Silicone Materials for Electronic Devices and Component Assemblies Contents Overview.................................................................................1-2 Industry Overview..............................................................3-4 Product Index Adhesives and Sealants....................................................5-6 Grease.......................................................................................7 Coating Materials................................................................7-8 Encapsulants / Potting Materials..................................9-10 Selection Guide................................................................11-12 Product Details 1 Part Condensation Cure............................................13-17 1 Part Heat (Addition) Cure..........................................18-20 2 Part Room Temperature. Cure................................21-22 2 Part Heat (Addition) Cure..........................................23-24 1 Part & 2 Part Gels......................................................25-26 Junction Coating Resin (JCR) Grades............................27 Grease....................................................................................28 UL Certifications...........................................................29-30 Technical Information..................................................31-32 FAQ............................................................................................33 Silicone Product Profile conditions, equipment, and desired material properties. The products introduced in this selector guide consist of RTV (Room Temperature Vulcanizing) silicone products that are commonly found in Electric and Electronic applications and component assemblies. This family of silicone products consists of both Room Temperature Cure and Heat (Addition) Cure grades. Condensation Cure Condensation cure silicone products cure when exposed to moisture in the environment at room temperature. These materials are categorized into Alkoxy, Acetoxy, or Oxime based on the byproducts that occur during cure. Heat (Addition) Cure Momentive Performance Materials offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements, curing Silicone RTV Heat cure grades cure upon exposure to elevated heat or room temperature. Condensation Cure 1 Part Sealing & Adhesion Silicones are used in a wide array of applications for bonding components, and sealing against moisture or environmental contaminants. A comprehensive portfolio of 1 Part and 2 Part Adhesives and Sealants, many of which are excellent candidates for assembly applications on or near sensitive electrical and electronic components, are available. These materials are applied by a variety of methods ranging from manual dispensing to autodispensing units for tube, cartridge, pail, or drum packages. Mixing for 2 Part grades may be accomplished by either manual processes or meter mix dispensing, depending on production volume and post-mix material properties. Coating The Coating process involves the application of silicone in a thin protective layer to a component surface by methods such as dip, flow, spray, and selective robotic Performance Considerations coating. Selection of a silicone coating material for a particular application involves the consideration of various performance and processing criteria. Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Low Volatility - Adhesion - Mechanical Strength - Hardness - Thermal Conductivity - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Low Volatility - Stress Relief Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life Potting & Encapsulation Silicone rubber and gels are widely used in electronics to ensure mechanical and environmental protection. A full range of products are offered in various cure speeds, viscosities, and performance, many of which offer enhancements for thermal cycling protection, stress relief, material strength, flame retardancy, or optical clarity. Heat (Addition) Cure Silicone Varnish Performance Considerations Millable Silicone Rubber 2 Part Condensation Cure Silicone Oil Heat (Addition) Cure - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Low Volatility - Adhesion - Stress Relief - Release Properties - Thermal Conductivity Process Considerations Relative Performance Characteristics Property Silicone RTV o Epoxy Urethane o -50 ~ +150 C - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life -30 ~ +120 oC Temperature Range -50 ~ +200 C Heat Resistance Good Poor Poor Flame Retardancy1 Good None None UV Stability Good Poor Poor Ozone Stability Good Poor Poor Modulus Low High High 1 As a base material silicone demonstrates flame retardant properties comparable to UL94HB. 1 2 Industries Served Electronic Devices and Power Modules Momentive Performance Materials is a driving force as a supplier of advanced silicone technology to the electronics industry. Increasing electronic component densities and performance demands have created a need for specialized silicone solutions from Momentive for a broad mix of performance and handling requirements. Typical Applications: - Power converters - Inverters - Hybrid ICs - Micro-Electronic packaging - High-voltage component insulation - Membrane switches - Photo couplers Typical Applications: Automotive Electronics - Board-level adhesion, fixing, and sealing The automotive industry plays a critical role in integrating new electronic technologies. As more and more components migrate to electronic solutions, silicones play an increasingly important role in helping deliver material solutions that contribute to design flexibility and long-term component reliability under harsh operating conditions. - PCB coating - Component encapsulation - Junction Coating Resins Consumer Electronics Silicones are commonly used in a variety of consumer electronics applications. In addition to providing adhesion to many substrates, an array of grades are available to provide heat resistance, flame retardancy, low volatility for sensitive components, and moisture protection. Typical Applications: - ECU potting, sealing, coating - Wire connector sealing - Sealing, encapsulation in a broad range of sensors - HVAC system sealing - Vibration dampening - Headlamp assemblies Aviation and Aerospace Avionics and frame assembly needs in Aviation and Aerospace are served through silicone adhesives, coating, encapsulation and potting materials that help withstand stress and temperature extremes. Typical Applications: - Avionics - Circuit and terminal protection - Wire sealants - Engine gasketing - Cargo door, window sealing - Weatherstrip adhesives - Aviation lighting - Ventilation ducts Typical Applications: - Flat panel displays - PCs and Smart Phones - LED Lighting - Steam iron plate seals Board Assembly Silicones are found in boardlevel adhesion, coating, and encapsulation applications, and contribute to the longterm, reliable performance of many components and assemblies. A wide portfolio of products is available, providing flame retardancy, thermal conductivity, temperature resistance, low-volatility, or high-purity benefits. 