MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 Features Operates 50 MHz to 20 GHz Usable up to 26 GHz Low Insertion Loss High Isolation Low Parasitic Capacitance and Inductance RoHS Compliant Surmount Package Rugged, Fully Monolithic Glass Encapsulated Construction Up to +38 dBm CW Power Handling @ +25C Silicon Nitride Passivation Polymer Scratch Protection Solderable Functional Schematic Description The MASW-003103-1364 is a SP3T, surmount, broadband, monolithic switch using series and shunt connected silicon PIN diodes. This device is designed for use in broadband, moderate signal, high performance, switch applications up to 20 GHz. It is a surface mountable switch configured for optimized performance and offers a distinct advantage over MMIC, beamlead and chip and wire hybrid designs. Because the PIN diodes of the MASW-004103-1365 are integrated into the chip and kept within close proximity, the parasitics typically associated with other designs that use individual components are kept to a minimum. To minimize the parasitics and achieve high performance the MASW-003103-1364 is fabricated using MACOMs' patented HMICTM (Heterolithic Microwave Integrated Circuit) process. This process allows the silicon pedestals, which form the series and shunt diodes or vias, to be imbeded in low loss, low dispersion glass. The combination of low loss glass and using tight spacing between elements results in an HMIC device with low loss and high isolation through low millimeter wave frequencies. The topside is fully encapsulated with silicon nitride and also has an additional layer of polymer for scratch and impact protection. The protective coating guards against damage to the junction and the anode airbridges during handling and assembly. On the backside of the chip gold metalized pads have been added to produce a solderable surmount device. J3 J2 J4 J1 Pin Configuration Pin Function J1 RFC J2 RF1 J3 RF2 J4 RF3 Ordering Information Part # Package MASW-003103-13640G 50 piece gel pack MASW-003103-13645P 500 piece reel MASW-003103-13640P 3000 piece reel MASW-003103-001SMB Sample Test Board 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008144 MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 Electrical Specifications: TA = 25C, PIN = 0 dBm, Z0 = 50 , 20 mA, -10 V Parameter Conditions 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz Insertion Loss Isolation Input Return Loss Output to Output Isolation Units Min. dB -- dB dB 50 37 25 19 14 14 dB -- Typ. Max. 0.5 0.8 1.2 54 40 31 25 22 21 57 42 30 0.6 1.1 1.4 -- -- -- Input 0.1 dB Compression Point 2 GHz dBm -- 36 -- Switching Speed1 -- ns -- 20 -- Voltage Rating2 -- V -- -- 80 1. Typical Switching Speed measured from 10% to 90 % of detected RF signal driven by TTL compatible drivers. 2. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 A maximum @ -80 volts. Absolute Maximum Ratings3,4,5 Parameter Absolute Maximum RF CW Incident Power 2 GHz 20 GHz 38 dBm 33 dBm Applied Reverse Voltage |-80 V| Bias Current +25C 50 mA Junction Temperature +175C Operating Temperature -65C to +125C Storage Temperature -65C to +150C Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity These electronic devices are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these Class 1A HBM devices. 3. Exceeding any one or combination of these limits may cause permanent damage to this device. 4. MACOM does not recommend sustained operation near these survivability limits. 5. Combined maximum operating conditions for RF power, DC bias, & temperature: 33 dBm CW, 20 mA per diode, +85C. 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008144 MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 Typical Performance Curves: 20 mA, -10 V (On-Wafer Probed) Insertion Loss @ 20mA, -10V Insertion LossRF Input to RF Outputs (J1 to J2, J3, J4) Isolation 0.0 0 J1 TO J2 J1 TO J3 J1 TO J4 J1 TO J2 J1 TO J3 J1 TO J4 -20 Isolation (dB) -0.5 Insertion Loss (dB) Isolation @ 20mA, -10V RF Input to RF Outputs (J1 to J2, J3, J4) -1.0 -1.5 -40 -60 -2.0 -80 0 5 10 15 20 25 30 0 5 10 Frequency (GHz) 15 20 25 Input Return Loss @ 20mA, -10V Input Return Loss RF Input to RF Outputs (J1 to J2, J3, J4) Output Return Loss @ 20mA, -10V Output ReturnRFLoss Input to RF Outputs (J1 to J2, J3, J4) 0 0 J1 TO J2 J1 TO J3 J1 TO J4 Output Return Loss (dB) J1 TO J2 J1 TO J3 J1 TO J4 Input Return Loss (dB) 30 Frequency (GHz) -10 -20 -30 -40 -10 -20 -30 -40 0 5 10 15 20 25 30 0 5 10 Frequency (GHz) 15 20 25 30 Frequency (GHz) Maximum Input Power, Baseplate Temperature fixed @ Input +25C MASW-003103-1364 Maximum Power Curve OutputIsolation to Output Isolation @ 20mA, -10V Output to Output J2 to J3 