1
FEATURES
3
2
1
4
5
IN
VCC
VDD
OUT
TPS2816, TPS2817
TPS2818, TPS2819
DBV PACKAGE
(TOP VIEW)
GND
3
2
1
4
5
IN
VCC
NC
OUT
DBV PACKAGE
(TOP VIEW)
GND
TPS2828, TPS2829
NC − No internal connection
DESCRIPTION/ORDERING INFORMATION
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008www.ti.com
SINGLE-CHANNEL HIGH-SPEED MOSFET DRIVER
•Controlled Baseline– One Assembly Site– One Test Site– One Fabrication Site•Extended Temperature Performance of – 55 °Cto 125 °C•Enhanced Diminishing Manufacturing Sources(DMS) Support•Enhanced Product-Change Notification•Qualification Pedigree
(1)
•Low-Cost Single-Channel High-Speed MOSFETDriver
•I
CC
...15 µA Max (TPS2828, TPS2829)•25 ns Max Rise/Fall Times and 40 ns MaxPropagation Delay . . . 1 nF Load•2 A Peak Output Current•4 V to 14 V Driver Supply Voltage Range;Internal Regulator Extends Range to 40 V(TPS2816, TPS2817, TPS2818, TPS2819)•5-pin SOT-23 Package•– 55 °C to 125 °C Ambient-Temperature
Operating Range•Highly Resistant to Latch-ups(1) Component qualification in accordance with JEDEC andindustry standards to ensure reliable operation over anextended temperature range. This includes, but is not limitedto, Highly Accelerated Stress Test (HAST) or biased 85/85,temperature cycle, autoclave or unbiased HAST,electromigration, bond intermetallic life, and mold compoundlife. Such qualification testing should not be viewed asjustifying use of this component beyond specifiedperformance and environmental limits.
The TPS28xx single-channel high-speed MOSFET drivers are capable of delivering peak currents of up to 2 Ainto highly capacitive loads. High switching speeds (t
r
and t
f
= 14 ns typ) are obtained with the use of BiCMOSoutputs. Typical threshold switching voltages are 2/3 and 1/3 of V
CC
. The design inherently minimizesshoot-through current.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2008, Texas Instruments IncorporatedPRODUCTION DATA information current as of publication date.Products conform to specifications per the terms of TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
A regulator is provided on TPS2816 through TPS2819 devices to allow operation with supply inputs between14 V and 40 V. The regulator output can be used to power other circuits, provided power dissipation does notexceed package limitations. If the regulator is not required, V
DD
(the regulator input) should be connected to V
CC
.The TPS2816 and TPS2817 input circuits include an active pullup circuit to eliminate the need for an externalresistor when using open-collector PWM controllers. The TPS2818 and TPS2819 are identical to the TPS2816and TPS2817, except that the active pullup circuit is omitted. The TPS2828 and TPS2829 are identical to theTPS2818 and TPS2819, except that the internal voltage regulator is omitted, allowing quiescent current to dropto less than 15 µA when the inputs are high or low.
The TPS28xx series devices are available in 5-pin SOT-23 (DBV) packages and operate over an ambienttemperature range of – 55 °C to 125 °C.
AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
CHIP FORMT
A
FUNCTION SYMBOL PACKAGE ORDER(Y)SOT-23-5 (DBV)
(2) (3)
Inverting driver with active
TPS2816DBV
(4)
TBD TPS2816Y TPS2816MDBVREPpullup inputNoninverting driver with active
TPS2817DBV
(4)
TBD TPS2817Y TPS2817MDBVREPpullup input– 55 °C to
Inverting driver TPS2818DBV PMTM TPS2818Y TPS2818MDBVREP125 °C
Noninverting driver TPS2819DBV PMUM TPS2819Y TPS2819MDBVREPInverting driver, no regulator TPS2828DBV
(4)
TBD TPS2828Y TPS2828MDBVREPNoninverting driver, no
TPS2829DBV
(4)
TBD TPS2829Y TPS2829MDBVREPregulator
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(3) The DBV package is available taped and reeled only.(4) Product Preview
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FUNCTIONAL BLOCK DIAGRAM
VREG
VDD
IN
GND
VCC
OUT
TPS2816, TPS2818
Active Pullup
(TPS2816 Only)
VREG
VDD
IN
GND
VCC
OUT
TPS2817, TPS2819
Active Pullup
(TPS2817 Only)
IN
GND
OUT
TPS2828
IN
GND
OUT
TPS2829
VCC VCC
INPUT STAGE DIAGRAM
To Drive
Stage
IN
VCC
OUTPUT STAGE DIAGRAM
VCC
OUT
Predrive
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
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TPS28xxY Chip Information
39
39
TPS2816Y
(4)
(2)
(3)
(5)
(1)
OUT
GND
IN
VCC
VDD†
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJ max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
(4)
(2)
(3) (1)
(5)
†TPS2816 through TPS2819 only
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermalcompression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may bemounted with conductive epoxy or a gold-silicon preform.
TERMINAL FUNCTIONSTPS2816, TPS2818, TPS2828 (Inverting Driver)
TERMINAL
DESCRIPTIONNAME NO.
V
DD
1 Regulator supply voltage input. (Not connected on TPS2828)GND 2 GroundIN 3 Driver input.OUT 4 Driver output, OUT = INV
CC
5 Driver supply voltage/regulator output voltage
TERMINAL FUNCTIONSTPS2817, TPS2819, TPS2829 (Noninverting Driver)
TERMINAL
DESCRIPTIONNAME NO.
V
DD
1 Regulator supply voltage input. (Not connected on TPS2829)GND 2 GroundIN 3 Driver input.OUT 4 Driver output, OUT = INV
CC
5 Driver supply voltage/regulator output voltage
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DISSIPATION RATING TABLE
(1)
ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
T
A
≤25 °C DERATING FACTOR T
A
= 70 °C T
A
= 80 °CPACKAGE
POWER RATING ABOVE T
A
= 25 °C POWER RATING POWER RATING
DBV 437 mW 3.5 mW/ °C 280 mW 227 mW
(1) These dissipation ratings are based upon EIA specification JESD51-3, "Low Effective Thermal Conductivity Test Board for LeadedSurface Mount Packages," in tests conducted in a zero-airflow, wind tunnel environment.
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
CC
Supply voltage range
(2)
– 0.3 to 15 VV
DD
Regulator supply voltage range
(2)
V
CC
– 0.3 to 42 VIN Input voltage range
(2)
– 0.3 to V
CC
+ 0.5 VOutput voltage range (pin 4)
(2)
– 0.5 to V
CC
+ 0.5 VV
CC
Continuous regulator output current 25 mAOUT Continuous output current ± 100 mAContinuous total power dissipation See Dissipation Rating TableT
A
Operating ambient temperature range – 55 to 125 °CT
stg
Storage temperature range – 65 to 150 °CLead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to device GND terminal.
