General Description
The MAX19995A dual-channel downconverter is
designed to provide 8.7dB of conversion gain,
+24.8dBm input IP3, +13.5dBm 1dB input compression
point, and a noise figure of 9.2dB for 1700MHz to
2200MHz diversity receiver applications. With an opti-
mized LO frequency range of 1750MHz to 2700MHz, this
mixer is ideal for high-side LO injection architectures.
Low-side LO injection is supported by the MAX19995,
which is pin-pin and functionally compatible with the
MAX19995A.
In addition to offering excellent linearity and noise per-
formance, the MAX19995A also yields a high level of
component integration. This device includes two double-
balanced passive mixer cores, two LO buffers, a dual-
input LO selectable switch, and a pair of differential IF
output amplifiers. Integrated on-chip baluns allow for sin-
gle-ended RF and LO inputs. The MAX19995A requires a
nominal LO drive of 0dBm and a typical supply current of
350mA at VCC = 5.0V, or 242mA at VCC = 3.3V.
The MAX19995/MAX19995A are pin compatible with the
MAX19985/MAX19985A series of 700MHz to 1000MHz
mixers and pin similar to the MAX19997A/MAX19999
series of 1800MHz to 4000MHz mixers, making this
entire family of downconverters ideal for applications
where a common PCB layout is used across multiple
frequency bands.
The MAX19995A is available in a 6mm x 6mm, 36-pin
thin QFN package with an exposed pad. Electrical per-
formance is guaranteed over the extended temperature
range (TC= -40°C to +85°C).
Applications
UMTS/WCDMA Base Stations
LTE/WiMAX™Base Stations
TD-SCDMA Base Stations
DCS1800/PCS1900 and GSM/EDGE Base
Stations
cdma2000®Base Stations
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Features
♦1700MHz to 2200MHz RF Frequency Range
♦1750MHz to 2700MHz LO Frequency Range
♦50MHz to 500MHz IF Frequency Range
♦8.7dB Typical Conversion Gain
♦9.2dB Typical Noise Figure
♦+24.8dBm Typical Input IP3
♦+13.5dBm Typical Input 1dB Compression Point
♦64dBc Typical 2LO-2RF Spurious Rejection at
PRF = -10dBm
♦Dual Channels Ideal for Diversity Receiver
Applications
♦48dB Typical Channel-to-Channel Isolation
♦Low -3dBm to +3dBm LO Drive
♦Integrated LO Buffer
♦Internal RF and LO Baluns for Single-Ended
Inputs
♦Built-In SPDT LO Switch with 48dB LO-to-LO
Isolation and 50ns Switching Time
♦Pin Compatible with the MAX19985/MAX19985A/
MAX19995 Series of 700MHz to 2200MHz Mixers
♦Pin Similar to the MAX19997A/MAX19999 Series
of 1800MHz to 4000MHz Mixers
♦Single 5.0V or 3.3V Supply
♦External Current-Setting Resistors Provide Option
for Operating Device in Reduced-Power/Reduced-
Performance Mode
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
19-4419; Rev 0; 1/09
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
*
EP = Exposed pad.
T = Tape and reel.
WiMAX is a trademark of WiMAX Forum.
cdma2000 is a registered trademark of Telecommunications
Industry Association.
PART TEMP RANGE PIN-PACKAGE
MAX19995AETX+
-40°C to +85°C 36 Thin QFN-EP*
MAX19995AETX+T
-40°C to +85°C 36 Thin QFN-EP*
Pin Configuration/Functional Diagram appears at end of
data sheet.
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, VCC = 4.75V to 5.25V, no input AC signals. TC= -40°C to +85°C, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ.
Typical values are at VCC = 5.0V, TC= +25°C, unless otherwise noted. All parameters are production tested.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Based on junction temperature TJ= TC+ (θJC x VCC x ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature TJ= TA+ (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: TCis the temperature on the exposed pad of the package. TAis the ambient temperature of the device and PCB.
VCC to GND...........................................................-0.3V to +5.5V
LO1, LO2 to GND ..................................................-0.3V to +0.3V
LOSEL to GND ...........................................-0.3V to (VCC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm
RFMAIN, RFDIV Current (RF is DC shorted to GND
through a balun)..............................................................50mA
Continuous Power Dissipation (Note 1) ...............................8.7W
θJA (Notes 2, 3)..............................................................+38°C/W
θJC (Notes 1, 3)...............................................................7.4°C/W
Operating Case Temperature Range (Note 4) ....-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 4.75 5 5.25 V
Supply Current ICC Total supply current, VCC = 5.0V 350 410 mA
LOSEL Input High Voltage VIH 2V
