Features
■ Superior circuit protection
■ Overcurrent & overvoltage protection
■ Blocks surges up to rated limits
■ High-speed performance
■ Small SMT package
■ RoHS compliant*
■ Agency recognition:
Applications
■ SLIC protection
■ Cable & DSL
■ MDU/MTU modems
■ ONT
■ Voice/DSL line cards
TBU-PL Series - TBU® High-Speed Protectors
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
General Information
The TBU-PL Series of Bourns® TBU® products are low capacitance dual bidirectional high-speed protection
components, constructed using MOSFET semiconductor technology, and designed to protect against faults
caused by short circuits, AC power cross, induction and lightning surges.
In addition to overcurrent protection, an added feature is the voltage monitoring on the two lines. If the voltage
on the line drops below Vss then the voltage will trigger the device to switch to the blocking state.
The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET detec-
tion circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to
large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package
and meets industry standard requirements such as RoHS and Pb Free solder refl ow profi les.
Agency Approval
TBU
®
Device
Line 1 SLIC Line 1
Line 2 SLIC Line 2
Vdd
Vss
Description
UL File Number: E315805
Industry Standards (in Conjunction with OVP Device)
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Symbol Parameter Part Number Value Unit
Vimp Peak impulse voltage withstand with duration less than 10 ms
TBU-PL050-xxx-WH
TBU-PL060-xxx-WH
TBU-PL075-xxx-WH
TBU-PL085-xxx-WH
500
600
750
850
V
Vrms Continuous A.C. RMS voltage
TBU-PL050-xxx-WH
TBU-PL060-xxx-WH
TBU-PL075-xxx-WH
TBU-PL085-xxx-WH
300
350
400
425
V
Top Operating temperature range -55 to +125 °C
Tstg Storage temperature range -65 to +150 °C
Tjmax Maximum Junction Temperature +125 °C
ESD HBM ESD Protection per IEC 61000-4-2 on line pads ±2 kV
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Symbol Parameter Part Number Min. Typ. Max. Unit
Itrigger
Current required for the device to go from
operating state to protected state
TBU-PLxxx-100-WH
TBU-PLxxx-200-WH
100
200
150
300
200
400 mA
Rdevice Series resistance of the TBU® device 40 50 55 Ω
Rmatch Package resistance matching of the TBU® device #1 - TBU® device #2 ±0.5 ±1.0 Ω
tblock Time taken for the device to go into current limiting 1 µs
IQCurrent through the triggered TBU® device with 50 Vdc circuit voltage 0.25 0.70 1.50 mA
Iss Operating current with Vss = -50 V 100 µA
Vreset
Voltage below which the triggered TBU®
device will transition to normal operating state
TBU-PLxxx-100-WH Forward Mode 12 15 22
V
Reverse Mode 10 13 20
TBU-PLxxx-200-WH Forward Mode 15 20 25
Reverse Mode 12 17 22
Vto Voltage threshold offset with 60 Hz applied voltage, with Vss -50 V (Vss - VlineSLIC) -1.0 0.2 V
Vss Operating voltage range relative to Vdd -180 -20 V
Rth(j-l) One side junction to package pads - FR4 using minimum recommended pad layout 110 °C/W
Rth(j-l) Both sides junction to package pads - FR4 using minimum recommended pad layout 65 °C/W
Rth(j-l) One side junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2) 70 °C/W
Rth(j-l) Both sides junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2) 40 °C/W
*RoHS COMPLIANT
L501
C954
Solutions available for GR-1089-CORE, ITU-T and a combination of both.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
TBU-PL Series - TBU® High-Speed Protectors
Functional Block Diagram
Reference Application
The TBU-PL Series are high-speed protectors used in voice/
VoIP SLIC applications.The maximum voltage rating of the TBU®
device should never be exceeded. Where necessary, an OVP
device should be employed to limit the maximum voltage. A cost-
effective protection solution combines Bourns® TBU® protection
devices with a pair of Bourns® MOVs. For bandwidth sensitive
applications, a Bourns® GDT may be substituted for the MOV. If
EN55024 EMC compliance is required, the TBU® device
may require capacitors to be fi tted between the Tip and Ring
connections and ground.
