LT3055 Series
5
Rev. B
For more information www.analog.com
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 2)
PARAMETER CONDITIONS MIN TYP MAX UNITS
FAULT, PWRGD Pins Logic Low Voltage Pull-Up Current = 50μA l 0.14 0.25 V
FAULT, PWRGD Pins Leakage Current VFAULT1, VFAULT2, VPWRGD = 5V 0.01 1 μA
IMIN Threshold Accuracy (Notes 6, 9) 5.6V < VIN < 15V, VOUT = 5V, RIMIN = 1.2M
5.6V < VIN < 15V, VOUT = 5V, RIMIN = 120K
l
l
0.9
9
1
10
1.1
11
mA
mA
PWRGD Trip Point % of Nominal Output Voltage, Output Rising l86 90 94 %
PWRGD Trip Point Hysteresis % of Nominal Output Voltage 1 %
Current Monitor Ratio (Notes 6,10), Ratio = IOUT/IMON ILOAD = 10mA, 250mA, 500mA l450 500 550 mA/mA
TEMP Voltage (Note 16) TJ = 25°C
TJ = 125°C
0.25
1.25
V
V
TEMP Error (Note 16) l–0.08 0.08 V
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime. Absolute maximum input-to-output differential
voltage is not achievable with all combinations of rated IN pin and OUT pin
voltages. With the IN pin at 50V, the OUT pin may not be pulled below 0V.
The total differential voltage from IN to OUT must not exceed +50V, –40V.
If OUT is pulled above GND and IN, the total differential voltage from OUT
to IN must not exceed 40V.
Note 2: The LT3055 is tested and specified under pulse load conditions
such that TJ ~ TA. The LT3055E is 100% production tested at TA = 25°C
and performance is guaranteed from 0°C to 125°C. Performance at –40°C
and 125°C is assured by design, characterization and correlation with
statistical process controls. The LT3055I is guaranteed over the full –40°C
to 125°C operating junction temperature range. The LT3055MP is 100%
tested over the –55°C to 150°C operating junction temperature range. The
LT3055H is 100% tested at 150°C operating junction temperature.
Note 3: The LT3055 adjustable version is tested and specified for these
conditions with ADJ pin connected to the OUT pin.
Note 4: Maximum junction temperature limits operating conditions.
Regulated output voltage specifications do not apply for all possible
combinations of input voltage and output current. If operating at the
maximum input voltage, limit the output current range. If operating at
the maximum output current, limit the input voltage range. Current limit
foldback limits the maximum output current as a function of input-to-
output voltage. See Current Limit vs VIN-VOUT in the Typical Performance
Characteristics section.
Note 5: Dropout voltage is the minimum differential IN-to-OUT voltage
needed to maintain regulation at a specified output current. In dropout,
the output voltage equals (VIN – VDROPOUT). For some output voltages,
minimum input voltage requirements limit dropout voltage.
Note 6: To satisfy minimum input voltage requirements, the LT3055
adjustable version is tested and specified for these conditions with an
external resistor divider (60k bottom, 440k top) which sets VOUT to 5V. The
external resistor divider adds 10μA of DC load on the output. This external
current is not factored into GND pin current.
Note 7: GND pin current is tested with VIN = VOUT(NOMINAL) + 0.6V and a
current source load. GND pin current increases in dropout. For the fixed
output voltage versions, an internal resistor divider adds about 10µA to
GND pin current. See GND pin current curves in the Typical Performance
Characteristics section.
Note 8: Current limit varies inversely with the external resistor value tied
from the IMAX pin to GND. For detailed information on how to set the IMAX
pin resistor value, please see the Operation section. If a programmed
current limit is not needed, tie the IMAX pin to GND and internal protection
circuitry implements short-circuit protection as specified.
Note 9: The IMIN fault condition asserts if the output current falls below the
IMIN threshold defined by an external resistor from the IMIN pin to GND.
For detailed information on how to set the IMIN pin resistor value, please
see the Operation section. If the IMIN fault condition is not needed, the IMIN
pin must be left floating (unconnected).
Note 10: Current monitor ratio is tested with the IMON pin fixed at
VOUT – 0.5V and with the input range limited to VOUT + 0.6V < VIN < VOUT
+ 10V for IOUT = 10mA; VOUT + 0.6V < VIN < VOUT + 4V for IOUT = 250mA,
and VOUT + 0.6V < VIN < VOUT + 2V for IOUT = 500mA. Input voltage range
conditions are set to limit power dissipation in the IC to 1W maximum for
test purposes. The current monitor ratio varies slightly when in current
limit or when the IMON voltage exceeds VOUT – 0.5V. Please see the
Operation section for more information. If the current monitor function is
not needed, tie the IMON pin to GND.
Note 11: To satisfy requirements for minimum input voltage, current limit
is tested at VIN = VOUT(NOMINAL) + 1V or VIN = 2.2V, whichever is greater.
Note 12: ADJ pin bias current flows out of the ADJ pin.
Note 13: SHDN pin current flows into the SHDN pin.
Note 14: Reverse output current is tested with the IN pin grounded and the
OUT pin forced to the specified voltage. This current flows into the OUT
pin and out of the GND pin.
Note 15: 500mA of output current does not apply to the full range of input
voltage due to the internal current limit foldback.
Note 16: The TEMP output voltage represents the average temperature of
the die while dissipating quiescent power. Due to the pass device power
dissipation and temperature gradients across the die, the TEMP output
voltage measurement does not guarantee that absolute maximum junction
temperature is not exceeded.
Note 17: Minimum Input Voltage is the input voltage at which the output
voltage is decreased 1% from nominal. At elevated temperatures, an input
voltage greater than this is necessary for correct operation of the TEMP
pin. See Temp Pin Minimum Input Voltage in the Typical Performance
Characteristics section.