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Rigado LLC

3950 Fairview Industrial Dr.

Salem, Oregon 97302

866-6-RIGADO  modules@rigado.com

www.rigado.com/modules

BMD-300 Series Evaluation Kit User Guide

The BMD-300 Series Evaluation Kits from Rigado allow for

stand-alone use of the BMD-300, BMD-301 and BMD-350

modules featuring the Nordic nRF52832 RF System on Chip

(SoC).

This guide provides setup instructions for starting

development and describes the hardware functionality of

the BMD-300 Series Evaluation Kits.

1. Overview

The BMD-300 Series Evaluation Kits provide a great starting point for almost any Bluetooth Smart (4.2 Low

Energy) project. All features of the BMD-300 are easily accessed from the evaluation board. A simple USB

connection provides power, programming, and a virtual COM port. Four user buttons are available, as well as

four LEDs and a reset button. All 32 GPIO are available on headers that are compatible with the Arduino form

factor. This allows easy use of the Rigado BMD-300 Series Shields, as well as many existing Arduino shields.

Current sense resistors allow for measuring current into the BMD-300 Series module and into the shield.

1.1. Key Features

 BMD-300 Series Module

 On-board programming and debug (Segger J-Link-OB)

 Able to program external modules

 Virtual COM port over USB

 Full GPIO pin out of the BMD-300 / nRF52832

 Buttons and LEDs for user interaction

 NFC antenna connector

 32.768kHz Crystal

 CR2032 battery holder

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Table of Contents 
1. Overview ............................................................................................................................................... 1 
1.1.  Key Features ................................................................................................................................................ 1 
2. Useful Tools ........................................................................................................................................... 3 
3. Hardware Kit .......................................................................................................................................... 3 
4. Application Firmware Development ....................................................................................................... 4 
4.1.  Set up tool chain ......................................................................................................................................... 4 
4.2.  Connect BMD-300 Evaluation Kit to computer ........................................................................................... 4 
4.3.  Program BMD-300 Evaluation Kit with the S132 Soft Device ..................................................................... 5 
4.4.  Set up the Application Project .................................................................................................................... 6 
5. Hardware Description ............................................................................................................................ 7 
5.1.  Power .......................................................................................................................................................... 7 
5.1.  Reset ........................................................................................................................................................... 8 
5.2.  Buttons ........................................................................................................................................................ 9 
5.1.  LEDs ............................................................................................................................................................. 9 
5.2.  Virtual COM Port ....................................................................................................................................... 10 
5.3.  32kHz Crystal Oscillator ............................................................................................................................ 10 
5.4.  NFC Connector .......................................................................................................................................... 10 
5.5.  Current Sensing Headers........................................................................................................................... 11 
5.6.  External Segger J-Link™ Debug Interface .................................................................................................. 11 
5.7.  GPIO Jumpers ............................................................................................................................................ 12 
5.8.  Header Pin-out .......................................................................................................................................... 13 
5.9.  BMD-300 Series Module Pinout ................................................................................................................ 15 
6. Life Support Policy ............................................................................................................................... 16 
7. Document History ................................................................................................................................ 16 
8. Related Documents .............................................................................................................................. 16 
 
Table of Figures 
Figure 1 – BMD-300 Evaluation Board (Top View) ................................................................................................. 3 
Figure 2 – Segger J-Link DLL Updater ...................................................................................................................... 4 
Figure 3 – nRFgo Studio with J-Link Interface ......................................................................................................... 5 
Figure 4 – nRFgo Studio SoftDevice Window ......................................................................................................... 5 
Figure 5 – J-Link Selection ....................................................................................................................................... 6 
Figure 6 – J-Link Identification ................................................................................................................................ 6 
Figure 7 – Assembly Drawing (Top View) ............................................................................................................... 7 
Figure 8 – Schematic – Power Supply ..................................................................................................................... 8 
Figure 9 – Schematic – Reset .................................................................................................................................. 9 
Figure 10 – Schematic – User Buttons .................................................................................................................... 9 
Figure 11 – Schematic – User LEDs ......................................................................................................................... 9 
Figure 12 – Schematic - 32KHz Crystal .................................................................................................................. 10 
Figure 13 – NFC Connector ................................................................................................................................... 10 
Figure 14 – Current Sensing Header Layout ......................................................................................................... 11 
Figure 15 – External J-Link Debug Interface ......................................................................................................... 11 
Figure 16 – GPIOs disconnected from I/O headers .............................................................................................. 12 
Figure 17 – GPIO Jumper Summary ...................................................................................................................... 12 
Figure 18 – BMD-300 Series Evaluation Board Pin-out ........................................................................................ 13 
Figure 19 – BMD-300 Series Module Pin-out ....................................................................................................... 15 
 

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2. Useful Tools

Below is a list of tools that aid in development with the BMD-300 Series Bluetooth modules. Not all tools

will be required depending on which software suite is used.

Tool

Description

Rigado Toolbox for iOS

and Android

The Rigado Toolbox provides a way for Rigado Module customers to

configure their Rigado Beacons and other out of the box firmware

features. The toolbox also provides the ability to securely update device

firmware. The secure update feature is available to module customers.

nRF Master Control

Panel for Android

A Nordic tool for Android devices to allow active scanning for Bluetooth

low energy devices and communication.

Nordic nRFgo Studio

The Nordic software suite is used to program and configure Nordic nRF

devices. It supports programming of nRF52 application, bootloader, and

soft device. This tool uses the on board Segger J-Link programming

interface.

Keil MDK-ARM

Development Kit

A development environment designed for microcontroller applications

that enables development using the nRF52 SDK application and example

files.

Segger J-Link Software

Software and documentation pack for the Segger J-Link interface

3. Hardware Kit

Figure 1 – BMD-300 Evaluation Board (Top View)

BMD-300-EVAL:

 1x BMD-300 Evaluation Board

 1x Micro-USB Cable

BMD-350-EVAL:

 1x BMD-300 Evaluation Board

 1x Micro-USB Cable

BMD-301-EVAL:

 1x BMD-301 Evaluation Board

 1x Micro-USB

 2x Bluetooth Antennas – patch and tilt-

whip styles

 1x U.FL to RP-SMA jumper cable

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4. Application Firmware Development

This section walks through how to set up and program the BMD-300 Series Evaluation Kit with an example

application.

NOTE: This process will erase any preloaded firmware provided by Rigado, such as the RigDFU secure

bootloader and BMDware beacon and UART-BLE bridge firmware. This firmware can be found as part of our

BMD Software Suite located on GitHub. Please contact Rigado to get free access (modules@rigado.com).

4.1. Set up tool chain

1. Download and install the latest Keil MDK-ARM development kit from

www.keil.com/arm/mdk.asp

a. Once the Keil MDK-ARM installation is complete, Keil will launch the Pack Installer.

The Keil Pack Installer manages software components for the various supported

microcontrollers

b. The Pack Installer will automatically download any updates for the core ARM support

c. Once these core packs are installed and up to date, close the Pack Installer

Note: As of Nordic Semiconductor SDK v11.0.0, Keil Packs are no longer supported.

The full SDK, with the currently released SoftDevices, is installed in step 4 below.

2. Download and install the nRFgo Studio from www.nordicsemi.com/eng/Products/2.4GHz-

RF/nRFgo-Studio

3. Download and install the latest Segger J-Link utilities from https://www.segger.com/jlink-

software.html. When prompted to overwrite the JLinkARM.dll file, select all of the listed

items and click OK:

Figure 2 – Segger J-Link DLL Updater

4. Download the latest Nordic Semiconductor nRF5 SDK from

http://developer.nordicsemi.com/nRF5_SDK/nRF5_SDK_v11.x.x. Extract the Zip file to a

working folder

4.2. Connect BMD-300 Evaluation Kit to computer

The evaluation board is provided with an on-board Segger J-Link programmer/debugger.

