TMC262-LA - TRINAMIC - Product.Network

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 1

TRINAMIC

®

Motion Control GmbH & Co. KG

Sternstraße 67

D – 20357 Hamburg

GERMANY

www.trinamic.com

1 Features

The TMC262 family is an energy efficient two phase stepper motor driver with high resolution

microstepping capability. It integrates the low resonance chopper spreadCycle for quiet and fast motor

operation. Its step and direction interface allows simple use. An SPI interface allows for

parameterization and diagnostics and can also be used to drive the motor. The TMC262 directly drives

four external N/P channel dual MOSFETs for motor currents up to 8A and up to 60V. Protection and

diagnostic features further reduce system cost and increase reliability. The TMC260 and TMC261

integrate a power stage for applications up to 40V resp. 60V and 1.7A. Their basic pinning is

compatible to the TMC236, allowing a simple upgrade path for existing applications. Its energy

efficiency and low power dissipation allow for a miniaturized design with minimum additional

infrastructure requirements making it a very cost effective driver.

Highlights

• up to 256 microsteps using the step/direction interface or the SPI interface

• coolStep™: Save up to 75% of energy using automatic load adaptive motor current control

• stallGuard2™: High precision sensorless motor load measurement

• microPlyer: Microstep extrapolator gives 256 microstep smoothness with low frequency step input

• spreadCycle: High precision chopper algorithm

• Dual edge step option allows half step frequency requirement, e.g. for opto-couplers

• Up to 8A Motor current using external N&P channel MOSFET pairs (TMC262)

Up to 1.7A with integrated power MOS transistors (TMC260 and TMC261)

• Synchronous rectification reduces transistor heating

• 9V to 60V operating voltage (TMC261, TMC262), respectively 9V to 40V (TMC260)

• 3.3V or 5V interface

• QFN32 package (TMC262) for extremely small solution with superior thermal performance

• 10mm x 10mm TQFP-44 package (TMC260, TMC261) integrates power bridges

• EMV optimized current controlled gate drivers – up to 40mA gate current (TMC262)

• Overcurrent, short to GND and overtemperature protection and diagnostics integrated

Applications

• Energy efficient industrial and commercial stepper applications

• Precision two phase stepper motor drives

• Medical and optical applications

• Robotics

Motor type

• 2 phase Stepper

TMC260, TMC261, TMC262

Energy saving high resolution microstep two

phase stepper driver with step and direction

interface and internal (TMC260, TMC261) or

external power stage (TMC262) with diagnostics

and protection

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 2

2 Table of contents

1

FEATURES .......................................................................................................................................... 1

2

TABLE OF CONTENTS ........................................................................................................................ 2

3

PRINCIPLE OF OPERATION ............................................................................................................... 4

3.1

M

OVING THE MOTOR

........................................................................................................................ 4

3.1.1

Step and direction control .................................................................................................. 4

3.1.2

SPI control .......................................................................................................................... 4

3.2

C

HOPPED MOTOR COIL DRIVER

............................................................................................................ 4

3.3

E

NERGY EFFICIENT DRIVER WITH LOAD FEEDBACK

.................................................................................... 4

4

PINNING ........................................................................................................................................... 5

4.1

TMC260-PA,

TMC261-PA ............................................................................................................... 5

4.2

TMC262-LA .................................................................................................................................. 5

4.3

P

ACKAGE CODES

............................................................................................................................. 5

4.4

D

IMENSIONAL DRAWINGS

................................................................................................................. 6

4.4.1

PQFP44 dimensions ............................................................................................................ 6

4.4.2

QFN32 dimensions .............................................................................................................. 6

5

BLOCK DIAGRAM .............................................................................................................................. 8

5.1

P

IN DESCRIPTION OF

TMC262-LA .................................................................................................... 10

5.2

P

IN DESCRIPTION OF

TMC260-PA

/

TMC261-PA ................................................................................ 11

6

SPI MODE SHIFT REGISTER ............................................................................................................ 12

6.1

O

VERVIEW

(

WRITE

) ........................................................................................................................ 12

6.2

O

VERVIEW

(

READ

) ......................................................................................................................... 12

6.3

D

RIVER CONTROL REGISTER BIT ASSIGNMENT

....................................................................................... 13

6.3.1

Driver control register bit assignment in SPI mode ......................................................... 13

6.3.2

Driver control register bit assignment in StepDir mode .................................................. 14

6.4

C

ONFIGURATION REGISTER BIT ASSIGNMENT

........................................................................................ 15

6.5

B

IT ASSIGNMENT FOR READ

............................................................................................................. 18

6.6

SPI

TIMING

................................................................................................................................. 19

7

STEP AND DIRECTION INTERFACE ................................................................................................. 20

7.1

T

IMING

....................................................................................................................................... 20

7.2

I

NTERNAL MICROSTEP TABLE

............................................................................................................ 20

7.3

S

WITCHING BETWEEN DIFFERENT MICROSTEP RESOLUTIONS

..................................................................... 21

7.3.1

Working with half- and fullstep resolution ...................................................................... 21

7.4

S

TEP RATE MULTIPLIER AND STAND STILL DETECTION

............................................................................. 22

8

CURRENT SETTING .......................................................................................................................... 23

8.1

C

ONSIDERATIONS ON THE CURRENT SENSE RESISTORS AND LAYOUT

........................................................... 23

9

CHOPPER OPERATION OF THE MOTOR COILS ................................................................................ 25

9.1

SPREAD

C

YCLE CHOPPER

................................................................................................................... 25

9.2

C

LASSIC CONSTANT OFF TIME CHOPPER

............................................................................................... 27

9.3

R

ANDOM OFF TIME

........................................................................................................................ 28

10

MOSFET DRIVER STAGE .............................................................................................................. 29

10.1

P

RINCIPLE OF OPERATION

............................................................................................................ 29

10.2

B

REAK

-

BEFORE

-

MAKE LOGIC

.......................................................................................................... 29

10.3

S

LOPE CONTROL IN

TMC262 ....................................................................................................... 30

11

DIAGNOSTICS AND PROTECTION ............................................................................................... 31

11.1

S

HORT TO

GND

DETECTION

......................................................................................................... 31

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 3

11.2

O

PEN LOAD DETECTION

............................................................................................................... 31

11.3

T

EMPERATURE MEASUREMENT

........................................................................................................ 32

11.4

U

NDERVOLTAGE DETECTION

.......................................................................................................... 32

12

STALLGUARD2™ SENSORLESS LOAD MEASUREMENT ................................................................. 33

12.1

T

UNING THE STALL

G

UARD

2™

THRESHOLD

SGT ................................................................................ 33

12.1.1

Variable velocity operation............................................................................................... 33

12.1.2

Small motors with high torque ripple and resonance ..................................................... 34

12.1.3

Temperature dependence of motor coil resistance .......................................................... 34

12.1.4

Accuracy and reproducibility of stallGuard2™ measurement ........................................... 34

12.2

STALL

G

UARD

2™

MEASUREMENT FREQUENCY AND FILTERING

................................................................ 34

13

COOLSTEP™ SMART ENERGY OPERATION .................................................................................. 36

13.1

COOL

S

TEP

™

SMART ENERGY CURRENT REGULATOR

............................................................................. 36

13.1.1

Adaptation to the load situation ..................................................................................... 36

13.1.2

Low velocity and standby operation ................................................................................ 36

13.2

U

SER BENEFITS

,

SAVE ENERGY

,

REDUCE POWER AND COOLING INFRASTRUCTURE

........................................ 37

14

CLOCK OSCILLATOR AND CLOCK INPUT ..................................................................................... 38

14.1

C

ONSIDERATIONS ON THE FREQUENCY

............................................................................................ 38

15

ABSOLUTE MAXIMUM RATINGS .................................................................................................. 39

16

ELECTRICAL CHARACTERISTICS .................................................................................................. 39

16.1

O

PERATIONAL

R

ANGE

................................................................................................................. 39

16.2

DC

C

HARACTERISTICS AND

T

IMING

C

HARACTERISTICS

........................................................................ 40

16.3

ESD

SENSITIVE DEVICE

............................................................................................................... 44

16.4

MOSFET

EXAMPLES

................................................................................................................... 45

17

USING AN EXTERNAL POWER STAGE FOR HIGHER VOLTAGE AND CURRENT ............................ 46

18

GETTING STARTED ...................................................................................................................... 47

18.1

I

NITIALIZATION OF THE DRIVER

..................................................................................................... 47

19

TABLE OF FIGURES ...................................................................................................................... 48

20

REVISION HISTORY .................................................................................................................... 48

20.1

D

OCUMENTATION

R

EVISION

......................................................................................................... 48

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 4

3 Principle of operation

figure 1: basic application block diagram

3.1 Moving the motor

3.1.1 Step and direction control

The TMC262 family is a family of chopped stepper motor drivers with integrated sequencer and SPI

interface. They provide two possibilities to control the motor: The motor can be controlled by applying

pulses on the step and direction interface, following an initialization phase which uses the SPI

interface to parameterize the driver for the application. Control and diagnostic registers give the

flexibility to react to changing operation conditions and to modify the behavior of the chip when it

receives a step impulse. An internal microstep table supplies sine and cosine values which control the

motor current for each step. Each step impulse advances the step pointer in the tables and hence

leads to the IC executing the next microstep.

3.1.2 SPI control

A second mode of operation uses the SPI interface, only. Both motor coil currents can be controlled

via the SPI interface, while taking advantage of all other control and diagnostic functions. This mode is

more flexible, as the microstep waves can be specially adapted to the motor to give the best fit for

smoothest operation. It requires slightly more CPU overhead to look up the driver tables and to send

out new current values for both coils. The SPI update rate corresponds to the step rate at low

velocities. At highest velocities the update rate can be limited to a few 10kHz or some 100kHz,

depending on the processor power, or alternatively to an update rate corresponding to a fullstep.

3.2 Chopped motor coil driver

The driver use a cycle by cycle chopper mode: The motor current becomes regulated by comparing

the motor current to a set value for each chopper cycle. This constant off time chopper scheme allows

highest dynamic. The spreadCycle chopper scheme automatically integrates a fast decay cycle and

guarantees smooth zero crossing performance. In an optional operation mode, fast decay length per

cycle can be selected by the user. In this classic constant off time mode, zero crossing can be

optimized by setting a programmable current offset.

3.3 Energy efficient driver with load feedback

The TMC262 family integrates a high resolution load measurement stallGuard2™, which allows

sensing the mechanical load on the motor. This gives more information on the drive allowing functions

like sensorless homing. Its coolStep™ feature uses load measurement information to reduce the

motor current to the minimum motor current required in the actual load situation. This saves lots of

energy and keeps components cool, making the drive an efficient and precise solution.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 5

4 Pinning

4.1 TMC260-PA, TMC261-PA

1

9

4

12

17

14

15

16

22

18

21

13

19

20

33

25

30

41

44

43

42

39

36

35

40

38

37

34

TMC260-PA / TMC261-PA

QFP44

-

OB1

OB2

BRB

VSB

DIR

GND

TST_MODE

STEP

GND

VS

VHS

VCC_IO

SG_TST

TST_ANA

-

OA1

OA2

OA1

BRA

VSA

SRA

GND

SDO

SDI

SCK

SRB

CSN

CLK

5VOUT

ENN

-

2

3

5

6

7

8

10

11

24

23

27

26

29

28

32

31

figure 2: TMC260 and TMC261 pinning

4.2 TMC262-LA

figure 3: TMC262 pinning

4.3 Package codes

Type Package Temperature range Code/marking

TMC260 TQFP44 (ROHS) -40°C ... +125°C TMC260-PA

TMC261 TQFP44 (ROHS) -40°C ... +125°C TMC261-PA

TMC262 QFN32 (ROHS) -40°C ... +125°C TMC262-LA

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 6

4.4 Dimensional drawings

For drawings, see next page.

