Schnelle IR-Lumineszenzdiode (950 nm) im 3 mm Radial-Gehause High-Speed Infrared Emitter (950 nm) in 3 mm Radial Package SFH 4301 Wesentliche Merkmale Features * Hohe Pulsleistung und hoher Gesamtstrahlungsflu e * Sehr kurze Schaltzeiten (10 ns) * Sehr hohe Langzeitstabilitat * Hohe Zuverlassigkeit * * * * Anwendungen Applications * Schnelle Datenubertragung mit Ubertragungsraten bis 100 Mbaud (IR Tastatur, Joystick, Multimedia) * Analoge und digitale Hi-Fi Audio- und Videosignalubertragung * Batteriebetriebene Gerate (geringe Stromaufnahme) * Anwendungen mit hohen Zuverlassigkeits-anspruchen bzw. erhohten Anforderungen * Alarm- und Sicherungssysteme * IR Freiraumubertragung * High data transmission rate up to 100 Mbaud (IR keyboard, Joystick, Multimedia) * Analog and digital Hi-Fi audio and video signal transmission * Low power consumption (battery) equipment * Suitable for professional and high-reliability applications * Alarm and safety equipment * IR free air transmission High pulse power and high radiant flux e Very short switching times (10 ns) Very high long-time stability High reliability Typ Type Bestellnummer Ordering Code Gehause Package SFH 4301 Q62702-P5166 3-mm-LED-Gehause (T1), schwarz eingefarbt, Anschlusse im 2.54-mm-Raster (1/10''), Kathodenkennung: langerer Anschlu 3 mm LED package (T1), black-colored epoxy resin, solder tabs lead spacing 2.54 mm (1/10''), cathode marking: long lead 2001-04-19 1 SFH 4301 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 3 V Durchlastrom Forward current IF (DC) 100 mA Stostrom Surge current tp = 10 s, D = 0 IFSM 2.2 A Verlustleistung Power dissipation Ptot 180 mW Warmewiderstand Sperrschicht - Umgebung, freie Beinchenlange max. 10 mm Thermal resistance junction - ambient, lead length between package bottom and PCB max. 10 mm RthJA 375 K/W 2001-04-19 2 SFH 4301 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength of peak emission IF = 100 mA, tp = 20 ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp = 20 ms 40 nm Abstrahlwinkel Half angle 10 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.3 x 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10% Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 100 mA, tP = 20 ms, RL = 50 t r, t f 10 ns Kapazitat Capacitance VR = 0 V, f = 1 MHz Co 35 pF VF VF 1.5 ( 1.8) 3.2 ( 4.0) V V Sperrstrom Reverse current VR = 3 V IR 0.01 ( 10) A Gesamtstrahlungsflu Total radiant flux IF = 100 mA, tp = 20 ms e 32 mW Temperaturkoeffizient von Ie bzw. e Temperature coefficient of Ie or e IF = 100 mA TCI - 0.44 %/K Durchlaspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2001-04-19 3 SFH 4301 Kennwerte (TA = 25 C) (cont'd) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Temperaturkoeffizient von VF Temperature coefficient of VF IF = 100 mA TCV - 1.5 mV/K Temperaturkoeffizient von Temperature coefficient of IF = 100 mA TC + 0.2 nm/K Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie typ 16 60 mW/sr mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ 400 mW/sr Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel von = 0.01 sr Radiant Intensity Ie in Axial Direction measured at a solid angle of = 0.01 sr Lotbedingungen Soldering Conditions Tauch-, Schwall- und Schlepplotung Dip, Wave and Drag Soldering Lotpadtemperatur Abstand Lotstelle - Gehause Temperatur des Kolbens Maximale zulassige Lotzeit Abstand Lotstelle - Gehause Temperature Max. Perm. of the Soldering Soldering Bath Time Distance between Solder Joint and Case Temperature of the Soldering Iron Max. Permissible Soldering Time Distance between Solder Joint and Case 260 C 1.5 mm 300 C 3s 1.5 mm 2001-04-19 Maximal zulassige Lotzeit Kolbenlotung (mit 1,5-mm-Kolbenspitze) Iron Soldering (with 1.5-mm-bit) 10 s 4 SFH 4301 Radiant Intensity Ie/Ie (100 mA) = f (IF) Single pulse, tp = 20 s Relative Spectral Emission Ierel = f () OHF00777 100 erel Max. Permissible Forward Current IF = f (T A ) OHF00809 10 2 F mA e e (100 mA) 80 OHF00359 120 100 80 60 10 0 40 10 -1 R thJA = 375 K/W 60 40 10 -2 20 0 800 850 900 950 1000 nm 1100 Forward Current IF = f (VF) single pulse, tp = 20 s F 10 -3 10 0 10 1 10 2 0 10 3 mA 10 4 F 0 20 40 60 80 100 C 120 TA Radiation Characteristic Ierel = f () OHF00784 10 4 mA 20 40 30 20 10 0 OHF01016 1.0 10 3 50 0.8 10 2 0.6 10 1 60 10 0 70 10 -1 80 10 -2 90 10 -3 0.4 0.2 0 0.5 1 1.5 2 2.5 3 3.5 V 4.5 0 100 1.0 0.8 0.6 VF Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter IF 101 A 5 OHF00041 t D = TP tP IF T D= 100 5 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 10-1 -5 10 10-4 10-3 10-2 10-1 100 101 s 10 2 tp 2001-04-19 5 0.4 0 20 40 60 80 100 120 SFH 4301 Mazeichnung Package Outlines 5.2 (0.205) 2.54 (0.100) spacing 1.8 (0.071) 1.2 (0.047) 0.7 (0.028) 0.4 (0.016) 0.8 (0.031) 0.4 (0.016) Area not flat 0.6 (0.024) 0.4 (0.016) 4.1 (0.161) 3.9 (0.154) o3.1 (0.122) o2.9 (0.114) 4.5 (0.177) 4.0 (0.157) 3.6 (0.142) (3.5 (0.138)) 6.3 (0.248) 29 (1.142) 27 (1.063) 5.9 (0.232) Chip position Cathode (SFH 409, SFH 4332) Anode (SFH 487, SFH 4301) 0.4 (0.016) GEXY6250 Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2001-04-19 6