RT9167/A
10 DS9167/A-29 April 2011www.richtek.com
Operating Region and Power Dissipation
The maximum power dissipation of RT9167/A depends
on the thermal resistance of the case and circuit board,
the temperature difference between the die junction and
a mbient air, and the rate of airflow. The power dissipation
a cross the device is P = IOUT (VIN − VOUT). The maximum
power dissipation is: PMAX = (TJ − TA) /θJA
where TJ − TA is the temperature difference between the
RT9167/A die junction and the surrounding environment,
θJA is the thermal resistance from the junction to the
surrounding environment. The GND pin of the RT9167/A
performs the dual function of providing an electrical
connection to ground and channeling heat away . Connect
the GND pin to ground using a large pad or ground plane.
Current Limit and Thermal Protection
T9167 includes a current limit which monitors and controls
the pass transistor's gate voltage limiting the output current
to 350mA Typ. (700mA Typ. for RT9167A). Thermal-
overload protection limits total power dissipation in the
RT9167/A. When the junction temperature exceeds
TJ = 155°C, the thermal sensor signals the shutdown logic
turning off the pa ss transistor a nd allowing the IC to cool.
The thermal sensor will turn the pa ss tra nsistor on again
after the IC's junction temperature cools by 10°C, resulting
in a pulsed output during continuous thermal-overload
conditions. Thermal-overloaded protection is designed to
protect the RT9167/A in the event of fault conditions. Do
not exceed the absolute maximum junction-temperature
rating of TJ = 150°C for continuous operation. The output
can be shorted to ground for an indefinite a mount of time
without da maging the part by cooperation of current limit
and thermal protection.
Thermal Considerations
Thermal protection limits power dissipation in RT9167/A.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function and
turns the pa ss element off. The pa ss element turn on again
after the junction temperature cools by 30°C.
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
PD = (VIN − VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference
between junction to ambient. The maximum power
dissipation can be calculated by f ollowing formula :
PD(MAX) = ( TJ(MAX) − TA ) / θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
the θJA is the junction to a mbient thermal resista nce.
For recommended operating conditions specification of
RT9167/A, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the operated
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-23-5 package,
the thermal resistance θJA is 250°C/W on the standard
JEDEC 51-3 single-layer thermal test board. The maximum
power dissipation at TA = 25°C can be calculated by
following formula :
PD(MAX) = (125°C − 25°C) / 250 = 0.4W for
SOT-23-5 package
PD(MAX) = (125°C - 25°C) / 160 = 0.625W for
SOP-8 package
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9167/A pa ck age s, the Figure 5 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Figure 5. Derating Curves for RT9167/A Packages
0
100
200
300
400
500
600
700
0 20406080100120140
Am bien t Tempera tu re
Maximum Power Dissipation (mW) 1
SOT-23-5
SOP-8