Attention: Drawings not to scale.

4.4.1 PQFP44 dimensions

Parameter Ref Min Nom Max

size over pins (X&Y) A 12

body size (X&Y) C 10

pin length D 1

total thickness E 1.6

lead frame thickness F 0.09 0.2

stand off G 0.05 0.10 0.15

pin width H 0.30 0.45

flat lead length I 0.45 0.75

pitch K 0.8

coplanarity ccc 0.08

All dimensions are in mm.

4.4.2 QFN32 dimensions

Parameter Ref Min Nom Max

total thickness A 0.80 0.85 0.90

stand off A1 0.00 0.035

0.05

mold thickness A2 - 0.65 0.67

lead frame thickness A3 0.203

lead width b 0.2 0.25 0.3

body size X D 5.0

body size Y E 5.0

lead pitch e 0.5

exposed die pad size X J 3.2 3.3 3.4

exposed die pad size Y K 3.2 3.3 3.4

lead length L 0.35 0.4 0.45

package edge tolerance aaa 0.1

mold flatness bbb 0.1

coplanarity ccc 0.08

lead offset ddd 0.1

exposed pad offset eee 0.1

All dimensions are in mm.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 7

figure 4: PQFP44 dimensions

figure 5: QFN32 5x5 dimensions

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 8

5 Block diagram

+VM

VHS

5V linear

regulator

5VOUT

470nF

VM

GND

slope HS

slope LS SRA

D

ENABLE

5V supply

TMC262

OSC

13MHz

CSN D

SCK

SDI

D

SDO D

RSENSE

DIE PAD

SPI interface

Chopper

logic

100m for 2.8A peak

(resp. 1.5A peak)

Provide sufficient filtering capacity

near bridge transistors (electrolyt

capacitors and ceramic capacitors)

S

D

G

S

D

G

P

N

motor coil A

HA2

HA1

BMA1

BMA2

S

D

G

S

D

G

P

N

LA1

LA2

P-Gate

drivers

Short to

GND

detectors

N-Gate

drivers

Break

before

make

VHS

+5V

9DAC

VM-10V

linear

regulator

220n

16V 100n

Protection &

Diagnostics

+VM

slope HS

slope LS SRB RSENSE

Chopper

logic

100m for 2.8A peak

(resp. 1.5A peak)

S

D

G

S

D

G

P

N

motor coil B

HB2

HB1

BMB1

BMB2

S

D

G

S

D

G

P

N

LB1

LB2

P-Gate

drivers

Short to

GND

detectors

N-Gate

drivers

Break

before

make

VHS

+5V

9DAC

ENABLE

Step &

Direction

interface

Step multiply

16 256

Sine wave

1024 entry

M

U

X

STEP D

DIR D

Temperature

sensor

100°C, 150°C

CoolStep

Energy

efficiency

stallGuard 2

Clock

selector

CLK D

SG_TST

Digital

control

D

SHORT

TO GND

BACK

EMF

CLK

8-20MHz

SIN &

COS

Phase polarity

VCC_IO D

D

TEST_SE

3.3V or 5V

+VCC

100n

9-59V

step & dir

(optional)

SPI

stallGuard

output

TEST_ANA

10R

optional input protection resistors

against inductive sparks upon

motor cable break

VREF

figure 6: TMC262 block and application diagram

The application diagram shows the basic building blocks of the IC and the connections to the power

bridge transistors, as well as the power supply. The connection of the digital interface lines to the

microcontroller and / or a motion controller is specific to the system architecture and the micro-

controller type. The choice of power MOSFETs for the TMC262 depends on the desired motor current

and supply voltage. Please refer chapter 16.4. For even higher motor current capability, external

MOSFET drivers can be added using full N channel bridges.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 9

+VM

VHS

5V linear

regulator

5VOUT

470nF

VM

GND

slope HS

slope LS SRA

D

ENABLE

5V supply

TMC260 / TMC261

OSC

13MHz

CSN D

SCK

SDI

D

SDO D

RSENSE

SPI interface

Chopper

logic

150m

for 1.8A peak

(resp. 1A peak)

Provide sufficient filtering capacity

near bridge supply (electrolyt

capacitors and ceramic capacitors)

S

D

G

S

D

G

motor coil A

S

D

G

S

D

G

P-Gate

drivers

Short to

GND

detectors

N-Gate

drivers

Break

before

make

VHS

+5V

9DAC

VM-10V

linear

regulator

100n

16V 100n

Protection &

Diagnostics

+VM

slope HS

slope LS RSENSE

Chopper

logic

150m

for 1.8A peak

(resp. 1A peak)

S

D

G

S

D

G

motor coil B

S

D

G

S

D

G

P-Gate

drivers

Short to

GND

detectors

N-Gate

drivers

Break

before

make

VHS

+5V

9DAC

ENABLE

Step &

Direction

interface

Step multiply

16 256

Sine wave

1024 entry

M

U

X

STEP D

DIR D

Temperature

sensor

100°C, 150°C

CoolStep

Energy

efficiency

stallGuard 2

Clock

selector

CLK D

SG_TST

Digital

control

D

SHORT

TO GND

BACK

EMF

CLK

8-20MHz

SIN &

COS

Phase polarity

VCC_IO D

D

TEST_SE

3.3V or 5V

+VCC

100n

9-39V / 9-59V

step & dir

(optional)

SPI

stallGuard

output

TEST_ANA

10R

optional input protection resistors

against inductive sparks upon

motor cable break

VSENSE

0.30V

0.16V

VREF

OA1

OA2

VSA

BRA

SRB

BRB

OB2

OB1

VSB

figure 7: TMC260 and TMC261 block and application diagram

The TMC260 and TMC261 integrate 40V resp. 60V MOSFETs capable of driving 1.2A RMS motors

continuously. They are identical to the TMC262 in all other respects.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 10

5.1 Pin description of TMC262-LA

Pin Number Type Function

GND 1, 13 Digital and analog low power GND

HAx

HBx

2, 3

22, 23

O (VS) High side P-channel driver output. Becomes driven to VHS to switch

on MOSFET.

BMAx

BMBx

4, 5

20, 21

I (VS) Sensing input for bridge outputs. Used for short to GND protection.

May be tied to VS if unused.

LAx

LBx

6, 7

18, 19

O 5V Low side MOSFET driver output. Becomes driven to 5VOUT to

switch on MOSFET.

SRA

SRB

8

17

AI Sense resistor input of chopper driver.

5VOUT 9 Output of internal 5V linear regulator. Provided for VCC supply. An

external capacitor to GND close to the pin is required. This voltage

is used to supply the low side drivers and internal analog circuitry.

SDO 10 DO VIO

Data output of SPI interface (Tristate)

SDI 11 DI VIO Data input of SPI interface

(Scan test input in test mode)

SCK 12 DI VIO Serial clock input of SPI interface

(Scan test shift enable input in test mode)

CSN 14 DI VIO Chip select input of SPI interface

ENN 15 DI VIO Enable not input for drivers. Switches off all MOSFETs.

CLK 16 DI VIO Clock input for all internal operations. Tie low to use internal

oscillator. A high signal disables the internal oscillator until power

down.

VHS 24 High side supply voltage (motor supply voltage - 10V)

VS 25 Motor supply voltage

TST_ANA 26 AO VIO

Analog mode test output. Leave open for normal operation.

SG_TST 27 DO VIO

stallGuard2™ output. Signals motor stall (high active).

GNDP 28 Power GND for MOSFET drivers. Connect directly to GND

VCC_IO 29 Input / output supply voltage VIO for all digital pins. Tie to digital

logic supply voltage. Allows operation in 3.3V and 5V systems.

DIR 30 DI VIO Direction input. Is sampled upon detection of a step to determine

stepping direction. An internal glitch filter for 60ns is provided.

STEP 31 DI VIO Step input. An internal glitch filter for 60ns is provided.

TST_MODE

32 DI VIO Test mode input. Puts IC into test mode. Tie to GND for normal

operation.

exposed die

pad

- GND Connect the exposed die pad to a GND plane. It is used for cooling

of the IC and may either be left open or be connected to GND.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 11

5.2 Pin description of TMC260-PA / TMC261-PA

Pin Number Type Function

OA1 2, 3

7, 8

O (VS) Bridge A1 output. Interconnect all pins using thick traces capable to

carry the motor current and distribute heat into the PCB. *)

OA2 5, 6

10, 11

O (VS) Bridge A2 output. Interconnect all pins using thick traces capable to

carry the motor current and distribute heat into the PCB. *)

OB1 26, 27

31, 32

O (VS) Bridge B1 output. Interconnect all pins using thick traces capable to

carry the motor current and distribute heat into the PCB. *)

OB2 23, 24

28, 29

O (VS) Bridge B2 output. Interconnect all pins using thick traces capable to

carry the motor current and distribute heat into the PCB. *)

VSA

VSB

4

30

Bridge A/B positive power supply. Connect to VS and provide

sufficient filtering capacity for chopper current ripple.

BRA

BRB

9

25

AI Bridge A/B negative power supply via sense resistor in bridge foot

point.

SRA

SRB

12

22

AI Sense resistor sensing input of chopper driver.

5VOUT 13 Output of internal 5V linear regulator. Provided for VCC supply. An

external capacitor to GND close to the pin is required. This voltage

is used to supply the low side drivers and internal analog circuitry.

SDO 14 DO VIO

Data output of SPI interface (Tristate)

SDI 15 DI VIO Data input of SPI interface

(Scan test input in test mode)

SCK 16 DI VIO Serial clock input of SPI interface

(Scan test shift enable input in test mode)

GND 17, 39,

44

Digital and analog low power GND

CSN 18 DI VIO Chip select input of SPI interface

ENN 19 DI VIO Enable not input for drivers. Switches off all MOSFETs.

CLK 21 DI VIO Clock input for all internal operations. Tie low to use internal

oscillator. A high signal disables the internal oscillator until power

down.

VHS 35 High side supply voltage (motor supply voltage - 10V)

VS 36 Motor supply voltage

TST_ANA 37 AO VIO

Analog mode test output. Leave open for normal operation.

SG_TST 38 DO VIO

stallGuard2™ output. Signals motor stall (high active).

VCC_IO 40 Input / output supply voltage VIO for all digital pins. Tie to digital

logic supply voltage. Allows operation in 3.3V and 5V systems.

DIR 41 DI VIO Direction input. Is sampled upon detection of a step to determine

stepping direction. An internal glitch filter for 60ns is provided.

STEP 42 DI VIO Step input. An internal glitch filter for 60ns is provided.

TST_MODE

43 DI VIO Test mode input. Puts IC into test mode. Tie to GND for normal

operation.

*) The OA and OB dual pin outputs directly are connected electrically and thermally to the drain of the

MOSFETs of the driver output stage. A symmetrical, thermally optimized layout is required to ensure

proper heat dissipation of all MOSFETs into the PCB. Use thick traces and enough vias for the motor

driver outputs.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 12

6 SPI mode shift register

The TMC26x requires a configuration via SPI prior to operation. Its SPI interface also allows for

reading back status flags. The SPI interface can operate up to the half clock frequency. The MSB (bit

19) is transmitted first. See chapter 6 for details.

