TM CALIFORNIA MICRO DEVICES Thin Film Resistor Series California Micro Devices offers the proven reliability of Tantalum Nitride in a high meg ohm resistor chip. Series TM high meg ohm resistor chips are available in values from 1 meg ohms to 20.0 meg ohms and tolerances to one percent. Electrical Specifications Parameter Conditions TCR -55C to 125C 2 5 0 p p m/ C Ma x Op e r a t i n g Vo l t a g e -55C to 125C 100Vdc Ma x Powe r Ra t i n g ( p e r r e s i s t o r ) @ 7 0 C ( D e r a t e l i n e a r l y t o ze r o @ 1 5 0 C ) 1 0 0 mw Ma x T h e r m a l S h o ck Me t h o d 1 0 7 MI L - STD- 2 0 2 F 0 . 5 %@R Ma x Hi g h Te mp e r a t u r e Ex p o s u r e 1 0 0 Hr s @ 1 5 0 C Amb i e n t 0 . 2 5 %R Ma x Mo i s t u r e Re s i s t a n c e Me t h o d 1 0 6 MI L - STD- 2 0 2 F 0 . 5 %R Ma x L i fe Me t h o d 1 0 8 MI L - STD- 2 0 2 F ( 1 2 5 C/ 1 0 0 0 h r ) 1 . 0 %R Ma x Noi se Me t h o d 3 0 8 MI L - STD- 2 0 2 F -20dB Ma x I nsul at i on Resi st ance @2 5 C 1 X 1 0 12 Mi n Va l u e s Bonding Area From 1 meg to 20 meg Mechanical Specifications Formats Substrate Die Size: 363 mils square Bonding Pads: 4x4 mils typical Isolation Layer Si02 10,000A thick, min Backing Lapped (gold optional) Metalization Aluminum 10,000A thick, min (15,000A gold optional) Silicon 102 mils thick Pa ck a g i n g Two inch square trays of 400 chips maximum is standard. Notes 1. Resistor pattern may vary from one value to another. Pa r t N u m b e r D e s i g n a t i o n TM Series 2005 Value First 3 digits are significant value. Last digit represents number of zeros. R indicates decimal point. F G W Tolerance Bond Pads Backing F = 1% G = Gold W = Gold G = 2% No Letter = Aluminium L = Lapped J = 5% No Letter = Either K = 10% M = 20% C1330800 (c) 2000 California Micro Devices Corp. All rights reserved. 8/7/2000 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1