Rev. 0.6 August 2012
www.aosmd.com
Page 1 of 14
AOZ3011PI
EZBuck™ 3 A Synchronous Buck Regulator
General Description
The AOZ3011PI is a high efficiency, easy to use, 3 A
synchronous buck regulator. The AOZ3011PI operates
from 4.5 V to 18 V input voltage range, and provides up
to 3 A of continuous output current with an output voltage
adjustable down to 0.8 V.
The AOZ3011PI comes in an exposed pad SO-8
package and is rated over a -40 °C to +85 °C operating
ambient temperature range.
Features
4.5 V to 18 V operating input voltage range
70 mΩ internal high-side switch and 40 mΩ internal
low-side switch (at 12 V)
Up to 95 % efficiency
External soft start
Output voltage adjustable to 0.8 V
3 A continuous output current
500 kHz PWM operation
Cycle-by-cycle current limit
Pre-bias start-up
Short-circuit protection
Thermal shutdown
Exposed pad SO-8 package
Applications
Point of load DC/DC converters
LCD TV
Set top boxes
DVD and Blu-ray players/recorders
Cable modems
Typical Application
Figure 1. 3.3 V, 3 A Synchronou s Buck Regulator, Fs = 500 kHz
LX
VIN
VIN
VOUT
FB
PGND
EN
COMP
AGND
C2, C3
22µF
R1
R2
CC
CSS
RC
C1
10µF
L1 4.7µH
AOZ3011PI
SS
Not Recommended For New Designs
Not Recommended For New Designs
Replacement Parts:
AOZ6663DI
AOZ6683CI
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 2 of 14
Ordering Information
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.
Pin Configuration
Pin Description
Part Number Ambient Temperature Range Package Environmental
AOZ3011PI -40 °C to +85 °C EPAD SO-8 Green Product
1
2
3
4
PGND
VIN
A
GND
FB
Exposed Pad SO-8
(Top View)
PAD
(LX)
LX
SS
EN
COMP
8
7
6
5
Pin Number Pin Name Pin Function
1 PGND Power ground. PGND needs to be electrically connected to AGND.
2 VIN Supply voltage input. When VIN rises above the UVLO th reshold and EN is logic high,
the device starts up.
3 AGND Analog ground. AGND is the reference point for controller section. AGND needs to be
electrically connected to PGND.
4 FB Feedback input. The FB pin is used to set the output voltage via a resistive voltage divider
between the output and AGND.
5 COMP External loop compensation pin. Connect a RC network between COMP and AGND to
compensate the control loop.
6 EN Enable pin. Pull EN to logic high to enable the device. Pull EN to logic low to disable th e
device. If on/off control in not needed, connect EN to VIN and do not leave it open.
7 SS Soft-start pin. 5 µA current charging current.
8 LX (Sense) Switching node. This pin has to be externally connected to exposed pad LX through PCB.
Exposed pad LX Switching node. LX is the drain of the internal PFET. LX is used as the thermal pad of the
power stage.
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 3 of 14
Block Diagram
Absolute Maximum Ratings
Exceeding the Absolute Maximum Ratings may damage the
device.
Note:
1. Devices are inherently ESD sensitive, handling precautions are
required. Human body model rating: 1.5 k
Ω
in series with 100 pF.
Recommended Operating Conditions
The device is not guaranteed to op erate beyond the Maximum
Recommended Operating Conditions.
500kHz
Oscillator
AGND PGND
VIN
EN
FB
SS
COMP
LX
OTP
Internal
+5V
ILimit
PWM
Control
Logic
5V LDO
Regulator
UVLO
& POR
Softstart
Reference
& Bias
0.8V
SS
5µA
Q1
Q2
PWM
Comp
Level
Shifter
+
FET
Driver
ISen
EAmp
+
–
+
–
Over-Voltage
Protection
Comparator
+
–
+
–
+
0.96V
Parameter Rating
Supply Voltage (V
IN
) 20 V
LX to AGND -0.7 V to V
IN
+0.3 V
LX to AGND (20 ns) -5 V to 22 V
EN to AGND -0.3 V to V
IN
+0.3 V
FB, SS, COMP to AGND -0.3 V to 6.0 V
PGND to AGND -0.3 V to +0.3 V
Junction Temperature (T
J
) +150 °C
Storage Temperature (T
S
) -65 °C to +150 °C
ESD Rating
(1)
2.0 kV
Parameter Rating
Supply Voltage (V
IN
) 4.5 V to 18 V
Output Voltage Range 0.8 V to 0.85*V
IN
Ambient Temperature (T
A
) -40 °C to +85 °C
Package Thermal Resistance
Exposed Pad SO-8 (
JA
) 50 °C/W
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 4 of 14
Electrical Characteristics
T
A
= 25 °C, V
IN
= V
EN
= 12 V, V
OUT
= 3.3 V unless otherw i s e specified
(2
)
Note:
2. Specification in BOLD indicate an ambient temperature range of -40 °C to +85 °C. These specifications are guaranteed by design.
Symbol Parameter Conditions Min. Typ. Max. Units
V
IN
Supply Voltage 4.5 18 V
V
UVLO
Input Under-Voltage Lockout
Threshold V
IN
Rising
V
IN
Falling 4.1
3.7 V
I
IN
Supply Current (Quiescent) I
OUT
= 0, VFB = 1.2 V, V
EN
> 2 V 1.6 2.5 mA
I
OFF
Shutdown Supply Current V
EN
= 0 V 110µA
V
FB
Feedback Voltage T
A
= 25 °C 0.788 0.8 0.812 V
Load Regulation 0.5 %
Line Regulation 1%
I
FB
Feedback Voltage Input Current 200 nA
V
EN
EN Input Threshold Off Threshold
On Threshold 2
0.6 V
V
HYS
EN Input Hysteresis 200 mV
EN Leakage Current 1µA
SS Time C
SS
= 16 nF 2 ms
MODULATOR
f
O
Frequency 400 500 600 kHz
D
MAX
Maximum Duty Cycle 85 %
T
MIN
Controllable Minimum On Time 150 ns
Current Sense Transconductance 8 A
/ V
Error Amplifier Tr ansconductance 200 µA
/
V
PROTECTION
I
LIM
Current Limit 3.5 4.5 A
V
OVP
Over-Voltage Protection Off Threshold
On Threshold 960
800 mV
Over-Temperature Shutdown Limit T
J
Rising
T
J
Falling 150
100 °C
OUTPUT STAGE
High-Side Switch On-Resistance V
IN
= 12 V
V
IN
= 5 V 70
110 m
Ω
Low-Side Switch On-Resistance V
IN
= 12 V
V
IN
= 5 V 40
50 m
Ω
Not Recommended For New Designs
Rev. 0.6 August 2012
www.aosmd.com
Page 5 of 14
AOZ3011PI
Typical Performance Characteristics
Circuit of Figure 1. TA = 25 °C, VIN = VEN = 12 V, VOUT = 3.3 V unless otherwise specified.
Light Load Operation
2µs/div
Start Up to Full Load
2µs/div
Full Load Operation
2µs/div
Short Circuit Protection
10ms/div
Short Circuit Recovery
10ms/div
Vin ripple
0.5V/div
Vo ripple
0.2V/div
VLX
10V/div
IL
2A/div
Vin
10V/div
Vo
2V/div
lo
2A/div
Vo
2V/div
VLX
10V/div
IL
2A/div
Vo
2V/div
VLX
10V/div
IL
2A/div
50% to 100% Load Transient
100µs/div
Vo ripple
0.2V/div
Io
2A/div
Vin ripple
0.2V/div
Vo ripple
0.2V/div
VLX
10V/div
IL
2A/div
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 6 of 14
Efficiency
Detailed Description
The AOZ3011PI is a current-mode step down regulator
with an integrated high- side PMOS switch and a low-side
NMOS switch. The AOZ3011PI operates from a 4.5 V to
18 V input voltage range and supplies up to 3 A of load
current. Feature s include enable control, power -on reset,
input under voltage lockout, output over voltage
protection, external soft-start and thermal shut down.
The AOZ3011PI is available in an exposed pad SO-8
package.
Enable and Soft Start
The AOZ3011PI has an external soft start feature to limit
in-rush current and ensure the output voltage ramps up
smoothly to regulation voltage. The soft start process
begins when the input voltage rises to 4.1 V and voltage
on the EN pin is HIGH. In the soft start process, the
FB volt age is ramped to follow the voltage of the soft start
pin until it reaches 0.8 V. The voltage of the soft-start pin
is charged by an internal 5 µA current.
The EN pin of the AOZ3 011PI is active high. Conn ect the
EN pin to VIN if the enable function is not used. Pulling
EN to ground will disable the AOZ3011PI. Do not leave
EN open. The voltage on the EN pin must be above 2 V
to enable the AOZ3011PI. When the EN pin voltage falls
below 0.6 V, the AOZ3011PI is disabled.
Steady-State Operation
Under heavy load steady-state conditions, the converter
operates in fixed frequency and Continuous-Conduction
Mode (CCM).
The AOZ3011PI integrates an inte rnal P-MOSFET as the
high-side switch. In ductor current is sensed by amplifying
the voltage drop across the drain to source of the high
side power MOSFET. Output voltage is divided down by
the external voltage divider at the FB pin. The difference
of the FB pin voltage and reference voltage is amplified
by the internal transconductance error amplifier. The
error voltage, which shows on the COMP pin, is
compared against the current signal, which is the sum of
inductor current signal and ramp compensation signal, at
the PWM comparator input. If the current signal is less
than the error voltage, the internal high-side switch is on.
The inductor current flows from the input through the
inductor to the output. When the current signal exceeds
the error volt age, the high-side switch is of f. The inductor
current is freewheeling through the internal low-side
N-MOSFET switch to output. The internal adaptive FET
driver guarantees no turn on overlap of both the
high-side and the low-side switch.
Efficiency (VIN = 12V, L = 4.7µH) vs. Load Current
100
95
90
85
80
75
70
65
60
55
50
0 0.5 1.0 1.5 2.0 2.5 3.0
Load Current (A )
Efficiency (%)
5V OUTPUT
3.3V OUTPUT
1. 8V O UTPUT
1. 2V O UTPUT
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 7 of 14
Compared with regulators using freewheeling Schottky
diodes, the AOZ3011PI uses a freewheeling NMOSFET
to realize synchron ou s re ctif ica tion . Th is grea tly
improves the converter efficiency and reduces power
loss in the low-side switch.
The AOZ3011PI uses a P-Channel MOSFET as the
high-side switch. This saves the bootstrap capacitor
normally seen in a circuit using an NMOS switch. It also
allows 100 % turn-on of th e hig h- sid e swit ch to achi ev e
linear regulation mode of operation. The minimum
voltage drop from VIN to VO is the load current times DC
resistance of the MOSFET plus DC resistance of the
buck inductor. It can be calculated by equation below:
where;
V
O_MAX
is the maximum output voltage,
V
IN
is the input voltage from 4.5 V to 18 V,
I
O
is the output current from 0 A to 3 A, and
R
DS(ON)
is the on resistance of the internal MOSFET.
Output Voltage Programming
Output voltage can be set by feeding back the output to
the FB pin using a resistor divider network as shown in
Figure 1. The resistor divider network includes R1 and
R2. Usually, a design is started by picking a fixed R2
value and calculating the required R1 with the equation
below:
Some sta ndard value of R1 and R2 for the most common
output voltages are listed in Table 1.
Table 1.
The combination of R1 and R2 sho uld be large enough to
avoid drawing excessive current from the output, which
will cause power loss.
