DX21TFAP02 - Samsung Electronics

Diplexer

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■INTRODUCTION

Diplexer is used for separating specific frequency in a mobile phone, Diplexer has six terminals

composed of antenna port, low frequency port(AMPS), high frequency port(GPS,PCS) and three

grounds. We produce diplexers for AMPS/GPS bands and AMPS/PCS bands. Diplexers for

TV/CDMA bands and 2.45GHz/5GHz bands are under development. Our diplexers have two

different kinds of pin structures called 01 or 02. Different types of pin structure help you to design

a circuit in HHP.

■FEATURE AND APPLICATION

●Feature

- Consist of low pass filterandhighpassfilter.

- Low insertion loss.

- Small size, 2.0x1.25x0.9mm. light weight.

- Available for dual-band system.

- Operating temperature: -40℃to +85℃-

- Storage temperature : +15℃to +35℃

- Reflow solderable. low-profiled SMD

- Available in tape and reel packings for automatic mounting

●Application

-Separating specific frequency in a mobile phone

Diplexer

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■STRUCTURE

Diplexer

- 3 -

■APPEARANCE AND DIMENSION

bae p

(1)

(5)

(4)

(2) (3)

(6)

cTerminal No. Terminal name Terminal No. Terminal name

1 PS(*1) 4 GND

2 GND 5 PS(*3)

3 PS(*2) 6 GND

(*1) Lower Frequency Port

(*2) Higher Frequency Port

(*3) Common Port

CODE DIMENSION ( mm )

L W T a b c e p

21 2.00±0.15 1.25±0.15 0.95±0.10 0.3+0.1/-0.15 0.20±0.15 0.3+0.1/-0.2 0.35±0.10 0.65±0.05

31 3.2 ±0.15 1.6 ±0.15 1.1 ±0.10 0.55 ±0.15 0.35 ±0.15 0.3 +0.1/-0.2 0.40 ±0.15 1.00 ±0.10

Diplexer

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■PART NUMBERING

●

2DIMENSION

CODE DIMENSION (L×W)

21 2.0×1.25mm

31 3.2×1.60mm

●

3MATERIAL

CODE DESCRIPTION OF CODE

TMaterial For High Frequency

●

4THE NUMBER OF TERMINALS

CODE DESCRIPTION OF CODE

●

5CENTER FREQUENCY OF LOW BAND

CODE DESCRIPTION OF CODE FREQUENCY

AAMPS BAND 859 ±35 MHz

GGSM 800 920 ±40 MHz

EEGSM 900 942.5 ±17.5 MHz

II-DEN 806~941MHz

KKCDMA 824~894MHz

DX 21 T F A P 01

●

2●

●

3●

4●

5●

●

1Abbreviation of Diplexer

●

2Dimension

●

3Material Code

●

4The number of terminals

●

5Center Frequency of Low Band

●

6Center Frequency of High Band

●

7Pin arrangement structure

Diplexer

- 5 -

●

6CENTER FREQUENCY OF HIGH BAND

CODE DESCRIPTION OF CODE FREQUENCY

PPCS BAND 1920 ±70 MHz

WW-CDMA 2045 MHz

GGPS 15757 MHz

DDCS 1795 ±85 MHz

●

7PIN ARRANGEMENT STRUCTURE

CODE DESCRIPTION OF CODE

01 01 Pin Structure(low band/high band)

02 02 Pin Structure(high band/low band)

03 03 Pin Structure(low band/high band)

Diplexer

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■PACKAGING

●EMBOSSED PLASTIC TAPE

TYPE THICKNESS OF BODY[MM] STANDARD QUANTITY[PCS]

21 0.95 3000

31 1.0 3000

●QUANTITY

2.0±0.05 4.0±0.1

φ1.5 +0.1

8.0±0.3

1.75±0.1

3.5±0.05

0.3

Embossed

TYPE TAPE

MATERIAL A B T Tc

(Chip Thickness)

31 EMBOSSED

BOARD 2.0±0.2

[.079±.008] 3.6±0.2

[.142±.008] 2.0

[.079] 1.1±0.1

21 EMBOSSED

TAPE 1.45±0.1 2.25±0.1 1.25

[±0.1] 0.95±0.1

unit:mm

Diplexer

- 7 -

●REEL DIMENSION

A B C D E W T R

φ178±2φ60±5.0 Φ13±0.5 Φ21±0.8 2±0.5 10.0±1.5 0.8±0.2 1.0

unit:mm

Diplexer

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■RELIABILITY TEST DATA

NO ITEM CONDITION SPECIFICATION

1 THERMAL SHOCK TEMP. CYCLE OF THE FOLLOWING

BE SUBJECT FOR 100CYCLES.

