www.ti.com SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS SCES046G - JULY 1995 - REVISED OCTOBER 2004 FEATURES * * * * * * DGG OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments WidebusTM Family EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JESD 17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages OEA LE1B 2B3 GND 2B2 2B1 VCC A1 A2 A3 GND A4 A5 A6 A7 A8 A9 GND A10 A11 A12 VCC 1B1 1B2 GND 1B3 LE2B SEL DESCRIPTION This 12-bit to 24-bit multiplexed D-type latch is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH16260 is used in applications in which two separate data paths must be multiplexed onto, or demultiplexed from, a single data path. Typical applications include multiplexing and/or demultiplexing address and data information in microprocessor or bus-interface applications. This device also is useful in memory-interleaving applications. Three 12-bit I/O ports (A1-A12, 1B1-1B12, and 2B1-2B12) are available for address and/or data transfer. The output-enable (OE1B, OE2B, and OEA) inputs control the bus transceiver functions. The OE1B and OE2B control signals also allow bank control in the A-to-B direction. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 OE2B LEA2B 2B4 GND 2B5 2B6 VCC 2B7 2B8 2B9 GND 2B10 2B11 2B12 1B12 1B11 1B10 GND 1B9 1B8 1B7 VCC 1B6 1B5 GND 1B4 LEA1B OE1B Address and/or data information can be stored using the internal storage latches. The latch-enable (LE1B, LE2B, LEA1B, and LEA2B) inputs are used to control data storage. When the latch-enable input is high, the latch is transparent. When the latch-enable input goes low, the data present at the inputs is latched and remains latched until the latch-enable input is returned high. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74ALVCH16260 is characterized for operation from -40C to 85C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, EPIC are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1995-2004, Texas Instruments Incorporated SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES046G - JULY 1995 - REVISED OCTOBER 2004 FUNCTION TABLES XXX B TO A (OEB = H) INPUTS 1B 2B SEL LE1B LE2B OEA OUTPUT A H X H H X L H L X H H X L L X X H L X L A0 X H L X H L H X L L X H L L X X L X L L A0 X X X X X H Z A TO B (OEA = H) INPUTS 2 OUTPUTS A LEA1B LEA2B OE1B OE2B 1B 2B H H H L L H H L H H L L L L H H L L L H 2B0 L H L L L L 2B0 H L H L L 1B0 H L L H L L 1B0 L X L L L L 1B0 2B0 X X X H H Z Z X X X L H Active Z X X X H L Z Active X X X L L Active Active SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES046G - JULY 1995 - REVISED OCTOBER 2004 LOGIC DIAGRAM (POSITIVE LOGIC) LE1B LE2B LEA1B LEA2B OE2B OE1B OEA SEL A1 2 27 30 55 56 29 1 28 G1 C1 1 1D 8 23 1B1 1 C1 1D 6 2B1 C1 1D C1 1D To 11 Other Channels 3 SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES046G - JULY 1995 - REVISED OCTOBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range MIN MAX -0.5 4.6 Except I/O ports (2) -0.5 4.6 I/O ports (2) (3) -0.5 VCC + 0.5 -0.5 VCC + 0.5 UNIT V VI Input voltage range VO Output voltage range (2) (3) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA Continuous current through each VCC or GND JA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) DGG package 81 DL package 74 -65 V V C/W C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 UNIT V 0.65 x VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 x VCC VCC = 1.65 V to 1.95 V VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 VI Input voltage 0 VCC V VO Output voltage 0 VCC V VCC = 2.7 V to 3.6 V IOH IOL High-level output current Low-level output current 0.8 VCC = 1.65 V -4 VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 t/v Input transition rise or fall rate TA (1) 4 Operating free-air temperature V -40 mA mA 10 ns/V 85 C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES046G - JULY 1995 - REVISED OCTOBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 A 1.65 V to 3.6 V 1.65 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = -24 mA 3V 2 IOL = 100 A IOH = -12 mA II(hold) V 1.65 V to 3.6 V 0.2 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 IOL = 24 mA 2.7 V 0.4 3V 0.55 5 VI = VCC or GND 3.6 V VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 3V -75 VI = 2 V VI = 0 to 3.6 V (2) IOZ (3) VO = VCC or GND ICC VI = VCC or GND, IO = 0 ICC One input at