H(3) H(53) 13 H(3) H(21) 17 H(3) H(13) 273

H(4) H(52) 0 H(4) H(20) 0 H(4) H(12) 0

H(5) H(51) 34 H(5) H(19) 75 H(5) H(11) 1102

H(6) H(50) 0 H(6) H(18) 0 H(6) H(10) 0

H(7) H(49) 72 H(7) H(17) 238 H(7) H(9) 4964

H(8) H(48) 0 H(8) H(16) 0 H(8) - 8192

H(9) H(47) 138 H(9) H(15) 660 - - -

H(10) H(46) 0 H(10) H(14) 0 - - -

H(11) H(45) 245 H(11) H(13) 2530 - - -

H(12) H(44) 0 H(12) - 4096 - - -

H(13) H(43) 408------

H(14)H(42)0------

H(15) H(41) 650 - - - - - -

H(16)H(40)0------

H(17) H(39) 1003------

H(18)H(38)0------

H(19) H(37) 1521 - - - - - -

H(20)H(36)0------

H(21) H(35) 2315------

H(22)H(34)0------

H(23) H(33) 3671 - - - - - -

H(24)H(32)0------

H(25) H(31) 6642------

H(26)H(30)0------

H(27) H(29) 20756 - - - - - -

H(28) 32768------

Product data sheet Rev. 4 — 31 January 2012 27 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.7.1 NCO in 32-bit

When using the NCO, the frequency can be set by the four registers FREQNCO_LSB,

FREQNCO_LISB, FREQNCO_UISB and FREQNCO_MSB over 32 bits.

The frequency for the NCO in 32-bit is calculated as follows:

(1)

where M is the decimal representation of FREQ_NCO[31:0].

The phase of the NCO can be set from 0 to 360 by both regi sters PHINCO_LSB and

PHINCO_MSB over 16 bits.

10.7.2 Low-power NCO

When using the low-power NCO, the frequency can be set by the 5 MSB of register

FREQNCO_MSB.

The frequency for the low-power NCO is calculated as follows:

(2)

where M is the decimal representation of FREQ_NCO[31:27].

The phase of the low-power NCO can be set by the 5 MSB of the register PHINCO_MSB.

10.7.3 Minus_3dB function

During normal use, a full-scale pattern will also be full scale at the output of the DAC.

Nevertheless, when the I and Q d ata are simultaneously close to full scale, some clipp ing

can occur and the Minus_3dB function can be used to reduce the gain by 3 dB in the

modulator. This is to keep a full-scale range at the output of the DAC without added

interferers.

10.8 x / (sin x)

Due to the roll-off effect of the DAC, a selectable FIR filter is inserted to compensate for

the x / (sin x) effect. This filter introduces a DC loss of 3.4 dB. The coefficients are

represented in Table 37.

fNCO Mf



232

--------------

fNCO Mf



--------------

Table 37. Inversion filter coefficients

First interpolation fil ter

Lower Upper Value

H(1) H(9) 2

H(2) H(8) 4

H(3) H(7) 10

H(4) H(6) 35

H(5) - 401

Product data sheet Rev. 4 — 31 January 2012 28 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.9 DAC transfer function

The full-scale output current for each DAC is the sum of the two complementary current

outputs:

(3)

The output current depends on the digital input data:

(4)

(5)

The setting applied to CODING (register 00h[2]; see Tab l e 9 “Register allocation map”)

defines whether the DAC1205D750 operates with a binary input or a two’s complement

input.

Table 38 shows the output current as a function of the input data, when IO(fs) = 20 mA.

10.10 Full-scale current

10.10.1 Regulation

The DAC1205D750 reference circuitry integrates an internal bandgap reference voltage

which delivers a 1.29 V reference to the GAPOUT pin. It is recommended to decouple pin

GAPOUT using a 100 nF capacitor.

The reference current is generated via an external resistor of 953  (1 %) connected to

pin VIRES. A control amplifier set s the ap propriate full-scale output current (IO(fs)) for both

DACs (see Figure 11).

Table 38. DAC transfer function

Data I11 to I0 and Q11 to Q0 IOUTP (mA) IOUTN (mA)

Binary Two’s complement

0 0000 0000 0000 1000 0000 0000 0 20

... ... ... ... ...