3 - Air conditioner units - Control panel insulation - PCB fixing and sealing Energy and sealants. Reliability of electronic components and the ability for panels to withstand harsh conditions over the lifecycle of the product are important considerations in solar energy applications. Momentive Performance Materials helps serve this growing industry with its range of potting materials Typical Applications: - Terminal box potting - Box and base sealing - Aluminum frame and glass / EVA plate sealing 4 Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions. Product Overview: Adhesives & Sealants Type 1 Part Condensation Cure 1 Part Heat Cure 2P 2 Part RT Heat Cure 1 5 Performance Grade Cure Chemistry Cured Property Feature Flowability RTV133 RTV167 TSE385 TSE3853-W TSE3854DS TN3005 TN3085 TSE3941M TSE3944 TN3305 TSE3971 TSE3976-B XE11-B5320 FRV1106 RTV100 series RTV106 RTV116 RTV157 RTV159 TSE370 TSE382 TSE3826 TSE3840-G TSE3843-W TSE384-B TSE387 TSE3877-B TSE388 TSE3212 TSE322 TSE3221S TSE322S TSE326 TSE3261-G TSE326M1 TSE3280-G TSE3281-G XE13-B3208 RTV577 RTV88 TSE3360 TSE3380 XE14-A0425 Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Oxime Oxime Oxime Oxime Oxime Oxime Oxime Oxime Heat Heat Heat Heat Heat Heat Heat Heat Heat Heat Condensation Condensation Heat Heat Heat Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber UL certified non-flowable sealant. High-strength paste adhesive with UL certified and Mil Spec. Paste adhesive. Suitable for PC substrates. UL certified, semi-flowable paste. UL certified paste adhesive. Fast tack, low volatile paste paste adhesive. Fast tack, low volatile paste paste adhesive. UL certified Fast tack, thermally conductive flowable sealant. Low volatile, UL certified flowable sealant. Fast tack, low volatile flowable adhesive / sealant Flowable adhesive / sealant. Low volatile, temperature resistant sealant. UL certified. Fast tack, low volatile, thermally conductive adhesive. UL certified. Fuel, solvent, chemical, and temperature-resistant fluoro sealant. FDA, USDA, and NSF compliant paste adhesive. Mil Spec. Temperature-resistant adhesive. FDA, USDA, & NSF compliant. Mil Spec. Temperature-resistant flowable sealant. FDA, USDA, & NSF compliant. Mil Spec. High strength paste / adhesive. High strength paste / adhesive. Temperature-resistant. Fast tack, general purpose paste adhesive. Fast tack, general purpose adhesive paste. UL certified. Fast tack adhesive for high-temperature applications. UL certified general purpose adhesive / sealant. UL certified general purpose adhesive / sealant. UL certified general purpose adhesive / sealant. General purpose flowable adhesive / sealant. Flowable sealant for high-temperature applications. Flowable general purpose adhesive / sealant. Thixotropic adhesive / sealant. Flowable adhesive / sealant. Flowable adhesive / sealant. UL certified, semi-flowable adhesive / sealant. UL certified, high temperature-resistant adhesive / sealant. High temperature-resistant adhesive / sealant. High temperature-resistant adhesive / sealant. Thermally conductive adhesive. Thermally conductive adhesive. General purpose adhesive / sealant. Extreme low temperature resistant sealant. Release capability. Semi-flowable temperature-resistant sealant. Release capability. General purpose adhesive / sealant. Thermally conductive adhesive. Fast cure at elevated temperatures. Heat resistant, thermally conductive adhesive. Non-flowable Non-flowable Non-flowable Semi-flowable Non-flowable Non-flowable Non-flowable Flowable Semi-flowable Flowable Flowable Flowable Non-flowable Non-flowable Non-flowable Non-flowable Flowable Non-flowable Non-flowable Non-flowable Non-flowable Non-flowable Semi-flowable Semi-flowable Non-flowable Flowable Flowable Flowable Semi-flowable Flowable Flowable Semi-flowable Flowable Flowable Flowable Flowable Flowable Non-flowable Non-flowable Semi-flowable Non-flowable Flowable Semi-flowable Flame Retardancy Low Volatility Thermally Conductive High Temp. Resistance Low Temp. Resistance FDA Compliant UL94 V-0 UL94 HB MIL-Spec MIL-A-46146B UL94 V-0 UL94 V-0 UL94 V-0 * * UL94 V-0 * * UL94 HB UL94 HB * * * * * * * * * * * * * UL94 HB * UL94 V-0 UL94 V-1 UL94 V-0 * * UL94 HB UL94 HB * * * * * * * * * * MIL-A-46106B MIL-A-46106B MIL-A-46106B Product Detail P. 13 P. 13 P. 13 P. 14 P. 13 P. 13 P. 13 P. 14 P. 14 P. 14 P. 14 P. 14 P. 13 P. 16 P. 17 P. 17 P. 17 P. 17 P. 17 P. 17 P. 15 P. 16 P. 16 P. 16 P. 16 P. 16 P. 16 P. 16 P. 18 P. 18 P. 19 P. 18 P. 19 P. 18 P. 19 P. 18 P. 19 P. 18 P. 21 P. 21 P. 23 P. 23 P. 23 TSE326M-EX in Europe and the Americas 6 Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions. Product Overview: Coating Materials Type 1 Part Condensation Cure 1 Part Heat Cure 2P RT 2 Part Heat Cure 1 Performance Grade Cure Chemistry Cured Property Feature Flowability ECC3010 ECC3050S ECS0600 ECS0601 ECS0609FR RTV160 TSE3941M TSE3944 TN3305 TSE3971 TSE3976-B TSE398 TN3705 XE11-A5133S RTV110 series TSE387 TSE3877-B TSE388 TSE389 ECC4865 TSE3221S TSE325 TSE3250 TSE3251 TSE3251-C TSE325-B TSJ3155 TSJ3195-W TSJ3185 RTV11 TSE3033 TSE3331 TSE3331K1 TSE3331K EX1 XE14-B5778 TSJ3175 Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Acetoxy Oxime Oxime Oxime Oxime Heat Heat Heat Heat Heat Heat Heat Heat Heat Heat Condensation Heat Heat Heat Heat Heat Heat Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Gel Gel Rubber Rubber Rubber Rubber Rubber Rubber Gel Fast cure conformal coating material. Solvent free Fast cure conformal coating material. Low volatile. Solvent free High purity repairable electrode coating. Fast tack. High purity, non-repairable type electrode coating. UL certified. High purity, non-repairable type electrode coating. UL certified. UL certified flowable sealant. Fast tack, thermally conductive flowable sealant. Low volatile, UL certified flowable sealant. Fast tack, low volatile flowable adhesive / sealant Flowable sealant. Low volatile, temperature resistant sealant. UL certified. Pourable coating / encapsulant. Low volatile, low viscosity coating / potting material Low volatile, UL certified, thermally conductive coating & potting. General purpose coating / encapsulant. FDA, USDA, and NSF compliant. Mil Spec. General purpose flowable sealant / coating. Flowable sealant for high-temperature applications. Flowable, general purpose sealant / coating. Flowable, UL certified coating / sealant. Extreme low viscosity coating material with UV tracer. Flowable sealant / coating material. Flowable coating / encapsulant. Flowable coating / encapsulant. Flowable coating material. Flowable coating material. Flowable coating / encapsulant. High purity JCR-grade white rubber. High purity JCR-grade white gel. High purity JCR-grade translucent gel. General purpose encapsulation and potting. FDA compliant. Transparent coating / encapsulant. Fast cure at elevated temperatures. UL certified, thermally conductive, coating / encapsulant. Low viscosity variant of TSE3331. Low viscosity variant of TSE3331. High purity JCR-grade translucent rubber. High purity JCR-grade thixotropic gel. Flowable Flowable Flowable Flowable Flowable Flowable Flowable Semi-flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Semi-flowable Semi-flowable Flowable Semi-flowable Semi-flowable Semi-flowable Flowable Flowable Flowable Flowable Flowable Semi-flowable Semi-flowable UL94 HB UL94 V-0 UL94 HB Low Volatility Thermally Conductive High Temp. Resistance JCR Grade FDA Compliant * * * * UL94 V-0 * * UL94 HB * UL94 V-1 * * * * * * * UL94 HB * * * UL94 V-0 UL94 V-0 UL94 V-0 MIL-Spec * * * * * * MIL-A-46106B Product Detail P. 15 P. 15 P. 15 P. 15 P. 14 P. 14 P. 14 P. 14 P. 14 P. 14 P. 14 P. 15 P. 15 P. 14 P. 17 P. 16 P. 16 P. 16 P. 16 P. 20 P. 19 P. 20 P. 20 P. 20 P. 20 P. 20 P. 27 P. 27 P. 27 P. 22 P. 24 P. 23 P. 24 P. 23 P. 27 P. 27 TSE3331K for Asia Pacific, TSE3331K EX for Europe and the Americas Grease - Product Index Grade Feature TSK5303 TSK5370 TSK550 TSK551 YG6111 YG6240 YG6260 TIG1000 Moderate thermal conductivity with heat resistance. General electrical insulation. Swell resistant on silicone. General electrical insulation, arc resistance. Insulator protection from salt, dust. Moderate thermal conductivity. Moderate thermal conductivity, low-bleed performance. Moderate thermal conductivity. High thermal conductivity. 