DATA SHEE
T
GENERAL PURPOSE CHIP RESISTORS
RC1206 (Pb Free)
5%, 1%
Product specification – Sep 03, 2004 V.2 Supersedes Date of Mar. 06, 2003
Product specification
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Chip Resistor Surface Mount SERIES
RC 1206 (Pb Free)
(1) The resistors have a 12-digit
ordering code starting with
2322/2350.
(2) The subsequent 4 or 5 digits
indicate the resistor
tolerance and packaging.
(3) The remaining 4 or 3 digits
represent the resistance value
with the last digit indicating
the multiplier as shown in the
table of “Last digit of 12NC”.
(4) “L” means lead-free
terminations.
ORDERING EXAMPLE
The ordering code of a RC02
resistor, value 56 X with ±1%
tolerance, supplied in tape of
5,000 units per reel is:
232272465609L.
P
PH
HY
YC
CO
OM
MP
P
O
OR
RD
DE
ER
RI
IN
NG
G
C
CO
OD
DE
E
12NC CODE
2322 / 2350 XXX XXXXX L
(1) (2) (3) (4)
PAPER / PE TAPE ON REEL (units) (2)
TYPE/
1206
START
IN (1)
TOL.
(%)
RESISTANCE
RANGE
5,000 10,000/not preferred 20,000
RC01
2322 ±5% 1 to 10 MΩ 711 61xxx 711 51xxx 711 81xx
x
RC02
2322 ±1% 1 to 10 MΩ 724 6xxxx 724 7xxxx 724 8xxx
x
HRC01
2350 ±5% 11 to 22 MΩ 520 10xxx - -
Jumper
2322 - 0 Ω 711 91032 711 91005 711 9200
4
SCOPE
This specification describes RC1206 series chip resistors with lead-free terminations made by thick film process.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and
resistance value.
CTC CODE
RC1206 X X X XX XXXX L
(1) (2) (3) (4) (5) (6)
(1) TOLERANCE
F = ±1%
J = ±5%
(2) PACKAGING TYPE
R = Paper/PE taping reel
(3) TEMPERATURE COEFFICIENT
OF RESISTANCE
– = Base on spec
(4) TAPING REEL
07 = 7 inch dia. Reel
10 = 10 inch dia. Reel (not preferred)
13 = 13 inch dia. Reel
(5) RESISTANCE VALUE
5R6, 56R, 560R, 5K6, 56K, 22M
(6) RESISTOR TERMINATIONS
L = Lead free terminations (pure Tin)
ORDERING EXAMPLE
The ordering code of a RC1206
chip resistor, value 56 X with
±1% tolerance, supplied in 7-inch
tape reel is: RC1206FR-0756RL.
NOTE
1. The “L” at the end of the code is only for ordering. On the reel label, the standard CTC or 12NC will be mentioned an additional stamp
“LFP”= lead free production.
2. Products with lead in terminations fulfil the same requirements as mentioned in this datasheet.
3. Products with lead in terminations will be phased out in the coming months (before July 1st, 2006)
Resistance decade (3) Last digit
0.01 to 0.0976 X0
0.1 to 0.976 X 7
1 to 9.76 X 8
10 to 97.6 X 9
100 to 976 X 1
1 to 9.76 kX 2
10 to 97.6 kX 3
100 to 976 kX 4
1 to 9.76 MX 5
10 to 97.6 MX 6
Example: 0.02
X= 0200 or 200
0.3 X = 3007 or 307
1
X = 1008 or 108
33 kX= 3303 or 333
10 MX= 1006 or 106
Last digit of 12NC
Product specification
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Chip Resistor Surface Mount SERIES
RC 1206 (Pb Free)
resistance value. Finally, the two external terminations (pure Tin) are added. See fig. 3.
CONSTRUCTION
The resistors are constructed out of
a high-grade ceramic body. Internal
metal electrodes are added at each
end and connected by a resistive
paste. The composition of the paste
is adjusted to give the approximate
required resistance and laser cutting
of this resistive layer that achieves
tolerance trims the value. The
resistive layer is covered with a
protective coat and printed with the
handbook, 4 columns
protective coat
resistor layer
inner electrode
end termination
ceramic substrate
MBE940_a
H
I2
Fig. 3 Chip resistor construction
MBE940_a
protective coat
W
L
I
1
Fig. 4 Chip resistor dimension For dimension see Table 1
MARKING
RC1206
E-24 series: 3 digits
First two digits for significant figure and 3rd digit for number of zeros
Both E-24 and E-96 series: 4 digits
First three digits for significant figure and 4th digit for number of zeros
For marking codes, please see EIA-marking code rules in data sheet “Chip resistors instruction”.