6.1 Overview (write)

Register/

Bit

DRVCTRL

(SDOFF=1)

DRVCTRL

(SDOFF=0)

CHOPCONF

SMARTEN

SGCSCONF

DRVCONF

19 0 0 1 1 1 1

18 0 0 0 0 1 1

17 PHA - 0 1 0 1

16 CA7 - TBL1 0 SFILT TST

15 CA6 - TBL0 SEIMIN - SLPH1

14 CA5 - CHM SEDN1 SGT6 SLPH0

13 CA4 - RNDTF SEDN0 SGT5 SLPL1

12 CA3 - HDEC1 - SGT4 SLPL0

11 CA2 - HDEC0 SEMAX3 SGT3 -

10 CA1 - HEND3 SEMAX2 SGT2 DISS2G

9 CA0 INTPOL HEND2 SEMAX1 SGT1 TS2G1

8 PHB DEDGE HEND1 SEMAX0 SGT0 TS2G0

7 CB7 - HEND0 - - SDOFF

6 CB6 - HSTRT2 SEUP1 - VSENSE

5 CB5 - HSTRT1 SEUP0 - RDSEL1

4 CB4 - HSTRT0 - CS4 RDSEL0

3 CB3 MRES3 TOFF3 SEMIN3 CS3 -

2 CB2 MRES2 TOFF2 SEMIN2 CS2 -

1 CB1 MRES1 TOFF1 SEMIN1 CS1 -

0 CB0 MRES0 TOFF0 SEMIN0 CS0 -

6.2 Overview (read)

Bit RDSEL=00 RDSEL=01 RDSEL=10

19 MSTEP9 SG9 SG9

18 MSTEP8 SG8 SG8

17 MSTEP7 SG7 SG7

16 MSTEP6 SG6 SG6

15 MSTEP5 SG5 SG5

14 MSTEP4 SG4 SE4

13 MSTEP4 SG3 SE3

12 MSTEP2 SG2 SE2

11 MSTEP1 SG1 SE1

10 MSTEP0 SG0 SE0

9 - - -

8 - - -

7 STST

6 OLB

5 OLA

4 S2GB

3 S2GA

2 OTPW

1 OT

0 SG

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 13

6.3 Driver control register bit assignment

The driver control register is used to operate the device in SPI mode. In StepDir mode, it selects

specific step and direction interface specific parameters. They need to be initialized once upon power

up, and whenever basic parameters are required to be changed. Only write access is possible.

The meaning of register 0 depends on the mode selection between SPI mode and StepDir mode as

selected by SDOFF (configuration register 11, bit 7).

6.3.1 Driver control register bit assignment in SPI mode

DRVCTRL write 0xxx, SDOFF=1

Bit Name Function Comment

19 CFR select configuration

register

0

: Operation mode dependent settings (see SDOFF)

18 - reserved set to 0

17 PHA Polarity A

16 CA7 Current A MSB 0 to max. 248 if hysteresis or offset are used up to their

full extent. The resulting value is not allowed to

overflow 255.

15 CA6

14 CA5

13 CA4

12 CA3

11 CA2

10 CA1

9 CA0 Current A LSB

8 PHB Polarity B

7 CB7 Current B MSB 0 to max. 248 if hysteresis or offset are used up to their

full extent. The resulting value is not allowed to

overflow 255.

6 CB6

5 CB5

4 CB4

3 CB3

2 CB2

1 CB1

0 CB0 Current B LSB

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 14

6.3.2 Driver control register bit assignment in StepDir mode

DRVCTRL write 0xxx, SDOFF=0

Bit Name Function Comment

19 CFR select configuration

register

0

: Operation mode dependent settings (see SDOFF)

18 - reserved set to 0

17 - reserved set to 0

16 - reserved set to 0

15 - reserved set to 0

14 - reserved set to 0

13 - reserved set to 0

12 - reserved set to 0

11 - reserved set to 0

10 - reserved set to 0

9 INTPOL enable step

interpolation

1: Enable step impulse multiplication by 16. Only in

resolution 16x microsteps, the microstepping becomes

extrapolated to 256 microsteps. Interpolation is possible

starting below step distance of max. 2^20 clock periods.

8 DEDGE enable double edge

step pulses

1: Enable step impulse at each step edge to reduce

step frequency requirement.

7 - reserved set to 0

6 - reserved set to 0

5 - reserved set to 0

4 - reserved set to 0

3 MRES3 micro step resolution

for step/direction mode

0000 … 1000:

256, 128, 64, 32, 16, 8, 4, 2, FULLSTEP

Please take into account, that the microstep position

when switching to a lower resolution determines the

sequence of patterns.

2 MRES2

1 MRES1

0 MRES0

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 15

6.4 Configuration register bit assignment

The configuration registers select the mode of operation and set all motor and application dependent

parameters. They need to be initialized once upon power up, and whenever basic parameters are

required to be changed. Only write access is possible.

CHOPCONF write 100x: Chopper Configuration

Bit Name Function Comment

19 CFR select configuration

register

1

: Configuration register

18 CFRSEL1

select configuration

register

0

: Chopper configuration register

17 CFRSEL0

16 TBL1 blank time select 00 … 11:

Set comparator blank time to 16, 24, 36 or 54 clocks

15 TBL0

14 CHM chopper mode 0 Standard mode (spreadCycle)

1

Constant t

OFF

with fast decay time.

Fast decay time is also terminated when the

negative nominal current is reached. Fast

decay is after on time.

13 RNDTF random TOFF time 0 Chopper off time is fixed as set by bits t

OFF

1 Random mode, t

OFF

is random modulated by

dN

CLK

= -12 … +3 clocks.

12 HDEC1 hysteresis decrement

interval

or fast decay mode

CHM=0

Hysteresis decrement period setting:

00 … 11: 16, 32, 48, 64 clocks

11 HDEC0

CHM=1

FDMODE setting:

HDEC1=1 disables current comparator usage

for termination of the fast decay cycle

HDEC0: MSB of fast decay time setting

10 HEND3 hysteresis low value

or

sine wave offset

0000 … 1111:

Hysteresis is -3, -2, -1, 0, 1, …, 12

(1/512 of this setting adds to current setting)

With CHM=1 this is the sine wave offset.

9 HEND2

8 HEND1

7 HEND0

6 HSTRT2 hysteresis start value

or

fast decay time setting

CHM=0

DAC hysteresis setting:

000 … 111:

add 1, 2, …, 8 to hysteresis low value HEND

(1/512 of this setting adds to current setting)

Attention:

Effective HEND+HSTRT must be ≤ 15

5 HSTRT1

4 HSTRT0

CHM=1 Fast decay time setting (MSB: HDEC0):

0000 … 1111: Fast decay time setting with

N

CLK

= 32*HSTRT (000: slow decay only)

3 TOFF3 off time

and driver enable

Off time setting for constant t

OFF

chopper

N

CLK

= 12 + 32*t

OFF

(Minimum is 64 clocks)

0000: Driver disable, all bridges off

0001: not allowed

0010 … 1111: 2 … 15

2 TOFF2

1 TOFF1

0 TOFF0

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 16

SMARTEN write 1010: Smart Energy control coolStep™

Bit Name Function Comment

19 CFR select configuration

register

1

: configuration register

18 CFRSEL1

select configuration

register

0

1

: Smart energy current control configuration register

17 CFRSEL0

16 - reserved set to 0

15 SEIMIN minimum current for

smart current control

0: 1/2 of current setting (CS)

1: 1/4 of current setting (CS)

14 SEDN1 current down step

speed

00: for each 32 stallGuard values decrease by one

01: for each 8 stallGuard values decrease by one

10: for each 2 stallGuard values decrease by one

11: for each stallGuard value decrease by one

13 SEDN0

12 - reserved set to 0

11 SEMAX3 stallGuard hysteresis

value for smart current

control

If the stallGuard result is equal to or above

(SEMIN+SEMAX+1)*32, the motor current becomes

decreased to save energy.

0000 … 1111: 0 … 15

10 SEMAX2

9 SEMAX1

8 SEMAX0

7 - reserved set to 0

6 SEUP1 current up step width Current steps per measured stallGuard value

00 … 11: 1, 2, 4, 8

5 SEUP0

4 - reserved set to 0

3 SEMIN3 minimum stallGuard

value for smart current

control and

smart current enable

If the stallGuard result falls below SEMIN*32, the motor

current becomes increased to reduce motor load angle.

0000: smart current control off

0001 … 1111: 1 … 15

2 SEMIN2

1 SEMIN1

0 SEMIN0

SGCSCONF write 110x: Load measurement stallGuard2™ and Current Setting

Bit Name Function Comment

19 CFR select configuration

register

1

: Configuration register

18 CFRSEL1

select configuration

register

10

: stallGuard and current configuration register

17 CFRSEL0

16 SFILT stallGuard filter enable 0 Standard mode, high time resolution for stallGuard

1 Filtered mode, stallGuard signal updated for each

four fullsteps only to compensate for motor pole

tolerances

15 - reserved set to 0

14 SGT6 stallGuard threshold

value

This signed value controls stallGuard level for stall

output and sets the optimum measurement range for

readout. A lower value gives a higher sensitivity. Zero is

the starting value working with most motors.

-64 to +63: A higher value makes stallGuard less

sensitive and requires more torque to

indicate a stall.

13 SGT5

12 SGT4

11 SGT3

10 SGT2

9 SGT1

8 SGT0

7 - reserved set to 0

6 - reserved set to 0

5 - reserved set to 0

4 CS4 current scale

(scales digital currents

A and B)

Current scaling for SPI and step/direction operation

00000 … 11111: 1/32, 2/32, 3/32, … 32/32

3 CS3

2 CS2

1 CS1

0 CS0

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 17

DRVCONF write 111x: Driver Configuration

Bit Name Function Comment

19 CFR select configuration

register

1

: Configuration register

18 CFRSEL1

select configuration

register

11

: Driver configuration register

17 CFRSEL0

16 TST reserved TEST mode Set to 0. When 1, SG_TST outputs digital test values,

and TEST_ANA outputs analog test values. Selection is

done by SGT1 and SGT0 (00 … 11):

For TEST_ANA: anatest_2vth, anatest_dac_out,

anatest_vdd_half.

For SG_TST: comp_A, comp_B, CLK, on_state_xy

15 SLPH1 Slope control high side 00: min, 01: min + tc, 10: med + tc, 11: max

In temperature compensated mode (tc), the driver

strength is increased if the overtemperature prewarning

temperature is reached. This compensates for tem-

perature dependence of high side slope control.

14 SLPH0

13 SLPL1 Slope control low side 00, 01: min, 10: med, 11: max

12 SLPL0

11 - reserved set to 0

10 DISS2G short to GND protection

disable

0: Short to GND protection is on

1: Short to GND protection is disabled

9 TS2G1 short to GND detection

timer

00: 3.2µs

01: 1.6µs

10: 1.2µs

11: 0.8µs

8 TS2G0

7 SDOFF Step Direction input off 0: Enable step and direction mode (StepDir)

1: Enable SPI mode

6 VSENSE sense resistor voltage

based current scaling

0: Full scale sense resistor voltage is 305mV

1: Full scale sense resistor voltage is 165mV

(refers to a current setting of 31 and DAC value 255)

5 RDSEL1 Select value for read

out (RD bits)

00

Microstep position read back

4 RDSEL0 01

stallGuard level read back

10

stallGuard and smart current level read back

11

Reserved, do not use

3 - reserved set to 0

2 - reserved set to 0

1 - reserved set to 0

0 - reserved set to 0

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 18

6.5 Bit assignment for read

Information can be read back from the driver on each access. Different information may be required,

depending on the application. This is selected by the bits RDSEL in the register DRVCONF.

