AOW11S60/AOWF11S60 600V 11A MOS TM Power Transistor General Description Product Summary The AOW11S60 & AOWF11S60 have been fabricated using the advanced MOSTM high voltage process that is designed to deliver high levels of performance and robustness in switching applications. By providing low RDS(on), Qg and EOSS along with guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. VDS @ Tj,max 700V IDM 45A RDS(ON),max 0.399 Qg,typ 11nC Eoss @ 400V 2.7J 100% UIS Tested 100% Rg Tested TO-262 TO-262F D Top View Bottom View Top View Bottom View G G D S S D G S G AOW11S60 D S D 600 Gate-Source Voltage 30 Continuous Drain Current VGS TC=100C S AOWF11S60 Absolute Maximum Ratings TA=25C unless otherwise noted Parameter AOW11S60 Symbol Drain-Source Voltage VDS TC=25C G AOWF11S60 11 ID Units V V 11* 8 8* A Pulsed Drain Current C IDM Avalanche Current C IAR 2 A Repetitive avalanche energy C EAR 60 mJ Single pulsed avalanche energy G TC=25C Power Dissipation B Derate above 25oC MOSFET dv/dt ruggedness Peak diode recovery dv/dt H Junction and Storage Temperature Range EAS 45 120 PD W 1.4 0.22 W/ oC 100 20 -55 to 150 TJ, TSTG TL Thermal Characteristics Parameter Maximum Junction-to-Ambient A,D Symbol RJA V/ns C 300 C AOW11S60 AOWF11S60 Units 65 65 C/W 0.5 0.7 -4.5 C/W C/W RCS Maximum Case-to-sink A Maximum Junction-to-Case RJC * Drain current limited by maximum junction temperature. Rev 3: Jan 2012 28 dv/dt Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds J mJ 178 www.aosmd.com Page 1 of 6 AOW11S60/AOWF11S60 Electrical Characteristics (TJ=25C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units ID=250A, VGS=0V, TJ=25C 600 - - ID=250A, VGS=0V, TJ=150C 650 700 - V A STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current VDS=600V, VGS=0V - - 1 VDS=480V, TJ=150C - 10 - IGSS Gate-Body leakage current VDS=0V, VGS=30V - - 100 VGS(th) Gate Threshold Voltage VDS=5V,ID=250A 2.8 3.5 4.1 n V RDS(ON) Static Drain-Source On-Resistance VSD Diode Forward Voltage IS ISM VGS=10V, ID=3.8A, TJ=25C - 0.35 0.399 VGS=10V, ID=3.8A, TJ=150C - 0.98 1.11 IS=5.5A,VGS=0V, TJ=25C - 0.84 - V Maximum Body-Diode Continuous Current - - 11 A Maximum Body-Diode Pulsed CurrentC - - 45 A DYNAMIC PARAMETERS Input Capacitance Ciss Coss Output Capacitance Co(er) Effective output capacitance, energy related H Crss Effective output capacitance, time related I Reverse Transfer Capacitance Rg Gate resistance Co(tr) - 545 - pF - 37.3 - pF - 30.8 - pF - 93.6 - pF VGS=0V, VDS=100V, f=1MHz - 1.42 - pF VGS=0V, VDS=0V, f=1MHz - 16.5 - VGS=0V, VDS=100V, f=1MHz VGS=0V, VDS=0 to 480V, f=1MHz SWITCHING PARAMETERS Total Gate Charge Qg - 11 - nC - 2.8 - nC Gate Drain Charge - 3.8 - nC Turn-On DelayTime - 20 - ns - 20 - ns - 59 - ns - 20 - ns IF=5.5A,dI/dt=100A/s,VDS=400V Qgs Gate Source Charge Qgd tD(on) tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf trr Turn-Off Fall Time VGS=10V, VDS=480V, ID=5.5A VGS=10V, VDS=400V, ID=5.5A, RG=25 Body Diode Reverse Recovery Time Peak Reverse Recovery Current - 250 - ns Irm IF=5.5A,dI/dt=100A/s,VDS=400V - 21 - Qrr Body Diode Reverse Recovery Charge IF=5.5A,dI/dt=100A/s,VDS=400V - 3.3 - A C A. The value of R JA is measured with the device in a still air environment with T A =25C. B. The power dissipation PD is based on TJ(MAX)=150C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150C, Ratings are based on low frequency and duty cycles to keep initial TJ =25C. D. The R JA is the sum of the thermal impedance from junction to case R JC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 s pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150C. The SOA curve provides a single pulse ratin g. G. L=60mH, IAS=2A, VDD=150V, Starting TJ=25C H. Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS. I. Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS. J. Wavesoldering only allowed at leads. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev 3: Jan 2012 www.aosmd.com Page 2 of 6 AOW11S60/AOWF11S60 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 16 24 10V 10V 20 7V 12 7V 6V 12 8 5.5V 4 5V 6V ID (A) ID (A) 16 8 5.5V 4 5V VGS=4.5V VGS=4.5V 0 0 0 5 10 15 0 20 5 10 15 20 VDS (Volts) Figure 2: On-Region Characteristics@125C VDS (Volts) Figure 1: On-Region Characteristics@25C 100 1.2 -55C VDS=20V 0.9 10 RDS(ON) ( ) ID(A) 125C 1 25C VGS=10V 0.6 0.3 0.1 0.0 0.01 2 4 6 8 0 10 10 15 20 25 ID (A) Figure 4: On-Resistance vs. Drain Current and Gate Voltage VGS(Volts) Figure 3: Transfer Characteristics 1.2 3 2.5 VGS=10V ID=3.8A BVDSS (Normalized) Normalized On-Resistance 5 2 1.5 1 1.1 1 0.9 0.5 0 -100 -50 0 50 100 150 200 Temperature (C) Figure 5: On-Resistance vs. Junction Temperature Rev 3: Jan 2012 www.aosmd.com 0.8 -100 -50 0 50 100 150 200 TJ (oC) Figure 6: Break Down vs. Junction Temperature Page 3 of 6 AOW11S60/AOWF11S60 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 15 1.0E+02 1.0E+01 125C 12 VDS=480V ID=5.5A 25C 1.0E-01 9 VGS (Volts) IS (A) 1.0E+00 1.0E-02 6 1.0E-03 3 1.0E-04 1.0E-05 0 0.0 0.2 0.4 0.6 0.8 1.0 VSD (Volts) Figure 7: Body-Diode Characteristics (Note E) 0 8 12 16 Qg (nC) Figure 8: Gate-Charge Characteristics 10000 6 5 Ciss 1000 Eoss(uJ) Capacitance (pF) 4 100 Eoss 4 3 Coss 2 10 1 Crss 0 1 0 100 200 300 400 500 VDS (Volts) Figure 9: Capacitance Characteristics 0 600 100 200 300 400 VDS (Volts) Figure 10: Coss stored Energy 500 600 100 100 10s RDS(ON) limited 10 100s 1 DC 1ms ID (Amps) ID (Amps) 10 10s RDS(ON) limited 100s 1ms 1 10ms 0.1 10ms 0.1s 1s DC 0.1 TJ(Max)=150C TC=25C TJ(Max)=150C TC=25C 0.01 0.01 1 10 100 1000 VDS (Volts) Figure 11: Maximum Forward Biased Safe Operating Area for AOW11S60 (Note F) Rev 3: Jan 2012 www.aosmd.com 0.1 1 10 VDS (Volts) 100 1000 Figure 12: Maximum Forward Biased Safe Operating Area for AOWF11S60(Note F) Page 4 of 6 AOW11S60/AOWF11S60 120 12 90 9 Current rating ID(A) EAS(mJ) TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 60 30 0 6 3 0 25 50 75 100 125 TCASE (C) Figure 13: Avalanche energy 150 175 0 25 50 75 100 125 TCASE (C) Figure 14: Current De-rating (Note B) 150 Z JC Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TC+PDM.ZJC.RJC RJC=0.7C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse PD 0.1 Ton 0.01 T Single Pulse 0.001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Width (s) Figure 15: Normalized Maximum Transient Thermal Impedance for AOW11S60 (Note F) Z JC Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TC+PDM.ZJC.RJC RJC=4.5C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD 0.01 Ton T Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 Pulse Width (s) Figure 16: Normalized Maximum Transient Thermal Impedance for AOWF11S60 (Note F) Rev 3: Jan 2012 www.aosmd.com Page 5 of 6 AOW11S60/AOWF11S60 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC DUT - Vgs Ig Charge Res istive Switching Test Circuit & Waveforms RL Vds Vds DUT Vgs + VDC 90% Vdd - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf t off Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L EAR= 1/2 LI Vds 2 AR BVDSS Vds Id + Vdd Vgs Vgs I AR VDC - Rg Id DUT Vgs Vgs Diode Recovery Tes t Circuit & Waveforms Qrr = - Idt Vds + DUT Vgs Vds - Isd Vgs Ig Rev 3: Jan 2012 L Isd + VDC - IF trr dI/dt IRM Vdd Vdd Vds www.aosmd.com Page 6 of 6