Fig. 1 Value=10 KΩ
ynsc001
Fig. 2 Value=10 KΩ
ynsc004
DIMENSIONS
TYPE RC1206
L (mm) 3.10 ±0.10
W (mm) 1.60 ±0.10
H (mm) 0.55 ±0.10
I1 (mm) 0.45 ±0.20
I2 (mm) 0.40 ±0.20
Table 1
Product specification
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Chip Resistor Surface Mount SERIES
RC 1206 (Pb Free)
ELECTRICAL CHARACTERISTICS
CHARACTERISTICS RC1206 1/4 W
Operating Temperature Range –55 °C to +155 °C
Maximum Working Voltage 200 V
Maximum Overload Voltage 400 V
Dielectric Withstanding Voltage 500 V
5% (E24) 1 Ω to 22 MΩ
1% (E96) 1 Ω to 10 MΩ
Resistance Range
Zero Ohm Jumper < 0.05 Ω
10 Ω < R ≤ 10 MΩ±100 ppm/°C
Temperature Coefficient R ≤ 10 Ω; R > 10 MΩ±200 ppm/°C
Rated Current 2.0 A
Jumper Criteria Maximum Current 10.0 A
FOOTPRINT AND SOLDERING
PROFILES
For recommended footprint and
soldering profiles, please see the
special data sheet “Chip resistors
mounting”.
ENVIRONMENTAL DATA
For material declaration
information (IMDS-data) of the
products, please see the
separated info “Environmental
data”.
PACKING STYLE AND P
A
CKAGING QUANTITY
PRODUCT TYPE PACKING STYLE REEL DIMENSION QUANTITY PER REEL
RC1206 Paper / PE Taping Reel (R) 7" (178 mm) 5,000 units
10" (254 mm) / not preferred 10,000 units
13" (330 mm) 20,000 units
NOTE
1. For Paper/PE tape and reel specification/dimensions, please see the special data sheet “Packing” document.
Table 3 Packing style and packaging quantity
Table 2
Product specification
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Sep 03, 2004 V.2
Chip Resistor Surface Mount SERIES
RC 1206 (Pb Free)
MRA632
70 100
−55 50
Tamb (°C)
(%Prated)
0
0
50
100
155
Pmax
Fig. 5 Maximum dissipation (Pmax) in percentage of rated power
as a function of the operating ambient temperature (Tamb)
FUNCTIONAL DESCRIPTION
P
PO
OW
WE
ER
R
R
RA
AT
TI
IN
NG
G
RC1206 rated power at 70°C is 1/4 W
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V=√(P X R)
Where
V=Continuous rated DC or
AC (rms) working voltage (V)
P=Rated power (W)
R=Resistance value (X)
P
PU
UL
LS
SE
E
L
LO
OA
AD
DI
IN
NG
G
C
CA
AP
PA
AB
BI
IL
LI
IT
TI
IE
ES
S
10 10 210 310 410 510 610 7
MBD641
104
10
102
103
V
R (Ω)
n
1.2/50 µs
10/700 µs
max
(V)
Fig. 6 Maximum permissible peak pulse voltage without failing to open circuit’ in accordance with DIN IEC 60040 (CO) 533 for type:
RC1206
Product specification
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Chip Resistor Surface Mount SERIES
RC 1206 (Pb Free)
10
1
1
MBD585
10
3
1
10
10
2
10
2
10
3
10
4
10
5
10
6
10
1
Pmax
(W)
t (s)
single pulse
t /t =1000
pi
i
Fig. 7 Pulse on a regular basis for type: RC1206; maximum permissible peak pulse powe
r
as a function of pulse duration for single
pulse and repetitive pulse tp/ti = 1000
600
200
0
400
MBD586
10 11
10 2
10 3
10 4
10 5
10 6
Vmax
(V)
t (s)
i
Fig. 8 Pulse on a regular basis for type: RC1206; maximum permissible peak pulse voltage as a function of pulse duration
Product specification
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Chip Resistor Surface Mount SERIES
RC 1206 (Pb Free)
TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENTS
At +25/–55 °C and +25/+125 °C Temperature
Coefficient o
f
Resistance
(T.C.R.)
MIL-STD-202F-method 304;
JIS C 5202-4.8
Formula:
T.C.R= ------------------------- × 106 (ppm/°C)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Refer to table 2
Thermal Shoc
MIL-STD-202F-method 107G;
IEC 60115-1 4.19
At –65 (+0/–10) °C for 2 minutes and at +155
(+10/–0) °C for 2 minutes; 25 cycles
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
Low
Temperature
Operation
MIL-R-55342D-Para 4.7.4 At –65 (+0/–5) °C for 1 hour; RCWV applied
for 45 (+5/–0) minutes
±(0.5%+0.05 Ω) for 1% tol .
