ATSAMB11XR/ZR Ultra-Low Power Bluetooth(R) Low Energy SiP/Module Introduction The ATSAMB11-XR2100A is an ultra-low power Bluetooth Low Energy (BLE) 4.2 System in a Package (SiP) with Integrated MCU, transceiver, modem, MAC, PA, Transmit/Receive (T/R) switch, and Power (R) Management Unit (PMU). It is a standalone Cortex -M0 applications processor with embedded Flash memory and BLE connectivity. The Bluetooth SIG-qualified Bluetooth Low Energy protocol stack is stored in a dedicated ROM. The firmware includes L2CAP service layer protocols, Security Manager, Attribute protocol (ATT), Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). Additionally, example applications are available for application profiles such as proximity, thermometer, heart rate and blood pressure, and many others. The ATSAMB11-XR2100A provides a compact footprint and various embedded features, such as a 26 MHz crystal oscillator. The ATSAMB11-ZR210CA is a fully certified module that contains the ATSAMB11-XR2100A and all external RF circuitry required, including a ceramic high-gain antenna. The user simply places the module into their PCB and provides power with a 32.768 kHz Real-Time Clock (RTC) or crystal, and an I/O path. Microchip BluSDK Smart offers a comprehensive set of tools and reference applications for several Bluetooth SIG defined profiles and a custom profile. The BluSDK Smart will help the user quickly evaluate, design and develop BLE products with the ATSAMB11-XR2100A and ATSAMB11-ZR210CA. The ATSAMB11-XR2100A and associated ATSAMB11-ZR210CA module have passed the Bluetooth SIG certification for interoperability with the Bluetooth Low Energy 4.2 specification. Features * * * 2.4 GHz Transceiver and Modem: - -92.5 dBm receiver sensitivity - -55 dBm to +3.5 dBm programmable TX output power - Integrated T/R switch - Single wire antenna connection (ATSAMB11-XR2100A) - Incorporated chip antenna (ATSAMB11-ZR210CA) Processor Features: (R) (R) - ARM Cortex -M0 32-bit processor - Serial Wire Debug (SWD) interface - Four-channel Direct Memory Access (DMA) controller - Watchdog timer Memory: (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 1 ATSAMB11XR/ZR * * * * * * * - 128 KB embedded Random Access Memory (RAM) - 128 KB embedded ROM - 256 KB stacked Flash memory Hardware Security Accelerators: - Advanced Encryption Standard (AES)-128 - Secure Hash Algorithm (SHA)-256 Peripherals: - 23 digital and 4 mixed-signal General Purpose Input Outputs (GPIOs) with 96 kOhm internal programmable pull-up or down resistors and retention capability, and one wake-up GPIO with 96 kOhm internal pull-up resistor - Two Serial Peripheral Interface (SPI) Master/Slave - Two Inter-Integrated Circuit (I2C) Master/Slave - Two UART - One SPI flash interface (used for accessing the internal stacked flash) - Three-axis quadrature decoder - Four Pulse Width Modulation (PWM) channels - Three General Purpose Timers and one Always-On (AON) sleep Timer - 4-channel, 11-bit Analog-to-Digital Converter (ADC) Clock: - Integrated 26 MHz RC oscillator - Integrated 2 MHz RC oscillator - 26 MHz crystal oscillator (XO) - 32.768 kHz Real Time Clock crystal oscillator (RTC XO) Ultra-Low Power: - 2.03 A sleep current - 4.17 mA peak TX current (1) - 5.26 mA peak RX current - 16.4 A average advertisement current (three channels, 1s interval) (2) Integrated Power Management: - 2.3V to 4.3V battery voltage range - 2.3V to 3.6V input range for I/O (limited by Flash memory) - Fully integrated Buck DC/DC converter Temperature Range: - -40C to 85C Package: - 49-pin FLGA SiP package 5.50 mm x 4.50 mm - 35-pin module package 10.541 mm x 7.503 mm Note: 1. TX output power - 0 dBm. 2. Advertisement channels - 3 ; Advertising interval - 1 second ; Advertising event type - Connectable undirected; Advertisement data payload size - 31 octets. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 2 Table of Contents Introduction......................................................................................................................1 Features.......................................................................................................................... 1 1. Ordering Information..................................................................................................7 2. Package Information..................................................................................................8 3. Block Diagram........................................................................................................... 9 4. Pinout Information................................................................................................... 10 5. Device States.......................................................................................................... 15 5.1. 5.2. 5.3. Description of Device States...................................................................................................... 15 Power Sequences...................................................................................................................... 15 Digital and Mixed-Signal I/O Pin Behavior during Power-Up Sequences.................................. 16 6. Processor Architecture............................................................................................ 18 6.1. 6.2. 6.3. ARM Subsystem.........................................................................................................................18 Cortex M0 Peripherals................................................................................................................19 Nested Vector Interrupt Controller..............................................................................................20 7. Memory Subsystem.................................................................................................23 7.1. 7.2. 7.3. 7.4. Shared Instruction and Data Memory.........................................................................................23 ROM........................................................................................................................................... 23 BLE Retention Memory.............................................................................................................. 23 Non-Volatile Memory.................................................................................................................. 23 8. Bluetooth Low Energy Subsystem...........................................................................26 8.1. 8.2. 8.3. 8.4. BLE Core....................................................................................................................................26 Features..................................................................................................................................... 26 BLE Radio.................................................................................................................................. 26 Microchip BluSDK Smart............................................................................................................27 9. Clocking...................................................................................................................28 9.1. Overview.................................................................................................................................... 28 9.2. 9.3. 9.4. 9.5. 9.6. 9.7. 9.8. 9.9. 26 MHz Crystal Oscillator (XO).................................................................................................. 28 32.768 kHz RTC Crystal Oscillator (RTC XO)............................................................................29 2 MHz Integrated RC Oscillator..................................................................................................33 Clock Settings for Critical Sections............................................................................................ 34 Peripheral Clock Configuration...................................................................................................35 AON Sleep Timer Clock Configuration....................................................................................... 35 Register Summary......................................................................................................................36 Register Description................................................................................................................... 36 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 3 ATSAMB11XR/ZR 10. I/O Peripheral Multiplexing and MEGAMUXing....................................................... 52 10.1. 10.2. 10.3. 10.4. I/O Multiplexing...........................................................................................................................52 MEGAMUXing............................................................................................................................ 54 Register Summary .....................................................................................................................56 Register Description .................................................................................................................. 57 11. Muxable Interrupt.....................................................................................................71 11.1. Example..................................................................................................................................... 72 11.2. Register Summary......................................................................................................................72 11.3. Register Description................................................................................................................... 72 12. GPIO Pin Controller.................................................................................................79 12.1. Features..................................................................................................................................... 79 12.2. Signal Description...................................................................................................................... 79 12.3. I/O Lines..................................................................................................................................... 79 12.4. Clock Configuration.................................................................................................................... 80 12.5. Functional Description of LP_GPIO_x I/O Pins..........................................................................80 12.6. Functional Description of GPIO_MSy I/O Pins...........................................................................82 12.7. Functional Description of AO_GPIO_z I/O Pins......................................................................... 83 12.8. External Interrupt........................................................................................................................86 12.9. Power Management................................................................................................................... 87 12.10. Register Summary..................................................................................................................... 87 12.11. Register Description................................................................................................................... 89 13. Always-On (AON) Sleep Timer..............................................................................107 13.1. 13.2. 13.3. 13.4. 13.5. 13.6. 13.7. 13.8. Features................................................................................................................................... 107 Clock Configuration.................................................................................................................. 107 Functional Description..............................................................................................................107 Restart the Running AON Sleep Timer.................................................................................... 108 Wake-up Source.......................................................................................................................108 Power Management................................................................................................................. 108 Register Summary....................................................................................................................108 Register Description................................................................................................................. 109 14. Pulse Width Modulation......................................................................................... 115 14.1. 14.2. 14.3. 14.4. 14.5. 14.6. Features................................................................................................................................... 115 Clock Configuration.................................................................................................................. 115 Functional Description.............................................................................................................. 115 Power Management................................................................................................................. 120 Register Summary....................................................................................................................121 Register Description................................................................................................................. 122 15. I2C Interface.......................................................................................................... 126 15.1. 15.2. 15.3. 15.4. Features................................................................................................................................... 126 Principal of Operation...............................................................................................................126 Clock Configuration.................................................................................................................. 127 Functional Description..............................................................................................................128 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 4 ATSAMB11XR/ZR 15.5. Power Management................................................................................................................. 129 15.6. Register Summary....................................................................................................................129 15.7. Register Description................................................................................................................. 131 16. Peripherals............................................................................................................ 146 16.1. Timer........................................................................................................................................ 146 16.2. Dual Timer................................................................................................................................146 16.3. Watchdog Timer....................................................................................................................... 146 16.4. SPI Controller........................................................................................................................... 146 16.5. SPI-Flash Controller................................................................................................................. 147 16.6. UART Interface.........................................................................................................................147 16.7. DMA Controller.........................................................................................................................148 16.8. Analog to Digital Converter...................................................................................................... 149 16.9. Three-axis Quadrature Decoder...............................................................................................150 16.10. Clock Output............................................................................................................................ 151 17. Electrical Characteristics....................................................................................... 152 17.1. 17.2. 17.3. 17.4. 17.5. 17.6. 17.7. 17.8. 17.9. Absolute Maximum Ratings......................................................................................................152 Recommended Operating Conditions...................................................................................... 152 DC Characteristics................................................................................................................... 152 Receiver Performance..............................................................................................................153 Transmitter Performance..........................................................................................................154 Current Consumption in Various Device States....................................................................... 155 ADC Characteristics................................................................................................................. 156 ADC Typical Characteristics.....................................................................................................157 Timing Characteristics.............................................................................................................. 160 18. Package Outline Drawings.................................................................................... 166 18.1. Package Outline Drawing.........................................................................................................166 18.2. Module PCB Package Outline Drawing....................................................................................168 19. Module Reference Schematics..............................................................................170 19.1. 19.2. 19.3. 19.4. Reference Schematic............................................................................................................... 170 Reference Schematic Bill of Materials (BOM).......................................................................... 170 Reference Schematic............................................................................................................... 172 Reference Bill of Materials(BOM).............................................................................................172 20. ATSAMB11-XR2100A Design Considerations.......................................................174 20.1. Layout Recommendation......................................................................................................... 174 20.2. SWD Interface.......................................................................................................................... 175 20.3. Unused or Unconnected Pins...................................................................................................177 21. ATSAMB11-ZR210CA Design Considerations...................................................... 178 21.1. Placement and Routing Guidelines.......................................................................................... 178 21.2. Interferers................................................................................................................................. 180 22. Reflow Profile Information..................................................................................... 181 22.1. Storage Condition.....................................................................................................................181 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 5 ATSAMB11XR/ZR 22.2. 22.3. 22.4. 22.5. Stencil Design.......................................................................................................................... 181 Soldering and Reflow Conditions............................................................................................. 181 Baking Conditions.................................................................................................................... 181 Module Assembly Considerations............................................................................................ 182 23. Regulatory Approval.............................................................................................. 183 23.1. 23.2. 23.3. 23.4. United States............................................................................................................................183 Canada.....................................................................................................................................184 Europe......................................................................................................................................186 Other Regulatory Information................................................................................................... 187 24. Reference Documents and Support...................................................................... 188 24.1. Reference Documents..............................................................................................................188 25. Document Revision History................................................................................... 189 The Microchip Web Site.............................................................................................. 190 Customer Change Notification Service........................................................................190 Customer Support....................................................................................................... 190 Microchip Devices Code Protection Feature............................................................... 190 Legal Notice.................................................................................................................191 Trademarks................................................................................................................. 191 Quality Management System Certified by DNV...........................................................192 Worldwide Sales and Service......................................................................................193 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 6 ATSAMB11XR/ZR Ordering Information 1. Ordering Information Table 1-1. Ordering Details Model Number Ordering Code Package Description ATSAMB11XR2100A ATSAMB11XR2100A 5.5 mm x 4.5 mm ATSAMB11 SiP tray ATSAMB11ZR210CA ATSAMB11ZR210CA Regulatory Information N/A 7.5 mm X 10.5 mm ATSAMB11 module FCC, ISED, CE with chip antenna Figure 1-1. Marking information (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 7 ATSAMB11XR/ZR Package Information 2. Package Information Table 2-1. ATSAMB11-XR2100A SiP 49 Package Information Parameter Value Units Tolerance Package size 5.50 x 4.50 mm 0.05 mm Pad count 49 Total thickness 1.40 mm Max Tolerance (maximum pad pitch) 0.40 mm 0.05 mm Pad width 0.21 Exposed pad size 0.50 x 0.50 Note: For drawing details, see Figure 18-1. Table 2-2. ATSAMB11-ZR210CA Module Information Parameter Value Units Tolerance Package size 7.503 x 10.541 mm Untoleranced dimension Pad count 35 Total thickness 1.868 mm Untoleranced dimensions Pad pitch 0.61 Pad width 0.406 Exposed pad size 2.705 x 2.705 Note: For drawing details, see Figure 18-2. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 8 ATSAMB11XR/ZR Block Diagram 3. Block Diagram Figure 3-1. Block Diagram (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 9 ATSAMB11XR/ZR Pinout Information 4. Pinout Information The ATSAMB11-XR2100A is offered in an exposed pad 49-pin SiP package. This package has an exposed paddle that must be connected to the system board ground. The SiP package pin assignment is shown in the figure below. The colored shading is used to indicate the pin type as follows: * * * * * * Red - analog Green - digital I/O (switchable power domain) Blue - digital I/O (always-on power domain) Yellow - power Purple - PMU Shaded green/red - configurable mixed-signal GPIO (digital/analog) The ATSAMB11-ZR210CA module is a castellated PCB with the ATSAMB11-XR2100A integrated with a matched chip antenna. The pins are identified in the pin description table. The ATSAMB11-XR2100A also contains a paddle pad on the bottom of the PCB, that must be soldered to the system ground. Figure 4-1. ATSAMB11-XR2100A Pin Assignment (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 10 ATSAMB11XR/ZR Pinout Information Figure 4-2. ATSAMB11-ZR210CA Pin Descriptions The following table lists the pin assignments for both the ATSAMB11-XR2100A and the ATSAMB11ZR210CA. Table 4-1. ATSAMB11-XR2100A and ATSAMB11-ZR210CA Pin Description ATSAMB11XR2100A Pin # ATSAMB11ZR210CA Pin # Pin Name Pin Type Description / Default Function 1 - LP_GPIO_23 Digital I/O GPIO with Programmable Pull Up/Down 2 17 LP_GPIO_5 Digital I/O GPIO with Programmable Pull Up/Down 3 18 LP_GPIO_6 Digital I/O GPIO with Programmable Pull Up/Down 4 19 LP_GPIO_7 Digital I/O GPIO with Programmable Pull Up/Down 5 20 LP_GPIO_8(1) Digital I/O GPIO with Programmable Pull Up/Down (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 11 ATSAMB11XR/ZR Pinout Information ATSAMB11XR2100A Pin # ATSAMB11ZR210CA Pin # Pin Name Pin Type Description / Default Function 6 21 LP_GPIO_9(1) Digital I/O GPIO with Programmable Pull Up/Down 7 22 LP_GPIO_10 Digital I/O GPIO with Programmable Pull Up/Down 8 23 LP_GPIO_11 Digital I/O GPIO with Programmable Pull Up/Down 9 24 LP_GPIO_12 Digital I/O GPIO with Programmable Pull Up/Down 10 25 LP_GPIO_13 Digital I/O GPIO with Programmable Pull Up/Down 11 27 VBAT Power supply Power supply pin for the DC/DC convertor 12 28 GPIO_MS1 Mixed Signal I/O Configurable to be a GPIO digital and analog signal. Only analog input for ADC interface. 13 29 GPIO_MS2 Mixed Signal I/O Configurable to be a GPIO digital and analog signal. Only analog input for ADC interface. 14 30 C_EN Digital Input Can be used to control the state of PMU. High level enables the module; low-level places module in Power-Down mode. 15 31 GPIO_MS3 Mixed Signal I/O Configurable to be a GPIO digital and analog signal. Only analog input for ADC interface. 16 32 GPIO_MS4 Mixed Signal I/O Configurable to be a GPIO digital and analog signal. Only analog input for ADC interface. 17 33 RTC_CLK_P Analog Crystal pin or External clock supply, see 32.768 kHz RTC Crystal Oscillator (RTC XO) 18 34 RTC_CLK_N Analog Crystal pin or External clock supply, see 32.768 kHz RTC Crystal Oscillator (RTC XO) 19 - AO_TM Digital Input Always-On Test Mode. Connect to GND (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 12 ATSAMB11XR/ZR Pinout Information ATSAMB11XR2100A Pin # ATSAMB11ZR210CA Pin # Pin Name Pin Type Description / Default Function 20 1 AO_GPIO_0 Always On Digital I/O, Programmable Pull-Up To be held in logic '0' GND to allow the device to enter Ultra_Low_Power mode Can be used to Wake-up the device from Ultra_Low_Power mode. 21 2 AO_GPIO_1 Always On. Digital I/O, Programmable Pull- Up GPIO with Programmable Pull Up 22 3 AO_GPIO_2 Always On. Digital I/O, Programmable Pull- Up GPIO with Programmable Pull Up 23 4 LP_GPIO_14 Digital I/O GPIO with Programmable Pull Up/Down 24 5 LP_GPIO_15 Digital I/O GPIO with Programmable Pull Up/Down 25 - LP_GPIO_24 Digital I/O GPIO with Programmable Pull Up/Down 26 6 LP_GPIO_16 Digital I/O GPIO with Programmable Pull Up/Down 27 7 VDDIO Power supply Power supply pin for the I/O pins. Can be less than or equal to voltage supplied at VBAT 28 8 LP_GPIO_17 Digital I/O GPIO with Programmable Pull Up/Down 29 9 LP_GPIO_18 Digital I/O GPIO with Programmable Pull Up/Down 30 10 LP_GPIO_19 Digital I/O GPIO with Programmable Pull Up/Down 31 - TPP 32 11, 26 GND Ground 33 - RFIO Analog I/O 34 - NC 35 12 LP_GPIO_0 (c) 2018 Microchip Technology Inc. Do not connect RX input and TX output. Singleended RF I/O; To be connected to antenna Do not connect Digital I/O Datasheet Preliminary SWD clock DS70005342B-page 13 ATSAMB11XR/ZR Pinout Information ATSAMB11XR2100A Pin # ATSAMB11ZR210CA Pin # Pin Name Pin Type Description / Default Function 36 13 LP_GPIO_1 Digital I/O SWD I/O 37 14 LP_GPIO_2 Digital I/O GPIO with Programmable Pull Up/Down 38 15 LP_GPIO_3 Digital I/O GPIO with Programmable Pull Up/Down 39 16 LP_GPIO_4 Digital I/O GPIO with Programmable Pull Up/Down 40 - LP_GPIO_22 Digital I/O GPIO with Programmable Pull Up/Down 41 - 49 35 Paddle Ground Exposed paddle must be soldered to system ground Note: 1. These GPIO pads are high-drive pads. Refer Table 17-3. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 14 ATSAMB11XR/ZR Device States 5. Device States This section includes details on the description and controlling of the Device states. 5.1 Description of Device States The ATSAMB11-XR2100A and the ATSAMB11-ZR210CA have multiple device states, depending on the state of the ARM processor and BLE subsystem. Note: The ARM is required to be powered on, if the BLE subsystem is active. * * * * * 5.1.1 BLE_On_Transmit - Device is actively transmitting a BLE signal. BLE_On_Receive - Device is in active receive state. MCU_Only - Device has ARM processor powered-on and BLE subsystem powered-down. Ultra_Low_Power - BLE subsystem and ARM processor are powered-down. Power_Down - Device core supply off. Controlling the Device States The following pins are used to switch between the main device states: * * * C_EN - used to enable PMU VDDIO - I/O supply voltage from an external power supply AO_GPIO_0 - can be used to control the device from entering/exiting Ultra_Low_Power mode To be in the Power_Down state, the VDDIO supply must be turned on and the C_EN must be maintained at logic low (at GND level). To switch between the Power_Down state and the MCU_Only state, C_EN is to be maintained at logic high (VDDIO voltage level). Once the device is in the MCU_Only state, all other state transitions are controlled entirely by software. When VDDIO supply is turned off and C_EN is in logic low, the chip is powered off with no leakage. When VDDIO supply is turned off, voltage cannot be applied to the ATSAMB11-XR2100A pins, as each pin contains an ESD diode from the pin to supply. This diode turns on, when a voltage higher than one diode-drop is supplied to the pin. If voltage is to be applied to the signal pads, while the chip is in a low-power state, the VDDIO supply must be on, so that the Power_Down state is used. Similarly, to prevent the pin-to-ground diode from turning on, do not apply a voltage to any pin that is more than one diode-drop below ground. The AO_GPIO_0 pin can be used to control the device from entering and exiting Ultra_Low_Power mode. When AO_GPIO_0 is maintained in logic high state, the device will not enter Ultra_Low_Power mode. When the AO_GPIO_0 is maintained in logic low, the device will enter Ultra_Low_Power mode provided there are no BLE events to be handled. 5.2 Power Sequences The power sequences and timing parameters for the ATSAMB11-XR2100A and ATSAMB11-ZR210CA, are illustrated below. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 15 ATSAMB11XR/ZR Device States Figure 5-1. Power-up/Power-down Sequence The timing parameters are provided in following table. Table 5-1. Power-up/Power-down Sequence Timing Parameter Min. Max. Units Description Notes VBAT rise to VDDIO rise VBAT and VDDIO can rise simultaneously or can be tied together tA 0 tB 0 ms VDDIO rise to C_EN rise tC 10 s C_EN rise to 31.25 kHz (2 MHz/64) oscillator stabilizing tB' 0 C_EN fall to VDDIO fall ms tA' 5.3 0 VDDIO fall to VBAT fall C_EN must not rise before VDDIO. C_EN must be driven high or low, not left floating. C_EN must fall before VDDIO. C_EN must be driven high or low, not left floating. VBAT and VDDIO can fall simultaneously or be tied together Digital and Mixed-Signal I/O Pin Behavior during Power-Up Sequences The following table represents I/O pin states corresponding to device power modes. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 16 ATSAMB11XR/ZR Device States Table 5-2. I/O Pin Behavior in the Different Device States (1) Device State VDDIO CHIP_EN Output Driver Input Driver Pull Up/Down Resistor (2) Power_Down: core supply off High Low Disabled (Hi-Z) Disabled Disabled Power-on Reset: core supply on, POR hard reset pulse on High High Disabled (Hi-Z) Disabled Disabled (3) Power-on Default: core supply on, device out of reset but not programmed yet High High Disabled (Hi-Z) Enabled(4) Enabled Pull-Up (4) MCU_Only, BLE_On: core supply on, device programmed by firmware High High Programmed by firmware for each pin: Enabled or Disabled (Hi-Z) (5) ,when Enabled driving 0 or 1 Opposite of Output Driver state: Disabled or Enabled (5) Programmed by firmware for each pin: Enabled or Disabled, Pull-Up or Pull- Down(5) Ultra_Low_Power: High High Retains previous Opposite of state(6) for each pin: Output Enabled or Disabled Driver state: (Hi-Z), when Disabled or Enabled driving 0 or Enabled(6) 1 Retains previous state (6) for each pin: Enabled or Disabled, Pull-Up or Pull-Down core supply on for alwayson domain, core supply off for switchable domains Note: 1. This table applies to all three types of I/O pins (digital switchable domain GPIOs, digital always-on/ wake-up GPIO, and mixed-signal GPIOs) unless otherwise noted. 2. Pull-up/down resistor value is 96 kOhm 10%. 3. In Power-on Reset state, the pull-up resistor is enabled in the always-on/wake-up GPIO only. 4. In Power-on Default state, the input drivers and pull-up/down resistors are disabled in the mixedsignal GPIOs only (mixed-signal GPIOs are defaulted to analog mode, see the note below). 5. Mixed-signal GPIOs can be programmed to be in analog or digital mode for each pin: when programmed to analog mode (default), the output driver, input driver, and pull-up/down resistors are all disabled. 6. In Ultra_Low_Power state, the always-on/wake-up GPIO does not have retention capability and behaves same as in MCU_Only or BLE_On states, also for mixed-signal GPIOs programming analog mode overrides retention functionality for each pin. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 17 ATSAMB11XR/ZR Processor Architecture 6. Processor Architecture 6.1 ARM Subsystem The ATSAMB11-XR2100A and ATSAMB11-ZR210CA have an ARM Cortex-M0 32-bit processor. It is responsible for controlling the BLE Subsystem and handling all application features. The Cortex-M0 Microcontroller consists of a full 32-bit processor capable of addressing 4GB of memory. It has a RISC like load/store instruction set and internal 3-stage Pipeline Von Neumann architecture. The Cortex-M0 processor provides a single system-level interface using AMBA technology to provide high speed, low latency memory accesses. The Cortex-M0 processor implements a complete hardware debug solution with four hardware breakpoint and two watchpoint options. This provides high system visibility of the processor, memory, and peripherals through a 2-pin Serial Wire Debug (SWD) port that is ideal for microcontrollers and other small package devices. ATSAMB11 is running a proprietary RTOS tightly coupled with FW in the ROM and the user can not override it. SysTick timer is being used by the stack and will not be available for usage by the application. Figure 6-1. ARM Cortex-M0 Subsystem (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 18 ATSAMB11XR/ZR Processor Architecture 6.1.1 Features The processor features and benefits are: * * * * * * 6.1.2 Tight integration with the system peripherals to reduce area and development costs Thumb instruction set combines high code density with 32-bit performance Integrated sleep modes using a Wakeup Interrupt Controller for low power consumption Deterministic and high-performance interrupt handling via Nested Vector Interrupt Controller for time-critical applications Serial Wire Debug reduces the number of pins required for debugging DMA engine for Peripheral-to-Memory, Memory-to-Memory, and Memory-to-Peripheral operation Wakeup Sources Ultra_Low_Power is the lowest possible power state for the system. In Ultra_Low_Power state, ARM Cortex-M0, BLE core, GPIO's, and all other peripheral cores are powered-down. Only AON-GPIO_0 and AON-Sleep timer are functional in this state. ATSAMB11 contains the following wake-up sources that wake up the system from Ultra_Low_Power mode: * BLE events * AON-GPIO_0 * AON-Sleep timer 6.2 Cortex M0 Peripherals * * * * 6.2.1 System Control Space (SCS) The processor provides debug through registers in the SCS. For more details, refer to the CortexM0 Technical Reference Manual (http://www.arm.com). Nested Vectored Interrupt Controller (NVIC) External interrupt signals connect to the NVIC, and the NVIC prioritizes the interrupts. Software can set the priority of each interrupt. The NVIC and the Cortex-M0 processor core are closely coupled, providing low latency interrupt processing and efficient processing of late arriving interrupts. For more details, refer to the Cortex-M0 Technical Reference Manual (http://www.arm.com). System Timer (SysTick) The System Timer is a 24-bit timer clocked by CLK_CPU that extends the functionality of both the processor and the NVIC. For more details, refer to the Cortex-M0 Technical Reference Manual (http://www.arm.com). System Control Block (SCB) The System Control Block provides system implementation information, and system control. This includes configuration, control, and reporting of the system exceptions. For more details, refer to the Cortex-M0 Devices Generic User Guide (http://www.arm.com). Cortex M0 Peripheral Memory Map * * * * 0xE000E000 System Control Space (SCS) 0xE000E010 System Timer (SysTick) 0xE000E100 Nested Vectored Interrupt Controller (NVIC) 0xE000ED00 System Control Block (SCB) (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 19 ATSAMB11XR/ZR Processor Architecture 6.3 Nested Vector Interrupt Controller External interrupt signals are connected to the NVIC, and the NVIC prioritizes the interrupts. Software can set the priority of each interrupt. The NVIC and the Cortex-M0 processor core are closely coupled to provide low-latency interrupt processing and efficient processing of late arriving interrupts. All NVIC registers are accessible via word transfers and are little endian. Any attempt to read or write a half-word or byte individually is unpredictable. The NVIC allows the CPU to be able to individually enable or disable each interrupt source, and hold each interrupt until it is serviced and cleared by the CPU. Table 6-1. NVIC Register Summary Name Description ISER Interrupt Set-Enable Register ICER Interrupt Clear-Enable Register ISPR Interrupt Set-Pending Register ICPR Interrupt Clear-Pending Register IPR0-IPR7 Interrupt Priority Registers Note: For a description of each register, see the Cortex-M0 documentation from ARM (http:// www.arm.com). 6.3.1 Functional Description The Cortex-M0 NVIC is connected to 32 IRQ sources. The following table lists the interrupts that are available in ATSAMB11. Also, some of the interrupts are marked as RESERVED as they are used by the BLE stack and are used for firmware in general. Applications must refrain from registering an ISR for those interrupts as it affects the chip functionality. Perform the following steps to enable an interrupt: * * * * Configure and enable peripheral interrupt using peripheral-specific registers. Refer to the intended peripheral chapter for configuring interrupt. The ISRs are mapped in RAM memory called interrupt vector table. 0x10000000 is the start address of first ISR index 0 and 4 bytes are allocated for each ISR index in incrementing order. The specific peripheral ISR handler to be registered by assigning the handler address to this interrupt vector table. Set the NVIC priority of the interrupt if required. IPR0-IPR7 ARM NVIC registers are used to set the priority level for individual interrupt sources. IRQ number of the specific interrupt source as per the following table is used. Only two bits are allocated for each interrupt source. Therefore, four priority levels (0, 1, 2, and 3) are possible. The priority value is zero by default, and is also the highest priority. Note: The BLE subsystem is handled by ROM firmware and BLE-specific interrupts are with default priority value equal to zero (highest priority). It is only possible to set the same or lesser priority than BLE-specific for other peripheral interrupts. Same or lesser priority interrupts cannot interrupt the running ISR. The latency to serve other peripheral interrupt when BLE ISR is servicing depends on the full execution time for BLE ISR. Enable NVIC interrupt of specific IRQ numbers using ISER register. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 20 ATSAMB11XR/ZR Processor Architecture Table 6-2. ATSAMB11 Interrupt Vector Table IRQ Number ISR Index Interrupt Source Muxability -15 1 Reset Non-muxable -14 2 NMI Non-muxable -13 3 Hard Fault Non-muxable -5 11 SVC Non-muxable -2 14 Pending SV Non-muxable -1 15 SysTick Non-muxable 0 16 UART0 RX Muxable 1 17 UART0 TX Muxable 2 18 UART1 RX Muxable 3 19 UART1 TX Muxable 4 20 SPI0 RX Muxable 5 21 SPI0 TX Muxable 6 22 SPI1 RX Muxable 7 23 SPI1 TX Muxable 8 24 I2C0 RX Muxable 9 25 I2C0 TX Muxable 10 26 I2C1 RX Muxable 11 27 I2C1 TX Muxable 12 28 Watchdog 0 Muxable(1) 13 29 Watchdog 1 Muxable 14 30 ARM Dual Timer 15 31 BLE Peripheral Register Muxable 16 32 EFuse Out of Reset Muxable(1) 17 33 BLE Security Muxable(1) 18 34 SPI Flash Muxable 19 35 Calibration Done Muxable(1) 20 36 Brown Out Detected Muxable 21 37 BLE specific Non-Muxable(1) 22 38 BLE specific Non-Muxable(1) 23 39 GPIO 0 Combined Non-Muxable 24 40 GPIO 1 Combined Non-Muxable (c) 2018 Microchip Technology Inc. (R) Datasheet Preliminary Muxable DS70005342B-page 21 ATSAMB11XR/ZR Processor Architecture IRQ Number ISR Index Interrupt Source Muxability 25 41 GPIO 2 combined Non-Muxable 26 42 ARM timer Non-Muxable(1) 27 43 AON sleep timer Non-Muxable 28 44 BLE specific Non-Muxable(1) 29 45 BLE specific Non-Muxable(1) 30 46 BLE specific Non-Muxable(1) 31 47 BLE specific Non-Muxable(1) Note: 1. This ISR index is used by the BLE stack. Applications must refrain from registering an ISR as it affects the chip functionality. For more details on configuration options for muxable interrupts, see Muxable Interrupt. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 22 ATSAMB11XR/ZR Memory Subsystem 7. Memory Subsystem The Cortex-M0 core uses a 128 KB instruction/boot ROM along with a 128 KB shared instruction and data RAM. 7.1 Shared Instruction and Data Memory The Instruction and Data Memory (IDRAM1 and IDRAM2) contains instructions and data used by the ARM. The 128 KB size of IDRAM1 and IDRAM2 is used for the BLE subsystem and also for the user application. IDRAM1 contains three 32 KB memories and IDRAM2 contains two 16 KB memories that are accessible to the ARM and used for instruction/data storage. RAM memory is used by the user application as well as ROM firmware for data storage. The memory split-up between application and firmware might change when there is a BluSDK SMART release. Refer to BluSDK SMART Example Profiles Application User Guide for the memory map of this memory section. 7.2 ROM The ROM is used to store the boot code and BLE firmware, stack, and selected user profiles. The ROM contains the 128 KB memory that is accessible to the ARM. The Boot loader code stored in ROM loads the application from Flash to RAM. 7.3 BLE Retention Memory The BLE functionality requires 8 KB state, instruction, and data to be retained in memory, when the processor either goes into Sleep mode or Power down mode. The RAM is separated into specific power domains to allow tradeoff in power consumption with retention memory size. 7.4 Non-Volatile Memory The ATSAMB11-XR2100A and ATSAMB11-ZR210CA have 768 bits of non-volatile eFuse memory that can be read by the CPU after device reset. This memory region is one-time- programmable. It is partitioned into six 128-bit banks. Each bank is divided into four blocks with each block containing 32 bits of memory locations. This non-volatile, one-time-programmable memory is used to store customer specific parameters as listed below. * 26 MHz XO Calibration information * BT address The bit map for the block containing the above parameters is detailed in the following figures. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 23 ATSAMB11XR/ZR Memory Subsystem Figure 7-1. Bank 5 Block 0 Figure 7-2. Bank 5 Block 1 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 24 ATSAMB11XR/ZR Memory Subsystem Figure 7-3. Bank 5 Block 3 The bits that are not depicted in the above register description are all reserved for future use. 7.4.1 26 MHz XO Calibration information Information for both ATSAMB11-XR2100A and ATSAMB11-ZR210CA will be pre-programmed. 7.4.2 BT Address These bits contain the BT address used by the user application. For ATSAMB11-ZR210CA modules, the BT address is pre-programmed. For ATSAMB11-XR2100A, the user must purchase the MAC address from IEEE and program it to the designated bit locations of the non-volatile memory. 7.4.3 Flash Memory The ATSAMB11-XR2100A and ATSAMB11-ZR210CA have 256 kB of Flash memory, stacked on top of the MCU and BLE SoC. It is accessed through the SPI Flash controller. Flash memory features are: * * * * * * * 256 bytes per programmable page Uniform 4 kB Sectors, 32 kB & 64 kB Blocks Sector Erase (4 Kbyte) Block Erase (32 K or 64 Kbyte) Page program up to 256 bytes <1 ms More than 100,000 erase/write cycles and more than 20-year data retention 2.3 V to 3.6 V supply range (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 25 ATSAMB11XR/ZR Bluetooth Low Energy Subsystem 8. Bluetooth Low Energy Subsystem The Bluetooth Low Energy (BLE) subsystem implements all the critical real-time functions required for full compliance with specification of the Bluetooth System v4.2, Bluetooth SIG. It consists of a Bluetooth 4.2 baseband controller (core), radio transceiver and the Microchip Bluetooth Smart Stack, and the BLE Software Platform. 8.1 BLE Core The baseband controller consists of a modem and a Medium Access Controller (MAC) through which it encodes and decodes HCI packets. In addition, it constructs baseband data packages and schedules frames, and manages and monitors connection status, slot usage, data flow, routing, segmentation and buffer control. The core performs Link Control Layer management supporting the main BLE states, including advertising and connection. 8.2 Features * * * * * * * 8.3 Broadcaster, Central, Observer, Peripheral Simultaneous Master and Slave operation, connect up to eight connections Frequency Hopping Advertising/Data/Control packet types Encryption (AES-128, SHA-256) Bitstream processing (CRC, whitening) Operating clock 52 MHz BLE Radio The radio consists of a fully integrated transceiver, low noise amplifier, Receive (RX) down converter, analog baseband processing, Phase Locked Loop (PLL), Transmit (TX) Power Amplifier, and Transmit/ Receive switch. At the RF front end, no external RF components on the PCB are required other than the antenna and a matching component. Table 8-1. ATSAMB11 BLE Radio features and properties Feature Description Part Number ATSAMB11-XR2100A and ATSAMB11-ZR210CA BLE standard Bluetooth V4.2 - Bluetooth Low Energy Frequency range 2402 MHz to 2480 MHz Number of channels 40 Modulation GFSK Data rate 1 Mbps (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 26 ATSAMB11XR/ZR Bluetooth Low Energy Subsystem 8.4 Microchip BluSDK Smart The BluSDK Smart offers a comprehensive set of tools including reference applications for several Bluetooth SIG defined profiles and custom profile. This will help the user quickly evaluate, design and develop BLE products with ATSAMB11-XR2100A and ATSAMB11-ZR210CA. The ATSAMB11-XR2100A and ATSAMB11-ZR210CA have a completely integrated Bluetooth Low Energy stack on chip that is fully qualified, mature, and Bluetooth V4.2 compliant. Customer applications interface with the BLE protocol stack through the Microchip BLE API, which supports direct access to the GAP, SMP, ATT, GATT client / server, and L2CAP service layer protocols in the embedded firmware. The stack includes numerous BLE profiles for applications like: * * * * * * * * Smart Energy Consumer Wellness Home Automation Security Proximity Detection Entertainment Sports and Fitness Automotive Together with the Atmel Studio Software Development environment, the additional customer profiles can be easily developed. In addition to the protocol stack, the drivers for each peripheral hardware block are provided as part of the Advanced Software Framework (ASF). 8.4.1 Direct Test Mode (DTM) Example Application A DTM example application is among the reference applications offered in BluSDK Smart. Using this application, the user will be able to configure the device in the different test modes as defined in the Bluetooth Low Energy Core 4.2 specification (Vol6,Part F Direct Test Mode). Please refer the example getting started guide available in the BluSDK Smart release package. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 27 ATSAMB11XR/ZR Clocking 9. Clocking 9.1 Overview Figure 9-1. Clock Architecture Figure 9-1 provides an overview of the clock tree and clock management blocks. The BLE Clock is used to drive the BLE subsystem. The ARM clock is used to drive the Cortex-M0 MCU and its interfaces (UART, SPI, and I2C); the recommended MCU clock speed is 26 MHz. The Low Power Clock is used to drive all the low-power applications like the BLE sleep timer, always-on power sequencer, always-on timer, and others. The 26 MHz integrated RC Oscillator is used for most general purpose operations on the MCU and its peripherals. In cases when the BLE subsystem is not used, the RC oscillator can be used for lower power consumption. The frequency variation of this RC oscillator is up to 50% over process, voltage, and temperature. The frequency variation of 2 MHz integrated RC Oscillator is up to 50% over process, voltage, and temperature. The 32.768 kHz RTC Crystal Oscillator (RTC XO) is used for BLE operations as it will reduce power consumption by providing the best timing for wake-up precision, allowing circuits to be in low-power sleep mode for as long as possible until they need to wake-up and connect during the BLE connection event. 9.2 26 MHz Crystal Oscillator (XO) A 26 MHz crystal oscillator is integrated into the ATSAMB11-XR2100A and ATSAMB11-ZR210CA to provide the precision clock for the BLE operations. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 28 ATSAMB11XR/ZR Clocking 9.3 32.768 kHz RTC Crystal Oscillator (RTC XO) 9.3.1 General Information The ATSAMB11-XR2100A and ATSAMB11-ZR210CA contain a 32.768 kHz RTC oscillator that is preferably used for BLE activities involving connection events. To be compliant with the BLE specifications for connection events, the frequency accuracy of this clock has to be within 500 ppm. Because of the high accuracy of the 32.768 kHz crystal oscillator clock, the power consumption can be minimized by leaving radio circuits in low-power sleep mode for as long as possible, until they need to wake-up for the next connection timed event. The block diagram in Figure 9-2 below shows how the internal low-frequency Crystal Oscillator (XO) is connected to the external crystal. The RTC XO has a programmable internal capacitance with a maximum of 15 pF on each terminal, RTC_CLK_P, and RTC_CLK_N. When bypassing the crystal oscillator with an external signal, the user can program down the internal capacitance to its minimum value (~1 pF) for easier driving capability. The driving signal can be applied to the RTC_CLK_P terminal, as illustrated in Figure 9-2 below. The need for external bypass capacitors depends on the chosen crystal characteristics. Typically, the crystal should be chosen to have a load capacitance of 7 pF to minimize the oscillator current. Refer to the datasheet of the preferred crystal and take into account the on-chip capacitance. Alternatively, if an external 32.768 kHz clock is available, it can be used to drive the RTC_CLK_P pin instead of using a crystal. The XO has 6 pF internal capacitance on the RTC_CLK_P pin. To bypass the crystal oscillator, an external signal capable of driving 6 pF can be applied to the RTC_CLK_P terminal, as illustrated in Figure 9-2. RTC_CLK_N must be left unconnected, when driving an external source into RTC_CLK_P. Refer to the Table 9-1 for the specification of the external clock to be supplied at RTC_CLK_P. Figure 9-2. Connections to RTC XO (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 29 ATSAMB11XR/ZR Clocking Table 9-1. 32.768 kHz External Clock Specification Parameter Min. Oscillation frequency Typ. Max Unit 32.768 kHz Must be able to drive 6 pF load at desired frequency VinH 0.7 1.2 VinL 0 0.2 Stability - Temperature -250 Comments V High level input voltage Low level input voltage +250 ppm Additional internal trimming capacitors (C_onchip) are available. They provide the possibility to tune the frequency output of RTC XO without changing the external load capacitors. Contact technical support for usage of the internal trimming capacitors. Note: Refer the BluSDK BLE API Software Development Guide for details on how to enable the 32.768 kHz clock output and tune the internal trimming capacitors. Table 9-2. 32.768 kHz XTAL C_onchip Programming 9.3.2 Register: pierce_cap_ctrl[3:0] C_onchip [pF] 0000 0.0 0001 1.0 0010 2.0 0011 3.0 0100 4.0 0101 5.0 0110 6.0 0111 7.0 1000 8.0 1001 9.0 1010 10.0 1011 11.0 1100 12.0 1101 13.0 1110 14.0 1111 15.0 RTC XO Design and Interface Specification The RTC consists of two main blocks: The Programmable Gm stage and tuning capacitors. The programmable Gm stage is used to guarantee start-up and to sustain oscillation. Tuning capacitors are used to adjust the XO center frequency and control the XO precision for different crystal models. The output of the XO is driven to the digital domain via a digital buffer stage with a supply voltage of 1.2V. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 30 ATSAMB11XR/ZR Clocking Table 9-3. RTC XO Interface Pin Name Function Register Default Digital Control Pins Pierce_res_ctrl Control feedback resistance value: 0X4000F404<15>='1' 0 = 20 MOhm Feedback resistance 1 = 30 MOhm Feedback resistance Pierce_cap_ctrl<3:0> Control the internal tuning capacitors with step of 700 fF: 0X4000F404<23:20>="1000" 0000=700 fF 1111=11.2 pF Refer to crystal datasheet to check for optimum tuning cap value Pierce_gm_ctrl<3:0> Controls the Gm stage gain for different crystal mode: 0X4000F404<19:16>="1000" 0011= for crystal with shunt capacitance of 1.2 pF 1000= for crystal with shunt capacitance of >3 pF VDD_XO 9.3.3 1.2V RTC Characterization with Gm Code Variation at Supply 1.2V and Temp. = 25C This section shows the RTC total drawn current and the XO accuracy versus different tuning capacitors and different GM codes, at a supply voltage of 1.2V and temperature = 25C. Figure 9-3. RTC Drawn Current vs. Tuning Caps at 25C (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 31 ATSAMB11XR/ZR Clocking Figure 9-4. RTC Oscillation Frequency Deviation vs. Tuning Caps at 25C 9.3.4 RTC Characterization with Supply Variation and Temp. = 25C Figure 9-5. RTC Drawn Current vs. Supply Variation (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 32 ATSAMB11XR/ZR Clocking Figure 9-6. RTC Frequency Deviation vs. Supply Voltage 9.4 2 MHz Integrated RC Oscillator The 2 MHz integrated RC Oscillator circuit without calibration contains a frequency variation of 50% over process, temperature, and voltage variation. As described above, calibration over process, temperature, and voltage is required to maintain the accuracy of this clock. Figure 9-7. 32 kHz RC Oscillator PPM Variation vs. Calibration Time at Room Temperature (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 33 ATSAMB11XR/ZR Clocking Figure 9-8. 32 kHz RC Oscillator Frequency Variation over Temperature 9.5 Clock Settings for Critical Sections The three different clock sources 26 MHz XO, 26 MHz internal RC and 2 MHz internal RC can be used as input to ARM processor and other peripheral interfaces. As the clock configuration for some of the critical sections such as ARM, AON power sequencer, AON Sleep Timer, and BLE Sleep Timer are done by ROM firmware, the user is not recommended to change this clock configuration. This might affect the overall functionality. Therefore, the register descriptions related to this clock configurations are not provided. 9.5.1 ARM Processor Clock 26 MHz XO external crystal clock - this is the clock source for ARM processor and many of the peripherals. 9.5.2 AON Power Sequencer Clock 32.768 kHz RTC XO external crystal clock is the low power clock source for AON Power Sequencer module which controls the wake-up and sleep operations of ARM and BLE subsystem. 9.5.3 BLE Sleep Timer Clock 32.768 kHz RTC XO external crystal clock - this is the low power clock source for BLE Sleep Timer. This timer is used to wake-up BLE subsystem. 9.5.4 AON Sleep Timer Clock 32.768 kHz RTC XO external crystal clock - this is the low power clock source for AON Sleep Timer. This timer can be used by user application to wake-up ARM from ULP mode at predefined interval. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 34 ATSAMB11XR/ZR Clocking 9.6 Peripheral Clock Configuration ARM clock is the source for peripherals except for AON sleep timer. This clock is pre-scaled as per peripheral clock requirement. This clock is gated to peripherals and is enabled or disabled when required. This is to ensure the power is not consumed by the peripherals that are not used. 9.6.1 Enabling Peripheral Clock Each peripheral clock is gated. Peripheral clock is enabled by setting the specific x_CLK_EN bit in LPMCU_CLOCK_ENABLES_0 or LPMCU_CLOCK_ENABLES_1 register. Few peripherals have gated clock for APB/AHB interface as well as for peripheral core operations. It is required to enable both the clocks for normal peripheral operation. For example, UART1_CORE_CLK_EN and UART1_IF_CLK_EN gate the clock for APB bus of UART1 and UART1 core operations. Note: Few bits in these registers marked as "INTERNAL" are not recommended to change as those are controlled by ROM firmware. 9.6.2 Disabling Peripheral Clock Peripheral clock is disabled by clearing the specific x_CLK_EN bit in LPMCU_CLOCK_ENABLES_0 or LPMCU_CLOCK_ENABLES_1 register. 9.6.3 Peripheral Reset Each peripheral can be reset to default state by clearing the x_RSTN bit of LPMCU_GLOBAL_RESET_0 or LPMCU_GLOBAL_RESET_1 register. As long as x_RSTN bit is `0' the peripheral is in reset state and cannot be configured for normal operations. Ensure that x_RSTN bit is set before configuring the peripheral for normal operation. The peripheral should be disabled before it is reset to avoid undefined behavior. Some peripherals have gated clock for APB/AHB interface as well as for peripheral core operations. It is required to reset both clock. For example, UART1_CORE_RSTN and UART1_IF_RSTN bits to be cleared for resetting APB bus and UART1 core. Note: Some bits in these registers marked as "INTERNAL" are not recommended to change as those are controlled by ROM firmware. 9.7 AON Sleep Timer Clock Configuration The 32.768 kHz RTC XO external crystal clock is given as clock source to AON Sleep Timer by ROM firmware. This clock is gated to enable or disable when required. 9.7.1 Enabling AON Sleep Timer Clock The AON Sleep Timer clock is enabled by setting AON_SLEEP_TIMER_CLK_EN bit in AON_MISC_CTRL register. Note: Some bits in these registers marked as "INTERNAL" are not recommended to change as those are controlled by ROM firmware. 9.7.2 Disabling AON Sleep Timer Clock The AON Sleep Timer clock is disabled by clearing AON_SLEEP_TIMER_CLK_EN bit in AON_MISC_CTRL register. 9.7.3 AON Sleep Timer Reset The AON Sleep Timer can be reset to default state by clearing the SLEEP_TIMER_RSTN bit of AON_GLOBAL_RESET register. As long as SLEEP_TIMER_RSTN bit is `0' the AON Sleep Timer is in (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 35 ATSAMB11XR/ZR Clocking reset state and cannot be configured for normal operations. Ensure that SLEEP_TIMER_RSTN bit is set before configuring the timer for normal operation. AON Sleep Timer should be disabled before it is reset in order to avoid undefined behavior. Note: Some bits in these register marked as "INTERNAL" are not recommended to change as those are controlled by ROM firmware. 