Diplexer Diplexer INTRODUCTION Diplexer is used for separating specific frequency in a mobile phone, Diplexer has six terminals composed of antenna port, low frequency port(AMPS), high frequency port(GPS,PCS) and three grounds. We produce diplexers for AMPS/GPS bands and AMPS/PCS bands. Diplexers for TV/CDMA bands and 2.45GHz/5GHz bands are under development. Our diplexers have two different kinds of pin structures called 01 or 02. Different types of pin structure help you to design a circuit in HHP. FEATURE AND APPLICATION Feature - Consist of low pass filter and high pass filter. Low insertion loss. Small size, 2.0x1.25x0.9mm. light weight. Available for dual-band system. Operating temperature: -40 to +85Storage temperature : +15 to +35 Reflow solderable. low-profiled SMD Available in tape and reel packings for automatic mounting Application -Separating specific frequency in a mobile phone -1- Diplexer STRUCTURE -2- Diplexer APPEARANCE AND DIMENSION T L (1) (2) (3) (4) (5) (6) W Terminal No. 1 2 3 c b a p e Terminal name PS(*1) GND PS(*2) Terminal No. Terminal name 4 GND 5 PS(*3) 6 GND (*1) Lower Frequency Port (*2) Higher Frequency Port (*3) Common Port DIMENSION ( mm ) CODE L W T a b c e p 21 2.000.15 1.250.15 0.950.10 0.3+0.1/-0.15 0.200.15 0.3+0.1/-0.2 0.350.10 0.650.05 31 3.2 0.15 1.6 0.15 1.1 0.10 0.55 0.15 0.35 0.15 0.3 +0.1/-0.2 0.40 0.15 1.00 0.10 -3- Diplexer PART NUMBERING DX 1 1 2 3 4 5 6 7 21 2 T 3 F 4 A 5 P 6 01 7 Abbreviation of Diplexer Dimension Material Code The number of terminals Center Frequency of Low Band Center Frequency of High Band Pin arrangement structure 2 DIMENSION CODE DIMENSION (LxW) 21 2.0x1.25mm 31 3.2x1.60mm 3 MATERIAL CODE DESCRIPTION OF CODE T Material For High Frequency 4 THE NUMBER OF TERMINALS CODE DESCRIPTION OF CODE F 6 5 CENTER FREQUENCY OF LOW BAND CODE DESCRIPTION OF CODE FREQUENCY A AMPS BAND 859 35 MHz G GSM 800 920 40 MHz E EGSM 900 942.5 17.5 MHz I I-DEN 806 ~ 941 MHz K KCDMA 824 ~ 894 MHz -4- Diplexer 6 CENTER FREQUENCY OF HIGH BAND CODE DESCRIPTION OF CODE FREQUENCY P PCS BAND 1920 70 MHz W W-CDMA 2045 MHz G GPS 15757 MHz D DCS 1795 85 MHz 7 PIN ARRANGEMENT STRUCTURE CODE DESCRIPTION OF CODE 01 01 Pin Structure(low band/high band) 02 02 Pin Structure(high band/low band) 03 03 Pin Structure(low band/high band) -5- Diplexer PACKAGING EMBOSSED PLASTIC TAPE 2.00.05 4.00.1 1.750.1 1.5 +0.1 0 8.00.3 B 3.50.05 A 0.3 T Embossed unit : mm TYPE 31 TAPE MATERIAL A B T Tc (Chip Thickness) EMBOSSED 2.00.2 3.60.2 BOARD [.079.008] [.142.008] 2.0 [.079] 1.10.1 1.450.1 2.250.1 EMBOSSED 21 TAPE 1.25 0.950.1 [0.1] QUANTITY TYPE THICKNESS OF BODY[MM] STANDARD QUANTITY[PCS] 21 0.95 3000 31 1.0 3000 -6- Diplexer REEL DIMENSION E C R B D W t A unit : mm A B C D E W T R 1782 605.0 130.5 210.8 20.5 10.01.5 0.80.2 1.0 -7- Diplexer RELIABILITY TEST DATA NO ITEM 1 THERMAL SHOCK 2 HUMIDITY RESISTANCE 3 4 5 CONDITION SPECIFICATION TEMP. CYCLE OF THE FOLLOWING BE SUBJECT FOR 100CYCLES. -40,30min +85,30min ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. +403, RELATIVE HUMIDITY 90~95% FOR 1000hours. ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. HIGH TEMPERATURE RESISTANCE +1253 FOR 1000hours. ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. LOW TEMPERATURE RESISTANCE -403 FOR 1000hours. ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. 2% EUTECTIC SOLDER. THE ENTIRE SAMPLE SHALL BE DIPPED IN SOLDER AT 2305 FOR 10s. A NEW UNIFORM COATING OF SOLDER SHALL COVER A MINIMUM OF 90% OF THE SURFACE BEING IMMERSED. SOLDERABILITY PEAK : 2205,40S THE SPECIMEN SHALL BE PASSED THROUGH THE REFLOW FURNACE WITH THE CONDITION SHOWN IN THE ABOVE PROFILE FOR 3 TIMES. 6 RESISTANCE TO SOLDERING HEAT soldering 250 200 150 ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. preheating 125~150 slow cooling WITHOUT DISTINCT DEFORMATION IN APPEARANCE. 