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
Short Time
Overload
MIL-R-55342D-Para 4.7.5;
IEC 60115-1 4.13
2.5 × RCWV applied for 5 seconds at room
temperature
±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
No visible damage
Insulation
Resistance
MIL-STD-202F-method 302;
IEC 60115-1 4.6.1.1
RCOV for 1 minute
Type RC1206
Voltage (DC) 400 V
≥10 GΩ
Dielectric
Withstand
Voltage
MIL-STD-202F-method 301;
IEC 60115-1 4.6.1.1
Maximun voltage (Vrms) applied for 1 minute
Type RC1206
Voltage (AC) 500 Vrms
No breakdown or flashover
Resistance to
Soldering
Heat
MIL-STD-202F-method 210C;
IEC 60115-1 4.18
Unmounted chips; 260 ±5 °C for 10 ±1
seconds
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
Life MIL-STD-202F-method 108A;
IEC 60115-1 4.25.1
At 70±2 °C for 1,000 hours; RCWV applied for
1.5 hours on and 0.5 hour off
±(1%+0.05 Ω) for 1% tol.
±(3%+0.05 Ω) for 5% tol.
Table 4 Test condition, procedure and requirements
R2–R1
R1(t2–t1)
Product specification
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RC 1206 (Pb Free)
TEST TEST METHOD PROCEDURE REQUIREMENTS
Solderabilit
y
MIL-STD-202F-method 208A;
IEC 60115-1 4.17
Solder bath at 245±3 °C
Dipping time: 2±0.5 seconds
Well tinned (≥95% covered)
No visible damage
Bending
Strength
JIS C 5202.6.14;
IEC 60115-1 4.15
Resistors mounted on a 90 mm glass epoxy
resin PCB (FR4)
Bending: 5 mm
±(1.0%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
Resistance to
Solvent
MIL-STD-202F-method 215;
IEC 60115-1 4.29
lsopropylalcohol (C3H7OH) or dichloromethane
(CH2Cl2) followed by brushing
No smeared
Noise JIS C 5202 5.9;
IEC 60115-1 4.12
Maximum voltage (Vrms) applied. Resistors range
V
alue
R < 100 Ω 10 dB
100 Ω ≤ R < 1 KΩ 20 dB
1 KΩ ≤ R < 10 KΩ 30 dB
10 KΩ ≤ R < 100 KΩ40 dB
100 KΩ ≤ R < 1 MΩ46 dB
1 MΩ ≤ R ≤ 22 MΩ48 dB
Humidit
y
(steady state)
JIS C 5202 7.5;
IEC 60115-8 4.24.8
1,000 hours; 40±2 °C; 93(+2/–3)% RH
RCWV applied for 1.5 hours on and 0.5 hour of
f
±(0.5%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
Leaching EIA/IS 4.13B;
IEC 60115-8 4.18
Solder bath at 260±5 °C
Dipping time: 30±1 seconds
No visible damage
Intermittent
Overload
JIS C 5202 5.8
At room temperature; 2.5 × RCWV applied for
1 second on and 25 seconds off; total 10,000
cycles
±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
Resistance to
Vibration
On request On request
Moisture
Resistance
Heat
MIL-STD-202F-method 106F;
IEC 60115-1 4.24.2
42 cycles; total 1,000 hours
Shown as figure 9
±(0.5%+0.05Ω) for 1% tol.
±(2.0%+0.05Ω) for 5% tol.
No visible damage
Product specification
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Chip Resistor Surface Mount SERIES
RC 1206 (Pb Free)
75
initial drying
24 hours
90 − 98% RH
80 − 98%
RH
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
initial measurements
as specified in 2.2
0
STEP1 STEP3STEP2
prior to first
cycle only
STEP4
one cycle 24 hours; repeat as specified in 2.5
voltage applied as specified in 2.4
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP6 STEP7
HBK073
STEP5
51015
end of final cycle;
measurements
as specified in 2.7
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
20
time [h]
temperature
[°C]
25
50
25
0
90 − 98% RH 90 − 98% RH
+10 °C (+18 °F)
−2 °C (−3.6 °F)
80 − 98%
RH
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
Fig. 9 Moisture resistance test requirements
Product specification
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Chip Resistor Surface Mount SERIES
RC 1206 (Pb Free)
REVISION HISTORY
REVISION DATE CHANGE NOTIFICATION DESCRIPTION
Version 2 Sep 03, 2004 - - New datasheet for 1206 thick film 1% and 5% with lead-free terminations
- Replace the 1206 part of pdf files: RC01_11_21_31_5, RC02_12_22_32_10,
and HRC01_5_4
- Test method and procedure updated
- PE tape added (paper tape will be replaced by PE tape)
- High ohmic products combined into standard products.