LOSEL Input Low Voltage VIL 0.8 V
LOSEL Input Current IIH and IIL -10 +10 µA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, VCC = 3.0V to 3.6V, no input AC signals. TC= -40°C to +85°C, R1 = R4 = 909Ω, R2 = R5 = 1kΩ. Typical
values are at VCC = 3.3V, TC= +25°C, unless otherwise noted. Parameters are guaranteed by design and not production tested.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 3.0 3.3 3.6 V
Supply Current ICC Total supply current 242 300 mA
LOSEL Input High Voltage VIH 2V
LOSEL Input Low Voltage VIL 0.8 V
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 3
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency fRF (Note 5) 1700 2200 MHz
LO Frequency fLO (Note 5) 1750 2700 MHz
U si ng M i ni - C i r cui ts TC 4- 1W- 17 4:1
tr ansfor m er as d efi ned i n the Typ i cal
Ap p l i cati on C i r cui t, IF m atchi ng com p onents
affect the IF fr eq uency r ang e ( N ote 5)
100 500
IF Frequency fIF U si ng al ter nati ve M i ni - C i r cui ts TC 4- 1W- 7A
4:1 tr ansfor m er as d efi ned i n the Typ i cal
Ap p l i cati on C i r cui t, IF m atchi ng com p onents
affect the IF fr eq uency r ang e ( N ote 5)
50 250
MHz
LO Drive Level PLO -3 +3 dBm
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
6.5 8.7 10.4
TC = +25°C (Note 7) 7.1 8.7 9.9
Conversion Gain GC
TC = +25°C, fRF = 1850MHz (Note 8) 7.7 8.7 9.7
dB
Flatness over any one of three frequency
bands:
fRF = 1710MHz to 1785MHz
+0.07
fRF = 1850MHz to 1910MHz -0.03
Conversion Gain Flatness ΔGC
fRF = 1920MHz to 1980MHz -0.13
dB
Gain Variation Over Temperature TCCG
fRF = 1700MHz to 2000MHz,
fLO = 2050MHz to 2350MHz,
TC = -40°C to +85°C
-0.011 dB/°C
Input Compression Point IP1dB fRF = 1850MHz (Notes 7, 9) 9.5 13.5 dBm
fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone 21.5 24.8
Input Third-Order Intercept Point IIP3 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone,
TC = +25°C 22 24.8 dBm
Input Third-Order Intercept Point
Variation Over Temperature TCIIP3 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone,
TC = -40°C to +85°C 0.006 dBm/°C
Single sideband, no blockers present 9.2 11.1
Noise Figure (Note 10) NFSSB fRF
= 1850M H z, fLO = 2200M H z, TC
= + 25° C ,
PLO = 0dBm, single sideband, no blockers
present
9.2 9.8 dB
Noise Figure Temperature
Coefficient TCNF Single sideband, no blockers present,
TC = -40°C to +85°C 0.016 dB/°C
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50Ωsources,
PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2000MHz, fLO = 2050MHz to 2350MHz, fIF = 350MHz, fRF < fLO, TC= -40°C
to +85°C. Typical values are at VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC= +25°C.
All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 6)
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
4 _______________________________________________________________________________________
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Noise Figure with Blocker NF
B
P
BLOCKER
= +8dBm, f
RF
= 1850MHz,
f
LO
= 2200MHz, f
BLOCKER
= 1725MHz,
P
LO
= 0dBm, V
CC
= 5.0V, T
C
= +25°C
(Notes 10, 11)
19.7 23.4 dB
P
RF
= -10dBm 54 64
f
RF
= 1850MHz,
f
LO
= 2200MHz,
f
SPUR
= 2025MHz P
RF
= -5dBm 49 59
P
RF
= -10dBm 57 64
2LO-2RF Spur Rejection
(Note 10) 2 x 2 f
RF
= 1850MHz,
f
LO
= 2200MHz,
f
SPUR
= 2025MHz,
P
LO
= 0dBm, V
CC
= 5.0V,
T
C
= +25°C P
RF
= -5dBm 52 59
dBc
P
RF
= -10dBm 70 80
f
RF
= 1850MHz,
f
LO
= 2200MHz,
f
SPUR
= 2083.33MHz P
RF
= -5dBm 60 70
P
RF
= -10dBm 71 80
3LO-3RF Spur Rejection
(Note 10) 3 x 3 f
RF
= 1850MHz,
f
LO
= 2200MHz,
f
SPUR
= 2083.33MHz,
P
LO
= 0dBm, V
CC
= 5.0V,
T
C
= +25°C P
RF
= -5dBm 61 70
dBc
RF Input Return Loss LO and IF terminated into matched
impedance, LO on 21 dB
LO port selected, RF and IF terminated into
matched impedance 20
LO Input Return Loss LO port unselected, RF and IF terminated
into matched impedance 22
dB
IF Output Impedance Z
IF
Nominal differential impedance of the IF
outputs 200 Ω
IF Output Return Loss
RF terminated into 50Ω, LO driven by 50Ω
source, IF transformed to 50Ω using
external components shown in the Typical
Application Circuit
11.5 dB
RF-to-IF Isolation (Note 8) 31 35 dB
LO Leakage at RF Port (Note 8) -35 -25 dBm
2LO Leakage at RF Port (Note 8) -17.5 -14 dBm
LO Leakage at IF Port (Note 8) -32 -22 dBm
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50Ωsources,
PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2000MHz, fLO = 2050MHz to 2350MHz, fIF = 350MHz, fRF < fLO, TC= -40°C
to +85°C. Typical values are at VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC= +25°C.
