71
Detector Slide Push Rotary Power
Dual-in-line
Package Type
71
Water-proof
Type
General-
purpose Type
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2.
Temperature measurement: Thermocouple φ0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
Temperature (˚C )
SPPB
260
230
40
35
40
18 0 15 0 12 0
SPPW8
SPVE
250
SSCQ
250
SPVN
S
PVL
S
PVM
S
PVS
S
PVT
S
SCM
S
PVR
Series (Reflow type) A(℃)3s max. B(℃) C(s) D(℃) E(℃) F(s)
SPVQC
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, surface depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines.
Prior verification of soldering condition is highly recommended.
Notes
Detector Switches Soldering Conditions
Reference for Hand Soldering
SPVS, SPVN, SPVT, SPVM, SPVR,
SPVE, SPPW8,SSCQ, SSCM,
SPVL, SSCT, SPVQC
SPVQ1, SPVQ3, SPVQ6, SPVQ7,
SPVQ8, SPVQ9, SSCN, SPVQA
SPPB
(Reflow)
SSCF, SPPB
(For Lead, Dip)
Soldering
temperature
350±5℃
300±5℃
3 0 0 ±10 ℃
3 5 0 ±10 ℃
Soldering time
3s max.
5s max.
3 +1 / 0s
3 +1 / 0s
Series
Reference for Dip Soldering
(For PC board terminal types)
SSCT, SPVQ1, SPVQ3,
SPVQ6, SPVQ7, SPVQ8,
SPVQ9, SPVQA
SSCF
SPPW8, SPPB
Items
Preheating
temperature
Soldering
temperature
Preheating
time
Duration of
immersion
Dip soldering
260±5℃10 0±10 ℃ 5 ±1s60s max.
260±5℃ー5 ±1s
255±5℃
10 0 ℃
max. 5 ±1s60s max.
Series