1. Connect the board to a computer using the USB cable provided

2. The status LED, D5, will flash and then turn solid once the USB device is enumerated.

3. After a few seconds the computer will recognize the Evaluation Board as a J-Link device and

install the USB-Virtual COM Port device driver

4. Open nRFgo Studio and verify that the J-Link interface is recognized:

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Figure 3 – nRFgo Studio with J-Link Interface

4.3. Program BMD-300 Evaluation Kit with the S132 Soft Device

1. Open the Nordic nRFgo Studio application. In the ’Device Manager’ section, there will be a

device named Segger followed by serial number under ‘nRF52 development boards.’ Select

Segger and the device programming interface will appear in the main window

a. If the programming window above does not appear, try the following at a command

line:

nrfjprog -f NRF52 -–recover

b. Select the Segger device and continue to Step 3.

2. Click ‘Erase all’ to clear the device of all current programmed software

3. Select the 'Program SoftDevice' tab in the pane on the right

4. Click ‘Browse…’ and navigate to the location of the S132 SoftDevice (<unzipped

location>\nRF5_SDK_11.0.0_89a8197\components\softdevice\s132\hex). Locate and select

the latest version of the SoftDevice hex file

5. Click program

6. After programming, nRFgo Studio should look similar to Figure 4 below:

Figure 4 – nRFgo Studio SoftDevice Window

7. Close nRFgo Studio

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4.4. Set up the Application Project

Note: The BMD-300 Series Evaluation Kit is directly compatible with the Nordic nRF52 DK (PCA10040)

1. Navigate to the location of the extracted examples from the SDK (typically <unzipped

location>\nRF5_SDK_11.0.0_89a8197\examples)

2. Select one of the examples that is labeled with “(nRF52 PCA10040)” and “s132”. The Heart Rate

Service Sample Application (.\ble_peripheral\ble_app_hrs\pca10040\s132\arm5_no_packs\) is a

good place to start. For starting on a custom application, using a template project is a good idea

(such as ble_app_template_s132_pca10040)

3. Open the project file (ble_app_hrs_s132_pca10040.uvprojx) to start the Keil IDE

4. Now build ( , ‘F7’) to make sure all project settings are configured correctly

5. Once the build is successful, you can download the application code onto the module Board ( ,

‘Flash’-> ‘Download’)

6. Using a standard heart rate app on Android or iOS allows you to connect to the evaluation board

and see the simulated heart rate

7. If you cannot program the device, go to the ‘Debug’ tab in ‘Options for Target’ ( , ‘Project’ ->

‘Options for Target’), and select ‘J-LINK/J-TRACE Cortex’ from the upper right hand drop down

Figure 5 – J-Link Selection

8. Clicking on ‘Settings’ shows the serial number of the JLink under ‘J-Link/J-Trace Adapter’ and also

shows the module’s IDCODE as an SWD device under ‘SW Device’

Figure 6 – J-Link Identification

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5. Hardware Description

Design files for the BMD-300 Series Evaluation Kit may be found on the Rigado website.

Figure 7 – Assembly Drawing (Top View)

5.1. Power

The BMD-300 Evaluation Board has three possible power sources: USB, a CR2032 coin cell battery, and a

0.1” through-hole connector. These power sources are diode OR’ed to prevent reverse voltage to any

supply. This allows them to be used simultaneously. Solder jumpers are provided to allow by-passing any

of the protection diodes eliminating the voltage drop across them. Care should be taken to not damage

the supplies when the protection is by-passed.

Powering the Board:

Typically, power will be provided by USB though VBUS, which will supply +5V to the 3.3V LDO regulator

and to the shield connector. The 3.3V LDO regulator will then power the VIO, VSHLD, and VBMD.

When powering the board from the CR2032 coin cell (3VDC) or the external power header, USB can be left

disconnected. In this configuration, the interface IC is held in reset to conserve power. If the power OR’ing

diodes are NOT by-passed, USB can be connected with the coin cell or external power still applied allowing

for easy programming of the module.

