B57421V2471J062 - EPCOS - Product.Network

NTC thermistors for

temperature measurement

SMD NTC thermistors,

case size 0805 (2012), standard series

Series/Type: B574**V2/ B57620C5

Date: June 2012

The following products presented in this data sheet are being withdrawn.

Ordering Code Substitute Product Date of

Withdrawal Deadline Last

Orders Last Shipments

B57411V2470+062 2012-11-09 2013-03-01 2013-06-01

B57411V2331+062 2012-11-09 2013-03-01 2013-06-01

B57411V2221+062 2012-11-09 2013-03-01 2013-06-01

information contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

Ordering Code Substitute Product Date of

Withdrawal Deadline Last

Orders Last Shipments

B57411V2151+062 2012-11-09 2013-03-01 2013-06-01

B57411V2101+062 2012-11-09 2013-03-01 2013-06-01

B57421V2681+062 2012-11-09 2013-03-01 2013-06-01

B57421V2471+062 2012-11-09 2013-03-01 2013-06-01

For further information please contact your nearest EPCOS sales office, which will also support

you in selecting a suitable substitute. The addresses of our worldwide sales network are

presented at www.epcos.com/sales.

1) Depends on mounting situation

Applications

Temperature measurement and

compensation

Features

Multilayer SMD NTC with inner electrodes

Nickel barrier termination

Excellent long-term aging stability in high

temperature environment

UL approval (E69802)

Options

Alternative resistance ratings, resistance

tolerances and B value tolerances available

on request.

Delivery mode

Blister tape, 180-mm reel (standard);

330-mm reel (on request)

Dimensional drawing

Dimensions in mm

Approx. weight 13 mg

General technical data

Operating temperature range Top 55 ... 125 °C

Max. power (at 25 °C, on PCB) P251) 210 mW

Resistance tolerance ∆RR/RR±3, ±5 %

Rated temperature TR25 °C

Dissipation factor (on PCB) δth1) approx. 3.5 mW/K

Thermal cooling time constant (on PCB) τc1) approx. 10 s

Heat capacity Cth1) approx. 35 mJ/K

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 2 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Electrical specification and ordering codes

R25

ΩNo. of R/T

characteristic

B25/50

B25/85

B25/100

Ordering code

+ = Resistance tolerance

H = ±3%

J = ±5%

47 8500 3590 3635 3650 ±3% B57411V2470+062

100 8501 3500 3540 3550 ±3% B57411V2101+062

150 8501 3500 3540 3550 ±3% B57411V2151+062

220 8501 3500 3540 3550 ±3% B57411V2221+062

330 8501 3500 3540 3550 ±3% B57411V2331+062

470 8502 3940 3980 4000 ±3% B57421V2471+062

680 8502 3940 3980 4000 ±3% B57421V2681+062

1.0 k 1010 3470 3514 3530 ±3% B57620C5102+062

1.0 k 8502 3940 3980 4000 ±3% B57421V2102+062

1.5 k 8502 3940 3980 4000 ±3% B57421V2152+062

2.2 k 8502 3940 3980 4000 ±3% B57421V2222+062

3.3 k 8502 3940 3980 4000 ±3% B57421V2332+062

4.7 k 8500 3590 3635 3650 ±3% B57401V2472+062

4.7 k 8507 4386 4455 4480 ±3% B57471V2472+062

6.8 k 8507 4386 4455 4480 ±3% B57471V2682+062

10 k 1011 3660 3720 3730 ±3% B57620C5103+062

10 k 8500 3590 3635 3650 ±3% B57401V2103+062

10 k 8502 3940 3980 4000 ±3% B57421V2103+062

10 k 8507 4386 4455 4480 ±3% B57471V2103+062

15 k 8502 3940 3980 4000 ±3% B57421V2153+062

22 k 8502 3940 3980 4000 ±3% B57421V2223+062

22 k 8507 4386 4455 4480 ±3% B57471V2223+062

33 k 8502 3940 3980 4000 ±3% B57421V2333+062

33 k 8507 4386 4455 4480 ±3% B57471V2333+062

47 k 8502 3940 3980 4000 ±3% B57421V2473+062

47 k 8507 4386 4455 4480 ±3% B57471V2473+062

100 k 8507 4386 4455 4480 ±3% B57471V2104+062

470 k 8507 4386 4455 4480 ±3% B57471V2474+062

680 k 8507 4386 4455 4480 ±3% B57471V2684+062

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 3 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Reliability data

SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a

standardized PCB in accordance with IEC 60539-1.

Test Standard Test conditions ∆R25/R25

(typical)

Remarks

Storage in

dry heat

IEC

60068-2-2

JIS C 0021

Storage at upper

category temperature

T: (125 ±2) °C

t: 1000 h

< 2%1)

Storage in damp

heat, steady state

IEC

60068-2-78

JIS C 0022

Temperature of air: (40 ±2) °C

Relative humidity of air:

(93 +2/3)%

Duration: 56 days2)

< 2%2)

Rapid temperature

cycling

IEC

60068-2-14

JIS C 0025

Lower test temperature: 55 °C

Upper test temperature: 125 °C

Number of cycles: 1003)

< 2%3)

Endurance Pmax: 210 mW

T: (65 ±2) °C

t: 1000 h

< 2%4)

Solderability IEC

60068-2-58

JIS C 0054

Solderability:

(215 ±3) °C, (3 ±0.3) s

(245 ±5) °C, (3 ±0.3) s

Resistance to soldering heat:

(260 ±5) °C, (10 ±1) s

95% of

terminations

wetted

Resistance drift

after soldering

Reflow soldering profile

Wave soldering profile

< 1%5)

1) Except B57620C5102+062 ∆R25/R25 (typical): < 6%, B57620C5103+062 ∆R25/R25 (typical): < 3%

2) Except B57620C5102+062 and B57620C5103+062 duration: 21 days, ∆R25/R25 (typical): < 3%

3) Except B57620C5102+062 and B57620C5103+062 number of cycles: 10, ∆R25/R25 (typical): < 3%

4) Except B57620C5102+062 and B57620C5103+062 ∆R25/R25 (typical): < 5%

5) Except B57620C5102+062 and B57620C5103+062 ∆R25/R25 (typical): < 5%

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 4 of 21Please read Cautions and warnings and

Important notes at the end of this document.

R/T characteristics

R/T No. 1010 1011 8500

T (°C) B25/100 = 3530 K B25/100 = 3730 K B25/100 = 3650 K

RT/R25 α(%/K) RT/R25 α(%/K) RT/R25 α(%/K)