VCC - 0.6 V, Other inputs at VCC or GND UNIT 1.2 IOL = 4 mA IOL = 12 mA II MAX VCC - 0.2 IOH = -4 mA VOH VOL MIN TYP (1) VCC V A A 3.6 V 500 3.6 V 10 A 3.6 V 40 A 3 V to 3.6 V 750 A Ci Control inputs VI = VCC or GND 3.3 V 3.5 pF Cio A or B ports VO = VCC or GND 3.3 V 9 pF (1) (2) (3) All typical values are at VCC = 3.3 V, TA = 25C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. For I/O ports, the parameter IOZ includes the input leakage current. TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3) VCC = 1.8 V MIN MAX VCC = 2.5 V 0.2 V VCC = 2.7 V MIN MAX MIN MAX VCC = 3.3 V 0.3 V MIN UNIT MAX tw Pulse duration, LE1B, LE2B, LEA1B, or LEA2B high (1) 3.3 3.3 3.3 ns tsu Setup time, data before LE1B, LE2B, LEA1B, or LEA2B (1) 1.4 1.1 1.1 ns th Hold time, data after LE1B, LE2B, LEA1B, or LEA2B (1) 1.6 1.9 1.5 ns (1) This information was not available at the time of publication. 5 SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES046G - JULY 1995 - REVISED OCTOBER 2004 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3) PARAMETER tpd (1) VCC = 2.5 V 0.2 V VCC = 2.7 V VCC = 3.3 V 0.3 V MIN MAX MIN MAX MIN MAX (1) 1 5.4 5.1 1.2 4.3 A or B (1) 1 5.6 5.2 1 4.4 FROM (INPUT) TO (OUTPUT) VCC = 1.8 V A or B B or A LE TYP UNIT ns SEL A (1) 1 6.9 6.6 1.1 5.6 ten OE A or B (1) 1 6.7 6.4 1 5.4 ns tdis OE A or B (1) 1 5.7 5 1.3 4.6 ns This information was not available at the time of publication. OPERATING CHARACTERISTICS TA = 25C PARAMETER Cpd (1) 6 Power dissipation capacitance All outputs enabled All outputs disabled TEST CONDITIONS CL = 50 pF, This information was not available at the time of publication. f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 37 41 (1) 4 7 UNIT pF SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES046G - JULY 1995 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 1.8 V 2 x VCC S1 1 k From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 1 k S1 Open 2 x VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 x VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH - 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2 ns, tf 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 7 SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES046G - JULY 1995 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V 0.2 V 2 x VCC S1 500 From Output Under Test Open GND CL = 30 pF (see Note A) 500 TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 2 x VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 x VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH - 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2 ns, tf 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 2. Load Circuit and Voltage Waveforms 8 SN74ALVCH16260 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES046G - JULY 1995 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 V AND 3.3 V 0.3 V 6V S1 500 From Output Under Test Open GND CL = 50 pF (see Note A) 500 TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 6V GND tw LOAD CIRCUIT 2.7 V 2.7 V Timing Input Input 1.5 V 1.5 V 0V 1.5 V 0V tsu VOLTAGE WAVEFORMS PULSE DURATION th 2.7 V Data Input 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES Output Control (low-level enabling) 2.7 V 1.5 V 0V tPZL 2.7 V Input 1.5 V 1.5 V 0V tPLH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ 3V 1.5 V VOL + 0.3 V VOL tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPHL 1.5 V Output Waveform 2 S1 at GND (see Note B) tPHZ VOH 1.5 V VOH - 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms 9 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ALVCH16260DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16260DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16260DLG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16260DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16260DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16260DL ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16260DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 20 Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74ALVCH16260DGGR TSSOP SN74ALVCH16260DLR SSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVCH16260DGGR TSSOP DGG 56 2000 346.0 346.0 41.0 SN74ALVCH16260DLR SSOP DL 56 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). 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