Product family data sheet
Copyright © 2014-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-DS90 REV 1J
Cree® XLamp® XB-H LEDs
PRODUCT DESCRIPTION
The XLamp® XB-H LED delivers a
breakthrough combination of lumen
output and efcacy in a small package.
Delivering more than 500 lumens at
1.5A, 25°C in a 2.45mm2 package, the
Cree XB-H LED offers triple the lumen
density of competing high‑power LEDs
to signicantly increase the performance
of today’s lighting designs. The XB‑H LED
joins a new generation of directionally
optimized LEDs that offers the industry’s
highest optical control factor (OCF),
a measurement of how LED size and
performance benet directional lighting
applications. High‑OCF LEDs enable
lighting manufacturers to improve the
performance of any lighting design, create
smaller and less expensive systems, and
develop new lighting solutions that were
previously not possible.
FEATURES
• Available in white, outdoor white
and 80‑, 85‑ and 90‑CRI white
• ANSI‑compatible chromaticity bins
• Binned at 85°C
• Maximum drive current: 1500mA
• Low thermal resistance: 4°C/W
• Wide viewing angle: 110°
• Unlimited oor life at
≤ 30ºC/85% RH
• Reow solderable ‑ JEDEC
J‑STD‑020C
• Electrically neutral thermal path
• RoHS and REACh compliant
• UL® recognized component
(E349212)
TABLE OF CONTENTS
Characteristics ........................................2
Flux Characteristics ................................3
Relative Spectral Power Distribution .....4
Relative Flux vs. Junction
Temperature ...........................................4
Electrical Characteristics ........................5
Relative Flux vs. Current .........................5
Relative Chromaticity vs Current and
Temperature ............................................6
Typical Spatial Distribution .....................7
Thermal Design .......................................7
Reow Soldering Characteristics ...........8
Notes .......................................................9
Mechanical Dimensions .......................11
Tape and Reel ........................................12
Packaging ..............................................13