7 Flame Retardancy Performance Thermally Conductive Low Bleed * * * * * Low Volatility * * * * * * * Heat Resistant * Product Detail P. 28 P. 28 P. 28 P. 28 P. 28 P. 28 P. 28 P. 28 8 Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions. Product Overview: Encapsulants and Potting Materials Type 1 Part Cond. Cure 1 Part Heat Cure 2 Part Room Temp. Cure 2 Part Heat Cure 1 9 Performance Grade Cure Chemistry Cured Property Feature Flowability RTV160 TSE398 TN3705 XE11-A5133S RTV110 series RTV116 TSE325 TSE3250 TSE325-B TSE3051 TSE3051-FR TSE3051-L TSE3053 RTV11 RTV31 RTV566 RTV60 TSE3663 TSE3661 TSE3664K RTV615 TSE3032 TSE3033 TSE3331 TSE3331K1 TSE3331K EX1 TSE3431 TSE3431-H XE14-B7892 YE5822 RTV6136-D1 TSE3062 TSE3070 Alkoxy Alkoxy Alkoxy Alkoxy Acetoxy Acetoxy Heat Heat Heat Heat Heat Heat Heat Condensation Condensation Condensation Condensation Condensation Condensation Condensation Heat Heat Heat Heat Heat Heat Heat Heat Heat Heat Heat Heat Heat Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Gel Gel Gel Gel Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Gel Gel Gel UL certified flowable encapsulant. Pourable coating / encapsulant. Low volatile, low viscosity potting / coating material. Low volatile, UL certified, thermally conductive coating & potting. General purpose coating / encapsulant. FDA, USDA, and NSF compliant. Mil Spec. Temperature-resistant flowable sealant. FDA, USDA, and NSF compliant. Mil Spec. Flowable coating / encapsulant. Flowable coating / encapsulant. Flowable coating / encapsulant. Low viscosity potting gel. UL certified variant of TSE3051. Low penetration variant of TSE3051. High penetration gel. General purpose encapsulation and potting. FDA compliant. High temperature resistant potting. Good release properties. Low volatile, high-low temperature-resistance. Extreme high temperature-resistant coating / potting. Release capability. Flowable encapsulant / potting material. Flowable encapsulant / potting material. UL certified, flowable encapsulant / potting material. High strength potting material. Fast cure at elevated temperatures. Transparent potting / encapsulant with excellent release properties. Low viscosity, transparent potting material. Fast cure at elevated temperatures. UL certified, thermally conductive, coating / encapsulant. Low viscosity variant of TSE3331. Low viscosity variant of TSE3331. UL certified, thermally conductive potting material. Release capability. UL certified, thermally conductive potting material. Release capability. UL certified low-viscosity potting material. Low temperture cure. Release capability. Low viscosity potting material. Good release properties. Low viscosity potting gel with fast cure at low temperatures. Fast cure at low temperatures. High-elongation gel with low temperature cure. Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flame Retardancy Low Volatility Thermally Conductive High Temp. Resistance Low Temp. Resistance FDA Compliant MIL-Spec UL94 HB UL94 V-1 * * * * * * UL94 V-1 * * * * * * UL94 HB UL94 V-0 * UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 * * * * * MIL-A-46106B MIL-A-46106B Product Detail P. 14 P. 15 P. 15 P. 14 P. 17 P. 17 P. 20 P. 20 P. 20 P. 25 P. 25 P. 25 P. 25 P. 22 P. 22 P. 21 P. 21 P. 22 P. 22 P. 22 P. 23 P. 23 P. 24 P. 23 P. 24 P. 23 P. 24 P. 24 P. 24 P. 24 P. 26 P. 26 P. 26 TSE3331K for Asia Pacific, TSE3331K EX for Europe and the Americas 10 2 Part Grades Selection Guide 1 Part Grades Viscosity Range Acetoxy Alkoxy BLACK=Rubber RED=Gels Oxime Heat Performance Thermally Conductive Low Volatility TN3085 XE11-B5320 UL Certified TN3005 TN3085 XE11-B5320 Temp. Resistant TSE3854DS TN3085 RTV133 FRV1106 RTV106 TSE3826 TSE382 TSE384-B High Viscosity TSE3843-W TSE3941M XE11-A5133S Medium Viscosity TSE3853-W TSE3976-B TSE322S TSE325 RTV110 RTV116 Cure Byproduct 11 Fast Cure Slow Cure Alcohol Alcohol High Viscosity Acetoxy Oxime Heat Cure Acetic Acid Methylethyl Ketoxime None Moderate Temp. Resistant FDA Compliant General Purpose TSE3360 XE14-A0425 RTV577 RTV88 TSE3971 TSE3380 RTV566 TSE3331 TSE3331K TSE3431 TSE3431-H TSE3661 TSE3664K High Viscosity - Flowable RTV31 RTV566 RTV60 TSE3331 TSE3331K TSE3431 TSE3431-H XE14-B7892 RTV567 Medium Low Viscosity-Flowable Viscosity - Flowable ECC3010 TSE3051 TSE3051-L TSE3053 TSE325 TSE3250 TSE3251 TSE3251-C TSE325-B UL Certified XE14-A0425 Medium Viscosity Non-Flowable Cure System Performance Guide Attribute Low Volatility TSE387 TSE388 TSE3221S TSE326 TSE3261-G TSE326M Room Temperature Non-Flowable TSE3212 TSE322 TSE398 TSE389 TSE3051FR Alkoxy Thermally Conductive Low Viscosity RTV116 Heat Performance Viscosity Range XE13-B3208 TSE3971 ECS0601 ECS0609FR Low Viscosity RTV157 TSE370 RTV159 TSE3877-B TSE3944 TSE3944 XE11-A5133S XE11-A5133S TN3305 RTV160 RTV167 RTV110 ECC3050S ECS0600 ECS0601 ECS0609FR TN3705 RTV100 RTV106 TSE3976-B TSE3840-G TSE3843-W TSE3280-G TSE3281-G General Purpose TSE385 NonFlowable TSE3976-B FDA Compliant BLACK=Rubber RED=Gels RTV11 RTV615 RTV567 TSE3664K RTV6136-D1 TSE3032 TSE3033 TSE3062 TSE3070 TSE3330 YE5822 TSE3663 Viscosity and flowability of the silicone material are often key factors in the selection of a material for use in sealing, coating, and encapsulation / potting applications. A broad array of material performance and viscosity combinations are provided to help match the requirements of many applications. Application Geometry and Cure Chemistry Options The shape and conditions of the part are important in selecting the suitable silicone grade for each application. The following are some general guidelines: Shallow Cavity / Small Mass Complex Design Exposed Surface 6mm 12mm Deep Cavity / Large Mass Enclosed System 12mm 6mm Cure Speed Fast Slow Fast Corrosion on Copper None None Yes Yes None Corrosion on Metals None None Yes None None Odor Low Low Strong Low None Strength Good Good Very Strong Good Good 12mm Very Fast Selection Options: - 1 Part Condensation Cure - 1 Part Heat Cure - 2 Part Room Temp. Cure - 2 Part Heat Cure Selection Options: - 1 Part Heat Cure - 2 Part Room Temp. Cure - 2 Part Heat Cure 25mm Selection Options: - 1 Part Heat Cure - 2 Part Room Temp. Cure - 2 Part Heat Cure Selection Options: - 1 Part Heat Cure - 2 Part Heat Cure 12 Product Details - 1 Part Condensation Cure Grades Properties RTV167 RTV133 TSE385 TSE3854DS TN3005 TN3085 XE11-B5320 TSE3944 TSE3853-W TSE3971 Cure Chemistry Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Non-Flowable Non-Flowable Non-Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Fast tack, low volatile, thermally conductive paste adhesive. Flowable low volatile adhesive / sealant. UL certified Flowable adhesive / sealant. UL certified * * * * - 400 (4000) 1 Flowability Features and Benefits Application Non-Flowable Non-Flowable Non-Flowable Non-Flowable High strength, paste adhesive with MILA46106B and UL certified UL certified paste adhesive. Paste adhesive Paste adhesive. UL certified * * * * Adhesive / Sealant Fast tack, low volatile Fast tack, low volatile paste adhesive. paste adhesive. UL certified * * Coating TSE3976-B XE11-A5133S TSE3941M Flowable adhesive / Flowable, high-temperature Flowable, low volatile Fast tack, thermally sealant. resistant low volatile thermally conductive potting conductive flowable adhesive / sealant. UL / coating material. UL adhesive / sealant. certified certified * * * * 100 (1000) 1 100 (1000) 1 Encapsulant / Potting - - - - ECS0609FR Alkoxy Alkoxy Alkoxy Flowable Flowable Flowable Fast tack, flowable adhesive / sealant. Flowable adhesive with UL certified High-purity electrode coating material with fast tack performance. UL certified * * * 38 (380)2 18 (180) 1 * * * * 50 (500) 1 47 (470) 1 * * 60 (600) 1 RTV160 Viscosity (23oC) Pa.s (P) - - Application Rate g/min 180 650 - - - - - - - - - - - - - - Tack Free Time min 240 60 90 15 7 7 5 5 15 10 5 10 5 9 240 7 1.12 1.23 1.10 1.33 1.04 1.63 2.59 1.31 1.31 1.04 1.08 1.64 1.64 1.04 1.04 1.22 Specific Gravity (23oC) - TN3305 37 46 35 45 22 46 80 38 34 16 30 63 63 14 25 28 5.5 (800) 4.5 (650) 2.9 (420) 3.0 (435) 1.8 (260) 2.3 (335) 3.6 (520) 1.5 (220) 2.3 (335) 1.5 (220) 1.7 (245) 3.9 (565) 3.2 (465) 1.5 (220) 1.9 (275) 2.4 (350) 600 250 390 300 330 150 40 170 270 350 210 100 70 400 230 250 1.2 (175) - 2.0 (290) 2.2 (320) 1.2 (175) 1.3 (190) 1.3 (190) 1.0 (145) 1.3 (190) 1.1 (160) 1.3 (190) 1.3 (190) 1.4 (205) 1.0 (145) - 1.2 (175) Hardness Tensile Strength MPa (psi) Elongation % Adhesive Strength MPa (psi) Thermal Conductivity W/m.K - - 0.17 0.34 0.18 0.7 1.3 0.36 0.34 0.18 0.18 0.83 0.83 0.18 - - Volume Resistivity M.m 3.0x107 3.0x107 5.0x107 2.0x106 2.0x106 4.0x107 2.0x107 1.0x107 2.0x106 2.0x107 1.0x107 4.0x106 4.0x106 2.0x107 4.0x106 1.0x105 Dielectric Strength kV/mm 20 20 22 25 23 22 17 22 20 21 20 20 21 26 20 20 2.8 2.8 (100Hz) 3.0 3.1 4.0 2.9 2.6 3.8 3.1 2.9 3.5 4.0 4.0 2.7 2.8 3.1 0.0026 0.001 (100Hz) 0.001 0.02 0.002 0.04 0.005 0.02 0.02 0.005 0.01 0.04 0.04 0.002 0.001 0.05 - - - - 0.01 0.01 0.010 0.028 - - 0.025 0.025 - 0.028 - - UL94 HB UL94 V-0 UL94 V-0 UL94 HB UL94 V-0 UL94 V-0 UL94 HB UL94 V-1 UL94 HB UL94 V-0 * * * * * * * * * * * * * * * Dielectric Constant (60Hz) Dissipation Factor (60Hz) Low Molecular Siloxane (D3-D10) wt% Flame Retardancy UL94 V-0 * Low Volatility Temperature Resistance Thermally Conductive * * * * * * FDA MIL-Spec2 MIL-A-46106B3 * White * * Black Gray Tube * * * * * * * * * * * * * * * * * * * * * * * * * * * * Can * Pail * * JIS K 6249 2Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling. 3MIL-A-46106B Group I Type I 10oC, 30%RH 2 9 30oC, 90%RH 6 30oC, 60%RH 30ooC, 30%RH 10oC, 90%RH 10oC, 60%RH 10 C, 30%RH 12 24 36 48 Cure Time h 60 72 0 24 48 72 96 Cure Time h 120 50oC, 30%RH 10 30oC, 90%RH 30oC, 60%RH 5 0 24 48 72 Cure Time h 30ooC, 30%RH 10oC, 90%RH 10 C, 60%RH 10oC, 30%RH 96 Manifestation of Adhesion 0.4 0.3 0.2 TN 3 0.1 0 im e) 15 3 1 50oC, 90%RH 50oC, 60%RH Adhesion is typicaly achieved after 5-15 hours. Full material properties including electronic performance, is achieved in up to 7 days. 8 E3 S T (A lko xy ) 3 TSE370 (Acetoxy) (O x 4 20 38 5 23oC, 50%RH 5 50oC, 90%RH 50oC, 60%RH 50oC, 30%RH y) 12 6 0 TSE382 (Oxime) 15 2 30oC, 60%RH lko x Condensation cure grades cure with exposure to atmospheric moisture. The cure process begins from the outer surface and proceeds inward. Therefore, deep section curing (in excess of 6mm) is not recommended. Typically, tackfree is achieved in 5-60 minutes at 25oC, 50%RH, depending on the grade. 7 TN3305 (Alkoxy) Cure Depth mm 8 Cure Depth mm Cure Properties: Typical property data values should not be used as specifications (A 1 00 5 See Page 15 for details 13 * Shear Adhesive Strength MPa Packaging Cartridge * * * * Cure Depth mm Color * * Clear TS 1 2 3 4 5 6 7 Cure Time h 8 9 E 10 14 Product Details - 1 Part Condensation Cure Grades Properties TSE398 ECS0600 TN3705 ECS0601 ECS3050S ECC3010 TSE382 TSE3826 Cure Chemistry Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Oxime Oxime Oxime Oxime Oxime Flowable Flowable Flowable Flowable Flowable Non-Flowable Non-Flowable Non-Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Fast cure conformal coating material. Solvent free General purpose paste adhesive. UL certified High temperature resistant paste adhesive General purpose paste adhesive. UL certified UL certified semiflowable adhesive / sealant. General purpose flowable adhesive / sealant. UL certified General purpose flowable adhesive / sealant. UL certified General purpose flowable adhesive / sealant. General purpose flowable adhesive / sealant. * * * * * * * * * * * * 300 (3000) 1 60 (600) 1 10 (100) 1 5.6 (56) 1 - Flowability Flowable Flowable adhesive / sealant. Features and Benefits High-purity electrode Low volatile potting coating material with and coating material fast tack performance. Repairable type High-purity electrode Fast cure conformal coating material coating material. Low with fast tack volatile. Solvent free performance Application Adhesive / Sealant * * * * * * * * 17 (170) 1 5.0 (50) 1 1.5 (15) 1 1.4 (14) 1 0.55 (5.5) 1 0.11 (1.1) 1 Coating Encapsulant / Potting Viscosity (23oC) Pa.s (P) Application Rate g/min Tack Free Time min o Specific Gravity (23 C) - - TSE384-B TSE3840-G TSE3843-W TSE3877-B - - 500 (5000) 1 Oxime TSE387 TSE388 TSE389 FRV1106 Oxime Oxime Oxime Acetoxy Flowable Non-Flowable - - - - - - - - - - - - - - - 88 7 7 7 5 3 10 10 60 30 60 20 90 60 30 20 1.04 1.03 1.01 1.01 0.98 0.99 1.04 1.04 1.46 1.40 1.57 1.08 1.03 1.04 1.04 1.58 14 20 13 25 22 35 28 29 50 31 60 25 25 16 30 42 1.3 (190) 1.2 (175) 0.4 (60) 0.8 (115) - - 1.9 (275) 2.0 (290) 2.9 (421) 2.4 (350) 3.9 (565) 2.0 (290) 2.3 (335) 1.5 (220) 2.0 (290) 3.33 (485) 230 450 130 150 - - 380 400 270 270 130 440 350 330 200 230 0.7 (100) - 0.2 (30) 0.3 (45) - - 1.7 (245) 1.4 (205) 1.4 (203) 1.5 (220) 1.8 (260) 2.0 (290) 1.3 (190) 1.3 (190) 1.8 (260) - 0.18 0.18 - 1.0x107 1.0x107 - Tensile Strength MPa (psi) Elongation % Adhesive Strength MPa (psi) Thermal Conductivity W/m.K 0.18 - 0.18 - - - 0.18 0.18 0.59 0.25 0.67 0.18 0.18 Volume Resistivity M.m 2.0x107 4.0x107 2.0x107 2.0x107 1.0x107 1.0x107 1.0x107 1.0x107 1.0x107 1.0x107 1.0x107 1.0x107 1.0x107 Dielectric Strength kV/mm 23 20 26 20 20 20 23 23 22 22 21 20 20 20 20 13.7 3.0 2.8 2.7 2.6 2.60 2.78 2.9 2.9 4.0 4.0 3.9 3.5 2.9 2.8 2.7 6.3 (1000Hz) 0.01 0.001 0.002 0.002 0.001 0.001 0.004 0.004 0.016 0.02 0.02 0.01 0.004 0.008 0.009 - - 0.01 0.01 0.01 0.01 - - - - - - - - - - - UL94 V-0 UL94 V-0 UL94 V-1 Dielectric Constant (60Hz) Low Molecular Siloxane (D3-D10) * 10 Hardness Dissipation Factor (60Hz) Flowable sealant / Fluorosilicone with high coating material. UL temperature performance. certified Good fuel, oil, moisture, UV, ozone & chemical resistance wt% UL94 HB Flame Retardancy * Low Volatility * * UL94 HB UL94 HB * * Temperature Resistance * * * Thermally Conductive FDA MIL-Spec2 * * White Clear * Color * * * Black * * * * Gray * * * * * * Packaging Cartridge * * * Can * Pail * See Page 15 for details 1 * JIS K 6249 2Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling. * * * * * * * * * Red Tube * * * * * * * * * * * * * * * * * * * * Typical property data values should not be used as specifications Packaging Supplement Grade TN3005 TN3305 TN3705 TSE382 TSE387 TSE389 Tube W C * * * * * Cartridge B W C B Can G W C Pail B W C B * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * W: White, C: Clear, B: Black, G: Gray 15 16 Product Details - 1 Part Condensation Cure Grades Product Details - 1 Part Heat Cure Grades Properties RTV157 RTV159 RTV100 series RTV106 TSE370 RTV116 RTV110 series Cure Chemistry Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Non-Flowable High temperature, high strength, paste adhesive Paste adhesive with High temperature FDA, USDA, NSF, resistant paste and MIL-A-46106B adhesive. FDA, USDA, NSF, MIL-A-46106B Application * Adhesive / Sealant * * Non-Flowable * Non-Flowable Fast tack paste adhesive Flowable Flowable High temperature resistant, Flowable adhesive flowable adhesive. FDA, with FDA, USDA, USDA, NSF, MIL-A-47040, NSF, MIL-A-46106B MIL-A-46106B * * Encapsulant / Potting Viscosity (23oC) Cure Condition - - - - - 25 (250) 1 20 (200) 1 Application Rate g/min 155 175 400 400 - - - Tack Free Time min 45 45 20 20 5 30 20 1.09 1.09 1.05 1.07 1.04 1.09 1.05 o Specific Gravity (23 C) Hardness Tensile Strength MPa (psi) Elongation % Adhesive Strength MPa (psi) Thermal Conductivity W/m.K 20 30 30 22 20 25 2.75 (400) 2.55 (370) 2.5 (365) 2.45 (355) 2.20 (320) 825 350 450 400 530 350 325 1.3 (183) - - 6 1.4 (200) 2 7 7 2 2 2 1.08 1.26 1.27 1.26 1.48 2.10 50 52 45 37 52 62 4.4 (640) 3.7 (535) 3.4 (495) 3.6 (520) 4.9 (710) 3.2 (465) 0.20 0.29 0.29 0.29 0.41 0.88 1.0x107 2.0x107 2.0x107 1.0x107 2.0x107 2.5x106 430 240 230 230 160 110 3.7 (535) 2.6 (375) 2.5 (365) 2.5 (365) 2.0 (290) 2.0 (290) 22 21 4.3 16 16 Dissipation Factor (60Hz) 0.001 0.001 0.006 0.006 0.005 0.002 2.8 2.8 Flame Retardancy 0.001 0.001 0.003 0.001 0.001 - - - - - - 2.0x10 Low Volatility Clear * * * * * Blue MIL-A-46106B3 MIL-A-46106B3 MIL-A-46106B3 MIL-A-46106B3 Tube Color * Thermally Conductive Packaging RTV112 RTV118 Color * * * * Thermally Conductive White * * UL94 HB Temperature Resistance Flame Retardancy * * * Black Gray * * * * * Cartridge Can * Pail * * * * * 1 JIS K 6249 * Aluminum * * * * * * * * * * Typical property data values should not be used