MIN MAX UNIT
V
DD
Regulator input voltage range, TPS2816 through TPS2819 8 40 VV
CC
Supply voltage 4 14 VIN Input voltage – 0.3 V
CC
VI
CC
Continuous regulator output current 0 20 mAT
A
Operating ambient temperature range – 55 125 °C
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TPS28xx ELECTRICAL CHARACTERISTICS
Outputs
Regulator, TPS2816 Through TPS2819
Supply Current
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Inputs
over recommended operating ambient temperature range, V
CC
= 10 V, V
DD
tied to V
CC
, C
L
= 1 nF (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
V
CC
= 5 V 3.3 4Positive-going input threshold voltage V
CC
= 10 V 6.6 7 VV
CC
= 14 V 9.3 10V
CC
= 5 V 1 1.7Negative-going input threshold voltage V
CC
= 10 V 2 3.3 VV
CC
= 14 V 2.5 4.6Input voltage hysteresis 1.3 VInput current, TPS2818/19/28/29 Input = 0 V or V
CC
0.2 µAInput = 0 V 650Input current, TPS2816/17 µAInput = V
CC
15Input capacitance 5 10 pF
(1) Typical are for T
A
= 25 °C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
I
O
= – 1 mA 9.75 9.9High-level output voltage VI
O
= – 100 mA 8 9.1I
O
= 1 mA 0.18 0.25Low-level output voltage VI
O
= 100 mA 1 2
(1) Typical are for T
A
= 25 °C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
14 ≤V
DD
≤40 V,Output voltage 10 11.5 13 V0≤I
O
≤20 mAI
O
= 10 mA,Output voltage in dropout 8 10 VV
DD
= 10 V
(1) Typical are for T
A
= 25 °C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
IN = high = 10 V 150 250TPS2816,
TPS2817
IN = low = 0 V 650 1000TPS2818,Supply current into V
CC
µA25 55TPS2819
IN = high or low,High = 10 V, Low = 0 VTPS2828,
0.1 15TPS2829
TPS2816, V
DD
= 20 V,
650 1000TPS2817 IN = high = 10 V or low = 0 VSupply current into V
DD
µATPS2818, V
DD
= 20 V,
50 400TPS2819 IN = high = 10 V or low = 0 V
(1) Typical are for T
A
= 25 °C (unless otherwise noted).
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TPS28xxY ELECTRICAL CHARACTERISTICS
Outputs
Regulator, TPS2816 Through TPS2819
Supply Current
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Inputs
over recommended operating ambient temperature range, V
CC
= 10 V, V
DD
tied to V
CC
, C
L
= 1 nF (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
V
CC
= 5 V 3.3Positive-going input threshold voltage V
CC
= 10 V 6.6 VV
CC
= 14 V 9.3V
CC
= 5 V 1.7Negative-going input threshold voltage V
CC
= 10 V 3.3 VV
CC
= 14 V 4.6Input voltage hysteresis 1.3 VInput current, TPS2818/19/28/29 Input = 0 V or V
CC
0.2 µAInput = 0 V 650Input current, TPS2816/17 µAInput = V
CC
15Input resistance 1000 M Ω
Input capacitance 5 pF
(1) Typical are for T
A
= 25 °C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
I
O
= – 1 mA 9.9High-level output voltage VI
O
= – 100 mA 9.1I
O
= 1 mA 0.18Low-level output voltage VI
O
= 100 mA 1
(1) Typical are for T
A
= 25 °C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
14 ≤V
DD
≤40 V,Output voltage 11.5 V0≤I
O
≤20 mAI
O
= 10 mA,Output voltage in dropout 9 VV
DD
= 10 V
(1) Typical are for T
A
= 25 °C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
IN = high = 10 V 150TPS2816,
TPS2817
IN = low = 0 V 650TPS2818,Supply current into V
CC
µA25TPS2819
IN = high or low,High = 10 V, Low = 0 VTPS2828,
0.1TPS2829
TPS2816, V
DD
= 20 V,
650TPS2817 IN = high = 10 V or low = 0 VSupply current into V
DD
µATPS2818, V
DD
= 20 V,
50TPS2819 IN = high = 10 V or low = 0 V
(1) Typical are for T
A
= 25 °C (unless otherwise noted).
