LM4862
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LM4862 675 mW Audio Power Amplifier with Shutdown
Mode
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1FEATURES DESCRIPTION
The LM4862 is a bridge-connected audio power
2• No Output Coupling Capacitors, Bootstrap amplifier capable of delivering typically 675mW of
Capacitors or Snubber Circuits are Necessary continuous average power to an 8Ωload with 1%
• Small Outline or PDIP Packaging THD+N from a 5V power supply.
• Unity-Gain Stable Boomer audio power amplifiers were designed
• External Gain Configuration Capability specifically to provide high quality output power with a
minimal amount of external components. Since the
• Pin Compatible with LM4861 LM4862 does not require output coupling capacitors,
bootstrap capacitors, or snubber networks, it is
APPLICATIONS optimally suited for low-power portable systems.
• Portable Computers The LM4862 features an externally controlled, low-
• Cellular Phones power consumption shutdown mode, as well as an
• Toys and Games internal thermal shutdown protection mechanism.
The unity-gain stable LM4862 can be configured by
KEY SPECIFICATIONS external gain-setting resistors.
• THD+N for 500mW Continuous Average
Output Power at 1kHz into 8Ω1% (max)
• Output Power at 10% THD+N at 1kHz into 8Ω
825 mW (typ)
• Shutdown Current 0.7μA (typ)
Typical Application
Connection Diagram
*Refer to Application Information for information concerning proper
selection of the input coupling capacitor.
Figure 1. Typical Audio Amplifier Application Figure 2. Small Outline and PDIP Package-Top
Circuit View
See Package Number D0008A or P0008E
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1997–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM4862
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD + 0.3V
Power Dissipation(3) Internally limited
ESD Susceptibility(4) 2000V
ESD Susceptibility(5) 200V
Junction Temperature 150°C
Soldering Information Small Outline Package Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
Thermal Resistance θJC (typ)—D0008A 35°C/W
θJA (typ)—D0008A 170°C/W
θJC (typ)—P0008E 37°C/W
θJA (typ)—P0008E 107°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TMAX −TA)/θJA. For the LM4862, TJMAX = 150°C. The typical junction-to-
ambient thermal resistance, when board mounted, is 170°C/W for package number D0008A and is 107°C/W for package number
P0008E.
(4) Human body model, 100 pF discharged through a 1.5 kΩresistor.
(5) Machine Model, 200 pF–240 pF discharged through all pins.
Operating Ratings
Temperature Range TMIN ≤TA≤TMAX −40°C ≤TA≤85°C
Supply Voltage 2.7V ≤VDD ≤5.5V
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Electrical Characteristics(1)(2)
The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA= 25°C.
Symbol Parameter Conditions LM4862 Units
(Limits)
Typical(3) Limit(4)
VDD Supply Voltage 2.7 V (min)
5.5 V (max)
IDD Quiescent Power Supply Current VIN = 0V, IO= 0A(5) 3.6 6.0 mA (max)
ISD Shutdown Current VPIN1 = VDD 0.7 5 μA (max)
VOS Output Offset Voltage VIN = 0V 5 50 mV (max)
POOutput Power THD = 1% (max); f = 1 kHz; RL= 8Ω675 500 mW (min)
THD + N = 10%; f = 1 kHz; RL= 8Ω825 mW
THD + N Total Harmonic Distortion + Noise PO= 500 mWrms; RL= 8Ω0.55 %
AVD = 2; 20 Hz ≤f≤20 kHz
PSRR Power Supply Rejection Ratio VDD = 4.9V to 5.1V 50 dB
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are ensured to TI's AOQL (Average Outgoing Quality Level).
(5) The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.
Automatic Switching Circuit
Figure 3. Automatic Switching Circuit
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External Components Description
(Figure 1)
Components Functional Description
1. RiInverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high pass filter
with Ciat fc= 1/(2πRiCI).
2. CiInput coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a highpass filter with Ri
at fc= 1/(2πRiCi). Refer to PROPER SELECTION OF EXTERNAL COMPONENTS for an explanation of how to determine
the value of Ci.
3. RFFeedback resistance which sets the closed-loop gain in conjunction with Ri.
4. CSSupply bypass capacitor which provides power supply filtering. Refer to POWER SUPPLY BYPASSING for proper
placement and selection of the supply bypass capacitor.
5. CBBypass pin capacitor which provides half-supply filtering. Refer to PROPER SELECTION OF EXTERNAL COMPONENTS
for proper placement and selection of the half-supply bypass capacitor.
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Typical Performance Characteristics
THD+N THD+N
vs vs
Frequency Frequency
Figure 4. Figure 5.
THD+N THD+N
vs vs
Frequency Output Power
Figure 6. Figure 7.
THD+N THD+N
vs vs
Output Power Output Power
Figure 8. Figure 9.
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Typical Performance Characteristics (continued)
Output Power vs Output Power vs
Supply Voltage Supply Voltage
Figure 10. Figure 11.
Output Power vs Output Power vs
Supply Voltage Load Resistance
Figure 12. Figure 13.
Power Dissipation vs
Output Power Power Derating Curve
Figure 14. Figure 15.
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Typical Performance Characteristics (continued)
Dropout Voltage vs
Power Supply Noise Floor
Figure 16. Figure 17.
Frequency Response vs Power Supply
Input Capacitor Size Rejection Ratio
Figure 18. Figure 19.
Open Loop Supply Current vs
Frequency Response Supply Voltage
Figure 20. Figure 21.
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APPLICATION INFORMATION
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4862 has two operational amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in
a unity-gain, inverting configuration. The closed-loop gain of the first amplifier is set by selecting the ratio of Rfto
Riwhile the second amplifier's gain is fixed by the two internal 10 kΩresistors. Figure 1 shows that the output of
amplifier one serves as the input to amplifier two which results in both amplifiers producing signals identical in
magnitude, but out of phase 180°. Consequently, the differential gain for the IC is
AVD = 2*(Rf/Ri) (1)
By driving the load differentially through outputs Vo1 and Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is different from the classical single-ended amplifier
configuration where one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over the single-ended configuration, as it provides
differential drive to the load, thus doubling output swing for a specified supply voltage. Consequently, four times
the output power is possible as compared to a single-ended amplifier under the same conditions. This increase in
attainable output power assumes that the amplifier is not current limited or clipped. In order to choose an
amplifier's closed-loop gain without causing excessive clipping which will damage high frequency transducers
used in loudspeaker systems, please refer to AUDIO POWER AMPLIFIER DESIGN.
A bridge configuration, such as the one used in LM4862, also creates a second advantage over single-ended
amplifiers. Since the differential outputs, Vo1 and Vo2, are biased at half-supply, no net DC voltage exists across
the load. This eliminates the need for an output coupling capacitor which is required in a single supply, single-
ended amplifier configuration. Without an output coupling capacitor, the half-supply bias across the load would
result in both increased internal lC power dissipation and also permanent loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power delivered to the load by a bridge amplifier is an
increase in internal power dissipation. Equation 2 states the maximum power dissipation point for a bridge
amplifier operating at a given supply voltage and driving a specified output load.
PDMAX = 4*(VDD)2/(2π2RL) (2)
Since the LM4862 has two operational amplifiers in one package, the maximum internal power dissipation is 4
times that of a single-ended amplifier. Even with this substantial increase in power dissipation, the LM4862 does
not require heatsinking. From Equation 2, assuming a 5V power supply and an 8Ωload, the maximum power
dissipation point is 625 mW. The maximum power dissipation point obtained from Equation 2 must not be greater
than the power dissipation that results from Equation 3:
PDMAX = (TJMAX–TA)/θJA (3)
For package D0008A, θJA = 170°C/W and for package P0008E, θJA = 107°C/W. TJMAX = 150°C for the LM4862.