as specifications * Packaging * * * * * * * * * * * * * ASTM D 2196S 2Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling 3MIL-A-46106B Group III Type I Typical property data values should not be used as specifications * * * * Cure Properties: The cure performance of 1 Part Heat Cure grades is demonstrated by the relationship between temperature and hardness, and temperature and adhesive strength of TSE322 when placed in an oven at temperatures ranging from 80oC to 150oC. Adhesion & Cure Time - TSE322 Hardness & Cure Time - TSE322 50 150oC 40 30 100oC 120oC 80oC 20 10 0 17 * * RTV109 Can Pail 150/1 3.9 0.0007 1 150/1 25 - Cartridge 150/1 3.1 0.0009 Tube 150/1 20 22 Red 150/1 3.1 3.0 Gray 150/1 * 20 20 RTV103 60 (600) 1 3.2 2.8 Black 50 (500) 1 23 20 RTV108 70 (700) 1 3.1 2.8 Clear 110 (1100) 1 Dielectric Constant (60Hz) 2.6 RTV102 280 (2800) 1 6.0x10 19.7 White 670 (6700) 1 W/m.K kV/mm 2.9 MIL-Spec2 * Thermal Conductivity Dielectric Strength 6 20.7 FDA * MPa (psi) 6 kV/mm * * Adhesive Strength - Dielectric Strength Temperature Resistance * % 0.18 1.1x10 wt% * MPa (psi) - 1.0x10 * Elongation M.m 3.0x10 Flowable Thermally conductive flowable adhesive Tensile Strength Volume Resistivity 7 Flowable High temperature resistant flowable adhesive / sealant C/h 0.7 (100) 7.5x10 Low Molecular Siloxane (D3-D10) o 0.9 (125) M.m Dissipation Factor (60Hz) Pa.s (P) 2.2 (320) 6 Semi-Flowable Flowable adhesive / sealant. UL certified Encapsulant / Potting 1.4 (200) Volume Resistivity Dielectric Constant (60Hz) 3.0x10 2 Non-Flowable Flowable adhesive / sealant Hardness 7.0 (1,025) 3 Semi-Flowable Thixotropic adhesive / sealant Specific Gravity (23 C) 28 TSE3261-G TSE3280-G Paste adhesive / sealant o 6.2 (900) TSE322S Coating * Pa.s (P) TSE322 Non-Flowable Adhesive / Sealant * * Coating Viscosity (23oC) Features and Benefits Application Non-Flowable Flowability TSE3212 Shear Adhesive Strength MPa Features and Benefits Non-Flowable High strength paste adhesive XE13-B3208 Hardness Flowability Properties 1 2 3 4 5 Cure Time h 6 7 8 3 150oC 120oC 100oC 2 1 0 80oC 1 2 3 4 5 Cure Time h 6 7 8 18 Product Details - 1 Part Heat Cure Grades Properties TSE3281-G TSE3221S Flowability Features and Benefits TSE326 TSE326M3 TSE3251 TSE3251-C Application Cure Condition Flowable Flowable Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable High temperature resistant flowable adhesive. UL certified High temperature resistant flowable adhesive Flowable coating material Flowable coating material Flowable potting / coating material Flowable potting / coating material Flowable potting / coating material Low viscosity conformal coating with UV tracer, fast thermal cure & long-term viscosity stability * * * * * * * * * * * * * * 60 (600) 1 58 (580) 1 28 (280) 1 16 (160) 1 8.5 (85) 1 7.0 (70) 1 4.0 (40) 1 3.5 (35) 1 1.3 (13) 1 0.25 (2.5) 2 150/1 150/1 150/1 200/0.5 150/1 150/1 150/1 150/1 150/1 - 2.70 1.03 1.45 1.46 1.02 1.02 1.02 1.02 0.97 1.19 84 28 43 38 16 16 12 20 9 35 4.5 (655) 2.8 (405) 3.4 (495) 2.9 (420) 0.7 (100) 0.7 (100) 0.7 (100) 0.9 (130) - - C/h o Specific Gravity (23 C) Hardness Tensile Strength MPa (psi) Elongation % Adhesive Strength MPa (psi) Thermal Conductivity W/m.K 1.68 0.18 0.41 0.41 0.18 0.18 0.18 Volume Resistivity M.m 4.8x106 6.0x107 2.0x107 2.0x107 2.0x107 2.0x107 2.0x107 Dielectric Strength kV/mm 50 370 170 180 200 200 200 200 - - 2.5 (365) 2.5 (365) 2.0 (290) 1.5 (220) 0.4 (60) 0.4 (60) 0.4 (60) 0.4 (60) 0.1 (15) - 0.18 0.17 - 2.0x107 2.0x107 - 15 23 22 22 20 20 21 21 21 20 Dielectric Constant (60Hz) 5.2 2.8 3.3 3.3 2.8 2.8 2.9 2.9 2.8 2.4 Dissipation Factor (60Hz) 0.002 0.001 0.02 0.02 0.002 0.001 0.001 0.001 0.001 0.01 * * Flame Retardancy UL94 HB * Temperature Resistance * * Thermally Conductive * White * Clear Color * * * * * * * Red Packaging 1 * * Black Gray * Tube Cartridge * Can * Pail JIS K 6249 2 ASTM D2196S * * 3 TSE325M EX in Europe and the Americas. Storage Stability: * * * * * * * Typical property data values should not be used as specifications TSE322 Viscosity and Storage Temperature 400 Viscosity Pa. s Storage under low temperature conditions is important particularly for 1-part heat cure grades to prevent viscosity inrease. o 25 C 300 200 o 5 C 100 1 19 ECC4865 Flowable adhesive / sealant, coating material Encapsulant / Potting Pa.s (P) TSE3250 Flowable Coating o TSE325-B Thermally conductive flowable adhesive Adhesive / Sealant Viscosity (23oC) TSE325 2 3 4 Storage Time months 5 6 20 Product Details - 2 Part Room Temperature Cure Grades Properties RTV577 Components RTV5773 RTV88 RTV883 DBT RTV60 RTV603 DBT RTV566 DBT RTV566(A)3 RTV566(B)3 RTV31 RTV313 RTV11 DBT RTV113 TSE3663 DBT TSE3661 TSE3664K TSE3663(A) TSE3663(B) TSE3661(A) TSE3661(B) TSE3664(A) TSE3664(B) Non-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Features and Benefits Low temperature resistant paste sealant with good release capabilities High temperature resistant, semi-flowable sealant. Good release capabilities High temperature resistant flowable sealant with good release capabilities Low volatile, low out gassing sealant with Low and High temperature performance capability High temperature resistant flowable sealant with good release capabilities Sealant with good release properties. FDA compliance Flowable encapsulant / adhesive Flowable encapsulant / adhesive Flowable encapsulant / adhesive with fast tack free times. UL certified * * * * * 100:2 100:2 100:7.5 Application Flowability Adhesive / Sealant * * * * * 100:0.5 100:0.1 100:0.5 100:0.5 Coating Encapsulant / Potting Mixing Ratio ((A):(B) by weight) 100:0.5 100:0.5 White Color (mixed) o Viscosity (mixed) (23 C) Pa.s (P) Red 700 (7000) 2 Red 880 (8800) 2 Red 47 (470) 2 Red 43 (430) 2 White 25 (250) 2 Off-White 11 (110) 2 1 Off-White 1 Gray 4.0 (40) 4.0 (40) 3.0 (30)1 Pot Life (23 C) h 2 0.75 2 1.5 2 1.5 0.5 0.5 0.1 Cure Condition o 25/24 25/24 25/24 25/24 25/24 25/24 23/72 23/72 23/72 1.35 1.47 1.48 1.49 1.42 1.19 1.19 1.19 1.41 48 58 57 61 54 41 42 42 60 3.0 (440) 5.8 (840) 6.9 (995) 5.5 (795) 5.9 (870) 2.1 (300) 1.4 (205) 1.4 (205) 3.0 (435) 150 120 120 120 170 160 110 110 70 o C/h Specific Gravity (23oC) Hardness Tensile Strength MPa (psi) Elongation % Adhesive Strength MPa (psi) Thermal Conductivity W/m.K Volume Resistivity M.m 5.6x10 2.8x10 4.4x10 2.0x10 1.6x10 Dielectric Strength kV/mm 18.5 17.4 17.7 21.2 17 - - - 3.2 (465) - - 0.9 (130) 0.9 (130) 1.0 (145) 0.31 0.31 0.31 0.31 0.31 0.29 0.27 0.27 0.42 6 6 6 6 6 7 1.1x10 1.0x10 20.3 20 7 7 1.0x10 5.0x107 20 26 Dielectric Constant (60Hz) 3.98 (1kHz) 4.3 (1kHz) 4.0 (1kHz) 3.9 (1kHz) 4.4 (1kHz) 3.3 (1kHz) 3.1 3.1 3.1 Dissipation Factor (60Hz) 0.02 (1kHz) 0.03 (1kHz) 0.02 (1kHz) 0.02 (1kHz) 0.03 (1kHz) 0.006 (1kHz) 0.025 0.025 0.01 UL94 HB UL94 V-0 * * Flame Retardancy * * Low Volatility * Temperature Resistance * * * * FDA * * Can Pail * Kit JIS K 6249 2 * * * ASTM D2196 3Sub-Zero long-term storage required. Cure Speed: The cure speed of 2 Part Condensation Cure grades can be changed by adjusting the amount of the catalyst component. However, the post-cure properties of the material may vary from those achieved under standard mixing ratios, and therefore, adequate testing and confirmation prior to use in an application is required. * * * * * * Typical property data values should not be used as specifications TSE3663 - Mixing Ratios & Viscosity (23oC) 60 100 : 2.5 50 Viscosity Pa.s Packaging 1 * Bottle 100 : 2.0 100 : 1.5 40 30 20 10 0 1 2 Time - h 21 22 Product Details - 2 Part Heat Cure Grades Properties TSE3360 Components XE14-A0425 TSE3380 RTV615 TSE3360(A) TSE3360(B) XE14-A0425(A) XE14-A0425(B) TSE3380(A) TSE3380(B) RTV615(A) Flowability Non-Flowable Features and Benefits General purpose paste adhesive with extended pot life Semi-Flowable Application * TSE3331 TSE3331K EX3 RTV615(B) TSE3032(A) TSE3032(B) TSE3331(A) TSE3331(B) TSE3331KEX(A) TSE3331KEX(B) Flowable Flowable High temperature Thermally conductive Low viscosity encapsulant