K M Y Last update: 2012.10.9 No.RAC-K-HTS-0006-7
(Uncontrolled copy)
Specification
(Reference)
Title: CHIP ATTENUATORS
Style: RAC101A
RoHS COMPLIANCE ITEM
Product specification contained in this specification
are subject to change at any time without notice
If you have any questions or a Purchasing Specification for any quality
Agreement is necessary, please contact our sales staff.
Issue Dept.: Research & Development Department Hokkaido Research Center
K M Y Drawing No: RAC−K−HTS−0006 /7
Title: CHIP ATTENUATORS
RAC101A Page: 1/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.9
1. Scope
1.1 This specification covers the detail requirements for chip attenuators, style of RAC10 1A.
1.2 Country of origin China
2. Classification
Type designation shall be the following form.
(Example)
1 Chip attenuators
2 Size
Symbol 1
3 Characteristic
impedance Characteristic impedance
50Ω
Symbol A
4 Circuit Circuit Unbalanced π type
Symbol 1 2 3 4 5 6 7 8 9 A
5
Attenuation
factor Attenuation
factor 1dB 2dB 3dB 4dB 5dB 6dB 7dB 8dB 9dB 10dB
6 Terminal style
7 Packaging form
3. Rating
3.1 The ratings shall be in accordance with Table−1.
Table−1
Style Terminations
style
Attenuation factor
(dB)
Attenuation
factor
tolerance
(dB)
Frequency
range
Voltage
standing
wave ratio
VSWR
Rated input power
(at 85 °C)
1,2,3,4,5 ±0.3
RAC101A C 6,7,8,9,10 ±0.4 DC≤f≤3GHz 1.2 max. 100 mW/package
Style Working temperature
range (°C)
Storage temperature
range
(Single unit) (°C)
RAC101A −40∼+125 −55∼+125
4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol Packaging form Standard packaging
quantity / units
B Bulk (loose package) 1,000 pcs.
TH Paper taping (8mm width), 2mm pitches 10,000 pcs.
RAC 10 1 A 1 C
TH
1 2 3 4 5 6 7
Style
K M Y Drawing No: RAC−K−HTS−0006 /7
Title: CHIP ATTENUATORS
RAC101A Page: 2/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.9
5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−1 and Table−3.
Figure−1
Ta ble−3 Unit: mm
Style L W H Q a b ∗P
RAC101A 1.0±0.1
+0.1
1.0
−0 0.35±0.10 0.33±0.10 0.15±0.10 0.25±0.10 0.65±0.10
∗Reference
5.2 Net weight (Reference)
Style Net weight(mg)
RAC101A 1.1
6. Circuit and DC resistance value
6.1 Unbalanced π type circuit 6.2 DC resistance value (Reference)
Attenuation factor R1 (Ω) R2 (Ω)
1dB 5.769 869.5
2dB 11.62 436.2
3dB 17.62 292.4
4dB 23.85 221.0
5dB 30.40 178.5
6dB 37.35 150.5
7dB 44.80 130.7
8dB 52.84 116.1
9dB 61.59 105.0
10dB 71.15 96.25
H
b
P
D
Q
a
W
L
R1
R2
Circuit
R2
12
43
K M Y Drawing No: RAC−K−HTS−0006 /7
Title: CHIP ATTENUATORS
RAC101A Page: 3/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.9
7. Marking
The following of marking items shall be marked on over coat side.
Marking items; 1. Dot mark Example)
2. Attenuation factor
″1″ → 1dB
″3″ → 3dB
″A″ → 10dB
8. Performance
8.1 Unless otherwise specified, the standard range of atmospheric conditions for tests is as follows;
Ambient temperature: 5 °C to 35 °C, Relative humidity: 45 % to 85 %, Air pressure: 86 kPa to 106 kPa
If there is any doubt the results, measurements shall be made within the following;
Ambient temperature: 20 °C ± 2 °C, Relative humidity: 60 % to 70 %, Air pressure: 86 kPa to 106 kPa
8.2 The performance shall be satisfied in Table−4.
Table−4(1)
No. Test items Condition of test Performance requirements
1 Characteristic
impedance
Test circuit
50 Ω
2 Frequency The test device: Network analyzer HP8753D
Agilent Technologies Inc.
(Max. frequency: 6 GHz )
Within the specified tolerance of
attenuation factor.
VSWR: See Table-1.
3 Insulation resistance Test condition: Between terminal to over coat.
Test potential: 50Vdc
Test period: 1min.
100 MΩ min.
4 Substrate bending test The test substrate: Glass fabric based epoxy
resin. t: 1.6 mm
Bending value: 3 mm
(Among the fulcrums: 90 mm)
0.5dB ∼ 2dB: Within ±0.1%
3dB ∼ 5dB: Within ±0.2%
6dB ∼ 10dB: Within ±0.3%
No evidence of mechanical damage.
5 Resistance to
soldering heat
Test condition: 260 °C ± 5 °C
10 s ± 1 s
0.5dB ∼ 2dB: Within ±0.1%
3dB ∼ 5dB: Within ±0.2%
6dB ∼ 10dB: Within ±0.3%
No evidence of appearance damage.
6 Solderability Flax: Rosin−Methanol
Test condition: 235 °C ± 5 °C
2 s ± 0.5 s
The surface of terminal immersed shall be
min. of 95 % covered with a new coating
of solder.