DRVSTATUS read status information – Partially selected by RDSEL in DRVCONF

Bit Name Function Comment

19 RD9 microstep position in

internal sine table for

phase A

or

stallGuard bits 9 to 0

or

stallGuard bits 9 to 5

and current control scale

RDSEL=00

Actual microstep position in sine table for

phase A in step/direction operation

(MSTEP) (MSTEP9=PHA)

18 RD8

17 RD7

16 RD6 RDSEL=01

Bits 9 … 0 of stallGuard result (SG)

15 RD5 RDSEL=10

Bits 9 … 5 of stallGuard result (SG)

and actual current control scaling

Bits 4 … 0

for monitoring smart energy current

setting (SE)

14 RD4

13 RD3

12 RD2

11 RD1

10 RD0

9 0 reserved -

8 0 reserved -

7 STST stand still step indicator 1: Indicates, that no step impulse occurred on the step

input during the last 2^20 clock cycles.

6 OLB open load indicator Flag becomes set, if no chopper event has happened

during the last period with constant coil polarity. Only a

current above 1/16 of maximum setting can reset this

flag!

5 OLA

4 S2GB short to GND detection

bits on high side

transistors

1: Short condition is detected, driver is currently shut

down (clear short condition by disabling driver)

In a short circuit condition, the chopper cycle becomes

terminated. The short counter is increased by each

short circuit. It becomes decreased by one for each

phase polarity change. The driver becomes shut down

when the counter reaches 3, until the short condition

becomes reset by disabling and re-enabling the driver.

3 S2GA

2 OTPW overtemperature pre-

warning

1: Warning threshold is exceeded

1 OT overtemperature 1: Driver is shut down due to overtemperature

0 SG stallGuard status 1: stallGuard threshold is reached, SG output high

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 19

6.6 SPI timing

The SPI interface uses the system clock to synchronize all input and output signals. This limits the SPI

clock frequency to at maximum half of the system clock frequency. For an asynchronous system using

the internal clock, some 10 percent of safety margin should be used, assuming the minimum internal

and maximum SPI master clock frequency, in order to ensure a reliable data transmission.

All SPI inputs as well as the ENN input are internally filtered to avoid triggering on short time glitches.

CSN

SCK

SDI

SDO

tCC tCC

tCL tCH

bit19 bit18 bit0

tDO tZC

tDU tDH

tCH

figure 8: SPI timing

SPI interface timing AC-Characteristics

clock period is t

CLK

Parameter Symbol Conditions Min Typ Max Unit

SCK valid before or after change

of CSN

t

CC

10 ns

CSN high time t

CSH

*) Min time is for syn-

chronous CLK with SCK

high one t

CH

before CSN

high only

t

CLK

*)

>2t

CLK

+10

ns

SCK low time t

CL

*) Min time is for syn-

chronous CLK only

t

CLK

*)

>t

CLK

+10

ns

SCK high time t

CH

*) Min time is for syn-

chronous CLK only

t

CLK

*)

>t

CLK

+10

ns

SCK frequency using internal

clock

f

SCK

assumes minimum

OSC frequency

4 MHz

SCK frequency using external

16MHz clock

f

SCK

assumes

synchronous CLK

8 MHz

SDI setup time before rising

edge of SCK

t

DU

10 ns

SDI hold time after rising edge of

SCK

t

DH

10 ns

Data out valid time after falling

SCK clock edge

t

DO

no capacitive load

on SDO

t

FILT

+5 ns

SDI, SCK and CSN filter delay

time

t

FILT

rising and falling

edge

12 20 30 ns

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 20

7 Step and direction interface

The step and direction interface allows easy movement of the motor and is a simple real time interface

for a motion controller. Its pulse rate multiplier allows smooth motor operation even with reduced pulse

bandwidth.

7.1 Timing

The step and direction interface pins are sampled synchronously with the clock signal. An internal

analog filter removes disturbances caused by glitches on the signals, e.g. caused by long PCB traces.

Despite this, the signals should be filtered and / or differentially transmitted, if the step source is far

from the TMC26x and especially if the step signals are interconnected via cables.

figure 9: STEP and DIR timing

STEP and DIR interface timing

AC-Characteristics

clock period is t

CLK

Parameter Symbol Conditions Min Typ Max Unit

step frequency (at maximum

microstep resolution)

f

STEP

DEGDE=0 ½ f

CLK

DEDGE=1 ¼ f

CLK

fullstep frequency f

FS

f

CLK

/512

STEP input low time t

SL

max(t

FILTSD

,

t

CLK

+20)

ns

STEP input high time t

SH

max(t

FILTSD

,

t

CLK

+20)

ns

DIR to STEP setup time t

DSU

20 ns

DIR after STEP hold time t

DSH

20 ns

STEP and DIR spike filtering

time

t

FILTSD

rising and falling

edge

36 60 85 ns

STEP and DIR sampling relative

to rising CLK input

t

SDCLKHI

before rising edge of

CLK input

t

FILTSD

ns

7.2 Internal microstep table

The internal microstep table uses 1024 sine wave entries to generate the wave. Its amplitude is +/-248

rather than +/-255, leaving enough headroom for a positive offset correction or hysteresis setting

within an 8 bit amplitude range. The step width depends on the microstep resolution setting. Due to

the symmetry of the sine wave, only a quarter of the table needs to be stored. The cosine wave uses a

phase shift of 90°. Despite many entries in the last quarter of the table being equal, the electrical angle

continuously changes, because either sine wave or cosine wave is in an area, where the current

vector changes monotonously from position to position.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 21

Entry

0

-

31

32

-

63

64

-

95

96

-

127

128

-

159

160

-

191

192

-

223

224

-

255

0

1

49

96

138

176

207

229

243

1

2

51

97

140

177

207

230

244

2

4

52

98

141

178

208

231

244

3

5

54

100

142

179

209

231

244

4

7

55

101

143

180

210

232

244

5

8

57

103

145

181

211

232

245

6

10

58

104

146

182

212

233

245

7

11

60

105

147

183

212

233

245

8

13

61

107

148

184

213

234

245

9

14

62

108

150

185

214

234

246

10

16

64

109

151

186

215

235

246

11

17

65

111

152

187

215

235

246

12

19

67

112

153

188

216

236

246

13

21

68

114

154

189

217

236

246

14

22

70

115

156

190

218

237

247

15

24

71

116

157

191

218

237

247

16

25

73

118

158

192

219

238

247

17

27

74

119

159

193

220

238

247

18

28

76

120

160

194

220

238

247

19

30

77

122

161

195

221

239

247

20

31

79

123

163

196

222

239

247

21

33

80

124

164

197

223

240

247

22

34

81

126

165

198

223

240

248

23

36

83

127

166

199

224

240

248

24

37

84

128

167

200

225

241

248

25

39

86

129

168

201

225

241

248

26

40

87

131

169

201

226

241

248

27

42

89

132

170

202

226

242

248

28

43

90

133

172

203

227

242

248

29

45

91

135

173

204

228

242

248

30

46

93

136

174

205

228

243

248

31

48

94

137

175

206

229

243

248

figure 10: internal microstep table showing the first quarter of the sine wave

7.3 Switching between different microstep resolutions

In principle, the microstep resolution can be changed at any time. The microstep resolution determines

the increment respectively the decrement, the TMC26x uses for advancing in the microstep table. At

maximum resolution, it advances one step for each step pulse. At half resolution, it advances two

steps and so on. This way, a change of resolution is possible transparently at each time.

7.3.1 Working with half- and fullstep resolution

Fullstepping is desirable in some applications, where maximum torque at maximum velocity with a

given motor is desired. Especially at low microstep resolutions like full- or halfstepping, the absolute

current values and thus the absolution positions in the table are important for best motor performance.

Thus, a software which uses resolution switching in order to get maximum torque and velocity from the

drive, should switch the resolution at or near certain positions, as shown in the following table.

Step position

MSTEP value

current coil A

current coil B

half step 0 0

0%

100%

full step 0 128

70.7%

half step 1 256

100%

0%

full step 1 384

70.7%

-70.7%

half step 2 512

0%

-100%

full step 2 640

-70.7%

half step 3 768

-100%

0%

full step 3 896

-70.7%

70.7%

figure 11: optimum position sequence for half- and full stepping

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 22

7.4 Step rate multiplier and stand still detection

The step rate multiplier can be enabled by setting the INTPOL bit. It supports a 16 microstep setting

and Step/Dir mode, only. In this setting, each step impulse at the input causes the execution of 16

times 1/256 microsteps. The step rate for the 16 microsteps is determined by measuring the time

interval of the previous step pulses and dividing it into 16 equal parts. This way, a smooth motor

movement like in 256 microstep resolution is achieved. The maximum time between two microsteps

corresponds to 2^20 i.e. roughly one million clock cycles, in order to reach evenly distributed 1/256

steps. At 16MHz clock frequency, this results in a minimum step input frequency of 16Hz for step rate

multiplier operation, i.e. one fullstep per second. A lower step rate causes the stand still flag to be set,

and execution of microsteps with a frequency of 1/(2^16) clock frequency.

Attention: The step rate multiplier will only give good results with a stable microstep frequency. Do

not use the DEDGE option, if the step input does not have a 50% duty cycle.

figure 12: operation of the step multiplier in different situations

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 23

8 Current setting

The internal 5V supply voltage is used as a reference. To adapt the motor current, and to allow for

different values of sense resistors, the voltage divider for full scale can be chosen as V

FS(HI)

=1/16 VDD

or V

FS(LO)

=1/30 of VDD. With this, the peak sense resistor voltage at a digital DAC control level of 255

is roughly 0.16V or 0.3V.

Using the internal sine wave table, which has the amplitude of 248, the RMS motor current thus can

be calculated by:







   

 











The momentary motor current is calculated by:









   

 







CS is the current scale setting as set by the CS bits and smart current scaler.

V

FS

is the full scale voltage as determined by VSENSE control bit (please refer electrical

characteristics).

CURRENT

A/B

is the value set by the current setting in SPI mode, or, the actual value from the internal

sine wave table in Step/Dir mode.

Parameter Description Range Comment

CS Current scale. Scales both coil current values as

taken from the internal sine wave table or from the

SPI interface. For high precision motor operation,

work with a current scaling factor in the range 16

to 31, because scaling down the current values

reduces the effective microstep resolution by

making microsteps coarser. This setting also

controls the maximum current value set by

coolStep™.

0 … 31 scaling factor:

0 … 31:

1/32, 2/32, … 32/32

VSENSE Allows control of the sense resistor voltage range

or adaptation of one electronic module to different

maximum motor currents.

0 / 1 0: 305mV

1: 165mV

8.1 Considerations on the current sense resistors and layout

Sense resistors should be carefully selected. The full motor current flows through each sense resistor.

They also see the switching spikes from the MOSFET bridges. A low inductance type resistor is

required to prevent spikes causing ringing on the current measurement leading to instable

measurement results. A low inductivity, low resistance layout is essential. Also, any common GND

path of the two sense resistors needs to be prevented, because this would lead to coupling between

both current sense signals. A massive GND plane is best. Especially for high current drivers or long

motor cables, a spike damping with parallel capacitors can make sense (see figure 13). As the

TMC26x is susceptible to negative over voltages on the sense resistor inputs, an additional input

protection resistor helps preventing damage in case of motor cable break or increased ringing on the

motor lines in case of long motor cables.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 24

figure 13: sense resistor grounding and optional parts

The sense resistor needs to be able to conduct the peak motor coil current in motor stand still

situations, unless standby power is reduced. Under normal conditions, the sense resistor sees a bit

less than the coil RMS current, because no current flows through the sense resistor during the slow

decay states.