8192 1000 0000 0000 0000 0000 0000 10 10

... ... ... ... ...

16383 1111 1111 1111 0111 1111 1111 20 0

IOfs IIOUTP IIOUTN

IIOUTP IOfs DATA

4095

----------------





=

IIOUTN IOfs 4095 DATA–

4095

----------------------------------





=

Product data sheet Rev. 4 — 31 January 2012 29 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

This configuration is optimum for temperature drift compensation because the ba ndgap

reference voltage can be matched to the voltage across the feedback resistor.

The DAC current can also be set by applying an external reference voltage to the

non-inverting input pin GAPOUT and disabling the internal bandgap reference voltage

with GAP_PD (register 00h[0]; see Table 10 “COMMon register (address 00h) bit

description”).

10.10.2 Full-scale current adjustment

The default full-scale current (IO(fs)) is 20 mA but further adjustments can be made by the

user to both DACs independently via the serial interface from 1.6 mA to 22 mA, 10 %.

The settings applied to DAC_A_GAIN_COARSE[3:0] (see Table 20 “DAC_A_Cfg_2

0Bh) bit description”) and to DAC_B_GAIN COARSE[3:0] (see Table 23 “DAC_B_Cfg_2

0Eh) bit description”) define the coarse variation of the full-scale current (see Table 39).

Fig 11. Internal reference configuration

aaa-002266

REF.

BANDGAP

GAPOUT

VDDA(1V8)

VIRES

DAC

CURRENT

SOURCES

ARRAY

AGND

100 nF

953 Ω

(1 %)

100

kΩ

Table 39. IO(fs) coarse adjustment

Default settings are shown highlighted.

DAC_GAIN_COARSE[3:0] IO(fs) (mA)

Decimal Binary

0 0000 1.6

1 0001 3.0

2 0010 4.4

3 0011 5.8

4 0100 7.2

5 0101 8.6

6011010.0

7011111.4

8 1000 12.8

9 1001 14.2

10 1010 15.6

11 1011 17.0

Product data sheet Rev. 4 — 31 January 2012 30 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

The settings applied to DAC_A_GAIN_FINE[5:0] (see Table 20 “DAC_A_Cfg_2 register

(address 0Ah) bit description”) and to DAC_B_GAIN_FINE[5:0] (see Table 23

“DAC_B_Cfg_2 register (address 0Dh) bit description”) define the fine variation of the

full-scale current (see Table 40).

The coding of the fine gain adjustment is two’s complement.

10.11 Digital offset adjustment

When the DAC1205D750 analog output is DC connected to the next stage, the digital

offset correction can be used to adjust the comm on-mode level at the output of the DAC.

It adds an offset at the end of the digital part, just before the DAC.

The settings applied to DAC_A_OFFSET[11:0] (see Table 19 “DAC_A_Cfg_1 register

(address 09h) bit description” and Table 21 “DAC_A_Cfg_3 register (address 0Bh) bit

description”) and to “DAC_B_O F F SET[11:0]” (see Table 22 “DAC_B_Cfg_1 register

(address 0Ch) bit description” and Table 24 “DAC_B_Cfg_3 register (addre ss 0Eh) bit

description”) define the range of variation of the digital offset (see Table 41).

12 1100 18.5

13 1101 20.0

14 1110 21.0

15 1111 22.0

Table 40. IO(fs) fine adjustment

Default settings are shown highlighted.

DAC_GAIN_FINE[5:0] Delta IO(fs)

Decimal Two’s complement

32 10 0000 10.3 %

... ... ...

0 00 0000 0

... ... ...

31 01 1111 +10 %

Table 39. IO(fs) coarse adjustment …continued

Default settings are shown highlighted.

DAC_GAIN_COARSE[3:0] IO(fs) (mA)

Decimal Binary

Product data sheet Rev. 4 — 31 January 2012 31 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.12 Analog output

The DAC1205D750 has two outpu t channels e ach of which p roduces two comple ment ary

current output s. These allo w the even-order harmonics and no ise to be reduce d. The pins

are IOUTAP/IOUTAN and IOUTBP/IOUTBN, respectively and need to be connected via a

load resistor RL to the 3.3 V analog power supply (VDDA(3V3)).

Refer to Figure 12 for the equivalent analog o utput circuit of one DAC. This circuit consists

of a parallel combination of NMOS current sources, and their associated switches, for

each segment.

The cascode source configuration increases the output impedance of the source, thus

improving the dynamic performance of the DAC by introducing less distortion.

The device can provide an outpu t leve l of up to 2 Vo(p-p) dep ending on the a pplication, the

following stages and the targeted performances.

Table 41. Digital offset adjustmen t

Default settings are shown highlighted.

DAC_OFFSET[11:0] Offset applied

Decimal Two’s complement

1024 100 0000 0000 1024

1023 100 0000 0001 1023

... ... ...

1 111 1111 1111 1

0 000 0000 0000 0

+1 000 0000 0001 +1

... ... ...

+1022 011 1111 1110 +1022

+1023 011 1111 1111 +1023

Fig 12. Equivalent analog output circuit (one DAC)

001aah019

VDDA(3V3)

AGND

IOUTAP/IOUTBP

IOUTAN/IOUTBN

RLRL

AGND

Product data sheet Rev. 4 — 31 January 2012 32 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.13 Auxiliary DACs

The DAC1205D750 integrates 2 auxiliary DACs that can be used to compensate for any

offset between the DAC and the next stage in the transmission path.

Both auxiliary DACs have a resolution of 10-bit and are current sources (referenced to

ground).

(6)

The output current depends on the auxiliary DAC data:

(7)

(8)

Table 42 shows the output current as a function of the auxiliary DAC data.

10.14 Output configuration

10.14.1 Basic output configuration

The use of a differentially-coupled transformer output provides optimum distortion

performance (see Figure 13). In addition, it helps to match the impedance and provides

electrical isolation.

Table 42. Auxiliary DAC transfer function

Default settings are shown highlighted.

Data AUX[9:0] (binary) IAUXP (mA) IAUXN (mA)

0 00 0000 0000 0 2.2

... ... ... ...

512 10 0000 0000 1.1 1.1

... ... ... ...

1023 11 1111 1111 2.2 0

IOAUX

IAUXP IAUXN

AUXP IOAUX

AUX 9:0

1023

-------------------------





=

AUXN IOAUX

(1023 A–UX 9:0

1023

---------------------------------------------





=

Fig 13. 1 Vo(p-p) differential output with transformer

001aaj817

50 Ω

IOUTnP/IOUTnN; V

o(cm)

= 2.8 V; V

o(dif)(p-p)

= 1 V

IOUTnP

IOUTnN

0 mA to 20 mA

2:1

0 mA to 20 mA

DDA(3V3)

Product data sheet Rev. 4 — 31 January 2012 33 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

The DAC1205D750 differential outputs can operate up to 2 Vo(p-p). In this configuration, it

is recommended to connect the center t ap of the transformer to a 62  resistor connected

to the 3.3 V analog power supply, in order to adjust the DC common-mode to

approximately 2.7 V (see Figure 14).

10.14.2 DC interface to an Analog Quadrature Modulator (AQM)

When the system operation requires to keep the DC component of the spectrum, the

DAC1205D750 can use a DC interface to connect to an AQM. In this case, the offset

compensation for LO cancellation can be made with the use of the digital offset control in

the DAC.

Figure 15 provides an example of a connection to an AQM with a 1.7 VI(cm)

common-mode input level.

Fig 14. 2 Vo(p-p) differential output with transformer

001aaj818

50 Ω

100 Ω

IOUTnP/IOUTnN; Vo(cm) = 2.7 V; Vo(dif)(p-p) = 2 V

IOUTnP

IOUTnN

0 mA to 20 mA 4:1

0 mA to 20 mA

VDDA(3V3)

62 Ω

VDDA(3V3)

Fig 15. An example of a DC interface to a 1.7 VI(cm) AQM

001aaj541

51.1 Ω51.1 Ω

442 Ω

VDDA(3V3)

IOUTnP

IOUTnN 0 mA to 20 mA

BBP

(1) IOUTnP/IOUTnN; Vo(cm) = 2.67 V; Vo(dif)(p-p) = 1.98 V

(2) BBP/BBN; Vi(cm) = 1.7 V; Vi(dif)(p-p) = 1.26 V

BBN

AQM (Vi(cm) = 1.7 V)

768 Ω768 Ω

(1) (2)

Product data sheet Rev. 4 — 31 January 2012 34 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Figure 16 provides an example of a connection to an AQM with a 3.3 VI(cm)

common-mode input level.

The auxiliary DACs can be used to control the offset in a precise range or with precise

steps.

Figure 17 provides an example of a DC interface with the auxiliary DACs to an AQM with

a 1.7 VI(cm) common-mode input level.

Fig 16. An example of a DC interface to a 3.3 VI(cm) AQM

Fig 17. An example of a DC interface to a 1.7 VI(cm) AQM using auxiliary DACs

001aaj542

54.9 Ω54.9 Ω

237 Ω

DDA(3V3)

IOUTnP

IOUTnN

BBP

BBN

AQM (V

i(cm)

= 3.3 V)

750 Ω750 Ω

5 V

1.27 kΩ1.27 kΩ

(1)

IOUTnP/IOUTnN; V

o(cm)

= 2.75 V; V

o(dif)(p-p)

= 1.97 V

(2)

BBP/BBN; V

i(cm)

= 3.3 V; V

i(dif)(p-p)

= 1.5 V

(1) (2)

001aal655

51.1 Ω51.1 Ω

442 Ω

VDDA(3V3)

IOUTnP

IOUTnN 0 mA to 20 mA

BBP

BBN

AQM (Vi(cm) = 1.7 V)

698 Ω698 Ω

51.1 Ω51.1 Ω

AUXnP

AUXnN 1.1 mA (typ.)

(1) IOUTnP/IOUTnN; Vo(cm) = 2.67 V; Vo(dif)(p-p) = 1.94 V

(2) BBP/BBN; Vi(cm) = 1.7 V; Vi(dif)(p-p) = 1.23 V; offset correction up to 50 mV

(1) (2)

Product data sheet Rev. 4 — 31 January 2012 35 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Figure 18 provides an example of a DC interface with the auxiliary DACs to an AQM with

a 3.3 VI(cm) common-mode input level.

The constraints to adjust the interface are the output compliance range of the DAC and

the auxiliary DACs, the input common-mode level of the AQM, and the range of offset

correction.

10.14.3 AC interface to an Analog Quadrature Modulator (AQM)

When the AQM common-mode voltage is close to ground, the DAC1205D750 must be

AC-coupled and the auxiliary DACs are needed for offset correction.

Figure 19 provides an example of a connection to an AQM with a 0.5 VI(cm)

common-mode input level using auxiliary DACs.

Fig 18. An example of a DC interface to a 3.3 VI(cm) AQM using auxiliary DACs

001aaj544

54.9 Ω54.9 Ω

237 Ω

3.3 V

IOUTnP

IOUTnN

AUXnP

AUXnN

BBP

BBN

AQM (V

i(cm)

= 3.3 V)

750 Ω750 Ω

5 V

634 Ω634 Ω

442 Ω442 Ω

(1)

IOUTnP/IOUTnN; V

o(cm)

= 2.75 V; V

o(dif)(p-p)

= 1.96 V

(2)

BBP/BBN; V

i(cm)

= 3.3 V; V

i(dif)(p-p)

= 1.5 V; offset correction up to 36 mV

(1) (2)

Product data sheet Rev. 4 — 31 January 2012 36 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

10.15 Power and grounding

In order to obtain optimum performance, it is recommended that the 1.8 V analog power

supplies on pins 5, 11, 71, 77 and 99 should not b e connected with the ones o n pins 6, 70,

79, 81, 83, 93, 95 and 97 on the top layer.

To optimize the decoupling, the power supplies should be decoupled with the following

ground pins:

•VDDD(1V8): pin 26 with 27; pin 32 with 33; pin 36 with 37; pin 4 0 with 39; pin 44 with 43

and pin 50 with 49.

•VDD(IO)(3V3): pin 16 with 17 and pin 60 with 59.

•VDDA(1V8): pin 5 with 4; pin 6 with 7; pin 11 with 10; pin 71 with 72; pin 77 with 78; pins

79, 81, 83 with 80, 82, 84; pins 93, 95, 97 with 92, 94, 96 and pin 99 with 98.

•VDDA(3V3): pin 1 with 100 and pin 75 with 76.

Fig 19. An example of an AC interface to a 0.5 VI(cm) AQM using auxiliary DACs

001aaj589

66.5 Ω66.5 Ω

10 nF

VDDA(3V3)

IOUTnP

IOUTnN 0 mA to 20 mA

BBP

BBN

AQM (Vi(cm) = 0.5 V)

2 kΩ2 kΩ

5 V

174 Ω174 Ω

34 Ω34 Ω

AUXnP

AUXnN 1.1 mA (typ.)

10 nF

(1) IOUTnP/IOUTnN; Vo(cm) = 2.65 V; Vo(dif)(p-p) = 1.96 V

(2) BBP/BBN; Vi(cm) = 0.5 V; Vi(dif)(p-p) = 1.96 V; offset correction up to 70 mV

(1) (2)

Product data sheet Rev. 4 — 31 January 2012 37 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

11. Package outline

Fig 20. Package outline SOT638-1 (HTQFP100)

UNIT A

max. A1A2A3bpHDHELpZD(1) ZE(1)

ceLywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 1.2 0.15

0.05 1.05

0.95 0.25 0.27

0.17 0.20

0.09 14.1

13.9 0.5 16.15

15.85 1.15

0.85 7°

0°

0.08 0.080.21

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT638-1 MS-026 03-04-07

05-02-02

D(1) E(1)

14.1

13.9 16.15

15.85

DhEh

7.1

6.1

7.1

6.1 1.15

0.85

EA1

detail X

(A3)

HEA2

vMB

vMA

100

7675 5150

pin 1 index

0 10 mm

scale

HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;

body 14 x 14 x 1 mm; exposed die pad SOT638-1

exposed die pad side

Product data sheet Rev. 4 — 31 January 2012 38 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

12. Abbreviations

Table 43. Abbreviations

Acronym Description

B Bandwidth

CDMA Code Division Multiple Acce ss

CML Current Mode Logic

CMOS Complementary Metal-Oxide Semiconductor

DAC Digital-to-Analog Converter

FIR Finite Impulse Response

GSM Global System for Mobile communications

IF Intermediate Frequency

IMD3 Third-order InterModulatio n Distortion

LISB Lower Intermediate Significant Byte

LMDS Local Multipoint Distribution Service

LSB Least Significant Bit

LTE Long Term Evolution

LVDS Low-Voltage Differential Signaling

MMDS Multichannel Multipoint Distribution Service

MSB Most Significant Bit

NCO Numerically Controlled Oscillator

NMOS Negative Metal-Oxide Semiconductor

PLL Phase-Locked Loop

SFDR Spurious-Free Dynamic Range

SPI Serial Peripheral Interface

TD-SCDMA Time Division-Synchronous Code Division Multiple Access

UISB Upper Intermediate Significant Byte

WCDMA Wideband Code Division Multiple Access

WiMAX Worldwide Interoperability for Microwave Access

Product data sheet Rev. 4 — 31 January 2012 39 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

13. Glossary

Spurious-Free Dynamic Range (SFDR): — The ratio between the RMS value of the

reconstruct ed ou tput sin e wave and the RMS value of the lar ges t spuriou s obse rved

(harmonic and non-harmonic, excluding DC component) in the frequency domain.

Intermodulation Distortion (IMD): — From a dual-tone digital input sine wave (these

two frequencies being close together), the intermodulation distortion products IMD2 and

IMD3 (respectively, second and third-order components) are defined below.

IMD2 — The ratio of the RMS value of either tone to the RMS value of the worst second

order intermodulation product.

IMD3 — The ratio of the RMS value of either tone to the RMS value of the worst third

order intermodulation product.

Restricted Bandwidth Spurious Free Dynamic Range — The ratio of the RMS value of

the reconstructed output sine wave to the RMS value of the no ise, inclu ding the

harmonics, in a given bandwidth centered around foffset.

Product data sheet Rev. 4 — 31 January 2012 40 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

14. Revision history

Table 44. Revision history

Document ID Release date Data sheet status Change notice Supersedes

DAC1205D750 v.4 20120131 Product data sheet - DAC1205D750 v.3

Modifications: •Section 2 “Features and benefits” has been updated.

•The values for VO(ref) in Table 5 “Characteristics” have been updated.

•Section 10.2.1 “Protocol description” has been updated.

•Section 10.10.1 “Regulation” has been updated.

DAC1205D750 v.3 20110607 Product data sheet - DAC1205D750 v.2

DAC1205D750 v.2 20100910 Product data sheet - DAC1205D750 v.1

DAC1205D750 v.1 20100802 Product data sheet - -

Product data sheet Rev. 4 — 31 January 2012 41 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

15. Legal information

15.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

15.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the appl ication or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 4 — 31 January 2012 42 of 43

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automo tive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product cl aims resulting f rom customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

15.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

16. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors DAC1205D750

Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 31 January 2012

Document identifier: DAC1205 D750

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

17. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

8 Thermal characteristics . . . . . . . . . . . . . . . . . . 8

9 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 Application information. . . . . . . . . . . . . . . . . . 13

10.1 General description . . . . . . . . . . . . . . . . . . . . 13

10.2 Serial peripheral interface. . . . . . . . . . . . . . . . 13

10.2.1 Protocol description . . . . . . . . . . . . . . . . . . . . 13

10.2.2 SPI timing description. . . . . . . . . . . . . . . . . . . 14

10.2.3 Detailed descriptions of registers . . . . . . . . . . 15

10.2.4 Detailed register descriptions . . . . . . . . . . . . . 17

10.2.5 Recommended configuration . . . . . . . . . . . . . 22

10.3 Input data . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10.3.1 Dual-port mode. . . . . . . . . . . . . . . . . . . . . . . . 22

10.3.2 Interleaved mode . . . . . . . . . . . . . . . . . . . . . . 22

10.4 Input clock . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

10.5 Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

10.5.1 Timing when using the internal PLL (PLL on). 25

10.5.2 Timing when using an external PLL (PLL off). 25

10.6 FIR filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

10.7 Quadrature modulator and Numerically

Controlled Oscillator (NCO) . . . . . . . . . . . . . . 26

10.7.1 NCO in 32-bit . . . . . . . . . . . . . . . . . . . . . . . . . 27

10.7.2 Low-power NCO. . . . . . . . . . . . . . . . . . . . . . . 27

10.7.3 Minus_3dB function . . . . . . . . . . . . . . . . . . . . 27

10.8 x / (sin x). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

10.9 DAC transfer function. . . . . . . . . . . . . . . . . . . 28

10.10 Full-scale current . . . . . . . . . . . . . . . . . . . . . . 28

10.10.1 Regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

10.10.2 Full-scale current adjustment . . . . . . . . . . . . . 29

10.11 Digital offset adjustment . . . . . . . . . . . . . . . . . 30

10.12 Analog output . . . . . . . . . . . . . . . . . . . . . . . . . 31

10.13 Auxiliary DACs . . . . . . . . . . . . . . . . . . . . . . . . 32

10.14 Output configuration. . . . . . . . . . . . . . . . . . . . 32

10.14.1 Basic output configuration . . . . . . . . . . . . . . . 32

10.14.2 DC interface to an Analog Quadrature

Modulator (AQM) . . . . . . . . . . . . . . . . . . . . . . 33

10.14.3 AC interface to an Analog Quadrature

Modulator (AQM) . . . . . . . . . . . . . . . . . . . . . . 35

10.15 Power and grounding. . . . . . . . . . . . . . . . . . . 36

11 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 37

12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 38

13 Glossary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

14 Revision history . . . . . . . . . . . . . . . . . . . . . . . 40

15 Legal information . . . . . . . . . . . . . . . . . . . . . . 41

15.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 41

15.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 41

15.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42

16 Contact information . . . . . . . . . . . . . . . . . . . . 42

17 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43