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Figure 8 – Schematic – Power Supply

5.1. Reset

The BMD-300 Series module has a configurable hardware reset. However, P0.21 is assumed to be used as

the reset pin for all Rigado and Nordic example projects, and thus the evaluation board hardware is

configured to use P0.21 as a reset. The Reset button can be configured to connect to an input on the

interface IC or to directly connect to P0.21.

The Reset button is connected to the IC used for the J-Link interface by default. Pressing reset while the

interface IC is powered will caused a momentary reset signal on the nRESET output of the interface IC,

which is connected via solder jumper to P0.21 of the BMD-300 Series module. If the Reset button is held

down during power on, it will cause the interface IC to enter its bootloader mode, allowing either Segger J-

Link or mbed programmer firmware to be programmed.

When the Reset button is directly connected to P0.21, it can be used as a 5th user button or as a reset

button directly connected to the BMD module.

Solder jumper J21 is used to connect P0.21 of the BMD module to the nRESET net. nRESET is connected to

the interface IC and to the reset connections on the Arduino headers.

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Figure 9 – Schematic – Reset

5.2. Buttons

The Evaluation Board has four user buttons: User 1, User 2, User 3, and User 4. All buttons are active low;

they will connect to ground when pressed. The button GPIO pins must be configured with internal pull-up

resistors for proper operation when using the user buttons. The buttons and ESD protection can be

completely removed from the circuit by breaking the associated jumper.

Figure 10 – Schematic – User Buttons

5.1. LEDs

Four User LEDs are provided on the Evaluation Board; two red and two green. LEDs are powered by VIO

and are active low. The GPIO should be enabled for high drive when sinking current for the LEDs. The LEDs

can be completely removed from the circuit by breaking the associated jumper.

Figure 11 – Schematic – User LEDs

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5.2. Virtual COM Port

The evaluation board allows for easy serial communication with the BMD-300 Series Modules and a

connected computer. The Interface IC provide a virtual COM USB device that connects to 4 GPIO pins on

the module, allowing for UART communication with or without hardware flow control. The UART lines can

be completely removed from the circuit by breaking the associated jumpers.

BMD-300

Pin Name

BMD-300

Function

Jumper

Interface IC

Function

P0.05

RTS

J05

CTS

P0.06

TXD

J06

RXD

P0.07

CTS

J07

TRS

P0.08

RXD

J08

TXD

5.3. 32kHz Crystal Oscillator

The evaluation board has a 32.768kHz Crystal Oscillator connected to the BMD-300 Series module by

default. This allows the module to use any of the three available low frequency (LF) clock sources: an

internal calibrated RC oscillator, an internal synthesized clock (derived from the 32MHz clock), or an

external crystal oscillator. The external crystal oscillator is the most accurate and lowest power LF clock

option. For applications without strict time keeping requirements, the internal calibrated RC oscillator is

often suitable. The crystal is connected to the module through a solder select jumper, allowing either the

crystal or the IO header to be connected to the module’s GPIO pins.

Figure 12 – Schematic - 32KHz Crystal

5.4. NFC Connector

Connection to an external NFC antenna is provided through a Molex flat-flex connector, Part number

051281-0594. Capacitors ‘C2’ and ‘C3’ provide tuning of the NFC antenna for resonance at 15.56MHz.

Figure 13 – NFC Connector

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5.5. Current Sensing Headers

The evaluation board provides two current sensing headers. ‘JBMD’ allows for power consumption

measurement of the BMD-300 Series Module and ‘JSHD’ allows for power consumption measurement of

shields connected to the Arduino-style headers (‘VSHLD’ power only).

