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ESD8V0L...
Low Capacitance TVS Diode
• ESD / transient protection of high-speed
data lines in 3.3 / 5 / 12 V applications
according to:
IEC61000-4-2 (ESD): up to ± 25 KV (contact)
IEC61000-4-4 (EFT): 40 A (5/50 ns)
IEC61000-4-5 (surge): up to 2.5 A (8/20 µs)
• Smallest form factor down to 1.0 x 0.6 x 0.4 mm
• Max. working voltage: -8 / +14 V or +8 / -14 V
• Ultra low dynamic resistance down to 0.3 Ω
• Very low capacitance down to 2 pF
• Very low reverse current < 1 nA typ.
• Very low series inductance down to 0.4 nH
• Pb-free (RoHS compliant) package
Applications
• USB 2.0, 10/100 Ethernet, Firewire, DVI
• Mobile communication
• Consumer products (STB, MP3, DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD8V0L2B-03LESD8V0L1B-02EL
ESD8V0L1B-02LRH
2
1
3
D2
D1
21
Type Package Configuration Marking
ESD8V0L1B-02EL
ESD8V0L1B-02LRH
ESD8V0L2B-03L
TSLP-2-18
TSLP-2-17
TSLP-3-1
1 channel, bi-directional
1 channel, bi-directional
2 channels, bi-directional
E7
B3
B3
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ESD8V0L...
Maximum Ratings at T
A
= 25°C, unless otherwise specified
Parameter Symbol Value Unit
ESD contact discharge1)
ESD8V0L1B...
ESD8V0L2B..., between all pins
VESD
25
15
kV
Peak pulse current (tp = 8 / 20 µs)2)
ESD8V0L1B...
ESD8V0L2B...
Ipp
2.5
1
A
Operating temperature range To
p
-55...125 °C
Storage temperature Tst
g
-65...150
1VESD according to IEC61000-4-2
2Ipp according to IEC61000-4-5
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ESD8V0L...
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Reverse working voltage VRWM -8 - 14 V
Breakdown voltage
I(BR) = 1 mA, from pin 2 to 1, ESD8V0L1B...
I(BR) = 1 mA, from pin 1 to 2, ESD8V0L1B...
I(BR) = 1 mA, from pin 1/2 to 3, ESD8V0L2B...
I(BR) = 1 mA, from pin 3 to 1/2, ESD8V0L2B...
I(BR) = 1 mA, from pin 1 to 2, ESD8V0L2B...
V(BR)
14.5
8.5
14.5
8.5
23
-
-
-
-
-
-
-
-
-
-
Reverse current
VR = 3 V, between all pins
IR- < 1 50 nA
Clamping voltage (contact)1)
VESD = +15 kV , from pin 1 to 2, ESD8V0L1B...
VESD = -15 kV, from pin 1 to 2, ESD8V0L1B...
VESD = +15 kV , from pin 1/2 to 3, ESD8V0L2B...
VESD = -15 kV , from pin 1/2 to 3, ESD8V0L2B...
VCL
-
-
-
-
21
16
26
20
-
-
-
-
V
Line capacitance2)
VR = 0 V, f = 1 MHz, ESD8V0L1B...
VR = 0 V, f = 1 MHz, ESD8V0L2B...,
from pin 1/2 to 3
from pin 1 to 2, pin 3 is not connected
CT
-
-
-
8.5
4
2
13
7
4
pF
Dynamic resistance ( tp=30ns )
ESD8V0L1B...
ESD8V0L2B...
RD
-
-
0.3
0.6
-
-
Ω
1VESD according to IEC61000-4-2
2Total capacitance line to ground
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ESD8V0L...
Reverse current IR = ƒ(VR)
TA = Parameter
0 2 4 6 8 10 V14
VR
-2
10
-1
10
0
10
1
10
nA
IR
TA = 25°C
TA = 85°C
Diode capacitance CT = ƒ (VR)
f = 1MHz
0 5 V15
VR
0
1
2
3
4
5
6
7
8
pF
10
CT
ESD8V0L1B...
ESD8V0L2B..., pins 1/2 to 3
ESD8V0L2B..., pins 1 to 2
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ESD8V0L...
Application example ESD8V0L2B...
2 channels, bi-directional
ESD sensitive
device
I/O
I/O
The protection diode should be placed very
close to the location where the ESD or
other transients can occur to keep loops
and inductances as small as possible.
Pin 3 should be connected directly to a
ground plane on the board.
2 protected signal lines, level up to
-8V/+14V
1 2
3
Connector
Application example ESD8V0L2B...
1 high-speed channel, bi-directional
ESD sensitive
device
I/O
Pin 1 (or pin 2) should be
connected directly to a
ground plane on the board.
Pin 3 is not connected.
Connector
Protected high-speed signal line, level up to
±22V (bi-directional)
1
2
3
Application example ESD8V0L1B...
1 channel, bi-directional
ESD sensitive
device
I/O
2
1
Pin 1 (or Pin 2) should be connected directly to a
ground plane on the board .
Connector
Protected signal line, level up to
-8/+14V or +8/-14 V
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ESD8V0L...
TSLP-2-17 (mm)
1
2
±0.05
0.6
1
2
±0.05
0.65
±0.035
0.25
1)
1
±0.05
0.05 MAX.
+0.01
0.39
-0.03
1) Dimension applies to plated terminal
Cathode
marking
1)
±0.035
0.5
Bottom viewTop view
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
For board assembly information please refer to Infineon website "Packages"
0.45
0.275
0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
0.76
4
1.16
0.5
Cathode
marking
8
BAR90-02LRH
Type code
Cathode marking
Laser marking
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ESD8V0L...
TSLP-2-18 (mm)
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ESD8V0L...
TSLP-3-1 (mm)
2
3
1
0.4
+0.1
BFR193L3
Type code
Pin 1 marking
Laser marking
0.76
4
1.16
0.5
Pin 1
marking
8
Reel ø180 mm = 15.000 Pieces/Reel
For board assembly information please refer to Infineon website "Packages"
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Stencil aperturesCopper Solder mask
0.275
0.2
0.315
0.945
0.45
0.17
0.355
0.2
0.35
0.225
1
0.6
0.225
0.15
0.35
0.3
R0.1
1
2
±0.05
0.35
±0.035
2 x 0.15
1)
Top view Bottom view
1) Dimension applies to plated terminal
±0.035
0.5
1)
±0.05
0.6
3
±0.05
0.65
±0.035
2x
0.25
1)
±0.035
0.25
1)
1
±0.05
Pin 1
marking
0.05 MAX.
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ESD8V0L...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