-40℃,30min ↔+85℃,30min

ELECTRICAL CHARACTERISTICS SHALL BE

SATISFIED.

2HUMIDITY

RESISTANCE +40±3℃, RELATIVE HUMIDITY

90~95% FOR 1000hours. ELECTRICAL CHARACTERISTICS SHALL BE

SATISFIED.

3HIGH TEMPERATURE

RESISTANCE +125±3℃FOR 1000hours. ELECTRICAL CHARACTERISTICS SHALL BE

SATISFIED.

4LOW TEMPERATURE

RESISTANCE -40±3℃FOR 1000hours. ELECTRICAL CHARACTERISTICS SHALL BE

SATISFIED.

5 SOLDERABILITY

2% EUTECTIC SOLDER.

THEENTIRESAMPLESHALLBE

DIPPED IN SOLDER AT 230±5℃FOR

10s.

A NEW UNIFORM COATING OF SOLDER

SHALL COVER A MINIMUM OF 90% OF

THE SURFACE BEING IMMERSED.

6RESISTANCE TO

SOLDERING HEAT

PEAK : 220±5℃,40S

THE SPECIMEN SHALL BE PASSED

THROUGH THE REFLOW FURNACE

WITH THE CONDITION SHOWN IN

THE ABOVE PROFILE FOR 3 TIMES.

ELECTRICAL CHARACTERISTICS SHALL

BE SATISFIED.

WITHOUT DISTINCT DEFORMATION IN

APPEARANCE.

1~2min 5s

preheating

125~150℃

soldering

slow

cooling

100

150

200

250

℃

time

Diplexer

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■BLOCK DIAGRAM

●FREQUENCY SEPARATOR IN DUAL BAND PHONE

AMPS/US-PCS

DUAL BAND AMPS

CDMA

BPF

US-PCS

BPF BALUN

BALUN

AMPS

CDMA

BPF

US-PCS

BPF

LPF COUPLER

COUPLER

APC

AMPS

VCO US-PCS

VCO

AMPS/

CDMA

US-PCS

DUPLEXER

LNA

PAM

DIPLEXER

AMPS/US-PCS

DUAL BAND AMPS

CDMA

BPF

US-PCS

BPF BALUN

BALUN

AMPS

CDMA

BPF

US-PCS

BPF

LPF COUPLER

COUPLER

APC

AMPS

VCO US-PCS

VCO

AMPS/

CDMA

US-PCS

DUPLEXER

LNA

PAM

AMPS

CDMA

BPF

US-PCS

BPF BALUN

BALUN

AMPS

CDMA

BPF

US-PCS

BPF

LPF COUPLER

COUPLER

APC

AMPS

VCO US-PCS

VCO

AMPS/

CDMA

US-PCS

DUPLEXER

LNA

PAM

DIPLEXER

Diplexer

- 10 -

STAGE PRECAUTION TECHNICAL CONSIDERATION

1. Soldering

2. Cleaning

▶Soldering

1. Temperature, time, amount of solder, etc. are

specified in accordance with the following

recommended conditions.

▶Cleaning conditions

1. When cleaning the PC board after the

diplexer are all mounted, select the

appropriate cleaning solution according to

thetypeoffluxusedandpurposeofthe

cleaning(e.g. to remove soldering flux or

other materials from the production

process.)

2. Cleaning conditions should be determined

after verifying, through a test run, that

the cleaning process does not affect the

diplexer's characteristics.

1-1. Preheating when soldering

Heating : Diplexer should be preheated within 100

to 130℃of the soldering.

Cooling : The temperature difference between the

components and cleaning process should not be

greater than 100℃. Diplexer is susceptible to

thermal shock when exposed to rapid or concentrated

heating or rapid cooling. Therefore, the soldering

process must be conducted with a great care so as

to prevent malfunction of the components due to

excessive thermal shock..

※Recommended conditions for soldering

[Reflow soldering]

Temperature Profile

100

150

200

250

300

0 50 100 150 200

TIME(sec.)

