Wireless Components ASK/FSK Single Conversion Receiver TDA 5210 Version 3.0 Specification May 2001 Revision History Current Version: 3.0 as of 18.05.01 Previous Version: 2.4, Dec. 2000 Page (in previous Version) Page(s) (in current Version) Subjects (major changes since last revision) Product Info, 2-2 Product Info, 2-2 typ. supply current changed 3-12 3-12 Sec. 3.4.8: max. datarate changed, Sec. 3.4.9: max. output current changed 4-4 4-4 value of a changed to 1.414 4-8 4-8 FSK demodulator gain changed to 140V/kHz 4-13 4-13 value for C2 changed to 22nF according to bill of materials, 2 and T2 changed 5-3 5-3 min. supply current limits added, max. limits changed 5-4 5-4 supply current max. limit changed, min. limit added 5-5 5-5 NFLNA specification removed 5-6 5-6 3VOUT min. & max. limits changed, TAGC typ. & max. values changed, IFO: NFmix and RF/IF isolation removed 5-7 5-7 Section "SLICER" reworked, max. datarate at given load capacitance quoted, high output voltage limits changed, precharge current: min., max. limits changed, PDO load and leakage currents limits and typ. values changed, 5-8 5-8 FSK demodulation gain min. limit changed 5-9 5-9 PDWN-current max. limit changed, supply currents min. limits added, max. limits changed, 3VOUT min. & max. limits changed, ITAGC_out limits changed 5-10 5-10 Section "SLICER" reworked, max. datarate at given load capacitance quoted, high output voltage limits changed, precharge current: min., max. limits changed, PDO output voltage removed 5-15 5-15 C18 value changed ABM(R), AOP(R), ARCOFI(R), ARCOFI(R)-BA, ARCOFI(R)-SP, DigiTape(R), EPIC(R)-1, EPIC(R)-S, ELIC(R), FALC(R)54, FALC(R)56, FALC(R)-E1, FALC(R)-LH, IDEC(R), IOM(R), IOM(R)-1, IOM(R)-2, IPAT(R)-2, ISAC(R)-P, ISAC(R)-S, ISAC(R)-S TE, ISAC(R)-P TE, ITAC(R), IWE(R), MUSAC(R)-A, OCTAT(R)-P, QUAT(R)-S, SICAT(R), SICOFI(R), SICOFI(R)2, SICOFI(R)-4, SICOFI(R)-4C, SLICOFI(R) are registered trademarks of Infineon Technologies AG. ACETM, ASMTM, ASPTM, POTSWIRETM, QuadFALCTM, SCOUTTM are trademarks of Infineon Technologies AG. Edition 05.01 Published by Infineon Technologies AG, Balanstrae 73, 81541 Munchen (c) Infineon Technologies AG May 2001. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. 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TDA 5210 Product Info Product Info General Description Features Application The IC is a very low power consump- Package tion single chip FSK/ASK Superheterodyne Receiver (SHR) for the frequency bands 810 to 870 MHz and 400 to 440 MHz that is pin compatible with the ASK Receiver TDA5200. The IC offers a high level of integration and needs only a few external components. The device contains a low noise amplifier (LNA), a double balanced mixer, a fully integrated VCO, a PLL synthesiser, a crystal oscillator, a limiter with RSSI generator, a PLL FSK demodulator, a data filter, a data comparator (slicer) and a peak detector. Additionally there is a power down feature to save battery life. Low supply current (typ. at 868MHz Is = 5.9mA in FSK mode, Is = 5.2mA in ASK mode) Selectable frequency ranges 810870 MHz and 400-440 MHz Supply voltage range 5V 10% Limiter with RSSI generation, operating at 10.7MHz Power down mode with very low supply current (50nA typ) Selectable reference frequency FSK and ASK demodulation capability 2nd order low pass data filter with external capacitors Fully integrated VCO and PLL Synthesiser Data slicer with self-adjusting threshold ASK sensitivity < -107dBm FSK sensitivity <-100dBm Keyless Entry Systems Alarm Systems Remote Control Systems Low Bitrate Communication Systems Ordering Information Type Ordering Code Package TDA 5210 Q67037-A1100 P-TSSOP-28-1 samples available on tape and reel Wireless Components Product Info Specification, May 2001 1 Table of Contents 1 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i 2 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3.2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.3 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.4 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.4.1 Low Noise Amplifier (LNA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.4.2 Mixer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4.3 PLL Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4.4 Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.4.5 Limiter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.4.6 FSK Demodulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.4.7 Data Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.8 Data Slicer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.9 Peak Detector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.10 Bandgap Reference Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4.1 Choice of LNA Threshold Voltage and Time Constant. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4.2 Data Filter Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4.3 Quartz Load Capacitance Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4.4 Quartz Frequency Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.5 Data Slicer Threshold Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.6 ASK/FSK Switch Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.6.1 FSK Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.6.2 ASK Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.7 Principle of the Precharge Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5.1 Electrical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.1.2 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.1.3 AC/DC Characteristics at TAMB = 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.1.4 AC/DC Characteristics at TAMB = -40 to 105C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.2 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.3 Test Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.4 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2 Product Description Contents of this Chapter 2.1 2.2 2.3 2.4 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 TDA 5210 Product Description 2.1 Overview The IC is a very low power consumption single chip FSK/ASK Superheterodyne Receiver (SHR) for the frequency bands 810 to 870 MHz and 400 to 440 MHz that is pin compatible with the ASK Receiver TDA5200. The IC offers a high level of integration and needs only a few external components. The device contains a low noise amplifier (LNA), a double balanced mixer, a fully integrated VCO, a PLL synthesiser, a crystal oscillator, a limiter with RSSI generator, a PLL FSK demodulator, a data filter, a data comparator (slicer) and a peak detector. Additionally there is a power down feature to save battery life. 2.2 Application Keyless Entry Systems Remote Control Systems Alarm Systems Low Bitrate Communication Systems 2.3 Features Wireless Components Low supply current (at 868MHz Is = 5.9 mA typ. FSK mode, 5.2mA typ. ASK mode) Supply voltage range 5V 10% Power down mode with very low supply current (50nA typ) FSK and ASK demodulation capability Fully integrated VCO and PLL Synthesiser RF input sensitivity ASK < -107dBm RF input sensitivity FSK < -100dBm Selectable frequency ranges 810-870 MHz and 400-440 MHz Selectable reference frequency Limiter with RSSI generation, operating at 10.7MHz 2nd order low pass data filter with external capacitors Data slicer with self-adjusting threshold 2-2 Specification, May 2001 TDA 5210 Product Description 2.4 Package Outlines P_TSSOP_28.EPS Figure 2-1 Wireless Components P-TSSOP-28-1 package outlines 2-3 Specification, May 2001 3 Functional Description Contents of this Chapter 3.1 3.2 3.3 3.4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 TDA 5210 Functional Description 3.1 Pin Configuration CRST1 1 28 CRST2 VCC 2 27 PDW N LNI 3 26 PDO TAGC 4 25 DATA AGND 5 24 3VO UT LNO 6 23 THRES VCC 7 22 FFB MI 8 21 OPP M IX 9 20 SLN AGND 10 19 SLP FSEL 11 18 L IM X IF O 12 17 L IM DGND 13 16 CSEL VDD 14 15 M SEL TDA 5210 Pin_Configuration_5210.wmf Figure 3-1 Wireless Components IC Pin Configuration 3-2 Specification, May 2001 TDA 5210 Functional Description 3.2 Pin Definition and Function In the subsequent table the internal circuits connected to the pins of the device are shown. ESD-protection circuits are omitted to ease reading. . Table 3-1 Pin Definition and Function Pin No. Symbol 1 CRST1 Equivalent I/O-Schematic Function External Crystal Connector 1 4 .1 5 V 1 50uA 2 VCC 5V Supply 3 LNI LNA Input 57uA 3 500uA 4k 1k Wireless Components 3-3 Specification, May 2001 TDA 5210 Functional Description 4 TAGC AGC Time Constant Control 4.3 V 3 uA 4 1k 1 .4u A 1 .7V 5 AGND Analogue Ground Return 6 LNO LNA Output 5V 1k 6 7 VCC 8 MI 5V Supply Mixer Input 1 .7 V 2k 9 2k MIX Complementary Mixer Input 8 9 4 0 0u A 10 AGND Wireless Components Analogue Ground Return 3-4 Specification, May 2001 TDA 5210 Functional Description 11 FSEL 868/434 MHz Operating Frequency Selector 7 50 1 .2 V 2k 11 12 IFO 10.7 MHz IF Mixer Output 300uA 2 .2 V 60 12 4 .5 k 13 DGND Digital Ground Return 14 VDD 5V Supply (PLL Counter Circuitry) 15 MSEL ASK/FSK Modulation Format Selector 1.2V 3.6k 15 Wireless Components 3-5 Specification, May 2001 TDA 5210 Functional Description 16 CSEL 6.xx or 13.xx MHz Quartz Selector 1 .2 V 8 0k 16 17 LIM Limiter Input 2 .4 V 15k 17 18 Complementary Limiter Input LIMX 75uA 330 18 15k 19 SLP Data Slicer Positive Input 15u A 100 3k 19 8 0A Wireless Components 3-6 Specification, May 2001 TDA 5210 Functional Description 20 SLN Data Slicer Negative Input 5uA 1 0k 20 21 OPP OpAmp Noninverting Input 5u A 200 21 22 FFB Data Filter Feedback Pin 5 uA 1 00k 22 23 THRES AGC Threshold Input 5u A 10 k 23 24 3VOUT 3V Reference Output 24 2 0k 3 .1 V Wireless Components 3-7 Specification, May 2001 TDA 5210 Functional Description 25 DATA Data Output 500 25 40k 26 PDO Peak Detector Output 200 26 27 PDWN Power Down Input 27 220k 220k 28 CRST2 External Crystal Connector 2 4 .1 5 V 28 50uA Wireless Components 3-8 Specification, May 2001 TDA 5210 Functional Description 3.3 Functional Block Diagram VCC IF Filter MSEL LNO MI 6 LNI RF 3 MIX 8 9 LIM IFO 12 LIMX 17 FFB 18 15 OPP 22 SLP 21 SLN 19 20 LNA + FSK - ASK + - TAGC FSK PLL Demod SLICER + + LIMITER OP 25 DATA 4 PEAK 26 PDO DETECTOR TDA 5210 OTA :1/2 VCC VCO : 128 / 64 DET UREF CRYSTAL OSC AGC Reference 23 THRES 24 3VOUT 14 Bandgap Reference Loop Filter DGND 13 2,7 5,10 VCC AGND 11 FSEL 16 1 28 27 PDWN CSEL Crystal Function_5200.wmf Figure 3-2 Main Block Diagram 3.4 Functional Blocks 3.4.1 Low Noise Amplifier (LNA) The LNA is an on-chip cascode amplifier with a voltage gain of 15 to 20dB. The gain figure is determined by the external matching networks situated ahead of LNA and between the LNA output LNO (Pin 6) and the Mixer Inputs MI and MIX (Pins 8 and 9). The noise figure of the LNA is approximately 3dB, the current consumption is 500A. The gain can be reduced by approximately 18dB. The switching point of this AGC action can be determined externally by applying a threshold voltage at the THRES pin (Pin 23). This voltage is compared internally with the received signal (RSSI) level generated by the limiter circuitry. In case that the RSSI level is higher than the threshold voltage the LNA gain is reduced and vice versa. The threshold voltage can be generated by attaching a voltage divider between the 3VOUT pin (Pin 24) which provides a temperature stable 3V output generated from the internal bandgap voltage and the THRES pin as described in Section 4.1. The time constant of the AGC action can be deter- Wireless Components 3-9 Specification, May 2001 TDA 5210 Functional Description mined by connecting a capacitor to the TAGC pin (Pin 4) and should be chosen along with the appropriate threshold voltage according to the intended operating case and interference scenario to be expected during operation. The optimum choice of AGC time constant and the threshold voltage is described in Section 4.1. 3.4.2 Mixer The Double Balanced Mixer downconverts the input frequency (RF) in the range of 400-440MHz/810-870MHz to the intermediate frequency (IF) at 10.7MHz with a voltage gain of approximately 21dB by utilising either high- or low-side injection of the local oscillator signal. In case the mixer is interfaced only single-ended, the unused mixer input has to be tied to ground via a capacitor. The mixer is followed by a low pass filter with a corner frequency of 20MHz in order to suppress RF signals to appear at the IF output (IFO pin). The IF output is internally consisting of an emitter follower that has a source impedance of approximately 330 to facilitate interfacing the pin directly to a standard 10.7MHz ceramic filter without additional matching circuitry. 