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SWITCHING CHARACTERISTICS
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
for all devices over recommended operating ambient temperature range, V
CC
= 10 V, V
DD
tied to V
CC
, C
L
= 1 nF(unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
CC
= 14 V 25t
r
Rise time V
CC
= 10 V 14 30 nsV
CC
= 5 V 35V
CC
= 14 V 25t
f
Fall time V
CC
= 10 V 14 30 nsV
CC
= 5 V 35V
CC
= 14 V 40t
PHL
Propagation delay time, high-to-low-level output V
CC
= 10 V 24 45 nsV
CC
= 5 V 50V
CC
= 14 V 40t
PLH
Propagation delay time, low-to-high-level output V
CC
= 10 V 24 45 nsV
CC
= 5 V 50
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PARAMETER MEASUREMENT INFORMATION
50% 90%
IN
OUT
50% 50%
90%
10% 50% 10%
tPLH
tr
tf
tPHL
0 V
0 V
Regulator
50 Ω
0.1 µF
4.7 µF
+10 V
1 nF
1
2
3
5
4
Input Output
TPS2816
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Figure 1. Typical Timing Diagram (TPS2816)
Figure 2. Switching Time Test Setup
Figure 3. Shoot-Through Current Test Setup
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TYPICAL CHARACTERISTICS
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Table of Graphs
FIGURE
Rise time vs Supply voltage 4Fall time vs Supply voltage 5Propagation time (L > H) vs Supply voltage 6Propagation Time (H > L) vs Supply voltage 7Rise time vs Ambient temperature 8Fall time vs Ambient temperature 9Propagation time (L > H) vs Supply voltage 10Propagation time (H > L) vs Ambient temperature 11Supply current (V
CC
) vs Supply voltage 12Supply current (V
CC
) vs Load capacitance 13Supply current (V
CC
) vs Ambient temperature 14Input threshold voltage vs Supply voltage 15Regulator output voltage vs Regulator supply voltage 16Regulator quiescent current vs Regulator supply voltage 17Shoot-through current vs Input voltage (L > H) 18Shoot-through current vs Input voltage (H > L) 19
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20
10
5
04 6 8 10
25
30
35
12 14
− Rise Time − ns
RISE TIME
vs
SUPPLY VOLTAGE
tr
VCC − Supply V oltage − V
15
TA = 25°C
CL = 2200 pF
CL = 1000 pF
CL = 0
15
10
5
04 6 8 10
20
25
30
12 14
− Fall Time − ns
FALL TIME
vs
SUPPLY VOLTAGE
tf
VCC − Supply V oltage − V
TA = 25°C
CL = 2200 pF
CL = 1000 pF
CL = 0
20
15
5
04 6 8 10
25
35
40
12 14
Propagation Delay T ime,
PROPAGATION DELAY TIME,
LOW-TO-HIGH-LEVEL OUTPUT
vs
SUPPLY VOLTAGE
VCC − Supply V oltage − V
t −
PLH
Low-To-High-Level Output − ns
30
10
TA = 25°C
CL = 2200 pF
CL = 1000 pF
CL = 0
20
15
5
04 6 8 10
25
35
40
12 14
TA = 25°C
CL = 2200 pF
CL = 1000 pF
CL = 0
Propagation Delay T ime,
PROPAGATION DELAY TIME,
HIGH-TO-LOW-LEVEL OUTPUT
vs
SUPPLY VOLTAGE
VCC − Supply V oltage − V
t −
PHL
High-To-Low-Level Output − ns
30
10
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Figure 4. Figure 5.
Figure 6. Figure 7.
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16
15
14
13
−50 −25 0 25 50
− Rise Time − ns
17
18
RISE TIME
vs
AMBIENT TEMPERATURE
19
75 100 125
Ambient Temperature − °C
VCC = 10 V
Load = 1000 pF
f = 100 kHz
tr
15
13
12
10
−50 −25 0 25 50
17
18
20
75 100 125
− Fall Time − ns
FALL TIME
vs
AMBIENT TEMPERATURE
Ambient Temperature − °C
VCC = 10 V
Load = 1000 pF
f = 100 kHz
tf
19
16
14
11
Propagation Delay Time,
PROPAGATION DELAY TIME,
HIGH-TO-LOW-LEVEL OUTPUT
vs
AMBIENT TEMPERATURE
t −
PHL
High-To-Low-Level Output − ns
15
14
12
10
−50 −25 0 25 50
17
19
20
75 100 125
VCC = 10 V
Load = 1000 pF
f = 100 kHz
TA − Ambient Temperature − °C
18
16
13
11
16
15
14
13
−50 −25 0 25 50
17
18
19
75 100 125
VCC = 10 V
Load = 1000 pF
f = 100 kHz
Propagation Delay T ime,
PROPAGATION DELAY TIME,
LOW-TO-HIGH-LEVEL OUTPUT
vs
SUPPLY VOLTAGE
t −
PLH
Low-To-High-Level Output − ns
TA − Ambient Temperature − °C
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Figure 8. Figure 9.
