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AS5215

Programmable 360º Magnetic Angle Encoder with Buffered SINE &

COSINE Output Signals

www.austriamicrosystems.com/AS5215 Revision 1.11 1 - 26

Datasheet

1 General Description

The AS5215 is a redundant, contactless rotary encoder sensor for

accurate angular measurement over a full turn of 360º and over an

extended ambient temperature range of -40ºC to +150ºC.

Based on an integrated Hall element array, the angular position of a

simple two-pole magnet is translated into analog output voltages.

The angle information is provided by means of buffered sine and

cosine voltages. This approach gives maximum flexibility in system

design, as it can be directly integrated into existing architectures and

optimized for various applications in terms of speed and accuracy.

With two independent dies in one package, the device offers true

redundancy. Usually the bottom die, which is exposed to slightly less

magnetic field is employed for plausibility check.

An SSI Interface is implemented for signal path configuration as well

as a one time programmable register block (OTP), which allows the

customer to adjust the signal path gain to adjust for different

mechanical constraints and magnetic field.

Figure 1. AS5215 Block Diagram

2 Key Features

 Contactless angular position encoding

 High precision analog output

 Buffered Sine and Cosine signals

 SSI Interface

 Low power mode

 Two programmable output modes: Differential or Single ended

 Wide magnetic field input range: 20 – 80 mT

 Wide temperature range: -40ºC to +150ºC

 Fully automotive qualified to AEC-Q100, grade 0

 Thin punched 32-pin QFN (7x7mm) package

3 Applications

The AS5215 is ideal for Electronic Power Steering systems and

general purpose for automotive or industrial applications in

microcontroller-based systems.

VDD

VSS

SINP/SINN

SINN/SINP/CM_SIN

COSP/COSN

COSN/COSP/CM_COS

Hall Array

Frontend

Amplifier

DCLK

DIO

POWER

MANAGEMENT

BUFFER Stage

OTP Register

Digital Part

SSI Interface

AS5215

PROG

Note: This Block Diagram presents only one die.

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AS5215
Datasheet - Contents
Contents
General Description .................................................................................................................................................................. 1
Key Features............................................................................................................................................................................. 1
Applications............................................................................................................................................................................... 1
Pin Assignments ....................................................................................................................................................................... 3
1  Pin Descriptions.................................................................................................................................................................................... 3
Absolute Maximum Ratings ...................................................................................................................................................... 5
Electrical Characteristics........................................................................................................................................................... 6
1  Timing Characteristics .......................................................................................................................................................................... 7
Detailed Description.................................................................................................................................................................. 8
1  Magnet Diameter and Vertical Distance ............................................................................................................................................... 8
1.1  The Linear Range ........................................................................................................................................................................ 8
1.2  Magnet Thickness...................................................................................................................................................................... 11
1.3  Axial Distance (Airgap) .............................................................................................................................................................. 12
1.4  Angle Error vs. Radial and Axial Misalignment..........................................................................................................................  12
1.5  Mounting the Magnet.................................................................................................................................................................  12
1.6  Summary ...................................................................................................................................................................................  14
Application Information ........................................................................................................................................................... 15
1  Sleep Mode ........................................................................................................................................................................................ 15
2  SSI Interface....................................................................................................................................................................................... 15
3  Device Communication / Programming.............................................................................................................................................. 16
4  Waveform – Digital Interface at Normal Operation Mode................................................................................................................... 18
5  Waveform – Digital Interface at Extended Mode ................................................................................................................................ 18
6  Waveform – Digital Interface at Analog Readback of the Zener Diodes ............................................................................................ 19
7  EasyZapp OTP Content ..................................................................................................................................................................... 19
8  Analog Sin/Cos Outputs with External Interpolator ............................................................................................................................ 20
9  OTP Programming and Verification.................................................................................................................................................... 21
Package Drawings and Markings ........................................................................................................................................... 23
Ordering Information............................................................................................................................................................. 25
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AS5215

Datasheet - Pin Assignments

4 Pin Assignments

Figure 2. Pin Assignments (Top Vie w)