9.7.4 Global (Chip) Reset By clearing the GLOBAL_RSTN bit of AON_GLOBAL_RESET register resets the entire chip. This is the auto set bit as it resets the entire chip. 9.8 Register Summary This is the summary of all the registers used in this chapter. Absolute Address 0x4000B004 0x4000B008 Register Group LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 Name LPMCU_GLOB AL_RESET_0 LPMCU_GLOB AL_RESET_1 Bit Pos. 7:0 SPI1_IF_RSTN SPI1_CORE_R STN SPI0_IF_RSTN SPI0_CORE_R STN SPI_FLASH0_ RSTN SPI_FLASH0_S YS_RSTN CPU_RSTN GLOBAL_RST N 15:8 UART1_IF_RS TN UART1_CORE _RSTN UART0_IF_RS TN UART0_CORE _RSTN TIMER0_RSTN GPIO_RSTN I2C0_IF_RSTN I2C0_CORE_R STN 23:16 ARM_FREE_C LK_RSTN DBUG_RSTN CALIB_XBAR_I F_RSTN CALIB_RSTN MBIST_RSTN IRQ_CTRLR_C ORE_RSTN WDT1_RSTN WDT0_RSTN 31:24 PWM3_RSTN PWM2_RSTN PWM1_RSTN PWM0_RSTN QUAD_DEC2_ RSTN QUAD_DEC1_ RSTN QUAD_DEC0_ RSTN ARM_PRESET N_RSTN 7:0 SPI0_SCK_CL K_RSTN SECURITY_AE S_AHB_RSTN SECURITY_AE S_CORE_RST N SECURITY_SH A_AHB_RSTN SECURITY_SH A_CORE_RST N I2C1_IF_RSTN I2C1_CORE_R STN DUALTIMER0_ RSTN PROV_DMA_C TRL0_RSTN SPI1_SCK_PH ASE_INT_CLK _RSTN SPI0_SCK_PH ASE_INT_CLK _RSTN SPI1_SCK_CL K_RSTN SLEEP_TIMER _RSTN GLOBAL_RST N 15:8 0x4000F010 AON_GP_REG S0 AON_GLOBAL _RESET 7:0 0x4000B00C LPMCU_MISC_ REGS0 LPMCU_CLOC K_ENABLES_0 7:0 GPIO_CLK_EN 15:8 UART1_CORE _CLK_EN 23:16 ARM_PCLK_E N 31:24 0x4000B010 0x4000F00C LPMCU_MISC_ REGS0 AON_GP_REG S0 LPMCU_CLOC K_ENABLES_1 AON_MISC_CT RL BLE_LP_RSTN DUALTIMER0_ CLK_EN I2C0_CORE_C LK_EN SPI1_CORE_C LK_EN UART0_IF_CL K_EN UART0_CORE _CLK_EN WDT1_CLK_E N WDT0_CLK_E N AON_WRAPPE R_CLK_EN CALIB_XBAR_I F_CLK_EN ROM_MEM_CL K_EN IDRAM_2_GL_ MEM_CLK_EN IDRAM_1_GL_ MEM_CLK_EN IRQ_CTRLR_C ORE_CLK_EN UART1_IF_CL K_EN CALIB_CLK_E N I2C1_CORE_C LK_EN QUAD_DEC2_ CLK_EN QUAD_DEC1_ CLK_EN QUAD_DEC0_ CLK_EN BLE_MEM_CL K_EN ARM_PCLKG_ EN SPI0_CORE_C LK_EN SPI_FLASH0_ CLK_EN TIMER0_CLK_ EN 7:0 PWM1_CLK_E N PWM0_CLK_E N EFUSE5_CLK_ EN EFUSE4_CLK_ EN EFUSE3_CLK_ EN EFUSE2_CLK_ EN EFUSE1_CLK_ EN EFUSE0_CLK_ EN 15:8 SHA_CORE_C LK_EN TIMER0_PGCL K_EN GPIO_GCLK_E N SPI1_SCK_PH ASE_INT_CLK _EN SPI0_SCK_PH ASE_INT_CLK _EN SENS_ADC_C LK_EN PWM3_CLK_E N PWM2_CLK_E N 23:16 IDRAM_2_1_M EM_CLK_EN IDRAM_2_0_M EM_CLK_EN IDRAM_1_2_M EM_CLK_EN IDRAM_1_1_M EM_CLK_EN IDRAM_1_0_M EM_CLK_EN AES_AHB_CLK _EN AES_CORE_C LK_EN SHA_AHB_CLK _EN LPMCU_CPU_ RESET_OVER RIDE_VAL LPMCU_CPU_ RESET_OVER RIDE_EN LPMCU_USE_ BOOT_REGS LPMCU_BOOT _RESET_MUX _SEL USE_EXT_32K HZ_CLK_SLEE P_TIMER USE_RTC_32K HZ_CLK_SLEE P_TIMER FORCE_XO_T O_BYPASS_M ODE FORCE_OFF_ XO INVERT_WAKE UP_GPIO_0 USE_RTC_AO N_PWR_SEQ_ CLK AON_EXT_32K HZ_OUT_EN 7:0 15:8 23:16 9.9 PD4_RSTN USE_OSC2M_ AS_TB_CLK USE_2M_AON _PWR_SEQ_C LK AON_SLEEP_T IMER_CLK_EN Register Description (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 36 ATSAMB11XR/ZR Clocking 9.9.1 LPMCU Global Reset 0 Name: Reset: LPMCU_GLOBAL_RESET_0 0xFFFFFFFD Absolute Address: 0x4000B004 This register is a part of LPMCU_MISC_REGS0 Registers. This register allows the user to reset the individual peripherals. Bit Access Reset Bit 31 30 29 PWM3_RSTN PWM2_RSTN PWM1_RSTN 28 RSTN RSTN RSTN N_RSTN R/W R/W R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 1 1 23 22 21 20 19 18 17 ARM_FREE_C DBUG_RSTN CALIB_XBAR_I CALIB_RSTN LK_RSTN Access Reset Bit 27 26 25 24 PWM0_RSTN QUAD_DEC2_ QUAD_DEC1_ QUAD_DEC0_ ARM_PRESET MBIST_RSTN IRQ_CTRLR_C WDT1_RSTN F_RSTN 16 WDT0_RSTN ORE_RSTN R/W R/W R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 UART1_IF_RS UART1_CORE UART0_IF_RS UART0_CORE TIMER0_RSTN GPIO_RSTN I2C0_IF_RSTN I2C0_CORE_R Access Reset Bit TN _RSTN TN _RSTN R/W R/W R/W R/W R/W R/W R/W STN R/W 1 1 1 1 1 1 1 1 7 6 5 4 3 2 SPI1_IF_RSTN SPI1_CORE_R SPI0_IF_RSTN SPI0_CORE_R SPI_FLASH0_R SPI_FLASH0_S STN Access Reset STN STN YS_RSTN 1 0 CPU_RSTN GLOBAL_RST N R/W R/W R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 0 1 Bit 31 - PWM3_RSTN PWM3 Peripheral Reset Writing '0' to this bit resets PWM3 peripheral Writing '1' to this bit allows normal PWM3 peripheral operations Bit 30 - PWM2_RSTN PWM2 Peripheral Reset Writing '0' to this bit resets PWM2 peripheral Writing '1' to this bit allows normal PWM2 peripheral operations Bit 29 - PWM1_RSTN PWM1 Peripheral Reset Writing '0' to this bit resets PWM1 peripheral Writing '1' to this bit allows normal PWM1 peripheral operations Bit 28 - PWM0_RSTN PWM0 Peripheral Reset Writing '0' to this bit resets PWM0 peripheral Writing '1' to this bit allows normal PWM0 peripheral operations (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 37 ATSAMB11XR/ZR Clocking Bit 27 - QUAD_DEC2_RSTN Quad Decoder 2 Peripheral Reset Writing '0' to this bit resets Quad Decoder 2 peripheral Writing '1' to this bit allows normal Quad Decoder 2 peripheral operations Bit 26 - QUAD_DEC1_RSTN Quad Decoder 1 Peripheral Reset Writing '0' to this bit resets Quad Decoder 1 peripheral Writing '1' to this bit allows normal Quad Decoder 1 peripheral operations Bit 25 - QUAD_DEC0_RSTN Quad Decoder 0 Peripheral Reset Writing '0' to this bit resets Quad Decoder 0 peripheral Writing '1' to this bit allows normal Quad Decoder 0 peripheral operations Bit 24 - ARM_PRESETN_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change Bit 23 - ARM_FREE_CLK_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change Bit 22 - DBUG_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change Bit 21 - CALIB_XBAR_IF_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change Bit 20 - CALIB_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change Bit 19 - MBIST_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change Bit 18 - IRQ_CTRLR_CORE_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change Bit 17 - WDT1_RSTN Writing '0' to this bit resets Watchdog 1 peripheral Writing '1' to this bit allows normal Watchdog 1 peripheral operations Bit 16 - WDT0_RSTN Writing '0' to this bit resets Watchdog 0 peripheral Writing '1' to this bit allows normal Watchdog 0 peripheral operations Bit 15 - UART1_IF_RSTN Writing '0' to this bit resets UART1 peripheral interface Writing '1' to this bit allows normal UART1 peripheral interface operations Bit 14 - UART1_CORE_RSTN Writing '0' to this bit resets APB operation of UART1 peripheral core Writing '1' to this bit allows normal UART1 peripheral core APB operations (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 38 ATSAMB11XR/ZR Clocking Bit 13 - UART0_IF_RSTN Writing '0' to this bit resets UART0 peripheral interface Writing '1' to this bit allows normal UART0 peripheral interface operations Bit 12 - UART0_CORE_RSTN Writing '0' to this bit resets APB operation of UART0 peripheral core Writing '1' to this bit allows normal UART0 peripheral core APB operations Bit 11 - TIMER0_RSTN Writing '0' to this bit resets Timer 0 peripheral Writing '1' to this bit allows normal Timer 0 peripheral operations Bit 10 - GPIO_RSTN Writing '0' to this bit resets GPIO Controllers Writing '1' to this bit allows normal GPIO Controllers operations Bit 9 - I2C0_IF_RSTN Writing '0' to this bit resets I2C0 peripheral interface Writing '1' to this bit allows normal I2C0 peripheral interface operations Bit 8 - I2C0_CORE_RSTN Writing '0' to this bit resets APB operation of I2C0 peripheral core Writing '1' to this bit allows normal I2C0 peripheral core APB operations Bit 7 - SPI1_IF_RSTN Writing '0' to this bit resets SPI1 peripheral interface Writing '1' to this bit allows normal SPI1 peripheral interface operations Bit 6 - SPI1_CORE_RSTN Writing '0' to this bit resets APB operation of SPI1 peripheral core Writing '1' to this bit allows normal SPI1 peripheral core APB operations Bit 5 - SPI0_IF_RSTN Writing '0' to this bit resets SPI0 peripheral interface Writing '1' to this bit allows normal SPI0 peripheral interface operations Bit 4 - SPI0_CORE_RSTN Writing '0' to this bit resets APB operation of SPI0 peripheral core Writing '1' to this bit allows normal SPI0 peripheral core APB operations Bit 3 - SPI_FLASH0_RSTN Writing '0' to this bit resets SPI Flash peripheral interface Writing '1' to this bit allows normal SPI Flash peripheral interface operations Bit 2 - SPI_FLASH0_SYS_RSTN Writing '0' to this bit resets AHB operation of SPI Flash peripheral system Writing '1' to this bit allows normal SPI Flash peripheral core AHB operations Bit 1 - CPU_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 39 ATSAMB11XR/ZR Clocking Bit 0 - GLOBAL_RSTN This is an 'INTERNAL' bit. Controlled by ROM firmware and not recommended to change (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 40 ATSAMB11XR/ZR Clocking 9.9.2 LPMCU Global Reset 1 Name: Reset: LPMCU_GLOBAL_RESET_1 0xFFF Absolute Address: 0x4000B008 This register is a part of LPMCU_MISC_REGS0 Registers. This register allows the user to reset the individual peripherals. Bit 15 14 13 12 11 10 9 8 PROV_DMA_C SPI1_SCK_PH SPI0_SCK_PH SPI1_SCK_CL TRL0_RSTN ASE_INT_CLK_ ASE_INT_CLK_ Access Reset Bit 7 6 5 4 K_RSTN RSTN RSTN R/W R/W R/W R/W 1 1 1 1 3 2 1 0 SPI0_SCK_CL SECURITY_AE SECURITY_AE SECURITY_SH SECURITY_SH I2C1_IF_RSTN I2C1_CORE_R DUALTIMER0_ K_RSTN S_AHB_RSTN S_CORE_RST A_AHB_RSTN A_CORE_RST N Access Reset STN RSTN N R/W R/W R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 1 1 Bit 11 - PROV_DMA_CTRL0_RSTN Writing '0' to this bit resets DMA Controller Writing '1' to this bit allows normal DMA Controller operations Bit 10 - SPI1_SCK_PHASE_INT_CLK_RSTN Writing '0' to this bit resets logic that is on SPI1 SCK Phase int clock. Phase int clock is same clock as that of SPI Master SCK clock, that can get inverted depending on the phase setting for the SPI. Writing '1' to this bit allows normal operations Bit 9 - SPI0_SCK_PHASE_INT_CLK_RSTN Writing '0' to this bit resets logic that is on SPI0 SCK Phase int clock. Phase int clock is same clock as that of SPI Master SCK clock, that can get inverted depending on the phase setting for the SPI. Writing '1' to this bit allows normal operations Bit 8 - SPI1_SCK_CLK_RSTN Writing '0' to this bit resets logic that is on SPI1 Master clock Writing '1' to this bit allows normal operations Bit 7 - SPI0_SCK_CLK_RSTN Writing '0' to this bit resets logic that is on SPI0 Master clock Writing '1' to this bit allows normal operations Bit 6 - SECURITY_AES_AHB_RSTN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 5 - SECURITY_AES_CORE_RSTN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 41 ATSAMB11XR/ZR Clocking Bit 4 - SECURITY_SHA_AHB_RSTN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 3 - SECURITY_SHA_CORE_RSTN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 2 - I2C1_IF_RSTN Writing '0' to this bit resets I2C1 peripheral interface Writing '1' to this bit allows normal I2C1 peripheral interface operations Bit 1 - I2C1_CORE_RSTN Writing '0' to this bit resets I2C1 APB operations of peripheral core Writing '1' to this bit allows normal I2C1 peripheral core APB operations Bit 0 - DUALTIMER0_RSTN Writing '0' to this bit resets Dual Timer peripheral Writing '1' to this bit allows normal operations of Dual Timer (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 42 ATSAMB11XR/ZR Clocking 9.9.3 AON Global Reset Name: Reset: AON_GLOBAL_RESET 0x1B Absolute Address: 0x4000F010 This register is a part of AON_GP_REGS0 Registers. This register allows the user to reset the individual Always-On power domain peripherals. Bit 7 6 5 Access Reset 4 3 PD4_RSTN BLE_LP_RSTN 2 1 0 _RSTN N R/W R/W R/W R/W 1 1 1 1 SLEEP_TIMER GLOBAL_RST Bit 4 - PD4_RSTN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 3 - BLE_LP_RSTN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 1 - SLEEP_TIMER_RSTN Writing '0' to this bit resets AON Sleep Timer peripheral Writing '1' to this bit allows normal AON Sleep Timer operations Bit 0 - GLOBAL_RSTN Writing '0' to this bit resets entire chip This is an auto set bit, resets entire chip (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 43 ATSAMB11XR/ZR Clocking 9.9.4 LPMCU Clock Enable 0 Name: Reset: LPMCU_CLOCK_ENABLES_0 0x 627FF9BE Absolute Address: 0x4000B00C This register is a part of LPMCU_MISC_REGS0 Registers. This register allows the user to enable clock for individual peripherals. Bit 31 30 29 28 27 26 25 24 CALIB_CLK_E I2C1_CORE_C QUAD_DEC2_ QUAD_DEC1_ QUAD_DEC0_ BLE_MEM_CL ARM_PCLKG_ Access Reset Bit 23 N LK_EN CLK_EN CLK_EN CLK_EN K_EN EN R/W R/W R/W R/W R/W R/W R/W 1 1 0 0 0 1 0 22 21 20 19 18 17 16 ARM_PCLK_E AON_WRAPPE CALIB_XBAR_I ROM_MEM_CL IDRAM_2_GL_ IDRAM_1_GL_ IRQ_CTRLR_C UART1_IF_CLK Access Reset Bit N R_CLK_EN F_CLK_EN K_EN MEM_CLK_EN MEM_CLK_EN ORE_CLK_EN R/W R/W R/W R/W R/W R/W R/W R/W 0 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 UART1_CORE UART0_IF_CLK UART0_CORE WDT1_CLK_E WDT0_CLK_E Access Reset Bit Reset TIMER0_CLK_ _CLK_EN _EN _CLK_EN N N EN R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 7 6 5 4 3 GPIO_CLK_EN Access _EN 2 1 0 DUALTIMER0_ I2C0_CORE_C SPI1_CORE_C SPI0_CORE_C SPI_FLASH0_C CLK_EN LK_EN LK_EN LK_EN LK_EN R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 Bit 30 - CALIB_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 29 - I2C1_CORE_CLK_EN Writing '0' to this bit disables clock to I2C1 core APB interface Writing '1' to this bit enables clock to I2C1 core APB interface Bit 28 - QUAD_DEC2_CLK_EN Writing '0' to this bit disables clock to Quad Decoder2 Writing '1' to this bit enables clock to Quad Decoder2 Bit 27 - QUAD_DEC1_CLK_EN Writing '0' to this bit disables clock to Quad Decoder1 Writing '1' to this bit enables clock to Quad Decoder1 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 44 ATSAMB11XR/ZR Clocking Bit 26 - QUAD_DEC0_CLK_EN Writing '0' to this bit disables clock to Quad Decoder0 Writing '1' to this bit enables clock to Quad Decoder0 Bit 25 - BLE_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 24 - ARM_PCLKG_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 23 - ARM_PCLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 22 - AON_WRAPPER_CLK_EN This is an INTERNAL bit and not recommended to change Bit 21 - CALIB_XBAR_IF_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 20 - ROM_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 19 - IDRAM_2_GL_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 18 - IDRAM_1_GL_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 17 - IRQ_CTRLR_CORE_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 16 - UART1_IF_CLK_EN Writing '0' to this bit disables clock to UART1 interface Writing '1' to this bit enables clock to UART1 interface Bit 15 - UART1_CORE_CLK_EN Writing '0' to this bit disables clock to UART1 core APB interface Writing '1' to this bit enables clock to UART1 core APB interface Bit 14 - UART0_IF_CLK_EN Writing '0' to this bit disables clock to UART0 interface Writing '1' to this bit enables clock to UART0 interface Bit 13 - UART0_CORE_CLK_EN Writing '0' to this bit disables clock to UART0 core APB interface Writing '1' to this bit enables clock to UART0 core APB interface Bit 12 - WDT1_CLK_EN Writing '0' to this bit disables clock to Watchdog Timer1 Writing '1' to this bit enables clock to Watchdog Timer1 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 45 ATSAMB11XR/ZR Clocking Bit 11 - WDT0_CLK_EN Writing '0' to this bit disables clock to Watchdog Timer0 Writing '1' to this bit enables clock to Watchdog Timer0 Bit 8 - TIMER0_CLK_EN Writing '0' to this bit disables clock to Timer0 Writing '1' to this bit enables clock to Timer0 Bit 7 - GPIO_CLK_EN Writing '0' to this bit disables clock to GPIO controllers Writing '1' to this bit enables clock to GPIO controllers Bit 5 - DUALTIMER0_CLK_EN Writing '0' to this bit disables clock to Dual Timer Writing '1' to this bit enables clock to Dual Timer Bit 4 - I2C0_CORE_CLK_EN Writing '0' to this bit disables clock to I2C0 core APB interface Writing '1' to this bit enables clock to I2C0 core APB interface Bit 3 - SPI1_CORE_CLK_EN Writing '0' to this bit disables clock to SPI1 core APB interface Writing '1' to this bit enables clock to SPI1 core APB interface Bit 2 - SPI0_CORE_CLK_EN Writing '0' to this bit disables clock to SPI0 core APB interface Writing '1' to this bit enables clock to SPI0 core APB interface Bit 1 - SPI_FLASH0_CLK_EN Writing '0' to this bit disables clock to SPI Flash0 Writing '1' to this bit enables clock to SPI Flash0 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 46 ATSAMB11XR/ZR Clocking 9.9.5 LPMCU Clock Enable 1 Name: Reset: LPMCU_CLOCK_ENABLES_1 0xF8783F Absolute Address: 0x4000B010 This register is a part of LPMCU_MISC_REGS0 Registers. This register allows the user to enable clock for individual peripherals. Bit 23 22 21 20 19 18 17 16 IDRAM_2_1_M IDRAM_2_0_M IDRAM_1_2_M IDRAM_1_1_M IDRAM_1_0_M AES_AHB_CLK AES_CORE_C SHA_AHB_CLK Access Reset Bit EM_CLK_EN EM_CLK_EN EM_CLK_EN EM_CLK_EN EM_CLK_EN _EN LK_EN _EN R/W R/W R/W R/W R/W R/W R/W R/W 1 1 1 1 1 0 0 0 15 14 13 12 11 10 9 8 SHA_CORE_C TIMER0_PGCL GPIO_GCLK_E SPI1_SCK_PH SPI0_SCK_PH SENS_ADC_CL PWM3_CLK_E PWM2_CLK_E LK_EN Access K_EN N ASE_INT_CLK_ ASE_INT_CLK_ EN EN K_EN N N R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 1 1 1 1 0 0 0 Bit 7 6 5 4 3 2 1 0 PWM1_CLK_E PWM0_CLK_E EFUSE5_CLK_ EFUSE4_CLK_ EFUSE3_CLK_ EFUSE2_CLK_ EFUSE1_CLK_ EFUSE0_CLK_ Access Reset N N EN EN EN EN EN EN R/W R/W R/W R/W R/W R/W R/W R/W 0 0 1 1 1 1 1 1 Bit 23 - IDRAM_2_1_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 22 - IDRAM_2_0_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 21 - IDRAM_1_2_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 20 - IDRAM_1_1_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 19 - IDRAM_1_0_MEM_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 18 - AES_AHB_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 17 - AES_CORE_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 47 ATSAMB11XR/ZR Clocking Bit 16 - SHA_AHB_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 15 - SHA_CORE_CLK_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 14 - TIMER0_PGCLK_EN Writing '0' to this bit disables clock to Timer0 APB interface Writing '1' to this bit enables clock to Timer0 APB interface Bit 13 - GPIO_GCLK_EN Writing '0' to this bit disables clock to GPIO AHB interface Writing '0' to this bit enables clock to GPIO AHB interface Bit 12 - SPI1_SCK_PHASE_INT_CLK_EN Writing '0' to this bit disables SPI1 SCK Phase int clock. Phase int clock is same clock as that of SPI Master SCK clock, that can get inverted depending on the phase setting for the SPI. Writing '1' to this bit enables SPI1 SCK Phase int clock Bit 11 - SPI0_SCK_PHASE_INT_CLK_EN Writing '0' to this bit disables SPI0 SCK Phase int clock. Phase int clock is same clock as that of SPI Master SCK clock, that can get inverted depending on the phase setting for the SPI. Writing '1' to this bit enables SPI0 SCK Phase int clock Bit 10 - SENS_ADC_CLK_EN Writing '0' to this bit disables ADC peripheral clock Writing '1' to this bit enables ADC peripheral clock Bit 9 - PWM3_CLK_EN Writing '0' to this bit disables PWM3 peripheral clock Writing '1' to this bit enables PWM3 peripheral clock Bit 8 - PWM2_CLK_EN Writing '0' to this bit disables PWM2 peripheral clock Writing '1' to this bit enables PWM2 peripheral clock Bit 7 - PWM1_CLK_EN Writing '0' to this bit disables PWM1 peripheral clock Writing '1' to this bit enables PWM1 peripheral clock Bit 6 - PWM0_CLK_EN Writing '0' to this bit disables PWM0 peripheral clock Writing '1' to this bit enables PWM0 peripheral clock Bit 5 - EFUSE5_CLK_EN Writing '0' to this bit disables EFUSE Bank 6 clock Writing '1' to this bit enables EFUSE Bank6 clock Bit 4 - EFUSE4_CLK_EN Writing '0' to this bit disables EFUSE Bank 5 clock (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 48 ATSAMB11XR/ZR Clocking Writing '1' to this bit enables EFUSE Bank 5 clock Bit 3 - EFUSE3_CLK_EN Writing '0' to this bit disables EFUSE Bank 4 clock Writing '1' to this bit enables EFUSE Bank 4 clock Bit 2 - EFUSE2_CLK_EN Writing '0' to this bit disables EFUSE Bank 3 clock Writing '1' to this bit enables EFUSE Bank 3 clock Bit 1 - EFUSE1_CLK_EN Writing '0' to this bit disables EFUSE Bank 2 clock Writing '1' to this bit enables EFUSE Bank 2 clock Bit 0 - EFUSE0_CLK_EN Writing '0' to this bit disables EFUSE Bank 1 clock Writing '1' to this bit enables EFUSE Bank 1 clock (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 49 ATSAMB11XR/ZR Clocking 9.9.6 AON Clock Enable Name: Reset: AON_MISC_CTRL 0x010000 Absolute Address: 0x4000F00C This register is a part of AON_GP_REGS0 Registers. This register allows the user to enable clock for AON power domain peripherals. Bit 23 22 21 20 19 18 17 16 FORCE_XO_T FORCE_OFF_ INVERT_WAKE USE_RTC_AO AON_EXT_32K AON_SLEEP_T O_BYPASS_M XO UP_GPIO_0 N_PWR_SEQ_ HZ_OUT_EN IMER_CLK_EN R/W R/W R/W R/W R/W R/W 0 0 0 0 0 1 13 12 11 10 9 8 5 4 3 2 1 0 ODE Access Reset Bit 15 14 CLK USE_OSC2M_ USE_2M_AON AS_TB_CLK _PWR_SEQ_C R/W R/W Reset 0 0 Bit 7 LK Access 6 LPMCU_CPU_ LPMCU_CPU_ LPMCU_USE_ LPMCU_BOOT USE_EXT_32K USE_RTC_32K RESET_OVER RESET_OVER BOOT_REGS _RESET_MUX_ HZ_CLK_SLEE HZ_CLK_SLEE Access Reset RIDE_VAL RIDE_EN R/W R/W 0 0 SEL P_TIMER P_TIMER R/W R/W R/W R/W 0 0 0 0 Bit 21 - FORCE_XO_TO_BYPASS_MODE This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 20 - FORCE_OFF_XO This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 19 - INVERT_WAKEUP_GPIO_0 This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 18 - USE_RTC_AON_PWR_SEQ_CLK This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 17 - AON_EXT_32KHZ_OUT_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 16 - AON_SLEEP_TIMER_CLK_EN Writing '0' to this bit disables AON Sleep Timer peripheral clock Writing '1' to this bit enables AON Sleep Timer peripheral clock (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 50 ATSAMB11XR/ZR Clocking Bit 15 - USE_OSC2M_AS_TB_CLK This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 14 - USE_2M_AON_PWR_SEQ_CLK This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 6 - LPMCU_CPU_RESET_OVERRIDE_VAL This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 5 - LPMCU_CPU_RESET_OVERRIDE_EN This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 4 - LPMCU_USE_BOOT_REGS This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 3 - LPMCU_BOOT_RESET_MUX_SEL This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 2 - USE_EXT_32KHZ_CLK_SLEEP_TIMER This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change Bit 1 - USE_RTC_32KHZ_CLK_SLEEP_TIMER This is an INTERNAL bit. Controlled by ROM firmware and not recommended to change (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 51 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10. I/O Peripheral Multiplexing and MEGAMUXing This chapter describes the peripheral multiplexing and MEGAMUXing options of the I/O pins. I/O Multiplexing By default, each pin is controlled by the GPIO controller as a general purpose I/O. Alternatively, it can be assigned to one of the peripheral functions. The I/O pins are categorized into three different groups called LP_GPIO_x (Low Power), AO_GPIO_z (Always ON) and GPIO_MSy (Mixed Signal). To enable a specific peripheral function on a LP_GPIO_x pin, the PINMUX_SEL_n, (n=0,1..4) register corresponding to that pin must be written with the specific MUX value. The specific functionality on AO_GPIO_z pin is selected by configuring MUX value in the AON_PINMUX_SEL register. Only, MUX0 is possible for GPIO_MSy to configure either as digital or analog I/O using the MS_GPIO_MODE register. Pin Name ZR Pin No. Table 10-1. I/O Port Function Multiplexing XR Pin No. 10.1 GPIO Controller Pull MUX0 MUX1 MUX2 MUX3 MUX4 MUX5 MUX6 MUX7 LP_GPIO_0 35 12 GPIO0_00 Up/ Down GPIO 0 MEGAMUX 0 SWD CLK - - - - TEST OUT 0 LP_GPIO_1 36 13 GPIO0_01 Up/ Down GPIO 1 MEGAMUX 1 SWD I/O - - - - TEST OUT 1 LP_GPIO_2 37 14 GPIO0_02 Up/ Down GPIO 2 MEGAMUX 2 UART0 RXD - SPI1 SCK SPI0 SCK SPI FLASH0 SCK TEST OUT 2 LP_GPIO_3 38 15 GPIO0_03 Up/ Down GPIO 3 MEGAMUX 3 UART0 TXD - SPI1 MOSI SPI0 MOSI SPI FLASH0 TXD TEST OUT 3 LP_GPIO_4 39 16 GPIO0_04 Up/ Down GPIO 4 MEGAMUX 4 UART0 CTS - SPI1 SSN SPI0 SSN SPI FLASH0 SSN TEST OUT 4 LP_GPIO_5 2 17 GPIO0_05 Up/ Down GPIO 5 MEGAMUX 5 UART0 RTS SPI1 MISO SPI0 MISO SPI FLASH0 RXD TEST OUT 5 LP_GPIO_6 3 18 GPIO0_06 Up/ Down GPIO 6 MEGAMUX 6 UART1 RXD - - SPI0 SCK SPI FLASH0 SCK TEST OUT 6 LP_GPIO_7 4 19 GPIO0_07 Up/ Down GPIO 7 MEGAMUX 7 UART1 TXD - - SPI0 MOSI SPI FLASH0 TXD TEST OUT 7 LP_GPIO_8 5 20 GPIO0_08 Up/ Down GPIO 8 MEGAMUX 8 I2C0 SDA - - SPI0 SSN SPI FLASH0 SSN TEST OUT 8 LP_GPIO_9 6 21 GPIO0_09 Up/ Down GPIO 9 MEGAMUX 9 I2C0 SCL - - SPI0 MISO SPI FLASH0 RXD TEST OUT 9 LP_GPIO_10 7 22 GPIO0_10 Up/ Down GPIO 10 MEGAMUX 10 SPI0 SCK - - - SPI FLASH0 SCK TEST OUT 10 LP_GPIO_11 8 23 GPIO0_11 Up/ Down GPIO 11 MEGAMUX 11 SPI0 MOSI - - - SPI FLASH0 TXD TEST OUT 11 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 52 ATSAMB11XR/ZR ZR Pin No. Pin Name XR Pin No. I/O Peripheral Multiplexing and MEGAMUXing GPIO Controller Pull MUX0 MUX1 MUX2 MUX3 MUX4 MUX5 MUX6 MUX7 LP_GPIO_12 9 24 GPIO0_12 Up/ Down GPIO 12 MEGAMUX 12 SPI0 SSN - - - SPI FLASH0 SSN TEST OUT 12 LP_GPIO_13 10 25 GPIO0_13 Up/ Down GPIO 13 MEGAMUX 13 SPI0 MISO - - - SPI FLASH0 RXD TEST OUT 13 LP_GPIO_14 23 4 GPIO0_14 Up/ Down GPIO 14 MEGAMUX 14 UART1 CTS - I2C1 SDA - - TEST OUT 14 LP_GPIO_15 24 5 GPIO0_15 Up/ Down GPIO 15 MEGAMUX 15 UART1 RTS - I2C1 SCL - - TEST OUT 15 LP_GPIO_16 25 6 GPIO1_00 Up/ Down GPIO 16 MEGAMUX 16 SPI FLASH0 SCK - SPI1 SSN SPI0 SCK SPI FLASH0 SSN TEST OUT 16 LP_GPIO_17 28 8 GPIO1_01 Up/ Down GPIO 17 MEGAMUX 17 SPI FLASH0 TXD - SPI1 SCK SPI0 MOSI - TEST OUT 17 LP_GPIO_18 29 9 GPIO1_02 Up/ Down GPIO 18 MEGAMUX 18 SPI FLASH0 SSN - SPI1 MISO SPI0 SSN SPI FLASH0 RXD TEST OUT 18 LP_GPIO_19 30 10 GPIO1_03 Up/ Down GPIO 19 MEGAMUX 19 SPI FLASH0 RXD - SPI1 MOSI SPI0 MISO - TEST OUT 19 LP_GPIO_22 40 GPIO1_06 Up/ Down GPIO 22 MEGAMUX 22 - - - - - - LP_GPIO_23 1 GPIO1_07 Up/ Down GPIO 23 MEGAMUX 23 - - - - - - LP_GPIO_24 25 GPIO1_08 Up/ Down GPIO 24 MEGAMUX 24 - - - - - - AO_GPIO_0 20 1 GPIO1_15 Up GPIO 31 WAKEUP RTC CLK IN 32kHZ CLK OUT - - - - AO_GPIO_1 21 2 GPIO1_14 Up GPIO 30 WAKEUP RTC CLK IN 32kHZ CLK OUT - - - - AO_GPIO_2 22 3 GPIO1_13 Up GPIO 29 WAKEUP RTC CLK IN 32kHZ CLK OUT - - - - GPIO_MS1(1) 12 17 GPIO2_15 Up/ Down GPIO 47 - - - - - - - GPIO_MS2 (1) 13 18 GPIO2_14 Up/ Down GPIO 46 - - - - - - - GPIO_MS3 (1) 15 31 GPIO2_13 Up/ Down GPIO 45 - - - - - - - GPIO_MS4 (1) 16 32 GPIO2_12 Up/ Down GPIO 44 - - - - - - - Note: 1. If analog is selected, then the digital is disabled. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 53 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 2. 10.1.1 MUX2 is the default MUX value for LP_GPIO_0 and LP_GPIO_1 to function as Single Wire Debug (SWD) interface. It is not recommended to use these pins for other peripheral functionality, as these pins are used for programming/debugging. Example An example to illustrate the available options for LP_GPIO_3 pin, depending on the PINMUX_SEL [2:0] LP_GPIO_3 value selected on [14:12] bits of PINMUX_SEL_0 register: * * * * * * * * 10.2 MUX0 - the pin functions general purpose I/O and is controlled by the GPIO controller. MUX1 - any option from the Table 10-2 is selected using MEGA_MUX_IO_SEL_n (n=0,1,2..6) register. It can be a quad_dec, pwm, or any of the other functions listed in the Table 10-2. MUX2 - the pin functions as UART1 TXD. This is achieved with the MUX1 option via MEGAMUX, but the MUX2 option allows a shortcut for the recommended pinout. MUX3 - this option is not used and thus defaults to MUX0. MUX4 - the pin functions as SPI1 MOSI. MUX5 - the pin functions as SPI0 MOSI. MUX6 - the pin functions as SPI FLASH0 SCK. MUX7 - the pin functions as bit 3 of the test output bus, giving access to various debug signals. MEGAMUXing In addition to peripheral multiplexing, the MEGAMUXing option allows more flexibility for mapping desired interfaces on I/O pins. The MUX1 option in Table 10-1 allows for any MEGAMUX option from Table 10-2 to be assigned to an I/O pin. When PINMUX_SEL_n (n=0 to 4) is assigned with MUX1 then the MEGA_MUX_IO_SEL_n (n=0 to 6) register is used to configure MEGAMUX for LP_GPIO_x I/O pins. MEGAMUX configuration is not possible for GPIO_MSy and AO_GPIO_z I/O pins. The use case of the MEGAMUX option is that when a specific peripheral functionality is not available on an intended LP_GPIO_x pin through MUX2 to MUX6 configurations, the MEGAMUX option allows that functionality. Table 10-2. MEGAMUX Options MUX_Sel Function 0x00 UART0 RXD 0x01 UART0 TXD 0x02 UART0 CTS 0x03 UART0 RTS 0x04 UART1 RXD 0x05 UART1 TXD 0x06 UART1 CTS 0x07 UART1 RTS 0x08 I2C0 SDA (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 54 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.2.1 MUX_Sel Function 0x09 I2C0 SCL 0x0A I2C1 SDA 0x0B I2C1 SCL 0x0C PWM 0 0x0D PWM 1 0x0E PWM 2 0x0F PWM 3 0x10 LP CLOCK OUT 0x11 Reserved 0x12 Reserved 0x13 Reserved 0x14 Reserved 0x15 Reserved 0x16 Reserved 0x17 Reserved 0x18 Reserved 0x19 Reserved 0x1A Reserved 0x1B Reserved 0x1C Reserved 0x1D QUAD DEC X IN A 0x1E QUAD DEC X IN B 0x1F QUAD DEC Y IN A 0x20 QUAD DEC Y IN B 0x21 QUAD DEC Z IN A 0x22 QUAD DEC Z IN B Example An example of peripheral assignment using these MEGAMUX options is as follows: (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 55 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing * * 10.3 I2C0 PINMUXed on LP_GPIO_10 and LP_GPIO_11 via - PINMUX_SEL_1 register PINMUX_SEL[2:0] LP_GPIO_10 = 1 PINMUX_SEL[2:0] LP_GPIO_11 = 1. - MEGA_MUX_IO_SEL_2 register MEGAMUX_SEL[5:0] LP_GPIO_10 = 0x08 and MEGAMUX_SEL[5:0] LP_GPIO_11 = 0x09. 2 I C1 PINMUXed on LP_GPIO_0 and LP_GPIO_1 via - PINMUX_SEL_0 register PINMUX_SEL[2:0] LP_GPIO_0 = 1 PINMUX_SEL[2:0] LP_GPIO_1 = 1. - MEGA_MUX_IO_SEL_1 register MEGAMUX_SEL[5:0] LP_GPIO_0 = 0x0A and MEGAMUX_SEL[5:0] LP_GPIO_1 = 0x0B. Register Summary This is the summary of all the registers used in this chapter. Absolute Address 0x4000B044 0x4000B048 0x4000B04C 0x4000B080 Register Group Name LPMCU_MISC_ REGS0 PINMUX_SEL_ 0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 PINMUX_SEL_ 1 PINMUX_SEL_ 2 PINMUX_SEL_ 4 Bit Pos. 7:0 PINMUX_SEL[2:0] LP_GPIO_1 PINMUX_SEL[2:0] LP_GPIO_0 15:8 PINMUX_SEL[2:0] LP_GPIO_3 PINMUX_SEL[2:0] LP_GPIO_2 23:16 PINMUX_SEL[2:0] LP_GPIO_5 PINMUX_SEL[2:0] LP_GPIO_4 31:24 PINMUX_SEL[2:0] LP_GPIO_7 PINMUX_SEL[2:0] LP_GPIO_6 7:0 PINMUX_SEL[2:0] LP_GPIO_9 PINMUX_SEL[2:0] LP_GPIO_8 15:8 PINMUX_SEL[2:0] LP_GPIO_11 PINMUX_SEL[2:0] LP_GPIO_10 23:16 PINMUX_SEL[2:0] LP_GPIO_13 PINMUX_SEL[2:0] LP_GPIO_12 31:24 PINMUX_SEL[2:0] LP_GPIO_15 PINMUX_SEL[2:0] LP_GPIO_14 7:0 PINMUX_SEL[2:0] LP_GPIO_17 PINMUX_SEL[2:0] LP_GPIO_16 15:8 PINMUX_SEL[2:0] LP_GPIO_19 PINMUX_SEL[2:0] LP_GPIO_18 23:16 PINMUX_SEL[2:0] LP_GPIO_21 PINMUX_SEL[2:0] LP_GPIO_20 31:24 PINMUX_SEL[2:0] LP_GPIO_23 PINMUX_SEL[2:0] LP_GPIO_22 7:0 PINMUX_SEL[2:0] LP_GPIO_24 15:8 23:16 31:24 0x4000B1A0 0x4000B1A4 0x4000B1A8 0x4000B1AC LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 MEGA_MUX_I O_SEL_0 MEGA_MUX_I O_SEL_1 MEGA_MUX_I O_SEL_2 MEGA_MUX_I O_SEL_3 7:0 MEGAMUX_SEL[5:0] LP_GPIO_0 15:8 MEGAMUX_SEL[5:0] LP_GPIO_1 23:16 MEGAMUX_SEL[5:0] LP_GPIO_2 31:24 MEGAMUX_SEL[5:0] LP_GPIO_3 7:0 MEGAMUX_SEL[5:0] LP_GPIO_4 15:8 MEGAMUX_SEL[5:0] LP_GPIO_5 23:16 MEGAMUX_SEL[5:0] LP_GPIO_6 31:24 MEGAMUX_SEL[5:0] LP_GPIO_7 7:0 MEGAMUX_SEL[5:0] LP_GPIO_8 15:8 MEGAMUX_SEL[5:0] LP_GPIO_9 23:16 MEGAMUX_SEL[5:0] LP_GPIO_10 31:24 MEGAMUX_SEL[5:0] LP_GPIO_11 7:0 MEGAMUX_SEL[5:0] LP_GPIO_12 15:8 MEGAMUX_SEL[5:0] LP_GPIO_13 23:16 MEGAMUX_SEL[5:0] LP_GPIO_14 31:24 MEGAMUX_SEL[5:0] LP_GPIO_15 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 56 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing Absolute Address 0x4000B1B0 0x4000B1B4 Register Group LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 Name MEGA_MUX_I O_SEL_4 MEGA_MUX_I O_SEL_5 Bit Pos. 7:0 MEGAMUX_SEL[5:0] LP_GPIO_16 15:8 MEGAMUX_SEL[5:0] LP_GPIO_17 23:16 MEGAMUX_SEL[5:0] LP_GPIO_18 31:24 MEGAMUX_SEL[5:0] LP_GPIO_19 7:0 MEGAMUX_SEL[5:0] LP_GPIO_20 15:8 MEGAMUX_SEL[5:0] LP_GPIO_21 23:16 MEGAMUX_SEL[5:0] LP_GPIO_22 31:24 MEGAMUX_SEL[5:0] LP_GPIO_23 MEGAMUX_SEL[5:0] LP_GPIO_24 0x4000B1B8 LPMCU_MISC_ REGS0 MEGA_MUX_I O_SEL_6 7:0 0x4000F000 AON_GP_REG S0 AON_PINMUX_ SEL 7:0 0x4000F410 AON_GP_REG S0 MS_GPIO_MO DE PINMUX_SEL[1:0] AO_GPIO_1 PINMUX_SEL[1:0] AO_GPIO_0 15:8 10.4 7:0 PINMUX_SEL[1:0] AO_GPIO_2 ANALOG_EN GPIO_MS3 ANALOG_EN GPIO_MS2 ANALOG_EN GPIO_MS1 ANALOG_EN GPIO_MS0 Register Description (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 57 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.1 LP_GPIO_x Peripheral Multiplexing 0 Name: Reset: PINMUX_SEL_0 0x00000022 Absolute Address: 0x4000B044 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_0, LP_GPIO_1, LP_GPIO_2, LP_GPIO_3, LP_GPIO_4, LP_GPIO_5, LP_GPIO_6, LP_GPIO_7 pins as listed in Table 10-1. Bit 31 30 29 28 27 26 PINMUX_SEL[2:0] LP_GPIO_x Access Reset Bit 23 Reset Bit 15 R/W R/W R/W R/W R/W 0 0 0 0 0 0 21 20 17 16 22 19 18 PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 14 13 12 10 9 8 11 PINMUX_SEL[2:0] LP_GPIO_x Access Reset Bit 7 PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 5 4 1 0 6 3 2 PINMUX_SEL[2:0] LP_GPIO_x Access Reset 24 R/W PINMUX_SEL[2:0] LP_GPIO_x Access 25 PINMUX_SEL[2:0] LP_GPIO_x PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 1 0 0 1 0 Bits 30:28, 26:24, 22:20, 18:16, 14:12, 10:8, 6:4, 2:0 - PINMUX_SEL[2:0] LP_GPIO_x (x = 7 to 0) Pin mux configuration These bits select peripheral function for LP_GPIO_x (x = 7 to 0; Replace x=7 for 30:28 bits, ... x=0 for 2:1 bits) PINMUX_SEL[2:0] Description 0x0 MUX0 peripheral function is selected 0x1 MUX1 (MEGAMUX) peripheral function is selected 0x2 MUX2 peripheral function is selected 0x3 MUX3 peripheral function is selected 0x4 MUX4 peripheral function is selected 0x5 MUX5 peripheral function is selected 0x6 MUX6 peripheral function is selected 0x7 MUX7 peripheral function is selected (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 58 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.2 LP_GPIO_x Peripheral Multiplexing 1 Name: Reset: PINMUX_SEL_1 0x00000033 Absolute Address: 0x4000B048 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_8, LP_GPIO_9, LP_GPIO_10, LP_GPIO_11, LP_GPIO_12, LP_GPIO_13, LP_GPIO_14, LP_GPIO_15 pins as listed in Table 10-1. Bit 31 30 29 28 27 26 PINMUX_SEL[2:0] LP_GPIO_x Access Reset Bit 23 Reset Bit 15 R/W R/W R/W R/W R/W 0 0 0 0 0 0 21 20 17 16 22 19 18 PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 14 13 12 10 9 8 11 PINMUX_SEL[2:0] LP_GPIO_x Access Reset Bit 7 PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 5 4 1 0 6 3 2 PINMUX_SEL[2:0] LP_GPIO_x Access Reset 24 R/W PINMUX_SEL[2:0] LP_GPIO_x Access 25 PINMUX_SEL[2:0] LP_GPIO_x PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 1 1 0 1 1 Bits 30:28, 26:24, 22:20, 18:16, 14:12, 10:8, 6:4, 2:0 - PINMUX_SEL[2:0] LP_GPIO_x (x = 15 to 8) Pin mux configuration These bits select peripheral function for LP_GPIO_x (x = 15 to 8; Replace x=15 for 30:28 bits, ... x=8 for 2:1 bits) PINMUX_SEL[2:0] Description 0x0 MUX0 peripheral function is selected 0x1 MUX1 (MEGAMUX) peripheral function is selected 0x2 MUX2 peripheral function is selected 0x3 MUX3 peripheral function is selected 0x4 MUX4 peripheral function is selected 0x5 MUX5 peripheral function is selected 0x6 MUX6 peripheral function is selected 0x7 MUX7 peripheral function is selected (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 59 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.3 LP_GPIO_x Peripheral Multiplexing 2 Name: Reset: PINMUX_SEL_2 0x00000000 Absolute Address: 0x4000B04C This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_16, LP_GPIO_17, LP_GPIO_18, LP_GPIO_19, LP_GPIO_20, LP_GPIO_21, LP_GPIO_22, LP_GPIO_23 pins as listed in Table 10-1. Bit 31 30 29 28 27 26 PINMUX_SEL[2:0] LP_GPIO_x Access Reset Bit 23 Reset Bit 15 R/W R/W R/W R/W R/W 0 0 0 0 0 0 21 20 17 16 22 19 18 PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 14 13 12 10 9 8 11 PINMUX_SEL[2:0] LP_GPIO_x Access Reset Bit 7 PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 5 4 1 0 6 3 2 PINMUX_SEL[2:0] LP_GPIO_x Access Reset 24 R/W PINMUX_SEL[2:0] LP_GPIO_x Access 25 PINMUX_SEL[2:0] LP_GPIO_x PINMUX_SEL[2:0] LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 Bits 30:28, 26:24, 22:20, 18:16, 14:12, 10:8, 6:4, 2:0 - PINMUX_SEL[2:0] LP_GPIO_x (x = 23 to 16) Pin mux configuration These bits select peripheral function for LP_GPIO_x (x = 23 to 16; Replace x=23 for 30:28 bits, ... x=16 for 2:1 bits) PINMUX_SEL[2:0] Description 0x0 MUX0 peripheral function is selected 0x1 MUX1 (MEGAMUX) peripheral function is selected 0x2 MUX2 peripheral function is selected 0x3 MUX3 