R 1
R2 R2
1 2
4 3
−
+
RL
: Attenuator
RL: 50 Ω
1
3
2
4
K M Y Drawing No: RAC−K−HTS−0006 /7
Title: CHIP ATTENUATORS
RAC101A Page: 4/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.9
Table−4(2)
No. Test items Condition of test Performance requirements
Test cycle: 5 cycles for duty cycle as specified
below.
Step Temperature (°C) Time (min)
1 Room temp. 2∼3
2 −55±3 30
3 Room temp. 2∼3
4 125±2 30
7 Temperature cycling
Leaving at the room temp. for 30 min. or more,
and then measure the attenuation factor.
0.5dB ∼ 2dB: Within ±0.1%
3dB ∼ 5dB: Within ±0.2%
6dB ∼ 10dB: Within ±0.3%
No evidence of appearance damage.
The test substrate: Glass fabric based epoxy
resin. t: 1.6 mm
Test temp.: 125 °C ± 2 °C
+48
Test period: 1,000 h
0
8 Dry heat
Leaving at the room temp. for 2h or more, and
then measure the attenuation factor.
0.5dB ∼ 2dB: Within ±0.1%
3dB ∼ 5dB: Within ±0.2%
6dB ∼ 10dB: Within ±0.3%
No evidence of appearance damage.
The test substrate: Glass fabric based epoxy
resin. t: 1.6 mm
Test temp.: −55 °C ± 3 °C
+48
Test period: 1,000 h
0
9 Cold
Leaving at the room temp. for 2h or more, and
then measure the attenuation factor.
0.5dB ∼ 2dB: Within ±0.1%
3dB ∼ 5dB: Within ±0.2%
6dB ∼ 10dB: Within ±0.3%
No evidence of appearance damage.
The test substrate: Glass fabric based epoxy
resin. t: 1.6 mm
Test circuit: See No. 1.
Test temp. & relative humidity:
60 °C ± 2 °C & 90 %∼95 %
Test voltage: Cycle of 1 h 30 min. ″ON″ and
30 min. ″OFF″ at dc rated voltage.
+48
Test period: 1,000 h
0
0.5dB ∼ 2dB: Within ±0.1%
3dB ∼ 5dB: Within ±0.2%
6dB ∼ 10dB: Within ±0.3%
No evidence of appearance damage.
10 Load life in humidity
Leaving at the room temp. for 2h or more, and
then measure the attenuation factor.
The test substrate: Glass fabric based epoxy
resin. t: 1.6 mm
Test circuit: See No. 1.
Test temp. : 85 °C ± 2 °C
Test voltage: Cycle of 1 h 30 min. ″ON″and
30 min. ″OFF″ at dc rated voltage.
+48
Test period: 1,000 h
0
0.5dB ∼ 2dB: Within ±0.1%
3dB ∼ 5dB: Within ±0.2%
6dB ∼ 10dB: Within ±0.3%
No evidence of appearance damage.
11 Load life
Leaving at the room temp. for 2h or more, and
then measure the attenuation factor.
K M Y Drawing No: RAC−K−HTS−0006 /7
Title: CHIP ATTENUATORS
RAC101A Page: 5/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.9
9. Taping
9.1 Applicable documents JIS C 0806−3: 1999, EIAJ ET−7200B: 2003
9.2 Taping dimensions
Taping dimensions shall be in accordance with below.
9.2.1 Paper taping, 8mm width, 2mm pitches
Unit: mm
Figure−2
Table−5 Unit: mm
Style A B t
1 t
2
RAC101A +0.05
1.15
−0.10 +0.05
1.15
−0.10 +0.05
0.4
−0.10 0.55max.
1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following
Figure−3.
6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shall
maintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The attenuators shall be faced to upward at the over coating side in the carrier cavity.
9). The direction of attenuator shall be taped as Figure−4.
Figure−3 Figure−4
t1
+
0
0.
.1
1
φ1.5
0
4
±
0.1
1.75±0.1
8±0.2
3.5±0.05
2
±
0.05
t2
A
B
Sprocket hole
Carrier cavity
Direction of unreeling
165°to180°
C
arr
i
er tape
T
op cover tape
Peel
−
off
(About 300mm/min)
Di
rec
ti
on o
f
unree
li
ng
Sprocket hole
K M Y Drawing No: RAC−K−HTS−0006 /7
Title: CHIP ATTENUATORS
RAC101A Page: 6/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.9
9.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−5 and Table−6.
Plastic reel (Based on EIAJ ET−7200B)
Unit: mm
Figure−5
Table−6 Unit: mm
Style A B Note
11.4±1.0 Injection molding
RAC101A +1.0
9 0 13±1.0 Vacuum forming
Note: Marking label shall be marked on a place of Marking A or two place of marking A and B.
9.4 Leader and trailer tape.
Figure−6
10. Marking on package
The label of a minimum package shall be legibly marked with follows.
10.1 Marking A
(1) Classification (Kind, Size, Style, Characteristic impedance, Circuit, Attenuation factor, Terminal style, Packaging form)
(2) Lot number (3) Quantity (4) Manufacturer’s name or trade mark (5) Others
10.2 Marking B(KAMAYA control label)
φ21±0.8
2
±
0.5
Marking A
0
φ180
−1.5
+1
φ
60
0
φ
13±0.2
B
A
Marking B
160mm min. 100mm min.
400mm min
.
End
Trailer
Direction of unreeling
Leader
Start