4.1 Pin Descriptions

Table 1. Pin Descriptions

Pin Name Pin Number Description

DIO_1 1 Data I/O for digital interface

DIO_2 2

TC_1 3 Test coil

TC_2 4

A_TST_1 5 Analog test pin

A_TST_2 6

PROG_1 7 OTP Programming Pad

PROG_2 8

AS5215

252627282930

161514131211

3132

109

VSS_1

VSS_2

SINP_1 / SINN_1

SINN_1 / SINP_1 / CM_SIN_1

SINP_2 / SINN_2

SINN_2 / SINP_2 / CM_SIN_2

COSP_1 / COSN_1

COSN_1 / COSP_1 / CM_COS_1

COSN_2 / COSP_2 / CM_COS_2

COSP_2 / COSN_2

CS_2

CS_1

DCLK_2

DCLK_1

VDD_2

VDD_1

DIO_1

DIO_2

TC_1

TC_2

A_TST_1

A_TST_2

PROG_1

PROG_2

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AS5215

Datasheet - Pin Assignments

VSS_1 9 Supply ground

VSS_2 10

SINP_1 / SINN_1 11 Switchable buffered analog output

SINN_1 / SINP_1 / CM_SIN_1 12 Switchable buffered analog or common mode output

SINP_2 / SINN_2 13 Switchable buffered analog output

SINN_2 / SINP_2 / CM_SIN_2 14 Switchable buffered analog or common mode output

COSP_1 / COSN_1 15 Switchable buffered analog output

COSN_1 / COSP_1 / CM_COS_1 16 Switchable buffered analog or common mode output

COSP_2 / COSN_2 17 Switchable buffered analog output

COSN_2 / COSP_2 / CM_COS_2 18 Switchable buffered analog or common mode output

NC 19

------

NC 20

NC 21

NC 22

NC 23

NC 24

NC 25

NC 26

VDD_1 27 Digital + analog supply

VDD_2 28

DCLK_1 29 Clock input for digital interface

DCLK_2 30

CS_1 31 Clock input for digital interface

CS_2 32

Table 1. Pin Descriptions

Pin Name Pin Number Description

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AS5215

Datasheet - Absolute Maximum Ratings

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter Min Max Units Comments

Electrical Parameters

Supply voltage (VDD)-0.37V

Input pin voltage (V_in) -0.3 VDD+0.3 V

Input current (latchup immunity), I_scr -100 100 mA Norm: EIA/JESD78 Class II Level A

Electrostatic Discharge

Electrostatic discharge (ESD) ±2 kV Norm: JESD22-A114E

Continous Power Dissipation

Total power dissipation (Ptot)275 mW

Package thermal resistance (Θ_JA) 27 ºC/W Velocity =0; Multi Layer PCB; Jedec Standard Testboard

Temperature Ranges and Storage Conditions

Storage temperature (T_strg) -65 150 ºC

Package body temperature (T_body) 260 ºC

Norm: IPC/JEDEC J-STD-020.

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing 585%

Moisture Sensitive Level (MSL) 3 Represents a maximum floor time of 168h

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AS5215

Datasheet - Electrical Characteristics

6 Electrical Characteristics

Unless otherwise noted all in this specification defined tolerances of parameters are assured over the whole operation conditions range and also

over lifetime.

Table 3. Operating Conditions

Symbol Parameter Condition Min Typ Max Unit

VDD Positive Supply Voltage 4.5 5.5 V

VSS Negative Supply Voltage 0.0 0.0 V

T_amb Ambient temperature -40 150 ºC

Table 4. DC/AC Characteristics for Digital Inputs and Outputs

Symbol Parameter Condition Min Typ Max Unit

CMOS Input

V_IH High level Input voltage 0.7 * VDD V

V_IL Low level Input Voltage 0.3 * VDD V

I_LEAK Input Leakage Current 1 µA

CMOS Output

V_OH High level Output voltage 4 mA VDD - 0.5 V

V_OL Low level Output Voltage 4 mA VSS + 0.4 V

C_L Capacitive Load 35 pF

t_slew Slew Rate 30 ns

t_delay Time Rise Fall 15 ns

CMOS Output Tristate

I_OZ Tristate Leakage Current 1 µA

Table 5. Magnetic Input Specification

Symbol Parameter Condition Min Typ Max Unit

Two pole cylindrical magnet, diametrically magnetized:

dMAG Diameter 4 6 mm

Bpp Magnetic input field amplitude 200 – 800 Gauss 20 50 80 mt

frot Rotational speed Max 30000 RPM 0 500 Hz

Table 6. Electrical System Specifications

Symbol Parameter Condition Min Typ Max Unit

IDD Current Consumption

Max value derived at maximum I_H (Hall Bias

Current)

Note: For single die only.

20 28 mA

tpower_on Power up time 1.275 ms

tprop Propagation delay -40 to 150ºC 18 22 30 µs

M Magnetic Sensitivity 1G = 0.1 mT 1 6 mV/G

Vout Analog output range Vss+

0.25

Vdd-

0.5 V

SF=SF25C

- (AP1_1/

AP2_1)

Amplitude ratio tracking accuracy

over temperature -40 to 150ºC -1 +1 %

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AS5215

Datasheet - Electrical Characteristics

6.1 Timing Characteristics

Remark: The digital interface will be reset during the low phase of the CS signal.