and J3 to J4 Baseplate Temperature fixed @ 25degC 0 12 10 J3 TO J4 -20 Input Power (Watts) Output to Output Isolation (dB) J2 TO J3 -40 -60 8 2GHz, 5.8W 6 4 10GHz, 2.75W 2 20GHz, 2W 0 -80 0 5 10 15 20 Frequency (GHz) 25 30 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Insertion Loss (dB) 3 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008144 MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 Bias Control Optimal operation of the MASW-003103-1364 is achieved by simultaneous application of negative DC voltage and current to the low loss switching arm J2, J3, or J4, and positive DC voltage and current to the remaining switching arms as shown in the applications circuit below. DC return is achieved via R2 on the J1/RF Com Path. In the low loss state, the series diode must be forward biased with current and the shunt diode reverse biased with voltage. In the isolation arms, the shunt diode is forward biased with current and the series diode is reverse biased with voltage. Driver Connections Control Level (DC Currents and Voltages) B2 -15 V at -20 mA B3 5 +6 V at +20 mA 5 +6 V at +20 mA -15 V at -20 mA +6 V at +20 mA +6 V at +20 mA Condition of RF Output B4 J1-J2 J1-J3 J1-J4 +6 V at +20 mA Low Loss Isolation Isolation +6 V at +20 mA Isolation Low Loss Isolation -15 V at -20 mA5 Isolation Isolation Low Loss 5. The voltage applied to the off arm is allowed to vary provided a constant current is applied through the shunt diode on the off arm. Application Circuit6,7,8,9,10 Example: J1 to J2 Low Loss R1 = 250 R2 = 450 B2 = -15 V B3, B4 = 6 V 6. 7. 8. 9. 10. 4 Assume VF ~ 1 V @ 20 mA R1 = 5 V / 0.02 A = 250 ; R2 = 9 V / 0.02 A = 450 PR1 = 0.02 A x 0.02 A x 250 = 0.1 W PR2 = 0.02 A x 0.02 A x 450 = 0.18 W Inductors shown in the above schematic are RF bias chokes. The operating bandwidth of a broad-band PIN diode switch is often dependent on the bias components, particularly the RF bias chokes. It is suggested that the response at the frequencies of interest be measured with all the bias components in place prior to installing of MASW-003103-1364. MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008144 MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 Outline Drawing and Footprint (All dimensions in m)11,12,13,14 Top View Side View Backside View 125 2065 1960 680 200 J3 285 200 J1 J1 680 200 285 1540 J2 J4 200 290 J4 200 200 200 1655 200 J2 11. 12. 13. 14. 684 200 290 200 J3 200 200 200 Bottom view shows the back metal foot print and mounting pads. All dimension are +/-0.5 m. Ground radius is 200 m and centered on the I/O Pad. The center pad shown on the chip bottom view must be connected to RF and DC ground. Dimensions Dim. Inches mm Min. Max. Min. Max. Width 0.06417 0.06614 1.630 1.680 Length 0.08031 0.08228 2.040 2.090 Thickness 0.00394 0.00591 0.100 0.150 5 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008144 MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 Handling Procedures Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is 1W, conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150C. When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum tip pick-up tool and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recommended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die so that its mounting pads are aligned with the circuit board mounting pads. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538, "Surface Mounting Instructions" and can viewed on the MACOM Technology Solutions website @ www.macom.com 6 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008144 MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 Carrier Tape Dimensions 0.157 0.004 4.000 0.100 0.157 0.004 4.000 0.100 0.079 0.002 2.000 0.050 0.059 0.004 thru typ. 1.500 0.100 +0.012 -0.004 +0.30 8.000 -0.10 0.315 0.069 0.004 1.750 0.100 0.138 0.002 3.500 0.050 0.093 0.002 0.035 thru typ. 0.890 0.012 0.001 0.300 0.030 2.360 0.050 5 max. typ. 0.012 0.002 0.300 0.050 Pocket Depth 0.066 0.002 1.800 0.050 Chip Orientation in Tape 7 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008144 MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 Reel Information Dim. inches mm Min. Max. Min. Max. A 6.980 7.019 177.3 178.3 B 0.059 0.098 1.5 2.5 C 0.504 0.520 12.8 13.2 D 0.795 0.815 20.2 20.7 N 2.146 2.185 54.5 55.5 W1 0.331 0.337 8.4 8.55 W2 --- 0.567 --- 14.4 8 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008144 MASW-003103-1364 HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz Rev. V3 MACOM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM") products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. 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