Features
■ Two resistance-matched PTCs in a
ceramic housing
■ Narrow resistance tolerance
■ RoHS compliant*
CMF-SD Series - Telecom CPTC Resettable Fuses
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
Test Procedures And Requirements For Model CMF-SD Series
Primary
Test Protection Test Condition Requirements
Mains Power Contact - ITU-T K.20, K.21 .... None .............. 230 V rms, 10 ohms, 15 Min. .....................................................(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. .....(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ........(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ........(Ri-Rf) / Ri < ±10 %
Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700 μs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. .................(Ri-Rf) / Ri < ±10 %
Lightning Surge ................................................................... 10/1000 μs, 40 ohms, 1.0 kV, 30 Tests, every 3 Min. ................(Ri-Rf) / Ri < ±10 %
Ri = R initial
Rf = R fi nal
Electrical Characteristics
Model
Induction
Voltage
Withstand
Rated
Voltage
Rated
Resistance
(RN) @ 25 °C
Resistance
Matching in
Housing
Hold
Current
Trip
Current
Imax @
230 VAC
Time to
Trip @
Imax / 230
VAC
VAC Volts Ohms Tolerance Ohms Amps @ 25 °C Amps @ 25 °C Amps Seconds
CMF-SD10 600 220 10 ±20 % ±1.0 0.150 0.360 1 <4.5
CMF-SD25 600 230 25 ±20 % ±0.5 0.130 0.260 2.8 < 0.3
CMF-SD25-10 600 220 25 ±10 % ±0.5 0.130 0.260 2.5 < 0.3
CMF-SD35 600 230 35 ±20 % ±0.5 0.100 0.200 3 < 0.2
CMF-SD35-10 600 230 35 ±10 % ±0.5 0.100 0.200 3 < 0.2
CMF-SD35A 600 230 35 ±20 % ±0.5 0.100 0.200 2.5 < 0.2
CMF-SD35A-10 600 230 35 ±10 % ±0.5 0.100 0.200 2.5 < 0.2
CMF-SD50 600 230 50 ±20 % ±0.5 0.090 0.190 3 < 0.1
CMF-SD50-10 600 230 50 ±10 % ±0.5 0.090 0.190 3 < 0.1
CMF-SD50A 600 230 50 ±20 % ±0.5 0.090 0.190 3 < 0.1
CMF-SD50A-10 600 230 50 ±10 % ± 0.5 0.090 0.190 3 < 0.1
How to Order
CMF - SD 35 A -10 - 2
Product Designator
Style
SD = Surface Mount Dual Pkg.
Rated Resistance (RN)
10, 25, 35, 50 (25, 35, 50 Ohms)
Reduced Footprint and Height
Option*
Resistance Tolerance Option
Blank = Standard (20 %)
-10 = 10 %
Packaging Options
- 2 = Tape & Reel
*Reduced footprint and height option currently
unavailable for Model CMF-SD25.
Typical Part Marking
Represents total content. Layout may vary.
356G
MANUFACTURER'S
TRADEMARK
PART
IDENTIFICATION:
10 = CMF-SD10
25 = CMF-SD25
35 = CMF-SD35
50 = CMF-SD50
35A = CMF-SD35A
50A = CMF-SD50A
25K = CMF-SD25-10
35K = CMF-SD35-10
50K = CMF-SD50-10
35AK = CMF-SD35A-10
50AK = CMF-SD50A-10
50AL = CMF-SD50A-15
YEAR CODE:
6 = 2006
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
Model CMF-SD is currently available,
although not recommended for new
designs. Model CMF-SDP is
preferred.
*RoHS COMPLIANT
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
CMF-SD Series - Telecom CPTC Resettable Fuses
CMF-SD SERIES, REV. O, 05/10
Product Dimensions
(Reduced value available on request.)
Packaging Options - Tape and Reel:
CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 400
pcs. per reel;
CMF-SD35A & CMF-SD50A = 500 pcs. per reel
A
B
F
H
G
E
D
C
Dim.
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
CMF-SD35A
CMF-SD50A
A 9.00
(.354) MAX. 7.15
(.281) MAX.
B 10.80
(.425) MAX. 8.50
(.355) MAX.
C 10.20
(.402) MAX. 8.10
(.319) MAX.