All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 6)
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 5
3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, R1 = R4 = 909Ω, R2 = R5 = 1kΩ. Typical values are at VCC = 3.3V, PRF = -5dBm, PLO = 0dBm,
fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.) (Note 6)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Conversion Gain GC(Note 8) 8.4 dB
Flatness over any one of three frequency
bands:
fRF = 1710MHz to 1785MHz
+0.07
fRF = 1850MHz to 1910MHz -0.03
Conversion Gain Flatness ΔGC
fRF = 1920MHz to 1980MHz -0.13
dB
Gain Variation Over Temperature TCCG TC = -40°C to +85°C -0.013 dB/°C
Input Compression Point IP1dB (Note 9) 10.2 dBm
Input Third-Order Intercept Point IIP3 fRF1 - fRF2 = 1MHz 22.5 dBm
Input Third-Order Intercept Point
Variation Over Temperature TCIIP3 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone,
TC = -40°C to +85°C 0.0017 dBm/°C
Noise Figure NFSSB Single sideband, no blockers present 9 dB
Noise Figure Temperature
Coefficient TCNF Single sideband, no blockers present,
TC = -40°C to +85°C 0.016 dB/°C
PRF = -10dBm 65
2LO-2RF Spur Rejection 2 x 2 PRF = -5dBm 60 dBc
PRF = -10dBm 77
3LO-3RF Spur Rejection 3 x 3 PRF = -5dBm 67 dBc
RF Input Return Loss LO and IF terminated into matched
impedance, LO on 25 dB
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RFMAIN converted power measured at
IFDIV relative to IFMAIN, all unused ports
terminated to 50Ω
40 48
Channel Isolation (Note 7) RFDIV converted power measured at
IFMAIN relative to IFDIV, all unused ports
terminated to 50Ω
40 48
dB
LO-to-LO Isolation PLO1 = +3dBm, PLO2 = +3dBm,
fLO1 = 2200MHz, fLO2 = 2201MHz (Note 7) 40 48 dB
LO Switching Time 50% of LOSEL to IF settled within
2 degrees 50 ns
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50Ωsources,
PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2000MHz, fLO = 2050MHz to 2350MHz, fIF = 350MHz, fRF < fLO, TC= -40°C
to +85°C. Typical values are at VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC= +25°C.
All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 6)
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
6 _______________________________________________________________________________________
3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(
Typical Application Circuit
, R1 = R4 = 909Ω, R2 = R5 = 1kΩ. Typical values are at VCC = 3.3V, PRF = -5dBm, PLO = 0dBm,
fRF = 1850MHz, fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.) (Note 6)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
LO port selected, RF and IF terminated into
matched impedance 22
LO Input Return Loss LO port unselected, RF and IF terminated
into matched impedance 16
dB
IF Output Return Loss
RF terminated into 50Ω, LO driven by 50Ω
source, IF transformed to 50Ω using
external components shown in the Typical
Application Circuit
11.5 dB
RF-to-IF Isolation 36 dB
LO Leakage at RF Port -40 dBm
2LO Leakage at RF Port -23 dBm
LO Leakage at IF Port -37 dBm
RFMAIN converted power measured at
IFDIV relative to IFMAIN, all unused ports
terminated to 50Ω
48
Channel Isolation RFDIV converted power measured at
IFMAIN relative to IFDIV, all unused ports
terminated to 50Ω
48
dB
LO-to-LO Isolation PLO1 = +3dBm, PLO2 = +3dBm,
fLO1 = 2200MHz, fLO2 = 2201MHz 47 dB
LO Switching Time 50% of LOSEL to IF settled within 2 degrees 50 ns
Note 5: Not production tested. Operation outside this range is possible, but with degraded performance of some parameters.
See the
Typical Operating Characteristics
.
Note 6: All limits reflect losses of external components, including a 0.9dB loss at fIF = 350MHz due to the 4:1 transformer. Output
measurements were taken at IF outputs of the
Typical Application Circuit
.
Note 7: 100% production tested.
Note 8: 100% production tested for functionality.
Note 9: Maximum reliable continuous input power applied to the RF or IF port of this device is +12dBm from a 50Ωsource.
Note 10: Not production tested.
Note 11: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of
all SNR degradations in the mixer, including the LO noise as defined in Application Note 2021:
Specifications and
Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers
.
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 7
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc01
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
7
8
9
10
6
1700 2200
TC = -30°C
TC = +25°C
TC = +85°C
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc02
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
7
8
9
10
6
1700 2200
PLO = -3dBm, 0dBm, +3dBm
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc03
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
7
8
9
10
6
1700 2200
VCC = 4.75V, 5.0V, 5.25V
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc04
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
2100200019001800
23
24
25
26
22
1700 2200
TC = +85°CPRF = -5dBm/TONE
TC = +25°C
TC = -30°C
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc05
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
2100200019001800
23
24
25
26
22
1700 2200
PLO = 0dBm PLO = -3dBm
PLO = +3dBm PRF = -5dBm/TONE
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc06
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
2100200019001800
23
24
25
26
22
1700 2200
PRF = -5dBm/TONE
VCC = 4.75V
VCC = 5.25V
VCC = 5.0V
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc07
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
2100200019001800
7
8
11
9
12
10
6
1700 2200
TC = -30°C
TC = +25°C
TC = +85°C
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc08
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
2100200019001800
7
8
11
9
12
10
6
1700 2200
PLO = -3dBm, 0dBm, +3dBm
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc09
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
2100200019001800
7
8
11
9
12
10
6
1700 2200
VCC = 4.75V, 5.0V, 5.25V
Typical Operating Characteristics
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
_______________________________________________________________________________________ 7
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
8 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc10