Depending on the ambient temperature, TA, of the system surroundings, Equation 3 can be used to find the
maximum internal power dissipation supported by the IC packaging. If the result of Equation 2 is greater than
that of Equation 3, then either the supply voltage must be decreased, the load impedance increased, or the
ambient temperature reduced. For the typical application of a 5V power supply, with an 8Ωload, the maximum
ambient temperature possible without violating the maximum junction temperature is approximately 44°C
provided that device operation is around the maximum power dissipation point. Power dissipation is a function of
output power and thus, if typical operation is not around the maximum power dissipation point, the ambient
temperature can be increased. Refer to Typical Performance Characteristics for power dissipation information for
lower output powers.
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POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. As displayed in Typical Performance Characteristics, the effect of a larger half supply bypass capacitor
is improved PSSR due to increased half-supply stability. Typical applications employ a 5V regulator with 10 μF
and a 0.1 μF bypass capacitors which aid in supply stability, but do not eliminate the need for bypassing the
supply nodes of the LM4862. The selection of bypass capacitors, especially CB, is thus dependant upon desired
PSSR requirements, click and pop performance as explained in PROPER SELECTION OF EXTERNAL
COMPONENTS, system cost, and size constraints.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4862 contains a shutdown pin to externally turn off
the amplifier's bias circuitry. The shutdown feature turns the amplifier off when a logic high is placed on the
shutdown pin. The trigger point between a logic low and logic high level is typically half supply. It is best to switch
between ground and supply to provide maximum device performance. By switching the shutdown pin to VDD, the
LM4862 supply current draw will be minimized in idle mode. While the device will be disabled with shutdown pin
voltages less than VDD, the idle current may be greater than the typical value of 0.7 μA. In either case, the
shutdown pin should be tied to a definite voltage because leaving the pin floating may result in an unwanted
shutdown condition.
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry which
provides a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch
that when closed, is connected to ground and enables the amplifier. If the switch is open, then a soft pull-up
resistor of 47 kΩwill disable the LM4862. There are no soft pull-down resistors inside the LM4862, so a definite
shutdown pin voltage must be applied externally, or the internal logic gate will be left floating which could disable
the amplifier unexpectedly.
AUTOMATIC SWITCHING CIRCUIT
As shown in Figure 3, the LM4862 and the LM4880 can be set up to automatically switch on and off depending
on whether headphones are plugged in. The LM4880 is used to drive a stereo single ended load, while the
LM4862 drives a bridged internal speaker.
The Automatic Switching Circuit is based upon a single control pin common in many headphone jacks which
forms a normally closed switch with one of the output pins. The output of this circuit (the voltage on pin 5 of the
LM4880) has two states based on the position of the switch. When the switch inside the headphone jack is open,
the LM4880 is enabled and the LM4862 is disabled since the NMOS inverter is on. If a headphone jack is not
present, it is assumed that the internal speakers should be on and the external speakers should be off. Thus the
voltage on the LM4862 shutdown pin is low and the voltage on the LM4880 shutdown pin is high.
The operation of this circuit is rather simple. With the switch closed, RPand ROform a resistor divider which
produces a gate voltage of less than 50 mV. The gate voltage keeps the NMOS inverter off and RSD pulls the
shutdown pin of the LM4880 to the supply voltage. This shuts down the LM4880 and places the LM4862 in its
normal mode of operation. When the switch is open, the opposite condition is produced. Resistor RPpulls the
gate of the NMOS high which turns on the inverter and produces a logic low signal on the shutdown pin of the
LM4880. This state enables the LM4880 and places the LM4862 in shutdown mode.
Only one channel of this circuit is shown in Figure 3 to keep the drawing simple but a typical application would be
a LM4880 driving a stereo headphone jack and two LM4862's driving a pair of internal speakers. If a single
internal speaker is required, one LM4862 can be used as a summer to mix the left and right inputs into a mono
channel.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical to optimize
device and system performance. While the LM4862 is tolerant of external component combinations,
consideration to component values must be used to maximize overall system quality.
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The LM4862 is unity-gain stable which gives a designer maximum system flexibility. The LM4862 should be used
in low gain configurations to minimize THD+N values, and maximize the signal to noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1
Vrms are available from sources such as audio codecs. Please refer to AUDIO POWER AMPLIFIER DESIGN for
a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closed-loop bandwidth of the amplifier. To a large extent, the
band-width is dictated by the choice of external components shown in Figure 1. The input coupling capacitor, Ci,
forms a first order high pass filter which limits low frequency response. This value should be chosen based on
needed frequency response for a few distinct reasons.