Since the switch duty cycle can be as high as 100 %, the
maximum output voltage can be set as high as the input
voltage minus the voltage drop on the up pe r PM OS an d
the inductor.
Protection Features
The AOZ3011PI has multiple protection features to
prevent system circuit damage under abnormal
conditions.
Over Current Protection (OCP)
The sensed inductor current signal is also used for over
current prot ec tio n. Sinc e th e AOZ3 011PI emp lo ys peak
current mode control, the COMP pin voltage is
proportional to the peak inductor current. The COMP pin
voltage is limited to be between 0.4 V and 2.5 V internally.
The peak inductor current is automatically limited
cycle-by-cycle.
When the output is shorted to ground under fault
conditions, the inductor current slowly decays during a
switching cycle because the output voltage is 0 V.
To prevent catastrophic failure, a secondary current limit
is designed inside the AOZ3011PI. The measured
inductor current is compared against a preset voltage
which represent s the current limit, between 3.5 A and 5.0
A. When the output current is greater than the current
limit, the high side switch will be turned off. The converter
will initiate a soft start once the over-current condition is
resolved.
Power-On Reset (POR)
A power-on reset circuit monitors the input volt age. When
the input voltage exceeds 4.1 V, the converter starts
operation. When input voltage falls below 3.7 V, the
converter will be shut down.
Thermal Protection
An internal temperature sensor monitors the junction
temperature. The sensor shuts down the internal control
circuit and high side PMOS if the junction temperature
exceeds 150 ºC. The regulator will restart automatically
under the control of the soft-start circuit when the junction
temperature decreases to 100 ºC.
VO (V) R1 (k
Ω
) R2 (k
Ω
)
0.8 1.0 Open
1.2 4.99 10
1.5 10 11.5
1.8 12.7 10.2
2.5 21.5 10
3.3 31.1 10
5.0 52.3 10
VO_MAX VIN IORDS ON
–=
VO0.8 1 R1
R2
-------
+



=
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 8 of 14
Application Information
The basic AOZ3011PI application circuit is show in
Figure 1. Component selection is explained below.
Input Capacitor
The input ca pacitor must be connected to t he V
IN
pin and
the PGND pin of AOZ3011PI to maintain steady input
voltage and filter out the pulsing input current. The
voltage rating of input capacitor must be greater than
maximum input voltage plus ripple voltage.
The input ripple voltage can be approximated by
equation below:
Since the input current is discontinuous in a buck
converter, the current stress on the input capacitor is
another concer n when selecting the cap acitor . For a buck
circuit, the RMS value of input capacitor current can be
calculated by:
if we let
m
equal the conversion ratio:
The relationship between the input capacitor RMS
current and voltage conv er sio n ratio is calcula te d and
shown in Figure 2 below. It can be seen that when V
O
is
half of V
IN
, C
IN
is under the worst current stress. The
worst current stress on C
IN
is 0.5 x I
O
.
Figure 2. I
CIN
vs. Voltage Conversion Ratio
For reliable operation and best performance, the input
capacitors must have a current rating higher than
I
CIN_RMS
at the worst operating conditions. Ceramic
capacitors are preferred for input capacitors because of
their low ESR and high current rating. Depending on the
application circuits, other low ESR tantalum capacitors
may be used. Whe n selecting ceramic capacitors , X5R or
X7R type dielectric ceramic capacitors should be used
for their better tem p erat ur e an d vo ltage char ac te rist ics.
Note that the ripple current rating from capacitor
manufactures are based on a certain operating life time.
Further de-rating may need to be considered for long
term reliability.
Inductor
The inductor is used to supply constant current to output
when it is driven by a switching volt age. For a given input
and output voltage, inductance and switching frequency
together decide the inductor ripple current, which is:
The peak inductor current is:
High inductance gives low inductor ripple current but
requires larger size inductor to avoid saturation. Low
ripple current reduces inductor core losses. It also
reduces RMS current through inductor and switches,
which results in less conduction loss. Usually, peak to
peak ripple current on the inductor is designed to be
20 % to 40 % of output current.
When selecting the inductor, confirm it is able to handle
the peak current without saturation at the highest
operating temperature.
The inductor takes the highest current in a buck circuit.
The conduction loss on the indu ctor needs to be checked
for thermal and efficiency requirements.
Surface mount in ductors in dif ferent shape an d styles are
available from Coilcraft, Elytone and Murata. Shielded
inductors are sma ll and radiat e less EMI no ise. However,
they cost more than unshielded inductors. The choice
depends on EMI requirement, price and size.
0
0.1
0.2
0.3
0.4
0.5
0 0.5 1
m
I
CIN_RMS
(m)
I
O
ILVO
fL
-----------1VO
VIN
---------
–



=
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 9 of 14
Output Capacitor
The output capacitor is selected based on the DC output
voltage rating, output ripple voltage specification and
ripple current rating.
The selected output capacitor must have a higher rated
voltage specification than the maximum desired output
voltage including ripple. De-rating needs to be
considered for long term reliability.
Output ripple voltage specification is another important
factor for selecting the output capacitor. In a buck
converter circuit, output ripple voltage is determined by
inductor value , s witc hin g fr eq ue n cy, output capacitor
value and ESR. It can be calculated by the equation
below:
where,
C
O
is output capacitor value, and
ESR
CO
is the equivalent series resistance of the output
capacitor.
When a low ESR ceramic cap aci tor is u sed as the output
capacitor, the impedance of the cap acitor at the switching
frequency dominates. Output ripple is mainly caused by
capacitor value and inductor ripple current. The output
ripple voltage calculation ca n be simp lified to :
If the impedance of ESR at switching frequency
dominates, the ou tput r ipple volt age is mainly de cided by
capacitor ESR and inductor ripple current. The output
ripple voltage calculation can be further simplified to:
For lower output ripple voltage across the entire
operating temperature range, X5R or X7R dielectric type
of ceramic, or other low ESR tantalum capacitors are
recommended as output capacitors.
In a buck converter, output capacitor current is
continuous. The RMS current of output capacitor is
decided by the peak to peak ind uctor ripple current. It can
be calculated by:
Usually, the ripple current r ating of the ou tput cap acitor is
a smaller issue because of the low current stress. When
the buck inductor is selected to be very small and
inductor ripple current is high, the output capacitor could
be overstressed.
Loop Compensation
The AOZ3011PI employs peak current mode control for
ease of use and fast transient response. Peak current
mode control eliminates the double pole effect of the
output L&C filter. It also gr eatly sim plif ies the
compensation loop design.
With peak current mode control, the buck power stage
can be simplified to be a one-pole and one-zero system
in frequency domain. The pole is dominant pole can be
calculated by:
The zero is a ESR zero due to the output capacitor and
its ESR. It is can be calculated by:
where;
C
O
is the output filter capacitor,
R
L
is load resistor value, and
ESR
CO
is the equivalent series resistance of output capacitor.
The compensation design shapes the converter control
loop transfer function for the desired gain and phase.
Several dif ferent type s of compensation ne tworks can be
used with the AOZ3011PI. For most cases, a series
capacitor and resistor network connected to the
COMP pin set s the pole-zero and is adequate for a stable
high-bandwidth control loop.
In the AOZ3011PI, FB and COMP are the inverting input
and the output of the internal error amplifier. A series
R and C compensation network connected to COMP
provides one pole and one zero. The pole is:
where;
G
EA
is the error amplifier transconductance, which is 200 x 10
-6
A/V,
G
VEA
is the error amplifier voltage gain, which is 500 V/V, and
C
C
is the compensation capacitor in Figure 1.
