Temperature
Sensor
Circuitry
Control
Logic
Temperature
Register
Manufacturer's
ID Register
Three-Wire
Serial Interface
14-Bit
Delta-Sigma
A/D Converter
SI/O
SC
2.65V to 5.5V
LM71
CS
LM71, LM71-Q1
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SNIS125D –MARCH 2004–REVISED MARCH 2013
LM71/LM71-Q1 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor
Check for Samples: LM71,LM71-Q1
1FEATURES • Temperature Accuracy
–−10°C to +65°C: ±1.5°C (max)
2• LM71Q is AEC-Q100 Grade 0 Qualified and is
Manufactured on an Automotive Grade Flow –−40°C to 150°C: +3/−2°C (max)
• 5-Pin SOT-23 Package or 6-Pin No-Pull-Back • Temperature Resolution: 31.25 m°C
WSON Package DESCRIPTION
• Operates Over a Full −40°C to +150°C Range The LM71 is a low-power, high-resolution digital
• SPI and MICROWIRE Bus Interface temperature sensor with an SPI and MICROWIRE
compatible interface, available in the 5-pin SOT-23 or
APPLICATIONS the 6-pin WSON (no pull back) package. The host
• System Thermal Management can query the LM71 at any time to read temperature.
Its low operating current is useful in systems where
• Personal Computers low power consumption is critical.
• Portable Electronic Devices The LM71 has 13-bit plus sign temperature resolution
• Disk Drives (0.03125°C per LSB) while operating over a
• Office Electronics temperature range of −40°C to +150°C.
• Electronic Test Equipment The LM71’s 2.65V to 5.5V supply voltage range, fast
• Vending Machines conversion rate, low supply current, and simple SPI
• Automotive interface make it ideal for a wide range of
applications. The LM71Q is available in the 5-lead
SOT-23 package only.
KEY SPECIFICATIONS
• Supply Voltage: 2.65V to 5.5V
• Supply Current
– Operating: 300 µA (typ)
– 550 µA (max)
Simplified Block Diagram
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM71
1
2
3 4
5
CS
GND
SI/O SC
V+
LM71
1
2
3 4
6
CS
GND
SI/O
SC V+
5GND
LM71, LM71-Q1
SNIS125D –MARCH 2004–REVISED MARCH 2013
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Connection Diagram
Figure 1. 5-Pin SOT-23 Figure 2. 6-Pin WSON No Pull-Back
See Package Number DBV See Package Number NGG0006A
PIN DESCRIPTIONS
Label Pin Number Function Typical Connection
SOT-23-5 WSON-6
CS 1 4 Chip Select input From controller
GND 2 2, 5 Power Supply Ground Connect all GND Pins to ground
Slave Input/Output - Serial bus bi-directional
SI/O 3 3 From and to controller
data line. Shmitt trigger input.
Slave Clock - Serial bus clock Shmitt trigger
SC 4 1 From controller
input line DC voltage from 2.65V to 5.5V. Bypass with
V+5 6 Positive Supply Voltage Input a 0.1 μF ceramic capacitor.
Typical Application
Figure 3. COP Microcontroller Interface
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)
Supply Voltage −0.3V to 6.0V
Voltage at any Pin −0.3V to V++ 0.3V
Input Current at any Pin(2) 5 mA
Storage Temperature −65°C to +150°C
Vapor Phase (60 seconds) 215°C
SOT-23-5 Package
Soldering Information, Lead Temperature Infrared (15 seconds) 220°C
WSON-6 Package Infrared (5 seconds) 215°C
Human Body Model 2000V
ESD Susceptibility(3) Machine Model 200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) When the input voltage (VI) at any pin exceeds the power supplies (VI< GND or VI> +VS) the current at that pin should be limited to 5
mA.
(3) Human body model, 100 pF discharged through a 1.5 kΩresistor. Machine model, 200 pF discharged directly into each pin.
Operating Ratings
Specified Temperature Range(1) (TMIN to TMAX) LM71CIMF, LM71CISD, LM71QCIMF −40°C to +150°C
Supply Voltage Range (+VS) LM71CIMF, LM71CISD, LM71QCIMF +2.65V to +5.5V
(1) The life expectancy of the LM71 will be reduced when operating at elevated temperatures. LM71 θJA (thermal resistance, junction-to-
ambient) when attached to a printed circuit board with 2 oz. foil is summarized in the table below:
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Device Number Thermal Resistance (θJA)
LM71CIMF/LM71QCIMF 250°C/W
LM71CISD 57.6°C/W
Temperature-to-Digital Converter Characteristics
Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V(1).Boldface limits apply for TA= TJ= TMIN to
TMAX;all other limits TA= TJ= +25°C, unless otherwise noted. LM71CIMF Units
Parameter Conditions Typical(2) LM71CISD (Limit)
Limits(3)
TA=−10°C to +65°C ±1.5 °C (max)
Temperature Error(1)(4) TA=−40°C to +85°C ±2.0 °C (max)
TA=−40°C to +150°C +3/−2°C (max)
14 Bits
Resolution 0.03125 °C
Temperature Conversion Time See(5) 200 270 ms (max)
Quiescent Current Serial Bus Inactive 300 550 μA (max)
(1) The LM71 will operate properly over the V+supply voltage range of 2.65V to 5.5V.
(2) Typicals are at TA= 25°C and represent most likely parametric norm.
(3) Limits are ensured to AOQL (Average Outgoing Quality Level).
(4) For best accuracy, minimize output loading. Higher sink currents can affect sensor accuracy with internal heating. This can cause an
error of 0.64°C at full rated sink current and saturation voltage based on junction-to-ambient thermal resistance.
(5) This specification is provided only to indicate how often temperature data is updated. The LM71 can be read at any time without regard
to conversion state (and will yield last conversion result). A conversion in progress will not be interrupted. The output shift register will be
updated at the completion of the read and a new conversion restarted.
Logic Electrical Characteristics
DIGITAL DC CHARACTERISTICS
Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V(1).Boldface limits apply for TA= TJ= TMIN to
TMAX;all other limits TA= TJ= +25°C, unless otherwise noted.
Symbol Parameter Conditions Typical(2) Limits(3) Units (Limit)
V+× 0.7 V (min)
VIN(1) Logical “1” Input Voltage V++ 0.3 V (max)
−0.3 V (min)
VIN(0) Logical “0” Input Voltage V+× 0.3 V (max)
Input Hysteresis Voltage V+= 3.0V to 3.6V 0.4 0.33 V (min)
IIN(1) Logical “1” Input Current VIN = V+0.005 3.0 μA (max)
IIN(0) Logical “0” Input Current VIN = 0V −0.005 −3.0 μA (min)
CIN All Digital Inputs 20 pF
VOH High Level Output Voltage IOH =−400 μA2.4 V (min)
VOL Low Level Output Voltage IOL = +2 mA 0.4 V (max)
VO= GND −1μA (min)
IO_TRI-STATE TRI-STATE Output Leakage Current VO= V++1 μA (max)
(1) The LM71 will operate properly over the V+supply voltage range of 2.65V to 5.5V.
(2) Typicals are at TA= 25°C and represent most likely parametric norm.
(3) Limits are ensured to AOQL (Average Outgoing Quality Level).
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SC
SO
CS
t5
30%
70%
70%
SC 70%
30%
70%
30%
70%
30%
SO
CS
t3
t2t4t4
70%
30%
tftr
30% 70%
LM71, LM71-Q1
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SNIS125D –MARCH 2004–REVISED MARCH 2013
SERIAL BUS DIGITAL SWITCHING CHARACTERISTICS
Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V(1); CL(load capacitance) on output lines = 100 pF
unless otherwise specified. Boldface limits apply for TA= TJ= TMIN to TMAX;all other limits TA= TJ= +25°C, unless
otherwise noted. Units
Symbol Parameter Conditions Typical(2) Limits(3) (Limit)
t10.16 μs (min)
SC (Clock) Period DC (max)
t2CS Low to SC (Clock) High Set-Up Time 100 ns (min)
t3CS Low to Data Out (SO) Delay 70 ns (max)
t4SC (Clock) Low to Data Out (SO) Delay 70 ns (max)
t5CS High to Data Out (SO) TRI-STATE 200 ns (max)
t6SC (Clock) High to Data In (SI) Hold Time 50 ns (min)
t7Data In (SI) Set-Up Time to SC (Clock) High 30 ns (min)
trSC (Clock) Rise Time 100 ns (max)
tfSC (Clock) Fall Time 100 ns (max)
(1) The LM71 will operate properly over the V+supply voltage range of 2.65V to 5.5V.
(2) Typicals are at TA= 25°C and represent most likely parametric norm.
(3) Limits are ensured to AOQL (Average Outgoing Quality Level).
Figure 4. Data Output Timing Diagram
Figure 5. TRI-STATE Data Output Timing Diagram
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SC
SI
CS
t6
30%
70%
70%
30%
t7
LM71, LM71-Q1
SNIS125D –MARCH 2004–REVISED MARCH 2013
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Figure 6. Data Input Timing Diagram
Figure 7. Temperature-to-Digital Transfer Function (Non-linear scale for clarity)
Figure 8. TRI-STATE Test Circuit
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FUNCTIONAL DESCRIPTION
The LM71 temperature sensor incorporates a temperature sensor and 13-bit plus sign ΔΣ ADC (Delta-Sigma
Analog-to-Digital Converter). Compatibility of the LM71's three wire serial interface with SPI and MICROWIRE
allows simple communications with common microcontrollers and processors. Shutdown mode can be used to
optimize current drain for different applications. A Manufacture's/Device ID register identifies the LM71 as TI
product.
POWER UP AND POWER DOWN
The LM71 always powers up in a known state. The power up default condition is continuous conversion mode.
Immediately after power up the LM71 will output an erroneous code until the first temperature conversion has
completed.
When the supply voltage is less than about 1.6V (typical), the LM71 is considered powered down. As the supply
voltage rises above the nominal 1.6V power up threshold, the internal registers are reset to the power up default
state described above.
SERIAL BUS INTERFACE
The LM71 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked
out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete
transmit/receive communication will consist of 32 serial clocks. The first 16 clocks comprise the transmit phase of
communication, while the second 16 clocks are the receive phase.
When CS is high SI/O will be in TRI-STATE. Communication should be initiated by taking chip select (CS) low.
This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O)
will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of
the data will be clocked out by the falling edge of SC. CS can be taken high at any time during the transmit
phase. If CS is brought low in the middle of a conversion the LM71 will complete the conversion and the output
shift register will be updated after CS is brought back high.
The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The
LM71 will read the data available on the SI/O line on the rising edge of the serial clock. Input data is to an 8-bit
shift register. The part will detect the last eight bits shifted into the register. The receive phase can last up to 16
SC periods. All ones must be shifted in order to place the part into shutdown. All zeros must be shifted in order to
place the LM71 into continuous conversion mode. Only the following codes should be transmitted to the LM71:
• 00 hex for continuous conversion
• FF hex for shutdown
Another code may place the part into a test mode. Test modes are used by TI to thoroughly test the function of
the LM71 during production testing. Only eight bits have been defined above since only the last eight transmitted
are detected by the LM71, before CS is taken HIGH.
The following communication can be used to determine the Manufacturer's/Device ID and then immediately place
the part into continuous conversion mode. With CS continuously low:
• Read 16 bits of temperature data
• Write 16 bits of data commanding shutdown
• Read 16 bits of Manufacture's/Device ID data
• Write 8 to 16 bits of data commanding Conversion Mode
• Take CS HIGH.
Note that 300 ms will have to pass for a conversion to complete before the LM71 actually transmits temperature
data.
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TEMPERATURE DATA FORMAT
Temperature data is represented by a 14-bit, two's complement word with an LSB (Least Significant Bit) equal to
0.03125°C:
Digital Output
Temperature Binary Hex
+150°C 0100 1011 0000 0011 4B03
+125°C 0011 1110 1000 0011 3E83
+25°C 0000 1100 1000 0011 0C83
+0.03125°C 0000 0000 0000 0111 0007
0°C 0000 0000 0000 0011 0003
−0.03125°C 1111 1111 1111 1111 FFFF
−25°C 1111 0011 1000 0011 F383
−40°C 1110 1100 0000 0011 EC03
The first data byte is the most significant byte with most significant bit first, permitting only as much data as
necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature
data indicate an overtemperature condition, the host processor could immediately take action to remedy the
excessive temperatures.