Figure 10. Figure 11.
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VCC − Supply V oltage − V
Load = 1000 pF
Duty Cycle = 50%
f = 1 MHz
f = 500 kHz
f = 100 kHz
f = 40 kHz
8
6
2
04 6 8 10
− Supply Current − mA
12
14
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
16
12 14
ICC
10
4
2
1.5
1
00 1000
3
3.5
SUPPLY CURRENT
vs
LOAD CAPACITANCE
4
2000
2.5
0.5
− Supply Current − mAICC
CL − Load Capacitance − pF
VCC = 10 V
f = 100 kHz
Duty Cycle = 50%
2
1.5
1
−50 −25 0 25 50
2.5
3
75 100 125
VCC = 10 V
Load = 1000 pF
f = 100 kHz
Duty Cycle = 50%
SUPPLY CURRENT
vs
AMBIENT TEMPERATURE
− Supply Current − mAICC
TA − Ambient Temperature − °C
4
3
2
04 6 8 10
− Input Threshold Voltage−V
7
8
INPUT THRESHOLD VOLTAGE
vs
SUPPLY VOLTAGE
9
12 14
VCC − Supply V oltage − V
5
6
1
Positive Going
Negative Going
VIT
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Figure 12. Figure 13.
Figure 14. Figure 15.
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8
7
5
4 8 12 16 20 24
Regulator Output Voltage − V
10
11
REGULATOR OUTPUT VOLTAGE
vs
REGULATOR SUPPLY VOLTAGE
12
28 32 36 40
9
6
4
Load = 10 kΩ
VDD − Regulator Supply V oltage − V
645
640
630
620 4 8 12 16 20 24
Regulator Quiescent Current −
655
665
REGULATOR QUIESCENT CURRENT
vs
REGULATOR SUPPLY VOLTAGE
670
28 32 36 40
660
650
635
625
TPS2816,17 only
No Load
Aµ
VDD − Regulator Supply V oltage − V
VCC = 10 V
No Load
TA = 25°C
4
3
2
00 2 4 6
Shoot-Through Current − mA
5
6
SHOOT-THROUGH CURRENT
vs
INPUT VOLTAGE LOW-TO-HIGH
7
8 10
1
VI − Input Voltage − V
4
3
2
00 2 4 6
5
6
7
8 10
Shoot-Through Current − mA
SHOOT-THROUGH CURRENT
vs
INPUT VOLTAGE HIGH-TO-LOW
VI − Input Voltage − V
1
VCC = 10 V
No Load
TA = 25°C
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Figure 16. Figure 17.
Figure 18. Figure 19.
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APPLICATION INFORMATION
Regulator
0.1 µF
1
2
3
5
4
Input
TPS2816 VCC
Load
Regulator
4.7 µF
1
2
3
5
4
Input
TPS2816
VDD
Load
0.1 µF+
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
MOSFETs are voltage-driven devices that require very little steady-state drive current. However, the large inputcapacitance (200 pF to 3000 pF or greater) of these devices requires large current surges to reduce the turn-onand turn-off times. The TPS2816 series of high-speed drivers can supply up to 2 A to a MOSFET, greatlyreducing the switching times. The fast rise times and fall times and short propagation delays allow for operationin today's high-frequency switching converters.
In addition, MOSFETs have a limited gate-bias voltage range, usually less than 20 V. The TPS2816 series ofdrivers extends this operating range by incorporating an on-board series regulator with an input range up to 40 V.This regulator can be used to power the drivers, the PWM chip, and other circuitry, providing the powerdissipation rating is not exceeded.