Peak sense resistor power dissipation:





    

 







For high current applications, power dissipation is halved by using the low VSENSE setting and using

an adapted resistance value. Please be aware, that in this case any voltage drop in PCB traces has a

larger influence on the result. A compact power stage layout with massive ground plane is best to

avoid parasitic effects.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 25

9 Chopper operation of the motor coils

Both motor coils are operated using a chopper principle. The chopper for both coils works

independently of each other. In figure 14 the different phases of a chopper cycles are shown. In the

on-phase, the current is actively driven into the coils by connecting them to the power supply in the

direction of the target current. A fast decay phase reverses the polarity of the coil voltage to actively

reduce the current. The slow decay phase shorts the coil in order to let the current re-circulate. While

in principle the current could be regulated using only on phases and fast decay phases, insertion of

the slow decay phase is important to reduce current ripple in the motor and electrical losses. The

duration of the slow decay phase sets an upper limit to the chopper frequency. The current comparator

can measure coil current, when the current flows through the sense resistor. Whenever the coil

becomes switched, spikes at the sense resistors occur due to charging and discharging parasitic

capacities. During this time (typically one or two microseconds), the current cannot be measured. It

needs to be covered by the blank time setting.

figure 14: chopper phases in motor operation

There are two chopper modes available: A new high performance chopper scheme, and a proven

constant off time chopper with a programmable portion of fast decay.

Parameter Description Range Comment

TOFF The off time setting controls the minimum chopper

frequency. For most applications an off time within

the range of 5µs to 20µs will fit.

Setting this parameter to zero completely disables

all driver transistors and the motor can free-wheel.

0 /

2…15

0: chopper off

2…15: off time setting

TBL Selects the comparator blank time. This time

needs to safely cover the switching event and the

duration of the ringing on the sense resistor. For

most low current drivers, a setting of 1 or 2 is

good. For high current applications with large

MOSFETs, a setting of 2 or 3 will be required.

0…3 0: min. setting

3: max. setting

CHM Selection of the chopper mode 0 / 1 0: spreadCycle

1: classic const. off time

9.1 spreadCycle chopper

The spreadCycle chopper scheme (pat.fil.) is a precise and simple to use chopper principle, which

automatically determines the optimum fast decay portion for the motor. Anyhow, a number of settings

can be made in order to optimally fit the driver to the motor.

Each chopper cycle is comprised of an on phase, a slow decay phase, a fast decay phase and a

second slow decay phase (see figure 15). The slow decay phases limit the maximum chopper

frequency and are important for low motor and driver power dissipation. The hysteresis start setting

limits the chopper frequency by forcing the driver to introduce a minimum amount of current ripple into

the motor coils. The motor inductivity determines the ability to follow a changing motor current. The

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 26

duration of the on- and fast decay phase needs to cover at least the blank time, because the current

comparator is disabled during this time. This is satisfied by choosing a positive value for the hysteresis

as can be estimated by the following calculation:





 















 



 



  







where dI

COILBLANK

is the coil current change during the blank time and dI

COILSD

is the coil current change

during the slow decay time, t

SD

is the slow decay time, t

BLANK

is the blank time (as set by TBL), V

M

is

the motor supply voltage, I

COIL

is the peak motor coil current at the maximum motor current setting CS,

and R

COIL

and L

COIL

are motor coil inductivity and motor coil resistance.

With this, a lower limit for the start hysteresis setting can be determined:

  



 



  





  



Example:

For a 42mm stepper motor with 7.5mH, 4.5Ω phase and 1A RMS current at CS=31, i.e. 1.41A

peak current, at 24V with a blank time of 1.5µs:





   

  





       

  

With this, the minimum hysteresis start setting is 5.2. A value in the range 6 to 10 can be used.

As experiments show, the setting is quite independent of the motor, as higher current motors typically

also have a lower coil resistance. Choosing a default value with enough safety margins normally fits

most applications.

The setting can also be determined by experimenting with the motor: A too low setting will result in

reduced microstep accuracy, while a too high setting will lead to more chopper noise and motor power

dissipation.

The hysteresis principle could in some cases lead to the chopper frequency becoming too low, e.g.

when the coil resistance is high when compared to the supply voltage. This is avoided by a second set

of parameters: The hysteresis end value and the hysteresis decrement speed (HDEC). This set of

additional parameters reduces the hysteresis from the start value to the end value within each chopper

cycle. This way, the chopper frequency becomes stabilized at high amplitudes, in case it tends to get

too low. This avoids the chopper frequency reaching the audible range.

figure 15: spreadCycle (pat.fil.) chopper scheme showing the coil current within a chopper cycle

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 27

Parameter Description Range Comment

HSTART Hysteresis start setting. Please remark, that this

value is an offset to the hysteresis end value

HEND.

1…8 This setting adds to

HEND.

HEND Hysteresis end setting. Sets the hysteresis end

value after a number of decrements. Decrement

interval time is controlled by HDEC.

-3…12 -3..-1: negative HEND

0: zero HEND

1…12: positive HEND

HDEC Hysteresis decrement setting. This setting

determines the slope of the hysteresis during on

time and during fast decay time.

0…3 0: fast decrement

3: very slow decrement

Example:

In the example above a hysteresis start of 7 has been chosen. The hysteresis end is set to

about half of this value, e.g. 3. The resulting configuration register values are as follows:

HEND=6 (sets an effective end value of 3)

HSTART=3 (sets an effective start value of hysteresis end +4)

HDEC=0 (Hysteresis decrement becomes used)

9.2 Classic constant off time chopper

The classic constant off time chopper uses a fixed portion of fast decay following each on phase.

While the duration of the on time is determined by the chopper comparator, the fast decay time needs

to be set by the user in a way, that the current decay is enough for the driver to be able to follow the

falling slope of the sine wave, and on the other hand it should not be too long, in order to minimize

motor current ripple and power dissipation. This best can be tuned using an oscilloscope or trying out

motor smoothness at different velocities. A good starting value is a fast decay time setting similar to

the slow decay time setting.

figure 16: classic const. off time chopper with offset showing the coil current within two cycles

After tuning of the fast decay time, the offset should be determined, in order to have a smooth zero

transition. This is necessary, because the fast decay phase leads to the absolute value of the motor

current being lower than the target current (see figure 17). If the zero offset is too low, the motor

stands still for a short moment during current zero crossing, if it is set too high, it makes a larger

microstep. Typically, a positive offset setting is required for optimum operation.

figure 17: zero crossing with classic chopper and correction using sine wave offset

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 28

Parameter Description Range Comment

TFD

(HSTART &

HDEC0)

Fast decay time setting. With CHM=1, these bits

control the portion of fast decay for each chopper

cycle. They must cover

0…15 0: slow decay only

1…15: duration of fast

decay phase

OFFSET

(HEND)

Sine wave offset. With CHM=1, these bits control

the sine wave offset. A positive offset corrects for

zero crossing error.

-3…12 -3..-1: negative offset

0: no offset

1…12: positive offset

NCCFD

(HDEC1)

Selects usage of the current comparator for

termination of the fast decay cycle. If current

comparator is enabled, it terminates the fast decay

cycle in case the current reaches a higher

negative value than the actual positive value.

0 / 1 0: enable comparator

termination of fast decay

cycle

1: end by time only

9.3 Random off time

One drawback of the constant off time chopper schemes is that both coil choppers are not

synchronized. A beat could occur between the chopper frequencies, especially when they are near to

each other. This typically occurs at a few microstep positions within each quarter wave. Factors

influencing this are also a bad PCB layout which causes coupling of both sense resistor voltages. A

beat between the frequencies can lead to low amplitude mechanical oscillations on the motor as well

as to audible chopper noise.

In order to minimize the effect of beat between both chopper frequencies, a random generator can be

used to modify the slow decay time setting. It is switched on by the RNDTF bit.

Parameter Description Range Comment

RNDTF This bit switches on a random off time generator,

which slightly modulates the off time t

OFF

using a

random polynomial.

0 / 1 1: random modulation

enable

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 29

10 MOSFET driver stage

The TMC262 provides a two full bridge driver stage for N&P channel MOSFETs. TMC260 and

TMC261 already integrate the power MOSFETs. The gate driver current for the power MOSFETs can

be adapted to match the MOSFETs and to influence the slew rate at the coil outputs. Main features of

the driver stage:

• 5V gate drive voltage for low side N MOS driver, 8V for high side P MOS driver.

• The drivers protect the bridges actively against cross conduction via an internal Q

GD

protection

that holds MOSFET safely off.

• Automatic brake-before-make logic minimizes dead time and diode conduction time.

• Integrated short to ground protection detects a short of the motor wires and protects the driver.

10.1 Principle of operation

The low side gate driver is supplied by the 5VOUT pin. The low side driver supplies 0V to the

MOSFET gate to close the MOSFET, and 5VOUT to open it. The high side gate driver voltage is

supplied by the VS and the VHS pin. VHS is more negative than VS and allows opening the VS

referenced high side MOSFET. The high side driver supplies VS to the P channel MOSFET gate to

close the MOSFET, and VHS to open it. The effective low side gate voltage is roughly 5V; the effective

high side gate voltage is roughly 8V.

Parameter Description Range Comment

SLPL Low side slope control. Controls the MOSFET

gate driver current.

For TMC262, set a value fitting the external

MOSFET gate charge and the desired slope.

For TMC260 and TMC261 set to 0 or to 1. Slopes

are fast in order to minimize package power

dissipation.

0…3 0, 1: min. setting…

3: max. setting

SLPH High side slope control. Controls the MOSFET

gate driver current.

For TMC262, set to a value fitting the external

MOSFET gate charge and the desired slope.

For TMC260 set to 0 or to 1. Slopes are fast in

order to minimize package power dissipation.

For TMC261 set to 0 or 1 for medium slope; 2 to

match fast low side slope.

0…3 0: min. setting…

3: max. setting

10.2 Break-before-make logic

Each half-bridge has to be protected against cross conduction during switching events. When

switching off the low-side MOSFET, its gate first needs to be discharged, before the high side

MOSFET is allowed to be switched on. The same goes when switching off the high-side MOSFET and

switching on the low-side MOSFET. The time for charging and discharging of the MOSFET gates

depends on the MOSFET gate charge and the driver current set by SLPL resp. SLPH. The BBM

(break-before-make) logic measures the gate voltage and automatically delays switching on of the

opposite bridge transistor, until its counterpart is discharged. This way, the bridge will always switch

with optimized timing independent of the MOSFETs used and independent of the slope setting.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 30

10.3 Slope control in TMC262

The TMC262 driver stage provides a constant current output stage slope control. This allows to adapt

driver strength to the drive requirements of the power MOSFETs and to adjust the output slope by

providing for a controlled gate charge and discharge. A slower slope causes less electromagnetic

emission, but at the same time power dissipation of the power transistors rises. The duration of the

complete switching event depends on the total gate charge. The voltage transition of the output takes

place during the so called miller plateau (see figure 18). The miller plateau results from the gate to

drain capacity of the MOSFET charging / discharging during the switching. From the datasheet of the

transistor it can be seen, that the miller plateau typically covers only a part (e.g. one quarter) of the

complete charging event. The gate voltage level, where the miller plateau starts, depends on the gate

threshold voltage of the transistor and on the actual load current.

MOSFET gate charge vs. switching event

Q

G

– Total gate charge (nC)

V

GS

– Gate to source voltage (V)

5

4

3

2

1

0

0 2 4 6 8 10

V

DS

– Drain to source voltage (V)

25

20

15

10

5

0

V

S

Q

MILLER

figure 18: MOSFET gate charge as available in device data sheet vs. switching event (dotted line)

The slope time t

SLOPE

can be calculated as follows:













Whereas Q

MILLER

is the charge the power transistor needs for the switching event, and I

GATE

is the

driver current setting of the TMC262.

Taking into account, that a slow switching event means high power dissipation during switching, and,

on the other side a fast switching event can cause EMV problems, the desired slope will be in some

ratio to the switching (chopper) frequency of the system. The chopper frequency is typically slightly

outside the audible range, i.e. 18 kHz to 40 kHz. The lower limit for the slope is dictated by the reverse

recovery time of the MOSFET internal diodes, unless additional Schottky diodes are used in parallel to

the MOSFETs source-drain diode. Thus, for most applications a switching time between 100ns and

750ns is chosen.

The required slope time can be calculated as follows:













Example:

A circuit using the transistor from the diagram above is operated with a gate current setting of

15mA. The miller charge of the transistor is about 2.5nC.







  

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 31

11 Diagnostics and protection

11.1 Short to GND detection

The short to GND detection prevents the high side power MOSFETs to be destroyed by accidentally

shorting the motor outputs to ground. It disables the driver, if a short condition persists, only. A

temporary event like an ESD event could look like a short, too. This becomes sorted out by the short

detection logic. In case of a short being detected, the bridge will be switched off instantaneously. The

chopper cycle on the affected coil becomes terminated and the short counter is increased by each

short circuit. It becomes decreased by one for each phase polarity change. The driver becomes shut

down when the counter reaches 3, until the short condition is reset by disabling the driver and re-

enabling it.

Status flag Description Range Comment

S2GA These bits identify a short to GND condition on

phase A resp. phase B persisting for multiple

chopper cycles. The flags become cleared when

disabling the driver.

0 / 1 1: short condition detected

S2GB

An overload condition of the high side MOSFET (“short to GND”) is detected by the TMC26x, by

monitoring the BM voltage during high side on time. Under normal conditions, the high side power

MOSFET reaches the bridge supply voltage minus a small voltage drop during on time. If the bridge is

overloaded, the voltage cannot rise to the detection level within a limited time, defined by the internal

detection delay setting. Upon detection of an error, the bridge becomes switched off.

The short to GND detection delay needs to be adapted to the slope time, because it must cover the

slope.

Short

detection

Valid area

BMxy

Hxy

V

VS

-

V

BMS2G

0V

V

VS

t

S2G

BM voltage

monitored

Short to GND

monitor phase

Driver

enabled 0V

t

S2G

Short detecteddelaydelay inactiveinactive

Short to GND

detected

Driver off

figure 19: timing of the short to GND detector

Parameter Description Range Comment

TS2G This setting controls the short to GND detection

delay time. It needs to cover the switching slope

time.

0…3 0: maximum time…

3: minimum time

11.2 Open load detection

The open load detection detects, if a motor coil has an open condition, for example due to a loose

contact. When driving in fullstep mode, the open load detection will also detect when the motor current

cannot be reached within each step, i.e. due to a too high motor velocity where the back EMF voltage

exceeds the supply voltage. The flag just has an informational character and an active open load

condition does not in all cases indicate that the motor is not working properly.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 32

11.3 Temperature measurement

The TMC26x integrates a two level temperature sensor (100°C prewarning and 150°C thermal

shutdown) for diagnostics and for protection of the driver stage. The temperature detector can detect

heat accumulation on the board, i.e. due to missing convection cooling. It cannot detect overheating of

the power transistors in all cases, because heat transfer between power transistors and driver chip

depends on the PCB layout and environmental conditions. Most critical situations, where the driver

MOSFETs could be overheated, are avoided when using the short to GND protection. For many

applications, the overtemperature prewarning will indicate an abnormal operation situation and can be

used to initiate user warning or power reduction measures. If continuous operation in hot environments

is necessary, a more precise processor based temperature measurement should be used to realize

application specific overtemperature detection. The thermal shutdown is just an emergency measure

and temperature rising to the shutdown level should be prevented by design.

The highside P-channel gate drivers within the TMC26x have a temperature dependency, which can

be compensated up to some extent by increasing driver current as soon as the warning temperature

threshold is reached. The TMC26x automatically corrects the temperature dependency at two settings,

marked as +tc in the SPI register documentation. In these settings, the driver current is increased by

one step when the temperature warning threshold is reached.

11.4 Undervoltage detection

The undervoltage detector monitors both, the internal logic supply voltage and the driver supply

voltage. It prevents operation of the chip at voltages, where a proper control of the MOSFET switches

cannot be guaranteed due to too low gate drive voltage. Be sure to operate the IC significantly above

the undervoltage threshold in order to assure reliable operation.

At undervoltage, the logic control block becomes reset and the driver is disabled. All MOSFETs

become switched off. The processor thus also should monitor the supply voltage to detect an

undervoltage condition. If the processor does not have an access to the voltage, the TMC26x can

directly be monitored via its SPI interface sending out only zero bits and not shifting through

information. A reset due to undervoltage or an actual undervoltage condition can be determined for

example by monitoring the current setting via its read back function. The current value becomes reset

to zero.

Status flag Description Range Comment

OLA These bits indicate an open load condition on

phase A resp. phase B. The flags become set, if

no chopper event has happened during the last

period with constant coil polarity. The flag is not

updated with too low actual coil current below 1/16

of maximum setting.

0 / 1 1: open load detected

OLB

Status flag Description Range Comment

OTPW Overtemperature pre-warning. This bit indicates

that the pre-warning level is reached. The

controller can react to this setting by reducing

power dissipation.

0 / 1 1: temperature prewarning

level reached

OT Overtemperature warning. This bit indicates that

the overtemperature threshold has been reached

and that the driver is switched off due to

overtemperature.

0 / 1 1: driver shut down due to

overtemperature

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 33

12 stallGuard2™ sensorless load measurement

stallGuard2™ delivers a sensorless load measurement of the motor as well as a stall detection signal.

The measured value changes linear with the load on the motor in a wide range of load, velocity and

current settings. At maximum motor load the stallGuard™ value goes to zero. This corresponds to a

load angle of 90° between the magnetic field of the stator and magnets in the rotor. This also is the

most energy efficient point of operation for the motor.

figure 20: principle function of stallGuard2

In order to use stallGuard2™ and coolStep™, the stallGuard2™ sensitivity should first be tuned using

the ST setting.

12.1 Tuning the stallGuard2™ threshold SGT

The sensorless motor measurement depends on a number of motor specific parameters and operation

parameters. The easiest way to find a parameter set which fits to a specific motor type and operating

conditions is interactive tuning:

Operate the motor at a reasonable velocity (taking into account your application) and monitor the

stallGuard™ value (SG). Now, apply slowly increasing mechanical load to the motor. If the motor stalls

before the stallGuard™ value reaches zero, decrease the stallGuard threshold value (SGT). A good

starting value is zero. You can apply negative values and positive values. If the SG value reaches zero

far before the motor stalls, increase the SGT value.

The optimum setting is reached, when the stallGuard2™ value reaches zero at increasing load shortly

before the motor stalls due to overload. However, this point can be shifted above 100% load, too. In

this case, activation of the stall output indicates, that a step has been lost.

Please be aware, that the driver clock frequency influences this setting. You should provide an

external stabilized clock for best performance. As the measurement has a high resolution, there are a

number of additional possibilities to enhance the absolute precision in order to give a good match to

the mechanical load on the motor. The optimum SGT value depends on a number of operating

parameters which can be compensated for, as shown in the next chapters.

12.1.1 Variable velocity operation

At varying velocities, a correction of the stallGuard2™ threshold value SGT can improve the exactness

of the load measurement and thus of coolStep™, which is based on the load measurement value. A

linear interpolation between two SGT values optimized for different velocities provides a higher

accuracy when operating with widely varying velocities. Linear interpolation can be used to reduce the

required parameter set (see curve for simplified SGT setting in the example in figure 21).

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 34

figure 21: optimum SGT setting and stallGuard2 reading with an example motor at 24V

12.1.2 Small motors with high torque ripple and resonance

Motors with a high detent torque also show an increased dependency of the stallGuard2™ reading

with varying (lower) motor currents. For these motors, the current dependency might need to be

modeled for best result.

12.1.3 Temperature dependence of motor coil resistance

For motors working in a large temperature range, also the motor temperature may be taken into

account, because motor coil resistance increases with rising temperature. This will show as a linear

reduction of the stallGuard2™ reading at increasing temperature, as the efficiency of the motor sinks.

12.1.4 Accuracy and reproducibility of stallGuard2™ measurement

It might be desired to work with a fixed SGT value within an application for one motor type. Most of the

stray in stallGuard2™ reading will result from motor production stray. Other factors which can be

compensated for are motor temperature, motor driver supply voltage and TMC26x clock frequency. A

stabilized driver supply voltage and an external clock source should be used in these applications. The

measurement error of stallGuard2™ – provided that all other parameters remain stable – can be

assumed as low as:

  

12.2 stallGuard2™ measurement frequency and filtering

The stallGuard2™ value becomes updated with each full step of the motor. This is enough to safely

detect a stall, as stalling of the motor always means the loss of four full steps. In a practical

application, especially when using coolStep™, a more precise measurement might be more important

than an update for each fullstep, taking into account that mechanical load never changes

instantaneously from one step to the next. Therefore, a filtering function is available: The SFILT bit

enables filtering of the motor load measurement over a number of 4 measurements. The filter should

always be enabled when a precise measurement is desired. It compensates for anisotropies in the

construction of the motor, e.g. due to misalignment of the phase A to phase B magnets. Only if very

fast response to increasing load is required, the bit should be cleared.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 35

Parameter Description Range Comment

SGT This signed value controls stallGuard2™ threshold

level for stall output and sets the optimum

measurement range for readout. A lower value

gives a higher sensitivity. Zero is the starting value

working with most motors. A higher value makes

stallGuard less sensitive and requires more torque

to indicate a stall.

-64 …

+63

0: indifferent value

+1…+63: less sensitivity

-1…-64: higher sensitivity

SFILT Enables the stallGuard2™ filter for more precision

of the measurement. If set, reduces the

measurement frequency to one measurement per

four fullsteps.

0 / 1 0: standard mode

1: filtered mode

Status

word

Description Range Comment

SG This is the stallGuard2™ result. A higher reading

indicates less mechanical load. A lower reading

indicates a higher load and thus a higher load

angle. Tune the SGT setting to show a SG reading

of 0 at maximum load before motor stall. This is

also signaled by the output SG_TST.

0…

1023

0: maximum load

>1: less load

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 36

13 coolStep™ smart energy operation

In order to use coolStep™, you should first tune the stallGuard2™ sensitivity. coolStep™ uses the

stallGuard2™ measurement, to operate the motor near the optimum load angle of +90°.

See example figure.

figure 22: motor current control via coolStep adapts motor current to motor load

13.1 coolStep™ smart energy current regulator

The coolStep™ current regulator allows to control the reaction of the driver to increasing or decreasing

load. The internal regulator uses two thresholds to determine the minimum and the maximum load

angle for optimum motor operation. The current increment speed and the current decrement speed

can be adapted to the application. Additionally, the lower current limit can be set in relation to the

upper current limit set by the current scale parameter CS.