55.0 52.826 6.4 70.014 6.9 63.917 6.8

50.0 38.643 6.1 49.906 6.7 45.889 6.5

45.0 28.574 5.9 36.015 6.4 33.344 6.3

40.0 21.346 5.7 26.296 6.2 24.504 6.1

35.0 16.1 5.5 19.411 6.0 18.201 5.8

30.0 12.256 5.4 14.479 5.8 13.657 5.6

25.0 9.4071 5.2 10.903 5.6 10.347 5.5

20.0 7.2862 5.0 8.2923 5.4 7.9114 5.3

15.0 5.6835 4.9 6.3591 5.2 6.1019 5.1

10.0 4.4698 4.7 4.9204 5.1 4.7454 4.9

5.0 3.5385 4.6 3.8279 4.9 3.7198 4.8

0.0 2.8222 4.5 3.0029 4.8 2.938 4.6

5.0 2.2649 4.3 2.3773 4.6 2.3372 4.5

10.0 1.83 4.2 1.8959 4.5 1.8722 4.4

15.0 1.4872 4.1 1.5207 4.3 1.5096 4.2

20.0 1.2161 4.0 1.228 4.2 1.2249 4.1

25.0 1.0000 3.9 1.0000 4.1 1.0000 4.0

30.0 0.82677 3.8 0.81779 3.9 0.82111 3.9

35.0 0.68708 3.6 0.67341 3.8 0.67798 3.8

40.0 0.57401 3.5 0.55747 3.7 0.56279 3.7

45.0 0.48181 3.5 0.46357 3.6 0.46958 3.6

50.0 0.40638 3.4 0.3874 3.6 0.39374 3.5

55.0 0.34427 3.3 0.32368 3.5 0.33171 3.4

60.0 0.29296 3.2 0.272 3.4 0.28073 3.3

65.0 0.25035 3.1 0.23041 3.3 0.23863 3.2

70.0 0.21478 3.0 0.19604 3.2 0.2037 3.1

75.0 0.18501 2.9 0.16735 3.1 0.17459 3.0

80.0 0.15995 2.9 0.14342 3.0 0.15022 3.0

85.0 0.13881 2.8 0.12347 3.0 0.12975 2.9

90.0 0.12088 2.7 0.10668 2.8 0.11247 2.8

95.0 0.10563 2.7 0.092734 2.8 0.097838 2.8

100.0 0.092597 2.6 0.080903 2.8 0.085396 2.7

105.0 0.081442 2.5 0.070616 2.7 0.074781 2.6

110.0 0.071842 2.5 0.061826 2.6 0.065691 2.6

115.0 0.063571 2.4 0.054282 2.6 0.057883 2.5

120.0 0.056407 2.4 0.047793 2.5 0.051153 2.4

125.0 0.050196 2.3 0.042249 2.4 0.045335 2.4

130.0     0.040289 2.3

135.0     0.0359 2.3

140.0     0.032071 2.2

145.0     0.028723 2.2

150.0     0.025786 2.1

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 5 of 21Please read Cautions and warnings and

Important notes at the end of this document.

R/T characteristics

R/T No. 8501 8502 8507

T (°C) B25/100 = 3550 K B25/100 = 4000 K B25/100 = 4480 K

RT/R25 α(%/K) RT/R25 α(%/K) RT/R25 α(%/K)