When using these devices, care should be exercised in the proper placement of the driver, the switchingMOSFET, and the bypass capacitor. Because of the large input capacitance of the MOSFET, the driver shouldbe placed close to the gate to eliminate the possibility of oscillations caused by trace inductance ringing with thegate capacitance of the MOSFET. When the driver output path is longer than approximately 2 inches, a resistorin the range of 10 Ωshould be placed in series with the gate drive as close as possible to the MOSFET. Aceramic bypass capacitor is also recommended to provide a source for the high-speed current transients that theMOSFET requires. This capacitor should be placed between V
CC
and GND of the driver (see Figure 20 andFigure 21 ).
Figure 20. V
CC
< 14 V
Figure 21. V
CC
> 14 V
The on-board series regulator supplies approximately 20 mA of current at 11.5 V, some of which can be used for
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): TPS2816-EP TPS2817-EP TPS2818-EP TPS2819-EP TPS2828-EP TPS2829-EP
www.ti.com
Regulator
1
2
3
5
4
34 VDC
TPS2816
0.1 µF
PWM
Controller
0.1 µF4.7 µF
VCC
Out
GND
0.1 µF
10 µF
VO
+
2.5-V/3.3-V, 3-A Application
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
external circuitry, providing the power dissipation rating for the driver is not exceeded. When using the on-boardseries regulator, an electrolytic output capacitor of 4.7 µF or larger is recommended. Although not required, a0.1 µF ceramic capacitor on the input of the regulator can help suppress transient currents (see Figure 22 ).When not used, the regulator should be connected to V
CC
. Grounding V
DD
will result in destruction of theregulator.
Figure 22. Boost Application
The TPS2816 and TPS2818 drivers include active pullup circuits on the inputs to eliminate the need for externalpullup resistors when using controllers with open-collector outputs (such as the TL5001). The TPS2817 andTPS2819 drivers have standard CMOS inputs providing a total device operating current of less than 50 µA. Alldevices switch at standard CMOS logic levels of approximately 2/3 V
CC
with positive-going input levels, andapproximately 1/3 V
CC
with negative-going input levels. Being CMOS drivers, these devices will draw relativelylarge amounts of current (Approximately 5 mA) when the inputs are in the range of one-half of the supplyvoltage. In normal operation, the driver input is in this range for a very short time. Care should be taken to avoiduse of very low slew-rate inputs, used under normal operating conditions. Although not destructive to the device,slew rates slower than 0.1 V/ µs are not recommended.
The BiCMOS output stage provides high instantaneous drive current to rapidly toggle the power switch, and verylow drop to each rail to ensure proper operation at voltage extremes.
Low-voltage circuits (less than 14 V) that require very low quiescent currents can use the TPS2828 andTPS2829 drivers. These drivers use typically 0.2 µA of quiescent current (with inputs high or low). They do nothave the internal regulator or the active pullup circuit, but all other specifications are the same as for the rest ofthe family.
Figure 23 illustrates the use of the TPS2817 with a TL5001 PWM controller and a TPS1110 in a simplestep-down converter application. The converter operates at 275 kHz and delivers either 2.5 V or 3.3 V(determined by the value of R6) at 3 A (5 A peak) from a 5-V supply. The bill of materials is provided in Table 1 .