VOIL1
8fC
O
-------------------------
=
VOILESRCO
=
fP11
2CORL
-----------------------------------
=
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 10 of 14
The zero given by the external compensation network,
capacitor C
C
and resistor R
C
, is located at:
To design the compensation circuit, a target crossover
frequency f
C
to close the loop must be selected. The
system crossover frequency is where the control loop
has unity gain. The crossover is the also called the
converter bandwidth. Generally a higher bandwidth
means faster response to load transients. However, the
bandwidth should not be too high because of system
stability concern. When designing the compensation
loop, converter stability under all line and load condition
must be considered.
Usually, it is recommended to set the bandwidth to be
equal or less than 1/10 of the switching frequency.
The strategy for choosing R
C
and C
C
is to set the cross
over frequency with R
C
and set the compensator zero
with C
C
. Using selected crossover frequency, f
C
, to
calculate R
C
:
where;
f
C
is the desired crossover frequency. For best pe rformance,
f
C
is set to be about 1/10 of the switching frequency;
V
FB
is 0.8V,
G
EA
is the error amplifier transconductance, which is
200 x 10
-6
A/V, and
G
CS
is the current sense circuit transconductance, which is
8 A/V
The compensation capacitor C
C
and resistor R
C
together
make a zero. This zero is put somewhere close to the
dominate pole f
p1
but lower than 1/5 of the selected
crossover frequency. C
C
can is selected by:
The above equation can be simplified to:
An easy-to-use application software which helps to
design and simulate the compensat ion loop can be found
at www.aosmd.com.
Thermal Management and Layout
Considerations
In the AOZ3011PI buck regulator circuit, high pulsing
current flows through two circuit loops. The first loop
starts from the input capacitors, to the VIN pin, to the
LX pad, to the filter inductor, to the output capacitor and
load, and then returns to the input capacitor through
ground. Current flows in the first loop when the high side
switch is on. The second loop starts from the inductor,
to the output capacitors and load, to the low side
NMOSFET. Current flows in the second loop when the
low side NMOSFET is on.
In PCB layout, minimizing the area of the two loops will
reduce the noise of the circuit and improves efficiency.
A ground plane is strongly recommended to connect the
input capacitor, the out put ca pacitor, an d th e PGN D pin
of the AOZ3011PI.
In the AOZ3011PI buck regulator circuit, the major power
dissipating components are the AOZ3011PI and the
output inductor. The total power dissipation of converter
circuit can be measured by input power minus output
power:
The power dissipation of the inductor can be
approximately calculated by the output current and DCR
value of the inductor:
The actual junction temperature can be calculated by the
power dissipation in the AOZ3011PI and the thermal
impedance from junction to ambient:
The maximum junction temperature of the AOZ3011PI is
150 ºC, which limits the maximum load current capability.
Please see the thermal de-rating curves for maximum
load current of the AOZ3011PI under different ambient
temperature.
The thermal performance of the AOZ3011PI is strongly
affected by the PCB layout. Care should be taken during
the design process to ensure that the IC will operate
under the recommended environmental conditions.
RCfCVO
VFB
---------- 2CC
GEA GCS
------------------------------
=
CCCORL
RC
---------------------
=
Ptotal_loss VIN IIN VOIO
–=
Pinductor_loss IO2Rinductor 1.1=
Tjunction Ptotal_loss Pinductor_loss
–JA
=
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 11 of 14
Layout Considerations
The AOZ3011PI is an expose d pad SO-8 package.
Several layout tips are listed for the be st ele ctr ic an d
thermal perf or ma n ce .
1. The exposed pad (LX) is connected to the internal
PFET and NFET drains. Connected a large copper
plane to the LX pin to help th er mal diss ipation.
2. Do not use a thermal relief connect ion to t he VIN pin
or the PGND pin. Pour a maximized copper area to
the PGND pin and the VIN pin to help thermal
dissipation.
3. The input cap acitor should be connected as close as
possible to the VIN pin and the PGND pin.
4. A ground plane is preferred. If a ground plane is not
used, separate PGND from AGND and only connect
them at one point to avoid the PGND pin noise
coupling to the AGN D pin.
5. Make the current trace from the LX pad to L to Co to
the PGND as short as possible.
6. Pour copper plane on all unused board area and
connect it to stable DC nodes, like VIN, GND or
VOUT.
7. Keep sensitive signal trace away from the LX pad.
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 12 of 14
Package Dimensions, SO-8 EP1
Notes:
1. Package body sizes exclude mold flash and gate burrs.
2. Dimension L is measured in gauge plane.
3. Tolerance 0.10mm unless otherwise specified.
4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Followed from JEDEC MS-012
Symbols
A
A1
A2
B
C
D
D0
D1
E
e
E1
E2
E3
L
y
θ
| L1–L1' |
L1
Dimensions in millimeters
RECOMMENDED LAND PATTERN
Min.
1.40
0.00
1.40
0.31
0.17
4.80
3.20
3.10
5.80
—
3.80
2.21
0.40
—
0°
—
D0
UNIT: mm
θ
Nom.
1.55
0.05
1.50
0.406
—
4.96
3.40
3.30
6.00
1.27
3.90
2.41
0.40 REF
0.95
—
3°
0.04
1.04 REF
Max.
1.70
0.10
1.60
0.51
0.25
5.00
3.60
3.50
6.20
—
4.00
2.61
1.27
0.10
8°
0.12
Dimensions in inches
D1
E1 E
E3E2
Note 5 L1'
L1
L
Gauge plane
0.2500 C
D
7 (4x)
B
3.70
2.20
2.87
2.71 5.74
1.27 0.80
0.635
eA1
A2 A
Symbols
A
A1
A2
B
C
D
D0
D1
E
e
E1
E2
E3
L
y
θ
| L1–L1' |
L1
Min.
0.055
0.000
0.055
0.012
0.007
0.189
0.126
0.122
0.228
—
0.150
0.087
0.016
—
0°
—
Nom.
0.061
0.002
0.059
0.016
—
0.195
0.134
0.130
0.236
0.050
0.153
0.095
0.016 REF
0.037
—
3°
0.002
0.041 REF
Max.
0.067
0.004
0.063
0.020
0.010
0.197
0.142
0.138
0.244
—
0.157
0.103
0.050
0.004
8°
0.005
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 13 of 14
Tape and Reel Dimensions, SO-8 EP1
Carrier Tape
Reel
Tape Size
12mm Reel Size
ø330 M
ø330.00
±0.50
Package
SO-8
(12mm)
A0
6.40
±0.10
B0
5.20
±0.10
K0
2.10
±0.10
D0
1.60
±0.10
D1
1.50
±0.10
E
12.00
±0.10
E1
1.75
±0.10
E2
5.50
±0.10
P0
8.00
±0.10
P1
4.00
±0.10
P2
2.00
±0.10
T
0.25
±0.10
N
ø97.00
±0.10
K0
UNIT: mm
B0
G
M
W1
S
K
H
N
W
V
R
Trailer Tape
300mm min. or
75 empty pockets
Components Tape
Orientation in Pocket Leader Tape
500mm min. or
125 empty pockets
A0
P1
P2
Feeding Direction
P0
E2
E1
E
D0
TD1
W
13.00
±0.30
W1
17.40
±1.00
H
ø13.00
+0.50/-0.20
K
10.60 S
2.00
±0.50
G
—R
—V
—
Leader/Trailer and Orientation
UNIT: mm
Not Recommended For New Designs
AOZ3011PI
Rev. 0.6 August 2012
www.aosmd.com
Page 14 of 14
Part Marking
Z3011PI
FAY Part Number Code
Assembly Lot Code
Year & Week Code
WLT
Fab & Assembly Location
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
2. A critical component in any component of a life
support, d evice, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
This data sheet contains preliminary data; supplementary data may be published at a later date.
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.
LIFE SUPPORT POLICY
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
Not Recommended For New Designs