TA7745P - TOSHIBA - Product.Network

TA7745P/PG/F/FG

2006-3-2

TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic

TA7745P/PG, TA7745F/FG

3-Phase Full-Wave (Half-Wave) Brushless DC Motor Driver IC

Features

z Three-phase, full-wave (and half-wave) driving

z Voltage control system

z Forward rotation, reverse rotation, and stop can be controlled

using only one pin

z High efficiency is obtained.

z Housed in a flat package (type F/FG only)

z Operating voltage range : VCC = 4.0 to 15 V

VS = 2 to 15 V

z High sensitivity of position sensing inputs, having a hysteresis

: VH = 20 mVp−p (typ.)

z Output current : IO (max) = 1.0 A

z Built-in thermal shutdown circuit

Block Diagram

TA7745P/PG

TA7745F/FG

Weight

DIP16−P−300−2.54A: 1.11 g (typ.)

SSOP16−P−225−1.00A: 0.14 g (typ.)

The TA7745PG/FG is a Pb-free product.

The following conditions apply to solderability:

*Solderability

1. Use of Sn-37Pb solder bath

*solder bath temperature = 230°C

*dipping time = 5 seconds

*number of times = once

*use of R-type flux

2. Use of Sn-3.0Ag-0.5Cu solder bath

*solder bath temperature = 245°C

*dipping time = 5 seconds

*the number of times = once

*use of R-type flux

TA7745P/PG/F/FG

2006-3-2

Pin Function

Pin No. Symbol Functional Description

1 ℓa a−phase Pre−drive stage output terminal

2 Ha+ a−phase Hall Amp. positive input terminal

3 Ha− a−phase Hall Amp. negative input terminal

4 Hb+ b−phase Hall Amp. positive input terminal

5 Hb− b−phase Hall Amp. negative input terminal

6 Hc+ c−phase Hall Amp. positive input terminal

7 Hc− c−phase Hall Amp. negative input terminal

8 CW/CCW Forward rotation/reverse rotation switch terminal

9 VCC Power Supply input terminal

10 Lc c−phase drive output terminal

11 GND GND terminal

12 Lb b−phase drive output terminal

13 GND GND terminal

14 La a−phase drive output terminal

15 ℓc c−phase Pre−drive stage output terminal

16 ℓb b−phase Pre−drive stage output terminal

Function

Position Sensing Input Coil Output

FRS

((8) PIN) Ha Hb Hc La Lb Lc

1 0 1 H L M

1 0 0 H M L

1 1 0 M H L

0 1 0 L H M

0 1 1 L M H

VRVS

0 0 1 M L H

1 0 1 L H M

1 0 0 L M H

1 1 0 M L H

0 1 0 H L M

0 1 1 H M L

VFWD

0 0 1 M H L

1 0 1

1 0 0

1 1 0

0 1 0

0 1 1

VSTOP

0 0 1

High impedance

TA7745P/PG/F/FG

2006-3-2

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

VCC 18 V

Supply voltage

VS 18 V

IO 1.0 A

Output current

Iℓ 20.0 mA

350

TA7745P/PG

550 (Note)

Power dissipation

TA7745F/FG

1200

Operating temperature Topr −30 to 75 °C

Storage temperature Tstg −55 to 150 °C

Note: This rating is obtained by mounting on 20 × 20 × 0.8 mm PCB that occupied above 60% of copper area.

TA7745P/PG/F/FG

2006-3-2

Electrical Characteristics (Unless otherwise specified, Ta = 25°C)

Characteristics Symbol

Test

Cir−

cuit

Test Condition Min Typ. Max Unit

ICC1 VCC = 5 V, Output “OPEN” 0.5 1 3.0

ICC2 VCC = 9 V, Output “OPEN” 0.6 1.3 3.5

Supply current

ICC3

VCC = 12 V, Output “OPEN” 0.7 1.5 5.0

VSL−1 IO = 0.1 A ― 0.12 0.3

La, Lb, Lc Side

VSL−2

IO = 0.5 A ― 0.5 1.0

Saturation

voltage

ℓa, ℓb, ℓc Side VSU I

ℓ = 1.0 mA ― ― 0.2

Sensitivity VH ― 20 ― mV

Position

sensing input Operating DC level CMR−H 1 ― VCC−1.5 V

Diode forward voltage VF I

F = 1 A ― 2.0 ― V

Forward VFWD Source current mode 3.9 ― VCC

Stop VSTOP No current flow (Note) 1.8 ― 2.6

Rotation control

input voltage

Reverse VRVS Sink current mode 0 ― 0.9

Saturation voltage differential

(La, Lb, Lc Side) ∆VS I

O = 200 mA ― ― 50 mV

Leakage current IL V = 18 V ― ― 50 µA

Note: The IC puts the motor in the stop mode even when pin 8 is open.

Applying VFWD to the pin puts the IC in the source mode. Applying VRVS puts the IC in the sink mode.

Applying VSTOP prevents a current flow.

TA7745P/PG TA7745F/FG

TA7745P/PG/F/FG

2006-3-2

Application Circuit 1

(3 phase Bi−Pola drive)

Io ≈ )

BE2

V+

BE1

(

R·

≈ (K1·VIN) + K2

(K1, K2 = CONSTANT)

Application Circuit 2

(3 phase UNI−Pola drive)

TA7745P/PG/F/FG

2006-3-2

Application Circuit 3

(high efficiency drive (UNI−Pola))

Application Circuit 4

(high efficiency drive (Bi−Pola))

(Note)

Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed

by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by

short-circuiting between contiguous pins.

TA7745P/PG/F/FG

2006-3-2

Package Dimensions

Weight: 1.11 g (typ.)

TA7745P/PG/F/FG

2006-3-2

Package Dimensions

Weight: 0.14 g (typ.)

TA7745P/PG/F/FG

2006-3-2

Notes on Contents

1. Block Diagrams

Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified

for explanatory purposes.

2. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for

explanatory purposes.

3. Timing Charts

Timing charts may be simplified for explanatory purposes.

4. Application Circuits

The application circuits shown in this document are provided for reference purposes only. Thorough

evaluation is required, especially at the mass production design stage.

Toshiba does not grant any license to any industrial property rights by providing these examples of

application circuits.

5. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerations

Notes on handling of ICs

[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load, causing a large current to continuously flow and the

breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case

of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,

are required.

[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into

the design to prevent device malfunction or breakdown caused by the current resulting from the

inrush current at power ON or the negative current resulting from the back electromotive force at

power OFF. IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is

unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause

injury, smoke or ignition.

[4] Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation

or incorrectly even just one time.

TA7745P/PG/F/FG

2006-3-2

Points to remember on handling of ICs

(1) Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal

shutdown circuits operate against the over temperature, clear the heat generation status

immediately.

Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings

can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.

(2) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the

device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ)

at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat

radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.

In addition, please design the device taking into considerate the effect of IC heat radiation with

peripheral components.

(3) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s

power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the

device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid

this problem, take the effect of back-EMF into consideration in system design.

TA7745P/PG/F/FG

2006-3-2