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
2100200019001800
50
70
60
80
90
40
1700 2200
TC = -30°CTC = +25°C
TC = +85°C
PRF = -5dBm
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc11
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
2100200019001800
50
70
60
80
90
40
1700 2200
PRF = -5dBm
PLO = 0dBmPLO = -3dBm
PLO = +3dBm
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc12
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
2100200019001800
50
70
60
80
90
40
1700 2200
PRF = -5dBm
VCC = 4.75V, 5.0V, 5.25V
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc13
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
2100200019001800
75
65
85
55
1700 2200
TC = -30°C
TC = +25°C
TC = +85°C
PRF = -5dBm
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc14
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
2100200019001800
75
65
85
55
1700 2200
PRF = -5dBm
PLO = -3dBm, 0dBm, +3dBm
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc15
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
2100200019001800
75
65
85
55
1700 2200
PRF = -5dBm
VCC = 4.75V
VCC = 5.25V
VCC = 5.0V
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc16
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
2100200019001800
12
14
13
15
16
11
1700 2200
TC = -30°C
TC = +25°C
TC = +85°C
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc17
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
2100200019001800
12
14
13
15
16
11
1700 2200
PLO = -3dBm, 0dBm, +3dBm
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc18
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
2100200019001800
12
14
13
15
16
11
1700 2200
VCC = 4.75V
VCC = 5.25V
VCC = 5.0V
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 9
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc19
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
2100200019001800
45
50
55
40
1700 2200
TC = -30°C, +25°C, +85°C
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc20
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
2100200019001800
45
50
55
40
1700 2200
PLO = -3dBm, 0dBm, +3dBm
CHANNEL ISOLATION vs. RF FREQUENCY
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
2100200019001800
45
50
55
40
1700 2200
VCC = 4.75V, 5.0V, 5.25V
MAX19995A toc21
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
2450 2550235022502150
-30
-35
-25
-20
-40
2050
MAX19995A toc22
TC = -30°C
TC = +25°C
TC = +85°C
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
2450 2550235022502150
-30
-35
-25
-20
-40
2050
MAX19995A toc23
PLO = -3dBm, 0dBm, +3dBm
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
2450 2550235022502150
-30
-35
-25
-20
-40
2050
MAX19995A toc24
VCC = 4.75V
VCC = 5.25V VCC = 5.0V
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
2100 2200200019001800
35
40
45
30
1700
MAX19995A toc25
TC = -30°C
TC = +25°C
TC = +85°C
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
2100 2200200019001800
35
40
45
30
1700
PLO = -3dBm, 0dBm, +3dBm
MAX19995A toc26
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
2100 2200200019001800
35
40
45
30
1700
MAX19995A toc27
VCC = 4.75V, 5.0V, 5.25V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
_______________________________________________________________________________________ 9
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
10 ______________________________________________________________________________________
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
2550 2750235021501950
-40
-30
-20
-50
1750
MAX19995A toc28
TC = -30°C
TC = +25°C
TC = +85°C
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
2550 2750235021501950
-40
-30
-20
-50
1750
MAX19995A toc29
PLO = 0dBm
PLO = -3dBm
PLO = +3dBm
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
2550 2750235021501950
-40
-30
-20
-50
1750
MAX19995A toc30
VCC = 4.75V, 5.0V, 5.25V
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
2550 2750235021501950
-40
-20
-30
-10
-50
1750
MAX19995A toc31
TC = -30°C
TC = +25°C
TC = +85°C
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
2550 2750235021501950
-40
-20
-30
-10
-50
1750
MAX19995A toc32
PLO = 0dBm
PLO = -3dBm
PLO = +3dBm
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
2550 2750235021501950
-40
-20
-30
-10
-50
1750
MAX19995A toc33
VCC = 4.75V, 5.0V, 5.25V
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
2550 2750235021501950
40
50
60
30
1750
MAX19995A toc34
TC = -30°C
TC = +25°C
TC = +85°C
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
2550 2750235021501950
40
50
60
30
1750
MAX19995A toc35
PLO = -3dBm, 0dBm, +3dBm
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
2550 2750235021501950
40
50
60
30
1750
MAX19995A toc36
VCC = 4.75V, 5.0V, 5.25V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 11
RF PORT RETURN LOSS
vs. RF FREQUENCY
RF FREQUENCY (MHz)
RF PORT RETURN LOSS (dB)
2100 2200200019001800
20
10
0
30
15
5
25
1700
MAX19995A toc37
PLO = -3dBm, 0dBm, +3dBm
fIF = 350MHz
IF PORT RETURN LOSS
vs. IF FREQUENCY
IF FREQUENCY (MHz)
IF PORT RETURN LOSS (dB)
410 500320230140
10
0
20
15
5
50
MAX19995A toc38
L = 120nH
L = 330nH
L = 470nH
L = L1, L2, L4, L5 fLO = 2300MHz
VCC = 4.75V, 5.0V, 5.25V
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO SELECTED RETURN LOSS (dB)
2550 2750235021501950
20
10
0
30
15
5
25
1750
MAX19995A toc39
PLO = -3dBm, 0dBm, +3dBm
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS (dB)
2550 2750235021501950
20
10
0
30
15
5
25
1750
MAX19995A toc40
PLO = -3dBm, 0dBm, +3dBm
SUPPLY CURRENT vs. TEMPERATURE (TC)
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
65 8525 455-15
340
360
400
300
380
320
-35
MAX19995A toc41
VCC = 4.75V
VCC = 5.25V
VCC = 5.0V
CONVERSION GAIN vs. RF FREQUENCY
(VARIOUS VALUES OF L3 AND L6)
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
22002000 210019001800
8
9
11
6
10
7
1700
MAX19995A toc42
0Ω, 3.6nH, 6.8nH, 10nH
INPUT IP3 vs. RF FREQUENCY
(VARIOUS VALUES OF L3 AND L6)
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
22002000 210019001800
24
26
22
25
23
1700
MAX19995A toc43
0Ω, 3.6nH, 6.8nH, 10nH
PRF = -5dBm/TONE
2LO-2RF RESPONSE vs. RF FREQUENCY
(VARIOUS VALUES OF L3 AND L6)
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
