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IR4426/IR4427/IR4428(S) & (PbF)
ADVANCE INFORMATION
www.irf.com
Symbol Definition Min. Max. Units
VSFixed supply voltage -0.3 25
VOOutput voltage -0.3 VS + 0.3
VIN Logic input voltage -0.3 VS + 0.3
PDPackage power dissipation @ TA ≤ +25°C (8 Lead PDIP) — 1.0
(8 lead SOIC) — 0.625
RthJA Thermal resistance, junction to ambient (8 lead PDIP) — 125
(8 lead SOIC) — 200
TJJunction temperature — 150
TSStorage temperature -55 150
TLLead temperature (soldering, 10 seconds) — 300
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to GND. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
V
°C
Symbol Definition Min. Max. Units
VSFixed supply voltage 6 20
VOOutput voltage 0 VS
VIN Logic input voltage 0 VS
TAAmbient temperature -40 125
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. All voltage parameters are absolute voltages referenced to GND.
°C
V
W
°C/W
Symbol Definition Min. Typ. Max. Units Test Conditions
VIH Logic “0” input voltage (OUTA=LO, OUTB=LO) 2.7 — —
(IR4426)
Logic “1” input voltage (OUTA=HI, OUTB=HI)
(IR4427)
Logic “0” input voltage (OUTA=LO), Logic “1”
input voltage (OUTB=HI) (IR4428)
DC Electrical Characteristics
VBIAS (VS) = 15V, TA = 25°C unless otherwise specified. The VIN, and IIN parameters are referenced to GND and are
applicable to input leads: INA and INB. The VO and IO parameters are referenced to GND and are applicable to the
output leads: OUTA and OUTB.
V