13.1.1 Adaptation to the load situation

To allow the motor current to quickly respond to increasing motor load, use a high current increment

step. If the motor load changes only slowly, a lower current increment step can be used. The current

decrement can then be adapted to work as quickly as possible, while avoiding oscillations of the

motor. Keep in mind, that enabling the stallGuard2™ filter via SFILT quarters the measurement speed

and thus the regulation speed.

13.1.2 Low velocity and standby operation

Since coolStep™ is not able to detect the motor load in standstill and at very low RPM operation, the

current at low velocities should be set to an application specific default value and should be combined

with a stand still current reduction.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 37

Parameter Description Range Comment

SEMIN Sets the lower threshold for stallGuard2™ reading.

Below this value, the motor current becomes

increased.

Set SEIMIN to zero to disable coolStep™.

0…15 lower stallGuard threshold:

SEIMIN*32

SEMAX Sets the distance between the lower and the

upper threshold for stallGuard2™ reading. Above

the upper threshold the motor current becomes

increased.

0…15 upper stallGuard

threshold:

(SEIMIN+SEIMAX+1)*32

SEUP Sets the current increment step. The current

becomes incremented for each measured

stallGuard2™ value below the lower threshold.

0…3 current increment step

size:

0…3: 1, 2, 4, 8

SEDN Sets the number of stallGuard2™ readings above

the upper threshold necessary for each current

decrement of the motor current.

0…3 number of stallGuard

measurements per

decrement:

0…3: 32, 8, 2, 1

SEIMIN Sets the lower motor current limit for coolStep™

operation by scaling the CS value. 0 / 1 minimum motor current:

0: 1/2 of CS

1: 1/4 of CS

Status

word

Description Range Comment

SE This status value provides the actual motor current

setting as controlled by coolStep™. The value

goes up to the CS value and down to the portion

of CS as specified by SEIMIN.

0…31 actual motor current

scaling factor:

0 … 31:

1/32, 2/32, … 32/32

13.2 User benefits, save energy, reduce power and cooling infrastructure

coolStep™ allows saving a lot of energy, especially for motors which see varying loads and operate at

a high duty cycle. Taking into account that a stepper motor application needs to work with a torque

reserve of 30% to 50%, even a constant load application allows saving lots of energy, because the

driver automatically enables torque reserve when required. The reduction in power dissipation further

keeps the system cooler and increases life time and allows savings in the power supply and cooling

infrastructure. Keep in mind, that half motor current means a quarter of the power dissipation in the

motor coils. This power dissipation makes up for most of the stepper motor losses!

www.coolstep.org

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 38

14 Clock oscillator and clock input

The internal clock frequency for all operations is nominal 13MHz. An external clock of 10MHz to

20MHz (16MHz recommended for optimum performance) can be supplied for more exact timing,

especially when using coolStep™ and stallGuard2™. Alternatively, the internal clock frequency can be

measured, by measuring the delay time after the last step, until the TMC26x raises the STANDSTILL

flag. From this measurement, chopper timing parameters can be corrected, as the internal oscillator is

relatively stable over a wide range of environment temperatures.

An external clock frequency of up to 20MHz can be supplied. The external clock is enabled with the

first positive polarity seen on the CLK input. Tie the CLK input to GND near to the TMC26x if the

internal clock oscillator is to be used. Switching off the external clock frequency prevents the driver

from operating normally. Be careful to switch off the motor before switching off the clock (e.g. using the

enable input), because otherwise the chopper would stop and the motor current level could rise

uncontrolled. The short to GND detection stays active even without clock, if enabled.

14.1 Considerations on the frequency

A higher frequency allows faster step rates, faster SPI operation and higher chopper frequencies. On

the other hand, it may cause more electromagnetic emission and causes more power dissipation in

the TMC26x digital core. Generally a frequency of 8MHz to 16MHz should be sufficient for most

applications, unless the motor is to operate very fast. For reduced requirements concerning the motor

dynamics, a clock frequency of 4 to 8MHz should be considered.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 39

15 Absolute Maximum Ratings

The maximum ratings may not be exceeded under any circumstances. Operating the circuit at or near

more than one maximum rating at a time for extended periods shall be avoided by application design.

Parameter Symbol Min Max Unit

Supply voltage (TMC261, TMC262)

V

VS

-0.5 60 V

Supply voltage (TMC260) -0.5 40 V

Supply and bridge voltage max. 20000s (TMC262) 65 V

Logic supply voltage V

VCC

-0.5 6.0 V

I/O supply voltage V

VIO

-0.5 6.0 V

Logic input voltage V

I

-0.5 V

VIO

+0.5 V

Analog input voltage V

IA

-0.5 V

CC

+0.5 V

Voltages on low side driver pins (LSx) V

OLS

-0.7 V

CC

+0.7 V

Voltages on high side driver pins (HSx) V

OHS

V

HS

-

0.7

V

VM

+0.7 V

Voltages on BM pins (BMx) V

IBM

-5 V

VM

+5 V

Relative high side driver voltage (V

VM

– V

HS

) V

HSVM

-0.5 15 V

Maximum current to / from digital pins

and analog low voltage I/Os

I

IO

+/-10 mA

Non destructive short time peak current into input / output pins I

IO

500 mA

5V regulator output current I

5VOUT

50 mA

5V regulator peak power dissipation (V

VM

-5V) * I

5VOUT

P

5VOUT

1 W

Junction temperature T

J

-50 150 °C

Storage temperature T

STG

-55 150 °C

ESD-Protection (Human body model, HBM), in application V

ESDAP

1 kV

ESD-Protection (Human body model, HBM), device handling V

ESDDH

300 V

16 Electrical Characteristics

16.1 Operational Range

Parameter Symbol Min Max Unit

Junction temperature T

J

-40 125 °C

Supply voltage TMC261, TMC262 V

VS

9 59 V

Supply voltage TMC260 V

VS

9 39 V

I/O supply voltage V

VIO

3.00 5.25 V

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 40

16.2 DC Characteristics and Timing Characteristics

DC characteristics contain the spread of values guaranteed within the specified supply voltage range

unless otherwise specified. Typical values represent the average value of all parts measured at

+25°C. Temperature variation also causes stray to some values. A device with typical values will not

leave Min/Max range within the full temperature range.

Power supply current DC-Characteristics

V

VS

= 24.0V

Parameter Symbol Conditions Min Typ Max Unit

Supply current, operating I

VS

f

CLK

=16MHz, 40kHz

chopper, Q

G

=10nC

12 mA

Supply current, driver disabled I

VS

f

CLK

=16MHz 10 mA

Supply current, driver disabled,

dependency on CLK frequency

I

VS

f

CLK

variable I

VS0

+

0.32

/MHz

mA

Static supply current I

VS0

f

CLK

=0Hz, digital in-

puts at +5V or GND

3.2 4 mA

Part of supply current NOT

consumed from 5V supply

I

VSHV

driver disabled 1.2 mA

IO supply current I

VIO

no load on outputs,

inputs at V

IO

or GND

0.3 µA

NMOS low side driver DC-Characteristics

V

LSX

= 2.5V, slope setting controlled by SLPL

Parameter Symbol Conditions Min Typ Max Unit

Gate drive current LSx

low side switch ON

a)

I

LSON

SLPL=00/01 13 mA

Gate drive current LSx

low side switch ON

a)

I

LSON

SLPL=10 25 mA

Gate drive current LSx

low side switch ON

a)

I

LSON

SLPL=11 25 37 60 mA

Gate drive current LSx

low side switch OFF

a)

I

LSOFF

SLPL=00/01 -13 mA

Gate drive current LSx

low side switch OFF

a)

I

LSOFF

SLPL=10 -25 mA

Gate drive current LSx

low side switch OFF

a)

I

LSOFF

SLPL=11 -25 -37 -60 mA

Gate Off detector threshold V

GOD

V

LSX

falling 1 V

Q

GD

protection resistance after

detection of gate off

R

LSOFFQGD

SLPL=11

V

LSX

= 1V

26 Ω

Driver active output voltage V

LSON

V

VCC

V

Notes:

a) Low side drivers behave similar to a constant current source between 0V and 2.5V (switching

on) resp. between 2.5V and 5V (switching off), because switching MOSFETs go into

saturation. At 2.5V, the output current is about 85% of peak value. This is the value specified.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 41

PMOS high side driver DC-Characteristics

V

VS

= 24.0V, V

VS

- V

HSX

= 2.5V, slope setting controlled by SLPH

Parameter Symbol Conditions Min Typ Max Unit

Gate drive current HSx

high side switch ON

b)

I

HSON

SLPH=00/01

-15 mA

Gate drive current HSx

high side switch ON

b)

I

HSON

SLPH=10 -29 mA

Gate drive current HSx

high side switch ON

b)

I

HSON

SLPH=11 -28 -43 -70 mA

Gate drive current HSx

high side switch OFF

c)

I

HSOFF

SLPH=00/01 15 mA

Gate drive current HSx

high side switch OFF

c)

I

HSOFF

SLPH=10 29 mA

Gate drive current HSx

high side switch OFF

c)

I

HSOFF

SLPH=11 28 43 70 mA

Gate Off detector threshold V

GOD

V

HSX

rising V

VS

-1 V

Q

GD

protection resistance after

detection of gate off

R

HSOFFQGD

SLPH=11

V

HSX

= V

VS

- 1V

32 Ω

Driver active output voltage V

HSON

I

OUT

= 0mA V

VHS

-2.8

V

VHS

-2.3

V

VHS

-1.8

V

Notes:

b) High side switch on drivers behave similar to a constant current source between V

VS

and V

VS

–

2.5V. At V

VS

-2.5V, the output current is about 90% of peak value. This is the value specified.

c) High side switch off drivers behave similar to a constant current source between V

VS

- 8V and

V

VS

-2.5V. At V

VS

-2.5V, the output current is about 65% of peak value. This is the value

specified.