3.4.3 PLL Synthesizer The Phase Locked Loop synthesiser consists of a VCO, an asynchronous divider chain, a phase detector with charge pump and a loop filter and is fully implemented on-chip. The VCO is including on-chip spiral inductors and varactor diodes. It's nominal centre frequency is 840MHz, the operating range guaranteed over the temperature range specified is 820 to 860MHz. Depending on whether high- or low-side injection of the local oscillator is used the receive frequency ranges are 810 to 840 and 840 to 870MHz or 400 to 420 and 420 to 440MHz (see also Section 4.4). No additional external components are necessary. The oscillator signal is fed both to the synthesiser divider chain and to the downconverting mixer. In case of operation in the 400 to 440 MHz range, the signal is divided by two before it is fed to the mixer. This is controlled by the selection pin FSEL (Pin 11) as described in the following table. The overall division ratio of the divider chain can be selected to be either 128 or 64, depending on the frequency of the reference oscillator quartz (see below and Section 4.4). The loop filter is also realised fully on-chip. Table 3-2 FSEL Pin Operating States Wireless Components FSEL RF Frequency Open 400-440 MHz Shorted to ground 810-870 MHz 3 - 10 Specification, May 2001 TDA 5210 Functional Description 3.4.4 Crystal Oscillator The on-chip crystal oscillator circuitry allows for utilisation of quartzes both in the 6 and 13MHz range as the overall division ratio of the PLL can be switched between 64 and 128 via the CSEL (Pin 16) pin according to the following table. Table 3-3 CSEL Pin Operating States CSEL Crystal Frequency Open 6.xx MHz Shorted to ground 13.xx MHz The calculation of the value of the necessary quartz load capacitance is shown in Section 4.3, the quartz frequency calculation is explained in Section 4.4. 3.4.5 Limiter The Limiter is an AC coupled multistage amplifier with a cumulative gain of approximately 80 dB that has a bandpass-characteristic centred around 10.7 MHz. It has a typical input impedance of 330 to allow for easy interfacing to a 10.7 MHz ceramic IF filter. The limiter circuit also acts as a Receive Signal Strength Indicator (RSSI) generator which produces a DC voltage that is directly proportional to the input signal level as can be seen in Figure 4-2. This signal is used to demodulate ASK-modulated receive signals in the subsequent baseband circuitry. The RSSI output is applied to the modulation format switch, to the Peak Detector input and to the AGC circuitry. In order to demodulate ASK signals the MSEL pin has to be left open as described in the next chapter. 3.4.6 FSK Demodulator To demodulate frequency shift keyed (FSK) signals a PLL circuit is used that is contained fully on chip. The Limiter output differential signal is fed to the linear phase detector as is the output of the 10.7 MHz center frequency VCO. The demodulator gain is typically 140V/kHz. The passive loop filter output that is comprised fully on chip is fed to both the VCO and the modulation format switch described in more detail below. This signal is representing the demodulated signal with high frequencies applied to the demodulator demodulated to logic ones and low frequencies demodulated to logic zeroes. Please note that due to this behaviour a sign inversion of the data occurs in case of high-side injection of the local oscillator at receive frequencies below 840 or 420MHz, respectively. See also . The modulation format switch is actually a switchable amplifier with an AC gain of 11 that is controlled by the MSEL pin (Pin 15) as shown in the following table. This gain was chosen to facilitate detection in the subsequent circuits. The DC Wireless Components 3 - 11 Specification, May 2001 TDA 5210 Functional Description gain is 1 in order not to saturate the subsequent Data Filter wih the DC offset produced by the demodulator in case of large frequency offsets of the IF signal. The resulting frequency characteristic and details on the principle of operation of the switch are described in Section 4.6. Table 3-4 MSEL Pin Operating States MSEL Modulation Format Open ASK Shorted to ground FSK The demodulator circuit is switched off in case of reception of ASK signals. 3.4.7 Data Filter The data filter comprises an OP-Amp with a bandwidth of 100kHz used as a voltage follower and two 100k on-chip resistors. Along with two external capacitors a 2nd order Sallen-Key low pass filter is formed. The selection of the capacitor values is described in Section 4.2. 3.4.8 Data Slicer The data slicer is a fast comparator with a bandwidth of 100 kHz. This allows for a maximum receive data rate of up to 100kBaud. The maximum achievable data rate also depends on the IF Filter bandwidth and the local oscillator tolerance values. Both inputs are accessible. The output delivers a digital data signal (CMOS-like levels) for sbsequent circuits. The self-adjusting threshold on pin 20 its generated by RC-term or peak detector depending on the baseband coding scheme. The data slicer threshold generation alternatives are described in more detail in Section 4.5. 3.4.9 Peak Detector The peak detector generates a DC voltage which is proportional to the peak value of the receive data signal. An external RC network is necessary. The input is connected to the output of the RSSI-output of the Limiter, the output is connected to the PDO pin (Pin 26 ). This output can be used as an indicator for the received signal strength to use in wake-up circuits and as a reference for the data slicer in ASK mode. The maximum output current is typically 950A, the discharge current is lower than 2A. Note that the RSSI level is also output in case of FSK mode. Wireless Components 3 - 12 Specification, May 2001 TDA 5210 Functional Description 3.4.10 Bandgap Reference Circuitry A Bandgap Reference Circuit provides a temperature stable reference voltage for the device. A power down mode is available to switch off all subcircuits which is controlled by the PWDN pin (Pin 27) as shown in the following table. The supply current drawn in this case is typically 50nA. Table 3-5 PDWN Pin Operating States PDWN Operating State Open or tied to ground Powerdown Mode Receiver On Tied to Vs Wireless Components 3 - 13 Specification, May 2001 4 Applications Contents of this Chapter 4.1 4.2 4.3 4.4 4.5 4.6 4.7 Choice of LNA Threshold Voltage and Time Constant . . . . . . . . . . . . 4-2 Data Filter Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Quartz Load Capacitance Calculation . . . . . . . . . . . . . . . . . . . . . . . . 4-5 Quartz Frequency Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 Data Slicer Threshold Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 ASK/FSK Switch Functional Description . . . . . . . . . . . . . . . . . . . . . . 4-8 Principle of the Precharge Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11 TDA 5210 Applications 4.1 Choice of LNA Threshold Voltage and Time Constant In the following figure the internal circuitry of the LNA automatic gain control is shown. R1 R2 Uth re s h old Pins: 23 24 RSSI (0.8 - 2.8V) 20k OTA VCC +3.1 V Ilo a d LNA Gain control voltage RSSI > Uth r es h o ld : Ilo a d =4.2A RSSI < Uth r es h o ld : Ilo a d = -1.5A 4 UC C Uc :< 2.6V : Gain high Uc :> 2.6V : Gain low Uc ma x = VC C - 0.7V Uc min = 1.67V LNA_autom.wmf Figure 4-1 LNA Automatic Gain Control Circuitry The LNA automatic gain control circuitry consists of an operational transimpedance amplifier that is used to compare the received signal strength signal (RSSI) generated by the Limiter with an externally provided threshold voltage Uthres. As shown in the following figure the threshold voltage can have any value between approximately 0.8 and 2.8V to provide a switching point within the receive signal dynamic range. This voltage Uthres is applied to the THRES pin (Pin 23) The threshold voltage can be generated by attaching a voltage divider between the 3VOUT pin (Pin 24) which provides a temperature stable 3V output generated from the internal bandgap voltage and the THRES pin. If the RSSI level generated by the Limiter is higher than Uthres, the OTA generates a positive current Iload. This yields a voltage rise on the TAGC pin (Pin 4). Otherwise, the OTA generates a negative current. These currents do not have the same values in order to achieve a fast-attack and slow-release action of the AGC and are used to charge an external capacitor which finally generates the LNA gain control voltage. Wireless Components 4-2 Specification, May 2001 TDA 5210 Applications LNA always in high gain mode 3 2 RSSI Level Range UTHRES Voltage Range 2.5 RSSI Level 1.5 1 LNA always in low gain mode 0.5 0 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 Input Level at LNA Input [dBm] RSSI-AGC.wmf Figure 4-2 RSSI Level and Permissive AGC Threshold Levels The switching point should be chosen according to the intended operating scenario. The determination of the optimum point is described in the accompanying Application Note, a threshold voltage level of 1.8V is apparently a viable choice. It should be noted that the output of the 3VOUT pin is capable of driving up to 50A, but that the THRES pin input current is only in the region of 40nA. As the current drawn out of the 3VOUT pin is directly related to the receiver power consumption, the power divider resistors should have high impedance values. The sum of R1 and R2 has to be 600k in order to yield 3V at the 3VOUT pin. R1 can thus be chosen as 240k, R2 as 360k to yield an overall 3VOUT output current of 5A1 and a threshold voltage of 1.8V Note: If the LNA gain shall be kept in either high or low gain mode this has to be accomplished by tying the THRES pin to a fixed voltage. In order to achieve high gain mode operation, a voltage higher than 2.8V shall be applied to the THRES pin, such as a short to the 3VOLT pin. In order to achieve low gain mode operation a voltage lower than 0.7V shall be applied to the THRES, such as a short to ground. As stated above the capacitor connected to the TAGC pin is generating the gain control voltage of the LNA due to the charging and discharging currents of the OTA and thus is also responsible for the AGC time constant. As the charging and discharging currents are not equal two different time constants will result. The time constant corresponding to the charging process of the capacitor shall be chosen according to the data rate. According to measurements performed at Infineon the capacitor value should be greater than 47nF. 1. note the 20k resistor in series with the 3.1V internal voltage source Wireless Components 4-3 Specification, May 2001 TDA 5210 Applications 4.2 Data Filter Design Utilising the on-board voltage follower and the two 100k on-chip resistors a 2nd order Sallen-Key low pass data filter can be constructed by adding 2 external capacitors between pins 19 (SLP) and 22 (FFB) and to pin 21 (OPP) as depicted in the following figure and described in the following formulas1. C1 Pins: C2 22 21 R R 100k 100k 19 Filter_Design.wmf Figure 4-3 Data Filter Design (1)(2) b C2 = -------------------------4QRf 3dB 2Q b C 1 = ---------------------R2f 3dB with Q = ------ba (3)the quality factor of the poles where in case of a Bessel filter a = 1.3617, b = 0.618 and thus Q = 0.577 and in case of a Butterworth filter a = 1.414, b = 1 and thus Q = 0.71 Example: Butterworth filter with f3dB = 5kHz and R = 100k: C1 = 450pF, C2 = 225pF 1. taken from Tietze/Schenk: Halbleiterschaltungstechnik, Springer Berlin, 1999 Wireless Components 4-4 Specification, May 2001 TDA 5210 Applications 4.3 Quartz Load Capacitance Calculation The value of the capacitor necessary to achieve that the quartz oscillator is operating at the intended frequency is determined by the reactive part of the negative resistance of the oscillator circuit as shown in Section 5.1.3 and by the quartz specifications given by the quartz manufacturer. CS Pin 28 Crystal Input impedance Z1-28 TDA5210 Pin 1 Quartz_load.wmf Figure 4-4 Determination of Series Capacitance Value for the Quartz Oscillator Crystal specified with load capacitance CS = 1 1 + 2 f X L Cl with Cl the load capacitance (refer to the quartz crystal specification). Examples: 6.7 MHz: CL = 12 pFXL=695CS = 8.9 pF 13.4 MHz: CL = 12 pFXL=1010 CS = 5.9 pF These values may be obtained in high accuracy by putting two capacitors in series to the quartz, such as 22pF and 15pF in the 6.7MHz case and 22pF and 8.2pF in the 13.4MHz case. Wireless Components 4-5 Specification, May 2001 TDA 5210 Applications 4.4 Quartz Frequency Calculation As described in Section 3.4.3 the operating range of the on-chip VCO is 820 to 860 MHz with a nominal center frequency of 840MHz. This signal is divided by 2 before applied to the mixer in case of operation at 434 MHz. This local oscillator signal can be used to downconvert the RF signals both with high- or lowside injection at the mixer. The resulting receive frequency ranges then extend between 810 and 870MHz or between 400 and 440MHz. Low-side injection of the local oscillator has to be used for receive frequencies between 840 and 870MHz as well as high-side injection for receive frequencies below 840MHz. Corresponding to that in the 400MHz region low-side injection is applicable for receive frequencies above 420MHz, high-side injection below this frequency. Therefore for operation both in the 868 and the 434 MHz ISM bands low-side injection of the local oscillator has to be used. Then the local oscillator frequency is calculated by subtracting the IF frequency (10.7 MHz) from the RF frequency (434 or 868 MHz). Please note that no sign-inversion occurs in case of reception and demodulation of FSK-modulated signals. The overall division ratios in the PLL are 64 or 128 in case of operation at 868 MHz or 32 and 64 in case of operation at 434 MHz, depending on the crystal frequency used as shown below. The quartz frequency in case of low-side injection may be calculated by using the following formula: QU = (RF - 10.7) / r with RF receive frequency LO local oscillator (PLL) frequency (RF - 10.7) QU quartz oscillator frequency r ratio of local oscillator (PLL) frequency and quartz frequency as shown in the subsequent table Table 4-1 Dependence of PLL Overall Division Ratio on FSEL and CSEL FSEL CSEL Ratio r = (fLO/fQU) open open 64 open GND 32 GND open 128 GND GND 64 : f QU = (868.4MHz - 10.7 MHz ) / 64 = 13.40156 MHz f QU = (868 .4 MHz - 10.7 MHz ) / 128 = 6.7008 MHz f QU = (434.2 MHz - 10.7 MHz ) / 32 = 13.23437 MHz f QU = (434 .2 MHz - 10.7 MHz ) / 64 = 6.6172 MHz Wireless Components 4-6 Specification, May 2001 TDA 5210 Applications 4.5 Data Slicer Threshold Generation The threshold of the data slicer can be generated using an external R-C integrator as shown in Figure 4-5. The cut-off frequency of the R-C integrator has to be lower than the lowest frequency appearing in the data signal. In order to keep distortion low, the minimum value for R is 20k. R C Pins: 19 data out 25 20 Uthreshold data filter data slicer Data_slice1.wmf Figure 4-5 Data Slicer Threshold Generation with External R-C Integrator In case of ASK operation another possibility for threshold generation is to use the peak detector in connection with two resistors and one capacitor as shown in the following figure. The component values are depending on the coding scheme and the protocol used. R C R Pins: peak detector 26 19 data out 25 20 Uthreshold data slicer data filter Data_slice2.wmf Figure 4-6 Wireless Components Data Slicer Threshold Generation Utilising the Peak Detector 4-7 Specification, May 2001 TDA 5210 Applications 4.6 ASK/FSK Switch Functional Description The TDA5210 is containing an ASK/FSK switch which can be controlled via Pin 15 (MSEL). This switch is actually consisting of 2 operational amplifiers that are having a gain of 1 in case of the ASK amplifier and a gain of 11 in case of the FSK amplifier in order to achieve an appropriate demodulation gain characteristic. In order to compensate for the DC-offset generated especially in case of the FSK PLL demodulator there is a feedback connection between the threshold voltage of the bit slicer comparator (Pin 20) to the negative input of the FSK switch amplifier. This is shown in the following figure. 15 MSEL RSSI (ASK signal) ASK/FSK Switch Data Filter FSK PLL Demodulator R1=100k + ASK DATA Out R2=100k + v=1 + FSK - 25 - AC 0.18 mV/kHz Comp R3=300k DC typ. 2 V 1.5 V......2.5 V R4=30k FFB 22 21 OPP SLP 19 20 SLN ASK mode : v=1 FSK mode : v=11 C1 C2 R C ask_fsk_datapath.WMF Figure 4-7 4.6.1 ASK/FSK mode datapath FSK Mode The FSK datapath has a bandpass characterisitc due to the feedback shown above (highpass) and the data filter (lowpass). The lower cutoff frequency f2 is determined by the external RC-combination. The upper cutoff frequency f3 is determined by the data filter bandwidth. The demodulation gain of the FSK PLL demodulator is 140V/kHz. This gain is increased by the gain v of the FSK switch, which is 11. Therefore the resulting dynamic gain of this circuit is 2mV/kHz within the bandpass. The gain for the DC content of FSK signal remains at 140V/kHz. The cutoff frequencies of the bandpass have to be chosen such that the spectrum of the data signal is influenced in an acceptable amount. In case that the user data is containing long sequences of logical zeroes the effect of the drift-off of the bit slicer threshold voltage can be lowered if the offset voltage inherent at the negative input of the slicer comparator (Pin20) is used. The comparator has no hysteresis built in. Wireless Components 4-8 Specification, May 2001 TDA 5210 Applications This offset voltage is generated by the bias current of the negative input of the comparator (i.e. 20nA) running over the external resistor R. This voltage raises the voltage appearing at pin 20 (e.g. 1mV with R = 100k). In order to obtain benefit of this asymmetrical offset for the demodulation of long zeros the lower of the two FSK frequencies should be chosen in the transmitter as the zerosymbol frequency. In the following figure the shape of the above mentioned bandpass is shown. gain (pin19) v v-3dB 20dB/dec -40dB/dec 3dB 0dB f DC f1 f2 0.18mV/kHz f3 2mV/kHz frequenzgang.WMF Figure 4-8 Frequency characterstic in case of FSK mode The cutoff frequencies are calculated with the following formulas: f1 = 1 R 330k C 2 R + 330k f 2 = v f1 = 11 f1 f 3 = f 3dB f3 is the 3dB cutoff frequency of the data filter - see Section 4.2. Example: R = 100k, C = 47nF This leads tof1 = 44Hzandf2 = 485Hz Wireless Components 4-9 Specification, May 2001 TDA 5210 Applications 4.6.2 ASK Mode In case the receiver is operated in ASK mode the datapath frequency charactersitic is dominated by the data filter alone, thus it is lowpass shaped.The cutoff frequency is determined by the external capacitors C12 and C14 and the internal 100k resistors as described in Section 4.2 0dB -3dB -40dB/dec f f3dB freq_ask.WMF Figure 4-9 Wireless Components Frequency charcteristic in case of ASK mode 4 - 10 Specification, May 2001 TDA 5210 Applications 4.7 Principle of the Precharge Circuit In case the data slicer threshold shall be generated with an external RC network as described in Section 4.5 it is necessary to use large values for the capacitor C attached to the SLN pin (pin 20) in order to achieve long time constants. This results also from the fact that the choice of the value for R connected between the SLP and SLN pins (pins 19 and 20) is limited by the 330k resistor appearing in parallel to R as can be seen in Figure 4-7. Apart from this a resistor value of 100k leads to a voltage offset of 1mv at the comparator input as described in Section 4.6.1. The resulting startup time constant 1 can be calculated with: 1 = (R // 330k) * C In case R is chosen to be 100k and C is chosen as 47nF this leads to 1 = (100k // 330k) * 47nF = 77k * 47nF = 3.6ms When the device is turned on this time constant dominates the time necessary for the device to be able to demodulate data properly. In the powerdown mode the capacitor is only discharged by leakage currents. In order to reduce the turn-on time in the presence of large values of C a precharge circuit was included in the TDA5210 as shown in the following figure. C2 R1+R2=600k R1 R2 C R Uth r es h o ld 24 20 23 Uc>Us Uc<Us 19 Uc I load Data Filter ASK/FSK Switch - U2 0 / 240uA + Us OTA + - U2<2.4V : I=240uA U2>2.4V : I=0 20k +3.1V +2.4V precharge.WMF Figure 4-10 Wireless Components Principle of the precharge circuit 4 - 11 Specification, May 2001 TDA 5210 Applications This circuit charges the capacitor C with an inrush current Iload of typically 220A for a duration of T2 until the voltage Uc appearing on the capacitor is equal to the voltage Us at the input of the data filter. This voltage is limited to 2.5V. As soon as these voltages are equal or the duration T2 is exceeded the precharge circuit is disabled. 2 is the time constant of the charging process of C which can be calculated as 2 20k * C2 as the sum of R1 and R2 is sufficiently large and thus can be neglected. T2 can then be calculated according to the following formula: 1 T 2 = 2 ln 1 - 2 . 