resistant paste adhesive paste adhesive / potting material with with thermal conductive capability to cure at RT. performance FDA recognition * Adhesive / Sealant Flowable TSE3032 Transparent encapsulant / potting material with good release properties Flowable TSE3431-H XE14-B7892 YE5822 TSE3331K(A) TSE3331K(B) TSE3431(A) TSE3431(B) TSE3431(A) TSE3431(B) XE14-B7892(A) XE14-B7892(B) YE5822(A) Flowable Flowable Flowable Thermally conductive encapsulant / potting material. UL certified Encapsulant / potting material with UL certified, thermal conductivity, and good release properties Encapsulant / potting material with UL certified, thermal conductivity, and good release properties Flowable TSE3033 YE5822(A) TSE3033(A) TSE3033(B) Flowable Flowable Encapsulant / potting Low viscosity transparent Low viscosity material with UL certified, encapsulant / potting transparent low temperature cure, and material. Good encapsulant / potting good release properties release properties material * * * * * * * * * * * * * * 100:100 100:10 100:10 100:100 100:100 100:100 100:10 100:10 100:100 100:10 100:100 Encapsulant / Potting 100:100 100:100 White Reddish Brown Gray Transparent Transparent Gray Dark Gray Dark Gray Black Black Black Transparent Transparent 640 (6400) 1 400 (4000) 1 40 (400) 1 4.0 (40) 2 4.0 (40) 1 3.5 (35) 1 3.0 (30) 1 2.6 (26) 1 2.6 (26) 1 2.6 (26) 1 1.3 (13) 1 1.0 (10) 1 0.9 (9) 1 h 24 24 8 4 4 8 8 8 1.5 1.5 2 4 6 o 150/1 150/1 150/0.5 150/0.25 100/1 120/1 120/1 120/1 100/1 100/1 60/1 100/1 150/0.5 1.12 2.11 2.70 1.02 1.02 1.51 1.43 1.43 1.50 1.52 1.39 0.97 1.01 Color (mixed) Viscosity (mixed) (23oC) Pa.s (P) Pot Life (23oC) Cure Condition TSE3431 * Coating Mixing Ratio ((A):(B) by weight) Flowable Thermally conductive Thermally conductive encapsulant / potting encapsulant / potting material. material. UL certified UL certified TSE3331K 2 C/h Specific Gravity (23oC) 42 65 70 44 35 60 50 45 70 70 60 27 30 5.4 (785) 5.0 (725) 2.5 (365) 6.3 (920) 4.5 (655) 2.9 (420) 3.0 (440) 3.1 (450) 4.9 (710) 4.1 (595) 3.5 (510) 0.4 (58) 1.0 (145) Hardness Tensile Strength MPa (psi) Elongation % Adhesive Strength MPa (psi) Thermal Conductivity W/m.K 0.23 0.80 1.68 0.19 0.17 0.63 0.53 0.53 0.63 0.63 0.44 0.17 0.17 Volume Resistivity M.m 1.0x107 2.0x106 2.1x106 1.8x107 2.0x107 2.0x106 6.0x106 6.0x106 5.0x107 5.0x106 2.0x107 2.0x107 2.0x107 Dielectric Strength kV/mm 380 120 100 120 210 70 100 120 70 60 100 130 130 3.1 (450) 2.9 (420) 1.5 (220) - - 1.3 (190) 1.6 (230) 1.6 (230) - - - - 0.3 (44) 21 26 15 19.7 21 26 22 22 26 27 27 21 21 Dielectric Constant (60Hz) 3.0 3.4 5.7 2.7 (1kHz) 2.8 3.4 3.1 3.1 3.4 3.5 3.1 2.8 2.8 Dissipation Factor (60Hz) 0.001 0.017 0.002 0.0006 (1kHz) 0.001 0.017 0.015 0.015 0.014 0.014 0.01 0.001 0.001 UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 UL94 V-0 * * * * * Flame Retardancy * * Temperature Resistance Thermally Conductive * * FDA * Can * Pail * * * * * * 2 * * ASTM D2196 3Sub-Zero long-term storage required. * * * * * * * * * * * * * * * * * * * * Typical property data values should not be used as specifications Pot Life: 5 Viscosity Pa.s The pot life of a 2 Part Heat Cure grade is affected by changes in viscosity that occur after the components have been mixed. 23oC 3 2 1 10 Viscosity Pa.s TSE3331 Viscosity Change After Mixing 4 0 2 4 Time - h 6 8 TSE3431-H Viscosity Change After Mixing 8 6 Cure Properties: The cure performance of 2 Part Heat Cure grades is demonstrated by the relationship between temperature and hardness of TSE3380 when placed in an oven at temperatures ranging from 100oC to 150oC. Hardness & Cure Time - TSE3380 80 150oC 70 120oC 100oC 60 50 30 60 Cure Time - min 90 120 23oC 4 2 0 23 * * * Kit JIS K 6249 * * Hardness Packaging 1 * Bottle 0.5 1 Time - h 1.5 2 24 Product Details - 1 Part Gels Properties TSE3051 Flowability Pa.s (P) Cure Condition o C/h Specific Gravity (23oC) Penetration TSE3051-FR TSE3051-L TSE3053 Properties Components Flowable Flowable Flowable Flowable Low viscosity Low viscosity, UL certified Low viscosity, low penetration Low viscosity, high penetration Features and Benefits Viscosity (23oC) Product Details - 2 Part Gels 0.7 (7) 1 0.7 (7) 1 0.7 (7) 1 0.7 (7) 1 125/2 150/1 125/2 125/2 0.97 0.97 0.97 0.97 85 85 65 105 0.17 0.17 0.17 0.17 Thermal Conductivity W/m.K Volume Resistivity M.m 1.0x10 5.0x10 1.0x107 1.0x107 Dielectric Strength kV/mm 18 18 18 18 Dielectric Constant (60Hz) 2.8 2.8 2.8 2.8 Dissipation Factor (60Hz) 0.001 0.001 0.001 0.001 7 UL94 V-1 Flame Retardancy Color Transparent * Gray Pkg 1kg can See below matrix 15kg can JIS K 6249 1kg bottle 15kg can 20kg pail * * Typical property data values should not be used as specifications TSE3051 4kg can * W C * * * * TSE3070 RTV6136-D1 TSE3062(A) TSE3062(B) TSE3070(A) TSE3070(B) RTV6126(A) RTV6126(B) Flowability Flowable Features and Benefits Low temperature cure Mixing Ratio ((A):(B) by weight) Color (mixed) Flowable Flowable High elongation gel Fast cure, low viscosity 100:100 100:100 100:100 Transparent Transparent Transparent 1.0 (10)1 0.8 (8)1 0.75 (7.5)2 Viscosity (mixed) (23oC) Pa.s (P) Pot Life (23oC) h 1 4 0.5 o 70/0.5 70/0.5 100/0.3 0.97 0.97 0.98 55 65 60 Cure Condition C/h Specific Gravity (23oC) Penetration Thermal Conductivity W/m.K 0.17 0.17 0.19 Volume Resistivity M.m 1.0x107 1.0x107 1.0x107 Dielectric Strength kV/mm 18 18 20.5 Dielectric Constant (60Hz) 2.7 2.7 2.8 (1kHz) Dissipation Factor (60Hz) 0.001 0.001 0.001 (1kHz) Package * * White 1 7 TSE3062 * * Bottle Can * * * Pail * 1 JIS K 6249 2ASTM D2196 Typical property data values should not be used as specifications G * * * * * * * W: White, C: Clear, G: Gray 25 26 Product Details - 1 Part JCR Grades Properties Flowability Features and Benefits Property o Viscosity (23 C) Pa.s (P) TSJ3155 TSJ3195-W TSJ3185 Semi-Flowable Semi-Flowable Semi-Flowable Thixotropic JCR rubber. Low post-cure hardness contributes to stress relief of critical components Low viscosity JCR gel. Provides stress and vibration relief performance Thixotropic JCR gel. Provides stress and vibration relief performance Rubber Gel Gel 1 Cure Condition 1 1 6 (60) 4 (40) 3 (30) White White Translucent 150/4 150/4 150/4 1.02 1.00 1.01 11 - - - 80 80 Color o Product Details - Grease C/h Specific Gravity (23oC) Hardness Penetration 0.18 0.18 Properties TSK5303 TSK5370 TSK550 Features and Benefits White 1.03 330 270 2.8 1.5 oil separation applications Green White White White White 1.03 2.45 2.45 2.30 2.50 220 220 310 290 300 340 1.5 1.0 0.4 0.0 0.5 0.1 0.2 0.2 0.2 0.3 0.1 0.4 0.1 0.1 - - - 0.84 0.84 0.84 1.00 Volume Resistivity M.m - 1.0x105 2.0x107 2.0x107 2.0x106 2.0x106 2.0x107 3.0x106 Dielectric Constant (60Hz) 5.0 2.5 2.8 2.8 5.0 5.0 5.0 5.0 Dissipation Factor (60Hz) 0.005 0.0001 0.0002 0.0002 0.006 0.006 0.005 0.006 0.0015 0.01 - - 0.01 0.003 0.003 0.003 - - 120< 120< - - - - * * * * * * * * * * * * * * * * * * * * 1.0x10 1.0x10 1.0x10 20 15 15 Arc Resistance1 Low Volatility Low Molecular Siloxane (D3-D10) wt% Dielectric Constant (60Hz) 2.8 2.8 2.7 Dissipation Factor (60Hz) 0.0004 0.0004 0.001 <2 <2 <2 Thermally Conductive * * * Low Bleed Temperature Resistance Typical property data values should not be used as specifications Packaging JIS K 6249 oil separation 0.84 kV/mm 1 oil separation W/m.K Dielectric Strength Pkg: 500g bottle moisture & contaminants moisture & contaminants Thermal Conductivity M.m ppm heat dissipation. Low heat dissipation. Low heat dissipation. Low to high heat dissipation - Evaporation (150 C, 24h) % 7 compound for medium compound for medium compound for medium compound for medium White o 0.18 contact insulation 2.34 % TIG1000 protection against White Bleed (150oC, 24h) YG6260 contact insulation Specific Gravity Penetration YG6240 protection against Color Volume Resistivity Na+K+ heat dissipation. Heat & sealing with swell resistant YG6111 Compound for electrical Compound for electrical Thermally conductive Thermally conductive Thermally conductive Thermally conductive performance Thermal Conductivity 7 Compound for electrical insulation resistance W/m.K 7 Thermally conductive compound for medium TSK551 1 s * Bottle Can Pail ASTM D-495 * * * * * * * Typical property data values should not be used as specifications Product Details - 2 Part JCR Grades Properties XE14-B5778 Components XE14-B5778(A) XE14-B5778(B) TSJ3175(A) TSJ3175(B) Flowability Features and Benefits Property Mixing Ratio ((A):(B) by weight) TSJ3175 Semi-Flowable Semi-Flowable Flow-controllable JCR rubber. Thixotropic JCR gel. Soft gel property contributes to stress and vibration relief Rubber Gel 100:100 100:100 Translucent Color (mixed) o Viscosity (mixed) (23 C) Pa.s (P) 1 Black 14 (140) 17 (170)1 Pot Life (23 C) h 8 12 Cure Condition o 80/2 125/2 1.02 1.01 16 - o C/h Specific Gravity (23oC) Hardness - 70 Thermal Conductivity W/m.K 0.17 0.18 Volume Resistivity M.m 2.0x105 1.0x107 Dielectric Strength kV/mm 24 15 Penetration Dielectric Constant (60Hz) 2.7 2.7 Dissipation Factor (60Hz) 0.001 0.001 <2 <2 Na+K+ Pkg: 500g bottle ppm * * * * 1 JIS K 6249 Typical property data values should not be used as specifications 27 28 UL Certifications Type source: Underwriters Laboratories Inc. Grade Color Thickness mm ECS0601 Black Clear White 1.5 TN3085 RTV160 RTV167 TSE382 TSE3840-G TSE3843-W TSE384-B TSE3853-W TSE3854DS TSE389 TSE3944 105 HB - - Gray 0.2 105 105 V-0 - - Gray 3.0 105 105 V-0 - - Gray 1.0 105 105 V-1 0 0 Gray 3.0 105 105 V-0 0 0 White 1.0 105 105 V-1 2 0 White 3.0 105 105 V-0 1 0 Black 0.71 105 105 V-1 3 0 Black 1.6 105 105 V-1 2 0 Black 3.4 105 105 V-0 1 0 White 0.75 105 105 HB 4 0 White 1.5 105 105 HB 3 0 White 2.5 105 105 HB 3 0 White 3.0 105 105 HB - - Gray 0.83 105 105 HB 3 0 Gray 1.5 105 105 HB 2 0 Gray 2.6 105 105 HB 2 0 Clear White 0.75 105 105 HB 4 0 Clear White 1.5 105 105 HB 3 0 Clear White 1.9 150 140 HB 3 0 Clear White 3.0 150 140 HB 3 0 Red 2.0 200 200 - - - Red 3.0 200 200 - - - File No. Type Grade E56745 E56745 0 4 0 E56745 0 0 1 3 3 5 0 0 0 TSE3976-B XE11-A5133S XE11-B5320 TSE3051-FR E36952 TSE322S N TSE326 E36952 TSE3331 0 5 0 E36952 TSE3331K 0 4 0 TSE3331K EX E56745 TSE3431 E56745 2 Part 1 Part Condenstaion Cure TSE3826 105 HWI HAI HVTR D495 CTI (PLC) (PLC) (PLC) (PLC) (PLC) 1 Part Heat Cure RTV133 Elec. Mech. Flame Class 1 P Cond Cure ECS0609FR RTI RTI Color Thickness mm Black 0.64 105 105 HB - - Black 1.5 105 105 HB - - Black 3.0 105 105 HB - - White 3.0 105 105 V-1 - - White 1.5 105 105 HB - - White 3.0 105 105 HB - - Clear 2.7-3.3 105 105 V-1 - - NC 1.0 105 105 HB - - NC 1.5 105 105 HB - - NC 3.0 105 105 HB - - Elec. Mech. Flame Class HWI HAI HVTR D495 CTI File No. (PLC) (PLC) (PLC) (PLC) (PLC) E56745 E56745 E56745 E56745 E56745 Red 1.0 105 105 HB - - Red 3.0 105 105 HB - - Black 1.0 105 105 V-0 - - Black 1.6 105 105 V-0 2 0 Black 2.0 105 105 V-0 - - Black 3.0 105 105 V-0 0 0 Black 2.5 105 105 V-0 - - Black 3.0 105 105 V-0 - - Black 2.5 105 105 V-0 - - Black 3.0 105 105 V-0 - - Gray 2.0 105 105 V-1 - - Gray 4.0 105 105 V-0 - - Gray 1.0 105 105 V-0 0 0 Gray 1.5 105 105 V-0 - - Gray 2.5 105 105 V-0 0 0 E56745 105 105 V-0 - - 1.5 105 105 V-0 0 0 Gray 3.0 105 105 V-0 0 0 Gray 3.0 105 105 V-0 - - White 1.1 105 105 V-1 - - Gray 1.0 105 105 V-1 - - Gray 2.0 105 105 V-0 - - Gray 3.0 105 105 V-0 0 0 Black 2.0 105 105 V-1 - - Black 3.0 105 105 V-0 - - All 1.0 105 105 HB 4 0 All 3.0 105 105 HB 3 0 White 1.5 105 105 V-1 0 0 White 1.9 150 140 V-1 - - White 2.5 150 140 V-1 - - White 3.0 150 140 V-1 - - Black 1.2 105 105 V-0 0 0 Black 1.9 150 140 V-0 - - Black 3.0 150 140 V-0 - - White 1.5 105 105 V-0 0 3 White 3.0 105 105 V-0 0 3 Gray 0.75 105 105 V-0 0 0 Gray 1.5 105 105 V-0 0 0 Gray 3.0 105 105 V-0 0 0 White 1.5 105 105 V-0 0 3 White 3.0 105 105 V-0 0 3 Clear White Black 1.5 105 105 HB - - Clear White Black 3.0 105 105 HB - - Gray 0.75 105 105 V-0 - - White 0.75 105 105 V-1 - - Gray White 1.5 105 105 V-0 0 0 Gray White 3.0 105 105 V-0 0 0 E56745 TSE3431-H TSE3664K 0 1 1 E56745 XE14-B7892 0 3 1 E56745 TSE3661 HWI 0 0 3 3 0 0 E56745 E56745 Resistance to ignition Mean Ignition w h e n e x p o s e d t o Time (sec) h i g h t e m p e r a t u re s . 120 Expressed as the m e a n n u m b e r o f 60 - 119 30 - 59 seconds required to 15 - 29 ignite a specimen 7 14 when wrapped with an <7 energized ni-chrome resistive wire that dissipates a specified level of energy. HAI Ability to withstand PLC e l e c t r i c a l a r c i n g . Expressed as the 0 number of arc rupture 1 exposures required to 2 ignite a specimen when 3 the arc occurs directly 4 on the surface or a 5 specified distance above the test specimen. Mean No. of Arcs PLC 120 0 60 - 119 1 30 - 59 2 15 - 29 3 <15 4 E56745 E56745 0.75 0 0 E56745 Gray 2 0 E56745 Gray 0 0 0 1 1 E56745 E56745 E56745 0 HVTR D495 Expressed as the rate HVTR Range E x p r e s s e d a s t h e Arc Resistance (inches per minute) that (in mm/min) PLC number of seconds that (sec) PLC a tracking path can a material resists the 0 - 10 420 0 0 formation of a surfacebe produced on the surface of the material 10.1 - 25.4 1 c o n d u c t i n g p a t h 360 - 419 1 25.5 80 300 359 2 2 under standardized test subjected to an 80.1 - 150 3 when conditions. intermittently occurring 240 - 299 3 >150 4 arc of high voltage, low 180 - 239 4 120 - 179 5 current characteristics. 60 - 119 <60 6 7 E56745 CTI E x p r e s s e d a s t h a t Tracking Index voltage which causes (volts) PLC tracking after 50 drops 600 0 of 0.1% ammonium chloride solution have 400 -599 1 250 399 2 fallen on the material. 175 - 249 100 - 174 <100 3 4 5 E56745 0 3 0 E56745 RTI: Relative Temperature Index PLC: Performance Level Category HWI: Hot Wire Ignition HAI: High-Current Arc Ignition HVTR: High-Voltage Arc Tracking Rate D495: D495 High-Voltage Dry Arc Resistance CTI: Comparative Tracking Index 29 30 Shear Adhesion Test Method Typical Adhesion Performance Typical Heat Resistance substrate 1-Part Condensation Cure Adhesive (Alkoxy Type) Condensation Cure Grades Substrate Primerless ME121 ABS * * * * * * * * * * * * * * * * * * * * Polypropylene x x * Polyethylene x x Copper Steel Metals Brass Stainless Steel Aluminum Galvanized Steel Tin Acrylic Resin Phenol Resin Epoxy Resin * * * * * * * PrimerME123 XP80-A5363 less * Soft Polyvinyl Chloride Rigid Polyvinyl Chloride Polyester Film Plastic Unsaturated Polyester Polyamide Nylon 66 PBT PPS ME123 1 1 1 1 * 2 Polycarbonate ME121 XP80-A5363 PrimerME121 ME123 / YP9341 less * * * * * * * * * * * * * * * * Oxime 1 1 * * * * x * * * * * * 2 * * * * * * * * 2 * * * * * x * * * * * * * * * * * * * * * * * * * * * * * * * x x x x x x x x x * * * * * x x Rubber Fluorocarbon Resin x x x x x x * * * Nitrile Rubber * * * * Chloroprene Rubber Styrene Butadiene Rubber Ethylene Propylene Rubber * * * * * * * * * Inorganic Glass Ceramic * * * * * * * * * * * * * * May corrode under some usage conditions, C JIS Method 25mm 10mm 1mm 10mm/min. ASTM Method 1" 0.5" 1"/min. 50 40 30 20 10 0 -10 * ME121 Yellow Yellow Yellow Transparent Transparent Transparent Transparent Appearance * 4 Typical Electrical Performance Dielectric Strength Test Method: Equipment: Dielectric voltage gauge Voltage Rise: 1kV/s Terminal Gap: 1mm (JIS C 2110) * * * * * Yellow Clear Colorless Yellow General ME153 XP81-B0016 SS4120 Yellow Yellow Transparent Transparent Clear Colorless SS4155 Blue Plastic, Rubber Plastic, Rubber Polylefins Metals Metals Plastic Metals, Glass, Plastic, Ceramic Plastic Metals, Glass - - Specific Gravity (23OC) 0.85 0.86 0.89 0.88 0.85 0.85 0.98 0.87 0.83 0.71 0.82 0.82 15% 15% 8% 7% 15% 15% 6% 24% 15% 7.5% 3% 10% 30 30 30 20 30 30 15 30 30 30 30 30 Toluene IPA Toluene IPA n-hexane Ethanol Methanol Mineral Spirits Solvents min Acetone Toluene IPA Acetone Toluene IPA Butyl Acetate Toluene Acetone Acetone Ethyl Xylene Xylene Acetate N-butanol N-butanol Toluene IPA IPA Methanol Conditions Initial 1 Day Metals, Glass, Plastic Non-Volatile Content 1mm 12.5mm adhesive Electrical Performance of Cured Material