55.0 56.633 6.5 96.158 7.4 142.71 7.9

50.0 41.134 6.3 66.892 7.1 96.913 7.6

45.0 30.209 6.1 47.127 6.9 66.637 7.4

40.0 22.42 5.9 33.606 6.6 46.366 7.1

35.0 16.807 5.7 24.243 6.4 32.629 6.9

30.0 12.721 5.5 17.681 6.2 23.213 6.7

25.0 9.7156 5.3 13.032 6.0 16.686 6.5

20.0 7.4854 5.1 9.702 5.8 12.115 6.3

15.0 5.8152 5.0 7.2923 5.6 8.8803 6.1

10.0 4.5537 4.8 5.5314 5.4 6.5692 5.9

5.0 3.5931 4.7 4.2325 5.3 4.9025 5.8

0.0 2.8558 4.5 3.2657 5.1 3.6896 5.6

5.0 2.2857 4.4 2.54 4.9 2.7994 5.4

10.0 1.8416 4.3 1.9907 4.8 2.1406 5.3

15.0 1.4934 4.1 1.5716 4.7 1.6492 5.1

20.0 1.2184 4.0 1.2494 4.5 1.2798 5.0

25.0 1.0000 3.9 1.0000 4.4 1.0000 4.9

30.0 0.82537 3.8 0.80552 4.3 0.78663 4.7

35.0 0.68495 3.7 0.65288 4.1 0.62277 4.6

40.0 0.57139 3.6 0.53229 4.0 0.4961 4.5

45.0 0.47905 3.5 0.43645 3.9 0.39757 4.4

50.0 0.40358 3.4 0.35981 3.8 0.32044 4.3

55.0 0.34158 3.3 0.29819 3.7 0.2597 4.1

60.0 0.2904 3.2 0.24837 3.6 0.21161 4.0

65.0 0.24795 3.1 0.20787 3.5 0.17331 3.9

70.0 0.21259 3.0 0.17479 3.4 0.14265 3.8

75.0 0.183 3.0 0.14763 3.3 0.11799 3.8

80.0 0.15813 2.9 0.12523 3.2 0.098035 3.7

85.0 0.13715 2.8 0.10667 3.2 0.081823 3.6

90.0 0.11938 2.7 0.091227 3.1 0.068589 3.5

95.0 0.10427 2.7 0.078319 3.0 0.057735 3.4

100.0 0.091375 2.6 0.067488 2.9 0.048796 3.3

105.0 0.080333 2.5 0.058363 2.9 0.041403 3.2

110.0 0.070846 2.5 0.050647 2.8 0.035263 3.2

115.0 0.062666 2.4 0.044098 2.7 0.030143 3.1

120.0 0.055592 2.4 0.03852 2.7 0.025858 3.0

125.0 0.049454 2.3 0.033752 2.6 0.022258 3.0

130.0   0.029663 2.6 0.019223 2.9

135.0   0.026146 2.5 0.016655 2.8

140.0   0.023111 2.4 0.014476 2.8

145.0   0.020484 2.4 0.012619 2.7

150.0   0.018203 2.3 0.011033 2.7

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 6 of 21Please read Cautions and warnings and

Important notes at the end of this document.

1) ≤0.2 mm over 10 sprocket holes.

Taping and packing

1 Taping of SMD NTC thermistors

1.1 Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3)

Dimensions (mm)

Case size

0402

(8-mm tape)

Case size

0603

(8-mm tape)

Tolerance

A0×B00.60 ×1.15 0.95 ×1.80 ±0.2

T20.70 1.10

T 0.60 0.90 max.

D01.50 1.50 ±0.10

P04.00 4.00 ±0.101)

P22.00 2.00 ±0.05

P12.00 4.00 ±0.10

W 8.00 8.00 ±0.30

E 1.75 1.75 ±0.10

F 3.50 3.50 ±0.05

G 0.75 0.75 min.

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 7 of 21Please read Cautions and warnings and

Important notes at the end of this document.

2) ≤0.2 mm over 10 sprocket holes.

1.2 Blister tape for case size 0805 and 1206 (taping to IEC 60286-3)

Dimensions (mm)

Case size

0805

(8-mm tape)

Case size

1206

(8-mm tape)

Tolerance

A0×B01.60 ×2.40 1.90 ×3.50 ±0.2

K01.40 1.40 max.

T22.5 2.5 max.

D01.50 1.50 +0.10/–0

D11.00 1.00 min.

P04.00 4.00 ±0.102)

P22.00 2.00 ±0.05

P14.00 4.00 ±0.10

W 8.00 8.00 ±0.30

E 1.75 1.75 ±0.10

F 3.50 3.50 ±0.05

G 0.75 0.75 min.

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 8 of 21Please read Cautions and warnings and

Important notes at the end of this document.

3) Chip thickness depends on the resistance value.

1.3 Reel packing

Packing survey

Case

size

Chip

thick-

ness3)

8-mm tape Reel dimensions Packing units

mm mm pcs./reel

Blister Card-

board

A Tol. W1 Tol. W2 180-mm

reel

330-mm

reel

0402 0.5 x 180 3/+0 8.4 +1.5/0 14.4 max. 10000 

0603 0.8 x 180 3/+0 8.4 +1.5/0 14.4 max. 4000 

330 ±2.0 12.4 +1.5/0 18.4 max. 16000

0805 0.8 x 180 3/+0 8.4 +1.5/0 14.4 max. 4000 16000

1.2 x 330 ±2.0 12.4 +1.5/0 18.4 max. 3000 12000

1206 0.8 x 180 2/+0 8.4 +1.5/0 14.4 max. 4000 

1.2 x 180 2/+0 8.4 +1.5/0 14.4 max. 2000 

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 9 of 21Please read Cautions and warnings and

Important notes at the end of this document.

