W25Q32DW 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI -1- Publication Release Date: September 18, 2012 Revision D W25Q32DW Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PIN CONFIGURATION SOIC 208-MIL ............................................................................................. 6 4. PAD CONFIGURATION WSON 6X5-MM / 8X6-MM........................................................................ 6 5. PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM ............................................................... 6 6. PIN CONFIGURATION SOIC 300-MIL ............................................................................................. 7 7. PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 7 7.1 Package Types ..................................................................................................................... 8 7.2 Chip Select (/CS) .................................................................................................................. 8 7.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8 7.4 Write Protect (/WP) .............................................................................................................. 8 7.5 HOLD (/HOLD) ..................................................................................................................... 8 7.6 Serial Clock (CLK) ................................................................................................................ 8 8. BLOCK DIAGRAM ............................................................................................................................ 9 9. FUNCTIONAL DESCRIPTION ....................................................................................................... 10 9.1 9.2 SPI/QPI OPERATIONS ...................................................................................................... 10 9.1.1 Standard SPI Instructions ..................................................................................................... 10 9.1.2 Dual SPI Instructions ............................................................................................................ 10 9.1.3 Quad SPI Instructions ........................................................................................................... 11 9.1.4 QPI Instructions .................................................................................................................... 11 9.1.5 Hold Function ....................................................................................................................... 11 WRITE PROTECTION ....................................................................................................... 12 9.2.1 10. Write Protect Features ......................................................................................................... 12 CONTROL AND STATUS REGISTERS......................................................................................... 13 10.1 STATUS REGISTER .......................................................................................................... 13 10.1.1 BUSY .................................................................................................................................. 13 10.1.2 Write Enable Latch (WEL) .................................................................................................. 13 10.1.3 Block Protect Bits (BP2, BP1, BP0) .................................................................................... 13 10.1.4 Top/Bottom Block Protect (TB) ........................................................................................... 13 10.1.5 Sector/Block Protect (SEC) ................................................................................................ 13 10.1.6 Complement Protect (CMP)................................................................................................ 14 10.1.7 Status Register Protect (SRP1, SRP0)............................................................................... 14 10.1.8 Erase/Program Suspend Status (SUS) .............................................................................. 14 10.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) .............................................................. 14 10.1.10 Quad Enable (QE) ............................................................................................................ 15 10.1.11 W25Q32DW Status Register Memory Protection (CMP = 0) ........................................... 16 10.1.12 W25Q32DW Status Register Memory Protection (CMP = 1) ........................................... 17 -2- W25Q32DW 10.2 INSTRUCTIONS................................................................................................................. 18 10.2.1 Manufacturer and Device Identification .............................................................................. 18 10.2.2 Instruction Set Table 1 (Standard SPI Instructions) ........................................................... 19 10.2.3 Instruction Set Table 2 (Dual SPI Instructions) ................................................................... 20 10.2.4 Instruction Set Table 3 (Quad SPI Instructions) ................................................................. 20 10.2.5 Instruction Set Table 4 (QPI Instructions) ........................................................................... 21 10.2.6 Write Enable (06h) ............................................................................................................. 23 10.2.7 Write Enable for Volatile Status Register (50h) .................................................................. 23 10.2.8 Write Disable (04h)............................................................................................................. 24 10.2.9 Read Status Register-1 (05h) and Read Status Register-2 (35h) ...................................... 24 10.2.10 Write Status Register (01h) .............................................................................................. 25 10.2.11 Read Data (03h) ............................................................................................................... 27 10.2.12 Fast Read (0Bh) ............................................................................................................... 28 10.2.13 Fast Read Dual Output (3Bh) ........................................................................................... 30 10.2.14 Fast Read Quad Output (6Bh) .......................................................................................... 31 10.2.15 Fast Read Dual I/O (BBh) ................................................................................................. 32 10.2.16 Fast Read Quad I/O (EBh) ............................................................................................... 34 10.2.17 Word Read Quad I/O (E7h) .............................................................................................. 37 10.2.18 Octal Word Read Quad I/O (E3h)..................................................................................... 39 10.2.19 Set Burst with Wrap (77h) ................................................................................................ 41 10.2.20 Page Program (02h) ......................................................................................................... 42 10.2.21 Quad Input Page Program (32h) ...................................................................................... 44 10.2.22 Sector Erase (20h) ........................................................................................................... 44 10.2.23 32KB Block Erase (52h) ................................................................................................... 46 10.2.24 64KB Block Erase (D8h) ................................................................................................... 47 10.2.25 Chip Erase (C7h / 60h) ..................................................................................................... 48 10.2.26 Erase / Program Suspend (75h) ....................................................................................... 49 10.2.27 Erase / Program Resume (7Ah) ....................................................................................... 51 10.2.28 Power-down (B9h) ............................................................................................................ 52 10.2.29 Release Power-down / Device ID (ABh) ........................................................................... 53 10.2.30 Read Manufacturer / Device ID (90h) ............................................................................... 55 10.2.31 Read Manufacturer / Device ID Dual I/O (92h) ................................................................. 56 10.2.32 Read Manufacturer / Device ID Quad I/O (94h) ............................................................... 57 10.2.33 Read Unique ID Number (4Bh)......................................................................................... 58 10.2.34 Read JEDEC ID (9Fh) ...................................................................................................... 59 10.2.35 Erase Security Registers (44h) ......................................................................................... 60 10.2.36 Program Security Registers (42h) .................................................................................... 61 10.2.37 Read Security Registers (48h) ......................................................................................... 62 10.2.38 Set Read Parameters (C0h) ............................................................................................. 63 10.2.39 Burst Read with Wrap (0Ch)............................................................................................. 64 10.2.40 Enable QPI (38h) .............................................................................................................. 65 -3- Publication Release Date: September 18, 2012 Revision D W25Q32DW 11. 12. 13. Disable QPI (FFh) ............................................................................................................. 66 10.2.42 Enable Reset (66h) and Reset (99h) ................................................................................ 67 ELECTRICAL CHARACTERISTICS ............................................................................................... 68 11.1 Absolute Maximum Ratings ................................................................................................ 68 11.2 Operating Ranges............................................................................................................... 68 11.3 Power-Up Power-Down Timing and Requirements ............................................................ 69 11.4 DC Electrical Characteristics .............................................................................................. 70 11.5 AC Measurement Conditions .............................................................................................. 71 11.6 AC Electrical Characteristics .............................................................................................. 72 11.7 AC Electrical Characteristics (cont'd) ................................................................................. 73 11.8 Serial Output Timing ........................................................................................................... 74 11.9 Serial Input Timing .............................................................................................................. 74 11.10 Hold Timing ....................................................................................................................... 74 PACKAGE SPECIFICATION .......................................................................................................... 75 12.1 8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 75 12.2 8-Contact 6x5mm WSON (Package Code ZP) .................................................................. 76 12.3 8-Contact 8x6mm WSON (Package Code ZE) .................................................................. 78 12.4 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 79 ORDERING INFORMATION .......................................................................................................... 80 13.1 14. 10.2.41 Valid Part Numbers and Top Side Marking ........................................................................ 81 REVISION HISTORY ...................................................................................................................... 82 -4- W25Q32DW 1. GENERAL DESCRIPTION The W25Q32DW (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.7V to 1.95V power supply with current consumption as low as 4mA active and 1A for power-down. All devices are offered in space-saving packages. The W25Q32DW array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32DW has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q32DW support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification, a 64-bit Unique Serial Number and four 256-bytes Security Registers. 2. FEATURES * Family of SpiFlash Memories - W25Q32DW: 32M-bit / 4M-byte (4,194,304) - Standard SPI: CLK, /CS, DI, DO, /WP, /Hold - Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold - Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 - QPI: CLK, /CS, IO0, IO1, IO2, IO3 * Low Power, Wide Temperature Range - Single 1.7 to 1.95V supply - 4mA active current, <1A Power-down (typ.) - -40C to +85C operating range * Flexible Architecture with 4KB sectors - Uniform Sector Erase (4K-bytes) - Uniform Block Erase (32K and 64K-bytes) - Program 1 to 256 byte per programmable page - Erase/Program Suspend & Resume * Highest Performance Serial Flash - 104MHz Standard/Dual/Quad SPI clocks - 208/416MHz equivalent Dual/Quad SPI - 50MB/s continuous data transfer rate - More than 100,000 erase/program cycles - More than 20-year data retention * Advanced Security Features - Software and Hardware Write-Protect - Top/Bottom, 4KB complement array protection - Power Supply Lock-Down and OTP protection - 64-Bit Unique ID for each device - 4X256-Bytes Security Registers with OTP locks - Volatile & Non-volatile Status Register Bits * Efficient "Continuous Read" and QPI Mode - Continuous Read with 8/16/32/64-Byte Wrap - As few as 8 clocks to address memory - Quad Peripheral Interface (QPI) reduces instruction overhead - Allows true XIP (execute in place) operation - Outperforms X16 Parallel Flash * Space Efficient Packaging - 8-pin SOIC 208-mil - 8-pad WSON 6x5-mm/8x6-mm - 16-pin SOIC 300-mil - Contact Winbond for KGD and other options -5- Publication Release Date: September 18, 2012 Revision D W25Q32DW 3. PIN CONFIGURATION SOIC 208-MIL Top View /CS 1 8 VCC DO (IO1) 2 7 /HOLD (IO3) /WP (IO2) 3 6 CLK GND 4 5 DI (IO0) Figure 1a. W25Q32DW Pin Assignments, 8-pin SOIC 208-mil (Package Code SS) 4. PAD CONFIGURATION WSON 6X5-MM / 8X6-MM Top View /CS 1 8 VCC DO (IO1) 2 7 /HOLD (IO3) /WP (IO2) 3 6 CLK GND 4 5 DI (IO0) Figure 1b. W25Q32DW Pad Assignments, 8-pad WSON (Package Code ZP & ZE) 5. PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM PIN NO. PIN NAME I/O 1 /CS I 2 DO (IO1) I/O Data Output (Data Input Output 1)* 3 /WP (IO2) I/O Write Protect Input ( Data Input Output 2)* 4 GND 5 DI (IO0) I/O 6 CLK I 7 /HOLD (IO3) I/O 8 VCC FUNCTION Chip Select Input Ground Data Input (Data Input Output 0)* 1 Serial Clock Input Hold Input (Data Input Output 3)* Power Supply *1 IO0 and IO1 are used for Standard and Dual SPI instructions *2 IO0 - IO3 are used for Quad SPI/QPI instructions -6- 2 1 2 W25Q32DW 6. PIN CONFIGURATION SOIC 300-MIL Top View /HOLD (IO3) 1 16 CLK VCC 2 15 DI (IO0) NC 3 14 NC NC 4 13 NC NC 5 12 NC NC 6 11 NC /CS 7 10 GND DO (IO1) 8 9 /WP (IO2) Figure 1c. W25Q32DW Pin Assignments, 16-pin SOIC 300-mil (Package Code SF) 7. PIN DESCRIPTION SOIC 300-MIL PAD NO. PAD NAME I/O FUNCTION 1 /HOLD (IO3) I/O 2 VCC Power Supply 3 N/C No Connect 4 N/C No Connect 5 N/C No Connect 6 N/C No Connect 7 /CS I 8 DO (IO1) I/O Data Output (Data Input Output 1)* 9 /WP (IO2) I/O Write Protect Input (Data Input Output 2)* 10 GND Ground 11 N/C No Connect 12 N/C No Connect 13 N/C No Connect 14 N/C No Connect 15 DI (IO0) I/O 16 CLK I Hold Input (Data Input Output 3)* 2 Chip Select Input 1 2 Data Input (Data Input Output 0)* 1 Serial Clock Input *1 IO0 and IO1 are used for Standard and Dual SPI instructions *2 IO0 - IO3 are used for Quad SPI/QPI instructions -7- Publication Release Date: September 18, 2012 Revision D W25Q32DW 7.1 Package Types At the time this datasheet was published, not all package types had been finalized. Contact Winbond to confirm availability of these packages before designing to this specification. W25Q32DW is offered in an 8-pin plastic 208-mil width SOIC (package code SS), a WSON 6x5-mm or 8X6-mm (package code ZP & ZE) and a 16-pin plastic 300-mil width SOIC (package code SF) as shown in Figure 1a, 1b, 1c. Package diagrams and dimensions are illustrated at the end of this datasheet. 