Each 3-pin 0.1” pitch header has two pins connected across a 1Ω current sense resistor powering the

module or the shield, and the third pin to ground. To measure current consumption, use a multimeter or

other precision voltage measurement device to measure voltage drop across pins one and two. Current

can also be measured directly by removing ‘RBMD’ / ‘RSHD’ and using a current meter in series with the

two voltage pins. The default hardware configuration does not require any modification of the current

sense headers for the BMD-300 Evaluation Board to perform properly.

Note: Only current flowing through ‘VBMD’ into the module is measured; current sunk through GPIO pins

is not measured.

Figure 14 – Current Sensing Header Layout

5.6. External Segger J-Link™ Debug Interface

External target hardware can be connected to J3 for firmware programming and debug. The Segger debug

interface is implemented as shown in Figure 15. J3 is implemented with a 2x5 10-pin header on 0.05”

centers.

Figure 15 – External J-Link Debug Interface

In order to enable the external J-Link connection, ensure the following are implemented on the target

hardware:

 EXT VTG is used by the debug interface as an input to set the debug interface voltage levels.

Connect EXT VTG to the BMD-300 Series power supply (VCC) on the target hardware.

 EXT GND DETECT is used by the debug interface to detect the presence of external target

hardware. Connect EXT GND DETECT to GND on the target hardware.

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 Connect EXT_SWDIO and EXT_SWCLK to SWDIO and SWDCLK on the target BMD-300,

respectively.

 (Optional) Connect EXT_SWO and/or EXT_RESETn to P0.18 and P0.21 on the target BMD-300,

respectively.

 Connect external power to the target hardware, then connect the BMD-300 Series Evaluation

Board to USB.

 At this point, the debug interface will interact with the target hardware instead of the on-board

BMD-300.

5.7. GPIO Jumpers

There are many solder bridge jumpers on the board available to allow for configurability of the GPIO. Most

solder jumpers are used to remove on-board components from the module’s GPIO nets, in the event that

they may interfere with external circuitry added on the I/O headers. All GPIOs are directly connected to

the I/O Headers by default, except P0.00 & P0.01 (32kHz crystal) and P0.09 & P0.10 (NFC antenna). These

are disconnected from the I/O headers as they would interfere with the default functions.

Figure 16 – GPIOs disconnected from I/O headers

The GPIO jumpers are shown on the bottom side of the BMD-300 Series Evaluation Board:

Figure 17 – GPIO Jumper Summary

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5.8. Header Pin-out

Headers J5 through J9 and J11 break-out the IO signals from the BMD-300 on 0.1” pitch headers.

Figure 18 – BMD-300 Series Evaluation Board Pin-out

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The tables below are presented relative to the positioning on the BMD-300 Series Evaluation Board

Header J8

Header

Name

nRF52

Port

Function

P0.31

GPIO / AIN7

P0.30

GPIO / AIN6

P0.29

GPIO / AIN5

P0.28

GPIO / AIN4

P0.04

GPIO / AIN2

P0.03

GPIO / AIN1

Header J5

Header

Name

nRF52

Port

Function

GND

Ground

GND

Ground

5V0

+5.0V USB Power

VSHLD

+3.3V Shield Power

RESET

P0.21

RESET

VSHLD

+3.3V Shield Power

VSHLD

+3.3V Shield Power

Header J11

Header

Name

nRF52

Port

Function

P0.24

GPIO

5V0

+5.0V USB Power

P0.25

GPIO

P0.23

GPIO

nRESET

P0.21

RESET

GND

Ground

Header J9

Header

Name

nRF52

Port

Function

GND

Ground

P0.00

OPEN / GPIO

P0.01

OPEN / GPIO

P0.21

RESET / GPIO

P0.05

GPIO / AIN3

P0.06

GPIO

P0.07

GPIO

P0.08

GPIO

P0.09

OPEN /GPIO

P0.10

OPEN / GPIO

Header J7

Header

Name

nRF52

Port

Function

P0.11

GPIO

P0.12

GPIO

P0.13

GPIO

P0.14

GPIO / TRACED[3]

P0.15

GPIO / TRACED[2]

P0.16

GPIO / TRACED[1]