D4.88 - 5.28
(.192 - .208)
3.25 - 3.65
(.128 - .144)
E2.41 - 2.61
(.095 - .103)
2.41 - 2.61
(.095 - .103)
F 0.5
(.020) MAX. 0.5
(.020) MAX.
G2.5
(.098)
2.5
(.098)
H1.0
(.039)
1.0
(.039)
DIMENSIONS: MM
(INCHES)
COPLANARITY: 0.15
(.006)
Recommended Pad Layout
B
1
2
3
4
A
F
E
D
C
H
G
12
34
Solder Refl ow Recommendations
160–220
300
250
200
150
100
50
0
10–20
Temperature (°C)
120
Preheating Soldering Cooling
Time (seconds)
Solder refl ow
• Recommended refl ow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If refl ow temperatures exceed the recommended profi le, devices may not
meet the performance requirements.
Rework
• A device should not be reworked.
Dim.
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
CMF-SD35A
CMF-SD50A
A10.0
(.394)
8.00
(.315)
B8.80
(.346)
7.05
(.278)
C3.20
(.126)
2.75
(.108)
D2.00
(.079)
2.00
(.079)
E2.60
(.102)
2.51
(.099)
F5.00
(.197)
3.45
(.136)
G7.60
(.299)
5.95
(.234)
H10.0
(.394)
8.15
(.321)
DIMENSIONS: MM
(INCHES)
Applications
Used as a secondary overcurrent protection
device in:
■ Customer Premise Equipment (CPE)
■ Central Offi ce (CO)
■ Access equipment
T
K
5°
93°
0
A0
P
PA0
B0
F
P2P0E
W
B0
F
E
W
P2P0
2.5
(.098)
0.5
(.020)
13.2 +0.2/-0
(.520 +.008/-0
16.4 +2.0/-0
(.646 +.079/-0)
16.4 +2.0/-0
(.646 +.079/-0)
22.4
(.882)
MAX.
22.4
(.882)
MAX.
330 -2/+0
(12.99 -.079/+0)
DIA.
100 ± 1.5
(3.94 ± .059) DIA.
13.2 +0.2/-0
(.520 +.008/-0
330 -2/+0
(12.99 -.079/+0)
DIA.
100 ± 1.5
(3.94 ± .059)
DIA.
D
DT
K0
1.0
(.039)
5.8
(.228)
3.45
(.136)
CMF-SD10
CMF-SD25-2
CMF-SD35-2 CMF-SD35A-2
Tape Dimensions per EIA 481-2 CMF-SD50-2 CMF-SD50A-2
W 24.0 +0.30/-0.10 24.0 ± 0.20
(0.945 +0.012/-0.004) (0.945 ± 0.008)
P0 4.00 ± 0.10 4.00 ± 0.10
(0.157 ± 0.004) (0.157 ± 0.004)
P 16.0 ± 0.10 12.0 ± 0.10
(0.630 ± 0.004) (0.472 ± 0.004)
P2 2.00 ± 0.10 2.00 ± 0.10
(0.079 ± 0.004) (0.079 ± 0.004)
A0 10.2 ± 0.10 7.30 ± 0.10
(0.402 ± 0.004) (0.287 ± 0.004)
B0 9.0 ± 0.10 8.30 ± 0.10
(0.354 ± 0.004) (0.327 ± 0.004)
D 1.5 + 0.10/-0.0 1.5 ± 0.10
(0.059 + 0.004/-0) (0.059 ± 0.004)
F 11.5 ± 0.10 11.5 ± 0.10
(0.453 ± 0.004) (0.453 ± 0.004)
E 1.75 ± 0.10 1.75 ± 0.10
(0.069 ± 0.004) (0.069 ± 0.004)
T max. 0.50 0.50 ± 0.005
(0.020) (0.020 ± 0.002)
T1 max. 0.1 0.1
(0.004) (0.004)
K0 11.0 ± 0.10 8.80 ± 0.10
(0.433 ± 0.004) (0.346 ± 0.004)
CMF-SD Series Tape and Reel Specifi cations
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
DIMENSIONS: MM
(INCHES)
CMF-SD25-2
CMF-SD35-2
CMF-SD50-2
CMF-SD35A-2
CMF-SD50A-2
