© 2017 Kingbright. All Rights Reserved. Spec No: DSAM8409 / 1301002031 Rev No: V.2A Date: 09/27/2017 Page 1 / 5
DESCRIPTIONS
zThe Green source color devices are made with
AlGaInP on GaAs substrate Light Emitting Diode
zElectrostatic discharge and power surge could
damage the LEDs
zIt is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs
zAll devices, equipments and machineries must be
electrically grounded
FEATURES
z1.0 inch digit height
zLow current operation
zExcellent character appearance
zHigh light output
zEasy mounting on P.C. boards or sockets
zMechanically rugged
zStandard: gray face, white segment
zRoHS compliant
APPLICATIONS
zHome and smart appliances
z Display time and digital combination
z Industrial and instrumental applications
zNumeric status
ATTENTION
Observe precautions for handling
electrostatic discharge sensitive devices
PACKAGE DIMENSIONS
SA10-21CGKWA
25.4 mm (1.0 inch) Single Digit Numeric Display
Notes:
1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted.
2. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
SELECTION GUIDE
Part Number Emitting Color
(Material) Lens Type Iv (ucd) @ 10mA [1]
Min. Typ.
SA10-21CGKWA ■ Green (AlGaInP) White Diffused
52000 95000
Common Anode,
Rt. Hand Decimal
*14000 *33000
Description
Notes:
1. Luminous intensity / luminous Flux: +/-15%.
* Luminous intensity value is traceable to CIE127-2007 standards.
© 2017 Kingbright. All Rights Reserved. Spec No: DSAM8409 / 1301002031 Rev No: V.2A Date: 09/27/2017 Page 2 / 5
ABSOLUTE MAXIMUM RATINGS at TA=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
SA10-21CGKWA
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. 2mm below package base.
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
Parameter Symbol Value Unit
Power Dissipation (Per chip) PD 75 mW
Reverse Voltage (Per chip) VR 5 V
Junction Temperature Tj 115 °C
Operating Temperature Top -40 to +85 °C
Storage Temperature Tstg -40 to +85 °C
DC Forward Current (Segment)
DC Forward Current (DP) IF 30
30 mA
Peak Forward Current (Segment)
Peak Forward Current (DP) IFM [1] 150
150 mA
Electrostatic Discharge Threshold (HBM) - 3000 V
Lead Solder Temperature [2] 260°C For 3-5 Seconds
Parameter Symbol Emitting Color Value Unit
Typ. Max.
Wavelength at Peak Emission IF = 10mA λpeak Green 574 - nm
Dominant Wavelength IF = 10mA λdom [1] Green 570 - nm
Spectral Bandwidth at 50% Φ REL MAX
IF = 10mA Δλ Green 20 - nm
Capacitance C Green 15 - pF
Forward Voltage IF = 10mA (Segment)
Forward Voltage IF = 10mA (DP) VF [2] Green
4
2
4.9
2.45 V
Reverse Current (VR = 5V) (Per chip) IR Green - 10 uA
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
© 2017 Kingbright. All Rights Reserved. Spec No: DSAM8409 / 1301002031 Rev No: V.2A Date: 09/27/2017 Page 3 / 5
0
4
8
12
16
20
1.8 1.9 2.0 2.1 2.2 2.3
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
1.0
2.0
3.0
4.0
5.0
0 1020304050
T
a
= 25 °C
Forward current (mA)
Luminous intensity normalised
at 10 mA
0
10
20
30
40
50
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-200 20406080100
Ambient temperature (°C)
Luminous intensity normalised at
T
a
= 25 °C
0
4
8
12
16
20
3.8 3.9 4.0 4.1 4.2 4.3
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
1.0
2.0
3.0
4.0
5.0
0 1020304050
T
a
= 25 °C
Forward current (mA)
Luminous intensity normalised
at 10 mA
0
10
20
30
40
50
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-200 20406080100
Ambient temperature (°C)
Luminous intensity normalised at
T
a
= 25 °C
0%
20%
40%
60%
80%
100%
350 400 450 500 550 600 650 700 750 800
T
a
= 25 °C
Green
Wavelength (nm)
Relative Intensity (a. u.)
TECHNICAL DATA
GREEN (SEGMENT)
SA10-21CGKWA
RELATIVE INTENSITY vs. WAVELENGTH
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
GREEN (DP)
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
© 2017 Kingbright. All Rights Reserved. Spec No: DSAM8409 / 1301002031 Rev No: V.2A Date: 09/27/2017 Page 4 / 5
SA10-21CGKWA
RECOMMENDED WAVE SOLDERING PROFILE Soldering General Notes
1. Through-hole displays are incompatible with reflow soldering.
2. If components will undergo multiple soldering processes,
or other processes where the components may be subjected
to intense heat, please check with Kingbright for compatibility.
CLEANING
1. Mild "no-clean" fluxes are recommended for use in soldering.
2. If cleaning is required, Kingbright recommends to wash
components with water only. Do not use harsh organic
solvents for cleaning because they may damage the plastic
parts .
3. The cleaning process should take place at room temperature
and the devices should not be washed for more than one
minute.
4. When water is used in the cleaning process, Immediately
remove excess moisture from the component with forced-air
drying afterwards.
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°Cfor 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
7. During wave soldering, the PCB top-surface temperature should be kept below 105°C.
PACKING & LABEL SPECIFICATIONS
THROUGH HOLE DISPLAY MOUNTING METHOD
Lead Forming
1. Do not bend the component leads by hand without
proper tools. The leads should be bent by clinching the
upper part of the lead firmly such that the bending force
is not exerted on the plastic body.
Installation
1. The installation process should not apply stress to the lead terminals.
2. When inserting for assembly, ensure the terminal pitch matches the substrate board's hole pitch to prevent spreading or pinching
the lead terminals. (Fig.1)
3. The component shall be placed at least 5mm from edge of PCB to avoid damage caused excessive heat during
wave soldering.(Fig.2)
© 2017 Kingbright. All Rights Reserved. Spec No: DSAM8409 / 1301002031 Rev No: V.2A Date: 09/27/2017 Page 5 / 5
SA10-21CGKWA
CIRCUIT DESIGN NOTES
1. Protective current-limiting resistors may be necessary to operate the LEDs within the specified range.
2. LEDs mounted in parallel should each be placed in series with its own current-limiting resistor.(Fig.3)
3. The driving circuit should be designed to protect the LED against reverse
voltages and transient voltage spikes when the circuit is powered up
or shut down.
4. The safe operating current should be chosen after considering the
maximum ambient temperature of the operating environment.
5. Prolonged reverse bias should be avoided, as it could cause metal
migration, leading to an increase in leakage current or causing
a short circuit.
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes
