1. Product profile
1.1 General description
The TEA1723 is a small and low cost module Switched Mode Power Supply (SMPS)
controller IC for po we r ap p lications (up to 11 W) and operates directly from the rectified
universal mains input. The device includes a high voltage power switch (700 V) and has
been optimize d fo r flyb ac k con ve rte r to po lo gie s to provide high- efficiency over the entire
load range with ultra-low power consumption in the no-load co nditio n. It provide s a circuit
for start-up directly from the rectified mains voltage without any external bleeder circuits.
The converter operates as a regulated voltage source from no-load up to the maximum
output current and operates as current source that delivers the maximum current over a
broad output voltage range. Using the TEA1723, a low power converter can be built at
minimum cost and with the minimum number of external components.
The controller reg ulates the output volt age with primar y-side sensing wh ich eliminates the
need for an additional secondary feedback circ uitry and simplifies the design. At higher
power levels, a frequency and current control mode is used. It operates with burst mode
control at low power levels and no-load condition. The burst mode minimizes audible
noise and provides an energy saver state which reduces the power consumption in
no-load condition. The Burst mode frequency of 1750 Hz enables no-load power
consumption < 53 mW at 230 V (AC) mains input.
1.2 Features and benefits
Power features:
Low power SMPS controller with inte grated power switch designed for applications up
to 11 W
700 V high voltage power switch for global mains operation
Primary sensing for control of the output voltage without optocoupler and secondary
feedback circuitry
Minimizes audible noise in all operation modes
Energy Star 2.0 compliant
Jitter function for reduced EMI
TEA1723FT
HV start-up flyback controller with integrated MOSFET for
11 W applications, 1750 Hz burst frequency
Rev. 2.1 — 7 June 2012 Product data sheet
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 2 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
Green features:
Enables no-load power consumption below < 53 mW
Very low supply current in no-load condition with energy saver mode
Incorporates a high voltage start-up circuit with zero current consumption under
normal switching operation
Available in halogen-free and Restriction of Hazardous Substances (RoHS) SO7
package
Protective functions:
OverVoltage Protection (OVP) on Feedback control (FB) pin with auto-restart
UnderVoltage LockOut (UVLO) protection on IC supply pin
OverTemperature Protection (OTP)
Soft-start by reduced peak current for zero and low output voltage
Demagnetization protection for guaranteed discontinuous conduction mode operation
Open and short- circuit protection of the Fee db a ck con tr ol (FB) pin
Short-circ uit pr ot ec tio n of th e ch arge r ou tp ut
1.3 Applications
Battery chargers for cellular phones, tablet pc and other power adapter s up to 11 W
Standby supply for TV, desktop PC and set-top boxes
Power supply for white goods applications
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Power switch (Pin: DRAIN)
RDSon drain-source
on-state
resistance
Ids = 30 mA; Tj=2C 3.5 4.8 6
Oscillator (Pins: DRAIN and SOURCE)
fburst burst frequency burst frequency in CVB mode,
without jitter 1575 1750 1925 Hz
fosc-high oscillator
frequency High maximum switching frequency
in CV and CC mode, without
jitter
48 50.5 53 kHz
Supply (Pin: VCC)
VCC(startup) start-up supply
voltage 15 17 19 V
VCC(stop) stop supply
voltage undervoltage lockout of IC 7.5 8.5 9.5 V
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 3 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
2. Ordering information
3. Block diagram
3.1 Block diagram
Table 2. Ordering information
Type number Package
Name Description Version
TEA1723FT/N1 SO7 plastic small outline package; 7 leads; body width 3.9 mm SOT1175-1
Fig 1. Block diagram
START
STOP
VCC
FB
GND
REFERENCES
AND
TEMPERATURE
PROTECTION
fosc,
VSOURCE AND
JITTER
REGULATOR
OSCILLATOR
BURST
REGULATOR
CONTROL
LOGIC
SOURCE
DRAIN
SENSOR
start-up source
VSOURCE
comparator
fburst
fSW
VOVP(FBS)
VFBS
OTP
enable
Vref
controller and cable
compensation
demag
driver
power
switch
Vpeak
001aao250
TEA1723
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 4 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
4. Pinning information
4.1 Pinning
4.2 Pin description
5. Functional description
5.1 Start-up
The TEA1723 starts up by charging the VCC capacitor until the VCC(start) level. The
charging current flows from the high voltage DRAIN pin via an internal start-up current
source to the VCC pin.
Once the start level has been reached the start-up current source is switched off. During
switching operation, the start-up current source remains current-less and has zero
bleeder loss.
5.2 Primary sensing
The FB input senses the reflected secondary voltage on the primary side. The FB input
has a sample and hold function that samples the FB voltage on the secondary stroke to
control the output voltage.
The sampled VFBS voltage is the input for the TEA1723 s control loop and defines the
operating mode.
Fig 2. Pinning top view
TEA1723
GND1 DRAIN
GND2
GND3 SOURCE
FB VCC
001aao249
1
2
3
4
6
5
7
Pin Pin name I/O type Pin description
1 GND1 ground
2 GND2 ground
3 GND3 ground
4 FB I feedback input for voltage sensing
5 VCC I supply input
6 SOURCE O source for power switch
7 DRAIN I drain of power switch
- - high voltage spacer
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 5 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
5.3 Operati ng modes
The TEA1723 operates in three modes, one of which is active at the time. The three
modes in order of decreasing load impedance are:
CVB: Constant Voltage with Burst mode
CV: Constant Voltage mode
CC: Constant Current mode
The converter acts as a voltage source in CVB and CV modes.
The converter acts as a current source in CC mode.
5.3.1 Constant Voltage with Burst mode (CVB)
At low power, the TEA1723 operates in Burst mode.
Burst mode operates with a VSOURCE = 100 mV, a switching frequency of 22.5 kHz and
burst duty-cycle regulation by sensing the FB voltage.
The TEA1723 features an energy save function that puts the main part of the analogue
blocks in a sleep mode with low supply current in burst mode. The burst mode enables the
energy save mode in the non-switching part of the burst. The IC switche s to th e nominal
supply just before new burst starts.
Transition from burst mode to CV mode happens at 100 % burst duty cycle: a burst
completely filled with 32 pulses. This 100 % pulse train is identical to the lowest power
level of the CV mode. The TEA1723 changes directly from burst mode to CV mode if the
FB voltage drops below 2.4 V in burst mode.
5.3.2 Constant Voltage mode (CV)
At higher power levels, the TEA1723 operates in CV mode. The outpu t voltage is sensed
by the FB pin and the control keeps the output voltage constant over the power range.
CV mode starts at 22.5 kHz switching frequency and ISOURCE regulation at the VSOURCE
minimum level of 100 mV.
With an increasing power output, the VSOURCE level and the switc hin g freq u en cy ar e als o
increased.
CV mode is exited when the maximum power level is reached. Maximum powe r occurs at
ISOURCE regulation at the VSOURCE maximum level of 555 mV and a maximum switching
frequency of 50.5 kHz.
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 6 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
5.3.3 Constant Current mode (CC)
The CC mode st arts at m aximum power delivery and keep s the output current const ant for
decreasing output voltage.
CC mode is enabled when the converter is operating at the maximum switching
frequency, with the maximum primary peak current when the FB voltage drop s below the
regulated level.
CC mode operation controlled is by regulation of the switching frequency from 50.5 kHz
down to 22.5 kHz and by ISOURCE regulation fro m th e ma xim u m V SOURCE level of 555 mV
until level of VSOURCE is 0.21 V. The VSOURCE level of 0.21 V equals th e level at start-up
with zero output voltage and the output capacitor discharged or on a short-circuit of the
charger output.
5.4 Jitter
The TEA1723 features a jitter function for ElectroMagnetic Interference (EMI) reduction.
The switching frequency is 7 % typical for the spread spectrum. The sweep frequency is a
low frequency of approximately 200 Hz. To keep the output power constan t, the VSOURCE
level is jittered with the opposite polarity. The jitter is active in all operation modes except
burst mode.
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 7 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
6. Limiting values
[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
7. Thermal characteristics
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Tamb ambient temperature -40 +85 °C
Tjjunction temperature -40 +150 °C
Tstg storage temperature -55 +150 °C
VESD electrostatic discharge voltage CDM; all pins -500 +500 V
HBM; all pins, except pin 7 [1] -2000 +2000 V
HBM; pin 7 [1] -1000 +1000 V
Voltages
VDRAIN voltage on pin DRAIN -2 +700 V
VSOURCE voltage on pin SOURCE -0.3 +5 V
VCC voltage on pin VCC -0.3 +35 V
VFB voltage on pin FB -20 +5 V
Currents
IDRAIN current on pin DRAIN -0.1 +1.5 A
ISOURCE current on pin SOURCE -1.5 +0.1 A
Table 4. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance
from junction to
ambient
in free air; SO7 package; on open PCB
of 2.2 cm X 2.2 cm; 2-layer; 70 µm Cu - 136 - K/W
in free air; SO7 package; on open PCB
of 3 cm X 6 cm; 1-layer; 35 µm Cu
operating charger
- 136 - K/W
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 8 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
8. Characteristics
Table 5. Characteristics
VCC = 20 V; VFB = 0 V; Rsource = 0.75 ; Tj-switch = 25 °C; Tj-controller = 25 °C; all voltages referenced to GND,
positive currents flow into the IC, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supply (Pin: VCC)
ICC(startup)0V start-up supply current VCC = 0 V -1.6 -1.2 -0.8 mA
ICC(startup)17V start-up supply current VCC = VCC(startup) -1.6 -0.7 -0.2 mA
ICC(energysave) supply current in
energy save VFB = 2.8 V, non-switching 90 130 1 70 µA
ICC(50kHz) supply current at
50 kHz in CC mode 530 750 970 µA
VCC(startup) start-up supply voltage 15 17 19 V
VCC(stop) stop supply voltage undervoltage lockout of IC 7.5 8.5 9.5 V
Totp overtemperature
protection threshold
temperature on
controller die
-150-°C
Totp(hys) overtemperature
protection temperature
hysteresis
-50C
Feedback (Pin: FB)
Vth(ovp)fbck feedback overvoltage
protection threshold
voltage
3.1 3.2 3.3 V
Vref(fbck) feedback reference
voltage in CV ode 2.5 2.55 2.6 V
Vth(fbck)CV constant voltage mode
feedback threshold
voltage
in burst mode operation 2.35 2.4 2.45 V
Vth(det)demag(fb) demagnetization
detection voltage level
on FB pin
25 50 75 mV
Oscillator (Pins: DRAIN and SOURCE)
fburst burst frequency burst frequency in CVB mode, without
jitter 1575 1750 1935 Hz
fjit/fsw jitter frequency to
switching frequency
ratio
in all operation modes except in CVB
mode 579%
fosc-high oscillator frequency
High maximum switching frequency in CV
and CC mode, without jitter 48 50.5 53 kHz
fosc-low oscillator frequency
Low minimum switching frequency in CV
and CC mode, without jitter. Switching
frequency in CVB mode
21 22.5 24 kHz
fsweep jitter sweep frequency - 200 - Hz
δmax maximum duty cycle 72 75 78 %
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 9 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
Power switch (Pin: DRAIN)
Idrain(off) off-state drain current VDRAIN = 325 V - 1 - µA
RDSon drain-source on-state
resistance Tj=2C; I
ds = 30 mA 3.5 4.8 6
V(BR)DS drain-source
breakdown voltage 700--V
Peak current comparator (Pin: SOURCE)
tPD propagation delay time dV/dt = 0.2 V/µs - 100 - ns
tleb leading edge blanking
time 290 325 360 ns
Vref-peak-high reference voltage, high
peak voltage maximum peak voltage in CV and CC
modes, without jitter 0.525 0.555 0.585 V
Vref-peak-low reference voltage, low
peak voltage in CVB mode 0.085 0.1 0.115 V
Vref-0 V reference voltage at
start-up or 0 V
feedback voltage
in CC mode with VFBS = 0 V 0.18 0.21 0.24 V
Table 5. Characteristics …continued
VCC = 20 V; VFB = 0 V; Rsource = 0.75 ; Tj-switch = 25 °C; Tj-controller = 25 °C; all voltages referenced to GND,
positive currents flow into the IC, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 10 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
9. Package outline
Fig 3. Package outline SOT1175-1 (SO7)
References
Outline
version European
projection Issue date
IEC JEDEC JEITA
SOT1175-1 - - -
- - -
- - -
sot1175-1_po
10-03-30
10-04-21
Unit
mm max
nom
min
1.75 0.250
0.175
0.100 0.25 0.49
0.40
0.36
5.0
4.9
4.8
A
Dimensions
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
A1A2
1.45
1.35
1.25
A3bp
1.0
0.7
0.4
0.70
0.67
0.60 0.25
LpQvc
0.25
0.20
0.19
DE
4.0
3.9
3.8
e
1.27 1.05
6.2
6.0
5.8
HEL
0.1
0.7
0.5
0.3
8°
4°
0°
yZθ
0.25
w
2.50 5 mm
scale
SO7: plastic small outline package; 7 leads; body width 3.9 mm SOT1175-1
y
D
A1
A2
Q
A
A3
θ
detail X
Lp
L
X
EA
HEvA
c
pin 1 index
Z
ebpw
41
75
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 11 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