16 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPS2816-EP TPS2817-EP TPS2818-EP TPS2819-EP TPS2828-EP TPS2829-EP
www.ti.com
Regulator
1
2
3
5
4
U1
TPS2817DBV
C8C7
CR1 C9 C10
L1
+
C12
+
C13
R4
C11 R7
R6
+C6
51
OUT SCP
8
74
R3
36
2
C3C2
R2
C4
C9
+
Q1
TPS1110D
DTC COMP FB RT
VCC GND
U2
TL5001CD
4.5 V to 7 V
GND
VO
3 A Continuous
5 A Peak
GND
R1
R5
C5
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Figure 23. Step-Down Application
NOTE:
If the parasitics of the external circuit cause the voltage to violate the AbsoluteMaximum Rating for the Output pins, Schottky diodes should be added from ground tooutput and from output to V
CC
.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): TPS2816-EP TPS2817-EP TPS2818-EP TPS2819-EP TPS2828-EP TPS2829-EP
www.ti.com
2 V/div
2 V/div
12.5 ns/div
Q1 Gate
Q1 Drain
2 V/div
2 V/div
12.5 ns/div
Q1 Drain
Q1 Gate
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
Table 1. Bill of Materials
REF DES PART NO. DESCRIPTION MFR
U1 TPS2817DBV IC, MOSFET driver, single noninverting TIU2 TL5001CD IC, PWM controller TIQ1 TPS1110D MOSFET, p-channel, 6 A, 7 V, 75 m ΩTIC1, C2, C5, C8 Capacitor, ceramic, 0.1 µF, 50 V, X7R, 1206C3 Capacitor, ceramic, 0.033 µF, 50 V, X7R, 1206C4 Capacitor, ceramic, 2200 pF, 50 V, X7R, 0805C6 ECS-T1CY105R Capacitor, tantalum, 1.0 µF, 16 V, A case PanasonicC7 10SC47M Capacitor, OS-Con, 47 µF, 10 V SanyoC9 Capacitor, ceramic, 1000 pF, 50 V, X7R, 0805C10, C12 10SA220M Capacitor, OS-Con, 220 µF, 10 V SanyoC11 Capacitor, ceramic, 0.022 µF, 50 V, X7R, 0805C13 Capacitor, ceramic, 47 µF, 50 V, X7RCR1 50WQ03F Diode, Schottky, D-pak, 5 A 30 V IRL1 SML3723 Inductor, 27 µH, ± 20%, 3 A Nova MagneticsR1 Resistor, CF, 47 k Ω, 1/10 W, 5%, 0805R2 Resistor, CF, 1.5 k Ω, 1/10 W, 5%, 0805R3 Resistor, MF, 30.1 k Ω, 1/10 W, 1%, 0805R4 Resistor, MF, 1.00 k Ω, 1/10 W, 1%, 0805R5 Resistor, CF, 47 Ω, 1/10 W, 5%, 0805R6 (3.3-V) Resistor, MF, 2.32 k Ω, 1/10 W, 1%, 0805R6 (2.5-V) Resistor, MF, 1.50 k Ω, 1/10 W, 1%, 0805R7 Resistor, CF, 100 Ω, 1/10 W, 5%, 0805
As shown in Figure 24 and Figure 25 , the TPS2817 turns on the TPS1110 power switch in less than 20 ns andoff in 25 ns.
Figure 24. Q1 Turn-On Waveform Figure 25. Q1 Turn-Off Waveform
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Product Folder Link(s): TPS2816-EP TPS2817-EP TPS2818-EP TPS2819-EP TPS2828-EP TPS2829-EP
www.ti.com
80
75
70 0 0.5 1 1.5 2 2.5 3
Efficiency − %
85
90
Load Current − A
95
3.5 4 4.5 5
VO = 3.3 V
VO = 2.5 V
VI = 5.25 V
TA = 25°C
TPS2816-EP , TPS2817-EP , TPS2818-EPTPS2819-EP , TPS2828-EP , TPS2829-EP
SGDS039 – FEBRUARY 2008
The efficiency for various output currents, with a 5.25-V input, is shown in Figure 26 . For a 3.3-V output, theefficiency is greater than 90% for loads up to 2 A – exceptional for a simple, inexpensive design.
Figure 26. Converter Efficiency
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): TPS2816-EP TPS2817-EP TPS2818-EP TPS2819-EP TPS2828-EP TPS2829-EP
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPS2818MDBVREP ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2818MDBVREPG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2819MDBVREP ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2819MDBVREPG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
V62/08601-03XE ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
V62/08601-04XE ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS2816-EP, TPS2817-EP, TPS2818-EP, TPS2819-EP, TPS2828-EP, TPS2829-EP :
•Catalog: TPS2816,TPS2817,TPS2818,TPS2819,TPS2828,TPS2829
•Automotive: TPS2829-Q1
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 17-Sep-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS2818MDBVREP SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS2819MDBVREP SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS2818MDBVREP SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS2819MDBVREP SOT-23 DBV 5 3000 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
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