P0.17

GPIO

P0.18

GPIO / TRACED[0]

Header J6

Header

Name

nRF52

Port

Function

P0.19

GPIO

P0.20

GPIO / TRACECLK

P0.22

GPIO

P0.23

GPIO

P0.24

GPIO

P0.25

GPIO

GND

Ground

P0.02

GPIO / AIN0

P0.26

GPIO

P0.27

GPIO

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5.9. BMD-300 Series Module Pinout

Top View

Figure 19 – BMD-300 Series Module Pin-out

Name

Direction

Description

P0.25

In/Out

GPIO3

P0.26

In/Out

GPIO3

P0.27

In/Out

GPIO3

P0.28

In/Out

GPIO/AIN43

P0.29

In/Out

GPIO/AIN53

P0.30

In/Out

GPIO/AIN63

P0.31

In/Out

GPIO/AIN73

P0.00

In/Out

GPIO/XTAL1 (32.768kHz)

P0.01

In/Out

GPIO/XTAL2 (32.768kHz)

P0.02

In/Out

GPIO/AIN0

P0.03

In/Out

GPIO/AIN1

P0.04

In/Out

GPIO/AIN2

P0.05

In/Out

GPIO/AIN3

P0.06

In/Out

GPIO

P0.07

In/Out

GPIO

P0.08

In/Out

GPIO

P0.09

In/Out

GPIO/NFC1

P0.10

In/Out

GPIO/NFC2

P0.11

In/Out

GPIO

P0.12

In/Out

GPIO

P0.13

In/Out

GPIO

P0.14

In/Out

GPIO/TRACEDATA[3]

P0.15

In/Out

GPIO/TRACEDATA[2]

P0.16

In/Out

GPIO/TRACEDATA[1]

P0.17

In/Out

GPIO

P0.18

In/Out

GPIO/TRACEDATA[0]/SWO

P0.19

In/Out

GPIO

P0.20

In/Out

GPIO/TRACECLK

P0.21

In/Out

GPIO/ RESET



P0.22

In/Out

GPIO3

P0.23

In/Out

GPIO3

P0.24

In/Out

GPIO3

SWCLK

SWD Clock

SWDIO

In/Out

SWD IO

VCC

Power

+1.7V to +3.6V2

1, 2, 3, 4, 5, 16, 18,

29, 30, 45, 46, 47

GND

Power

Electrical Ground

Note 1: The RESET



function can be assigned to another GPIO during programming. P0.21 is the default used by

Rigado and Nordic example applications and development kits.

Note 2: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add

additional bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw.

Note 3: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance

parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on

these pins. Nordic recommends using only low frequency, low-drive functions when possible.

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6. Life Support Policy

This product is not designed to be used in a life support device or system, or in applications where there is

potential for a failure or malfunction to, directly or indirectly, cause significant injury. By using this product in

an application that poses these risks, such as described above, the customer is agreeing to indemnify Rigado

for any damages that result.

7. Document History

Revision

Date

Changes / Notes

1.0

2016-05-04

Initial release

1.0.1

2016-05-06

Added link to reference design files in Section 4, updated logo

1.1

2016-07-28

Updated images, Added section on External J-Link connector, corrected section

numbering

1.2

2016-09-09

Added BMD-350 ordering information, document links

8. Related Documents

Rigado Documents:

 BMD-300-Series-DS: Module Datasheet

 MAC Address Provisioning

 RIGDFU-DS-1: RigDFU Secure Bootloader Datasheet

 BMDWARE-DS-1: BMDware Datasheet

 Rigado Toolbox: iOS and Android apps

Nordic Documents:

Visit infocenter.nordicsemi.com for a comprehensive library of Nordic technical documentation.

 nRF52832-PS: nRF52832 Product Specification

 S132-SDS – nRF52832 S132 Soft Device Specification

 S212-SDS – nRF52832 S132 Soft Device Specification

 S332-SDS – nRF52832 S132 Soft Device Specification