4V 3V (c) * 2 1 . 6 The voltage transient during the charging of C2 is shown in the following figure: U2 3V 2.4V 2 T2 e-fkt1.WMF Figure 4-11 Voltage appearing on C2 during precharging process The voltage appearing on the capacitor C connected to pin 20 is shown in the following figure. It can be seen that due to the fact that it is charged by a constant current source it exhibits is a linear increase in voltage which is limited to USmax = 2.5V which is also the approximate operating point of the data filter input. The time constant appearing in this case can be denoted as T3, which can be calculated with USmax C 2.5V T3 = ----------------------- = ----------------- C 220A 220A Wireless Components 4 - 12 Specification, May 2001 TDA 5210 Applications Uc Us T3 e-Fkt2.WMF Figure 4-12 Voltage transient on capacitor C attached to pin 20 As an example the choice of C2 = 22nF and C = 47nF yields 2 = 0.44ms T2 = 0.71ms T3 = 0.53ms This means that in this case the inrush current could flow for a duration of 0.64ms but stops already after 0.49ms when the USmax limit has been reached. T3 should always be chosen to be shorter than T2. It has to be noted finally that during the turn-on duration T2 the overall device power consumption is increased by the 220A needed to charge C. The precharge circuit may be disabled if C2 is not equipped. This yields a T2 close to zero. Note that the sum of R4 and R5 has to be 600k in order to produce 3V at the THRES pin as this voltage is internally used also as the reference for the FSK demodulator. Wireless Components 4 - 13 Specification, May 2001 5 Reference Contents of this Chapter 5.1 5.2 5.3 5.4 Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 Test Board Layouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15 TDA 5210 preliminary Reference 5.1 Electrical Data 5.1.1 Absolute Maximum Ratings WARNING The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the IC will result. Table 5-1 Absolute Maximum Ratings, Ambient temperature TAMB=-40C ... + 105C # Parameter Symbol Limit Values min max Unit 1 Supply Voltage Vs -0.3 5.5 V 2 Junction Temperature Tj -40 +150 C 3 Storage Temperature Ts -40 +125 C 4 Thermal Resistance RthJA 114 K/W 5 ESD integrity, all pins excl. Pins 1,3, 6, 28 ESD integrity Pins 1,3,6,28 VESD +2 +1.5 kV kV Wireless Components 5-2 Remarks HBM according to MIL STD 883D, method 3015.7 Specification, May 2001 TDA 5210 preliminary Reference 5.1.2 Operating Range Within the operational range the IC operates as explained in the circuit description. The AC/DC characteristic limits are not guaranteed. Currents flowing into the device are denoted as positive currents and v.v. Supply voltage: VCC = 4.5V .. 5.5V Table 5-2 Operating Range, Ambient temperature TAMB= -40C ... + 105C # Parameter 1 Supply Current 2 Receiver Input Level ASK FSK, frequ. dev. 50kHz Symbol Limit Values Unit Test Conditions fRF = 868MHz, FSK Mode fRF = 434MHz, FSK Mode fRF = 868MHz, ASK Mode fRF = 434MHz, ASK Mode min max ISF 868 ISF 434 ISA 868 ISA 434 4.1 3.9 3.4 3.2 7.7 7.5 7 6.8 mA mA mA mA RFin -106 -100 -13 -13 dBm dBm 3 LNI Input Frequency fRF 400/ 810 440/ 870 MHz 4 MI/X Input Frequency fMI 400/ 810 440/ 870 MHz 5 3dB IF Frequency Range ASK FSK fIF -3dB 5 10.4 23 11 MHz 6 Powerdown Mode On PWDNON 0 0.8 V 7 Powerdown Mode Off PWDNOFF 2 VS V 8 Gain Control Voltage, LNA high gain state VTHRES 2.8 VS V 9 Gain Control Voltage, LNA low gain state VTHRES 0 0.7 V @ source impedance 50, BER 2E-3, average power level, Manchester encoded datarate 4kBit, 280kHz IF Bandwidth L Item This value is guaranteed by design. Wireless Components 5-3 Specification, May 2001 TDA 5210 preliminary Reference 5.1.3 AC/DC Characteristics at TAMB = 25C AC/DC characteristics involve the spread of values guaranteed within the specified voltage and ambient temperature range. Typical characteristics are the median of the production. Currents flowing into the device are denoted as positive currents and vice versa. Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V Parameter Symbol Limit Values min Unit Test Conditions typ max 50 100 nA Pin 27 (PDWN) open or tied to 0 V L Item Supply Supply Current 1 Supply current, standby mode IS PDWN 2 Supply current, device operating in 868 MHz range, FSK mode ISF 868 5.1 5.9 6.7 mA Pin 11 (FSEL) tied to GND, Pin 15 (MSEL) tied to GND 3 Supply current, device operating in 434 MHz range, FSK mode ISF 434 4.9 5.7 6.5 mA Pin 11 (FSEL) open, Pin 15 (MSEL) tied to GND 4 Supply current, device operating in 868 MHz range, ASK mode ISA 868 4.4 5.2 6 mA Pin 11 (FSEL) tied to GND, Pin 15 (MSEL) open 5 Supply current, device operating in 434 MHz range, ASK mode ISA 434 4.2 5 5.8 mA Pin 11 (FSEL) open, Pin 15 (MSEL) open dBm Manchester encoded datarate 4kBit, 280kHz IF Bandwidth LNA Signal Input LNI (PIN 3), VTHRES > 2.8V, high gain mode 1 2 Average Power Level at BER = 2E-3 (Sensitivity) ASK RFin -110 Average Power Level at BER = 2E-3 (Sensitivity) FSK RFin -103 dBm Manchester enc. datarate 4kBit, 280kHz IF Bandw., 50kHz pk. dev. 3 Input impedance, fRF=434 MHz S11 LNA 0.873 / -34.7 deg 4 Input impedance, fRF=869 MHz S11 LNA 0.738 / -73.5 deg 5 Input level @ 1dB compression P1dBLNA -15 dBm 6 Input 3rd order intercept point fRF=434 MHz IIP3LNA -10 dBm matched input 7 Input 3rd order intercept point fRF=869 MHz IIP3LNA -14 dBm matched input Wireless Components 5-4 Specification, May 2001 TDA 5210 preliminary Reference Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values min 8 LO signal feedthrough at antenna port typ LOLNI Unit Test Conditions L Item max -73 dBm Signal Output LNO (PIN 6), VTHRES > 2.8V, high gain mode 1 Gain fRF=434 MHz S21 LNA 1.509 / 138.2 deg 2 Gain fRF=869 MHz S21 LNA 1.419 / 101.7 deg 3 Output impedance, fRF=434 MHz S22 LNA 0.886 / -12.9 deg 4 Output impedance, fRF=869 MHz S22 LNA 0.866 / -24.2 deg 5 Voltage Gain Antenna to IFO fRF=434 MHz GAntMI 42 dB 6 Voltage Gain Antenna to IFO fRF=869 MHz GAntMI 40 dB Signal Input LNI, VTHRES = GND, low gain mode 1 Input impedance, fRF=434 MHz S11 LNA 0.873 / -34.7 deg 2 Input impedance, fRF=869 MHz S11 LNA 0.738 / -73.5 deg 3 Input level @ 1dB C. P fRF = 434 MHz P1dBLNA -18 dBm matched input 4 Input level @ 1dB C. P fRF = 869 MHz P1dBLNA -6 dBm matched input 5 Input 3rd order intercept point fRF=434 MHz IIP3LNA -10 dBm matched input 6 Input 3rd order intercept point fRF=869 MHz IIP3LNA -5 dBm matched input Signal Output LNO, VTHRES = GND, low gain mode 1 Gain fRF=434 MHz S21 LNA 0.183 / 140.6 deg 2 Gain fRF=869 MHz S21 LNA 0.179 / 109.1deg 3 Output impedance, fRF=434 MHz S22 LNA 0.897 / -13.6 deg 4 Output impedance, fRF=869 MHz S22 LNA 0.868 / -26.3 deg 5 Voltage Gain Antenna to MI fRF=434 MHz GAntMI 22 dB 6 Voltage Gain Antenna to MI fRF=869 MHz GAntMI 19 dB Wireless Components 