peripheral function is selected 0x4 MUX4 peripheral function is selected 0x5 MUX5 peripheral function is selected 0x6 MUX6 peripheral function is selected 0x7 MUX7 peripheral function is selected (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 60 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.4 LP_GPIO_x Peripheral Multiplexing 4 Name: Reset: PINMUX_SEL_4 0x00000000 Absolute Address: 0x4000B080 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_24 pin as listed in Table 10-1. Bit 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Access Reset Bit Access Reset Bit Access Reset Bit PINMUX_SEL[2:0] LP_GPIO_x Access Reset R/W R/W R/W 0 0 0 Bits 2:0 - PINMUX_SEL[2:0] LP_GPIO_x (x = 24) Pin mux configuration These bits select peripheral function for LP_GPIO_x (x = 24). PINMUX_SEL[2:0] Description 0x0 MUX0 peripheral function is selected 0x1 MUX1 (MEGAMUX) peripheral function is selected 0x2 MUX2 peripheral function is selected 0x3 MUX3 peripheral function is selected 0x4 MUX4 peripheral function is selected 0x5 MUX5 peripheral function is selected 0x6 MUX6 peripheral function is selected 0x7 MUX7 peripheral function is selected (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 61 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.5 LP_GPIO_x Mega Multiplexing 0 Name: Reset: MEGA_MUX_IO_SEL_0 0x3F3F3F3F Absolute Address: 0x4000B1A0 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_0, LP_GPIO_1, LP_GPIO_2, LP_GPIO_3 pins using MEGAMUX configuration as listed in Table 10-2. Bit 31 30 29 28 27 26 25 24 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 23 22 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 21 20 19 18 17 16 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 15 14 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 13 12 11 10 9 8 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 5 4 3 2 1 0 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 7 6 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 Bits 29:24, 21:16, 13:8, 5:0 - MEGAMUX_SEL[5:0] LP_GPIO_x (x = 3 to 0; Replace x=3 for 29:24 bits, ... x=0 for 5:0 bits) MEGAMUX configuration These bits select peripheral function for LP_GPIO_x when, corresponding PINMUX_SEL[2:0] value in PINMUX_SEL_n register is 1 (MUX1). See Table 10-2 for different possible peripheral options for MEGAMUX_SEL[5:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 62 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.6 LP_GPIO_x Mega Multiplexing 1 Name: Reset: MEGA_MUX_IO_SEL_1 0x3F3F3F3F Absolute Address: 0x4000B1A4 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_4, LP_GPIO_5, LP_GPIO_6, LP_GPIO_7 pins using MEGAMUX configuration as listed in Table 10-2. Bit 31 30 29 28 27 26 25 24 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 23 22 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 21 20 19 18 17 16 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 15 14 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 13 12 11 10 9 8 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 5 4 3 2 1 0 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 7 6 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 Bits 29:24, 21:16, 13:8, 5:0 - MEGAMUX_SEL[5:0] LP_GPIO_x (x = 7 to 4; Replace x=7 for 29:24 bits, ... x=4 for 5:0 bits) MEGAMUX configuration These bits select peripheral function for LP_GPIO_x when, corresponding PINMUX_SEL[2:0] value in PINMUX_SEL_n register is 1 (MUX1). See Table 10-2 for different possible peripheral options for MEGAMUX_SEL[5:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 63 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.7 LP_GPIO_x Mega Multiplexing 2 Name: Reset: MEGA_MUX_IO_SEL_2 0x3F3F3F3F Absolute Address: 0x4000B1A8 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_8, LP_GPIO_9, LP_GPIO_10, LP_GPIO_11 pins using MEGAMUX configuration as listed in Table 10-2. Bit 31 30 29 28 27 26 25 24 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 23 22 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 21 20 19 18 17 16 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 15 14 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 13 12 11 10 9 8 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 5 4 3 2 1 0 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 7 6 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 Bits 29:24, 21:16, 13:8, 5:0 - MEGAMUX_SEL[5:0] LP_GPIO_x (x = 11 to 8; Replace x=11 for 29:24 bits, ... x=8 for 5:0 bits) MEGAMUX configuration These bits select peripheral function for LP_GPIO_x when, corresponding PINMUX_SEL[2:0] value in PINMUX_SEL_n register is 1 (MUX1). See Table 10-2 for different possible peripheral options for MEGAMUX_SEL[5:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 64 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.8 LP_GPIO_x Mega Multiplexing 3 Name: Reset: MEGA_MUX_IO_SEL_3 0x3F3F3F3F Absolute Address: 0x4000B1AC This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_12, LP_GPIO_13, LP_GPIO_14, LP_GPIO_15 pins using MEGAMUX configuration as listed in Table 10-2. Bit 31 30 29 28 27 26 25 24 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 23 22 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 21 20 19 18 17 16 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 15 14 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 13 12 11 10 9 8 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 5 4 3 2 1 0 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 7 6 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 Bits 29:24, 21:16, 13:8, 5:0 - MEGAMUX_SEL[5:0] LP_GPIO_x (x = 15 to 12; Replace x=15 for 29:24 bits, ... x=12 for 5:0 bits) MEGAMUX configuration These bits select peripheral function for LP_GPIO_x when, corresponding PINMUX_SEL[2:0] value in PINMUX_SEL_n register is 1 (MUX1). See Table 10-2 for different possible peripheral options for MEGAMUX_SEL[5:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 65 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.9 LP_GPIO_x Mega Multiplexing 4 Name: Reset: MEGA_MUX_IO_SEL_4 0x3F3F3F3F Absolute Address: 0x4000B1B0 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_16, LP_GPIO_17, LP_GPIO_18, LP_GPIO_19 pins using MEGAMUX configuration as listed in Table 10-2. Bit 31 30 29 28 27 26 25 24 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 23 22 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 21 20 19 18 17 16 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 15 14 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 13 12 11 10 9 8 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 5 4 3 2 1 0 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 7 6 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 Bits 29:24, 21:16, 13:8, 5:0 - MEGAMUX_SEL[5:0] LP_GPIO_x (x = 19 to 16; Replace x=19 for 29:24 bits, ... x=16 for 5:0 bits) MEGAMUX configuration These bits select peripheral function for LP_GPIO_x when, corresponding PINMUX_SEL[2:0] value in PINMUX_SEL_n register is 1 (MUX1). See Table 10-2 for different possible peripheral options for MEGAMUX_SEL[5:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 66 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.10 LP_GPIO_x Mega Multiplexing 5 Name: Reset: MEGA_MUX_IO_SEL_5 0x3F3F3F3F Absolute Address: 0x4000B1B4 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_20, LP_GPIO_21, LP_GPIO_22, LP_GPIO_23 pins using MEGAMUX configuration as listed in Table 10-2. Bit 31 30 29 28 27 26 25 24 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 23 22 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 21 20 19 18 17 16 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 15 14 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 13 12 11 10 9 8 R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 5 4 3 2 1 0 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset Bit 7 6 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 Bits 29:24, 21:16, 13:8, 5:0 - MEGAMUX_SEL[5:0] LP_GPIO_x (x = 23 to 20; Replace x=23 for 29:24 bits, ... x=20 for 5:0 bits) MEGAMUX configuration These bits select peripheral function for LP_GPIO_x when, corresponding PINMUX_SEL[2:0] value in PINMUX_SEL_n register is 1 (MUX1). See Table 10-2 for different possible peripheral options for MEGAMUX_SEL[5:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 67 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.11 LP_GPIO_x Mega Multiplexing 6 Name: Reset: MEGA_MUX_IO_SEL_6 3F Absolute Address: 0x4000B1B8 This register is a part of LPMCU_MISC_REGS0 registers. This register allows the user to enable a specific peripheral function on LP_GPIO_24 pin using MEGAMUX configuration as listed in Table 10-2. Bit 7 6 5 4 3 2 1 0 MEGAMUX_SEL[5:0] LP_GPIO_x Access Reset R/W R/W R/W R/W R/W R/W 1 1 1 1 1 1 Bits 5:0 - MEGAMUX_SEL[5:0] LP_GPIO_x (x = 24) MEGAMUX configuration These bits select peripheral function for LP_GPIO_x when, corresponding PINMUX_SEL[2:0] value in PINMUX_SEL_n register is 1 (MUX1). See Table 10-2 for different possible peripheral options for MEGAMUX_SEL[5:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 68 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.12 AO_GPIO_z Peripheral Multiplexing Name: Reset: AON_PINMUX_SEL 0x0001 Absolute Address: 0x4000F000 This register is a part of AON_GP_REGS0 registers. This register allows the user to enable a specific peripheral function on AO_GPIO_z pins as listed in I/O Port Function Multiplexing table. Bit 15 14 13 12 11 10 9 8 PINMUX_SEL[1:0] AO_GPIO_z Access Reset Bit 7 6 5 4 3 2 PINMUX_SEL[1:0] AO_GPIO_z Access Reset R/W R/W 0 0 1 0 PINMUX_SEL[1:0] AO_GPIO_z R/W R/W R/W R/W 0 0 0 1 Bits 9:8, 5:4, 1:0 - PINMUX_SEL[1:0] AO_GPIO_z (z = 2 to 0; Replace z=2 for 9:8 bits , ... z=0 for 1:0 bits) Pin mux configuration These bits select peripheral function for AO_GPIO_z pin. PINMUX_SEL[1:0] Description 0x0 MUX0 peripheral function is selected 0x1 MUX1 peripheral function is selected 0x2 MUX2 peripheral function is selected 0x3 MUX3 peripheral function is selected (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 69 ATSAMB11XR/ZR I/O Peripheral Multiplexing and MEGAMUXing 10.4.13 GPIO_MSy Mixed Signal Mode Select Name: Reset: MS_GPIO_MODE 0x0F Absolute Address: 0x4000F410 This register is a part of AON_GP_REGS0 registers. This register allows the user to configure GPIO_MSy as either digital I/O pin or analog input pin. Bit 7 6 Access Reset 5 4 3 2 1 0 ANALOG_EN ANALOG_EN ANALOG_EN ANALOG_EN GPIO_MSy GPIO_MSy GPIO_MSy GPIO_MSy R/W R/W R/W R/W 1 1 1 1 Bits 3,2,1,0 - ANALOG_EN GPIO_MSy (y = 1 to 4 ; y=1 for bit 3, ... y=4 for bit 0) Mixed Signal Mode Select Writing '0' to a bit configures GPIO_MSy as digital I/O. Writing '1' to a bit configures GPIO_MSy as an analog input pin. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 70 ATSAMB11XR/ZR Muxable Interrupt 11. Muxable Interrupt The Nested Vectored Interrupt Controller (NVIC) supports 32 interrupt lines. Each of the 32 interrupt lines is connected to one peripheral instance, as shown in the ATSAMB11 Interrupt Vector Table table. It is possible to change this default interrupt mapping to a different peripheral through muxable interrupt configuration. IRQ number 0 to IRQ number 20 are muxable interrupts. The following table provides the list of interrupt options available for each of the muxable interrupts. IRQ_MUX_IO_SEL_n (n = 0 to 20) is the register used to configure the muxable interrupt options. The default value of IRQ_MUX_IO_SEL_n is zero; that is, the IRQ source for the IRQ number (0 to 20) is default as mentioned in the ATSAMB11 Interrupt Vector Table. The use case of the muxable interrupt option is that when a specific peripheral interrupt (eg: DMA Status) is not mapped in the default ATSAMB11 Interrupt Vector Table, then the peripheral interrupt can be mapped through the muxable interrupt configuration. Table 11-1. ATSAMB11 Muxable Interrupt Options Option Interrupt Source 0x1 UART0 RX 0x2 UART0 TX 0x3 UART1 RX 0x4 UART1 TX 0x5 SPI0 RX 0x6 SPI0 TX 0x7 SPI1 RX 0x8 SPI1 TX 0x9 I2C0 RX 0xA I2C0 TX 0xB I2C1 RX 0xC I2C1 TX 0xD WDT0 - RESERVED 0xE WDT1 0xF ARM DUALTIMER 0x10 DMA STATUS 0x11 SECURITY 0x12 RESERVED 0x13 QUAD DECODER 0x14 RESERVED 0x15 RESERVED (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 71 ATSAMB11XR/ZR Muxable Interrupt 11.1 Option Interrupt Source 0x16 RESERVED 0x17 RESERVED 0x18 BROWNOUT DETECTED Example An example of providing interrupt source as QUAD DECODER for IRQ number 11 using the muxable interrupt options is as follows: 1. Configure IRQ_MUX_IO_SEL_2 register MUX_11[4:0] = 0x13. 2. Follow the steps provided in Functional Description for enabling the interrupt. 11.2 Register Summary This is the summary of all the registers used in this chapter. Absolute Address 0x4000B0C0 0x4000B0C4 0x4000B0C8 0x4000B0CC 0x4000B0D0 0x4000B0D4 11.3 Register Group Name LPMCU_MISC_ REGS0 IRQ_MUX_IO_ SEL_0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 IRQ_MUX_IO_ SEL_1 IRQ_MUX_IO_ SEL_2 IRQ_MUX_IO_ SEL_3 IRQ_MUX_IO_ SEL_4 IRQ_MUX_IO_ SEL_5 Bit Pos. 7:0 MUX_0[4:0] 15:8 MUX_1[4:0] 23:16 MUX_2[4:0] 31:24 MUX_3[4:0] 7:0 MUX_4[4:0] 15:8 MUX_5[4:0] 23:16 MUX_6[4:0] 31:24 MUX_7[4:0] 7:0 MUX_8[4:0] 15:8 MUX_9[4:0] 23:16 MUX_10[4:0] 31:24 MUX_11[4:0] 7:0 MUX_12[4:0] 15:8 MUX_13[4:0] 23:16 MUX_14[4:0] 31:24 MUX_15[4:0] 7:0 MUX_16[4:0] 15:8 MUX_17[4:0] 23:16 MUX_18[4:0] 31:24 MUX_19[4:0] 7:0 MUX_20[4:0] Register Description (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 72 ATSAMB11XR/ZR Muxable Interrupt 11.3.1 IRQ Multiplexing 0 Name: Reset: IRQ_MUX_IO_SEL_0 0x00000000 Absolute Address: 0x4000B0C0 This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to select the interrupt source for IRQ number 0, IRQ number 1, IRQ number 2, IRQ number 3 as listed in the ATSAMB11 Interrupt Vector table. Bit 31 30 29 28 27 26 25 24 MUX_n[4:0] Access Reset Bit 23 22 21 R/W R/W R/W R/W R/W 0 0 0 0 0 20 19 18 17 16 MUX_n[4:0] Access Reset Bit 15 14 13 R/W R/W R/W R/W R/W 0 0 0 0 0 12 11 10 9 8 R/W R/W R/W R/W R/W 0 0 0 0 0 4 3 2 1 0 MUX_n[4:0] Access Reset Bit 7 6 5 MUX_n[4:0] Access Reset R/W R/W R/W R/W R/W 0 0 0 0 0 Bits 28:24, 20:16, 12:8, 4:0 - MUX_n[4:0] IRQ number (n) = 3 to 0 (n=3 for 28:24 bits and n=0 for 4:0 bits), IRQ mux configuration These bits select interrupt source for specific IRQ number. Refer to the ATSAMB11 Muxable Interrupt Options table for different possible interrupt source options for MUX_n[4:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 73 ATSAMB11XR/ZR Muxable Interrupt 11.3.2 IRQ Multiplexing 1 Name: Reset: IRQ_MUX_IO_SEL_1 0x00000000 Absolute Address: 0x4000B0C4 This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to select the interrupt source for IRQ number 4, IRQ number 5, IRQ number 6, IRQ number 7 as listed in ATSAMB11 Interrupt Vector table. Bit 31 30 29 28 27 26 25 24 MUX_n[4:0] Access Reset Bit 23 22 21 R/W R/W R/W R/W R/W 0 0 0 0 0 20 19 18 17 16 MUX_n[4:0] Access Reset Bit 15 14 13 R/W R/W R/W R/W R/W 0 0 0 0 0 12 11 10 9 8 R/W R/W R/W R/W R/W 0 0 0 0 0 4 3 2 1 0 MUX_n[4:0] Access Reset Bit 7 6 5 MUX_n[4:0] Access Reset R/W R/W R/W R/W R/W 0 0 0 0 0 Bits 28:24, 20:16, 12:8, 4:0 - MUX_n[4:0] IRQ number (n) = 7 to 4 (n=7 for 28:24 bits and n=4 for 4:0 bits, IRQ mux configuration These bits select interrupt source for specific IRQ number. Refer to the ATSAMB11 Muxable Interrupt Options table for different possible interrupt source options for MUX_n[4:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 74 ATSAMB11XR/ZR Muxable Interrupt 11.3.3 IRQ Multiplexing 2 Name: Reset: IRQ_MUX_IO_SEL_2 0x00000000 Absolute Address: 0x4000B0C8 This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to select the interrupt source for IRQ number 8, IRQ number 9, IRQ number 10, IRQ number 11 as listed in the ATSAMB11 Interrupt Vector table. Bit 31 30 29 28 27 26 25 24 MUX_n[4:0] Access Reset Bit 23 22 21 R/W R/W R/W R/W R/W 0 0 0 0 0 20 19 18 17 16 MUX_n[4:0] Access Reset Bit 15 14 13 R/W R/W R/W R/W R/W 0 0 0 0 0 12 11 10 9 8 R/W R/W R/W R/W R/W 0 0 0 0 0 4 3 2 1 0 MUX_n[4:0] Access Reset Bit 7 6 5 MUX_n[4:0] Access Reset R/W R/W R/W R/W R/W 0 0 0 0 0 Bits 28:24, 20:16, 12:8, 4:0 - MUX_n[4:0] IRQ number (n) = 11 to 8 (n=11 for 28:24 bits and n=8 for 4:0 bits, IRQ mux configuration These bits select interrupt source for specific IRQ number. Refer to the ATSAMB11 Muxable Interrupt Options table for different possible interrupt source options for MUX_n[4:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 75 ATSAMB11XR/ZR Muxable Interrupt 11.3.4 IRQ Multiplexing 3 Name: Reset: IRQ_MUX_IO_SEL_3 0x00000000 Absolute Address: 0x4000B0CC This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to select the interrupt source for IRQ number 12, IRQ number 13, IRQ number 14, IRQ number 15 as listed in the ATSAMB11 Interrupt Vector table. Bit 31 30 29 28 27 26 25 24 MUX_n[4:0] Access Reset Bit 23 22 21 R/W R/W R/W R/W R/W 0 0 0 0 0 20 19 18 17 16 MUX_n[4:0] Access Reset Bit 15 14 13 R/W R/W R/W R/W R/W 0 0 0 0 0 12 11 10 9 8 R/W R/W R/W R/W R/W 0 0 0 0 0 4 3 2 1 0 MUX_n[4:0] Access Reset Bit 7 6 5 MUX_n[4:0] Access Reset R/W R/W R/W R/W R/W 0 0 0 0 0 Bits 28:24, 20:16, 12:8, 4:0 - MUX_n[4:0] IRQ number (n) = 15 to 12 (n=15 for 28:24 bits and n=12 for 4:0 bits, IRQ mux configuration These bits select interrupt source for specific IRQ number. Refer to the ATSAMB11 Muxable Interrupt Options table for different possible interrupt source options for MUX_n[4:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 76 ATSAMB11XR/ZR Muxable Interrupt 11.3.5 IRQ Multiplexing 4 Name: Reset: IRQ_MUX_IO_SEL_4 0x00000000 Absolute Address: 0x4000B0D0 This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to select the interrupt source for IRQ number 16, IRQ number 17, IRQ number 18, IRQ number 19 as listed in the ATSAMB11 Interrupt Vector table. Bit 31 30 29 28 27 26 25 24 MUX_n[4:0] Access Reset Bit 23 22 21 R/W R/W R/W R/W R/W 0 0 0 0 0 20 19 18 17 16 MUX_n[4:0] Access Reset Bit 15 14 13 R/W R/W R/W R/W R/W 0 0 0 0 0 12 11 10 9 8 R/W R/W R/W R/W R/W 0 0 0 0 0 4 3 2 1 0 MUX_n[4:0] Access Reset Bit 7 6 5 MUX_n[4:0] Access Reset R/W R/W R/W R/W R/W 0 0 0 0 0 Bits 28:24, 20:16, 12:8, 4:0 - MUX_n[4:0] IRQ number (n) = 19 to 16 (n=19 for 28:24 bits and n=16 for 4:0 bits, IRQ mux configuration These bits select interrupt source for specific IRQ number. Refer to the ATSAMB11 Muxable Interrupt Options table for different possible interrupt source options for MUX_n[4:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 77 ATSAMB11XR/ZR Muxable Interrupt 11.3.6 IRQ Multiplexing 5 Name: Reset: IRQ_MUX_IO_SEL_5 0x00000000 Absolute Address: 0x4000B0D4 This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to select the interrupt source for IRQ number 20 as listed in the ATSAMB11 Interrupt Vector table. Bit 7 6 5 4 3 2 1 0 MUX_n[4:0] Access Reset R/W R/W R/W R/W R/W 0 0 0 0 0 Bits 4:0 - MUX_n[4:0] IRQ number (n) = 20, IRQ mux configuration These bits select interrupt source for specific IRQ number. Refer to the ATSAMB11 Muxable Interrupt Options table for different possible interrupt source options for MUX_n[4:0]. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 78 ATSAMB11XR/ZR GPIO Pin Controller 12. GPIO Pin Controller The GPIO pin controller controls the I/O pins of the device. The I/O pins are organized in a series of groups, collectively referred to as a Port group. Each Port group can have up to 16 pins that can be configured and controlled individually or as a group. There are three Port groups on a SAMB11-XR/ZR device, controlled by three GPIO pin controllers. Each pin is either used for general-purpose I/O under direct application control or assigned to an embedded device peripheral. When used for general-purpose I/O, each pin is configured as input or output, with configurable pull-up/pull-down settings. All I/O pins have true read-modify-write functionality when used for general purpose I/O. The direction or the output value of one or more pins may be changed explicitly without unintentionally changing the state of any other pins in the same port group by a single, atomic 16-bit write. The GPIO controller is connected to the high-speed bus matrix through the AHB bus. 12.1 Features The AHB GPIO controller provides a 16-bit I/O interface with the following properties: * * * * * * 12.2 Selectable input and output configuration for each individual pin. Software-controlled multiplexing of peripheral functions on I/O pins. Configurable pull settings: - Internal pull-up or pull-down. Programmable interrupt generation capability: - Interrupt generation masking. - Edge-triggered on rising, falling. - Level-sensitive on high or low values. Thread safe operation by providing separate set and clear addresses for control registers. Inputs are sampled using a double flip-flop to avoid metastability issues. Signal Description The following table describes the signal description of the GPIO pins. Table 12-1. Signal Description for GPIO Pins Pin Name Description LP_GPIO_x Digital I/O General-purpose I/O pin x AO_GPIO_z Digital I/O General-purpose I/O pin z. It can also be used to wake-up the core from the Ultra-Low Power mode GPIO_MSy 12.3 Type Mixed signal I/O General-purpose I/O pin y. Analog input can be connected I/O Lines The I/O lines are mapped to pins of the physical device. The I/O lines are categorized based on different functionalities into three groups called LP_GPIO_x, AO_GPIO_z, GPIO_MSy, as shown in Table 12-1. However, all these GPIO's are controlled by one of three GPIO controllers. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 79 ATSAMB11XR/ZR GPIO Pin Controller The I/O lines are divided into three groups with each group of 16 pins controlled by an individual GPIO controller. Referring to the GPIO Controller column of Table 10-1, the I/O lines from GPIO0_00 to GPIO0_15 are controlled using GPIO0 controller; GPIO1_00 to GPIO1_15 are controlled using GPIO1 controller, and GPIO2_00 to GPIO2_15 are controlled using GPIO2 controller. Each pin can be controlled by pinmux settings, which allow the pad to route internally to a dedicated peripheral function. When set to specific PINMUX value in PINMUX_SEL_n/AON_PINMUX_SEL_n, the selected peripheral controls the output state of the pad, and reads the current physical pad state. For more details see, I/O Multiplexing. 12.4 Clock Configuration The GPIO controller must be provided with clock source before configuring for normal operation. Two bits GPIO_CLK_EN, and GPIO_GCLK_EN enable the clock for GPIO controllers and its AHB interface. Both the bits must be set for GPIO controller normal operation. For more details on configuration, see Peripheral Clock Configuration. 12.5 Functional Description of LP_GPIO_x I/O Pins The overview and peripheral multiplexing of LP_GPIO_x I/O pins are shown in the following figures. Figure 12-1. Overview of LP_GPIO_x Port (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 80 ATSAMB11XR/ZR GPIO Pin Controller Figure 12-2. Overview of Peripheral Multiplexing for LP_GPIO_x Port 12.5.1 Initialization After reset, all LP_GPIO_x pads are enabled with input and pull up. For more details, see the I/O Pin Behavior in the Different Device States table. However, specific pins, such as those used for connection to a debugger are configured using PINMUX_SEL_n, as required by its special function. 12.5.2 Operation 1. 2. 3. 4. Each LP_GPIO_x can be configured by the registers in PORT Config as shown in Figure 12-1. It is required to map a specific pin (LP_GPIO_x) to the GPIO controller which controls it. To control pin LP_GPIO_x, get the corresponding GPIO pin number `n' and the GPIO controller number `p' which controls it from I/O Multiplexing under GPIO Controller column (GPIOp_n). For example, LP_GPIO_18 is mapped to GPIO1_02. Here `p' equals to 1, `n' equals to 02 and `x' equals to 18. In the configuration steps below, `n' and `p' are used to configure GPIO controller specific registers, and `x' is used to configure LPMCU_MISC_REGS0 specific registers. 'n', 'p', 'x' value of specific LP_GPIO_x pin to be noted to configure that pin as general purpose I/O. Configure PINMUX_SEL[2:0] bits of PINMUX_SEL_n register corresponding to x pin with MUX value equals to zero. Three bits are used to configure MUX for LP_GPIO_x pin. For example, to configure LP_GPIO_18: PINMUX_SEL_2 register PINMUX_SEL[2:0] LP_GPIO_18 = 0. To use LP_GPIO_x pin as an output, write n bit of OUTENSET register of `p' GPIO controller to '1'. The n bit in the DATAOUT register must be written to the desired output value. The output on pin `n' can be inverted by configuring INVERT_OUT_CTRL register. To invert `n' pin write `1' of LP_GPIO_x bit on INVERT_OUT_CTRL register. For example, to configure LP_GPIO_18 as output: assign bit 2 of OUTENSET register of GPIO1(p) Controller to '1'. To use pin LP_GPIO_x as an input, bit `n' in the OUTENCLR register of `p' GPIO controller must be written to '1'. The input value can be read from bit `n' in register DATA. For example, to configure LP_GPIO_18 as input: assign bit 2 of OUTENCLR register of GPIO1(p) Controller to '1'. The (PINMUX_SEL_n) registers select the peripheral function for the corresponding pin. When PINMUX_SEL[2:0] value is other than zero, then this overrides the connection between the GPIO (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 81 ATSAMB11XR/ZR GPIO Pin Controller controller and the I/O pin, and connects the selected peripheral signal to the particular I/O pin instead of the GPIO Controller. For more information on different MUX configurations, see I/O Multiplexing. 12.5.3 I/O Pin Pull Configuration The PULL_ENABLE and RTYPE_PAD registers are used to configure pull up or pull down on the LP_GPIO_x I/O pins as shown in the following pull configuration table. The internal pull up or pull down is mainly used for input; if the input pin is not connected, then Hi-z occurs. Enabling pull up or pull down leads to defined state on input line. The pull up or pull down circuit is common for input and output. Table 12-2. Pull Configuration OUTENSET PULL_ENABLE RTYPE_PAD 12.6 Configuration 0 0 0 Input with pull up 0 0 1 Input with pull down 0 1 0 0 1 1 Input; pull disabled If input line is floating then the value on pad is Hi-z. This means the sampled value in DATA register can be 0 or 1, and not a fixed value. 1 0 0 Output with pull up 1 0 1 Output with pull down 1 1 0 Output; pull disabled 1 1 1 Output; pull disabled Functional Description of GPIO_MSy I/O Pins The overview of GPIO_MSy I/O pins is shown in the following figure. Figure 12-3. Overview of GPIO_MSy Port (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 82 ATSAMB11XR/ZR GPIO Pin Controller 12.6.1 Initialization After reset, all GPIO_MSy pads are configured as analog input pin with pull disabled. 12.6.2 Operation The GPIO_MSy pins are mixed signal pins which are configured as analog or digital. Each GPIO_MSy can be configured by the registers in PORT Config as shown in Figure 12-3. The GPIO_MSy pins are configured either as analog input pins or general purpose digital I/O pins using register MS_GPIO_MODE. By default, the GPIO_MSy pins are analog input pins with the MS_GPIO_MODE bit set for individual pins. 1. 2. 3. 12.6.3 To use GPIO_MSy as general purpose I/O pin, clear the ANALOG_EN GPIO_MSy bit of MS_GPIO_MODE register. Similar to LP_GPIO_x, it is required to get the corresponding GPIO_MSy pin number `n' from I/O multiplexing under GPIO controller column. The GPIO_MSy I/O pins are controlled by GPIO2 controller. To use `n' pin as an output, write `n' bit of OUTENSET register of GPIO2 controller. The `n' bit in the DATAOUT register must be written to the desired output value. For example, to configure GPIO_MS1 as output: assign bit 15 of OUTENSET register of GPIO2 Controller to '1'. To use pin GPIO_MSy as an input, bit `n' in the OUTENCLR register of GPIO2 Controller must be written to '1'. The input value can be read from bit `n' in register DATA. For example, to configure GPIO_MS1 as input: assign bit 15 of OUTENCLR register of GPIO2 Controller to '1'. I/O Pin Pull Configuration The MS_GPIO register is used to configure pull up or pull down on the GPIO_MSy I/O pins as shown in the following pull configuration table. The pull up/down circuit is common for input and output. Table 12-3. Pull Configuration OUTENSET MS_GPIO[7:4] MS_GPIO[3:0] 12.7 Configuration 0 0 0 Input with pull up 0 0 1 Input with pull down 0 1 0 0 1 1 Input; pull disabled If input line is floating then the value on PAD is Hi-z. This means the value be sampled in DATA register can be 0 or 1, not a fixed value. 1 0 0 Output with pull up 1 0 1 Output with pull down 1 1 0 Output; pull disabled 1 1 1 Output; pull disabled Functional Description of AO_GPIO_z I/O Pins The overview and peripheral multiplexing of AO_GPIO_z I/O pins are shown in the following figures. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 83 ATSAMB11XR/ZR GPIO Pin Controller Figure 12-4. Overview of AO_GPIO_z Port Figure 12-5. Overview of Peripheral Multiplexing for AO_GPIO_z Port 12.7.1 Initialization After reset, all AO_GPIO_z pads are enabled with input and pull up. By default, the AO_GPIO_0 pin is configured to wake-up the core from the Ultra-Low Power (ULP) mode. 12.7.2 Operation The AO_GPIO_z pins are special function I/O pins that are configured as general purpose I/O and also configured to wake-up (Wake-up Source) the core from the ULP mode. 1. 2. 3. To use AO_GPIO_z pin as an general-purpose I/O, configure PINMUX_SEL[1:0] of AON_PINMUX_SEL register corresponding to AO_GPIO_y pin with MUX value equals to zero. Two bits are used to configure MUX for AO_GPIO_z GPIO pin. For example, to configure AO_GPIO_1: AON_PINMUX_SEL register PINMUX_SEL[1:0] AO_GPIO_1 = 0. Similar to LP_GPIO_x, it is required to get the corresponding AO_GPIO_z pin number `n' from I/O Multiplexing under GPIO controller column. The AO_GPIO_z I/O lines are controlled by GPIO1 controller. To use AO_GPIO_z `n' pin as an output, write n bit of OUTENSET register of GPIO1 controller. The n bit in the DATAOUT register must be written to the desired output value. For example, to configure AO_GPIO_1 as output: assign bit 30 of OUTENSET register of GPIO1 Controller to '1'. To use pin AO_GPIO_z `n' as an input, bit `n' in the OUTENCLR register of GPIO1 controller must be written to '1'. The input value can be read from bit `n' in register DATA. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 84 ATSAMB11XR/ZR GPIO Pin Controller For example, to configure AO_GPIO_1 as output: assign bit 30 of OUTENSET register of GPIO1 Controller to '1'. The AON_PINMUX_SEL register selects the peripheral function for the corresponding AO_GPIO_z pin. When PINMUX_SEL[1:0] value is other than zero, then this overrides the connection between the GPIO controller and the I/O pin, and connects the selected peripheral signal to the particular I/O pin instead of the GPIO controller. For more information on different MUX configuration, see I/O Multiplexing. 12.7.3 I/O Pin Pull Configuration The AON_PULL_ENABLE register is used to configure pull up on the AO_GPIO_z I/O pins as shown in the following pull configuration table. The pull up circuit is common for input and output. Table 12-4. Pull Configuration OUTENSET AON_PULL_ENABLE 12.7.4 Configuration 0 0 Input with pull up 0 1 Input; pull disabled If input line is floating then the value on pad is Hi-z. This means the sampled value in DATA register can be 0 or 1, and not a fixed value. 1 0 Output with pull up 1 1 Output; pull disabled Wake-up Source The AO_GPIO_z pin can also wake-up the ARM Subsystem and BLE Subsystem from the ULP mode. Along with wake-up configuration, enabling an external interrupt generates an interrupt request. On reset, the AO_GPIO_0 as wake-up source is enabled by default. 1. 2. To use AO_GPIO_z as wake-up source: - Wake-up source for ARM subsystem - configure AON_PINMUX_SEL with MUX1 and set the value as one for specific AO_GPIO_z pin. - Wake-up source for BLE subsystem - set the BLE_ENABLE bit on GPIO_WAKEUP_CTRL register. This configuration is common for all AO_GPIO_z pins. Note: * It is recommended to enable wake-up of ARM subsystem and BLE subsystem together. Enabling only the wake-up of BLE subsystem should not be performed. * Only AO_GPIO_0 can be configured as wake-up source with the present firmware. The AO_GPIO_1 and AO_GPIO_2 cannot be used as wake-up source at present. * As the firmware on ROM handles the wake-up and sleep operation, it is restricted to configure the AO_GPIO_z as rising interrupt only. Rising edge on AO_GPIO_z wakesup the ARM and falling edge triggers the sleep. On rising edge, interrupt ROM firmware configures the AO_GPIO_z as falling edge. Until AO_GPIO_z is held high, the device is awake and awaits for falling edge on this pin. At falling edge, it triggers the interrupt and ROM firmware, configures the pin as rising edge, and enables sleep operation. Configure AO_GPIO_z pin as input with external interrupt enable. For more details, see External Interrupt section. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 85 ATSAMB11XR/ZR GPIO Pin Controller 12.8 External Interrupt The GPIO Controller allows all GPIO pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z) to be configured as interrupt lines. Each interrupt line can be individually masked and can generate an interrupt to CPU on rising, falling, or on high or low levels. 12.8.1 Initialization After reset, the interrupt is disabled on all GPIO pins. 12.8.2 Operation To configure a GPIO pin as external interrupt, get the corresponding GPIO pin number `n' and GPIO controller number `p' from I/O Multiplexing table under the GPIO Controller column and perform the following initialization steps: * Configure PINMUX_SEL_n or MS_GPIO_MODE or AON_PINMUX_SEL based in GPIO group with MUX0. When AO_GPIO_z is configured as wake-up source, then configure AON_PINMUX_SEL with MUX1. * Initialize the GPIO pin direction as input. For LP_GPIO_x pin operation, GPIO_MSy pin operation and AO_GPIO_z pin operation, see Operation section. * Refer to default pull configuration of the intended GPIO pin group and enable or disable pull based on the requirement. * The GPIO controller provides programmable interrupt generation features. As shown in the following table, three registers control the operation, and each register has separate set and clear addresses. To configure each bit of the I/O pin (`n' bit on `p' GPIO register) generate interrupt based on these three registers. Table 12-5. Interrupt Configuration Interrupt Enable Set (INTENSET ) Interrupt Polarity Set (INTPOLSET ) Interrupt Type Set (INTTYPESET ) Interrupt Feature 0 X X Disabled 1 0 0 Low-Level 1 0 1 Falling Edge 1 1 0 High-Level 1 1 1 Rising Edge * * Note: External interrupts are double synchronized to FCLK( Free-running clock) before being converted to edge/level types and then is registered on FCLK. Hence, there are only three FCLK cycles latency on these interrupts for all of the four types (high level/low level/ rise edge/ fall edge) of interrupt configurations before being sensed by the processor. The interrupt request line is connected to the Interrupt Controller (NVIC). To use interrupt requests of this peripheral, the Interrupt Controller (NVIC) must be configured first. For more details, see Nested Vector Interrupt Controller. After an interrupt request is triggered, the corresponding bit in the INTSTATUSCLEAR register is set. The interrupt status can be cleared by writing 1 to the corresponding bit of the INTSTATUSCLEAR register. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 86 ATSAMB11XR/ZR GPIO Pin Controller 12.9 Power Management If the system goes to Ultra-Low Power mode, the GPIO controller is shut down and the latches in the pad retain their current configuration in the Sleep mode, such as the output value and pull settings. However, the PORT configuration registers lose their content, and these cannot be restored when PORT is powered-up again. Therefore, user must reconfigure the PORT peripheral at power-up to ensure it is in a well-defined state before use. For more details on reconfiguration, refer to the ATSAMB11 BluSDK Smart Interrupts and ULP Architecture and Usage User guide. This document also explains on how sleep and wake-up are controlled. 12.10 Register Summary This is the summary of all the registers used in this chapter. Absolute Address Register Group 0x40010000 (GPIO0), 0x40011000 (GPIO1), 0x40013000 (GPIO2) GPIO Controller 0x40010004 (GPIO0), 0x40011004 (GPIO1), 0x40013004 (GPIO2) GPIO Controller 0x40010010 (GPIO0), 0x40011010 (GPIO1), 0x40013010 (GPIO2) GPIO Controller 0x40010014 (GPIO0), 0x40011014 (GPIO1), 0x40013014 (GPIO2) GPIO Controller 0x40010020 (GPIO0), 0x40011020 (GPIO1), 0x40013020 (GPIO2) GPIO Controller 0x40010024 (GPIO0), 0x40011024 (GPIO1), 0x40013024 (GPIO2) GPIO Controller 0x40010028 (GPIO0), 0x40011028 (GPIO1), 0x40013028 (GPIO2) GPIO Controller 0x4001002C (GPIO0), 0x4001102C (GPIO1), 0x4001302C (GPIO2) GPIO Controller 0x40010030 (GPIO0), 0x40011030 (GPIO1), 0x40013030 (GPIO2) GPIO Controller 0x40010034 (GPIO0), 0x40011034 (GPIO1), GPIO Controller Name DATA DATAOUT OUTENSET OUTENCLR INTENSET INTENCLR INTTYPESET INTTYPECLR INTPOLSET INTPOLCLR Bit Pos. 7:0 DATA[7:0] 15:8 DATA[15:8] 7:0 DATAOUT[7:0] 15:8 DATAOUT[15:8] 7:0 OUTENSET[7:0] 15:8 OUTENSET[15:8] 7:0 OUTENCLR[7:0] 15:8 OUTENCLR[15:8] 7:0 INTENSET[7:0] 15:8 INTENSET[15:8] 7:0 INTENCLR[7:0] 15:8 INTENCLR[15:8] 7:0 INTTYPESET[7:0] 15:8 INTTYPESET[15:8] 7:0 INTTYPECLR[7:0] 15:8 INTTYPECLR[15:8] 7:0 INTPOLSET[7:0] 15:8 INTPOLSET[15:8] 7:0 INTPOLCLR[7:0] 15:8 INTPOLCLR[15:8] (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 87 ATSAMB11XR/ZR GPIO Pin Controller Absolute Address Register Group Name Bit Pos. 0x40013034 (GPIO2) 0x40010038 (GPIO0), 0x40011038 (GPIO1), 0x40013038 (GPIO2) GPIO Controller 0x4000B040 LPMCU_MISC_ REGS0 INTSTATUSCL EAR INVERT_OUTP UT_CTRL 7:0 INTSTATUSCLEAR[7:0] 15:8 INTSTATUSCLEAR[15:8] 7:0 INVERT_OUT LP_GPIO_x (x = 7:0) 15:8 INVERT_OUT LP_GPIO_x (x = 15:8 ) 23:16 31:24 0x4000B050 LPMCU_MISC_ REGS0 PULL_ENABLE 7:0 LPMCU_MISC_ REGS0 RTYPE_PAD_0 INVERT_OUT LP_GPIO_24 PULL_EN LP_GPIO_x (x = 7:0) 15:8 PULL_EN LP_GPIO_x (x = 15:8 ) 23:16 PULL_EN LP_GPIO_x (x = 23:16) 31:24 0x4000B054 INVERT_OUT LP_GPIO_x (x = 23:16) INVERT_OUT LP_SIP_x (x = 5:0) PULL_EN LP_SIP_x (x = 5:0) PULL_EN LP_GPIO_24 7:0 PULL_TYPE LP_GPIO_x (x = 7:0) 15:8 PULL_TYPE LP_GPIO_x (x = 15:8 ) 23:16 PULL_TYPE LP_GPIO_x (x = 23:16) 31:24 PULL_TYPE LP_GPIO_24 0x4000B414 LPMCU_MISC_ REGS0 MS_GPIO 7:0 0x4000F014 AON_GP_REG S0 AON_PULL_EN ABLE 7:0 PULLUP_EN AO_GPIO_z (z= 0:2) 0x4000E000 AON_PWR_SE Q0 GPIO_WAKEU P_CTRL 7:0 BLE_ENABLE 0x4000B044 LPMCU_MISC_ REGS0 PINMUX_SEL_ 0 7:0 PINMUX_SEL[2:0] LP_GPIO_1 PINMUX_SEL[2:0] LP_GPIO_0 15:8 PINMUX_SEL[2:0] LP_GPIO_3 PINMUX_SEL[2:0] LP_GPIO_2 23:16 PINMUX_SEL[2:0] LP_GPIO_5 PINMUX_SEL[2:0] LP_GPIO_4 31:24 PINMUX_SEL[2:0] LP_GPIO_7 PINMUX_SEL[2:0] LP_GPIO_6 7:0 PINMUX_SEL[2:0] LP_GPIO_9 PINMUX_SEL[2:0] LP_GPIO_8 15:8 PINMUX_SEL[2:0] LP_GPIO_11 PINMUX_SEL[2:0] LP_GPIO_10 23:16 PINMUX_SEL[2:0] LP_GPIO_13 PINMUX_SEL[2:0] LP_GPIO_12 31:24 PINMUX_SEL[2:0] LP_GPIO_15 PINMUX_SEL[2:0] LP_GPIO_14 7:0 PINMUX_SEL[2:0] LP_GPIO_17 PINMUX_SEL[2:0] LP_GPIO_16 15:8 PINMUX_SEL[2:0] LP_GPIO_19 PINMUX_SEL[2:0] LP_GPIO_18 23:16 PINMUX_SEL[2:0] LP_GPIO_21 PINMUX_SEL[2:0] LP_GPIO_20 31:24 PINMUX_SEL[2:0] LP_GPIO_23 PINMUX_SEL[2:0] LP_GPIO_22 0x4000B048 0x4000B04C 0x4000B080 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 PINMUX_SEL_ 1 PINMUX_SEL_ 2 PINMUX_SEL_ 4 PULL_EN GPIO_MSy (y = 1:4) PULL_TYPE GPIO_MSy (y = 1:4) 7:0 PINMUX_SEL[2:0] LP_GPIO_24 15:8 23:16 31:24 0x4000B1A0 0x4000B1A4 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 MEGA_MUX_I O_SEL_0 MEGA_MUX_I O_SEL_1 7:0 MEGAMUX_SEL[5:0] LP_GPIO_0 15:8 MEGAMUX_SEL[5:0] LP_GPIO_1 23:16 MEGAMUX_SEL[5:0] LP_GPIO_2 31:24 MEGAMUX_SEL[5:0] LP_GPIO_3 7:0 MEGAMUX_SEL[5:0] LP_GPIO_4 15:8 MEGAMUX_SEL[5:0] LP_GPIO_5 23:16 MEGAMUX_SEL[5:0] LP_GPIO_6 31:24 MEGAMUX_SEL[5:0] LP_GPIO_7 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 88 ATSAMB11XR/ZR GPIO Pin Controller Absolute Address 0x4000B1A8 0x4000B1AC 0x4000B1B0 0x4000B1B4 Register Group LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 Name MEGA_MUX_I O_SEL_2 MEGA_MUX_I O_SEL_3 MEGA_MUX_I O_SEL_4 MEGA_MUX_I O_SEL_5 Bit Pos. 7:0 MEGAMUX_SEL[5:0] LP_GPIO_8 15:8 MEGAMUX_SEL[5:0] LP_GPIO_9 23:16 MEGAMUX_SEL[5:0] LP_GPIO_10 31:24 MEGAMUX_SEL[5:0] LP_GPIO_11 7:0 MEGAMUX_SEL[5:0] LP_GPIO_12 15:8 MEGAMUX_SEL[5:0] LP_GPIO_13 23:16 MEGAMUX_SEL[5:0] LP_GPIO_14 31:24 MEGAMUX_SEL[5:0] LP_GPIO_15 7:0 MEGAMUX_SEL[5:0] LP_GPIO_16 15:8 MEGAMUX_SEL[5:0] LP_GPIO_17 23:16 MEGAMUX_SEL[5:0] LP_GPIO_18 31:24 MEGAMUX_SEL[5:0] LP_GPIO_19 7:0 MEGAMUX_SEL[5:0] LP_GPIO_20 15:8 MEGAMUX_SEL[5:0] LP_GPIO_21 23:16 MEGAMUX_SEL[5:0] LP_GPIO_22 31:24 MEGAMUX_SEL[5:0] LP_GPIO_23 MEGAMUX_SEL[5:0] LP_GPIO_24 0x4000B1B8 LPMCU_MISC_ REGS0 MEGA_MUX_I O_SEL_6 7:0 0x4000F000 AON_GP_REG S0 AON_PINMUX_ SEL 7:0 0x4000F410 AON_GP_REG S0 MS_GPIO_MO DE PINMUX_SEL[1:0] AO_GPIO_1 PINMUX_SEL[1:0] AO_GPIO_0 15:8 12.11 PINMUX_SEL[1:0] AO_GPIO_2 7:0 ANALOG_EN GPIO_MS1 ANALOG_EN GPIO_MS2 ANALOG_EN GPIO_MS3 ANALOG_EN GPIO_MS4 Register Description (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 89 ATSAMB11XR/ZR GPIO Pin Controller 12.11.1 Data Input Value Name: Reset: DATA 0x---- (Based on level on I/O pin) Absolute Address: 0x40010000 (GPIO0), 0x40011000 (GPIO1), 0x40013000 (GPIO2) This register is a part of GPIO Controller registers. This register reads the input drive value on individual I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to register bit. Bit 15 14 13 12 11 10 9 8 R/W R/W R/W R/W 3 2 1 0 R/W R/W R/W R/W DATA[15:8] Access R/W R/W R/W R/W 7 6 5 4 Reset Bit DATA[7:0] Access R/W R/W R/W R/W Reset Bits 15:0 - DATA[15:0] Port Data Input Value Read Value Description 0 The corresponding I/O pin input sampler detects a logical low level on the input pin. 1 The corresponding I/O pin input sampler detects a logical high level on the input pin Writing this register sends the DATA register value to DATAOUT register. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 90 ATSAMB11XR/ZR GPIO Pin Controller 12.11.2 Data Output Value Name: Reset: DATAOUT 0x0000 Absolute Address: 0x40010004 (GPIO0), 0x40011004 (GPIO1), 0x40013004 (GPIO2) This register is a part of GPIO Controller registers. This register sets the data output drive value for individual I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to the register bit. Bit 15 14 13 12 11 10 9 8 DATAOUT[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 DATAOUT[7:0] Access Reset R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 Bits 15:0 - DATAOUT[15:0] Port Data Output Value When the register is configured as output via the Data Direction register (OUTENSET), these bits set the logical output drive. Read Value Description 0 The corresponding I/O pin is driven logical low level. 1 The corresponding I/O pin is driven logical high level. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 91 ATSAMB11XR/ZR GPIO Pin Controller 12.11.3 Data Direction Set Name: Reset: OUTENSET 0x0000 Absolute Address: 0x40010010 (GPIO0), 0x40011010 (GPIO1), 0x40013010 (GPIO2) This register is a part of GPIO Controller registers. This register allows the user to set one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z) as an output. This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to register bit. Bit 15 14 13 12 11 10 9 8 OUTENSET[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OUTENSET[7:0] Access Reset R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 Bits 15:0 - OUTENSET[15:0] Port Data Direction Set Writing '0' to a bit has no effect. Writing '1' to a bit sets the corresponding bit in the OUTENSET register, which configures the I/O pin as an output. Read Value Description 0 Indicates the corresponding I/O pin in the GPIO Controller group as input. 1 Indicates the corresponding I/O pin in the GPIO Controller group as output. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 92 ATSAMB11XR/ZR GPIO Pin Controller 12.11.4 Data Direction Clear Name: Reset: OUTENCLR 0x0000 Absolute Address: 0x40010014 (GPIO0), 0x40011014 (GPIO1), 0x40013014 (GPIO2) This register is a part of GPIO Controller registers. This register allows the user to set one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z) as input. This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to the register bit. Bit 15 14 13 12 11 10 9 8 OUTENCLR[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 OUTENCLR[7:0] Access Reset R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 Bits 15:0 - OUTENCLR[15:0] Port Data Direction Clear Writing '0' to a bit has no effect. Writing '1' to a bit clears the corresponding bit in the OUTENSET register, which configures the I/O pin as an input. Read Value Description 0 Indicates the corresponding I/O pin in the GPIO Controller group as input. 1 Indicates the corresponding I/O pin in the GPIO Controller group as output. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 93 ATSAMB11XR/ZR GPIO Pin Controller 12.11.5 Interrupt Enable Set Name: Reset: INTENSET 0x0000 Absolute Address: 0x40010020 (GPIO0), 0x40011020 (GPIO1), 0x40013020 (GPIO2) This register is a part of GPIO Controller Registers. This register allows the user to enable interrupt on one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to the register bit. Bit 15 14 13 12 11 10 9 8 INTENSET[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 INTENSET[7:0] Access Reset Bits 15:0 - INTENSET[15:0] Interrupt Enable Set Writing '0' to a bit has no effect. Writing '1' to a bit sets the corresponding bit in the INTENSET register, which enables interrupt on I/O pin. Read Value Description 0 Indicates the interrupt is disabled on corresponding I/O pin in GPIO controller group. 1 Indicates the interrupt is enabled on corresponding I/O pin in GPIO controller group. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 94 ATSAMB11XR/ZR GPIO Pin Controller 12.11.6 Interrupt Enable Clear Name: Reset: INTENCLR 0x0000 Absolute Address: 0x40010024 (GPIO0), 0x40011024 (GPIO1), 0x40013024 (GPIO2) This register is a part of GPIO Controller Registers. This register allows the user to disable interrupt on one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to the register bit. Bit 15 14 13 12 11 10 9 8 INTENCLR[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 INTENCLR[7:0] Access Reset Bits 15:0 - INTENCLR[15:0] Interrupt Enable Clear Writing '0' to a bit has no effect. Writing '1' to a bit clears the corresponding bit in the INTENSET register, which disables interrupt on I/O pin. Read Value Description 0 Indicates the interrupt is disabled on corresponding I/O pin in GPIO controller group. 1 Indicates the interrupt is enabled on corresponding I/O pin in GPIO controller group. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 95 ATSAMB11XR/ZR GPIO Pin Controller 12.11.7 Interrupt Type Set Name: Reset: INTTYPESET 0x0000 Absolute Address: 0x40010028 (GPIO0), 0x40011028 (GPIO1), 0x40013028 (GPIO2) This register is a part of GPIO Controller Registers. This register allows the user to set interrupt type on one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to the register bit. Bit 15 14 13 12 11 10 9 8 INTTYPESET[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 INTTYPESET[7:0] Access Reset Bits 15:0 - INTTYPESET[15:0] Interrupt Type Set Writing '0' to a bit has no effect. Writing '1' to a bit sets the corresponding bit in the INTTYPESET register, which configures interrupt as falling edge or rising edge. For more details, see Interrupt Configuration table. Read Value Description 0 Indicates the interrupt as LOW level or HIGH level decided by INTPOL register. 1 Indicates the interrupt as Falling edge or Rising edge decided by INTPOL register. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 96 ATSAMB11XR/ZR GPIO Pin Controller 12.11.8 Interrupt Type Clear Name: Reset: INTTYPECLR 0x0000 Absolute Address: 0x4001002C (GPIO0), 0x4001102C (GPIO1), 0x4001302C (GPIO2) This register is a part of GPIO Controller Registers. This register allows the user to clear interrupt type on one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to the register bit. Bit 15 14 13 12 11 10 9 8 INTTYPECLR[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 INTTYPECLR[7:0] Access Reset Bits 15:0 - INTTYPECLR[15:0] Interrupt Type Clear Writing '0' to a bit has no effect. Writing '1' to a bit clears the corresponding bit in the INTTYPESET register. Read Value Description 0 Indicates the interrupt as LOW level or HIGH level decided by INTPOL register. 1 Indicates the interrupt as Falling edge or Rising edge decided by INTPOL register. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 97 ATSAMB11XR/ZR GPIO Pin Controller 12.11.9 Interrupt Polarity Set Name: Reset: INTPOLSET 0x0000 Absolute Address: 0x40010030 (GPIO0), 0x40011030 (GPIO1), 0x40013030 (GPIO2) This register is a part of GPIO Controller Registers. This register allows the user to set interrupt polarity on one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to the register bit. Bit 15 14 13 12 11 10 9 8 INTPOLSET[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 INTPOLSET[7:0] Access Reset Bits 15:0 - INTPOLSET[15:0] Interrupt Polarity Set Writing '0' to a bit has no effect. Writing '1' to a bit sets the corresponding bit in the INTPOLSET register, which configures interrupt as High level or Rising edge. For more details, see Interrupt Configuration table. Read Value Description 0 Indicates the interrupt as LOW level or Falling edge decided by INTTYPE register. 1 Indicates the interrupt as HIGH level or Rising edge decided by INTTYPE register. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 98 ATSAMB11XR/ZR GPIO Pin Controller 12.11.10 Interrupt Polarity Clear Name: Reset: INTPOLCLR 0x0000 Absolute Address: 0x40010034 (GPIO0), 0x40011034 (GPIO1), 0x40013034 (GPIO2) This register is a part of GPIO Controller Registers. This register allows the user to clear interrupt polarity on one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of the I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to the register bit. Bit 15 14 13 12 11 10 9 8 INTPOLCLR[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 INTPOLCLR[7:0] Access Reset Bits 15:0 - INTPOLCLR[15:0] Interrupt Polarity Clear Writing '0' to a bit has no effect. Writing '1' to a bit clears the corresponding bit in the INTPOLSET register. Read Value Description 0 Indicates the interrupt as LOW level or Falling edge decided by INTTYPE register. 1 Indicates the interrupt as HIGH level or Rising edge decided by INTTYPE register. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 99 ATSAMB11XR/ZR GPIO Pin Controller 12.11.11 Interrupt Status Clear Name: Reset: INTSTATUSCLEAR 0x0000 Absolute Address: 0x40010038 (GPIO0), 0x40011038 (GPIO1), 0x40013038 (GPIO2) This register is a part of GPIO Controller Registers. This register indicates status of interrupt trigger and allows the user to clear interrupt status on one or more I/O pins (LP_GPIO_x, GPIO_MSy, AO_GPIO_z). This register is duplicated for each GPIO Controller, with increasing base address. For more details on mapping between LP_GPIO_x, GPIO_MSy, AO_GPIO_z pin number with GPIO controller pin number, see GPIO Controller column of I/O Port Function Multiplexing table. The corresponding GPIO controller pin number 'n' is mapped to register bit. Bit 15 14 13 12 11 10 9 8 INTSTATUSCLEAR[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 INTSTATUSCLEAR[7:0] Access Reset Bits 15:0 - INTSTATUSCLEAR[15:0] Interrupt Status Clear Writing '0' to a bit has no effect. Writing '1' to a bit clears the interrupt request. Read Value Description 0 Indicates the interrupt request is not triggered. 1 Indicates the interrupt request is triggered. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 100 ATSAMB11XR/ZR GPIO Pin Controller 12.11.12 LP_GPIO_x Invert Output Level Name: Reset: INVERT_OUTPUT_CTRL 0x00000000 Absolute Address: 0x4000B040 This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to invert the logical output level which is set using DATAOUT register for LP_GPIO_x pins. Bit 31 30 29 28 27 26 25 INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT Access Reset Bit 24 INVERT_OUT LP_SIP_x LP_SIP_x LP_SIP_x LP_SIP_x LP_SIP_x LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 23 22 21 20 19 18 17 16 INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT Access Reset Bit LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT Access Reset Bit LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT INVERT_OUT Access Reset LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 Bits 31,30,29,28,27 - INVERT_OUT LP_SIP_x (x = 4 to 0; Replace x=4 for bit 31, ... x=0 for bit 27) Output level invert The LP_SIP_x pins are connected to internal SPI Flash0 which holds the application code. It is not recommended to use these pins as general purpose I/O. Bits 24,23,22,21,20,19,18,17,16,15,14,13,12,11,10,9,8,7,6,5,4,3,2,1,0 - INVERT_OUT LP_GPIO_x (x = 24 to 0; Replace x=24 for bit 24, ... x=0 for bit 0) Output level invert Writing '1'inverts the output logical level set using DATAOUT register on LP_GPIO_x pin. For example, if low level is set using DATAOUT register, writing '1' to INVERT_OUTPUT_CTRL changes to high level. Writing '0' sets the output logical level same as DATAOUT register on LP_GPIO_x pin. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 101 ATSAMB11XR/ZR GPIO Pin Controller 12.11.13 LP_GPIO_x Pull Enable Name: Reset: PULL_ENABLE 0x00000000 Absolute Address: 0x4000B050 This register is a part of LPMCU_MISC_REGS0 Registers. This register allows the user to enable or disable the internal pull up or pull down for LP_GPIO_x pins. Bit Access Reset Bit Access Reset Bit Access Reset Bit Access Reset 31 30 29 28 27 PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN 26 25 PULL_EN 24 LP_SIP_x LP_SIP_x LP_SIP_x LP_SIP_x LP_SIP_x LP_GPIO_x R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 23 22 21 20 19 18 17 16 PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN PULL_EN LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 Bits 31,30,29,28,27 - PULL_EN LP_SIP_x (x = 4 to 0; Replace x=4 for bit 31, ... x=0 for bit 27) Pull Enable Register The LP_SIP_x pins are connected to internal SPI Flash which holds the application code. It is not recommended to use these pins as general purpose I/O. Bits 24,23,22,21,20,19,18,17,16,15,14,13,12,11,10,9,8,7,6,5,4,3,2,1,0 - PULL_EN LP_GPIO_x (x = 24 to 0; Replace x=24 for bit 24, ... x=0 for bit 0) Pull Enable Register Writing '1'disables the internal Pull up/Pull down on LP_GPIO_x pin. Writing '0' enables the internal Pull up/Pull down on LP_GPIO_x pin. It is an active LOW pull enable configuration. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 102 ATSAMB11XR/ZR GPIO Pin Controller 12.11.14 LP_GPIO_x Pull Type Set Name: Reset: RTYPE_PAD_0 0x00000000 Absolute Address: 0x4000B054 This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to set the pull type to pull up or pull down for LP_GPIO_x pins. Bit 31 30 29 28 27 26 25 24 PULL_TYPE LP_GPIO_x Access R/W Reset Bit Access Reset Bit Access Reset Bit Access Reset 0 23 22 21 20 19 18 17 16 PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x LP_GPIO_x R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 Bits 24,23,22,21,20,19,18,17,16,15,14,13,12,11,10,9,8,7,6,5,4,3,2,1,0 - PULL_TYPE LP_GPIO_x (x = 24 to 0; Replace x=24 for bit 24, ... x=0 for bit 0) Pull Type Set Register Writing '1' enables the internal pull down on LP_GPIO_x pin. Writing '0' enables the internal pull up on LP_GPIO_x pin. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 103 ATSAMB11XR/ZR GPIO Pin Controller 12.11.15 GPIO_MSy Pull Configuration Name: Reset: MS_GPIO 0xF0 Absolute Address: 0x4000B414 This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to set and enable the internal pull up or pull down for GPIO_MSy pins. Bit Access Reset 7 6 5 4 3 2 1 0 PULL_EN PULL_EN PULL_EN PULL_EN PULL_TYPE PULL_TYPE PULL_TYPE PULL_TYPE GPIO_MSy GPIO_MSy GPIO_MSy GPIO_MSy GPIO_MSy GPIO_MSy GPIO_MSy GPIO_MSy R/W R/W R/W R/W R/W R/W R/W R/W 1 1 1 1 0 0 0 0 Bits 7,6,5,4 - PULL_EN GPIO_MSy (y = 1 to 4; Replace y=1 for bit7, ... y=4 for bit4) Writing '1'disables the internal pull up/pull down on GPIO_MSy pin. Writing '0' enables the internal pull up/pull down on GPIO_MSy pin. It is an active LOW pull enable configuration. Bits 3,2,1,0 - PULL_TYPE GPIO_MSy (y = 1 to 4; Replace y=1 for bit3, ... y=4 for bit0) Writing '1' enables the internal pull down on GPIO_MSy pin. Writing '0' disables the internal pull up on GPIO_MSy pin. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 104 ATSAMB11XR/ZR GPIO Pin Controller 12.11.16 AO_GPIO_z Pull Enable Name: Reset: AON_PULL_ENABLE 0x00 Absolute Address: 0x4000F014 This register is a part of the AON_GP_REGS0 Registers. This register allows the user to enable the internal pull up for AO_GPIO_z pins. Bit 7 6 5 4 3 2 1 0 PULLUP_EN PULLUP_EN PULLUP_EN AO_GPIO_z AO_GPIO_z AO_GPIO_z R/W R/W R/W 0 0 0 Access Reset Bits 2,1,0 - PULLUP_EN AO_GPIO_z (z = 2 to 0; Replace z=2 for bit 2, ... z=0 for bit0) Writing '1'disables the internal pull up on AO_GPIO_z pin. Writing '0' enables the internal pull up on AO_GPIO_z pin. It is an active LOW pull enable configuration (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 105 ATSAMB11XR/ZR GPIO Pin Controller 12.11.17 WakeUp Control on AO_GPIO_z Name: Reset: GPIO_WAKEUP_CTRL 0x02 Absolute Address: 0x4000E000 This register is a part of the AON_PWR_SEQ0 registers. This register allows the user to enable the AO_GPIO_z to wake-up BLE subsystem from the ULP mode. Bit 7 6 5 4 3 2 1 0 BLE_ENABLE Access R/W Reset 1 Bit 1 - BLE_ENABLE Wake-up BLE subsystem on AO_GPIO_z (z = 0,1,2) Writing '0' to this bit disables the wake-up of BLE subsystem on AO_GPIO_z. Writing '1' to this bit enables the wake-up of BLE subsystem on AO_GPIO_z. This configuration is common for all AO_GPIO_z pins. For more details on wake-up procedure, see Wake-up Source. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 106 ATSAMB11XR/ZR Always-On (AON) Sleep Timer 13. Always-On (AON) Sleep Timer This timer is a 32-bit countdown timer that operates on the 32 kHz sleep clock. It can be used as a general-purpose timer for the ARM or as a wake-up source for the chip. 13.1 Features The following are the AON Sleep Timer features: * * * 13.2 32 bit decrement counter operation Supported modes: - Single Count mode - Reload mode Wake-up source for ARM and BLE subsystem Clock Configuration The AON Sleep Timer must be provided with clock source before configuring for normal operation. For more details on configuration, see AON Sleep Timer Clock Configuration. 13.3 Functional Description 13.3.1 Initialization After device reset, the AON Sleep Timer is not active. 13.3.2 Operation The Always-On (AON) Sleep Timer generates a timer tick at a programmed interval. The counter decrements at the frequency of the P_CLK (32.768 kHz is configured) clock signal. For more details see, Clock Settings for Critical Sections. When the counter reaches zero, a tick is generated and interrupt is triggered. There are two different modes; single count mode and reload mode. The following are the steps to initialize and enable the AON Sleep Timer. * * * * * Counter is decremented for each P_CLK. Calculate the counter value for desired interval (ms) using the following formula: SINGLE_COUNT_DURATION = Interval (ms) * P_CLK (kHz) Load the counter value in SINGLE_COUNT_DURATION register. Configure the interrupt vector line to connect the interrupt request to NVIC. To use interrupt requests of this peripheral, the Interrupt Controller (NVIC) must be configured first. For more information, see Nested Vector Interrupt Controller. To enable timer with the Single Count mode, set SINGLE_COUNT_ENABLE bit in CONTROL register. To enable timer with the Reload mode, set RELOAD_ENABLE bit in CONTROL register. This loads the CURRENT_COUNT_VALUE register with the value set in SINGLE_COUNT_DURATION register. It is required to wait for reload delay (Reload mode) or single count delay (Single Count mode) to ensure that the timer is loaded with the set counter value. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 107 ATSAMB11XR/ZR Always-On (AON) Sleep Timer * * 13.4 The CURRENT_COUNT_VALUE register starts decrementing and when it reaches zero, AON Sleep Timer interrupt is triggered. Interrupt request can be cleared by writing `1' to IRQ_CLEAR bit of CONTROL register. In Single Count mode, the AON Sleep Timer counter is not reloaded again and timer stops. In Reload mode AON Sleep Timer is again reloaded with SINGLE_COUNT_DURATION and timer starts decrementing again. Restart the Running AON Sleep Timer The AON Sleep Timer is started in Single Count mode or Reload mode by configuring CONTROL register as explained in Operation. Once the timer starts decrementing the CURRENT_COUNT_VALUE, to stop the counter, SINGLE_COUNT_ENABLE or RELOAD_ENABLE bit must be cleared. Even after clearing the bits, CURRENT_COUNT_VALUE register is not cleared immediately. It continues to decrement till it reaches zero, then the AON Sleep Timer stops. Therefore, while restarting the timer again with new value loaded on SINGLE_COUNT_DURATION gets reloaded on CURRENT_COUNT_VALUE only when the current counter reaches zero. AON Sleep Timer must be reset to clear the CURRENT_COUNT_VALUE to zero immediately. The AON Sleep Timer can be reset by clearing the SLEEP_TIMER_RSTN bit of AON_GLOBAL_RESET register. This procedure resets all the AON Sleep Timer registers to default values. For more details, see AON Sleep Timer Reset. The AON Sleep Timer must be disabled before it is reset in order to avoid undefined behavior. 13.5 Wake-up Source The AON Sleep Timer is also a wake-up source for the ARM subsystem and BLE subsystem to wake-up from the ULP mode after the set interval. Enabling the AON Sleep Timer as wake-up source can be done using the AON_ST_WAKEUP_CTRL register. By default, on reset the AON Sleep Timer as wake-up source is disabled. Note: It is recommended to enable wake-up of ARM subsystem and BLE subsystem together or wakeup of only the ARM subsystem. Enabling only the wake-up of the BLE subsystem should not be performed. 13.6 Power Management As AON Timer belongs to the Always On power domain, the configuration registers are intact when device goes to the ULP mode. For more details on how sleep and wake-up are controlled by ROM firmware, see ATSAMB11 BluSDK Smart Interrupts and ULP Architecture. 13.7 Register Summary This is the summary of all the registers used in this chapter. Absolute Address 0x4000D000 Register Group AON_SLEEP_T IMER0 Name CONTROL Bit Pos. 7:0 15:8 (c) 2018 Microchip Technology Inc. IRQ_CLEAR SLP_TIMER_SINGLE_COUNT_ENABLE_DLY [2:0] Datasheet Preliminary SINGLE_COUN T_ENABLE RELOAD_ENA BLE SLP_TIMER_CLK_RELOAD_DLY[ 1:0] DS70005342B-page 108 ATSAMB11XR/ZR Always-On (AON) Sleep Timer Absolute Address Register Group Name Bit Pos. 23:16 31:24 0x4000D004 0x4000D00C 0x4000E00C 13.8 AON_SLEEP_T IMER0 AON_SLEEP_T IMER0 AON_PWR_SE Q0 SINGLE_COUN T_DURATION CURRENT_CO UNT_VALUE AON_ST_WAK EUP_CTRL SLEEP_TIMER _NOT_ACTIVE SLEEP_TIMER _ACTIVE 7:0 COUNT_DURATION[7:0] 15:8 COUNT_DURATION[15:8] 23:16 COUNT_DURATION[23:16] 31:24 COUNT_DURATION[31:24] 7:0 COUNT[7:0] 15:8 COUNT[15:8] 23:16 COUNT[23:16] 31:24 COUNT[31:24] 7:0 BLE_ENABLE ARM_ENABLE Register Description (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 109 ATSAMB11XR/ZR Always-On (AON) Sleep Timer 13.8.1 AON Sleep Timer Control Name: Reset: CONTROL 0x80000000 Absolute Address: 0x4000D000 This register is a part of AON_SLEEP_TIMER0 Registers. This register allows the user to configure and enable AON Sleep Timer in Single Count mode or Reload mode. Bit 31 30 29 28 27 26 25 24 SLEEP_TIMER SLEEP_TIMER _NOT_ACTIVE _ACTIVE Access R R Reset 1 0 Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 Access Reset Bit SLP_TIMER_SINGLE_COUNT_ENABLE_DLY[2 SLP_TIMER_CLK_RELOAD_D :0] LY[1:0] Access R R R R R Reset 0 0 0 0 0 6 5 1 0 Bit 7 4 3 IRQ_CLEAR Access Reset 2 SINGLE_COUN RELOAD_ENA T_ENABLE BLE R/W R/W R/W 0 0 0 Bit 31 - SLEEP_TIMER_NOT_ACTIVE Read value '1', indicates that the CURRENT_COUNT_VALUE is 0 and AON Sleep Timer is not active. Bit 30 - SLEEP_TIMER_ACTIVE Read value '1', indicates that the CURRENT_COUNT_VALUE value is not 0 and AON Sleep Timer is running. Bits 14:12 - SLP_TIMER_SINGLE_COUNT_ENABLE_DLY[2:0] This provides the current status of the Single Count mode. Before setting or clearing SINGLE_COUNT_ENABLE bit the SLP_TIMER_SINGLE_COUNT_ENABLE_DLY[2] bit must be checked. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 110 ATSAMB11XR/ZR Always-On (AON) Sleep Timer Read Value of SLP_TIMER_SINGLE_COUNT_E NABLE_DLY[2] Description 0 If SLP_TIMER_SINGLE_COUNT_ENABLE_DLY[2] is 0, which means the SINGLE_COUNT_ENABLE bit is cleared and can write SINGLE_COUNT_ENABLE bit to a 1 when needed 1 If SLP_TIMER_SINGLE_COUNT_ENABLE_DLY[2] is 1, which means the SINGLE_COUNT_ENABLE bit is set and can write SINGLE_COUNT_ENABLE bit to a 0 when needed Bits 9:8 - SLP_TIMER_CLK_RELOAD_DLY[1:0] This provides the current status of the reload mode. Before setting or clearing RELOAD_ENABLE bit the SLP_TIMER_CLK_RELOAD_DLY[1] bit must be checked. Read Value of SLP_TIMER_CLK_RELOAD_DL Y[1] Description 0 If SLP_TIMER_CLK_RELOAD_DLY[1] bit is 0, which means the RELOAD_ENABLE bit is cleared and it is safe to write RELOAD_ENABLE bit to a 1 when needed 1 If SLP_TIMER_CLK_RELOAD_DLY[1] bit is 1, which means the RELOAD_ENABLE bit is set and it is safe to write RELOAD_ENABLE bit to a 0 when needed Bit 4 - IRQ_CLEAR Writing '0' to a bit has no effect. Writing '1' to a bit will clear the AON Sleep Timer interrupt request. Bit 1 - SINGLE_COUNT_ENABLE Writing '0' to a bit disables AON Sleep Timer in Single Count mode. Writing '1' to a bit enables AON Sleep Timer in Single Count mode and loads the AON Sleep Timer with the SINGLE_COUNT_DURATION value. Bit 0 - RELOAD_ENABLE Writing '0' to a bit disables AON Sleep Timer in Reload mode. Writing '1' to a bit enable AON Sleep Timer in Reload mode and loads the AON Sleep Timer with the SINGLE_COUNT_DURATION value whenever the timer expires. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 111 ATSAMB11XR/ZR Always-On (AON) Sleep Timer 13.8.2 AON Sleep Timer Duration Name: Reset: SINGLE_COUNT_DURATION 0x00000000 Absolute Address: 0x4000D004 This register is a part of AON_SLEEP_TIMER0 Registers. This register allows the user to load AON Sleep Timer duration counter value for Single Count mode or Reload mode. Bit 31 30 29 28 27 26 25 24 COUNT_DURATION[31:24] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 23 22 21 20 19 18 17 16 COUNT_DURATION[23:16] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 15 14 13 12 11 10 9 8 COUNT_DURATION[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 COUNT_DURATION[7:0] Access Reset Bits 31:0 - COUNT_DURATION[31:0] These bits hold the counter value equivalent to timer interval that is loaded into the CURRENT_COUNT_VALUE register. For more details on formula, see Operation. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 112 ATSAMB11XR/ZR Always-On (AON) Sleep Timer 13.8.3 AON Sleep Timer Current Counter Value Name: Reset: CURRENT_COUNT_VALUE 0x00000000 Absolute Address: 0x4000D00C This register is a part of the AON_SLEEP_TIMER0 Registers. This register contains the AON Sleep Timer current counter value of Single Count mode or Reload mode. This starts decrementing and when it reaches zero AON Sleep Timer interrupt is triggered. Bit 31 30 29 28 27 26 25 24 COUNT[31:24] Access R R R R R R R R Reset 0 0 0 0 0 0 0 0 Bit 23 22 21 20 19 18 17 16 COUNT[23:16] Access R R R R R R R R Reset 0 0 0 0 0 0 0 0 Bit 15 14 13 12 11 10 9 8 Access R R R R R R R R Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 COUNT[15:8] COUNT[7:0] Access R R R R R R R R Reset 0 0 0 0 0 0 0 0 Bits 31:0 - COUNT[31:0] These bits contain the current counter value. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 113 ATSAMB11XR/ZR Always-On (AON) Sleep Timer 13.8.4 WakeUp Control on AON Sleep Timer Name: Reset: AON_ST_WAKEUP_CTRL 0x00 Absolute Address: 0x4000E00C This register is a part of the AON_PWR_SEQ0 Registers. This register allows the user to enable the AON Sleep Timer to wake-up ARM subsystem and BLE subsystem from the ULP mode. Bit 7 6 5 4 3 2 1 0 BLE_ENABLE ARM_ENABLE Access Reset R/W R/W 0 0 Bit 1 - BLE_ENABLE Writing '0' disables BLE subsystem wake-up by AON Sleep Timer. Writing '1' enables BLE subsystem wake-up by AON Sleep Timer. Bit 0 - ARM_ENABLE Writing '0' disables ARM subsystem wake-up by AON Sleep Timer. Writing '1' enables ARM subsystem wake-up by AON Sleep Timer. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 114 ATSAMB11XR/ZR Pulse Width Modulation 14. Pulse Width Modulation The Pulse Width Modulation (PWM) feature provides a way to generate a periodic pulse waveform. The SAMB11 contains four individually configurable PWM blocks to provide external control voltages. 14.1 Features * * * * * * 14.2 Four individually configurable PWM blocks Automatic generation of PWM output by hardware without software intervention Two PWM modes of operation Configurable period and duty cycle of PWM output Four different selectable base frequencies for PWM (26 MHz, 13 MHz, 6.5 MHz, 3.25 MHz) Configurable PWM output on LP_GPIO_x pins via MEGAMUX options Clock Configuration Before configuring the PWM registers, reset the PWM core by setting PWMx_ RSTN bit in LPMCU_GLOBAL_RESET_0 register. The PWM peripheral must be provided with clock source before configuring for normal operation. For more details on configuration, see Peripheral Clock Configuration. 14.3 Functional Description 14.3.1 Initialization After device reset, PWM registers are zero. PWM waveform can be output on any of LP_GPIO_x pins configured through MEGAMUX options. * * * * To get output of PWM waveform on specific LP_GPIO_x pin, configure PINMUX_SEL[2:0] of specific pin on PINMUX_SEL_n register with value equal to 1. This configuration enables MEGAMUXing on this pin. See the MEGAMUX Options table and configure the MEGA_MUX_IO_SEL_n register with PWM option. Select the PWM module clock source by configuring the CLOCK_SEL[1:0] bits of PWMn_CTRL register. The clock sources that can be selected are 26 MHz, 13 MHz, 6.5 MHz and 3 MHz. There are two modes of operation that are selectable through the PWM_MODE_SEL bit of the PWMn_CTRL register. - - 14.3.2 PWM Mode 1-Clear PWM_MODE_SEL bit PWM Mode 2-Set PWM_MODE_SEL bit PWM Mode 1 Operation The PWM Mode 1 operation is based on 15-bit timer with compare match logic. The PWM period (T) is controlled by PWM_PERIOD [3:0] and the duty cycle is controlled by AGCDATA_IN[9:0] bits of PWMn_CTRL register. The timer TOP value is set based on PWM_PERIOD[3:0] and SAMPLE_METHOD as shown in the following table. When the PWM is enabled by writing 1' to PWM_EN bit of PWMn_CTRL register, the timer counter is incremented for every clock cycle. When up-counting, the PWM output on LP_GPIO_x is set when the masked value of TOP value with timer counter becomes ZERO. The PWM (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 115 ATSAMB11XR/ZR Pulse Width Modulation output is cleared when the timer counter reaches CC value as per the table. This PWM output polarity on LP_GPIO_x is reversed when OUTPUT_POLARITY bit of PWMn_CTRL register is set. 14.3.2.1 Method of Operation in PWM Mode 1 There are three methods of operation in PWM Mode 1: 1. 2. 3. USE_AGCUPDATE=1 and AGCUPDATE=1 USE_AGCUPDATE=0 , AGCUPDATE=0 and SAMPLE_METHOD=1 USE_AGCUPDATE=0 , AGCUPDATE=0 and SAMPLE_METHOD=0 Table 14-1. PWM Mode 1 Functional Values SHIFTED_OUT TOP MAX CC SAMPLE_M ETHOD=0 SAMPLE_M ETHOD=1 USE_AGCU PDATE = 1, AGC_UPDA TE=1 SAMPLE_M ETHOD=0 SAMPLE_M ETHOD=1 USE_AGCU PDATE = 1, AGC_UPDA TE=1 SAMPLE_M ETHOD=0 SAMPLE_M ETHOD=1 USE_AGCU PDATE = 1, AGC_UPDA TE=1 0 AGCDATA_I N_POST_IN VERT[9:0]> >4 AGCDATA_I N_POST_IN VERT[3:0] 0 0 0x3F 0x3F 0x3F 0x3FF 0x3F 0x3F 1 AGCDATA_I N_POST_IN VERT[9:0]> >3 AGCDATA_I N_POST_IN VERT[2:0] 0 0 0x7F 0x7F 0x7F 0x3FF 0x7F 0x7F 2 AGCDATA_I N_POST_IN VERT[9:0]> >2 AGCDATA_I N_POST_IN VERT[1:0] 0 0 0xFF 0xFF 0xFF 0x3FF 0xFF 0xFF 3 AGCDATA_I N_POST_IN VERT[9:0]> >1 AGCDATA_I N_POST_IN VERT[0:0] 0 0 0x1FF 0x1FF 0x1FF 0x3FF 0x1FF 0x1FF 4 AGCDATA_I N_POST_IN VERT[9:0]> >0 0 0 0 0x3FF 0x3FF 0x3FF 0x3FF 0x3FF 0x3FF 5 AGCDATA_I N_POST_IN VERT[9:0]< <1 0 0 0 0x7FF 0x7FF 0x7FF 0x3FF 0x7FF 0x7FF 6 AGCDATA_I N_POST_IN VERT[9:0]< <2 0 0 0 0xFFF 0xFFF 0xFFF 0x3FF 0xFFF 0xFFF 7 AGCDATA_I N_POST_IN VERT[9:0]< <3 0 0 0 0x1FFF 0x1FFF 0x1FFF 0x3FF 0x1FFF 0x1FFF 8 AGCDATA_I N_POST_IN VERT[9:0]< <4 0 0 0 0x3FFF 0x3FFF 0x3FFF 0x3FF 0x3FFF 0x3FFF Others AGCDATA_I N_POST_IN VERT[9:0]> >0 0 0 0 0x3FF 0x3FF 0x3FF 0x3FF 0x3FF 0x3FF PWM_PERI OD[3:0] (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 116 ATSAMB11XR/ZR Pulse Width Modulation Note: The AGCDATA_FMT bit of PWMn_CTRL register decides the sign of AGCDATA_IN[9:0] data. If AGCDATA_FMT is `1' then AGCDATA_IN is unsigned data and if AGCDATA_FMT is `0' then AGCDATA_IN is signed data. AGCDATA_IN_POST_INVERT[9:0] = {AGCDATA_IN[9] ^ (~AGCDATA_FMT), AGCDATA_IN[8:0]} USE_AGCUPDATE=1 and AGCUPDATE=1 If USE_AGCUPDATE bit is `1', then the AGCUPDATE bit must be `1' for PWM pulse output. The TOP and MAX values are as per PWM Mode 1 Functional Values under USE_AGCUPDATE =1, AGCUPDATE=1. The TOP and MAX values are same in this method. The CC value is the shifted value of AGCDATA_IN[9:0]. The SHIFTED_OUT bits of AGCDATA_IN[9:0] are lost in this method. Hence, there PWM pulse output is not generated for AGCDATA_IN[9:0] values 0x1 to 0xF. Figure 14-1. PWM Mode1 Operation USE_AGCUPDATE=0 , AGCUPDATE=0 and SAMPLE_METHOD=1 USE_AGCUPDATE=0 , AGCUPDATE=0 and SAMPLE_METHOD=1 If USE_AGCUPDATE is `0', then PWM pulse output is changed based on SAMPLE_METHOD bit. Refer the TOP and MAX in table under SAMPLE_METHOD=1. The operation of SAMPLE_METHOD=1 is same as the first method. Figure 14-2. PWM Mode1 Operation USE_AGCUPDATE =1 and AGCUPATE=1 USE_AGCUPDATE=0 , AGCUPDATE=0 and SAMPLE_METHOD=0 If USE_AGCUPDATE is `0' and SAMPLE_METHOD=0, then, the TOP and MAX values are referred under SAMPLE_METHOD=0 in table. The TOP and MAX values are not same in this method. In this method, the SHIFTED_OUT bits of AGCDATA_IN adds extra cycle in the PWM pulse stream. The SHIFTED_OUT value is getting added with EXTRA_CYCLE[3:0] every time the counter reaches TOP (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 117 ATSAMB11XR/ZR Pulse Width Modulation value as per the following equation. An extra pulse is generated when the bit `4' of EXTRA_CYCLE[4:0] is set. EXTRA_CYCLE[4:0] = SHITED_OUT + EXTRA_CYCLE[3:0] Example1: The PWM pulse output for AGCDATA_IN[9:0] = 0x11 and PWM_PERIOD[3:0]=0x00 is shown in the following figure. When upcounting, the PWM output on LP_GPIO_x is set when the masked value of TOP (TOP = 0x3F) value with timer counter becomes ZERO. The PWM output is cleared when the timer counter reaches CC (CC = 0x01). An extra cycle is added in the pulse stream when EXTRA_CYCLE[4:0] bit '4' is set. This is set when timer counter reaches 0x3CO for this AGCDATA_IN[9:0] = 0x11 as shown in the following figure. Figure 14-3. PWM Mode1 Operation SAMPLE_METHOD=0 Example: AGCDATA_IN[9:0] = 0x11 and PWM_PERIOD[3:0] = 0 Example2: The PWM pulse output for AGCDATA_IN[9:0] = 0x01 and PWM_PERIOD[3:0]=0x00 is shown in the following figure. As CC=0x00, there is no pulse stream, but an extra cycle is added in the pulse stream when EXTRA_CYCLE[4:0] bit '4' is set. The extra pulse is added when timer counter reaches 0x3CO for this AGCDATA_IN[9:0] = 0x01 as shown in the following figure. Figure 14-4. Figure 14-3. PWM Mode1 Operation SAMPLE_METHOD=0 Example: AGCDATA_IN[9:0] = 0x01 and PWM_PERIOD[3:0] = 0 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 118 ATSAMB11XR/ZR Pulse Width Modulation 14.3.2.2 PWM Pulse Frequency The clock input to PWM module can be selected through CLOCK_SEL[1:0] bits of PWMn_CTRL register. Four different clock inputs are possible. The PWM pulse frequency (fPWM) of the PWM block is derived from selected input clock frequency (fPWM_base) using the following formula. When, PWM_PERIOD[3:0] = 0,1,2, ... , 8 (Mode 1) = 64*2 _ PWM_PERIOD[3:0] When, PWM_PERIOD[3:0] > 8 (Mode 1) = _ 64*2^4 fPWM_base can be selected to have different values according to Table 14-2. The minimum and maximum frequencies supported for each clock selection are also listed in the table. Table 14-2. fPWM Range for Different fPWM Base Frequencies fPWM_base fPWM max. fPWM min. 26 MHz 406.25 kHz 1.586 kHz 13 MHz 203.125 kHz 793.25 Hz 6.5 MHz 101.562 kHz 396.72 Hz 3.25 MHz 50.781 kHz 198.36 Hz 14.3.2.3 PWM Duty Cycle The duty cycle is configured through AGCDATA_IN[9:0] bits. The duty cycle is calculated using the following formula: Duty cycle (Mode1) = CC TOP+1 14.3.2.4 Enabling and Disabling PWM Mode 1 Operation After configuring PWMn_CTRL register with desired duty cycle and period the PWM output on specific LP_GPIO_x is enabled by writing a `1' to PWM_EN bit of PWMn_CTRL register. 14.3.2.5 Updating New Duty Cycle and Period for Mode 1 USE_AGCUPDATE and AGCUPDATE decide the update new AGCDATA_IN[9:0] value and output the PWM pulse accordingly. If USE_AGCUPDATE is `1' then only when AGCUPDATE bit is `1' the AGCDATA_IN[9:0] is loaded into internal registers. The PWM output is available on LP_GPIO_x pin after PWM_EN is set. If AGCUPDATE bit is `0' then PWM pulse is not output. If USE_AGCUPDATE is `0' then the internal PWM register is updated with new values when the timer counter reaches MAX value in SAMPLE_METHOD =1 and SAMPLE_METHOD =0. 14.3.3 PWM Mode 2 Operation The PWM Mode 2 operation is based on accumulator logic. Both the PWM period (T) and duty cycle are controlled by AGCDATA_IN[9:0] bits of PWMn_CTRL register. The PWM Mode 2 operation is selected by setting PWM_MODE_SEL bit of PWMn_CTRL register. When AGCUPDATE bit is `1' the AGCDATA_IN_POST_INVERT[9:0] is loaded into internal register. Enable PWM pulse output on specific LP_GPIO_x by writing a `1' to PWM_EN bit of PWMn_CTRL register. When AGCUPDATE bit is `0', on (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 119 ATSAMB11XR/ZR Pulse Width Modulation every clock cycle (clock input selected using CLOCK_SEL[2:0] bits of PWMn_CTRL register) accumulation happens as per below calculation: AGC_ACC[10:0] = AGCDATA_IN_POST_INVERT[9:0] + AGC_ACC[9:0] The PWM output on LP_GPIO_x is set whenever AGC_ACC[10] is `1' and cleared when AGC_ACC[10] is `0'. This PWM output polarity on LP_GPIO_x is reversed when OUTPUT_POLARITY bit of PWMn_CTRL register is set. 14.3.3.1 PWM Pulse Frequency The clock input to PWM module can be selected through CLOCK_SEL[1:0] bits of PWMn_CTRL register. Four different clock inputs are possible. The PWM pulse frequency (fPWM) of the PWM block is derived from selected input clock frequency (fPWM_base) using following formula. When, AGCDATA_IN_POST_INVERT[9:0] <= 512: (Mode 2) = _* AGCDATA_IN_POST_INVERT[9:0]/1024 When, AGCDATA_IN_POST_INVERT[9:0] > 512: (Mode 2) = _* (1024 - AGCDATA_IN_POST_INVERT[9:0])/1024 Note: The AGCDATA_FMT bit of PWMn_CTRL register decides the sign of AGCDATA_IN[9:0] data. If AGCDATA_FMT is `1' then AGCDATA_IN is unsigned data and if AGCDATA_FMT is `0' then AGCDATA_IN is signed data. AGCDATA_IN_POST_INVERT[9:0] = {AGCDATA_IN[9] ^ (~AGCDATA_FMT), AGCDATA_IN[8:0]} 14.3.3.2 PWM Duty Cycle The duty cycle is configured through AGCDATA_IN[9:0] bits. The duty cycle is calculated using the following formula: Duty cycle (Mode2) = AGCDATA_IN_POST_INVERT[9:0] 1024 Note: The AGCDATA_FMT bit of PWMn_CTRL register decides the sign of AGCDATA_IN[9:0] data. If AGCDATA_FMT is `1' then AGCDATA_IN is unsigned data and if AGCDATA_FMT is `0' then AGCDATA_IN is signed data. AGCDATA_IN_POST_INVERT[9:0] = {AGCDATA_IN[9] ^ (~AGCDATA_FMT), AGCDATA_IN[8:0]} 14.3.3.3 Enabling and Disabling PWM Mode 2 Operation After configuring PWMn_CTRL register with desired duty cycle and period the PWM output on specific LP_GPIO_x is enabled by writing a `1' to PWM_EN bit of PWMn_CTRL register. 14.3.3.4 Updating New Duty Cycle and Period The AGCUPDATE bit decides the update of new AGCDATA_IN[9:0] and output of the PWM pulse accordingly. If AGCUPDATE bit is `1', the AGCDATA_IN[9:0] will be loaded into internal register. If AGCUPDATE bit is `0', the AGC accumulation as per new AGCDATA_IN[9:0] value starts and PWM pulse is available on LP_GPIO_x pin when PWM_EN is bit is set. The USE_AGCUPDATE bit is not used for PWM Mode 2 operation. 14.4 Power Management If the system goes to the Ultra-Low Power mode, the PWM peripheral is shut down and the PWM pulse output is stopped. The PWM configuration registers lose its content, and can not be restored when powered-up again. Therefore, the user must reconfigure the PWM peripheral at power-up to ensure it is in a well-defined state before use. For details on reconfiguration, refer to ATSAMB11 BluSDK Smart (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 120 ATSAMB11XR/ZR Pulse Width Modulation Interrupts and ULP Architecture and Usage User Guide. This document also explains how sleep and wake-up are controlled. 14.5 Register Summary This is the summary of all the registers used in this chapter. Absolute Address 0x4000B160 Register Group LPMCU_MISC_ REGS0 Registers Name PWM0_CTRL Bit Pos. 7:0 PWM_PERIOD[ 2:0] 15:8 LPMCU_MISC_ REGS0 Registers PWM1_CTRL CLOCK_SEL[1:0] 7:0 PWM_PERIOD[ 2:0] 15:8 AGCDATA_IN[6 :0] 23:16 0x4000B168 LPMCU_MISC_ REGS0 Registers PWM2_CTRL 7:0 PWM_PERIOD[ 2:0] 15:8 AGCDATA_IN[6 :0] LPMCU_MISC_ REGS0 Registers PWM3_CTRL PWM_PERIOD[ 2:0] 15:8 AGCDATA_IN[6 :0] 23:16 0x4000B044 0x4000B048 0x4000B04C 0x4000B080 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 PINMUX_SEL_ 0 PINMUX_SEL_ 1 PINMUX_SEL_ 2 PINMUX_SEL_ 4 OUTPUT_POL ARITY PWM_EN PWM_PERIOD[ 3] USE_AGCUPD ATE SAMPLE_MET HOD AGCDATA_IN[9:7] AGCDATA_FM T OUTPUT_POL ARITY PWM_EN PWM_PERIOD[3] AGC_UPDATE USE_AGCUPD ATE SAMPLE_MET HOD PWM_MODE_SEL AGCDATA_IN[9:7] AGCDATA_FM T OUTPUT_POL ARITY PWM_EN PWM_PERIOD[3] CLOCK_SEL[1:0] 7:0 AGC_UPDATE PWM_MODE_SEL CLOCK_SEL[1:0] 23:16 0x4000B16C AGCDATA_FM T AGCDATA_IN[6:0] 23:16 0x4000B164 SAMPLE_MET HOD PWM_MODE_SEL AGC_UPDATE USE_AGCUPD ATE SAMPLE_MET HOD PWM_MODE_SEL AGCDATA_IN[9:7] AGCDATA_FM T OUTPUT_POL ARITY PWM_EN PWM_PERIOD[3] CLOCK_SEL[1:0] AGC_UPDATE USE_AGCUPD ATE AGCDATA_IN[9:7] 7:0 PINMUX_SEL[2:0] LP_GPIO_1 PINMUX_SEL[2:0] LP_GPIO_0 15:8 PINMUX_SEL[2:0] LP_GPIO_3 PINMUX_SEL[2:0] LP_GPIO_2 23:16 PINMUX_SEL[2:0] LP_GPIO_5 PINMUX_SEL[2:0] LP_GPIO_4 31:24 PINMUX_SEL[2:0] LP_GPIO_7 PINMUX_SEL[2:0] LP_GPIO_6 7:0 PINMUX_SEL[2:0] LP_GPIO_9 PINMUX_SEL[2:0] LP_GPIO_8 15:8 PINMUX_SEL[2:0] LP_GPIO_11 PINMUX_SEL[2:0] LP_GPIO_10 23:16 PINMUX_SEL[2:0] LP_GPIO_13 PINMUX_SEL[2:0] LP_GPIO_12 31:24 PINMUX_SEL[2:0] LP_GPIO_15 PINMUX_SEL[2:0] LP_GPIO_14 7:0 PINMUX_SEL[2:0] LP_GPIO_17 PINMUX_SEL[2:0] LP_GPIO_16 15:8 PINMUX_SEL[2:0] LP_GPIO_19 PINMUX_SEL[2:0] LP_GPIO_18 23:16 PINMUX_SEL[2:0] LP_GPIO_21 PINMUX_SEL[2:0] LP_GPIO_20 31:24 PINMUX_SEL[2:0] LP_GPIO_23 PINMUX_SEL[2:0] LP_GPIO_22 7:0 PINMUX_SEL[2:0] LP_GPIO_24 15:8 23:16 31:24 0x4000B1A0 0x4000B1A4 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 MEGA_MUX_I O_SEL_0 MEGA_MUX_I O_SEL_1 7:0 MEGAMUX_SEL[5:0] LP_GPIO_0 15:8 MEGAMUX_SEL[5:0] LP_GPIO_1 23:16 MEGAMUX_SEL[5:0] LP_GPIO_2 31:24 MEGAMUX_SEL[5:0] LP_GPIO_3 7:0 MEGAMUX_SEL[5:0] LP_GPIO_4 15:8 MEGAMUX_SEL[5:0] LP_GPIO_5 23:16 MEGAMUX_SEL[5:0] LP_GPIO_6 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 121 ATSAMB11XR/ZR Pulse Width Modulation Absolute Address 0x4000B1A8 0x4000B1AC 0x4000B1B0 0x4000B1B4 0x4000B1B8 14.6 Register Group LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 Name MEGA_MUX_I O_SEL_2 MEGA_MUX_I O_SEL_3 MEGA_MUX_I O_SEL_4 MEGA_MUX_I O_SEL_5 MEGA_MUX_I O_SEL_6 Bit Pos. 31:24 MEGAMUX_SEL[5:0] LP_GPIO_7 7:0 MEGAMUX_SEL[5:0] LP_GPIO_8 15:8 MEGAMUX_SEL[5:0] LP_GPIO_9 23:16 MEGAMUX_SEL[5:0] LP_GPIO_10 31:24 MEGAMUX_SEL[5:0] LP_GPIO_11 7:0 MEGAMUX_SEL[5:0] LP_GPIO_12 15:8 MEGAMUX_SEL[5:0] LP_GPIO_13 23:16 MEGAMUX_SEL[5:0] LP_GPIO_14 31:24 MEGAMUX_SEL[5:0] LP_GPIO_15 7:0 MEGAMUX_SEL[5:0] LP_GPIO_16 15:8 MEGAMUX_SEL[5:0] LP_GPIO_17 23:16 MEGAMUX_SEL[5:0] LP_GPIO_18 31:24 MEGAMUX_SEL[5:0] LP_GPIO_19 7:0 MEGAMUX_SEL[5:0] LP_GPIO_20 15:8 MEGAMUX_SEL[5:0] LP_GPIO_21 23:16 MEGAMUX_SEL[5:0] LP_GPIO_22 31:24 MEGAMUX_SEL[5:0] LP_GPIO_23 7:0 MEGAMUX_SEL[5:0] LP_GPIO_24 Register Description (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 122 ATSAMB11XR/ZR Pulse Width Modulation 14.6.1 PWM Control Register Name: Reset: PWMn_CTRL 0x000000 Absolute Address: 0x4000B160(PWM0),0x4000B164(PWM1),0x4000B168(PWM2), 0x4000B16C(PWM3) This register is a part of the LPMCU_MISC_REGS0 Registers. This register allows the user to configure PWM functionality and enables the PWM output. There are four individual PWM blocks in SAMB11 and four PWMn_CTRL registers (n=0,1,2,3). Bit 23 22 21 CLOCK_SEL[1:0] 20 19 18 AGC_UPDATE USE_AGCUPD 17 16 AGCDATA_IN[9:7] ATE Access Reset Bit 15 R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 14 13 12 11 10 9 AGCDATA_IN[6:0] 8 PWM_PERIOD[ 3:3] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 PWM_PERIOD[2:0] Access Reset PWM_MODE_S SAMPLE_MET AGCDATA_FM OUTPUT_POL EL HOD T ARITY 0 PWM_EN R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 Bits 22:21 - CLOCK_SEL[1:0] These bits select clock input for PWM. CLOCK_SEL[1:0] Description 0x0 26 MHz 0x1 13 MHz 0x2 6.5 MHz 0x3 3.25 MHz Bit 20 - AGC_UPDATE In combination with USE_AGCUPDATE, PWM_MODE_SEL, and SAMPLE_METHOD controls the loading of AGCDATA_IN into internal registers. Bit 19 - USE_AGCUPDATE In combination with AGC_UPDATE, and PWM_MODE_SEL controls the loading of AGCDATA_IN into internal registers. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 123 ATSAMB11XR/ZR Pulse Width Modulation PWM_MODE_SEL USE_AGCUPDATE AGC_UPDATE SAMPLE_METHOD Operation 0 1 1 X AGCDATA_IN loaded into internal register 0 1 0 X AGCDATA_IN is not loaded into internal register 0 0 X 1 The SHIFTED_OUT bits of AGCDATA_IN[9:0] are lost in this method 0 0 X 0 The SHIFTED_OUT bits of AGCDATA_IN adds extra cycle in the PWM pulse stream 1 X 0->1->0 X AGCDATA_IN loaded into internal register when AGC_UPDATE is '1' and PWM output is seen after AGC_UPDATE is made as '0' Bits 18:9 - AGCDATA_IN[9:0] Configures the duty cycle. Bits 8:5 - PWM_PERIOD[3:0] Configures the period of PWM pulse frequency for PWM Mode 1 operation. For more details on formula, see PWM Pulse Frequency. Bit 4 - PWM_MODE_SEL Selects the two different PWM modes of operations. PWM_MODE_SEL Mode 0 Mode 1 1 Mode 2 Bit 3 - SAMPLE_METHOD SAMPLE_METHOD Description 0 SHIFTED_OUT bits of AGCDATA_IN adds extra cycle in the PWM pulse stream 1 The SHIFTED_OUT bits of AGCDATA_IN[9:0] are lost in this method Bit 2 - AGCDATA_FMT Configures the sign of AGCDATA_IN[9:0] value. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 124 ATSAMB11XR/ZR Pulse Width Modulation Bit 1 - OUTPUT_POLARITY Writing '1' to this bit reverses PWM pulse output polarity. Bit 0 - PWM_EN Writing '1' to this bit enables PWM functionality. Writing '0' to this bit disables PWM functionality. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 125 ATSAMB11XR/ZR I2C Interface 15. I2C Interface The ATSAMB11-XR2100A and the ATSAMB11-ZR210CA provide an I2C interface that can be configured as slave or master. The I2C interface is a two-wire serial interface consisting of a serial data line (SDA) and a serial clock line (SCL). The ATSAMB11-XR2100A and the ATSAMB11-ZR210CA I2C support I2C bus Version 2.1 - 2000. 15.1 Features The following are the features of I2C module: * * * * * * * * 15.2 Two I2C peripherals (I2C0 and I2C1) available Modes of operation: - Master mode - Slave mode Clock stretching by slave Automatic address recognition in hardware Automatic acknowledgment generation Standard mode (100 kbps) Fast mode (400 kbps) High-Speed mode (3.4 Mbps) Principal of Operation The I2C interface uses two physical lines for communication: * * Serial Data Line (SDA) for packet transfer Serial Clock Line (SCL) for the bus clock The I2C is a synchronous serial interface. The SDA line is a bidirectional signal and changes only when the SCL line is low, except for STOP and START conditions. A transaction starts with the I2C master sending the start condition, followed by a 7-bit address and a direction bit (read or write to/from the slave). The addressed I2C slave will then acknowledge (ACK) the address, and data packet transactions can begin. Every 9-bit data packet consists of 8 data bits followed by a one-bit reply indicating whether or not the data was acknowledged. If a data packet is not acknowledged (NACK), whether by the I2C slave or master, the I2C master acts by terminating the transaction by sending the stop condition. The I2C peripheral in ATSAMB11-XR2100A and the ATSAMB11-ZR210CA does not support repeated start and 10-bit slave addressing condition. The output drivers are open-drain to perform wire-AND functions on the bus. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 126 ATSAMB11XR/ZR I2C Interface The maximum number of devices on the bus are limited by only the maximum capacitance specification of 400 pF. The following figure illustrates the I2C transaction formats. The I2C pins SCL and SDA can be selected based on the configuration selected in the Peripheral Multiplexing and MEGAMUXing register. For more details, see Peripheral Multiplexing and MEGAMUXing. 15.3 Clock Configuration Before configuring the I2C registers, reset the I2C core by setting I2CX_CORE_RSTN bit in LPMCU_GLOBAL_RESET_0 register. Then the clock to the I2C peripheral needs to be enabled. This is done by setting the I2C0_CORE_CLK_EN, I2C1_CORE_CLK_EN bit in LPMCU_CLOCK_ENABLES_0 register for I2C0 and I2C1 respectively. For more details on configuration, see Peripheral Clock Configuration. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 127 ATSAMB11XR/ZR I2C Interface 15.4 Functional Description 15.4.1 Initialization * * * * * 15.4.2 Enabling, Disabling, and Flushing * * * * 15.4.3 Configure the pin mux register and/or MEGAMUX register (see I/O Peripheral Multiplexing and MegaMuxing) to select the IO pins that need to be used as SCL and SDA lines. Select the I2C module clock source by configuring the CLOCK_SOURCE_SELECT register. The clock sources that can be selected are 26 MHz, 13 MHz, 6.5 MHz and 3 MHz. In Slave mode, the clock source selected should be a factor of at least five times more than the SCL clock from master device. For example, to operate the SCL at 400 kHz a minimum 2 MHz clock is required. Set the clock divider value by configuring I2C_CLK_DIVIDER register. In Master mode, the value configured in this register determine the SCL frequency. The clock source selected in CLOCK_SOURCE_SELECT register is divided by (n+1), where n is the value set in I2C_CLK_DIVIDER register. SCL Frequency = CLOCK_SOURCE_SELECT/(I2C_CLK_DIVIDER+1) To configure the I2C as master, set the MASTER_ENABLE bit in I2C_MASTER_MODE register. To configure the I2C as slave, write the 7-bit slave address in register I2C_SLAVE_ADDRESS. Clear MASTER_ENABLE bit in I2C_MASTER_MODE register. The I2C peripheral is enabled by setting the ENABLE bit in I2C_MODULE_ENABLE register. Setting the ENABLE bit enables the I2C module clock and can perform in I2C transactions. To generate interrupts on I2C transaction, the appropriate bits in the interrupt mask registers must be set, as follows: - Register the I2C transmit and receive ISR function - Enable the interrupts in NVIC interrupt controller registers. For more details, see Interrupt section. 2 The I C peripheral is disabled by clearing the ENABLE bit in I2C_MODULE_ENABLE register. If this bit is cleared then the module does not take part in any I2C transactions and the internal state of the module is reset and placed in a low power mode. The I2C_FLUSH register can be used to flush the contents of both the transmit and receive FIFOs. Flushing the transmit FIFO terminates any ongoing transactions when the current byte is transmitted. This allows the software to flush the FIFOs and abort any ongoing transactions. The I2C_ACTIVE bit in I2C_STATUS register indicates whether the I2C peripheral is idle or active state. If the I2C_ACTIVE bit is set, the I2C module is in active state and the configuration registers should not be changed during this period. If the registers are modified while a transaction is ongoing, the state of the I2C module cannot be guaranteed. I2C Master Operation * * The I2C transaction is started by setting the ONBUS_ENABLE bit in the I2C_ONBUS register. When operating as a master the module initiates transactions when data are placed in the transmit FIFO, and continues to transmit the content of the FIFO until it is empty. If ONBUS_ENABLE bit is reset to 0 then the module completes the transmission of the current byte and generates a stop condition on the bus. The start condition is generated by setting the ADDRESS_FLAG bit in TRANSMIT_DATA register and ONBUS_ENABLE bit in I2C_ONBUS register is enabled. The byte written into the lower 8 [7:1] bits of TRANSMIT_DATA register must then be the address of the device associated with this transaction and the least significant bit 0 of the data indicates the direction of the transaction. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 128 ATSAMB11XR/ZR I2C Interface * 15.4.4 The NAK bit in RECEIVE_STATUS register is set when a NAK is received. The I2C module automatically retries the transmission, the transaction can be aborted by writing to the I2C_FLUSH register. I2C Slave Operation In Slave mode, the NAK bit in RECEIVE_STATUS register is set at the end of a transaction. The module automatically recognizes the end of a transaction and stops; this bit can be used by the software to recognize the end of a transaction. 15.4.5 Transmit and Receive Operation * * * * 15.5 The I2C Module has two FIFOs, one for transmit and one for receive to automate transmission/ reception. The data written on TRANSMIT_DATA register pushes one byte into the transmit FIFO. The TRANSMIT_STATUS register reflects the state of the I2C transmitter. If the corresponding bits are set in the TX_INTERRUPT_MASK register then interrupts can be generated upon the bit in this register being set. To enable the I2C interrupt on transmit, register the I2C transmit ISR function and enable the interrupts in NVIC interrupt controller registers. For more details, see Interrupt. Reading from the RECEIVE_DATA register pops one byte from the receive FIFO. The RECEIVE_STATUS register reflects the state of the I2C receiver. If the corresponding bits are set in the RX_INTERRUPT_MASK mask register, then interrupts can be generated upon the bit in this register being set. To enable the I2C interrupt on reception, register the I2C receive ISR function and enable the interrupts in NVIC interrupt controller registers. For more details, see Interrupt. Power Management If the system goes to the Ultra-Low Power mode, the I2C peripheral shuts down. The I2C configuration registers lose their content, and are not restored when powered- up again. User must reconfigure the I2C peripheral at power-up to ensure it is in a well-defined state before use. For details on reconfiguration, refer to ATSAMB11 BluSDK Smart Interrupts and ULP Architecture and Usage User Guide. This document also explains on how sleep and wake-up are controlled. 