7.2 Chip Select (/CS) The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high, the device is deselected and the Serial Data Output (DO, or IO0, IO1, IO2, IO3) pins are at high impedance. When deselected, the devices power consumption will be at standby levels unless an internal erase, program or write status register cycle is in progress. When /CS is brought low, the device will be selected, power consumption will increase to active levels and instructions can be written to and data read from the device. After power-up, /CS must transition from high to low before a new instruction will be accepted. The /CS input must track the VCC supply level at power-up and power-down (see "Write Protection" and figure 43). If needed a pull-up resister on /CS can be used to accomplish this. 7.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) The W25Q32DW supports standard SPI, Dual SPI, Quad SPI and QPI operation. Standard SPI instructions use the unidirectional DI (input) pin to serially write instructions, addresses or data to the device on the rising edge of the Serial Clock (CLK) input pin. Standard SPI also uses the unidirectional DO (output) to read data or status from the device on the falling edge of CLK. Dual/Quad SPI and QPI instructions use the bidirectional IO pins to serially write instructions, addresses or data to the device on the rising edge of CLK and read data or status from the device on the falling edge of CLK. Quad SPI and QPI instructions require the non-volatile Quad Enable bit (QE) in Status Register-2 to be set. When QE=1, the /WP pin becomes IO2 and /HOLD pin becomes IO3. 7.4 Write Protect (/WP) The Write Protect (/WP) pin can be used to prevent the Status Registers from being written. Used in conjunction with the Status Register's Block Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits and Status Register Protect (SRP) bits, a portion as small as a 4KB sector or the entire memory array can be hardware protected. The /WP pin is active low. However, when the QE bit of Status Register-2 is set for Quad I/O, the /WP pin function is not available since this pin is used for IO2. See figure 1a, 1b and 1c for the pin configuration of Quad I/O operation. 7.5 HOLD (/HOLD) The /HOLD pin allows the device to be paused while it is actively selected. When /HOLD is brought low, while /CS is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be ignored (don't care). When /HOLD is brought high, device operation can resume. The /HOLD function can be useful when multiple devices are sharing the same SPI signals. The /HOLD pin is active low. When the QE bit of Status Register-2 is set for Quad I/O, the /HOLD pin function is not available since this pin is used for IO3. See figure 1a, 1b and 1c for the pin configuration of Quad I/O operation. 7.6 Serial Clock (CLK) The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See SPI Operations") -8- W25Q32DW 8. BLOCK DIAGRAM Security Register 3 - 0 003000h 002000h 001000h 000000h Block Segmentation xxFF00h * xxF000h Sector 15 (4KB) xxFFFFh * xxF0FFh xxEF00h * xxE000h Sector 14 (4KB) xxEFFFh * xxE0FFh xxDF00h * xxD000h Sector 13 (4KB) xxDFFFh * xxD0FFh 3FFF00h * 3F0000h Block 63 (64KB) xx2FFFh * xx20FFh xx1F00h * xx1000h Sector 1 (4KB) xx1FFFh * xx10FFh xx0F00h * xx0000h Sector 0 (4KB) xx0FFFh * xx00FFh 20FF00h * 200000h Block 32 (64KB) 20FFFFh * 2000FFh 1FFF00h * 1F0000h Block 31 (64KB) 1FFFFFh * 1F00FFh * * * Write Control Logic Status Register 10FF00h * 100000h Block 16 (64KB) 10FFFFh * 1000FFh 0FFF00h * 0F0000h Block 15 (64KB) 0FFFFFh * 0F00FFh * * * High Voltage Generators 00FF00h * 000000h /HOLD (IO3) /CS DI (IO0) DO (IO1) SPI Command & Control Logic Page Address Latch / Counter W25Q32DW Sector 2 (4KB) Write Protect Logic and Row Decode xx2F00h * xx2000h CLK 3FFFFFh * 3F00FFh * * * * * * /WP (IO2) 0030FFh 0020FFh 0010FFh 0000FFh Block 0 (64KB) Beginning Page Address 00FFFFh * 0000FFh Ending Page Address Column Decode And 256-Byte Page Buffer Data Byte Address Latch / Counter Figure 2. W25Q32DW Serial Flash Memory Block Diagram -9- Publication Release Date: September 18, 2012 Revision D W25Q32DW 9. FUNCTIONAL DESCRIPTION 9.1 SPI/QPI OPERATIONS Power On Reset (66h + 99h) Reset (66h + 99h) Device Initialization Standard SPI Dual SPI Quad SPI operations Enable QPI (38h) Disable QPI (FFh) QPI operations Figure 3. W25Q32DW Serial Flash Memory Operation Diagram 9.1.1 Standard SPI Instructions The W25Q32DW is accessed through an SPI compatible bus consisting of four signals: Serial Clock (CLK), Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Standard SPI instructions use the DI input pin to serially write instructions, addresses or data to the device on the rising edge of CLK. The DO output pin is used to read data or status from the device on the falling edge of CLK. SPI bus operation Mode 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in standby and data is not being transferred to the Serial Flash. For Mode 0, the CLK signal is normally low on the falling and rising edges of /CS. For Mode 3, the CLK signal is normally high on the falling and rising edges of /CS. 9.1.2 Dual SPI Instructions The W25Q32DW supports Dual SPI operation when using instructions such as "Fast Read Dual Output (3Bh)" and "Fast Read Dual I/O (BBh)". These instructions allow data to be transferred to or from the device at two to three times the rate of ordinary Serial Flash devices. The Dual SPI Read instructions are ideal for quickly downloading code to RAM upon power-up (code-shadowing) or for executing non-speedcritical code directly from the SPI bus (XIP). When using Dual SPI instructions, the DI and DO pins become bidirectional I/O pins: IO0 and IO1. - 10 - W25Q32DW 9.1.3 Quad SPI Instructions The W25Q32DW supports Quad SPI operation when using instructions such as "Fast Read Quad Output (6Bh)", "Fast Read Quad I/O (EBh)", "Word Read Quad I/O (E7h)" and "Octal Word Read Quad I/O (E3h)". These instructions allow data to be transferred to or from the device four to six times the rate of ordinary Serial Flash. The Quad Read instructions offer a significant improvement in continuous and random access transfer rates allowing fast code-shadowing to RAM or execution directly from the SPI bus (XIP). When using Quad SPI instructions the DI and DO pins become bidirectional IO0 and IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively. Quad SPI instructions require the non-volatile Quad Enable bit (QE) in Status Register-2 to be set. 9.1.4 QPI Instructions The W25Q32DW supports Quad Peripheral Interface (QPI) operations only when the device is switched from Standard/Dual/Quad SPI mode to QPI mode using the "Enable QPI (38h)" instruction. The typical SPI protocol requires that the byte-long instruction code being shifted into the device only via DI pin in eight serial clocks. The QPI mode utilizes all four IO pins to input the instruction code, thus only two serial clocks are required. This can significantly reduce the SPI instruction overhead and improve system performance in an XIP environment. Standard/Dual/Quad SPI mode and QPI mode are exclusive. Only one mode can be active at any given time. "Enable QPI (38h)" and "Disable QPI (FFh)" instructions are used to switch between these two modes. Upon power-up or after a software reset using "Reset (99h)" instruction, the default state of the device is Standard/Dual/Quad SPI mode. To enable QPI mode, the non-volatile Quad Enable bit (QE) in Status Register-2 is required to be set. When using QPI instructions, the DI and DO pins become bidirectional IO0 and IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively. See Figure 3 for the device operation modes. 9.1.5 Hold Function For Standard SPI and Dual SPI operations, the /HOLD signal allows the W25Q32DW operation to be paused while it is actively selected (when /CS is low). The /HOLD function may be useful in cases where the SPI data and clock signals are shared with other devices. For example, consider if the page buffer was only partially written when a priority interrupt requires use of the SPI bus. In this case the /HOLD function can save the state of the instruction and the data in the buffer so programming can resume where it left off once the bus is available again. The /HOLD function is only available for standard SPI and Dual SPI operation, not during Quad SPI or QPI. To initiate a /HOLD condition, the device must be selected with /CS low. A /HOLD condition will activate on the falling edge of the /HOLD signal if the CLK signal is already low. If the CLK is not already low the /HOLD condition will activate after the next falling edge of CLK. The /HOLD condition will terminate on the rising edge of the /HOLD signal if the CLK signal is already low. If the CLK is not already low the /HOLD condition will terminate after the next falling edge of CLK. During a /HOLD condition, the Serial Data Output (DO) is high impedance, and Serial Data Input (DI) and Serial Clock (CLK) are ignored. The Chip Select (/CS) signal should be kept active (low) for the full duration of the /HOLD operation to avoid resetting the internal logic state of the device. - 11 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 9.2 WRITE PROTECTION Applications that use non-volatile memory must take into consideration the possibility of noise and other adverse system conditions that may compromise data integrity. To address this concern, the W25Q32DW provides several means to protect the data from inadvertent writes. 9.2.1 * * * * * * * Write Protect Features Device resets when VCC is below threshold Time delay write disable after Power-up Write enable/disable instructions and automatic write disable after erase or program Software and Hardware (/WP pin) write protection using Status Register Write Protection using Power-down instruction Lock Down write protection for Status Register until the next power-up * One Time Program (OTP) write protection for array and Security Registers using Status Register * Note: This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q32DW will maintain a reset condition while VCC is below the threshold value of VWI, (See Power-up Timing and Voltage Levels and Figure 43). While reset, all operations are disabled and no instructions are recognized. During power-up and after the VCC voltage exceeds VWI, all program and erase related instructions are further disabled for a time delay of tPUW . This includes the Write Enable, Page Program, Sector Erase, Block Erase, Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS) must track the VCC supply level at power-up until the VCC-min level and tVSL time delay is reached, and it must also track the VCC supply level at powerdown to prevent adverse command sequence. If needed a pull-up resister on /CS can be used to accomplish this. After power-up the device is automatically placed in a write-disabled state with the Status Register Write Enable Latch (WEL) set to a 0. A Write Enable instruction must be issued before a Page Program, Sector Erase, Block Erase, Chip Erase or Write Status Register instruction will be accepted. After completing a program, erase or write instruction the Write Enable Latch (WEL) is automatically cleared to a writedisabled state of 0. Software controlled write protection is facilitated using the Write Status Register instruction and setting the Status Register Protect (SRP0, SRP1) and Block Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits. These settings allow a portion as small as a 4KB sector or the entire memory array to be configured as read only. Used in conjunction with the Write Protect (/WP) pin, changes to the Status Register can be enabled or disabled under hardware control. See Status Register section for further information. Additionally, the Power-down instruction offers an extra level of write protection as all instructions are ignored except for the Release Power-down instruction. - 12 - W25Q32DW 10. CONTROL AND STATUS REGISTERS The Read Status Register-1 and Status Register-2 instructions can be used to provide status on the availability of the Flash memory array, if the device is write enabled or disabled, the state of write protection, Quad SPI setting, Security Register lock status and Erase/Program Suspend status. The Write Status Register instruction can be used to configure the device write protection features, Quad SPI setting and Security Register OTP lock. Write access to the Status Register is controlled by the state of the nonvolatile Status Register Protect bits (SRP0, SRP1), the Write Enable instruction, and during Standard/Dual SPI operations, the /WP pin. 10.1 STATUS REGISTER 10.1.1 BUSY BUSY is a read only bit in the status register (S0) that is set to a 1 state when the device is executing a Page Program, Quad Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register or Erase/Program Security Register instruction. During this time the device will ignore further instructions except for the Read Status Register and Erase/Program Suspend instruction (see tW , tPP, tSE, tBE, and tCE in AC Characteristics). When the program, erase or write status/security register instruction has completed, the BUSY bit will be cleared to a 0 state indicating the device is ready for further instructions. 10.1.2 Write Enable Latch (WEL) Write Enable Latch (WEL) is a read only bit in the status register (S1) that is set to 1 after executing a Write Enable Instruction. The WEL status bit is cleared to 0 when the device is write disabled. A write disable state occurs upon power-up or after any of the following instructions: Write Disable, Page Program, Quad Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register, Erase Security Register and Program Security Register. 