SHUTDOWN MODE/MANUFACTURER'S ID
Shutdown mode is enabled by writing XX FF to the LM71 as shown in Figure 13. The serial bus is still active
when the LM71 is in shutdown. When in shutdown mode the LM71 always will output 1000 0000 0000 1111. This
is the manufacturer's/Device ID information. The first 5-bits of the field (1000 0XXX) are reserved for
manufacturer's ID.
INTERNAL REGISTER STRUCTURE
The LM71 has three registers, the temperature register, the configuration register and the manufacturer's/device
identification register. The temperature and manufacturer's/device identification registers are read only. The
configuration register is write only.
Configuration Register
(Selects shutdown or continuous conversion modes):
Table 1. (Write Only):
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
X X X X X X X X Shutdown
D0–D15 set to XX FF hex enables shutdown mode.
D0–D15 set to 00 00 hex sets Continuous conversion mode.
Note: setting D0-D15 to any other values may place the LM70 into a manufacturer's test mode, upon which the
LM71 will stop responding as described. These test modes are to be used for TI production testing only. See
SERIAL BUS INTERFACE for a complete discussion.
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Temperature Register
Table 2. (Read Only):
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
MSB Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit1 LSB 1 1
D0–D1: Logic 1 will be output on SI/0.
D2–D15: Temperature Data. One LSB = 0.03125°C. Two's complement format.
Manufacturer/Device ID Register
Table 3. (Read Only):
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
1000000000001111
D0–D1: Logic 1 will be output on SI/0.
D2–D15: Manufacturer's/Device ID Data. This register is accessed whenever the LM71 is in shutdown mode.
Serial Bus Timing Diagrams
Figure 11. Reading Continuous Conversion - Single Eight-Bit Frame
Figure 12. Reading Continuous Conversion - Two Eight-Bit Frames
Figure 13. Writing Shutdown Control
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SNIS125D –MARCH 2004–REVISED MARCH 2013
Application Hints
To get the expected results when measuring temperature with an integrated circuit temperature sensor like the
LM71, it is important to understand that the sensor measures its own die temperature. For the LM71, the best
thermal path between the die and the outside world is through the LM71's pins. In the SOT-23 package, all the
pins on the LM71 will have an equal effect on the die temperature. Because the pins represent a good thermal
path to the LM71 die, the LM71 will provide an accurate measurement of the temperature of the printed circuit
board on which it is mounted. There is a less efficient thermal path between the plastic package and the LM71
die. If the ambient air temperature is significantly different from the printed circuit board temperature, it will have
a small effect on the measured temperature.
In probe-type applications, the LM71 can be mounted inside a sealed-end metal tube, and can then be dipped
into a bath or screwed into a threaded hole in a tank. As with any IC, the LM71 and accompanying wiring and
circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may
operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as
Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM71 or its
connections.
Typical Applications
Figure 14. Temperature monitor using Intel 196 processor
Figure 15. LM71 digital input control using micro-controller's general purpose I/O.
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SNIS125D –MARCH 2004–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM71CIMF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI T16C
LM71CIMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM T16C
LM71CIMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T16C
LM71CISD/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 L71CI
LM71CISDX/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 L71CI
LM71QCIMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T16Q
LM71QCIMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T16Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM71, LM71-Q1 :
•Catalog: LM71
•Automotive: LM71-Q1
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM71CIMF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM71CIMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM71CIMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM71CISD/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM71CISDX/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM71QCIMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM71QCIMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM71CIMF SOT-23 DBV 5 1000 210.0 185.0 35.0
LM71CIMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM71CIMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LM71CISD/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LM71CISDX/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LM71QCIMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM71QCIMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2
MECHANICAL DATA
NGG0006A
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SDE06A (Rev A)
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