SF=AP1_

1/AP2_1

Amplitude ratio mismatch at room

temperature -2 2 %

Voffset1 DC Offset Ratiometric to VDD 0.294 0.3 0.306 V / VDD

Voffset2 0.49 0.5 0.51 V / VDD

DCoffdrift DC Offset Drift -40 to 150ºC -50 +50 µV/ºC

THD Total Harmonic Distortion 0.2 %

SR Slew Rate 1 V/µs

CLOAD Capacitive Load 1000 pF

Table 7. Timing Characteristics

Symbol Parameter Condition Min Typ Max Unit

t1_3 Chip select to positive edge of DCLK 30 - ns

t2_3 Chip select to drive bus externally 0-ns

t3 Setup time command bit

Data valid to positive edge of DCLK 30 - ns

t4 Hold time command bit

Data valid after positive edge of DCLK 15 - ns

t5 Float time

Positive edge of DCLK for last command bit to bus float -DCLK/

2+0 ns

Bus driving time

Positive edge of DCLK for last command bit to bus

drive

DCLK/

2+0 -ns

t7 Data valid time

Positive edge of DCLK to bus valid

DCLK/

2+0

DCLK/

2+30 ns

t8 Hold time data bit

Data valid after positive edge of DCLK

DCLK/

2+0 -ns

t9_3 Hold time chip select

Positive edge DCLK to negative edge of chip select

DCLK/

2+0 -ns

t10_3 Bus floating time

Negative edge of chip select to float bus -30ns

t11 Setup time data bit at write access

Data valid to positive edge of DCLK 30 - ns

t12 Hold time data bit at write access

Data valid after positive edge of DCLK 15 - ns

t13_3 Bus floating time

Negative edge of chip select to float bus -30ns

Table 6. Electrical System Specifications

Symbol Parameter Condition Min Typ Max Unit

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AS5215

Datasheet - Detailed Description

7 Detailed Description

The AS5215 is a redundant rotary encoder sensor front end. Based on an integrated Hall element array, the angular position of a simple two-pole

magnet is translated into analog output voltages. The angle information is provided by means of sine and cosine voltages. This approach gives

maximum flexibility in system design, as it can be directly integrated into existing architectures and optimized for various applications in terms of

speed and accuracy.

With two independent dies in one package, the device offers true redundancy. Usually the bottom die, which is exposed to slightly less magnetic

field is employed for plausibility check.

An SSI (SPI standard) protocol is implemented for internal test access to the different circuit blocks and for signal path configuration.

A One Time Programmable register block (OTP) allows the customer to adjust the signal path gain to adjust for different mechanical constraints

and magnetic field strengths. Furthermore, for internal use, the test mode can be enabled and the system oscillator is trimmable, DC offset of the

output signal can be set to either 1.5V or 2.5V. A unique chip ID is stored to ensure traceability.

For operating point control, a band gap circuit is implemented together with a central bias block to distribute all reference bias currents for the

analog signal conditioning. The digital signal part is based on a 2MHz system, CLK derived via. divider from a 4MHz system oscillator.

Figure 3. Typical Arrangement of AS5215 and Magnet

7.1 Magnet Diameter and Vertical Distance

Note: Following is just an abstract taken from the elaborate application note on the Magnet.

For more detailed information, please visit our homepage www.austriamicrosystems.com → Magnetic Rotary Encoders → Magnet

Application Notes

7.1.1 The Linear Range

The Hall elements used in the AS5000-series sensor ICs are sensitive to the magnetic field component Bz, which is the magnetic field vertical to

the chip surface. Figure 4 shows a 3-dimensional graph of the Bz field across the surface of a 6mm diameter, cylindrical NdFeB N35H magnet at

an axial distance of 1mm between magnet and IC.

The highest magnetic field occurs at the north and south poles, which are located close to the edge of the magnet, at ~2.8mm radius (see Figure

5). Following the poles towards the center of the magnet, the Bz field decreases very linearly within a radius of ~1.6mm. This linear range is the

operating range of the magnet with respect to the Hall sensor array on the chip. For best performance, the Hall elements should always be within

this linear range.

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AS5215

Datasheet - Detailed Description

Figure 4. 3D-Graph of Vertical Magnetic Field of a 6mm Cylindrical Magnet

As shown in Figure 5 (grey zone), the Hall elements are located on the chip at a circle with a radius of 1mm. Since the difference between two

opposite Hall sensors is measured, there will be no difference in signal amplitude when the magnet is perfectly centered or if the magnet is

misaligned in any direction as long as all Hall elements stay within the linear range.

Bz [mT]

BZ; 6mm magnet @ Z=1mm

Y -displacement [mm]

X -displacement [mm]

area of X- Y-misalignment from cen-

ter: ±0.5mm

circle of Hall elements on chip

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AS5215

Datasheet - Detailed Description

For the 6mm magnet (shown in Figure 5), the linear range has a radius of 1.6mm, hence this magnet allows a radial misalignment of 0.5mm

(1.6mm linear range radius; 1mm Hall array radius). Consequently, the larger the linear range, the more radial misalignment can be tolerated. By

contrast, the slope of the linear range decreases with increasing magnet diameter, as the poles are further apart. A smaller slope results in a

smaller differential signal, which means that the magnet must be moved closer to the IC (smaller airgap) or the amplification gain must be

increased, which leads to a poorer signal-to-noise ratio. More noise results in more jitter at the angle output. A good compromise is a magnet

diameter in the range of 5…8mm.

Figure 5. Vertical Magnetic Field Across the Center of a Cylindrical Magnet

Small Diameter Magnet (<6mm) Large Diameter Magnet (>6mm)

+ stronger differential signal =

good signal / noise ratio,

larger airgaps

+ wider linear range =

larger horizontal misalignment area

- shorter linear range =

smaller horizontal misalignment area

- weaker differential signal =

poorer signal / noise ratio,

smaller airgaps

Bz; 6mm magnet @ y=0; z=1mm

X -displacement [mm]

Hall elements (side view)

Bz [mT]

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AS5215

Datasheet - Detailed Description

7.1.2 Magnet Thickness

Figure 6 shows the relationship of the peak amplitude in a rotating system (essentially the magnetic field strength of the Bz field component) in

relation to the thickness of the magnet. The X-axis shows the ratio of magnet thickness (or height) [h] to magnet diameter [d] and the Y-axis

shows the relative peak amplitude with reference to the recommended magnet (d=6mm, h=2.5mm). This results in an h/d ratio of 0.42.

Figure 6. Relationship of Peak Amplitude vs. Magnet Thickness

As the graph in Figure 6 shows, the amplitude drops significantly at h/d ratios below this value and remains relatively flat at ratios above 1.3.

Therefore, the recommended thickness of 2.5mm (at 6mm diameter) should be considered as the low limit with regards to magnet thickness.

It is possible to get 40% or more signal amplitude by using thicker magnets. However, the gain in signal amplitude becomes less significant for h/

d ratios >~1.3. Therefore, the recommended magnet thickness for a 6mm diameter magnet is between 2.5 and ~8 mm.

Bz ampl i t ude vs. magnet t hi ckness

of a cyl indri cal di am etr ic m agnet wi t h 6mm di am et er

20%

40%

60%

80%

100%

120%

140%

160%

0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8

thickness to diameter [h/d] ratio

Relative pea k amplitude [%]

d= 6m m x h= 2 .5m m ref. magnet:

h/ d = 0.42

Rel . am pl i tude = 1 00%

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AS5215

Datasheet - Detailed Description

7.1.3 Axial Distance (Airgap)

Figure 7. Sinusoidal Magnetic Field Generated by the Rotating Magnet

The recommended magnetic field, measured at the chip surface on a radius equal to the Hall sensor array radius (typ 1mm) should be within a

certain range. This range lies between 45 and 75mT or between 20 and 80mT, depending on the encoder product.

Linear position sensors are more sensitive as they use weaker magnets. The allowed magnetic range lies typically between 5 and 60mT.

7.1.4 Angle Error vs. Radial and Axial Misalignment

The angle error is the deviation of the actual angle vs. the angle measured by the encoder. There are several factors in the chip itself that

contribute to this error, mainly offset and gain matching of the amplifiers in the analog signal path. On the other hand, there is the nonlinearity of

the signals coming from the Hall sensors, caused by misalignment of the magnet and imperfections in the magnetic material.

Ideally, the Hall sensor signals should be sinusoidal, with equal peak amplitude of each signal. This can be maintained, as long as all Hall

elements are within the linear range of the magnetic field Bz (see Figure 5).

7.1.5 Mounting the Magnet

Generally, for on-axis rotation angle measurement, the magnet must be mounted centered over the IC package. However, the material of the

shaft into which the magnet is mounted, is also of big importance.

Magnetic materials in the vicinity of the magnet will distort or weaken the magnetic field being picked up by the Hall elements and cause

additional errors in the angular output of the sensor.

Figure 8. Magnetic Field Lines in Air

Figure 8 shows the ideal case with the magnet in air. No magnetic materials are anywhere nearby.

