VCC1, VCC2, RSTIN, MR, WDI to GND ..................-0.3V to +6V
RST, WDO to GND (open drain) ............................. -0.3V to +6V
RST, WDO to GND (push-pull) .............. -0.3V to (VCC1 + 0.3V)
Input Current/Output Current (all pins) ...............................20mA
Continuous Power Dissipation (TA = +70°C)
6-Pin SOT23-6 (derate 4.3mW/°C above +70°C) ....347.8mW
8-Pin SOT23-8 (derate 5.6mW/°C above +70°C) ....444.4mW
Operating Temperature Range ........................... -40°C to +85°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ...................................................... +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
Lead (Pb)-free packages.............................................+260°C
Package containing lead (Pb) .....................................+240°C
6 SOT23
Junction-to-Ambient Thermal Resistance (θJA) ........230°C/W
Junction-to-Case Thermal Resistance (θJC) ...............76°C/W
8 SOT23
Junction-to-Ambient Thermal Resistance (θJA) ........180°C/W
Junction-to-Case Thermal Resistance (θJC) ...............60°C/W
(Note 1)
(VCC1 = VCC2 = +0.8V to +5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC1,
VCC20.8 5.5 V
Supply Current
ICC1
VCC1 < +5.5V, all I/O connections
open, outputs not asserted 15 39
µA
VCC1 < +3.6V, all I/O connections
open, outputs not asserted 10 28
ICC2
VCC2 < +3.6V, all I/O connections
open, outputs not asserted 411
VCC2 < +2.75V, all I/O connections
open, outputs not asserted 3 9
VCC1 Reset Threshold VTH1
L (falling) 4.500 4.625 4.750
V
M (falling) 4.250 4.375 4.500
T (falling) 3.000 3.075 3.150
S (falling) 2.850 2.925 3.000
R (falling) 2.550 2.625 2.700
Z (falling) 2.250 2.313 2.375
Y (falling) 2.125 2.188 2.250
W (falling) 1.620 1.665 1.710
V (falling) 1.530 1.575 1.620
MAX6730–MAX6735 Single/Dual/Triple-Voltage μP Supervisory
Circuits with Independent Watchdog Output
www.maximintegrated.com Maxim Integrated
│
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics