DATASHEET Board Level Cooling - Extruded 3753 BOARD LEVEL COOLING EXTRUDED 3753 3753 is a square pin fin board level heat sink designed to cool BGA and FPGA devices. Representative image only. ORDERING INFORMATION Part Number Device Type 375324B00035G BGA, FPGA HEAT SINK DETAILS Property Details Property Details Material Finish Device Attachment Options Thermal Interface Material Aluminum Black Anodize Tape T411 Chomerics Tape for Plastic Surfaces Heat Sink Width (mm) Heat Sink Length (mm) Heat Sink Height (mm) Heat Sink Mounting Direction 10.20 10.20 10.20 Horizontal MECHANICAL & PERFORMANCE Drawing dimensions are shown in mm, (in) USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com