0360º

vertical

field

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AS5215

Datasheet - Detailed Description

Figure 9. Magnetic Field Lines in Plastic or Copper Shaft

If the magnet is mounted in non-magnetic material, such as plastic or diamagnetic material, such as copper, the magnetic field distribution is not

disturbed. Even paramagnetic material, such as aluminium may be used. The magnet may be mounted directly in the shaft (see Figure 9).

Note: Stainless steel may also be used, but some grades are magnetic. Therefore, steel with magnetic grades should be avoided.

Figure 10. Magnetic Field Lines in Iron Shaft

If the magnet is mounted in a ferromagnetic material, such as iron, most of the field lines are attracted by the iron and flow inside the metal shaft

(see Figure 10). The magnet is weakened substantially.

This configuration should be avoided!

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AS5215

Datasheet - Detailed Description

Figure 11. Magnetic Field Lines with Spacer Between Magnet and Iron Shaft

If the magnet has to be mounted inside a magnetic shaft, a possible solution is to place a non-magnetic spacer between shaft and magnet, as

shown in Figure 11. While the magnetic field is rather distorted towards the shaft, there are still adequate field lines available towards the sensor

IC. The distortion remains reasonably low.

7.1.6 Summary

 Small diameter magnets (<6mm Ø) have a shorter linear range and allow less lateral misalignment. The steeper slope allows larger axial

distances.

 Large diameter magnets (>6 mm Ø) have a wider linear range and allow a wider lateral misalignment. The flatter slope requires shorter axial

distances.

 The linear range decreases with airgap; Best performance is achieved at shorter airgaps.

 The ideal vertical distance range can be determined by using magnetic range indicators provided by the encoder ICs. These indicators are

named MagInc, MagDec, MagRngn, or similar, depending on product.

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AS5215

Datasheet - Application Information

8 Application Information

8.1 Sleep Mode

The target is to provide the possibility to reduce the total current consumption. No output signal will be provided when the IC is in sleep mode.

Enabling or disabling sleep mode is done by sending the SLEEP or WAKEUP commands via. the SSI interface. Analog blocks are powered

down with respect to fast wake up time.

8.2 SSI Interface

The setup for the device is handled by the digital interface. Each communication starts with the rising edge of the chip select signal. The

synchronization between the internal free running analog clock oscillator and the external used digital clock source for the digital interface is

done in a way that the digital clock frequency can vary in a wide range.

Table 8. SSI Interface Pin Description

Port Symbol Function

Chip select CS Indicates the start of a new access cycle to the device

CS = LO → reset of the digital interface

DCLK DCLK Clock source for the communication over the digital interface

Bidirectional data input output DIO Command and data information over one single line

The first bit of the command defines a read or write access

Table 9. SSI Interface Parameter Description

Symbol Parameter Notes Min Typ Max Unit

f_DCLK Clock frequency at normal operation The nominal value for the clock frequency can

be derived from a 10MHz oscillator source.

no limit 5 6 MHz

f_EZ_RW Clock frequency at easy zap read

write access no limit 5 6 kHz

f_EZ_PR

Clock frequency at easy zap access

program OTP

Correct access to the programmable zener

diode block needs a strict timing – the zap pulse

is exact one period.

The nominal value for the clock frequency can

be derived from a 10MHz oscillator source.

200 - 650 kHz

f_EZ_AR

Clock frequency at easy zap analog

readback

20pF external load allowed.

The nominal value for the clock frequency can

be derived from a 10MHz oscillator source.

no limit 156.3 162.5 kHz

Interface General at normal mode

Protocol: 5 command bit + 16 data input output

Command 5 bit command: cmd<4:0> ← bit<21:16>

Data 16 bit data: data<15:0> ← bit<15:0>

Interface General at extended mode

Protocol: 5 command bit + 46 data input output

Command 5 bit command: cmd<4:0> ← bit<50:46>

Data 34 bit data: data<45:0> ← bit<45:0>

Interface Modes

Normal read operation mode cmd<4:0> = <00xxx> → 1 DCLK per data bit

Extended read operation mode cmd<4:0> = <01xxx> → 4 DCLK per data bit

Normal write operation mode cmd<4:0> = <10xxx> → 1 DCLK per data bit

Extended write operation mode cmd<4:0> = <11xxx> → 4 DCLK per data bit

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AS5215

Datasheet - Application Information

8.3 Device Communication / Programming

Remark:

1. Send EN PROG (command 16) in normal mode before accessing the OTP in extended mode.

2. OTP assignment will be defined/updated.

Table 10. Digital Interface at Normal Mode

#command bin mode 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

23 WRITE CONFIG

110111 write go2sleep gen_rst analog_sig OB_bypassed

16 EN_PROG 10000 write 1 0 0 0 1 1 0 0 1 0 1 0 1 1 1 0

Name Functionality

go2sleep Enter/leave low power mode (no output signals)

gen_rst Generates global reset

analog_sig Switches the channels to the test bus after the PGA

OB_bypassed Disable and bypass output buffer for testing purpose

Table 11. Digital Interface at Extended Mode

#command bin mode Factory Settings User Settings

<45:44> <43:

26> <25:23> <22:2

0> <19:1

8> <17:1

4> <13> <12> <11> <10> <9> <8:7> <6> <5:0>

31 WRITE OTP 11111 xt write otp test ID 10µbiastrim vref osc lock_O

TP n.c. invert_

channel cm_sin cm_cos gain dc_

offset

hall_

bias

25 PROG_OTP 11001 xt write otp test ID 10µbiastrim vref osc lock_O

TP n.c. invert_

channel cm_sin cm_cos gain dc_

offset

hall_

bias

15 RD_OTP 01111 xt read otp test ID 10µbiastrim vref osc lock_O

TP n.c. invert_

channel cm_sin cm_cos gain dc_

offset

hall_

bias

9RD_OTP_ANA 01001 xt read

Name Functionality

Otp_test Dummy fuse bit used in production test

ID Part identification

n.c. Not connected

10µbiastrim 10µ bias current trim bits

vref Bias Block reference voltage trim bits

osc Oscillator trimming bits

lock_OTP To disable the programming of the factory bits <45…14>

invert_channel Inverts SIN and COS channel before the PGA for inverted output function (0...SIN/COS, 1...SINN/

COSN)

cm_sin Common mode voltage output enabled at SINN / CM pin (0...differential, 1...common)

cm_cos Common mode voltage output enabled at COSN / CM pin (0...differential, 1...common)

gain PGA gain setting (influences overall magnetic sensitivity), 2bit

dc_offset Output DC offset (0…1.5V, 1…2.5V)

Hall_b Hall bias setting (influences overall magnetic sensitivity), 6bit

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AS5215

Datasheet - Application Information

Figure 12. Sensitivity Gain Settings - Relative Sensitivity in %

The amplitude of the output signal is programmable via sensitivity (6bit) and/or gain (2bit) settings (see Figure 12).

Figure 13. Sensitivity Gain Settings - Sensitivity [mV/mT]

Magnetic S ensitiv i ty vs. OTP Hall Current & PGA Gain Setting

100

150

200

250

300

350

400

450

500

550

600

0 102030405060

Hall Current OTP setting (6 bits)

Relative Sensitivity in %

M_PGA_00

M_PGA_01

M_PGA_10

M_PGA_11

Magnetic Sensitivity v s. OTP Hall Current & P GA Gain Setting

0 102030405060

Hall Current OTP setting (6 bits)

Sensitivity [mV/mT ]

M_PGA_00

M_PGA_01

M_PGA_10

M_PGA_11

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AS5215

Datasheet - Application Information

8.4 Waveform – Digital Interface at Normal Operation Mode

Figure 14. Digital Interface at Normal Operation Mode

8.5 Waveform – Digital Interface at Extended Mode

In the extended mode, the digital interface needs four clocks for one data bit. During this time, the device is able to handle internal signals for

special access (e.g. the easy zap interface).

Figure 15. Digital Interface at Extended Mode

DCLK

DIO

DIO D15 D13

D14 D0

CMD_PHASE DATA_PHASE

t1_3 t9_3

t2_3 t5

t3 t6 t10_3

t13_3

t12

t11

DIO

CMD

READ

WRITE

CMD4 CMD3 CMD2 CMD1 CMD0

D15 D13

D14 D0

DCLK

DIO

CMD4 CMD3 CMD2 CMD1 CMD0

D45 D44

CMD_PHASE DATA_PHASE

t1_3 t9_3

t2_3 t5 t7

t3 t6 t10_3

t13_3

t12

t11

DIO

CMD

READ

WRITE

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AS5215

Datasheet - Application Information

8.6 Waveform – Digital Interface at Analog Readback of the Zener Diodes

To be sure that all Zener-Diodes are correctly burned, an analog readback mechanism is defined. Perform the ‘READ OTP ANA’ sequence

according to the command table and measure the value of the diode at the end of each phase.

Figure 16. Digital Interface at Analog Readback of Zener Diodes

8.7 EasyZapp OTP Content

Each AS5215 die has an integrated 32-bit OTP ROM (Easyzapp) for trimming and configuration purposes. The PROM can be programmed via.

the serial interface. For irreversible programming, an external programming voltage at PROG pin is needed. For security reasons, the factory

trim bits can be locked by a lock bit.

Remark: OTP assignment will be defined/updated.

