DATASHEET
BoardLevelCooling–Extruded3753
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
BOARDLEVELCOOLING‐EXTRUDED3753
3753isasquarepinfinboardlevelheatsinkdesignedtocoolBGAandFPGA
devices.Representativeimageonly.
ORDERINGINFORMATION
PartNumberDeviceType
375324B00035GBGA,FPGA
HEATSINKDETAILS
PropertyDetails
MaterialAluminum
FinishBlackAnodize
DeviceAttachmentOptionsTape
ThermalInterfaceMaterialT411ChomericsTapeforPlastic
Surfaces
PropertyDetails
HeatSinkWidth(mm)10.20
HeatSinkLength(mm)10.20
HeatSinkHeight(mm)10.20
HeatSinkMountingDirectionHorizontal
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)