22002000 210019001800
70
90
40
80
60
50
1700
MAX19995A toc44
0Ω
3.6nH
6.8nH, 10nH
PRF = -5dBm
3LO-3RF RESPONSE vs. RF FREQUENCY
(VARIOUS VALUES OF L3 AND L6)
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
22002000 210019001800
65
85
55
75
1700
MAX19995A toc45
0Ω, 3.6nH, 6.8nH, 10nH
PRF = -5dBm
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
12 ______________________________________________________________________________________
CHANNEL ISOLATION vs. RF FREQUENCY
(VARIOUS VALUES OF L3 AND L6)
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
22002000 210019001800
45
55
40
50
1700
MAX19995A toc46
10nH
6.8nH
3.6nH
0Ω
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
(VARIOUS VALUES OF L3 AND L6)
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
25502350 245022502150
-50
-40
-20
-60
-30
2050
MAX19995A toc47
10nH
6.8nH
3.6nH
0Ω
RF-TO-IF ISOLATION vs. RF FREQUENCY
(VARIOUS VALUES OF L3 AND L6)
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
22002000 210019001800
20
30
50
10
40
1700
MAX19995A toc48
10nH
6.8nH
3.6nH
0Ω
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 681Ω, R2 = R5 = 1.5kΩ, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 13
10
9
8
7
6
1700 19001800 2000 2100 2200
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc49
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
TC = -30°C
TC = +85°C
TC = +25°C
VCC = 3.3V
10
9
8
7
6
1700 19001800 2000 2100 2200
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc50
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
PLO = -3dBm, 0dBm, +3dBm
VCC = 3.3V
6
8
7
10
9
11
12
1700 2200
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc55
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
19001800 2000 2100
TC = +85°C
TC = +25°C
TC = -30°C
VCC = 3.3V
6
8
7
10
9
11
12
1700 2200
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc56
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
19001800 2000 2100
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
6
8
7
10
9
11
12
1700 2200
NOISE FIGURE vs. RF FREQUENCY
MAX19995A toc57
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
19001800 2000 2100
VCC = 3.0V, 3.3V, 3.6V
10
9
8
7
6
1700 19001800 2000 2100 2200
CONVERSION GAIN vs. RF FREQUENCY
MAX19995A toc51
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
VCC = 3.0V VCC = 3.3V
VCC = 3.6V
18
20
19
22
21
23
24
1700 2200
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc52
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
19001800 2000 2100
PRF = -5dBm/TONE
TC = -30°C
TC = +85°C
TC = +25°C
VCC = 3.3V
18
20
19
22
21
23
24
1700 2200
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc53
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
19001800 2000 2100
PRF = -5dBm/TONE
PLO = -3dBm PLO = 0dBm
PLO = +3dBm
VCC = 3.3V
18
20
19
22
21
23
24
1700 2200
INPUT IP3 vs. RF FREQUENCY
MAX19995A toc54
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
19001800 2000 2100
PRF = -5dBm/TONE
VCC = 3.6V
VCC = 3.3V
VCC = 3.0V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 909Ω, R2 = R5 = 1kΩ, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 909Ω, R2 = R5 = 1kΩ, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
14 ______________________________________________________________________________________
80
70
60
50
40
1700 19001800 2000 2100 2200
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc60
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
PRF = -5dBm
VCC = 3.0V, 3.3V, 3.6V
80
70
60
50
1700 19001800 2000 2100 2200
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc61
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
PRF = -5dBm
TC = -30°C
TC = +85°C
TC = +25°C
VCC = 3.3V
80
70
60
50
1700 19001800 2000 2100 2200
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc62
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
PRF = -5dBm
PLO = -3dBm
PLO = +3dBm
PLO = 0dBm
VCC = 3.3V
80
70
60
50
1700 19001800 2000 2100 2200
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX19995A toc63
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
PRF = -5dBm
VCC = 3.3V
VCC = 3.0V
VCC = 3.6V
12
11
10
9
8
1700 19001800 2000 2100 2200
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc64
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
TC = -30°C
TC = +85°C
TC = +25°C
VCC = 3.3V
12
11
10
9
8
1700 19001800 2000 2100 2200
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc65
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
VCC = 3.3V
PLO = -3dBm
PLO = 0dBm, +3dBm
12
11
10
9
8
1700 19001800 2000 2100 2200
INPUT P1dB vs. RF FREQUENCY
MAX19995A toc66
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
VCC = 3.3V
VCC = 3.0V
VCC = 3.6V
80
70
60
50
40
1700 19001800 2000 2100 2200
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc58
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
TC = -30°C
TC = +85°C
TC = +25°C
PRF = -5dBm
VCC = 3.3V
80
70
60
50
40
1700 19001800 2000 2100 2200
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX19995A toc59
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
PRF = -5dBm
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 15
55
50
45
40
1700 19001800 2000 2100 2200
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc69
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
VCC = 3.0V, 3.3V, 3.6V
-30
-35
-40
-45
-50
2050 22502150 2350 2450 2550
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19995A toc70
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
TC = -30°C
TC = +85°C
TC = +25°C
VCC = 3.3V
-30
-35
-40
-45
-50
2050 22502150 2350 2450 2550
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19995A toc71
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19995A toc72
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
235022502150 2450
-45
-40
-35
-30
-50
2050 2550
VCC = 3.3V
VCC = 3.0V
VCC = 3.6V
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX19995A toc73
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
200019001800 2100
35
40
45
30
1700 2200
TC = +85°C
TC = +25°C
TC = -30°C
VCC = 3.3V
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX19995A toc74
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
200019001800 2100
35
40
45
30
1700 2200
PLO = -3dBm, 0dBm, +3dBm
VCC = 3.3V
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX19995A toc75
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
200019001800 2100
35
40
45
30
1700 2200
VCC = 3.0V, 3.3V, 3.6V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 909Ω, R2 = R5 = 1kΩ, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
55
50
45
40
1700 19001800 2000 2100 2200
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc67
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
VCC = 3.3V
TC = -30°C, +25°C, +85°C
55
50
45
40
1700 19001800 2000 2100 2200
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19995A toc68
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
16 ______________________________________________________________________________________
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19995A toc78
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
235021501950 2550
-50
-40
-30
-60
1750 2750
VCC = 3.3V
VCC = 3.0V
VCC = 3.6V
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19995A toc79
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
235021501950 2550
-40
-30
-20
-10
-50
1750 2750
TC = +85°C
TC = +25°C
TC = -30°C
VCC = 3.3V
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19995A toc80
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
235021501950 2550
-40
-30
-20
-10
-50
1750 2750
PLO = +3dBm
PLO = 0dBm
PLO = -3dBm
VCC = 3.3V
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19995A toc81
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
235021501950 2550
-40
-30
-20
-10
-50
1750 2750
VCC = 3.3V
VCC = 3.0V
VCC = 3.6V
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX19995A toc82
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
235021501950 2550
40
50
60
30
1750 2750
TC = +85°CTC = +25°C
TC = -30°C
VCC = 3.3V
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX19995A toc83
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
235021501950 2550
40
50
60
30
1750 2750
PLO = -3dBm, 0dBm, +3dBm
VCC = 3.3V
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX19995A toc84
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
235021501950 2550
40
50
60
30
1750 2750
VCC = 3.0V, 3.3V, 3.6V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 909Ω, R2 = R5 = 1kΩ, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19995A toc76
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
235021501950 2550
-50
-40
-30
-60
1750 2750
TC = +85°C
TC = +25°C
TC = -30°CVCC = 3.3V
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19995A toc77
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
235021501950 2550
-50
-40
-30
-60
1750 2750
PLO = -3dBm, 0dBm, +3dBm
VCC = 3.3V
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 17
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
MAX19995A toc87
LO FREQUENCY (MHz)
LO SELECTED RETURN LOSS (dB)
235021501950 2550
20
10
0
30
15
5
25
1750 2750
PLO = -3dBm, 0dBm, +3dBm
VCC = 3.3V
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
MAX19995A toc88
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS (dB)
235021501950 2550
20
10
0
30
15
5
25
1750 2750
PLO = -3dBm, 0dBm, +3dBm
VCC = 3.3V
SUPPLY CURRENT vs. TEMPERATURE (TC)
MAX19995A toc89
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
-15 6525 455
200
220
240
260
280
180
-35 85
VCC = 3.3V
VCC = 3.0V
VCC = 3.6V
RF PORT RETURN LOSS
vs. RF FREQUENCY
MAX19995A toc85
RF FREQUENCY (MHz)
RF PORT RETURN LOSS (dB)
200019001800 2100
20
10
0
30
15
5
25
1700 2200
PLO = -3dBm, 0dBm, +3dBm
fIF = 350MHz
VCC = 3.3V
IF PORT RETURN LOSS
vs. IF FREQUENCY
MAX19995A toc86
IF FREQUENCY (MHz)
IF PORT RETURN LOSS (dB)
320230140 410
5
0
20
10
15
50 500
L = L1, L2, L4, L5 fLO = 2300MHz
VCC = 3.3V
L = 120nH
L = 470nH
L = 330nH
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, R1 = R4 = 909Ω, R2 = R5 = 1kΩ, VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1850MHz,
fLO = 2200MHz, fIF = 350MHz, TC= +25°C, unless otherwise noted.)
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
18 ______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1 RFMAIN Main Channel RF input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
2 TAPMAIN Main Channel Balun Center Tap. Bypass to GND with 39pF and 0.033µF capacitors as close as
possible to the pin with the smaller value capacitor closer to the part.
3, 5, 7, 12,
20, 22, 24,
25, 26, 34
GND Ground
4, 6, 10, 16,
21, 30, 36 VCC Power Supply. Bypass to GND with capacitors as shown in the Typical Application Circuit as close as
possible to the pin.
8 TAPDIV Diversity Channel Balun Center Tap. Bypass to GND with 39pF and 0.033µF capacitors as close as
possible to the pin with the smaller value capacitor closer to the part.
9 RFDIV Diversity Channel RF input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
11 IFD_SET
IF Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for
the diversity IF amplifier (see the Typical Operating Characteristics for typical performance vs.
resistor value).
13, 14 IFD+, IFD- Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see
the Typical Application Circuit).
15 IND_EXTD
Diversity External Inductor Connection. Connect this pin to ground. For improved RF-to-IF and LO-to-
IF isolation, connect a low-ESR 10nH inductor from this pin to ground (see the Typical Operating
Characteristics for typical performance vs. inductor value).
17 LO_ADJ_D
LO Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current
for the diversity LO amplifier (see the Typical Operating Characteristics for typical performance vs.
resistor value).
18, 28 N.C. No Connection. Not internally connected.
19 LO1 Local Osci l l ator 1 Inp ut. Thi s i np ut i s i nter nal l y m atched to 50Ω . Req ui r es an i np ut D C - b l ocki ng cap aci tor .
23 LOSEL Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2.
27 LO2 Local Osci l l ator 2 Inp ut. Thi s i np ut i s i nter nal l y m atched to 50Ω . Req ui r es an i np ut D C - b l ocki ng cap aci tor .
29 LO_ADJ_M LO M ai n Am p l i fi er Bi as C ontr ol . C onnect a r esi stor fr om thi s p i n to g r ound to set the b i as cur r ent for the
m ai n LO am p l i fi er ( see the Typical Operating Characteristics for typ i cal p er for m ance vs. r esi stor val ue) .