High side voltage regulator DC-Characteristics

V

VS

= 24.0V

Parameter Symbol Conditions Min Typ Max Unit

Output voltage V

VHS

I

OUT

= 0mA

T

J

= 25°C

9.3 10.0 10.8 V

Output resistance R

VHS

Static load 50 Ω

Deviation of output voltage over

the full temperature range

V

VHS(DEV)

T

J

= full range 60 200 mV

DC Output current I

VHS

4 mA

Current limit I

VHSMAX

15 mA

Series regulator transistor output

resistance (determines voltage

drop at low supply voltages)

R

VHSLV

400 1000 Ω

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 42

Internal MOSFETs TMC260 DC-Characteristics

V

VS

= V

VSX

≥ 12.0V, V

BRX

= 0V

Parameter Symbol Conditions Min Typ Max Unit

N channel MOSFET on

resistance

R

ONN

T

J

= 25°C 125 190 mΩ

P channel MOSFET on

resistance

R

ONP

T

J

= 25°C 190 240 mΩ

N channel MOSFET on

resistance

R

ONN

T

J

= 150°C 205 mΩ

P channel MOSFET on

resistance

R

ONP

T

J

= 150°C 312 mΩ

Internal MOSFETs TMC261 DC-Characteristics

V

VS

= V

VSX

≥ 12.0V, V

BRX

= 0V

Parameter Symbol Conditions Min Typ Max Unit

N channel MOSFET on

resistance

R

ONN

T

J

= 25°C 100 150 mΩ

P channel MOSFET on

resistance

R

ONP

T

J

= 25°C 200 255 mΩ

N channel MOSFET on

resistance

R

ONN

T

J

= 150°C 164 mΩ

P channel MOSFET on

resistance

R

ONP

T

J

= 150°C 328 mΩ

Linear regulator DC-Characteristics

Parameter Symbol Conditions Min Typ Max Unit

Output voltage V

5VOUT

I

5VOUT

= 10mA

T

J

= 25°C

4.75 5.0 5.25 V

Output resistance R

5VOUT

Static load 3 Ω

Deviation of output voltage over

the full temperature range

V

5VOUT(DEV)

I

5VOUT

= 10mA

T

J

= full range

30 60 mV

Output current capability

(attention, do not exceed

maximum ratings with DC

current)

I

5VOUT

V

VS

= 12V 100 mA

V

VS

= 8V 60 mA

V

VS

= 6.5V 20 mA

Clock oscillator and input Timing-Characteristics

Parameter Symbol Conditions Min Typ Max Unit

Clock oscillator frequency f

CLKOSC

t

J

=-50°C 8.8 12.4 17.9 MHz

Clock oscillator frequency f

CLKOSC

t

J

=50°C 9.4 13.2 18.8 MHz

Clock oscillator frequency f

CLKOSC

t

J

=150°C 9.6 13.4 18.9 MHz

External clock frequency

(operating)

f

CLK

4 20 MHz

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 43

Detector levels DC-Characteristics

Parameter Symbol Conditions Min Typ Max Unit

V

VS

undervoltage threshold V

UV

6.5 7.5 8 V

Short to GND detector threshold

(V

VS

- V

BMx

)

V

BMS2G

1.0 1.5 2.3 V

Short to GND detector delay

(low side gate off detected to

short detection)

t

S2G

TS2G=00 2.0 3.2 4.5 µs

TS2G=10 1.6 µs

TS2G=01 1.2 µs

TS2G=11 0.8 µs

Overtemperature prewarning t

OTPW

80 100 120 °C

Overtemperature shutdown t

OT

Temperature rising 135 150 170 °C

Sense resistor voltage levels DC-Characteristics

Parameter Symbol Conditions Min Typ Max Unit

Sense input peak threshold

voltage (low sensitivity)

V

UV

VSENSE=0

Cx=255; Hyst.=0

285 307 329 mV

sense input peak threshold

voltage (high sensitivity)

t

OTPW

VSENSE=1

Cx=255; Hyst.=0

153 165 177 mV

Digital logic levels DC-Characteristics

Parameter Symbol Conditions Min Typ Max Unit

Input voltage low level V

INLO

-0.3 0.8 V

Input voltage high level V

INHI

2.4 V

VIO

+0.3

V

Output voltage low level V

OUTLO

I

OUTLO

= 1mA 0.4 V

Output voltage high level V

OUTHI

I

OUTHI

= -1mA 0.8V

VIO

V

Input leakage current I

ILEAK

-10 10 µA

Notes:

d) Digital inputs left within or near the transition region substantially increase power supply

current by drawing power from the internal 5V regulator. Make sure that digital inputs become

driven near to 0V and up to the V

IO

I/O voltage.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 44

16.3 ESD sensitive device

The TMC26x is an ESD sensitive CMOS device and also MOSFET transistors used in the application

schematic are very sensitive to electrostatic discharge. Take special care to use adequate grounding

of personnel and machines in manual handling. After soldering the devices to the board, ESD

requirements are more relaxed. Failure to do so can result in defect or decreased reliability.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 45

16.4 MOSFET examples

There is a number of N&P channel paired MOSFETs available, which fit the TMC262, as well as single

N and P devices. The user choice will depend on the electrical data (voltage, current, RDSon) and on

the package and configuration (single / dual). The following table gives a few examples of SMD

MOSFET pairs for different motor voltages and currents. The MOSFETs explicitly are modern types

with a low total gate charge.

For the actual application, we suggest to calculate static and dynamic power dissipation for a given

MOSFET pair. A gate charge below 20nC should be preferred to reach reasonable slopes.

Transistor

type

manu-

facturer

voltage

V

DS

max. RMS

current (*)

package R

DSon

N (5V)

R

DSon

P (8V)

Q

G

N

Q

G

P

unit V A mΩ mΩ nC nC

SUD23N06

SUD08P06 Vishay 60 6 DPAK 35

125

8

10

SI7414

SI7415 Vishay 60 3 PPAK1212 28

60

9

12

SI7530 Vishay 60 3 PPAK-SO8 70 55 6 22

SI4559ADY Vishay 60 2.2 SO8 55 110 7 12

IRF7343 Vishay 55 1.8 SO8 55 125 13 22

FDD8424H Fairchild 40 4.2 DPAK-4L 25 45 9 14

SI4565DY Vishay 40 3 SO8 35 45 9 13

SI4567DY Vishay 40 2.5 SO8 60 80 6 10

SI3529DV Vishay 40 1.5 TSOP-6 110 190 2.5 4

FDS8960C Fairchild 35 3.3 SO8 20 45 6 9

BSZ050N03

BSZ180P03 Infineon 30 8 S3O8 7

18

13

15

FDS8958A Fairchild 30 3.2 SO8 25 45 6 9

TMC34NP Trinamic 30 3 PPAK1212 35 50 5 11

SI4544DY Vishay 30 3 SO8 40 40 9 15

SI4539ADY Vishay 30 2.8 SO8 45 50 6 12

SI4532ADY Vishay 30 2.7 SO8 50 70 4 8

IRF9952 Vishay 30 2 SO8 80 220 4 5.5

(*) Remark: The maximum motor current applicable in a given design depends upon PCB size and

layout, since all of these transistors are mainly cooled via the PCB. The data given implies adequate

cooling measures taken by the user, especially for higher current designs. The maximum RMS current

rating takes into account package power dissipation, on resistances and gate charges.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 46

17 Using an external power stage for higher voltage and current

The TMC262 uses a completely complementary driving scheme for power transistors. This allows

attaching an external gate driver, using the low side driver output information, only. Therefore, the

external gate driver needs to bring brake-before make capability. You can directly attach gate driver

ICs like TMC603 as gate drivers for high current NMOS transistor bridges. The TMC603 also supplies

a gate drive voltage regulator and allows 100% duty cycle. Please refer TMC603 datasheet. The

example shows a standard low side / high side driver boosting TMC262. The higher gate driving

capability allows addressing designs for more than 20A and higher voltages.

figure 23: high current high voltage power stage using additional gate drivers (example)

Please be aware, that the short to GND protection of the TMC262 cannot be used in this scheme: The

driver cannot be fully disabled, because the external gate driver just switches on either high side

MOSFET or low side MOSFET. An external short to GND protection could use a series resistor to

measure power bridge current and to disable the high side MOSFETs by using the TMC262 enable

input ENN. Use a gate driver like TMC603 to provide additional short to GND protection without the

need for a high side shunt.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 47

18 Getting started

18.1 Initialization of the driver

Initialization SPI datagram example sequence to enable the driver and initialize the chopper:

SPI = $901B4; // Hysteresis mode

or

SPI = $94557; // Const. toff mode

SPI = $D001F; // Current setting: $d001F (max. current)

SPI = $EF010; // high gate driver strength, stallGuard read, SDOFF=0 for TMC262

or

SPI = $E0010; // low driver strength, stallGuard read, SDOFF=0 for TMC260/261

SPI = $00000; // 256 microstep setting

First test of coolStep™ current control:

SPI = $A8202; // Enable coolStep with minimum current ¼ CS

Please note, that the configuration parameters should be tuned to the motor and application for

optimum performance.

TMC260/TMC261/TMC262 DATA SHEET (V. 1.02 / 2010-Aug-12) 48

19 Table of figures

FIGURE

1:

BASIC APPLICATION BLOCK DIAGRAM

.................................................................................................... 4

FIGURE

2:

TMC260

AND

TMC261

PINNING

........................................................................................................ 5

FIGURE

3:

TMC262

PINNING

........................................................................................................................... 5

FIGURE

4:

PQFP44

DIMENSIONS

...................................................................................................................... 7

FIGURE

5:

QFN32

5

X

5

DIMENSIONS

.................................................................................................................. 7

FIGURE

6:

TMC262

BLOCK AND APPLICATION DIAGRAM

......................................................................................... 8

FIGURE

7:

TMC260

AND

TMC261

BLOCK AND APPLICATION DIAGRAM

...................................................................... 9

FIGURE

8:

SPI

TIMING

.................................................................................................................................. 19

FIGURE

9:

STEP

AND

DIR

TIMING

.................................................................................................................. 20

FIGURE

10:

INTERNAL MICROSTEP TABLE SHOWING THE FIRST QUARTER OF THE SINE WAVE

........................................... 21

FIGURE

11:

OPTIMUM POSITION SEQUENCE FOR HALF

-

AND FULL STEPPING

................................................................ 21

FIGURE

12:

OPERATION OF THE STEP MULTIPLIER IN DIFFERENT SITUATIONS

.............................................................. 22

FIGURE

13:

SENSE RESISTOR GROUNDING AND OPTIONAL PARTS

............................................................................. 24

FIGURE

14:

CHOPPER PHASES IN MOTOR OPERATION

............................................................................................ 25

FIGURE

15:

SPREAD

C

YCLE

(

PAT

.

FIL

.)

CHOPPER SCHEME SHOWING THE COIL CURRENT WITHIN A CHOPPER CYCLE

................. 26

FIGURE

16:

CLASSIC CONST

.

OFF TIME CHOPPER WITH OFFSET SHOWING THE COIL CURRENT WITHIN TWO CYCLES

............... 27

FIGURE

17:

ZERO CROSSING WITH CLASSIC CHOPPER AND CORRECTION USING SINE WAVE OFFSET

................................... 27

FIGURE

18:

MOSFET

GATE CHARGE AS AVAILABLE IN DEVICE DATA SHEET VS

.

SWITCHING EVENT

(

DOTTED LINE

) ............... 30

FIGURE

19:

TIMING OF THE SHORT TO

GND

DETECTOR

......................................................................................... 31

FIGURE

20:

PRINCIPLE FUNCTION OF STALL

G

UARD

2 ............................................................................................. 33

FIGURE

21:

OPTIMUM

SGT

SETTING AND STALL

G

UARD

2

READING WITH AN EXAMPLE MOTOR AT

24V .............................. 34

FIGURE

22:

MOTOR CURRENT CONTROL VIA COOL

S

TEP ADAPTS MOTOR CURRENT TO MOTOR LOAD

.................................... 36

FIGURE

23:

HIGH CURRENT HIGH VOLTAGE POWER STAGE USING ADDITIONAL GATE DRIVERS

(

EXAMPLE

) ........................... 46

20 Revision History

20.1 Documentation Revision

Version Date Author

BD=Bernhard Dwersteg

Description

0.90 2010-APR-14 BD First release candidate of datasheet covering TMC260,

TMC261 and TMC262

0.92 2010-APR-19 BD Corrected gate driver specs, new MOSFET examples

0.94 2010-APR-22 BD New headline, photo, details

0.95 2010-MAY-14 BD Added chapter 10, more technical parameters

0.96 2010-MAY-21 BD Idea for short to GND protection for ext. drivers

0.97 2010-JUN-25 BD Step Dir detail, added power supply current

1.00 2010-AUG-09 BD V2 silicon results, increased chopper thresholds (identical

ratio of VCC power supply as in V1 and V1.2 silicon)

VSENSE bit description corrected based on actual values

1.01 2010-AUG-10 BD Removed preliminary note from el. specs, corrected UV

threshold, additional values

Table 1: Documentation Revisions