15.6 Register Summary This is the summary of all the registers used in this chapter. Absolute Address Register Group 0x40003000 I2C0 Register 0x40003400 I2C1 Register 0x40003004 I2C0 Register 0x40003404 I2C1 Register 0x40003008 I2C0 Register 0x40003408 I2C1 Register 0x4000300C I2C0 Register 0x4000340C I2C1 Register 0x40003010 I2C0 Register 0x40003410 I2C1 Register 0x40003014 I2C0 Register 0x40003414 I2C1 Register Name TRANSMIT_DA TA Bit Pos. 7:0 TX_DATA[7:0] 15:8 RECEIVE_DAT A 7:0 TRANSMIT_ST ATUS 7:0 RECEIVE_STA TUS 7:0 CLOCK_SOUR CE_SELECT 7:0 I2C_MODULE_ ENABLE 7:0 (c) 2018 Microchip Technology Inc. ADDRESS_FL AG RX_BYTE[7:0] NAK TX_FIFO_EMP TY TX_FIFO_0P75 _EMPTY TX_FIFO_0P5_ EMPTY TX_FIFO_0P25 _EMPTY TX_FIFO_NOT _FULL FIFO_OVERRU N RX_FIFO_0P75 _FULL RX_FIFO_0P5_ FULL RX_FIFO_0P25 _FULL RX_FIFO_NOT _EMPTY CLOCK[1:0] ENABLE Datasheet Preliminary DS70005342B-page 129 ATSAMB11XR/ZR I2C Interface Absolute Address Register Group 0x40003018 I2C0 Register 0x40003418 I2C1 Register 0x4000301C I2C0 Register 0x4000341C I2C1 Register 0x40003020 I2C0 Register 0x40003420 I2C1 Register 0x40003024 I2C0 Register 0x40003424 I2C1 Register 0x40003028 I2C0 Register 0x40003428 I2C1 Register 0x4000302C I2C0 Register 0x4000342C I2C1 Register 0x40003030 I2C0 Register 0x40003430 0x40003034 I2C0 Register I2C1 Register 0x4000B044 LPMCU_MISC_ REGS0 0x4000B04C 0x4000B080 Bit Pos. I2C_CLK_DIVI DER 7:0 I2C_DIVIDE_RATIO[7:0] 15:8 I2C_DIVIDE_RATIO[15:8] I2C_MASTER_ MODE 7:0 MASTER_ENA BLE I2C_ONBUS 7:0 ONBUS_ENAB LE I2C_SLAVE_A DDRESS 7:0 I2C_STATUS 7:0 TX_INTERRUP T_MASK 7:0 RX_INTERRUP T_MASK 7:0 I2C_FLUSH 7:0 PINMUX_SEL_ 0 7:0 PINMUX_SEL[2:0] LP_GPIO_1 PINMUX_SEL[2:0] LP_GPIO_0 15:8 PINMUX_SEL[2:0] LP_GPIO_3 PINMUX_SEL[2:0] LP_GPIO_2 23:16 PINMUX_SEL[2:0] LP_GPIO_5 PINMUX_SEL[2:0] LP_GPIO_4 31:24 PINMUX_SEL[2:0] LP_GPIO_7 PINMUX_SEL[2:0] LP_GPIO_6 7:0 PINMUX_SEL[2:0] LP_GPIO_9 PINMUX_SEL[2:0] LP_GPIO_8 15:8 PINMUX_SEL[2:0] LP_GPIO_11 PINMUX_SEL[2:0] LP_GPIO_10 23:16 PINMUX_SEL[2:0] LP_GPIO_13 PINMUX_SEL[2:0] LP_GPIO_12 31:24 PINMUX_SEL[2:0] LP_GPIO_15 PINMUX_SEL[2:0] LP_GPIO_14 7:0 PINMUX_SEL[2:0] LP_GPIO_17 PINMUX_SEL[2:0] LP_GPIO_16 15:8 PINMUX_SEL[2:0] LP_GPIO_19 PINMUX_SEL[2:0] LP_GPIO_18 23:16 PINMUX_SEL[2:0] LP_GPIO_21 PINMUX_SEL[2:0] LP_GPIO_20 31:24 PINMUX_SEL[2:0] LP_GPIO_23 PINMUX_SEL[2:0] LP_GPIO_22 ADDRESS[6:0] I2C_ACTIVE NAK_MASK TX_FIFO_EMP TY_MASK TX_FIFO_0P75 _EMPTY_MAS K TX_FIFO_0P5_ EMPTY_MASK TX_FIFO_0P25 _EMPTY_MAS K TX_FIFO_NOT _FULL_MASK FIFO_OVERRU N_MASK RX_FIFO_0P75 _FULL_MASK RX_FIFO_0P5_ FULL_MASK RX_FIFO_0P25 _FULL_MASK RX_FIFO_NOT _EMPTY_MAS K I2C1 Register 0x40003434 0x4000B048 Name LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 PINMUX_SEL_ 1 PINMUX_SEL_ 2 PINMUX_SEL_ 4 I2C_FLUSH 7:0 PINMUX_SEL[2:0] LP_GPIO_24 15:8 23:16 31:24 0x4000B1A0 0x4000B1A4 0x4000B1A8 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 MEGA_MUX_I O_SEL_0 MEGA_MUX_I O_SEL_1 MEGA_MUX_I O_SEL_2 7:0 MEGAMUX_SEL[5:0] LP_GPIO_0 15:8 MEGAMUX_SEL[5:0] LP_GPIO_1 23:16 MEGAMUX_SEL[5:0] LP_GPIO_2 31:24 MEGAMUX_SEL[5:0] LP_GPIO_3 7:0 MEGAMUX_SEL[5:0] LP_GPIO_4 15:8 MEGAMUX_SEL[5:0] LP_GPIO_5 23:16 MEGAMUX_SEL[5:0] LP_GPIO_6 31:24 MEGAMUX_SEL[5:0] LP_GPIO_7 7:0 MEGAMUX_SEL[5:0] LP_GPIO_8 15:8 MEGAMUX_SEL[5:0] LP_GPIO_9 23:16 MEGAMUX_SEL[5:0] LP_GPIO_10 31:24 MEGAMUX_SEL[5:0] LP_GPIO_11 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 130 ATSAMB11XR/ZR I2C Interface Absolute Address 0x4000B1AC 0x4000B1B0 0x4000B1B4 Register Group LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 Name MEGA_MUX_I O_SEL_3 MEGA_MUX_I O_SEL_4 MEGA_MUX_I O_SEL_5 Bit Pos. 7:0 MEGAMUX_SEL[5:0] LP_GPIO_12 15:8 MEGAMUX_SEL[5:0] LP_GPIO_13 23:16 MEGAMUX_SEL[5:0] LP_GPIO_14 31:24 MEGAMUX_SEL[5:0] LP_GPIO_15 7:0 MEGAMUX_SEL[5:0] LP_GPIO_16 15:8 MEGAMUX_SEL[5:0] LP_GPIO_17 23:16 MEGAMUX_SEL[5:0] LP_GPIO_18 31:24 MEGAMUX_SEL[5:0] LP_GPIO_19 7:0 MEGAMUX_SEL[5:0] LP_GPIO_20 15:8 MEGAMUX_SEL[5:0] LP_GPIO_21 23:16 MEGAMUX_SEL[5:0] LP_GPIO_22 31:24 MEGAMUX_SEL[5:0] LP_GPIO_23 MEGAMUX_SEL[5:0] LP_GPIO_24 0x4000B1B8 LPMCU_MISC_ REGS0 MEGA_MUX_I O_SEL_6 7:0 0x4000B0C0 LPMCU_MISC_ REGS0 IRQ_MUX_IO_ SEL_0 7:0 MUX_0[4:0] 15:8 MUX_1[4:0] 23:16 MUX_2[4:0] 31:24 MUX_3[4:0] 7:0 MUX_4[4:0] 15:8 MUX_5[4:0] 23:16 MUX_6[4:0] 31:24 MUX_7[4:0] 7:0 MUX_8[4:0] 0x4000B0C4 0x4000B0C8 0x4000B0CC 0x4000B0D0 0x4000B0D4 15.7 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 LPMCU_MISC_ REGS0 IRQ_MUX_IO_ SEL_1 IRQ_MUX_IO_ SEL_2 IRQ_MUX_IO_ SEL_3 IRQ_MUX_IO_ SEL_4 IRQ_MUX_IO_ SEL_5 15:8 MUX_9[4:0] 23:16 MUX_10[4:0] 31:24 MUX_11[4:0] 7:0 MUX_12[4:0] 15:8 MUX_13[4:0] 23:16 MUX_14[4:0] 31:24 MUX_15[4:0] 7:0 MUX_16[4:0] 15:8 MUX_17[4:0] 23:16 MUX_18[4:0] 31:24 MUX_19[4:0] 7:0 MUX_20[4:0] Register Description (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 131 ATSAMB11XR/ZR I2C Interface 15.7.1 I2C Transmit Data Name: Reset: TRANSMIT_DATA 0x0000 Absolute Address: 0x40003000 (I2C0), 0x40003400 (I2C1) This register is a part of I2C Registers. Writing this register pushes one byte of data into the transmit FIFO of I2C module. Bit 15 14 13 12 11 10 9 8 ADDRESS_FLA G Access W Reset 0 Bit 7 6 5 4 3 2 1 0 TX DATA[7:0] Access W W W W W W W W Reset 0 0 0 0 0 0 0 0 Bit 8 - ADDRESS_FLAG Writing '1' to bit indicate the start of I2C transaction. When this bit is set, the byte written into the lower 8 bits of this register should then be the address of the device associated with this transaction. When this bit is set the least significant bit of the data is used to indicate the direction of the transaction. ADDRESS_FLAG TX_DATA 0 Bits 7:0 is data 1 Bits 7:1 is Address of the slave Bit 0: Direction of Transaction Bits 7:0 - TX DATA[7:0] These eight bits are the data or address to transmit (see ADDRESS_FLAG table). Writing '0' to Bit 0, indicates the write command and the direction is writing to slave from master. Writing '1' to Bit 0, indicates the read command and the direction is reading from slave by master. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 132 ATSAMB11XR/ZR I2C Interface 15.7.2 I2C Receive Data Name: Reset: RECEIVE_DATA 0x00 Absolute Address: 0x40003004 (I2C0), 0x40003404 (I2C1) This register is a part of I2C Registers. Reading this register pops one byte of received data from receive FIFO. Bit 7 6 5 4 3 2 1 0 RX_BYTE[7:0] Access R R R R R R R R Reset 0 0 0 0 0 0 0 0 Bits 7:0 - RX_BYTE[7:0] Reading from this 8-bit read only register pops one byte from the receive FIFO. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 133 ATSAMB11XR/ZR I2C Interface 15.7.3 I2C Transmit Status Name: Reset: TRANSMIT_STATUS 0x1F Absolute Address: 0x40003008 (I2C0), 0x40003408 (I2C1) This register is a part of I2C Registers. This register provides the status of I2C transmit operation. Bit 7 6 5 4 3 2 1 0 TX_FIFO_EMP TX_FIFO_0P75 TX_FIFO_0P5_ TX_FIFO_0P25 TX_FIFO_NOT TY _EMPTY EMPTY _EMPTY _FULL Access R R R R R Reset 1 1 1 1 1 Bit 4 - TX_FIFO_EMPTY This bit is set if the FIFO is completely empty. Bit 3 - TX_FIFO_0P75_EMPTY This bit is set if the FIFO is three-quarters empty. Bit 2 - TX_FIFO_0P5_EMPTY This bit is set if the FIFO is half empty. Bit 1 - TX_FIFO_0P25_EMPTY This bit is set if the FIFO is one quarter empty. Bit 0 - TX_FIFO_NOT_FULL This bit is set if there is at least space for one more byte in the FIFO. Reading '0' indicates TX FIFO is full. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 134 ATSAMB11XR/ZR I2C Interface 15.7.4 I2C Receive Status Name: Reset: RECEIVE_STATUS 0x00 Absolute Address: 0x4000300C (I2C0), 0x4000340C (I2C1) This register is a part of I2C Registers. This register provides the status of I2C transmit operation. Bit 7 6 5 NAK 4 3 2 1 0 FIFO_OVERRU RX_FIFO_0P75 RX_FIFO_0P5_ RX_FIFO_0P25 RX_FIFO_NOT N _FULL FULL _FULL _EMPTY Access R R R R R R Reset 0 0 0 0 0 0 Bit 5 - NAK This bit is set when NAK is received. The I2C module retries transmission unless transaction aborted by the flush register. This bit is reset after the status register is read. Bit 4 - FIFO_OVERRUN This bit is set when a character is received but there is no place left in the FIFO to store it. This bit is reset after the status register is read. Bit 3 - RX_FIFO_0P75_FULL This bit is set if the FIFO is three-quarters full. Bit 2 - RX_FIFO_0P5_FULL This bit is set if the FIFO is half full. Bit 1 - RX_FIFO_0P25_FULL This bit is set if the FIFO is one quarter full. Bit 0 - RX_FIFO_NOT_EMPTY This bit is set if there is at least space for one more byte in the FIFO. Reading '0' indicates RX FIFO is Empty. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 135 ATSAMB11XR/ZR I2C Interface 15.7.5 I2C Clock Source Select Name: Reset: CLOCK_SOURCE_SELECT 0x00 Absolute Address: 0x40003010 (I2C0), 0x40003410 (I2C1) This register is a part of I2C Registers. This register allows the user to select the input clock source for I2C peripheral. Bit 7 6 5 4 3 2 1 0 CLOCK[1:0] Access Reset R/W R/W 0 0 Bits 1:0 - CLOCK[1:0] Selects the input clock for I2C module. CLOCK[1:0] Description 0 26 MHz clock 1 13 MHz clock 2 6.5 MHz clock 3 3.25 MHz clock (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 136 ATSAMB11XR/ZR I2C Interface 15.7.6 I2C Module Enable Name: Reset: I2C_MODULE_ENABLE 0x00 Absolute Address: 0x40003014 (I2C0), 0x40003414 (I2C1) This register is a part of I2C Registers. This register allows the user to enable/disable the I2C peripheral. Bit 7 6 5 4 3 2 1 0 ENABLE Access R/W Reset 0 Bit 0 - ENABLE Writing '0' to this bit disables I2C module Writing '1' to this bit enables I2C module. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 137 ATSAMB11XR/ZR I2C Interface 15.7.7 I2C SCK Clock Divider Name: Reset: I2C_CLK_DIVIDER 0x0000 Absolute Address: 0x40003018 (I2C0), 0x40003418 (I2C1) This register is a part of I2C Registers. This register sets the divide ratio used to generate the SCK clock from the module's input clock. Bit 15 14 13 12 11 10 9 8 I2C_DIVIDE_RATIO[15:8] Access R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 I2C_DIVIDE_RATIO[7:0] Access Reset Bits 15:0 - I2C_DIVIDE_RATIO[15:0] Sets the divide ratio used to generate the SCK clock signal from the clock selected by the CLOCK_SOURCE_SELECT register. The minimum division is by 2; a value of 0 is not valid. SCK Clock = CLOCK[1:0] / (I2C_DIVIDE_RATIO[15:0]+1) (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 138 ATSAMB11XR/ZR I2C Interface 15.7.8 I2C Master Mode Enable Name: Reset: I2C_MASTER_MODE 0x00 Absolute Address: 0x4000301C (I2C0), 0x4000341C (I2C1) This register allows the user to select I2C between Master and Slave modes. Bit 7 6 5 4 3 2 1 0 MASTER_ENA BLE Access R/W Reset 0 Bit 0 - MASTER_ENABLE Writing '0' to this bit enables I2C in Slave mode. Writing '1' to this bit enables I2C in Master mode. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 139 ATSAMB11XR/ZR I2C Interface 15.7.9 I2C Start Master Transaction Name: Reset: I2C_ONBUS 0x00 Absolute Address: 0x40003020 (I2C0), 0x40003420 (I2C1) This register is a part of I2C Registers. This register initiates the I2C transactions when in Master mode. Bit 7 6 5 4 3 2 1 0 ONBUS_ENAB LE Access R/W Reset 0 Bit 0 - ONBUS_ENABLE Active High Enable to initiate transactions when in Master mode Writing '0' to this bit Master completes current byte and generates stop condition on bus Writing '1' to this bit Master transmits contents of FIFO until empty (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 140 ATSAMB11XR/ZR I2C Interface 15.7.10 I2C Slave Address Name: Reset: I2C_SLAVE_ADDRESS 0x00 Absolute Address: 0x40003024 (I2C0), 0x40003424 (I2C1) This register is a part of I2C Registers. This seven bit read/write register sets the I2C slave address. Bit 7 6 5 4 3 2 1 0 ADDRESS[6:0] Access Reset R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 Bits 6:0 - ADDRESS[6:0] These bits hold the I2C slave address. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 141 ATSAMB11XR/ZR I2C Interface 15.7.11 I2C Status Name: Reset: I2C_STATUS 0x00 Absolute Address: 0x40003028 (I2C0), 0x40003428 (I2C1) This register is a part of I2C Registers. Bit 7 6 5 4 3 2 1 0 I2C_ACTIVE Access R Reset 0 Bit 0 - I2C_ACTIVE The I2C configuration registers must not be changed when this bit is set. If the registers are modified during transaction is ongoing, the state of the I2C module is not guaranteed. Read Value Description 0 I2C is idle 1 I2C is active (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 142 ATSAMB11XR/ZR I2C Interface 15.7.12 I2C Transmit Interrupt Mask Name: Reset: TX_INTERRUPT_MASK 0x00 Absolute Address: 0x4000302C (I2C0), 0x4000342C (I2C1) This register is a part of I2C Registers. This register is used to enable or disable the generation of I2C transmission interrupts. During the I2C transmission interrupt, if a bit in TX_INTERRUPT_MASK register is set and its corresponding bit in TRANSMIT_STATUS register is set then an interrupt is generated. Bit 7 6 5 4 3 2 1 0 TX_FIFO_EMP TX_FIFO_0P75 TX_FIFO_0P5_ TX_FIFO_0P25 TX_FIFO_NOT TY_MASK _EMPTY_MAS EMPTY_MASK _EMPTY_MAS _FULL_MASK K Access Reset K R/W R/W R/W R/W R/W 0 0 0 0 0 Bit 4 - TX_FIFO_EMPTY_MASK Writing '0' disables the TX_FIFO_EMPTY interrupt. Writing '1' enables the TX_FIFO_EMPTY interrupt. Bit 3 - TX_FIFO_0P75_EMPTY_MASK Writing '0' disables the TX_FIFO_0P75_EMPTY interrupt. Writing '1' enables the TX_FIFO_0P75_EMPTY interrupt. Bit 2 - TX_FIFO_0P5_EMPTY_MASK Writing '0' disables the TX_FIFO_0P5_EMPTY interrupt. Writing '1' enables the TX_FIFO_0P5_EMPTY interrupt. Bit 1 - TX_FIFO_0P25_EMPTY_MASK Writing '0' disables the TX_FIFO_0P25_EMPTY interrupt. Writing '1' enables the TX_FIFO_0P25_EMPTY interrupt. Bit 0 - TX_FIFO_NOT_FULL_MASK Writing '0' disables the TX_FIFO_NOT_FULL interrupt. Writing '1' enables the TX_FIFO_NOT_FULL interrupt. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 143 ATSAMB11XR/ZR I2C Interface 15.7.13 I2C Receive Interrupt Mask Name: Reset: RX_INTERRUPT_MASK 0x00 Absolute Address: 0x40003030 (I2C0), 0x40003430 (I2C1) This register is a part of I2C Registers. This register is used to enable or disable the generation of I2C receive interrupts. During the I2C receive interrupt, if a bit in RX_INTERRUPT_MASK register is set and its corresponding bit in RECEIVE_STATUS register is set then an interrupt is generated. Bit 7 6 5 NAK_MASK 4 3 2 1 0 FIFO_OVERRU RX_FIFO_0P75 RX_FIFO_0P5_ RX_FIFO_0P25 RX_FIFO_NOT N_MASK _FULL_MASK FULL_MASK _FULL_MASK _EMPTY_MAS R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 K Access Reset Bit 5 - NAK_MASK Writing '0' disables the NAK interrupt. Writing '1' enables the NAK interrupt. Bit 4 - FIFO_OVERRUN_MASK Writing '0' disables the FIFO_OVERRUN interrupt. Writing '1' enables the FIFO_OVERRUN interrupt. Bit 3 - RX_FIFO_0P75_FULL_MASK Writing '0' disables the RX_FIFO_0P75_FULL interrupt. Writing '1' enables the RX_FIFO_0P75_FULL interrupt. Bit 2 - RX_FIFO_0P5_FULL_MASK Writing '0' disables the RX_FIFO_0P5_FULL interrupt. Writing '1' enables the RX_FIFO_0P5_FULL interrupt. Bit 1 - RX_FIFO_0P25_FULL_MASK Writing '0' disables the RX_FIFO_0P25_FULL interrupt. Writing '1' enables the RX_FIFO_0P25_FULL interrupt. Bit 0 - RX_FIFO_NOT_EMPTY_MASK Writing '0' disables the RX_FIFO_NOT_EMPTY interrupt. Writing '1' enables the RX_FIFO_NOT_EMPTY interrupt. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 144 ATSAMB11XR/ZR I2C Interface 15.7.14 I2C FLUSH Name: Reset: I2C_FLUSH 0x00 Absolute Address: 0x40003034 (I2C0), 0x40003434 (I2C1) This register is a part of I2C Registers. This register allows the software to flush the FIFOs and abort any ongoing transactions. Bit 7 6 5 4 3 2 1 0 I2C_FLUSH Access W Reset 0 Bit 0 - I2C_FLUSH Writing to this address flushes the content of both the Tx and Rx FIFOs. The written value does not have effect. Flushing the Tx FIFO aborts the ongoing transactions when the current byte is being transmitted. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 145 ATSAMB11XR/ZR Peripherals 16. Peripherals 16.1 Timer The 32-bit timer block allows the CPU to generate a time tick at a programmed interval. This feature can be used for a wide variety of functions such as counting, interrupt generation, and time tracking. Note: ARM Timer is one of the reserved resources being used by the BLE stack. Application must refrain from using this peripheral. 16.2 Dual Timer The APB dual-input timer module is an APB slave module consisting of two programmable 32-bit downcounters that can generate interrupts when they expire. The timer can be used in a Free-running, Periodic, or One-shot mode. 16.3 Watchdog Timer The two watchdog blocks allow the CPU to be interrupted, if it has not interacted with the watchdog timer before it expires. In addition, this interrupt will be an output of the core, so that it can be used to reset the CPU in the event that a direct interrupt to the CPU is not useful. This will allow the CPU to get back to a known state in the event, a program is no longer executing as expected. The watchdog module applies a reset to a system in the event of a software failure, providing a way to recover from software crashes. Watchdog timer 0 is a reserved resource, being used by the BLE stack. Application must refrain from using the watchdog timer 0. 16.4 SPI Controller 16.4.1 SPI Master/Slave Interface The ATSAMB11-XR2100A and ATSAMB11-ZR210CA provides a Serial Peripheral Interface (SPI) that can be configured as master or slave. The SPI Interface pins are mapped, as illustrated in the following table. The SPI Interface is a full-duplex slave-synchronous serial interface. When the SPI is not selected, i.e., when SSN is high, the SPI interface will not interfere with data transfers between the serial-master and other serial-slave devices. When the serial slave is not selected, its transmitted data output is buffered, resulting in a high impedance drive onto the serial master receive line. The SPI slave interface responds to a protocol that allows an external host to read or write any register in the chip as well as initiate DMA transfers. Table 16-1. SPI Interface Pin Mapping Pin Name SPI Function SSN Active-Low Slave Select SCK Serial Clock MOSI Master Out Slave In (Data) MISO Master In Slave Out (Data) (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 146 ATSAMB11XR/ZR Peripherals 16.4.1.1 SPI Interface Modes The SPI Interface supports four standard modes as determined by the Clock Polarity (CPOL) and Clock Phase (CPHA) settings. These modes are illustrated in Table 16-2 and Figure 16-1. The red lines in Figure 16-1 correspond to Clock Phase = 0 and the blue lines correspond to Clock Phase = 1. Table 16-2. SPI Modes Mode CPOL CPHA 0 0 0 1 0 1 2 1 0 3 1 1 Figure 16-1. SPI Clock Polarity and Clock Phase Timing 16.5 SPI-Flash Controller The AHB SPI-Flash Controller is used to access the internal stacked SPI Flash to access various instruction/data code required for storing application code, code patches, and OTA images. It supports several SPI modes including 0, 1, 2, and 3. The ATSAMB11-XR2100A and ATSAMB11-ZR210CA provide an SPI Master interface for accessing the internal stacked SPI Flash memory. The TXD pin is same as the Master Output, Slave Input (MOSI), and the RXD pin is the same as the Master Input, Slave Output (MISO). The SPI Master interface supports all four standard modes of clock polarity and clock phase, as shown in Table 16-2. Internal stacked SPI Flash memory is accessed by a processor programming commands to the SPI Master interface, which in turn initiates SPI master access to the Flash. 16.6 UART Interface The ATSAMB11-XR2100A and ATSAMB11-ZR210CA provide Universal Asynchronous Receiver/ Transmitter (UART) interfaces for serial communication. The Bluetooth subsystem contains two UART interfaces: 2-pin mode for data only, and a 4-pin interface for flow control and data transfer. The UART (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 147 ATSAMB11XR/ZR Peripherals interfaces are compatible with the RS-232 standard, where the ATSAMB11-XR2100A and ATSAMB11ZR210CA operate as Data Terminal Equipment (DTE). The 4-pin UART has two pins for data (TX and RX) and two pins for flow control/handshaking: Request To Send (RTS) and Clear To Send (CTS). CAUTION The RTS and CTS are used for hardware flow control. The RTS and CTS pins must be interfaced to the remote device and hardware flow control must be enabled to guarantee data integrity. The pins associated with each UART interfaces can be enabled on several alternative pins by programming their corresponding pin-MUX control registers (see I/O Port Function Multiplexing and MEGAMUX Options for available options). The UART features the programmable baud rate generation with fractional clock division, which allows transmission and reception at a wide variety of standard and non-standard baud rates. The Bluetooth UART input clock is selectable between 26 MHz, 13 MHz, 6.5 MHz, and 3.25 MHz. The clock divider value is programmable as 13 integer bits and three fractional bits (with 8.0 being the smallest recommended value for normal operation). This results in the maximum supported baud rate of 26 MHz/8.0 = 3.25 MBd. The UART can be configured for 7- or 8-bit operation, with or without parity, with four different parity types (odd, even, mark, or space), and with one or two stop bits. It also contains RX and TX FIFOs, which ensure reliable high-speed reception and low software overhead transmission. FIFO size is 4 x 8 for both RX and TX direction. The UART also contains status registers showing the number of received characters available in the FIFO and various error conditions, and also the ability to generate interrupts based on these status bits. An example of UART receiving or transmitting a single packet is shown in Figure 16-2. This example shows 7-bit data (0x45), odd parity, and two stop bits. Figure 16-2. Example of UART RX or TX Packet 16.7 DMA Controller Direct Memory Access (DMA) allows certain hardware subsystems to access main system memory independent of the Cortex-M0 Processor. The DMA features and benefits are: * Supports any address alignment (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 148 ATSAMB11XR/ZR Peripherals * * * * * * * * * * * * 16.8 Supports any buffer size alignment Peripheral flow control and peripheral block transfer The following modes are supported: - Peripheral to peripheral transfer - Memory to memory - Memory to peripheral - Peripheral to memory - Register to memory Interrupts for both TX done and RX done in memory and peripheral mode Scheduled transfers Endianness byte swapping Watchdog timer 4-channel operation 32-bit Data width AHB MUX (on read and write buses) Command lists support Usage of tokens Analog to Digital Converter The ATSAMB11-XR2100A and ATSAMB11-ZR210CA have an integrated Successive Approximation Register (SAR) ADC with 11-bit resolution and variable conversion speed up 1MS/s. The key building blocks are the capacitive DAC, comparator, and synchronous SAR engine as illustrated in the following figure. Figure 16-3. SAR ADC Block Diagram The ADC reference voltage can be either generated internally or set externally via one of the four available Mixed Signal GPIO pins on the ATSAMB11-XR2100A and the ATSAMB11-ZR210CA. There are two modes of operation: * High resolution (11-bit): Set the reference voltage to half the supply voltage or below. In this condition the input signal dynamic range is equal to twice the reference voltage (ENOB=10-bit). (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 149 ATSAMB11XR/ZR Peripherals * Medium Resolution (10-bit) : Set the reference voltage to any value below supply voltage (up to supply voltage - 300 mV) and in this condition the input dynamic range is from zero to the reference voltage (ENOB = 9-bit). Four input channels are time multiplexed to the input of the SAR ADC. However, on the ATSAMB11, only four channel inputs are accessible from the outside, through the Mixed Signal GPIO pin numbers listed in I/O Port Function Multiplexing. In Power-Saving mode, the internal reference voltage is completely off and the reference voltage is set externally. The ADC characteristics are summarized in the following table. Table 16-3. SAR ADC Characteristics Conversion rate 1 ks 1 MS Selectable Resolution 10 11 bit Power consumption 13.5 A (at 100 KS/s) (1) Note: 1. With external reference. 16.8.1 Timing The ADC timing is shown in Figure SAR ADC Timing. The input signal is sampled twice, in the first sampling cycle the input range is defined either to be above reference voltage or below it and in the second sampling instant the ADC start its normal operation. The ADC takes two sampling instants and N-1 conversion cycle (N=ADC resolution) and one cycle to sample the data out. Therefore, for the 11-bit resolution, it takes 13 clock cycles to do one Sample conversion. The Input clock equals N+2 the sampling clock frequency (N is the ADC resolution). CONV signal : Gives indication about end of conversion. SAMPL : The input signal is sampled when this signal is high. RST ENG : When High SAR Engine is in reset mode (SAR engine output is set to mid-scale). Figure 16-4. SAR ADC Timing 16.9 Three-axis Quadrature Decoder The ATSAMB11-XR2100A and ATSAMB11-ZR210CA have a three-axis Quadrature decoder (X, Y, and Z) that can determine the direction and speed of movement on three axes, requiring in total six GPIO pins to (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 150 ATSAMB11XR/ZR Peripherals interface with the sensors. The sensors are expected to provide pulse trains as inputs to the quadrature decoder. Each axis channel input will have two pulses with 90 degrees phase shift depending on the direction of movement. The decoder counts the edges of the two waveforms to determine the speed and uses the phase relationship between the two inputs to determine the direction of motion. The decoder is configured to interrupt ARM based on independent thresholds for each direction. Each quadrature clock counter (X, Y, and Z) is an unsigned 16-bit counter and the system clock uses a programmable sampling clock ranging from 26 MHz, 13, 6.5, to 3.25 MHz. If wakeup is desired from threshold detection on an axis input, AO_GPIO_0 needs to be used. 16.10 Clock Output The ATSAMB11-XR2100A and ATSAMB11-ZR210CA have an option to output a clock. The clock can be output to any GPIO pin via the test MUX. Note that this feature requires that the ARM and BLE power domains stay on. If BLE is not used, the clocks to the BLE core are gated off, resulting in small leakage. The following two methods can be used to output a clock. Note: Refer the BluSDK Smart BLE API Software Development Guide for details on how to enable the 32.768 kHz clock output. 16.10.1 Variable Frequency Clock Output Using Fractional Divider The ATSAMB11-XR2100A and ATSAMB11-ZR210CA can output the variable frequency ADC clock using a fractional divider of the 26 MHz oscillator. This clock needs to be enabled using bit 10 of the lpmcu_clock_enables_1 register. The clock frequency can be controlled by the divider ratio using the sens_adc_clk_ctrl register (12-bits integer part, 8-bit fractional part).The division ratio can vary from 2 to 4096 delivering output frequency between 6.35 kHz to 13 MHz. This is a digital divider with pulse swallowing implementation, so the clock edges may not be at exact intervals for the fractional ratios. However, it is exact for integer division ratios. 16.10.2 Fixed Frequency Clock Output The ATSAMB11-XR2100A and ATSAMB11-ZR210CA can output the following fixed-frequency clocks: * * * * * * 52 MHz derived from XO 26 MHz derived from XO 32.768 kHz derived from the RTC XO 26 MHz derived from 26 MHz RC Osc. 6.5 MHz derived from XO 3.25 MHz derived from 26 MHz RC Osc. For clocks with frequency of 26 MHz and above, ensure that external pad load on the board is minimized to get a clean waveform. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 151 ATSAMB11XR/ZR Electrical Characteristics 17. Electrical Characteristics There are voltage ranges where different VDDIO levels apply. This separation is for the IO drivers whose drive strength is directly proportional to the IO supply voltage. In the ATSAMB11 products, there is a large gap in the IO supply voltage range (2.3V to 3.6V). A guarantee on drive strength across this voltage range would be intolerable to most vendors who only use a subsection of the IO supply range. As such, these voltages are segmented into two manageable sections referenced as VDDIOM, and VDDIOH in tables listed in this document.. 17.1 Absolute Maximum Ratings The values listed in this section are ratings that can be peaked by the device, but not sustained without causing irreparable damage to the device. Table 17-1. Absolute Maximum Ratings Symbol Characteristics Min. Max. VDDIO I/O Supply Voltage -0.3 4.2 VBAT Battery Supply Voltage -0.3 5.0 VIN (1) Digital Input Voltage -0.3 VDDIO VAIN(2) Analog Input Voltage -0.3 1.5 TA Storage Temperature -65 150 Unit V C Note: 1. VIN corresponds to all the digital pins. 2. VAIN corresponds to all the analog pins, RFIO, XO_N, XO_P, TPP, RTC_CLK_N and RTC_CLK_P. 17.2 Recommended Operating Conditions Table 17-2. Recommended Operating Conditions Symbol Characteristic Min. Typ. Max. VDDIOM I/O Supply Voltage Mid-Range 2.3 2.50 3.00 VDDIOH I/O Supply Voltage High Range 3.00 3.30 3.60 VBAT Battery Supply Voltage (1) 2.3 3.6 4.3 Operating Temperature -40 85 Unit V C Note: 1. VBAT must not be less than VDDIO. 17.3 DC Characteristics The Table 17-3 provides the DC characteristics for the digital pads. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 152 ATSAMB11XR/ZR Electrical Characteristics Table 17-3. DC Electrical Characteristics VDDIO Condition Characteristic Min. VDDIOM Input Low Voltage VIL Input High Voltage VIH Typ. Max. Unit -0.30 0.63 V VDDIO-0.60 VDDIO+0.30 Output Low Voltage VOL 0.45 Output High Voltage VOH VDDIO-0.50 Input Low Voltage VIL -0.30 0.65 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 VDDIOH (up to 3.60) Output Low Voltage VOL 0.45 Output High Voltage VOH All VDDIOM VDDIO-0.50 Output Loading 20 Digital Input Load 6 Pad drive strength 3.4 6.6 10.5 14 6.8 13.2 21 28 pF mA (regular pads (1)) VDDIOH Pad drive strength (regular pads (1)) VDDIOM Pad drive strength (high-drive pads (1)) VDDIOH Pad drive strength (high-drive pads (1)) Note: 1. The following GPIO pads are high-drive pads: GPIO_8, GPIO_9; all other pads are regular pads. 17.4 Receiver Performance Table 17-4. BLE Receiver Performance Parameter Minimum Frequency 2,402 Sensitivity with on-chip DC/DC(1) -92.7 Typical 2,480 -91.9 Maximum receive signal level +5 CCI 12.5 ACI (N1) 0 (c) 2018 Microchip Technology Inc. Maximum Datasheet Preliminary Unit MHz dBm dB DS70005342B-page 153 ATSAMB11XR/ZR Electrical Characteristics Parameter Minimum Typical Maximum Unit N+2 Blocker (Image) -20 N-2 Blocker -38 N+3 Blocker (Adj. Image) -35 N-3 Blocker -43 N4 or greater -45 dB Intermod (N+3, N+6) -32 dBm OOB (2 GHz<f<2.399 GHz) -15 OOB (f<2 GHz or f>2.5 GHz) -10 All measurements are taken after the RF input matching network. Refer to the reference schematic of Figure 19-1. All measurements are performed at VBAT - 3.3V; VDDIO-3.3V and 25C, with tests following the Bluetooth V4.2 standard tests. Note: 1. Typical receiver sensitivity is average across 40 channels. 17.5 Transmitter Performance The transmitter contains fine step power control with Pout variable in <3 dB steps below 0 dBm and in <0.5 dB steps above 0 dBm. Table 17-5. BLE Transmitter Performance Parameter Frequency Minimum Typical 2,402 2,480 Maximum output power 3.5 In-band Spurious (N2) -45 In-band Spurious (N3) -50 2nd harmonic Pout -41 3rd harmonic Pout -41 4th harmonic Pout -41 5th harmonic Pout -41 Frequency deviation Maximum 250 Unit MHz dBm kHz All measurements are taken after the RF input matching network. Refer to the reference schematic Figure 19-1. All measurements are performed at VBAT - 3.3V; VDDIO - 3.3V and 25C, with tests following the Bluetooth V4.2 standard tests. Note: (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 154 ATSAMB11XR/ZR Electrical Characteristics 1. 2. 3. 17.6 At 0 dBm TX output power. With respect to TX power, different (higher/lower) RF output power settings may be used for specific antennas and/or enclosures, in which case recertification may be required. Country specific settings (as per the Module Certifications) should be programmed at the Host product factory to match the intended Destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via Host implementation. Current Consumption in Various Device States Table 17-6. Device State Current Consumption C_EN VDDIO IVBAT+IVDDIO (typical) (2) Device State Power_Down Off On 0.03 A Ultra_Low_Power with BLE timer, with RTC (1) On On 2.03 A MCU_Only, idle On On 1.35 mA BLE_On_Receive @channel 37 (2402 MHz) On On 5.26 mA BLE_On_Transmit, 0 dBm output power @Channel 37 (2402 MHz) On On 4.18 mA BLE_On_Transmit, 0 dBm output power @Channel 39 (2480 MHz) On On 3.71 mA BLE_On_Transmit, 3 dBm output power @Channel 37 (2480 MHz) On On 5.69 mA BLE_On_Transmit, 3 dBm output power @Channel 39 (2480 MHz) On On 4.65 mA Note: 1. Sleep clock derived from external 32.768 kHz crystal specified for CL = 7 pF, using the default onchip capacitance only, without using external capacitance. 2. Measurement conditions: 2.1. VBAT=3.3V 2.2. VDDIO=3.3V 2.3. Temperature=25C 2.4. These measurements are taken with FW BluSDK Smart V6.1.6991 (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 155 ATSAMB11XR/ZR Electrical Characteristics Figure 17-1. Average Advertising Current Note: 1. The Average advertising current is measured at VBAT = 3.3 V, VDDIO = 3.3 V, TX output power = 0 dBm. Temperature - 25C. 2. Advertisement data payload size - 31 octets. 3. Advertising event type - Connectable Undirected. 4. Advertising channels used in 2 channel : 37 and 38. 5. Advertising channels used in 1 channel: 37. 