MOV
14
2
85
6
MOV
TBU®
Device
GND
-VBAT
Line 1
SLIC
Vdd
Vss
Line 2
SLIC
Line 1
Line 2
C1
C2
The TBU® device, constructed using MOSFET semiconductor
technology, placed in the system circuit will monitor the
current with the MOSFET detection circuit triggering to provide
an effective barrier behind which sensitive electronics are not
exposed to large voltages or currents during surge events. The
TBU® device operates in approximately 1 µs - once line current
exceeds the TBU® device’s trigger current Itrigger. When
operated, the TBU® device restricts line current to less than
1 mA typically. When operated, the TBU® device will block all
voltages including the surge up to rated limits.
When the voltage on the SLIC output is driven below
(Vbat – Vto) the TBU-PL series device switches to the
blocking state, regardless of output current in the device.
After the surge, the TBU® device resets when the voltage
across the TBU® device falls to the Vreset level. The TBU®
device will automatically reset on lines which have no DC bias
or have DC bias below Vreset (such as unpowered signal lines).
If the line has a normal DC bias above Vreset, the voltage
across the TBU® device may not fall below Vreset after the
surge. In such cases, special care needs to be taken to ensure
that the TBU® device will reset, with software monitoring as one
method used to accomplish this. Bourns application
engineers can provide further assistance.
Basic TBU Operation
Line 1
HIGH
VOLTAGE
SWITCH
Line 1 SLIC
Vss
Line 2
Line 2 SLIC
CURRENT
SENSE
+
VOLTAGE
COMPARATOR
HIGH
VOLTAGE
SWITCH
CURRENT
SENSE
+
VOLTAGE
COMPARATOR
Vss
Vdd
Vss
Vdd
Vdd
TBU-PL Series - TBU® High-Speed Protectors
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
Bourns® TBU® Device Solutions
* GDT Special Test Protector with DC breakdown (DCBD) of less than 330 V.
Notes:
1) The Le9500, Le9520 and Le9530 (VE950 series) require a 200 mA Itrigger TBU® device for normal operation. Other SLIC types should use
the 100 mA device.
2) The MOV maximum continuous rms voltage rating should not be exceeded. The exception is where the data sheet highlights withstand
capability such as the 600 Vrms, 1 A for 0.2 s, for example.
3) If EN55024 EMC compliance is required, the TBU® device may require capacitors to be fi tted between the Tip and Ring connections and
ground (i.e. in parallel with the MOV device). The capacitance value can be chosen to meet levels as follows:
• 10 nF for EN55024 Level 1
• 20 nF for EN55024 Level 2
• 47 nF for EN55024 Level 3
Selection of capacitor voltage rating depends upon TBU® part number selection. Recommendations include:
• TBU-PL050 & TBU-PL060 Series: 120 VAC, 500 V Peak Surge Rated
• TBU-PL075 & TBU-PL085 Series: 240 VAC, 750 V Peak Surge Rated
Depending upon the SLIC type, it is usually possible to remove any EMI capacitors present between the output of the SLIC and ground
when using capacitors C1 and C2 in parallel with the MOVs.
Industry Standard Surge & AC Withstand TBU® Device P/N Qty. OVP Device P/N Qty.