2 Packing codes

The last two digits of the complete ordering code state the packing mode:

Last two digits

60 SMD Cardboard tape 180-mm reel packing

62 SMD Blister tape 180-mm reel packing

70 SMD Cardboard tape 330-mm reel packing

72 SMD Blister tape 330-mm reel packing

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 10 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Mounting instructions

1 Soldering

1.1 SMD NTC thermistors

SMD NTC thermistors can be provided with a nickel barrier termination or on special request with

silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-

ed as well as a proper cleaning of the PCB.

The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the

silver base metalization layer. This allows great flexibility in the selection of soldering parameters.

The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The

nickel barrier termination is suitable for all commonly-used soldering methods.

Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.

Figure 1

SMD NTC thermistors, structure of nickel barrier termination

1.1.1 Solderability (test to IEC 60068-2-58)

Preconditioning: Immersion into flux F-SW 32.

Evaluation criterion: Wetting of soldering areas ≥95%.

Solder Bath temperature (°C) Dwell time (s)

SnPb 60/40 215 ±3 3 ±0.3

SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3

1.1.2 Resistance to soldering heat (test to IEC 60068-2-58)

Preconditioning: Immersion into flux F-SW 32.

Evaluation criterion: Leaching of side edges ≤1/3.

Solder Bath temperature (°C) Dwell time (s)

SnPb 60/40 260 ±5 10 ±1

SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 11 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Wave soldering

Temperature characteristic at component terminal with dual wave soldering

Solder joint profiles for silver/nickel/tin terminations

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 12 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Reflow soldering

Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature Sn-Pb eutectic assembly Pb-free assembly

Preheat and soak

- Temperature min Tsmin 100 °C 150 °C

- Temperature max Tsmax 150 °C 200 °C

- Time tsmin to tsmax 60 ... 120 s 60 ... 180 s

Average ramp-up rate Tsmax to Tp3°C/ s max. 3 °C/ s max.

Liquidous temperature TL183 °C 217 °C

Time at liquidous tL60 ... 150 s 60 ... 150 s

Peak package body temperature Tp1) 220 °C ... 235 °C2) 245 °C ... 260 °C2)

Time (tP)3) within 5 °C of specified

classification temperature (Tc)20 s3) 30 s3)

Average ramp-down rate Tpto Tsmax 6°C/ s max. 6 °C/ s max.

Time 25 °C to peak temperature maximum 6 min maximum 8 min

1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.

3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Number of reflow cycles: 3

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 13 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Solder joint profiles for silver/nickel/tin terminations

1.1.3 Recommended geometry of solder pads

Recommended maximum dimensions (mm)

Case size

inch/mm

ABC

0402/1005 0.6 0.6 1.7

0603/1608 1.0 1.0 3.0

0805/2012 1.3 1.2 3.4

1206/3216 1.8 1.2 4.5

1.1.4 Notes

Iron soldering should be avoided, hot air methods are recommended for repair purposes.

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 14 of 21Please read Cautions and warnings and

Important notes at the end of this document.

2 Conductive adhesion

An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of

this method is that it involves no thermal stress. The adhesives used must be chemically inert.

3 Clamp contacting

Pressure contacting by means of clamps is particularly suitable for applications involving frequent

switching and high turn-on powers.

4 Sealing and potting

When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused

by thermal expansion during the production process (curing / overmolding process) and during

later operation. The upper category temperature of the thermistor must not be exceeded. Ensure

that the materials used (sealing / potting compound and plastic material) are chemically neutral.

5 Cleaning

If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are

recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are

permissible.

6 Storage

In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.

Humidity, temperature and container materials are critical factors.

Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-

terial may be deformed or SMDs may stick together, causing problems during mounting. After

opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.

The components should be left in the original packing. Touching the metallization of unsoldered

thermistors may change their soldering properties.

Storage temperature: 25 °Cupto45°C

Relative humidity (without condensation): ≤75% annual mean

<95%, maximum 30 days per annum

Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-

fied:

SMDs: 12 months for Ni-barrier termination

6 months for AgPd termination

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 15 of 21Please read Cautions and warnings and

Important notes at the end of this document.