100 50 1~2min 5s time -8- Diplexer BLOCK DIAGRAM FREQUENCY SEPARATOR IN DUAL BAND PHONE AMPS/US-PCS DUAL BAND DUPLEXER RX AMPS CDMA BPF LNA BALUN TX DIPLEXER AMPS/ US-PCS BPF CDMA BALUN LNA DIPLEXER AMPS VCO US-PCS VCO APC LPF US-PCS RX DUPLEXER TX AMPS CDMA BPF COUPLER PAM US-PCS BPF DIPLEXER COUPLER APC -9- Diplexer APPLICATION MANUAL STAGE 1. Soldering PRECAUTION Soldering 1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions. TECHNICAL CONSIDERATION 1-1. Preheating when soldering Heating : Diplexer should be preheated within 100 to 130 of the soldering. Cooling : The temperature difference between the components and cleaning process should not be greater than 100. Diplexer is susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.. Recommended conditions for soldering [Reflow soldering] Temperature Profile Temperature( C) 300 Preheating 250 230 200 150 100 50 Over 1min. Over 1min. Gradual cooling 0 0 50 Within 10 sec. 100 150 200 TIME(sec.) 1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thickness of the diplexer, as shown below: DIPLEXER 1/2T1/3T T Solder PC board 2. Cleaning Cleaning conditions 1. When cleaning the PC board after the diplexer are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning(e.g. to remove soldering flux or other materials from the production process.) 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the diplexer's characteristics. 2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the splitter, resulting in a degradation of the splitter's electrical properties (especially insulation resistance). 2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the splitters. (1)Excessive cleaning In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the diplexer or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 20 w/l Ultrasonic frequency Below 40 kHz Ultrasonic washing period 5 min. or less - 10 - Diplexer STAGE 3. Post cleaning processes PRECAUTION TECHNICAL CONSIDERATION Application of resin coatings, molding, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the diplexer's performance. 2. When a resin's hardening temperature is higher than the diplexer's operating temperature, the stresses generated by the excess heat may lead to diplexer damage or destruction. 3. Stress caused by a resin's temperature generated expansion and contraction may damage diplexer The use of such resins, molding materials etc. is not recommended. 4. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the diplexer Recommended conditions Ambient temperature Below 40 Humidity Below 70% RH The ambient temperature must be kept below 30. Even under ideal storage conditions diplexer electrode solderability decreases as time passes, so diplexer should be used within 6 months from the time of delivery. The packaging material should be kept where no chlorine or sulfur exists in the air - 11 - Diplexer CROSS REFERENCE FREQ.[MHz] BAND SAMSUNG LOW HITACHI MURATA SLF-S080ML LFDP15N0039A HIGH DX21TFAP01 AMPS/ US-PCS DX21TFAP03 824~894 1850~1990 DX31TFAP01 SLF-080EL LFDP20N0022A DX21TFAP03 SLF-080ML AMPS/GPS 824~925 1570~1580 DX21TFAG01 - - GSM/DCS 880~960 1710~1880 DX21TFGD01 SLF-S090ME LFDP15N0044A - 12 - Diplexer NOTICE REPORT BEFORE CHANGE If it is required to change the specifications, materials or manufacturing methods of this specified diplexers, we shall inform on written statement with its quality and reliability data before changes may occur. PACKAGING Package includes label with below item and outgoing inspection data on customer's request. - Part No.& Lot No. - Quantity - Name and logo of manufacturer RESTRICTION OF ENVIRONMENTAL DESTRUCTIVE MATERIAL Diplexers specified on this specification do not use any of under stated materials. Cd, Hg, As, Br and its chemical composite, PCB and asbestos. PBBS PBBOs PBDO PBDE PBB USAGE OF MATERIALS DESTRUCTIVE OZONOSPHERE Diplexers specified on this specification do not use any of under stated ODS materials on its manufacturing stages. Freon Haron 1-1-1 TCE CC1 HCFC - 13 -