Telcordia GR-1089-CORE
Intra-building
Port Type 4
1500 V, 100 A 2/10 µs
120 Vrms, 25 A, 900 s TBU-PL050-100-WH 1 MOV-07D201K 2
Telcordia GR-1089-CORE
Intra-building
Port Type 4a
1000 V, 100 A 10/1000 µs
120 Vrms, 25 A, 900 s TBU-PL060-100-WH 1 MOV-10D201K 2
Non-GR-1089-CORE Intra-building
Specifi cations
5000 V, 500 A 2/10 µs
230 Vrms, 25 A, 900 s TBU-PL085-100-WH 1 MOV-10D361K 2
1500 V, 100 A 2/10 µs
275 Vrms, 25 A, 900 s TBU-PL085-100-WH 1 MOV-10D431K 2
ITU-T Basic K.20, K.21, K.45
4000 V, 40 Ω 10/700 µs
230 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 0.2 s
TBU-PL075-100-WH 1 MOV-10D361K 2
4000 V, 40 Ω 10/700 µs
230 V rms 10 Ω -1000 Ω, 900 s
600 V rms 600 Ω, 0.1 s
TBU-PL060-100-WH 1 TISP4400M3BJ 2
ITU-T Enhanced K.20, K.21, K.45
6000 V, 40 Ω 10/700 µs
240 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 0.2 s
600 Vrms 600 Ω, 1 s*
1500 Vrms, 200 Ω, 2 s*
TBU-PL085-100-WH 1 MOV-10D391K 2
6000 V, 40 Ω 10/700 µs
240 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 1 s
1500 Vrms, 200 Ω, 2 s
TBU-PL060-100-WH 1 TISP4500H3BJ 2
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
TBU-PL Series - TBU® High-Speed Protectors
Performance Graphs
Typical V-I Characteristics (TBU-PL085-200-WH)
Tracking Voltage Characteristics
Typical Trigger Current vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25 0 25 50 75 100 125
Junction Temperature (°C)
Normalized Trigger Current
Typical Resistance vs. Temperature
2.2
1.6
1.8
2.0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25 0 25 50 75 100 125
Junction Temperature (°C)
Normalized Resistance
CURRENT
(50 mA/div)
VOLTAGE
(5 V/div)
ITRIGGER
VRESET
Power Derating Curve
One Side, No PCB Cu
One Side, 0.5 sq. in. PCB Cu
Two Sides, No PCB Cu
Two Sides, 0.5 sq. in. PCB Cu
Ambient Temperature (°C)
20
3.0
2.5
2.0
1.5
1.0
0.5
0.0
40 60 80 100 120 140
Total Max. Power (W)
100
90
80
70
60
50
40
-4 -3 -2 -1 0 1 2 3 4
Voltage threshold offset (V)
Resistance ( )
Vbat range of -25 V to -150 V
Typical Surge Response
Voltage: 100 V/div
Time: 250 ns/div
Current: 100 mA/div
(TBU-PL050-100-WH with MOV-07D201K
Using 1800 V 1.2/50 ms Surge Pulse)
Product Dimensions
PIN 1 & BACKSIDE CHAMFER
4.00
(.157)
0.00 - 0.05
(.000 - .002)
0.80 - 0.95
(.031 - .037)
6.50
(.256)
0.85
(.033)
0.85 ± 0.05
(.033 ± .002)
0.90
(.035)
0.85
(.033)
0.30
(.012)
0.30
(.012)
1.335
(.053)
1.335
(.053)
1.275
(.050)
1.275
(.050)
0.85
(.033)
0.85
(.033)
0.85
(.033)
0.73
(.029)
1.20
(.047)
1.20
(.047)
1.35
(.053)
1.35
(.053)
0.85
(.033)
1.275
(.050)
0.725
(.029)
0.825
(.032)
0.70
(.028)
0.825
(.032)
0.40
(.016)
1.15
(.045)
1.25
(.049)
0.75
(.030)
0.75
(.030)
0.75
(.030)
1.30
(.051)
C PIN 1
0.25
(.010)
0.40
(.016)
0.70
(.028)
DIMENSIONS: MM
(INCHES)
Recommended Pad Layout
1234
8765
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
TBU-PL Series - TBU® High-Speed Protectors
Dark grey areas show added PCB copper area for better
thermal resistance.
Thermal Resistance vs Additional PCB Cu Area
Added Cu Area (Sq. In.)
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
120
100
80
60
40
20
0
Thermal Resistance (°C/W)
Power in One Side of TBU® Device
Total Power in Both Sides of TBU® Device
TBU® High-Speed Protectors have a 100 % matte-tin termination
fi nish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be defi ned by a solder mask
which matches the pad layout of the TBU® device in size and spac-
ing. It is recommended that they should be the same dimension as
the TBU® pads but if smaller solder pads are used, they should be
centered on the TBU® package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be larger than the TBU® pad sizes
to ensure adequate clearance is maintained. The recommended
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad
size. Extended copper areas beyond the solder pad signifi cantly
improve the junction to ambient thermal resistance, resulting in
operation at lower junction temperatures with a corresponding
benefi t of reliability. All pads should soldered to the PCB, includ-
ing pads marked as NC or NU but no electrical connection should
be made to these pads. For minimum parasitic capacitance, it is
recommended that signal, ground or power signals are not routed
beneath any pad.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
3312 - 2 mm SMD Trimming Potentiometer
TBU-PL Series - TBU® High-Speed Protectors
Refl ow Profi le
Profi le Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 °C/sec. max.
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
150 °C
200 °C
60-180 sec.
Time maintained above:
- Temperature (TL)
- Time (tL)
217 °C
60-150 sec.
Peak/Classifi cation Temperature (Tp) 260 °C
Time within 5 °C of Actual Peak Temp. (tp) 20-40 sec.
Ramp-Down Rate 6 °C/sec. max.
Time 25 °C to Peak Temperature 8 min. max.
How to Order
TBU - PL 085 - 100 - WH
TBU® Product
Series
PL = Dual Bidirectional Series
Impulse Voltage Rating
050 = 500 V
060 = 600 V
075 = 750 V
085 = 850 V
Trigger Current
100 = 100 mA
200 = 200 mA
Hold to Trip Ratio Suffi x
W = Hold to Trip Ratio
Package Suffi x
H = DFN Package
Typical Part Marking
PIN 1
MANUFACTURING
DATE CODE
- 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD.
- 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD.
- 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK.
6-MONTH PERIOD CODES:
A = JAN-JUN 2009 C = JAN-JUN 2010 E = JAN-JUN 2011
B = JUL-DEC 2009 D = JUL-DEC 2010 F = JUL-DEC 2011
MANUFACTURER’S
TRADEMARK
PRODUCT CODE
- 1ST DIGIT INDICATES PRODUCT FAMILY:
L = TBU-PL SERIES
- 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE:
50 = 500 V 60 = 600 V 75 = 750 V 85 = 850 V
- 4TH DIGIT INDICATES TRIGGER CURRENT:
1 = 100 mA 2 = 200 mA
41
58
6
2
Device Pin Out
Pad # Pin Out
1 Line 1
2V
dd (SLIC Ground or 0 V)
3 Not Used
4 Line 1 SLIC
Pad Designation
Pad # Pin Out
5 Line 2 SLIC
6V
ss (SLIC Negative Supply or -Vbat)
7 Not Used
8 Line 2
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
3312 - 2 mm SMD Trimming Potentiometer
TBU-PL Series - TBU® High-Speed Protectors
REV. 01/25/12
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries.
Packaging Specifi cations
B
A
DC
NF
G (MEASURED AT HUB)
USER DIRECTION OF FEED
K0
B0
P2
D1
CENTER
LINES OF
CAVITY
EMBOSSMENT
tD
P0
TOP
COVER
TAPE
E
W
P
A0
DIMENSIONS: MM
(INCHES)
A B C D G N
Min. Max. Min. Max. Min. Max. Min. Max. Ref. Ref.
326
(12.835)
330
(13.002)
1.5
(.059)
2.5
(.098)
12.8
(.504)
13.5
(.531)
20.2
(.795) - 16.5
(.650)
102
(4.016)
A0 B
0 D D1 E F
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. max.
4.30
(.169)
4.50
(.177)
6.70
(.264)
6.90
(.272)
1.5
(.059)
1.6
(.063)
1.5
(.059) -1.65
(.065)
1.85
(.073)
7.4
(.291)
7.6
(.299)
K0P P0 P
2 t W
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
1.0
(.039)
1.2
(.047)
7.9
(.311)
8.1
(.319)
3.9
(.159)
4.1
(.161)
1.9
(.075)
2.1
(.083)
0.25
(.010)
0.35
(.014)
15.7
(.618)
16.3
(.642)
QUANTITY: 3000 PIECES PER REEL
Asia-Pacifi c: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