7 Placement and orientation of SMD NTC thermistors on PCB

a) Component placement

It is recommended that the PC board

should be held by means of some

adequate supporting pins such as

shown left to prevent the SMDs from

being damaged or cracked.

b) Cracks

When placing a component near an

area which is apt to bend or a grid

groove on the PC board, it is advisable

to have both electrodes subjected to

uniform stress, or to position the

component's electrodes at right angles

to the grid groove or bending line (see

c) Component orientation).

c) Component orientation

Choose a mounting position that

minimizes the stress imposed on the

chip during flexing or bending of the

board.

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 16 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Cautions and warnings

General

See "Important notes".

Storage

Store thermistors only in original packaging. Do not open the package prior to storage.

Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative

humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is

inadmissible.

Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the

packing material may be deformed or components may stick together, causing problems during

mounting.

Avoid contamination of thermistor surface during storage, handling and processing.

Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).

Use the components as soon as possible after opening the factory seals, i.e. the

polyvinyl-sealed packages.

Solder SMD NTC thermistors with nickel barrier termination within 12 months after shipment

from EPCOS.

Handling

NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused

during handling of NTCs.

Do not touch components with bare hands. Gloves are recommended.

Avoid contamination of thermistor surface during handling.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

Soldering

Use resin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 17 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Mounting

Ensure that no thermo-mechanical stress occurs due to production processes (curing or

overmolding processes) when thermistors are sealed, potted or overmolded or during their

subsequent operation. The maximum temperature of the thermistor must not be exceeded.

Ensure that the materials used (sealing/potting compound and plastic material) are chemically

neutral.

Electrodes/contacts must not be scratched or damaged before/during/after the mounting

process.

Contacts and housing used for assembly with the thermistor must be clean before mounting.

Ensure that adjacent materials are designed for operation at temperatures comparable to the

surface temperature of the thermistor. Be sure that surrounding parts and materials can

withstand the temperature.

Avoid contamination of the thermistor surface during processing.

The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to

an environment with normal atmospheric conditions.

Avoid using chemical substances as mounting aids. It must be ensured that no water or other

liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based

substances (e.g. soap suds) must not be used as mounting aids for sensors.

Operation

Use thermistors only within the specified operating temperature range.

Use thermistors only within the specified power range.

Environmental conditions must not harm the thermistors. Only use the thermistors under

normal atmospheric conditions or within the specified conditions.

Contact of NTC thermistors with any liquids and solvents should be prevented. It must be

ensured that no water enters the NTC thermistors (e.g. through plug terminals). For

measurement purposes (checking the specified resistance vs. temperature), the component

must not be immersed in water but in suitable liquids (e.g. Galden).

Avoid dewing and condensation unless thermistor is specified for these conditions.

Be sure to provide an appropriate fail-safe function to prevent secondary product damage

caused by malfunction.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 18 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Symbols and terms

Symbol English German

A Area Fläche

B B value B-Wert

B25/100 B value determined by resistance

measurement at 25 °C and 100 °C

B-Wert, ermittelt durch Widerstands-

messungen bei 25 °C und 100 °C

Cth Heat capacitance Wärmekapazität

I Current Strom

N Number (integer) Anzahl (ganzzahliger Wert)

P25 Maximum power at 25 °C Maximale Leistung bei 25 °C

Pdiss Power dissipation Verlustleistung

Pel Electrical power Elektrische Leistung

Pmax Maximum power within stated

temperature range

Maximale Leistung im

angegebenenTemperaturbereich

∆RB/RBResistance tolerance caused by

spread of B value

Widerstandstoleranz, die durch die

Streuung des B-Wertes verursacht wird

Rins Insulation resistance Isolationswiderstand

RPParallel resistance Parallelwiderstand

RRRated resistance Nennwiderstand

∆RR/RRResistance tolerance Widerstandstoleranz

RSSeries resistance Serienwiderstand

RTResistance at temperature T

(e.g. R25 = resistance at 25 °C)

Widerstand bei Temperatur T

(z.B. R25 = Widerstand bei 25 °C)

T Temperature Temperatur

∆T Temperature tolerance Temperaturtoleranz

t Time Zeit

TAAmbient temperature Umgebungstemperatur

Tmax Upper category temperature Obere Grenztemperatur

(Kategorietemperatur)

Tmin Lower category temperature Untere Grenztemperatur

(Kategorietemperatur)

Top Operating temperature Betriebstemperatur

TRRated temperature Nenntemperatur

Tsurf Surface temperature Oberflächentemperatur

V Voltage Spannung

Vins Insulation test voltage Isolationsprüfspannung

Vop Operating voltage Betriebsspannung

Vtest Test voltage Prüfspannung

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 19 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Symbol English German

αTemperature coefficient Temperaturkoeffizient

∆Tolerance, change Toleranz, Änderung

δth Dissipation factor Wärmeleitwert

τcThermal cooling time constant Thermische Abkühlzeitkonstante

τaThermal time constant Thermische Zeitkonstante

Abbreviations / Notes

Symbol English German

Surface-mounted devices Oberflächenmontierbares Bauelement

* To be replaced by a number in ordering

codes, type designations etc.

Platzhalter für Zahl im Bestellnummern-

code oder für die Typenbezeichnung.

+ To be replaced by a letter. Platzhalter für einen Buchstaben.

All dimensions are given in mm. Alle Maße sind in mm angegeben.

The commas used in numerical values

denote decimal points.

Verwendete Kommas in Zahlenwerten

bezeichnen Dezimalpunkte.

Temperature measurement and compensation B574**V2/ B57620C5

SMD NTC thermistors, case size 0805 (2012) Standard series

Page 20 of 21Please read Cautions and warnings and

Important notes at the end of this document.

Page 21 of 21

Important notes

The following applies to all products named in this publication:

Some parts of this publication contain

statements about the suitability of our products for certain

areas of application

. These statements are based on our knowledge of typical requirements that are

often placed on our products in the areas of application concerned. We nevertheless expressly point

out

that such statements cannot be regarded as binding statements about the suitability of our

products for a particular customer application.

As a rule we are either unfamiliar with individual

customer applications or less familiar with them than the customers themselves. For these reasons, it is

always ultimately incumbent on the customer to check and decide whether a product with the properties

described in the product specification is suitable for use in a particular customer application.

We also point out that

in individual cases, a malfunction of electronic components or failure

before the end of their usual service life cannot be completely ruled out in the current state of the

art, even if they are operated as specified.

In customer applications requiring a very high level of

operational safety and especially in customer applications in which the malfunction or failure of an

electronic component could endanger human life or health (e.g. in accident prevention or life-saving

systems), it must therefore be ensured by means of suitable design of the customer application or other

action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or

damage is sustained by third parties in the event of malfunction or failure of an electronic component.

The warnings, cautions and product-specific notes must be observed.

In order to satisfy certain technical requirements,

some of the products described in this publication

may contain substances subject to restrictions in certain jurisdictions (e.g. because they are

classed as hazardous)

. Useful information on this will be found in our Material Data Sheets on the

Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please

contact our sales offices.

We constantly strive to improve our products. Consequently,

the products described in this

publication may change from time to time

. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications contained

in this publication are still applicable before or when you place an order.

We also

reserve the right to discontinue production and delivery of products

. Consequently, we

cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the foregoing for

customer-specific products.

Unless otherwise agreed in individual contracts,

all orders are subject to our General Terms and

Conditions of Supply.

Our manufacturing sites serving the automotive business apply the IATF 16949 standard.

The

IATF certifications confirm our compliance with requirements regarding the quality management system

in the automotive industry. Referring to customer requirements and customer specific requirements

(“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even

if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to

emphasize that

only requirements mutually agreed upon can and will be implemented in our

Quality Management System.

For clarification purposes we like to point out that obligations from IATF

16949 shall only become legally binding if individually agreed upon.

The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,

PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI,

SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are

trademarks registered or pending

in Europe and in other countries. Further information will be found

on the Internet at www.tdk-electronics.tdk.com/trademarks.

Release 2018-10