10.1.3 Block Protect Bits (BP2, BP1, BP0) The Block Protect Bits (BP2, BP1, BP0) are non-volatile read/write bits in the status register (S4, S3, and S2) that provide Write Protection control and status. Block Protect bits can be set using the Write Status Register Instruction (see tW in AC characteristics). All, none or a portion of the memory array can be protected from Program and Erase instructions (see Status Register Memory Protection table). The factory default setting for the Block Protection Bits is 0, none of the array protected. 10.1.4 Top/Bottom Block Protect (TB) The non-volatile Top/Bottom bit (TB) controls if the Block Protect Bits (BP2, BP1, BP0) protect from the Top (TB=0) or the Bottom (TB=1) of the array as shown in the Status Register Memory Protection table. The factory default setting is TB=0. The TB bit can be set with the Write Status Register Instruction depending on the state of the SRP0, SRP1 and WEL bits. 10.1.5 Sector/Block Protect (SEC) The non-volatile Sector/Block Protect bit (SEC) controls if the Block Protect Bits (BP2, BP1, BP0) protect either 4KB Sectors (SEC=1) or 64KB Blocks (SEC=0) in the Top (TB=0) or the Bottom (TB=1) of the array as shown in the Status Register Memory Protection table. The default setting is SEC=0. - 13 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.1.6 Complement Protect (CMP) The Complement Protect bit (CMP) is a non-volatile read/write bit in the status register (S14). It is used in conjunction with SEC, TB, BP2, BP1 and BP0 bits to provide more flexibility for the array protection. Once CMP is set to 1, previous array protection set by SEC, TB, BP2, BP1 and BP0 will be reversed. For instance, when CMP=0, a top 4KB sector can be protected while the rest of the array is not; when CMP=1, the top 4KB sector will become unprotected while the rest of the array become read-only. Please refer to the Status Register Memory Protection table for details. The default setting is CMP=0. 10.1.7 Status Register Protect (SRP1, SRP0) The Status Register Protect bits (SRP1 and SRP0) are non-volatile read/write bits in the status register (S8 and S7). The SRP bits control the method of write protection: software protection, hardware protection, power supply lock-down or one time programmable (OTP) protection. SRP1 SRP0 /WP Status Register Description 0 0 X Software Protection /WP pin has no control. The Status register can be written to after a Write Enable instruction, WEL=1. [Factory Default] 0 1 0 Hardware Protected When /WP pin is low the Status Register locked and can not be written to. 0 1 1 Hardware Unprotected When /WP pin is high the Status register is unlocked and can be written to after a Write Enable instruction, WEL=1. 1 0 X Power Supply Lock-Down 1 1 X One Time (2) Program Status Register is protected and can not be written to again (1) until the next power-down, power-up cycle. Status Register is permanently protected and can not be written to. Note: 1. When SRP1, SRP0 = (1, 0), a power-down, power-up cycle will change SRP1, SRP0 to (0, 0) state. 2. This feature is available upon special order. Please contact Winbond for details. 10.1.8 Erase/Program Suspend Status (SUS) The Suspend Status bit is a read only bit in the status register (S15) that is set to 1 after executing a Erase/Program Suspend (75h) instruction. The SUS status bit is cleared to 0 by Erase/Program Resume (7Ah) instruction as well as a power-down, power-up cycle. 10.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) The Security Register Lock Bits (LB3, LB2, LB1, LB0) are non-volatile One Time Program (OTP) bits in Status Register (S13, S12, S11, S10) that provide the write protect control and status to the Security Registers. The default state of LB3-0 is 0, Security Registers are unlocked. LB3-0 can be set to 1 individually using the Write Status Register instruction. LB3-0 are One Time Programmable (OTP), once it's set to 1, the corresponding 256-Byte Security Register will become read-only permanently. - 14 - W25Q32DW 10.1.10 Quad Enable (QE) The Quad Enable (QE) bit is a non-volatile read/write bit in the status register (S9) that allows Quad SPI and QPI operation. When the QE bit is set to a 0 state (factory default), the /WP pin and /HOLD are enabled. When the QE bit is set to a 1, the Quad IO2 and IO3 pins are enabled, and /WP and /HOLD functions are disabled. QE bit is required to be set to a 1 before issuing an "Enable QPI (38h)" to switch the device from Standard/Dual/Quad SPI to QPI, otherwise the command will be ignored. When the device is in QPI mode, QE bit will remain to be 1. A "Write Status Register" command in QPI mode cannot change QE bit from a "1" to a "0". WARNING: If the /WP or /HOLD pins are tied directly to the power supply or ground during standard SPI or Dual SPI operation, the QE bit should never be set to a 1. S7 S6 S5 S4 S3 S2 SRP0 SEC TB BP2 BP1 BP0 S1 S0 WEL BUSY STATUS REGISTER PROTECT 0 (non-volatile) SECTOR PROTECT (non-volatile) TOP/BOTTOM PROTECT (non-volatile) BLOCK PROTECT BITS (non-volatile) WRITE ENABLE LATCH ERASE/WRITE IN PROGRESS Figure 4a. Status Register-1 S15 S14 S13 S12 S11 S10 S9 S8 SUS CMP LB3 LB2 LB1 LB0 QE SRP1 SUSPEND STATUS COMPLEMENT PROTECT (non-volatile) SECURITY REGISTER LOCK BITS (non-volatile OTP) QUAD ENABLE (non-volatile) STATUS REGISTER PROTECT 1 (non-volatile)) (non-volatile Figure 4b. Status Register-2 - 15 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.1.11 W25Q32DW Status Register Memory Protection (CMP = 0) STATUS REGISTER(1) W25Q32DW (32M-BIT) MEMORY PROTECTION(3) SEC TB BP2 BP1 BP0 PROTECTED BLOCK(S) PROTECTED ADDRESSES PROTECTED DENSITY PROTECTED PORTION(2) X X 0 0 0 NONE NONE NONE NONE 0 0 0 0 1 63 3F0000h - 3FFFFFh 64KB Upper 1/64 0 0 0 1 0 62 and 63 3E0000h - 3FFFFFh 128KB Upper 1/32 0 0 0 1 1 60 thru 63 3C0000h - 3FFFFFh 256KB Upper 1/16 0 0 1 0 0 56 thru 63 380000h - 3FFFFFh 512KB Upper 1/8 0 0 1 0 1 48 thru 63 300000h - 3FFFFFh 1MB Upper 1/4 0 0 1 1 0 32 thru 63 200000h - 3FFFFFh 2MB Upper 1/2 0 1 0 0 1 0 000000h - 00FFFFh 64KB Lower 1/64 0 1 0 1 0 0 and 1 000000h - 01FFFFh 128KB Lower 1/32 0 1 0 1 1 0 thru 3 000000h - 03FFFFh 256KB Lower 1/16 0 1 1 0 0 0 thru 7 000000h - 07FFFFh 512KB Lower 1/8 0 1 1 0 1 0 thru 15 000000h - 0FFFFFh 1MB Lower 1/4 0 1 1 1 0 0 thru 31 000000h - 1FFFFFh 2MB Lower 1/2 X X 1 1 1 0 thru 63 000000h - 3FFFFFh 4MB ALL 1 0 0 0 1 63 3FF000h - 3FFFFFh 4KB U - 1/1024 1 0 0 1 0 63 3FE000h - 3FFFFFh 8KB U - 1/512 1 0 0 1 1 63 3FC000h - 3FFFFFh 16KB U - 1/256 1 0 1 0 X 63 3F8000h - 3FFFFFh 32KB U - 1/128 1 1 0 0 1 0 000000h - 000FFFh 4KB L - 1/1024 1 1 0 1 0 0 000000h - 001FFFh 8KB L - 1/512 1 1 0 1 1 0 000000h - 003FFFh 16KB L - 1/256 1 1 1 0 X 0 000000h - 007FFFh 32KB L - 1/128 Note: 1. X = don't care 2. L = Lower; U = Upper 3. If any Erase or Program command specifies a memory region that contains protected data portion, this command will be ignored. - 16 - W25Q32DW 10.1.12 W25Q32DW Status Register Memory Protection (CMP = 1) STATUS REGISTER(1) W25Q32DW (32M-BIT) MEMORY PROTECTION(3) SEC TB BP2 BP1 BP0 PROTECTED BLOCK(S) PROTECTED ADDRESSES PROTECTED DENSITY PROTECTED PORTION(2) X X 0 0 0 0 thru 63 000000h - 3FFFFFh 4MB ALL 0 0 0 0 1 0 thru 62 000000h - 3EFFFFh 4,032KB Lower 63/64 0 0 0 1 0 0 and 61 000000h - 3DFFFFh 3,968KB Lower 31/32 0 0 0 1 1 0 thru 59 000000h - 3BFFFFh 3,840KB Lower 15/16 0 0 1 0 0 0 thru 55 000000h - 37FFFFh 3,584KB Lower 7/8 0 0 1 0 1 0 thru 47 000000h - 2FFFFFh 3MB Lower 3/4 0 0 1 1 0 0 thru 31 000000h - 1FFFFFh 2MB Lower 1/2 0 1 0 0 1 1 thru 63 010000h - 3FFFFFh 4,032KB Upper 63/64 0 1 0 1 0 2 and 63 020000h - 3FFFFFh 3,968KB Upper 31/32 0 1 0 1 1 4 thru 63 040000h - 3FFFFFh 3,840KB Upper 15/16 0 1 1 0 0 8 thru 63 080000h - 3FFFFFh 3,584KB Upper 7/8 0 1 1 0 1 16 thru 63 100000h - 3FFFFFh 3MB Upper 3/4 0 1 1 1 0 32 thru 63 200000h - 3FFFFFh 2MB Upper 1/2 X X 1 1 1 NONE NONE NONE NONE 1 0 0 0 1 0 thru 63 000000h - 3FEFFFh 4,092KB L - 1023/1024 1 0 0 1 0 0 thru 63 000000h - 3FDFFFh 4,088KB L - 511/512 1 0 0 1 1 0 thru 63 000000h - 3FBFFFh 4,080KB L - 255/256 1 0 1 0 X 0 thru 63 000000h - 3F7FFFh 4,064KB L - 127/128 1 1 0 0 1 0 thru 63 001000h - 3FFFFFh 4,092KB U - 1023/1024 1 1 0 1 0 0 thru 63 002000h - 3FFFFFh 4,088KB U - 511/512 1 1 0 1 1 0 thru 63 004000h - 3FFFFFh 4,080KB U - 255/256 1 1 1 0 X 0 thru 63 008000h - 3FFFFFh 4,064KB U - 127/128 Note: 1. X = don't care 2. L = Lower; U = Upper 3. If any Erase or Program command specifies a memory region that contains protected data portion, this command will be ignored. - 17 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2 INSTRUCTIONS The Standard/Dual/Quad SPI instruction set of the W25Q32DW consists of thirty six basic instructions that are fully controlled through the SPI bus (see Instruction Set table1-3). Instructions are initiated with the falling edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code. Data on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first. The QPI instruction set of the W25Q32DW consists of twenty four basic instructions that are fully controlled through the SPI bus (see Instruction Set table 4). Instructions are initiated with the falling edge of Chip Select (/CS). The first byte of data clocked through IO[3:0] pins provides the instruction code. Data on all four IO pins are sampled on the rising edge of clock with most significant bit (MSB) first. All QPI instructions, addresses, data and dummy bytes are using all four IO pins to transfer every byte of data with every two serial clocks (CLK). Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data bytes, dummy bytes (don't care), and in some cases, a combination. Instructions are completed with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in figures 5 through 42. All read instructions can be completed after any clocked bit. However, all instructions that Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or when the Status Register is being written, all instructions except for Read Status Register will be ignored until the program or erase cycle has completed. 10.2.1 Manufacturer and Device Identification MANUFACTURER ID (MF7 - MF0) Winbond Serial Flash EFh Device ID (ID7 - ID0) (ID15 - ID0) Instruction ABh, 90h, 92h, 94h 9Fh W25Q32DW 15h 6016h - 18 - W25Q32DW 10.2.2 Instruction Set Table 1 (Standard SPI Instructions)(1) INSTRUCTION NAME BYTE 1 BYTE 2 BYTE 3 BYTE 4 BYTE 5 BYTE 6 CLOCK NUMBER (0 - 7) (8 - 15) (16 - 23) (24 - 31) (32 - 39) (40 - 47) D7-D0 D7-D0(3) Write Enable 06h Volatile SR Write Enable 50h Write Disable 04h Read Status Register-1 05h (S7-S0)(2) Read Status Register-2 35h (S15-S8)(2) Write Status Register 01h (S7-S0) (S15-S8) Page Program 02h A23-A16 A15-A8 A7-A0 Sector Erase (4KB) 20h A23-A16 A15-A8 A7-A0 Block Erase (32KB) 52h A23-A16 A15-A8 A7-A0 Block Erase (64KB) D8h A23-A16 A15-A8 A7-A0 Chip Erase C7h/60h Erase / Program Suspend 75h Erase / Program Resume 7Ah Power-down B9h Read Data 03h A23-A16 A15-A8 A7-A0 (D7-D0) 0Bh A23-A16 A15-A8 A7-A0 dummy Fast Read (4) Release Powerdown / ID ABh dummy dummy dummy Manufacturer/Device ID(4) 90h dummy dummy 00h JEDEC ID(4) 9Fh (MF7-MF0) Manufacturer (ID15-ID8) Memory Type (ID7-ID0) Capacity Read Unique ID 4Bh dummy dummy dummy Erase Security Registers(5) 44h A23-A16 A15-A8 A7-A0 Program Security Registers(5) 42h A23-A16 A15-A8 Read Security Registers(5) 48h A23-A16 A15-A8 Enable QPI 38h Enable Reset 66h Reset 99h - 19 - (D7-D0) (2) (ID7-ID0) (MF7-MF0) (ID7-ID0) dummy (UID63-UID0) A7-A0 D7-D0 D7-D0(3) A7-A0 dummy (D7-D0) Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.3 Instruction Set Table 2 (Dual SPI Instructions) INSTRUCTION NAME BYTE 1 BYTE 2 BYTE 3 BYTE 4 BYTE 5 BYTE 6 CLOCK NUMBER (0 - 7) (8 - 15) (16 - 23) (24 - 31) (32 - 39) (40 - 47) Fast Read Dual Output 3Bh A23-A16 A15-A8 A7-A0 dummy (D7-D0, ...)(7) Fast Read Dual I/O BBh A23-A8(6) A7-A0, M7-M0 (6) (D7-D0, ...)(7) Manufacturer/Device ID by Dual I/O(4) 92h A23-A8(6) A7-A0, M7-M0 (6) (MF7-MF0, ID7-ID0) 10.2.4 Instruction Set Table 3 (Quad SPI Instructions) INSTRUCTION NAME BYTE 1 BYTE 2 BYTE 3 BYTE 4 BYTE 5 BYTE 6 CLOCK NUMBER (0 - 7) (8 - 15) (16 - 23) (24 - 31) (32 - 39) (40 - 47) Quad Page Program 32h A23-A16 A15-A8 A7-A0 D7-D0, ...(9) D7-D0, ...(3) Fast Read Quad Output 6Bh A23-A16 A15-A8 A7-A0 dummy (D7-D0, ...)(9) Fast Read Quad I/O EBh A23-A0, M7-M0(8) (xxxx, D7-D0)(10) (D7-D0, ...)(9) Word Read Quad I/O(12) E7h A23-A0, M7-M0(8) (xx, D7-D0)(11) (D7-D0, ...)(9) Octal Word Read Quad I/O(13) E3h A23-A0, M7-M0(8) (D7-D0, ...)(9) Set Burst with Wrap 77h xxxxxx, W6-W4(8) Manufacture/Device ID by Quad I/O(4) 94h A23-A0, M7-M0(8) xxxx, (MF7-MF0, ID7-ID0) - 20 - (MF7-MF0, ID7-ID0, ...) W25Q32DW 10.2.5 Instruction Set Table 4 (QPI Instructions)(14) INSTRUCTION NAME BYTE 1 BYTE 2 BYTE 3 BYTE 4 BYTE 5 BYTE 6 CLOCK NUMBER (0 , 1) (2 , 3) (4 , 5) (6 , 7) (8 , 9) (10 , 11) D7-D0(9) D7-D0(3) Write Enable 06h Volatile SR Write Enable 50h Write Disable 04h Read Status Register-1 05h (S7-S0)(2) Read Status Register-2 35h (S15-S8)(2) Write Status Register 01h (S7-S0) (S15-S8) Page Program 02h A23-A16 A15-A8 A7-A0 Sector Erase (4KB) 20h A23-A16 A15-A8 A7-A0 Block Erase (32KB) 52h A23-A16 A15-A8 A7-A0 Block Erase (64KB) D8h A23-A16 A15-A8 A7-A0 A15-A8 A7-A0 dummy(15) (D7-D0) (15) (D7-D0) (D7-D0) Chip Erase C7h/60h Erase / Program Suspend 75h Erase / Program Resume 7Ah Power-down B9h Set Read Parameters C0h P7-P0 Fast Read 0Bh A23-A16 (16) Burst Read with Wrap 0Ch A23-A16 A15-A8 A7-A0 dummy Fast Read Quad I/O EBh A23-A16 A15-A8 A7-A0 M7-M0(15) (4) Release Powerdown / ID ABh dummy dummy dummy Manufacturer/Device ID(4) 90h dummy dummy 00h JEDEC ID(4) 9Fh (MF7-MF0) Manufacturer (ID15-ID8) Memory Type (ID7-ID0) Capacity Disable QPI FFh Enable Reset 66h Reset 99h - 21 - (2) (ID7-ID0) (MF7-MF0) (ID7-ID0) Publication Release Date: September 18, 2012 Revision D W25Q32DW Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis "( )" indicate data output from the device on either 1, 2 or 4 IO pins. The Status Register contents and Device ID will repeat continuously until /CS terminates the instruction. At least one byte of data input is required for Page Program, Quad Page Program and Program Security Registers, up to 256 bytes of data input. If more than 256 bytes of data are sent to the device, the addressing will wrap to the beginning of the page and overwrite previously sent data. See Manufacturer and Device Identification table for device ID information. Security Register Address: Security Register 0: A23-16 = 00h; A15-8 = 00h; A7-0 = byte address Security Register 1: A23-16 = 00h; A15-8 = 10h; A7-0 = byte address Security Register 2: A23-16 = 00h; A15-8 = 20h; A7-0 = byte address Security Register 3: A23-16 = 00h; A15-8 = 30h; A7-0 = byte address Please note that Security Register 0 is Reserved by Winbond for future use. It is recommended to use Security registers 1- 3 before using register 0. Dual SPI address input format: IO0 = A22, A20, A18, A16, A14, A12, A10, A8 A6, A4, A2, A0, M6, M4, M2, M0 IO1 = A23, A21, A19, A17, A15, A13, A11, A9 A7, A5, A3, A1, M7, M5, M3, M1 Dual SPI data output format: IO0 = (D6, D4, D2, D0) IO1 = (D7, D5, D3, D1) Quad SPI address input format: Set Burst with Wrap input format: IO0 = A20, A16, A12, A8, A4, A0, M4, M0 IO0 = x, x, x, x, x, x, W4, x IO1 = A21, A17, A13, A9, A5, A1, M5, M1 IO1 = x, x, x, x, x, x, W5, x IO2 = A22, A18, A14, A10, A6, A2, M6, M2 IO2 = x, x, x, x, x, x, W6, x IO3 = A23, A19, A15, A11, A7, A3, M7, M3 IO3 = x, x, x, x, x, x, x, x Quad SPI data input/output format: IO0 = (D4, D0, .....) IO1 = (D5, D1, .....) IO2 = (D6, D2, .....) IO3 = (D7, D3, .....) Fast Read Quad I/O data output format: IO0 = (x, x, x, x, D4, D0, D4, D0) IO1 = (x, x, x, x, D5, D1, D5, D1) IO2 = (x, x, x, x, D6, D2, D6, D2) IO3 = (x, x, x, x, D7, D3, D7, D3) Word Read Quad I/O data output format: IO0 = (x, x, D4, D0, D4, D0, D4, D0) IO1 = (x, x, D5, D1, D5, D1, D5, D1) IO2 = (x, x, D6, D2, D6, D2, D6, D2) IO3 = (x, x, D7, D3, D7, D3, D7, D3) For Word Read Quad I/O, the lowest address bit must be 0. (A0 = 0) For Octal Word Read Quad I/O, the lowest four address bits must be 0. (A3, A2, A1, A0 = 0) QPI Command, Address, Data input/output format: CLK # 0 1 2 3 4 5 6 7 8 9 10 11 IO0 = C4, C0, A20, A16, A12, A8, A4, A0, D4, D0, D4, D0 IO1 = C5, C1, A21, A17, A13, A9, A5, A1, D5, D1, D5, D1 IO2 = C6, C2, A22, A18, A14, A10, A6, A2, D6, D2, D6, D2 IO3 = C7, C3, A23, A19, A15, A11, A7, A3, D7, D3, D7, D3 The number of dummy clocks for QPI Fast Read, QPI Fast Read Quad I/O & QPI Burst Read with Wrap is controlled by read parameter P7 - P4. The wrap around length for QPI Burst Read with Wrap is controlled by read parameter P3 - P0. - 22 - W25Q32DW 10.2.6 Write Enable (06h) The Write Enable instruction (Figure 5) sets the Write Enable Latch (WEL) bit in the Status Register to a 1. The WEL bit must be set prior to every Page Program, Quad Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register and Erase/Program Security Registers instruction. The Write Enable instruction is entered by driving /CS low, shifting the instruction code "06h" into the Data Input (DI) pin on the rising edge of CLK, and then driving /CS high. /CS Mode 3 /CS CLK Mode 3 CLK 0 1 2 3 4 5 6 7 Mode 0 0 1 Mode 0 Mode 3 Mode 3 Mode 0 Instruction 06h Mode 0 IO0 Instruction (06h) DI (IO0) IO1 High Impedance DO (IO1) IO2 IO3 Figure 5. Write Enable Instruction for SPI Mode (left) or QPI Mode (right) 10.2.7 Write Enable for Volatile Status Register (50h) The non-volatile Status Register bits described in section 10.1 can also be written to as volatile bits. This gives more flexibility to change the system configuration and memory protection schemes quickly without waiting for the typical non-volatile bit write cycles or affecting the endurance of the Status Register nonvolatile bits. To write the volatile values into the Status Register bits, the Write Enable for Volatile Status Register (50h) instruction must be issued prior to a Write Status Register (01h) instruction. Write Enable for Volatile Status Register instruction (Figure 6) will not set the Write Enable Latch (WEL) bit, it is only valid for the Write Status Register instruction to change the volatile Status Register bit values. /CS Mode 3 /CS CLK Mode 3 CLK 0 1 2 3 4 5 6 7 Mode 0 1 Mode 3 Mode 0 Instruction 50h Mode 0 IO0 Instruction (50h) DI (IO0) DO (IO1) Mode 3 0 Mode 0 IO1 High Impedance IO2 IO3 Figure 6. Write Enable for Volatile Status Register Instruction for SPI Mode (left) or QPI Mode (right) - 23 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.8 Write Disable (04h) The Write Disable instruction (Figure 7) resets the Write Enable Latch (WEL) bit in the Status Register to a 0. The Write Disable instruction is entered by driving /CS low, shifting the instruction code "04h" into the DI pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and upon completion of the Write Status Register, Erase/Program Security Registers, Page Program, Quad Page Program, Sector Erase, Block Erase, Chip Erase and Reset instructions. /CS Mode 3 /CS CLK Mode 3 CLK 0 1 2 3 4 5 6 0 Mode 0 Mode 0 Mode 3 7 Mode 0 Mode 3 1 Instruction 04h Mode 0 IO0 Instruction (04h) DI (IO0) IO1 High Impedance DO (IO1) IO2 IO3 Figure 7. Write Disable Instruction for SPI Mode (left) or QPI Mode (right) 10.2.9 Read Status Register-1 (05h) and Read Status Register-2 (35h) The Read Status Register instructions allow the 8-bit Status Registers to be read. The instruction is entered by driving /CS low and shifting the instruction code "05h" for Status Register-1 or "35h" for Status Register-2 into the DI pin on the rising edge of CLK. The status register bits are then shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first as shown in Figure 8. The Status Register bits are shown in Figure 4a and 4b and include the BUSY, WEL, BP2-BP0, TB, SEC, SRP0, SRP1, QE, LB3-0, CMP and SUS bits (see Status Register section earlier in this datasheet). The Read Status Register instruction may be used at any time, even while a Program, Erase or Write Status Register cycle is in progress. This allows the BUSY status bit to be checked to determine when the cycle is complete and if the device can accept another instruction. The Status Register can be read continuously, as shown in Figure 8. The instruction is completed by driving /CS high. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Mode 0 Instruction (05h or 35h) DI (IO0) DO (IO1) High Impedance * = MSB Status Register 1 or 2 out 7 6 5 4 * 3 2 1 Status Register 1 or 2 out 0 7 * Figure 8a. Read Status Register Instruction (SPI Mode) - 24 - 6 5 4 3 2 1 0 7 W25Q32DW /CS Mode 3 CLK 0 1 2 3 4 5 Mode 0 Instruction 05h or 35h IO0 4 0 4 0 4 IO1 5 1 5 1 5 IO2 6 2 6 2 6 7 3 7 3 7 IO3 SR1 or SR2 SR1 or SR2 out out Figure 8b. Read Status Register Instruction (QPI Mode) 10.2.10 Write Status Register (01h) The Write Status Register instruction allows the Status Register to be written. Only non-volatile Status Register bits SRP0, SEC, TB, BP2, BP1, BP0 (bits 7 thru 2 of Status Register-1) and CMP, LB3, LB2, LB1, LB0, QE, SRP1 (bits 14 thru 8 of Status Register-2) can be written to. All other Status Register bit locations are read-only and will not be affected by the Write Status Register instruction. LB3-0 are nonvolatile OTP bits, once it is set to 1, it can not be cleared to 0. The Status Register bits are shown in Figure 4a and 4b, and described in 10.1. To write non-volatile Status Register bits, a standard Write Enable (06h) instruction must previously have been executed for the device to accept the Write Status Register instruction (Status Register bit WEL must equal 1). Once write enabled, the instruction is entered by driving /CS low, sending the instruction code "01h", and then writing the status register data byte as illustrated in figure 9. To write volatile Status Register bits, a Write Enable for Volatile Status Register (50h) instruction must have been executed prior to the Write Status Register instruction (Status Register bit WEL remains 0). However, SRP1 and LB3, LB2, LB1, LB0 can not be changed from "1" to "0" because of the OTP protection for these bits. Upon power off or the execution of a "Reset (99h)" instruction, the volatile Status Register bit values will be lost, and the non-volatile Status Register bit values will be restored. To complete the Write Status Register instruction, the /CS pin must be driven high after the eighth or sixteenth bit of data that is clocked in. If this is not done the Write Status Register instruction will not be executed. If /CS is driven high after the eighth clock (compatible with the 25X series) the CMP, QE and SRP1 bits will be cleared to 0. During non-volatile Status Register write operation (06h combined with 01h), after /CS is driven high, the self-timed Write Status Register cycle will commence for a time duration of tW (See AC Characteristics). While the Write Status Register cycle is in progress, the Read Status Register instruction may still be accessed to check the status of the BUSY bit. The BUSY bit is a 1 during the Write Status Register cycle - 25 - Publication Release Date: September 18, 2012 Revision D W25Q32DW and a 0 when the cycle is finished and ready to accept other instructions again. After the Write Status Register cycle has finished, the Write Enable Latch (WEL) bit in the Status Register will be cleared to 0. During volatile Status Register write operation (50h combined with 01h), after /CS is driven high, the Status Register bits will be refreshed to the new values within the time period of tSHSL2 (See AC Characteristics). BUSY bit will remain 0 during the Status Register bit refresh period. The Write Status Register instruction can be used in both SPI mode and QPI mode. However, the QE bit cannot be written to when the device is in the QPI mode, because QE=1 is required for the device to enter and operate in the QPI mode. Please refer to 10.1 for detailed Status Register Bit descriptions. Factory default for all status Register bits are 0. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 11 12 13 14 15 16 17 18 19 20 21 22 23 Mode 3 Mode 0 Instruction (01h) Status Register 1 in DI (IO0) DO (IO1) 10 Mode 0 7 6 * 5 4 3 Status Register 2 in 2 1 0 15 14 * High Impedance * = MSB Figure 9a. Write Status Register Instruction (SPI Mode) /CS Mode 3 CLK 0 1 2 3 4 5 Mode 0 Mode 3 Mode 0 Instruction 01h SR1 in SR2 in IO0 4 0 12 8 IO1 5 1 13 9 IO2 6 2 14 10 IO3 7 3 15 11 Figure 9b. Write Status Register Instruction (QPI Mode) - 26 - 13 12 11 10 9 8 W25Q32DW 10.2.11 Read Data (03h) The Read Data instruction allows one or more data bytes to be sequentially read from the memory. The instruction is initiated by driving the /CS pin low and then shifting the instruction code "03h" followed by a 24-bit address (A23-A0) into the DI pin. The code and address bits are latched on the rising edge of the CLK pin. After the address is received, the data byte of the addressed memory location will be shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The address is automatically incremented to the next higher address after each byte of data is shifted out allowing for a continuous stream of data. This means that the entire memory can be accessed with a single instruction as long as the clock continues. The instruction is completed by driving /CS high. The Read Data instruction sequence is shown in figure 10. If a Read Data instruction is issued while an Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects on the current cycle. The Read Data instruction allows clock rates from D.C. to a maximum of fR (see AC Electrical Characteristics). The Read Data (03h) instruction is only supported in Standard SPI mode. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 Mode 0 Instruction (03h) DI (IO0) 24-Bit Address 23 High Impedance DO (IO1) 22 21 3 2 1 0 * Data Out 1 7 6 5 4 3 2 1 0 7 * * = MSB Figure 10. Read Data Instruction (SPI Mode only) - 27 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.12 Fast Read (0Bh) The Fast Read instruction is similar to the Read Data instruction except that it can operate at the highest possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight "dummy" clocks after the 24-bit address as shown in figure 11. The dummy clocks allow the devices internal circuits additional time for setting up the initial address. During the dummy clocks the data value on the DO pin is a "don't care". /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 Mode 0 Instruction (0Bh) 24-Bit Address DI (IO0) 23 High Impedance DO (IO1) 22 21 42 43 3 2 1 0 45 46 47 48 * * = MSB /CS 31 32 33 34 35 36 37 38 39 40 41 44 49 50 51 52 53 54 55 CLK Dummy Clocks DI (IO0) DO (IO1) 0 High Impedance Data Out 1 7 6 5 4 * 3 Data Out 2 2 1 0 7 * Figure 11a. Fast Read Instruction (SPI Mode) - 28 - 6 5 4 3 2 1 0 7 W25Q32DW Fast Read (0Bh) in QPI Mode The Fast Read instruction is also supported in QPI mode. When QPI mode is enabled, the number of dummy clocks is configured by the "Set Read Parameters (C0h)" instruction to accommodate a wide range applications with different needs for either maximum Fast Read frequency or minimum data access latency. Depending on the Read Parameter Bits P[5:4] setting, the number of dummy clocks can be configured as either 2, 4, 6 or 8. The default number of dummy clocks upon power up or after a Reset instruction is 2. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 Mode 0 Instruction 0Bh A23-16 A15-8 A7-0 IOs switch from Input to Output Dummy* IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 * "Set Read Parameters" instruction (C0h) can set the number of dummy clocks. Figure 11b. Fast Read Instruction (QPI Mode) - 29 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.13 Fast Read Dual Output (3Bh) The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction except that data is output on two pins; IO0 and IO1. This allows data to be transferred from the W25Q32DW at twice the rate of standard SPI devices. The Fast Read Dual Output instruction is ideal for quickly downloading code from Flash to RAM upon power-up or for applications that cache code-segments to RAM for execution. Similar to the Fast Read instruction, the Fast Read Dual Output instruction can operate at the highest possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight "dummy" clocks after the 24-bit address as shown in Figure 12. The dummy clocks allow the device's internal circuits additional time for setting up the initial address. The input data during the dummy clocks is "don't care". However, the IO0 pin should be high-impedance prior to the falling edge of the first data out clock. /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 9 10 28 29 30 31 Mode 0 Instruction (3Bh) 24-Bit Address DI (IO0) 23 High Impedance DO (IO1) 22 21 42 43 3 2 1 0 45 46 47 48 * * = MSB /CS 31 32 33 34 35 36 37 38 39 40 41 44 49 50 51 52 53 54 55 CLK IO0 switches from Input to Output Dummy Clocks DI (IO0) DO (IO1) 0 6 High Impedance 7 * 4 2 0 6 5 3 1 7 Data Out 1 * 4 2 0 6 5 3 1 7 Data Out 2 * 4 2 0 6 5 3 1 7 Data Out 3 Figure 12. Fast Read Dual Output Instruction (SPI Mode only) - 30 - * 4 2 0 6 5 3 1 7 Data Out 4 W25Q32DW 10.2.14 Fast Read Quad Output (6Bh) The Fast Read Quad Output (6Bh) instruction is similar to the Fast Read Dual Output (3Bh) instruction except that data is output on four pins, IO0, IO1, IO2, and IO3. A Quad enable of Status Register-2 must be executed before the device will accept the Fast Read Quad Output Instruction (Status Register bit QE must equal 1). The Fast Read Quad Output Instruction allows data to be transferred from the W25Q32DW at four times the rate of standard SPI devices. The Fast Read Quad Output instruction can operate at the highest possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight "dummy" clocks after the 24-bit address as shown in Figure 13. The dummy clocks allow the device's internal circuits additional time for setting up the initial address. The input data during the dummy clocks is "don't care". However, the IO pins should be high-impedance prior to the falling edge of the first data out clock. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 Mode 0 Instruction (6Bh) 24-Bit Address IO0 23 High Impedance IO1 22 21 42 43 3 2 1 45 46 47 0 * High Impedance IO2 High Impedance IO3 * = MSB /CS 31 32 33 34 35 36 37 38 39 40 41 44 CLK IO0 switches from Input to Output Dummy Clocks IO0 IO1 IO2 IO3 0 High Impedance High Impedance High Impedance 4 0 4 0 4 0 4 0 4 5 1 5 1 5 1 5 1 5 6 2 6 2 6 2 6 2 6 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Byte 3 Byte 4 Figure 13. Fast Read Quad Output Instruction (SPI Mode only) - 31 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.15 Fast Read Dual I/O (BBh) The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO pins, IO0 and IO1. It is similar to the Fast Read Dual Output (3Bh) instruction but with the capability to input the Address bits (A23-0) two bits per clock. This reduced instruction overhead may allow for code execution (XIP) directly from the Dual SPI in some applications. Fast Read Dual I/O with "Continuous Read Mode" The Fast Read Dual I/O instruction can further reduce instruction overhead through setting the "Continuous Read Mode" bits (M7-0) after the input Address bits (A23-0), as shown in Figure 14a. The upper nibble of the (M7-4) controls the length of the next Fast Read Dual I/O instruction through the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don't care ("x"). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock. If the "Continuous Read Mode" bits M5-4 = (1,0), then the next Fast Read Dual I/O instruction (after /CS is raised and then lowered) does not require the BBh instruction code, as shown in Figure 14b. This reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered after /CS is asserted low. If the "Continuous Read Mode" bits M5-4 do not equal to (1,0), the next instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. It is recommended to input FFFFh on IO0 for the next instruction (16 clocks), to ensure M4 = 1 and return the device to normal operation. /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Mode 0 Instruction (BBh) A23-16 A15-8 A7-0 M7-0 DI (IO0) 22 20 18 16 14 12 10 8 6 4 2 0 6 4 2 0 DO (IO1) 23 21 19 17 15 13 11 9 7 5 3 1 7 5 3 1 * * * = MSB /CS 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 CLK IOs switch from Input to Output DI (IO0) 0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6 DO (IO1) 1 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7 * Byte 1 * Byte 2 * Byte 3 * Byte 4 Figure 14a. Fast Read Dual I/O Instruction (Initial instruction or previous M5-4 10, SPI Mode only) - 32 - W25Q32DW /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Mode 0 A23-16 A15-8 A7-0 M7-0 DI (IO0) 22 20 18 16 14 12 10 8 6 4 2 0 6 4 2 0 DO (IO1) 23 21 19 17 15 13 11 9 7 5 3 1 7 5 3 1 30 31 * = MSB /CS 15 16 * * 17 18 19 20 21 22 23 24 25 26 27 28 29 CLK IOs switch from Input to Output DI (IO0) 0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6 DO (IO1) 1 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7 * Byte 1 * * Byte 2 Byte 3 * Byte 4 Figure 14b. Fast Read Dual I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode only) - 33 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.16 Fast Read Quad I/O (EBh) The Fast Read Quad I/O (EBh) instruction is similar to the Fast Read Dual I/O (BBh) instruction except that address and data bits are input and output through four pins IO0, IO1, IO2 and IO3 and four Dummy clocks are required in SPI mode prior to the data output. The Quad I/O dramatically reduces instruction overhead allowing faster random access for code execution (XIP) directly from the Quad SPI. The Quad Enable bit (QE) of Status Register-2 must be set to enable the Fast Read Quad I/O Instruction. Fast Read Quad I/O with "Continuous Read Mode" The Fast Read Quad I/O instruction can further reduce instruction overhead through setting the "Continuous Read Mode" bits (M7-0) after the input Address bits (A23-0), as shown in Figure 15a. The upper nibble of the (M7-4) controls the length of the next Fast Read Quad I/O instruction through the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don't care ("x"). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock. If the "Continuous Read Mode" bits M5-4 = (1,0), then the next Fast Read Quad I/O instruction (after /CS is raised and then lowered) does not require the EBh instruction code, as shown in Figure 15b. This reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered after /CS is asserted low. If the "Continuous Read Mode" bits M5-4 do not equal to (1,0), the next instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. It is recommended to input FFh on IO0 for the next instruction (8 clocks), to ensure M4 = 1 and return the device to normal operation. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Mode 0 Instruction (EBh) A23-16 A15-8 A7-0 M7-0 Dummy IOs switch from Input to Output Dummy IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Figure 15a. Fast Read Quad I/O Instruction (Initial instruction or previous M5-410, SPI Mode) - 34 - Byte 3 W25Q32DW /CS Mode 3 CLK 0 1 2 3 4 6 5 7 8 9 10 11 12 13 14 15 Mode 0 A23-16 A15-8 A7-0 M7-0 Dummy IOs switch from Input to Output Dummy IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Byte 3 Figure 15b. Fast Read Quad I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode) Fast Read Quad I/O with "8/16/32/64-Byte Wrap Around" in Standard SPI mode The Fast Read Quad I/O instruction can also be used to access a specific portion within a page by issuing a "Set Burst with Wrap" (77h) command prior to EBh. The "Set Burst with Wrap" (77h) command can either enable or disable the "Wrap Around" feature for the following EBh commands. When "Wrap Around" is enabled, the data being accessed can be limited to either a 8, 16, 32 or 64-byte section of a 256-byte page. The output data starts at the initial address specified in the instruction, once it reaches the ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary automatically until /CS is pulled high to terminate the command. The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read commands. The "Set Burst with Wrap" instruction allows three "Wrap Bits", W6-4 to be set. The W4 bit is used to enable or disable the "Wrap Around" operation while W6-5 are used to specify the length of the wrap around section within a page. See 10.2.19 for detail descriptions. - 35 - Publication Release Date: September 18, 2012 Revision D W25Q32DW Fast Read Quad I/O (EBh) in QPI Mode The Fast Read Quad I/O instruction is also supported in QPI mode, as shown in Figure 15c. When QPI mode is enabled, the number of dummy clocks is configured by the "Set Read Parameters (C0h)" instruction to accommodate a wide range applications with different needs for either maximum Fast Read frequency or minimum data access latency. Depending on the Read Parameter Bits P[5:4] setting, the number of dummy clocks can be configured as either 2, 4, 6 or 8. The default number of dummy clocks upon power up or after a Reset instruction is 2. In QPI mode, the "Continuous Read Mode" bits M7-0 are also considered as dummy clocks. In the default setting, the data output will follow the Continuous Read Mode bits immediately. "Continuous Read Mode" feature is also available in QPI mode for Fast Read Quad I/O instruction. Please refer to the description on previous pages. "Wrap Around" feature is not available in QPI mode for Fast Read Quad I/O instruction. To perform a read operation with fixed data length wrap around in QPI mode, a dedicated "Burst Read with Wrap" (0Ch) instruction must be used. Please refer to 10.2.39 for details. /CS Mode 3 CLK 0 1 2 3 4 6 5 7 8 9 10 11 12 13 14 Mode 0 Instruction EBh A23-16 A15-8 A7-0 IOs switch from Input to Output M7-0* IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Byte 3 * "Set Read Parameters" instruction (C0h) can set the number of dummy clocks. Figure 15c. Fast Read Quad I/O Instruction (Initial instruction or previous M5-410, QPI Mode) - 36 - W25Q32DW 10.2.17 Word Read Quad I/O (E7h) The Word Read Quad I/O (E7h) instruction is similar to the Fast Read Quad I/O (EBh) instruction except that the lowest Address bit (A0) must equal 0 and only two Dummy clock are required prior to the data output. The Quad I/O dramatically reduces instruction overhead allowing faster random access for code execution (XIP) directly from the Quad SPI. The Quad Enable bit (QE) of Status Register-2 must be set to enable the Word Read Quad I/O Instruction. Word Read Quad I/O with "Continuous Read Mode" The Word Read Quad I/O instruction can further reduce instruction overhead through setting the "Continuous Read Mode" bits (M7-0) after the input Address bits (A23-0), as shown in Figure 16a. The upper nibble of the (M7-4) controls the length of the next Fast Read Quad I/O instruction through the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don't care ("x"). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock. If the "Continuous Read Mode" bits M5-4 = (1,0), then the next Fast Read Quad I/O instruction (after /CS is raised and then lowered) does not require the E7h instruction code, as shown in Figure 16b. This reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered after /CS is asserted low. If the "Continuous Read Mode" bits M5-4 do not equal to (1,0), the next instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. It is recommended to input FFh on IO0 for the next instruction (8 clocks), to ensure M4 = 1 and return the device to normal operation. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Mode 0 Instruction (E7h) A23-16 A15-8 A7-0 M7-0 IOs switch from Input to Output Dummy IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Byte 3 Figure 16a. Word Read Quad I/O Instruction (Initial instruction or previous M5-4 10, SPI Mode only) - 37 - Publication Release Date: September 18, 2012 Revision D W25Q32DW /CS Mode 3 CLK 0 1 2 3 4 6 5 7 8 9 10 11 12 13 Mode 0 A23-16 A15-8 A7-0 M7-0 IOs switch from Input to Output Dummy IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Byte 3 Figure 16b. Word Read Quad I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode only) Word Read Quad I/O with "8/16/32/64-Byte Wrap Around" in Standard SPI mode The Word Read Quad I/O instruction can also be used to access a specific portion within a page by issuing a "Set Burst with Wrap" (77h) command prior to E7h. The "Set Burst with Wrap" (77h) command can either enable or disable the "Wrap Around" feature for the following E7h commands. When "Wrap Around" is enabled, the data being accessed can be limited to either a 8, 16, 32 or 64-byte section of a 256-byte page. The output data starts at the initial address specified in the instruction, once it reaches the ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary automatically until /CS is pulled high to terminate the command. The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read commands. The "Set Burst with Wrap" instruction allows three "Wrap Bits", W6-4 to be set. The W4 bit is used to enable or disable the "Wrap Around" operation while W6-5 are used to specify the length of the wrap around section within a page. See 10.2.19 for detail descriptions. - 38 - W25Q32DW 10.2.18 Octal Word Read Quad I/O (E3h) The Octal Word Read Quad I/O (E3h) instruction is similar to the Fast Read Quad I/O (EBh) instruction except that the lower four Address bits (A0, A1, A2, A3) must equal 0. As a result, the dummy clocks are not required, which further reduces the instruction overhead allowing even faster random access for code execution (XIP). The Quad Enable bit (QE) of Status Register-2 must be set to enable the Octal Word Read Quad I/O Instruction. Octal Word Read Quad I/O with "Continuous Read Mode" The Octal Word Read Quad I/O instruction can further reduce instruction overhead through setting the "Continuous Read Mode" bits (M7-0) after the input Address bits (A23-0), as shown in Figure 17a. The upper nibble of the (M7-4) controls the length of the next Octal Word Read Quad I/O instruction through the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don't care ("x"). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock. If the "Continuous Read Mode" bits M5-4 = (1,0), then the next Fast Read Quad I/O instruction (after /CS is raised and then lowered) does not require the E3h instruction code, as shown in Figure 17b. This reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered after /CS is asserted low. If the "Continuous Read Mode" bits M5-4 do not equal to (1,0), the next instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. It is recommended to input FFh on IO0 for the next instruction (8 clocks), to ensure M4 = 1 and return the device to normal operation. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Mode 0 Instruction (E3h) A23-16 A15-8 A7-0 IOs switch from Input to Output M7-0 IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Byte 3 Byte 4 Figure 17a. Octal Word Read Quad I/O Instruction (Initial instruction or previous M5-4 10, SPI Mode only) - 39 - Publication Release Date: September 18, 2012 Revision D W25Q32DW /CS Mode 3 CLK 0 1 2 3 4 6 5 7 9 8 10 11 12 13 Mode 0 A23-16 A15-8 A7-0 IOs switch from Input to Output M7-0 IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Byte 3 Byte 4 Figure 17b. Octal Word Read Quad I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode only) - 40 - W25Q32DW 10.2.19 Set Burst with Wrap (77h) In Standard SPI mode, the Set Burst with Wrap (77h) instruction is used in conjunction with "Fast Read Quad I/O" and "Word Read Quad I/O" instructions to access a fixed length of 8/16/32/64-byte section within a 256-byte page. Certain applications can benefit from this feature and improve the overall system code execution performance. Similar to a Quad I/O instruction, the Set Burst with Wrap instruction is initiated by driving the /CS pin low and then shifting the instruction code "77h" followed by 24 dummy bits and 8 "Wrap Bits", W7-0. The instruction sequence is shown in Figure 18. Wrap bit W7 and the lower nibble W3-0 are not used. W4 = 0 W6, W5 0 0 1 1 W4 =1 (DEFAULT) Wrap Around Wrap Length Wrap Around Wrap Length Yes Yes Yes Yes 8-byte 16-byte 32-byte 64-byte No No No No N/A N/A N/A N/A 0 1 0 1 Once W6-4 is set by a Set Burst with Wrap instruction, all the following "Fast Read Quad I/O" and "Word Read Quad I/O" instructions will use the W6-4 setting to access the 8/16/32/64-byte section within any page. To exit the "Wrap Around" function and return to normal read operation, another Set Burst with Wrap instruction should be issued to set W4 = 1. The default value of W4 upon power on is 1. In the case of a system Reset while W4 = 0, it is recommended that the controller issues a Set Burst with Wrap instruction to reset W4 = 1 prior to any normal Read instructions since W25Q32DW does not have a hardware Reset Pin. In QPI mode, the "Burst Read with Wrap (0Ch)" instruction should be used to perform the Read operation with "Wrap Around" feature. The Wrap Length set by W5-4 in Standard SPI mode is still valid in QPI mode and can also be re-configured by "Set Read Parameters (C0h)" instruction. Refer to 10.2.38 and 10.2.39 for details. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 11 10 12 13 14 15 Mode 0 Mode 3 Mode 0 don't care Instruction (77h) don't care don't care Wrap Bit IO0 X X X X X X w4 X IO1 X X X X X X w5 X IO2 X X X X X X w6 X IO3 X X X X X X X X Figure 18. Set Burst with Wrap Instruction (SPI Mode only) - 41 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.20 Page Program (02h) The Page Program instruction allows from one byte to 256 bytes (a page) of data to be programmed at previously erased (FFh) memory locations. A Write Enable instruction must be executed before the device will accept the Page Program Instruction (Status Register bit WEL= 1). The instruction is initiated by driving the /CS pin low then shifting the instruction code "02h" followed by a 24-bit address (A23-A0) and at least one data byte, into the DI pin. The /CS pin must be held low for the entire length of the instruction while data is being sent to the device. The Page Program instruction sequence is shown in Figure 19. If an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address bits) should be set to 0. If the last address byte is not zero, and the number of clocks exceed the remaining page length, the addressing will wrap to the beginning of the page. In some cases, less than 256 bytes (a partial page) can be programmed without having any effect on other bytes within the same page. One condition to perform a partial page program is that the number of clocks can not exceed the remaining page length. If more than 256 bytes are sent to the device the addressing will wrap to the beginning of the page and overwrite previously sent data. As with the write and erase instructions, the /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done the Page Program instruction will not be executed. After /CS is driven high, the self-timed Page Program instruction will commence for a time duration of tpp (See AC Characteristics). While the Page Program cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Page Program cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. After the Page Program cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Page Program instruction will not be executed if the addressed page is protected by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits. /CS Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 Mode 0 2 1 * = MSB 0 6 5 4 3 2 1 0 2079 3 2078 21 2077 22 * 2076 23 Data Byte 1 2075 24-Bit Address 2074 Instruction (02h) DI (IO0) 2073 CLK 7 * 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 2072 /CS CLK Mode 0 Data Byte 2 DI (IO0) Mode 3 0 7 * 6 5 4 3 Data Byte 3 2 1 0 7 6 5 4 3 * Data Byte 256 2 1 0 7 * Figure 19a. Page Program Instruction (SPI Mode) - 42 - 6 5 4 3 2 1 0 W25Q32DW 2 3 4 5 6 7 8 9 10 11 12 13 519 1 518 0 517 Mode 3 CLK 516 /CS Mode 0 Mode 3 Mode 0 Instruction 02h A23-16 A15-8 A7-0 Byte1 Byte 2 Byte 3 Byte 255 Byte 256 IO0 20 16 12 8 4 0 4 0 4 0 4 0 4 0 4 0 IO1 21 17 13 9 5 1 5 1 5 1 5 1 5 1 5 1 IO2 22 18 14 10 6 2 6 2 6 2 6 2 6 2 6 2 IO3 23 19 15 11 7 3 7 3 7 3 7 3 7 3 7 3 Figure 19b. Page Program Instruction (QPI Mode) - 43 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.21 Quad Input Page Program (32h) The Quad Page Program instruction allows up to 256 bytes of data to be programmed at previously erased (FFh) memory locations using four pins: IO0, IO1, IO2, and IO3. The Quad Page Program can improve performance for PROM Programmer and applications that have slow clock speeds <5MHz. Systems with faster clock speed will not realize much benefit for the Quad Page Program instruction since the inherent page program time is much greater than the time it take to clock-in the data. To use Quad Page Program the Quad Enable in Status Register-2 must be set (QE=1). A Write Enable instruction must be executed before the device will accept the Quad Page Program instruction (Status Register-1, WEL=1). The instruction is initiated by driving the /CS pin low then shifting the instruction code "32h" followed by a 24-bit address (A23-A0) and at least one data byte, into the IO pins. The /CS pin must be held low for the entire length of the instruction while data is being sent to the device. All other functions of Quad Page Program are identical to standard Page Program. The Quad Page Program instruction sequence is shown in Figure 20. /CS 0 Mode 3 1 2 3 4 5 6 7 8 9 10 28 29 30 31 Mode 0 22 21 3 2 1 543 23 542 IO0 539 24-Bit Address 538 Instruction (32h) 541 CLK 0 * IO1 IO2 IO3 * = MSB 33 34 35 36 37 540 32 537 31 536 /CS CLK Mode 0 Byte 253 Byte 254 Byte 255 Byte 256 Byte 1 Byte 2 Byte 3 4 0 4 0 4 0 4 0 4 0 4 0 4 0 IO1 5 1 5 1 5 1 5 1 5 1 5 1 5 1 IO2 6 2 6 2 6 2 6 2 6 2 6 2 6 2 IO3 7 3 7 3 7 3 7 3 7 3 7 3 7 3 IO0 Mode 3 0 * * * * * * * Figure 20. Quad Input Page Program Instruction (SPI Mode only) 10.2.22 Sector Erase (20h) The Sector Erase instruction sets all memory within a specified sector (4K-bytes) to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Sector Erase - 44 - W25Q32DW Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code "20h" followed a 24-bit sector address (A23-A0) (see Figure 2). The Sector Erase instruction sequence is shown in Figure 21a & 21b. The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done the Sector Erase instruction will not be executed. After /CS is driven high, the self-timed Sector Erase instruction will commence for a time duration of tSE (See AC Characteristics). While the Sector Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Sector Erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. After the Sector Erase cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Sector Erase instruction will not be executed if the addressed page is protected by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection table). /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 29 30 31 Mode 3 Mode 0 Instruction (20h) 24-Bit Address DI (IO0) DO (IO1) 9 Mode 0 23 High Impedance 22 2 1 0 * * = MSB Figure 21a. Sector Erase Instruction (SPI Mode) /CS Mode 3 CLK 0 1 2 3 4 5 6 7 Mode 0 Mode 3 Mode 0 Instruction 20h A23-16 A15-8 A7-0 IO0 20 16 12 8 4 0 IO1 21 17 13 9 5 1 IO2 22 18 14 10 6 2 IO3 23 19 15 11 7 3 Figure 21b. Sector Erase Instruction (QPI Mode) - 45 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.23 32KB Block Erase (52h) The Block Erase instruction sets all memory within a specified block (32K-bytes) to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code "52h" followed a 24-bit block address (A23-A0). The Block Erase instruction sequence is shown in Figure 22a & 22b. The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done the Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block Erase instruction will commence for a time duration of tBE1 (See AC Characteristics). While the Block Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. After the Block Erase cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase instruction will not be executed if the addressed page is protected by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection table). /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 29 30 31 Mode 3 Mode 0 Instruction (52h) 24-Bit Address DI (IO0) DO (IO1) 9 Mode 0 23 High Impedance 22 2 1 * * = MSB Figure 22a. 32KB Block Erase Instruction (SPI Mode) /CS Mode 3 CLK 0 1 2 3 4 5 7 6 Mode 0 Mode 3 Mode 0 Instruction 52h A23-16 A15-8 A7-0 IO0 20 16 12 8 4 0 IO1 21 17 13 9 5 1 IO2 22 18 14 10 6 2 IO3 23 19 15 11 7 3 Figure 22b. 32KB Block Erase Instruction (QPI Mode) - 46 - 0 W25Q32DW 10.2.24 64KB Block Erase (D8h) The Block Erase instruction sets all memory within a specified block (64K-bytes) to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code "D8h" followed a 24-bit block address (A23-A0). The Block Erase instruction sequence is shown in Figure 23a & 23b. The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done the Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block Erase instruction will commence for a time duration of tBE (See AC Characteristics). While the Block Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. After the Block Erase cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase instruction will not be executed if the addressed page is protected by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection table). /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 29 30 31 Mode 3 Mode 0 Instruction (D8h) 24-Bit Address DI (IO0) DO (IO1) 9 Mode 0 23 High Impedance 22 2 1 0 * * = MSB Figure 23a. 64KB Block Erase Instruction (SPI Mode) /CS Mode 3 CLK 0 1 2 3 4 5 7 6 Mode 0 Mode 3 Mode 0 Instruction D8h A23-16 A15-8 A7-0 IO0 20 16 12 8 4 0 IO1 21 17 13 9 5 1 IO2 22 18 14 10 6 2 IO3 23 19 15 11 7 3 Figure 23b. 64KB Block Erase Instruction (QPI Mode) - 47 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.25 Chip Erase (C7h / 60h) The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Chip Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code "C7h" or "60h". The Chip Erase instruction sequence is shown in Figure 24. The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip Erase instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction will commence for a time duration of tCE (See AC Characteristics). While the Chip Erase cycle is in progress, the Read Status Register instruction may still be accessed to check the status of the BUSY bit. The BUSY bit is a 1 during the Chip Erase cycle and becomes a 0 when finished and the device is ready to accept other instructions again. After the Chip Erase cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed if any page is protected by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection table). /CS Mode 3 /CS CLK Mode 3 CLK 0 1 2 3 4 5 Mode 0 6 7 Instruction (C7h/60h) DI (IO0) DO (IO1) IO0 IO1 High Impedance IO2 IO3 Figure 24. Chip Erase Instruction for SPI Mode (left) or QPI Mode (right) - 48 - 1 Mode 3 Mode 0 Instruction C7h/60h Mode 3 Mode 0 0 Mode 0 W25Q32DW 10.2.26 Erase / Program Suspend (75h) The Erase/Program Suspend instruction "75h", allows the system to interrupt a Sector or Block Erase operation or a Page Program operation and then read from or program/erase data to, any other sectors or blocks. The Erase/Program Suspend instruction sequence is shown in Figure 25a & 25b. The Write Status Register instruction (01h) and Erase instructions (20h, 52h, D8h, C7h, 60h, 44h) are not allowed during Erase Suspend. Erase Suspend is valid only during the Sector or Block erase operation. If written during the Chip Erase operation, the Erase Suspend instruction is ignored. The Write Status Register instruction (01h) and Program instructions (02h, 32h, 42h) are not allowed during Program Suspend. Program Suspend is valid only during the Page Program or Quad Page Program operation. The Erase/Program Suspend instruction "75h" will be accepted by the device only if the SUS bit in the Status Register equals to 0 and the BUSY bit equals to 1 while a Sector or Block Erase or a Page Program operation is on-going. If the SUS bit equals to 1 or the BUSY bit equals to 0, the Suspend instruction will be ignored by the device. A maximum of time of "tSUS" (See AC Characteristics) is required to suspend the erase or program operation. The BUSY bit in the Status Register will be cleared from 1 to 0 within "tSUS" and the SUS bit in the Status Register will be set from 0 to 1 immediately after Erase/Program Suspend. For a previously resumed Erase/Program operation, it is also required that the Suspend instruction "75h" is not issued earlier than a minimum of time of "tSUS" following the preceding Resume instruction "7Ah". Unexpected power off during the Erase/Program suspend state will reset the device and release the suspend state. SUS bit in the Status Register will also reset to 0. The data within the page, sector or block that was being suspended may become corrupted. It is recommended for the user to implement system design techniques against the accidental power interruption and preserve data integrity during erase/program suspend state. /CS tSUS Mode 3 CLK 0 1 2 3 4 5 6 7 Mode 3 Mode 0 Mode 0 Instruction (75h) DI (IO0) DO (IO1) High Impedance Accept instructions Figure 25a. Erase/Program Suspend Instruction (SPI Mode) - 49 - Publication Release Date: September 18, 2012 Revision D W25Q32DW /CS tSUS Mode 3 CLK 0 1 Mode 3 Mode 0 Mode 0 Instruction 75h IO0 IO1 IO2 IO3 Accept instructions Figure 25b. Erase/Program Suspend Instruction (QPI Mode) - 50 - W25Q32DW 10.2.27 Erase / Program Resume (7Ah) The Erase/Program Resume instruction "7Ah" must be written to resume the Sector or Block Erase operation or the Page Program operation after an Erase/Program Suspend. The Resume instruction "7Ah" will be accepted by the device only if the SUS bit in the Status Register equals to 1 and the BUSY bit equals to 0. After issued the SUS bit will be cleared from 1 to 0 immediately, the BUSY bit will be set from 0 to 1 within 200ns and the Sector or Block will complete the erase operation or the page will complete the program operation. If the SUS bit equals to 0 or the BUSY bit equals to 1, the Resume instruction "7Ah" will be ignored by the device. The Erase/Program Resume instruction sequence is shown in Figure 26a & 26b. Resume instruction is ignored if the previous Erase/Program Suspend operation was interrupted by unexpected power off. It is also required that a subsequent Erase/Program Suspend instruction not to be issued within a minimum of time of "tSUS" following a previous Resume instruction. /CS Mode 3 CLK 0 1 2 3 4 5 6 Mode 3 7 Mode 0 Mode 0 Instruction (7Ah) DI (IO0) Resume previously suspended Program or Erase Figure 26a. Erase/Program Resume Instruction (SPI Mode) /CS Mode 3 CLK 0 1 Mode 3 Mode 0 Mode 0 Instruction 7Ah IO0 IO1 IO2 IO3 Resume previously suspended Program or Erase Figure 26b. Erase/Program Resume Instruction (QPI Mode) - 51 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.28 Power-down (B9h) Although the standby current during normal operation is relatively low, standby current can be further reduced with the Power-down instruction. The lower power consumption makes the Power-down instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC Characteristics). The instruction is initiated by driving the /CS pin low and shifting the instruction code "B9h" as shown in Figure 27a & 27b. The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-down instruction will not be executed. After /CS is driven high, the power-down state will entered within the time duration of tDP (See AC Characteristics). While in the power-down state only the Release from Powerdown / Device ID instruction, which restores the device to normal operation, will be recognized. All other instructions are ignored. This includes the Read Status Register instruction, which is always available during normal operation. Ignoring all but one instruction makes the Power Down state a useful condition for securing maximum write protection. The device always powers-up in the normal operation with the standby current of ICC1. /CS tDP 0 Mode 3 CLK 1 2 3 4 5 6 7 Mode 3 Mode 0 Mode 0 Instruction (B9h) DI (IO0) Stand-by current Power-down current Figure 27a. Deep Power-down Instruction (SPI Mode) /CS tDP Mode 3 CLK 0 Mode 3 1 Mode 0 Mode 0 Instruction B9h IO0 IO1 IO2 IO3 Stand-by current Power-down current Figure 27b. Deep Power-down Instruction (QPI Mode) - 52 - W25Q32DW 10.2.29 Release Power-down / Device ID (ABh) The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to release the device from the power-down state, or obtain the devices electronic identification (ID) number. To release the device from the power-down state, the instruction is issued by driving the /CS pin low, shifting the instruction code "ABh" and driving /CS high as shown in Figure 28a & 28b. Release from power-down will take the time duration of tRES1 (See AC Characteristics) before the device will resume normal operation and other instructions are accepted. The /CS pin must remain high during the tRES1 time duration. When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by driving the /CS pin low and shifting the instruction code "ABh" followed by 3-dummy bytes. The Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 28. The Device ID values for the W25Q32DW is listed in Manufacturer and Device Identification table. The Device ID can be read continuously. The instruction is completed by driving /CS high. When used to release the device from the power-down state and obtain the Device ID, the instruction is the same as previously described, and shown in Figure 28c & 28d, except that after /CS is driven high it must remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will resume normal operation and other instructions will be accepted. If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on the current cycle. /CS tRES1 Mode 3 CLK 0 1 2 3 4 5 6 7 Mode 3 Mode 0 Mode 0 Instruction (ABh) DI (IO0) Power-down current Stand-by current Figure 28a. Release Power-down Instruction (SPI Mode) - 53 - Publication Release Date: September 18, 2012 Revision D W25Q32DW /CS tRES1 Mode 3 CLK 0 Mode 3 1 Mode 0 Mode 0 Instruction ABh IO0 IO1 IO2 IO3 Power-down current Stand-by current Figure 28b. Release Power-down Instruction (QPI Mode) /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 9 29 30 31 32 33 34 35 36 37 38 Mode 3 Mode 0 Mode 0 Instruction (ABh) DI (IO0) 23 High Impedance DO (IO1) tRES2 3 Dummy Bytes 22 2 1 0 * Device ID 7 6 5 4 3 2 1 0 * * = MSB Power-down current Stand-by current Figure 28c. Release Power-down / Device ID Instruction (SPI Mode) /CS tRES2 Mode 3 CLK 0 1 2 3 4 5 6 7 8 Mode 3 Mode 0 Mode 0 Instruction ABh IOs switch from Input to Output 3 Dummy Bytes IO0 X X X X X X 4 0 IO1 X X X X X X 5 1 IO2 X X X X X X 6 2 IO3 X X X X X X 7 3 Device ID Power-down current Stand-by current Figure 28d. Release Power-down / Device ID Instruction (QPI Mode) - 54 - W25Q32DW 10.2.30 Read Manufacturer / Device ID (90h) The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID. The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code "90h" followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in Figure 29. The Device ID values for the W25Q32DW is listed in Manufacturer and Device Identification table. The instruction is completed by driving /CS high. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 Mode 0 Instruction (90h) Address (000000h) DI (IO0) 23 High Impedance DO (IO1) 22 21 42 43 3 2 45 46 1 0 * * = MSB /CS 31 32 33 34 35 36 37 38 39 40 41 44 Mode 3 CLK DI (IO0) DO (IO1) Mode 0 0 7 Manufacturer ID (EFh) * 6 5 4 3 2 1 0 Device ID Figure 29. Read Manufacturer / Device ID Instruction (SPI Mode) - 55 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.31 Read Manufacturer / Device ID Dual I/O (92h) The Read Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer / Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID at 2x speed. The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code "92h" followed by a 24-bit address (A23-A0) of 000000h, but with the capability to input the Address bits two bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2 bits per clock on the falling edge of CLK with most significant bits (MSB) first as shown in Figure 30. The Device ID values for the W25Q32DW is listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to the other. The instruction is completed by driving /CS high. /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Mode 0 Instruction (92h) A23-16 DI (IO0) High Impedance DO (IO1) * = MSB A15-8 A7-0 (00h) M7-0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 * * * * /CS 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Mode 3 CLK Mode 0 IOs switch from Input to Output DI (IO0) 0 6 4 2 0 6 4 2 0 6 DO (IO1) 1 7 5 3 1 7 5 3 1 * MFR ID * Device ID 4 2 0 6 7 5 3 1 7 * MFR ID (repeat) * 4 2 0 5 3 1 Device ID (repeat) Figure 30. Read Manufacturer / Device ID Dual I/O Instruction (SPI Mode only) Note: The "Continuous Read Mode" bits M(7-0) must be set to Fxh to be compatible with Fast Read Dual I/O instruction. - 56 - W25Q32DW 10.2.32 Read Manufacturer / Device ID Quad I/O (94h) The Read Manufacturer / Device ID Quad I/O instruction is an alternative to the Read Manufacturer / Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID at 4x speed. The Read Manufacturer / Device ID Quad I/O instruction is similar to the Fast Read Quad I/O instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code "94h" followed by a four clock dummy cycles and then a 24-bit address (A23-A0) of 000000h, but with the capability to input the Address bits four bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out four bits per clock on the falling edge of CLK with most significant bit (MSB) first as shown in Figure 31. The Device ID values for the W25Q32DW is listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to the other. The instruction is completed by driving /CS high. /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Mode 0 Instruction (94h) IO0 High Impedance IO1 High Impedance IO2 High Impedance IO3 A7-0 (00h) M7-0 Dummy IOs switch from Input to Output A23-16 A15-8 Dummy 4 0 4 0 4 0 4 0 4 0 4 0 5 1 5 1 5 1 5 1 5 1 5 1 6 2 6 2 6 2 6 2 6 2 6 2 7 3 7 3 7 3 7 3 7 3 7 3 MFR ID Device ID /CS 23 24 25 26 27 28 29 30 Mode 3 CLK Mode 0 IO0 0 4 0 4 0 4 0 4 0 IO1 1 5 1 5 1 5 1 5 1 IO2 2 6 2 6 2 6 2 6 2 IO3 3 7 3 7 3 7 3 7 3 MFR ID (repeat) Device ID (repeat) MFR ID (repeat) Device ID (repeat) Figure 31. Read Manufacturer / Device ID Quad I/O Instruction (SPI Mode only) Note: The "Continuous Read Mode" bits M(7-0) must be set to Fxh to be compatible with Fast Read Quad I/O instruction. - 57 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.33 Read Unique ID Number (4Bh) The Read Unique ID Number instruction accesses a factory-set read-only 64-bit number that is unique to each W25Q32DW device. The ID number can be used in conjunction with user software methods to help prevent copying or cloning of a system. The Read Unique ID instruction is initiated by driving the /CS pin low and shifting the instruction code "4Bh" followed by a four bytes of dummy clocks. After which, the 64bit ID is shifted out on the falling edge of CLK as shown in Figure 32. /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Mode 0 Instruction (4Bh) Dummy Byte 1 Dummy Byte 2 DI (IO0) High Impedance DO (IO1) 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 102 24 101 23 100 /CS Mode 3 CLK Mode 0 Dummy Byte 3 Dummy Byte 4 DI (IO0) DO (IO1) High Impedance * = MSB 63 62 61 * 64-bit Unique Serial Number Figure 32. Read Unique ID Number Instruction (SPI Mode only) - 58 - 2 1 0 W25Q32DW 10.2.34 Read JEDEC ID (9Fh) For compatibility reasons, the W25Q32DW provides several instructions to electronically determine the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low and shifting the instruction code "9Fh". The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in Figure 33a & 33b. For memory type and capacity values refer to Manufacturer and Device Identification table. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Mode 0 Instruction (9Fh) DI (IO0) Manufacturer ID (EFh) High Impedance DO (IO1) * = MSB /CS 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Mode 3 CLK Mode 0 DI (IO0) DO (IO1) Memory Type ID15-8 7 6 5 4 3 2 Capacity ID7-0 1 0 7 * 6 5 4 3 2 1 0 * Figure 33a. Read JEDEC ID Instruction (SPI Mode) /CS Mode 3 CLK 0 1 2 3 4 5 Mode 3 6 Mode 0 Mode 0 Instruction 9Fh IOs switch from Input to Output IO0 12 8 4 0 IO1 13 9 5 1 IO2 14 10 6 2 IO3 15 11 7 3 EFh ID15-8 ID7-0 Figure 33b. Read JEDEC ID Instruction (QPI Mode) - 59 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.35 Erase Security Registers (44h) The W25Q32DW offers four 256-byte Security Registers which can be erased and programmed individually. These registers may be used by the system manufacturers to store security and other important information separately from the main memory array. The Erase Security Register instruction is similar to the Sector Erase instruction. A Write Enable instruction must be executed before the device will accept the Erase Security Register Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code "44h" followed by a 24-bit address (A23-A0) to erase one of the four security registers. ADDRESS A23-16 A15-12 A11-8 A7-0 Security Register #0* 00h 0000 0000 Don't Care Security Register #1 00h 0001 0000 Don't Care Security Register #2 00h 0010 0000 Don't Care Security Register #3 00h 0011 0000 Don't Care * Please note that Security Register 0 is Reserved by Winbond for future use. It is recommended to use Security registers 1- 3 before using register 0. The Erase Security Register instruction sequence is shown in Figure 34. The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done the instruction will not be executed. After /CS is driven high, the self-timed Erase Security Register operation will commence for a time duration of tSE (See AC Characteristics). While the Erase Security Register cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. After the Erase Security Register cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Security Register Lock Bits (LB3-0) in the Status Register-2 can be used to OTP protect the security registers. Once a lock bit is set to 1, the corresponding security register will be permanently locked, Erase Security Register instruction to that register will be ignored (See 11.1.9 for detail descriptions). /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 29 30 31 Mode 3 Mode 0 Instruction (44h) 24-Bit Address DI (IO0) DO (IO1) 9 Mode 0 23 High Impedance 22 2 1 * * = MSB Figure 34. Erase Security Registers Instruction (SPI Mode only) - 60 - 0 W25Q32DW 10.2.36 Program Security Registers (42h) The Program Security Register instruction is similar to the Page Program instruction. It allows from one byte to 256 bytes of security register data to be programmed at previously erased (FFh) memory locations. A Write Enable instruction must be executed before the device will accept the Program Security Register Instruction (Status Register bit WEL= 1). The instruction is initiated by driving the /CS pin low then shifting the instruction code "42h" followed by a 24-bit address (A23-A0) and at least one data byte, into the DI pin. The /CS pin must be held low for the entire length of the instruction while data is being sent to the device. ADDRESS A23-16 A15-12 A11-8 A7-0 Security Register #0* 00h 0000 0000 Byte Address Security Register #1 00h 0001 0000 Byte Address Security Register #2 00h 0010 0000 Byte Address Security Register #3 00h 0011 0000 Byte Address * Please note that Security Register 0 is Reserved by Winbond for future use. It is recommended to use Security registers 1- 3 before using register 0. The Program Security Register instruction sequence is shown in Figure 35. The Security Register Lock Bits (LB3-0) in the Status Register-2 can be used to OTP protect the security registers. Once a lock bit is set to 1, the corresponding security register will be permanently locked, Program Security Register instruction to that register will be ignored (See 11.1.9, 11.2.21 for detail descriptions). /CS 0 Mode 3 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 Mode 0 1 * * = MSB 0 6 5 4 3 2 1 0 2079 Data Byte 1 2 2078 3 2077 21 2076 22 2075 24-Bit Address 23 2074 Instruction (42h) DI (IO0) 2073 CLK 7 * 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 2072 /CS CLK Mode 0 Data Byte 2 DI (IO0) Mode 3 0 7 * 6 5 4 3 Data Byte 3 2 1 0 7 6 5 4 3 * Data Byte 256 2 1 0 7 6 5 4 3 2 1 0 * Figure 35. Program Security Registers Instruction (SPI Mode only) - 61 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.37 Read Security Registers (48h) The Read Security Register instruction is similar to the Fast Read instruction and allows one or more data bytes to be sequentially read from one of the four security registers. The instruction is initiated by driving the /CS pin low and then shifting the instruction code "48h" followed by a 24-bit address (A23-A0) and eight "dummy" clocks into the DI pin. The code and address bits are latched on the rising edge of the CLK pin. After the address is received, the data byte of the addressed memory location will be shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The byte address is automatically incremented to the next byte address after each byte of data is shifted out. Once the byte address reaches the last byte of the register (byte FFh), it will reset to 00h, the first byte of the register, and continue to increment. The instruction is completed by driving /CS high. The Read Security Register instruction sequence is shown in Figure 36. If a Read Security Register instruction is issued while an Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects on the current cycle. The Read Security Register instruction allows clock rates from D.C. to a maximum of FR (see AC Electrical Characteristics). ADDRESS A23-16 A15-12 A11-8 A7-0 Security Register #0* 00h 0000 0000 Byte Address Security Register #1 00h 0001 0000 Byte Address Security Register #2 00h 0010 0000 Byte Address Security Register #3 00h 0011 0000 Byte Address * Please note that Security Register 0 is Reserved by Winbond for future use. It is recommended to use Security registers 1- 3 before using register 0. /CS 0 Mode 3 CLK 1 2 3 4 5 6 7 8 9 10 28 29 30 31 Mode 0 Instruction (48h) 24-Bit Address DI (IO0) 23 High Impedance DO (IO1) 22 21 42 43 3 2 1 0 45 46 47 48 * * = MSB /CS 31 32 33 34 35 36 37 38 39 40 41 44 49 50 51 52 53 54 55 CLK Dummy Byte DI (IO0) 0 7 6 5 4 3 2 1 0 Data Out 1 DO (IO1) High Impedance 7 6 5 4 * 3 Data Out 2 2 1 0 7 6 * Figure 36. Read Security Registers Instruction (SPI Mode only) - 62 - 5 4 3 2 1 0 7 W25Q32DW 10.2.38 Set Read Parameters (C0h) In QPI mode, to accommodate a wide range of applications with different needs for either maximum read frequency or minimum data access latency, "Set Read Parameters (C0h)" instruction can be used to configure the number of dummy clocks for "Fast Read (0Bh)", "Fast Read Quad I/O (EBh)" & "Burst Read with Wrap (0Ch)" instructions, and to configure the number of bytes of "Wrap Length" for the "Burst Read with Wrap (0Ch)" instruction. In Standard SPI mode, the "Set Read Parameters (C0h)" instruction is not accepted. The dummy clocks for various Fast Read instructions in Standard/Dual/Quad SPI mode are fixed, please refer to the Instruction Table 10.2.2-10.2.4 for details. The "Wrap Length" is set by W5-4 bit in the "Set Burst with Wrap (77h)" instruction. This setting will remain unchanged when the device is switched from Standard SPI mode to QPI mode. The default "Wrap Length" after a power up or a Reset instruction is 8 bytes, the default number of dummy clocks is 2. The number of dummy clocks is only programmable for "Fast Read (0Bh)", "Fast Read Quad I/O (EBh)" & "Burst Read with Wrap (0Ch)" instructions in the QPI mode. Whenever the device is switched from SPI mode to QPI mode, the number of dummy clocks should be set again, prior to any 0Bh, EBh or 0Ch instructions. P5 - P4 0 0 1 1 0 1 0 1 DUMMY CLOCKS MAXIMUM READ FREQ. 2 4 6 8 30MHz 50MHz 80MHz 104MHz MAXIMUM READ FREQ. (A[1:0]=0,0) 30MHz 80MHz 104MHz 104MHz P1 - P0 0 0 1 1 0 1 0 1 WRAP LENGTH 8-byte 16-byte 32-byte 64-byte /CS Mode 3 CLK 0 1 2 Mode 3 3 Mode 0 Mode 0 Instruction Read Parameters C0h IO0 P4 P0 IO1 P5 P1 IO2 P6 P2 IO3 P7 P3 Figure 37. Set Read Parameters Instruction (QPI Mode only) - 63 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.39 Burst Read with Wrap (0Ch) The "Burst Read with Wrap (0Ch)" instruction provides an alternative way to perform the read operation with "Wrap Around" in QPI mode. The instruction is similar to the "Fast Read (0Bh)" instruction in QPI mode, except the addressing of the read operation will "Wrap Around" to the beginning boundary of the "Wrap Length" once the ending boundary is reached. The "Wrap Length" and the number of dummy clocks can be configured by the "Set Read Parameters (C0h)" instruction. /CS Mode 3 CLK 0 1 2 3 4 6 5 7 8 9 10 11 12 13 14 Mode 0 Instruction 0Ch A23-16 A15-8 A7-0 IOs switch from Input to Output Dummy* IO0 20 16 12 8 4 0 4 0 4 0 4 IO1 21 17 13 9 5 1 5 1 5 1 5 IO2 22 18 14 10 6 2 6 2 6 2 6 IO3 23 19 15 11 7 3 7 3 7 3 7 Byte 1 Byte 2 * "Set Read Parameters" instruction (C0h) can set the number of dummy clocks. Figure 38. Burst Read with Wrap Instruction (QPI Mode only) - 64 - Byte 3 W25Q32DW 10.2.40 Enable QPI (38h) The W25Q32DW support both Standard/Dual/Quad Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI). However, SPI mode and QPI mode can not be used at the same time. "Enable QPI (38h)" instruction is the only way to switch the device from SPI mode to QPI mode. Upon power-up, the default state of the device upon is Standard/Dual/Quad SPI mode. This provides full backward compatibility with earlier generations of Winbond serial flash memories. See Intruction Set Table 1-3 for all supported SPI commands. In order to switch the device to QPI mode, the Quad Enable (QE) bit in Status Register 2 must be set to 1 first, and an "Enable QPI (38h)" instruction must be issued. If the Quad Enable (QE) bit is 0, the "Enable QPI (38h)" instruction will be ignored and the device will remain in SPI mode. See Instruction Set Table 4 for all the commands supported in QPI mode. When the device is switched from SPI mode to QPI mode, the exsiting Write Enable and Program/Erase Suspend status, and the Wrap Length setting will remain unchanged. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 Mode 0 Mode 3 Mode 0 Instruction (38h) DI (IO0) DO (IO1) High Impedance Figure 39. Enable QPI Instruction (SPI Mode only) - 65 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 10.2.41 Disable QPI (FFh) In order to exit the QPI mode and return to the Standard/Dual/Quad SPI mode, a "Disable QPI (FFh)" instruction must be issued. When the device is switched from QPI mode to SPI mode, the exsiting Write Enable Latch (WEL) and Program/Erase Suspend status, and the Wrap Length setting will remain unchanged. /CS Mode 3 CLK 0 1 Mode 0 Mode 3 Mode 0 Instruction FFh IO0 IO1 IO2 IO3 Figure 40. Disable QPI Instruction (QPI Mode only) - 66 - W25Q32DW 10.2.42 Enable Reset (66h) and Reset (99h) Because of the small package and the limitation on the number of pins, the W25Q32DW provide a software Reset instruction instead of a dedicated RESET pin. Once the Reset instruction is accepted, any on-going internal operations will be terminated and the device will return to its default power-on state and lose all the current volatile settings, such as Volatile Status Register bits, Write Enable Latch (WEL) status, Program/Erase Suspend status, Read parameter setting (P7-P0), Continuous Read Mode bit setting (M7-M0) and Wrap Bit setting (W6-W4). "Enable Reset (66h)" and "Reset (99h)" instructions can be issued in either SPI mode or QPI mode. To avoid accidental reset, both instructions must be issued in sequence. Any other commands other than "Reset (99h)" after the "Enable Reset (66h)" command will disable the "Reset Enable" state. A new sequence of "Enable Reset (66h)" and "Reset (99h)" is needed to reset the device. Once the Reset command is accepted by the device, the device will take approximately tRST=30us to reset. During this period, no command will be accepted. Data corruption may happen if there is an on-going or suspended internal Erase or Program operation when Reset command sequence is accepted by the device. It is recommended to check the BUSY bit and the SUS bit in Status Register before issuing the Reset command sequence. /CS Mode 3 CLK 0 1 2 3 4 5 6 7 Mode 0 Mode 3 0 1 2 3 4 Mode 0 5 6 7 Mode 3 Mode 0 Instruction (66h) Instruction (99h) DI (IO0) DO (IO1) High Impedance Figure 41a. Enable Reset and Reset Instruction Sequence (SPI Mode) /CS Mode 3 CLK 0 1 Mode 0 Mode 3 0 1 Mode 0 Instruction 66h Mode 3 Mode 0 Instruction 99h IO0 IO1 IO2 IO3 Figure 41b. Enable Reset and Reset Instruction Sequence (QPI Mode) - 67 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 11. ELECTRICAL CHARACTERISTICS 11.1 Absolute Maximum Ratings (1) PARAMETERS SYMBOL Supply Voltage VCC Voltage Applied to Any Pin VIO Transient Voltage on any Pin VIOT Storage Temperature Lead Temperature Electrostatic Discharge Voltage CONDITIONS RANGE UNIT -0.6 to VCC+0.4 V Relative to Ground -0.6 to VCC+0.4 V <20nS Transient Relative to Ground -1.0V to VCC+1.0V V TSTG -65 to +150 C TLEAD See Note C VESD Human Body Model(3) (2) -2000 to +2000 V Notes: 1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability. Exposure beyond absolute maximum ratings may cause permanent damage. 2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU. 3. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms). 11.2 Operating Ranges PARAMETER Supply Voltage(1) Ambient Temperature, Operating SYMBOL CONDITIONS VCC FR = 104MHz, TA Industrial SPEC fR = 50MHz UNIT MIN MAX 1.7 1.95 V -40 +85 C Note: 1. VCC voltage during Read can operate across the min and max range but should not exceed 10% of the programming (erase/write) voltage. - 68 - W25Q32DW 11.3 Power-Up Power-Down Timing and Requirements SPEC PARAMETER SYMBOL VCC (min) to /CS Low tVSL(1) 10 Time Delay Before Write Instruction tPUW 1 10 ms Write Inhibit Threshold Voltage VWI 1.0 1.4 V MIN (1) (1) MAX UNIT s Note: 1. These parameters are characterized only. VCC VCC (max) Program, Erase and Write Instructions are ignored /CS must track VCC VCC (min) Reset State tVSL Read Instructions Allowed Device is fully Accessible VWI tPUW Time Figure 43a. Power-up Timing and Voltage Levels /CS must track VCC during VCC Ramp Up/Down VCC /CS Time Figure 43b. Power-up, Power-Down Requirement - 69 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 11.4 DC Electrical Characteristics PARAMETER SYMBOL CONDITIONS Input Capacitance CIN(1) VIN = 0V(1) Output Capacitance Cout(1) Input Leakage SPEC MIN TYP MAX UNIT 6 pF 8 pF ILI 2 A I/O Leakage ILO 2 A Standby Current ICC1 /CS = VCC, VIN = GND or VCC 10 40 A Power-down Current ICC2 /CS = VCC, VIN = GND or VCC 1 20 A Current Read Data / Dual /Quad 1MHz(2) ICC3 C = 0.1 VCC / 0.9 VCC DO = Open 15 mA Current Read Data / Dual /Quad 50MHz(2) ICC3 C = 0.1 VCC / 0.9 VCC DO = Open 20 mA Current Read Data / Dual /Quad 80MHz(2) ICC3 C = 0.1 VCC / 0.9 VCC DO = Open 30 mA Current Read Data / Dual Output Read/Quad Output Read 104MHz(2) ICC3 C = 0.1 VCC / 0.9 VCC DO = Open 40 mA Current Write Status Register ICC4 /CS = VCC 8 12 mA Current Page Program ICC5 /CS = VCC 20 25 mA Current Sector/Block Erase ICC6 /CS = VCC 20 25 mA Current Chip Erase ICC7 /CS = VCC 20 25 mA Input Low Voltage VIL -0.5 VCC x 0.3 V VCC x 0.7 VCC + 0.4 V 0.2 V VOUT = 0V(1) Input High Voltage VIH Output Low Voltage VOL IOL = 100 A Output High Voltage VOH IOH = -100 A VCC - 0.2 Notes: 1. Tested on sample basis and specified through design and characterization data. TA = 25 C, VCC = 1.8V. 2. Checker Board Pattern. - 70 - V W25Q32DW 11.5 AC Measurement Conditions PARAMETER SPEC SYMBOL Load Capacitance Input Rise and Fall Times Input Pulse Voltages Input Timing Reference Voltages Output Timing Reference Voltages MIN MAX UNIT CL 30 pF TR, TF 5 ns VIN 0.1 VCC to 0.9 VCC V IN 0.3 VCC to 0.7 VCC V OUT 0.5 VCC to 0.5 VCC V Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. Input and Output Timing Reference Levels Input Levels 0.9 VCC 0.5 VCC 0.1 VCC Figure 39. AC Measurement I/O Waveform - 71 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 11.6 AC Electrical Characteristics DESCRIPTION SYMBOL Clock frequency for SPI Read data instructions (03h) fR Clock frequency for SPI Quad Read instructions (6Bh,EBh,E7h,E3h) FR Clock frequency for QPI Read instructions(0Bh, ALT SPEC MIN TYP MAX UNIT D.C. 50 MHz fC1 D.C. 80 MHz FR fC1 D.C. 30/50/80/104 MHz FR fC1 D.C. 30/80/104/104 MHz FR fC1 D.C. 104 MHz EBh,0Ch) with 2/4/6/8 dummy clocks Clock frequency for QPI Read instructions(0Bh, EBh,0Ch) with 2/4/6/8 dummy clocks, A<1:0>=0,0 Clock frequency for all other SPI/QPI instructions Clock High, Low Time for all instructions except for Read Data (03h) tCLH, tCLL(1) 4 ns Clock High, Low Time for Read Data (03h) instruction tCRLH, tCRLL(1) 8 8 ns Clock Rise Time peak to peak tCLCH(2) 0.1 V/ns Clock Fall Time peak to peak tCHCL(2) 0.1 V/ns 5 ns 5 ns /CS Active Setup Time relative to CLK tSLCH tCSS /CS Not Active Hold Time relative to CLK tCHSL Data In Setup Time tDVCH tDSU 2 ns Data In Hold Time tCHDX tDH 3 ns /CS Active Hold Time relative to CLK tCHSH 5 ns /CS Not Active Setup Time relative to CLK tSHCH 5 ns /CS Deselect Time (for Array Read AE Array Read) tSHSL1 tCSH 10 ns /CS Deselect Time (for Erase or Program AE Read Status Registers) Volatile Status Register Write Time tSHSL2 tCSH 50 ns 50 tSHQZ(2) tDIS 7 ns Clock Low to Output Valid tCLQV1 tV1 7 ns Clock Low to Output Valid (for Read ID instructions) tCLQV2 tV2 7.5 ns Output Hold Time tCLQX tHO /HOLD Active Setup Time relative to CLK tHLCH Output Disable Time 0 ns 5 ns Continued - next page - 72 - W25Q32DW 11.7 AC Electrical Characteristics (cont'd) SPEC DESCRIPTION SYMBOL ALT MIN TYP MAX UNIT /HOLD Active Hold Time relative to CLK tCHHH 5 ns /HOLD Not Active Setup Time relative to CLK tHHCH 5 ns /HOLD Not Active Hold Time relative to CLK tCHHL 5 ns /HOLD to Output Low-Z tHHQX(2) tLZ 7 ns /HOLD to Output High-Z tHLQZ(2) tHZ 12 ns Write Protect Setup Time Before /CS Low tWHSL(3) 20 ns Write Protect Hold Time After /CS High tSHWL(3) 100 ns tDP(2) 3 s /CS High to Standby Mode without Electronic Signature Read tRES1(2) 30 s /CS High to Standby Mode with Electronic Signature Read tRES2(2) 30 s /CS High to next Instruction after Suspend tSUS(2) 20 s /CS High to next Instruction after Reset tRST(2) 30 s /CS High to Power-down Mode Write Status Register Time tW 10 15 ms Byte Program Time (First Byte) (4) tBP1 20 50 s Additional Byte Program Time (After First Byte) (4) tBP2 2.5 10 s Page Program Time tPP 0.7 3 ms Sector Erase Time (4KB) tSE 30 200/400(5) ms Block Erase Time (32KB) tBE1 120 800 ms Block Erase Time (64KB) tBE2 150 1,000 ms Chip Erase Time tCE 7.5 30 s Notes: 1. 2. 3. Clock high + Clock low must be less than or equal to 1/fC. Value guaranteed by design and/or characterization, not 100% tested in production. Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set to 1. 4. For multiple bytes after first byte within a page, tBPN = tBP1 + tBP2 * N (typical) and tBPN = tBP1 + tBP2 * N (max), where N = number of bytes programmed. 5. Max Value tSE with <50K cycles is 200ms and >50K & <100K cycles is 400ms. - 73 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 11.8 Serial Output Timing 11.9 Serial Input Timing 11.10 Hold Timing - 74 - W25Q32DW 12. PACKAGE SPECIFICATION 12.1 8-Pin SOIC 208-mil (Package Code SS) GAUGE PLANE SYMBOL A A1 A2 b C D D1 E E1 e(2) H L y MILLIMETERS INCHES Min Nom Max Min Nom Max 1.75 0.05 1.70 0.35 0.19 5.18 5.13 5.18 5.13 1.95 0.15 1.80 0.42 0.20 5.28 5.23 5.28 5.23 1.27 BSC. 7.90 0.65 ----- 2.16 0.25 1.91 0.48 0.25 5.38 5.33 5.38 5.33 0.069 0.002 0.067 0.014 0.007 0.204 0.202 0.204 0.202 0.085 0.010 0.075 0.019 0.010 0.212 0.210 0.212 0.210 8.10 0.80 0.10 8 0.303 0.020 --0 0.077 0.006 0.071 0.017 0.008 0.208 0.206 0.208 0.206 0.050 BSC. 0.311 0.026 ----- 7.70 0.50 --0 0.319 0.031 0.004 8 Notes: 1. Controlling dimensions: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches. - 75 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 12.2 8-Contact 6x5mm WSON (Package Code ZP) SYMBOL MILLIMETERS INCHES Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.35 0.40 0.48 0.014 0.016 0.019 C --- 0.20 REF. --- --- 0.008 REF. --- D 5.90 6.00 6.10 0.232 0.236 0.240 D2 3.35 3.40 3.45 0.132 0.134 0.136 E 4.90 5.00 5.10 0.193 0.197 0.201 E2 4.25 4.30 4.35 0.167 0.169 0.171 (2) 1.27 BSC. e 0.050 BSC. L 0.55 0.60 0.65 0.022 0.024 0.026 y 0.00 --- 0.075 0.000 --- 0.003 - 76 - W25Q32DW 8-Contact 6x5mm WSON Cont'd. SYMBOL MILLIMETERS Min Nom INCHES Max Min Nom Max SOLDER PATTERN M 3.40 0.134 N 4.30 0.169 P 6.00 0.236 Q 0.50 0.020 R 0.75 0.026 Notes: 1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package. 4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad. - 77 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 12.3 8-Contact 8x6mm WSON (Package Code ZE) MILLIMETERS Min Nom Max A 0.70 0.75 0.80 A1 0.00 0.02 SYMBOL Min INCHES Nom Max 0.028 0.030 0.031 0.05 0.000 0.001 0.002 b 0.35 0.40 0.48 0.014 0.016 0.019 C 0.19 0.20 0.25 0.007 0.008 0.010 D 7.90 8.00 8.10 0.311 0.315 0.319 0.185 D2 4.60 4.65 4.70 0.181 0.183 E 5.90 6.00 6.10 0.232 0.236 0.240 E2 5.15 5.20 5.25 0.203 0.205 0.207 e 1.27 BSC 0.050 BSC L 0.45 0.50 0.55 0.018 0.020 0.022 y 0.00 --- 0.050 0.000 --- 0.002 - 78 - W25Q32DW 12.4 16-Pin SOIC 300-mil (Package Code SF) GAUGE PLANE DETAIL A SYMBOL Min MILLIMETERS Nom Max Min INCHES Nom Max A 2.36 2.49 2.64 0.093 0.098 0.104 A1 0.10 --- 0.30 0.004 --- 0.012 A2 --- 2.31 --- --- 0.091 --- b 0.33 0.41 0.51 0.013 0.016 0.020 C 0.18 0.23 0.28 0.007 0.009 0.011 0.413 D 10.08 10.31 10.49 0.397 0.406 E 10.01 10.31 10.64 0.394 0.406 0.419 E1 7.39 7.49 7.59 0.291 0.295 0.299 e(2) 1.27 BSC. 0.050 BSC. L 0.38 0.81 1.27 0.015 0.032 0.050 y --- --- 0.076 --- --- 0.003 0 --- 8 0 --- 8 Notes: 1. Controlling dimensions: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. - 79 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 13. ORDERING INFORMATION W(1) 25Q 32D W xx(2) W = Winbond 25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O 32D = 32M-bit W = 1.7V to 1.95V SS = 8-pin SOIC 208-mil SF = 16-pin SOIC 300-mil I = ZP ZE = 8-pad WSON 6x5mm = 8-pad WSON 8x6mm Industrial (-40C to +85C) (3,4) G P = = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3) Green Package with Status Register Power-Down & OTP enabled Notes: 1. The "W" prefix is not included on the part marking. 2. Only the 2 marking. 3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T) or Tray (shape S), when placing orders. 4. For shipments with OTP feature enabled, please specify when placing orders. nd letter is used for the part marking; WSON package type ZP and ZE are not used for the part - 80 - W25Q32DW 13.1 Valid Part Numbers and Top Side Marking The following table provides the valid part numbers for the W25Q32DW SpiFlash Memory. Please contact Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages use an abbreviated 10-digit number. PACKAGE TYPE DENSITY SS SOIC-8 208mil SF SOIC-16 300mil 32M-bit (1) ZP WSON-8 6x5mm (1)(2) ZE WSON-8 8x6mm 32M-bit 32M-bit 32M-bit PRODUCT NUMBER TOP SIDE MARKING W25Q32DWSSIG W25Q32DWSSIP W25Q32DWSFIG W25Q32DWSFIP W25Q32DWZPIG W25Q32DWZPIP W25Q32DWZEIG W25Q32DWZEIP 25Q32DWSIG 25Q32DWSIP 25Q32DWFIG 25Q32DWFIP 25Q32DWIG 25Q32DWIP 25Q32DWIG 25Q32DWIP Notes: 1. For WSON packages, the package type ZP and ZE are not used in the top side marking. 2. Package type ZE (WSON-8 8x6mm) is a special order package, please contact Winbond for ordering information. - 81 - Publication Release Date: September 18, 2012 Revision D W25Q32DW 14. REVISION HISTORY VERSION DATE PAGE A 11/11/09 B 08/03/10 All C 01/14/11 55 63 70-71 72 na 63 72-73 D 09/18/12 All 69 DESCRIPTION New Create Preliminary Updated QPI instruction diagrams Updated instruction 90h description Updated dummy clocks description & frequency Updated ICC1, ICC2, Vin, Vin Waveform Updated maximum frequency Update VCC Range Update Set Read Parameter (C0h) Update parameters tCE & tCHDX Removed preliminary designator Added power-down requirement Trademarks Winbond and SpiFlash are trademarks of Winbond Electronics Corporation. All other marks are the property of their respective owner. Important Notice Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Further more, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. Information in this document is provided solely in connection with Winbond products. Winbond reserves the right to make changes, corrections, modifications or improvements to this document and the products and services described herein at any time, without notice. - 82 -