Technical Data Sheet LOCTITE GC 10 May-2015 PRODUCT DESCRIPTION LOCTITE GC 10 provides the following product characteristics: Technology Application No-clean and Halogen-free Solder Paste Pb-free soldering LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes and component metallizations including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints. LOCTITE GC 10 is suitable for use with industry standard SAC alloys. FEATURES AND BENEFITS Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582 Halogen-free flux classification: ROL0 to ANSI/J-STD-004 Rev. B Printing: down to 0.3 mm pitch Printing: up to 72 hours stencil life Printing: up to 24 hours abandon time Printing: up to 125 mms-1 Printing: improved paste-transfer efficiency Printing: suitable for high-speed printing up to 125 mms-1 Reflow: improved process window (high soak temperatures and time) with superior coalescence and wetting Reflow: enhanced soak process window 150-200C (temperature and time) Reflow: minimum hot slump at 182C Reflow: superior coalescence and wetting on small components down to 01005 Reflow: very shiny solder joints Reflow: clear, colorless residues for easy post-reflow inspection Reflow: residues print testable after 4x reflows TYPICAL PROPERTIES Solder Powder: Solder powder is produced to a quality level that exceeds IPC industry requirements for sphericity, size distribution, impurities and oxide levels. All solder powders are RoHS compliant. Particle Size Distribution (PSD) (J-STD-005A) Powder Description T4 Powder Particle Size Distribution 20 to 38 m Former PSD DAP Solder Alloy (J-STD 006) LOCTITE Code Alloy Melting Point (C) Ag % SAC305 Industry Standard 217 3.0 Based on type 4 powder. Solder Paste Typical Properties Metal Content, % Brookfield Viscosity @ 25C, mPas Spindle TF, speed 5, rpm, after 2 minutes Malcom Viscosity @ 25C, Pa.s Speed 10 rpm Malcom Thixotropic Index IPC Slump A21 mm 25C, 15 minutes 0.33 x 2.03 mm pads 0.63 x 2.03 mm pads IPC Slump A21 mm 182C, 15 minutes 0.33 x 2.03 mm pads 0.63 x 2.03 mm pads 88.5 900,000 190 0.5 0.10 0.33 0.20 0.33 DIRECTIONS FOR USE Printing: LOCTITE GC 10 is available for stencil printing with Type 4 powder. Printing at speeds between 25 to 125 mms-1 can be achieved using laser cut, electropolished or electroformed stencils with metal squeegees. Reflow: Suitable for convection, IR, hot belt and vapor phase. Proven profiles for multiple circuit board configurations. Reflow Profile TDS LOCTITE GC 10, May-2015 Cleaning: Cleaning Solder Paste from Stencils: LOCTITE GC 10 is a no-clean solder paste designed to be left on the PCB in many applications post assembly; it does not pose a hazard to long-term reliability For stencil cleaning and cleaning board misprints, LOCTITE MSC 01 solvent cleaner is recommended . Cleaning Solder Paste from Circuit Boards: Residues can be removed using conventional cleaning processes based on solvents, such as LOCTITE MCF 800. Cleaning of some assemblies is best conducted in an ultrasonic bath. Tap water is not recommended for rinsing. Ionic impurities present in tap water can lead to reduced reliability of the assembly. . RELIABILITY PROPERTIES Solder Paste Medium: LOCTITE GC 10 medium contains a stable resin system, slow evaporating solvents and with minimal odor. The formulation has been tested to the requirements of the ANSI/J-STD-004B for a type ROL0 classification specifications. Test Flux Corrosion Copper Mirror Surface Insulation Resistance (SIR) Electromigration (ECM) Flux Activity Classification Specification J-STD004B (2.6.15C) J-STD004B (2.3.32D) J-STD004B (2.6.3.7) Results Pass Pass Pass J-STD004B (2.6.14.1) J-STD004B Pass ROL0 PACKAGING LOCTITE GC 10 is available in both jars and semco cartridges. Other types of packaging may be available on request. Storage: Optimal storage: 5 to 26.5C Storage information may be indicated on the product container labelling. Material removed from containers may be contaminated during use. Do not return products to the original container. Henkel Corporation cannot assume responsibility for product that has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative. Shelf Life: Provided that LOCTITE GC 10 is stored in the original container, a minimum shelf life of 365 days at 5 to 26.5C or 31 days at 40C can be expected. Air shipment is recommended to minimize the time the containers are exposed to higher temperatures. DATA RANGES The data contained herein may be reported as a typical value and/or a range. Values are based on actual test data and are verified on a periodic basis. GENERAL INFORMATION For safe handling information on this product, consult the Material Safety Data Sheet (MSDS). Not for Product Specifications The technical information contained herein is intended for reference only. Please contact Henkel Technologies Technical Service for assistance and recommendations on specifications for this product. Conversions (C x 1.8) + 32 = F kV/mm x 25.4 = V/mil mm / 25.4 = inches m / 25.4 = mil N x 0.225 = lb N/mm x 5.71 = lb/in N/mm x 145 = psi MPa x 145 = psi N*m x 8.851 = lb*in N*m x 0.738 = lb*ft N*mm x 0.142 = oz*in mPa*s = cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable, on whatever legal ground, Henkel's liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation's products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. Trademark usage Except as otherwise noted, all trademarks in this document are trademarks of Henkel Corporation in the U.S. and elsewhere. (R) denotes a trademark registered in the U.S. Patent and Trademark Office. Reference 0.2 Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics