1
2
notice_e-01
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called “TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’ s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to “Foreign Exchange and For-
eign Trade Control Law” of Japan, “U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
126
1
2
mlci07_e-01
■ FEATURES
■ ORDERING CODE
■ EXTERNAL DIMENSIONS/STANDARD QUANTITY
■ APPLICATIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
❼Internal code
△Standard Products
△＝Blank Space
❷External Dimensions
（L×W）〔mm〕
0402（01005）0.4×0.2
0603（0201）0.6×0.3
1005（0402）1.0×0.5
1608（0603）1.6×0.8
2125（0805）2.0×1.25
❹Impedance 〔Ω〕
example
150 15
101 100
102 1000
❺Characteristics
ーStandard Products
❶Type
BK Multilayer Chip
Bead Inductor
BKHMultilayer Chip
Bead Inductor
B K 1 6 0 8 H S 1 2 1 －T○
❶ ❷ ❸ ❹ ❺ ❻ ❼
❻Packaging
T Tape & Reel
❸Material
HW
Refer to impedance
curves for material
differences
HS
HR
HM
LM
LL
TS
◦ Internal silver printed layer creates a closed circuit which acts as a
magnetic shield minimizing heat generation and crosstalk.
◦ No need for grounding provides greater circuit design flexibility.
◦ Several material types and a broad range of impedance values pro-
vide noise countermeasures for various applications.
HS ： With low R-XL cross point frequency characteristics and large
resistance part working as damping function, suppresses un-
necessary resonance and keeps signal integrity.
HW ： With a lower R-XL cross point frequency characteristics than
those of HS, strongly suppresses unnecessary resonance.
TS ： Low DC resistance HS version. For power supply lines .
HM ： Resistance part rising exceeding from 20MHz. For general us-
age, especially effective for video signal lines.
HR ： Resistance part rising exceeding from 10MHz. For general us-
age, Wider effective range than that of HM.
LM ： With larger impedance set at around 200MHz considering for
noise regulation.
LL ： Resistance part steeply rising exceeding from 100MHz. For high
speed signal line, good for clock line, sharply cutting noise off.
◦ The small case size lineup with 01005 inch size.
◦High frequency noise countermeasure in personal computers, digital
cameras and other information system products. For use on digital
product clock lines and general signal lines.
◦Radiated noise suppression in computer or printer interfaces and har-
ness connectors.
◦Noise suppression in video and other AV products.
◦Prevents interference between circuits in cellular phones（PHS, PDC,
etc.）
◦Due to the closed internal circuit which acts as a magnetic shield, the
TS material is extremely effective as a noise filter on LSI power supply
lines where downsizing of components is needed.
MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)
REFLOWWAVE＊
Type L W T e Standard Quantity ［pcs］
Paper Tape Embossed Tape
BK0402
（01005）
0.40±0.02
（0.016±0.001）
0.20±0.02
（0.008±0.001）
0.20±0.02
（0.008±0.001）
0.10＋0.04
ー0.03
（0.004＋0.002
ー0.001 ）20000 ー
BK0603
（0201）
0.60±0.03
（0.024±0.001）
0.30±0.03
（0.012±0.001）
0.30±0.03
（0.012±0.001）
0.15±0.05
（0.006±0.002）15000 ー
BK1005
（0402）
1.00±0.05
（0.039±0.002）
0.50±0.05
（0.020±0.002）
0.50±0.05
（0.020±0.002）
0.25±0.10
（0.010±0.004）10000 ー
BKH1005
（0402）
1.00±0.05
（0.039±0.002）
0.50±0.05
（0.020±0.002）
0.50±0.05
（0.020±0.002）
0.25±0.10
（0.010±0.004）10000 ー
BK1608
（0603）
1.6±0.15
（0.063±0.006）
0.8±0.15
（0.031±0.006）
0.8±0.15
（0.031±0.006）
0.3±0.2
（0.012±0.008）4000 ー
BK2125
（0805）
2.0＋0.3
ー0.1
（0.079＋0.012
ー0.004 ）
1.25±0.2
（0.049±0.008）
0.85±0.2
（0.033±0.008）0.5±0.3
（0.020±0.012）
4000 ー
1.25±0.2
（0.049±0.008）ー2000
Unit：mm（inch）
＊Except for BK0402, BK0603, BK1005, BKH1005
■ OPERATING TEMP.
◦－55～125℃
127
1
2
mlci07_e-01
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
■ AVAILABLE MATERIALS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
I max=100～200mA
1
6
7
2
3
45
1000
800
600
400
200
0
Frequency [MHz]
IZI
100 100001000101
1 LL121
2 LL800
3 LL560
4 LL470
5 LL330
6 LL220
7 LL100
I max=100～200mAI max=150～500mA
800
500
600
700
400
300
200
100
0100 100001000101
Frequency [MHz]
IZI
1 HS601
2 HS241
3 HS121
4 HS800
5 HS330
6 HS220
1
2
34
5
6
Frequency [MHz]
IZI
100 1000 10000101
12
3
45
1 HM601
2 HM471
3 HM241
4 HM121
5 HM600
1000
900
800
700
600
500
400
300
200
100
0
HS
HS
HS
HS
HW
HW
HW
HW
I max=300～600mA
I max=300mA I max=200mA
I max=300～1500mA
HM
HM
HM
HM
HM
I max=200～350mA I max=250～500mA
I max=150～200mA
1 LL241
2 LL181
3 LL121
4 LL680
5 LL560
6 LL470
7 LL300
2000
1000
0
1
3
45
2
6
7
LM
LM
LM
LM
I max=200～300mA
TS
TS
TS
I max=300～400mA
HS
HS
HS
HS
HS
HM
HM
HM
HM
HM
LM
LM
LM
LM
LL
LL
LL
I max=300～1200mA I max=400～800mA I max=300～600mA I max=200～400mA
I max=150～350mA
1600
1400
1200
1000
800
600
400
200
HM
HM
HM
HM
HM
HM7506
6
I max=300～1000mA
I max=250～600mA I max=120mA
1 HS102
2 HS601
3 HS431
4 HS241
5 HS121
6 HS680
7 HS800
8 HS330
9 HS100
1
0
1200
1000
800
600
400
200
2
3
4
5
8
87
7
9
9
6
6
2500
2000
1500
1000
500
0
1 LL241
2 LL181
3 LL121
4 LL680
5 LL470
6 LL330
7 LL220
8 LL100
2
3
45678
1
0
2500
2000
1500
1000
500
1 LM182
1
I max=300～500mA
I max=240～540mA I max=220～260mA
700
500
300
HW
HW
HW
HW
HW
200
180
160
140
120
100
80
60
40
20
0
1 121
2 700
3 100
300
250
200
150
100
50
0
1 121
2 750
0
800
600
400
200
1 HR601
1
3000
2500
2000
1500
1000
500
0
1
2
1 LM182
2 LM152
■
BK0603
■
BK1005
■
BK0402
■
BK1608
■
BK2125
HS type HM type
LL type HW type
HS type HM type
HS type HM type
LL type LM type HR type
HW type HS type HM type LL type
LL type LM type TS type
HS type HM type LL type LM type
BKH type
128
1
2
mlci07_e-01
■ PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Ordering code
EHS（
Environmental
Hazardous
Substances
）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔Ω〕 （max.）
Rated current
〔mA〕 （max.）
Thickness
〔mm〕 （inch）
BK 10 05 HW 680 RoHS 68±25％
100
0.17 500
0.50±0.05
（0.020±0.002）
BK 10 05 HW 121 RoHS 120±25％0.24 450
BK 10 05 HW 241 RoHS 240±25％0.31 400
BK 10 05 HW 431 RoHS 430±25％0.50 350
BK 10 05 HW 601 RoHS 600±25％0.60 300
BK 10 05 HS 100 RoHS 10±5 0.03 1000
BK 10 05 HS 330 RoHS 33±25％0.06 700
BK 10 05 HS 680 RoHS 68±25％0.10 700
BK 10 05 HS 800 RoHS 80±25％0.10 700
BK 10 05 HS 121 RoHS 120±25％0.20 500
BK 10 05 HS 241 RoHS 240±25％0.30 400
BK 10 05 HS 431 RoHS 430±25％0.45 350
BK 10 05 HS 601 RoHS 600±25％0.55 300
BK 10 05 HS 102 RoHS 1000±25％0.58 300
BK 10 05 HR 601 RoHS 600±25％0.60 300
BK 10 05 HM 750 RoHS 75±25％0.18 350
BK 10 05 HM 121 RoHS 120±25％0.18 300
BK 10 05 HM 241 RoHS 240±25％0.30 300
BK 10 05 HM 471 RoHS 470±25％0.45 250
BK 10 05 HM 601 RoHS 600±25％0.50 250
BK 10 05 HM 102 RoHS 1000±25％0.70 150
BK 10 05 LL 100 RoHS 10±25％0.11 500
BK 10 05 LL 220 RoHS 22±25％0.18 400
BK 10 05 LL 330 RoHS 33±25％0.25 400
BK 10 05 LL 470 RoHS 47±25％0.33 350
BK 10 05 LL 680 RoHS 68±25％0.31 400
BK 10 05 LL 121 RoHS 120±25％0.45 350
BK 10 05 LL 181 RoHS 180±25％0.50 300
BK 10 05 LL 241 RoHS 240±25％0.70 250
BK 10 05 LM 182 RoHS 1800±25％0.90 120
BKH 1005 LM 152 RoHS 1500±25％1.50 200
BKH 1005 LM 182 RoHS 1800±25％2.00 200
●BK1005
Ordering code
EHS（
Environmental
Hazardous
Substances
）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔Ω〕 （max.）
Rated current
〔mA〕 （max.）
Thickness
〔mm〕 （inch）
BK 0603 HS 220 RoHS 22±25％
100
0.065 500
0.30±0.03
（0.012±0.001）
BK 0603 HS 330 RoHS 33±25％0.070 500
BK 0603 HS 80 0 RoHS 80±25％0.40 200
BK 0603 HS 121 RoHS 120±25％0.45 200
BK 0603 HS 241 RoHS 240±25％0.65 200
BK 0603 HS 601 RoHS 600±25％1.20 150
BK 0603 HM 600 RoHS 60±25％0.25 200
BK 0603 HM 121 RoHS 120±25％0.40 200
BK 0603 HM 241 RoHS 240±25％0.80 200
BK 0603 HM 471 RoHS 470±25％1.05 100
BK 0603 HM 601 RoHS 600±25％1.20 100
BK 0603 LL 100 RoHS 10±25％0.25 200
BK 0603 LL 220 RoHS 22±25％0.45 200
BK 0603 LL 330 RoHS 33±25％0.55 150
BK 0603 LL 470 RoHS 47±25％0.70 150
BK 0603 LL 560 RoHS 56±25％1.00 100
BK 0603 LL 800 RoHS 80±25％1.30 100
BK 0603 LL 121 RoHS 120±25％1.50 100
Ordering code
EHS（
Environmental
Hazardous
Substances
）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔Ω〕 （max.）
Rated current
〔mA〕 （max.）
Thickness
〔mm〕 （inch）
BK 0402 HS 100 RoHS 10±5
100
0.10 540
0.20±0.02
（0.008±0.001）
BK 0402 HS 700 RoHS 70±25％0.37 280
BK 0402 HS 121 RoHS 120±25％0.53 240
BK 0402 HM 750 RoHS 75±25％0.45 260
BK 0402 HM 121 RoHS 120±25％0.60 220
●BK0603
●BK0402
129
1
2
mlci07_e-01
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
■ PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Ordering code
EHS（
Environmental
Hazardous
Substances
）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔Ω〕 （max.）
Rated current
〔mA〕 （max.）
Thickness
〔mm〕 （inch）
BK 1608 HW 121 RoHS 120±25％
100
0.15 600
0.80±0.15
（0.031±0.006）
BK 1608 HW 241 RoHS 240±25％0.25 450
BK 1608 HW 431 RoHS 430±25％0.30 400
BK 1608 HW 601 RoHS 600±25％0.40 300
BK 1608 HS 220 RoHS 22±25％0.05 1500
BK 1608 HS 330 RoHS 33±25％0.08 1200
BK 1608 HS 470 RoHS 47±25％0.10 900
BK 1608 HS 600 RoHS 60±25％0.10 800
BK 1608 HS 800 RoHS 80±25％0.10 600
BK 1608 HS 121 RoHS 120±25％0.18 500
BK 1608 HS 241 RoHS 240±25％0.25 400
BK 1608 HS 601 RoHS 600±25％0.45 350
BK 1608 HS 102 RoHS 1000±25％0.60 300
BK 1608 HM 121 RoHS 120±25％0.20 350
BK 1608 HM 241 RoHS 240±25％0.35 300
BK 1608 HM 471 RoHS 470±25％0.45 250
BK 1608 HM 601 RoHS 600±25％0.60 250
BK 1608 HM 102 RoHS 1000±25％0.70 200
BK 1608 LL 300 RoHS 30±25％0.20 500
BK 1608 LL 470 RoHS 47±25％0.30 400
BK 1608 LL 560 RoHS 56±25％0.30 400
BK 1608 LL 680 RoHS 68±25％0.35 300
BK 1608 LL 121 RoHS 120±25％0.50 300
BK 1608 LL 181 RoHS 180±25％0.65 250
BK 1608 LL 241 RoHS 240±25％0.80 250
BK 1608 LL 331 RoHS 330±25％0.85 200
BK 1608 LL 431 RoHS 430±25％0.85 200
BK 1608 LL 511 RoHS 510±25％0.90 200
BK 1608 LL 681 RoHS 680±25％1.00 150
BK 1608 LM 751 RoHS 750±25％0.60 300
BK 1608 LM 152 RoHS 1500±25％0.75 250
BK 1608 LM 182 RoHS 1800±25％0.85 200
BK 1608 LM 252 RoHS 2500±25％1.10 200
BK 1608 TS 431 RoHS 430±25％0.21±30% 400
BK 1608 TS 601 RoHS 600±25％0.27±30% 350
BK 1608 TS 102 RoHS 1000±25％0.30±30% 300
Ordering code
EHS（Environmental
Hazardous
Substances）
Impedance
〔Ω〕
Measuring
frequency
〔MHz〕
DC resistance
〔Ω〕 （max.）
Rated current
〔mA〕 （max.）
Thickness
〔mm〕 （inch）
BK 2125 HS 150 RoHS 15±25％
100
0.05 1200
0.85±0.2
（0.033±0.008）
BK 2125 HS 220 RoHS 22±25％0.05 1200
BK 2125 HS 330 RoHS 33±25％0.05 1200
BK 2125 HS 470 RoHS 47±25％0.05 1000
BK 2125 HS 750 RoHS 75±25％0.10 1000
BK 2125 HS 101 RoHS 100±25％0.10 900
BK 2125 HS 121 RoHS 120±25％0.15 800
BK 2125 HS 241 RoHS 240±25％0.20 600
BK 2125 HS 431 RoHS 430±25％0.25 500
BK 2125 HS 6 01 RoHS 600±25％0.30 500
BK 2125 HS 102 RoHS 1000±25％0.40 300
BK 2125 HM 121 RoHS 120±25％0.15 800
BK 2125 HM 241 RoHS 240±25％0.20 600
BK 2125 HM 471 RoHS 470±25％0.25 500
BK 2125 HM 601 RoHS 600±25％0.25 500
BK 2125 HM 102 RoHS 1000±25％0.35 400
BK 2125 LL 560 RoHS 56±25％0.20 600
BK 2125 LL 121 RoHS 120±25％0.30 400
BK 2125 LL 241 RoHS 240±25％0.35 300
BK 2125 LM 751 RoHS 750±25％0.30 400
BK 2125 LM 152 RoHS 1500±25％0.35 400
BK 2125 LM 182 RoHS 1800±25％0.45 300 1.25±0.2
（0.049±0.008）
BK 2125 LM 252 RoHS 2500±25％0.75 200
●BK1608
●BK2125
130
1
2
mlci07_e-01
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
250
200
150
100
50
0100 100001000101
Frequency [MHz]
BK0402 HS121
Impedance［Ω］
Ｚ
Ｒ
Ｘ
BK0402 HÇl750
㻓
㻘㻓
㻔㻓㻓
㻔㻘㻓
㻕㻓㻓
㻕㻘㻓
㻖㻓㻓
㻔㻔㻓 㻔㻓㻓 㻔㻓㻓㻓 㻔㻓㻓㻓
㻓
㻩㼕㼈㼔㼘㼈㼑㼆㼜㻃㻃㻾㻰㻫㼝㼀
Ç
y
Çq
Ç
w
300
250
200
150
100
50
0100 100001000101
Frequency [MHz]
BK0402 HM750
Impedance［Ω］
Ｚ
Ｒ
Ｘ
300
250
200
150
100
50
0100 100001000101
Frequency [MHz]
BK0402 HM121
Impedance［Ω］
Ｚ
Ｒ
Ｘ
100
80
60
40
20
0100 100001000101
Frequency [MHz]
BK0402 HS100
Impedance［Ω］
Ｚ
Ｒ
Ｘ
250
200
150
100
50
0100 100001000101
Frequency [MHz]
BK0402 HS700
Impedance［Ω］
ＺＲ
Ｘ
■
BK0402
R
X
Z
100 100001000101
250
200
150
100
50
100
80
60
40
20
0100 100001000101
Frequency [MHz]
BK0603 HS220
Impedance［Ω］
Ｚ
Ｒ
Ｘ
BK0603 HS330
100
80
60
40
20
100101 1000 10000
Frequency ［MHz］
Impedance［Ω］
R
X
0
Z
R
X
Z
100 100001000101
250
200
150
100
50
■
BK0603
100 100001000101
250
200
150
100
50
100 100001000101
250
200
150
100
50
100 100001000101
BK0603 HS601
1000
800
600
400
200
0
Frequency ［MHz］
Impedance［Ω］
100 100001000101
Z
R
X
BK0603 LL220
Frequency ［MHz］
Impedance［Ω］
250
200
150
100
50
0100 100001000101
ZＲ
Ｘ
BK0603 LL100
Frequency ［MHz］
Impedance［Ω］
250
200
150
100
50
0100 100001000101
Z
R
X
BK0603 HM241
500
400
300
200
100
0
Frequency ［MHz］
Impedance［Ω］
100 100001000101
Z
X
R
BK0603 HM471
Frequency ［MHz］
Impedance［Ω］
1000
800
600
400
200
0
100 100001000101
Z
R
Ｘ
BK0603 HM601
Impedance[ ]
1000
800
600
400
200
0
Z
R
Ｘ
BK0603 LL330
Frequency ［MHz］
Impedance［Ω］
500
400
300
200
100
0100 100001000101
X
Z
Ｒ
BK0603 LL470
500
400
300
200
100
0100101 1000 10000
Frequency ［MHz］
Impedance［Ω］
R
X
Z
BK0603 LL560
500
400
300
200
100
0100101 1000 10000
Frequency ［MHz］
Impedance［Ω］
Z
R
X
BK0603 LL800
1000
800
600
400
200
0100101 1000 10000
Frequency ［MHz］
Impedance［Ω］
Z
R
X
BK0603 LL121
1000
800
600
400
200
0100101 1000 10000
Frequency ［MHz］
Impedance［Ω］
ZＲ
Ｘ
BK1005 HW680
Frequency ［MHz］
Impedance［Ω］
250
200
150
100
50
0100101 1000 10000
R
X
Z
■
BK1005
131
1
2
mlci07_e-01
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
BK1005 HW121
250
200
150
100
50
0
Frequency ［MHz］
Impedance［Ω］
100101 1000 10000
Ｚ
Ｒ
Ｘ
BK1005 HW241
500
400
300
200
100
0
Frequency ［MHz］
Impedance［Ω］
100101 1000 10000
R
X
Z
BK1005 HW431
1000
800
600
400
200
0
Frequency ［MHz］
Impedance［Ω］
100101 1000 10000
R
X
Z
BK1005 HW601
1000
800
600
400
200
0
Frequency ［MHz］
Impedance［Ω］
100101 1000 10000
R
X
Z
BK1005 HS100
100
80
60
40
20
0
Frequency ［MHz］
Impedance［Ω］
100101 1000 10000
RX
Z
BK1005 HS330
100
80
60
40
20
0
Impedance［Ω］
100101 1000 10000
R
X
Z
BK1005 HS680
250
200
150
100
50
0
Frequency ［MHz］
Impedance［Ω］
100 100001000101
X
Z
Ｒ
250
200
150
100
50
0
BK1005 HS800
250
200
150
100
50
0
Frequency ［MHz］
Impedance［Ω］
100101 1000 10000
R
X
Z
BK1005 HS431
1000
800
600
400
200
0100101 100001000
Frequency ［MHz］
Impedance［Ω］
RR
X
Z
Z
RR
X
Z
Z
BK1005 HS102
2000
1000
01000100101 10000
Frequency ［MHz］
Impedance［Ω］
BK1005 HR601
1000
800
600
400
200
0
BK1005 HM750
200
150
100
50
0
2000
1000
0
110 1000100 10000
BK1005 HM102
250
150
200
100
50
0
110 100 1000 10000
BK1005 LL100
250
200
150
100
50
0
110 100 1000 10000
BK1005 LL220
500
400
300
200
100
0
110 100 1000 10000
BK1005 LL330
BK1005 HM121
250
200
150
100
50
0100 1000101 10000
Frequency ［MHz］
Impedance［Ω］
RR
X
Z
500
100
200
300
400
110 100 1000 10000
0
500
400
300
200
100
0
110 100 1000 10000
BK1005 LL470
132
1
2
mlci07_e-01
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
2500
2000
1500
1000
500
0
110 100 100001000
BK1005 LM182
RR
X
Z
Z
BKH1005 LM152
Impedance[ ]
3000
2500
2000
1500
1000
500
0
Z
R
X
BKH1005 LM182
Impedance[ ]
3000
2500
2000
1500
1000
500
0
Z
R
X
■
BK1608
500
400
300
200
100
0
110 100 1000 10000
BK1005 LL680
133
1
2
mlci07_e-01
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
500
250
0
110 100 1000 10000
BK1608 LL300
500
250
0
110 100 1000 10000
BK1608 LL470
500
250
0
110 100 1000 10000
BK1608 LL560
500
250
0
110 100 1000 10000
BK1608 LL680
1500
750
0
110 100 1000
BK1608 LL121
2000
4000
■
BK2125
134
1
2
mlci07_e-01
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
R
Z
X
1000100101
0
500
1000
R
Z
1000100101
0
500
1000
X
135
1
2
mlci07_e-01
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1
2
mlci0109_reli-PRP1 mlci0109_reli_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Tape & Reel Packaging
①Minimum Quantity ②Taping material
◦Paper tape (0.315 inches wide)
③Taping Dimensions
Unit : mm （inch）
To next page
C K 2125
C K S 2125
C K P 2012
C K P 2016
C K P 25 2 0
N M 20 12
N M 252 0
L K 2125
H K 2125
B K 2125
B K 3216
Type
Thickness
〔mm〕
（inch）
Chip cavity Insertion
Pitch
Tape
Thickness
A B F T
CK1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
CK2125（0805）0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
CKS2125（0805）
0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
LK1005（0402）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
LK1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
LK2125（0805）0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
HK0402（01005）0.2
（0.008）
0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36ｍａｘ
（0.014max）
HK0603（0201）0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
HK1005（0402）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
HK1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
HKQ0603S（0201）
0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
HKQ0603U（0201）
0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
AQ105（0402）0.5
（0.020）
0.75±0.1
（0.030±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
Type Thickness
［mm］ （inch）
Standard Quantity ［pcs］
Paper Tape Embossed Tape
CK1608（0603）0.8 4000 ー
（0.031）
CK2125（0805）
0.85 4000 ー
（0.033）
1.25 ー2000
（0.049）
CKS2125（0805）
0.85 4000 ー
（0.033）
1.25 ー2000
（0.049）
CKP2012（0805）0.9 ー3000
（0.035）
CKP2016（0806）0.9 ー3000
（0.035）
CKP2520（1008）
0.7 ー3000
（0.028）
0.9 ー3000
（0.035）
1.1 ー2000
（0.043）
NM2012（0805）0.9 ー3000
（0.035）
NM2520（1008）1.1 ー2000
（0.043）
LK1005（0402）0.5 10000 ー
（0.020）
LK1608（0603）0.8 4000 ー
（0.031）
LK2125（0805）
0.85 4000 ー
（0.033）
1.25 ー2000
（0.049）
HK0402（01005）0.2 20000 ー
（0.008）
HK0603（0201）0.3 15000 ー
（0.012）
HK1005（0402）0.5 10000 ー
（0.020）
HK1608（0603）0.8 4000 ー
（0.031）
HK2125（0805）
0.85 ー4000
（0.033）
1.0 ー3000
（0.039）
HKQ0603S（0201）0.3 15000 ー
（0.012）
HKQ0603U（0201）0.3 15000 ー
（0.012）
AQ105（0402）0.5 10000 ー
（0.020）
BK0402（01005）0.2 20000 ー
（0.008）
BK0603（0201）0.3 15000 ー
（0.012）
BK1005（0402）0.5 10000 ー
（0.020）
BKH1005（0402）0.5 10000 ー
（0.020）
BK1608（0603）0.8 4000 ー
（0.031）
BK2125（0805）
0.85 4000 ー
（0.033）
1.25 ー2000
（0.049）
BK2010（0804）0.45 4000 ー
（0.018）
BK3216（1206）0.8 ー4000
（0.031）
BKP0603（0201）0.3 15000 ー
（0.012）
BKP1005（0402）0.5 10000 ー
（0.020）
BKP1608（0603）0.8 4000 ー
（0.031）
BKP2125（0805）0.85 4000 ー
（0.033）
C K 16 0 8
C K 2 125
C K S 2125
L K 10 0 5
L K 16 0 8
L K 2 125
H K 04 0 2
H K 06 0 3
H K 10 0 5
H K 16 0 8
H K Q 0 6 0 3
A Q 10 5
B K 04 0 2
B K 06 0 3
B K 10 0 5
B K 16 0 8
B K 2 125
B K 2 010
B K P 0 6 0 3
B K P 10 0 5
B K P 16 0 8
B K P 2125
B K H 10 0 5
1
2
mlci0109_reli-PRP2
mlci0109_reli_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Unit : mm （inch）
◦Embossed Tape (0.315 inches wide)
④LEADER AND BLANK PORTION
160mm or more
（
6.3inches or more
）
Direction of tape feed
100mm or more
（3.94inches or more）
400mm ore more
（15.7inches or more）
⑤Reel Size
2.0±0.5
（0.079±0.031）
φ13.0±0.2
（φ0.512±0.020）
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as
illustrated below.
Type
Thickness
〔mm〕
（inch）
Chip cavity Insertion
Pitch
Tape
Thickness
A B F T
BK0402（01005）0.2
（0.008）
0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36ｍａｘ
（0.014max）
BK0603（0201）0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
BK1005（0402）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
BK1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
BK2125（0805）0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
BK2010（0804）0.45
（0.018）
1.2±0.1
（0.047±0.004）
2.17±0.1
（0.085±0.004）
4.0±0.1
（0.157±0.004）
0.8ｍａｘ
（0.031max）
BKP0603（0201）0.3
（0.012）
0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45ｍａｘ
（0.018max）
BKP1005（0402）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
BKP1608（0603）0.8
（0.031）
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
BKP2125（0805）0.85
（0.033）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1ｍａｘ
（0.043max）
BKH1005（0805）0.5
（0.020）
0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8ｍａｘ
（0.031max）
Unit : mm （inch）
Type
Thickness
〔mm〕
（inch）
Chip cavity Insertion
Pitch
Tape
Thickness
A B F K T
CK2125（0805）
1.25
（0.049）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
CKS2125（0805）
1.25
（0.049）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
CKP2012（0805）
0.9
（0.035）
1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.3
（0.012）
CKP2016（0806）
0.9
（0.035）
1.8±0.1
（0.071±0.004）
2.2±0.1
（0.087±0.004）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.25
（0.01）
CKP2520（1008）
0.7
（0.028）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055）
0.3
（0.012）
0.9
（0.035）
1.4
（0.055）
1.1
（0.043）
1.7
（0.067）
NM2012（0805）
0.9
（0.035）
1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.3
（0.012）
NM2520（1008）
1.1
（0.043）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.7
（0.067）
0.3
（0.012）
LK2125（0805）
1.25
（0.049）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
HK2125（0805）
0.85
（0.033）1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5
（0.059）0.3
（0.012）
1.0
（0.039）
2.0
（0.079）
BK2125（0805）
1.25
（0.049）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
BK3216（1206）
0.8
（0.031）
1.9±0.1
（0.075±0.004）
3.5±0.1
（0.138±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055）
0.3
（0.012）
1
2
mlci0109_reli-PRP3 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
1. Operating Temperature Range
BK0402
－55～＋125℃
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
－55～＋85℃
BKP1005
BKP1608
BKP2125
CK1608
－40～＋85℃
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
－55～＋125℃HK0603
HK1005
HK1608 －40～＋85℃
HK2125
HKQ0603S
－55～＋125℃HKQ0603U
AQ105
2. Storage Temperature Range
BK0402
－55～＋125℃
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
－55～＋85℃
BKP1005
BKP1608
BKP2125
CK1608
－40～＋85℃
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
－55～＋125℃HK0603
HK1005
HK1608 －40～＋85℃
HK2125
HKQ0603S
－55～＋125℃HKQ0603U
AQ105
1
2
mlci0109_reli-PRP4
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
3. Rated Current
BK0402 240～540mA DC
BK0603 100～500mA ＤＣ
BK1005 120～1000mA ＤＣ
BKH1005 200mA ＤＣ
BK1608 150～1500mA ＤＣ
BK2125 200～1200mA ＤＣ
ARRAY BK2010 100mA ＤＣ
BK3216 100～200mA ＤＣ
BKP0603 1.0A ＤＣ
BKP1005 800～2000mA DC
BKP1608 1.0～3.0A ＤＣ
BKP2125 1.5～4.0A ＤＣ
CK1608 50～60mA DC
CK2125 60～500mA DC
CKS2125 110～280mA DC
CKP2012 0.7～1.2A DC
CKP2016 0.9～1.6A DC
CKP2520 1.1～1.8A DC
NM2012 0.8～1.5A DC
NM2520 0.9～1.1A DC
LK1005 20～25mA DC
LK1608 1～150mA DC
LK2125 5～300mA DC
HK0402 160～380mA DC
HK0603 60～470mA DC
HK1005 110～300mA DC
HK1608 150～300mA DC
HK2125 300mA DC
HKQ0603S 130～600mA DC
HKQ0603U 130～600mA DC
AQ105 280～710mA DC
Definition of rated current：
・In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20℃.
・In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within 40℃.
・In the LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current
at which the temperature of the element is increased within 20℃.
4. Impedance
BK0402 10～120Ω ±25%
BK0603 10～600Ω ±25%
BK1005 10～1800Ω ±25%
BKH1005 1500～1800Ω ±25%
BK1608 22～2500Ω ±25%
BK2125 15～2500Ω ±25%
ARRAY BK2010 5～1000Ω ±25%
BK3216 68～1000Ω ±25%
BKP0603 22～33Ω ±25%
BKP1005 10～220Ω ±25%
BKP1608 33～470Ω ±25%
BKP2125 33～330Ω ±25%
CK1608
——
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
BK0402 Series
Measuring frequency：100±1MHz
Measuring equipment：E4991A（or its equivalent）
Measuring jig：16196D（or its equivalent）
BK0603 Series, BKP0603 Series
Measuring frequency：100±1MHz
Measuring equipment：4291A（or its equivalent）
Measuring jig：16193A（or its equivalent）
BK1005 Series, BKP1005 Series, BKH1005 Series
Measuring frequency：100±1MHz
Measuring equipment：4291A（or its equivalent）
Measuring jig：16192A（or its equivalent）, 16193A（or its equivalent）
BK1608・2125 Series, BKP1608・2125 Series
Measuring frequency：100±1MHz
Measuring equipment：4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig：16092A（or its equivalent） or 16192A（or its equivalent）/HW
BK2010・3216 Series
Measuring frequency：100±1MHz
Measuring equipment：4291A（or its equivalent） , 4195A（or its equivalent）
Measuring jig：16192A（or its equivalent）
1
2
mlci0109_reli-PRP5 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
5. Inductance
BK0402
——
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 4.7～10.0μH：±20%
CK2125 0.1～10.0μH：±20%
CKS2125 1.0～10.0μH：±20%
CKP2012 0.47～4.7μH：±20%
CKP2016 0.47～4.7μH：±20%
CKP2520 0.47～4.7μH：±20%
NM2012 0.82～1.0μH：±20%
NM2520 1.0～2.2μH：±20%
LK1005 0.12～2.2μH：±10% Q 0.12～2.2μH：±30%
LK1608 0.047～33.0μH：±20% 0.10～12.0μH：±10% Q 0.12～2.2μH：±30%
LK2125 0.047～33.0μH：±20% 0.10～12.0μH：±10% Q 0.12～2.2μH：±30%
HK0402 1.0～6.2nH：±0.3nH 6.8～12nH：±5%
HK0603 1.0～6.2nH：±0.3nH 6.8～100nH：±5%
HK1005 1.0～6.2nH：±0.3nH 6.8～270nH：±5%
HK1608 1.0～5.6nH：±0.3nH 6.8～470nH：±5%
HK2125 1.5～5.6nH：±0.3nH 6.8～470nH：±5%
HKQ0603S 0.6～6.2nH：±0.3nH 6.8～22nH：±5%
HKQ0603U 0.6～6.2nH：±0.3nH 6.8～22nH：±5%
AQ105 1.0～6.2nH：±0.3nH 6.8～15nH：±5%
【Test Methods and Remarks】
CK Series：
Measuring frequency：2 to 4MHz （CK1608）
Measuring frequency：2 to 25MHz （CK2125）
Measuring frequency：2 to 10MHz （CKS2125）
LK Series：
Measuring frequency：10 to 25MHz （LK1005）
Measuring frequency：1 to 50MHz （LK1608）
Measuring frequency：0.4 to 50MHz （LK2125）
CKP Series, NM Series：
Measuring frequency：1MHz（CKP2012, CKP2016, CKP2520, NM2012・NM2520）
Measuring equipment, jig：・4194A＋16085B＋16092A（or its equivalent）
・4195A＋41951＋16092A（or its equivalent）
・4294A＋16192A（or its equivalent）
・4291A＋16193A（or its equivalent）/LK1005
・4285A＋42841A＋42842C＋42851－61100（CKP2012・CKP2016・CKP2520・NM2012・NM2520）
Measuring current：・1mA rms（0.047 to 4.7μH） ・0.1mA rms（5.6 to 33μH）
HK、HKQ、AQ Series：
Measuring frequency：100MHz（HK0402・HK0603・HK1005・AQ105）
Measuring frequency：50/100MHz（HK1608・HK2125）
Measuring frequency：500MHz（HKQ0603S・HKQ0603U）
Measuring equipment, jig：・4291A＋16197A（or its equivalent）/HK0603・AQ105
・4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S・HKQ0603U
・4291A＋16092＋in-house made jig（or its equivalent）/HK1608・HK2125
・E4991A＋16196D（or its equivalent）/HK0402
1
2
mlci0109_reli-PRP6
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
6. Q
BK0402
——
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 20 min.
CK2125 15～20 min.
CKS2125
——
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 10～20 min.
LK1608 10～35 min.
LK2125 15～50 min.
HK0402 3 min.
HK0603 4～5 min.
HK1005 8 min.
HK1608 8～12 min.
HK2125 10～18 min.
HKQ0603S 10～13 min.
HKQ0603U 10～13 min.
AQ105 8 min.
7. DC Resistance
BK0402 0.10～0.53Ω max.
BK0603 0.065～1.50Ω max.
BK1005 0.03～0.80Ω max.
BKH1005 1.50～2.00Ω max.
BK1608 0.05～1.10Ω max.
BK2125 0.05～0.75Ω max.
ARRAY BK2010 0.10～0.90Ω max.
BK3216 0.15～0.80Ω max.
BKP0603 0.065～0.070Ω max.
BKP1005 0.030～0.20Ω max.
BKP1608 0.025～0.18Ω max.
BKP2125 0.020～0.075Ω max.
CK1608 0.45～0.85Ω （±30%）
CK2125 0.16～0.65Ω max.
CKS2125 0.09～0.40Ω typ.
0.12～0.52Ω max.
CKP2012 0.10～0.28Ω max.
CKP2016 0.08～0.20Ω max.
CKP2520 0.05～0.16Ω max.
NM2012 0.10～0.19Ω max.
NM2520 0.13～0.22Ω max.
LK1005 0.41～1.16Ω max.
LK1608 0.2～2.2Ω max.
LK2125 0.1～1.1Ω max.
HK0402 0.18～0.99Ω max.
HK0603 0.11～3.74Ω max.
HK1005 0.08～4.8Ω max.
HK1608 0.05～2.6Ω max.
HK2125 0.10～1.5Ω max.
HKQ0603S 0.06～1.29Ω max.
HKQ0603U 0.06～1.29Ω max.
AQ105 0.07～0.45Ω max.
【Test Methods and Remarks】
Measuring equipment：VOAC-7412（made by Iwasaki Tsushinki） VOAC-7512（made by Iwasaki Tsushinki）
【Test Methods and Remarks】
CK Series：
Measuring frequency：2 to 4MHz（CK1608）
Measuring frequency：2 to 25MHz（CK2125）
LK Series：
Measuring frequency：10 to 25MHz（LK1005）
Measuring frequency：1 to 50MHz（LK1608）
Measuring frequency：0.4 to 50MHz（LK2125）
Measuring equipment, jig：・4194A＋16085B＋16092A（or its equivalent）
・4195A＋41951＋16092A（or its equivalent）
・4294A＋16192A（or its equivalent）
・4291A＋16193A（or its equivalent）/LK1005
Measuring current：・1mA rms（0.047 to 4.7μH） ・0.1mA rms（5.6 to 33μH）
HK、HKQ、AQ Series：
Measuring frequency：100MHz（HK0603・HK1005・AQ105）
Measuring frequency：50/100MHz（HK1608・HK2125）
Measuring frequency：500MHz（HKQ0603S
・
HKQ0603U）
Measuring equipment, jig：
・4291A＋16197A（or its equivalent）/HK0603・AQ105
・4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S
・
HKQ0603U
・4291A＋16092A＋ in-house made jig（or its
equivalent）/HK1608・HK2125
・E4991A＋16196D（or its equivalent）HK0402
1
2
mlci0109_reli-PRP7 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
8. Self Resonance Frequency（SRF）
BK0402
——
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 17～25MHz min.
CK2125 24～235MHz min.
CKS2125
——
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 40～180MHz min.
LK1608 9～260MHz min.
LK2125 13～320MHz min.
HK0402 29000～10000MHz min.
HK0603 900～10000MHz min.
HK1005 400～10000MHz min.
HK1608 300～10000MHz min.
HK2125 200～4000MHz min.
HKQ0603S 1900～10000MHｚ min.
HKQ0603U 1900～10000MHｚ min.
AQ105 2300～10000MHz min.
【Test Methods and Remarks】
LK Series：
Measuring equipment：4195A（or its equivalent）
Measuring jig：41951＋16092A（or its equivalent）
HK、HKQ、AQ Series：
Measuring equipment：8719C（or its equivalent）・8753D（or its equivalent）/HK2125
9. Temperature Characteristic
BK0402
——
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
Inductance change：Within ±10％
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
HK、HKQ、AQ Series：Temperature range：－30 to ＋85℃
Reference temperature：＋20℃
1
2
mlci0109_reli-PRP8
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
10. Resistance to Flexure of Substrate
BK0402
No mechanical damage.
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
Warp：2mm（BK Series without 0402size, BKP
, BKH, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series）
：1mm（BK0402, HK0402 Series）
Testing board：glass epoxy-resin substrate
Thickness：0.8mm
11. Solderability
BK0402
At least 75％ of terminal electrode is covered by new solder.
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
At least 75％ of terminal electrode is covered by new solder.
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
Solder temperature：230±5℃
Duration：4±1 sec.
1
2
mlci0109_reli-PRP9 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
12. Resistance to Soldering
BK0402
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change
R10～4R7 ： Within ±10％
6R8～100 ： Within ±15％
CKS2125 ： Within ±20％
CKP2012、CKP2016、CKP2520、NM2012、NM2520：Within ±30％
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage. Remaining terminal electrode：70％ min. Inductance change：Within ±15％
LK1608 No mechanical damage.
Remaining terminal electrode：70％ min. Inductance change 47N～4R7：Within ±10％ 5R6～330：Within ±15％
LK2125
HK0402
No mechanical damage.
Remaining terminal electrode：70％ min. Inductance change：Within ±5％
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
Solder temperature：260±5℃
Duration：10±0.5 sec.
Preheating temperature：150 to 180℃
Preheating time：3 min.
Flux：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
13. Thermal Shock
BK0402
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change：Within ±20％ Q change：Within ±30％
Inductance change：Within ±20％（CKS2125）
CK2125
CKS2125
CKP2012
No mechanical damage. Inductance change：Within ±30％
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change：Within ±10％ Q change：Within ±30％
LK1608
LK2125
HK0402
No mechanical damage.
Inductance change：Within ±10％ Q change：Within ±20％
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
Conditions for 1 cycle
Step 1：Minimum operating temperature
＋0
－3℃ 30±3 min.
Step 2：Room temperature 2 to 3 min.
Step 3：Maximum operating temperature
＋3
－0℃ 30±3 min.
Step 4：Room temperature 2 to 3 min.
Number of cycles：5
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning mesurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
1
2
mlci0109_reli-PRP10
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
14. Damp Heat （Steady state）
BK0402
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change：Within ±20％ Q change：Within ±30％
CK2125
CKS2125 Inductance change：Within ±20％
CKP2012
No mechanical damage. Inductance change：Within ±30％
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change：Within ±10％ Q change：Within ±30％
LK1608
LK2125 No mechanical damage. Inductance change：Within ±20％ Q change：Within ±30％
HK0402
No mechanical damage.
Inductance change：Within ±10％ Q change：Within ±20％
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
BK, BKP, BKH Series：
Temperature：40±2℃
Humidity：90 to 95％RH
Duration：500＋24
－0hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ Series：
Temperature：40±2℃（LK、CK、CKS、CKP、NM Series）
：60±2℃（HK、HKQ、AQ Series）
Humidity：90 to 95％RH
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
1
2
mlci0109_reli-PRP11 mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
15. Loading under Damp Heat
BK0402
Appearance：No significant abnormality.
Impedance change：Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change：Within ±20％ Q change：Within ±30％
CK2125
CKS2125 No mechanical damage. Inductance change：Within ±20％
CKP2012
No mechanical damage. Inductance change：Within ±30％
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage. Inductance change：Within ±10％ Q change：Within ±30％
LK1608 No mechanical damage.
Inductance change：0.047 to 12.0μH：Within ±10％ 15.0 to 33.0μH：Within ±15％ Q change：Within ±30％
LK2125 No mechanical damage. Inductance change：Within ±20％ Q change：Within ±30％
HK0402
No mechanical damage.
Inductance change：Within ±10％ Q change：Within ±20％
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
BK, BKP, BKH Series：
Temperature：40±2℃
Humidity：90 to 95％RH
Applied current：Rated current
Duration：500＋24
－0hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ Series：
Temperature：40±2℃（LK、CK、CKS、CKP、NM Series）
：60±2℃（HK、HKQ、AQ Series）
Humidity：90 to 95％RH
Applied current：Rated current
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
1
2
mlci0109_reli-PRP12
mlci0109_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
16. Loading at High Temperature
BK0402
Appearance：No significant abnormality
Impedance change：Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change：Within ±20％ Q change：Within ±30％
CK2125
CKS2125 No mechanical damage. Inductance change：Within ±20％
CKP2012
No mechanical damage. Inductance change：Within ±30％
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage. Inductance change：Within ±10％ Q change：Within ±30％
LK1608 No mechanical damage.
Inductance change：0.047 to 12.0μH：Within ±10％ 15.0 to 33.0μH：Within ±15％ Q change：Within ±30％
LK2125 No mechanical damage. Inductance change：Within ±20％ Q change：Within ±30％
HK0402
No mechanical damage.
Inductance change：Within ±10％ Q change：Within ±20％
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
BK, BKH Series：
Temperature：125±3℃
Applied current：Rated current
Duration：500＋24
－0hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ、BKP Series：
Temperature：85±2℃（LK、CK、CKS、CKP、NM、BKP Series）
：85±2℃（HK1608，2125）
：85±2℃（HK1005, AQ105 operating temperature range －55 to ＋85℃）
：125±2℃（HK0402, HK0603, HK1005, HKQ0603S, HKQ0603U, AQ105 operating temperature range －55 to ＋125℃）
Applied current：Rated current
Duration：500±12 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless other-
wise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
1
2
mlci0109_reli-PRP13 mlci0109_reli_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from
components used in general purpose applications.
◆Operating Current （Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
Precautions
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when
designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of
solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated
by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns
smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized ［breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting,
board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.）For this reason, planning pattern
configurations and the position of SMD inductors should be carefully performed to minimize stress.
Technical
consider-
ations
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets which extend above
the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Recommended land dimensions for wave-soldering
Recommended land dimensions for reflow-soldering
Type 1608 2125 3216
Size
L 1.6 2.0 3.2
W 0.8 1.25 1.6
A 0.8～1.0 1.0～1.4 1.8～2.5
B 0.5～0.8 0.8～1.5 0.8～1.7
C 0.6～0.8 0.9～1.2 1.2～1.6
（Unit：mm）
Type 0402 0603 1005 105 1608 2012 2125 2016 3216 2520
Size
L 0.4 0.6 1.0 1.0 1.6 2.0 2.0 2.0 3.2 2.5
W 0.2 0.3 0.5 0.6 0.8 1.25 1.25 1.6 1.6 2.0
A
0.15～0.25 0.20～0.30 0.45～0.55 0.50～0.55
0.8～1.0 0.8～1.2 0.8～1.2 0.8～1.2 1.8～2.5 1.0～1.4
B
0.10～0.20 0.20～0.30 0.40～0.50 0.30～0.40
0.6～0.8 0.8～1.2 0.8～1.2 0.8～1.2 0.6～1.5 0.6～1.0
C
0.15～0.30 0.25～0.40 0.45～0.55 0.60～0.70
0.6～0.8 0.9～1.6 0.9～1.6 1.2～2.0 1.2～2.0 1.8～2.2
（Unit：mm）
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.
Recommended land dimension for Reflow-soldering
Type 3216 2010
Size
L 3.2 2.0
W 1.6 1.0
a 0.7～0.9 0.5～0.6
b 0.8～1.0 0.5～0.6
c 0.4～0.5 0.2～0.3
d 0.8 0.5
（Unit：mm）
（2） Examples of good and bad solder application
Item Not recommended Recommended
Mixed mounting of SMD
and leaded components
Component placement
close to the chassis
Hand-soldering of leaded
components near mounted
components
Horizontal component
placement
To next page
1
2
mlci0109_reli-PRP14
mlci0109_reli_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following
factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is
imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.
Technical
consider-
ations
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be
considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC
board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item Improper method Proper method
Single-sided mounting
Double-sided mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the
inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the
pin should be conducted periodically.
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may
result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component
placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too
little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive
flow of adhesive on to the land or solder pad.
［Recommended conditions］
Figure 0805 case sizes as examples
a 0.3mm min
b 100～120μm
c Area with no adhesive
2. PCB Design
Technical
consider-
ations
◆Pattern configurations（Inductor layout on panelized ［breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board
warp or deflection.
Item Not recommended Recommended
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout.
An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following
methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must
also consider the PCB splitting procedure.
1
2
mlci0109_reli-PRP15 mlci0109_reli_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong acidity content should
not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak tem-and please contact us about peak tem-
perature when you use lead-free paste.
Technical
consider-
ations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue
after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect
solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may
cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines
used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be
conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
［Reflow soldering］
Temperature profile
Peak 260℃ max
10 sec max
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
Peak 260℃ max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
（※⊿ＴT190℃ （3216Type max）, ⊿Ｔ≦ 130℃ （3225
Type ming）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature（℃）
300
200
100
0
Temperature（℃）
300
200
100
0
Temperature（℃）
400
300
200
100
0
Preheating
150℃
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230℃
40 sec max
Preheating
150℃
120 sec min
350℃ max
3 sec max
60 sec min
⊿Ｔ
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below:
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.
［Wave soldering］
Temperature profile
Peak 260℃ max
10 sec max
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
Peak 260℃ max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
（※⊿ＴT190℃ （3216Type max）, ⊿Ｔ≦ 130℃ （3225
Type ming）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature（℃）
300
200
100
0
Temperature（℃）
300
200
100
0
Temperature（℃）
400
300
200
100
0
Preheating
150℃
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230℃
40 sec max
Preheating
150℃
120 sec min
350℃ max
3 sec max
60 sec min
⊿Ｔ
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
Temperature profile
Peak 260℃ max
10 sec max
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
Peak 260℃ max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
（※⊿ＴT190℃ （3216Type max）, ⊿Ｔ≦ 130℃ （3225
Type ming）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature（℃）
300
200
100
0
Temperature（℃）
300
200
100
0
Temperature（℃）
400
300
200
100
0
Preheating
150℃
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230℃
40 sec max
Preheating
150℃
120 sec min
350℃ max
3 sec max
60 sec min
⊿Ｔ
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
1
2
mlci0109_reli-PRP16
mlci0109_reli_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of
the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics.
Technical
consider-
ations
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's
electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor
or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;
Ultrasonic output Below 20W/ℓ
Ultrasonic frequency Below 40kHz
Ultrasonic washing period 5 min. or less
6. Post cleaning processes
Precautions
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal
storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor
damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors （soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and
humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature Below 40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so
inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
Technical
consider-
ations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the inductors.