5-5 Specification, May 2001 TDA 5210 preliminary Reference Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values min typ max Unit Test Conditions L Item Signal 3VOUT (PIN 24) 1 Output voltage V3VOUT 2.9 3.1 3.3 V 3VOUT Pin open 2 Current out I3VOUT -3 -5 -10 A see Section 4.1 VS-1V V see Section 4.1 Signal THRES (PIN 23) 1 Input Voltage range VTHRES 0 2 LNA low gain mode VTHRES 0 3 LNA high gain mode VTHRES 2.8 4 Current in ITHRES_in V 3 VS 5 V or shorted to Pin 24 nA Signal TAGC (PIN 4) 1 Current out, LNA low gain state ITAGC_out -3.6 -4.2 -5 A RSSI > VTHRES 2 Current in, LNA high gain state VTAGC_in 1 1.6 2.2 A RSSI>VTHRES MIXER Signal Input MI/MIX (PINS 8/9) 1 Input impedance, fRF=434 MHz S11 MIX 0.942 / -14.4 deg 2 Input impedance, fRF=869 MHz S11 MIX 0.918 / -28.1 deg 3 Input 3rd order intercept point fRF=434 MHz IIP3MIX -28 dBm 4 Input 3rd order intercept point fRF=869 MHz IIP3MIX -26 dBm Signal Output IFO (PIN 12) 1 Output impedance ZIFO 330 2 Conversion Voltage Gain fRF=434 MHz GMIX +19 dB 3 Conversion Voltage Gain fRF=869 MHz GMIX +18 dB LIMITER Signal Input LIM/X (PINS 17/18) 1 Input Impedance ZLIM 264 2 RSSI dynamic range DRRSSI 60 3 RSSI linearity LINRSSI 4 Operating frequency (3dB points) Wireless Components fLIM 330 396 80 dB 1 5 10.7 5-6 23 dB MHz Specification, May 2001 TDA 5210 preliminary Reference Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values min typ Unit Test Conditions L Item max DATA FILTER 1 Useable bandwidth 2 RSSI Level at Data Filter Output SLP, RFIN=-103dBm RSSIlow 3 RSSI Level at Data Filter Output SLP, RFIN=-30dBm RSSIhigh BWBB FILT 100 kHz 0.3 1 V LNA in high gain mode 1.8 3 V LNA in high gain mode 100 kBps 0.1 V Slicer, Signal Output DATA (PIN 25) 1 Maximum Datarate DRmax 2 LOW output voltage VSLIC_L 0 3 HIGH output voltage VSLIC_H VS1.3V VS-1V VS0.7V V IPCH_SLN -100 -220 -300 A Iload -600 -950 -1300 A Ileakage 0 200 1000 nA 14 MHz NRZ, 20pF capacitive loading Slicer, Signal Output DATA (PIN 20) 1 Precharge Current Out see Section 4.7 PEAK DETECTOR Signal Output PDO (PIN 26) 1 Load current 2 Leakage current CRYSTAL OSCILLATOR Signals CRSTL1, CRSTL 2, (PINS 1/28) 1 Operating frequency 2 Input Impedance @ ~6MHz Z1-28 -825 +j695 3 Input Impedance @ ~13MHz Z1-28 -600 +j1010 4 Serial Capacity @ ~6MHz CS 6=C1 8.9 pF 5 Serial Capacity @ ~13MHz CS13=C1 5.9 pF fCRSTL 6 fundamental mode, series resonance ASK/FSK Signal Switch Signal MSEL (PIN 15) 1 ASK Mode VMSEL 1.4 4 V 2 FSK Mode VMSEL 0 0.2 V Wireless Components 5-7 or open Specification, May 2001 TDA 5210 preliminary Reference Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values Unit min typ max Test Conditions L Item FSK DEMODULATOR 1 Demodulation Gain GFMDEM 85 140 225 V/ kHz 2 Useable IF Bandwidth BWIFPLL 10.2 10.7 11.2 MHz POWER DOWN MODE Signal PDWN (PIN 27) 1 Powerdown Mode On PWDNON 0 0.8 V 2 Powerdown Mode Off PWDNOff 2.8 VS V 3 Input bias current PDWN 4 Start-up Time until valid signal is detected at IF IPDWN 19 TSU uA 1 ms Power On Mode VCO MULTIPLEXER Signal FSEL (PIN 11) 1 fRF range 434 MHz VFSEL 1.4 4 V 2 fRF range 869 MHz VFSEL 0 0.2 V 3 Output bias current FSEL IFSEL -160 -240 A FSEL tied to GND or open -200 or open PLL DIVIDER Signal CSEL (PIN 16) 1 fCRSTL range 6.xxMHz VCSEL 1.4 4 V 2 fCRSTL range 13.xxMHz VCSEL 0 0.2 V 3 Input bias current CSEL ICSEL -3 -7 A -5 CSEL tied to GND Measured only in lab. Wireless Components 5-8 Specification, May 2001 TDA 5210 preliminary Reference 5.1.4 AC/DC Characteristics at TAMB = -40 to 105C Currents flowing into the device are denoted as positive currents and vice versa Table 5-4 AC/DC Characteristics with TAMB= -40C ... + 105C, VVCC = 4.5 ... 5.5 V Parameter Symbol Limit Values min Unit Test Conditions typ max 50 400 nA Pin 27 (PDWN) open or tied to 0 V L Item Supply Supply Current 1 Supply current, standby mode IS PDWN 2 Supply current, device operating in 868 MHz range, FSK mode ISF 868 4.1 5.9 7.7 mA Pin 11 (FSEL) tied to GND, Pin 15 (MSEL) tied to GND 3 Supply current, device operating in 434 MHz range, FSK mode ISF 434 3.9 5.7 7.5 mA Pin 11 (FSEL) open, Pin 15 (MSEL) tied to GND 4 Supply current, device operating in 868 MHz range, ASK mode ISA 868 3.4 5.2 7 mA Pin 11 (FSEL) tied to GND, Pin 15 (MSEL) open 5 Supply current, device operating in 434 MHz range, ASK mode ISA 434 3.2 5 6.8 mA Pin 11 (FSEL) open, Pin 15 (MSEL) open Signal 3VOUT (PIN 24) 1 Output voltage V3VOUT 2.9 3.1 3.3 V 3VOUT Pin open 2 Current out I3VOUT -3 -5 -10 A see Section 4.1 see Section 4.1 Signal THRES (PIN 23) 1 Input Voltage range VTHRES 0 VS-1V V 2 LNA low gain mode VTHRES 0 0.3 V 3 LNA high gain mode VTHRES 3 VS V 4 Current in ITHRES_in 5 or shorted to Pin 24 nA Signal TAGC (PIN 4) 1 Current out, LNA low gain state ITAGC_out -1 -4.2 -8 A RSSI > VTHRES 2 Current in, LNA high gain state VTAGC_in 0.5 1.5 5 A RSSI>VTHRES MIXER 1 Conversion Voltage Gain fRF=434 MHz GMIX +19 dB 2 Conversion Voltage Gain fRF=869 MHz GMIX +18 dB LIMITER Signal Input LIM/X (PINS 17/18) 1 RSSI dynamic range Wireless Components DRRSSI 60 80 5-9 dB Specification, May 2001 TDA 5210 preliminary Reference Table 5-4 AC/DC Characteristics with TAMB= -40C ... + 105C, VVCC = 4.5 ... 5.5 V Parameter Symbol Limit Values min typ Unit Test Conditions L Item max DATA FILTER 2 RSSI Level at Data Filter Output SLP, RFIN=-103dBm RSSIlow 0.3 1 V LNA in high gain mode 3 RSSI Level at Data Filter Output SLP, RFIN=-30dBm RSSIhigh 1.8 3 V LNA in high gain mode 100 kBps 0.1 V Slicer, Signal Output DATA (PIN 25) 1 Maximum Datarate DRmax 2 LOW output voltage VSLIC_L 0 3 HIGH output voltage VSLIC_H VS1.5V VS-1V VS0.5V V IPCH_SLN -100 -220 -300 A Iload -400 -850 -1400 A Ileakage 0 700 2000 nA NRZ, 20pF capacitive loading Slicer, Signal Output DATA (PIN 20) 1 Precharge Current Out see Section 4.7 PEAK DETECTOR Signal Output PDO (PIN 26) 1 Load current 2 Leakage current CRYSTAL OSCILLATOR Signals CRSTL1, CRSTL 2, (PINS 1/28) 1 Operating frequency fCRSTL 6 14 MHz fundamental mode, series resonance ASK/FSK Signal Switch Signal MSEL (PIN 15) 1 ASK Mode VMSEL 1.4 4 V 2 FSK Mode VMSEL 0 0.2 V or open FSK DEMODULATOR 1 Demodulation Gain GFMDEM 105 140 245 V/ kHz 2 Useable IF Bandwidth BWIFPLL 10.2 10.7 11.2 MHz POWER DOWN MODE Signal PDWN (PIN 27) 1 Powerdown Mode On PWDNON 0 0.8 V 2 Powerdown Mode Off PWDNOff 2.8 VS V 3 Start-up Time until valid signal is detected at IF 1 ms Wireless Components TSU 5 - 10 Specification, May 2001 TDA 5210 preliminary Reference Table 5-4 AC/DC Characteristics with TAMB= -40C ... + 105C, VVCC = 4.5 ... 5.5 V Parameter Symbol Limit Values min typ Unit Test Conditions L Item max VCO MULTIPLEXER Signal FSEL (PIN 11) 1 fRF range 434 MHz VFSEL 1.4 4 V 2 fRF range 869 MHz VFSEL 0 0.2 V 3 Output bias current FSEL IFSEL -110 -340 A FSEL tied to GND or open -200 or open PLL DIVIDER Signal CSEL (PIN 16) 1 fCRSTL range 6.xxMHz VCSEL 1.4 4 V 2 fCRSTL range 13.xxMHz VCSEL 0 0.2 V 3 Input bias current CSEL ICSEL -3 -7 A Wireless Components -5 5 - 11 CSEL tied to GND Specification, May 2001 TDA 5210 preliminary Reference 5.2 Test Circuit The device performance parameters marked with in Section 5.1.3 were measured on an Infineon evaluation board. This evaluation board can be obtained together with evaluation boards of the accompanying transmitter device TDA5100 in an evaluation kit that may be ordered on the INFINEON RKE Webpage www.infineon.com/rke. In case a matching codeword is received, decoded and accepted by the decoder the on-board LED will turn on. This signal is also accessible on a 2-pole pin connector and can be used for simple remote-control applications. More information on the kit is available on request. TDA5210_testboard_20_schematic.WMF Figure 5-1 Wireless Components Schematic of the Evaluation Board 5 - 12 Specification, May 2001 TDA 5210 preliminary Reference 5.3 Test Board Layouts tda5210_testboard_20_top.WMF Figure 5-2 Top Side of the Evaluation Board tda5210_testboard_20_bot.WMF Figure 5-3 Wireless Components Bottom Side of the Evaluation Board 5 - 13 Specification, May 2001 TDA 5210 preliminary Reference tda5210_testboard_20_plc.EMF Figure 5-4 Wireless Components Component Placement on the Evaluation Board 5 - 14 Specification, May 2001 TDA 5210 preliminary Reference 5.4 Bill of Materials The following components are necessary for evaluation of the TDA5210 without use of a Microchip HCS512 decoder. Table 5-5 Bill of Materials Ref Value Specification R1 100k 0805, 5% R2 100k 0805, 5% R3 820k 0805, 5% R4 240k 0805, 5% R5 360k 0805, 5% R6 10k 0805, 5% L1 434 MHz: 15nH 869 MHz: 3.3nH Toko, PTL2012-F15N0G Toko, PTL2012-F3N3C L2 434 MHz: 8.2pF 869 MHz: 3.9nH 0805, COG, 0.1pF Toko, PTL2012-F3N9C C1 1pF 0805, COG, 0.1pF C2 434 MHz: 4.7pF 869 MHz: 3.9pF 0805, COG, 0.1pF 0805, COG, 0.1pF C3 434 MHz: 6.8pF 869 MHz: 5.6pF 0805, COG, 0.1pF 0805, COG, 0.1pF C4 100pF 0805, COG, 5% C5 47nF 1206, X7R, 10% C6 434 MHz: 10nH 869 MHz: 3.9pF Toko, PTL2012-F10N0G 0805, COG, 0.1pF C7 100pF 0805, COG, 5% C8 434 MHz: 33pF 869 MHz: 22pF 0805, COG, 5% 0805, COG, 5% C9 100pF 0805, COG, 5% C10 10nF 0805, X7R, 10% C11 10nF 0805, X7R, 10% C12 220pF 0805, COG, 5% C13 47nF 0805, X7R, 10% C14 470pF 0805, COG, 5% C15 47nF 0805, X7R, 5% C16 8.2pF 0805, COG, 0.1pF C17 22pF 0805, COG, 1% C18 22nF 0805, X7R, 5% Q1 (fRF - 10.7MHz)/32 or (fRF - 10.7MHz)/64 HC49/U, fundamental mode, CL = 12pF, e.g. 434.2MHz: Jauch Q 13,23437-S11-1323-12-10/20 e.g. 868.4MHz: Jauch Q 13,40155-S11-1323-12-10/20 Wireless Components 5 - 15 Specification, May 2001 TDA 5210 preliminary Reference Q2 SFE10.7MA5-A or SKM107M1-A20-10 Murata Toko X2, X3 142-0701-801 Johnson S1-S3, S6 X1, X3 2-pole pin connector S4 3-pole pin connector, or not equipped IC1 TDA 5210 Infineon Please note that in case of operation at 434 MHz a capacitor has to be soldered in place L2 and an inductor in place C6. The following components are necessary in addition to the above mentioned ones for evaluation of the TDA5210 in conjunction with a Microchip HCS512 decoder. Table 5-6 Bill of Materials Addendum Ref Value Specification R7 100k 0805, 5% R8 10k 0805, 5% R9 100k 0805, 5% R10 22k 0805, 5% R11 100 0805, 5% R12 100 0805, 5% R13 100 0805, 5% R14 100 0805, 5% R21 22k 0805, 5% R22 10k 0805, 5% R23 22k 0805, 5% R24 820k 0805, 5% R25 560 0805, 5% C19 10pF 0805, COG, 5% C21 100nF 1206, X7R, 10% C22 100nF 1206, X7R, 10% IC2 HCS512 Microchip 2-pole pin connector S5, X4-X9 T1, T2 BC 847B Infineon D1 LS T670-JL Infineon Wireless Components 5 - 16 Specification, May 2001 TDA 5210 preliminary Reference Wireless Components 5 - 17 Specification, May 2001 TDA 5210 List of Figures List of Figures Figure 2-1 P-TSSOP-28-1 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Figure 3-1 IC Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Figure 3-2 Main Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 Figure 4-1 LNA Automatic Gain Control Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Figure 4-2 RSSI Level and Permissive AGC Threshold Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Figure 4-3 Data Filter Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Figure 4-4 Determination of Series Capacitance Value for the Quartz Oscillator . . . . . . . . . . . . . . 4-5 Figure 4-5 Data Slicer Threshold Generation with External R-C Integrator . . . . . . . . . . . . . . . . . . 4-7 Figure 4-6 Data Slicer Threshold Generation Utilising the Peak Detector . . . . . . . . . . . . . . . . . . . 4-7 Figure 4-7 ASK/FSK mode datapath . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8 Figure 4-8 Frequency characterstic in case of FSK mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9 Figure 4-9 Frequency charcteristic in case of ASK mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10 Figure 4-10 Principle of the precharge circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11 Figure 4-11 Voltage appearing on C2 during precharging process . . . . . . . . . . . . . . . . . . . . . . . . . 4-12 Figure 4-12 Voltage transient on capacitor C attached to pin 20 . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13 Figure 5-1 Schematic of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 Figure 5-2 Top Side of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 Figure 5-3 Bottom Side of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 Figure 5-4 Component Placement on the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14 Wireless Components List of Figures - 1 Specification, May 2001 TDA 5210 List of Tables List of Tables Table 3-1 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Table 3-2 FSEL Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 Table 3-3 CSEL Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 Table 3-4 MSEL Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12 Table 3-5 PDWN Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13 Table 4-1 Dependence of PLL Overall Division Ratio on FSEL and CSEL . . . . . . . . . . . . . . . . . 4-6 Table 5-1 Absolute Maximum Ratings, Ambient temperature TAMB=-40C ... + 105C . . . . . . . . 5-2 Table 5-2 Operating Range, Ambient temperature TAMB= -40C ... + 105C . . . . . . . . . . . . . . . . 5-3 Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V . . . . . . . . . . . . . . . . . . . . . 5-4 Table 5-4 AC/DC Characteristics with TAMB= -40C ... + 105C, VVCC = 4.5 ... 5.5 V . . . . . . . . . 5-9 Table 5-5 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15 Table 5-6 Bill of Materials Addendum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16 Wireless Components List of Tables - 1 Specification, May 2001