Temperature( C)

Preheating 230℃

Over 1min. Over 1min. Gradual cooling

Within 10 sec.

※1. The ideal condition is to have solder mass (fillet)

controlled to 1/2 to 1/3 of the thickness of the

diplexer, as shown below:

2. Because excessive dwell times can detrimentally

affect solderability, soldering duration should be

kept as close to recommended times as possible.

1. The use of inappropriate solutions can cause foreign

substances such as flux residue to adhere to the

splitter, resulting in a degradation of the splitter's

electrical properties (especially insulation resistance).

2. Inappropriate cleaning conditions (insufficient or

excessive cleaning) may detrimentally affect the

performance of the splitters.

(1)Excessive cleaning

In the case of ultrasonic cleaning, too much power

output can cause excessive vibration of the PC board

which may lead to the cracking of the diplexer or the

soldered portion, or decrease the terminal electrodes'

strength. Thus the following conditions should be

carefully checked;

Ultrasonic output Below 20 w/l

Ultrasonic frequency Below 40 kHz

Ultrasonic washing period 5 min. or less

■APPLICATION MANUAL

DIPLEXER

1/2T∼1/3T

Solder

PC board

Diplexer

- 11 -

STAGE PRECAUTION TECHNICAL CONSIDERATION

3. Post

cleaning

processes

4. Storage

conditions

▶Application of resin coatings, molding,

etc. to the PCB and components.

1. With some type of resins a

decomposition gas or chemical reaction

vapor may remain inside the resin during

the hardening period or while left under

normal storage conditions resulting in the

deterioration of the diplexer's

performance.

2. When a resin's hardening temperature is

higher than the diplexer's operating

temperature, the stresses generated by

the excess heat may lead to diplexer

damage or destruction.

3. Stress caused by a resin's temperature

generated expansion and contraction may

damage diplexer

The use of such resins, molding materials etc.

is not recommended.

▶Storage

1. To maintain the solderability of terminal

electrodes and to keep the packaging

material in good condition, care must be

taken to control temperature and

humidity in the storage area. Humidity

should especially be kept as low as

possible.

Recommended conditions

Ambient temperature Below 40℃

Humidity Below 70% RH

The ambient temperature must be kept below

30℃. Even under ideal storage conditions

diplexer electrode solderability decreases as

time passes, so diplexer should be used within

6 months from the time of delivery.

※The packaging material should be kept

wherenochlorineorsulfurexistsintheair

1. If the parts are stocked in a high temperature and

humidity environment, problems such as reduced

solderability caused by oxidation of terminal

electrodes and deterioration of taping/packaging

materials may take place. For this reason,

components should be used within 6 months from

the time of delivery. If exceeding the above period,

please check solderability before using the diplexer

Diplexer

- 12 -

■CROSS REFERENCE

BAND FREQ.[MHz] SAMSUNG HITACHI MURATA

LOW HIGH

AMPS/

US-PCS 824~894 1850~1990

DX21TFAP01 SLF-S080ML LFDP15N0039A

DX21TFAP03

DX31TFAP01 SLF-080EL LFDP20N0022A

DX21TFAP03 SLF-080ML

AMPS/GPS 824~925 1570~1580 DX21TFAG01 - -

GSM/DCS 880~960 1710~1880 DX21TFGD01 SLF-S090ME LFDP15N0044A

Diplexer

- 13 -

■NOTICE

●REPORT BEFORE CHANGE

If it is required to change the specifications, materials or manufacturing methods of

this specified diplexers, we shall inform on written statement with its quality and

reliability data before changes may occur.

●PACKAGING

Package includes label with below item and outgoing inspection data on customer's request.

- Part No.& Lot No.

- Quantity

- Name and logo of manufacturer

●RESTRICTION OF ENVIRONMENTAL DESTRUCTIVE MATERIAL

Diplexers specified on this specification do not use any of under stated materials.

Cd, Hg, As, Br and its chemical composite, PCB and asbestos.

PBBS

PBBOs

PBDO

PBDE

PBB

●USAGE OF MATERIALS DESTRUCTIVE OZONOSPHERE

Diplexers specified on this specification do not use any of under stated ODS materials

on its manufacturing stages.

Freon

Haron

1-1-1 TCE

CC1₄

HCFC