17.7 ADC Characteristics Table 17-7. Static Performance of SAR ADC Parameter Condition Input voltage range Min. Typ. 0 Resolution Max. Unit VBAT V 11 Sample rate 100 bits 1000 KSPS Input offset Internal VREF -10 +10 mV Gain error Internal VREF -4 +4 % (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 156 ATSAMB11XR/ZR Electrical Characteristics Parameter Condition Min. Typ. Max. Unit DNL(2) 100 KSPS. Internal VREF=1.6V. Same result for external VREF. -0.75 +1.75 LSB INL(2) 100 KSPS. Internal VREF=1.6V. Same result for external VREF. -2 +2.5 LSB THD 1 kHz sine input at 100 KSPS 73 dB SINAD 1 kHz sine input at 100 KSPS 62.5 dB SFDR 1 kHz sine input at 100 KSPS 73.7 dB 13 cycles Using external VREF, at 100 KSPS 13.5 A Using internal VREF, at 100 KSPS 25.0 A Using external VREF, at 1 MSPS 94 A Using internal VREF, at 1MSPS 150 A Using internal VREF, during VBAT monitoring 100 A Using internal VREF, during temperature monitoring 50 A Mean value using VBAT = 2.5V 1.026 (1) V Standard deviation across parts 10.5 mV Conversion time Current consumption Internal reference voltage VBAT Sensor Accuracy Temperature Sensor Accuracy Without calibration -55 +55 mV With offset and gain calibration -17 +17 mV Without calibration -9 +9 C With offset calibration -4 +4 C Note: 1. Effective VREF is 2xInternal Reference Voltage. 2. These values are characterized for 0x4000F404<28:29>: 0x03 and with Vin in the range 0.25 VBAT to 0.75 VBAT. If Vin is to be used beyond this range, configure 0x4000F404<28:29> with value = 0x00. 17.8 ADC Typical Characteristics TC = 25C and VBAT = 3.0V, unless otherwise noted. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 157 ATSAMB11XR/ZR Electrical Characteristics Figure 17-2. INL of SAR ADC Figure 17-3. DNL of SAR ADC (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 158 ATSAMB11XR/ZR Electrical Characteristics Figure 17-4. Sensor ADC Dynamic Measurement with Sinusoidal Input Note: 1. 25C, 3.6V VBAT, and 100 kS/s . Input signal: 1 kHz sine wave, 3Vp-p amplitude. 2. SNDR = 62.5 dB , SFDR = 73.7 dB, and THD = 73.0 dB. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 159 ATSAMB11XR/ZR Electrical Characteristics Figure 17-5. Sensor ADC Dynamic Performance Summary at 100 KSPS 17.9 Timing Characteristics 17.9.1 I2C Interface Timing The I2C Interface timing (common to both Slave and Master) is provided in Figure 17-6. The timing parameters for Slave and Master modes are specified in tables Table 17-8 and Table 17-9 respectively. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 160 ATSAMB11XR/ZR Electrical Characteristics Figure 17-6. I2C Slave Timing Diagram Table 17-8. I2C Slave Timing Parameters Parameter Symbol Min. Max. Units SCL Clock Frequency fSCL 0 400 SCL Low Pulse Width tWL 1.3 SCL High Pulse Width tWH 0.6 SCL, SDA Fall Time tHL 300 SCL, SDA Rise Time tLH 300 START Setup Time tSUSTA 0.6 START Hold Time tHDSTA 0.6 SDA Setup Time tSUDAT 100 SDA Hold Time tHDDAT STOP Setup time tSUSTO 0.6 Bus Free Time between STOP and START tBUF 1.3 Glitch Pulse Reject tPR 0 Remarks kHz s ns This is dictated by external components s 0 Slave and Master Default ns 40 Master Programming Option s 50 ns Table 17-9. I2C Master Timing Parameters Parameter Symbol Standard Mode Fast Mode High-speed Mode Units Min. Max. 100 SCL Clock Frequency fSCL 0 SCL Low Pulse Width tWL 4.7 (c) 2018 Microchip Technology Inc. Min. Max. 0 1.3 Datasheet Preliminary 400 Min. Max. 0 3400 0.16 kHz s DS70005342B-page 161 ATSAMB11XR/ZR Electrical Characteristics Parameter Symbol Standard Mode Fast Mode High-speed Mode Units Min. 17.9.2 Max. 4 Min. Max. 0.6 Min. Max. SCL High Pulse Width tWH SCL Fall Time tHLSCL 300 300 10 40 SDA Fall Time tHLSDA 300 300 10 80 SCL Rise Time tLHSCL 1000 300 10 40 SDA Rise Time tLHSDA 1000 300 10 80 START Setup Time tSUSTA 4.7 0.6 0.16 START Hold Time tHDSTA 4 0.6 0.16 SDA Setup Time tSUDAT 250 100 10 SDA Hold Time tHDDAT 5 40 0 STOP Setup time tSUSTO 4 0.6 0.16 Bus Free Time between STOP and START tBUF 4.7 1.3 Glitch Pulse Reject tPR 0 0.06 ns s 70 ns s 50 ns SPI Slave Timing The SPI Slave timing is provided in the following figure and tables. Figure 17-7. SPI Slave Timing Diagram (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 162 ATSAMB11XR/ZR Electrical Characteristics Table 17-10. SPI Slave Timing Parameters (1) Parameter Clock Input Frequency (2) Symbol Min. fSCK Max. 2 MHz Clock Low Pulse Width tWL 55 Clock High Pulse Width tWH 55 Clock Rise Time tLH 0 7 Clock Fall Time tHL 0 7 tODLY 7 28 RXD Input Setup Time tISU 5 RXD Input Hold Time tIHD 10 SSN Input Setup Time tSUSSN 5 SSN Input Hold Time tHDSSN 10 TXD Output Delay(3) Units ns Note: 1. Timing is applicable to all SPI modes. 2. Maximum clock frequency specified is limited by the SPI Slave interface internal design. Actual maximum clock frequency can be lower and depends on the specific PCB layout. 3. Timing based on 15 pF output loading. 17.9.3 SPI Master Timing The SPI Master Timing is provided in the following figure and table. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 163 ATSAMB11XR/ZR Electrical Characteristics Figure 17-8. SPI Master Timing Diagram Table 17-11. SPI Master Timing Parameters(1) Parameter Symbol Min. Units Max. Clock Output Frequency(2) fSCK 4 MHz Clock Low Pulse Width tWL 30 Clock High Pulse Width tWH 32 Clock Rise Time(3) tLH 7 Clock Fall Time(3) tHL 7 RXD Input Setup Time tISU 23 RXD Input Hold Time tIHD 0 SSN/TXD Output Delay(3) tODLY 0 ns 12 Note: 1. Timing is applicable to all SPI modes 2. Maximum clock frequency specified is limited by the SPI Master interface internal design. The actual maximum clock frequency can be lower and depends on the specific PCB layout 3. Timing based on 15pF output loading 17.9.4 SPI Flash Master Timing The SPI Master Timing is provided in the following figure and table. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 164 ATSAMB11XR/ZR Electrical Characteristics Figure 17-9. SPI Flash Master Timing Diagram Table 17-12. SPI Flash Master Timing Parameters(1) Parameter Symbol Min. Max. Units Clock Output Frequency(2) fSCK 13 MHz Clock Low Pulse Width tWL 25 Clock High Pulse Width tWH 27 Clock Rise Time(3) tLH 11 Clock Fall Time(3) tHL 10 RXD Input Setup Time tISU 19 RXD Input Hold Time tIHD 0 SSN/TXD Output Delay(3) tODLY 1 ns 7 Note: 1. Timing is applicable to all SPI modes. 2. Maximum clock frequency specified is limited by the SPI Master interface internal design. Actual maximum clock frequency can be lower and depends on the specific PCB layout. 3. Timing based on 15 pF output loading. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 165 ATSAMB11XR/ZR Package Outline Drawings 18. Package Outline Drawings 18.1 Package Outline Drawing (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 166 ATSAMB11XR/ZR Figure 18-1. ATSAMB11-XR2100A Package Outline Drawing Package Outline Drawings (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 167 ATSAMB11XR/ZR Package Outline Drawings 18.2 Module PCB Package Outline Drawing Figure 18-2. ATSAMB11-ZR210CA Module Package Outline Drawing (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 168 ATSAMB11XR/ZR Package Outline Drawings Figure 18-3. Customer PCB Top View Footprint (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 169 ATSAMB11XR/ZR Module Reference Schematics 19. Module Reference Schematics 19.1 Reference Schematic Figure 19-1. ATSAMB11-XR2100A Reference Schematic 19.2 Reference Schematic Bill of Materials (BOM) Table 19-1. ATSAMB11-XR2100A Reference Schematic Bill of Materials (BOM) Ite m Qty Referenc e Value 1 1 A1 2450AT07A010 1x0.5 mm Ceramic Johanson 0 Chip Antenna Dielectrics 2450AT07A0 100 2 1 C1 0.5 pF CAP, CER, 0.5 pF, Johanson +/-0.1 pF, NPO, Dielectrics 0201, 25V, -55-125 C 250R05L0R 5BV4T 3 1 C2 2.1 nH Inductor,2.1 nH, +/-0.1 nH, Q=14@500 MHz, LQP03TN2N 0201 1B02D (c) 2018 Microchip Technology Inc. Description Manufacturer Murata Americas Datasheet Preliminary Part Number Footprin t 0201 DS70005342B-page 170 ATSAMB11XR/ZR Module Reference Schematics Ite m Qty Referenc e Value Description Manufacturer Part Number Footprin t SRF=11 GHz, 0201, -55-125 C 4 1 C3 DNP CAP, CER, 2.2 pF, Johanson +/-0.1 pF, NPO, Dielectrics 0201, 25V, -55-125C 250R05L2R 2BV4T 0201 5 1 C4 2.2 pF CAP, CER, 2.2 pF, Johanson +/-0.1 pF, NPO, Dielectrics 0201, 25V, -55-125 C 250R05L2R 2BV4T 0201 6 1 C5 2.6 nH Inductor, 2.6 nH, +/-0.1 nH, Q=13@500 MHz, SRF=6 GHz, 0201,-55-125 C Murata Americas LQP03TG2N 0201 6B02D 7 1 C6 10 uF CAP, CER, 10 uF, 20%, X5R, 0603, 6.3V AVX Corporation 06036D106 MAT2A 0603 8 1 L1 8.2 pF CAP, CER, 8.2 pF, Johanson +/-0.1 pF, NPO, Dielectrics 0201, 25V, -55-125 C 250R05L8R 2BV4T 0201 9 1 L2 4.3 nH Inductor, 4.3 nH, Murata +/-3%, Q=13@500 Americas MHz, SRF=6 GHz, 0201, -55-125 C LQP03TG4N 0201 3H02D 10 2 R5,R6 100K RESISTOR, Thick Film, 100 kOhm, 0201 11 7 TP1,TP2, TP4,TP5, TP6,TP7, TP8 NonComponent Test Point,Surface Mount, 0.040"sq w/0.25"hole 12 1 U1 ATSAMB11XR2100A ATSAMB11Microchip ATSAMB11XR2100A BLE SIP Technology Inc XR2100A 13 1 Y1 32.768 KHz Crystal, 32.768 KHz, +/-20 ppm, -40-+85C, CL=7 pF, 2 lead, SMD (c) 2018 Microchip Technology Inc. Panasonic (R) ERJ-1GEF1 003C 0201 40X40_SM_ 0.04"SQx TEST_POIN 0.025"H T ECS, Inc. International Datasheet Preliminary ATSAMB 11XR2100A ECS-. 327-7-34BTR DS70005342B-page 171 ATSAMB11XR/ZR Module Reference Schematics 19.3 Reference Schematic Figure 19-2. ATSAMB11-ZR210CA Reference Schematic 19.4 Reference Bill of Materials(BOM) Table 19-2. ATSAMB11-ZR210CA Reference Schematic Bill of Materials (BOM) Item Qty Referenc Value e Description Manufacturer Part Number Footprint 1 1 C1 0.1 uF CAP, CER, 0.1 UF 6.3V +/-10% X5R 0201 AVX Corporation 02016D104K 0201 AT2A 2 1 C2 10 uF CAP, CER, 10 uF, 20%, X5R, 0603, 6.3V AVX Corporation 06036D106M 0603 AT2A 3 2 R1, R2 100 K RESISTOR, Thick Film, 100 kOhm, 0201 Panasonic ERJ-1GEF10 0201 03C (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 172 ATSAMB11XR/ZR Module Reference Schematics Item Qty Referenc Value e Description Manufacturer Part Number Footprint 4 1 U1 ATSAMB11ZR210CA ATSAMB11ZR210CA BLE Module Microchip Technology Inc. ATSAMB11ZR210CA 5 1 Y1 32.768 KHz Crystal, 32.768 KHz, +/-20 ppm, -40-+85 C, CL=7 pF, 2 lead, SMD ECS, Inc. International ECS-. 327-7-34BTR (c) 2018 Microchip Technology Inc. Datasheet Preliminary ATSAMB 11ZR210CA DS70005342B-page 173 ATSAMB11XR/ZR ATSAMB11-XR2100A Design Considerations 20. ATSAMB11-XR2100A Design Considerations The ATSAMB11-XR2100A is offered in a shielded Land Grid Array (LGA) package with organic laminate substrates. The LGA package makes the second level interconnect (from package to the customer PCB) with an array of solderable surfaces. This may consist of a layout similar to a BGA with no solder spheres. However, it may also have an arbitrary arrangement of solderable surfaces that typically includes large planes for grounding or thermal dissipation, smaller lands for signals or shielding grounds, and in some cases, mechanical reinforcement features for mechanical durability. 20.1 Layout Recommendation Referring to the SiP footprint dimensions in Figure 18-1, it is recommended to use solder mask defined with PCB pads 0.22 mm wide that have a 0.4 mm pitch. A Sample PCB pad layout in following figure shows the required vias for the center ground paddle. Figure 20-1. PCB Footprint For ATSAMB11-XR2100A The land design on the customer PCB should follow the following rules: 1. The solderable area on the customer PCB should match the nominal solderable area on the LGA package 1:1. 2. The solderable area should be finished with organic surface protectant (OSP), NiAu, or a solder cladding. 3. The decision on whether to have a solder mask defined (SMD) land or a non-solder mask defined (NSMD) land depends on the application space. - SMD: If field reliability is at risk due to impact failures such as dropping a hand-held portable application, then the SMD land is recommended to optimize mechanical durability. - NSMD: If field reliability is at risk due to a solder fatigue failure (temperature cycle related open circuits), then the NSMD land is recommended to maximize solder joint life. 20.1.1 Power and Ground Proper grounding is essential for correct operation of the SiP and peak performance. Figure 18-1 shows the bottom view of the ATSAMB11-XR2100A SiP with exposed ground pads. The SiP exposed ground pads must be soldered to customer PCB ground plane. A solid inner layer ground plane should be provided. The center ground paddle of the SiP must have a grid of ground vias solidly connecting the pad to the inner layer ground plane (one via per exposed center ground pads J41 to J49). (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 174 ATSAMB11XR/ZR ATSAMB11-XR2100A Design Considerations Dedicate one layer as a ground plane, preferably the second layer from the top. Make sure that this ground plane does not get broken up by routes. Power can route on all layers except the ground layer. Power supply routes should be heavy copper fill planes to ensure the lowest possible inductance. The power pins of the ATSAMB11-XR2100A should have a via directly to the power plane as close to the pin as possible. Decoupling capacitors should have a via right next to the capacitor pin and this via should go directly down to the power plane - that is to say, the capacitor should not route to the power plane through a long trace. The ground side of the decoupling capacitor should have a via right next to the pad which goes directly down to the ground plane. Each decoupling capacitor should have its own via directly to the ground plane and directly to the power plane right next to the pad. The decoupling capacitors should be placed as close to the pin that it is filtering as possible. 20.1.2 Antenna When designing the ATSAMB11-XR2100A, it is important to pay attention to the following recommendations for antenna placement: 1. 2. 3. 4. 5. 6. 7. 8. 20.2 Make sure to choose an antenna that covers the proper frequency band; 2.400 GHz to 2.500 GHz. Assure that the antenna is designed matched to 50 Ohm input impedance. Talk to the antenna vendor and make sure it is understood that the full frequency range must be covered by the antenna. Be sure to follow the antenna vendors best practice layout recommendations, while placing the antenna in the customer PCB design. The customer PCB pad that the antenna is connected to must be properly designed for 50 Ohm impedance. Make sure that the trace from the RF pin on the ATSAMB11-XR2100A to the antenna matching circuitry has a 50 Ohm impedance. Do not enclose the antenna within a metal shield. Keep any components that may radiate noise or signals within the 2.4 GHz to 2.5 GHz frequency band far away from the antenna and RF traces or better yet, shield the noisy components. Any noise radiated from the customer PCB in this frequency band will degrade the sensitivity of the ATSAMB11-XR2100A device. SWD Interface For programming and/or debugging the ATSAMB11XR/ZR, the device must be connected using the Serial Wire Debug (SWD) interface. Currently, the SWD interface is supported by Microchip programmers and debuggers SAM-ICE and ATMEL-ICE. For ATMEL-ICE, which supports Cortex Debug Connector (10-pin) interface, the signals must be connected, as shown in Figure 20-2 with details described in Table 20-1. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 175 ATSAMB11XR/ZR ATSAMB11-XR2100A Design Considerations Figure 20-2. Cortex Debug Connector (10-pin) Table 20-1. Cortex Debug Connector (10-pin) Header Signal Name Description SWDCLK Serial wire clock pin SWDIO Serial wire bidirectional data pin C_EN Target device reset pin, active-low Vcc Target voltage GND Ground For SAM-ICE which support the 20-pin IDC JTAG Connector, the signals from ATSAMB11-XR2100A/ ATSAMB11-ZR210CA must be connected, as shown in Figure 20-3 with details described in Table 20-2. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 176 ATSAMB11XR/ZR ATSAMB11-XR2100A Design Considerations Figure 20-3. 20-pin IDC JTAG Connector Table 20-2. 20-pin IDC JTAG Connector Header Signal Name Description SWDCLK Serial wire clock pin 20.3 SWDIO Serial wire bidirectional data pin nRESET Target device reset pin, active-low Vcc Target voltage GND Ground GND* These pins are reserved for firmware extension purposes. They can be left open or connected to GND in normal debug environment. They are not essential for SWD in general. Unused or Unconnected Pins Internal pull-down for unused pins must be enabled to acheive the lowest current leakage. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 177 ATSAMB11XR/ZR ATSAMB11-ZR210CA Design Considerations 21. ATSAMB11-ZR210CA Design Considerations 21.1 Placement and Routing Guidelines It is critical to follow the recommendations listed below to achieve the best RF performance for the ATSAMB11-ZR210CA module: 1. The host board design should have a solid ground plane. It is recommended to have a 3x3 grid of GND vias solidly connecting the exposed GND paddle of the module to the ground plane on the inner/other layers of the host board. The module ground pins should have ground vias either on or right next to the host PCB pad. 2. Place GND polygon pour below the module. Do not have any breaks in this GND plane. Place sufficient GND vias connecting this GND polygon pour with the GND plane on the inner/other layers of the host board. 3. When the ATSAMB11-ZR210CA is placed on the host board, a provision for the antenna must be made. The antenna should not be placed directly on top of the host board design as seen in the following figure (a). The best placement, for example, is placing the module at the edge of the host board such that the module edge with the antenna extends beyond the main board edge by 3 mm, as shown as (b). Alternatively, an acceptable case could be to provide a cutout in the host board, as shown as (c). The cutout should be 7.5 mm (minimum) x 3 mm as shown in the Figure 21-2. 4. Keep large metal objects as far away as possible from the antenna, to avoid electromagnetic field blocking. 5. Do not enclose the antenna within a metal shield. 6. Keep any components that may radiate noise or signals within the 2.4 GHz - 2.5 GHz frequency band far away from the antenna or better yet, shield those components. Any noise radiated from the host board in this frequency band will degrade the sensitivity of the ATSAMB11-ZR210CA. 7. Avoid routing any traces on the top layer of the host board in the area directly below the module. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 178 ATSAMB11XR/ZR ATSAMB11-ZR210CA Design Considerations Figure 21-1. ATSAMB11-ZR210CA Placement Examples Figure 21-2. PCB Keep Out Area (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 179 ATSAMB11XR/ZR ATSAMB11-ZR210CA Design Considerations 21.2 Interferers One of the biggest problems with RF devices is poor performance due to interferers on the board radiating noise into the antenna or coupling into the RF traces going to input LNA. Care must be taken to make sure that there no noisy circuitry is placed anywhere near the antenna or the RF traces. All noise generating circuits should also be shielded so they do not radiate noise that is picked up by the antenna. This applies to all layers. Even if there is a ground plane on a layer between the RF route and another signal, the ground return current will flow on the ground plane and couple into the RF traces. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 180 ATSAMB11XR/ZR Reflow Profile Information 22. Reflow Profile Information This section provides guidelines for the reflow process in soldering the ATSAMB11-XR2100A or the ATSAMB11-ZR210CA to the customer's design. 22.1 Storage Condition 22.1.1 Moisture Barrier Bag Before Opening A moisture barrier bag must be stored in a temperature of less than 30C with humidity under 85% RH. The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed. 22.1.2 Moisture Barrier Bag Open Humidity indicator cards must be blue, < 30%. 22.2 Stencil Design The recommended stencil is a laser-cut, stainless-steel type with a thickness of 75 m to 100 m and approximately a 1:1 ratio of stencil opening to pad dimension. To improve paste release, a positive taper with bottom opening 25 m larger than the top can be utilized. Local manufacturing experience may find other combinations of stencil thickness and aperture size to get good results. 22.3 Soldering and Reflow Conditions 22.3.1 Reflow Oven It is strongly recommended that a reflow oven equipped with more heating zones and Nitrogen atmosphere be used for lead-free assembly. Nitrogen atmosphere has shown to improve the wet-ability and reduce temperature gradient across the board. It can also enhance the appearance of the solder joints by reducing the effects of oxidation. The following items should also be observed in the reflow process: Some recommended pastes include (R) (R) * NC-SMQ 230 flux and Indalloy 241 solder paste made up of 95.5 Sn/3.8 Ag/0.7 Cu * SENJU N705-GRN3360-K2-V Type 3, no clean paste. Allowable reflow soldering iterations: * Three times based on the following reflow soldering profile (see Figure 22-1). Temperature profile: * Reflow soldering shall be done according to the following temperature profile (see Figure 22-1). * Peak temperature: 250C. 22.4 Baking Conditions This module is rated at MSL level 3. After sealed bag is opened, no baking is required within 168 hours so long as the devices are held at <= 30C/60% RH or stored at <10% RH. The module will require baking before mounting if: (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 181 ATSAMB11XR/ZR Reflow Profile Information * * * The sealed bag has been open for > 168 hours. Humidity Indicator Card reads >10%. SiPs need to be baked for 8 hours at 125C. Figure 22-1. Solder Reflow Profile 22.5 Module Assembly Considerations The Microchip ATSAMB11-ZR210CA module is manufactured without any conformal coating applied. It is the customer's responsibility if a conformal coating is specified and or applied to the ATSAMB11ZR210CA module. Solutions like IPA and similar solvents can be used to clean the ATSAMB11-ZR210CA module. However, cleaning solutions containing acid should never be used on the module. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 182 ATSAMB11XR/ZR Regulatory Approval 23. Regulatory Approval Regulatory approvals received: ATSAMB11-ZR210CA * United States/FCC ID: 2ADHKBZR * Canada/ISED - IC: 20266-SAMB11ZR - HVIN: ATSAMB11-ZR210CA * Europe - CE (RED) 23.1 United States The ATSAMB11-ZR210CA module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C "Intentional Radiators" single-modular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product, or host device) by the grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. A host product itself is required to comply with all other applicable FCC equipment authorization regulations, requirements, and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification or Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions). 23.1.1 Labeling And User Information Requirements Due to the limited module size of ATSAMB11-ZR210CA (7.503 mm x10.541 mm), FCC identifier is displayed only in the datasheet and packaging box label. FCC identifier cannot be displayed on the module label. When the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording as follows: For the ATSAMB11-ZR210CA: Contains Transmitter Module FCC ID: 2ADHKBZR or Contains FCC ID: 2ADHKBZR (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 183 ATSAMB11XR/ZR Regulatory Approval This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A user's manual for the finished product should include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: * * * * Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) https://apps.fcc.gov/oetcf/kdb/index.cfm 23.1.2 RF Exposure All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power is conducted. Module is approved for use in mixed mobile-device and portable-device exposure host platforms. The antenna(s) used with this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 23.1.3 Helpful Web Sites Federal Communications Commission (FCC): http://www.fcc.gov FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): https://apps.fcc.gov/oetcf/kdb/index.cfm 23.2 Canada The ATSAMB11-ZR210CA module has been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 184 ATSAMB11XR/ZR Regulatory Approval 23.2.1 Labeling and User Information Requirements Labeling Requirements (from RSP-100 Issue 11, Section 3): The host product shall be properly labeled to identify the module within the host device. Due to limited size of the ATSAMB11-ZR210CA (7.503 mm x10.541 mm), the Innovation, Science and Economic Development Canada certification number is not displayed on the module. Therefore, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the words "Contains", or similar wording expressing the same meaning, as follows: For the ATSAMB11-ZR210CA: Contains IC: 20266-SAMB11ZR User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device complies with Industry Canada's license exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. Guidelines on Transmitter Antenna for License Exempt Radio Apparatus: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformement a la reglementation d'Industrie Canada, le present emetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inferieur) approuve pour l'emetteur par Industrie Canada. Dans le but de reduire les risques de brouillage radioelectrique a l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnee equivalente (p.i.r.e.) ne depasse pas l'intensite necessaire a l'etablisse-ment d'une communication satisfaisante. 23.2.2 RF Exposure All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands). (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 185 ATSAMB11XR/ZR Regulatory Approval This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with Canada multi-transmitter product procedures. The device operates at an output power level which is within the ISED SAR test exemption limits at any user distance. 23.2.3 Helpful Web Sites Innovation, Science and Economic Development Canada: http://www.ic.gc.ca/ 23.3 Europe The ATSAMB11-ZR210CA module is a Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The ATSAMB11-ZR210CA module has been tested to RED 2014/53/EU Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2), which is summarized in Table 23-1. The ETSI provides guidance on modular devices in the "Guide to the application of harmonised standards covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and nonradio equipment" document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/20 3367/01.01.01_60/eg_203367v010101p.pdf. Note: To maintain conformance to the testing listed in Table 23-1, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED. 23.3.1 Labeling and User Information Requirements The label on the final product that contains the ATSAMB11-ZR210CA module must follow CE marking requirements. Table 23-1. European Compliance Testing (ATSAMB11-ZR210CA) Certification Standards Safety EN60950-1:2006/A11:2009/ A1:2010/ A12:2011/A2:2013 Health EN 300 328 V2.1.1/ EN 62479:2010 Article EN 301 489-1 V2.2.0 EN 301 489-17 V3.1.1 Date 11062248 001 2017-08-18 50098290 001 2017-09-22 10062088 001 2017-09-22 50098290 001 2017-09-22 [3.1(a)] EN 301 489-1 V2.1.1 EMC Laboratory Report Number [3.1(b)] TUV Rheinland, Taiwan EN 301 489-17 V3.2.0 Radio EN 300 328 V2.1.1 (c) 2018 Microchip Technology Inc. (3.2) Datasheet Preliminary DS70005342B-page 186 ATSAMB11XR/ZR Regulatory Approval 23.3.2 Conformity Assessment From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio product: If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required. The European Compliance Testing listed in the Table 23-1 is performed using the integral chip antenna. 23.3.2.1 Simplified EU Declaration of Conformity Hereby, Microchip Technology Inc. declares that the radio equipment type ATSAMB11-ZR210CA is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity for this product is available at http://www.microchip.com/ design-centers/wireless-connectivity/. 23.3.3 Helpful Web Sites A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communications Committee (ECC) at: http://www.ecodocdb.dk/. Additional helpful web sites are: * Radio Equipment Directive (2014/53/EU): : https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/rtte_en * European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org * European Telecommunications Standards Institute (ETSI): http://www.etsi.org * The Radio Equipment Directive Compliance Association (REDCA) (Previously known as R&TTE Compliance Association): http://www.redca.eu 23.4 Other Regulatory Information * * For information on the other countries jurisdictions covered, refer to the http://www.microchip.com/ design-centers/wireless-connectivity Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, contact Microchip for the required utilities and documentation (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 187 ATSAMB11XR/ZR Reference Documents and Support 24. Reference Documents and Support 24.1 Reference Documents Microchip offers a set of collateral documentation to ease integration and device ramp. The following table list documents available on Microchip website or integrated into development tools. Table 24-1. Reference Documents Title ATSAMB11 BluSDK Smart Release Package Content This package contains the software development kit and all the necessary documentation including getting started guides for interacting with different hardware devices, tools and API user manual. BluSDK Smart BLE API Software This user guide details the functional description of Bluetooth Low Development Guide Energy (BLE) Application Peripheral Interface (API) programming model. This also provides the example code to configure an API for Generic Access Profile (GAP), Generic Attribute (GATT) Profile, and other services using the ATSAMB11. ATSAMB11 BluSDK SMART OTAU Profile Getting Started Guide This document describes how to set the evaluation board for the Bluetooth Low Energy Over-the-Air Upgrade (OTAU) application supported by the ASF. ATSAMB11 BluSDK SMART This document details the design and usage scenarios for the Atmel Interrupts and ULP - Architecture ATSAMB11 peripheral interrupts and ULP feature and Usage User's Guide ATSAMB11 BluSDK SMART Example Profiles Application User Guide This document describes how to set up the evaluation boards for various example applications supported by the Advanced Software Framework (ASF). Ultra Low Power BLE 4.1 SiP/ Module Errata Errata document capturing the known issues with the ATSAMB11XR2100A SiP (R) For a complete listing of development support tools and documentation, visit http://www.microchip.com, or contact the nearest microchip field representative. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 188 ATSAMB11XR/ZR Document Revision History 25. Document Revision History Rev B - 03/2018 Section Section 9, 10, 11, 12, 13, 14 and 15 Changes * * * Added register descriptions for BLE Clock. Updated and added register descriptions for I/O Peripheral Multiplexing and MEGAMUXing. Added detailed information and register descriptions for various peripherals such as, muxable interrupts, GPIO pin controller, AlwaysOn sleep timer, Pulse Width Modulation, and I2C interface. Rev A - 09/2017 Section Document Changes * * * (c) 2018 Microchip Technology Inc. Updated from Atmel to Microchip template. Assigned a new Microchip document number. Previous version is Atmel 42751 revision A. ISBN number added. Datasheet Preliminary DS70005342B-page 189 ATSAMB11XR/ZR The Microchip Web Site Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * * * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Customer Change Notification Service Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at http://www.microchip.com/. Under "Support", click on "Customer Change Notification" and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: * * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 190 ATSAMB11XR/ZR * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. 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Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 191 ATSAMB11XR/ZR (c) 2018, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-2754-4 Quality Management System Certified by DNV ISO/TS 16949 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California (R) (R) and India. The Company's quality system processes and procedures are for its PIC MCUs and dsPIC (R) DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2018 Microchip Technology Inc. Datasheet Preliminary DS70005342B-page 192 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-67-3636 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra'anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7289-7561 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 (c) 2018 Microchip Technology Inc. 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