Substrates Drying Time (23OC) 31 Pink ME151 360 3 Addition Cure ME123 YP9341 XP80-A5363 SS4004P SS4044P SS4179 14 30 90 180 Elapsed Time days * TSE3843-W Substrate 7 3 Stress cracking may occur under some usage conditions, 3 YP9341, 4 XP80-A5363 Condensation Cure 20oC 150oC 200oC 40 20 0 -20 -40 20 0 -20 -40 -60 -80 from surface when pulled, x Does not adhere * Adheres completely, Adheres, but separates 2 1 B Typical Chemical Resistance 2 * A: B: C: Pull Rate: 1 * * * * * adhesive 1 Silicone Resin Laminate Silicone A Acetoxy Elongation Chng. Adhesion Chng. Hardness Chng. % % Alkoxy Volume Resistivity M.m Dielectric Strength kV/mm 40OC, 95%RH 25OC Immersed 40OC, 95%RH 25OC Immersed 1.6x107 1.6x107 29 29 6 2.2x106 27 25 6 6 2.9x10 2 Days 2.5x10 3.6x10 29 22 3 Days 2.7x106 1.9x106 24 23 32 Other Electronic Solutions from Momentive Performance Materials Thermal Management Silicones for Electronics Frequently Asked Questions What does RTV mean? RTV stands for Room Temperature Vulcanization (cure). Despite the low-temperature connotations conveyed by this name, RTV silicones consist of both Room Temperture Cure and Heat Cure grades. What is the cure mechanism of a condensation cure product? Provides detailed information on silicone materials used for thermal management applications in electronics and micro-electronics. Includes SilCool* grease & adhesives, and conventional grades for adhesion, encapsulation and potting. Condensation cure silicone products cure when exposed to atmospheric moisture. Moisture in the air is generally required to cure (or vulcanize) condensation cure products. The cure process begins from the outer surface, and therefore time is required for complete cure. The cure time is affected by the reaction mechanism and viscosity of the material. Generally, at 25C and 50%RH, condensation cure RTV silicones cure through in 24 to 48 hours. Full physical properties may take up to 7 days to develop. What is the depth (bead thickness) limit for a condensation cure grade? Silicone Material Solutions for LED Packages and Assemblies For 1-part, condensation cure products, the depth (bead thickness) limitation is approximately 6mm (1/4"). For 2-part, condensation cure products, the depth (bead thickness) limitation is approximately 25mm (1"). Can I accelerate the cure time of a 1-part product? Provides opto-electronic solutions for LED Packages and Assemblies. Includes InvisiSil* LED encapsulants, Glob Top, Lens fabrication materials, Die Attach adhesives, and Dot Matrix assembly materials. Condensation cure silicone cure rates depend on humidity, silicone thickness, and to a smaller degree heat. Increasing the relative humidity around the silicone or reducing the thickness of the material will reduce the time to cure the material. Increased heat (not over 50C) will somewhat reduce cure time but as mentioned will do so to a much smaller degree than humidity or thickness. What is the cure mechanism of an addition cure product? Addition cure silicone RTV products may be 1 or 2-part and cure when exposed to heat. Although some heat cure products can cure at room temperature, higher heat greatly accelerates the cure. 1-part heat cure products typically have an inhibitor in the formulation that stops the product from curing until an activation temperature, greater than room temperature, is achieved and the inhibitor is driven off and the cure reaction is allowed to proceed. What does "tack free time" mean? Tack free refers to the amount of time it takes for a condensation cure silicone product to form a cured outer layer (the cured outer layer is not tacky like uncured material). What is "mix ratio"? Mix ratio is a term used to state the amount of each material to be in a multi-component material. The mix ratios for 2-part products are described on the individual product data sheets and are given as a ratio by weight of each material. What does "pot life" or "work life" mean? The amount of time after a 2-part grade is mixed with its curing agent that it will remain useful or pliable. How do I remove silicone? Before it is cured: use a putty knife to remove any of the uncured paste. Wipe the area clean with isopropyl alcohol to remove any leftover residue. After it is cured: First mechanically remove as much of the silicone as you can with either a knife or a razor. A solvent (mineral spirits, toluene, xylene, acetone) can them be used to remove any oily residue or any remaining silicone, It may be necessary to soak the silicone in a solvent overnight to break it down. Can I thin a silicone? Silicone can be thinned using a solvent in which the silicone is miscible, generally an aromatic solvent such as toluene or xylene. As always, be sure to follow the producer's instructions when using solvent products and always use in a well-ventilated area. The shrinkage of the silicone and the cure time will increase with the addition of solvent. Alternative suggestions would include non- reactive fluids or an RTV with a lower viscosity. Dispensing Equipment Examples What can I do to improve the adhesion of the silicone adhesive to my parts? The first step to good adhesion is to have clean surfaces for the silicone to bond to. For difficultto-bond-substrates, Momentive Performance Materials offers a number of primers that can be used to improve and maximize adhesion. How do I ensure that air is removed from 2-part grades? If you are hand mixing, air may become added to the material during the mixing process. Vacuum de-airing is most effective in removing air prior to use. Automated mixing equipment that utilizes a static mixer can eliminate the need to de-air prior to dispensing. Tube Type Dispensing Unit On complex high-density electronics, air can sometimes be trapped under components during the potting process. Where this is a concern, potting under vacuum or vacuum de-airing after potting can remove the trapped air. An alternate approach may be to use a grade with a low viscosity and longer potlife and to cure at lower temperatures (if heat-cure grade), allowing entrapped air to escape prior to the cure of the material. Cartridge Type Dispensing Unit What is cure inhibition, and how do I prevent it? Cure inhibition is a phenomenon that may be observed in additioncure grades. These materials use a platinum catalyst to drive the curing reaction. Surfaces containing water, sulphur, nitrogen compounds, organic metal compounds, or phosphate compounds, may inhibit cure. Cartridge Air-Gun Dispensing Unit Cure inhibition is characterized by a gummy or sticky appearance of the silicone at the interface between the silicone and offending substrate. Inhibition can be prevented by application of a barrier coat, cleaning of the offending material prior to application of the silicone material, replacing the offending material with a suitable alternative, or selection of a condensation cure grade. 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Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers' Standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affiliates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right. Technical subject matter in this publication is described and protected by one or more of the following U.S. Patents and their foreign counterpart patents and/or patent applications: U.S. Patent Nos. 7,411,007; 7,388,049; 7,387,784; 7,381,769; 7,374,771; 7,241,835; 7,217,777; 6,759,479; 6,538,061; 6,531,540; 6,475,568; 6,444,745; 6,291,563; 6,207,782; 5,981,681; and 5,807,956. Other U.S. and foreign patents and/or patent applications not listed covering the subject matter may be relevant. *SilCool and InvisiSil are trademarks of Momentive Performance Materials Inc. The Momentive logo is a trademark of Momentive Performance Materials Holdings LLC. 22 Corporate Woods Boulevard Albany, NY 12211 USA +1 800 295 2392 +1 607 786 8131 momentive.com Copyright 2011 Momentive Performance Materials Inc. All rights reserved. MPM 131-155-00E-GL