Selection of Input Capacitor Size
Large input capacitors are both expensive and space hungry for portable designs. Clearly, a certain sized
capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the speakers
used in portable systems, whether internal or external, have little ability to reproduce signals below 100–150 Hz.
Thus using a large input capacitor may not increase system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling
capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally
½ VDD). This charge comes from the output via the feedback and is apt to create pops upon device enable. Thus,
by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value.
Bypass capacitor, CB, is the most critical component to minimize turn-on pops since it determines how fast the
LM4862 turns on. The slower the LM4862's outputs ramp to their quiescent DC voltage (nominally ½ VDD), the
smaller the turn-on pop. Choosing CBequal to 1.0 μF along with a small value of Ci(in the range of 0.1 μF to
0.39 μF), should produce a virtually clickless and popless shutdown function. While the device will function
properly, (no oscillations or motorboating), with CBequal to 0.1 μF, the device will be much more susceptible to
turn-on clicks and pops. Thus, a value of CBequal to 1.0 μF or larger is recommended in all but the most cost
sensitive designs.
AUDIO POWER AMPLIFIER DESIGN
Design a 500 mW/8ΩAudio Amplifier
Given:
Power Output 500 mWrms
Load Impedance 8Ω
Input Level 1 Vrms
Input Impedance 20 kΩ
Bandwidth 100 Hz–20 kHz ± 0.25 dB
A designer must first determine the minimum supply rail to obtain the specified output power. By extrapolating
from Figure 10,Figure 11, and Figure 12 in Typical Performance Characteristics, the supply rail can be easily
found. A second way to determine the minimum supply rail is to calculate the required Vopeak using Equation 4
and add the dropout voltage. Using this method, the minimum supply voltage would be (Vopeak + (2*VOD)), where
VOD is extrapolated from the Figure 16 in Typical Performance Characteristics.
(4)
Using the Output Power vs Supply Voltage graph for an 8Ωload, the minimum supply rail is 4.3V. But since 5V is
a standard supply voltage in most applications, it is chosen for the supply rail. Extra supply voltage creates
headroom that allows the LM4862 to reproduce peaks in excess of 500 mW without clipping the signal. At this
time, the designer must make sure that the power supply choice along with the output impedance does not
violate the conditions explained in POWER DISSIPATION.
Once the power dissipation equations have been addressed, the required differential gain can be determined
from Equation 5.
(5)
Rf/Ri= AVD/2 (6)
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From Equation 5, the minimum AVD is 2; use AVD = 2.
Since the desired input impedance was 20 kΩ, and with a AVD of 2, a ratio of 1:1 of Rfto Riresults in an
allocation of Ri= Rf= 20 kΩ. The final design step is to address the bandwidth requirements which must be
stated as a pair of −3 dB frequency points. Five times away from a –3 dB point is 0.17 dB down from passband
response which is better than the required ±0.25 dB specified. This fact results in a low and high frequency pole
of 20 Hz and 100 kHz respectively. As stated in External Components Description , Riin conjunction with Ci
create a highpass filter.
Ci≥1/(2π*20 kΩ*20 Hz) = 0.397 μF; use 0.39 μF. (7)
The high frequency pole is determined by the product of the desired high frequency pole, fH, and the differential
gain, AVD. With an AVD = 2 and fH= 100 kHz, the resulting GBWP = 100 kHz which is much smaller than the
LM4862 GBWP of 12.5 MHz. This figure displays that if a designer has a need to design an amplifier with a
higher differential gain, the LM4862 can still be used without running into bandwidth problems.
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REVISION HISTORY
Changes from Revision E (May 2013) to Revision F Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4862M ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM
4862M
LM4862M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM
4862M
LM4862MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM
4862M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jul-2014
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4862MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-May-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4862MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-May-2013
Pack Materials-Page 2
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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