31 IND_EXTM
Main External Inductor Connection. Connect this pin to ground. For improved RF-to-IF and LO-to-IF
isolation, connect a low-ESR 10nH inductor from this pin to ground (see the Typical Operating
Characteristics for typical performance vs. inductor value).
32, 33 IFM-, IFM+ Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the
Typical Application Circuit).
35 IFM_SET IF M ai n Am p l i fi er Bi as C ontr ol . C onnect a r esi stor fr om thi s p i n to g r ound to set the b i as cur r ent for the
m ai n IF am p l i fi er ( see the Typical Operating Characteristics for typ i cal p er for m ance vs. r esi stor val ue) .
—EP
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple
ground vias are also required to achieve the noted RF performance.
Detailed Description
The MAX19995A is a dual-channel downconverter
designed to provide up to 8.7dB of conversion gain,
+24.8dBm input IP3, +13.5dBm 1dB input compression
point, and a noise figure as low as 9.2dB.
In addition to its high-linearity performance, the
MAX19995A achieves a high level of component inte-
gration. The device integrates two double-balanced
mixers for two-channel downconversion. Both the main
and diversity channels include a balun and matching
circuitry to allow 50Ωsingle-ended interfaces to the RF
ports and the two LO ports. An integrated single-
pole/double-throw (SPDT) switch provides 50ns switch-
ing time between the two LO inputs, with 48dB of
LO-to-LO isolation and -35dBm of LO leakage at the RF
port. Furthermore, the integrated LO buffers provide a
high drive level to each mixer core, reducing the LO
drive required at the MAX19995A’s inputs to a range of
-3dBm to +3dBm. The IF ports for both channels incor-
porate differential outputs for downconversion, which
are ideal for providing enhanced 2LO-2RF performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in UMTS/WCDMA, LTE/WiMAX,
DCS1800/PCS1900 GSM/EDGE, TD-SCDMA, and
cdma2000 base stations. The MAX19995A is specified
to operate over an RF input range of 1700MHz to
2200MHz, an LO range of 1750MHz to 2700MHz, and
an IF range of 50MHz to 500MHz. The external IF com-
ponents set the lower frequency range (see the
Typical
Operating Characteristics
for details). Operation
beyond these ranges is possible; see the
Typical
Operating Characteristics
for additional information.
Although this device is optimized for high-side LO
injection applications, it can operate in low-side LO
injection modes as well. However, performance
degrades as fLO continues to decrease. For increased
low-side LO performance, refer to the MAX19995 data
sheet.
RF Port and Balun
The RF input ports of both the main and diversity chan-
nels are internally matched to 50Ω, requiring no exter-
nal matching components. A DC-blocking capacitor is
required as the input is internally DC shorted to ground
through the on-chip balun. The RF port input return loss
is typically better than 16.5dB over the RF frequency
range of 1700MHz to 2200MHz.
LO Inputs, Buffer, and Balun
The MAX19995A is optimized for a 1750MHz to
2700MHz LO frequency range. As an added feature,
the MAX19995A includes an internal LO SPDT switch
for use in frequency-hopping applications. The switch
selects one of the two single-ended LO ports, allowing
the external oscillator to settle on a particular frequency
before it is switched in. LO switching time is typically
50ns, which is more than adequate for typical GSM
applications. If frequency hopping is not employed,
simply set the switch to either of the LO inputs. The
switch is controlled by a digital input (LOSEL), where
logic-high selects LO1 and logic-low selects LO2. LO1
and LO2 inputs are internally matched to 50Ω, requiring
only 39pF DC-blocking capacitors.
If LOSEL is connected directly to a logic source, then
voltage MUST be applied to VCC before digital logic is
applied to LOSEL to avoid damaging the part.
Alternatively, a 1kΩresistor can be placed in series at
the LOSEL to limit the input current in applications
where LOSEL is applied before VCC.
The main and diversity channels incorporate a two-
stage LO buffer that allows for a wide-input power
range for the LO drive. The on-chip low-loss baluns,
along with LO buffers, drive the double-balanced mix-
ers. All interfacing and matching components from the
LO inputs to the IF outputs are integrated on-chip.
High-Linearity Mixer
The core of the MAX19995A dual-channel downcon-
verter consists of two double-balanced, high-perfor-
mance passive mixers. Exceptional linearity is provided
by the large LO swing from the on-chip LO buffers.
When combined with the integrated IF amplifiers, the
cascaded IIP3, 2LO-2RF rejection, and noise-figure
performance are typically +24.8dBm, 64dBc, and
9.2dB, respectively.
Differential IF
The MAX19995A has an IF frequency range of 50MHz
to 500MHz, where the low-end frequency depends on
the frequency response of the external IF components.
Note that these differential ports are ideal for providing
enhanced IIP2 performance. Single-ended IF applica-
tions require a 4:1 (impedance ratio) balun to transform
the 200Ωdifferential IF impedance to a 50Ωsingle-
ended system. After the balun, the return loss is typical-
ly 11.5dB. The user can use a differential IF amplifier on
the mixer IF ports, but a DC block is required on both
IFD+/IFD- and IFM+/IFM- ports to keep external DC
from entering the IF ports of the mixer.
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 19
MAX19995A
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω.
No matching components are required. The RF port
input return loss is typically better than 16.5dB over the
RF frequency range of 1700MHz to 2200MHz and
return loss at the LO ports is typically better than 15dB
over the entire LO range. RF and LO inputs require only
DC-blocking capacitors for interfacing.
The IF output impedance is 200Ω(differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance to a 50Ωsingle-ended
output (see the
Typical Application Circuit
).
Reduced-Power Mode
Each channel of the MAX19995A has two pins
(LO_ADJ_ _, IF_ _SET) that allow external resistors to
set the internal bias currents. Nominal values for these
resistors are given in Table 1. Larger value resistors
can be used to reduce power dissipation at the
expense of some performance loss. If ±1% resistors
are not readily available, substitute with ±5% resistors.
Significant reductions in power consumption can also
be realized by operating the mixer with an optional sup-
ply voltage of 3.3V. Doing so reduces the overall power
consumption by up to 54%. See the
3.3V Supply AC
Electrical Characteristics
table and the relevant 3.3V
curves in the
Typical Operating Characteristics
section.
IND_EXT_ Inductors
For applications requiring optimum RF-to-IF and LO-to-
IF isolation, connect low-ESR inductors from IND_EXT_
(pins 15 and 31) to ground. When improved isolation is
not required, connect IND_EXT_ to ground using 0Ω
resistance. See the
Typical Operating Characteristics
to
evaluate the isolation vs. inductor value tradeoff.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
The load impedance presented to the mixer must be so
that any capacitance from both IF- and IF+ to ground
does not exceed several picofarads. For the best per-
formance, route the ground pin traces directly to the
exposed pad under the package. The PCB exposed
pad MUST be connected to the ground plane of the
PCB. It is suggested that multiple vias be used to con-
nect this pad to the lower-level ground planes. This
method provides a good RF/thermal-conduction path
for the device. Solder the exposed pad on the bottom
of the device package to the PCB. The MAX19995A
evaluation kit can be used as a reference for board lay-
out. Gerber files are available upon request at
www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each VCC pin and
TAPMAIN/TAPDIV with the capacitors shown in the
Typical Application Circuit
(see Table 1 for component
values). Place the TAPMAIN/TAPDIV bypass capacitors
to ground within 100 mils of the pin.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX19995A’s 36-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PCB on which the
MAX19995A is mounted be designed to conduct heat
from the EP. In addition, provide the EP with a low-
inductance path to electrical ground. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes.
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
20 ______________________________________________________________________________________
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 21
DESIGNATION QTY DESCRIPTION COMPONENT SUPPLIER
C1, C2, C7, C8,
C14, C16 6 39pF microwave capacitors (0402) Murata Electronics North America, Inc.
C3, C6 2 0.033µF microwave capacitors (0603) Murata Electronics North America, Inc.
C4, C5 2 Not used —
C9, C13, C15,
C17, C18 5 0.01µF microwave capacitors (0402) Murata Electronics North America, Inc.
C10, C11, C12,
C19, C20, C21 6 150pF microwave capacitors (0603) Murata Electronics North America, Inc.
L1, L2, L4, L5 4 120nH wire-wound high-Q inductors (0805) Coilcraft, Inc.
L3, L6 2
10nH wire-wound high-Q inductors (0603). Smaller values can
be used at the expense of some performance loss (see the
Typical Operating Characteristics).
Coilcraft, Inc.
681Ω ±1% resistors (0402). Used for VCC = 5.0V applications.
Larger values can be used to reduce power at the expense of
some performance loss (see the Typical Operating
Characteristics).
R1, R4 2
909Ω ±1% resistors (0402). Used for VCC = 3.3V applications.
Digi-Key Corp.
1.5kΩ ±1% resistors (0402). Used for VCC = 5.0V applications.
Larger values can be used to reduce power at the expense of
some performance loss (see the Typical Operating
Characteristics).
R2, R5 2
1kΩ ±1% resistors (0402). Used for VCC = 3.3V applications.
Digi-Key Corp.
R3, R6 2 0Ω resistors (1206) Digi-Key Corp.
T1, T2 2 4:1 transformers (200:50) TC4-1W-17 Mini-Circuits
U1 1 MAX19995A IC (36 TQFN-EP) Maxim Integrated Products, Inc.
Table 1. Component Values
22 ______________________________________________________________________________________
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
MAX19995A
Typical Application Circuit
RF MAIN INPUT
RF DIV INPUT
C2C3
C1 +
C8
C9
C13
C17
C18
R1
VCC
L2
L1
R3
C20
C19
IF MAIN OUTPUT
T1
C16
R2
L3
LO2
C14
LO1
4:1
4:1
VCC
VCC
VCC
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27 LO2
VCC
GND
VCC
GND
GND
TAPDIV
TAPMAIN
RFMAIN
RFDIV
EXPOSED
PAD
IFD_SET
GND
IND_EXTD
LO_ADJ_D
N.C.
V
CC
V
CC
N.C.
LO_ADJ_M
V
CC
IND_EXTM
GND
IFM_SET
IFD+
IFD-
V
CC
IFM+
IFM-
LO1
LOSEL
GND
GND
GND
GND
GND
VCC
MAX19995A
C4
C7C6
C5
VCC
VCC
C21
LO SELECT
C15
VCC
R5
R4
VCC
L4
L5
R6
L6
C10
C11
T2
IF DIV OUTPUT
C12
MAX19995A
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
23
© 2009 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.
Pin Configuration/Functional Diagram
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27 LO2
VCC
GND
VCC
GND
GND
TAPDIV
TAPMAIN
RFMAIN
RFDIV
EXPOSED
PAD
IFD_SET
GND
IND_EXTD
LO_ADJ_D
N.C.
VCC
VCC
N.C.
LO_ADJ_M
VCC
IND_EXTM
GND
IFM_SET
IFD+
IFD-
VCC
IFM+
IFM-
LO1
LOSEL
GND
GND
GND
GND
GND
VCC
MAX19995A
EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
THIN QFN (EXPOSED PAD)
6mm x 6mm
TOP VIEW
+
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
36 Thin QFN-EP T3666+2 21-0141