Table 12. Serial Bit Sequence (16-bit read / write)

Write Command Read / Write Data

C4 C3 C2 C1 C0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Name Bit Count OTP Start OTP End Access Comments

Hall Bias 6 0 5 user Sets overall sensitivity

DC offset 1 6 6 user Output DC offset setting

gain 2 7 8 user Programmable gain amplifier setting

Lock 1 13 13 austriamicrosystems Set in production test

invert_channel 1 11 11 user Inverts SIN and COS channel before the

PGA for inverted output function

cm_sin 1 10 10 user Common mode voltage output enabled at SINN /

CM pin

cm_cos 1 9 9 user Common mode voltage output enabled at COSN /

CM pin

CMD0CMD1CMD2CMD3CMD4

EXT D45 EXT D44 EXT D1 EXT D0

CMD_PHASE DATA_PHASE_EXTENDED

perform analog measurements at PROG

OTP D45 OTP D44 OTP D43 OTP D0

DCLK

DIO

PROG

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AS5215

Datasheet - Application Information

8.8 Analog Sin/Cos Outputs with External Interpolator

Figure 17. Sine and Cosine Outputs for External Angle Calculation

The AS5215 provides analog Sine and Cosine outputs (SINP, COSP) of the Hall array front-end for test purposes. These outputs allow the user

to perform the angle calculation by an external ADC + µC, e.g. to compute the angle with a high resolution. The output driver capability is 1mA.

The signal lines should be kept as short as possible, longer lines should be shielded in order to achieve best noise performance.

Through the programming of one bit, you have the possibility to choose between the analog Sine and Cosine outputs (SINP, COSP) and their

inverted signals (SINN, COSN). Furthermore, by programming the bits <9:10> you can enable the common mode output signals of SIN and

COS.

The DC bias voltage is 1.5 or 2.5 V.

VDD

VSS

Micro

Controller AS5130

100n

VSS

+5V

VDD

SINP_1/SINN_1

SINN_1/SINP_1/CM_SIN_1

SINN_2/SINP_2/CM_SIN_2

VSS

AS5215

COSP_1/COSN_1

COSN_1/COSP_1/CM_COS_1

COSN_2/COSP_2/CM_COS_2

SINP_2 / SINN_2

COSP_2/COSN_2

PROG

100k

Notes:

1. We recommend to use a 100k pull-up resistance.

2. Default conditions for unused pins are: DCLK_1/2, CS_1/2, DIO_1/2, TC_1/2, A_TST_1/2, TBO_1/2, TB1_1/2, TB2_1/2,

TB3_1/2 connect to VSS

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AS5215

Datasheet - Application Information

8.9 OTP Programming and Verification

Figure 18. OTP Programming Connection

For programming of the OTP, an additional voltage has to be applied to the pin PROG. It has to be buffered by a fast 100nF capacitor (ceramic)

and a 10µF capacitor. The information to be programmed is set by command 25. The OTP bits 16 until 45 are used for AMS factory trimming and

cannot be overwritten.

After programming, the programmed OTP bits must be verified in two ways:

By Digital Verification: This is simply done by sending a READ OTP command (#15). The structure of this register is the same as for the OTP

PROG or OTP WRITE commands.

Symbol Parameter Min Max Unit Note

VDD Supply Voltage 5 5.5 V

GND Ground level 0 0 V

V_zapp Programming Voltage 8 8.5 V At pin PROG

T_zapp Temperature 0 85 ºC

f_clk CLK Frequency 100 kHz At pin DCLK

VDD

VSS

Micro

Controller

AS5130 100n

VSS

+5V

VDD

DCLK

DIO

PROG

VSS

AS5215

10µF 100n

8.0 - 8.5V

VDD

VSUPPLY

PROG

GND

C1 C2

100nF 10µF

Vzapp Vprog

PROM Cell

maximum

parasitic cable

inductance

L<50nH

I/O

Output

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AS5215

Datasheet - Application Information

By Analog V erification: By switching into Extended Mode and sending an ANALOG OTP READ command (#9), pin PROG becomes an output,

sending an analog voltage with each clock representing a sequence of the bits in the OTP register (starting with D45). A voltage of <500mV

indicates a correctly programmed bit (“1”) while a voltage level between 2V and 3.5V indicates a correctly unprogrammed bit (“0”). Any voltage

level in between indicates incorrect programming.

Figure 19. Analog OTP Verification

VDD

VSS

Micro

Controller

AS5130 100n

VSS

+5V

VDD

DCLK

DIO

PROG

VSS

AS5215

I/O

Output

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AS5215

Datasheet - Package Drawings and Markings

9 Package Drawings and Markings

The devices are available in a 32-pin QFN (7x7mm) package.

Figure 20. Package Drawings and Dimensions

Notes:

1. Dimensions and tolerancing conform to ASME Y14.5M-1994.

2. All dimensions are in millimeters. Angles are in degrees.

3. Bilateral coplanarity zone applies to the exposed pad as well as the terminal.

4. Radius on terminal is optional.

5. N is the total number of terminals.

Marking: YYWWVZZ.

YY WW VZZ

Last two digits of the manufacturing year Manufacturing week Plant identifier Assembly traceability code

Symbol Min Nom Max

A 0.80 0.90 1.00

A1 0 0.02 0.05

A2 - 0.65 1.00

A3 0.20 REF

L 0.50 0.60 0.75

Θ0º - 14º

b 0.23 0.28 0.35

D 7.00 BSC

E 7.00 BSC

e 0.65 BSC

D1 6.75 BSC

E1 6.75 BSC

D2 4.70 4.80 4.90

E2 4.70 4.80 4.90

aaa - 0.15 -

bbb - 0.10 -

ccc - 0.10 -

ddd - 0.05 -

eee - 0.08 -

fff - 0.10 -

N32

AS5215OM

YYWWVZZ

18085-002

B2P0

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AS5215
Datasheet - Revision History
Revision History
Note: Typos may not be explicitly mentioned under revision history.
Revision Date Owner Description
1.0 April 29, 2008
apg
Initial revision
July 03, 2008 Redundancy Coding topic deleted.
1.1 July 15, 2008 Updated Key Features, Table 1 - Pin Descriptions, Figure 1 and 
Figure 17.
1.2 July 14, 2009 Updated min, typ, max values for ‘Power up time’ parameter in Ta ble  6.
1.3
July 31, 2009
Updated the following parameters in Table 6:
- Values and conditions updated for
1.  Propagation delay
2.  Amplitude ratio tracking accuracy over temperature
3.  DC Offset Drift
- Deleted the ‘Output Offset’ parameter from the table.
Aug 24, 2009 Updated following bits related information on page 16 - invert_channel, 
cm_sin, cm_cos, gain, dc_offset, Hall_b
1.4 Aug 26, 2009 Inserted Figure 12 and updated Applications and Figure 17.
1.5 Sept 01, 2009 Inserted Figure 13, Added a note in Revision History.
1.6 Sept 02, 2009 Deleted ‘Displacement’ parameter from Table 5.
1.7 Nov 26, 2009 Hall Array Radius value updated from 1.1mm to 1mm
Updated Figure 13
1.8 Dec 11, 2009 Updated values for ‘Magnetic Sensitivity’ parameter in Table 6.
Dec 15, 2009 Ordering code updated.
1.9
Jan 27, 2010 Updated ‘Interface General at extended mode’ (see Table 9)
Feb 10, 2010 Updated values for ‘Power up time’ parameter in Table 6.
Mar 19, 2010 Added ‘Current Consumption’ parameter in Table 6.
1.10 Sep 06, 2010 Updated Package Drawings and Markings (page 23) and Ordering 
Information (page 25).
1.11 Jun 27, 2011 mub
Updated Absolute Maximum Ratings (page 5), Table 4, OTP 
Programming and Verification (page 21), Package Drawings and 
Markings (page 23).
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AS5215

Datasheet - Ordering Information

10 Ordering Information

The devices are available as the standard products shown in Table 13.

Note: All products are RoHS compliant and austriamicrosystems green.

Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect

Technical Support is available at http://www.austriamicrosystems.com/Technical-Support

For further information and requests, please contact us mailto: sales@austriamicrosystems.com

or find your local distributor at http://www.austriamicrosystems.com/distributor

Table 13. Ordering Information

Ordering Code Description Delivery Form Package

AS5215OM-HMFP, -HMFM Sine and cosine analog output magnetic rotary encoder Tape & Reel 32-pin QFN (7x7mm)

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AS5215

Datasheet - Copyrights

Copyrights

the copyright owner.

All products and companies mentioned are trademarks or registered trademarks of their respective companies.

Disclaimer

Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale.

austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding

the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at

any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for

current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range,

unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are

specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100

parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location.

The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not

be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use,

interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing,

performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of

austriamicrosystems AG rendering of technical or other services.

Contact Information

Headquarters

austriamicrosystems AG

Tobelbaderstrasse 30

A-8141 Unterpremstaetten, Austria

Tel: +43 (0) 3136 500 0

Fax: +43 (0) 3136 525 01

For Sales Offices, Distributors and Representatives, please visit:

http://www.austriamicrosystems.com/contact

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AS5215 AB AS5215 DB AS5215OM-HMFP-500 AS5215OM-HMFP