10. Revision history
Table 6. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TEA1723FT v.2.1 20120607 Product data sheet - TEA1723FT v.2
Modifications: Symbo l td(OCP) changed to tPD in table 5 on page 8.
Data sheet title changed.
TEA1723FT v.2 20120508 Product data sheet - TEA1723FT v.1
TEA1723FT v.1 20120127 Preliminary data sheet - -
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 12 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
11. Legal information
11.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. Th e latest product
status information is available on the Internet at URLhttp://www.nxp.com.
11.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modificati ons or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of informati on included herein and shall have
no liability for the consequences of use of such info rmation.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract fr om a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and dat a provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with theTerms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersed es an d r eplaces all inf ormation supplied pri or
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Quick reference dataThe Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associate d with t heir
applications and products.
NXP Semiconductors does not accept any liabil ity related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by cu stomer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — St ress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress rating s only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Document status[1] [2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specif ication for product development.
Preliminary [shor t] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
TEA1723FT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 7 June 2012 13 of 14
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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agreed in a valid written individual agreement. In case an individual
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may b e interpreted or
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Export control — This document as well as the item(s) descri bed herein may
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors prod uct is automotive qualified,
the product is not suitable for automotive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
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non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
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11.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G
reenChip,HiPerSmart,HITAG,I²C-bus
logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE
Ultralight,MoReUse,QLPAK,Silicon
Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia
andUCODE — are trademarks of NXP B.V.
HD Radio andHD Radio logo — are trademarks of iBiquity Digital
Corporation.
12. Contact information
For more information, please visit:http://www.nxp.com
For sales office addresses, please send an email to:salesaddresses@nxp.com
NXP Semiconductors TEA1723FT
HV start-up flyback controller with integrated MOSFET for 11 W
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 7 June 2012
Document iden tifier: TEA1723FT
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
13. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .2
2 Ordering information. . . . . . . . . . . . . . . . . . . . . .3
3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .3
3.1 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . .3
4 Pinning information. . . . . . . . . . . . . . . . . . . . . . .4
4.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
4.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
5.1 Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
5.2 Primary sensing . . . . . . . . . . . . . . . . . . . . . . . . .4
5.3 Operating modes . . . . . . . . . . . . . . . . . . . . . . . .5
5.4 Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
5.3.1 Constant Voltage with Burst mode (CVB). . . . . .5
5.3.2 Constant Voltage mode (CV) . . . . . . . . . . . . . . .5
5.3.3 Constant Current mode (CC) . . . . . . . . . . . . . . .6
6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .7
7 Thermal characteristics . . . . . . . . . . . . . . . . . . .7
8 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11
11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12
11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
12 Contact information. . . . . . . . . . . . . . . . . . . . . .1 3